WO2022270013A1

WO2022270013A1 - Power conversion device

Info

Publication number: WO2022270013A1
Application number: PCT/JP2022/008089
Authority: WO
Inventors: 敬介堀内; 欣也中津; 奈柄久野; 高志平尾
Original assignee: 日立Astemo株式会社
Priority date: 2021-06-25
Filing date: 2022-02-25
Publication date: 2022-12-29
Also published as: JP2023004273A

Abstract

This power conversion device comprises: a semiconductor module that has a semiconductor element; and a heat dissipation member that contacts at least one surface of the semiconductor module. The heat dissipation member has a flat shape in the interior of which a refrigerant flow path is formed. Recessed sections that are recessed in toward the the refrigerant flow path are formed on at least one surface from among a pair of principal surfaces of the heat dissipation member, said surface being on the side that contacts the semiconductor module.

Description

power converter

The present invention relates to a power converter.

In electric vehicles and hybrid vehicles, the miniaturization and cost reduction of the mounted parts are emphasized. In this respect, a power converter that converts a DC current of a battery into an AC current of a motor is no exception, and there is a demand for miniaturization and cost reduction. In the case of a power conversion device, the pursuit of miniaturization increases the heat generation density, so it is necessary to improve the cooling performance of the device.

Among the electronic components that make up the power converter, the power module generates the largest amount of heat. Need to improve below. As a background art of the present invention, for example, JP-A-2003-100002 discloses an approach to improve the heat transfer coefficient of water channels.

Patent Document 1 discloses a technique for improving the heat transfer coefficient under the same pressure loss condition by providing fine depressions (scalene triangular grooves) on the wall surface in the flow path. This is possible to improve the heat transfer characteristics by suppressing the development of the temperature boundary layer formed on the surface due to the agitation and mixing with the high-temperature fluid by providing fine depressions in the direction perpendicular to the main stream direction of the flow. It uses the principle of

JP 2009-135524 A

However, the structure of Patent Document 1 is based on the premise that only the inner wall of the flow path is processed unevenly, and lacks productivity for mass-produced products such as automobiles. In addition, assuming that only the inner wall is processed by cutting or mechanical/chemical polishing, for example, it is not possible to process unevenness that is greater than the wall pressure of the flow path wall, and the cooling performance improvement is limited due to the processing limit. There is a problem.

In addition, in pursuit of miniaturization and high-density mounting of devices to meet the needs, it becomes necessary to intensively cool the local heat generation (hot spots) of semiconductor elements (IGBTs and diodes). It is necessary to reduce the pitch in the mainstream flow direction of the convex structure on the inner surface of the channel wall. If this pitch is made too small, the flow separated at the upstream convex portion cannot reattach to the immediately following convex portion, making it difficult to improve the cooling performance to the limit.

Based on the above, it is an object of the present invention to provide a power conversion device that simultaneously achieves miniaturization, cost reduction, and improvement in cooling performance.

A power conversion device is a power conversion device comprising a semiconductor module having a semiconductor element and a heat radiating member in contact with at least one surface of the semiconductor module, wherein the heat radiating member has a coolant channel formed therein. The coolant channel has a concave portion recessed toward the inside of the coolant channel on at least one of a pair of main surfaces of the heat radiating member, and the semiconductor module and the It is formed on the surface of the contact side.

According to the present invention, it is possible to provide a power converter that achieves both miniaturization, cost reduction, and improvement in cooling performance.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view of the power converter device 100 which employ|adopted this invention. FIG. 2 is an exploded perspective view of the power converter of FIG. 1; FIG. 2 is an exploded perspective view of a power module subassembly with water channels; 1A and 1B are a perspective view and a cross-sectional view of a power module subassembly with water channels according to a first embodiment of the present invention; FIG. FIG. 2 is a circuit block configuration diagram of the power conversion device 100. FIG. FIG. 2 is a principle diagram of cooling performance improvement showing the effect of the present invention. The graph which showed the relationship between the heat transfer coefficient which shows the effect of this invention, and a pressure loss. FIG. 4 is a dimple structural diagram of a power module subassembly with water channels according to a second embodiment of the present invention; The figure explaining the shape of the header part which concerns on the 3rd Embodiment of this invention. The figure explaining the structure of the flat tube based on the 4th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and are appropriately omitted and simplified for clarity of explanation. The present invention can also be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

The position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc. in order to facilitate the understanding of the invention. As such, the present invention is not necessarily limited to the locations, sizes, shapes, extents, etc., disclosed in the drawings.

(Overall configuration of the device provided with the first embodiment and the present invention)
FIG. 1 is a perspective view of a power converter 100 employing the present invention. FIG. 2 is an exploded perspective view of the power converter 100 of FIG.

The power conversion device 100 has components housed inside it by the device housing 50 and the housing lower lid 15 . A cooling water inlet hole 11 and a cooling water outlet hole 12 are formed in the device housing 50 so as to protrude outward. In addition, a cooling water channel 20 formed by die casting (one of the metal mold casting methods) or the like is formed on the inner lower side of the device housing 50, and functions as a water channel by being closed by the housing lower lid 15. do. A control circuit board 132 is arranged on the lower side of the housing 50, and a driver circuit board 131 housed in the housing space 25 is provided in a direction perpendicular to the control circuit board 132. and the control circuit board 132 are connected by a board connector 133 .

Since the driver circuit board 131 and the control circuit board 132 are bolted to the rigid body (not shown) of the vehicle body and the device housing 50, the connector connection of the two

boards

131 and 132 increases vibration resistance. Therefore, flexible electrical wiring is desirable.

The cooling water path 20 is formed so as to avoid the driver circuit board 131 and the control circuit board 132 and cover the capacitor module storage space 111 formed in the device housing 50 . The capacitor module 110 is housed so as to be in thermal contact with this capacitor housing space 111 . By interposing a TIM (Thermal Interface Material) between the capacitor module 110 and the capacitor module housing space 111 for the purpose of reducing the contact thermal resistance, it is possible to improve the heat transfer performance.

The pressure receiving portion 55 is provided at a position adjacent to the capacitor module storage space 110 of the device housing 50 , and the power module subassembly 123 with water channel (hereinafter abbreviated as “subassembly 123 ”) is pressed by the pressing member 40 . It is pressed against the portion 55 . 2, the pressing member 40 is divided into three phases corresponding to the three-phase power modules 122 (see FIG. 3) provided in the subassembly 123, respectively.

Note that the pressure receiving portion 55 may be integrated with the device housing 50, or may be a separate member having a vibration-isolating structure such as anti-vibration rubber. Further, the pressing member 40 may have a structure capable of pressing the three phases integrally, or may be provided separately for each phase as shown in the figure. Further, the pressing member 40 may be fixed to the device housing 50 with bolts, or may have a hook-like structure and be fitted and fixed to the housing 50 like a snap fit.

The coolant flowing through the cooling water passage 20 enters the housing 50 through the cooling water inlet hole 11, radiates heat from each functional part of the power converter 100, and is discharged from the cooling water outlet hole 12 together with the heat. The discharged coolant is directed to a radiator (not shown) in the engine room, and the heat is released to the outside air by the radiator, thereby returning to a low temperature. The coolant that has returned to a low temperature is circulated by the pump and used to cool the power conversion device 100 again.

The circulation of the refrigerant in the power conversion device 100 will be explained. Refrigerant entering the housing 50 from the cooling water inlet hole 11 branches into a direction toward the subassembly 123 through the power module side water channel inlet 21, the first condenser side water channel 23, and the second condenser side water channel 24. be done. The power module-side water channel outlet 22 is a channel through which the coolant that has passed through the power module subassembly 123 with water channel returns to the cooling water channel 20 .

Regarding the cooling water passage 20 as a whole, since the power module in the subassembly 123 is the member that must dissipate the most heat in the power converter 100, the first condenser side water passage 23 and the second It is necessary that the amount of refrigerant flowing through the condenser-side water passage 24 does not exceed the amount of refrigerant flowing through the subassembly 123 . Therefore, the channel widths of the first condenser-side channel 23 and the second capacitor-side channel 24 are formed smaller than the width of the power module-side channel inlet 21, which is the power module-side channel.

If the discharge pressure of the circulation pump that shares the refrigerant with the power conversion device 100 has a margin for the pressure loss in the power conversion device 100, the

water channels

21 and 22 flowing to the power module side for pressure loss distribution The condenser side water channel 23 does not need to be a parallel water channel, and may be a series water channel such that the

water channels

21 and 22 flowing to the power module side are connected to the capacitor side water channel 23 .

Also, although not shown, a control signal connector holding a signal line for the later-described control module 130 to transmit and receive signals to and from an external device such as a host system is provided in the device housing 50 at the cooling water inlet hole 11 is provided on a side different from the side on which is provided.

FIG. 3 is an exploded perspective view of the subassembly 123, and FIG. 4 is a perspective view and cross-sectional view of the power module subassembly with water channels according to the first embodiment of the present invention.

The coolant supplied from the power module side water channel inlet 21 branches at the header 80 in the power module subassembly 123 with water channel. The branched refrigerant passes through two flat tubes 60 sandwiching the three-phase power module 122 on both sides, joins again at the other header 80 on the opposite side, and returns to the cooling water channel 20 from the power module side water channel outlet 22. .

Here, the two flat tubes 60 that serve as heat dissipation members for the power module 122 sandwich the power module 122 via TIM 70, which is an insulating heat dissipation member such as heat dissipating grease. The two flat tubes 60 are wholly sandwiched between the pressing member 40 and the pressure receiving portion 55 described above. In this way, by adopting a structure that does not create a gap between the flat tube 60 and the housing 50, the contact thermal resistance for the entire power module 122 provided in plurality along the direction of the coolant flow path is reduced. and strengthen mechanical vibration resistance and temperature cycle resistance.

Although the structure in which the power module 122 is sandwiched between the flat tubes 60 from both sides has been described, only one side of the flat tube 60 is provided so as to be in contact with the power module 122, and is connected to the pressing member 40 and the pressure receiving portion 55. It is also possible to have a structure sandwiched between

In the flat tube 60, a striped pattern 61 can be formed by forming a concave shape 65 that is depressed toward the inside of the coolant channel, that is, a convex shape 66 on the inner wall of the water channel. The concave shape 65 and the convex shape 66 are structured to have grooves in the direction perpendicular to the coolant channel along the width direction of the main surface of the flat tube 60 . Further, concave shapes 65 are formed corresponding to the positions of the upper and lower arms of the power module 122, respectively.

Regarding the formation of the striped pattern 61, when the flat tube 60 is processed by pressing, if only one side of the flat tube 60 is press-processed, the flat tube 60 may be warped and bent toward the processed side. You can keep it flat by pressing both sides. Further, by molding the flat tube 60 by extrusion or drawing, and pressing the outer surface of the flat tube 60 to form the concave shape 65 and the convex shape 66 in the flat tube 60, a larger concave-convex structure can be realized. In addition, by forming uneven structures alternately along the coolant channel, the turbulence effect described later with reference to FIG. 6 can be increased, and the cooling performance can be further enhanced. Also, by improving the cooling performance only with the flat tube 60, it is possible to contribute to miniaturization and cost reduction.

It should be noted that although the refrigerant flow path in which both surfaces of the flat tube 60 are provided with an uneven structure has been described, the uneven structure may be formed only on one side of the flat tube 60 that is in contact with the power module 122 . Further, the pressing member 40 is arranged corresponding to the portion where the concave shape 65 is formed, so that the cooling effect can be further improved.

FIG. 5 is a circuit block configuration diagram of the power converter 100. As shown in FIG.

The power conversion device 100 is a device that is connected to the battery 200 and the motor generator 300 , converts the direct current supplied from the battery 200 into three-phase alternating current, and supplies the three-phase alternating current to the motor generator 300 .

The power conversion device 100 includes a capacitor module 110 for stabilizing and smoothing the DC current supplied from the battery 200, and an inverter device 120 for generating a three-phase AC current from the DC current. there is The inverter device 120 includes an upper and lower arm series circuit 122 forming three phases of U-phase, V-phase and W-phase, and a control module 130 for controlling it.

The DC connector 140 and the capacitor module 110 are electrically connected, and the capacitor module 110 and the DC terminals of the upper and lower arm series circuits 122 are electrically connected by bolts or by welding. AC terminals of the power module are connected to the AC connector 160 via the current sensor 150 .

In the inverter device 120, each of the upper and lower arm series circuits 122 is an IGBT (Insulated
Two current switch circuits consisting of a parallel connection circuit of a Gate Bipolar Transistor 125 and a diode 126 are arranged in series. The upper and lower ends of upper and lower arm series circuit 122 are connected to the positive and negative electrodes of battery 200 via DC connectors 140, respectively. In the upper and lower arm series circuit 122, the current switch circuit composed of the IGBT 125a and the diode 126a arranged on the upper side (positive side) operates as an upper arm, and is composed of the IGBT 125b and the diode 126b arranged on the lower side (negative side). A current switch circuit operates as a lower arm.

The inverter device 120 outputs three-phase AC currents U, V, W from the midpoint position of each of the upper and lower arm series circuits 122, that is, from the connection portion of the upper and lower current switch circuits. are supplied to motor generator 300 via AC connector 160 .

Although the circuit has been described using a single inverter device 120 as an example, it is also possible to increase the amount of power to be converted by using a plurality of inverter devices 120 and to accommodate a plurality of motor generators 300. can.

Signal lines for gates, emitter senses, thermistors, etc. of the power module are connected to the driver circuit 131 . Driver circuit 131 is connected to control circuit 132 via board connector 133 (see FIG. 1).

The control module 130 includes a driver circuit 131 that drives and controls the three sets of upper and lower arm series circuits 122 and a control circuit 132 that supplies control signals to the driver circuit 131 . Here, the signal output from the driver circuit 131 is supplied to each IGBT 125 of the upper arm and the lower arm of the power module, and controls the switching operation according to the information of the current sensor 150 and the like to control each upper and lower arm series circuit. It controls the amplitude, phase, etc. of the AC currents U, V, W output from 122 . In this manner, the control module 130 feedback-controls the upper and lower arm series circuit 122 .

The control circuit 132 has a microcomputer for arithmetic processing of the switching timing of each IGBT 125 in the three sets of upper and lower arm series circuits 122 . Input information to the microcomputer includes the target torque value required for motor generator 300, the current value supplied from upper and lower arm series circuit 122 to motor generator 300, the magnetic pole position of the rotor of motor generator 300, and the like. is entered.

Among these pieces of input information, the target torque value is based on a command signal output from a higher-level control device (not shown). Also, the current value is based on the detection signal of current sensor 150 that detects the current value of the alternating current output from each upper and lower arm series circuit 122 . The magnetic pole position is based on a detection signal of a rotating magnetic pole sensor (not shown) provided in motor generator 300 .

The control module 130 also has a function of detecting abnormalities such as overcurrent, overvoltage, and overtemperature, and protects the upper and lower arm series circuits 122 . The emitter electrode of the IGBT 125 of each arm is connected to a driver circuit 131. The driver circuit 131 detects overcurrent in the emitter electrode of each IGBT 125, and stops the switching operation of the IGBT 125 in which overcurrent is detected. and protect against overcurrent.

The control circuit 132 also receives signals from a temperature sensor (not shown) provided in the upper and lower arm series circuit 122, a detection circuit for detecting a DC voltage applied across the upper and lower arm series circuit 122, and the like. abnormalities such as overtemperature and overvoltage are detected based on the signals from the When an abnormality such as overtemperature or overvoltage is detected, the power conversion device 100 stops switching operations of all IGBTs 125 to protect the entire power module 122 from abnormalities such as overtemperature and overvoltage.

In the power converter 100 shown above, the current switch circuit composed of the IGBT 125 and the diode 126 may be configured using a MOSFET (Metal-Oxide-Semiconductor Field-Effect-Transistor). Also, the three sets of upper and lower arm series circuits 122 may include two upper and lower arm series circuits and output two-phase AC currents. Furthermore, the power conversion device 100 may be a device that converts a three-phase (two-phase) alternating current into a direct current and is configured in almost the same circuit configuration.

Also, the power module 122 uses a 2-in-1 type configured corresponding to the upper and lower arm series circuits 122 of each phase, but the positional relationship between the flat pipe conduit 10 and the power module 122 shown in this embodiment is based on the 1-in-1 type semiconductor A module (a configuration in which each arm divided into an upper arm and a lower arm is one unit) or a 6-in-1 type semiconductor module (a configuration in which upper and lower arms for three phases are integrated) may be used.

FIG. 6 is a principle diagram of cooling performance improvement showing the effect of the embodiment of the present invention.

FIG. 6(a) shows the laminar flow boundary layer 20b, the velocity distribution 20e, and the temperature distribution 20f when the inner wall of the flat tube 60 (cooling channel 20) does not have a convex shape 66 and has a smooth channel shape. . In addition, the coolant has a low temperature inside the laminar boundary layer 20b and a warm temperature outside the laminar boundary layer 20b. In the case of FIG. 6A, the temperature of the coolant in the vicinity of the water channel wall surface increases as it advances in the traveling direction 20a. Therefore, the heat transfer coefficient as a refrigerant is low.

In FIG. 6B, a flat tube 60 (cooling water channel 20) is provided with a convex shape 66 toward the flow channel side, and not only the flow channel wall on the side contacting the power module 122 but also the surface on the opposite side A convex shape 66 is formed. The convex shape 66 is formed by machining the concave shape 65 from the outside of the flat tube 60 . In addition, the TIM 70 is filled in the gaps generated in the concave shape 65 so that the heat of the power module 122 is efficiently transported to the refrigerant over the entire area of the flat tube 60 .

As shown in FIG. 6(b), by forming a convex shape 66, a vertical vortex 20d is generated immediately after the convex shape 66, and the flow separates and reattaches, thereby thinning the boundary layer 20c as shown in the figure. Become. This makes it possible to transport the low-temperature coolant to the vicinity of the wall surface of the flat tube 60 . In addition, the convex shape 66 (concave shape 65) is locally formed only around the heating element 122, and the flow channel cross-sectional area from the vertex of the convex shape 66 to the flow channel wall of the opposing flat tube 60 is made small. there is By doing so, the flow velocity of the coolant is increased by turbulent flow, and the heat transfer coefficient is improved.

In addition, as shown in FIGS. 4 and 6, the structure in which both wall surfaces of the flat tube 60 are alternately provided with uneven structures in a zigzag pattern doubles the heat transfer area between the refrigerant and the flow path wall surface, The turbulence effect of the vortex 20d is increased, and the separation and reattachment of the flow are possible even with a convex structure formed at a narrow pitch, so that the cooling performance can be enhanced to the utmost limit.

Note that the smaller the flow path height H is, the more the refrigerant can be guided toward the power module 122, so that the reattachment of the separated vortex 20d can be promoted. Further, by doing so, the efficiency of the fins is increased, and since the convex shape 66 fins on the opposite surface of the flat tube 60 can be substituted for the fins, the heat transfer area can be increased, and the heat transfer coefficient is improved.

FIG. 7 is a graph showing the relationship between heat transfer coefficient and pressure loss, which shows the effect of the present invention.

In FIG. 7, the height of the convex shape 66 is defined as h, and it is verified whether there is an optimum shape in relation to the flow path height H described above. Also, in each of h/H>0.3 (analysis result 67 of uneven shape) and 0.05<h/H<0.3 (analysis result 68 of uneven shape), how is the Pareto solution of the trade-off It was predicted by thermal fluid analysis. However, the definition of a smooth surface was h/H<0.05 (smooth surface analysis result 69). In FIG. 7, the uneven shape analysis result 67 is represented by ◇, the uneven shape analysis result 68 is represented by Δ, and the smooth surface analysis result 69 is represented by ◯. As a result of the verification, it was confirmed that if 0.05<h/H<0.3 (68), the required specifications that are expected to increase the heat transfer coefficient to the required value while maintaining low pressure loss can be achieved. .

(Second embodiment)
FIG. 8 is a dimple structural diagram of a power module subassembly with water channels according to a second embodiment of the present invention.

In this embodiment, the dimple structure 62 is provided in the direction perpendicular to the coolant flow path over the entire main surface of the flat tube 60 . When compared with the first embodiment described above with reference to FIG. 4, the structure of the striped pattern 61 shown in FIG. This has the advantage that there is no need for positioning even if the pitch between adjacent channels of the flat tube cross section is uneven in the stage of manufacturing the flat tube 60 by extrusion or drawing. On the other hand, in the dimple structure 62 of the present embodiment, when manufacturing variations in the flow path structure in the flat tube 60 are small, the convex fins 66 make it easy to target cooling, and even a small press pressure can be achieved in the manufacturing stage. There is an effect of facilitating the formation of a large concave-convex shape by using a mold like a pincushion. As a result, the burden on the press machine is reduced, and there is an effect that the capital investment for the press machine required when processing a large area and the trouble of frequent mold maintenance work can be reduced.

Furthermore, since the amount of deformation due to press working is smaller in the dimple structure 62 than in the first embodiment, it is possible to suppress dimensional changes such as warpage, undulation, and width. As a result, the flatness of the flat tube 60 is reduced, so that the contact area between the power module 122 and the flat tube 60 can be increased, and the contact thermal resistance can be reduced.

(Third Embodiment)
FIG. 9 is a diagram explaining the shape of the header portion according to the third embodiment of the present invention.

For example, as shown in FIG. 9A, in the case of a chip layout in which the IGBTs 25 and the diodes 126 on the upper and lower arms are arranged in the direction of the flow path, there is no chip in the central portion of the power module 122, so the width of the flat tube 60 is The flow path in the center of the direction has its inlet partly closed by an in-header baffle plate 90 so that the coolant does not actively flow. In the case of a chip layout in which the IGBTs and diodes are divided into four parts along the width of the flow path as shown in FIG. This can be dealt with by designing the center of the channel in which the module 122 is arranged to positively share the coolant.

In this manner, the flow path to be shared with the coolant is uniquely determined by the in-header baffle plate 90 provided in the header 80 in accordance with the chip layout. There is an effect that can be In addition, even if the device housing 50 is not at hand, the cooling performance verification test can be performed on the power module assembly 123 with housing water passages alone. In addition, defect factor analysis can be performed for each individual component.

(Fourth embodiment)
FIG. 10 is a diagram illustrating the structure of a flat tube according to a fourth embodiment of the present invention.

In general, when a water channel branches, if the coolant continues to flow in the direction of travel, it will be affected by inertial force, so the deeper the coolant, the easier it will flow, and the more difficult it will be for the front side. Due to this principle, there is a problem that the refrigerant cannot easily flow through the flat tubes 60 formed on the refrigerant inlet side of the header portion 80 . This is because the flow in the header portion 80 is orthogonal to the main stream direction of the cooling water inlet hole 11 and the cooling water outlet hole 12, so when the refrigerant decelerates in the header portion 80, the flow rate 64a of the upper flat tube increases. This problem arises from the principle that the flow rate is greater than the flow rate 64b of the lower flat tube.

Therefore, in the present embodiment, the lower flat tube 60, which is disadvantageous due to inertial force, has a dimple structure 63 with only one side in contact with the power module 122. By doing so, the difference between the flow rate 64a of the upper flat tube and the flow rate 64b of the lower flat tube can be reduced.

According to the first embodiment of the present invention described above, the following effects are obtained.

(1) The power conversion device 100 includes a semiconductor module 122 having semiconductor elements 125 and 126 and a heat dissipation member 60 in contact with at least one surface of the semiconductor module 122 . The heat radiating member 60 has a flat shape in which a coolant channel is formed. It is formed on one surface, which is the surface that contacts the semiconductor module 122 . By doing so, it is possible to provide a power conversion device that simultaneously achieves miniaturization, cost reduction, and improvement in cooling performance.

(2) The concave portions 65 are formed on both surfaces of the pair of main surfaces of the heat radiating member 60, and are alternately recessed from the respective surfaces along the coolant flow path. By doing so, it is possible to increase the turbulence effect in the coolant flow path and further improve the cooling performance.

(3) The concave portion 65 is filled with the heat dissipating grease 70 between the semiconductor module 122 and the external surface of the heat dissipating member 60 . By doing so, the heat of the power module 122 is efficiently transported to the refrigerant over the entire area of the flat tube 60 .

(4) The recessed portion 65 has a groove perpendicular to the coolant channel along the lateral direction of the main surface of the heat radiating member 60 . By doing so, it is possible to reliably dissipate heat in the width direction of the coolant channel.

(5) The concave portion 65 has a dimple structure 62 in the direction perpendicular to the coolant channel on the main surface of the heat radiating member 60 . By doing so, it is easy to target the cooling by the fins of the convex shape 66, and it becomes easy to form the large

uneven shapes

65 and 66 with a mold like a ridge in the manufacturing stage even with a small pressing pressure.

(6) The power conversion device 100 includes the pressing member 40 pressing the heat dissipation member 60 toward the main surface of the semiconductor module 122 . By doing so, the contact thermal resistance is reduced for the entire power modules 122 provided along the direction of the refrigerant flow path, and the mechanical vibration resistance and temperature cycle resistance are enhanced.

(7) The pressing member 40 is arranged corresponding to the location where the concave portion 65 is formed. By doing so, the heat dissipation effect can be reliably improved.

(8) A plurality of semiconductor modules 122 are provided along the coolant flow path direction, and the concave portions 65 are formed corresponding to the arrangement of the plurality of semiconductor modules 122, respectively. By doing so, the heat dissipation effect can be reliably improved.

(9) The recesses 65 are formed corresponding to the upper and lower arms of the semiconductor module 122, respectively. By doing so, the heat dissipation effect can be reliably improved.

(10) A method for manufacturing a power conversion device 100 having a heat dissipation member that cools a semiconductor module 122 having semiconductor elements 125 and 126 with a coolant flowing therein, wherein the heat dissipation member 60 is extruded or drawn into a flat shape. A concave portion 65 is formed by press working in the heat radiating member 60 that has been molded and molded into a flat shape. By doing so, the cooling water passage of the present invention can be realized.

It should be noted that the present invention is not limited to the above embodiments, and various modifications and other configurations can be combined without departing from the scope of the invention. Moreover, the present invention is not limited to those having all the configurations described in the above embodiments, and includes those having some of the configurations omitted.

11: Cooling water inlet hole 12: Cooling water outlet hole 15: Housing lower lid 20: Cooling water channel 20a: Refrigerant traveling direction 20b: Laminar boundary layer 20c: Turbulent boundary layer 20d: Longitudinal vortex 20e: Velocity distribution 20f: Temperature Distribution 21: power module side channel inlet 22: power module side channel outlet 23: first capacitor side channel 24: second capacitor side channel 25: driver circuit board storage space 30: control signal connector 40: pressing member 50: device housing Body 55: Pressure receiving portion 60: Flat tube (heat radiation member)
61: striped pattern 62: double-sided dimple structure 63: single-sided dimple structure 64a: upper flat tube flow rate 64b: lower flat tube flow rate 65: concave shape 66: convex shape 67: uneven shape analysis result (h/H>0.3)
68: Uneven shape analysis result (0.05<h/H<0.3)
69: Analysis result of smooth surface (h / H < 0.05)
70: TIM (Thermal Interface Material)
80: Header 90: Baffle plate in header 100: Power conversion device 110: Capacitor module 111: Capacitor module storage space 120: Inverter device 122: Power module (upper and lower arm series circuit)
123: power module subassembly with water channel 125: IGBT
126: Diode 130: Control Module 131: Driver Circuit Board 132: Control Circuit Board 133: Board Connector

Claims

A power converter comprising a semiconductor module having a semiconductor element and a heat dissipation member in contact with at least one surface of the semiconductor module,
The heat dissipating member has a flat shape in which a coolant channel is formed,
In the coolant channel, a concave portion recessed toward the inside of the coolant channel is formed on at least one of the pair of main surfaces of the heat radiating member, which is the surface that contacts the semiconductor module. power conversion equipment.
The power converter according to claim 1,
The power conversion device, wherein the recesses are formed on both surfaces of a pair of main surfaces of the heat radiating member, and are alternately recessed from the respective surfaces along the coolant flow path.
The power converter according to claim 1,
The power conversion device, wherein the recess is filled with heat dissipating grease between the semiconductor module and the outer surface of the heat dissipating member.
The power converter according to claim 1,
The power conversion device, wherein the concave portion has a groove in a direction perpendicular to the coolant flow path along the width direction of the main surface of the heat radiating member.
The power converter according to claim 1,
The power conversion device, wherein the recess has a dimple structure in a direction perpendicular to the coolant channel on the main surface of the heat radiating member.
The power converter according to claim 1,
A power converter comprising a pressing member pressing the heat radiation member toward the main surface of the semiconductor module.
The power converter according to claim 6,
The power conversion device, wherein the pressing member is arranged corresponding to the location where the recess is formed.
The power converter according to any one of claims 1 to 7,
A plurality of the semiconductor modules are provided along the direction of the coolant flow path,
The power conversion device, wherein the recesses are formed corresponding to the arrangement of the plurality of semiconductor modules.
The power converter according to claim 8,
The power conversion device, wherein the recesses are formed corresponding to the upper and lower arms of the semiconductor module, respectively.
A method for manufacturing a power conversion device having a heat dissipation member that cools a semiconductor module having a semiconductor element with a coolant flowing therein,
The heat dissipating member is formed into a flat shape by extrusion or drawing,
A method of manufacturing a heat radiating member for a power conversion device, wherein a concave portion is formed in the flat heat radiating member by press working.