WO2022267126A1 - 显示面板和电子设备 - Google Patents

显示面板和电子设备 Download PDF

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Publication number
WO2022267126A1
WO2022267126A1 PCT/CN2021/107300 CN2021107300W WO2022267126A1 WO 2022267126 A1 WO2022267126 A1 WO 2022267126A1 CN 2021107300 W CN2021107300 W CN 2021107300W WO 2022267126 A1 WO2022267126 A1 WO 2022267126A1
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WO
WIPO (PCT)
Prior art keywords
conductive layer
touch
binding
area
connection part
Prior art date
Application number
PCT/CN2021/107300
Other languages
English (en)
French (fr)
Inventor
杨薇薇
王国超
Original Assignee
武汉华星光电技术有限公司
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司, 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US17/608,145 priority Critical patent/US20240019951A1/en
Publication of WO2022267126A1 publication Critical patent/WO2022267126A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, in particular to a display panel and electronic equipment.
  • Organic light emitting diode (Organic Light Emitting Display, OLED) display panel has many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, near 180° viewing angle, wide operating temperature range, etc. Widely used in smartphones, tablets, full-color TVs, etc.
  • touch circuits are directly deposited on the packaging layer of the display panel to replace the external touch screen to save costs.
  • most of the self-capacitive touch display panels integrate image sensors, fingerprint sensors, and pressure sensors, and there are many sensor transmission signal lines.
  • the wiring of the touch circuit is changed above the bending area of the lower frame of the screen to the wiring layer of the driving circuit of the display panel. Because of this structure of changing lines, the width h of the lower frame of the display panel cannot be further reduced, and cannot further meet the requirements of the display panel. Users' pursuit of extremely narrow bezels on display panels.
  • Embodiments of the present application provide a display panel and an electronic device to solve the technical problem that the frame width of the existing display panel cannot be further reduced.
  • An embodiment of the present application provides a display panel, including a display touch area and a frame area, the frame area includes a bending area and a binding area, and the display panel includes:
  • the driving circuit layer is formed with a driving circuit
  • the touch function layer is formed with a touch circuit
  • the display panel includes a first conductive layer and a second conductive layer
  • the driving circuit is electrically connected to the binding terminal located in the binding area through the first conductive layer
  • the contact The control circuit is connected to the binding terminal located in the binding area through the first conductive layer after crossing the bending area through the second conductive layer.
  • the first conductive layer in the bending region, is located on a side where the second conductive layer is bent, and the first conductive layer is configured as a constant voltage signal circuit.
  • the second conductive layer includes a touch circuit connection part and a binding terminal connection part, one end of the touch circuit connection part is electrically connected to the touch circuit, and the other end is electrically connected to the touch circuit.
  • One end of the binding terminal connection part is connected in the bending area, and the other end of the binding terminal connection part is connected to the binding terminal.
  • the traces of the binding terminal connection part are connected to the traces of the touch circuit connection part.
  • the included angle ranges from 30° to 150°.
  • the binding terminals include driving binding terminals and touch binding terminals, the touch binding terminals are located on both sides of the binding area, and the driving binding terminals are located on the In the middle of the binding area, the first conductive layer is electrically connected to the driving binding terminal, and the second conductive layer is electrically connected to the touch binding terminal.
  • the included angle formed by the wiring of the second conductive layer connected to the touch binding terminal is 90°. ° to 170°.
  • the first conductive layer is located in a middle region of the second conductive layer, and at least a part of the second conductive layer covers the first conductive layer.
  • the second conductive layer includes a plurality of touch traces, each of the touch traces includes a plurality of curved parts and a plurality of straight parts, and the curved parts and the straight parts Interval settings.
  • the curved portion includes a first curved portion and a second curved portion, the bending direction of the first curved portion is opposite to that of the second curved portion; One end is connected to the first bending part, and the other end is connected to the second bending part.
  • the embodiment of the present application also provides an electronic device, including a display panel, a driver chip, and a touch chip.
  • the display panel includes a display touch area and a frame area, and the frame area includes a bending area and a binding area.
  • the display Panels include:
  • the driving circuit layer is formed with a driving circuit
  • the touch function layer is formed with a touch circuit
  • the display panel includes a first conductive layer and a second conductive layer
  • the driving circuit is electrically connected to the binding terminal located in the binding area through the first conductive layer
  • the contact The control circuit is connected to the binding terminal located in the binding area through the first conductive layer after crossing the bending area through the second conductive layer.
  • the first conductive layer in the bending region, is located on a side where the second conductive layer is bent, and the first conductive layer is configured as a constant voltage signal circuit.
  • the second conductive layer includes a touch circuit connection part and a binding terminal connection part, one end of the touch circuit connection part is electrically connected to the touch circuit, and the other end is electrically connected to the touch circuit.
  • One end of the binding terminal connection part is connected in the bending area, and the other end of the binding terminal connection part is connected to the binding terminal.
  • the traces of the binding terminal connection part are connected to the traces of the touch circuit connection part.
  • the included angle ranges from 30° to 150°.
  • the binding terminal includes a driving binding terminal and a touch binding terminal, the touch binding terminal is located on both sides of the binding area, and the driving binding terminal is located on the In the middle of the binding area, the first conductive layer is electrically connected to the driving binding terminal, and the second conductive layer is electrically connected to the touch binding terminal.
  • the included angle formed by the connection of the second conductive layer and the touch binding terminal is 90°. ° to 170°.
  • the first conductive layer is located in a middle region of the second conductive layer, and at least a part of the second conductive layer covers the first conductive layer.
  • the second conductive layer includes a plurality of touch traces, each of the touch traces includes a plurality of bent parts and a plurality of straight parts, and the bent parts and the straight parts Interval settings.
  • the curved portion includes a first curved portion and a second curved portion, the bending direction of the first curved portion is opposite to that of the second curved portion; One end is connected to the first bending part, and the other end is connected to the second bending part.
  • Embodiments of the present application provide a display panel and an electronic device.
  • the display panel includes a display touch area and a frame area, and the frame area includes a bending area and a binding area.
  • the display panel includes: formed with The driving circuit layer of the driving circuit, the light emitting function layer, and the touch function layer formed with the touch circuit; in the frame area, the display panel includes a first conductive layer and a second conductive layer, and the driving circuit passes through the The first conductive layer is electrically connected to the binding terminal located in the binding area, and the touch circuit is connected to the binding terminal located in the binding area through the second conductive layer after crossing the bending area through the first conductive layer. zone binding terminals.
  • the driving circuit is electrically connected to the binding terminal located in the binding area through the first conductive layer
  • the touch circuit is connected to the binding terminal located in the binding area through the second conductive layer after crossing the bending area through the first conductive layer. terminals.
  • the touch circuit does not need to be rewired to the driving circuit layer, and the distance between the second conductive layer and the first conductive layer in the bending area can be saved, so that the bending area of the display panel can be closer to the display touch area.
  • the distance between the edge of the display touch area and the frame area is smaller, so that the frame of the display panel is narrower, thereby solving the technical problem that the frame width of the existing display panel cannot be further reduced.
  • FIG. 1 is a schematic structural diagram of a lower frame of a display panel in the prior art.
  • Fig. 2 is a cross-sectional view along the line A-A of Fig. 1 .
  • Fig. 3 is a sectional view along the B-B direction of Fig. 1 .
  • FIG. 4 is a schematic structural diagram of a lower frame of a display panel according to an embodiment of the present application.
  • Fig. 5 is a sectional view in the direction A'-A' of Fig. 4 .
  • Fig. 6 is a cross-sectional view along the B'-B' direction of Fig. 4 .
  • FIG. 7 is a schematic structural diagram of the touch wiring on the second conductive layer according to the embodiment of the present application.
  • Embodiments of the present application provide a display panel and an electronic device to solve the technical problem that the frame width of the existing display panel cannot be further reduced.
  • the display panel in the embodiment of the present application includes a display touch area and a frame area, the frame area includes a bending area and a binding area, the display panel includes a driving circuit layer, a light emitting function layer and a touch function layer; the driving circuit layer is formed with a driving circuit; The touch function layer is formed with a touch circuit; in the frame area, the display panel includes a first conductive layer and a second conductive layer, and the driving circuit is electrically connected to the binding terminal located in the binding area through the first conductive layer, and the touch circuit The binding terminal located in the binding area is connected through the first conductive layer after crossing the bending area through the second conductive layer.
  • Figure 4 is a schematic structural diagram of the lower frame of the display panel of the embodiment of the present application
  • Figure 5 is a cross-sectional view in the direction A'-A' of Figure 4
  • Figure 6 is a cross-sectional view of B'-B in Figure 4 'A section view in the direction.
  • the display panel includes a display touch area 1 and a frame area 2.
  • the frame area 2 includes a bending area 21 and a binding area 22.
  • the display panel specifically includes a driving circuit layer 100, a light-emitting function layer 200 and a touch function layer 300; the driving circuit layer 100 A driving circuit is formed; the touch function layer 300 is formed with a touch circuit; in the frame area 2, the display panel includes a first conductive layer 201 and a second conductive layer 202, and the driving circuit is electrically connected to the bonding layer through the first conductive layer 201.
  • the touch circuit connects to the binding terminals 221 in the binding area 22 through the first conductive layer 201 after crossing the bending area 21 through the second conductive layer 202 .
  • the frame area 2 is located below the display touch area 1 .
  • the frame area 2 is bent downward along the bending area 21, and finally the display presented in the electronic device
  • the width h of the lower border of the panel is the distance between the upper end of the bending area 21 and the lower end of the display touch area 1 .
  • FIG. 1 is a schematic structural view of the lower frame of a display panel in the prior art
  • FIG. 2 is a cross-sectional view along the A-A direction of FIG. 1
  • FIG. 3 is a cross-sectional view along the B-B direction of FIG. 1 .
  • the second conductive layer 202 is switched to the first conductive layer 201 above the bending area 21. Because of this switching structure, the width h of the lower frame of the display panel after bending cannot be further reduced.
  • the driving circuit is electrically connected to the binding terminal 221 located in the binding area 22 through the first conductive layer 201, and the touch circuit is connected to the terminal located in the binding area 22 through the second conductive layer 202 after crossing the bending area 21 through the first conductive layer 201.
  • the binding terminal 221 of the binding area 22 .
  • the touch circuit does not need to be rewired to the driving circuit layer, and the distance from the second conductive layer 202 to the first conductive layer 201 in the bending area 21 can be saved, so that the bending area 21 of the display panel can be closer to the display panel.
  • the distance between the edge of the display touch area 1 and the frame area 2 is smaller, so that the frame of the display panel is narrower.
  • the first conductive layer 201 is located on the side where the second conductive layer 202 is bent, and the first conductive layer 201 is configured as a constant voltage signal circuit. This ensures stable transmission of the touch signal of the touch circuit and the drive signal of the drive circuit.
  • the second conductive layer 202 includes a touch circuit connection part and a binding terminal connection part. One end of the touch circuit connection part is electrically connected to the touch circuit, and the other end is connected to one end of the binding terminal connection part in the bending area 21. The other end of the fixed terminal connection part is connected to the binding terminal. In this way, when the display panel is bent, the second conductive layer 202 is bent in the bending area 21 along the connection between the touch circuit connection part and the binding terminal connection part, so as to improve the bending effect of the bending area 21 .
  • the included angle formed by the connection between the wiring of the binding terminal connection part and the wiring connection of the touch circuit connection part ranges from 30° to 150°.
  • the setting of such an angle can make the traces of the second conductive layer 202 be well connected after being bent.
  • the binding terminal 221 includes a driving binding terminal 2211 and a touch binding terminal 2212, the touch binding terminal 2212 is located on both sides of the binding area 22, the driving binding terminal 2211 is located in the middle of the binding area 22, and the first conductive layer 201 is electrically connected to the driving binding terminal 2212 , and the second conductive layer 202 is electrically connected to the touch binding terminal 2212 .
  • the first conductive layer 201 and the second conductive layer 202 can be bent better without interference with each other.
  • the angle formed between the edge of the second conductive layer 202 and the touch binding terminal ranges from 90° to 170°. This angle setting enables the second conductive layer 202 to form a good connection with the binding terminal when it is bent.
  • the first conductive layer 201 is located in the middle region of the second conductive layer 202 , and at least a part of the second conductive layer 202 covers the first conductive layer 201 . In this way, when the first conductive layer 201 and the second conductive layer 202 are bent, they can be bent better without interfering with each other.
  • the drive circuit layer 100 includes a flexible substrate 110, and on the flexible substrate 110, a barrier layer 111, a buffer layer 112, an active layer 113, a first gate insulating layer 114, a first gate 115, a second Two gate insulating layers 116 , a second gate 117 , a dielectric layer 118 , source and drain electrodes 119 and a planarization layer 120 .
  • the first gate 115 is located on the first gate insulating layer 114
  • a part of the second gate insulating layer 116 covers the first gate 115
  • another part covers the first gate insulating layer 114 .
  • the second gate 117 is located on the second gate insulating layer 116 , a part of the dielectric layer 118 covers the second gate 117 , and another part covers the second gate insulating layer 116 .
  • the barrier layer 111 is located on the flexible substrate 110, the buffer layer 112 is located on the barrier layer 111, the active layer 113 is located on the buffer layer 112, the first gate insulating layer 114 is located on the active layer 113, and the first gate 115 is located on the first On the gate insulating layer 114, the second gate insulating layer 116 is located on the first gate insulating layer 114 and covers the first gate 115, the second gate 117 is located on the second gate insulating layer 116, and the dielectric layer 118 Located on the second gate insulating layer 116 and covering the second gate 117 , the source and drain electrodes 119 are located on the dielectric layer 118 , and the planarization layer 120 is located on the dielectric layer 118 and covering the source and drain electrodes 119 .
  • the source and drain electrodes 119 include a source electrode 1191 and a drain electrode 1192 .
  • the source electrode 1191 and the drain electrode 1192 are located on the planarization layer 120 and are connected to the active layer through semiconductor components.
  • the dielectric layer 118, the second gate insulating layer 116 and the first gate insulating layer 114 are all provided with through holes, and the active layer 113 is provided with a source connection region and a drain connection region, and the semiconductor components pass through the through holes
  • the source 1191 is connected to the source connection region of the active layer 113 through the semiconductor component
  • the drain 1192 is connected to the drain connection region of the active layer 113 through the semiconductor component.
  • the source connection region and the drain connection region are conductorized metal oxide semiconductor materials.
  • the orthographic projection of the barrier layer 111 on the flexible substrate 110 covers the orthographic projection of the active layer 113 on the flexible substrate 110, so that the barrier layer 111 can completely cover the active layer 113, preventing the active layer 113 from being irradiated by light, avoiding The threshold voltage of the thin film transistor produces a negative drift.
  • the first conductive layer 201 is located on the dielectric layer and covered by the planarization layer. In this way, the dielectric layer and the planarization layer form an effective protection for the first conductive layer 201 .
  • the light-emitting structure layer 200 includes an anode layer 2001, and on the anode layer 2001, a pixel definition layer 2002, a light-emitting layer (OLED) 2003, and a cathode layer are sequentially arranged toward the light-emitting direction. .
  • the anode layer 2001 is located on the planarization layer 120
  • the pixel definition layer 2002 is located on the anode layer 2001
  • the light emitting layer 2003 is located on the pixel definition layer 2002
  • the cathode layer is located on the light emitting layer 2003 .
  • the pixel definition layer 2002 is separated to form a pixel opening, the light-emitting layer 2003 is tiled on the anode layer 2001 for the pixel opening, the cathode layer is tiled on the light-emitting layer 2003 for the pixel opening, and the anode layer 2001 passes through the anode via hole and the film
  • the drain 1192 is in electrical contact
  • the source 1191 is connected to the positive pole of the external power supply
  • the cathode layer is electrically connected to the negative pole of the external power supply through the power supply wiring layer.
  • the anode layer 2001 and the cathode layer are set at 2V to 10V
  • the anode layer 2001 generates holes
  • the cathode layer generates electrons, which meet in the light-emitting layer 2003.
  • the electrons and holes are respectively negatively charged and positively charged. They attract each other and excite the organic materials in the light-emitting layer 2003 to emit light to realize the display panel normal work.
  • the brightness of the light emitting layer 2003 can be adjusted, the higher the voltage, the higher the brightness, and vice versa. According to its different formulas, it can produce three primary colors of red, green and blue (R, G, B) to form basic colors.
  • the light-emitting functional layer includes a pixel definition layer, and the second conductive layer 202 is located on the pixel definition layer, and the pixel definition layer forms a good support for the second conductive layer 202 .
  • the display panel of the embodiment of the present application further includes a support layer 121 , an encapsulation layer 400 and a touch insulation layer 500 .
  • the encapsulation layer 400 covers the pixel definition layer 2002 and the light emitting layer 2003
  • the touch insulation layer 500 covers the touch function layer 300 .
  • the support layer 121 is located between the encapsulation layer 400 and the light emitting layer 2003 , providing support for the encapsulation layer 400 , the touch function layer 300 and the touch insulation layer 500 on the encapsulation layer 400 .
  • the touch insulating layer 500 is specifically an organic insulating layer.
  • the organic insulating layer 500 covers the touch function layer 300; in the frame area 2, the organic insulating layer 500 covers the Pixel definition layer 2002.
  • the organic insulating layer 500 can insulate and protect the touch function layer 300 to prevent the touch signal from being interfered by other electrical signals, resulting in touch failure.
  • FIG. 7 it is a schematic structural diagram of the touch trace on the second conductive layer of the embodiment of the present application.
  • the second conductive layer 202 includes a plurality of touch traces, and each touch trace includes A plurality of curved portions 2021 and a plurality of straight portions 2022 are arranged at intervals between the curved portions 2021 and the straight portions 2022 .
  • the overall toughness of the touch wiring can be improved.
  • the touch wiring is not easy to break, and the bending angle can also be larger.
  • the curved portion 2021 includes a first curved portion 20211 and a second curved portion 20212, the bending direction of the first curved portion 20211 is opposite to that of the second curved portion 20212; One bending part 20211, the other end is connected to the second bending part 20212.
  • the overall toughness of the touch trace can be further improved, and the angle at which the second conductive layer can be bent is larger, so that the width h of the frame area after bending is smaller.
  • the length of the curved portion 2021 in the vertical direction is not less than the length of the straight portion 2022 , which can further improve the overall toughness of the touch traces and make the bending angle of the touch traces larger.
  • the manufacturing process of the display panel in the embodiment of the present application adopts an OLED evaporation process and a thin film encapsulation process.
  • the OLED evaporation process includes the following steps:
  • the ITO (conductive glass) substrate is subjected to pre-evaporation treatment: the ITO substrate is scrubbed with cleaning solution, ultrasonic cleaning with cleaning solution and ultrasonic cleaning with pure water three times, and then baked and placed in a vacuum sample chamber Vacuumize until the vacuum degree is 5.0E-0.4Pa, and the rotation speed of the rotating tray is 5r/min.
  • the pretreated ITO substrate in the evaporation cabin, control the vacuum degree in the evaporation cabin to 2.0E-5Pa, stack the evaporation hole injection layer, the hole transport layer, the electron blocking layer on the ITO substrate in sequence.
  • layer in which the hole injection layer is heated to 235°C with teraniline derivatives at a rate of 0.97 ⁇ /s-1.03 ⁇ /s, and at the same time heated to 265°C with tetrafluorobenzonitrile, and the two are vapor-deposited with 3% doping made.
  • the hole transport layer is heated to 235°C with terphenylamine derivatives at a rate of 0.97 ⁇ /s-1.03 ⁇ /s, separately evaporated.
  • the electron blocking layer is formed by separately evaporating spirofluorene derivatives heated to 225° C. at a rate of 0.97 ⁇ /s-1.03 ⁇ /s.
  • the platinum compound (light-emitting guest material) and DPQP (hole-type host material) were placed in the same rotating tray by ternary evaporation method, and 2,4,6-triphenyl-1,3,5 - Derivatives of triazine are placed outside the rotating tray, and derivatives of 2,4,6-triphenyl-1,3,5-triazine are heated sequentially (heating temperature is 225°C, evaporation rate is 0.91 ⁇ / s-0.97 ⁇ /s) and platinum compound (heating temperature is 255°C, vapor deposition rate is 0.11 ⁇ /s-0.13 ⁇ /s), after the platinum compound vapor deposition rate is stable, heat DPQP to 225°C, when platinum compound and DPQP When the evaporation rate reaches 1.06 ⁇ /s, start the rotating tray, control the rotation speed of the rotating tray to 10r/min, and then open the baffle to continue the evaporation to obtain a luminescent layer.
  • the electron transport layer, the electron injection layer and the cathode are sequentially laminated, wherein the electron transport layer is heated to 285 ° C with 8-hydroxyquinoline lithium (LiQ) and anthracene derivatives, and the speed is mixed. made.
  • the electron injection layer is formed by vapor deposition of metal Yb heated to 1000° C. at a high rate.
  • the cathode is formed by heating metal Ag to 1200° C. at a rate of 0.97 ⁇ /s-1.03 ⁇ /s and separately evaporating, and finally obtains a finished OLED device.
  • the embodiment of the present application also provides an electronic device, including a display panel, a driver chip, and a touch chip.
  • the display panel includes a display touch area and a frame area, and the frame area includes a bending area and a binding area.
  • the display Panels include:
  • the driving circuit layer is formed with a driving circuit
  • the touch function layer is formed with a touch circuit
  • the display panel includes a first conductive layer and a second conductive layer
  • the driving circuit is electrically connected to the binding terminal located in the binding area through the first conductive layer
  • the contact The control circuit is connected to the binding terminal located in the binding area through the first conductive layer after crossing the bending area through the second conductive layer.
  • the first conductive layer in the bending region, is located on a side where the second conductive layer is bent, and the first conductive layer is configured as a constant voltage signal circuit.
  • the second conductive layer includes a touch circuit connection part and a binding terminal connection part, one end of the touch circuit connection part is electrically connected to the touch circuit, and the other end is connected to the binding terminal.
  • One end of the fixed terminal connection part is connected in the bending area, and the other end of the binding terminal connection part is connected to the binding terminal.
  • the traces of the binding terminal connection part and the traces of the touch circuit connection part are connected to form a clip
  • the angular range is from 30° to 150°.
  • the binding terminal includes a driving binding terminal and a touch binding terminal, the touch binding terminal is located on both sides of the binding area, and the driving binding terminal is located on the In the middle of the binding area, the first conductive layer is electrically connected to the driving binding terminal, and the second conductive layer is electrically connected to the touch binding terminal.
  • the included angle formed by the wiring of the second conductive layer connected to the touch binding terminal is 90° to 170°.
  • the first conductive layer is located in the middle region of the second conductive layer, and at least a part of the second conductive layer covers the first conductive layer.
  • the second conductive layer includes a plurality of touch wires, each of the touch wires includes a plurality of curved parts and a plurality of straight parts, and the curved parts and the straight parts are connected to each other. interval setting.
  • the curved portion includes a first curved portion and a second curved portion, the bending direction of the first curved portion is opposite to that of the second curved portion; one end of the straight portion The first bending part is connected, and the other end is connected to the second bending part.
  • the driving binding terminal is electrically connected to the driving chip
  • the touch binding terminal is electrically connected to the touch chip.
  • the driving chip controls the display work of the display touch area by driving the binding terminal and the driving circuit.
  • the touch chip transmits the touch signal through the touch binding terminal, the touch circuit and the display touch area.
  • the driving circuit is electrically connected to the binding terminal located in the binding area through the first conductive layer
  • the touch circuit is connected to the binding terminal located in the binding area through the second conductive layer after crossing the bending area through the first conductive layer. binding terminal.
  • the touch circuit does not need to be rewired to the driving circuit layer, and the distance between the second conductive layer and the first conductive layer in the bending area can be saved, so that the bending area of the display panel can be closer to the display touch area.
  • the distance between the edge of the display touch area and the frame area is smaller, so that the frame of the display panel is narrower, thereby solving the technical problem that the frame width of the existing display panel cannot be further reduced.
  • Embodiments of the present application provide a display panel and an electronic device.
  • the display panel includes a display touch area and a frame area, the frame area includes a bending area and a binding area, and the display panel includes a driving circuit layer, a light-emitting function layer, and a touch function layer;
  • the driving circuit layer is formed with a driving circuit;
  • the touch function layer is formed with a touch circuit; in the frame area, the display panel includes a first conductive layer and a second conductive layer, and the driving circuit is electrically connected to the bonding area through the first conductive layer
  • the touch circuit is connected to the binding terminal located in the binding area through the first conductive layer after crossing the bending area through the second conductive layer.
  • the driving circuit is electrically connected to the binding terminals in the binding area through the first conductive layer, and the touch circuit is connected to the binding terminals in the binding area through the first conductive layer after crossing the bending area through the second conductive layer.
  • the touch circuit does not need to be rewired to the driving circuit layer, and the distance between the second conductive layer and the first conductive layer in the bending area can be saved, so that the bending area of the display panel can be closer to the display touch area.
  • the distance between the edge of the display touch area and the frame area is smaller, so that the frame of the display panel is narrower, thereby solving the technical problem that the frame width of the existing display panel cannot be further reduced.

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Abstract

一种显示面板及电子设备，显示面板包括显示触控区（1）和边框区（2），边框区（2）包括弯曲区（21）和绑定区（22），显示面板具体包括：驱动电路层（100）、发光功能层（200）、触控功能层（300），驱动电路通过第一导电层（201）电连接绑定区（22）内的绑定端子（221），触控电路通过第二导电层（202）跨越弯曲区（21）后通过第一导电层（201）连接绑定区（22）的绑定端子（221）。显示面板的边框宽度更小。

Description

显示面板和电子设备 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板和电子设备。
 背景技术
有机发光二极管(Organic Light Emitting Display，OLED)显示面板具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽等诸多优点，而被广泛地应用于智能手机、平板电脑、全彩电视等。
现有OLED显示面板会直接在显示面板的封装层上面沉积触控电路，替代外挂式触控屏，来节约成本。目前自容式触控显示面板上大多集成了图像传感器、指纹传感器、压力传感器多个传感器，传感器传输信号线较多，为了较好的布设这些传输信号线，如图1和图2所示，一般将触控电路走线在屏幕下边框弯曲区的上方换线到显示面板的驱动电路走线层，因为存在这个换线结构，导致显示面板的下边框宽度h无法进一步的缩小，无法进一步满足用户对显示面板极致窄边框的追求。
 技术问题
本申请实施例提供一种显示面板和电子设备，用以解决现有显示面板边框宽度不能进一步缩减的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种显示面板，包括显示触控区和边框区，所述边框区包括弯曲区和绑定区，所述显示面板包括：
驱动电路层，形成有驱动电路；
发光功能层；
触控功能层，形成有触控电路；
在所述边框区内，所述显示面板包括第一导电层和第二导电层，所述驱动电路通过所述第一导电层电连接位于所述绑定区内的绑定端子，所述触控电路通过所述第二导电层跨越所述弯曲区后通过所述第一导电层连接位于所述绑定区的绑定端子。
在本申请的显示面板中，在所述弯曲区内，所述第一导电层位于所述第二导电层进行弯曲的一侧，且所述第一导电层设为定电压信号电路。
在本申请的显示面板中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
在本申请的显示面板中，所述绑定端子连接部与所述触控电路连接部连接时，所述绑定端子连接部的走线与所述触控电路连接部的走线连接形成的夹角范围为30°至150°。
在本申请的显示面板中，所述绑定端子包括驱动绑定端子和触控绑定端子，所述触控绑定端子位于所述绑定区的两侧，所述驱动绑定端子位于所述绑定区的中部，所述第一导电层与所述驱动绑定端子电连接，所述第二导电层与所述触控绑定端子电连接。
在本申请的显示面板中，所述第二导电层与所述触控绑定端子连接时，所述第二导电层的走线与所述触控绑定端子连接形成的夹角范围为90°至170°。
在本申请的显示面板中，所述第一导电层位于所述第二导电层的中间区域，并且所述第二导电层至少一部分覆盖在所述第一导电层上。
在本申请的显示面板中，所述第二导电层包括多个触控走线，每个所述触控走线包括多个弯曲部和多个直线部，所述弯曲部和所述直线部互相间隔设置。
在本申请的显示面板中，所述弯曲部包括第一弯曲部和第二弯曲部，所述第一弯曲部的弯曲方向与所述第二弯曲部的弯曲方向相反；一个所述直线部的一端连接所述第一弯曲部，另一端连接所述第二弯曲部。
本申请实施例还提供一种电子设备，包括显示面板、驱动芯片和触控芯片，所述显示面板包括显示触控区和边框区，所述边框区包括弯曲区和绑定区，所述显示面板包括：
驱动电路层，形成有驱动电路；
发光功能层；
触控功能层，形成有触控电路；
在所述边框区内，所述显示面板包括第一导电层和第二导电层，所述驱动电路通过所述第一导电层电连接位于所述绑定区内的绑定端子，所述触控电路通过所述第二导电层跨越所述弯曲区后通过所述第一导电层连接位于所述绑定区的绑定端子。
在本申请的电子设备中，在所述弯曲区内，所述第一导电层位于所述第二导电层进行弯曲的一侧，且所述第一导电层设为定电压信号电路。
在本申请的电子设备中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
在本申请的电子设备中，所述绑定端子连接部与所述触控电路连接部连接时，所述绑定端子连接部的走线与所述触控电路连接部的走线连接形成的夹角范围为30°至150°。
在本申请的电子设备中，所述绑定端子包括驱动绑定端子和触控绑定端子，所述触控绑定端子位于所述绑定区的两侧，所述驱动绑定端子位于所述绑定区的中部，所述第一导电层与所述驱动绑定端子电连接，所述第二导电层与所述触控绑定端子电连接。
在本申请的电子设备中，所述第二导电层与所述触控绑定端子连接时，所述第二导电层的走线与所述触控绑定端子连接形成的夹角范围为90°至170°。
在本申请的电子设备中，所述第一导电层位于所述第二导电层的中间区域，并且所述第二导电层至少一部分覆盖在所述第一导电层上。
在本申请的电子设备中，所述第二导电层包括多个触控走线，每个所述触控走线包括多个弯曲部和多个直线部，所述弯曲部和所述直线部互相间隔设置。
在本申请的电子设备中，所述弯曲部包括第一弯曲部和第二弯曲部，所述第一弯曲部的弯曲方向与所述第二弯曲部的弯曲方向相反；一个所述直线部的一端连接所述第一弯曲部，另一端连接所述第二弯曲部。
 有益效果
本申请的有益效果：本申请实施例提供一种显示面板和电子设备，显示面板包括显示触控区和边框区，所述边框区包括弯曲区和绑定区，所述显示面板包括：形成有驱动电路的驱动电路层、发光功能层、形成有触控电路的触控功能层；在所述边框区内，所述显示面板包括第一导电层和第二导电层，所述驱动电路通过所述第一导电层电连接位于所述绑定区内的绑定端子，所述触控电路通过所述第二导电层跨越所述弯曲区后通过所述第一导电层连接位于所述绑定区的绑定端子。本申请实施例中，驱动电路通过第一导电层电连接位于绑定区内的绑定端子，触控电路通过第二导电层跨越弯曲区后通过第一导电层连接位于绑定区的绑定端子。这样触控电路不需要换线到驱动电路层，可以省去第二导电层在弯曲区换线到的第一导电层的这段距离，使显示面板的弯曲区可以更靠近显示触控区，在边框区域弯折后，显示触控区的边缘与边框区的间距更小，达到显示面板的边框更窄的效果，从而解决现有显示面板边框宽度不能进一步缩减的技术问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有技术显示面板下边框结构示意图。
图2是图1的A-A方向上的剖面图。
图3是图1的B-B方向上的剖面图。
图4是本申请实施例显示面板下边框结构示意图。
图5是图4的A’-A’方向上的剖面图。
图6是图4的B’-B’方向上的剖面图。
图7是本申请实施例第二导电层上触控走线的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相近的单元是用以相同标号表示。
本申请实施例提供一种显示面板和电子设备，用以解决现有显示面板边框宽度不能进一步缩减的技术问题。
本申请实施例的显示面板包括显示触控区和边框区，边框区包括弯曲区和绑定区，显示面板包括驱动电路层、发光功能层和触控功能层；驱动电路层形成有驱动电路；触控功能层形成有触控电路；在边框区内，显示面板包括第一导电层和第二导电层，驱动电路通过第一导电层电连接位于绑定区内的绑定端子，触控电路通过第二导电层跨越弯曲区后通过第一导电层连接位于绑定区的绑定端子。
如图4至图6所示，图4为本申请实施例显示面板下边框结构示意图，图5是图4的A’-A’方向上的剖面图；图6是图4的B’-B’方向上的剖面图。显示面板包括显示触控区1和边框区2，边框区2包括弯曲区21和绑定区22，显示面板具体包括驱动电路层100、发光功能层200和触控功能层300；驱动电路层100形成有驱动电路；触控功能层300形成有触控电路；在边框区2内，显示面板包括第一导电层201和第二导电层202，驱动电路通过第一导电层201电连接位于绑定区22内的绑定端子221，触控电路通过第二导电层202跨越弯曲区21后通过第一导电层201连接位于绑定区22内的绑定端子221。
基于图4的布局方向，在本申请实施例中，边框区2为位于显示触控区1的下方。基于图5和图6的方向，在将显示面板组装到电子设备（例如手机、平板电脑）中时，沿着弯曲区21将边框区2向下弯折，最后在电子设备中呈现出的显示面板的下边框宽度h就是弯曲区21上端与显示触控区1下端的间距。
如图1至图3所示，图1是现有技术显示面板下边框结构示意图，图2是图1的A-A方向上的剖面图，图3是图1的B-B方向上的剖面图。现有技术中，一般将第二导电层202在弯曲区21的上方换线到第一导电层201，因为存在这个换线结构，导致显示面板弯曲后的下边框的宽度h无法进一步的缩小。
本申请实施例中，驱动电路通过第一导电层201电连接位于绑定区22内的绑定端子221，触控电路通过第二导电层202跨越弯曲区21后通过第一导电层201连接位于绑定区22的绑定端子221。这样触控电路不需要换线到驱动电路层，可以省去第二导电层202在弯曲区21换线到的第一导电层201的这段距离，使显示面板的弯曲区21可以更靠近显示触控区1，在边框区2域弯折后，显示触控区1的边缘与边框区2的间距更小，达到显示面板的边框更窄的效果。
在弯曲区21内，第一导电层201位于第二导电层202进行弯曲的一侧，且第一导电层201设为定电压信号电路。这样保证触控电路的触控信号和驱动电路的驱动信号可以稳定的传输。
第二导电层202包括触控电路连接部和绑定端子连接部，触控电路连接部的一端与触控电路电连接，另一端与绑定端子连接部的一端在弯曲区21内连接，绑定端子连接部的另一端与绑定端子连接。这样，在显示面板弯曲时，第二导电层202在弯曲区21内沿着触控电路连接部与绑定端子连接部的连接处进行弯曲，提升弯曲区21的弯曲效果。
绑定端子连接部与触控电路连接部连接时，绑定端子连接部的走线与触控电路连接部的走线连接形成的夹角范围为30°至150°。这种角度的设置，可以使第二导电层202在弯曲后，走线还可以进行良好的连接。
绑定端子221包括驱动绑定端子2211和触控绑定端子2212，触控绑定端子2212位于绑定区22的两侧，驱动绑定端子2211位于绑定区22的中部，第一导电层201与驱动绑定端子2212电连接，第二导电层202与触控绑定端子2212电连接。这样在边框区2弯曲时，第一导电层201和第二导电层202更好的弯曲，彼此不会产生干涉。
第二导电层202与触控绑定端子连接时，第二导电层202的边缘与触控绑定端子形成的夹角范围为90°至170°。这种角度设置，使第二导电层202在弯曲时可以与绑定端子形成良好的连接。
第一导电层201位于第二导电层202的中间区域，并且第二导电层202至少一部分覆盖在第一导电层201上。这样在第一导电层201和第二导电层202弯曲时，可以更好的弯曲，并且彼此不会产生干涉。
驱动电路层100包括柔性基板110，以及在柔性基板110上，朝出光方向依次设置的阻隔层111、缓冲层112、有源层113、第一栅极绝缘层114、第一栅极115、第二栅极绝缘层116、第二栅极117、介电层118、源漏极119和平坦化层120。其中，第一栅极115位于第一栅极绝缘层114上，第二栅极绝缘层116一部分覆盖在第一栅极115上，另一部分覆盖在第一栅极绝缘层114上。第二栅极117位于第二栅极绝缘层116上，介电层118的一部分覆盖在第二栅极117上，另一部分覆盖在第二栅极绝缘层116上。
阻隔层111位于柔性基板110上，缓冲层112位于阻隔层111上，有源层113位于缓冲层112上，第一栅极绝缘层114位于有源层113上，第一栅极115位于第一栅极绝缘层114上，第二栅极绝缘层116位于第一栅极绝缘层114上且覆盖第一栅极115，第二栅极117位于第二栅极绝缘层116上，介电层118位于第二栅极绝缘层116上且覆盖第二栅极117，源漏极119位于介电层118上，平坦化层120位于介电层118上且覆盖源漏极119。
源漏极119包括源极1191和漏极1192，源极1191和漏极1192位于平坦化层120上，且均通过半导体构件与有源层连接。
介电层118、第二栅极绝缘层116和第一栅极绝缘层114上均设有通过孔，有源层113上设有源极连接区和漏极连接区，半导体构件穿过通过孔，源极1191通过半导体构件与有源层113的源极连接区连接，漏极1192通过半导体构件与有源层113的漏极连接区连接。源极连接区和漏极连接区为导体化的金属氧化物半导体材料。
阻隔层111在柔性基板110上的正投影覆盖有源层113在柔性基板110上的正投影，从而使阻隔层111能够对有源层113进行完全覆盖，防止有源层113受到光线照射，避免薄膜晶体管的阈值电压产生负漂。
本申请实施例中，在边框区2内，第一导电层201位于介电层上，并且被平坦化层覆盖。这样介电层和平坦化层对第一导电层201形成有效的保护。
本申请实施例中，在显示触控区1内，发光结构层200包括阳极层2001、以及在阳极层2001上，朝出光方向依次设置的像素定义层2002、发光层(OLED)2003和阴极层。
阳极层2001位于平坦化层120上、像素定义层2002位于阳极层2001上，发光层2003位于像素定义层2002上，阴极层位于发光层2003上。像素定义层2002分离设置形成像素开口，发光层2003对于像素开口的部分平铺在阳极层2001上，阴极层对于像素开口的部分平铺在发光层2003上，阳极层2001通过阳极过孔与薄膜晶体管层中漏极1192电性接触，源极1191与外接电源的正极相连，阴极层通过电源走线层与外接电源的负极电性连接，当阳极层2001与阴极层之间设置为2V至10V的直流电压时，阳极层2001产生空穴，阴极层产生电子，在发光层2003相遇，电子和空穴分别带负电和正电，它们相互吸引，激发发光层2003中有机材料发光，以实现显示面板的正常工作。通过控制阳极层2001与阴极层之间电压的大小，可调整发光层2003发光亮度，电压越大，亮度越高，反之越暗。依其不同的配方，可产生红、绿、蓝(R、G、B)三基色，构成基本色彩。
在边框区2内，发光功能层包括像素定义层，第二导电层202位于像素定义层上, 像素定义层对第二导电层202形成良好的支撑。
本申请实施例的显示面板还包括支撑层121、封装层400和触控绝缘层500。封装层400覆盖在像素定义层2002和发光层2003上，触控绝缘层500覆盖在触控功能层300上。支撑层121位于封装层400和发光层2003之间，为封装层400、触控功能层300及位于封装层400上的触控绝缘层500提供支撑。
本申请实施例中，触控绝缘层500具体为有机绝缘层，在显示触控区1内，有机绝缘层500覆盖在触控功能层300上；在边框区2内，有机绝缘层500覆盖在像素定义层2002上。有机绝缘层500可以对触控功能层300进行绝缘保护，避免触控信号被其他的电信号干扰，导致触控失效。
本申请实施例中，如图7所示，是本申请实施例第二导电层上触控走线的结构示意图，第二导电层202包括多个触控走线，每个触控走线包括多个弯曲部2021和多个直线部2022，弯曲部2021和直线部2022互相间隔设置。
这样可以提升触控走线的整体韧性，当第二导电层202在弯曲时，触控走线不容易折断，并且弯曲的角度也可以更大。
在一种实施例中，弯曲部2021包括第一弯曲部20211和第二弯曲部20212，第一弯曲部20211的弯曲方向与第二弯曲部20212的弯曲方向相反；一个直线部2022的一端连接第一弯曲部20211，另一端连接第二弯曲部20212。
这样可以进一步提升触控走线的整体韧性，第二导电层可以弯曲的角度更大，使弯折后的边框区宽度h更小。
基于图7所示的方向，弯曲部2021垂直方向上的长度不小于直线部2022的长度，这样可以进一步提升触控走线的整体韧性，使触控走线的弯曲角度更大。
本申请实施例的显示面板的制造工艺采用了OLED蒸镀工艺和薄膜封装工艺。其中，OLED蒸镀工艺包括以下步骤：
首先，对ITO（导电玻璃）基板进行蒸镀前处理：将ITO基板依次进行清洗液刷洗、清洗液超声清洗和重复三次纯水超声清洗，后进行烘烤处理，并置于真空进样室中抽真空至真空度为5.0E-0.4Pa、旋转托盘转速为5r/min。
其次，将前处理后的ITO基板置于蒸镀舱中，控制蒸镀舱中的真空度为2.0E-5Pa，在ITO基板上依次层叠蒸镀空穴注入层、空穴传输层、电子阻挡层，其中空穴注入层是采用三联苯胺衍生物加热到235℃、速率为0.97Å/s-1.03 Å/s，同时采用四氟苯腈加热到265℃，两者按3％掺杂蒸镀而成。所述空穴传输层是采用三联苯胺衍生物加热到235℃、速率为0.97Å/s-1.03 Å/s，单独蒸镀而成。所述电子阻挡层是采用螺芴衍生物加热到225℃、速率为0.97Å/s-1.03 Å/s单独蒸镀而成。
然后，采用三元蒸镀方式，将铂化合物(发光客体材料)和DPQP(空穴型主体材料)置于同一个旋转托盘中，将2,4,6-三苯基-1,3,5-三嗪的衍生物置于所述旋转托盘外，依次加热2,4,6-三苯基-1,3,5-三嗪的衍生物(加热温度为225℃、蒸镀速率为0.91Å/s-0.97 Å/s)和铂化合物(加热温度为255℃、蒸镀速率为0.11Å/s-0.13 Å/s)，待铂化合物蒸镀速率稳定后再加热DPQP至225℃，当铂化合物与DPQP的蒸镀速率达到1.06 Å/s时，启动旋转托盘，控制旋转托盘转速为10r/min，再打开挡板继续进行蒸镀，得发光层。
最后，于发光层上依次层叠蒸镀电子传输层、电子注入层和阴极，其中所述电子传输层是采用8-羟基喹啉锂(LiQ)与蒽衍生物加热到285℃、速率混合蒸镀而成。所述电子注入层是采用金属Yb加热到1000℃、速率单独蒸镀而成。所述阴极是采用金属Ag加热到1200℃、速率0.97Å/s-1.03 Å/s单独蒸镀而成，最后得到OLED器件成品。
本申请实施例还提供一种电子设备，包括显示面板、驱动芯片和触控芯片，所述显示面板包括显示触控区和边框区，所述边框区包括弯曲区和绑定区，所述显示面板包括：
驱动电路层，形成有驱动电路；
发光功能层；
触控功能层，形成有触控电路；
在所述边框区内，所述显示面板包括第一导电层和第二导电层，所述驱动电路通过所述第一导电层电连接位于所述绑定区内的绑定端子，所述触控电路通过所述第二导电层跨越所述弯曲区后通过所述第一导电层连接位于所述绑定区的绑定端子。
在一种实施例中，在所述弯曲区内，所述第一导电层位于所述第二导电层进行弯曲的一侧，且所述第一导电层设为定电压信号电路。
在一种实施例中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
在一种实施例中，所述绑定端子连接部与所述触控电路连接部连接时，所述绑定端子连接部的走线与所述触控电路连接部的走线连接形成的夹角范围为30°至150°。
在一种实施例中，所述绑定端子包括驱动绑定端子和触控绑定端子，所述触控绑定端子位于所述绑定区的两侧，所述驱动绑定端子位于所述绑定区的中部，所述第一导电层与所述驱动绑定端子电连接，所述第二导电层与所述触控绑定端子电连接。
在一种实施例中，所述第二导电层与所述触控绑定端子连接时，所述第二导电层的走线与所述触控绑定端子连接形成的夹角范围为90°至170°。
在一种实施例中，所述第一导电层位于所述第二导电层的中间区域，并且所述第二导电层至少一部分覆盖在所述第一导电层上。
在一种实施例中，所述第二导电层包括多个触控走线，每个所述触控走线包括多个弯曲部和多个直线部，所述弯曲部和所述直线部互相间隔设置。
在一种实施例中，所述弯曲部包括第一弯曲部和第二弯曲部，所述第一弯曲部的弯曲方向与所述第二弯曲部的弯曲方向相反；一个所述直线部的一端连接所述第一弯曲部，另一端连接所述第二弯曲部。
本申请实施例中，驱动绑定端子与驱动芯片电连接，触控绑定端子与触控芯片电连接。驱动芯片通过驱动绑定端子、驱动电路控制显示触控区的显示工作。触控芯片通过触控绑定端子、触控电路与显示触控区进行触控信号的传输。
本申请实施例的电子设备中，驱动电路通过第一导电层电连接位于绑定区内的绑定端子，触控电路通过第二导电层跨越弯曲区后通过第一导电层连接位于绑定区的绑定端子。这样触控电路不需要换线到驱动电路层，可以省去第二导电层在弯曲区换线到的第一导电层的这段距离，使显示面板的弯曲区可以更靠近显示触控区，在边框区域弯折后，显示触控区的边缘与边框区的间距更小，达到显示面板的边框更窄的效果，从而解决现有显示面板边框宽度不能进一步缩减的技术问题。
根据以上实施例可知：
本申请实施例提供一种显示面板和电子设备，显示面板包括显示触控区和边框区，边框区包括弯曲区和绑定区，显示面板包括驱动电路层、发光功能层和触控功能层；驱动电路层形成有驱动电路；触控功能层形成有触控电路；在边框区内，显示面板包括第一导电层和第二导电层，驱动电路通过第一导电层电连接位于绑定区内的绑定端子，触控电路通过第二导电层跨越弯曲区后通过第一导电层连接位于绑定区的绑定端子。驱动电路通过第一导电层电连接位于绑定区内的绑定端子，触控电路通过第二导电层跨越弯曲区后通过第一导电层连接位于绑定区的绑定端子。这样触控电路不需要换线到驱动电路层，可以省去第二导电层在弯曲区换线到的第一导电层的这段距离，使显示面板的弯曲区可以更靠近显示触控区，在边框区域弯折后，显示触控区的边缘与边框区的间距更小，达到显示面板的边框更窄的效果，从而解决现有显示面板边框宽度不能进一步缩减的技术问题。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板和电子设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其包括显示触控区和边框区，所述边框区包括弯曲区和绑定区，所述显示面板包括：
    驱动电路层，形成有驱动电路；
    发光功能层；
    触控功能层，形成有触控电路；
    在所述边框区内，所述显示面板包括第一导电层和第二导电层，所述驱动电路通过所述第一导电层电连接位于所述绑定区内的绑定端子，所述触控电路通过所述第二导电层跨越所述弯曲区后通过所述第一导电层连接位于所述绑定区的绑定端子。
  2. 如权利要求1所述的显示面板，其中，在所述弯曲区内，所述第一导电层位于所述第二导电层进行弯曲的一侧，且所述第一导电层设为定电压信号电路。
  3. 如权利要求1所述的显示面板，其中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
  4. 如权利要求2所述的显示面板，其中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
  5. 如权利要求4所述的显示面板，其中，所述绑定端子连接部与所述触控电路连接部连接时，所述绑定端子连接部的走线与所述触控电路连接部的走线连接形成的夹角范围为30°至150°。
  6. 如权利要求1所述的显示面板，其中，所述绑定端子包括驱动绑定端子和触控绑定端子，所述触控绑定端子位于所述绑定区的两侧，所述驱动绑定端子位于所述绑定区的中部，所述第一导电层与所述驱动绑定端子电连接，所述第二导电层与所述触控绑定端子电连接。
  7. 如权利要求6所述的显示面板，其中，所述第二导电层与所述触控绑定端子连接时，所述第二导电层的走线与所述触控绑定端子连接形成的夹角范围为90°至170°。
  8. 如权利要求6所述的显示面板，其中，所述第一导电层位于所述第二导电层的中间区域，并且所述第二导电层至少一部分覆盖在所述第一导电层上。
  9. 如权利要求1所述的显示面板，其中，所述第二导电层包括多个触控走线，每个所述触控走线包括多个弯曲部和多个直线部，所述弯曲部和所述直线部互相间隔设置。
  10. 如权利要求9所述的显示面板，其中，所述弯曲部包括第一弯曲部和第二弯曲部，所述第一弯曲部的弯曲方向与所述第二弯曲部的弯曲方向相反；一个所述直线部的一端连接所述第一弯曲部，另一端连接所述第二弯曲部。
  11. 一种电子设备，其包括显示面板、驱动芯片和触控芯片，所述显示面板包括显示触控区和边框区，所述边框区包括弯曲区和绑定区，所述显示面板包括：
    驱动电路层，形成有驱动电路；
    发光功能层；
    触控功能层，形成有触控电路；
    在所述边框区内，所述显示面板包括第一导电层和第二导电层，所述驱动电路通过所述第一导电层电连接位于所述绑定区内的绑定端子，所述触控电路通过所述第二导电层跨越所述弯曲区后通过所述第一导电层连接位于所述绑定区的绑定端子。
  12. 如权利要求11所述的电子设备，其中，在所述弯曲区内，所述第一导电层位于所述第二导电层进行弯曲的一侧，且所述第一导电层设为定电压信号电路。
  13. 如权利要求11所述的电子设备，其中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
  14. 如权利要求12所述的电子设备，其中，所述第二导电层包括触控电路连接部和绑定端子连接部，所述触控电路连接部的一端与所述触控电路电连接，另一端与所述绑定端子连接部的一端在所述弯曲区内连接，所述绑定端子连接部的另一端与所述绑定端子连接。
  15. 如权利要求14所述的电子设备，其中，所述绑定端子连接部与所述触控电路连接部连接时，所述绑定端子连接部的走线与所述触控电路连接部的走线连接形成的夹角范围为30°至150°。
  16. 如权利要求11所述的电子设备，其中，所述绑定端子包括驱动绑定端子和触控绑定端子，所述触控绑定端子位于所述绑定区的两侧，所述驱动绑定端子位于所述绑定区的中部，所述第一导电层与所述驱动绑定端子电连接，所述第二导电层与所述触控绑定端子电连接。
  17. 如权利要求16所述的电子设备，其中，所述第二导电层与所述触控绑定端子连接时，所述第二导电层的走线与所述触控绑定端子连接形成的夹角范围为90°至170°。
  18. 如权利要求16所述的电子设备，其中，所述第一导电层位于所述第二导电层的中间区域，并且所述第二导电层至少一部分覆盖在所述第一导电层上。
  19. 如权利要求11所述的电子设备，其中，所述第二导电层包括多个触控走线，每个所述触控走线包括多个弯曲部和多个直线部，所述弯曲部和所述直线部互相间隔设置。
  20. 如权利要求19所述的电子设备，其中，所述弯曲部包括第一弯曲部和第二弯曲部，所述第一弯曲部的弯曲方向与所述第二弯曲部的弯曲方向相反；一个所述直线部的一端连接所述第一弯曲部，另一端连接所述第二弯曲部。
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