WO2022264574A1 - Capteur de débit thermique et dispositif de commande de fluide - Google Patents

Capteur de débit thermique et dispositif de commande de fluide Download PDF

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Publication number
WO2022264574A1
WO2022264574A1 PCT/JP2022/011795 JP2022011795W WO2022264574A1 WO 2022264574 A1 WO2022264574 A1 WO 2022264574A1 JP 2022011795 W JP2022011795 W JP 2022011795W WO 2022264574 A1 WO2022264574 A1 WO 2022264574A1
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WO
WIPO (PCT)
Prior art keywords
heat
thermal
flow sensor
conductive member
electric resistance
Prior art date
Application number
PCT/JP2022/011795
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English (en)
Japanese (ja)
Inventor
浩之 岡野
Original Assignee
株式会社堀場エステック
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Filing date
Publication date
Application filed by 株式会社堀場エステック filed Critical 株式会社堀場エステック
Priority to JP2023529558A priority Critical patent/JPWO2022264574A1/ja
Publication of WO2022264574A1 publication Critical patent/WO2022264574A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow

Definitions

  • the present invention relates to a thermal flow sensor and a fluid control device equipped with this thermal flow sensor.
  • a thermal flow sensor has a pair of electrical resistance wires wound around a thin tube, and measures the flow rate of the fluid by utilizing the difference in temperature between the upstream and downstream sides when the fluid flows through the thin tube. It is something to do.
  • Patent Document 1 As such a thermal flow sensor, in Patent Document 1, in order to increase the response speed, it is equipped with a radiator that dissipates the heat of the electric resistance wire to the outside, and is configured to quickly stabilize the temperature distribution of the fluid. There is something
  • the measured flow rate may be affected by the temperature.
  • the temperature decreases when the fluid expands. It may be transmitted to the electric resistance wire.
  • heat generated by a CPU or the like that controls flow rate calculation or the like is transmitted to the electric resistance wire via a radiator.
  • the present invention has been made to solve the above-mentioned problems, and it is intended to quickly stabilize the temperature distribution of the fluid, improve the response speed, and reduce the external thermal influence on the measured flow rate.
  • the main task is to reduce it.
  • the thermal flow sensor according to the present invention includes a pair of electric resistance wires wound around a pipe through which a fluid flows, a heat radiation part for radiating heat from the electric resistance wires to the outside, and a heat radiation part around the heat radiation part. and a low thermal conductive member having a thermal conductivity lower than that of the heat radiating portion.
  • the low heat conductive member having a lower thermal conductivity than the heat radiating portion is provided around the heat radiating portion, the heat transfer from the outside to the heat radiating portion is suppressed by the low heat conductive member. can do. As a result, it is possible to quickly stabilize the temperature distribution of the fluid, improve the response speed, and reduce the external thermal influence on the measured flow rate.
  • the heat radiating portions are provided on the upstream side and the downstream side of the pair of electric resistance wires, respectively, and the low thermal conductive member has a flat plate shape that supports these heat radiating portions.
  • the flat plate-shaped low thermal conductive member that supports the pair of heat radiating parts is used, it is preferable to use a large low thermal conductive member compared to, for example, a frame-shaped member described later. It is possible to more reliably suppress the transmission of heat from the outside to the radiator.
  • a flat plate-shaped member is used as the low thermal conductive member, the low thermal conductive member can be easily manufactured.
  • the heat radiating portions are provided upstream and downstream of the pair of electric resistance wires, respectively, and the low thermal conductive member has a frame shape surrounding these heat radiating portions.
  • the inside of the frame-shaped low thermal conductive member is made of a member with high thermal conductivity (for example, the same member as the outer side of the low thermal conductive member), so that the heat of the electric resistance wire is released to the outside. It is possible to suppress the transmission of heat from the outside to the electric resistance wire through the heat sink while sufficiently exhibiting the heat dissipation effect of the heat sink.
  • the heat dissipating portion is in contact with the outer peripheral surface of the pipe, and further includes buffer portions provided at respective positions that contact the heat dissipating portion and sandwich the pipe, wherein the buffer portion is in contact with the low heat conductive member.
  • They are preferably made of the same material.
  • a sensor cover is further provided with a cavity for accommodating the pair of electric resistance wires, and the cavity is counterbore so that the low thermal conductivity member can be fitted therein.
  • heat from the outside such as cold air generated near the fluid control valve may be transmitted to the radiator through the cover attached to the sensor cover described above, and this heat is transferred from the radiator to the electric resistance wire.
  • the transmission has a thermal effect on the flow rate measured by the thermal flow sensor. Therefore, in the structure provided with a cover attached to the sensor cover, a heat insulating part may be further provided between the cover and the heat radiating part to insulate them. With such a configuration, heat from the outside can be suppressed from being transmitted to the radiator via the lid, and the thermal effect on the flow rate measured by the thermal flow sensor can be more reliably reduced. can.
  • the heat radiating section may be provided in a non-contact manner with respect to the lid.
  • a fluid control device includes a thermal flow sensor, a block provided with the thermal flow sensor, and an internal flow path through which the fluid flows, and a fluid control valve provided in the block. and With such a fluid control device, it is possible to exhibit the same effect as the thermal flow sensor described above, quickly stabilize the temperature distribution of the fluid, improve the response speed, It is possible to reduce the thermal effect from the outside on the flow rate. Factors that cause thermal effects from the outside include cool air generated by the fluid passing through the fluid control valve and heat generated by a CPU or the like that controls the flow rate calculation.
  • a fluid control device includes a thermal flow sensor, a block provided with the thermal flow sensor and an internal flow path through which the fluid flows, and a fluid control valve provided in the block. and the thermal flow sensor includes a pair of electric resistance wires wound around a pipe through which a fluid flows, and provided around the electric resistance wires, and the electric resistance wires and the outside are thermally connected It is characterized by having a separate low thermal conductivity member. With such a fluid control device, it is possible to reduce the external thermal influence on the measured flow rate.
  • FIG. 1 is a schematic diagram showing the configuration of a fluid control device according to an embodiment of the present invention
  • FIG. The schematic diagram which shows the structure of the thermal type flow sensor of the same embodiment.
  • the schematic diagram which shows the low heat-conductive member of the same embodiment.
  • the perspective view which shows the low thermally-conductive member of the same embodiment.
  • FIG. 4 is an exploded perspective view of the same embodiment before incorporating a low heat conductive member into the hollow portion; Sectional drawing after incorporating a low heat-conduction member into the hollow part of the same embodiment.
  • the schematic diagram which shows the low heat-conductive member of other embodiment.
  • the schematic diagram which shows the low heat-conductive member of other embodiment.
  • Sectional drawing which shows the structure of the cover body of other embodiment. Sectional drawing which shows the structure of the radiator of other embodiment.
  • the thermal flow sensor S of this embodiment constitutes a fluid control device 100 that controls the flow rate of fluid used in, for example, a semiconductor manufacturing process.
  • the fluid control device 100 includes a block B made of metal (for example, made of stainless steel) in which an internal flow path X (hereinafter also referred to as a main flow path X) through which a fluid flows is formed, and this block B
  • a control that controls the opening of the fluid control valve V so that the flow rate measured by the thermal flow sensor S and the fluid control valve V provided in the thermal flow sensor S approaches the preset flow rate Part C is a mass flow controller.
  • a pressure sensor may be provided upstream of the thermal flow sensor S.
  • the fluid control device 100 is characterized by the thermal flow sensor S, the details will be described below.
  • the thermal flow sensor S is set in a part of the branch flow path L that branches off from the main flow path X and merges with the main flow path X at a confluence downstream of the branch point. and a flow rate detection mechanism 10 for detecting the flow rate of the fluid.
  • a laminar flow element as a resistor R having a constant flow rate characteristic is provided between the branch point and the confluence point in the main flow path X, and the split flow ratio of the main flow path X and the sensor flow path L1 is predetermined. is set to be the design value.
  • the sensor flow path L1 is formed by a pipe 20 having a small diameter (hereinafter also referred to as a thin tube 20).
  • a sensor cover 40 is attached to the above-described block B via a base 30, and the sensor cover 40 is accommodated so that the sensor flow path L1 passes through.
  • the thin tube 20 and the base 30 are made of metal such as stainless steel, and the sensor cover 40 is made of alumina having higher thermal conductivity than the thin tube 20 and the base 30, for example.
  • the flow rate detection mechanism 10 includes a sensor section 11 for detecting the flow rate split to the sensor flow path L1, and an output signal from the sensor section 11 to detect the gas flowing through the main flow path X. and a flow rate calculation unit 12 that calculates at least the mass flow rate of.
  • the sensor section 11 is housed in the sensor cover 40 and has a pair of electrical resistance wires 13A and 13B wound around the thin tube 20.
  • the electric resistance wires 13A and 13B are heating resistance wires whose electric resistance value increases and decreases according to changes in temperature, are wound around the outer peripheral surface of the thin tube 20, and serve as both a heater and a temperature sensor.
  • the flow rate calculation unit 12 is an electric circuit having a pair of electric resistance wires 13A and 13B as part of its configuration, and includes a bridge circuit, an amplifier circuit, a correction circuit, and the like.
  • This flow rate calculation unit 12 is a function exhibited by, for example, the control unit C described above, and detects the instantaneous gas flow rate as an electric signal (voltage value) from the pair of electric resistance lines 13A and 13B, and detects the sensor flow path L1.
  • the flow rate of the gas in the main flow path X is calculated based on the split flow ratio between the main flow path X and the sensor flow path L1, and the sensor output signal (flow measurement signal).
  • the circuit configuration of the flow rate calculation unit 12 is of a constant temperature control type in this embodiment, and since this is known, a detailed description thereof will be omitted.
  • the circuit configuration of the flow rate calculator 12 may be of a constant current control system, a constant voltage control system, or a low temperature difference control system.
  • the thermal flow sensor S of the present embodiment further includes radiators 50A and 50B that radiate heat from the electric resistance wires 13A and 13B to the outside, as shown in FIG.
  • the heat radiators 50A and 50B secure a path for the heat of the electric resistance wires 13A and 13B to escape to the outside and shorten the time until the temperature distribution of the fluid stabilizes. are provided upstream and downstream of the pair of electric resistance wires 13A and 13B. That is, the upstream radiator 50A, the upstream electrical resistance wire 13A, the downstream electrical resistance wire 13B, and the downstream radiator 50B are arranged in this order from the upstream side along the sensor flow path L1.
  • the radiators 50A and 50B as shown in FIG. It has a rib-shaped buffer portion 62 provided at each position where the thin tube 20 is sandwiched.
  • the heat radiation part 61 mainly exhibits the heat radiation function of the heat radiators 50A and 50B, and is specifically made of a putty material such as thermally conductive silicon having high thermal conductivity.
  • the buffer section 62 functions as a so-called heat sink that receives and absorbs heat from the electric resistance wires 13A and 13B transmitted through the heat dissipation section 50, and has a lower thermal conductivity than the heat dissipation section 61, for example.
  • the buffer portion 62 also has a holding function of holding the heat radiating portion 61, which is the putty material, wrapped around the outer peripheral surface of the thin tube 200. As shown in FIG.
  • the thermal flow sensor S of the present embodiment is provided around the heat radiating portion 61 described above, and includes a low thermal conductive member 70 having a lower thermal conductivity than the heat radiating portion 61. further comprising
  • the low heat conductive member 70 suppresses the transfer of heat from the outside to the heat radiating portion 61, thereby suppressing the transfer of external heat to the electric resistance wires 13A and 13B via the heat radiating portion 61.
  • the low heat conductive member 70 is made of, for example, stainless steel, resin, ceramics, zirconia, etc. Here, it is made of the same material as the buffer portion 62 described above. That is, in this embodiment, not only the low heat conductive member 70 but also the buffer portion 62 described above suppresses the transfer of heat from the outside to the heat radiating portion 61 .
  • the heat from the outside includes, for example, cold air generated in the vicinity of the fluid control valve V shown in FIG. More specifically, after the fluid has passed through the fluid control valve V, when the fluid expands, work is done to the outside, and the internal energy corresponding to the work is reduced. This lowers the temperature of the fluid and creates cold air. Then, this cool air tries to be transmitted from the block B supporting the fluid control valve V and the thermal flow sensor S to the heat radiating section 61 through the sensor base 30 and the sensor cover 40 described above.
  • the low heat conductive member 70 suppresses the cold air from being transmitted to the electrical resistance wires 13A and 13B via the heat radiating portion 61.
  • the block B is thermally isolated from the portion 61 and the electric resistance wires 13A and 13B.
  • FIG. 1 As another heat source, devices such as a CPU and a circuit board that constitute the control unit C shown in FIG. 1 can be cited. That is, when such a device generates heat, the heat may be transmitted to the electric resistance wires 13A and 13B via the heat radiation portion 61.
  • FIG. 1 As another heat source, devices such as a CPU and a circuit board that constitute the control unit C shown in FIG. 1 can be cited. That is, when such a device generates heat, the heat may be transmitted to the electric resistance wires 13A and 13B via the heat radiation portion 61.
  • the low thermal conductive member 70 suppresses the heat from the equipment constituting the control unit C from being transmitted to the electric resistance wires 13A and 13B via the heat dissipation unit 61. In other words, , the low heat conductive member 70 thermally isolates the heat radiating portion 61 and the electric resistance wires 13A and 13B from the components of the control portion C. As shown in FIG.
  • the low thermal conductive member 70 does not need to completely insulate the heat transmitted to the heat radiators 50A and 50B and the electric resistance wires 13A and 13B, and heat is applied from the outside as long as it does not affect the flow rate to be measured. may slightly transfer heat to the radiators 50A and 50B and the electric resistance wires 13A and 13B.
  • the low thermal conductivity member 70 is accommodated in a cavity H formed in the sensor cover 40, as shown in FIGS.
  • the cavity H is formed by penetrating the sensor cover 40, and in this embodiment, the cavity H is hollowed so that the low thermal conductivity member 70 can be fitted therein. That is, the space of the hollow portion H of the present embodiment narrows from the near side toward the far side in the penetrating direction D1 penetrating the sensor cover 40 .
  • the cavity H here has a stepped shape and is composed of a wide space H1 on the front side and a narrow space H2 on the back side.
  • the hollow portion H does not necessarily have a stepped shape, and may have, for example, a tapered shape that gradually narrows from the near side to the far side.
  • the low heat conductive member 70 has a shape that fits tightly into the hollow portion H, and has a flat plate shape in this embodiment.
  • the low thermal conductive member 70 has a first flat plate element 71 that supports the heat radiating portions 61 of the upstream radiator 50A and the downstream radiator 50B.
  • the first flat plate element 71 has a rectangular shape in plan view, for example, a substantially rectangular shape in plan view whose longitudinal direction is set in the tube axis direction D2 along the narrow tube 20 .
  • a heat radiation portion 61 and a pair of buffer portions 62 sandwiching the heat radiation portion 61 are provided in contact with each other.
  • a pair of buffer portions 62 are provided at positions sandwiching the thin tube 20 on the upstream side of the pair of electric resistance wires 13A and 13B, and another pair of buffer portions 62 are provided on the downstream side of the pair of electric resistance wires 13A and 13B. are provided at positions sandwiching the thin tube 20 .
  • the above-described heat dissipation portion 61 made of heat conductive silicon or the like is interposed. With such a configuration, the heat radiating portion 61 is held between the pair of buffer portions 62 while being in contact with the outer peripheral surface of the thin tube 20 .
  • the low heat conductive member 70 of this embodiment further has a second flat plate element 72 provided on the rear surface 71b of the first flat plate element 71, as shown in FIGS.
  • the second flat plate element 72 has a rectangular shape in plan view, for example, a substantially rectangular shape in plan view whose longitudinal direction is set in the tube axis direction D2 along the thin tube 20 .
  • the second flat plate element 72 of this embodiment has a smaller dimension along the width direction orthogonal to the longitudinal direction than the first flat plate element 71 .
  • the second flat plate element 72 may be integrated with the first flat plate element 71 or may be separate.
  • the low thermal conductive member 70 is fitted into the hollow portion H without looseness. 70 is fixed while being positioned with respect to the sensor cover 40 .
  • the thermal flow sensor S is assembled by attaching the lid body 80 to the sensor cover 40 as shown in FIG.
  • the low heat conductive member 70 having a lower thermal conductivity than the heat radiating portion 61 is provided around the heat radiating portion 61 .
  • Heat transfer to the heat radiating portion 61 can be suppressed.
  • the temperature distribution of the fluid can be quickly stabilized by the heat radiation effect of the heat radiation part 61, and the response speed can be improved. can.
  • the low heat conductive member 70 has a flat plate shape that supports the upstream heat radiator 50A and the downstream heat radiator 50B at once, a relatively large size can be used as the low heat conductive member 70. , the transmission of heat from the outside to the heat radiating portion 61 can be more reliably suppressed. Furthermore, since the low heat conductive member 70 is flat, it is easy to manufacture the low heat conductive member 70 .
  • the hollow portion H of the sensor cover 40 is hollowed, and by fitting the low heat conductive member 70 into the hollow portion H, the low heat conductive member 70 is fixed while being positioned, thereby improving the ease of assembly.
  • the buffer portion 62 is made of the same material as the low heat conductive member 70 , the effect of suppressing heat transfer to the heat dissipation portion 61 can be exhibited not only by the low heat conductive member 70 but also by the buffer portion 62 .
  • the low thermal conductive member 70 has a flat plate shape in the above embodiment, but may have a frame shape as shown in FIGS. 8 and 9 . Specifically, the low thermal conductive member 70 surrounds the pair of upstream heat radiators 50A, the pair of downstream heat radiators 50B, and the pair of electric resistance wires 13A and 13B all at once. It is provided in the hollow portion H of the sensor cover 40 . It should be noted that the term “frame-like” as used herein does not necessarily mean a shape without any gaps, and there may be slight gaps as long as the effect of suppressing heat transfer from the outside to the radiators 50A and 50B can be ensured. Also good.
  • the inner side of the low thermal conductive member 70 is made of, for example, the same alumina as the sensor cover 40, and has a higher thermal conductivity than the low thermal conductive member 70. More preferably, the thin tube 20 or the base It is preferable that an embedded material 90 having a higher thermal conductivity than 30 is provided. In this case, a plurality of radiators 50A and 50B are supported by the embedded object 90.
  • FIG. 1 the frame-shaped low thermal conductive member 70 described above is used, the inner side of the low thermal conductive member 70 is made of, for example, the same alumina as the sensor cover 40, and has a higher thermal conductivity than the low thermal conductive member 70. More preferably, the thin tube 20 or the base It is preferable that an embedded material 90 having a higher thermal conductivity than 30 is provided. In this case, a plurality of radiators 50A and 50B are supported by the embedded object 90.
  • the heat from the outside is suppressed from being transmitted to the electric resistance wires 13A and 13B through the radiators 50A and 50B by the frame-shaped low heat conductive member 70, and the inside of the low heat conductive member 70
  • the embedded object 90 provided in the can be done.
  • the low heat conductive member 70 may be provided so as to separately surround the heat radiating portion 61 of the radiator 50A on the upstream side and the heat radiating portion 61 of the radiator 50B on the downstream side. .
  • the low thermal conductivity member 70 in the above embodiment is made of the same material as the buffer portion 62, it may be made of a material with a lower thermal conductivity than the buffer portion 62.
  • the buffer portion 62 has, for example, a U-shape surrounding the heat radiating portion 61, and is made of stainless steel, zirconia, or the like having a lower thermal conductivity than the heat radiating portion 61. Also good.
  • the member 70 in the above embodiment may be made of the same material as the sensor cover 40 (for example, alumina) (in other words, the member 70 does not necessarily have to be a low heat conductive member), In this case, the buffer part 62 plays a role of the low thermal conductive member 70 .
  • the thermal flow sensor S may further include a heat insulating portion 73 interposed between the lid 80 and the heat radiating portion 61 to insulate them. 2, the heat radiating portion 61 may be provided in a non-contact manner with respect to the lid 80. As shown in FIG.
  • the heat insulating portion 73 may be made of, for example, stainless steel, resin, ceramics, zirconia, or the like. With such a configuration, heat from the outside can be suppressed from being transmitted to the heat radiating portion 61 via the lid 80, and the thermal effect on the flow rate measured by the thermal flow sensor S can be more reliably reduced. can be made
  • the radiators 50 are provided on the upstream side and the downstream side of the pair of electric resistance wires 13A and 13B, respectively, but the radiator 50 may be provided on either the upstream side or the downstream side. , a radiator 50 may be provided between the pair of electric resistance wires 13A and 13B.
  • the fluid control device does not necessarily have the radiator 50, and a low heat conductive member is provided around the electric resistance wire and thermally separates the electric resistance wire from the outside. It's good to be prepared. It should be noted that the heat from the outside includes cold air generated by the passage of the fluid through the fluid control valve, and heat generated by the CPU or the like that controls the flow rate calculation.
  • the present invention it is possible to quickly stabilize the temperature distribution of the fluid, improve the response speed, and reduce the external thermal influence on the measured flow rate.

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)

Abstract

Afin de réduire le degré d'influence thermique externe sur un débit mesuré tout en réalisant une stabilisation rapide de la répartition de température d'un fluide, et en améliorant la vitesse de réponse, la présente invention comprend : une paire de fils résistifs électriques 13A, 13B enroulés sur un tuyau 20 à travers lequel s'écoule un fluide ; une partie de dissipation de chaleur 61 qui dissipe la chaleur des fils résistifs électriques 13A, 13B vers l'extérieur ; et un élément à faible transfert de chaleur 70 qui est prévu autour de la partie de dissipation de chaleur 61 et qui présente une conductivité thermique inférieure à celle de la partie de dissipation de chaleur 61.
PCT/JP2022/011795 2021-06-17 2022-03-16 Capteur de débit thermique et dispositif de commande de fluide WO2022264574A1 (fr)

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Application Number Priority Date Filing Date Title
JP2023529558A JPWO2022264574A1 (fr) 2021-06-17 2022-03-16

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Application Number Priority Date Filing Date Title
JP2021101218 2021-06-17
JP2021-101218 2021-06-17

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WO2022264574A1 true WO2022264574A1 (fr) 2022-12-22

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105520A (ja) * 1982-12-08 1984-06-18 Tokyo Keiso Kk 熱式質量流量計
JPS63133020A (ja) * 1986-11-25 1988-06-04 Nippon Tairan Kk 質量流量センサ
JPH06507713A (ja) * 1991-04-26 1994-09-01 ユニット・インストゥルメンツ・インコーポレーテッド 熱質量流量センサ
WO2018180387A1 (fr) * 2017-03-30 2018-10-04 株式会社フジキン Capteur de débit massique, débitmètre massique muni d'un capteur de débit massique, et contrôleur de débit massique muni d'un capteur de débit massique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105520A (ja) * 1982-12-08 1984-06-18 Tokyo Keiso Kk 熱式質量流量計
JPS63133020A (ja) * 1986-11-25 1988-06-04 Nippon Tairan Kk 質量流量センサ
JPH06507713A (ja) * 1991-04-26 1994-09-01 ユニット・インストゥルメンツ・インコーポレーテッド 熱質量流量センサ
WO2018180387A1 (fr) * 2017-03-30 2018-10-04 株式会社フジキン Capteur de débit massique, débitmètre massique muni d'un capteur de débit massique, et contrôleur de débit massique muni d'un capteur de débit massique

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TW202300873A (zh) 2023-01-01

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