WO2022262431A1 - 一种摄像头装饰件、制作方法及电子设备 - Google Patents

一种摄像头装饰件、制作方法及电子设备 Download PDF

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Publication number
WO2022262431A1
WO2022262431A1 PCT/CN2022/089285 CN2022089285W WO2022262431A1 WO 2022262431 A1 WO2022262431 A1 WO 2022262431A1 CN 2022089285 W CN2022089285 W CN 2022089285W WO 2022262431 A1 WO2022262431 A1 WO 2022262431A1
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WO
WIPO (PCT)
Prior art keywords
plate
camera
decoration
electronic device
area
Prior art date
Application number
PCT/CN2022/089285
Other languages
English (en)
French (fr)
Inventor
王琪
张嘉靖
王振
高保军
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22750987.4A priority Critical patent/EP4135307A4/en
Priority to US17/799,379 priority patent/US20240187507A1/en
Publication of WO2022262431A1 publication Critical patent/WO2022262431A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/52—Details of telephonic subscriber devices including functional features of a camera

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a camera decoration, a manufacturing method and electronic equipment.
  • a camera trim is a part used to decorate a camera on an electronic device.
  • the camera decoration is generally prepared on one surface of a single transparent plate with a decorative effect picture, such as texture, glare and other effects, and then the decorative effect picture
  • the single plate is installed on the shell 01 of the electronic equipment as a whole, wherein the surface prepared with the decorative effect drawing is used as the installation surface and installed towards the direction of the electronic equipment shell 01, so that a complete decorative effect drawing (decorative The effect is not shown in the figure), and the camera decoration part 02 with good permeability.
  • a protective structure is provided to protect the camera, and the protective structure cooperates with the protruding camera to protrude from the outer surface of the housing of the electronic device to a certain height.
  • the present application provides a camera decoration, a manufacturing method and an electronic device, which can provide a flat installation surface for the first plate, thereby ensuring the integrity of the decoration effect picture on the first surface of the first plate.
  • the present application provides a camera decoration, which is applied to an electronic device, wherein the electronic device includes a camera assembly, and the camera assembly includes a main camera protruding from the outer surface of the electronic device casing at a first height , and a boss located around the main camera and connected to the outer surface of the housing of the electronic device;
  • the camera trim includes a first plate and a second plate; the first surface of the first plate is connected to the second surface of the second plate, and the first surface of the second plate is used for connecting with the electronic device.
  • the outer surface of the housing is connected; the first plate is provided with a first through hole for penetrating the main camera, and the second plate is provided with a second through hole corresponding to the first through hole;
  • the first surface of the first plate has a decorative effect diagram, wherein the first plate is made of a transparent material; the first surface of the second plate includes a connection area and an avoidance area, and the avoidance area is the second plate material
  • the first surface of the second plate is recessed to a first depth from the second surface of the second plate, wherein the thickness of the second plate is greater than or equal to the height of the boss on the housing of the electronic device, and the first depth is greater than or equal to the The height of the boss, and the projection of the boss is within the projection area of the avoidance area.
  • connection area of the second board is connected to the housing of the electronic device correspondingly, and the avoidance area is installed in cooperation with the boss, and the height of the boss is less than or equal to the first depth, so that after the second board is connected to the housing, the second The second surface of the plate is at the same level as the upper surface of the boss, or the second surface of the second plate is at a level higher than the upper surface of the boss, so as to provide a flat mounting surface for the first plate, The integrity of the decorative rendering on the first surface of the first plate is guaranteed.
  • the first depth is equal to the thickness of the second board
  • the second through hole communicates with the escape area to form a hollow area
  • the connection area surrounds the hollow area.
  • the main camera and the boss can be avoided through the hollow area, and the first surface of the first plate connected to the second plate can avoid the boss and connect to the connection area of the second plate , so as to ensure the integrity of the first surface decoration rendering of the first plate.
  • a third plate is provided between the first plate and the second plate; a decorative ring corresponding to the first through hole is provided on the third plate.
  • the thickness of the first plate can be reduced, so that the first plate has better light transmittance.
  • it further includes a first limit baffle, and the first limit baffle extends along the outer periphery of the third plate in a direction close to the first plate; the first plate is surrounded by In the area enclosed by the first limit baffle.
  • the first plate can be limited in the area enclosed by the first limit baffle on the third plate through the first limit baffle, thereby improving assembly accuracy.
  • it further includes a second limit baffle, the second limit baffle extends along the inner hole wall of the decorative ring toward the direction close to the second plate, and the second limit baffle
  • the plate is used to limit the decoration ring around the main camera; a third limit baffle is arranged in the circumferential direction of the decoration ring, and the third baffle is located on the second surface of the third plate, The third baffle is used to limit the lens corresponding to the main camera; the third limit baffle and the first limit baffle form a groove, and the first plate is located at the inside the groove.
  • the second limit baffle clip can just snap into the camera hole of the main camera, thereby limiting the decorative ring around the main camera and preventing the decorative ring from moving.
  • the decorative effect diagram is printed on the first surface of the first plate through a printing process.
  • a decorative effect drawing can be directly produced on the first surface of the first plate.
  • the UV transfer process can be used to make the desired texture on the first surface of the first plate, and then the first surface of the first plate is coated to obtain the desired glare effect.
  • the first surface of a plate is coated with ink, and the ink can protect the texture and strengthen the bonding performance between the first plate and the second plate.
  • the decorative effect diagram is formed by pasting a film having the decorative effect diagram on the first surface of the first plate.
  • the first surface of the first plate includes at least one window area.
  • the AR film can be coated on the first surface of the first plate or a predetermined area of the membrane to obtain a window area with high light transmittance.
  • This window area can be used as a lens for the smaller camera in the camera stack.
  • the second surface of the second plate is glued and connected to the first surface of the first plate by hot-melt adhesive tape.
  • the second surface of the second sheet is pasted and connected to the first surface of the first sheet by the following method:
  • the assembly obtained after pressing is placed on a roller machine and rolled repeatedly;
  • the assembly after being rolled by the roller machine is placed in a degassing machine and baked to obtain a camera decorative part.
  • connection strength between the first plate and the second plate can be ensured; on the other hand, the hot-melt tape itself is only about 0.05mm, which can ensure that the overall camera decoration has good permeability.
  • the first temperature is 120-140°C.
  • the pressing temperature on the hydraulic press is 110-130° C.
  • the pressing time is 5-20 seconds.
  • the rolling speed of the roller machine is 2-10m/min, and the rolling temperature on the roller machine is 80-100°C.
  • the baking temperature in the degassing machine is 80-100° C.
  • the baking time is 20-40 minutes.
  • a glue dispensing groove is provided on the second surface of the second plate, and a retaining wall is arranged around the periphery of the glue dispensing groove; the second surface of the second plate is in contact with the first The first surface of the board is connected by glue, and the glue is located in the glue dispensing groove.
  • the glue is solidified, it is located between the first board and the second board, and the retaining wall plays a role of concealing defects, so that there is no residual glue and other defects on the appearance of the camera decoration, and the whole has good permeability.
  • the first board is connected to the third board by adhesive
  • the second board is connected to the third board by hot-melt tape.
  • connection gap between the second plate and the third plate, and the connection gap between the first plate and the third plate can be reduced, so that the overall camera head decoration has a compact structure.
  • the present application provides an electronic device, including a main camera, and the camera decoration according to any one of the first aspect, where the camera decoration is installed around the main camera.
  • connection area of the second board is connected to the housing of the electronic device correspondingly, and the avoidance area is installed in cooperation with the boss, and the height of the boss is less than or equal to the first depth, so that after the second board is connected to the housing, the second The second surface of the plate is at the same level as the upper surface of the boss, or the second surface of the second plate is at a level higher than the upper surface of the boss, so as to provide a flat mounting surface for the first plate, The integrity of the decorative rendering on the first surface of the first plate is guaranteed, thereby improving the product competitiveness of the electronic device.
  • the present application also provides a method for manufacturing a camera decoration, where the camera decoration includes a first plate and a second plate;
  • the assembly obtained after pressing is placed on a roller machine and rolled repeatedly;
  • the assembly after being rolled by the roller machine is placed in a degassing machine and baked to obtain a camera decorative part.
  • the camera decorative part manufactured by the above method can not only improve the bonding strength between the first plate and the second plate, but also ensure that the connecting surface between the first plate and the second plate is smooth and flawless.
  • the first temperature is 120-140°C.
  • the pressing temperature on the hydraulic press is 110-130° C.
  • the pressing time is 5-20 seconds.
  • the rolling speed of the roller machine is 2-10m/min, and the rolling temperature on the roller machine is 80-100°C.
  • the baking temperature in the degassing machine is 80-100° C.
  • the baking time is 20-40 minutes.
  • FIG. 1A is a schematic structural view of an electronic device housing equipped with a camera decoration
  • FIG. 2A is a schematic structural diagram of an electronic device provided by an embodiment of the present application after the camera decoration is removed;
  • FIG. 2B is a schematic diagram of the structure in the M direction of FIG. 2A;
  • FIG. 2C is an overall rendering of the camera decoration provided by the present application and the camera assembly in FIG. 2A after being installed in the housing of the electronic device;
  • Fig. 2D is a partially enlarged view of the area including the camera decoration in Fig. 2C;
  • FIG. 2E is a schematic diagram of a 2D M-direction structure
  • FIG. 2F is a schematic diagram of the overall structure of a camera decoration provided in an embodiment of the present application.
  • FIG. 2G is an exploded view of a camera decoration provided in an embodiment of the present application.
  • FIG. 3A is a schematic structural diagram of a first plate in a camera decoration provided in an embodiment of the present application.
  • Fig. 3B is a flow chart of making a decorative effect diagram on the first plate provided by the embodiment of the present application.
  • Fig. 3C is another flow chart for making a decorative effect diagram on the first plate provided by the embodiment of the present application.
  • FIG. 4A is a schematic structural diagram of a second plate in a camera trim provided in an embodiment of the present application.
  • Fig. 4B is a schematic structural view of the second plate in another camera trim provided in the embodiment of the present application.
  • Fig. 5A is an exploded view of the camera head decoration obtained by connecting the first plate and the second plate with hot-melt tape according to the embodiment of the present application;
  • Fig. 5B is a side sectional view of the camera trim obtained by connecting the first plate and the second plate with hot-melt tape according to the embodiment of the present application;
  • FIG. 5C is a schematic workflow diagram of a method for manufacturing a camera decoration provided in an embodiment of the present application.
  • Fig. 5D is a side sectional view of another camera decoration obtained by connecting the first plate and the second plate with a hot-melt adhesive tape according to the embodiment of the present application;
  • Fig. 6A is a schematic structural view of the second plate in another camera decoration provided by the embodiment of the present application.
  • Fig. 6B is a schematic structural diagram of another camera decoration provided by the embodiment of the present application.
  • Figure 6C is a side sectional view of Figure 6B;
  • FIG. 7A is an effect diagram of another camera decoration provided in the embodiment of the present application after it is installed on the housing of the electronic device;
  • Fig. 7B is an exploded view of another camera decoration provided in the embodiment of the present application.
  • Fig. 7C is a schematic structural view of the third plate in another camera decoration provided by the embodiment of the present application.
  • FIG. 7D is a schematic diagram of the structure in FIG. 7A after removing the first plate.
  • the electronic device in this application may be any electronic device with a camera, such as a mobile phone, a smart watch, a computer, and the like.
  • a mobile phone is taken as an example to illustrate the structure of the camera decoration on the electronic device.
  • an embodiment of the present application provides a camera decoration.
  • FIG. 2A shows a structure of a camera assembly located on an electronic device housing in an implementation manner.
  • the camera assembly includes four cameras, wherein the first camera 011 and the second camera 012 among the four cameras are main cameras, and the remaining two smaller cameras are non-main cameras.
  • the main camera will exceed the main body of the electronic device in the thickness direction.
  • a metal ring structure 013 and a boss 014 matching the metal ring 013 are set around each main camera.
  • the boss 014 is used to receive the metal ring 013 and the housing 01 , so that the metal ring 013 is supported and fixed on the housing 01 .
  • FIG. 2B is a schematic diagram of the M-direction structure in FIG. 2A . It can be clearly seen from FIG. 2B that the boss 014 located between the two metal rings 013 is higher than the housing 01 by a certain height.
  • Figure 2C is the overall rendering of the camera decoration provided by this application and the camera assembly in Figure 2A after being installed in the housing of the electronic device
  • Figure 2D is the area including the camera decoration in Figure 2C Partial zoom-in.
  • the camera decoration in Figure 2C and Figure 2D can present a complete decoration effect diagram (not shown in the figure), and for the decoration effect diagram on the camera decoration, please refer to Figure 2F and Figure 2G .
  • FIG. 2E is a schematic structural diagram of the M direction in FIG. 2D .
  • the first camera 011 and the second camera 012 in the camera assembly can be exposed, and the boss 014 higher than the housing 01 can be covered in the camera decoration, so that the camera can be kept Complete trim renderings on trim pieces.
  • FIG. 2F is a schematic diagram of the overall structure of the camera decoration in the embodiment of the present application
  • FIG. 2G is an exploded view of FIG. 2F
  • the camera trim in the embodiment of the present application includes two plates, a first plate 10 and a second plate 20 .
  • the first plate 10 is provided with a first through hole 101 for penetrating the main camera
  • the A surface (first surface) of the first plate 10 is a flat surface
  • the A surface of the first plate 10 has a decorative effect picture.
  • the second plate 20 is a ring structure with a hollow center, wherein the hollow area in the middle is used to avoid the main cameras 011 and 012 and the boss 014 in the camera assembly.
  • the second plate 20 is located between the first plate 10 and the housing 01, the A surface of the first plate 10 is connected to the B surface (second surface) of the second plate 20, the first Surface A of the two boards 20 is connected to the outer surface of the casing 01 of the electronic device.
  • the middle hollow area of the second plate 20 avoids the main camera 011, 012 and the boss 014 in the camera assembly, the thickness of the second plate 20 is the same as the height of the boss 014, after the second plate 20 is connected to the outer surface of the housing 01 , making up for the height difference between the first board and the outer surface of the casing 01 .
  • the second sheet material 20 and the boss 014 having the same thickness provide a flat installation surface for the first sheet material 10, so that it is not necessary to avoid cutting the A surface of the first sheet material 10, and the decoration on the A surface of the first sheet material 10 is ensured. Integrity of renderings.
  • the shape and structure of the first plate 10 can be set according to needs, for example, it can be determined according to the contour shape jointly formed by the boss 014 and the main camera.
  • the first plate 10 can be of regular shape or irregular shape.
  • the first sheet 10 may be rectangular or rectangular with rounded corners.
  • first through holes 101 for penetrating through the first camera 011 and the second camera 012 are provided on the first plate 10 respectively, wherein the positions and sizes of the two first through holes 101 are respectively the same as those of The first camera 011 on the electronic device corresponds to the second camera 012.
  • the first sheet material 10 includes a surface A (first surface) and a surface B (second surface) which are oppositely disposed. Wherein, the surface A of the first plate 10 is used for connecting with the surface B of the second plate 20 .
  • the surface A of the first plate 10 has a decorative effect picture, which can be set according to actual needs, such as texture effect, light effect effect, or texture effect and light effect effect at the same time.
  • the present application does not limit the formation method of the decorative effect diagram on the A side of the first board 10, for example, it may be etched on the A side of the first board 10 by etching, or it may be printed by a printing process.
  • the patterns or light effects made on the surface A of the first plate 10 can also be, for example, transferred to the surface A of the first plate 10 by transferring the patterns or light effects printed on the film.
  • a decorative effect drawing can be directly produced on the surface A of the first plate 10 .
  • the UV transfer process can be used to make the desired texture on the A side of the first plate 10, and then the A side of the first plate 10 can be coated to obtain the desired glare effect.
  • the surface A of a board 10 is coated with ink, and the ink can protect the texture and strengthen the bonding performance between the first board 10 and the second board 20 .
  • the ink can protect the texture and strengthen the bonding performance between the first board 10 and the second board 20 .
  • the decorative effect drawing can be made on the film 30 in advance, and then the film 30 with the decorative effect picture is pasted on the A surface of the first plate 10 .
  • texture, film coating and ink painting are made on the film 30 first to obtain the desired decorative effect picture, and then the film 30 with the decorative effect picture is bonded to the A side of the first plate 10 .
  • the shape of the diaphragm 30 should be the same as the shape of the first plate 10, for example, the diaphragm 30 is provided with the first through holes of the same number and size as the first plate 10, and the diaphragm 30 is usually a thin plastic film material, such as The diaphragm 30 can be a plastic glare film.
  • the first plate 10 in the present application is made of a transparent material, for example, the first plate 10 can be made of transparent glass, crystal, acrylic and other materials.
  • At least one window area 102 can be made on the surface A of the first plate 10, and the window area 102 can be used as a lens of a relatively small camera in the camera assembly.
  • the present application does not limit the method of making the window area 102, for example, coating the AR film on the A surface of the first plate 10 or the predetermined area of the diaphragm 30 to obtain the window area 102 with high light transmittance.
  • first plate 10 is a schematic illustration for the convenience of solution expression, and does not represent a limitation on the structure of the first plate 10 in this application.
  • the surface B of the first plate 10 may be a plane as shown in FIG. 3A , or may not be a plane, such as a structure with a concave-convex structure, which is not limited in the present application.
  • the B side of the first plate 10 Since the B side of the first plate 10 is directly exposed outside the electronic equipment, some surface treatment can be carried out on the B side of the first plate 10 to improve the surface performance of the B side of the first plate 10, for example, by coating AF film
  • the surface performance is strengthened with the flow coating hardening process, so that the B surface of the first plate 10 has the characteristics of waterproof, moisture-proof, friction resistance, and easy cleaning.
  • the structure of the first board 10 can only be applied to the scene including two main cameras, the first board The structure of 10 can also be applied to scenarios with more or fewer main cameras. If the first plate 10 is applied to a scene with more or fewer main cameras, it is only necessary to adjust the position, number and size of the first through holes 101 on the first plate 10 accordingly, and no further description will be given here. For details, please refer to the above implementation methods.
  • the second plate 20 is used to receive the first plate 10 and the housing 01 of the electronic device.
  • the outer edge profile of the second plate 20 can be the same as the outer edge profile of the first plate 10 , so that after laminating the first plate 10 and the second plate 20 , a camera trim with regular outer edges can be obtained.
  • the outer edge profile of the second sheet material 20 may also be different from the outer edge profile of the first sheet material 10, for example, the outer edge profile of the second sheet material 20 is slightly smaller than the outer edge profile of the first sheet material 10, so that the second sheet material
  • the projection of the outer edge contour of 20 is within the projection of the outer edge contour of the first sheet metal 10 .
  • the thickness of the second plate 20 is equal to the height of the boss 014, the second plate 20 includes the middle hollow area 202 and the connection area 201, the hollow area 202 runs through the thickness direction of the second plate 20, the boss 014 Both the projection and the projection of the main camera are within the projection area of the hollow area 202 surrounded by the connection area 201 .
  • the connection area 201 corresponding to the surface B (second surface) of the second plate 20 and the upper surface of the boss 014 are in the same level.
  • the A surface of the first plate 10 can be indirectly connected to the housing 01 through the connection area 201 of the second plate, thereby avoiding the cutting of the area corresponding to the boss 014 in the A surface of the first plate 10, ensuring the first Integrity of the first surface decoration rendering of the plate 10.
  • the area corresponding to the boss 014 on the A surface of the first plate 10 can be connected to the upper surface of the boss 014
  • the area corresponding to the connection area 201 on the A surface of the first plate 10 can be connected to the connection area 201 .
  • the first plate 10 is mainly used for decoration, and the second plate 20 is mainly used to connect the first plate 10 and the housing 01. Therefore, this application does not limit the material of the second plate 20.
  • the second plate 20 can be made of the same or different material as that of the first plate 10 . If the second board 20 is made of the same material as the first board 10 , it is more beneficial to realize the adhesive connection between the first board 10 and the second board 20 .
  • boss structure shown in FIG. 2A .
  • the boss structure is not limited to the situation shown in FIG. 2A .
  • the position and size of the hollow area 202 can be adjusted.
  • connection method between the first plate 10 and the second plate 20 in this application will be further described below with reference to the accompanying drawings.
  • first plate 10 and the second plate 20 may be directly connected, or connected through other components or materials, which is not limited in this application.
  • the first board 10 and the second board 20 are pasted and connected by a hot-melt adhesive tape 40 .
  • the hot-melt adhesive tape 40 has no stickiness at normal temperature, and the hot-melt adhesive tape 40 becomes sticky only after heat treatment, so that the first plate 10 and the second plate 20 can be pasted together.
  • the present application also provides a bonding method using a hot-melt adhesive tape 40.
  • the construction method of the first plate 10 and the second plate 20, as shown in FIG. 5C, the method includes the following steps:
  • Step 100 pre-laminating the surface B of the second plate 20 with the hot melt adhesive tape 40 under the silicone roller with the first temperature.
  • the hot-melt adhesive tape 40 can be cut into the same shape as the B-side of the second sheet material, and then, the B-side of the second sheet material 20 is aligned with the cut-out hot-melt adhesive tape 40 under the silicone roller having the first temperature, Ensure that the air bubbles between the hot melt adhesive tape 40 and the surface B of the second board 20 are uniform.
  • the first temperature can be properly adjusted according to the material of the selected hot melt adhesive tape 40 , generally the first temperature can be 120-140°C, for example, the first temperature is 130°C.
  • Step 200 put the A-side of the first plate 10 and the B-side of the second plate 20 together and place them on a hydraulic press to obtain an assembly of the first plate 10 and the second plate 20, wherein the pressing temperature of the hydraulic press can be
  • the setting is 110-130°C, and the pressing time can be 5-20s.
  • the pressing temperature of the hydraulic press may be set at 120° C., and the pressing time may be 10 s.
  • Step 300 place the assembly obtained after pressing on a roller machine and repeat rolling at least once.
  • the rolling speed of the roller machine can be set to 2-10m/min, and the temperature of the assembly can be set to 80-100 m/min when the roller machine is heated. °C.
  • the speed of the roller machine is 5 m/min, and the roller machine is heated to a temperature of 90° C. of the assembly.
  • the hot melt adhesive tape can be activated, and on the other hand, air bubbles between the first plate and the second plate can be removed.
  • Step 400 placing the assembly after rolling by the roller machine in a degassing machine for baking.
  • the hot-melt adhesive tape 40 can be fully activated by placing the assembly in a defoaming machine for baking, wherein the defoaming machine can be a high-pressure defoaming machine, for example, a high-pressure defoaming machine capable of reaching about 1.0Mpa.
  • the baking temperature in the high-pressure degassing machine can be set at 80-100° C.
  • the baking time can be set at 20-40 minutes.
  • the baking temperature in the high-pressure defoaming machine is 90° C.
  • the baking time is 30 minutes.
  • the camera decorative part shown in FIG. 2E has no residual glue and other defects on the appearance, so that the overall camera decorative part has good permeability.
  • the first plate 10 and the second plate 20 pasted with the film 30 can be pasted and connected by hot-melt tape according to the above method, and the obtained after pasting As for the camera decoration part, as shown in FIG. 5D , the hot-melt tape 40 is located between the diaphragm 30 and the second plate 20 .
  • first board 10 and the second board 20 may be connected by glue.
  • a dispensing groove 203 can be set on the B side of the second plate 20, and then use a glue dispenser to dispense glue in the dispensing groove 203, and then place the second
  • the A side of a plate 10 and the B side of the second plate 20 are bonded and kept under pressure, for example, they can be left in a fixture for 1 hour to ensure good bonding strength between the first plate 10 and the second plate 20, and obtain The camera trim as shown in Figure 6B.
  • the thickness of the glue is generally more than 0.1mm. Therefore, the appearance of the assembly of the first board 10 and the second board 20 obtained after bonding Glue will be seen on the surface, and then the appearance requirements cannot be met. For this reason, as shown in FIG.
  • the height of the wall 204 is higher than the thickness of the glue 205, for example, the thickness of the glue 205 is 0.2mm, and the height of the retaining wall 204 is set to 0.3mm.
  • the glue 205 After the glue 205 is solidified, it is located between the first plate 10 and the second plate 20, and the retaining wall 204 plays a role of concealing, so that there is no residual glue and other defects on the appearance of the camera decoration, and the whole has good permeability.
  • first board 10 and the second board 20 can be assembled first, and then connected to the housing 01; or the second board 20 can be connected to the housing 01 first, and then the The first plate 10 is connected to the second plate 20 .
  • present application does not limit the connection method of the second board 20 and the housing 01 , for example, the second board 20 and the housing 01 may be pasted and connected by adhesive.
  • the camera decoration in the above embodiments includes a first plate 10 and a second plate 20 that cooperate with each other, wherein the first plate 10 mainly plays the role of decorating the camera, and the second plate 20 passes through the hollow area 202 provided to make the second After the plate 20 cooperates with the housing, it provides a flat mounting surface for the first plate 10 , thereby ensuring the integrity of the decorative effect on the first surface of the first plate 10 .
  • the hollow area 202 is integrally formed in the middle area of the second plate 20 to avoid the main camera and the boss 014 .
  • the present application is not limited to the structure of the second plate 20 provided in the above embodiments.
  • the second board 20 only needs to be able to avoid the main camera and the boss 014.
  • the second plate 20 may only include the second through hole 202A corresponding to the first through hole 101 , and the avoidance area 202B corresponding to the boss 014 .
  • the thickness of the second plate 20 may be greater than the height of the boss 014 , in this case, the avoidance area 202B may not penetrate through the thickness direction of the second plate 20 .
  • FIG. 4B in another implementation manner, the thickness of the second plate 20 may be greater than the height of the boss 014 , in this case, the avoidance area 202B may not penetrate through the thickness direction of the second plate 20 .
  • the avoidance area 202B is formed by etching the first depth from the side A of the second plate 20 facing the B side of the second plate 20, wherein the first depth of etching is greater than or equal to the boss on the casing 01 of the electronic device 014, and less than the thickness of the second plate 20. That is to say, a groove structure is formed by etching the first depth from the surface A of the second plate 20 toward the surface B of the second plate 20, wherein the bottom area of the groove can cover the upper surface of the boss 014. In this way, the surface B of the second plate 20 can have the same shape as the surface A of the first plate 10 , thereby increasing the connection area between the first plate 10 and the second plate 20 .
  • the boss 014 is located in the groove on the second plate, so that the B surface of the second plate 20 can be used as the installation surface of the first plate 10 .
  • the second plate shown in FIG. 4A it is equivalent to connecting the second through hole 202A with the avoidance area 202B to form a complete hollow area 202 , and the entire hollow area 202 runs through the second plate 20 in the thickness direction. and in the second plate shown in FIG. 4B , only the second through hole 202A penetrates through the thickness direction of the second plate.
  • the structure of another camera decoration in this application will be introduced below with reference to the accompanying drawings.
  • the camera decoration includes a first board 10 , a second board 20 and a third board 50 .
  • the structure of the camera decoration including the third plate 50 will be described below.
  • FIG. 7A is an effect diagram of the camera decoration in Embodiment 2 of the present application after being installed in the housing of the electronic device
  • FIG. 7B is an exploded view of the camera decoration in Embodiment 2 of the present application.
  • the third sheet material 50 is positioned between the first sheet material 10 and the second sheet material 20, like this, the A face of the first sheet material 10 is connected with the upper surface of the third sheet material 50, and the B face of the second sheet material 20 is connected with the lower surface of the third sheet material 50.
  • the surface is connected, and the A surface of the second plate 20 is connected with the outer surface of the casing.
  • the outer edge profile of the third plate 50 may be the same shape as the outer edge profiles of the first plate 10 and the second plate 20 . Further, as shown in FIG. 7D , the outer edge of the third plate 50 can also extend toward the direction close to the first plate 10 to form a first limiting baffle 503 , and the first limiting baffle 503 can limit the first plate 10 . It is located in the area enclosed by the first limit baffle 503 on the third board 50 .
  • the third plate 50 includes two decorative rings 501, the decorative rings 501 correspond to the positions of the first through holes 101 on the first plate 10, wherein the decorative rings 501 are the same as those in the first embodiment
  • the function of the metal ring structure 013 is the same, and each decorative ring 501 is used to be sleeved around the corresponding main camera, so as to realize the protection effect on the main camera.
  • the boss 014 located below the decoration ring 501 is used to support and fix the decoration ring 501 on the casing of the electronic device.
  • the third plate 50 is also provided with a light transmission hole 502 corresponding to the non-main camera in the camera assembly, and the light transmission hole 502 corresponds to the window area 102 on the first plate 10 .
  • the outer edge profile of the third plate 50 may also be different from the outer edge profiles of the first plate 10 and the second plate 20, for example, the outer edge profile of the third plate 50 is slightly smaller than the outer edge profile of the first plate 10 , so that the projection of the outer edge contour of the third sheet material 50 is within the projection of the outer edge contour of the first sheet material 10 .
  • the present application does not limit the material of the third board 50 , and the third board 50 may be made of metal, transparent glass, crystal, acrylic and other materials.
  • the decoration ring 501 includes a decoration ring main body 5011 , a second limit baffle 5012 , and a third limit baffle 5013 .
  • the decoration ring main body 5011 is an annular plate structure, which is mainly overlapped around the first camera.
  • the decoration ring main body 5011 can be used to fix the lens corresponding to the first camera.
  • the second limit baffle 5012 extends along the inner hole wall of the decoration ring main body 5011 towards the direction of the second plate 20, so that after the decoration ring is placed around the first camera, the second limit baffle 5012 can just snap into the second plate 20.
  • a camera hole for the camera so that the decoration ring is limited around the first camera to prevent the decoration ring from moving.
  • a third limiting baffle 5013 is provided in the circumferential direction of the decorative ring, and the third baffle 5013 is located on the second surface of the third plate 50, and the third baffle 5013 is used to align with the main The lens limit corresponding to the camera, that is, the lens of the main camera can be installed in the area enclosed by the third baffle 5013 .
  • the third limiting baffle 5013 and the first limiting baffle 5011 form a groove, and the first plate 10 can be placed in the groove, so that the third limiting baffle 5013 and the first The limiting baffle 5011 limits the first plate 10 on the third plate. It should be noted that, if the electronic device includes two main cameras, a decoration ring 501 may be sleeved around each main camera.
  • each decorative ring 501 can be set separately to form an independent component, in this case, the third plate 50 includes two independent decorative ring 501 structures;
  • the rings 501 may also be connected to each other to form an integral part, which is the case with the structure of the third sheet 50 shown in Figure 7D.
  • each decoration ring 501 used to realize the connection with the first plate should be on the same horizontal plane.
  • the surface of the first decorative ring 501 used to realize the connection with the second plate should also be on the same horizontal plane.
  • the above implementation is only illustrated by the decoration ring around the first camera in FIG. 7D , which does not represent a limitation on the structure of the decoration ring 501 in this application.
  • the positions and sizes of the second limiting baffle 5012 and the third limiting baffle 5013 in the structure of the decoration ring 501 can be adjusted according to different actual usage scenarios.
  • the second limiting baffle 5012 can be arranged at a preset position between the inner ring and the outer ring of the main body of the decoration ring 5011 .
  • This application does not limit the connection mode between the first plate 10 and the second plate 20 and the third plate 50, wherein the first plate 10 and the third plate 50 can be directly connected, or connected through other components or materials, the first The second plate 20 and the third plate 50 can be directly connected, or connected through other components or materials.
  • the first board 10 and the third board 50 may be connected by adhesive, and the second board 20 and the third board 50 may be connected by hot-melt tape.
  • the thickness of the first plate 10 can be reduced by adding the third plate 50 between the first plate 10 and the second plate 20, so that the first plate 10 has a higher Light transmittance, on the one hand, enables the user to see the decorative effect diagram on the first surface of the first plate 10 more clearly in appearance, on the other hand, if the first plate 10 is provided with a window area, it can improve the degree of communication with the window area.
  • the light transmittance of the corresponding camera is provided with a window area.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

本申请提供了一种摄像头装饰件、制作方法及电子设备，包括第一板材和第二板材；在第一板材的第一表面具有装饰效果图；第二板材上设有与第一通孔对应的第二通孔；第二板材的第一表面包括连接区和避让区，避让区由第二板材的第一表面向第二板材的第二表面凹进第一深度，其中，第二板材的厚度大于等于电子设备的壳体上凸台的高度，第一深度大于等于凸台的高度；凸台的投影在避让区的投影区域内。这样，第二板材与壳体连接后，第二板材的第二表面与凸台的上表面在同一水平面，或者，第二板材的第二表面所在水平面高于凸台的上表面所在水平面，从而能够为第一板材提供平整的安装面，保证了第一板材的第一表面上装饰效果图的完整性。

Description

一种摄像头装饰件、制作方法及电子设备
本申请要求在2021年6月15日提交中国专利局、申请号为202110660324.8、发明名称为“一种摄像头装饰件、制作方法及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种摄像头装饰件、制作方法及电子设备。
背景技术
摄像头装饰件是一种用于装饰电子设备上摄像头的部件。如图1A所示，在一种实现方式中，摄像头装饰件一般先在单块透明的板材的一表面上制备出装饰效果图，例如具有纹理、炫光等效果，然后将带有装饰效果图的单块板材整体安装在电子设备的壳体01上，其中，将制备有装饰效果图的表面作为安装面，朝向电子设备壳体01方向安装，如此便可得到具有完整的装饰效果图(装饰效果在图中未示出)，且通透性好的摄像头装饰件02。
但是，随着电子设备的摄像头的尺寸越来越大，安装在电子设备上的摄像头在厚度方向会超出电子设备本体较多，因此，为了保护凸出电子设备本体部分的摄像头，可以在摄像头周围设置保护摄像头的保护结构，该保护结构配合凸出的摄像头会凸出电子设备的壳体的外表面一定高度。
在摄像头装饰件与电子设备的壳体连接时，由于保护结构的存在，为了将摄像头装饰件与电子设备的壳体连接，就需要将单块板材安装面上与保护结构对应的部分进行避让切割，而对单块板材安装面的避让切割操作，势必会将原本平整的单块板材安装面上的装饰效果图部分切除，从而影响摄像头装饰件的整体效果。
发明内容
本申请提供了一种摄像头装饰件、制作方法及电子设备，能够为第一板材提供平整的安装面，从而保证第一板材的第一表面上装饰效果图的完整性。
第一方面，本申请提供了一种摄像头装饰件，应用于电子设备，其中，所述电子设备包括摄像头组件，所述摄像头组件包括凸出于所述电子设备壳体外表面第一高度的主摄像头，以及位于所述主摄像头周围、且与所述电子设备壳体外表面连接的凸台；
所述摄像头装饰件包括第一板材和第二板材；所述第一板材的第一表面与所述第二板材的第二表面连接，所述第二板材的第一表面用于与电子设备的壳体的外表面连接；所述第一板材上设有用于贯穿所述主摄像头的第一通孔，所述第二板材上设有与所述第一通孔对应的第二通孔；所述第一板材的第一表面具有装饰效果图，其中，所述第一板材为透明材质；所述第二板材的第一表面包括连接区和避让区，所述避让区为所述第二板材的第一表面向所述第二板材的第二表面凹进第一深度，其中，所述第 二板材的厚度大于等于电子设备的壳体上凸台的高度，所述第一深度大于等于所述凸台的高度，且所述凸台的投影在所述避让区的投影区域内。
这样，第二板材的连接区与电子设备的壳体对应连接，避让区朝与凸台配合安装，凸台的高度小于等于第一深度，使得第二板材与壳体连接后，所述第二板材的第二表面与凸台的上表面在同一水平面，或者，所述第二板材的第二表面所在水平面高于凸台的上表面所在水平面，从而能够为第一板材提供平整的安装面，保证了第一板材的第一表面上装饰效果图的完整性。
在一种实现方式中，所述第一深度等于所述第二板材的厚度，所述第二通孔与所述避让区连通形成镂空区，所述连接区包围所述镂空区。
这样，在第二板材与壳体连接时，通过镂空区能够避让主摄像头以及凸台，与第二板材连接的第一板材的第一表面可以避开凸台，与第二板材的连接区连接，从而保证第一板材的第一表面装饰效果图的完整性。
在一种实现方式中，所述第一板材与所述第二板材之间设有第三板材；所述第三板材上设有与所述第一通孔对应的装饰环。
这样，通过在第一板材与第二板材之间增设的第三板材，可以减小第一板材的厚度，使第一板材具有更好透光度。
在一种实现方式中，还包括第一限位挡板，所述第一限位挡板沿所述第三板材的外周围向靠近所述第一板材方向延伸；所述第一板材被包围在由所述第一限位挡板围合形成的区域内。
这样，可以通过第一限位挡板将第一板材限位在第三板材上第一限位挡板所围合的区域内，提供装配精确度。
在一种实现方式中，还包括第二限位挡板，所述第二限位挡板沿所述装饰环的内孔壁向靠近所述第二板材方向延伸，所述第二限位挡板用于将所述装饰环限位于所述主摄像头周围；在所述装饰环的环向设有第三限位挡板，所述第三挡板位于所述第三板材的第二表面，所述第三挡板用于对与所述主摄像头对应的镜片限位；所述第三限位挡板与所述第一限位挡板围合形成凹槽，所述第一板材位于所述凹槽内。
这样，将装饰环放置在主摄像头周围后，第二限位挡板卡刚好能够卡进主摄像头的摄像孔，从而将装饰环限位在主摄像头周围，防止装饰环窜动。
在一种实现方式中，所述装饰效果图通过印制工艺印制于所述第一板材的第一表面。
这样，可以直接在第一板材的第一表面上制作出装饰效果图。例如，可以先采用UV转印工艺在第一板材的第一表面制作出想要的纹理，然后在第一板材的第一表面镀膜，以得到想要的炫光效果，最后，还可以在第一板材的第一表面涂制油墨，该油墨可以起到保护纹理，并且强化第一板材与第二板材的粘接性能作用。
在一种实现方式中，所述装饰效果图通过具有所述装饰效果图的膜片与第一板材的第一表面粘贴形成。
这样，可以避免直接在第一板材的第一表面上制作装饰效果图过程中，容易导致第一板材第一通孔内壁脏污的问题。
在一种实现方式中，所述第一板材的第一表面上包括至少一个视窗区。
这样，可以在第一板材的第一表面或者膜片的预设区域镀AR膜，得到具有高透光率的视窗区。该视窗区可以用作摄像头组中比较小的摄像头的镜片。
在一种实现方式中，所述第二板材的第二表面与所述第一板材的第一表面通过热熔胶带粘贴连接。
在一种实现方式中，所述第二板材的第二表面与所述第一板材的第一表面由如下方法粘贴连接：
将第二板材的第二表面在具有第一温度的硅胶滚轮下与热熔胶带进行预贴合；
将第一板材的第一表面与第二板材的第二表面贴合放置在液压机上压合，得到第一板材1和第二板材的组合件；
将压合后得到的所述组合件放置在滚轮机上重复滚压；
将滚轮机滚压后的组合件放置在脱泡机中烘烤，得到摄像头装饰件。
这样，一方面能够保证第一板材与第二板材的连接强度；另一方面，热熔胶带本身只有0.05mm左右，可以保证摄像头装饰件整体具有很好的通透性。
在一种实现方式中，所述第一温度为120-140℃。
在一种实现方式中，在所述液压机上压合的温度为110-130℃，压合时间为5-20秒。
在一种实现方式中，所述滚轮机的滚压速度为2-10m/min，在所述滚轮机上的滚压温度为80-100℃。
在一种实现方式中，在所述脱泡机中的烘烤温度为80-100℃，烘烤时间为20-40分钟。
在一种实现方式中，所述第二板材的第二表面上设有点胶槽，在所述点胶槽的外围设有挡墙；所述第二板材的第二表面与所述第一板材的第一表面通过胶水粘贴连接，所述胶水位于所述点胶槽内。
这样，胶水凝固后位于第一板材与第二板材之间，挡墙起到了遮瑕的作用，使摄像头装饰件外观上无残胶和其他瑕疵，整体具有很好的通透性。
在一种实现方式中，所述第一板材与所述第三板材通过背胶粘贴连接，所述第二板材与所述第三板材通过热熔胶带粘贴连接。
这样，可以减小第二板材与第三板材之间的连接缝隙，以及第一板材与所述第三板材之间的连接缝隙，使摄像头装饰件整体具有紧凑的结构。
第二方面，本申请提供了一种电子设备，包括主摄像头，以及第一方面任一所述的摄像头装饰件，所述摄像头装饰件安装于所述主摄像头周围。
这样，第二板材的连接区与电子设备的壳体对应连接，避让区朝与凸台配合安装，凸台的高度小于等于第一深度，使得第二板材与壳体连接后，所述第二板材的第二表面与凸台的上表面在同一水平面，或者，所述第二板材的第二表面所在水平面高于凸台的上表面所在水平面，从而能够为第一板材提供平整的安装面，保证了第一板材的第一表面上装饰效果图的完整性，从而提高电子设备的产品竞争力。
第三方面，本申请还提供了一种摄像头装饰件的制作方法，所述摄像头装饰件包括第一板材和第二板材；
将第二板材的第二表面在具有第一温度的硅胶滚轮下与热熔胶带进行预贴合；
将第一板材的第一表面与第二板材的第二表面贴合放置在液压机上压合，得到第一板材1和第二板材的组合件；
将压合后得到的所述组合件放置在滚轮机上重复滚压；
将滚轮机滚压后的组合件放置在脱泡机中烘烤，得到摄像头装饰件。
这样，通过采用上述方法制作的摄像头装饰件，既能提高第一板材与第二板材之间的粘接强度，又能保证第一板材与第二板材之间的连接面平整无瑕疵。
在一种实现方式中，所述第一温度为120-140℃。
在一种实现方式中，在所述液压机上压合的温度为110-130℃，压合时间为5-20秒。
在一种实现方式中，所述滚轮机的滚压速度为2-10m/min，在所述滚轮机上的滚压温度为80-100℃。
在一种实现方式中，在所述脱泡机中的烘烤温度为80-100℃，烘烤时间为20-40分钟。
附图说明
图1A为一种装配有摄像头装饰件的电子设备壳体的结构示意图；
图2A为本申请实施例提供的一种电子设备中去掉摄像头装饰件后的结构示意图；
图2B为图2A的M向结构示意图；
图2C为本申请提供的摄像头装饰件与图2A中摄像头组件配合安装于电子设备壳体后的整体效果图；
图2D为图2C中包括摄像头装饰件区域的局部放大图；
图2E为2D的M向结构示意图；
图2F为本申请实施例提供的一种摄像头装饰件的整体结构示意图；
图2G为本申请实施例提供的一种摄像头装饰件的分解图；
图3A为本申请实施例提供的一种摄像头装饰件中第一板材的结构示意图；
图3B为本申请实施例提供的一种在第一板材上制作装饰效果图的流程图；
图3C为本申请实施例提供的另一种在第一板材上制作装饰效果图的流程图；
图4A为本申请实施例提供的一种摄像头装饰件中第二板材的结构示意图；
图4B为本申请实施例提供的又一种摄像头装饰件中第二板材的结构示意图；
图5A为本申请实施例提供的采用热熔胶带连接第一板材和第二板材,得到的摄像头装饰件的分解图；
图5B为本申请实施例提供的采用热熔胶带连接第一板材和第二板材,得到的摄像头装饰件的侧面剖视图；
图5C为本申请实施例提供的一种摄像头装饰件的制作方法的工作流程示意图；
图5D为本申请实施例提供的采用热熔胶带连接第一板材和第二板材,得到的又一种摄像头装饰件的侧面剖视图；
图6A为本申请实施例提供的又一种摄像头装饰件中第二板材的结构示意图；
图6B为本申请实施例提供的又一种摄像头装饰件的结构示意图；
图6C为图6B的侧面剖视图；
图7A为本申请实施例提供的又一种摄像头装饰件安装于电子设备壳体后的效果 图；
图7B为本申请实施例提供的又一种摄像头装饰件的分解图；
图7C为本申请实施例提供的又一种摄像头装饰中第三板材的结构示意图；
图7D为图7A中去掉第一板材后的结构示意图。
具体实施方式
本申请中的电子设备可以是任何具有摄像头的电子设备，例如手机、智能手表、电脑等。本申请实施例接下来以手机为例，对电子设备上的摄像头装饰件结构进行阐述说明。
为避免对单块平整板材安装面上的装饰效果图部分切除，本申请实施例提供一种摄像头装饰件。
实施例一
首先参见图2A和图2B，图2A示出了一种实现方式中，位于电子设备壳体上摄像头组件的结构。该摄像头组件包括四个摄像头，其中，四个摄像头中的第一摄像头011和第二摄像头012为主摄像头，剩余的两个较小的摄像头为非主摄像头。主摄像头在厚度方向会超出电子设备本体较多，为了保护主摄像头，在每个主摄像头周围套设金属环结构013，以及与金属环013配合的凸台014。该凸台014用于承接金属环013与壳体01，使金属环013被支撑固定在壳体01上。如图2B所示，图2B为图2A的M向结构示意图。从图2B中可以明显看出，位于两个金属环013之间的凸台014高出壳体01一定的高度。
请继续参见图2C和图2D，图2C为本申请提供的摄像头装饰件与图2A中摄像头组件配合安装于电子设备壳体后的整体效果图，图2D为图2C中包括摄像头装饰件区域的局部放大图。其中，从外观上应该可以看到，图2C和图2D中摄像头装饰件能够呈现完整的装饰效果图(图中未示出)，对于摄像头装饰件上的装饰效果图可以参见图2F和图2G。
如图2C至图2E所示，图2E为图2D中M向的结构示意图。摄像头装饰件与电子设备的壳体连接后，能够露出摄像头组件中第一摄像头011和第二摄像头012，并且能够将高出壳体01的凸台014覆盖在摄像头装饰件内，从而能够保留摄像头装饰件上完整的装饰效果图。
下面结合附图对摄像头装饰件的结构进行详细说明。
如图2F图2G所示，图2F为本申请实施例中摄像头装饰件的整体结构示意图，图2G为图2F的分解图。本申请实施例中的摄像头装饰件包括两块板材，第一板材10和第二板材20。其中，第一板材10上设有用于贯穿主摄像头的第一通孔101，第一板材10的A面(第一表面)为一平整面，在第一板材10的A面上制作有装饰效果图。
如图2G所示，第二板材20为中间镂空的环状结构，其中，中间镂空的区域用于避开摄像头组件中的主摄像头011和012，以及凸台014。
结合图2E和图2G，第二板材20位于第一板材10与壳体01之间，第一板材10的A面与所述第二板材20的B面(第二表面)连接，所述第二板材20的A面与电子设备的壳体01的外表面连接。第二板材20的中间镂空区域避开了摄像头组件中的主摄像头011、012和凸台014，第二板材20厚度与凸台014的高度相同，第二板材20 与壳体01外表面连接后，弥补了第一板材与壳体01外表面之间的高度差。具有相同厚度的第二板材20和凸台014，为第一板材10提供了平整的安装面，从而不必再对第一板材10的A面避让切割，保证了第一板材10的A面上装饰效果图的完整性。
需要说明的是，以上仅以电子设备的后壳体上设有主摄像头的场景进行示例说明，实际应用中，摄像头装饰件还可以应用于电子设备的其他壳体上设有主摄像头的场景，本申请对此不进行限定。
下面结合附图对本申请中的摄像头装饰件的第一板材10的结构做进一步说明。
在本申请各个实施例中，第一板材10的形状及结构可以根据需要进行设置，例如可以根据凸台014和主摄像头共同组成的轮廓形状确定。第一板材10可以为规则形状也可以为不规则形状。例如，第一板材10可以是长方形或具有圆角的长方形。
如图3A所示，第一板材10上设有分别用于贯穿第一摄像头011和第二摄像头012的两个第一通孔101，其中，两个第一通孔101的位置和尺寸分别与电子设备上的第一摄像头011和第二摄像头012对应。
第一板材10包括相对设置的A面(第一表面)和B面(第二表面)。其中，第一板材10的A面，用于与第二板材20的B面连接。第一板材10的A面上具有装饰效果图，该装饰效果图可以根据实际需求设定，例如可以是纹理效果、光效效果，或者同时具有纹理效果和光效效果等。
本申请对第一板材10的A面上装饰效果图的形成方式不进行限定，例如可以是通过刻蚀方式刻蚀在第一板材10的A面上图案，又例如可以是通过印制工艺印制于第一板材10的A面上图案或者光效，再例如还可以是通过将印制于膜片上的图案或者光效转移至第一板材10的A面。
在一种实现方式中，如图3B所示，可以直接在第一板材10的A面上制作出装饰效果图。例如，可以先采用UV转印工艺在第一板材10的A面制作出想要的纹理，然后在第一板材10的A面镀膜，以得到想要的炫光效果，最后，还可以在第一板材10的A面涂制油墨，该油墨可以起到保护纹理，并且强化第一板材10与第二板材20的粘接性能作用。为了避免直接在第一板材10的A面上制作装饰效果图过程中，容易导致第一板材10的第一通孔内壁脏污的问题。在另一种实现方式中，如图3C所示，可以预先将装饰效果图制作于膜片30上，然后将制作有装饰效果图的膜片30粘贴于第一板材10的A面。例如，先在膜片30上制作纹理、镀膜和涂制油墨，以得到想要的装饰效果图，然后将该具有装饰效果图的膜片30贴合到第一板材10的A面。其中，膜片30的形状应与第一板材10的形状相同，例如膜片30上设有与第一板材10相同数量和尺寸的第一通孔，膜片30通常为薄塑料膜材料，例如膜片30可以采用塑料炫光膜。
为了能够透过第一板材10的B面看到第一板材10的A面上装饰效果图，本申请中的第一板材10采用透明材质，例如第一板材10可以采用透明玻璃、水晶、亚克力等材质。
其中，第一板材10的A面上还可以制作出至少一个视窗区102，该视窗区102可以用作摄像头组件中比较小的摄像头的镜片。本申请对制作视窗区102的方法不进行限定，例如在第一板材10的A面或者膜片30的预设区域镀AR膜，得到具有高透光率 的视窗区102。
需要说明的是，以上第一板材10均是便于方案表述的示意性的说明，并不代表对本申请中第一板材10结构的限定。对于第一板材10的B面可以是如图3A中示出的，为一个平面，也可以不是平面，例如具有凹凸构造的结构，本申请对此不进行限定。由于第一板材10的B面直接裸露在电子设备外部，因此，可以对第一板材10的B面进行一些表面处理，以提高第一板材10的B面的表面性能，例如，通过镀AF膜和淋涂硬化工艺来强化表面性能，使第一板材10的B面具有防水防潮、耐摩擦、易清洁等特点。
需要进一步说明的是，以上实现方式中仅以摄像头组件包括两个主摄像头的情况进行示例说明，但是并不表示第一板材10的结构只能应用于包括两个主摄像头的场景，第一板材10的结构还可以应用于具有更多或更少主摄像头的场景。如果将第一板材10应用于具有更多或更少主摄像头的场景，仅需对应调整第一板材10上第一通孔101的位置、数量和尺寸，在此就不再一一进行说明相关之处参见上述实现方式即可。
下面结合附图对本申请中的第二板材20的结构做进一步说明。
第二板材20用于承接第一板材10和电子设备的壳体01。第二板材20的外边缘轮廓可以与第一板材10的外边缘轮廓相同，从而可以将第一板材10与第二板材20贴合后，得到外边缘规整的摄像头装饰件。应理解，第二板材20的外边缘轮廓也可以与第一板材10的外边缘轮廓不相同，例如，第二板材20的外边缘轮廓略小于第一板材10的外边缘轮廓，使第二板材20的外边缘轮廓的投影在第一板材10的外边缘轮廓的投影内。
结合图4A和图2E，第二板材20的厚度等于凸台014的高度，第二板材20包括中间镂空区202和连接区201，镂空区202在第二板材20厚度方向贯穿，凸台014的投影以及主摄像头的投影均在镂空区202的投影区域内，该镂空区202被连接区201包围。如图2E所示，第二板材20的A面(第一表面)与壳体01连接后，第二板材20的B面(第二表面)对应的连接区201与凸台014的上表面在同一水平面。这样，第一板材10的A面可以通过第二板材的连接区201与壳体01间接连接，从而避免了对第一板材10的A面中与凸台014对应区域的切割，保证了第一板材10的第一表面装饰效果图的完整性。
其中，第一板材10的A面中与凸台014对应的区域可以与凸台014的上表面连接，第一板材10的A面中与连接区201对应的区域可以与连接区201连接。
需要说明的是，第一板材10主要起到装饰的效果，第二板材20主要起到承接第一板材10与壳体01的作用，因此，本申请对第二板材20的材质不进行限定，第二板材20可以采用与第一板材10相同或不同的材质。如果第二板材20采用与第一板材10相同的材质，更有利于实现第一板材10与第二板材20的粘贴连接。
需要进一步说明的是，以上实施例仅以图2A中示出的凸台结构进行说明，实际应用中，凸台结构不仅限于图2A中示出的情况。根据不同的凸台结构，可以调整镂空区202的位置和尺寸。
下面结合附图对本申请中的第一板材10与第二板材20之间的连接方式做进一步说明。
本申请中第一板材10与第二板材20可以直接连接，或者通过其他组件或材料连接，本申请对此不进行限定。
在一种实现方式中，如图5A和图5B所示，第一板材10与第二板材20通过热熔胶带40粘贴连接。热熔胶带40在常温下无任何粘性，经过加热处理后热熔胶带40才具有粘性，从而可以将第一板材10与第二板材20粘贴在一起。
为提高第一板材10与第二板材20之间的粘接强度，以及保证第一板材10与第二板材20之间的连接面平整无瑕疵，本申请还提供一种采用热熔胶带40粘贴第一板材10与第二板材20的施工方法，如图5C所示，该方法包括如下步骤：
步骤100、将第二板材20的B面在具有第一温度的硅胶滚轮下与热熔胶带40进行预贴合。
可以将热熔胶带40裁剪成与第二板材的B面相同的形状，然后，将第二板材20的B面在具有第一温度的硅胶滚轮下与裁剪好的热熔胶带40对齐贴合，保证热熔胶带40与第二板材20的B面之间气泡均匀一致。
其中，第一温度可以根据选用的热熔胶带40的材质不同适当调整，一般第一温度可以为120-140℃，例如第一温度为130℃。
步骤200、将第一板材10的A面与第二板材20的B面贴合放置在液压机上压合，得到第一板材10和第二板材20的组合件，其中，液压机的压合温度可以设置为110-130℃，压合时间可以为5-20s。
在一具体例子中，液压机的压合温度可以设置为120℃，压合时间可以为10s。
步骤300、将压合后得到的组合件放置在滚轮机上重复滚压至少一遍，滚轮机的滚压速度可以设置为2-10m/min，滚轮机加热到组合件的温度可以设置为80-100℃。
在一具体例子中，滚轮机的速度为5m/min，滚轮机加热到组合件的温度为90℃。
经过步骤200和步骤300，一方面可以激活热熔胶带，另一方面可以驱除第一板材与第二板材之间的气泡。
步骤400、将滚轮机滚压后的组合件放置在脱泡机中烘烤。
本申请通过将组合件放置在脱泡机中烘烤，能够使热熔胶带40充分激活，其中，脱泡机可以采用高压脱泡机，例如采用能够到达到1.0Mpa左右的高压脱泡机。其中，在高压脱泡机中的烘烤温度可以设置为80-100℃，烘烤时间可以设置为20-40分钟。在一具体例子中，在高压脱泡机中的烘烤温度为90℃，烘烤时间为30分钟。
经过上述方法将第一板材10与第二板材20粘贴后，还可以在第一板材10和第二板材20组合件的周圈进行高光切削处理，得到如图2E所示的摄像头装饰件。图2E所示的摄像头装饰件，外观上无残胶和其他瑕疵，使摄像头装饰件整体具有很好的通透性。
如果装饰效果图通过膜片30转移至第一板材10的A面，则可以将粘贴有膜片30的第一板材10与第二板材20按照上述方法通过热熔胶带粘贴连接，粘贴后得到的摄像头装饰件，如图5D所示，热熔胶带40位于膜片30与第二板材20之间。
在另一种实现方式中，第一板材10与第二板材20可以通过胶水粘贴连接。如果通过胶水连接第一板材10与第二板材20，如图6A可以在第二板材20的B面设置点胶槽203，然后使用点胶机在点胶槽203内点胶后，再将第一板材10的A面与第二板 材20的B面贴合保压，例如可以在夹具中静置1小时，以保证第一板材10与第二板材20之间具有良好的粘接强度，得到如图6B所示的摄像头装饰件。
申请人发现，采用胶水连接第一板材10与第二板材20的方式中，胶水厚度一般会在0.1mm以上，因此，在粘接后得到的第一板材10与第二板材20的组合件外观面会看到胶水，进而无法满足外观要求，为此，如图6C所示，本申请进一步在点胶槽203外圈设置有挡墙204，利用挡墙204遮挡点胶槽内203胶水205，挡墙204的高度要高于胶水205的厚度，例如胶水205厚度为0.2mm，挡墙204的高度设为0.3mm。胶水205凝固后位于第一板材10与第二板材20之间，挡墙204起到了遮瑕的作用，使摄像头装饰件外观上无残胶和其他瑕疵，整体具有很好的通透性。
需要说明的是，在实际使用中，可以先将第一板材10与第二板材20组装好后，再与壳体01连接；也可以先将第二板材20与壳体01连接后，再将第一板材10与第二板材20连接。其中，本申请对第二板材20与壳体01的连接方式不进行限定，例如，可以通过背胶将第二板材20与壳体01粘贴连接。
以上实施例中的摄像头装饰件包括互相配合的第一板材10和第二板材20，其中，第一板材10主要起到装饰摄像头的作用，第二板材20通过设置的镂空区202，使第二板材20与壳体配合后，为第一板材10提供了平整的安装面，从而可以保证第一板材10第一表面上装饰效果图的完整性。
以上实施例中，通过在第二板材20的中间区域整体形成镂空区202，以避开主摄像头以及凸台014。在实际应用中，本申请不限于上述实施例中提供的第二板材20的结构。第二板材20只要能够避开主摄像头以及凸台014即可。例如：第二板材20上可以仅包括与第一通孔101对应的第二通孔202A，以及与凸台014对应的避让区202B。如图4B所示，在另一种实现方式中，第二板材20的厚度可以大于凸台014的高度，这种情况下，避让区202B可以不在第二板材20的厚度方向上贯穿。如图4B所示，避让区202B由第二板材20的A面向第二板材20的B面刻蚀第一深度形成，其中，刻蚀的第一深度大于等于电子设备的壳体01上凸台014的高度，且小于第二板材20的厚度。也就相当于，由所述第二板材20的A面向所述第二板材20的B面刻蚀第一深度形成一个凹槽结构，其中，凹槽的槽底区域能够覆盖凸台014的上表面所在区域，这样，第二板材20的B面可以呈现与第一板材10的A面相同的形状，从而可以增加第一板材10与第二板材20的连接面积。该种实现方式中，在第二板材20与壳体01连接后，凸台014位于第二板材上的凹槽内，从而第二板材20的B面可以作为第一板材10的安装面。
需要说明的是，图4A中示出的第二板材中，相当于将第二通孔202A与避让区202B连通，形成完整的镂空区202，并且整个镂空区202在第二板材20厚度方向贯穿；而图4B中示出的第二板材中，只有第二通孔202A在第二板材的厚度方向贯穿。
实施例二
下面结合附图对本申请中另一种摄像头装饰件的结构进行介绍，该摄像头装饰件包括第一板材10、第二板材20和第三板材50。
以下依然以电子设备包括两个主摄像头的场景为例，对包括第三板材50的摄像头装饰件的结构进行说明。
如图7A和图7B所示，图7A为本申请实施例二中摄像头装饰件安装于电子设备壳体后的效果图，图7B为本申请实施例二中摄像头装饰件的分解图。第三板材50位于第一板材10和第二板材20之间，这样，第一板材10的A面与第三板材50的上表面连接，第二板材20的B面与第三板材50的下表面连接，第二板材20的A面与壳体的外表面连接。通过在第一板材10与第二板材20之间增设的第三板材50，可以减小第一板材10的厚度，使第一板材10具有更好透光度。
其中，对于第一板材10和第二板材20的结构可以参见上述实施例一中描述，此处不再赘述。
下面结合附图对本申请中第三板材50的结构做进一步说明。
如图7B和图7C所示，第三板材50的外边缘轮廓可以与第一板材10和第二板材20的外边缘轮廓形状相同。进一步的，如图7D所示，第三板材50的外边缘还可以向靠近第一板材10方向延伸，形成第一限位挡板503，第一限位挡板503可以将第一板材10限位在第三板材50上第一限位挡板503所围合的区域内。
如图7C和图7D所示，第三板材50上包括两个装饰环501，装饰环501与第一板材10上第一通孔101的位置相对应，其中，装饰环501与实施例一中的金属环结构013的作用相同，每个装饰环501用于套设在对应的主摄像头周围，以实现对主摄像头的保护作用。其中，位于所述装饰环501下方的凸台014用于将装饰环501支撑固定在电子设备的壳体上。第三板材50上还设有与摄像头组件中非主摄像头对应的透光孔502，该透光孔502与第一板材10上的视窗区102相对应。
应理解，第三板材50的外边缘轮廓也可以与第一板材10和第二板材20的外边缘轮廓不相同，例如，第三板材50的外边缘轮廓略小于第一板材10的外边缘轮廓，使第三板材50的外边缘轮廓的投影在第一板材10的外边缘轮廓的投影内。其中，本申请对第三板材50的材质不进行限定，第三板材50可以采用金属、透明玻璃、水晶、亚克力等材质。
其中，如图7D所示，装饰环501包括装饰环主体5011、第二限位挡板5012、第三限位挡板5013。装饰环主体5011为环形板状结构，其主要搭接在第一摄像头周围。装饰环主体5011可以用于固定与第一摄像头对应的镜片。第二限位挡板5012沿装饰环主体5011的内孔壁向靠近第二板材20方向延伸，这样，将装饰环放置在第一摄像头周围后，第二限位挡板5012刚好能够卡进第一摄像头的摄像孔，从而将装饰环限位在第一摄像头周围，防止装饰环窜动。在所述装饰环的环向设第三限位挡板5013，所述第三挡板5013位于所述第三板材50的第二表面，所述第三挡板5013用于对与所述主摄像头对应的镜片限位，即可以将主摄像头的镜片安装在第三挡板5013围合形成的区域内。第三限位挡板5013与所述第一限位挡板5011围合形成凹槽，可以将第一板材10放置于凹槽内，从而可以通过第三限位挡板5013与所述第一限位挡板5011，将第一板材10限位在第三板材上。需要说明的是，如果电子设备包括两个主摄像头，则可以在每个主摄像头周围可以套设一个装饰环501。如果摄像头装饰件包括两个或两个以上装饰环501，则各个装饰环501可以单独设置，形成独立的部件，这种情况下，第三板材50包括两个独立的装饰环501结构；各个装饰环501也可以互相连接，形成一个整体的部件，这种情况即是图7D中示出的第三板材50的结构。
需要进一步说明的是，如图7D所示，如果摄像头装饰件包括两个或两个以上装饰环501，则每个装饰环501用于实现与第一板材连接的表面应该在同一水平面上，每个装饰环501用于实现与第二板材连接的表面也应该在同一水平面上。
需要进一步说明的是，以上实现方式中仅以图7D中第一摄像头周围的装饰环进行示例说明，并不代表对本申请中装饰环501结构的限定。可以根据实际使用场景的不同，对装饰环501的结构中第二限位挡板5012和第三限位挡板5013的位置、尺寸进行调整。例如图7D中，第二摄像头周围的装饰环501，可以将第二限位挡板5012设置在装饰环主体5011的内环与外环之间预设位置处。
本申请对第一板材10和第二板材20与第三板材50之间的连接方式不进行限定，其中，第一板材10与第三板材50可以直接连接，或者通过其他组件或材料连接，第二板材20与第三板材50可以直接连接，或者通过其他组件或材料连接。在一种实现方式中，第一板材10与第三板材50可以通过背胶粘贴连接，第二板材20与第三板材50可以通过热熔胶带粘贴连接。
需要说明的是，以上实施例仅用于说明不同摄像头装饰件间的不同之处，其相同之处(例如第一板材和第二板材的结构等)，可以参见其他实施例，在此就不再一一赘述。
采用前述实施例所提供的技术方案，通过在第一板材10与第二板材20之间增设的第三板材50，可以减小第一板材10的厚度，从而使第一板材10具有更高的透光度，一方面使用户在外观上能够更加清晰地看到第一板材10的第一表面上装饰效果图，另一方面如果第一板材10上设有视窗区，能够提高与该视窗区对应的摄像头的透光率。

Claims (22)

  1. 一种摄像头装饰件，其特征在于，应用于电子设备，其中，所述电子设备包括摄像头组件，所述摄像头组件包括凸出于所述电子设备壳体外表面第一高度的主摄像头，以及位于所述主摄像头周围、且与所述电子设备壳体外表面连接的凸台；
    所述摄像头装饰件包括第一板材和第二板材；
    所述第一板材的第一表面与所述第二板材的第二表面连接，所述第二板材的第一表面用于与所述电子设备的壳体的外表面连接；
    所述第一板材上设有用于贯穿所述主摄像头的第一通孔，所述第二板材上设有与所述第一通孔对应的第二通孔；
    所述第一板材的第一表面具有装饰效果图，其中，所述第一板材为透明材质；
    所述第二板材的第一表面包括连接区和避让区，所述避让区为所述第二板材的第一表面向所述第二板材的第二表面凹进第一深度，其中，所述第二板材的厚度大于等于电子设备的壳体上凸台的高度，所述第一深度大于等于所述凸台的高度，且所述凸台的投影在所述避让区的投影区域内。
  2. 根据权利要求1所述的摄像头装饰件，其特征在于，所述第一深度等于所述第二板材的厚度，所述第二通孔与所述避让区连通形成镂空区，所述连接区包围所述镂空区。
  3. 根据权利要求1所述的摄像头装饰件，其特征在于，
    所述第一板材与所述第二板材之间设有第三板材；
    所述第三板材上设有与所述第一通孔对应的装饰环。
  4. 根据权利要求3所述的摄像头装饰件，其特征在于，还包括第一限位挡板，所述第一限位挡板沿所述第三板材的外周围向靠近所述第一板材方向延伸；
    所述第一板材被包围在由所述第一限位挡板围合形成的区域内。
  5. 根据权利要求3所述的摄像头装饰件，其特征在于，还包括第二限位挡板，所述第二限位挡板沿所述装饰环的内孔壁向靠近所述第二板材方向延伸，所述第二限位挡板用于将所述装饰环限位于所述主摄像头周围；
    在所述装饰环的环向设有第三限位挡板，所述第三挡板位于所述第三板材的第二表面，所述第三挡板用于对与所述主摄像头对应的镜片限位；
    所述第三限位挡板与所述第一限位挡板围合形成凹槽，所述第一板材位于所述凹槽内。
  6. 根据权利要求1-5任一所述的摄像头装饰件，其特征在于，所述装饰效果图通过印制工艺印制于所述第一板材的第一表面。
  7. 根据权利要求1-5任一所述的摄像头装饰件，其特征在于，所述装饰效果图通过具有所述装饰效果图的膜片与第一板材的第一表面粘贴形成。
  8. 根据权利要求1-5任一所述的摄像头装饰件，其特征在于，所述第一板材的第一表面上包括至少一个视窗区。
  9. 根据权利要求1-5任一所述的摄像头装饰件，其特征在于，所述第二板材的第二表面与所述第一板材的第一表面通过热熔胶带粘贴连接。
  10. 根据权利要求9所述的摄像头装饰件，其特征在于，所述第二板材的第二表 面与所述第一板材的第一表面由如下方法粘贴连接：
    将第二板材的第二表面在具有第一温度的硅胶滚轮下与热熔胶带进行预贴合；
    将第一板材的第一表面与第二板材的第二表面贴合放置在液压机上压合，得到第一板材1和第二板材的组合件；
    将压合后得到的所述组合件放置在滚轮机上重复滚压；
    将滚轮机滚压后的组合件放置在脱泡机中烘烤，得到摄像头装饰件。
  11. 根据权利要求10所述的方法，其特征在于，所述第一温度为120-140℃。
  12. 根据权利要求10所述的方法，其特征在于，在所述液压机上压合的温度为110-130℃，压合时间为5-20秒。
  13. 根据权利要求10所述的方法，其特征在于，所述滚轮机的滚压速度为2-10m/min，在所述滚轮机上的滚压温度为80-100℃。
  14. 根据权利要求10所述的方法，其特征在于，在所述脱泡机中的烘烤温度为80-100℃，烘烤时间为20-40分钟。
  15. 根据权利要求1-5任一所述的摄像头装饰件，其特征在于，所述第二板材的第二表面上设有点胶槽，在所述点胶槽的外围设有挡墙；
    所述第二板材的第二表面与所述第一板材的第一表面通过胶水粘贴连接，所述胶水位于所述点胶槽内。
  16. 根据权利要求3-5任一所述的摄像头装饰件，其特征在于，所述第一板材与所述第三板材通过背胶粘贴连接，所述第二板材与所述第三板材通过热熔胶带粘贴连接。
  17. 一种电子设备，其特征在于，包括摄像头组件，以及如权利要求1-16任一所述的摄像头装饰件，其中，所述摄像头组件包括凸出于所述电子设备壳体外表面第一高度的主摄像头，以及位于所述主摄像头周围、且与所述电子设备壳体外表面连接的凸台。
  18. 一种摄像头装饰件的制作方法，其特征在于，所述摄像头装饰件包括第一板材和第二板材；
    将第二板材的第二表面在具有第一温度的硅胶滚轮下与热熔胶带进行预贴合；
    将第一板材的第一表面与第二板材的第二表面贴合放置在液压机上压合，得到第一板材和第二板材的组合件；
    将压合后得到的所述组合件放置在滚轮机上重复滚压；
    将滚轮机滚压后的组合件放置在脱泡机中烘烤，得到摄像头装饰件。
  19. 根据权利要求18所述的方法，其特征在于，所述第一温度为120-140℃。
  20. 根据权利要求18所述的方法，其特征在于，在所述液压机上压合的温度为110-130℃，压合时间为5-20秒。
  21. 根据权利要求18所述的方法，其特征在于，所述滚轮机的滚压速度为2-10m/min，在所述滚轮机上的滚压温度为80-100℃。
  22. 根据权利要求18所述的方法，其特征在于，在所述脱泡机中的烘烤温度为80-100℃，烘烤时间为20-40分钟。
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