WO2022257524A1 - 印刷电路板制备方法、印刷电路板、钻头及钻孔装置 - Google Patents

印刷电路板制备方法、印刷电路板、钻头及钻孔装置 Download PDF

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Publication number
WO2022257524A1
WO2022257524A1 PCT/CN2022/080755 CN2022080755W WO2022257524A1 WO 2022257524 A1 WO2022257524 A1 WO 2022257524A1 CN 2022080755 W CN2022080755 W CN 2022080755W WO 2022257524 A1 WO2022257524 A1 WO 2022257524A1
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Prior art keywords
board
target layer
drill bit
printed circuit
circuit board
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PCT/CN2022/080755
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English (en)
French (fr)
Inventor
谢剑
魏仲民
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中兴通讯股份有限公司
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Publication of WO2022257524A1 publication Critical patent/WO2022257524A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection

Definitions

  • Printed circuit board PCB (printed circuit board, PCB) is generally composed of multi-layer boards. In order to realize the electrical connection between multi-layer boards, it is generally adopted to open a through hole on the PCB board, and then electroplate a layer on the inner wall of the through hole. Copper plating, so as to achieve electrical conduction between multi-layer boards, and then use back drilling to remove copper in invalid holes.
  • back-drilling in order to avoid damage to the copper plating that needs to be kept electrically connected by an excessively deep back-drilling hole, a section of copper plating that is as short as possible is usually reserved at the bottom, that is, a stub.
  • the embodiment of the present application provides a method for preparing a printed circuit board, a printed circuit board, electronic equipment, a drill bit, and a drilling device.
  • the electrical signal generated by the pre-prepared target layer is used to mark the back-drilling depth, and the back-drilling is precise to obtain zero residual piles. Effect.
  • the embodiments of the present application provide a method for preparing a printed circuit board.
  • a conductive material is placed on the first core board to form a target layer; the first core board and the second core board are laminated and pressed together. , form the whole board; prepare a through hole, and collect the electrical signal generated when the drill bit passes through the target layer and the depth H of the through hole; according to the electrical signal, determine the depth of the target layer in the whole board; the whole board is copper-plated ; performing back-drilling on the position of the through hole, so that the drill bit stops at the relative depth of the target layer.
  • the method provided in this embodiment generates an electrical signal during the preparation of the through-hole through the pre-prepared conductive target layer, and then obtains the depth of the target layer in the entire board, and provides an accurate mark for the actual stop position of the back-drilling depth. Accurate backdrilling of stumps.
  • embodiments of the present application provide a printed circuit board, which is prepared according to the method for manufacturing a printed circuit board described in the first aspect.
  • embodiments of the present application provide an electronic device, including the printed circuit board as described in the second aspect.
  • the embodiment of the present application also provides a drill bit, the drill bit includes a drill shank, the drill shank is conductive; a drill tip, the drill bit is insulated; the drill tip is arranged on the top of the drill shank; the drill bit It is configured to realize the printed circuit board preparation method described in the first aspect. Since the drill bit in the embodiment of the present application has a conductive shank, it can generate an electrical signal when it touches a target layer that is also a conductor, thereby providing an accurate mark for the back-drilling depth and realizing precise back-drilling with zero residual piles.
  • embodiments of the present application provide a drilling device, including the drill bit described in the fourth aspect.
  • Fig. 1 is the schematic flow chart of the printed circuit board preparation method provided by the embodiment of the present application.
  • Figure 2a is a cross-sectional view of a first core plate provided by an embodiment of the present application.
  • Figure 2b is a cross-sectional view of the entire board provided by an embodiment of the present application.
  • Fig. 2c is a cross-sectional view during the formation of a through hole provided by an embodiment of the present application.
  • Figure 2d is a cross-sectional view of the entire board after copper plating provided by an embodiment of the present application.
  • Fig. 2e is a cross-sectional view of backdrilling provided by an embodiment of the present application.
  • Fig. 3a is a cross-sectional view of a first core plate provided by another embodiment of the present application.
  • Figure 3b is a cross-sectional view of the entire board provided by another embodiment of the present application.
  • Fig. 3c is a cross-sectional view during the formation of a through hole provided by another embodiment of the present application.
  • Figure 3d is a cross-sectional view of the entire board after copper plating provided by another embodiment of the present application.
  • Figure 3e is a cross-sectional view of back drilling provided by another embodiment of the present application.
  • Fig. 4 is a schematic structural diagram of a drill bit provided by an embodiment of the present application.
  • first”, “second” and the like in the specification and claims and the above drawings are used to distinguish similar objects, and not necessarily used to describe a specific sequence or sequence. It should be understood that if it involves orientation descriptions, for example, the orientation or positional relationship indicated by up, down, front, rear, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and The description is simplified, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus should not be construed as limiting the application.
  • the drill bit should be able to stop precisely at the signal layer during back drilling.
  • the embodiment of the present application provides a method for preparing a printed circuit board.
  • Fig. 1 is a schematic flowchart of a method for preparing a printed circuit board provided in an embodiment of the present application
  • Figs. 2a-2e are cross-sectional views during the manufacturing process of a printed circuit board in an embodiment.
  • the method for preparing a printed circuit board provided in this embodiment at least includes:
  • Step S110 disposing a conductive material on the first core board to form a target layer.
  • the first core board 200 includes a signal layer 210 , and the drill bit should stop precisely at the signal layer 210 during back drilling, so as to achieve the effect of back drilling with zero stubs.
  • the target layer 220 is one layer. Since the target layer 220 is adjacent to the signal layer 210, the conductive target layer 220 can generate an electrical signal by contacting the drill bit to identify the depth of the signal layer 210. effect, the material of the target layer is copper.
  • the target layer 220 has two or more layers, and the target layer 220 is adjacent to the signal layer 210 and has a certain thickness, which can ensure that the electrical conduction of the signal layer 210 will not be damaged during back drilling.
  • the target layer 220 can form a conductive layer with a determined position and shape through a patterning process according to the back-drilling position requirement.
  • the target layer 220 may extend to the edge of the board, enabling electrical signals to be generated when drilling at any location on the board.
  • Step S120 Laminating and pressing the first core board and the second core board to form a whole board.
  • Step S120 is a conventional process step of the multi-layer composite PCB board, which will not be repeated here, and can refer to FIG. 2 b , wherein the prepreg layer 230 can play a bonding role.
  • Step S130 Prepare a through hole, and collect the electrical signal and the depth H of the through hole generated when the drill bit passes through the target layer.
  • an electrical signal can be generated when a drill bit that also has a conductive material passes through; at the same time, whether it is based on a physical measurement method or using other peripheral devices, the measurement
  • the depth of the through hole denoted as H, can refer to Figure 2c. At this time, the depth of the through hole is the thickness of the entire PCB at the current drilling position.
  • Step S140 Determine the depth of the target layer in the entire board according to the electrical signal.
  • the drilling device will record the position of the drill bit before drilling, and record it as the initial position.
  • the signal records the position of the drill bit at this time, which is recorded as the target position, and the target position indicates the depth of the target layer 220 in the entire plate. Based on the initial position and the target position, the relative depth of the target layer 220 relative to the drilling start plane can be calculated and obtained.
  • the starting surface of the through-hole drilling and the surface to be back-drilled are not the same surface, and the starting surface of the through-hole drilling is recorded as the first surface of the entire board. After measurement Then calculate the distance H1 between the target layer 220 and the first surface of the whole board, that is, the depth of the target layer 220 is H1, and the thickness of the whole board, that is, the depth of the through hole H, then the back-drilling depth is H-H1.
  • Step S150 Copper plating the entire board.
  • the copper plating layer 250 is formed after copper plating, for details, refer to FIG. 2d.
  • Step S160 Back-drilling the through hole position, so that the drill bit stops at the depth where the target layer is located.
  • the back-drilling depth H-H1 finally forms a back-drilled hole 260 with zero residual piles, for details, refer to FIG. 2e.
  • the depth of back drilling is H-H1-X, where X is the compensation value.
  • the printed circuit board preparation method provided in this embodiment prepares the conductive target layer in advance, so that it generates an electrical signal during the preparation of the through hole, and then obtains the depth of the target layer in the entire board, providing an accurate mark for the actual stop position of the back drilling depth , realize the precise back drilling of zero residual piles, improve the signal quality and reduce the loss of the transmission line; at the same time, because no other auxiliary materials and equipment are needed, the printed circuit board preparation method provided in this embodiment is compared with other back drilling methods It is also simpler and easier to implement.
  • Figures 3a-3e provide a flow chart of the printed circuit board manufacturing process in another embodiment, including:
  • Step S110 disposing a conductive material on the first core board to form a target layer.
  • the first core board 300 includes a signal layer 310 , and the drill bit should stop precisely at the signal layer 310 during back drilling, so as to achieve the effect of back drilling with zero stubs.
  • the target layer 320 is one layer. Since the target layer 320 is adjacent to the signal layer 310, the conductive target layer 320 can generate an electrical signal by contacting the drill bit to identify the depth of the signal layer 310. effect, the material of the target layer 320 is copper.
  • the target layer 320 has two or more layers, and the target layer 320 is adjacent to the signal layer 310 and has a certain thickness, which can ensure that the electrical conduction of the signal layer 310 will not be damaged during back drilling.
  • the target layer 320 can form a conductive layer with a determined position and shape through a patterning process according to the back-drilling position requirement.
  • the target layer 320 can extend to the edge of the board, so that electrical signals can be generated when holes are drilled anywhere on the board.
  • Step S120 laminating and pressing the first core board and the second core board to form a whole board.
  • Step S120 is a conventional process step of a multi-layer composite PCB board, which will not be repeated here, and can refer to FIG. 3 b , wherein the prepreg layer 330 can play a bonding role.
  • Step S130 Prepare a through hole, and collect the electrical signal and the depth H of the through hole generated when the drill bit passes through the target layer.
  • an electrical signal can be generated when a drill bit that also has a conductive material passes through; at the same time, whether it is based on a physical measurement method or using other peripheral devices, the measurement
  • the depth of the through hole denoted as H, can refer to Figure 3c. At this time, the depth of the through hole is the thickness of the entire PCB at the current drilling position.
  • Step S140 Determine the depth of the target layer in the entire board according to the electrical signal.
  • the drilling device will record the position of the drill bit before drilling, and record it as the initial position.
  • the signal records the position of the drill bit at this time, which is recorded as the target position, and the target position indicates the depth of the target layer 320 in the entire plate. Based on the initial position and the target position, the relative depth of the target layer 320 relative to the drilling start plane can be calculated and obtained.
  • the starting surface of the through-hole drilling and the surface to be back-drilled are the same surface, and the starting surface of the through-hole drilling is recorded as the second surface of the entire board.
  • the back-drilling depth is H2.
  • Step S150 Copper plating the entire board.
  • the copper plating layer 350 is formed after copper plating, for details, refer to FIG. 3d.
  • Step S160 Back-drilling the through hole position, so that the drill bit stops at the depth where the target layer is located.
  • the back-drilling depth H-H1 finally forms a back-drilled hole 360 with zero residual piles, for details, refer to FIG. 2e.
  • the backdrilling depth is H2-X, where X is the compensation value.
  • the printed circuit board preparation method provided in this embodiment prepares the conductive target layer in advance, so that it generates an electrical signal during the preparation of the through hole, and then obtains the depth of the target layer in the entire board, providing an accurate mark for the actual stop position of the back drilling depth , realize the precise back drilling of zero residual piles, improve the signal quality and reduce the loss of the transmission line; at the same time, because no other auxiliary materials and equipment are needed, the printed circuit board preparation method provided in this embodiment is compared with other back drilling methods It is also simpler and easier to implement.
  • the embodiment of the present application provides a printed circuit board, which is prepared according to the method for preparing the printed circuit board described in the first aspect.
  • the printed circuit board provided in the embodiment of the present application has zero stumps, so it has better Excellent signal quality and lower loss.
  • an embodiment of the present application provides an electronic device, including the printed circuit board described in the second aspect.
  • the implementation of the present application provides a drill bit, as shown in FIG. 4 .
  • the drill bit 400 includes a drill shank 410 and a drill tip 420 , and the drill tip 420 is disposed on the top of the drill shank. Since the drill bit 400 will generate an electrical signal when it is in contact with the target layer, the drill bit 400 needs to have a metal part, i.e. the drill shank 410, to form a conductive loop, but the top of the drill bit needs to be insulated to prevent it from contacting the conductive part of the signal layer. The signal layer will not be damaged, so the drill tip 420 needs to be made of insulating material. Compared with the fully insulated drill bit in the related art, the drill bit provided in the implementation of the present application can cooperate with the conductive target layer to realize accurate marking of the back-drilling depth.
  • the embodiment of the present application also provides a drilling device, including the drill bit as described in the fourth aspect.
  • the drilling device can detect and record the drilling depth by itself or by connecting with other computer equipment.
  • an electrical signal is generated during the preparation of the through hole, and then the depth of the target layer in the entire board is obtained, providing an accurate mark for the actual stop position of the back drilling depth, and achieving zero stubs
  • the precise back drilling improves the signal quality and reduces the loss of the transmission line.
  • the device embodiments described above are only illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • the functional modules/units in the system, and the device can be implemented as software, firmware, hardware, and an appropriate combination thereof.
  • the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be composed of several physical components. Components cooperate to execute.
  • Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit .
  • Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media).
  • computer storage media includes both volatile and nonvolatile media implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules, or other data. permanent, removable and non-removable media.
  • Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, tape, magnetic disk storage or other magnetic storage devices, or can Any other medium used to store desired information and which can be accessed by a computer.
  • communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media .
  • Mobile terminal devices can be mobile phones, tablet computers, notebook computers, handheld computers, vehicle-mounted terminal devices, wearable devices, super mobile personal computers, netbooks, personal digital assistants, CPE, UFI (wireless hotspot equipment), etc.; Specific limits.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

印刷电路板制备方法、印刷电路板、钻头及钻孔装置，其中，印刷电路板制备方法包括S110：在第一芯板(200，300)上方设置导电材料，形成目标层(220，320)；S120：将所述第一芯板(200，300)和第二芯板层叠并压合，形成整板；S130：制备通孔，并采集钻头(400)经过所述目标层(220,320)时产生的电信号以及通孔深度H；S140：根据所述电信号，确定所述目标层(220，320)在整板中的深度；S150：整板镀铜；以及S160：对所述通孔位置进行背钻，使所述钻头(400)在所述目标层(220，320)所处的相对深度处停止。

Description

印刷电路板制备方法、印刷电路板、钻头及钻孔装置
相关申请的交叉引用
本申请基于申请号为202110630030.0、申请日为2021年6月7日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请实施例涉及但不限于印刷线路板领域，尤其涉及一种印刷电路板制备方法、印刷电路板、电子设备、钻头及钻孔装置。
背景技术
印刷线路板PCB(printed circuit board，PCB)一般由多层板复合而成，为了实现多层板之间的电连通，一般采取在PCB板上开设通孔，然后在通孔内壁上电镀一层镀铜，从而实现多层板之间的电气导通，然后再采用背钻的方式去除无效孔铜。在背钻时，为了避免过深的背钻孔对需要保留电连通的镀铜造成破坏，通常会在底部预留一段尽可能短的镀铜，即残桩。然而伴随着5G的发展，网络产品的高速串行信号速率在不断提升，残桩导致的信号的反射、散射、延迟等问题愈发突出，成为限制PCB往更高速率发展的主要因素。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种印刷电路板制备方法、印刷电路板、电子设备、钻头及钻孔装置，通过预先制备的目标层产生的电信号标记背钻深度，精准背钻，获得零残桩的效果。
第一方面，本申请的实施例提供了印刷电路板制备方法，本方法通过在第一芯板上方设置导电材料，形成目标层；将所述第一芯板和第二芯板层叠并压合，形成整板；制备通孔，并采集钻头经过所述目标层时产生的电信号以及通孔深度H；根据所述电信号，确定所述目标层在整板中的深度；整板镀铜；对所述通孔位置进行背钻，使所述钻头在所述目标层所处的相对深度处停止。本实施例提供的方法通过预先制备形成的导电目标层，在通孔制备中产生电信号，进而获得目标层在整板中的深度，为背钻深度的实际停止位置提供准确标记，实现了零残桩的精准背钻。
第二方面，本申请的实施例提供了一种印刷电路板，根据第一方面所述的印刷电路板制备方法制备获得。
第三方面，本申请的实施例提供了一种电子设备，包括如第二方面所述的印刷电路板。
第四方面，本申请的实施例还提供了一种钻头，钻头包括钻柄，所述钻柄导电；钻尖，所述钻头绝缘；所述钻尖设置于所述钻柄顶端；所述钻头被设置成实现第一方面所述的印刷电路板制备方法。本申请实施例的钻头由于具有导电钻柄，能够在接触到同为导体的目标层时产生电信号，进而为背钻深度提供准确标记，实现了零残桩的精准背钻。
第五方面，本申请的实施例提供了一种钻孔装置，包括了第四方面所述的钻头。
本申请实施例的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请实施例而了解。本申请实施例的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
图1为本申请实施例提供的印刷电路板制备方法的流程示意图；
图2a为本申请一实施例提供的第一芯板的剖面图；
图2b为本申请一实施例提供的整板的剖面图；
图2c为本申请一实施例提供的通孔形成过程中的剖面图；
图2d为本申请一实施例提供的整板镀铜后的剖面图；
图2e为本申请一实施例提供的背钻后的剖面图；
图3a为本申请另一实施例提供的第一芯板的剖面图；
图3b为本申请另一实施例提供的整板的剖面图；
图3c为本申请另一实施例提供的通孔形成过程中的剖面图；
图3d为本申请另一实施例提供的整板镀铜后的剖面图；
图3e为本申请另一实施例提供的背钻后的剖面图；以及
图4为本申请一实施例提供的钻头的结构示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。需要理解的是，如果涉及到方位描述，例如上、下、前、后、左、右等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
需要说明的是，若干的含义是一个或者多个，多个的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
为了便于后文实施例说明，假设多层复合的PCB板中，需要保持电气导通的层定义为信号层，那么背钻时应使钻头能够精确地在信号层处停止。
第一方面，本申请实施例提供了一种印刷电路板制备方法。图1为本申请实施例提供的印刷电路板制备方法的流程示意图，图2a-2e是一实施例中印刷电路板制备工艺过程中的剖面图。参考图1与图2a-2e，本实施例提供的印刷电路板制备方法至少包括：
步骤S110：在第一芯板上方设置导电材料，形成目标层。
在一些实施例中，参考图2a，第一芯板200包括信号层210，背钻时应使钻头能够精确地在信号层210处停止，以此达到零残桩的背钻效果。
在一些实施例中，参考图2b，目标层220为一层，由于目标层220与信号层210临近，因此导电的目标层220可通过与钻头接触产生电信号以达到标识信号层210所处深度的效果，目标层的材料为铜。
在一些实施例中，目标层220为两层及以上，目标层220与信号层210临近且具有一定厚度，能够保证背钻时不会破坏信号层210的电气导通。
在一些实施例中，参考图2b，目标层220可根据背钻位置需要，通过图形化工艺，形成具有确定位置与形状的导电层。
在一些实施例中，目标层220可延伸至板边，使在板任一位置进行钻孔时均能够产生电信号。
步骤S120：将所述第一芯板和所述第二芯板层叠并压合，形成整板。
步骤S120是多层复合型PCB板的常规工艺步骤，在此不作赘述，可参考图2b，其中半固化层230可起到粘结作用。
步骤S130：制备通孔，并采集钻头经过所述目标层时产生的电信号以及通孔深度H。
在一些实施例中，由于目标层220为导电材料形成，因此能够在同样具有导电材料的钻头钻孔经过时，产生电信号；同时，无论是基于物理测量的方式，或利用其他外围设备，测量通孔的深度，记作H，可参考图2c，此时通孔的深度，就是当前钻孔位置处PCB整板的厚度。
步骤S140：根据所述电信号，确定所述目标层在所述整板中的深度。
在一些实施例中，钻孔装置在钻孔开始前将记录钻头所处位置，记作初始位置，钻孔过程中，当钻头的导电部分与目标层220接触后形成导电回路时，产生了电信号，记录此时钻头所处位置，记作目标位置，目标位置表明了目标层220在整板中所处的深度。基于初始位置与目标位置，能够计算获得目标层220相对于钻孔起始面的相对深度。
如图2c所示，在此实施例中，通孔钻孔的起始面与待背钻面不为同一个面，将通孔钻孔的起始面记作整板第一表面，经过测量后计算目标层220与整板第一表面相距H1，即目标层220所处深度为H1，整板厚度，即通孔深度H，那么背钻深度为H-H1。
步骤S150：整板镀铜。
在一些实施例中，镀铜后形成镀铜层250，具体可参考图2d。
步骤S160：对所述通孔位置进行背钻，使所述钻头在所述目标层所处的深度处停止。
在一些实施例中，背钻深度H-H1，最终形成零残桩的背钻孔260，具体可参考图2e。
本领域技术人员应当知晓，由于钻孔装置、加工工艺误差等因素产生的常规误差，可以在背钻具体实施时进行补偿。在一些实施例中，背钻的深度为H-H1-X，X即为补偿值。
本实施例提供的印刷电路板制备方法通过预先制备导电目标层，使其在通孔制备中产生电信号，进而获得目标层在整板中的深度，为背钻深度的实际停止位置提供准确标记，实现了零残桩的精准背钻，提升了信号质量的同时，降低了传输线的损耗；同时，由于无需其它辅助物料和设备，本实施例提供的印刷电路板制备方法相对于其它背钻方法也更加简单易行。
图3a-3e提供了另一实施例中印刷电路板制备工艺的流程图，包括：
步骤S110：在第一芯板上方设置导电材料，形成目标层。
在一些实施例中，参考图3a，第一芯板300包括信号层310，背钻时应使钻头能够精确地在信号层310处停止，以此达到零残桩的背钻效果。
在一些实施例中，参考图3b，目标层320为一层，由于目标层320与信号层310临近，因此导电的目标层320可通过与钻头接触产生电信号以达到标识信号层310所处深度的效果，目标层320的材料为铜。
在一些实施例中，目标层320为两层及以上，目标层320与信号层310临近且具有一定厚度，能够保证背钻时不会破坏信号层310的电气导通。
在一些实施例中，参考图3b，目标层320可根据背钻位置需要，通过图形化工艺，形成具有确定位置与形状的导电层。
在一些实施例中，目标层320可延伸至板边，使在板任一位置进行钻孔时均能够产生电信号。
步骤S120：将第一芯板和所述第二芯板层叠并压合，形成整板。
步骤S120是多层复合型PCB板的常规工艺步骤，在此不作赘述，可参考图3b，其中半固化层330可起到粘结作用。
步骤S130：制备通孔，并采集钻头经过所述目标层时产生的电信号以及通孔深度H。
在一些实施例中，由于目标层320为导电材料形成，因此能够在同样具有导电材料的钻头钻孔经过时，产生电信号；同时，无论是基于物理测量的方式，或利用其他外围设备，测量通孔的深度，记作H，可参考图3c，此时通孔的深度，就是当前钻孔位置处PCB整板的厚度。
步骤S140：根据所述电信号，确定所述目标层在所述整板中的深度。
在一些实施例中，钻孔装置在钻孔开始前将记录钻头所处位置，记作初始位置，钻孔过程中，当钻头的导电部分与目标层320接触后形成导电回路时，产生了电信号，记录此时钻头所处位置，记作目标位置，目标位置表明了目标层320在整板中所处的深度。基于初始位置与目标位置，能够计算获得目标层320相对于钻孔起始面的相对深度。
如图3c所示，在此实施例中，通孔钻孔的起始面与待背钻面为同一个面，将通孔钻孔的起始面记作整板第二表面，经过测量后计算目标层320与整板第二表面相距H2，即目标层320所处深度为H2，整板厚度，即通孔深度H，那么背钻深度为H2。
步骤S150：整板镀铜。
在一些实施例中，镀铜后形成镀铜层350，具体可参考图3d。
步骤S160：对所述通孔位置进行背钻，使所述钻头在所述目标层所处的深度处停止。
在一些实施例中，背钻深度H-H1，最终形成零残桩的背钻孔360，具体可参考图2e。
本领域技术人员应当知晓，由于钻孔装置、加工工艺误差等因素产生的常规误差，可以在背钻具体实施时进行补偿。在一些实施例中，背钻的深度为H2-X，X即为补偿值。
本实施例提供的印刷电路板制备方法通过预先制备导电目标层，使其在通孔制备中产生电信号，进而获得目标层在整板中的深度，为背钻深度的实际停止位置提供准确标记，实现了零残桩的精准背钻，提升了信号质量的同时，降低了传输线的损耗；同时，由于无需其它辅助物料和设备，本实施例提供的印刷电路板制备方法相对于其它背钻方法也更加简单易行。
第二方面，本申请实施例提供了一种印刷电路板，根据第一方面所述的印刷电路板制备方法制备获得，本申请实施例提供的印刷电路板由于具有零残桩，因此具有更好的信号质量与更低的损耗。
第三方面，本申请实施例提供了一种电子设备，包括第二方面所述的印刷电路板。
第四方面，本申请实施提供了一种钻头，如图4所示。钻头400，钻头400包括钻柄410与钻尖420，钻尖420设置于所述钻柄顶端。由于钻头400在与目标层接触时要产生电信号，因此钻头400需具有金属部分，即钻柄410，使其形成导电回路，但是钻头顶端需要绝缘，以防止在接触到信号层导电部分时，不会对信号层产生破坏，因此钻尖420需采用绝缘材料。相较于相关技术中全绝缘的钻头，本申请实施中提供的钻头能够配合导电的目标层，实现对背钻深度的精确标记。
第五方面，本申请实施例还提供了一种钻孔装置，包括如第四方面所述的钻头，钻孔装置可以通过自身或外接其它计算机设备，起到检测、记录钻孔深度的作用。
本申请实施例通过预先制备形成的导电目标层，在通孔制备中产生电信号，进而获得目标层在整板中的深度，为背钻深度的实际停止位置提供准确标记，实现了零残桩的精准背钻，提升了信号质量的同时，降低了传输线的损耗。
以上所描述的装置实施例仅仅是示意性的，其中作为分离部件说明的单元可以是或者也可以不是物理上分开的，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。
本领域普通技术人员可以理解，上文中所公开方法中的全部或某些步骤、系统、装置中的功能模块/单元可以被实施为软件、固件、硬件及其适当的组合。在硬件实施方式中，在以上描述中提及的功能模块/单元之间的划分不一定对应于物理组件的划分；例如，一个物理组件可以具有多个功能，或者一个功能或步骤可以由若干物理组件合作执行。某些物理组件或所有物理组件可以被实施为由处理器，如中央处理器、数字信号处理器或微处理器执行的软件，或者被实施为硬件，或者被实施为集成电路，如专用集成电路。这样的软件可以分布在计算机可读介质上，计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的，术语计算机存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于RAM、ROM、EEPROM、闪存或其他存储器技术、CD-ROM、数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。此外，本领域普通技术人员公知的是，通信介质通常包含计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据，并且可包括任何信息递送介质。移动终端设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载终端设备、可穿戴设备、超级移动个人计算机、上网本、个人数字助理、CPE、UFI(无线热点设备)等；本申请实施方案不作具体限定。
以上是对本申请的一些实施方式进行了具体说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请范围的前提下还可作出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (10)

  1. 一种印刷电路板制备方法，包括：
    在第一芯板上方设置导电材料，形成目标层；
    将所述第一芯板和第二芯板层叠并压合，形成整板；
    制备通孔，并采集钻头经过所述目标层时产生的电信号以及通孔深度H；
    根据所述电信号，确定所述目标层在所述整板中的深度；
    整板镀铜；以及
    对所述通孔位置进行背钻，使所述钻头在所述目标层所处的深度处停止。
  2. 根据权利要求1所述的方法，其中，所述根据所述电信号，确定所述目标层在所述整板中的深度包括至少以下之一：
    确定所述整板第一表面与所述目标层的第一距离H1；以及
    确定所述整板第二表面与所述目标层的第二距离H2。
  3. 根据权利要求2所述的方法，其中，所述整板中的深度为H2或H-H1。
  4. 根据权利要求3所述的方法，其中，所述背钻深度根据制备过程中产生的补偿值进行调整。
  5. 根据权利要求1至4任一项所述的方法，其中，所述目标层材料为铜。
  6. 一种印刷电路板，包括：
    根据权利要求1至5任一项所述的印刷电路板制备方法获得。
  7. 一种电子设备，包括权利要求6所述的印刷电路板。
  8. 一种钻头，包括：
    钻柄，所述钻柄导电；
    钻尖，所述钻头绝缘；
    所述钻尖设置于所述钻柄顶端；以及
    所述钻头被设置成实现权利要求1至5任一项所述的印刷电路板制备方法。
  9. 根据权利要求8所述的钻头，其中，所述钻柄在接触到所述目标层时能够产生所述电信号。
  10. 一种钻孔装置，包括权利要求8或9所述的钻头。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103433969A (zh) * 2013-08-28 2013-12-11 华为技术有限公司 印刷电路板的钻孔方法和装置
CN107920423A (zh) * 2017-11-21 2018-04-17 大族激光科技产业集团股份有限公司 钻孔机及钻孔制作方法
CN110022647A (zh) * 2018-01-08 2019-07-16 深南电路股份有限公司 一种pcb的钻孔方法及装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103433969A (zh) * 2013-08-28 2013-12-11 华为技术有限公司 印刷电路板的钻孔方法和装置
CN107920423A (zh) * 2017-11-21 2018-04-17 大族激光科技产业集团股份有限公司 钻孔机及钻孔制作方法
CN110022647A (zh) * 2018-01-08 2019-07-16 深南电路股份有限公司 一种pcb的钻孔方法及装置

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