WO2022253013A1 - Appareil électronique - Google Patents

Appareil électronique Download PDF

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Publication number
WO2022253013A1
WO2022253013A1 PCT/CN2022/094308 CN2022094308W WO2022253013A1 WO 2022253013 A1 WO2022253013 A1 WO 2022253013A1 CN 2022094308 W CN2022094308 W CN 2022094308W WO 2022253013 A1 WO2022253013 A1 WO 2022253013A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
diaphragm
housing
heat
support plate
Prior art date
Application number
PCT/CN2022/094308
Other languages
English (en)
Chinese (zh)
Inventor
王宇
张志峰
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2022253013A1 publication Critical patent/WO2022253013A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the field of electroacoustic technology, in particular to an electronic device.
  • electronic devices that use sound-generating devices such as chips in speakers as the main heat source, usually conduct heat to the die-cast aluminum shell of the speaker box through a heat-conducting silica gel sheet, so as to dissipate heat through the high thermal conductivity of the shell itself, but , the thermal conductivity of the heat-conducting silicone sheet is small, the heat generated by the chip cannot be quickly transferred to the shell, and the heat transferred to the shell can only rely on the part of the shell itself exposed to the natural air for natural convection heat dissipation, the heat dissipation performance Poor, and with the increase of smart speaker functions, the demand for chip heat dissipation is also increasing, and the current heat dissipation method can no longer meet the demand for high heat dissipation.
  • the main purpose of the present invention is to provide an electronic device aimed at solving the problem of poor heat dissipation performance of existing sound boxes.
  • the present invention proposes an electronic device, the electronic device includes a housing and a sound-generating device accommodated in the housing, a front channel acoustic cavity is formed between the housing and the sound-generating device, and the housing is provided with A sound outlet that communicates with the front sound cavity;
  • the sound-generating device includes a housing, a sound-generating unit accommodated in the housing, and a support plate arranged outside the housing, the sound-generating unit and the housing
  • a rear cavity is formed between the bodies, a heat dissipation channel is formed between the support plate and the housing, a heat source is provided on the side of the support plate facing the housing, and the heat source is located in the heat dissipation channel, so
  • the casing is provided with a heat dissipation window communicating with the rear cavity and the heat dissipation channel, and the heat dissipation window is covered with a heat dissipation diaphragm.
  • the heat dissipation diaphragm and the heat source are misplaced, the angle between the heat dissipation diaphragm and the support plate is an acute angle, and the distance between the heat dissipation diaphragm and the support plate is closer to The direction of the heat source is gradually expanding.
  • the heat dissipating diaphragm and the heat source are arranged in dislocation, and the heat dissipating diaphragm is arranged perpendicular to the support plate.
  • the housing is provided with a protruding structure, the protruding structure protrudes from the shell wall of the housing facing the supporting plate toward the direction of the supporting plate, and the protruding structure faces the heat source
  • the heat dissipation window is opened on one side, and the heat dissipation diaphragm is installed on the raised structure.
  • the protruding structure includes a windshield part and a mounting part, the heat dissipation window is opened in the installation part, the heat dissipation diaphragm is mounted on the mounting part, and the windshield part is connected to the mounting part part away from the side of the heat source, and the windshield part abuts against the support plate.
  • the protruding structure is integrally formed on the housing.
  • the heat dissipating diaphragm, the support plate, and the shell wall of the shell facing the support plate are arranged parallel to each other.
  • the heat dissipation diaphragm is arranged facing the heat source, and there is a gap communicating with the heat dissipation channel between the heat dissipation diaphragm and the heat source.
  • the heat dissipation diaphragm and the heat source are dislocated.
  • the housing is made of a heat-conducting material, and a heat-conducting sheet is provided between the heat source and the housing, and both sides of the heat-conducting sheet are in contact with the heat source and the housing respectively.
  • the heat dissipation diaphragm includes a mounting ring and a vibrating diaphragm, the vibrating diaphragm covers the heat dissipation window, and the outer edge of the vibrating diaphragm is mounted on the mounting ring, and the mounting ring surrounds the The heat dissipation window is arranged and installed on the outer periphery of the heat dissipation window.
  • the heat dissipation diaphragm further includes a counterweight, the counterweight is arranged on the diaphragm, and the counterweight is arranged facing the heat dissipation window.
  • the vibrating diaphragm is made of elastic soft material.
  • the support plate is made of heat-conducting material; and/or, the support plate is detachably connected to the housing.
  • the vibrating membrane of the sounding unit of the sounding device vibrates up and down to cause the airflow in the rear cavity to oscillate, and then the heat dissipation diaphragm covered at the heat dissipation window is subjected to the vibration of the rear cavity.
  • Vibration is generated by the impact of airflow, and the vibration of the heat dissipation diaphragm generates oscillating airflow in the heat dissipation channel, and then generates forced convection around the heat source, quickly dissipates heat and cools the heat source, speeds up heat dissipation, improves heat dissipation efficiency and heat dissipation performance, and meets the requirements of high heat dissipation. need.
  • FIG. 1 is an exploded schematic diagram of a sound-generating device in an electronic device according to an embodiment of the present invention
  • Fig. 2 is a schematic cross-sectional view of a sound-generating device in an electronic device according to an embodiment of the present invention
  • Fig. 3 is an exploded schematic diagram of a sound-generating device in an electronic device according to another embodiment of the present invention.
  • Fig. 4 is a schematic cross-sectional view of a sound emitting device in an electronic device according to another embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of a heat dissipation diaphragm of a sound emitting device in an electronic device according to an embodiment of the present invention
  • FIG. 6 is a schematic cross-sectional view of a heat dissipation diaphragm of a sound emitting device in an electronic device according to another embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.
  • the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
  • orientations such as “up”, “down”, “left”, and “right” in the present invention are based on the orientation shown in Figure 2 and Figure 4, and are only used to explain the postures shown in Figure 2 and Figure 4 If the relative positional relationship among the components changes, the directional indication will also change accordingly.
  • the invention provides an electronic device.
  • the electronic device 200 of this embodiment includes a casing 201 and a sound emitting device 100 housed in the casing 201, and a front channel acoustic cavity 202 is formed between the casing 201 and the sound emitting device 100,
  • the casing 201 is provided with a sound outlet 2011 communicating with the front sound cavity 202 .
  • the sounding device 100 includes a housing 10, a sounding unit 20 and a support plate 30, wherein the sounding unit 20 is accommodated in the housing 10, the support plate 30 is arranged outside the housing 10, and between the sounding unit 20 and the housing 10 A rear cavity 11 is formed, a heat dissipation channel 50 is formed between the support plate 30 and the housing 10, a heat source 40 is provided on the side of the support plate 30 facing the housing 10, and the heat source 40 is located in the heat dissipation channel 50, and the housing 10 is provided with a communicating back
  • the cavity 11 and the heat dissipation window 12 of the heat dissipation channel 50 are covered with a heat dissipation diaphragm 60 .
  • the supporting plate 30 of the sounding device 100 is located above the casing 10 , and the sounding unit 20 and the casing 10 face the upper shell of the supporting plate 30
  • a rear cavity 11 is formed between the walls, and the support plate 30 and the upper shell wall of the housing 10 are spaced up and down, so that a heat dissipation channel 50 is formed between the support plate 30 and the housing 10 , and the support plate 30 faces one side of the housing 10 , That is, a heat source 40 is disposed on the lower side of the support plate 30 , and the heat source 40 may be a chip of the sound-generating device 100 .
  • This embodiment takes the heat source 40 as an example for illustration.
  • the chip is located in the heat dissipation passage 50, and the housing 10 is provided with a heat dissipation window 12 connecting the rear cavity 11 and the heat dissipation passage 50.
  • the heat dissipation window 12 is specifically opened on the upper shell wall of the housing 10, and the heat dissipation window 12 is covered with a heat dissipation
  • the diaphragm 60 that is, the heat dissipation diaphragm 60 covers the heat dissipation window 12 .
  • the electronic device 200 of this embodiment can be a computer, a mobile phone, a sound box, and a car sound box applied to a car, etc., and the electronic device 200 is applied with a sound generating device 100.
  • the sound generating device 100 is used as a speaker used in a sound box as an example It is illustrated that the sound emitting unit 20 is a loudspeaker unit. It can be understood that the speaker unit has a diaphragm. During use, the diaphragm of the speaker unit vibrates up and down to cause the airflow in the rear cavity 11 to oscillate, thereby causing the heat dissipation diaphragm 60 covering the heat dissipation window 12 to be subjected to back pressure.
  • the vibration of the airflow in the cavity 11 produces vibration, and the vibration of the heat dissipation diaphragm 60 generates an oscillating airflow in the heat dissipation channel 50, which in turn generates forced convection around the chip to quickly dissipate heat and cool down the chip, speed up heat dissipation, and improve heat dissipation efficiency and heat dissipation performance , to meet the needs of high heat dissipation.
  • the housing 201 is provided with sound holes 2011 to realize normal sounding of the electronic device 200 .
  • the number of sound outlets 2011 may be multiple, and the plurality of sound outlets 2011 are arranged at intervals.
  • the housing 2011 is also provided with cooling holes 2012.
  • the cooling holes 2012 are arranged on the side of the housing 201 close to the heat source 40. After the airflow generated by the vibration of the cooling diaphragm and the air around the heat source generate forced convection, the airflow with a large amount of heat flows out from the cooling channel. , and then dissipate to the outside world through the heat dissipation holes, so as to achieve the purpose of rapid cooling.
  • the number of heat dissipation holes 2012 may be multiple, and the plurality of heat dissipation holes 2012 are arranged at intervals. It should be noted that the arrows in FIG. 2 and FIG. 4 indicate the flow direction of the airflow.
  • the heat dissipation diaphragm 60 and the heat source 40 are misplaced, the angle between the heat dissipation diaphragm 60 and the support plate 30 is an acute angle, and the heat dissipation diaphragm 60 and the support plate 30 The distance between them is gradually expanded toward the direction close to the heat source 40 .
  • the heat dissipation window 12 is opened on the upper shell wall of the housing 10 to avoid the position of the chip, so that the heat dissipation diaphragm 60 and the chip are misplaced.
  • the heat dissipation vibration The membrane 60 is arranged obliquely, so that the angle between the heat dissipation diaphragm 60 and the support plate 30 is an acute angle, and the distance between the heat dissipation diaphragm 60 and the support plate 30 is gradually expanded toward the direction close to the heat source 40, as shown in Figure 1 and As shown in Figure 2, the heat dissipation diaphragm 60 is located on the right side of the chip, and the heat dissipation diaphragm 60 is arranged obliquely downward from right to left, so that the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 can flow to the left to the chip, and the heat dissipation diaphragm
  • the distance between the support plate 60 and the support plate 30 gradually increases from right to left, so that the airflow generated by the vibration of the heat dissipation diaphragm 60 can flow to the chip smoothly and improve
  • the heat dissipating diaphragm 60 and the chip are dislocated, so that the heat dissipating diaphragm 60 avoids the chip, and it is convenient to install the following heat conducting sheet 70 .
  • the casing 10 can be made of heat-conducting material, and a heat-conducting sheet 70 is arranged between the heat source 40 and the casing 10 , and both sides of the heat-conducting sheet 70 are in contact with the heat source 40 and the casing 10 respectively.
  • the housing 10 can be made of die-casting aluminum material with better thermal conductivity in the prior art, and the heat-conducting sheet 70 can be a heat-conducting silica gel sheet in the prior art.
  • the housing 10 can be made of the first housing 13 and the second Two housings 14 are assembled, wherein, the first housing 13 forms a rear chamber 11 with the loudspeaker unit, and the support plate 30 is installed on the first housing 13.
  • the first housing 13 can be It is made of die-casting aluminum, while the second housing 14 can be made of plastic.
  • the heat conduction sheet 70 By setting the heat conduction sheet 70, and the upper side of the heat conduction sheet 70 is in contact with the chip, and the lower side of the heat conduction sheet 70 is in contact with the upper shell wall of the casing 10 (first casing 13), so that the heat generated by the chip can be passed through heat conduction.
  • the sheet 70 conducts to the housing 10, and then dissipates heat through the housing 10, and then uses the dual heat dissipation effect of the heat dissipation diaphragm 60 and the heat conduction sheet 70 to greatly speed up the heat dissipation of the chip and greatly improve the heat dissipation efficiency.
  • the heat dissipation diaphragm 60 and the heat source 40 are dislocated, and the heat dissipation diaphragm 60 is arranged perpendicular to the support plate 30 .
  • the support plate 30 is arranged parallel to the upper shell wall of the housing 10, and the heat dissipation diaphragm 60 is vertically arranged so that the heat dissipation diaphragm 60 and the support plate 30 are perpendicular to each other.
  • the vertical The heat dissipation diaphragm 60 arranged vertically can make the oscillating air flow generated by the vibration have no upward component, so that it can all flow to the left to the chip, so as to quickly cool the chip, further accelerate the heat dissipation speed, and improve the heat dissipation efficiency.
  • the heat dissipating diaphragm 60 and the chip are dislocated, so that the heat dissipating diaphragm 60 avoids the chip, and it is convenient to install the following heat conducting sheet 70 .
  • the casing 10 can be made of heat-conducting material, and a heat-conducting sheet 70 is provided between the heat source 40 and the casing 10 , and both sides of the heat-conducting sheet 70 are in contact with the heat source 40 and the casing 10 respectively.
  • the housing 10 can be made of die-casting aluminum material with better thermal conductivity in the prior art, and the heat-conducting sheet 70 can be a heat-conducting silica gel sheet in the prior art.
  • the housing 10 can be made of the first housing 13 and the second Two casings 14 are assembled, wherein, the first casing 13 forms a rear chamber 11 with the speaker unit, and the support plate 30 is installed on the first casing 13.
  • the first casing 13 can be It is made of die-casting aluminum, while the second housing 14 can be made of plastic.
  • the heat conduction sheet 70 By setting the heat conduction sheet 70, and the upper side of the heat conduction sheet 70 is in contact with the chip, and the lower side of the heat conduction sheet 70 is in contact with the upper shell wall of the casing 10 (first casing 13), so that the heat generated by the chip can be passed through heat conduction.
  • the sheet 70 conducts to the housing 10, and then dissipates heat through the housing 10, and then uses the dual heat dissipation effect of the heat dissipation diaphragm 60 and the heat conduction sheet 70 to greatly speed up the heat dissipation of the chip and greatly improve the heat dissipation efficiency.
  • the housing 10 is provided with a protruding structure 15, the protruding structure 15 protrudes from the shell wall of the housing 10 facing the supporting plate 30 to the direction of the supporting plate 30, and the protruding A heat dissipation window 12 is opened on the side of the structure 15 facing the heat source 40 , and the heat dissipation diaphragm 60 is installed on the protruding structure 15 .
  • the protruding structure 15 is arranged on the upper shell wall of the housing 10, the protruding structure 15 protrudes upward from the upper shell wall of the housing 10, and a heat dissipation window 12 is opened on the side of the protruding structure 15 facing the chip to dissipate heat.
  • the diaphragm 60 is mounted on the protruding structure 15 .
  • the protruding structure 15 includes a windshield portion 151 and a mounting portion 152.
  • the mounting portion 152 is provided with a heat dissipation window 12.
  • the heat dissipation diaphragm 60 is installed on the mounting portion 152.
  • the windshield portion 151 is connected to the side of the mounting portion 152 away from the heat source 40. In addition, the windshield portion 151 abuts against the support plate 30 .
  • the installation part 152 is arranged facing the chip, the heat dissipation window 12 is opened on the installation part 152, and the heat dissipation diaphragm 60 is installed on the installation part 152, so that the heat dissipation diaphragm 60 is arranged facing the chip, which is beneficial to the heat dissipation diaphragm 60
  • the oscillating airflow generated by the vibration flows in the direction of the chip.
  • the windshield part 151 is connected to the right side of the mounting part 152 away from the chip, and the upper end of the windshield part 151 abuts against the support plate 30, so that the windshield part 151 has a windshield effect, and blocks the oscillating air flow generated by the vibration of the cooling diaphragm 60 from The outflow from the windshield part 151 ensures that the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 all flows toward the chip direction, speeding up the heat dissipation speed and improving the heat dissipation efficiency.
  • the protruding structure 15 is integrally formed on the casing 10, omitting assembly steps and assembly errors, and is easy to manufacture. Specifically, the protruding structure 15 is integrally formed with the upper shell wall of the housing 10, and the heat dissipation diaphragm 60 can be installed on the inner side of the protruding structure 15 by gluing or screwing, or by gluing or screwing. Installed on the outside of the raised structure 15, the assembly is simple and convenient.
  • the heat dissipation diaphragm 60 , the support plate 30 , and the shell wall of the housing 10 facing the support plate 30 are arranged parallel to each other.
  • the heat dissipation diaphragm 60 is disposed facing the heat source 40 , and there is a gap 80 communicating with the heat dissipation channel 50 between the heat dissipation diaphragm 60 and the heat source 40 .
  • the heat dissipation diaphragm 60, the support plate 30, and the upper shell wall of the housing 10 are all arranged horizontally, and the three are parallel to each other.
  • the heat dissipation diaphragm 60 is arranged facing the chip, and the heat dissipation diaphragm There is a gap 80 communicating with the heat dissipation channel 50 between the heat source 60 and the heat source 40, that is, the chip and the heat dissipation diaphragm 60 are arranged at intervals up and down, and the chip is located directly above the heat dissipation diaphragm 60, and the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 can pass through directly.
  • the gap 80 directly blows upward to the chip, shortens the distance between the heat dissipation diaphragm 60 and the heat dissipation diaphragm 60, reduces the loss of the oscillating air flow during the flow process, makes the oscillating air flow directly and fully act on the chip, accelerates the heat dissipation speed, and improves cooling efficiency.
  • the sound-generating device 100 has no heat conduction requirement on the material of the casing 10 , and the casing 10 can be made of a relatively low-cost plastic material to save production costs.
  • the heat dissipation diaphragm 60 , the support plate 30 , and the housing wall of the housing 10 facing the support plate 30 are arranged parallel to each other.
  • the heat dissipation diaphragm 60 and the heat source 40 are dislocated.
  • the heat dissipation diaphragm 60, the support plate 30, and the upper shell wall of the housing 10 are all arranged horizontally, and the three are parallel to each other.
  • the heat dissipation diaphragm 60 and the chip are misplaced, so that the heat dissipation diaphragm 60 is set away from the chip. , to facilitate the installation of the following heat conducting sheet 70.
  • the casing 10 can be made of heat-conducting material, and a heat-conducting sheet 70 is provided between the heat source 40 and the casing 10 , and both sides of the heat-conducting sheet 70 are in contact with the heat source 40 and the casing 10 respectively.
  • the housing 10 can be made of die-casting aluminum material with better thermal conductivity in the prior art, and the heat-conducting sheet 70 can be a heat-conducting silica gel sheet in the prior art.
  • the housing 10 can be made of the first housing 13 and the second Two housings 14 are assembled, wherein, the first housing 13 forms a rear chamber 11 with the loudspeaker unit, and the support plate 30 is installed on the first housing 13.
  • the first housing 13 can be It is made of die-casting aluminum, while the second housing 14 can be made of plastic.
  • the heat conduction sheet 70 By setting the heat conduction sheet 70, and the upper side of the heat conduction sheet 70 is in contact with the chip, and the lower side of the heat conduction sheet 70 is in contact with the upper shell wall of the casing 10 (first casing 13), so that the heat generated by the chip can be passed through heat conduction.
  • the sheet 70 conducts to the housing 10, and then dissipates heat through the housing 10, and then uses the dual heat dissipation effect of the heat dissipation diaphragm 60 and the heat conduction sheet 70 to greatly speed up the heat dissipation of the chip and greatly improve the heat dissipation efficiency.
  • the heat dissipation diaphragm 60 includes a mounting ring 61 and a vibrating diaphragm 62, the vibrating diaphragm 62 covers the heat dissipation window 12, and the outer edge of the vibrating diaphragm 62 is mounted on the mounting ring 61,
  • the mounting ring 61 surrounds the heat dissipation window 12 and is installed on the outer periphery of the heat dissipation window 12 .
  • the shape of the vibrating diaphragm 62 basically matches the shape of the heat dissipation window 12.
  • the vibrating diaphragm 62 covers the heat dissipation window 12.
  • the vibrating diaphragm 62 covering the heat dissipation window 12 is impacted by the airflow in the rear cavity 11. Vibrates, thereby generating an oscillating airflow in the heat dissipation channel 50 .
  • the cooling diaphragm 60 includes a mounting ring 61, the mounting ring 61 is arranged along the outer edge of the vibrating diaphragm 62, the outer edge of the vibrating diaphragm 62 is mounted on the mounting ring 61, and the mounting ring 61 surrounds the heat dissipation window 12 and is fixed on the outer periphery of the heat dissipation window 12 by bonding or screwing, so as to achieve a stable assembly of the heat dissipation diaphragm 60 and the housing 10 .
  • the heat dissipating diaphragm 60 also includes a counterweight 63, and the counterweight 63 is arranged on the vibrating diaphragm. 62 , and the counterweight 63 is set up against the heat dissipation window 12 .
  • the counterweight 63 can be made of metal material in the prior art, and the counterweight 63 is arranged on the vibrating diaphragm 62, which can make the vibrating diaphragm 62 vibrate effectively and stably, and improve the sound quality of the sound box.
  • the counterweight 63 can be arranged on the upper surface of the vibrating membrane 62, or on the lower surface of the vibrating membrane 62, or embedded in the vibrating membrane 62, which is convenient and flexible to assemble.
  • the vibrating diaphragm 62 is made of elastic soft material.
  • the vibrating membrane 62 can be made of elastic soft material such as silica gel or rubber in the prior art, so that the vibrating membrane 62 has elasticity and is conducive to vibration.
  • the support plate 30 can be made of a heat-conducting material.
  • the support plate 30 can be made of a metal material with better thermal conductivity in the prior art, and the heat generated by the chip can also be conducted to the support plate 30. To dissipate heat through the support plate 30 .
  • the support plate 30 is detachably connected to the housing 10 . It should be noted that the support plate 30 can also be made of low-cost plastic material or FR-4 plate, which is convenient for installing chips.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un appareil électronique, comprenant un boîtier et un dispositif de production de sons logé dans le boîtier, dans lequel une cavité sonore avant est formée entre le boîtier et le dispositif de production de sons, et le boîtier est pourvu d'un trou de sortie de sons en communication avec la cavité sonore avant ; le dispositif de production de sons comprend un boîtier, une unité de production de sons logée dans le boîtier, et une plaque de support prévue à l'extérieur du boîtier ; une cavité arrière est formée entre l'unité de production de sons et la coque, et un canal de dissipation de chaleur est formé entre la plaque de support et la coque ; le côté de la plaque de support qui fait face à la coque est pourvu d'une source de chaleur, et la source de chaleur est située dans le canal de dissipation de chaleur ; la coque est pourvue d'une fenêtre de dissipation de chaleur en communication avec la cavité arrière et le canal de dissipation de chaleur ; et une membrane de dissipation de chaleur couvre la fenêtre de dissipation de chaleur. Dans un procédé d'utilisation de l'appareil électronique, l'unité de production de sons vibre pour faire osciller un flux d'air dans la cavité arrière, de sorte que le diaphragme de dissipation de chaleur recouvrant la fenêtre de dissipation de chaleur est soumis à l'impact du flux d'air provenant de la cavité arrière pour générer une vibration, et ensuite la vibration du diaphragme de dissipation de chaleur génère un flux d'air oscillant dans le canal de dissipation de chaleur, générant ainsi une convection forcée autour de la source de chaleur, ainsi la chaleur de la source de chaleur est rapidement dissipée, et l'efficacité de dissipation de chaleur et les performances de dissipation de chaleur sont améliorées.
PCT/CN2022/094308 2021-05-31 2022-05-23 Appareil électronique WO2022253013A1 (fr)

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Application Number Priority Date Filing Date Title
CN202121202830.4U CN214675560U (zh) 2021-05-31 2021-05-31 电子装置
CN202121202830.4 2021-05-31

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WO2022253013A1 true WO2022253013A1 (fr) 2022-12-08

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113395617B (zh) * 2021-05-31 2022-10-18 歌尔股份有限公司 发声器件及电子装置
CN214675560U (zh) * 2021-05-31 2021-11-09 歌尔股份有限公司 电子装置

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CN101154124A (zh) * 2006-09-28 2008-04-02 广达电脑股份有限公司 散热装置
JP2010219557A (ja) * 2010-06-21 2010-09-30 Sony Corp 気体噴出装置及び電子機器
US20100289998A1 (en) * 2009-05-14 2010-11-18 Hannstar Display Corp. Electronic Equipment Having Heat-Dissipating Device and Method
CN103686483A (zh) * 2012-09-20 2014-03-26 深圳市得辉达科技有限公司 对流式倒相式音箱
CN103857257A (zh) * 2012-11-28 2014-06-11 联想(北京)有限公司 一种电子设备及电子设备散热方法
CN105430124A (zh) * 2015-10-28 2016-03-23 努比亚技术有限公司 一种终端及散热方法
CN205793275U (zh) * 2016-04-18 2016-12-07 乐视控股（北京）有限公司 扬声器以及电子设备
CN214675560U (zh) * 2021-05-31 2021-11-09 歌尔股份有限公司 电子装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101154124A (zh) * 2006-09-28 2008-04-02 广达电脑股份有限公司 散热装置
US20100289998A1 (en) * 2009-05-14 2010-11-18 Hannstar Display Corp. Electronic Equipment Having Heat-Dissipating Device and Method
JP2010219557A (ja) * 2010-06-21 2010-09-30 Sony Corp 気体噴出装置及び電子機器
CN103686483A (zh) * 2012-09-20 2014-03-26 深圳市得辉达科技有限公司 对流式倒相式音箱
CN103857257A (zh) * 2012-11-28 2014-06-11 联想(北京)有限公司 一种电子设备及电子设备散热方法
CN105430124A (zh) * 2015-10-28 2016-03-23 努比亚技术有限公司 一种终端及散热方法
CN205793275U (zh) * 2016-04-18 2016-12-07 乐视控股（北京）有限公司 扬声器以及电子设备
CN214675560U (zh) * 2021-05-31 2021-11-09 歌尔股份有限公司 电子装置

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