WO2021120950A1 - Module de haut-parleur et dispositif électronique - Google Patents

Module de haut-parleur et dispositif électronique Download PDF

Info

Publication number
WO2021120950A1
WO2021120950A1 PCT/CN2020/129220 CN2020129220W WO2021120950A1 WO 2021120950 A1 WO2021120950 A1 WO 2021120950A1 CN 2020129220 W CN2020129220 W CN 2020129220W WO 2021120950 A1 WO2021120950 A1 WO 2021120950A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation plate
cavity
opening
housing
Prior art date
Application number
PCT/CN2020/129220
Other languages
English (en)
Chinese (zh)
Inventor
唐兰欣
刘磊
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021120950A1 publication Critical patent/WO2021120950A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil

Definitions

  • the present invention relates to the technical field of sound energy conversion, in particular to a speaker module and electronic equipment.
  • the speaker module is an important acoustic component of portable electronic equipment. It is used to complete the conversion between electrical and acoustic signals. In order to achieve better sound reproduction in a small cavity space, SmartPA ( Smart power amplifier) and tuning algorithm, but in the process of Smart PA application, the speaker module will work for a long time under high power conditions, which will increase the heat generated by the speaker module.
  • the current speaker module mainly passes through the housing The sound hole on the upper side is used for heat dissipation, and the heat dissipation effect is poor. The high temperature in the speaker module cannot be effectively conducted and emitted, and the risk of the voice coil of the speaker module is relatively high.
  • the main purpose of the present invention is to provide a loudspeaker module, which aims to improve the heat dissipation capacity of the loudspeaker module.
  • the speaker module provided by the present invention includes:
  • the speaker unit is arranged in the receiving cavity, and the receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity, the rear acoustic cavity is provided with a flexible deformable part, the speaker module further includes an electronic device housing, the A closed cavity is formed between the housing of the electronic device and the module housing, and the housing of the electronic device isolates the sound generated by the flexible deformable portion from the sound transmitted by the speaker unit through the front acoustic cavity; the front The acoustic cavity or the rear acoustic cavity is provided with a first opening, the rear acoustic cavity is also provided with a second opening, the flexible deformable portion covers the second opening, and the first opening and the second opening are located in the mold The same side of the group shell;
  • a first heat dissipation plate arranged to cover the first opening
  • a second heat dissipation plate is located on the side of the flexible deformable portion facing the sealed cavity, is provided to cover the second opening and has a plurality of ventilation holes, and the second heat dissipation plate is connected to the first heat dissipation plate As one.
  • the first heat dissipation plate and the second heat dissipation plate are integrally formed.
  • first heat dissipation plate and the second heat dissipation plate are welded into one body.
  • both the first heat dissipation plate and the second heat dissipation plate are integrally molded with the module housing; or, the first heat dissipation plate and the second heat dissipation plate are adhered to the module shell.
  • connection hole is provided at the connection of the first heat dissipation plate and the second heat dissipation plate, and the module housing has a connection portion, and the connection portion extends into the connection hole.
  • the first opening is provided in the front acoustic cavity
  • the speaker unit includes a unit housing, and a vibration system and a magnetic circuit system connected to the unit housing, and the vibration system is connected to the front sound cavity.
  • the acoustic cavity is connected
  • the module housing is further provided with a third opening, and the magnetic circuit system is exposed from the third opening.
  • the outer surface of the second heat dissipation plate is arranged lower than the outer surface of the module housing.
  • the module housing includes a bottom wall and a side wall connected to the bottom wall, the side wall is further provided with an air hole, and the air hole is located in the second heat dissipation plate and the flexible deforming part between.
  • the material of the first heat dissipation plate and the second heat dissipation plate is any one of stainless steel, copper, copper alloy, and aluminum alloy.
  • the present invention also provides an electronic device including a speaker module.
  • the speaker module includes a module housing, a speaker unit, a first heat dissipation plate, and a second heat dissipation plate.
  • the module housing has a receiving cavity; The receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity, the rear acoustic cavity is provided with a flexible deformable part, the speaker module further includes an electronic device housing, the electronic device housing and the A closed cavity is formed between the module housings, and the electronic device housing isolates the sound generated by the flexible deformable portion from the sound emitted by the speaker unit through the front sound cavity; the front sound cavity or the rear sound cavity is provided There is a first opening, the rear acoustic cavity is further provided with a second opening, the flexible deformable portion covers the second opening, and the first opening and the second opening are located on the same side of the module housing; A heat dissipation plate is arranged to cover the first opening; a second
  • the technical solution of the present invention covers the first opening with the first heat dissipation plate, which is equivalent to that the first heat dissipation plate can directly contact the heat in the front acoustic cavity, and the heat in the front acoustic cavity can be conducted and radiated through the heat dissipation plate.
  • the heat between the second heat dissipation plate and the flexible deformable portion can also be transmitted and radiated through the second heat dissipation plate.
  • a plurality of ventilation holes are provided on the second heat dissipation plate, the heat dissipation area of the second heat dissipation plate is increased.
  • the heat dissipation capacity of the speaker module can be effectively improved, and the temperature in the speaker unit can be effectively reduced, which causes the Smart PA (smart power amplifier) temperature protection mechanism to be triggered to reduce the input voltage, thereby causing playback Poor sound quality can also reduce the risk of voice coil burning of the speaker unit.
  • Fig. 1 is a schematic structural diagram of an embodiment of a speaker module of the present invention
  • Figure 2 is an enlarged view of A in Figure 1;
  • FIG. 3 is a schematic diagram of the structure of the speaker module and the housing of the electronic device in FIG. 1;
  • Fig. 4 is an enlarged view of B in Fig. 3.
  • the directional indication is only used to explain that it is in a specific posture (as shown in the drawings). If the specific posture changes, the relative positional relationship, movement, etc. of the components below will also change the directional indication accordingly.
  • the present invention provides a speaker module, which can be used in electronic devices capable of producing sound such as earphones and mobile phones.
  • the speaker module includes a module housing 10, a speaker unit 20, a first heat dissipation plate 30, and a second heat dissipation plate 40.
  • the module housing 10 has a receiving cavity 13.
  • the speaker unit 20 is arranged in the receiving cavity 13, and the receiving cavity 13 is divided into a front acoustic cavity 131 and a rear acoustic cavity 132.
  • the rear acoustic cavity 132 is provided with a flexible deformable portion 60.
  • the speaker module also includes an electronic device housing 80.
  • a closed cavity 70 is formed between the electronic device housing 80 and the module housing.
  • the electronic device housing 80 removes the sound generated by the flexible deformable portion 60.
  • the front acoustic cavity 131 or the rear acoustic cavity 132 is provided with a first opening 1311, the rear acoustic cavity 132 has a second opening 1321, the flexible deformable portion 60 covers the second opening 1321, and the first opening 1311 and the second opening 1321 are located on the same side of the module housing 10 .
  • the first heat dissipation plate 30 is arranged to cover the first opening 1311, and the second heat dissipation plate 40 is located on the side of the flexible deformable part 60 facing the sealed cavity 70, and is arranged to cover the second opening 1321, and has a plurality of vents 41.
  • the second heat dissipation plate 40 The plate 40 and the first heat dissipation plate 30 are connected as a whole.
  • the electronic device housing 80 in this embodiment may be a housing structure integrally formed with the module housing 10, that is, the electronic device housing 80 is a part of the speaker module, and the speaker module is installed in, for example, a mobile phone.
  • the module housing 10 and the electronic device housing 80 are equivalent to installing the module housing 10 and the electronic device housing 80 in an electronic device such as a mobile phone.
  • the electronic device housing 80 can also be used as a housing for electronic devices such as mobile phones.
  • the rear acoustic cavity 132 can be separated from the sealed cavity 70, so that the rear acoustic cavity 132 and the sealed cavity 70 are closed to each other, and the second heat dissipation plate 40 is located on the flexible deformed portion 60 facing the sealed cavity
  • a first cavity 71 is formed between the second heat dissipation plate 40 and the flexible deformable portion 60.
  • the first cavity 71 is used to increase sufficient space for the deformation of the flexible deformable portion 60.
  • the second heat dissipation plate 40 and the electronic A second cavity 72 is formed between the equipment housing 80, and the first cavity 71 and the second cavity 72 are communicated with each other through the vent 41.
  • the rear acoustic cavity 132 is a closed cavity
  • the flexible deformable part 60 includes a central part and a convex suspension part located outside the central part, and the suspension part is fixedly connected to the module housing 10.
  • the flexible deformable portion 60 may be a single-layer structure, which is made of one of polymer plastics, thermoplastic elastomers, and silicone rubber, or may be a multilayer structure, and at least one layer of the multilayer structure is It is made of one of high molecular plastic, thermoplastic elastomer and silicone rubber.
  • the flexible deforming part 60 deforms with the sound pressure, so that the volume of the rear acoustic cavity 132 can be adjusted, thereby increasing the equivalent acoustic compliance of the rear acoustic cavity 132, effectively reducing the resonance frequency of the speaker module, and improving low-frequency sensitivity ;
  • the radiated sound waves of the flexible deformation portion 60 are enclosed inside the electronic device housing 80 to avoid the reverse phase of the flexible deformation portion 60
  • the radiated sound waves have a canceling effect on the forward radiated sound waves of the speaker unit 20, thereby greatly improving the low-frequency sensitivity of the product as a whole.
  • the module housing 10 includes a first housing 11 and a second housing 12.
  • a receiving cavity 13 is formed between the first housing 11 and the second housing 12, and the first housing 11 has a distance away from the second housing.
  • the first surface 1111 of the body 12 and the second housing 12 have a second surface 121 facing away from the first housing 11.
  • the speaker unit 20 has multiple installation positions in the accommodating cavity 13.
  • the diaphragm of the speaker unit 20 faces the first housing 11, and the speaker unit 20 and the first housing 11 together form the front acoustic cavity 131, the first housing 11, the second housing 12 and the speaker unit 20 together form the rear acoustic cavity 132, the second opening 1321 is provided in the first housing 11 and penetrates the first surface 1111, and is flexibly deformed
  • the portion 60 is disposed in the second opening 1321 and covers the second opening 1321 so that the rear acoustic cavity 132 is separated from the airtight cavity 70, and the airtight cavity 70 and the front acoustic cavity 131 are not connected to each other.
  • the front acoustic cavity 131 is provided with a first opening 1311, the first opening 1311 penetrates the first surface 1111, and the first opening 1311 and the second opening 1321 are spaced apart.
  • the diaphragm of the speaker unit 20 faces the second housing 12, and the speaker unit 20 and the first housing 11 together form a front sound cavity 131, the first housing 11, the second housing 12 and the speaker
  • the monomers 20 together form the rear acoustic cavity 132.
  • the second opening 1321 is provided in the first housing 11 and penetrates the first surface 1111.
  • the flexible deformable portion 60 is provided in the second opening 1321 and covers the second opening 1321, so that the rear acoustic cavity 132 is separated from the airtight cavity 70, and the airtight cavity 70 and the front acoustic cavity 131 are not connected to each other.
  • the rear acoustic cavity 132 is provided with a first opening 1311, the first opening 1311 penetrates the first surface 1111, and the first opening 1311 and the second opening 1321 are spaced apart.
  • the vent 41 communicates with the first cavity 71 and the second cavity 72 so that when the flexible deformable part 60 vibrates, the vent 41 can achieve pressure balance during the vibration of the flexible deformable part 60.
  • the plurality of ventilation holes 41 may be arranged regularly, for example, the plurality of ventilation holes 41 may be arranged in a matrix, or arranged in a multi-layer ring shape, or arranged in a divergent shape.
  • the material of the first heat dissipation plate 30 and the second heat dissipation plate 40 is any one of stainless steel, copper, copper alloy, and aluminum alloy.
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 may be made of metal materials such as stainless steel, copper, copper alloy, and aluminum alloy. Of course, in other embodiments, it can also be made of non-metallic materials such as silicon, graphite, or thermally conductive plastic.
  • the sound holes can also be arranged on the first heat dissipation plate 30, which can increase the surface area of the first heat dissipation plate 30, that is, increase the heat dissipation area.
  • the technical solution of the present invention covers the first opening 1311 with the first heat dissipation plate 30, which is equivalent to that the first heat dissipation plate 30 can directly contact the heat in the front acoustic cavity 131, so that the heat in the front acoustic cavity 131 can be conducted and radiated through the heat dissipation plate. .
  • the heat between the second heat dissipation plate 40 and the flexible deformable portion 60 can also be conducted and radiated through the second heat dissipation plate 40.
  • a plurality of ventilation holes 41 are provided on the second heat dissipation plate 40, it is equivalent to increasing the heat dissipation area of the second heat dissipation plate 40. As shown in FIG.
  • the vent 41 can achieve pressure balance during the vibration of the flexible deformed part 60, and the air flow between the second heat dissipation plate 40 and the flexible deformed part 60 can flow out and inflow from the vent 41, and then The heat between the second heat dissipation plate 40 and the flexible deformable portion 60 is driven to radiate from the vent 41 to achieve a better heat dissipation effect.
  • the front acoustic cavity 131 is connected to the speaker unit 20, the heat in the front acoustic cavity 131 is relatively large, and the heat between the second heat dissipation plate 40 and the flexible deformable portion 60 is relatively small, and the second heat dissipation plate 40 is provided with a breathable Hole 41 has stronger heat dissipation capacity.
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 can transmit heat to the second heat dissipation plate 40 for heat dissipation while dissipating heat by itself. , The heat dissipation effect of the front acoustic cavity 131 can be improved.
  • the heat dissipation capacity of the speaker module can be effectively improved, and the temperature in the speaker unit 20 can be effectively reduced, which causes the Smart PA (smart power amplifier) temperature protection mechanism to be triggered to reduce the input voltage, thereby reducing the input voltage.
  • the Smart PA smart power amplifier
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 are integrally formed. That is, the first heat dissipation plate 30 and the second heat dissipation plate 40 have an integral plate-like structure, so that the connection between the first heat dissipation plate 30 and the second heat dissipation plate 40 is closer, avoiding the first heat dissipation plate 30 and the second heat dissipation plate 40 There is a gap between them, resulting in poor thermal conductivity.
  • the thermal conductivity between the first heat dissipation plate 30 and the second heat dissipation plate 40 is better, and the subsequent assembly process of the first heat dissipation plate 30 and the second heat dissipation plate 40 can also be eliminated. , The installation process of the speaker module is simplified, which is beneficial to improve the production efficiency.
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 are welded into one body. In this way, the connection stability and heat conduction effect between the two can be better guaranteed.
  • first heat dissipation plate 30 and the second heat dissipation plate 40 can be mounted on the module housing 10 in many ways.
  • first heat dissipation plate 30 and the second heat dissipation plate 40 are both the same as the module housing. 10 injection molding as a whole.
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 are used as inserts to be integrated with the module housing 10 by injection molding, so that the first heat dissipation plate 30 and the second heat dissipation plate 40 can be firmly installed on the module housing 10, and the speaker mold
  • the overall stability of the group is high, the structural strength of the module housing 10 can also be improved, and the subsequent assembly process of the first heat dissipation plate 30, the second heat dissipation plate 40 and the module housing 10 is eliminated, which simplifies the speaker module
  • the installation process is conducive to improving production efficiency.
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 are bonded to the module housing 10.
  • the first surface 1111 is provided with a mounting groove (not shown in the figure), the first opening 1311 and the second opening 1321 of the mounting groove are arranged through the bottom of the mounting groove, and the groove depth of the mounting groove is greater than or equal to the thickness of the first heat dissipation plate 30, Also greater than or equal to the thickness of the second heat dissipation plate 40, the first heat dissipation plate 30 and the second heat dissipation plate 40 are installed in the mounting groove, which can increase the thickness of the first heat dissipation plate 30, the second heat dissipation plate 40 and the module housing 10
  • the contact area can improve the connection stability of the first heat dissipation plate 30 and the second heat dissipation plate 40.
  • the first heat dissipation plate 30 and the second heat dissipation plate 40 can also be directly adhered to the first surface 1111.
  • a connecting hole 50 is provided at the connection of the first heat dissipation plate 30 and the second heat dissipation plate 40, and the module housing 10 has a connecting portion 113, and the connecting portion 113 extends into the connecting hole 50.
  • the connecting hole 50 is provided as a through hole, the connecting portion 113 and the module housing 10 are integrally arranged, and the first heat dissipation plate 30 and the second heat dissipation plate 40 are respectively covered with the first opening 1311 and the second opening 1321,
  • the connecting portion 113 can be plug-fitted with the connecting hole 50.
  • connection hole 50 and the connection portion 113 By providing the connection hole 50 and the connection portion 113, the contact area between the first heat dissipation plate 30, the second heat dissipation plate 40 and the module housing 10 can be increased, and the connection stability of the first heat dissipation plate 30 and the second heat dissipation plate 40 can be improved .
  • the number of the connecting holes 50 may be one or more, for example, the number of the connecting holes 50 is two, three or four, and so on.
  • both the first heat dissipation plate 30 and the second heat dissipation plate 40 are integrally molded with the module housing 10
  • the plastic of the molded module housing 10 is filled in the connection hole 50 to form the connection portion 113, which can improve the first Both the heat dissipation plate 30 and the second heat dissipation plate 40 are combined with the injection molding of the module housing 10.
  • the connecting portion 113 can also be used for positioning the first heat dissipation plate 30 and the second heat dissipation plate 40 to facilitate the first heat dissipation plate 30 and the installation of the second heat dissipation plate 40.
  • the first opening 1311 is provided in the front acoustic cavity 131
  • the speaker unit 20 includes a single housing (not shown), and a vibration system (not shown) and a magnetic circuit system (not shown) connected to the single housing.
  • the vibration system is in communication with the front acoustic cavity 131
  • the module housing 10 is further provided with a third opening (not shown in the figure), and the magnetic circuit system is exposed from the third opening.
  • the third opening is provided in the second housing 12 and penetrates the second surface 121.
  • the magnetic circuit system includes a magnetic yoke, a side magnet arranged on the magnetic yoke, and a side magnetic plate arranged on the upper end of the side magnet.
  • the surface of the magnetic yoke away from the side magnet is exposed from the third opening, so that the magnetic circuit system
  • the heat can be directly radiated from the surface of the magnetic yoke facing away from the side magnets, which can improve the heat dissipation effect of the speaker module, and can also reduce the heat accumulation in the rear acoustic cavity 132.
  • a fourth opening may be provided in the front acoustic cavity 131, and a third heat dissipation plate (not shown in the figure) is also provided on the module housing 10 (Shown), the third heat dissipation plate covers the fourth opening, so that the heat in the front acoustic cavity 131 can be directly radiated from the third heat dissipation plate to the outside of the speaker module.
  • the structure and installation method of the third heat dissipation plate can refer to the first heat dissipation plate 30 and the second heat dissipation plate 40, which will not be repeated here.
  • the upper surface of the second heat dissipation plate 40 is disposed lower than the outer surface of the module housing 10. That is, the surface of the second heat dissipation plate 40 facing away from the first cavity 71 is set lower than the first surface 1111, so that when the speaker module is installed in the mounting cavity of the electronic device, even if the first surface 1111 and the cavity wall of the mounting cavity The abutment also ensures that the second heat dissipation plate 40 is spaced from the cavity wall of the installation cavity, avoids the cavity wall of the installation cavity from blocking the vent 41, and ensures that the vent 41 can be well ventilated.
  • the module housing 10 includes a bottom wall 111 and a side wall 112 connected to the bottom wall 111, and an air hole 1121 is also provided on the side wall 112.
  • the air outlet 1121 is located between the second heat dissipation plate 40 and the flexible deforming part 60.
  • the bottom wall 111 is disposed opposite to the flexible deformable portion 60, the outer surface of the bottom wall 111 facing away from the first cavity 71 is the first surface 1111, the second opening 1321 penetrates the bottom wall 111, and the air outlet 1121 penetrates the side wall
  • the inner wall surface of 112 communicates with the cavity between the second heat dissipation plate 40 and the flexible deformable portion 60, that is, the air outlet 1121 communicates with the first cavity 71 and penetrates the outer wall surface of the side wall 112 to enlarge the first cavity 71
  • the air permeability can improve the heat exchange ability of the first cavity 71 with the outside through the flow of airflow, thereby improving the heat dissipation effect of the first cavity 71, and can also reduce the conduction of the first cavity 71 to the second heat dissipation plate 40
  • the heat enables the second heat dissipation plate 40 to receive more heat conducted by the first heat dissipation plate 30, which can increase the heat dissipation speed of the
  • the vent hole 1121 may be a round hole or a square hole.
  • the vent hole 1121 is a square hole, and the vent hole 1121 is also formed through the first surface 1111, so that the position of the vent hole 1121 on the side wall 112 is It is provided in a notch shape.
  • the second heat dissipation plate 40 can cover the gap of the air outlet 1121 that penetrates the first surface 1111, and the part corresponding to the second heat dissipation plate 40 can also be used as one of the air outlet 1121 The side wall 112.
  • the heat carried by the gas flowing out of the air outlet 1121 can also be discharged from the upper end of the second heat dissipation plate 40 that covers the air outlet 1121.
  • the vent hole 1121 may not be formed by an additional side core pulling mechanism, which can simplify the mold structure and reduce the production cost.
  • the single housing includes a heat conduction part (not shown in the figure), the heat conduction part is connected to the magnetic circuit system, and the speaker module further includes a heat conduction plate (not shown in the figure) connected to the first heat dissipation plate 30, and the heat conduction plate passes through Into the module housing 10 and thermally conductively connected with the heat conducting part. Specifically, when the heat in the accommodating cavity 13 is conducted to the first heat dissipation plate 30 via the heat conducting plate, the heat can be radiated from the exposed surface of the first heat dissipation plate 30, thereby achieving a heat dissipation effect.
  • the heat in the magnetic circuit system can be conducted to the heat conduction part, and then a heat conduction plate is arranged on the module housing 10, One end of the heat conducting plate is connected to the first heat dissipation plate 30, and the other end is penetrated into the module housing 10 and is thermally connected to the heat conducting part.
  • the heat in the magnetic circuit system can be sequentially conducted from the heat conducting portion and the heat conducting plate to the first heat dissipation plate 30, and then radiated from the exposed surface of the first heat dissipation plate 30.
  • the heat of the magnetic circuit system can be effectively conducted to the first heat dissipation plate 30 for heat dissipation, which further improves the heat dissipation capability of the speaker module.
  • the heat-conducting part may be metal, heat-conducting plastic or composite heat-conducting material.
  • the material of the heat-conducting part may be stainless steel or copper sheet.
  • the heat conduction plate and the heat conduction part are thermally connected, and the heat of the heat conduction part can be conducted to the heat conduction plate.
  • the specific methods include but are not limited to directly contacting the heat conduction plate and the heat conduction part, or a heat conduction medium is provided between the heat conduction plate and the heat conduction part, etc .
  • the number of the first heat dissipation plate 30 may be one or more.
  • the number of the first heat dissipation plate 30 may be two, and the two first heat dissipation plates 30 respectively correspond to the positions of the front acoustic cavity 131 and the rear acoustic cavity 132 Settings etc.
  • the single housing further includes a mounting part (not shown in the figure), the mounting part is a plastic part, the mounting part and the heat conducting part are integrally injection molded, and the mounting part can be used to mount the pad and the magnetic circuit system.
  • the whole single housing can also be made of metal, that is, the single housing only includes the heat-conducting part.
  • the heat-conducting plate can also be extended in the direction of the magnetic yoke, and the heat-conducting plate is also thermally connected to the outer circumferential surface of at least one of the magnetic yoke, the side magnet and the side magnetic guide. This is equivalent to increasing the contact area between the heat conducting plate and the magnetic circuit system, which can further improve the heat conduction effect of the magnetic circuit system, and further improve the heat dissipation capacity of the speaker module.
  • the present invention also provides an electronic device (not shown in the figure).
  • the electronic device includes a device housing, a host, and a speaker module.
  • a device housing for the specific structure of the speaker module, refer to the above-mentioned embodiment. Because the electronic device adopts all the above-mentioned implementations All the technical solutions in this example have at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
  • the host and the speaker module are both arranged in the housing.
  • At least a part of the device casing and the sealed cavity 70 of the speaker module form a sealed cavity, and the sealed cavity is arranged between the sealed cavity and the sound hole to prevent the flexible deformable part 60 from radiating sound waves in the opposite phase and radiating sound waves in the forward direction to the speaker module. Resulting in the cancellation effect, and thus the overall low-frequency sensitivity of the product is greatly improved.
  • the device housing doubles as the cavity wall of the sealed cavity 70, which can make full use of the space inside the electronic device, while saving a part of the space occupied by the cavity wall, which is more conducive to the thin design of the electronic device.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un module de haut-parleur et un dispositif électronique sont divulgués dans la présente invention. Le module de haut-parleur comprend un boîtier de module, une unité de haut-parleur, une première plaque de dissipation de chaleur et une seconde plaque de dissipation de chaleur. Le boîtier du module dispose d'une cavité de logement. L'unité de haut-parleur est disposée dans la cavité de logement et divise la cavité de logement en une cavité acoustique avant et une cavité acoustique arrière. La cavité acoustique arrière est pourvue d'une partie de déformation flexible. Le module de haut-parleur comprend en outre un boîtier de dispositif électronique. Une cavité fermée est formée entre le boîtier de dispositif électronique et le boîtier de module. La cavité acoustique avant ou la cavité acoustique arrière est pourvue d'une première ouverture, la cavité acoustique arrière est en outre pourvue d'une seconde ouverture, la partie de déformation flexible recouvre la seconde ouverture, et la première ouverture et la seconde ouverture sont situées sur le même côté du boîtier de module. La première plaque de dissipation de chaleur recouvre la première ouverture. La seconde plaque de dissipation de chaleur est située sur le côté de la partie de déformation flexible faisant face à la cavité fermée, recouvre la seconde ouverture, et est pourvue d'une pluralité de trous d'air. La seconde plaque de dissipation de chaleur et la première plaque de dissipation de chaleur sont reliées dans un ensemble intégral. La solution technique de la présente invention peut améliorer la propriété d'étanchéité du module de haut-parleur.
PCT/CN2020/129220 2019-12-20 2020-11-17 Module de haut-parleur et dispositif électronique WO2021120950A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911343383.1 2019-12-20
CN201911343383.1A CN111010634B (zh) 2019-12-20 2019-12-20 扬声器模组和电子设备

Publications (1)

Publication Number Publication Date
WO2021120950A1 true WO2021120950A1 (fr) 2021-06-24

Family

ID=70117742

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/129220 WO2021120950A1 (fr) 2019-12-20 2020-11-17 Module de haut-parleur et dispositif électronique

Country Status (2)

Country Link
CN (1) CN111010634B (fr)
WO (1) WO2021120950A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010634B (zh) * 2019-12-20 2021-10-08 歌尔股份有限公司 扬声器模组和电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027573A1 (fr) * 2003-07-14 2005-03-24 Andrei Ilies Haut-parleur et microphone bases sur le principe du centre de percussion
CN205847576U (zh) * 2016-07-20 2016-12-28 瑞声科技(新加坡)有限公司 扬声器模组
CN205847582U (zh) * 2016-07-20 2016-12-28 瑞声科技(新加坡)有限公司 扬声器模组
CN206341416U (zh) * 2016-12-28 2017-07-18 歌尔科技有限公司 扬声器模组
CN109803215A (zh) * 2018-12-18 2019-05-24 歌尔股份有限公司 声学装置及电子设备
CN111010634A (zh) * 2019-12-20 2020-04-14 歌尔股份有限公司 扬声器模组和电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204681570U (zh) * 2015-06-10 2015-09-30 歌尔声学股份有限公司 扬声器模组
CN204836566U (zh) * 2015-07-20 2015-12-02 歌尔声学股份有限公司 多功能扬声器模组及应用其的电子终端设备
CN206674192U (zh) * 2017-04-13 2017-11-24 瑞声科技(新加坡)有限公司 微型扬声器
CN207200967U (zh) * 2017-07-19 2018-04-06 歌尔科技有限公司 扬声器模组
CN209184736U (zh) * 2019-02-12 2019-07-30 浙江盛元信息科技有限公司 音箱系统的功放机机箱

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027573A1 (fr) * 2003-07-14 2005-03-24 Andrei Ilies Haut-parleur et microphone bases sur le principe du centre de percussion
CN205847576U (zh) * 2016-07-20 2016-12-28 瑞声科技(新加坡)有限公司 扬声器模组
CN205847582U (zh) * 2016-07-20 2016-12-28 瑞声科技(新加坡)有限公司 扬声器模组
CN206341416U (zh) * 2016-12-28 2017-07-18 歌尔科技有限公司 扬声器模组
CN109803215A (zh) * 2018-12-18 2019-05-24 歌尔股份有限公司 声学装置及电子设备
CN111010634A (zh) * 2019-12-20 2020-04-14 歌尔股份有限公司 扬声器模组和电子设备

Also Published As

Publication number Publication date
CN111010634A (zh) 2020-04-14
CN111010634B (zh) 2021-10-08

Similar Documents

Publication Publication Date Title
WO2021120949A1 (fr) Module de haut-parleur et dispositif électronique
WO2021120948A1 (fr) Module de haut-parleur et dispositif électronique
US10178481B2 (en) Sound producing device
WO2021135690A1 (fr) Module de haut-parleur et dispositif électronique
CN206341416U (zh) 扬声器模组
US20170134848A1 (en) Speaker module
CN109246553B (zh) 一种应用于扬声器振膜的补强部及振膜
CN210431861U (zh) 电子设备
CN210093444U (zh) 扬声器装置及具有该扬声器装置的移动终端
WO2021103070A1 (fr) Haut-parleur et dispositif audio
CN114630249B (zh) 发声模组和电子设备
WO2021120950A1 (fr) Module de haut-parleur et dispositif électronique
WO2022067901A1 (fr) Boîtier de haut-parleur et dispositif terminal
CN109151687B (zh) 一种应用于扬声器振膜的补强部、振膜及扬声器
CN212086479U (zh) 扬声器
CN113596637A (zh) 发声装置
CN105992107B (zh) 用于电子设备中的部件的一体式框架以及电子设备
WO2023030127A1 (fr) Noyau interne de module de haut-parleur, module de haut-parleur et écouteur
WO2022227586A1 (fr) Dispositif de production de sons et appareil électronique
CN113993043B (zh) 发声装置和电子设备
WO2021120286A1 (fr) Dispositif de sondage et terminal électronique
CN211557474U (zh) 一种发声装置以及电子设备
WO2022067908A1 (fr) Caisson de haut-parleur
CN111294713A (zh) 一种发声装置以及电子设备
WO2021012276A1 (fr) Appareil électronique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20901442

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20901442

Country of ref document: EP

Kind code of ref document: A1