WO2022253013A1

WO2022253013A1 - Electronic apparatus

Info

Publication number: WO2022253013A1
Application number: PCT/CN2022/094308
Authority: WO
Inventors: 王宇; 张志峰
Original assignee: 歌尔股份有限公司
Priority date: 2021-05-31
Filing date: 2022-05-23
Publication date: 2022-12-08
Also published as: CN214675560U

Abstract

Disclosed in the present invention is an electronic apparatus, comprising a housing and a sound production device accommodated in the housing, wherein a front sound cavity is formed between the housing and the sound production device, and the housing is provided with a sound output hole in communication with the front sound cavity; the sound production device comprises a shell, a sound production unit accommodated in the shell, and a support plate provided outside the shell; a rear cavity is formed between the sound production unit and the shell, and a heat dissipation channel is formed between the support plate and the shell; the side of the support plate that faces the shell is provided with a heat source, and the heat source is located in the heat dissipation channel; the shell is provided with a heat dissipation window in communication with the rear cavity and the heat dissipation channel; and a heat dissipation diaphragm covers the heat dissipation window. In a use process of the electronic apparatus, the sound production unit vibrates to oscillate an airflow in the rear cavity, such that the heat dissipation diaphragm covering the heat dissipation window is subjected to airflow impact from the rear cavity to generate vibration, and then the vibration of the heat dissipation diaphragm generates an oscillating airflow in the heat dissipation channel, thereby generating forced convection around the heat source, thus the heat from the heat source is rapidly dissipated, and the heat dissipation efficiency and the heat dissipation performance are improved.

Description

electronic device

technical field

The invention relates to the field of electroacoustic technology, in particular to an electronic device.

Background technique

At present, electronic devices that use sound-generating devices, such as chips in speakers as the main heat source, usually conduct heat to the die-cast aluminum shell of the speaker box through a heat-conducting silica gel sheet, so as to dissipate heat through the high thermal conductivity of the shell itself, but , the thermal conductivity of the heat-conducting silicone sheet is small, the heat generated by the chip cannot be quickly transferred to the shell, and the heat transferred to the shell can only rely on the part of the shell itself exposed to the natural air for natural convection heat dissipation, the heat dissipation performance Poor, and with the increase of smart speaker functions, the demand for chip heat dissipation is also increasing, and the current heat dissipation method can no longer meet the demand for high heat dissipation.

Contents of the invention

The main purpose of the present invention is to provide an electronic device aimed at solving the problem of poor heat dissipation performance of existing sound boxes.

In order to achieve the above object, the present invention proposes an electronic device, the electronic device includes a housing and a sound-generating device accommodated in the housing, a front channel acoustic cavity is formed between the housing and the sound-generating device, and the housing is provided with A sound outlet that communicates with the front sound cavity; the sound-generating device includes a housing, a sound-generating unit accommodated in the housing, and a support plate arranged outside the housing, the sound-generating unit and the housing A rear cavity is formed between the bodies, a heat dissipation channel is formed between the support plate and the housing, a heat source is provided on the side of the support plate facing the housing, and the heat source is located in the heat dissipation channel, so The casing is provided with a heat dissipation window communicating with the rear cavity and the heat dissipation channel, and the heat dissipation window is covered with a heat dissipation diaphragm.

Preferably, the heat dissipation diaphragm and the heat source are misplaced, the angle between the heat dissipation diaphragm and the support plate is an acute angle, and the distance between the heat dissipation diaphragm and the support plate is closer to The direction of the heat source is gradually expanding.

Preferably, the heat dissipating diaphragm and the heat source are arranged in dislocation, and the heat dissipating diaphragm is arranged perpendicular to the support plate.

Preferably, the housing is provided with a protruding structure, the protruding structure protrudes from the shell wall of the housing facing the supporting plate toward the direction of the supporting plate, and the protruding structure faces the heat source The heat dissipation window is opened on one side, and the heat dissipation diaphragm is installed on the raised structure.

Preferably, the protruding structure includes a windshield part and a mounting part, the heat dissipation window is opened in the installation part, the heat dissipation diaphragm is mounted on the mounting part, and the windshield part is connected to the mounting part part away from the side of the heat source, and the windshield part abuts against the support plate.

Preferably, the protruding structure is integrally formed on the housing.

Preferably, the heat dissipating diaphragm, the support plate, and the shell wall of the shell facing the support plate are arranged parallel to each other.

Preferably, the heat dissipation diaphragm is arranged facing the heat source, and there is a gap communicating with the heat dissipation channel between the heat dissipation diaphragm and the heat source.

Preferably, the heat dissipation diaphragm and the heat source are dislocated.

Preferably, the housing is made of a heat-conducting material, and a heat-conducting sheet is provided between the heat source and the housing, and both sides of the heat-conducting sheet are in contact with the heat source and the housing respectively.

Preferably, the heat dissipation diaphragm includes a mounting ring and a vibrating diaphragm, the vibrating diaphragm covers the heat dissipation window, and the outer edge of the vibrating diaphragm is mounted on the mounting ring, and the mounting ring surrounds the The heat dissipation window is arranged and installed on the outer periphery of the heat dissipation window.

Preferably, the heat dissipation diaphragm further includes a counterweight, the counterweight is arranged on the diaphragm, and the counterweight is arranged facing the heat dissipation window.

Preferably, the vibrating diaphragm is made of elastic soft material.

Preferably, the support plate is made of heat-conducting material; and/or, the support plate is detachably connected to the housing.

In the technical solution of the present invention, during the use of the electronic device, the vibrating membrane of the sounding unit of the sounding device vibrates up and down to cause the airflow in the rear cavity to oscillate, and then the heat dissipation diaphragm covered at the heat dissipation window is subjected to the vibration of the rear cavity. Vibration is generated by the impact of airflow, and the vibration of the heat dissipation diaphragm generates oscillating airflow in the heat dissipation channel, and then generates forced convection around the heat source, quickly dissipates heat and cools the heat source, speeds up heat dissipation, improves heat dissipation efficiency and heat dissipation performance, and meets the requirements of high heat dissipation. need.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative effort.

FIG. 1 is an exploded schematic diagram of a sound-generating device in an electronic device according to an embodiment of the present invention;

Fig. 2 is a schematic cross-sectional view of a sound-generating device in an electronic device according to an embodiment of the present invention;

Fig. 3 is an exploded schematic diagram of a sound-generating device in an electronic device according to another embodiment of the present invention;

Fig. 4 is a schematic cross-sectional view of a sound emitting device in an electronic device according to another embodiment of the present invention;

5 is a schematic cross-sectional view of a heat dissipation diaphragm of a sound emitting device in an electronic device according to an embodiment of the present invention;

6 is a schematic cross-sectional view of a heat dissipation diaphragm of a sound emitting device in an electronic device according to another embodiment of the present invention;

7 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.

Explanation of reference numbers:

100100	发声器件 Sound device	5050	散热通道 cooling channel
1010	壳体 case	6060	散热振膜 Diaphragm
1111	后腔 back cavity	6161	安装环 mounting ring
1212	散热窗 thermal window	6262	振动膜片 diaphragm
1313	第一壳体 first shell	6363	配重块 Counterweight
1414	第二壳体 second shell	7070	导热片 Thermal pad
1515	凸起结构raised structure	8080	空隙 gap
151151	挡风部 windshield	200200	电子装置 electronic device
152152	安装部 Installation Department	201201	外壳 shell
2020	发声单体 Sound unit	20112011	出声孔 sound hole
3030	支撑板 support plate	20122012	散热孔Vents
4040	热源 heat source	202202	前道声腔anterior vocal cavity

The realization of the purpose of the present invention, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

In addition, if there are descriptions involving "first", "second" and so on in the embodiments of the present invention, the descriptions of "first", "second" and so on are only for descriptive purposes, and should not be interpreted as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present invention.

The descriptions of orientations such as "up", "down", "left", and "right" in the present invention are based on the orientation shown in Figure 2 and Figure 4, and are only used to explain the postures shown in Figure 2 and Figure 4 If the relative positional relationship among the components changes, the directional indication will also change accordingly.

The invention provides an electronic device.

As shown in Fig. 1 to Fig. 4, Fig. 7 and Fig. 8, the electronic device 200 of this embodiment includes a casing 201 and a sound emitting device 100 housed in the casing 201, and a front channel acoustic cavity 202 is formed between the casing 201 and the sound emitting device 100, The casing 201 is provided with a sound outlet 2011 communicating with the front sound cavity 202 . The sounding device 100 includes a housing 10, a sounding unit 20 and a support plate 30, wherein the sounding unit 20 is accommodated in the housing 10, the support plate 30 is arranged outside the housing 10, and between the sounding unit 20 and the housing 10 A rear cavity 11 is formed, a heat dissipation channel 50 is formed between the support plate 30 and the housing 10, a heat source 40 is provided on the side of the support plate 30 facing the housing 10, and the heat source 40 is located in the heat dissipation channel 50, and the housing 10 is provided with a communicating back The cavity 11 and the heat dissipation window 12 of the heat dissipation channel 50 are covered with a heat dissipation diaphragm 60 .

Specifically, as shown in FIGS. 1 to 4 , in the electronic device 200 of this embodiment, the supporting plate 30 of the sounding device 100 is located above the casing 10 , and the sounding unit 20 and the casing 10 face the upper shell of the supporting plate 30 A rear cavity 11 is formed between the walls, and the support plate 30 and the upper shell wall of the housing 10 are spaced up and down, so that a heat dissipation channel 50 is formed between the support plate 30 and the housing 10 , and the support plate 30 faces one side of the housing 10 , That is, a heat source 40 is disposed on the lower side of the support plate 30 , and the heat source 40 may be a chip of the sound-generating device 100 . This embodiment takes the heat source 40 as an example for illustration. The chip is located in the heat dissipation passage 50, and the housing 10 is provided with a heat dissipation window 12 connecting the rear cavity 11 and the heat dissipation passage 50. The heat dissipation window 12 is specifically opened on the upper shell wall of the housing 10, and the heat dissipation window 12 is covered with a heat dissipation The diaphragm 60 , that is, the heat dissipation diaphragm 60 covers the heat dissipation window 12 .

The electronic device 200 of this embodiment can be a computer, a mobile phone, a sound box, and a car sound box applied to a car, etc., and the electronic device 200 is applied with a sound generating device 100. In this embodiment, the sound generating device 100 is used as a speaker used in a sound box as an example It is illustrated that the sound emitting unit 20 is a loudspeaker unit. It can be understood that the speaker unit has a diaphragm. During use, the diaphragm of the speaker unit vibrates up and down to cause the airflow in the rear cavity 11 to oscillate, thereby causing the heat dissipation diaphragm 60 covering the heat dissipation window 12 to be subjected to back pressure. The vibration of the airflow in the cavity 11 produces vibration, and the vibration of the heat dissipation diaphragm 60 generates an oscillating airflow in the heat dissipation channel 50, which in turn generates forced convection around the chip to quickly dissipate heat and cool down the chip, speed up heat dissipation, and improve heat dissipation efficiency and heat dissipation performance , to meet the needs of high heat dissipation. The housing 201 is provided with sound holes 2011 to realize normal sounding of the electronic device 200 . The number of sound outlets 2011 may be multiple, and the plurality of sound outlets 2011 are arranged at intervals. The housing 2011 is also provided with cooling holes 2012. The cooling holes 2012 are arranged on the side of the housing 201 close to the heat source 40. After the airflow generated by the vibration of the cooling diaphragm and the air around the heat source generate forced convection, the airflow with a large amount of heat flows out from the cooling channel. , and then dissipate to the outside world through the heat dissipation holes, so as to achieve the purpose of rapid cooling. The number of heat dissipation holes 2012 may be multiple, and the plurality of heat dissipation holes 2012 are arranged at intervals. It should be noted that the arrows in FIG. 2 and FIG. 4 indicate the flow direction of the airflow.

As shown in Figures 1 and 2, in one embodiment, the heat dissipation diaphragm 60 and the heat source 40 are misplaced, the angle between the heat dissipation diaphragm 60 and the support plate 30 is an acute angle, and the heat dissipation diaphragm 60 and the support plate 30 The distance between them is gradually expanded toward the direction close to the heat source 40 . As shown in Figures 1 and 2, the heat dissipation window 12 is opened on the upper shell wall of the housing 10 to avoid the position of the chip, so that the heat dissipation diaphragm 60 and the chip are misplaced. In order to facilitate forced convection around the chip, the heat dissipation vibration The membrane 60 is arranged obliquely, so that the angle between the heat dissipation diaphragm 60 and the support plate 30 is an acute angle, and the distance between the heat dissipation diaphragm 60 and the support plate 30 is gradually expanded toward the direction close to the heat source 40, as shown in Figure 1 and As shown in Figure 2, the heat dissipation diaphragm 60 is located on the right side of the chip, and the heat dissipation diaphragm 60 is arranged obliquely downward from right to left, so that the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 can flow to the left to the chip, and the heat dissipation diaphragm The distance between the support plate 60 and the support plate 30 gradually increases from right to left, so that the airflow generated by the vibration of the heat dissipation diaphragm 60 can flow to the chip smoothly and improve the heat dissipation efficiency.

In this embodiment, the heat dissipating diaphragm 60 and the chip are dislocated, so that the heat dissipating diaphragm 60 avoids the chip, and it is convenient to install the following heat conducting sheet 70 . The casing 10 can be made of heat-conducting material, and a heat-conducting sheet 70 is arranged between the heat source 40 and the casing 10 , and both sides of the heat-conducting sheet 70 are in contact with the heat source 40 and the casing 10 respectively. Specifically, the housing 10 can be made of die-casting aluminum material with better thermal conductivity in the prior art, and the heat-conducting sheet 70 can be a heat-conducting silica gel sheet in the prior art. Further, the housing 10 can be made of the first housing 13 and the second Two housings 14 are assembled, wherein, the first housing 13 forms a rear chamber 11 with the loudspeaker unit, and the support plate 30 is installed on the first housing 13. In order to save production costs, the first housing 13 can be It is made of die-casting aluminum, while the second housing 14 can be made of plastic.

By setting the heat conduction sheet 70, and the upper side of the heat conduction sheet 70 is in contact with the chip, and the lower side of the heat conduction sheet 70 is in contact with the upper shell wall of the casing 10 (first casing 13), so that the heat generated by the chip can be passed through heat conduction. The sheet 70 conducts to the housing 10, and then dissipates heat through the housing 10, and then uses the dual heat dissipation effect of the heat dissipation diaphragm 60 and the heat conduction sheet 70 to greatly speed up the heat dissipation of the chip and greatly improve the heat dissipation efficiency.

In another embodiment, the heat dissipation diaphragm 60 and the heat source 40 are dislocated, and the heat dissipation diaphragm 60 is arranged perpendicular to the support plate 30 . Specifically, the support plate 30 is arranged parallel to the upper shell wall of the housing 10, and the heat dissipation diaphragm 60 is vertically arranged so that the heat dissipation diaphragm 60 and the support plate 30 are perpendicular to each other. Compared with the heat dissipation diaphragm 60 arranged obliquely, the vertical The heat dissipation diaphragm 60 arranged vertically can make the oscillating air flow generated by the vibration have no upward component, so that it can all flow to the left to the chip, so as to quickly cool the chip, further accelerate the heat dissipation speed, and improve the heat dissipation efficiency.

In this embodiment, the heat dissipating diaphragm 60 and the chip are dislocated, so that the heat dissipating diaphragm 60 avoids the chip, and it is convenient to install the following heat conducting sheet 70 . The casing 10 can be made of heat-conducting material, and a heat-conducting sheet 70 is provided between the heat source 40 and the casing 10 , and both sides of the heat-conducting sheet 70 are in contact with the heat source 40 and the casing 10 respectively. Specifically, the housing 10 can be made of die-casting aluminum material with better thermal conductivity in the prior art, and the heat-conducting sheet 70 can be a heat-conducting silica gel sheet in the prior art. Further, the housing 10 can be made of the first housing 13 and the second Two casings 14 are assembled, wherein, the first casing 13 forms a rear chamber 11 with the speaker unit, and the support plate 30 is installed on the first casing 13. In order to save production costs, the first casing 13 can be It is made of die-casting aluminum, while the second housing 14 can be made of plastic.

In order to realize the oblique setting or vertical setting of the heat dissipation diaphragm 60, the housing 10 is provided with a protruding structure 15, the protruding structure 15 protrudes from the shell wall of the housing 10 facing the supporting plate 30 to the direction of the supporting plate 30, and the protruding A heat dissipation window 12 is opened on the side of the structure 15 facing the heat source 40 , and the heat dissipation diaphragm 60 is installed on the protruding structure 15 . Specifically, the protruding structure 15 is arranged on the upper shell wall of the housing 10, the protruding structure 15 protrudes upward from the upper shell wall of the housing 10, and a heat dissipation window 12 is opened on the side of the protruding structure 15 facing the chip to dissipate heat. The diaphragm 60 is mounted on the protruding structure 15 .

The protruding structure 15 includes a windshield portion 151 and a mounting portion 152. The mounting portion 152 is provided with a heat dissipation window 12. The heat dissipation diaphragm 60 is installed on the mounting portion 152. The windshield portion 151 is connected to the side of the mounting portion 152 away from the heat source 40. In addition, the windshield portion 151 abuts against the support plate 30 .

As shown in Figure 2, the installation part 152 is arranged facing the chip, the heat dissipation window 12 is opened on the installation part 152, and the heat dissipation diaphragm 60 is installed on the installation part 152, so that the heat dissipation diaphragm 60 is arranged facing the chip, which is beneficial to the heat dissipation diaphragm 60 The oscillating airflow generated by the vibration flows in the direction of the chip. The windshield part 151 is connected to the right side of the mounting part 152 away from the chip, and the upper end of the windshield part 151 abuts against the support plate 30, so that the windshield part 151 has a windshield effect, and blocks the oscillating air flow generated by the vibration of the cooling diaphragm 60 from The outflow from the windshield part 151 ensures that the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 all flows toward the chip direction, speeding up the heat dissipation speed and improving the heat dissipation efficiency.

The protruding structure 15 is integrally formed on the casing 10, omitting assembly steps and assembly errors, and is easy to manufacture. Specifically, the protruding structure 15 is integrally formed with the upper shell wall of the housing 10, and the heat dissipation diaphragm 60 can be installed on the inner side of the protruding structure 15 by gluing or screwing, or by gluing or screwing. Installed on the outside of the raised structure 15, the assembly is simple and convenient.

As shown in FIGS. 3 and 4 , in yet another embodiment, the heat dissipation diaphragm 60 , the support plate 30 , and the shell wall of the housing 10 facing the support plate 30 are arranged parallel to each other. The heat dissipation diaphragm 60 is disposed facing the heat source 40 , and there is a gap 80 communicating with the heat dissipation channel 50 between the heat dissipation diaphragm 60 and the heat source 40 .

As shown in Figures 3 and 4, the heat dissipation diaphragm 60, the support plate 30, and the upper shell wall of the housing 10 are all arranged horizontally, and the three are parallel to each other. The heat dissipation diaphragm 60 is arranged facing the chip, and the heat dissipation diaphragm There is a gap 80 communicating with the heat dissipation channel 50 between the heat source 60 and the heat source 40, that is, the chip and the heat dissipation diaphragm 60 are arranged at intervals up and down, and the chip is located directly above the heat dissipation diaphragm 60, and the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 can pass through directly. The gap 80 directly blows upward to the chip, shortens the distance between the heat dissipation diaphragm 60 and the heat dissipation diaphragm 60, reduces the loss of the oscillating air flow during the flow process, makes the oscillating air flow directly and fully act on the chip, accelerates the heat dissipation speed, and improves cooling efficiency. In this embodiment, the sound-generating device 100 has no heat conduction requirement on the material of the casing 10 , and the casing 10 can be made of a relatively low-cost plastic material to save production costs.

In yet another embodiment, the heat dissipation diaphragm 60 , the support plate 30 , and the housing wall of the housing 10 facing the support plate 30 are arranged parallel to each other. The heat dissipation diaphragm 60 and the heat source 40 are dislocated. Specifically, the heat dissipation diaphragm 60, the support plate 30, and the upper shell wall of the housing 10 are all arranged horizontally, and the three are parallel to each other. The heat dissipation diaphragm 60 and the chip are misplaced, so that the heat dissipation diaphragm 60 is set away from the chip. , to facilitate the installation of the following heat conducting sheet 70.

In this embodiment, the casing 10 can be made of heat-conducting material, and a heat-conducting sheet 70 is provided between the heat source 40 and the casing 10 , and both sides of the heat-conducting sheet 70 are in contact with the heat source 40 and the casing 10 respectively. Specifically, the housing 10 can be made of die-casting aluminum material with better thermal conductivity in the prior art, and the heat-conducting sheet 70 can be a heat-conducting silica gel sheet in the prior art. Further, the housing 10 can be made of the first housing 13 and the second Two housings 14 are assembled, wherein, the first housing 13 forms a rear chamber 11 with the loudspeaker unit, and the support plate 30 is installed on the first housing 13. In order to save production costs, the first housing 13 can be It is made of die-casting aluminum, while the second housing 14 can be made of plastic.

As shown in FIG. 5 , in one embodiment, the heat dissipation diaphragm 60 includes a mounting ring 61 and a vibrating diaphragm 62, the vibrating diaphragm 62 covers the heat dissipation window 12, and the outer edge of the vibrating diaphragm 62 is mounted on the mounting ring 61, The mounting ring 61 surrounds the heat dissipation window 12 and is installed on the outer periphery of the heat dissipation window 12 . The shape of the vibrating diaphragm 62 basically matches the shape of the heat dissipation window 12. The vibrating diaphragm 62 covers the heat dissipation window 12. During the use of the speaker, the vibrating diaphragm 62 covering the heat dissipation window 12 is impacted by the airflow in the rear cavity 11. Vibrates, thereby generating an oscillating airflow in the heat dissipation channel 50 . For the convenience of installation, the cooling diaphragm 60 includes a mounting ring 61, the mounting ring 61 is arranged along the outer edge of the vibrating diaphragm 62, the outer edge of the vibrating diaphragm 62 is mounted on the mounting ring 61, and the mounting ring 61 surrounds the heat dissipation window 12 and is fixed on the outer periphery of the heat dissipation window 12 by bonding or screwing, so as to achieve a stable assembly of the heat dissipation diaphragm 60 and the housing 10 .

As shown in Figure 6, in another embodiment, in addition to the above-mentioned mounting ring 61 and vibrating diaphragm 62, the heat dissipating diaphragm 60 also includes a counterweight 63, and the counterweight 63 is arranged on the vibrating diaphragm. 62 , and the counterweight 63 is set up against the heat dissipation window 12 . The counterweight 63 can be made of metal material in the prior art, and the counterweight 63 is arranged on the vibrating diaphragm 62, which can make the vibrating diaphragm 62 vibrate effectively and stably, and improve the sound quality of the sound box. The counterweight 63 can be arranged on the upper surface of the vibrating membrane 62, or on the lower surface of the vibrating membrane 62, or embedded in the vibrating membrane 62, which is convenient and flexible to assemble.

The vibrating diaphragm 62 is made of elastic soft material. Specifically, the vibrating membrane 62 can be made of elastic soft material such as silica gel or rubber in the prior art, so that the vibrating membrane 62 has elasticity and is conducive to vibration.

In order to further accelerate the heat dissipation speed of the chip, the support plate 30 can be made of a heat-conducting material. The support plate 30 can be made of a metal material with better thermal conductivity in the prior art, and the heat generated by the chip can also be conducted to the support plate 30. To dissipate heat through the support plate 30 . In order to facilitate assembly and disassembly, the support plate 30 is detachably connected to the housing 10 . It should be noted that the support plate 30 can also be made of low-cost plastic material or FR-4 plate, which is convenient for installing chips.

The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Under the inventive concept of the present invention, the equivalent structural transformation made by using the description of the present invention and the contents of the accompanying drawings, or directly/indirectly used in other All relevant technical fields are included in the patent protection scope of the present invention.

Claims

An electronic device, characterized in that the electronic device includes a housing and a sound-generating device accommodated in the housing, a front channel acoustic cavity is formed between the housing and the sound-generating device, and the housing is provided with a A sound outlet that communicates with the sound cavity; the sound-generating device includes a housing, a sound-emitting monomer accommodated in the housing, and a support plate arranged outside the housing, and a sound-emitting monomer is formed between the housing and the housing. There is a rear cavity, a heat dissipation channel is formed between the support plate and the housing, a heat source is provided on the side of the support plate facing the housing, the heat source is located in the heat dissipation channel, and the housing is opened There is a heat dissipation window connecting the rear cavity and the heat dissipation channel, and the heat dissipation window is covered with a heat dissipation diaphragm.
The electronic device according to claim 1, wherein the heat dissipation diaphragm and the heat source are dislocated, the angle between the heat dissipation diaphragm and the support plate is an acute angle, and the heat dissipation diaphragm The distance from the support plate is gradually expanded toward the direction close to the heat source.
The electronic device according to claim 1, wherein the heat dissipation diaphragm is arranged in a dislocation with the heat source, and the heat dissipation diaphragm is arranged perpendicular to the support plate.
The electronic device according to claim 2 or 3, wherein the housing is provided with a protruding structure, and the protruding structure extends from the shell wall of the housing facing the support plate to the wall of the support plate. The direction protrudes, and the side of the protruding structure facing the heat source is provided with the heat dissipation window, and the heat dissipation diaphragm is installed on the protruding structure.
The electronic device according to claim 4, wherein the protruding structure includes a windshield portion and a mounting portion, the mounting portion is provided with the heat dissipation window, and the heat dissipation diaphragm is mounted on the mounting portion , the windshield part is connected to a side of the mounting part away from the heat source, and the windshield part abuts against the support plate.
The electronic device according to claim 4, wherein the protruding structure is integrally formed on the casing.
The electronic device according to claim 1, wherein the heat dissipation diaphragm, the support plate, and the shell wall of the shell facing the support plate are arranged parallel to each other.
The electronic device according to claim 7, wherein the heat dissipation diaphragm is arranged facing the heat source, and there is a gap communicating with the heat dissipation channel between the heat dissipation diaphragm and the heat source.
The electronic device according to claim 7, wherein the heat dissipation diaphragm and the heat source are dislocated.
The electronic device according to claim 2, 3 or 9, wherein the casing is made of a heat-conducting material, a heat-conducting sheet is arranged between the heat source and the casing, and the two sides of the heat-conducting sheet The sides are in contact with the heat source and the housing respectively.
The electronic device according to claim 1, wherein the heat dissipation diaphragm comprises a mounting ring and a diaphragm, the diaphragm covers the heat dissipation window, and the outer edge of the diaphragm is installed on the On the installation ring, the installation ring is arranged around the heat dissipation window and installed on the outer periphery of the heat dissipation window.
The electronic device according to claim 11, wherein the heat dissipation diaphragm further comprises a weight, the weight is arranged on the diaphragm, and the weight is facing the heat dissipation window settings.
The electronic device according to claim 11, wherein the vibrating diaphragm is made of elastic soft material.
The electronic device according to claim 1, wherein the support plate is made of heat-conducting material; and/or, the support plate is detachably connected to the housing.