WO2022252223A1 - 一种散热装置及电子设备 - Google Patents

一种散热装置及电子设备 Download PDF

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Publication number
WO2022252223A1
WO2022252223A1 PCT/CN2021/098399 CN2021098399W WO2022252223A1 WO 2022252223 A1 WO2022252223 A1 WO 2022252223A1 CN 2021098399 W CN2021098399 W CN 2021098399W WO 2022252223 A1 WO2022252223 A1 WO 2022252223A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
circuit board
support rod
heat
guide rod
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Application number
PCT/CN2021/098399
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English (en)
French (fr)
Inventor
郭卫
郭军
Original Assignee
海能达通信股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 海能达通信股份有限公司 filed Critical 海能达通信股份有限公司
Priority to PCT/CN2021/098399 priority Critical patent/WO2022252223A1/zh
Publication of WO2022252223A1 publication Critical patent/WO2022252223A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment.
  • the spring-type radiator has great advantages in heat dissipation of high-power chips.
  • the extremely small contact thermal resistance under the action of elastic force keeps the temperature of chips such as high-power CPUs and FPGAs within a reliable range.
  • the spring heat sink requires screw holes on the PCB board to fix the spring screws.
  • the technical problem mainly solved by this application is to provide a heat dissipation device and electronic equipment, which can reduce the product volume.
  • a technical solution adopted by the present application is to provide a heat dissipation device for dissipating heat from chips on a circuit board, the heat dissipation device includes a heat sink and at least one elastic connection assembly; the elastic connection assembly One end of the elastic connection component is fixedly connected to the heat sink, and the other end of the elastic connection component is used for elastic connection to the mounting frame of the circuit board.
  • the elastic connection assembly includes a support rod and an elastic member, the first end of the support rod is fixedly connected to the installation frame, and the two ends of the elastic member are respectively connected to the second end of the support rod and the Radiator connection.
  • the support rod is provided with an accommodating cavity, and the second end of the support rod is provided with an opening communicating with the accommodating cavity;
  • the elastic connection assembly also includes a guide rod, and the elastic member is a spring, The spring is sheathed on the periphery of the guide rod, the first end of the guide rod is fixedly connected with the heat sink, and the second end of the guide rod is inserted into the accommodating cavity.
  • two ends of the elastic member are respectively fixedly connected with the second end of the support rod and the heat sink.
  • the opening at the second end of the support rod is a threaded hole
  • the second end of the guide rod is set as a screw rod matched with the threaded hole
  • the elastic connection assembly further includes a first fastening screw, the first end of the guide rod is provided with a first threaded hole, and the first end of the guide rod passes through the first fastening screw and the first threaded hole.
  • a threaded hole fits and is detachably connected with the radiator.
  • the elastic connection assembly further includes a second fastening screw, the first end of the support rod is provided with a second threaded hole, and the second end of the support rod passes through the second fastening screw and the first screw hole.
  • the two threaded holes cooperate and are detachably connected with the installation frame.
  • the side of the radiator facing the circuit board is provided with a heat conduction element, and the heat conduction element is attached to the chip on the circuit board.
  • an electronic device the electronic device includes a circuit board, a mounting frame and a heat dissipation device, and the heat dissipation device is arranged on the circuit board and the mounting frame Between, the heat dissipation device is any one of the above heat dissipation devices.
  • the heat dissipation device of the present application includes a heat sink and at least one elastic connection component, one end of the elastic connection component is fixedly connected to the heat sink, and the other end of the elastic connection component is used for
  • the mounting frame elastically connected to the circuit board, so that in the process of installing the circuit board and the mounting frame, the elastic connection component can press the heat sink towards the direction of the circuit board under the action of the mounting frame, so that the heat sink can be abutted against the circuit board board, so that the chips on the circuit board can be dissipated.
  • the heat dissipation device of the present application does not need to be fixedly connected to the heat sink by punching holes on the circuit board. When the heat sink can meet the heat dissipation requirements, the number of PCB openings can be reduced. Make the product volume smaller.
  • FIG. 1 is a schematic structural view of an embodiment in which a heat sink provided by the present application is installed in a circuit board and a mounting frame;
  • Fig. 2 is a schematic diagram of the exploded structure of the cooling device in Fig. 1;
  • Fig. 3 is a schematic diagram of product status structure comparison between electronic equipment before remanufacturing and electronic equipment after remanufacturing in an application scenario
  • Fig. 4 is a schematic diagram of the layout structure comparison of the circuit board when the restructured electronic equipment of Fig. 3 adopts the heat dissipation device of existing design and the heat dissipation device of the present application;
  • FIG. 5 is a schematic diagram showing the structure comparison between the heat sink of the conventional design and the heat sink of the present application for the remanufactured electronic equipment of FIG. 3 .
  • system and “network” are often used interchangeably herein.
  • the term “and/or” in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations.
  • the character "/” in this article generally indicates that the contextual objects are an “or” relationship.
  • “many” herein means two or more than two.
  • FIG. 1 is a structural diagram of an embodiment of a heat dissipation device provided by the present application installed in a circuit board and a mounting frame
  • FIG. 2 is a schematic diagram of an exploded structure of the heat dissipation device in FIG. 1
  • the heat sink 10 of the present application is used to dissipate heat from the chip 110 on the circuit board 11.
  • the heat sink 10 includes a heat sink 100 and at least one elastic connection component 101; one end of the elastic connection component 101 is fixedly connected to the heat sink 100, The other end of the elastic connection component 101 is used to elastically connect to the installation frame 12 of the circuit board 11.
  • the heat sink 10 is located between the circuit board 11 and the installation frame 12, and the elastic
  • the connecting assembly 101 presses the heat sink 100 toward the circuit board 11 under the action of the mounting frame 12 , so that the heat sink 100 abuts against the circuit board 11 .
  • the heat sink is arranged on one side of the circuit board to dissipate heat on the chip on the circuit board, generally by opening a mounting hole on the circuit board, and then directly passing through the retaining spring , spring screws, etc. Press the heat sink on the chip, fix the circlip or spring screw on the mounting hole of the circuit board, or install the structural parts on the circuit board in advance, and then press the heat sink on the structural part through the circlip or spring screw
  • the mounting structure needs to be fixed on the mounting hole of the circuit board.
  • the heat dissipation device 10 of the present application is fixedly connected to the heat sink 100 through one end of the elastic connection component 101, and the other end of the elastic connection component 101 is used to elastically connect to the installation frame 12 of the circuit board 11, so that the installation frame 12 is installed on the During the installation process on the circuit board 11, the elastic connection assembly 101 can press the heat sink 100 towards the direction of the circuit board 11 under the action of the installation frame 12, and then the heat sink 100 can be abutted against the circuit board 11, so that the heat sink 100 can be connected to the circuit board 11.
  • the chip 110 on the circuit board 11 dissipates heat.
  • the heat sink 10 of the present application does not need to be fixedly connected to the heat sink 100 by punching holes on the circuit board 11.
  • the opening of the circuit board 11 can be reduced.
  • the number of holes is conducive to layout and wiring, and helps to reduce the area of the single board, so that the product volume can be made smaller, without stress concentration, and with higher reliability.
  • the elastic connection assembly 101 includes a support rod 1011 and an elastic member 1012, the first end of the support rod 1011 is fixedly connected to the installation frame 12, and the two ends of the elastic member 1012 are respectively connected to the second end of the support rod 1011 and the heat dissipation device 100 connection.
  • the first end of the support rod 1011 is fixedly connected to the installation frame 12
  • the second end of the support rod 1011 is connected to one end of the elastic member 1012
  • the other end of the elastic member 1012 is connected to the radiator 100, so that the installation of the radiator 100 can be realized.
  • the frames 12 are elastically connected, and under the action of the mounting frame 12, the support rod 1011 and the elastic member 1012 can be pushed to press the heat sink 100 toward the circuit board 11, and then the heat sink 100 can be abutted against the circuit board 11 to realize heat dissipation
  • the device 100 dissipates heat from the chip 110 on the circuit board 11 .
  • the support rod 1011 is provided with an accommodation chamber 1013, and the second end of the support rod 1011 is provided with an opening communicating with the accommodation chamber 1013;
  • the elastic connection assembly 101 also includes a guide rod 1014, the elastic member 1012 is a spring, and the spring sleeve It is arranged on the periphery of the guide rod 1014 , the first end of the guide rod 1014 is fixedly connected with the heat sink 100 , and the second end of the guide rod 1014 is inserted into the accommodating cavity 1013 .
  • the first end of the guide rod 1014 is fixedly connected with the radiator 100, and the second end of the guide rod 1014 is inserted into the accommodating cavity In 1013, the elastic member 1012 is a spring, and the spring is sleeved on the periphery of the guide rod 1014, so that when the support rod 1011 and the elastic member 1012 are pushed under the action of the installation frame 12 to press the radiator 100 toward the direction of the circuit board 11, the guide rod The second end of 1014 moves in the accommodating cavity 1013 and acts as a guide.
  • two ends of the elastic member 1012 abut against the second end of the supporting rod 1011 and the heat sink 100 respectively.
  • the elastic member 1012 is installed by abutting against the second end of the support rod 1011 and the heat sink 100.
  • the elastic member 1012 needs to be sleeved on the guide rod 1014 first, and then the guide rod 1014 The second end of the second end is inserted into the accommodating cavity 1013 .
  • two ends of the elastic member 1012 are respectively fixedly connected with the second end of the support rod 1011 and the heat sink 100 . Since the elastic member 1012 is fixedly connected to the second end of the support rod 1011 and the heat sink 100, during the installation of the heat sink 10, the second end of the guide rod 1014 is directly passed through the elastic member 1012 and inserted into the accommodating cavity 1013 within.
  • the opening at the second end of the support rod 1011 is a threaded hole
  • the second end of the guide rod 1014 is set as a screw that matches the threaded hole.
  • the elastic connection assembly 101 further includes a first fastening screw 1015, the first end of the guide rod 1014 is provided with a first threaded hole, and the first end of the guide rod 1014 passes through the first fastening screw 1015 and the first The threaded holes are matched to be detachably connected with the radiator 100 .
  • the elastic connection assembly 101 further includes a second fastening screw 1016, the first end of the support rod 1011 is provided with a second threaded hole, and the second end of the support rod 1011 passes through the second fastening screw 1016 and the second threaded hole.
  • the threaded holes are matched to be detachably connected with the mounting frame 12.
  • the heat sink 100 is provided with a heat conduction element 102 on the side facing the circuit board 11 .
  • the heat conduction element 102 may specifically be a sheet-shaped heat conduction material, and the heat conduction element 102 is attached to the chip 110 on the circuit board 11 .
  • the present application also provides an electronic device, the electronic device includes a circuit board 11, a mounting frame 12 and a heat sink 10, the heat sink 10 is arranged between the circuit board 11 and the mounting frame 12, and the heat sink 10 is any of the above-mentioned A cooling device 10.
  • the installation frame 12 may be the upper cover of the machine frame of the electronic equipment, or may be a structure such as a bracket or a fixing frame arranged in the machine frame.
  • the cooling device 10 is installed in the frame of the electronic device. Specifically, the cooling device 10 is arranged between the circuit board 11 of the electronic device and the installation frame 12. At this time, the installation frame 12 is The top cover of the machine frame and the cooling device 10 can be installed in the following order: install the support rod 1011 on the top cover of the machine frame through the second fastening screw 1016, and then screw the guide rod 1014 into the accommodating cavity 1013 of the support rod 1011 , the elastic member 1012 is sleeved on the guide rod 1014, so the heat sink 100 with the heat conduction member 102 can be installed on the guide rod 1014 through the first fastening screw 1015, that is, the heat sink 10 can be installed on the machine frame Cover; then, prepress the upper cover of the machine frame with the cooling device 10 installed downwards onto the lower cover 13 of the machine frame with the circuit board 11 installed.
  • the chips 110 are bonded together, and then the upper cover of the machine frame and the lower cover 13 of the machine frame are fastened, and the entire installation process is completed.
  • the cooling device 10 it is only necessary to repeat the above operation of installing the cooling device 10 on the upper cover of the machine frame, and then install all the cooling devices 10 on the machine frame
  • the cover and the lower cover 13 of the machine frame can be operated. It can be found that since the installation of the heat sink 10 does not occupy the layout space of the circuit board 11, the heat sink 10 can be arranged in any arrangement on the cover of the machine frame.
  • Figure 3 is a schematic diagram of a product status structure comparison between electronic equipment before remanufacturing and electronic equipment after remanufacturing in an application scenario
  • Figure 4 is a schematic diagram of the electronic equipment after remanufacturing in Figure 3.
  • Figure 5 is a schematic diagram of the comparison of the layout structure of the circuit board between the designed heat sink and the heat sink of the present application.
  • the electronic equipment on the left side of Figure 3 is the electronic equipment before remanufacturing, and it is an outdoor installation product at 55°C.
  • the electronic equipment is the remanufactured electronic equipment, and the development requirements are: the volume should be as small as possible, and the development cycle should be as short as possible.
  • the comparison of product demand specification parameters before and after the restructuring is as follows:
  • Option 1 Install the heat dissipation device of the existing design, that is, to modify the PCB board and add ten screw holes;
  • Option 2 Install the cooling device of this application, that is, directly borrow the original PCB without revision.
  • the key chip temperature data on the PCB board in Figure 4 can be obtained through simulation.
  • the key chip temperature data obtained by simulation of different heat sink installation schemes are compared in the following table:
  • the second solution can effectively solve the problem of screw holes occupying the board in the existing design, making the product volume smaller; and it can solve the compatibility problem of heat dissipation schemes in different usage scenarios without the PCB board being revised. ;
  • the PCB board can directly borrow the original product, which reduces the material, time, and labor costs of PCB board development.
  • the heat dissipation device is fixedly connected to the heat sink through one end of the elastic connection component, and the other end of the elastic connection component is used to elastically connect to the mounting frame of the circuit board, so that when the mounting frame is installed on the circuit board During the installation process, the heat sink is located between the circuit board and the installation frame. Under the action of the installation frame, the elastic connection component can press the heat sink toward the circuit board, and then make the heat sink abut against the circuit board.
  • the chip on the circuit board dissipates heat, and the heat dissipation device of the present application does not need to be fixedly connected to the heat sink by punching holes on the circuit board.
  • the heat sink can satisfy the heat dissipation, the number of PCB openings can be reduced, so that the product volume can reach smaller.
  • the disclosed heat dissipation device and electronic equipment may be implemented in other ways.
  • the implementations of the receiving circuit and the absorbing filter described above are only schematic.
  • the division of modules or units is only a logical function division.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
  • a unit described as a separate component may or may not be physically separated, and a component displayed as a unit may or may not be a physical unit, that is, it may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
  • the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium.
  • the technical solution of the present application is essentially or part of the contribution to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions to make a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor (processor) execute all or part of the steps of the methods in various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc., which can store program codes. .

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Abstract

本申请公开了一种散热装置及电子设备。散热装置用于对电路板上的芯片进行散热，所述散热装置包括散热器和至少一弹性连接组件；所述弹性连接组件的一端固定连接于所述散热器，所述弹性连接组件的另一端用于弹性连接于所述电路板的安装框架。通过上述设计，本申请能够缩小产品体积。

Description

一种散热装置及电子设备 【技术领域】
本申请涉及电子设备技术领域，特别是涉及一种散热装置及电子设备。
【背景技术】
当下，电子产品市场的竞争日趋激烈，产品小型化设计在竞争中占有重要地位。然而，小型化产品PCB板面积小，芯片密度高，功耗密度增大，散热风险直线上升。
弹簧式散热器在大功耗芯片的散热上极具优势，弹力作用下的极小接触热阻让大功耗CPU、FPGA等芯片温度维持在可靠范围内。常规安装方式中，弹簧式散热器需要PCB板上开有螺钉孔以固定弹簧螺钉。
芯片密度极高的电路板上，增加一个螺钉孔会给芯片布局、走线带来非常大的影响，从而导致PCB板尺寸难以压缩，产品体积难以减小。
【发明内容】
本申请主要解决的技术问题是提供一种散热装置及电子设备，能够缩小产品体积。
为解决上述技术问题，本申请采用的一个技术方案是提供一种散热装置，用于对电路板上的芯片进行散热，所述散热装置包括散热器和至少一弹性连接组件；所述弹性连接组件的一端固定连接于所述散热器，所述弹性连接组件的另一端用于弹性连接于所述电路板的安装框架。
其中，所述弹性连接组件包括支撑杆和弹性件，所述支撑杆的第一端与所述安装框架固定连接，所述弹性件的两端分别与所述支撑杆的第二端和所述散热器连接。
其中，所述支撑杆设置有容置腔，所述支撑杆的第二端设置有与所述容置腔连通的开孔；所述弹性连接组件还包括导杆，所述弹性件为弹簧，所述弹簧套设在所述导杆的外围，所述导杆的第一端与所述散热器固定连接，所述导杆的第二端插置于所述容置腔内。
其中，所述弹性件的两端分别抵接于所述支撑杆的第二端和所述散热器。
其中，所述弹性件的两端分别与所述支撑杆的第二端和所述散热器固定连接。
其中，所述支撑杆的第二端的开孔为螺纹孔，所述导杆的第二端设置为与所述螺纹孔相配合的螺杆。
其中，所述弹性连接组件还包括第一紧固螺钉，所述导杆的第一端开设有第一螺纹孔，所述导杆的第一端通过所述第一紧固螺钉和所述第一螺纹孔配合，与所述散热器可拆卸连接。
其中，所述弹性连接组件还包括第二紧固螺钉，所述支撑杆的第一端开设有第二螺纹孔，所述支撑杆的第二端通过所述第二紧固螺钉和所述第二螺纹孔配合，与所述安装框架可拆卸连接。
其中，所述散热器朝向所述电路板一侧设置有导热件，所述导热件与所述电路板上的芯片相贴合。
为解决上述技术问题，本申请采用的另一个技术方案是提供一种电子设备，所述电子设备包括电路板、安装框架和散热装置，所述散热装置设置于所述电路板和所述安装框架之间，所述散热装置为上述任意一种散热装置。
本申请的有益效果是：区别于现有技术的情况，本申请的散热装置包括散热器和至少一弹性连接组件，通过弹性连接组件的一端固定连接于散热器，弹性连接组件的另一端用于弹性连接于电路板的安装框架，使得在安装电路板和安装框架的过程中，弹性连接组件在安装框架的作用下可以将散热器往电路板的方向按压，进而可以使散热器抵接于电路板，从而可以对电路板上的芯片进行散热，本申请的散热装置无需通过在电路板上进行打孔来固定连接散热器，在散热器能满足散热的情况下，可以减少PCB开孔数量，使产品体积做到更小。
【附图说明】
图1是本申请提供的散热装置安装于电路板和安装框架中的一实施例的结构示意图；
图2是图1中的散热装置的爆炸结构示意图；
图3是一应用场景中改制前的电子设备与改制后的电子设备之间的产品状态结构对比示意图；
图4是图3的改制后的电子设备采用现有设计的散热装置与本申请的散热 装置时电路板的布局结构对比示意图；
图5是图3的改制后的电子设备采用现有设计的散热装置与本申请的散热装置的设备结构对比示意图。
【具体实施方式】
下面结合说明书附图，对本申请实施例的方案进行详细说明。
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、接口、技术之类的具体细节，以便透彻理解本申请。
本文中术语“系统”和“网络”在本文中常被可互换使用。本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。此外，本文中的“多”表示两个或者多于两个。
请参阅图1和图2，其中，图1是本申请提供的散热装置安装于电路板和安装框架中的一实施例的结构示意图，图2是图1中的散热装置的爆炸结构示意图。本申请的散热装置10用于对电路板11上的芯片110进行散热，具体地，散热装置10包括散热器100和至少一弹性连接组件101；弹性连接组件101的一端固定连接于散热器100，弹性连接组件101的另一端用于弹性连接于电路板11的安装框架12，在将安装框架12安装于电路板11上的过程中，散热装置10位于电路板11和安装框架12之间，弹性连接组件101在安装框架12的作用下将散热器100往电路板11的方向按压，使散热器100抵接于电路板11。
在现有的对电路板进行散热的设计中，将散热器设置在电路板一侧以对电路板上的芯片进行散热的方式，一般是通过在电路板上开设安装孔，然后直接通过卡簧、弹簧螺钉等将散热器按压在芯片上，卡簧或弹簧螺钉固定在电路板的安装孔上，或者预先在电路板上安装结构件，然后将散热器通过卡簧或弹簧螺钉按压在结构件上，而安装结构件需要固定在电路板的安装孔上，这些方式需在芯片附近的电路板上开设安装孔，增大了单板走线、布局的空间，且开孔应力集中，可靠性低。而本申请的散热装置10，通过弹性连接组件101的一端固定连接于散热器100，弹性连接组件101的另一端用于弹性连接于电路板11的安装框架12，使得在将安装框架12安装于电路板11上的过程中，弹性连接 组件101在安装框架12的作用下可以将散热器100往电路板11的方向按压，进而可以使散热器100抵接于电路板11，实现散热器100对电路板11上的芯片110进行散热，本申请的散热装置10无需通过在电路板11上进行打孔来固定连接散热器100，在散热器100能满足散热的情况下，可以减少电路板11开孔数量，有利于布局、走线，有助于缩小单板面积，使产品体积做到更小，且无应力集中，可靠性更高。
在一实施例中，弹性连接组件101包括支撑杆1011和弹性件1012，支撑杆1011的第一端与安装框架12固定连接，弹性件1012的两端分别与支撑杆1011的第二端和散热器100连接。通过支撑杆1011的第一端与安装框架12固定连接，支撑杆1011的第二端与弹性件1012的一端连接，弹性件1012的另一端与散热器100连接，从而可以实现散热器100与安装框架12之间弹性连接，在安装框架12的作用下可以推动支撑杆1011和弹性件1012将散热器100往电路板11的方向按压，进而可以使散热器100抵接于电路板11，实现散热器100对电路板11上的芯片110进行散热。
进一步地，支撑杆1011设置有容置腔1013，支撑杆1011的第二端设置有与容置腔1013连通的开孔；弹性连接组件101还包括导杆1014，弹性件1012为弹簧，弹簧套设在导杆1014的外围，导杆1014的第一端与散热器100固定连接，导杆1014的第二端插置于容置腔1013内。通过在支撑杆1011内设置容置腔1013，在散热器100一侧设置导杆1014，导杆1014的第一端与散热器100固定连接，导杆1014的第二端插置于容置腔1013内，弹性件1012为弹簧，弹簧套设在导杆1014的外围，使得在安装框架12的作用下推动支撑杆1011和弹性件1012将散热器100往电路板11的方向按压时，导杆1014的第二端在容置腔1013中移动，起导向作用。
在一实施例中，弹性件1012的两端分别抵接于支撑杆1011的第二端和散热器100。弹性件1012采用抵接于支撑杆1011的第二端和散热器100的方式安装，在散热装置10安装的过程中，需要先将弹性件1012套设在导杆1014上，然后将导杆1014的第二端插置于容置腔1013内。在另一实施例中，弹性件1012的两端分别与支撑杆1011的第二端和散热器100固定连接。由于弹性件1012与支撑杆1011的第二端和散热器100固定连接，在散热装置10安装的过程中，直接将导杆1014的第二端穿过弹性件1012并插置于容置腔1013内即可。
进一步地，支撑杆1011的第二端的开孔为螺纹孔，导杆1014的第二端设 置为与螺纹孔相配合的螺杆。通过导杆1014的第二端的螺杆从支撑杆1011的第二端的螺纹孔旋入，可以将导杆1014的第二端插置于容置腔1013内时，且导杆1014的第二端不会脱离容置腔1013。
在一实施例中，弹性连接组件101还包括第一紧固螺钉1015，导杆1014的第一端开设有第一螺纹孔，导杆1014的第一端通过第一紧固螺钉1015和第一螺纹孔配合，与散热器100可拆卸连接。
在一实施例中，弹性连接组件101还包括第二紧固螺钉1016，支撑杆1011的第一端开设有第二螺纹孔，支撑杆1011的第二端通过第二紧固螺钉1016和第二螺纹孔配合，与安装框架12可拆卸连接。
在一实施例中，散热器100朝向电路板11一侧设置有导热件102，导热件102具体可以为片状导热材料，导热件102与电路板11上的芯片110相贴合。
请结合图1，本申请还提供一种电子设备，电子设备包括电路板11、安装框架12和散热装置10，散热装置10设置于电路板11和安装框架12之间，散热装置10为上述任意一种散热装置10。安装框架12可以是电子设备的机框上盖，也可以是设置于机框内的支架、固定架等结构。
请结合图1，在一应用场景中，散热装置10安装于电子设备的机框中，具体地，散热装置10设置于电子设备的电路板11和安装框架12之间，此时安装框架12为机框上盖，散热装置10可以按照以下顺序进行安装：将支撑杆1011通过第二紧固螺钉1016安装在机框上盖上，然后将导杆1014旋入支撑杆1011的容置腔1013内，将弹性件1012套设在导杆1014上，于是可以将贴有导热件102的散热器100通过第一紧固螺钉1015安装在导杆1014上，即实现将散热装置10安装在机框上盖上；接着，将装好散热装置10的机框上盖向下预压到装好电路板11的机框下盖13上，此时散热器100的导热件102正好与电路板11上的芯片110相贴合，然后紧固机框上盖和机框下盖13，整个安装过程完成。另外，当电路板11上有多个芯片110需要设置散热装置10时，只需要重复以上将散热装置10安装在机框上盖上的操作，将所有散热装置10安装好后再安装机框上盖和机框下盖13操作即可。可以发现，由于散热装置10的安装不占用电路板11的布局空间，使得散热装置10可在机框上盖上任意排布设置，可以同时使多颗大功耗芯片110全部安装散热装置10，进行弹性接触散热；并且，所有散热装置10随机框上盖整体向下压，有助于缓解芯片110受力不均现象，可以降低焊点损坏风险；另外，安装散热装置10无需再电路板11上开孔，与 电路板11上的器件不存在位置竞争关系，散热装置10的安装孔位设计更灵活，适应性强。
请结合图3至图5，其中，图3是一应用场景中改制前的电子设备与改制后的电子设备之间的产品状态结构对比示意图，图4是图3的改制后的电子设备采用现有设计的散热装置与本申请的散热装置时电路板的布局结构对比示意图，图5是图3的改制后的电子设备采用现有设计的散热装置与本申请的散热装置的设备结构对比示意图。在一应用场景中，图3左侧的电子设备为改制前的电子设备，其为户外55℃安装产品，为了拓宽市场，现需要将其改成图3右侧的电子设备，图3右侧的电子设备为改制后的电子设备，开发需求为：体积尽可能小，开发周期要尽可能短。改制前后产品需求规格参数对比如下表：
Figure PCTCN2021098399-appb-000001
通过图3可以发现，PCB板上芯片1/2/3需要安装散热器进行强化散热，原产品PCB板上没有安装散热器1/2/3的合适孔位，为实现散热器安装，推荐以下两种方案：
方案一：安装现有设计的散热装置，即将PCB板改版，增加十个螺钉孔；
方案二：安装本申请的散热装置，即直接借用原PCB，不改版。
请结合图4，两种不同的解决方案的关键参数信息对比如下表：
Figure PCTCN2021098399-appb-000002
然后，通过仿真可以得到图4的PCB板上关键芯片温度数据，不同散热器安装方案仿真得到的关键芯片温度数据对比如下表：
Figure PCTCN2021098399-appb-000003
可以发现，在散热上，方案一和方案二基本无差别，即本申请的散热装置亦能保证关键芯片的温度在规格范围内。
综上，将两种方案的优劣势进行对比，汇总如下表：
Figure PCTCN2021098399-appb-000004
Figure PCTCN2021098399-appb-000005
通过以上分析可知，采用方案二可以有效解决现有设计中螺钉孔占板问题，使产品体积做到更小；并且可以解决产品在PCB板不改版情况下的不同使用场景中的散热方案兼容问题；另外，PCB板可以直接借用原产品，降低了PCB板开发的物料、时间、人力成本。
本申请提供的散热装置和电子设备，散热装置通过弹性连接组件的一端固定连接于散热器，弹性连接组件的另一端用于弹性连接于电路板的安装框架，使得在将安装框架安装于电路板上的过程中，散热装置位于电路板和安装框架之间，弹性连接组件在安装框架的作用下可以将散热器往电路板的方向按压，进而可以使散热器抵接于电路板，从而可以对电路板上的芯片进行散热，本申请的散热装置无需通过在电路板上进行打孔来固定连接散热器，在散热器能满足散热的情况下，可以减少PCB开孔数量，使产品体积做到更小。
在本申请所提供的几个实施例中，应该理解到，所揭露的散热装置和电子设备，可以通过其它的方式实现。例如，以上所描述的接收电路和吸收式滤波器的实施方式仅仅是示意性的，例如，模块或单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施方式方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分 可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)或处理器(processor)执行本申请各个实施方式方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。

Claims (10)

  1. 一种散热装置，用于对电路板上的芯片进行散热，其特征在于，所述散热装置包括散热器和至少一弹性连接组件；所述弹性连接组件的一端固定连接于所述散热器，所述弹性连接组件的另一端用于弹性连接于所述电路板的安装框架。
  2. 根据权利要求1所述的散热装置，其特征在于，
    所述弹性连接组件包括支撑杆和弹性件，所述支撑杆的第一端与所述安装框架固定连接，所述弹性件的两端分别与所述支撑杆的第二端和所述散热器连接。
  3. 根据权利要求2所述的散热装置，其特征在于，
    所述支撑杆设置有容置腔，所述支撑杆的第二端设置有与所述容置腔连通的开孔；
    所述弹性连接组件还包括导杆，所述弹性件为弹簧，所述弹簧套设在所述导杆的外围，所述导杆的第一端与所述散热器固定连接，所述导杆的第二端插置于所述容置腔内。
  4. 根据权利要求3所述的散热装置，其特征在于，
    所述弹性件的两端分别抵接于所述支撑杆的第二端和所述散热器。
  5. 根据权利要求3所述的散热装置，其特征在于，
    所述弹性件的两端分别与所述支撑杆的第二端和所述散热器固定连接。
  6. 根据权利要求3所述的散热装置，其特征在于，
    所述支撑杆的第二端的开孔为螺纹孔，所述导杆的第二端设置为与所述螺纹孔相配合的螺杆。
  7. 根据权利要求3所述的散热装置，其特征在于，
    所述弹性连接组件还包括第一紧固螺钉，所述导杆的第一端开设有第一螺纹孔，所述导杆的第一端通过所述第一紧固螺钉和所述第一螺纹孔配合，与所述散热器可拆卸连接。
  8. 根据权利要求3所述的散热装置，其特征在于，
    所述弹性连接组件还包括第二紧固螺钉，所述支撑杆的第一端开设有第二螺纹孔，所述支撑杆的第二端通过所述第二紧固螺钉和所述第二螺纹孔配合，与所述安装框架可拆卸连接。
  9. 根据权利要求1所述的散热装置，其特征在于，
    所述散热器朝向所述电路板一侧设置有导热件，所述导热件与所述电路板上的芯片相贴合。
  10. 一种电子设备，其特征在于，所述电子设备包括电路板、安装框架和散热装置，所述散热装置设置于所述电路板和所述安装框架之间，所述散热装置为权利要求1至9任一项所述的散热装置。
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