WO2022250118A1 - 光源モジュール - Google Patents

光源モジュール Download PDF

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Publication number
WO2022250118A1
WO2022250118A1 PCT/JP2022/021620 JP2022021620W WO2022250118A1 WO 2022250118 A1 WO2022250118 A1 WO 2022250118A1 JP 2022021620 W JP2022021620 W JP 2022021620W WO 2022250118 A1 WO2022250118 A1 WO 2022250118A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting element
waveguide
light
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/021620
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English (en)
French (fr)
Japanese (ja)
Inventor
康弘 藤本
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Kyocera Corp
Original Assignee
Kyocera Corp
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Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to US18/564,415 priority Critical patent/US12276823B2/en
Priority to EP22811386.6A priority patent/EP4350402A1/en
Priority to CN202280038173.5A priority patent/CN117396786A/zh
Priority to JP2023524231A priority patent/JPWO2022250118A1/ja
Publication of WO2022250118A1 publication Critical patent/WO2022250118A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0006—Coupling light into the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G02B6/2821—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using lateral coupling between contiguous fibres to split or combine optical signals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12097—Ridge, rib or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
    • H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4056—Edge-emitting structures emitting light in more than one direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Definitions

  • the present disclosure relates to light source modules.
  • Patent Document 1 An example of conventional technology is described in Patent Document 1.
  • the light source module of the present disclosure includes a first light emitting element that emits light of a first wavelength, a second light emitting element that emits light of a second wavelength different from the first wavelength, and the first wavelength and the second wavelength. comprises a third light emitting element emitting light of a third different wavelength, a clad, and a core located within the clad.
  • the core includes a first waveguide portion through which light emitted from the first light emitting element propagates, a second waveguide portion through which light emitted from the second light emitting element propagates, and from the third light emitting element a third waveguide through which the emitted light propagates; a first combining portion where two of the first waveguide, the second waveguide, and the third waveguide meet; a second multiplexing portion where the first multiplexing portion meets the remaining one of the first waveguide portion, the second waveguide portion, and the third waveguide portion; and one end of the second multiplexing portion. and an output portion located at the .
  • FIG. 1 is an exploded perspective view of a light source module according to an embodiment of the present disclosure
  • FIG. FIG. 2 is a perspective view of the light source module of FIG. 1 omitting a lid
  • FIG. 3 is a cross-sectional view cut along the cutting plane line III-III in FIG. 2
  • 2 is a plan view of the light source module of FIG. 1
  • FIG. FIG. 2 is an enlarged plan view showing a main part of the light source module of FIG. 1
  • FIG. 5 is an end view cut along the section line VI-VI of FIG. 4
  • FIG. 10 is a plan view showing a modification of the light source module according to the embodiment of the present disclosure
  • FIG. 10 is a plan view showing a modification of the light source module according to the embodiment of the present disclosure
  • FIG. 10 is a plan view showing a modification of the light source module according to the embodiment of the present disclosure
  • FIG. 10 is a plan view showing a modification of the light source module according to the embodiment of the present disclosure;
  • a display device that projects an image onto a screen or the like by two-dimensionally scanning a laser beam.
  • a light source for such a display device various light source modules provided with a multiplexing section for multiplexing lights with different wavelengths have been proposed (see, for example, Japanese Patent Application Laid-Open No. 2002-200016).
  • the multiplexing section is configured as a directional coupler, the multiplexing section itself requires high processing accuracy, and miniaturization is required from the viewpoint of suppressing optical loss. It was difficult.
  • the light source module includes a multiplexing section including an optical element such as a mirror or a lens, the number of components of the multiplexing section may increase, or the light source module may become large.
  • the light source module of the present disclosure may be used with any direction directed upward or downward, for the sake of convenience, a rectangular coordinate system (X, Y, Z) is defined herein and , the positive side in the Z-axis direction is defined as the upper side, and terms such as the upper surface and the lower surface are used.
  • the X direction is also referred to as the length direction.
  • the Y direction is also referred to as the width direction.
  • the Z direction is also called the thickness direction.
  • FIG. 1 is an exploded perspective view showing a light source module according to an embodiment of the present disclosure
  • FIG. 2 is a perspective view of the light source module in FIG. 1 with the cover omitted
  • FIG. 4 is a plan view of the light source module of FIG. 1
  • FIG. 5 is a plan view showing an enlarged main part of the light source module of FIG.
  • FIG. 6 is an end view cut along the section line VI--VI of FIG. 7-9 are plan views showing modifications of the light source module according to an embodiment of the present disclosure.
  • FIG. 2 shows a perspective view from a direction different from that of FIG. 4 omits the lid
  • FIG. 5 shows an enlarged portion A of FIG.
  • constituent elements other than the first light emitting element, the second light emitting element, the third light emitting element, the core and the substrate among the constituent elements of the light source module, and FIG.
  • constituent elements other than the first light emitting element, the second light emitting element, the third light emitting element, the clad, the core and the substrate are omitted from illustration.
  • the light source module 100 of this embodiment includes a first light emitting element 21, a second light emitting element 22, a third light emitting element 23, a clad 3, and a core 4.
  • the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23 may be semiconductor lasers, light emitting diodes, or the like, for example. In the following description, it is assumed that the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23 are semiconductor lasers. In addition, when the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23 are not distinguished from each other, they may be collectively referred to as the light emitting element 20 in some cases.
  • the first light emitting element 21 emits light having a peak emission intensity at the first wavelength.
  • the second light emitting element 22 emits light having a peak emission intensity at a second wavelength.
  • the third light emitting element 23 emits light having a peak emission intensity at the third wavelength.
  • the first, second and third wavelengths are different from each other.
  • the second wavelength may be longer than the first wavelength, for example.
  • the third wavelength may be, for example, a longer wavelength than the second wavelength.
  • the first wavelength may be located in a wavelength range of approximately 400-500 nm.
  • a blue semiconductor laser can be used as the first light emitting element 21 that emits light in such a wavelength region.
  • the second wavelength may be located in the wavelength region of about 500-600 nm.
  • a green semiconductor laser may be used as the second light emitting element 22 that emits light in such a wavelength region.
  • the third wavelength may be located in the wavelength region of about 600-700 nm.
  • a red semiconductor laser can be used as the third light emitting element 23 that emits light in such a wavelength region.
  • the optical waveguide layer 5 is composed of the clad 3 and the core 4 .
  • the core 4 is located within the cladding 3, for example as shown in FIGS. 1-6.
  • the light source module 100 may have a substrate 1 , in which case the clad 3 is positioned on the first surface 1 a and the core 4 is positioned to extend along the first surface 1 a of the substrate 1 .
  • the substrate 1 may be an organic wiring substrate made of an organic material.
  • the organic wiring board may be, for example, a printed wiring board, a build-up wiring board, a flexible wiring board, or the like.
  • organic materials used for organic wiring boards include epoxy resins, polyimide resins, polyester resins, acrylic resins, phenolic resins, and fluorine resins. Note that the organic wiring board may be a laminate.
  • the substrate 1 may be a compound semiconductor such as gallium nitride (GaN), gallium arsenide (GaAs), indium phosphide (InP), silicon (Si), germanium (Ge), sapphire ( Al2O3 ). .
  • GaN gallium nitride
  • GaAs gallium arsenide
  • InP indium phosphide
  • Si silicon
  • Ge germanium
  • Al2O3 Al2O3
  • the optical waveguide layer 5 may be made of, for example, glass such as quartz, or may be made of resin such as polymethyl methacrylate or fluororesin.
  • both the clad 3 and the core 4 may be made of glass or resin, or one of the clad 3 and the core 4 may be made of glass and the other made of resin.
  • core 4 has a higher refractive index than clad 3 .
  • the optical waveguide layer 5 utilizes the difference in refractive index between the clad 3 and the core 4 to totally reflect the light propagating through the core 4 .
  • the optical waveguide layer 5 can confine light in the core 4 with a high refractive index by forming a path with a material with a high refractive index and surrounding the path with a material with a low refractive index.
  • the light propagates inside the core 4 while repeating total reflection at the boundary between the core 4 and the clad 3 .
  • the clad 3 may be configured by laminating a lower clad layer 31 and an upper clad layer 32 as shown in FIG. 6, for example.
  • Core 4 may extend between lower clad layer 31 and upper clad layer 32 .
  • the upper clad layer 32 may have a ridge portion 32 a corresponding to the shape of the core 4 on the upper surface opposite to the lower surface facing the lower clad layer 31 .
  • the optical waveguide layer 5 may have a refractive index difference of 0.05 to 0.30 between the clad 3 and the core 4. In this case, the optical waveguide layer 5 stably propagates multimode light. can be done.
  • the optical waveguide layer 5 can be formed, for example, using techniques similar to photolithography and etching techniques used in semiconductor device manufacturing processes.
  • the core 4 includes a first waveguide portion 41, a second waveguide portion 42, and a third waveguide portion 43.
  • the first waveguide 41 is configured to propagate light emitted from the first light emitting element 21 .
  • the first waveguide part 41 has a first incident surface 41a on which the light emitted from the first light emitting element 21 is incident.
  • the first entrance surface 41 a faces the light exit surface of the first light emitting element 21 .
  • the second waveguide part 42 is configured to propagate the light emitted from the second light emitting element 22 .
  • the second waveguide part 42 has a second incident surface 42a on which the light emitted from the second light emitting element 22 is incident.
  • the second entrance surface 42 a faces the light exit surface of the second light emitting element 22 .
  • the third waveguide 43 is configured to propagate light emitted from the third light emitting element 23 .
  • the third waveguide part 43 has a third incident surface 43a on which the light emitted from the third light emitting element 23 is incident.
  • the third incident surface 43 a faces the light exit surface of the third light emitting element 23 .
  • the first waveguide section 41 , the second waveguide section 42 and the third waveguide section 43 may be collectively referred to as the waveguide section 40 .
  • the core 4 further includes a first combining section 44, a second combining section 45, and an emission section 46.
  • first combining section 44 two of the first waveguide section 41, the second waveguide section 42 and the third waveguide section 43 meet.
  • second combining section 45 located closer to the output section 46 than the first combining section 44, the remaining one of the first waveguide section 41, the second waveguide section 42 and the third waveguide section 43
  • the first multiplexing section 44 meets.
  • the second multiplexing section 45 may extend linearly.
  • the output section 46 is located at one end of the second combining section 45 .
  • the output section 46 is located at one end of the second combining section 45 opposite to the first combining section 44 side.
  • the light emitted from the light emitting element 20 is multiplexed by the first multiplexing section 44 and the second multiplexing section 45, and then output from the output section 46 to the outside.
  • the first waveguide portion 41 and the second waveguide portion 42 meet at the first combining portion 44
  • the third waveguide portion 43 and the first combining portion 44 meet at the second combining portion 45.
  • At least one of the two waveguides meeting at the first multiplexing section 44 may have a large bend (curvature).
  • the first multiplexing portion 44 is located closer to the light emitting element 20 than the second multiplexing portion 45, and the length of the waveguide portion with a large bend to the first multiplexing portion 44 is short. There is little optical loss (hereinafter simply referred to as loss) due to bending at the part.
  • the length of the waveguide means the length of the waveguide in the light propagation direction.
  • the length of one waveguide portion that meets the first multiplexing portion 44 in the second multiplexing portion 45 is relatively long, bending may be reduced to reduce loss.
  • the optical loss in the waveguide section 40 is small, so that lights with different wavelengths can be efficiently combined.
  • the first combining section 44 and the second combining section 45 of the light source module 100 do not include a directional coupler or an optical element such as a mirror or a lens, the light source module 100 has a compact and simple configuration. be able to.
  • the first light emitting element 21 is a blue semiconductor laser
  • the second light emitting element 22 is a green semiconductor laser
  • the third light emitting element 23 is a red semiconductor laser.
  • the first waveguide section 41 and the second waveguide section 42 meet at the first combining section 44, and the third waveguide section 43 and the first combining section 44 meet at the second combining section. It may be configured to meet at 45 .
  • the light of the third wavelength emitted from the red semiconductor laser is more susceptible to bending loss than the light of the first wavelength emitted from the blue semiconductor laser and the light of the second wavelength emitted from the green semiconductor laser. Therefore, the bending loss in the third waveguide portion 43 can be reduced by reducing the bending of the third waveguide portion 43 up to the second multiplexing portion 45 meeting the first multiplexing portion 44 .
  • the bending of the first waveguide part 41 is increased and the length is shortened to reduce the loss. , the width in the Y direction can be reduced. Since the light source module 100 satisfying such a configuration has little bending loss in the waveguide section 40, it is possible to efficiently combine lights with different wavelengths. In addition, it is possible to reduce the size by adopting a configuration that takes into consideration the bending loss characteristics due to light.
  • the second waveguide portion 42 may be sandwiched between the first waveguide portion 41 and the third waveguide portion 43, for example, as shown in FIGS. It may be located closest to the axis.
  • the second multiplexing section 42 can be a waveguide section with a small bend or a straight waveguide section.
  • the second light emitting element 22, which is a green semiconductor laser has lower light emission efficiency than the first light emitting element 21, which is a blue semiconductor laser, and the third light emitting element 23, which is a red semiconductor laser.
  • Bending loss in the second waveguide 42 can be reduced by making the second waveguide 42 a waveguide with a small bend or a straight waveguide.
  • the light source module 100 of the present embodiment can output white light whose color temperature and color rendering properties are appropriately adjusted.
  • the first incident surface 41 a and the third incident surface 43 a may face the central axis of the second combining section 45 .
  • FIG. 7 shows an example in which the second incident surface 42 a is also directed to the central axis of the second combining section 45 .
  • the angles ⁇ 1, ⁇ 2, and ⁇ 3 formed by the first incident surface 41a, the second incident surface 42a, and the third incident surface 43a with a plane perpendicular to the central axis of the second combining portion 45 are 35 degrees or less. may FIG.
  • the first waveguide 41, the second waveguide 42 and the third waveguide 43 can be shaped and arranged in a broom shape.
  • the interval in the width direction (Y direction) between the adjacent light emitting elements 20 can be narrowed.
  • the intervals in the width direction can be minimized by setting the angles ⁇ 1 and ⁇ 3 within a range of 5 degrees or more and 35 degrees or less. Become. As a result, the dimension in the width direction (Y direction) of the light source module 100 can be reduced.
  • the adjacent light emitting elements 20 should be arranged so as to overlap each other in the length direction (X direction). , it is also possible to further reduce the dimension of the light source module 100 in the width direction (Y direction).
  • the first incident surface 41a, the second incident surface 42a, and the third incident surface 43a satisfy the above configuration, the bending of the waveguide section 40 is small, so that the bending loss in the waveguide section 40 is small. As a result, the lights emitted from the light emitting elements 20 can be efficiently combined.
  • the second incident surface 42a may have a smaller angle with the vertical line 45a than the first incident surface 41a and the third incident surface 43a. Accordingly, the second waveguide portion 42 through which the light emitted from the second light emitting element 22 with low light emission efficiency propagates has a small bend and a small bending loss, so that the light emitted from the second light emitting element 22 can be reduced. It can be propagated with loss. As a result, it is possible to obtain a light source module capable of outputting white light whose color temperature and color rendering properties are appropriately adjusted.
  • the third incident surface 43a may form a smaller angle with the vertical line 45a than the first incident surface 41a.
  • the third waveguide part 43 through which the light of the third wavelength, which tends to cause bending loss, propagates, has a small bend and a small bending loss, so that the light emitted from the third light emitting element 23 is propagated with low loss. be able to.
  • the first incident surface 41a may be positioned closer to the output section 46 than the second incident surface 42a and the third incident surface 43a.
  • the first waveguide portion 41 having such a configuration can be shorter in length along the light propagation direction than the second waveguide portion 42 and the third waveguide portion 43 .
  • the position of the first light emitting element 21 and the external shape of the substrate 1 in the light source module 100 of FIG. 7 are indicated by two-dot chain lines.
  • the first light emitting element 21 is arranged near the first combining section 44 so that the first light emitting element 21 and the second light emitting element 22 overlap in the length direction (X direction).
  • the size of the light source module 100 in the width direction (Y direction) can be reduced, so that the light source module 100 can be miniaturized.
  • the first light emitting element 21 is arranged near the first combining section 44, for example, the first light emitting element 21 and the second light emitting element 22 are separated from each other in the length direction (X direction). not only overlap each other, but also the light exit surfaces can be arranged so as to overlap each other. As a result, the size of the light source module 100 in the width direction (Y direction) can be further reduced, and the size of the light source module 100 can be further reduced.
  • the bending of the first waveguide portion 41 may increase.
  • the short length of the waveguide 41 can reduce the increase in loss due to bending.
  • the light source module can propagate light emitted from the first light emitting element 21 with low loss and can output white light whose color temperature and color rendering properties are appropriately adjusted.
  • the clad 3 has a second surface 3a, which is a lower surface facing the substrate 1, and a third surface 3b, which is an upper surface opposite to the second surface 3a. It may have three through-holes 33 penetrating from 3b to the second surface 3a.
  • the first light emitting element 21, the second light emitting element 22, and the third light emitting element 23 may be positioned within three through holes 33, for example, as shown in FIG. In this case, by forming the through holes 33 according to the sizes of the first to third light emitting elements 21, 22, and 23, the opening of the through holes 33 can be reduced. Therefore, the rigidity of the clad 3 becomes high, and distortion of the clad 3 and the core 4 in the clad 3 can be reduced.
  • the distortion of the inner surface of the through-hole 33 where the entrance surfaces 41a, 42a, 43a of the core 4 are located is reduced, so that the light emitted from the first to third light emitting elements 21, 22, 23 can be efficiently emitted. It can be made incident on the core 4 .
  • the size and shape of the through hole 33 may be adapted to the outlines of the first to third light emitting elements 21, 22, 23. FIG. By arranging the first to third light emitting elements 21, 22, 23 in the through holes 33, they can be easily positioned.
  • the through-holes 33 are not limited to each element, and may be a single through-hole 34 as shown in FIG. 9, for example. All of the first light emitting element 21 , the second light emitting element 22 and the third light emitting element 23 may be positioned within a single through hole 34 .
  • the opening of a single through-hole 34 may have a shape that includes the openings of three through-holes 33 . In this case, when the light-emitting element 20 is mounted on the substrate 1, the risk of the light-emitting element 20 colliding with the opening or the inner peripheral surface of the through-hole 34 can be reduced. become easier.
  • the positions of the first incident surface 41a, the second incident surface 42a, and the third incident surface 43a are the same in the case of forming the through hole 33 for each element and the case of forming the single through hole 34. be able to.
  • the through hole 33 for each element for example, at least one of the width direction (the Y direction in the drawing) and the length direction (the X direction in the drawing) of the through hole 33 is made larger than the light emitting element 20. You may As a result, when the light emitting element 20 is mounted on the substrate 1, the risk of the light emitting element 20 colliding with the opening or the inner peripheral surface of the through hole 33 can be reduced. Moreover, even in this case, the rigidity of the clad 3 can be increased compared to a single large through-hole 34 .
  • the light source module 100 may further include a lid body 6, a seal ring 7, and a condenser lens 8, as shown in FIGS. 1 and 3, for example.
  • the lid 6 is located on the third surface 3 b of the clad 3 and covers the first light emitting element 21 , the second light emitting element 22 and the third light emitting element 23 .
  • a seal ring 7 is positioned between the lid 6 and the clad 3 .
  • the seal ring 7 has a continuous annular shape, and collectively surrounds the openings of the three through holes 33 in plan view.
  • the lid 6 can be directly bonded to the clad by using heat bonding, for example. There is a possibility that optical axis misalignment may occur between them.
  • the mechanical strength around the through-hole 33 can be improved and the distortion of the clad 3 and the core 4 can be reduced. As a result, optical axis deviation between the light emitting element 20 and the core 4 can be suppressed.
  • the lid 6 may be made of a glass material such as quartz, borosilicate glass, sapphire, or the like. Moreover, the lid 6 may be made of metals such as Fe, Ni, and Co, alloys containing these metals, and silicon.
  • the seal ring 7 may be made of, for example, metals such as Ti, Ni, Au, Pt, and Cr, or alloys containing these metals. The seal ring 7 is fixed on the third surface 3b of the clad 3 by vapor deposition, sputtering, ion plating, plating, or the like.
  • the lid body 6 uses a sealing ring 7 and a bonding material such as Au—Sn or Sn—Ag—Cu solder, Ag, Cu, or other metallic nanoparticle paste, or glass paste, for example, to form a thermosetting bond. Alternatively, they may be joined by laser welding or the like.
  • a bonding material such as Au—Sn or Sn—Ag—Cu solder, Ag, Cu, or other metallic nanoparticle paste, or glass paste, for example, to form a thermosetting bond. Alternatively, they may be joined by laser welding or the like.
  • the seal ring 7 may be provided not on the clad 3 but on a portion of the lid 6 facing the clad 3 .
  • the seal ring 7 may be made of, for example, metals such as Ti, Ni, Au, Pt, and Cr, or alloys containing these metals.
  • the seal ring 7 may be fixed to the lid 6 by vapor deposition, sputtering, ion plating, plating, or the like.
  • the clad 3 uses a seal ring 7 and a bonding material such as Au—Sn or Sn—Ag—Cu solder, metal nanoparticle paste such as Ag or Cu, or glass paste for thermosetting bonding or They may be joined by laser welding or the like.
  • the seal ring 7 may be provided on both the clad 3 and the lid 6.
  • the seal rings 7 provided on each of the clad 3 and the lid 6 are bonded by, for example, Au--Sn-based or Sn--Ag--Cu-based solder, metal-based nanoparticle paste such as Ag or Cu, or glass paste. It may be joined by thermosetting joining, laser welding, or the like using a material.
  • the seal ring 7 is not essential, and may be used as long as the clad 3 and the lid 6 can be joined together to maintain a high degree of airtightness.
  • the condenser lens 8 is positioned on the optical path of the light emitted from the emission section 46 .
  • the condenser lens 8 may be configured to collimate the light emitted from the emission section 46 or may be configured to collect the light emitted from the emission section 46 .
  • the condenser lens 8 may be a plano-convex lens having a plane entrance surface facing the exit portion 46 and a convex exit surface.
  • the light source module 100 further includes a plurality of electrodes 9 for supplying driving current to the light emitting elements 20.
  • two electrodes 9 are arranged for each of the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23.
  • the two electrodes 9 may be two parallel strip-shaped wires arranged on the first surface 1 a of the substrate 1 .
  • Each strip-shaped wiring has one end located in a region surrounded by the inner peripheral surface of the through hole 33 on the first surface 1a and the other end located in a region exposed from the clad 3 on the first surface 1a in plan view. may be located.
  • One end of each strip-shaped wiring is electrically connected to an electrode (p-electrode or n-electrode) of light-emitting element 20, and the other end of each strip-shaped wiring is electrically connected to an external power supply circuit.
  • the light source module 100 of the present disclosure includes a first light emitting element 21 that emits light of a first wavelength, a second light emitting element 22 that emits light of a second wavelength different from the first wavelength, the first wavelength and the second wavelength.
  • a third light emitting element 23 that emits light of a third wavelength different from the two wavelengths, a clad 3 , and a core 4 located within the clad 3 are provided.
  • the core 4 includes a first waveguide portion 41 through which light emitted from the first light emitting element 21 propagates, a second waveguide portion 42 through which light emitted from the second light emitting element 22 propagates, and the A third waveguide portion 43 through which light emitted from the third light emitting element 23 propagates, and two of the first waveguide portion 41, the second waveguide portion 42 and the third waveguide portion 43 meet. and the remaining one of the first waveguide portion 41, the second waveguide portion 42 and the third waveguide portion 43 and the first multiplex portion 44 meet. It has a second multiplexing section 45 and an emission section 46 positioned at one end of the second multiplexing section 45 .
  • lights with different wavelengths can be efficiently multiplexed with a small and simple configuration.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
PCT/JP2022/021620 2021-05-28 2022-05-26 光源モジュール Ceased WO2022250118A1 (ja)

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US18/564,415 US12276823B2 (en) 2021-05-28 2022-05-26 Light source module
EP22811386.6A EP4350402A1 (en) 2021-05-28 2022-05-26 Light source module
CN202280038173.5A CN117396786A (zh) 2021-05-28 2022-05-26 光源模块
JP2023524231A JPWO2022250118A1 (https=) 2021-05-28 2022-05-26

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040017539A (ko) * 2002-08-22 2004-02-27 우리로광통신주식회사 3분기형 광 도파로
JP2005189385A (ja) * 2003-12-25 2005-07-14 Sony Corp 分岐型光導波路、光源モジュール、並びに光情報処理装置
WO2015170505A1 (ja) * 2014-05-09 2015-11-12 国立大学法人福井大学 合波器、この合波器を用いた画像投影装置及び画像投影システム
WO2017065225A1 (ja) 2015-10-14 2017-04-20 シャープ株式会社 光合波器及びこの光合波器を用いた画像投影装置
JP2019105774A (ja) * 2017-12-13 2019-06-27 日東電工株式会社 光導波路
WO2021065948A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 光導波路パッケージおよび発光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10256365A1 (de) * 2001-12-04 2003-07-17 Ccs Inc Lichtabstrahlungsvorrichtung, Lichtquellenvorrichtung, Beleuchtungseinheit und Lichtverbindungsmechanismus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040017539A (ko) * 2002-08-22 2004-02-27 우리로광통신주식회사 3분기형 광 도파로
JP2005189385A (ja) * 2003-12-25 2005-07-14 Sony Corp 分岐型光導波路、光源モジュール、並びに光情報処理装置
WO2015170505A1 (ja) * 2014-05-09 2015-11-12 国立大学法人福井大学 合波器、この合波器を用いた画像投影装置及び画像投影システム
WO2017065225A1 (ja) 2015-10-14 2017-04-20 シャープ株式会社 光合波器及びこの光合波器を用いた画像投影装置
JP2019105774A (ja) * 2017-12-13 2019-06-27 日東電工株式会社 光導波路
WO2021065948A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 光導波路パッケージおよび発光装置

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EP4350402A1 (en) 2024-04-10
CN117396786A (zh) 2024-01-12

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