WO2022249841A1 - Structure de montage - Google Patents
Structure de montage Download PDFInfo
- Publication number
- WO2022249841A1 WO2022249841A1 PCT/JP2022/018975 JP2022018975W WO2022249841A1 WO 2022249841 A1 WO2022249841 A1 WO 2022249841A1 JP 2022018975 W JP2022018975 W JP 2022018975W WO 2022249841 A1 WO2022249841 A1 WO 2022249841A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- wiring board
- radiator
- area
- insulating member
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 31
- 230000032258 transport Effects 0.000 claims description 9
- 230000014509 gene expression Effects 0.000 description 22
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 15
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000004519 grease Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000011190 CEM-3 Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
L'invention concerne une structure de montage (1) comprenant : une carte de câblage (10) ayant une première surface (10a) et une seconde surface (10b) qui est opposée à la première surface (10a) ; un ou plusieurs composants de génération de chaleur de type à montage en surface (20) monté sur la première surface (10a) de la carte de câblage (10) ; un dissipateur de chaleur (30) disposé sur le coté de seconde surface (10b) de la carte de câblage (10) ; un élément isolant (40) disposé entre la carte de câblage (10) et le dissipateur de chaleur (30) ; un élément de transfert de chaleur (50) disposé entre la carte de câblage (10) et l'élément isolant (40) ; et un élément de fixation (60) de fixation de la carte de câblage (10) au dissipateur de chaleur (30), la zone (40) coté élément isolant (S50b) de l'élément de transfert de chaleur (5) et la zone (10) côté carte de câblage (S50a) de l'élément de transfert de chaleur (50) sont plus petites que la zone (30) côté dissipateur de chaleur (30) de l'élément isolant (40).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-088732 | 2021-05-26 | ||
| JP2021088732 | 2021-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022249841A1 true WO2022249841A1 (fr) | 2022-12-01 |
Family
ID=84228707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2022/018975 WO2022249841A1 (fr) | 2021-05-26 | 2022-04-26 | Structure de montage |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2022249841A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955459A (ja) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | 半導体装置 |
| JP2004311566A (ja) * | 2003-04-03 | 2004-11-04 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
| JP2010232318A (ja) * | 2009-03-26 | 2010-10-14 | Toyota Industries Corp | 半導体装置および熱伝シート |
| JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
| JP2016054221A (ja) * | 2014-09-03 | 2016-04-14 | トヨタ自動車株式会社 | 半導体装置 |
-
2022
- 2022-04-26 WO PCT/JP2022/018975 patent/WO2022249841A1/fr unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955459A (ja) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | 半導体装置 |
| JP2004311566A (ja) * | 2003-04-03 | 2004-11-04 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
| JP2010232318A (ja) * | 2009-03-26 | 2010-10-14 | Toyota Industries Corp | 半導体装置および熱伝シート |
| JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
| JP2016054221A (ja) * | 2014-09-03 | 2016-04-14 | トヨタ自動車株式会社 | 半導体装置 |
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