WO2022249452A1 - Dispositif à cycle de réfrigération - Google Patents

Dispositif à cycle de réfrigération Download PDF

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Publication number
WO2022249452A1
WO2022249452A1 PCT/JP2021/020447 JP2021020447W WO2022249452A1 WO 2022249452 A1 WO2022249452 A1 WO 2022249452A1 JP 2021020447 W JP2021020447 W JP 2021020447W WO 2022249452 A1 WO2022249452 A1 WO 2022249452A1
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WO
WIPO (PCT)
Prior art keywords
heat exchanger
refrigeration cycle
pump
cooling unit
condensed water
Prior art date
Application number
PCT/JP2021/020447
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English (en)
Japanese (ja)
Inventor
宗希 石山
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2023523911A priority Critical patent/JP7479569B2/ja
Priority to PCT/JP2021/020447 priority patent/WO2022249452A1/fr
Publication of WO2022249452A1 publication Critical patent/WO2022249452A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating [HVAC] devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/42—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger characterised by the use of the condensate, e.g. for enhanced cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/22—Means for preventing condensation or evacuating condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators

Definitions

  • the present disclosure relates to a refrigeration cycle device.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2009-257601 includes an electronic device that controls a refrigerant circuit, and performs heat exchange between the refrigerant circulating in the refrigerant circuit and the electronic device to cool the electronic device.
  • An air conditioner is disclosed.
  • the air conditioner disclosed in Japanese Patent Application Laid-Open No. 2009-257601 extends a pipe from an indoor heat exchanger to a compressor, and cools electronic equipment with refrigerant flowing through the pipe. For this reason, when the coolant is in a gas-liquid two-phase state, dew condensation is likely to occur in the electronic device. Furthermore, the increased pressure loss in the extended piping may reduce the performance of the refrigeration cycle. As a result, in the air conditioner disclosed in Japanese Patent Application Laid-Open No. 2009-257601, there is a risk that the reliability of the electronic equipment and the entire apparatus will be lowered.
  • the present disclosure has been made to solve the above problems, and an object thereof is to provide a refrigeration cycle device that dissipates heat from a control device without reducing reliability as much as possible.
  • a refrigeration cycle device includes a refrigerant circuit, a control device, a storage section, a cooling section, and a first pump.
  • the refrigerant circuit includes a compressor, a first heat exchanger, an expansion device, and a second heat exchanger and is configured to circulate refrigerant.
  • a controller is formed on the substrate and controls the refrigerant circuit.
  • the cooling unit cools the substrate.
  • the reservoir stores water condensed on the surface of the heat exchanger that functions as an evaporator.
  • the first pump supplies the water stored in the storage section to the cooling section.
  • the refrigeration cycle device can cool the substrate on which the control device is formed by supplying the cooling unit with water that condenses on the surface of the heat exchanger that functions as an evaporator. As a result, the refrigeration cycle device can dissipate heat from the control device without deteriorating reliability as much as possible.
  • FIG. 1 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 1;
  • FIG. 10 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 3;
  • FIG. 10 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 3;
  • FIG. 10 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 4;
  • FIG. 11 is a flow chart for explaining control of a control device in a refrigeration cycle apparatus according to Embodiment 4;
  • FIG. 10 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 5;
  • FIG. 12 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 6;
  • 14 is a flow chart for explaining control of a control device in a refrigeration cycle apparatus according to Embodiment 6.
  • FIG. FIG. 13 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 7;
  • FIG. 11 is a ph diagram of a refrigeration cycle in a refrigeration cycle device according to Embodiment 7;
  • FIG. 12 is a diagram showing the configuration of a refrigeration cycle apparatus according to Embodiment 8;
  • FIG. 11 is a ph diagram of a refrigeration cycle in a refrigeration cycle device according to Embodiment 8;
  • FIG. 1 is a diagram showing the configuration of a refrigeration cycle apparatus 11 according to Embodiment 1.
  • FIG. 1 functionally shows the connection relationship and arrangement configuration of each device in the refrigeration cycle apparatus 11, and does not necessarily show the arrangement in a physical space.
  • the refrigeration cycle device 11 includes a refrigerant circuit 20 that circulates refrigerant and a control device 100 that controls the refrigerant circuit 20 .
  • the refrigerant circuit 20 includes a compressor 1, a first heat exchanger 2, an expansion device 3, a second heat exchanger 4, and a plurality of pipes 71-74.
  • the discharge port 1b of the compressor 1 and the first heat exchanger 2 are connected by a pipe 71.
  • the first heat exchanger 2 and the expansion device 3 are connected by a pipe 72 .
  • the expansion device 3 and the second heat exchanger 4 are connected by a pipe 73 .
  • the second heat exchanger 4 and the suction port 1 a of the compressor 1 are connected by a pipe 74 .
  • the compressor 1 sucks in the low-temperature, low-pressure gas refrigerant that has flowed out of the second heat exchanger 4, and compresses the sucked gas refrigerant to increase the pressure of the gas refrigerant.
  • the compressor 1 discharges the high-temperature and high-pressure gas refrigerant obtained by compression to the first heat exchanger 2 .
  • the compressor 1 is configured to operate, stop, and change the rotational speed during operation according to a control signal from the control device 100 .
  • the control device 100 performs inverter control on the compressor 1 and arbitrarily changes the drive frequency of the compressor 1 .
  • the compressor 1 changes its rotation speed according to the change in drive frequency under the inverter control of the control device 100, thereby adjusting the circulation amount of the discharged refrigerant.
  • Various types can be adopted as the compressor 1 , for example, a scroll type, a rotary type, a screw type, etc. can be adopted as the compressor 1 .
  • the first heat exchanger 2 works as a condenser.
  • the first heat exchanger 2 heat-exchanges the high-temperature, high-pressure gas refrigerant that has flowed out of the compressor 1 with the outside air sucked in from the outside.
  • the gas refrigerant that has released heat to the outside air through this heat exchange is condensed inside the first heat exchanger 2 to change into a high-temperature, high-pressure liquid refrigerant.
  • a fan 21 is attached to the first heat exchanger 2 to send outside air in order to increase the efficiency of heat exchange.
  • the fan 21 supplies the first heat exchanger 2 with outside air for the refrigerant to exchange heat in the first heat exchanger 2 .
  • the high-temperature and high-pressure liquid refrigerant obtained by the first heat exchanger 2 flows out to the expansion device 3 .
  • the expansion device 3 reduces the pressure of the high-temperature, high-pressure liquid refrigerant that has flowed out of the first heat exchanger 2 .
  • the low-temperature, low-pressure gas-liquid two-phase refrigerant obtained by the pressure reduction in the expansion device 3 flows out to the second heat exchanger 4 .
  • the second heat exchanger 4 works as an evaporator.
  • the second heat exchanger 4 exchanges heat between the low-temperature, low-pressure gas-liquid two-phase refrigerant flowing out of the expansion device 3 and the air or water sucked from the air-conditioned space.
  • the gas-liquid two-phase refrigerant that absorbs heat from the air through this heat exchange evaporates inside the second heat exchanger 4 to change into a low-temperature, low-pressure gas refrigerant.
  • the low-temperature, low-pressure gas refrigerant obtained by the second heat exchanger 4 flows out to the compressor 1 .
  • the compressor 1, the first heat exchanger 2, the expansion device 3, and the second heat exchanger 4 are connected in order via the pipes 71 to 74.
  • the first heat exchanger 2 is a high-pressure side heat exchanger
  • the second heat exchanger 4 is a low-pressure side heat exchanger.
  • the coolant circulates through a path formed by connecting these components in a ring.
  • the control device 100 is formed on a substrate 100a and includes a processor 101 and a memory 102 as a storage medium.
  • the controller 100 can communicate with each component of the refrigerant circuit 20 to control each component of the refrigerant circuit 20 .
  • the processor 101 is a computing entity that controls each configuration of the refrigerant circuit 20 by executing various programs.
  • the processor 101 is composed of, for example, at least one of a CPU (central processing unit) and an FPGA (field programmable gate array).
  • the processor 101 may be configured with a processing circuit such as an ASIC (application specific integrated circuit).
  • the memory 102 is composed of volatile memory such as DRAM (dynamic random access memory) and SRAM (static random access memory), or non-volatile memory such as ROM (read only memory).
  • Memory 102 may include a solid state drive (SSD) or hard disk drive (HDD).
  • the memory 102 stores various programs in which processing procedures of the processor 101 are described.
  • Processor 101 controls each component of refrigerant circuit 20 by executing a program stored in memory 102 .
  • the processing by the control device 100 is not limited to software processing by a computer, and may be realized by hardware processing by an electronic circuit. Also, the processing by the control device 100 may be realized by a combination of software processing and hardware processing.
  • the control device 100 drives each actuator such as the compressor 1, but the temperature of the substrate 100a of the control device 100 may rise excessively during the driving.
  • a reference temperature is set in advance in the control device 100, and the temperature of the substrate 100a must be maintained below the reference temperature in order to ensure reliability.
  • a generally known technique is to dissipate heat from the substrate 100a by installing a heat sink on the substrate 100a.
  • the temperature of the substrate 100a can rise the most in a cooling operation state in which the drive frequency of the compressor 1 is maximized when the outside air is at a high temperature.
  • a heat sink as large as possible must be installed.
  • the larger the heat sink the greater the weight of the substrate 100a and the greater the force required to hold the substrate 100a.
  • a space for housing a large-sized heat sink is required, and the structure of the refrigerating cycle device 11 becomes complicated. Installation of the heat sink may also reduce the performance of the refrigeration cycle.
  • the refrigeration cycle apparatus 11 supplies the cooling unit 5 with water that condenses on the surface of the second heat exchanger 4 that functions as an evaporator (hereinafter also referred to as “condensed water”). , are configured to cool the substrate 100a.
  • the refrigeration cycle device 11 further includes a storage section 9, a first pump 7, a cooling section 5, and pipes 75 to 77.
  • the reservoir 9 and the suction port 7a of the first pump 7 are connected by a pipe 75.
  • the discharge port 7 b of the first pump 7 and one side of the cooling section 5 are connected by a pipe 76 .
  • the other side of the cooling section 5 is connected to the outside by a pipe 77 .
  • the reservoir 9 is installed below the second heat exchanger 4 .
  • the temperature of the substrate 100a can rise the most in the cooling operation state in which the driving frequency of the compressor 1 is maximized when the outside air is at a high temperature.
  • condensed water drain water
  • the surface of the second heat exchanger 4 that functions as an evaporator.
  • the dry-bulb temperature of outside air is 52° C. and the relative humidity is 80% during cooling operation
  • about 220 ml/min of condensed water is generated from a refrigeration cycle device equivalent to 4 horsepower.
  • Condensed water generated from the second heat exchanger 4 falls toward the reservoir 9 due to gravity and is stored by the reservoir 9 .
  • the storage part 9 may have any shape as long as it stores the condensed water.
  • the reservoir 9 may have a dish-like shape like a drain pan, a tank-like shape like a drain tank, or other shapes such as a bag and a bottle. may have
  • the first pump 7 sucks the condensed water stored in the storage portion 9 and discharges the sucked condensed water to the cooling portion 5 .
  • the amount of condensed water supplied to the cooling unit 5 by the first pump 7 may be fixed at a constant amount, or may be variable under the control of the control device 100 .
  • the first pump 7 may have any structure, such as a non-positive displacement pump such as a centrifugal pump and a positive displacement pump such as a reciprocating pump.
  • the first pump 7 is not limited to being controlled by the control device 100 and may be controlled by a control device other than the control device 100 .
  • the cooling unit 5 is configured to exchange heat between the condensed water supplied from the first pump 7 and the substrate 100 a of the control device 100 . By such heat exchange, the cooling unit 5 cools the substrate 100a. The condensed water heat-exchanged by the cooling unit 5 is discharged to the outside through the pipe 77 .
  • the reservoir 9 stores the condensed water generated from the second heat exchanger 4 that functions as an evaporator.
  • the condensed water stored by the storage section 9 is supplied to the cooling section 5 by the first pump 7 .
  • the cooling unit 5 heat is exchanged between the condensed water supplied from the first pump 7 and the substrate 100a of the control device 100, and the substrate 100a is cooled by such heat exchange.
  • the refrigeration cycle device 11 supplies the condensed water generated from the second heat exchanger 4 to the cooling unit 5 by the first pump 7, thereby cooling the substrate 100a on which the control device 100 is formed. can be done. This eliminates the need to install a heat sink on the substrate 100a. Furthermore, since the refrigerating cycle device 11 does not cool the substrate 100a with the refrigerant circulating in the refrigerant circuit 20, there is no risk of deterioration in the performance of the refrigerating cycle. Therefore, the refrigerating cycle device 11 can dissipate heat from the control device 100 without deteriorating the reliability of the control device 100 and the refrigerating cycle device 11 as a whole.
  • the refrigerating cycle apparatus 11 supplies the condensed water generated from the second heat exchanger 4 to the cooling unit 5 by the first pump 7, a sufficient amount of condensed water necessary for cooling the substrate 100a is supplied. It can be supplied to the cooling unit 5 .
  • Embodiment 2 A refrigeration cycle apparatus 12 according to Embodiment 2 will be described with reference to FIGS. 2 and 3. FIG. Only parts of the refrigerating cycle device 12 that differ from the refrigerating cycle device 11 according to the first embodiment will be described below.
  • FIG. 2 is a diagram showing the configuration of the refrigeration cycle device 12 according to Embodiment 2. As shown in FIG. As shown in FIG. 2, the refrigeration cycle device 12 further includes a first temperature sensor 111 that measures the temperature of the substrate 100a.
  • the first temperature sensor 111 measures the temperature of the substrate 100a and outputs the measured value T1 to the control device 100.
  • the controller 100 controls the first pump 7 based on the measured value T ⁇ b>1 of the first temperature sensor 111 to change the amount of condensed water supplied to the cooling unit 5 by the first pump 7 .
  • FIG. 3 is a flow chart for explaining the control of the control device 100 in the refrigeration cycle device 12 according to Embodiment 2.
  • the control device 100 executes the processing of the flowchart shown in FIG. 3 by executing the control program stored in the memory 102 .
  • the processing of this flowchart is called and executed by the main control routine of the refrigeration cycle device 12 at regular intervals.
  • "S" is used as an abbreviation for "STEP".
  • the control device 100 determines whether or not the refrigeration cycle device 12 is in operation (S1). If the refrigeration cycle device 12 is not in operation (NO in S1), the control device 100 returns control to the main control routine.
  • the control device 100 acquires the measured value T1 from the first temperature sensor 111 (S2).
  • the control device 100 determines whether or not the measured value T1 is greater than or equal to the first reference value (S3).
  • the first reference value is the temperature at which normal operation of control device 100 is guaranteed.
  • the refrigerating cycle device 12 controls the first pump 7 so that the temperature of the substrate 100a measured by the first temperature sensor 111 is less than the first reference value, thereby reducing the amount of condensed water supplied to the cooling unit 5. to adjust.
  • the control device 100 controls the first pump 7 to increase the amount of condensed water supplied to the cooling unit 5. (S4).
  • the control device 100 starts supplying the condensed water to the cooling unit 5 by starting the operation of the first pump 7 (S4).
  • the control device 100 controls the first pump 7 to reduce the amount of condensed water supplied to the cooling unit 5 (S5).
  • the control device 100 stops the supply of condensed water to the cooling unit 5 by stopping the operation of the first pump 7 (S5).
  • control device 100 After executing the process of S4 or S5, the control device 100 returns control to the main control routine.
  • the refrigeration cycle apparatus 12 increases the amount of condensed water supplied to the cooling unit 5 so that the temperature of the substrate 100a reaches the first reference value.
  • the temperature of the substrate 100a can be adjusted to be less than the value.
  • the refrigerating cycle device 12 reduces the amount of condensed water supplied to the cooling unit 5, so that the condensed water stored in the storage unit 9 is removed unnecessarily. use can be prevented.
  • the refrigerating cycle device 12 stops the operation of the first pump 7, so that heat is generated by heat exchange or natural convection between the air and the substrate 100a.
  • the power consumption of the first pump 7 can be suppressed by cooling the substrate 100a by the replacement.
  • Embodiment 3 A refrigeration cycle apparatus 13 according to Embodiment 3 will be described with reference to FIGS. 4 and 5. FIG. Only parts of the refrigerating cycle device 13 that differ from the refrigerating cycle device 11 according to the first embodiment will be described below.
  • FIGS. 4 and 5 are diagrams showing the configuration of the refrigeration cycle device 13 according to Embodiment 3.
  • FIG. As shown in FIGS. 4 and 5 , the refrigeration cycle device 13 further includes a four-way valve 30 , piping 310 , piping 320 , piping 330 and piping 340 .
  • the four-way valve 30 has ports 31 to 34.
  • the port 31 and the suction port 1 a of the compressor 1 are connected by a pipe 310 .
  • a pipe 320 connects the port 32 and the second heat exchanger 4 .
  • the port 33 and the discharge port 1 b of the compressor 1 are connected by a pipe 330 .
  • a pipe 340 connects the port 34 and the first heat exchanger 2 .
  • the four-way valve 30 is controlled by the control device 100 to a first state in which the ports 31 and 32 are communicated and the ports 33 and 34 are communicated. As shown in FIG. 5, the four-way valve 30 is controlled by the control device 100 to a second state in which the ports 31 and 34 are communicated and the ports 32 and 33 are communicated.
  • the control device 100 causes the refrigerant to flow from the second heat exchanger 4 to the compressor 1 by controlling the four-way valve 30 to the first state as shown in FIG. That is, during cooling operation, the refrigerant circulates through the compressor 1, the first heat exchanger 2, the expansion device 3, and the second heat exchanger 4 in this order.
  • the control device 100 causes the refrigerant to flow from the compressor 1 to the second heat exchanger 4 by controlling the four-way valve 30 to the second state as shown in FIG. That is, during heating operation, the refrigerant circulates through the compressor 1, the second heat exchanger 4, the expansion device 3, and the first heat exchanger 2 in this order.
  • the refrigeration cycle device 13 controls the four-way valve 30 so that the communication state inside the four-way valve 30 is changed so that the suction port 1a of the compressor 1 communicates with the second heat exchanger 4 and the compressor 1 a first state in which the discharge port 1b of the compressor 1 communicates with the first heat exchanger 2; 4 and the second state communicating with 4.
  • the refrigeration cycle device 13 includes a first reservoir 91 installed below the first heat exchanger 2 and a It further comprises a second reservoir 92 that is installed. That is, in Embodiment 3, reservoir 9 according to Embodiment 1 includes first reservoir 91 and second reservoir 92 .
  • the refrigeration cycle device 13 further includes a pipe 78 .
  • the second reservoir 92 is connected to the suction port 7a of the first pump 7 by a pipe 75, like the reservoir 9 according to the first embodiment.
  • a branch point 41 is provided in the pipe 75 between the second reservoir 92 and the first pump 7 .
  • the first reservoir 91 is connected by a pipe 78 to a branch point 41 provided in the middle of the pipe 75 .
  • the four-way valve 30 is controlled to the first state and the second heat exchanger 4 works as an evaporator. Condensed water generated from the second heat exchanger 4 during cooling operation falls toward the second reservoir 92 due to gravity and is stored by the second reservoir 92 .
  • the first pump 7 sucks the condensed water stored in the second storage portion 92 and discharges the sucked condensed water to the cooling portion 5 .
  • the four-way valve 30 is controlled to the second state and the first heat exchanger 2 works as an evaporator. Condensed water generated from the first heat exchanger 2 in the heating operation falls toward the first storage portion 91 due to gravity and is stored by the first storage portion 91 .
  • the first pump 7 sucks the condensed water stored in the first storage portion 91 and discharges the sucked condensed water to the cooling portion 5 .
  • Each of the first storage part 91 and the second storage part 92 may have any shape as long as it stores the condensed water.
  • each of the first reservoir 91 and the second reservoir 92 may have a dish-like shape like a drain pan, or may have a tank-like shape like a drain tank. but may have other shapes such as bags and bottles.
  • the second storage section 92 stores the condensed water generated from the second heat exchanger 4 that functions as an evaporator during cooling operation.
  • the condensed water stored by the second storage section 92 is supplied to the cooling section 5 by the first pump 7 .
  • the cooling unit 5 heat is exchanged between the condensed water supplied from the first pump 7 and the substrate 100a of the control device 100, and the substrate 100a is cooled by such heat exchange.
  • the first reservoir 91 stores the condensed water generated from the first heat exchanger 2 that functions as an evaporator during the heating operation.
  • the condensed water stored by the first storage section 91 is supplied to the cooling section 5 by the first pump 7 .
  • the cooling unit 5 heat is exchanged between the condensed water supplied from the first pump 7 and the substrate 100a of the control device 100, and the substrate 100a is cooled by such heat exchange.
  • the refrigeration cycle device 13 supplies the condensed water generated from the heat exchanger that functions as an evaporator to the cooling unit 5 by the first pump 7 in both the cooling operation and the heating operation.
  • the substrate 100a on which 100 is formed can be cooled.
  • the refrigeration cycle device 13 can radiate heat from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 13 as a whole in both the cooling operation and the heating operation.
  • Embodiment 4 A refrigeration cycle apparatus 14 according to Embodiment 4 will be described with reference to FIG. Only parts of the refrigerating cycle device 14 that differ from the refrigerating cycle device 12 according to the second embodiment will be described below.
  • FIG. 6 is a diagram showing the configuration of a refrigeration cycle device 14 according to Embodiment 4.
  • the refrigeration cycle device 14 further includes a drain pan 93 and a tank 94 as the reservoir 9 . That is, in the fourth embodiment, the storage section 9 according to the second embodiment includes the drain pan 93 and the tank 94 .
  • the refrigeration cycle device 14 further includes a pipe 75a and a pipe 75b.
  • the drain pan 93 stores the condensed water generated from the second heat exchanger 4 in the same manner as the storage section 9 according to the second embodiment.
  • a tank 94 is provided between the drain pan 93 and the first pump 7 and stores the condensed water flowing out of the drain pan 93 .
  • the tank 94 and the drain pan 93 are connected by a pipe 75a.
  • the tank 94 and the suction port 7a of the first pump 7 are connected by a pipe 75b.
  • an end portion 750a of the pipe 75a and an end portion 750b of the pipe 75b are connected in the tank 94.
  • the condensed water stored in the drain pan 93 flows through the pipe 75a and flows out to the tank 94 from the end 750a.
  • An end portion 750b of the pipe 75b is connected below the surface of the condensed water stored in the tank 94 .
  • the condensed water stored in the tank 94 is sucked up by the first pump 7 through the pipe 75 b and supplied to the cooling section 5 .
  • FIG. 7 is a flow chart for explaining the control of the control device 100 in the refrigeration cycle device 14 according to Embodiment 4.
  • the control device 100 executes the process of the flowchart shown in FIG. 7 by executing the control program stored in the memory 102 . The processing of this flowchart is called and executed by the main control routine of the refrigeration cycle device 14 at regular intervals.
  • "S" is used as an abbreviation for "STEP".
  • the control device 100 determines whether or not the refrigeration cycle device 14 is in operation (S11). If the refrigeration cycle device 14 is not in operation (NO in S11), the control device 100 returns control to the main control routine.
  • the control device 100 acquires the measured value T1 from the first temperature sensor 111 (S12).
  • the control device 100 determines whether or not the measured value T1 is greater than or equal to the first reference value (S13).
  • the first reference value is a threshold temperature at which normal operation of the control device 100 is guaranteed.
  • the refrigerating cycle device 14 controls the first pump 7 so that the temperature of the substrate 100a measured by the first temperature sensor 111 is less than the first reference value, thereby reducing the amount of condensed water supplied to the cooling unit 5. to adjust.
  • the controller 100 controls the first pump 7 to increase the amount of condensed water supplied to the cooling unit 5. (S14).
  • the control device 100 starts supplying condensed water to the cooling unit 5 by starting the operation of the first pump 7 (S14). Therefore, the first pump 7 supplies the condensed water stored in the tank 94 to the cooling section 5 .
  • the control device 100 controls the first pump 7 to reduce the amount of condensed water supplied to the cooling unit 5 (S15).
  • the control device 100 stops the supply of condensed water to the cooling unit 5 by stopping the operation of the first pump 7 after the operation for a certain period of time (S15). Therefore, the dew condensation water can be stored in the tank 94 again.
  • control device 100 After executing the process of S14 or S15, the control device 100 returns control to the main control routine.
  • the refrigeration cycle device 14 uses the condensed water stored in the tank 94 to increase the amount of condensed water supplied to the cooling unit 5 when the temperature of the substrate 100a is equal to or higher than the first reference value. By doing so, the temperature of the substrate 100a can be adjusted so that the temperature of the substrate 100a is less than the first reference value.
  • the refrigerating cycle device 14 reduces the amount of condensed water supplied to the cooling unit 5, so that the condensed water is stored again in the tank 94 or the drain pan 93 , and the unneeded use of the condensed water stored in each of the tanks 94 can be prevented.
  • the refrigerating cycle apparatus 14 cools the substrate 100a using the condensed water stored in the tank 94 even during operation in which the second heat exchanger 4 is unlikely to generate the condensed water necessary for cooling the substrate 100a. Since it can be cooled, heat can be released from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 14 as a whole as much as possible.
  • Embodiment 5 A refrigeration cycle apparatus 15 according to Embodiment 5 will be described with reference to FIG. Only parts of the refrigerating cycle device 15 that differ from the refrigerating cycle device 11 according to the first embodiment will be described below.
  • FIG. 8 is a diagram showing the configuration of a refrigeration cycle device 15 according to Embodiment 5. As shown in FIG. As shown in FIG. 8 , the refrigeration cycle device 15 further includes a second pump 8 , piping 78 and piping 79 .
  • the second pump 8 is provided between the pipes 77 and 76 .
  • a branch point 42 is provided in the pipe 77 between the cooling unit 5 and the outside.
  • a branch point 43 is provided in the pipe 76 between the first pump 7 and the cooling unit 5 .
  • the branch point 42 and the suction port 8 a of the second pump 8 are connected by a pipe 78 .
  • the discharge port 8 b of the second pump 8 and the branch point 43 are connected by a pipe 79 .
  • the second pump 8 sucks the heat-exchanged condensed water flowing out of the cooling unit 5 through the pipes 77 and 78, and supplies the sucked condensed water to the cooling unit 5 again through the pipes 79 and 76. .
  • the amount of condensed water supplied to the cooling unit 5 by the second pump 8 may be fixed at a constant amount, or may be variable under the control of the control device 100 .
  • the second pump 8 may have any structure, such as a non-positive displacement pump such as a centrifugal pump and a positive displacement pump such as a reciprocating pump.
  • the second pump 8 is not limited to being controlled by the control device 100 and may be controlled by a control device other than the control device 100 .
  • the condensed water generated from the second heat exchanger 4 acting as an evaporator is supplied to the cooling unit 5 by the first pump 7, and the supplied condensed water is used.
  • the substrate 100a is cooled by heat exchange. After that, the heat-exchanged condensed water flowing out of the cooling unit 5 is supplied to the cooling unit 5 again by the second pump 8 .
  • the refrigeration cycle device 15 circulates the heat-exchanged condensed water flowing out of the cooling unit 5 by the second pump 8, thereby reducing the condensed water generated from the second heat exchanger 4 a plurality of times. Heat can be exchanged between the water and the substrate 100a. As a result, the refrigeration cycle device 15 can efficiently cool the substrate 100a even during operation in which dew condensation water required for cooling the substrate 100a is unlikely to be generated from the second heat exchanger 4. It is possible to dissipate heat from the control device 100 without reducing the reliability of the device 100 and the refrigeration cycle device 15 as a whole as much as possible.
  • Embodiment 6 A refrigeration cycle apparatus 16 according to Embodiment 6 will be described with reference to FIGS. 9 and 10. FIG. Only parts of the refrigerating cycle device 16 that differ from the refrigerating cycle device 15 according to the fifth embodiment will be described below.
  • FIG. 9 is a diagram showing the configuration of a refrigeration cycle device 16 according to Embodiment 6. As shown in FIG. As shown in FIG. 9 , the refrigerating cycle device 16 further includes a second temperature sensor 112 that measures the temperature of the heat-exchanged condensed water flowing out of the cooling section 5 .
  • the second temperature sensor 112 measures the temperature of the condensed water flowing out of the cooling unit 5 and outputs the measured value T2 to the control device 100.
  • Control device 100 changes the amount of condensed water supplied to cooling unit 5 by controlling each of first pump 7 and second pump 8 based on measured value T2 of second temperature sensor 112 .
  • FIG. 10 is a flowchart for explaining the control of the control device 100 in the refrigeration cycle device 16 according to Embodiment 6.
  • the control device 100 executes the process of the flowchart shown in FIG. 10 by executing the control program stored in the memory 102 .
  • the processing of this flowchart is called and executed by the main control routine of the refrigeration cycle device 16 at regular intervals.
  • "S" is used as an abbreviation for "STEP".
  • the control device 100 determines whether or not the refrigeration cycle device 16 is in operation (S21). If the refrigeration cycle device 16 is not in operation (NO in S21), the control device 100 returns control to the main control routine.
  • the control device 100 acquires the measured value T2 from the second temperature sensor 112 (S22).
  • the control device 100 determines whether or not the measured value T2 is greater than or equal to the second reference value (S23).
  • the second reference value is a temperature at which a sufficient amount of heat can be exchanged between the condensed water supplied to the cooling unit 5 and the substrate 100a. That is, the second reference value is such that sufficient heat is generated between the condensed water supplied to the cooling unit 5 and the substrate 100a in order to set the temperature of the control device 100 to the temperature at which normal operation of the control device 100 is guaranteed. is the temperature at which the exchange takes place.
  • the refrigerating cycle device 16 controls each of the first pump 7 and the second pump 8 depending on whether the temperature of the condensed water measured by the second temperature sensor 112 is equal to or higher than the second reference value. , to adjust the amount of condensed water supplied to the cooling unit 5 .
  • the control device 100 controls each of the first pump 7 and the second pump 8 so that the first pump 7
  • the amount of condensed water supplied to the cooling unit 5 is made larger than the amount of condensed water supplied to the cooling unit 5 by the second pump 8 (S24). That is, when the temperature of the heat-exchanged condensed water that has flowed out of the cooling unit 5 is equal to or higher than the second reference value and thus it is not suitable for the heat exchange by the cooling unit 5 again, the control device 100 newly More condensed water generated from the second heat exchanger 4 is supplied than the condensed water that is reused multiple times.
  • the control device 100 controls each of the first pump 7 and the second pump 8 so that the second pump 8 supplies water to the cooling unit 5.
  • the amount of condensed water supplied is made larger than the amount of condensed water supplied to the cooling unit 5 by the first pump 7 (S25). That is, if the temperature of the heat-exchanged condensed water that has flowed out of the cooling unit 5 is less than the second reference value and it is suitable for the heat exchange to be performed again by the cooling unit 5, the control device 100 performs the heat exchange a plurality of times. Condensed water that is reused over a period of time is supplied in a larger amount than newly generated condensed water from the second heat exchanger 4 .
  • control device 100 After executing the process of S24 or S25, the control device 100 returns control to the main control routine.
  • the refrigeration cycle device 16 reduces the amount of condensed water supplied to the cooling unit 5 by the first pump 7 to the By increasing the amount of condensed water supplied to the cooling unit 5 by the 2-pump 8, the temperature difference between the condensed water supplied to the cooling unit 5 and the substrate 100a is reduced to between the cooling unit 5 and the substrate 100a. It is possible to maintain a temperature difference that allows sufficient heat exchange at As a result, the refrigeration cycle device 16 can radiate heat from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 11 as a whole as much as possible.
  • the refrigerating cycle device 16 reduces the amount of condensed water supplied to the cooling unit 5 by the second pump 8 to By increasing the amount of condensed water supplied to the unit 5, the condensed water newly generated from the second heat exchanger 4 is warmed by the condensed water that has been heat-exchanged, and then the warmed condensed water is cooled. 5 can be supplied. Thereby, the refrigerating cycle device 16 can prevent condensation from occurring on the substrate 100 a and the pipe 76 due to the temperature of the condensed water supplied to the cooling unit 5 .
  • Embodiment 7 A refrigeration cycle apparatus 17 according to Embodiment 7 will be described with reference to FIGS. 11 and 12 . Only parts of the refrigerating cycle device 17 that differ from the refrigerating cycle device 11 according to the first embodiment will be described below.
  • FIG. 11 is a diagram showing the configuration of a refrigeration cycle device 17 according to Embodiment 7. As shown in FIG. As shown in FIG. 11 , the refrigeration cycle device 17 further includes a third heat exchanger 50, a pipe 72a, a pipe 72b, a pipe 80, and a pipe 81.
  • the third heat exchanger 50 is provided between the first heat exchanger 2 and the expansion device 3.
  • the third heat exchanger 50 has ports 51 to 54 .
  • the port 51 is connected to the port 52 but not connected to each of the other ports 53 and 54 .
  • Port 52 is connected to port 51 and is not connected to each of other ports 53 and 54 .
  • Port 53 is connected to port 54 and is not connected to each of the other ports 51 and 52 .
  • Port 54 is connected to port 53 and is not connected to each of the other ports 51 and 52 .
  • the port 51 of the third heat exchanger 50 and the first heat exchanger 2 are connected by a pipe 72a.
  • the port 52 of the third heat exchanger 50 and the expansion device 3 are connected by a pipe 72b.
  • a pipe 80 connects the port 53 of the third heat exchanger 50 and the discharge port 7b of the first pump 7 .
  • the port 54 of the third heat exchanger 50 and the cooling section 5 are connected by a pipe 81 .
  • the refrigerant that flows out from the first heat exchanger 2 that functions as a condenser during cooling operation flows into the port 51 of the third heat exchanger 50 and flows into the third heat exchanger. It passes through the interior of 50 out of port 52 and then into expansion device 3 .
  • the condensed water stored by the storage part 9 is supplied to the third heat exchanger 50 by the first pump 7 .
  • the condensed water supplied to the third heat exchanger 50 flows into the port 53 of the third heat exchanger 50 and passes through the inside of the third heat exchanger 50 .
  • heat exchange takes place between the refrigerant from the first heat exchanger 2 and the condensed water from the first pump 7 .
  • the condensed water heat-exchanged in the third heat exchanger 50 flows out from the port 54 and is then supplied to the cooling section 5 .
  • the refrigeration cycle device 17 warms the condensed water generated from the second heat exchanger 4 by heat exchange in the third heat exchanger 50, and then supplies the warmed condensed water to the cooling unit 5. can do. Thereby, the refrigerating cycle device 17 can prevent condensation from occurring on the substrate 100 a and the pipe 76 due to the temperature of the condensed water supplied to the cooling unit 5 .
  • FIG. 12 is a ph diagram of the refrigeration cycle C1 in the refrigeration cycle device 17 according to the seventh embodiment.
  • the vertical axis represents the absolute pressure p
  • the horizontal axis represents the specific enthalpy h.
  • Each of points a to e shown in FIG. 12 corresponds to each of points a to e shown in FIG.
  • a point a indicates a position between the discharge port 1 b of the compressor 1 and the first heat exchanger 2 .
  • Point b indicates the position between the first heat exchanger 2 and the port 51 of the third heat exchanger 50 .
  • Point c indicates the position between port 52 of third heat exchanger 50 and expansion device 3 .
  • Point d indicates the position between expansion device 3 and second heat exchanger 4 .
  • a point e indicates a position between the second heat exchanger 4 and the suction port 1 a of the compressor 1 .
  • the change in the graph from point e to point a indicates the change in the refrigerant when it passes through the compressor 1.
  • the change in the graph from point a to point b shows the change in refrigerant when passing through the first heat exchanger 2 acting as a condenser.
  • Changes in the graph from point b to point c show changes in the refrigerant when passing through the third heat exchanger 50 .
  • a change in the graph from point c to point d indicates the change in refrigerant when it passes through the expansion device 3 .
  • the change in the graph from point d to point e shows the change in refrigerant when passing through the second heat exchanger 4 acting as an evaporator.
  • the high-temperature and high-pressure gas refrigerant discharged by the compressor 1 is heat-exchanged by the first heat exchanger 2 to convert the high-temperature and high-pressure liquid refrigerant. change to Furthermore, as shown in the graph from point b to point c, the high-temperature, high-pressure liquid refrigerant that has flowed out of the first heat exchanger 2 undergoes further heat exchange by the third heat exchanger 50 .
  • the third heat exchanger is used instead of performing heat exchange with the high-pressure side refrigerant only by the first heat exchanger 2 without providing the third heat exchanger 50.
  • the enthalpy of the refrigerant on the outflow side (point b) of the first heat exchanger 2 can be increased by exchanging heat with the refrigerant on the high pressure side by means of 50 as well.
  • the refrigerant flowing through the first heat exchanger 2 changes state in the order of gas phase, gas-liquid two-phase, and liquid phase, and the electric heating performance is highest when the refrigerant is in the gas-liquid two-phase state.
  • the refrigeration cycle device 17 increases the enthalpy of the refrigerant on the outflow side (point b) of the first heat exchanger 2, thereby increasing the ratio of the liquid single phase in the refrigerant flowing through the first heat exchanger 2 to can be made smaller. Thereby, the refrigerating cycle device 17 can improve the electric heat performance of the refrigerant in the first heat exchanger 2 and reduce the pressure of the refrigerant on the high pressure side.
  • the refrigeration cycle device 17 exchanges heat with the refrigerant not only by the first heat exchanger 2 but also by the third heat exchanger 50, the first heat exchanger does not need to be provided with the third heat exchanger 50.
  • the amount of heat exchanged with the refrigerant in the first heat exchanger 2 can be made smaller than when heat is exchanged with the refrigerant only by 2, and the pressure on the high pressure side of the refrigerant can be reduced.
  • Embodiment 8 A refrigeration cycle apparatus 18 according to Embodiment 8 will be described with reference to FIGS. 13 and 14. FIG. Only parts of the refrigerating cycle device 18 that differ from the refrigerating cycle device 17 according to the seventh embodiment will be described below.
  • FIG. 13 is a diagram showing the configuration of a refrigeration cycle device 18 according to Embodiment 8. As shown in FIG. As shown in FIG. 13, the refrigeration cycle device 18 further includes a fourth heat exchanger 60, a pipe 74a, and a pipe 74b.
  • the fourth heat exchanger 60 is provided between the second heat exchanger 4 and the compressor 1.
  • the fourth heat exchanger 60 has ports 61 to 64 . Inside the fourth heat exchanger 60 , the port 61 is connected to the port 62 but not connected to each of the other ports 63 and 64 .
  • Port 62 is connected to port 61 and is not connected to each of the other ports 63 and 64 .
  • Port 63 is connected to port 64 and is not connected to each of the other ports 61 and 62 .
  • Port 64 is connected to port 63 and is not connected to each of the other ports 61 and 62 .
  • a port 61 of the fourth heat exchanger 60 is connected to the outside by a pipe 82 .
  • a port 62 of the fourth heat exchanger 60 and the cooling section 5 are connected by a pipe 77 .
  • the port 63 of the fourth heat exchanger 60 and the second heat exchanger 4 are connected by a pipe 74a.
  • the port 64 of the fourth heat exchanger 60 and the suction port 1a of the compressor 1 are connected by a pipe 74b.
  • the refrigerant that has flowed out of the second heat exchanger 4 that functions as an evaporator during cooling operation flows into the port 63 of the fourth heat exchanger 60 and flows into the fourth heat exchanger. It passes through the interior of 60 and out port 64 before flowing to compressor 1 .
  • the heat-exchanged condensed water that has flowed out of the cooling unit 5 flows into the port 62 of the fourth heat exchanger 60 and passes through the inside of the fourth heat exchanger 60 .
  • heat exchange takes place between the refrigerant from the second heat exchanger 4 and the condensed water from the cooling section 5 .
  • the condensed water heat-exchanged in the fourth heat exchanger 60 flows out from the port 61 to the outside.
  • the refrigeration cycle device 18 can perform heat exchange of the refrigerant flowing out of the second heat exchanger 4 using the heat-exchanged condensed water flowing out of the cooling unit 5 .
  • FIG. 14 is a ph diagram of the refrigerating cycle C2 in the refrigerating cycle device 18 according to the eighth embodiment.
  • the vertical axis represents the absolute pressure p
  • the horizontal axis represents the specific enthalpy h.
  • Each of points a to f shown in FIG. 14 corresponds to each of points a to f shown in FIG.
  • a point a indicates a position between the discharge port 1 b of the compressor 1 and the first heat exchanger 2 .
  • Point b indicates the position between the first heat exchanger 2 and the port 51 of the third heat exchanger 50 .
  • Point c indicates the position between port 52 of third heat exchanger 50 and expansion device 3 .
  • Point d indicates the position between expansion device 3 and second heat exchanger 4 .
  • Point e indicates the position between the port 63 of the second heat exchanger 4 and the fourth heat exchanger 60 .
  • a point f indicates the position between the port 64 of the fourth heat exchanger 60 and the suction port 1a of the compressor 1 .
  • the change in the graph from point e to point a indicates the change in the refrigerant when it passes through the compressor 1.
  • the change in the graph from point a to point b shows the change in refrigerant when passing through the first heat exchanger 2 acting as a condenser.
  • Changes in the graph from point b to point c show changes in the refrigerant when passing through the third heat exchanger 50 .
  • a change in the graph from point c to point d indicates the change in refrigerant when it passes through the expansion device 3 .
  • the change in the graph from point d to point e shows the change in refrigerant when passing through the second heat exchanger 4 acting as an evaporator.
  • a change in the graph from point e to point f indicates a change in refrigerant when passing through the fourth heat exchanger 60 .
  • the low-temperature, low-pressure gas-liquid two-phase refrigerant flowing out of the expansion device 3 is heat-exchanged by the second heat exchanger 4 .
  • the low-temperature, low-pressure gas-liquid two-phase refrigerant flowing out of the second heat exchanger 4 is further heat-exchanged by the fourth heat exchanger 60.
  • the refrigerant changes to a low-temperature, low-pressure gas refrigerant.
  • the fourth heat exchanger in addition to the second heat exchanger 4 60 also makes it easier for the refrigerant on the outflow side (point e) of the second heat exchanger 4 to be in a gas-liquid two-phase state when heat is exchanged with the refrigerant on the low-pressure side.
  • the electric heating performance is higher when the refrigerant is in the gas-liquid two-phase state than in the gas phase state.
  • the refrigeration cycle device 18 changes the refrigerant on the outflow side (point e) of the second heat exchanger 4 to a gas-liquid two-phase state, thereby improving the electrothermal performance of the refrigerant in the second heat exchanger 4.
  • the pressure of the refrigerant on the low pressure side can be increased.
  • a refrigeration cycle apparatus 11 includes a compressor 1, a first heat exchanger 2, an expansion device 3, and a second heat exchanger 4, and is configured to circulate refrigerant.
  • a control device 100 that is formed on a substrate 100a and controls the refrigerant circuit 20, a cooling unit 5 that cools the substrate 100a, a first heat exchanger 2 and a second heat exchanger 4 Among them, a storage part 9 for storing water condensed on the surface of a heat exchanger (second heat exchanger 4) that functions as an evaporator, and a first and a pump 7 .
  • the refrigerating cycle device 11 supplies the condensed water generated from the second heat exchanger 4 to the cooling unit 5 by the first pump 7, and thus the substrate 100a on which the control device 100 is formed. can be cooled. This eliminates the need to install a heat sink on the substrate 100a. Furthermore, since the refrigerating cycle device 11 does not cool the substrate 100a with the refrigerant circulating in the refrigerant circuit 20, there is no risk of deterioration in the performance of the refrigerating cycle. Therefore, the refrigerating cycle device 11 can dissipate heat from the control device 100 without deteriorating the reliability of the control device 100 and the refrigerating cycle device 11 as a whole.
  • the refrigerating cycle apparatus 11 supplies the condensed water generated from the second heat exchanger 4 to the cooling unit 5 by the first pump 7, a sufficient amount of condensed water necessary for cooling the substrate 100a is supplied. It can be supplied to the cooling unit 5 .
  • the refrigeration cycle apparatus 12 further includes a first temperature sensor 111 that measures the temperature of the substrate 100a.
  • the first pump 7 increases the amount of condensed water supplied to the cooling unit 5 when the measured value T1 of the first temperature sensor 111 is greater than or equal to the first reference value.
  • the refrigeration cycle device 12 can adjust the temperature of the substrate 100a so that the temperature of the substrate 100a is less than the first reference value.
  • the refrigeration cycle device 13 according to Embodiment 3 further includes a four-way valve 30.
  • the four-way valve 30 has a first state in which the suction port 1a of the compressor 1 communicates with the second heat exchanger 4 and a discharge port 1b of the compressor 1 communicates with the first heat exchanger 2;
  • the internal communication state is switched between a second state in which the port 1 a communicates with the first heat exchanger 2 and the discharge port 1 b of the compressor 1 communicates with the second heat exchanger 4 .
  • the communication state is the first state, the first heat exchanger 2 works as a condenser and the second heat exchanger 4 works as an evaporator.
  • the storage unit 9 includes a first storage unit 91 that stores water condensed on the surface of the first heat exchanger 2 and a second storage unit 92 that stores water condensed on the surface of the second heat exchanger 4. .
  • the first pump 7 supplies the condensed water stored in the second reservoir 92 to the cooling unit 5 when the communication state is the first state, and the first reservoir 91 when the communication state is the second state. to the cooling unit 5.
  • the refrigeration cycle device 13 can perform a cooling operation in which the communication state inside the four-way valve 30 is the first state, and a heating operation in which the communication state inside the four-way valve 30 is the second state.
  • the substrate 100a on which the control device 100 is formed can be cooled by supplying the cooling unit 5 with condensed water produced by the heat exchanger that functions as an evaporator.
  • the refrigeration cycle device 13 can radiate heat from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 13 as a whole in both the cooling operation and the heating operation.
  • the refrigeration cycle apparatus 14 further includes a first temperature sensor 111 that measures the temperature of the substrate 100a.
  • the reservoir 9 includes a drain pan 93 and a tank 94 that stores dew condensation water flowing out of the drain pan 93 .
  • the first pump 7 supplies the condensed water stored in the tank 94 to the cooling unit 5 when the measured value T1 of the first temperature sensor 111 is greater than or equal to the first reference value.
  • the refrigeration cycle device 14 can adjust the temperature of the substrate 100a so that the temperature of the substrate 100a is less than the first reference value.
  • the refrigerating cycle apparatus 14 cools the substrate 100a using the condensed water stored in the tank 94 even during operation in which the second heat exchanger 4 is unlikely to generate the condensed water necessary for cooling the substrate 100a. Since it can be cooled, heat can be dissipated from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 11 as a whole as much as possible.
  • the refrigeration cycle device 15 according to Embodiment 5 further includes a second pump 8 that resupplies the condensed water that has flowed out of the cooling section 5 to the cooling section 5 .
  • the refrigerating cycle device 15 efficiently cools the substrate 100a even during operation in which the second heat exchanger 4 is unlikely to generate condensed water necessary for cooling the substrate 100a. Therefore, heat can be dissipated from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 15 as a whole.
  • the refrigeration cycle device 16 further includes a second temperature sensor 112 that measures the temperature of the condensed water flowing out from the cooling section 5.
  • a second temperature sensor 112 that measures the temperature of the condensed water flowing out from the cooling section 5.
  • the measured value T2 of the second temperature sensor 112 is equal to or greater than the second reference value
  • the amount of condensed water supplied to the cooling unit 5 by the first pump 7 is equal to the amount of condensed water supplied to the cooling unit 5 by the second pump 8. larger than quantity.
  • the measured value T2 of the second temperature sensor 112 is less than the second reference value
  • the amount of condensed water supplied to the cooling unit 5 by the second pump 8 is equal to the amount of condensed water supplied to the cooling unit 5 by the first pump 7. larger than quantity.
  • the refrigerating cycle device 16 allows sufficient heat exchange between the cooling unit 5 and the substrate 100a to reduce the temperature difference between the condensed water supplied to the cooling unit 5 and the substrate 100a.
  • the temperature difference can be kept as is done.
  • the refrigeration cycle device 16 can dissipate heat from the control device 100 without reducing the reliability of the control device 100 and the refrigeration cycle device 16 as a whole as much as possible.
  • the refrigeration cycle device 17 exchanges heat between the refrigerant flowing out of the first heat exchanger 2 and the condensed water stored in the reservoir 9.
  • a third heat exchanger 50 is further provided.
  • the first pump 7 supplies the condensed water heat-exchanged by the third heat exchanger 50 to the cooling unit 5 .
  • the refrigeration cycle device 17 can prevent condensation from occurring on the substrate 100 a and the pipe 76 due to the temperature of the condensed water supplied to the cooling section 5 .
  • the refrigeration cycle device 17 can improve the electric heat performance of the refrigerant in the first heat exchanger 2 and reduce the pressure of the refrigerant on the high pressure side.
  • the refrigeration cycle device 17 reduces the amount of heat exchanged with the refrigerant in the first heat exchanger 2 rather than performing heat exchange with the refrigerant only by the first heat exchanger 2 without providing the third heat exchanger 50. It is possible to reduce the pressure on the high pressure side of the refrigerant.
  • the refrigeration cycle apparatus 18 according to Embodiment 8 exchanges heat between the refrigerant flowing out of the second heat exchanger 4 and the condensed water flowing out of the cooling unit 5.
  • 4 heat exchanger 60 is further provided.
  • the refrigeration cycle device 18 can improve the electric heat performance of the refrigerant in the second heat exchanger 4 and increase the pressure of the refrigerant on the low pressure side.
  • the refrigeration cycle device may also be used in an air conditioner or the like.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

L'invention concerne un dispositif à cycle de réfrigération (11) comprenant : un circuit de fluide frigorigène (20) qui est équipé d'un compresseur (1), d'un premier échangeur de chaleur (2), un dispositif d'expansion (3), et un second échangeur de chaleur (4), et conçu de façon à faire circuler un fluide frigorigène ; un dispositif de commande (100) qui est formé sur un substrat (100a) et commande le circuit de fluide frigorigène ; une unité de refroidissement (5) qui refroidit le substrat ; une unité de stockage (9) qui stocke l'eau qui se condense sur la surface de l'échangeur de chaleur (4) qui agit comme un évaporateur parmi le premier échangeur de chaleur et le second échangeur de chaleur ; et une première pompe (7) qui fournit l'eau stockée dans l'unité de stockage à l'unité de refroidissement.
PCT/JP2021/020447 2021-05-28 2021-05-28 Dispositif à cycle de réfrigération WO2022249452A1 (fr)

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JP2023523911A JP7479569B2 (ja) 2021-05-28 2021-05-28 冷凍サイクル装置
PCT/JP2021/020447 WO2022249452A1 (fr) 2021-05-28 2021-05-28 Dispositif à cycle de réfrigération

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4874251U (fr) * 1971-12-15 1973-09-14
JPS6146378U (ja) * 1984-08-30 1986-03-27 株式会社東芝 空気調和機
JPH0546511U (ja) * 1991-11-27 1993-06-22 株式会社日立製作所 凝縮器
JP2009292318A (ja) * 2008-06-05 2009-12-17 Sanden Corp 熱交換装置
JP2013541466A (ja) * 2010-11-10 2013-11-14 ルノー・トラックス 自動車の車室用空気調和システム
WO2018047540A1 (fr) * 2016-09-09 2018-03-15 株式会社デンソー Appareil de réglage de température de dispositif
WO2019008667A1 (fr) * 2017-07-04 2019-01-10 三菱電機株式会社 Unité d'échange de chaleur et dispositif de climatisation
WO2020059418A1 (fr) * 2018-09-21 2020-03-26 サンデンホールディングス株式会社 Circuit de réfrigération

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4874251U (fr) * 1971-12-15 1973-09-14
JPS6146378U (ja) * 1984-08-30 1986-03-27 株式会社東芝 空気調和機
JPH0546511U (ja) * 1991-11-27 1993-06-22 株式会社日立製作所 凝縮器
JP2009292318A (ja) * 2008-06-05 2009-12-17 Sanden Corp 熱交換装置
JP2013541466A (ja) * 2010-11-10 2013-11-14 ルノー・トラックス 自動車の車室用空気調和システム
WO2018047540A1 (fr) * 2016-09-09 2018-03-15 株式会社デンソー Appareil de réglage de température de dispositif
WO2019008667A1 (fr) * 2017-07-04 2019-01-10 三菱電機株式会社 Unité d'échange de chaleur et dispositif de climatisation
WO2020059418A1 (fr) * 2018-09-21 2020-03-26 サンデンホールディングス株式会社 Circuit de réfrigération

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