WO2022242284A1 - 焊点寿命测试装置以及焊点寿命的预测方法 - Google Patents

焊点寿命测试装置以及焊点寿命的预测方法 Download PDF

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Publication number
WO2022242284A1
WO2022242284A1 PCT/CN2022/081176 CN2022081176W WO2022242284A1 WO 2022242284 A1 WO2022242284 A1 WO 2022242284A1 CN 2022081176 W CN2022081176 W CN 2022081176W WO 2022242284 A1 WO2022242284 A1 WO 2022242284A1
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WIPO (PCT)
Prior art keywords
solder joint
layer
unit
lead screw
piece
Prior art date
Application number
PCT/CN2022/081176
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English (en)
French (fr)
Inventor
谢朝阳
朱朝飞
王凤伟
程毅辉
王彬开
王小林
Original Assignee
中兴通讯股份有限公司
陕西科技大学
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Application filed by 中兴通讯股份有限公司, 陕西科技大学 filed Critical 中兴通讯股份有限公司
Publication of WO2022242284A1 publication Critical patent/WO2022242284A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/32—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
    • G01N3/38—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces generated by electromagnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0001—Type of application of the stress
    • G01N2203/001—Impulsive
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/005—Electromagnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0296—Welds

Definitions

  • the present application relates to the technical field of testing, for example, to a solder joint life testing device and a solder joint life prediction method.
  • the surface mount process is usually used to fix the two device layers together through the solder joint layer.
  • the solder joint layer in the actual working condition will generate cracks with a preset length inside and then fatigue fracture, resulting in the failure of the solder joint, so that it cannot play the role of fixing the device layer.
  • the life test of the solder joint layer can apply a periodically changing mechanical load or thermal load to the solder joint layer, so that the solder joint layer will generate internal stress under the action of mechanical load or thermal load, and then generate a crack with a preset length, resulting in a solder joint layer.
  • the point layer fails due to fatigue fracture.
  • the number of mechanical loads or thermal loads applied to the solder joint layer can be used to evaluate the life of the solder joint layer.
  • the present application proposes a solder joint life testing device and a solder joint life prediction method, aiming at improving the speed and accuracy of the solder joint life test.
  • the present application provides a solder joint life testing device, the solder joint life testing device includes: a frame, a supporting structure and a driving structure, the supporting structure is set to support the object to be tested, wherein the first surface of the object to be tested fixed on the surface of the support structure, the second surface of the test piece opposite to the first surface is connected to the frame, and the test piece includes a first device layer, a second device layer and solder joints layer, the pad layer is located between the first device layer and the second device layer, and is configured to fix the first device layer and the second device layer; the driving structure is located in the support structure A side away from the test piece and connected to the frame, the driving structure is connected to the supporting structure, the driving structure is configured to provide a pulling force acting on the supporting structure, wherein the pulling force The value changes periodically within a preset value range.
  • the application also provides a method for predicting the lifetime of solder joints, the method comprising:
  • the solder joint life test device is the above solder joint life test device
  • the theoretical maximum tensile stress is the maximum tensile stress corresponding to the failure of the solder joint layer of the standard test piece under static load
  • the preset parameters include at least one of the torque, the preset maximum tensile stress and the preset minimum tensile stress when the test piece is deformed by a preset tensile force, wherein the preset minimum tensile stress is less than the preset
  • the preset maximum tensile stress, the preset maximum tensile stress is less than the theoretical maximum tensile stress, and the structure, size and manufacturing process of the standard test piece and the test piece are the same.
  • FIG. 1 is a schematic structural view of a solder joint life testing device provided in an embodiment of the present application
  • FIG. 2 is a schematic structural view of another solder joint life testing device provided in the embodiment of the present application.
  • Fig. 3 is a schematic cross-sectional structure diagram of a structure corresponding to region S1 in Fig. 2;
  • Fig. 4 is a schematic cross-sectional structure diagram of a structure corresponding to region S2 in Fig. 2;
  • FIG. 5 is a flow chart of a method for predicting the life of a solder joint provided in an embodiment of the present application
  • FIG. 6 is a flow chart of another method for predicting the life of a solder joint provided by an embodiment of the present application.
  • the solder joint layer will generate stress inside it under the action of the thermal load, and then generate a crack with a preset length, which will cause fatigue of the solder joint layer break and fail.
  • the number of thermal loads applied to the solder joint layer can be used to evaluate the life of the solder joint.
  • the device needs to periodically heat up or cool down the device formed by the surface mount process, so that the printed circuit board and electronic components in the device are cyclically warped and deformed, and the internal stress of the solder joint layer is generated under the action of thermal load. The length of the crack is set, which leads to fatigue fracture of the solder joint layer and failure.
  • the test period of the device is long and the cost is high, and when the solder joint life test is implemented by applying periodic thermal loads to the solder joint layer, creep cracks will appear inside the solder joint layer due to periodic changes in temperature, and the final solder joint
  • the cracks of the preset length generated by the layer come from creep cracks due to periodic changes in temperature and cracks caused by cyclic warping deformation of printed circuit boards and electronic components in the device. Therefore, the life of the solder joint layer tested by this device is consistent with the actual The life of the solder joint layer does not match, resulting in low test speed and accuracy.
  • the embodiments of the present application provide the following technical solutions, aiming to realize a solder joint life testing device with high accuracy.
  • FIG. 1 is a schematic structural diagram of a solder joint life testing device provided in an embodiment of the present application. Wherein, FIG. 1 a only shows a structural schematic diagram of the driving structure 40 , the supporting structure 10 and the object to be tested 20 .
  • Figure 1b shows a schematic diagram of the overall structure of the solder joint life testing device. Referring to Fig.
  • this solder joint life testing device comprises: frame 30, supporting structure 10 and driving structure 40, and supporting structure 10 is arranged to support to-be-tested piece 20, and wherein, the first surface of to-be-tested piece 20 is fixed on the support structure 10 surface, the second surface opposite to the first surface of the object to be tested 20 is connected to the frame 30, the object to be tested 20 includes a first device layer 21, a second device layer 22 and a solder joint layer 23, and the solder joint layer 23 is located at the first Between the device layer 21 and the second device layer 22, it is arranged to fix the first device layer 21 and the second device layer 22; the driving structure 40 is located on the side of the support structure 10 away from the DUT 20 and is connected to the frame 30, and the driving structure 40 is connected to the supporting structure 10, and the driving structure 40 is configured to provide a pulling force F1 acting on the supporting structure 10, wherein the value of the pulling force F1 changes periodically within a preset value range.
  • the process that the first device layer 21 and the second device layer 22 are fixedly connected together through the solder joint layer 23 to form an electronic device is called a surface mount process.
  • the first device layer 21 can be a chip layer or a printed circuit board.
  • the second device layer 22 may be a chip layer or a printed circuit board.
  • Chips in the chip layer of the test piece 20 in this embodiment include but are not limited to ball contact array (Ball Grid Array, BGA) surface mount package and square flat no-lead package (Quad Flat No-leads Package, QFN ).
  • the chip is BGA surface mount package and the size of the solder joints of the solder joint layer 23 in the QFN to-be-tested piece 20 is small, making it difficult to manufacture, and the difficulty of life testing also increases accordingly.
  • the driving structure 40 is directly used to apply a pulling force F1 to the test piece 20, wherein the value of the pulling force F1 changes periodically within a preset value range, because the size of the electronic device is relatively small, the distance between the driving structure 40 and the test piece 20 Junction points are difficult to set up.
  • the support structure 10 between the test piece 20 and the driving structure 40 is provided to support the test piece 20, and the driving structure 40 provides a pulling force F1 acting on the support structure 10, because the test piece 20
  • the first surface of the support structure 10 is fixed on the surface of the support structure 10, the support structure 10 is set to support the test piece 20, the tension F1 can act on the test piece 20 through the support structure 10, because the value of the tension F1 is periodically within the preset value range Therefore, it is equivalent to that the driving structure 40 applies a periodically changing mechanical load on the test piece 20 through the support structure 10, and the solder joint layer 23 generates stress inside the solder joint of the solder joint layer 23 under the action of the tension F1.
  • the solder joint layer 23 fails due to fatigue fracture, that is, the second device layer 22 is separated from the first device layer 21 .
  • the number of times the pulling force F1 is applied to the solder joint layer 23 can be used to evaluate the lifetime of the solder joints of the solder joint layer 23 .
  • the driving structure 40 is configured to provide a pulling force F1 acting on the support structure 10, and the value of F1 changes periodically within a preset value range.
  • the value of the pulling force F1 changes according to the following rule: f1, f2, f1, f2 , f1, f2, f1, f2.
  • the value of f1 is equal to 0, or a value close to 0, and the value of f2 is smaller than the theoretical maximum tensile force of the solder joint layer 23 .
  • the value of f1 is close to 0, it can be approximated as 0.
  • the lifetime of the pad layer 23 is 4 times. Under the action of the theoretical maximum tensile force, the solder joint layer 23 will break under the static load, resulting in failure.
  • the support structure 10 is located between the test piece 20 and the driving structure 40, and is set to support the test piece 20, and the driving structure 40 acts on the test piece 20 through the support structure 10 with the pulling force F1, because
  • the value of the tension F1 changes periodically within the preset value range, so it is equivalent to the driving structure 40 applying a periodically changing mechanical load on the test piece 20 through the support structure 10, and the solder joint layer 23 under the action of the tension F1, Stress is generated inside the solder joints of the solder joint layer 23, and then cracks appear.
  • the solder joint layer 23 fails due to fatigue fracture, that is, the second device layer 22 is separated from the first device layer 21. .
  • the device realizes a life testing device for the solder joint layer 23 of the smaller size test piece 20 by counting the number of times of the pulling force F1 applied by the driving structure 40 to the solder joint layer 23 as the life test result of the solder joint layer 23 .
  • the cracks of the preset length produced by the final solder joint layer 23 originate from the cracks generated by the internal deformation of the solder joint due to the periodically changing mechanical load.
  • the device for testing the life of solder joints avoids the fact that the cracks of the preset length generated by the final solder joint layer 23 are caused by creep cracks due to periodic changes in temperature.
  • the technical solution of this embodiment improves the life of the solder joints. The accuracy shortens the test cycle and reduces the test cost.
  • FIG. 2 is a schematic structural diagram of another solder joint life testing device provided in an embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional structure diagram of the structure corresponding to the region S1 in FIG. 2 , wherein FIG. 3 b is a schematic structural diagram of the object to be tested 20 in FIG. 3 a .
  • FIG. 4 is a schematic cross-sectional structure diagram of the structure corresponding to the region S2 in FIG. 2 .
  • the supporting structure 10 in the solder joint life testing device includes a magnetic force adsorption unit 11; the first surface of the test piece 20 is provided with a magnetic permeable layer 20A; 11 is located on the surface of the magnetic permeable layer 20A away from the test piece 20 , and the magnetic adsorption unit 11 is connected to the magnetic permeable layer 20A.
  • the magnetically permeable layer 20A is made of magnetically permeable materials, which may include, but not limited to, metallic iron and low carbon steel.
  • the magnetic attraction unit 11 and the magnetic permeable layer 20A are attracted together by magnetic force.
  • the magnetic permeable layer 20A and the first surface of the test piece 20 can be fixedly connected by an adhesive layer.
  • the magnetic adsorption unit 11 and the magnetic permeable layer 20A can be magnetically adsorbed together, so as to realize the support function of the magnetic adsorption unit 11 for the object 20 to be tested.
  • the magnetic adsorption unit 11 and the test piece 20 are magnetically adsorbed together, which simplifies the component arrangement of the support structure 10 and the assembly process of the support structure 10 compared with the mechanical fixation method.
  • the pulling force F1 of the driving structure 40 acts on the test piece 20 through the magnetic force adsorption unit 11. In order to ensure the high stability of the connection between the magnetic force absorption unit 11 and the test piece 20, it is possible to increase the magnetic force absorption unit 11 for the magnetic conduction.
  • the magnetic force of layer 20A is realized.
  • the magnetic attraction unit 11 includes a magnetic material layer 110 and a magnetic yoke layer 111 that are stacked.
  • the setting of the yoke layer 111 can bind the magnetic induction lines of the magnetic material layer 110 in the magnetic material layer 110, so as to increase the magnetic force of the magnetic adsorption unit 11 for the magnetic permeable layer 20A, and ensure the connection between the magnetic adsorption unit 11 and the test piece 20
  • the method has high stability, thereby improving the stability of the solder joint life test device.
  • the magnetic material layer 110 may include but not limited to a permanent magnet material, and the yoke layer 111 may include a magnetically permeable material.
  • the second surface of the test piece 20 is sequentially provided with a first fixed layer 20B1 and a second fixed layer 20B2, and the area of the second fixed layer 20B2 is larger than that of the first fixed layer.
  • the area of the layer 20B1, the frame 30 is provided with the placement groove 30A of the piece to be tested 20, and the first fixed layer 20B1 and the second fixed layer 20B2 are fixed in the placement groove 30A of the frame 30 to realize the fixed connection of the piece to be tested 20 and the frame 30 .
  • the first fixing layer 20B1 can be fixedly connected to the test piece 20 through an adhesive layer.
  • the first pinned layer 20B1 and the second pinned layer 20B2 may include but not limited to magnetically permeable materials.
  • the magnetic adsorption unit 11 can increase the magnetic force of the test piece 20 Fixing strength with the first fixing layer 20B1 and the second fixing layer 20B2.
  • the support structure 10 can be fixed on the frame 30 through at least one guide column 50 to improve the stability of the support structure 10 .
  • the drive structure 40 includes a power unit 41 and a transmission unit 42; the power unit 41 includes a rotary output shaft 41A, and the rotary output shaft 41A of the power unit 41 is set to rotate clockwise or counterclockwise
  • the first connecting end of the transmission unit 42 is connected with the rotating output shaft 41A of the power unit 41, the second connecting end of the transmission unit 42 is connected with the supporting structure 10, and the second connecting end of the transmission unit 42 is arranged to be relative to the object to be tested 20 in Make a linear movement in a direction perpendicular to the test piece 20 to provide a pulling force F1 acting on the support structure 10 .
  • the transmission unit 42 converts the rotation of the rotary output shaft 41A of the power unit 41 into a linear motion of the transmission unit 42 relative to the test piece 20 in a direction perpendicular to the test piece 20, thereby realizing the second connection end of the transmission unit 42 to provide
  • the tension F1 acting on the support structure 10 wherein the tension F1 can act on the test piece 20 through the support structure 10, since the value of the tension F1 changes periodically within the preset value range, it is equivalent to the driving structure 40 passing through the support
  • the structure 10 applies the fatigue load on the test piece 20, and the solder joint layer 23 is under the action of the tension F1, and the solder joint of the solder joint layer 23 generates stress inside the solder joint, and then cracks appear.
  • the solder joint layer 23 fails due to fatigue fracture.
  • the number of times the pulling force F1 is applied to the solder joint layer 23 can be used to evaluate the lifetime of the solder joints of the solder joint layer 23 .
  • the transmission unit 42 makes a linear motion away from the test piece 20 relative to the test piece 20 in a direction perpendicular to the test piece 20, so as to realize the transmission unit 42
  • the second connection end provides the tension F1 acting on the supporting structure 10 .
  • the more clockwise rotations of the rotating output shaft 41A of the power unit 41 the greater the value of the pulling force F1 acting on the support structure 10 provided by the second connection end of the transmission unit 42 .
  • the value of the pulling force F1 provided by the second connection end of the transmission unit 42 acting on the support structure 10 can be reduced by rotating the output shaft 41A of the power unit 41 counterclockwise, and the output shaft 41A of the power unit 41 rotates counterclockwise. The larger the number of turns, the smaller the value of the pulling force F1 acting on the support structure 10 provided by the second connection end of the transmission unit 42 .
  • the transmission unit 42 when the rotary output shaft 41A of the power unit 41 can be set to rotate counterclockwise, the transmission unit 42 will move away from the test piece 20 in a direction perpendicular to the test piece 20 relative to the test piece 20, so as to realize the transmission unit.
  • the second connection end of 42 provides the pulling force F1 acting on the support structure 10 .
  • the more the rotation output shaft 41A of the power unit 41 rotates counterclockwise the greater the tension F1 provided by the second connection end of the transmission unit 42 acts on the support structure 10 .
  • the value of the pulling force F1 provided by the second connection end of the transmission unit 42 acting on the support structure 10 can be reduced by rotating the output shaft 41A of the power unit 41 clockwise, and the output shaft 41A of the power unit 41 rotates clockwise
  • a positioning hole can be provided on the frame 30 , one end of the fixing assembly 51 is located in the positioning hole, and the other end is located in the power unit 41 , and the power unit 41 and the frame 30 are fixed together through the fixing assembly 51 .
  • the fixing component 51 may include bolts or screws.
  • the power unit 41 includes a motor, and the first connection end of the transmission unit 42 is sleeved on the rotation output shaft of the motor.
  • a motor as the power unit 41 can precisely control the direction of rotation and the number of rotations of the output shaft of the motor at the control end of the motor, so as to accurately control the pulling force acting on the support structure 10 provided by the second connection end of the transmission unit 42
  • the value of F1 the direction of rotation and the number of turns of the motor can be recorded by the controller of the motor, so as to determine the lifespan of the solder joint layer 23 in the test piece 20 according to the direction of rotation of the motor and the number of turns. Therefore, the above technical proposal improves the accuracy and automatic control degree of the solder joint life testing device.
  • the transmission unit 42 includes a rotating subunit 420 and a linear subunit 421; the rotating subunit 420 includes a driving wheel 420A and at least one driven wheel 420B, and the driving wheel 420A is sleeved on On the rotation output shaft 41A of the power unit 41, the rotation output shaft 41A of the power unit 41 is set to drive the driving wheel 420A to make rotational movement; the driven wheel 420B is connected to the driving wheel 420A in rotation, and the driving wheel 420A is set to drive the driven wheel 420B to rotate;
  • the subunit 421 includes a lead screw 421A and a nut 421B.
  • the nut 421B is located in a positioning hole inside a driven wheel 420B.
  • the lead screw 421A and the nut 421B are screwed together.
  • the lead screw 421A can rotate relative to the nut 421B, and the lead screw 421A can relatively
  • the nut 421B moves linearly, the first end of the lead screw 421A is connected to the support structure 10 , and the lead screw 421A is arranged perpendicular to the object 20 to be tested.
  • the figure of this embodiment only shows one driven wheel 420B as an example, and this embodiment does not limit the number of driven wheels 420B.
  • the diameter of the driven wheel 420B is larger than that of the driving wheel 420A, and the relationship between the diameters of the driven wheel 420B and the driving wheel 420A is not limited here.
  • the driving wheel 420A is sleeved on the rotation output shaft 41A of the power unit 41 , and the rotation output shaft 41A of the power unit 41 drives the driving wheel 420A to rotate.
  • the driven wheel 420B is rotationally connected to the driving wheel 420A, and the driving wheel 420A drives the driven wheel 420B to rotate.
  • the lead screw 421A and the nut 421B in the linear sub-unit 421 are threadedly connected. While the lead screw 421A and the nut 421B can rotate relative to each other, the lead screw 421A can move linearly relative to the nut 421B.
  • the nut 421B Since the nut 421B is located in a positioning hole inside a driven wheel 420B, the nut 421B and the driven wheel 420B rotate synchronously, and the lead screw 421A can move linearly relative to the nut 421B and the driven wheel 420B.
  • the lead screw 421A is arranged perpendicular to the object to be tested 20, since the first end of the lead screw 421A is connected with the support structure 10, when the lead screw 421A moves linearly relative to the nut 421B and the driven wheel 420B, it can control the rotation of the power unit 41
  • the rotation direction of the output shaft 41A enables the lead screw 421A to move linearly away from the test piece 20 relative to the test piece 20 , and realizes that the lead screw 421A applies the pulling force F1 to the test piece 20 through the support structure 10 .
  • the tensile force F1 whose value changes periodically within the preset value range acts on the test piece 20 through the support structure 10, and then the welding point of the lead screw 421A is determined by the number of rotations and the rotation direction of the rotation output shaft 41A of the power unit 41
  • the number of times of the pulling force F1 applied by the layer 23 is used as the life test result of the solder joint layer 23 , realizing a life test device for the solder joint layer 23 of the smaller-sized test piece 20 .
  • the transmission unit 42 also includes an elastic module 422, the first end of the elastic module 422 is connected with the first end of the lead screw 421A, and the second end of the elastic module 422 is connected with the support Structure 10 connected.
  • the elastic module 422 can reciprocate relative to the equilibrium position, the pulling force F1 provided by the lead screw 421A acts on the elastic module 422, the second end of the elastic module 422 is connected with the support structure 10, and the driving structure 40 is stretched by stretching the elastic module.
  • the elastic module 422 deviates from the equilibrium position under the action of the tension F1 and is in a stretched state, so that the lead screw 421A acts on the support structure 10 through the tension F1 through the elastic module 422 .
  • the value of the tension F1 increases as the distance from the elastic module 422 away from the equilibrium position increases. Therefore, the elastic module 422 can be used as a buffer structure to realize that the tension F1 provided by the screw 421A acts slowly on the support structure 10.
  • the effect is to prevent the lead screw 421A from directly acting on the support structure 10 with the pulling force F1, causing the solder joint layer 23 to fail due to cracks, thereby preventing the static load from causing failure to the solder joint layer 23, so as to improve the accuracy of the solder joint life test device.
  • the elastic module 422 includes at least one elastic unit 422A and a first connecting component 422B, the first connecting component 422B is connected to the first end of the lead screw 421A, and the first connecting component 422B is set There is at least one first hanging post 4220, the first end of the elastic unit 422A is connected to the first hanging post 4220, the support structure 10 is provided with at least one second hanging post 100, the second end of the elastic unit 422A is connected to the second hanging post 100 connect.
  • the elastic unit 422A can be realized by choosing an inexpensive spring, so as to reduce the cost of the life testing device.
  • a tension sensor can also be set to detect the tension value of the spring.
  • the numerical relationship between the stretching length and the tension of the spring can be obtained through the tension sensor, and the corresponding relationship between the tension of the spring and the number of turns of the motor can be determined through multiple tests, so as to accurately obtain the action on the support structure 10 through the number of turns of the motor.
  • the initial position where the elastic unit 422A is in a balanced state can be determined by adjusting the connection position between the first connection component 422B and the first end of the lead screw 421A. Through the positional relationship between the first hanging column 4220 and the second hanging column 100, the positional relationship of the elastic unit 422A can be adjusted. When the elastic unit 422A is arranged perpendicular to the test piece 20, it can be ensured that the lead screw 421A will be perpendicular to the test piece 20 The tension F1 acts on the support structure 10 through the elastic unit 422A.
  • the elastic unit 422A can realize the effect that the pulling force F1 provided by the lead screw 421A acts slowly on the support structure 10, avoiding the effect of the lead screw 421A.
  • the tensile force F1 is directly applied to the support structure 10 to cause cracks in the solder joint layer 23 to cause failure, thereby preventing static load from causing failure to the solder joint layer 23 and improving the accuracy of the solder joint life testing device.
  • the first connecting assembly 422B may include two connecting pieces provided with the first hanging post 4220, and the lead screw 421A is fixed between the two connecting pieces through nuts and bolts.
  • the lead screw 421A is set as a ball screw in this embodiment.
  • the thread of the ball screw is provided with balls, and the rotation of the balls realizes the rotation of the screw 421A relative to the nut 421B, which reduces the friction between the screw 421A and the nut 421B, and reduces the power consumption of the solder joint life test device.
  • the driving wheel 420A includes a first gear
  • the number of the driven wheel 420B is one
  • the driven wheel 420B includes a second gear
  • the number of teeth of the second gear is greater than the number of teeth of the first gear
  • the number of teeth of the second gear is greater than that of the first gear.
  • the second gear and the first gear mesh with each other.
  • the second gear and the first gear form a reducer to reduce the mechanical loss of the second gear, and the second gear and the first gear mesh with each other so that the driving wheel 420A drives the driven wheel 420B to rotate under the drive of the power unit 41 .
  • the embodiment of the present application also provides the following technology Program:
  • the driving structure 40 also includes a first limiting unit 43, the first limiting unit 43 is located on the side away from the driven wheel 420B connected to the nut 421B away from the test piece 20, and the sleeve Set on the lead screw 421A, the first limit unit 43 is connected with the frame 30, the first limit unit 43 is set to limit the linear movement of the driven wheel 420B connected with the nut 421B in a direction parallel to the lead screw 421A, and the lead screw 421A can rotate relative to the first limiting unit 43 .
  • the nut 421B is located in a positioning hole inside a driven wheel 420B.
  • the nut 421B and the driven wheel 420B rotate synchronously.
  • the first limiting unit 43 is connected to the frame 30 to limit the direction of the driven wheel 420B connected to the nut 421B in a direction parallel to the lead screw 421A.
  • the first limiting unit 43 includes a shaft sleeve 430 and a bearing 431, the shaft sleeve 430 is located between the nut 421B and the driven wheel 420B, and the shaft sleeve 430 is respectively connected to the nut 421B Connected with the driven wheel 420B, the bearing 431 is located outside the shaft sleeve 430, the outer ring 431B of the bearing 431 is fixed to the frame 30, the inner ring 431A of the bearing 431 is connected to the shaft sleeve 430, and the inner ring 431A of the bearing 431 can rotate relative to the screw 421A .
  • the shaft sleeve 430, the driven wheel 420B and the nut 421B are connected with the inner ring 431A of the bearing 431, and the outer ring 431B of the bearing 431 is connected with the frame 30.
  • the driving wheel 420A can drive the nut 421B, the driven wheel 420B, the shaft sleeve 430 and the driven wheel 420B through the driven wheel 420B.
  • the inner ring 431A of the bearing 431 rotates, so that the inner ring 431A of the bearing 431 can rotate relative to the lead screw 421A.
  • the linear movement of the driven wheel 420B connected to the nut 421B in a direction parallel to the lead screw 421A can be restricted, so that the driving wheel 420A can drive the nut 421B to rotate through the driven wheel 420B to realize During the linear movement of the lead screw 421A relative to the test piece 20 in a direction away from the test piece 20 , the pulling force F1 acts on the test piece 20 through the support structure 10 .
  • the shaft sleeve 430 is connected to the driven wheel 420B through the fixing assembly 51 and the nut 421B respectively.
  • the outer ring 431B of the bearing 431 is fixedly connected with the frame 30 through the fixing assembly 51 .
  • the fixing assembly 51 may include bolts or screws.
  • the driving structure 40 also includes a second limiting unit 44, and the second limiting unit 44 includes a linear limiting groove 440 and a second connection assembly 441.
  • the straight line of the linear limiting groove 440 The depth direction of the groove 440A is parallel to the lead screw 421A, and is located on one side of the lead screw 421A.
  • the connecting end 440B of the linear limit groove 440 is connected to the frame 30, and the second connection component 441 is arranged perpendicular to the lead screw, and the second connection
  • the first end of the component 441 is located in the linear groove 440A and can move linearly relative to the linear groove 440A.
  • the second end of the second connecting component 441 is connected to the second end of the lead screw 421A.
  • the second limiting unit 44 is set to Rotation of the lead screw 421A is restricted.
  • the first end of the second connection assembly 441 is located in the linear groove 440A, and the connecting end 440B of the linear limit groove 440 is connected to the frame 30, which can be set to limit the rotation of the screw 421A, so that the driving wheel 420A is driven by the driven wheel 420B. While the nut 421B is rotating, the lead screw 421A does not rotate relative to the frame 30, and only the tension F1 acts on the test piece 20 through the support structure 10 during the linear movement relative to the test piece 20 in a direction away from the test piece 20 , improving the conversion rate of the drive structure 40 converting rotation into linear motion, thereby reducing the power consumption of the solder joint life testing device.
  • the connecting end 440B of the linear limiting slot 440 may be connected to the frame 30 through bolts and nuts.
  • the second connecting assembly 441 may include two connecting pieces, and the lead screw 421A is fixed between the two connecting pieces through nuts and bolts.
  • the solder joint life testing device also includes a position sensor 60, the position sensor 60 is fixed on the frame 30, and is configured to detect the positional relationship between the first device layer 21 and the second device layer 22, the position sensor 60
  • the signal output end of the drive structure 40 is connected to the control end.
  • the position sensor 60 can be set to detect the positional relationship between the first device layer 21 and the second device layer 22, the signal output terminal of the position sensor 60 is connected with the control terminal of the drive structure 40, after the solder joint layer 23 fails, the first device layer 21 and the second device layer 22 are separated, the drive structure 40 no longer performs power output, and the number of F1 applied to the support structure 10 is recorded to obtain the life of the solder joint.
  • FIG. 5 is a flow chart of a method for predicting the life of a solder joint provided in an embodiment of the present application.
  • the solder joint life test device shown in Figure 1- Figure 4 is used as an example to illustrate, see Figure 5, the prediction method of the solder joint life includes:
  • Step 110 use the solder joint life test device to perform a solder joint life test on the standard to-be-tested piece, and determine the constant and the theoretical maximum tensile stress in the preset life prediction formula.
  • Point life test device the theoretical maximum tensile stress is the maximum tensile stress corresponding to the failure of the solder joint layer of the standard test piece under static load.
  • the preset lifetime formula satisfies the following relationship:
  • Np is the life of the piece to be tested
  • a 0 is the initial crack fracture depth of the solder joint layer
  • a p is the crack fracture depth when the solder joint layer fails
  • C and n are constant values
  • ⁇ is the maximum tensile stress and the minimum tensile stress
  • M is the moment when the test piece is subjected to tension and deformation.
  • a 0 is the initial crack fracture depth of the solder joint layer, and its value is 10 -7 ⁇ 10 -9 m for lead-free solder joints.
  • a p is the value corresponding to the fracture depth of the crack when the solder joint layer fails, and may be the radius of the solder joint.
  • the maximum tensile stress can be determined by the ratio of the maximum tensile force to the area of the support structure 10
  • the minimum tensile stress can be determined by the ratio of the minimum tensile force to the area of the support structure 10 .
  • the value of the pulling force F1 varies according to the following rule: f1, f2, f1, f2, f1, f2, f1, f2.
  • the value of f1 is equal to 0, or a value close to 0, and the value of f2 is smaller than the theoretical maximum tensile force of the solder joint layer 23 . Wherein, when the value of f1 is close to 0, it can be approximated as 0.
  • the minimum tensile stress is 0 or a value close to 0, and ⁇ is the difference between the maximum tensile stress and the minimum tensile stress.
  • the moment M when the test piece 20 is deformed by the tensile force is the moment when the test piece is deformed by the maximum tensile force f2.
  • the solder joint life test is carried out on the standard test piece by the solder joint life test device. From the test results, the life of the standard test piece, the difference between the maximum tensile stress and the minimum tensile stress ⁇ , and the time when the test piece is deformed by tensile force can be obtained. By substituting the above test data into the preset life formula (1), the constants C and n in the preset life prediction formula can be determined. At the same time, the solder joint life test is carried out on the standard test piece through the solder joint life test device, and the theoretical maximum tensile stress of the standard test piece can also be determined.
  • i and j in the formula (2) are the labels of the standard test piece, f is the tensile force acting on the support structure 10, and f i is the load on the i standard test piece when the i-th standard test piece is tested
  • the structure, size and manufacturing process of the standard test piece are the same as those of the test piece 20 in the above technical solution.
  • the structure, size and manufacturing process of the standard test piece and the test piece in step 120 are the same.
  • the standard DUT includes a first device layer 21 , a second device layer 22 and a pad layer 23 . In order to install the standard DUT on the installation position of the solder joint life testing device, it is necessary to set an adhesive layer on the first surface of the standard DUT, and then attach the magnetic permeable layer 20A to the first surface of the standard DUT. .
  • the second surface of the standard test piece is provided with a bonding layer, and then the first fixed layer 20B1 and the second fixed layer 20B2 are attached to the second surface of the standard test piece in turn, and the area of the second fixed layer 20B is larger than that of the first fixed layer.
  • An area of the fixed layer 20B1. Place the manufactured standard DUT into the placement groove 30A of the frame 30 .
  • Step 120 Predict the life of the piece to be tested according to the preset life prediction formula and preset parameters, wherein the preset parameters include the torque, the preset maximum tensile stress, and the preset minimum tensile stress of the test piece when it is deformed by a preset tensile force At least one of them, wherein the preset minimum tensile stress is less than the preset maximum tensile stress, the preset maximum tensile stress is less than the theoretical maximum tensile stress, and the structure, size and manufacturing process of the standard test piece and the test piece are the same.
  • the preset parameters include the torque, the preset maximum tensile stress, and the preset minimum tensile stress of the test piece when it is deformed by a preset tensile force At least one of them, wherein the preset minimum tensile stress is less than the preset maximum tensile stress, the preset maximum tensile stress is less than the theoretical maximum tensile stress, and the structure, size and manufacturing process
  • the life of the test piece 20 can be predicted.
  • the tension value of the spring may be detected by a tension sensor.
  • the numerical relationship between the stretching length and the tension of the spring can be obtained through the tension sensor, and the corresponding relationship between the tension of the spring and the number of turns of the motor can be determined through multiple tests, so as to accurately obtain the action on the support structure 10 through the number of turns of the motor. At least one of the moment, the preset maximum tensile stress and the preset minimum tensile stress when the test piece is deformed by the preset tensile force can be accurately obtained.
  • the technical solution of this embodiment improves the life of the standard test piece, the constant in the preset life prediction formula and the accuracy of the theoretical maximum tensile stress through the above-mentioned solder joint life testing device, and then improves the solder joint of the test piece.
  • the accuracy of life prediction results are provided.
  • FIG. 6 is a flow chart of another method for predicting the life of a solder joint provided by an embodiment of the present application.
  • step 110 uses the solder joint life test device to perform a solder joint life test on the standard to-be-tested piece, and before determining the constant in the life prediction formula includes:
  • Step 1101 detecting the actual position of the standard DUT on the frame through the position sensor.
  • the actual position of the standard DUT on the frame 30 is detected by the position sensor 60 .
  • Step 1102 when the actual position of the standard test piece on the frame is consistent with the preset position, adjust the position of the first end of the first connecting component on the lead screw so that the elastic unit is in a balanced state.
  • the preset position of the standard DUT on the frame 30 is the correct installation position.
  • the position of the first end of the first connection component 422B on the wire 421A is adjusted so that the elastic unit 422A is in a balanced state. After determining the position of the first end of the first connection component 422B on the wire 421A when the elastic unit 422A is in a balanced state, it is convenient to accurately correspond to the pulling force of the elastic unit 422A by controlling the number of turns of the motor during the test.
  • Step 1103 applying a pre-tightening force of a preset value to the elastic unit.
  • applying a pre-tightening force of a preset value to the elastic unit 422A through the rotation of the motor can eliminate the gap existing between the driving wheel 420A and the driven wheel 420B.
  • the pre-tightening force of the preset value is relatively small, and the pulling force F1 generated on the support structure 10 can be ignored.
  • performing the solder joint life test on the standard DUT by the solder joint life test device in step 110 includes: detecting the positional relationship between the first device layer 21 and the second device layer 22 through the position sensor 60 fixed on the frame 30 , the signal output terminal of the position sensor 60 is connected with the control terminal of the driving structure 40 .
  • the solder joint layer 23 fails, the first device layer 21 and the second device layer 22 are separated, and the motor of the drive structure 40 no longer performs power output, and the number of F1 applied to the support structure 10 is obtained by the number of turns of the motor , the life of the solder joint can be obtained.
  • the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be composed of multiple Physical components cooperate to perform.
  • Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit.
  • a processor such as a central processing unit, digital signal processor or microprocessor
  • Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media).
  • Computer storage media includes both volatile and nonvolatile media implemented in any method or technology arranged to store information, such as computer readable instructions, data structures, program modules, or other data. permanent, removable and non-removable media.
  • Computer storage media include but not limited to Random Access Memory (Random Access Memory, RAM), Read Only Memory (Read Only Memory, ROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Flash memory or other memory technology, Compact Disc Read-Only Memory (CD-ROM), Digital Video Disc (DVD) or other optical disk storage, magnetic cartridges, tape, disk storage or other magnetic storage device, or any other medium that can be configured to store desired information and that can be accessed by a computer.
  • communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media .

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Abstract

一种焊点寿命测试装置以及焊点寿命的预测方法。焊点寿命测试装置包括：框架（30）、支撑结构（10）和驱动结构（40），支撑结构（10）设置为支撑待测试件（20），其中，待测试件（20）的第一表面固定在支撑结构（10）的表面，待测试件（20）的与第一表面相对的第二表面与框架（30）连接，待测试件（20）包括第一器件层（21）、第二器件层（22）和焊点层（23），焊点层（23）位于第一器件层（21）和第二器件层（22）之间，设置为固定第一器件层（21）和第二器件层（22）；驱动结构（40）位于支撑结构（10）远离待测试件（20）的一侧且与框架（30）连接，驱动结构（40）与支撑结构（10）连接，驱动结构（40）设置为提供作用在支撑结构（10）上的拉力，其中，拉力的数值在预设数值范围内周期性变化。

Description

焊点寿命测试装置以及焊点寿命的预测方法 技术领域
本申请涉及测试技术领域，例如涉及一种焊点寿命测试装置以及焊点寿命的预测方法。
背景技术
随着便携式电子产品的发展，在便携式电子产品性能不断提高的同时，其体积也越来越小。在便携式电子产品中的器件制备过程中，通常采用表面贴装工艺将两个器件层通过焊点层固定在一起。
实际工况中的焊点层在内部应力的长时间作用下，其内部产生预设长度的裂纹进而发生疲劳断裂，导致焊点的失效，以至于不能起到固定器件层的作用。焊点层寿命测试可以通过对焊点层施加周期性变化的机械载荷或者热载荷，使得焊点层在机械载荷或者热载荷的作用下内部产生应力，进而产生预设长度的裂纹，从而导致焊点层发生疲劳断裂而失效。对焊点层施加的机械载荷或者热载荷的次数可以用来评价焊点层的寿命。
但是寿命测试装置和焊点寿命的预测方法并不能快速且准确地测得焊点层的寿命。
发明内容
本申请提出一种焊点寿命测试装置以及焊点寿命的预测方法，旨在提高焊点寿命测试的速度和准确度。
本申请提供了一种焊点寿命测试装置，该焊点寿命测试装置包括：框架、支撑结构和驱动结构，所述支撑结构设置为支撑待测试件，其中，所述待测试件的第一表面固定在所述支撑结构的表面，所述待测试件的与所述第一表面相对的第二表面与所述框架连接，所述待测试件包括第一器件层、第二器件层和焊点层，所述焊点层位于所述第一器件层和所述第二器件层之间，设置为固定所述第一器件层和所述第二器件层；所述驱动结构位于所述支撑结构远离所述待测试件的一侧且与所述框架连接，所述驱动结构与所述支撑结构连接，所述驱动结构设置为提供作用在所述支撑结构上的拉力，其中，所述拉力的数值在预设数值范围内周期性变化。
本申请还提供了一种焊点寿命的预测方法，该方法包括：
通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，确定预设寿命预测公式中的常数和理论最大拉应力，其中，所述焊点寿命测试装置如上所述的焊点寿命测试装置，所述理论最大拉应力为所述标准待测试件的焊点层在静载荷下发生失效对应的最大拉应力；根据所述预设寿命预测公式以及预设参数预测待测试件的寿命，其中，所述预设参数包括所述待测试件受到预设拉力产生变形时的力矩、预设最大拉应力和预设最小拉应力中的至少一种，其中，所述预设最小拉应力小于所述预设最大拉应力，所述预设最大拉应力小于所述理论最大拉应力，所述标准待测试件和所述待测试件的结构、尺寸和制作工艺均相同。
附图说明
图1是本申请实施例提供的一种焊点寿命测试装置的结构示意图；
图2是本申请实施例提供的另一种焊点寿命测试装置的结构示意图；
图3是图2中区域S1对应的结构的剖面结构示意图；
图4是图2中区域S2对应的结构的剖面结构示意图；
图5是本申请实施例提供的一种焊点寿命的预测方法的流程图；
图6是本申请实施例提供的另一种焊点寿命的预测方法的流程图。
具体实施方式
此处所描述的具体实施例仅仅用以解释本申请。
在后续的描述中，使用用于表示元件的诸如“模块”、“部件”或“单元”的后缀仅为了有利于本申请的说明，其本身没有特有的意义。因此，“模块”、“部件”或“单元”可以混合地使用。
正如上述背景技术中所述，由于便携式电子产品的尺寸很小，相关技术中很难找到测量准确度高且测试速度快的焊点寿命测试装置来测试器件层之间设置为实现连接作用的焊点层的寿命。究其原因，首先，相关技术中对于施加周期性变化的机械载荷的寿命测试装置，其要求的待测样品形状规整且尺寸符合预设标准，因此，该装置并不能对于尺寸比较小的采用表面贴装工艺形成的器件的焊点层的寿命进行测试。其次，相关技术中，通过对焊点层施加周期性变化的热载荷，使得焊点层在热载荷的作用下在其内部产生应力，进而产生预设长度的裂纹，从而导致焊点层发生疲劳断裂而失效。对焊点层施加的热载荷的次数可以用来评价焊点的寿命。该装置需要周期性对采用表面贴装工艺形成的器件进行升温或者降温，使得器件中印刷电路板以及电子元件发生循环翘曲变 形，焊点层在热载荷的作用下内部产生应力，进而产生预设长度的裂纹，从而导致焊点层发生疲劳断裂而失效。该装置的测试周期长、成本较高，且通过对焊点层加载周期性的热载荷实现焊点寿命测试时，焊点层内部会因为温度的周期性变化而出现蠕变裂纹，最终焊点层产生的预设长度的裂纹来源于因为温度的周期性变化而出现蠕变裂纹和器件中印刷电路板以及电子元件发生循环翘曲变形产生的裂纹，因此该装置测试的焊点层寿命和实际的焊点层寿命并不匹配，导致其测试速度和准确度不高。
针对上述技术问题，本申请实施例提供了如下技术方案，旨在实现一种准确度高的焊点寿命测试装置。
图1是本申请实施例提供的一种焊点寿命测试装置的结构示意图。其中，图1a仅示出了驱动结构40、支撑结构10和待测试件20的结构示意图。图1b示出了焊点寿命测试装置的整体结构示意图。参见图1，该焊点寿命测试装置包括：框架30、支撑结构10和驱动结构40，支撑结构10设置为支撑待测试件20，其中，待测试件20的第一表面固定在支撑结构10的表面，待测试件20的与第一表面相对的第二表面与框架30连接，待测试件20包括第一器件层21、第二器件层22和焊点层23，焊点层23位于第一器件层21和第二器件层22之间，设置为固定第一器件层21和第二器件层22；驱动结构40位于支撑结构10远离待测试件20的一侧且与框架30连接，驱动结构40与支撑结构10连接，驱动结构40设置为提供作用在支撑结构10上的拉力F1，其中，拉力F1的数值在预设数值范围内周期性变化。
第一器件层21和第二器件层22通过焊点层23固定连接在一起形成电子器件的工艺方法称之为表面贴装工艺，第一器件层21可以是芯片层也可以是印刷电路板，第二器件层22可以是芯片层也可以是印刷电路板。本实施例中的待测试件20中芯片层中的芯片包括但不限于球形触点阵列(Ball Grid Array，BGA)表面贴片封装以及方形扁平无引脚封装(Quad Flat No-leads Package，QFN)。芯片是BGA表面贴片封装以及QFN的待测试件20中的焊点层23的焊点的尺寸小，制作难度大，寿命测试难度也随之增加。
如果直接采用驱动结构40对待测试件20施加拉力F1，其中，拉力F1的数值在预设数值范围内周期性变化，由于该电子器件的尺寸比较小，驱动结构40与待测试件20之间的连接点难以设置。本实施例中，设置了位于待测试件20和驱动结构40之间的支撑结构10，设置为支撑待测试件20，驱动结构40提供作用在支撑结构10上的拉力F1，由于待测试件20的第一表面固定在支撑结构10的表面，支撑结构10设置为支撑待测试件20，拉力F1通过支撑结构10可以作用到待测试件20上，由于拉力F1的数值在预设数值范围内周期性变化， 因此相当于驱动结构40通过支撑结构10将周期性变化的机械载荷施加在待测试件20上，焊点层23在拉力F1的作用下，焊点层23的焊点内部产生应力，进而出现裂纹，当裂纹的长度大于或等于预设长度时，焊点层23发生疲劳断裂而失效，即第二器件层22与第一器件层21分开。对焊点层23施加的拉力F1的次数可以用来评价焊点层23的焊点的寿命。
驱动结构40设置为提供作用在支撑结构10上的拉力F1，F1的数值在预设数值范围内周期性变化，示例性的，拉力F1的数值按照下面变化规律如下：f1，f2，f1，f2，f1，f2，f1，f2。f1的数值等于0，或者是接近0的一个数值，f2的取值小于焊点层23的理论最大拉力。其中，f1的数值和0接近的情况，可以将其近似为0。焊点层23的寿命为4次。焊点层23在理论最大拉力的作用下，会发生静载荷下的断裂，而导致失效。
本实施例提供的技术方案，支撑结构10位于待测试件20和驱动结构40之间，设置为支撑待测试件20，驱动结构40通过支撑结构10将拉力F1作用到待测试件20上，由于拉力F1的数值在预设数值范围内周期性变化，因此相当于驱动结构40通过支撑结构10将周期性变化的机械载荷施加在待测试件20上，焊点层23在拉力F1的作用下，焊点层23的焊点内部产生应力，进而出现裂纹，当裂纹的长度大于或等于预设长度时，焊点层23发生疲劳断裂而失效，即第二器件层22与第一器件层21分开。该装置通过统计驱动结构40对焊点层23施加的拉力F1的次数作为焊点层23的寿命测试结果，实现了一种针对尺寸较小的待测试件20的焊点层23的寿命测试装置。其中，本实施例中，最终焊点层23产生的预设长度的裂纹来源于周期性变化的机械载荷使得焊点内部变形产生的裂纹，相比通对焊点层加载周期性的热载荷实现焊点寿命测试的装置，避免了最终焊点层23产生的预设长度的裂纹来源于因为温度的周期性变化而出现蠕变裂纹的情况，本实施例的技术方案提高了焊点寿命测试装置的准确度，缩短了测试周期，降低了测试成本。
下面对支撑结构10进行说明。图2是本申请实施例提供的另一种焊点寿命测试装置的结构示意图。图3是图2中区域S1对应的结构的剖面结构示意图，其中，图3b是图3a中待测试件20的结构示意图。图4是图2中区域S2对应的结构的剖面结构示意图。
在上述技术方案的基础上，参见图2和图3，该焊点寿命测试装置中的支撑结构10包括磁力吸附单元11；待测试件20的第一表面设置有导磁层20A；磁力吸附单元11位于导磁层20A远离待测试件20一侧的表面，磁力吸附单元11和导磁层20A连接。
图2中为了示出支撑结构10和待测试件20，标记了支撑结构10和待测试 件20之间的垂直距离L，在本实施例中，支撑结构10和待测试件20之间的垂直距离L的取值为0。
示例性的，导磁层20A是由导磁材料组成的，示例性的，可以包括但不限于金属铁和低碳钢。磁力吸附单元11和导磁层20A之间通过磁力吸附在一起。
导磁层20A和待测试件20的第一表面可以通过粘结层来固定连结。磁力吸附单元11和导磁层20A可以通过磁力吸附在一起，以实现磁力吸附单元11对待测试件20的支撑作用。本实施例中，磁力吸附单元11和待测试件20通过磁力吸附在一起，相比机械固定方式，简化了支撑结构10的部件设置，以及支撑结构10的装配工艺。驱动结构40的拉力F1通过磁力吸附单元11作用在待测试件20上，为了保证磁力吸附单元11和待测试件20的连接方式具有较高的稳定性，可以通过增加磁力吸附单元11对于导磁层20A的磁力来实现。
可选的，在上述技术方案的基础上，参见图2和图3，磁力吸附单元11包括层叠设置的磁性材料层110和磁轭层111。
磁轭层111的设置可以将磁性材料层110的磁感线束缚在磁性材料层110中，以增加磁力吸附单元11对于导磁层20A的磁力，保证磁力吸附单元11和待测试件20的连接方式具有较高的稳定性，进而提高焊点寿命测试装置的稳定性。磁性材料层110可以包括但不限于永磁体材料，磁轭层111可以包括导磁材料。
可选的，在上述技术方案的基础上，参见图3，待测试件20的第二表面依次设置有第一固定层20B1和第二固定层20B2，第二固定层20B2的面积大于第一固定层20B1的面积，框架30设置有待测试件20的放置槽30A，将第一固定层20B1和第二固定层20B2固定在框架30的放置槽30A内以实现待测试件20和框架30的固定连接。第一固定层20B1与待测试件20可以通过粘结层实现固定连接。第一固定层20B1和第二固定层20B2可以包括但不限于导磁材料，当第一固定层20B1和第二固定层20B2是导磁材料时，磁力吸附单元11可以通过磁力增加待测试件20与第一固定层20B1和第二固定层20B2的固定强度。
可选的，在上述技术方案的基础上，参见图2，可以通过至少一个导向柱50将支撑结构10固定在框架30上，以提高支撑结构10的稳定性。
下面介绍驱动结构40的结构。在上述技术方案的基础上，参见图2，驱动结构40包括动力单元41和传动单元42；动力单元41包括转动输出轴41A，动力单元41的转动输出轴41A设置为顺时针转动或者逆时针转动；传动单元42的第一连接端与动力单元41的转动输出轴41A连接，传动单元42的第二连接端与支撑结构10连接，传动单元42的第二连接端设置为相对待测试件20在垂 直于待测试件20的方向上作直线运动，以提供作用在支撑结构10上的拉力F1。
传动单元42将动力单元41的转动输出轴41A的转动，转换为传动单元42相对于待测试件20在垂直于待测试件20方向上的直线运动，进而实现传动单元42的第二连接端提供作用在支撑结构10上的拉力F1，其中，拉力F1通过支撑结构10可以作用到待测试件20上，由于拉力F1的数值在预设数值范围内周期性变化，因此相当于驱动结构40通过支撑结构10将疲劳载荷施加在待测试件20上，焊点层23在拉力F1的作用下，焊点层23的焊点内部产生应力，进而出现裂纹，当裂纹的长度大于或等于预设长度时，焊点层23发生疲劳断裂而失效。对焊点层23施加的拉力F1的次数可以用来评价焊点层23的焊点的寿命。其中，设定动力单元41的转动输出轴41A顺时针转动时，传动单元42相对于待测试件20在垂直于待测试件20方向上作远离待测试件20的直线运动，以实现传动单元42的第二连接端提供作用在支撑结构10上的拉力F1。且动力单元41的转动输出轴41A顺时针转动的圈数越多，传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1值越大。可以通过动力单元41的转动输出轴41A逆时针转动来降低传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1的数值，且动力单元41的转动输出轴41A逆时针转动的圈数越多，传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1值越小。
或者，可以设定动力单元41的转动输出轴41A逆时针转动时，传动单元42相对于待测试件20在垂直于待测试件20方向上作远离待测试件20的直线运动，以实现传动单元42的第二连接端提供作用在支撑结构10上的拉力F1。且动力单元41的转动输出轴41A逆时针转动的圈数越多，传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1值越大。可以通过动力单元41的转动输出轴41A顺时针转动来降低传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1的数值，且动力单元41的转动输出轴41A顺时针转动的圈数越多，传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1值越小。
可选的，参见图4，可以在框架30上设置定位孔，固定组件51的一端位于定位孔内，另一端位于动力单元41内，通过固定组件51将动力单元41与框架30固定在一起。示例性的，固定组件51可以包括螺栓或者螺钉。
可选的，在上述技术方案的基础上，动力单元41包括电机，传动单元42的第一连接端套设在电机的转动输出轴上。
采用电机作为动力单元41，可以通过在电机的控制端精确控制电机的转动输出轴的转动方向以及转动圈数，以精确控制传动单元42的第二连接端提供的作用在支撑结构10上的拉力F1的数值。其中，可以通过电机的控制器记录下电机的转动方向以及转动圈数，便于根据电机的转动方向以及转动圈数来确定 待测试件20中焊点层23的寿命。因此上述技术方案提高了焊点寿命测试装置的准确度和自动化控制程度。
下面介绍传动单元42的结构。在上述技术方案的基础上，参见图2和图4，传动单元42包括转动子单元420和直线子单元421；转动子单元420包括主动轮420A和至少一个从动轮420B，主动轮420A套设在动力单元41的转动输出轴41A上，动力单元41的转动输出轴41A设置为带动主动轮420A作转动运动；从动轮420B和主动轮420A转动连接，主动轮420A设置为带动从动轮420B转动；直线子单元421包括丝杠421A和螺母421B，螺母421B位于一个从动轮420B内部的定位孔内，丝杠421A和螺母421B螺纹连接，丝杠421A可相对于螺母421B转动运动，且丝杠421A可相对螺母421B作直线运动，丝杠421A的第一端与支撑结构10连接，丝杠421A垂直于待测试件20设置。
本实施例的图中示例性的仅仅示出了1个从动轮420B，本实施例对于从动轮420B的数量不作限定。示例性的，从动轮420B的直径大于主动轮420A的直径，此处对于从动轮420B和主动轮420A的直径大小关系也不作限定。
主动轮420A套设在动力单元41的转动输出轴41A上，动力单元41的转动输出轴41A带动主动轮420A转动。从动轮420B和主动轮420A转动连接，主动轮420A带动从动轮420B转动。直线子单元421中丝杠421A和螺母421B螺纹连接，丝杠421A和螺母421B可以相对转动的同时，丝杠421A可相对螺母421B作直线运动。由于螺母421B位于一个从动轮420B内部的定位孔内，螺母421B和从动轮420B同步转动，丝杠421A可以相对螺母421B和从动轮420B作直线运动。且丝杠421A垂直于待测试件20设置，由于丝杠421A的第一端与支撑结构10连接，丝杠421A在相对螺母421B和从动轮420B作直线运动时，可以通过控制动力单元41的转动输出轴41A的转动方向，实现丝杠421A相对待测试件20向远离待测试件20的方向作直线运动，实现丝杠421A将拉力F1通过支撑结构10作用在待测试件20上。还可以通过控制动力单元41的转动输出轴41A的转动圈数和转动方向，调整丝杠421A通过支撑结构10作用在待测试件20上的拉力F1的数值大小和变化规律，以实现丝杠421A将数值在预设数值范围内周期性变化的拉力F1通过支撑结构10作用在待测试件20上，进而通过动力单元41的转动输出轴41A的转动圈数和转动方向确定丝杠421A对焊点层23施加的拉力F1的次数作为焊点层23的寿命测试结果，实现了一种针对尺寸较小的待测试件20的焊点层23的寿命测试装置。
为了将丝杠421A提供的拉力F1缓慢作用在支撑结构10上，本申请实施例还提供了如下技术方案：
在上述技术方案的基础上，参见图2，传动单元42还包括弹性模组422， 弹性模组422的第一端与丝杠421A的第一端连接，弹性模组422的第二端与支撑结构10连接。
弹性模组422可以相对平衡位置作往复运动，丝杠421A提供的拉力F1作用在弹性模组422上，弹性模组422的第二端与支撑结构10连接，驱动结构40通过拉伸弹性模组422的第一端，弹性模组422在拉力F1的作用下偏离平衡位置，处于拉伸状态，以实现丝杠421A将拉力F1通过弹性模组422作用在支撑结构10上。拉力F1的数值是随着弹性模组422偏离平衡位置的距离的增加而增大的，因此，弹性模组422可作为缓冲结构，实现丝杠421A提供的拉力F1缓慢作用在支撑结构10上的效果，避免丝杠421A将拉力F1直接作用在支撑结构10上，导致焊点层23产生裂纹而失效，进而避免静载荷对焊点层23造成失效，以提高焊点寿命测试装置的准确度。
可选的，在上述技术方案的基础上，弹性模组422包括至少一个弹性单元422A和第一连接组件422B，第一连接组件422B与丝杠421A的第一端连接，第一连接组件422B设置有至少一个第一挂柱4220，弹性单元422A的第一端与第一挂柱4220连接，支撑结构10设置有至少一个第二挂柱100，弹性单元422A的第二端与第二挂柱100连接。
示例性的，弹性单元422A可以选择价格低廉的弹簧来实现，以降低寿命测试装置的成本。可选的，还可以设置拉力传感器，设置为检测弹簧的拉力数值。通过拉力传感器可以获得弹簧的拉伸长度与拉力的数值关系，并且通过多次测试确定弹簧的拉力与电机的转动圈数的对应关系，便于通过电机的转动圈数精确获得作用在支撑结构10上的拉力F1。
可以通过调整第一连接组件422B与丝杠421A的第一端的连接位置，来确定弹性单元422A处于平衡状态的初始位置。通过第一挂柱4220和第二挂柱100的位置关系，可以调整弹性单元422A的位置关系，当弹性单元422A垂直于待测试件20设置时，可以保证丝杠421A将垂直于待测试件20的拉力F1通过弹性单元422A作用在支撑结构10上。当丝杠421A提供的拉力F1为零时对应弹性单元422A处于平衡状态时，当丝杠421A相对待测试件20的距离越远，丝杠421A通过弹性单元422A作用在支撑结构10上的拉力F1的数值越大。拉力F1的数值是随着弹性单元422A偏离平衡位置的距离的增加而增大的，因此，弹性单元422A可实现丝杠421A提供的拉力F1缓慢作用在支撑结构10上的效果，避免丝杠421A将拉力F1直接作用在支撑结构10上，导致焊点层23产生裂纹而失效，进而避免静载荷对焊点层23造成失效，以提高焊点寿命测试装置的准确度。
示例性的，第一连接组件422B可以包括设置有第一挂柱4220的两个连接 件，通过螺母和螺栓将丝杠421A固定在两个连接件之间。
为了减少丝杠421A和螺母421B之间的摩擦力，降低焊点寿命测试装置的功耗，本实施例中设置丝杠421A为滚珠丝杠。
滚珠丝杠的螺纹内设置有滚珠，通过滚珠的转动实现丝杠421A相对螺母421B转动，降低了丝杠421A和螺母421B之间的摩擦力，降低焊点寿命测试装置的功耗。
在上述技术方案的基础上，参见图2，主动轮420A包括第一齿轮，从动轮420B的数量为一个，从动轮420B包括第二齿轮，第二齿轮的齿数大于第一齿轮的齿数，且第二齿轮和第一齿轮相互啮合。
第二齿轮和第一齿轮组成减速器，以降低第二齿轮的机械损耗，且第二齿轮和第一齿轮相互啮合以实现主动轮420A在动力单元41的带动下，带动从动轮420B转动。
为了实现丝杠421A向远离支撑结构10的方向上作直线运动的同时，限制螺母421B和从动轮420B相对框架30在丝杠421A的延伸方向上作直线运动，本申请实施例还提供了如下技术方案：
在上述技术方案的基础上，参见图2，驱动结构40还包括第一限位单元43，第一限位单元43位于与螺母421B连接的从动轮420B远离待测试件20的一侧，且套设在丝杠421A上，第一限位单元43与框架30连接，第一限位单元43设置为限制与螺母421B连接的从动轮420B在平行于丝杠421A方向上的直线运动，且丝杠421A可相对第一限定单元43转动。
螺母421B位于一个从动轮420B内部的定位孔内，螺母421B和从动轮420B同步转动，第一限位单元43与框架30连接，可以限制与螺母421B连接的从动轮420B在平行于丝杠421A方向上的直线运动，以实现主动轮420A通过从动轮420B带动螺母421B转动，实现丝杠421A相对待测试件20向远离待测试件20的方向作直线运动的过程中将拉力F1通过支撑结构10作用在待测试件20上。
下面介绍第一限位单元43的结构。在上述技术方案的基础上，参见图2和图4，第一限位单元43包括轴套430和轴承431，轴套430位于螺母421B和从动轮420B之间，且轴套430分别和螺母421B与从动轮420B连接，轴承431位于轴套430的外侧，轴承431的外圈431B与框架30固定，轴承431的内圈431A和轴套430连接，轴承431的内圈431A可相对丝杠421A转动。
轴套430、从动轮420B和螺母421B与轴承431的内圈431A连接，轴承431的外圈431B和框架30连接，主动轮420A可以通过从动轮420B带动螺母 421B、从动轮420B、轴套430和轴承431的内圈431A转动，进而实现轴承431的内圈431A可相对丝杠421A转动。且由于轴承431的外圈431B和框架30连接，可以限制与螺母421B连接的从动轮420B在平行于丝杠421A方向上的直线运动，以实现主动轮420A通过从动轮420B带动螺母421B转动，实现丝杠421A相对待测试件20向远离待测试件20的方向作直线运动的过程中将拉力F1通过支撑结构10作用在待测试件20上。
示例性的，参见图4，轴套430通过固定组件51分别和螺母421B与从动轮420B连接。轴承431的外圈431B通过固定组件51与框架30固定连接。固定组件51可以包括螺栓或者螺钉。
为了限制丝杠421A的转动，本申请实施例还提供了如下技术方案：
在上述技术方案的基础上，参见图2，驱动结构40还包括第二限位单元44，第二限位单元44包括直线限位槽440和第二连接组件441，直线限位槽440的直线凹槽440A的深度方向平行于丝杠421A，且位于丝杠421A的一侧，直线限位槽440的连接端440B与框架30连接，第二连接组件441垂直于丝杠设置，且第二连接组件441的第一端位于直线凹槽440A内，可相对直线凹槽440A作直线运动，第二连接组件441的第二端与丝杠421A的第二端连接，第二限位单元44设置为限制丝杠421A的转动。
第二连接组件441的第一端位于直线凹槽440A内，直线限位槽440的连接端440B与框架30连接，可以设置为限制丝杠421A的转动，以实现主动轮420A通过从动轮420B带动螺母421B转动的同时，实现丝杠421A相对框架30不转动，仅相对待测试件20向远离待测试件20的方向作直线运动的过程中将拉力F1通过支撑结构10作用在待测试件20上，提高驱动结构40将转动转换为直线运动的转换率，进而降低焊点寿命测试装置的功耗。
示例性的，直线限位槽440的连接端440B可以通过螺栓和螺母与框架30连接。第二连接组件441可以包括两个连接件，通过螺母和螺栓将丝杠421A固定在两个连接件之间。
为了检测待测试件20的焊点层23是否失效，本申请实施例还提供了如下技术方案：
在上述技术方案的基础上，该焊点寿命测试装置还包括位置传感器60，位置传感器60固定在框架30上，设置为检测第一器件层21和第二器件层22的位置关系，位置传感器60的信号输出端与驱动结构40的控制端连接。
位置传感器60可以设置为检测第一器件层21和第二器件层22的位置关系，位置传感器60的信号输出端与驱动结构40的控制端连接，当焊点层23失效后， 第一器件层21和第二器件层22分离，驱动结构40便不再进行动力输出，并记录下施加在支撑结构10上的F1的次数，便可以得到焊点的寿命。
本申请实施例还提供了一种焊点寿命的预测方法。图5是本申请实施例提供的一种焊点寿命的预测方法的流程图。结合图1-图4示出的焊点寿命测试装置为例进行说明，参见图5，该焊点寿命的预测方法包括：
步骤110、通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，确定预设寿命预测公式中的常数和理论最大拉应力，其中，焊点寿命测试装置如上述技术方案中任意的焊点寿命测试装置，理论最大拉应力为标准待测试件的焊点层在静载荷下发生失效对应的最大拉应力。
可选的，预设寿命公式满足如下关系：
Figure PCTCN2022081176-appb-000001
其中，Np为待测试件的寿命，a 0为焊点层的初始裂纹断裂深度；a p为焊点层失效时的裂纹断裂深度，C和n为常数值，Δσ为最大拉应力和最小拉应力的差值，M为待测试件受到拉力产生变形时的力矩。a 0为焊点层的初始裂纹断裂深度，对应无铅焊点时，其取值为10 -7～10 -9m。a p为焊点层失效时的裂纹断裂深度对应的取值，可以是焊点的半径。最大拉应力可以由最大拉力与支撑结构10的面积的比值确定，最小拉应力可以由最小拉力与支撑结构10的面积的比值确定。示例性的，拉力F1的数值按照下面变化规律如下：f1，f2，f1，f2，f1，f2，f1，f2。f1的数值等于0，或者是接近0的一个数值，f2的取值小于焊点层23的理论最大拉力。其中，f1的数值和0接近的情况，可以将其近似为0。最小拉应力是0或者接近与0的一个数值，Δσ为最大拉应力和最小拉应力的差值。待测试件20受到拉力产生变形时的力矩M为待测试件受到最大拉力f2产生变形时的力矩。
通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，从测试结果中可以获取标准待测试件的寿命，最大拉应力和最小拉应力的差值Δσ以及待测试件受到拉力产生变形时的力矩M，将上述测试数据代入预设寿命公式(1)，便可以确定预设寿命预测公式中的常数C和n。同时，通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，还可以确定标准待测试件的理论最大拉应力。
预设寿命预测公式中的常数n满足如下关系：
Figure PCTCN2022081176-appb-000002
预设寿命预测公式中的常数C满足如下关系：
Figure PCTCN2022081176-appb-000003
公式(2)中的i和j为标准待测试件的标号，f为作用在支撑结构10上的拉力，f i是对第i个标准待测试件进行实验时加载在第i个标准待测试件的支撑结构10上的拉力；f j是对第j个标准待测试件进行实验时加载在第j个标准待测试件的支撑结构10上的拉力，N i是对第i个标准待测试件进行实验时加载在第i个标准待测试件的支撑结构10上的拉力的循环次数；N j是对第j个标准待测试件进行实验时加载在第j个标准待测试件的支撑结构10上的拉力循环次数。
可选的，在测试之前，需要制备标准待测试件，并将标准待测试件安装在框架30的放置槽30A内。标准待测试件和上述技术方案中的待测试件20的结构、尺寸和制作工艺相同。标准待测试件和步骤120中待测试件的结构、尺寸和制作工艺相同。标准待测试件包括第一器件层21、第二器件层22和焊点层23。为了将标准待测试件安装在焊点寿命测试装置的安装位置上，需要在标准待测试件的第一表面设置粘结层，之后将导磁层20A贴附在标准待测试件的第一表面。并且在标准待测试件的第二表面设置粘结层，之后依次将第一固定层20B1和第二固定层20B2贴附在标准待测试件的第二表面，第二固定层20B的面积大于第一固定层20B1的面积。将制作好的标准待测试件放置到框架30的放置槽30A内。
步骤120、根据预设寿命预测公式以及预设参数预测待测试件的寿命，其中，预设参数包括待测试件受到预设拉力产生变形时的力矩、预设最大拉应力和预设最小拉应力中的至少一种，其中，预设最小拉应力小于预设最大拉应力，预设最大拉应力小于理论最大拉应力，标准待测试件和待测试件的结构、尺寸和制作工艺均相同。
将预设参数代入预设寿命预测公式(1)，可以对待测试件20的寿命进行预测。
可选的，在步骤120之前或者在步骤110之前可以通过拉力传感器，检测弹簧的拉力数值。通过拉力传感器可以获得弹簧的拉伸长度与拉力的数值关系，并且通过多次测试确定弹簧的拉力与电机的转动圈数的对应关系，便于通过电机的转动圈数精确获得作用在支撑结构10上的拉力F1，进而可以准确获得待测试件受到预设拉力产生变形时的力矩、预设最大拉应力和预设最小拉应力中的 至少一种。
本实施例的技术方案，通过上述焊点寿命测试装置提高了标准待测试件的寿命、预设寿命预测公式中的常数和理论最大拉应力的准确度，进而提高了对于待测试件的焊点寿命的预测结果的准确度。
图6是本申请实施例提供的另一种焊点寿命的预测方法的流程图。可选的，在上述技术方案的基础上，参见图6，步骤110通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，确定寿命预测公式中的常数之前包括：
步骤1101、通过位置传感器检测标准待测试件在框架上的实际位置。
参见图2和图3，通过位置传感器60检测标准待测试件在框架30上的实际位置。
步骤1102、标准待测试件在框架上的实际位置和预设位置相符时，通过调整第一连接组件在丝杠上的第一端的位置，以使弹性单元处于平衡状态。
标准待测试件在框架30的预设位置即正确的安装位置。调整第一连接组件422B在丝421A上的第一端的位置，以使弹性单元422A处于平衡状态。确定了弹性单元422A处于平衡状态时，第一连接组件422B在丝421A上的第一端的位置，后面在测试过程中，便于通过控制电机转动的圈数来准确对应弹性单元422A的拉力。
步骤1103、对弹性单元施加预设数值的预紧力。
在本实施例中，参见图2，通过电机的转动对弹性单元422A施加预设数值的预紧力可以消除主动轮420A和从动轮420B之间存在的间隙。其中，预设数值的预紧力的数值比较小，对支撑结构10产生的拉力F1可以忽略不计。
可选的，步骤110通过焊点寿命测试装置对标准待测试件进行焊点寿命测试包括：可以通过固定在框架30上的位置传感器60检测第一器件层21和第二器件层22的位置关系，位置传感器60的信号输出端与驱动结构40的控制端连接。当焊点层23失效后，第一器件层21和第二器件层22分离，驱动结构40的电机便不再进行动力输出，通过电机转动的圈数获得施加在支撑结构10上的F1的次数，便可以得到焊点的寿命。
上文中所公开方法中的全部或一些步骤、系统、设备中的功能模块/单元可以被实施为软件、固件、硬件及其适当的组合。
在硬件实施方式中，在以上描述中提及的功能模块/单元之间的划分不一定对应于物理组件的划分；例如，一个物理组件可以具有多个功能，或者一个功 能或步骤可以由多个物理组件合作执行。一些物理组件或所有物理组件可以被实施为由处理器，如中央处理器、数字信号处理器或微处理器执行的软件，或者被实施为硬件，或者被实施为集成电路，如专用集成电路。这样的软件可以分布在计算机可读介质上，计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的，术语计算机存储介质包括在设置为存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于随机存取存储器(Random Access Memory，RAM)、只读存储器(Read Only Memory，ROM)、带电可擦可编程只读存储器(Electrically Erasable Programmable Read-Only Memory，EEPROM)、闪存或其他存储器技术、只读光盘存储器(Compact Disc Read-Only Memory，CD-ROM)、数字多功能盘(Digital Video Disc，DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以设置为存储期望的信息并且可以被计算机访问的任何其他的介质。此外，本领域普通技术人员公知的是，通信介质通常包含计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据，并且可包括任何信息递送介质。

Claims (17)

  1. 一种焊点寿命测试装置，包括：框架、支撑结构和驱动结构；
    所述支撑结构设置为支撑待测试件，其中，所述待测试件的第一表面固定在所述支撑结构的表面，所述待测试件的与所述第一表面相对的第二表面与所述框架连接，所述待测试件包括第一器件层、第二器件层和焊点层，所述焊点层位于所述第一器件层和所述第二器件层之间，设置为固定所述第一器件层和所述第二器件层；
    所述驱动结构位于所述支撑结构远离所述待测试件的一侧且与所述框架连接，所述驱动结构与所述支撑结构连接，所述驱动结构设置为提供作用在所述支撑结构上的拉力，其中，所述拉力的数值在预设数值范围内周期性变化。
  2. 根据权利要求1所述的焊点寿命测试装置，其中，所述支撑结构包括磁力吸附单元；
    所述待测试件的第一表面设置有导磁层；
    所述磁力吸附单元位于所述导磁层远离所述待测试件一侧的表面，所述磁力吸附单元和所述导磁层连接。
  3. 根据权利要求2所述的焊点寿命测试装置，其中，所述磁力吸附单元包括层叠设置的磁性材料层和磁轭层。
  4. 根据权利要求1所述的焊点寿命测试装置，其中，所述驱动结构包括动力单元和传动单元；
    所述动力单元包括转动输出轴，所述动力单元的转动输出轴设置为顺时针转动或者逆时针转动；
    所述传动单元的第一连接端与所述动力单元的转动输出轴连接，所述传动单元的第二连接端与所述支撑结构连接，所述传动单元的第二连接端设置为相对所述待测试件在垂直于所述待测试件的方向上作直线运动，以提供作用在所述支撑结构上的拉力。
  5. 根据权利要求4所述的焊点寿命测试装置，其中，
    所述动力单元包括电机，所述传动单元的第一连接端套设在所述电机的转动输出轴上。
  6. 根据权利要求4所述的焊点寿命测试装置，其中，所述传动单元包括转动子单元和直线子单元；
    所述转动子单元包括主动轮和至少一个从动轮，所述主动轮套设在所述动力单元的转动输出轴上，所述动力单元的转动输出轴设置为带动所述主动轮作转动运动；所述从动轮和所述主动轮转动连接，所述主动轮设置为带动所述从 动轮转动；
    所述直线子单元包括丝杠和螺母，所述螺母位于一个从动轮内部的定位孔内，所述丝杠和所述螺母螺纹连接，所述丝杠可相对于所述螺母转动运动，且所述丝杠可相对所述螺母作直线运动，所述丝杠的第一端与所述支撑结构连接，所述丝杠垂直于所述待测试件设置。
  7. 根据权利要求6所述的焊点寿命测试装置，其中，所述传动单元还包括弹性模组，所述弹性模组的第一端与所述丝杠的第一端连接，所述弹性模组的第二端与所述支撑结构连接。
  8. 根据权利要求7所述的焊点寿命测试装置，其中，所述弹性模组包括至少一个弹性单元和第一连接组件，所述第一连接组件与所述丝杠的第一端连接，所述第一连接组件设置有至少一个第一挂柱，所述弹性单元的第一端与所述第一挂柱连接，所述支撑结构设置有至少一个第二挂柱，所述弹性单元的第二端与所述第二挂柱连接。
  9. 根据权利要求6所述的焊点寿命测试装置，其中，所述丝杠为滚珠丝杠。
  10. 根据权利要求6所述的焊点寿命测试装置，其中，所述主动轮包括第一齿轮，所述从动轮的数量为一个，所述从动轮包括第二齿轮，所述第二齿轮的齿数大于所述第一齿轮的齿数，且所述第二齿轮和所述第一齿轮相互啮合。
  11. 根据权利要求6所述的焊点寿命测试装置，其中，所述驱动结构还包括第一限位单元，所述第一限位单元位于与所述螺母连接的所述从动轮远离所述待测试件的一侧，且套设在所述丝杠上，所述第一限位单元与所述框架连接，所述第一限位单元设置为限制与所述螺母连接的所述从动轮在平行于所述丝杠方向上的直线运动，且所述丝杠可相对所述第一限定单元转动。
  12. 根据权利要求11所述的焊点寿命测试装置，其中，所述第一限位单元包括轴套和轴承，所述轴套位于所述螺母和所述从动轮之间，且所述轴套分别和所述螺母与所述从动轮连接，所述轴承位于所述轴套的外侧，所述轴承的外圈与所述框架连接，所述轴承的内圈和所述轴套连接，所述轴承的内圈可相对所述丝杠转动。
  13. 根据权利要求6所述的焊点寿命测试装置，其中，所述驱动结构还包括第二限位单元，所述第二限位单元包括直线限位槽和第二连接组件，所述直线限位槽的直线凹槽的深度方向平行于所述丝杠，且位于所述丝杠的一侧，所述直线限位槽的连接端与所述框架连接，所述第二连接组件垂直于所述丝杠设置，且所述第二连接组件的第一端位于所述直线凹槽内，可相对所述直线凹槽作直线运动，所述第二连接组件的第二端与所述丝杠的第二端连接，所述第二 限位单元设置为限制所述丝杠的转动。
  14. 根据权利要求1所述的焊点寿命测试装置，还包括位置传感器，所述位置传感器固定在所述框架上，设置为检测所述第一器件层和所述第二器件层的位置关系，所述位置传感器的信号输出端与所述驱动结构的控制端连接。
  15. 一种焊点寿命的预测方法，包括：
    通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，确定预设寿命预测公式中的常数和理论最大拉应力，其中，所述焊点寿命测试装置如权利要求1-14任一项所述的焊点寿命测试装置，所述理论最大拉应力为所述标准待测试件的焊点层在静载荷下发生失效对应的最大拉应力；
    根据所述预设寿命预测公式以及预设参数预测待测试件的寿命，其中，所述预设参数包括所述待测试件受到预设拉力产生变形时的力矩、预设最大拉应力和预设最小拉应力中的至少一种，其中，所述预设最小拉应力小于所述预设最大拉应力，所述预设最大拉应力小于所述理论最大拉应力，所述标准待测试件和所述待测试件的结构、尺寸和制作工艺均相同。
  16. 根据权利要求15所述的焊点寿命的预测方法，在所述通过焊点寿命测试装置对标准待测试件进行焊点寿命测试，确定寿命预测公式中的常数和理论最大拉应力之前，还包括：
    通过位置传感器检测所述标准待测试件在框架上的实际位置；
    在所述标准待测试件在框架上的实际位置和预设位置相符的情况下，通过调整所述焊点寿命测试装置的第一连接组件在所述焊点寿命测试装置的丝丝杠上的第一端的位置，以所述焊点寿命测试装置的的弹性单元处于平衡状态；
    对所述弹性单元施加预设数值的预紧力。
  17. 根据权利要求15所述的焊点寿命的预测方法，其中，所述预设寿命预测公式满足如下关系：
    Figure PCTCN2022081176-appb-100001
    其中，Np为所述待测试件的寿命，a 0为所述待测试件的焊点层的初始裂纹断裂深度；a p为所述待测试件的焊点层失效时的裂纹断裂深度，C和n为常数值，Δσ为最大拉应力和最小拉应力的差值，M为所述待测试件受到拉力产生变形时的力矩，N为对所述待测试件加载的周期性拉力的循环次数，a为所述待测试件的焊点层的裂纹断裂深度。
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