WO2022242225A1 - Module de caméra à temps de vol et dispositif électronique - Google Patents

Module de caméra à temps de vol et dispositif électronique Download PDF

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Publication number
WO2022242225A1
WO2022242225A1 PCT/CN2022/074027 CN2022074027W WO2022242225A1 WO 2022242225 A1 WO2022242225 A1 WO 2022242225A1 CN 2022074027 W CN2022074027 W CN 2022074027W WO 2022242225 A1 WO2022242225 A1 WO 2022242225A1
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WIPO (PCT)
Prior art keywords
camera module
area
circuit board
tof camera
chip
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PCT/CN2022/074027
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English (en)
Chinese (zh)
Inventor
曾媛媛
阎小霞
Original Assignee
深圳市汇顶科技股份有限公司
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Publication of WO2022242225A1 publication Critical patent/WO2022242225A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements

Definitions

  • the present application relates to the technical field of electronic products, in particular to a time-of-flight camera module and electronic equipment for ranging or 3D measurement.
  • Time of Flight (TOF) camera module is a commonly used depth camera module, which can be used to measure the depth of field (depth) or distance information, and can realize the three-dimensional imaging or distance detection function of the target object by electronic equipment.
  • the TOF camera module generally includes an optical signal transmitting (Tx) module and an optical signal receiving (Rx) module.
  • the common TOF emission modules on the market generally use surface light source TOF (Flood TOF), but the surface light source is limited by the luminous power and heat dissipation problems, and the output light intensity cannot be high, which affects the effective distance and detection of TOF detection. precision.
  • the industry is trying to use point light source TOF (Spot TOF).
  • spot TOF point light source TOF
  • the light signal from the light source in the Spot TOF to the target object after passing through the optical element is a limited number of speckle light signals, which are returned to the light receiving unit such as a complementary metal-oxide semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS) sensor.
  • CMOS complementary metal-oxide semiconductor
  • the number of effective light spot irradiation points and the number of pixels of the sensor are generally quite different (the pixels of the sensor are generally more than 100,000 pixels), so the number of pixels of the light spot returned by the sensor that can detect the target object is higher than that of the Flood TOF.
  • the number of speckles is limited. Therefore, in the Spot TOF solution, it is hoped that each speckle point can be effectively detected on the sensor side, which leads to TOF camera modules
  • the optical axis offset angle between the transmitting module and the receiving module is particularly sensitive. If there is an offset between the optical axis of the transmitting module and the optical axis of the receiving module, part of the speckle of the transmitting module will be reflected by the target object.
  • one solution is to rotate the optical axis of the transmitting module and the optical axis of the receiving module installed on the bracket plate, and correct the offset angle of the optical axis by rotating the module to make the transmitting module
  • the optical axis of the receiver is aligned with the optical axis of the receiving module.
  • the rotation angle of the optical axis of the transmitting module and the optical axis of the receiving module will be affected by various factors, and the correction of the optical axis offset by rotating the module is limited, thus affecting the TOF camera module. Imaging function or distance detection function.
  • Embodiments of the present application provide a TOF camera module and electronic equipment, which can effectively improve the optical axis offset between the transmitting module and the receiving module at a lower cost.
  • a TOF camera module including: a circuit board, including an upper surface and a lower surface, and the upper surface includes at least a first area and a second area that do not overlap each other; a transmitter chip, through a ceramic
  • the substrate is arranged in the first area for emitting light signals to the target object, wherein the projected area of the ceramic substrate on the upper surface of the circuit board is smaller than the area of the upper surface;
  • the first mirror seat is fixed on On the ceramic substrate, wherein the emitter chip is accommodated in the first mirror seat;
  • the optical device is fixed in the first mirror seat and arranged above the emitter chip, and the emitter
  • the optical signal emitted by the chip forms a speckle light signal after passing through the optical device;
  • the image sensor chip is arranged on the second area of the upper surface of the circuit board, and the image sensor chip is used to receive the speckle light signal
  • the depth optical signal returned after arriving at the target object is used to convert the depth optical signal into an electrical signal;
  • the second mirror seat is fixed on the
  • the emitter chip and the image sensor chip share a circuit board, so that when the emitter chip and the image sensor chip are arranged on the circuit board, they can refer to a common reference point (mark point) or refer to each other, which is beneficial to reduce
  • the alignment tolerance between the transmitter chip and the image sensor chip can greatly reduce the angle between the optical axis of the transmitter module and the relative optical axis of the receiver module, and improve the imaging function or distance detection function of the TOF camera module.
  • it can reduce the cost of the circuit board.
  • the transmitter module and the receiver module no longer need metal brackets during the assembly process, which not only helps to reduce the bracket cost of the TOF camera module, but also reduces the cost of the transmitter chip and the image sensor chip. There is also no need for an additional metal bracket assembly process, which is also conducive to reducing the assembly process cost of the TOF camera module.
  • the transmitting module and the receiving module do not share the mirror base, that is, the respective optical components of the transmitting module and the receiving module are independent structural parts. In this way, if a certain structural part is damaged, only the damaged structural part needs to be replaced. Yes, there is no need to replace the entire mirror base, which effectively reduces the cost of the TOF camera module.
  • the emitter chip and the first mirror base are arranged on the circuit board through the ceramic substrate. Since the ceramic substrate itself is an insulator and has good heat dissipation performance, the problem of thermoelectric separation of the transmitter module can be solved through the ceramic substrate. In addition, only the transmitter chip is set on the ceramic substrate, and the image sensor chip is set on the lower-cost circuit board, which is beneficial to further reduce the cost of the TOF camera module.
  • the projected area of the ceramic substrate on the upper surface of the circuit board is less than 15% of the area of the upper surface.
  • the projected area of the ceramic substrate on the upper surface of the circuit board is 9% of the area of the upper surface.
  • the optical device includes a shaping lens
  • the shaping lens is a collimating lens made of plastic
  • the shaping lens includes 3 lenses or 1 lens.
  • the optical device further includes: a diffractive optical element disposed above the shaping lens.
  • diffractive optical elements By configuring diffractive optical elements, it is helpful to spatially modulate the shaped light signal emitted by the shaped lens to form speckle light signals in multiple areas, which expands the measurement range of the TOF camera module and improves the accuracy of three-dimensional imaging or distance detection. precision.
  • the surface of the ceramic substrate is plane.
  • the area of the first region is smaller than the area of the second region. Setting the area of the first region smaller than the area of the second region, that is, setting the size of the ceramic substrate smaller, because the cost of the ceramic substrate is higher, so setting the size of the ceramic substrate smaller can further reduce the TOF imaging. The production cost of the module.
  • it also includes: an auxiliary device, arranged in a third area of the circuit board, for assisting the transmitter chip to generate the optical signal, wherein the third area is respectively connected to the The first area and the second area do not overlap.
  • the auxiliary device is arranged on a lower-cost circuit board, which further reduces the cost of the TOF camera module.
  • the third area is located on the upper surface of the circuit board.
  • the size of the first region and the third region in the first direction is greater than the size of the second region in the first direction, wherein the first direction is A direction perpendicular to a line connecting the center point of the optical axis of the image sensor chip and the center point of the optical axis of the emitter chip.
  • At least part of the third area is located on the lower surface of the circuit board.
  • a shielding case is further included, and at least part of the auxiliary components are arranged in the shielding case.
  • the shielding cover has openings for injecting heat-conducting silicone grease through the openings.
  • the heat-conducting silicone grease is injected into the shielding cover through openings, so that the heat-conducting silicone grease can quickly transfer the heat in the shielding cover to the external space, realize rapid cooling of the auxiliary chip, and improve the heat dissipation efficiency of the TOF camera module.
  • it further includes: a heat dissipation device disposed on the outer surface of the shielding case.
  • a heat dissipation device is arranged outside the shielding cover, so that the heat is transmitted outward through the thermal conductive silicone grease and then through the heat dissipation device, which effectively improves the heat dissipation speed. Moreover, the small-area concentrated heat emitted by the driver chip passes through the heat-conducting silicone grease and then passes through the large-area heat dissipation device, which can further increase the heat dissipation area.
  • the heat dissipation device includes a heat conduction pad and/or a heat dissipation copper sheet.
  • the emitter chip is then fixed on the ceramic substrate.
  • the circuit board is a flexible circuit board or a rigid-flex board or a printed circuit board.
  • the emitter chip is fixed to the ceramic substrate by a die-bonding process
  • the image sensor chip is fixed to the second region by a chip-bonding process.
  • an electronic device including: the time-of-flight TOF camera module in the first aspect or any possible implementation of the first aspect, the TOF camera module is used to measure depth information of a target object; A control unit, configured to control the operation of at least one function of the electronic device according to the depth information.
  • Fig. 1 is a schematic diagram of an offset between the optical axes of the transmitting module and the receiving module.
  • Fig. 2 is a schematic diagram of rotating the optical axis of the transmitting module and the optical axis of the receiving module.
  • FIG. 3 is a schematic structural diagram of a TOF camera module according to an embodiment of the present application.
  • FIG. 4 is a schematic perspective view of the three-dimensional structure of the TOF camera module according to the embodiment of the present application.
  • FIG. 5 is a top view of the TOF camera module shown in FIG. 4 .
  • FIG. 6 is a main flow chart of the production process of the TOF camera module according to the embodiment of the present application.
  • Fig. 7 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • the TOF camera module can include a TOF transmitter module (or called a transmitter unit) and a TOF receiver module (or called a receiver unit), wherein the transmitter module is used to transmit optical signals , the light signal irradiates the target object and returns to the receiving module to generate a depth light signal.
  • the target object can refer to the object to be photographed (or called shooting target, imaging target, detection target);
  • the optical signal, or the receiving module is used to sense the returned optical signal, and the depth optical signal carries the depth information of the object to be photographed, so that the imaging function or the distance measurement function of the target object can be realized.
  • the TOF can be divided into Flood TOF and Spot TOF.
  • the light signal projected by the light source in the Flood TOF to the target object after passing through the optical element is a relatively uniform surface light
  • the light signal in the Spot TOF that reaches the target object after the light source passes through the optical element is a speckle light signal, that is, a series of light spots Composed of arrays, or spot lights.
  • Spot TOF the optical signal emitted by the light source passes through the optical element and finally forms a speckle optical signal and projects it to the target object.
  • the TOF camera module is sensitive to the offset angle of the optical axis between the transmitting module and the receiving module. If there is an offset between the optical axis of the transmitting module and the optical axis of the receiving module, the transmitting There is an alignment tolerance between the transmitter chip of the module and the image sensor chip of the receiving module, which will affect the depth light signal received by the receiving module, thereby affecting the imaging effect or ranging effect of the electronic device on the target object.
  • the image sensor chip has an included angle of ⁇ 1 relative to the receiving end circuit board
  • the transmitter chip has an included angle of ⁇ 2 relative to the transmitting end circuit board
  • the included angle between the image sensor chip and the transmitter chip ⁇ ⁇ 1 + ⁇ 2 , in other words, the optical axis offset angle between the transmitting module and the receiving module is ⁇ .
  • the receiving module can receive 576 spot lights reflected by the target object, so that the receiving module can image or measure the target object based on the received 576 spot lights.
  • the module structure shown in Figure 1 may cause some spot lights to be lost, and the number of spot lights reflected by the target object received by the receiving module will be less than 576. Depth calculations may result in less accurate imaging or ranging.
  • a common TOF camera module usually includes an independent transmitter module and a receiver module.
  • a complete transmitter module includes transmitter chips, transmitter circuit boards, transmitter optical devices, etc., and the receiver module includes sensor chips. , the receiving end circuit board, the receiving end optical device, etc., the two modules are assembled and then installed on the same metal bracket.
  • the optical axis between the modules has no offset, that is, in order to reduce the alignment tolerance between the image sensor chip and the transmitter chip, the optical axis of the transmitting module and the optical axis of the receiving module can be rotated so that the transmitting
  • the optical axis of the module and the optical axis of the receiving module are aligned with each other please refer to FIG. 2 for details.
  • the rotation angle of the optical axis of the transmitting module and the optical axis of the receiving module will be affected by various factors, for example, limited by the metal bracket used to install the transmitting module and receiving module or the interior of the terminal electronic device Due to space constraints, the transmitting module and receiving module cannot be rotated to eliminate the optical axis offset at will, which affects the imaging function or ranging function of the TOF camera module.
  • the embodiment of the present application proposes a TOF camera module, which can effectively reduce the relative optical axis angle between the transmitting module and the receiving module at a lower cost, so as to improve the imaging function of the TOF camera module or ranging function.
  • FIG. 3 is a schematic structural diagram of a TOF camera module 100 according to an embodiment of the present application.
  • the TOF camera module 100 may include a circuit board 110 , an emitter chip 120 , an image sensor chip 130 , a first mirror mount 140 , a second mirror mount 150 , an optical device 160 , an imaging lens 170 and a ceramic substrate 180 .
  • the circuit board 110 includes an upper surface and a lower surface, and the upper surface at least includes a first area and a second area that do not overlap each other.
  • the transmitter chip 120 is disposed on the first area of the circuit board through the ceramic substrate 180 for emitting optical signals to the target object.
  • the projected area of the ceramic substrate 180 on the upper surface of the circuit board 110 is smaller than the area of the upper surface of the circuit board 110 .
  • the first mirror seat 140 is fixed on the ceramic substrate 180 , and the transmitter chip 120 is accommodated in the first mirror seat 140 .
  • the optical device 160 is fixed in the first mirror seat 140 and arranged above the transmitter chip 120 , and the optical signal emitted by the transmitter chip 120 forms a speckle optical signal after passing through the optical device 160 .
  • the image sensor chip 130 is disposed on the second area of the upper surface of the circuit board 110, wherein the image sensor chip 130 is used to receive the depth light signal returned after the speckle light signal irradiates the target object and is used to convert the depth light signal into an electrical signal. Signal.
  • the second mirror seat 150 is fixed on the circuit board 110 , wherein the image sensor chip 130 is accommodated in the second mirror seat 150 . It should be noted that the mirror base in the embodiment of the present application may also be called a bracket or a holder.
  • the imaging lens 170 is fixed in the second mirror seat 150 and disposed above the image sensor chip 130 for imaging the depth light signal to the image sensor chip 130 .
  • the circuit board 110 is electrically connected to the connector. In this way, the circuit board 110 can electrically connect the TOF camera module with the external circuit through the connector.
  • the circuit board 110 may be a flexible printed circuit (Flexible Printed Circuit, FPC). Since the FPC is relatively soft, as shown in FIG. 4 , when the circuit board 110 is an FPC, the TOF camera module 100 may further include a reinforcing piece 111 to support the FPC. Wherein, the reinforcing member 111 may be, but not limited to, steel sheet reinforcement.
  • the circuit board 110 may also be a printed circuit board (Printed Circuit Board, PCB) or a rigid-flex board. Wherein, when the circuit board 110 is a rigid-flex board, the TOF camera module 100 may also include reinforcements to improve the flatness of the TOF camera module 100 .
  • Circuits are provided on the surface of the ceramic substrate 180 for electrically connecting the transmitter chip 120 with the circuit board 110 .
  • the ceramic substrate 180 is a flat plate, that is, the surface of the ceramic substrate 180 is a plane, and the ceramic substrate 180 and the first mirror holder 150 are two independent structures.
  • the projected area of the ceramic substrate 180 on the upper surface of the circuit board 110 may be less than 15% of the area of the upper surface of the circuit board 110 .
  • the projected area of the ceramic substrate 180 on the upper surface of the circuit board 110 is 9% of the area of the upper surface of the circuit board 110 . Due to the high cost of the ceramic substrate, the projected area of the ceramic substrate on the upper surface of the circuit board 110 is only 9% of the area of the upper surface of the circuit board, which can further reduce the cost of the TOF camera module.
  • the first area is smaller than the second area, that is, the projected area of the ceramic substrate on the upper surface of the circuit board 110 is smaller than the projected area of the receiving module on the upper surface of the circuit board 110 . Since the cost of the ceramic substrate is relatively high, setting the size of the ceramic substrate smaller can also reduce the production cost of the TOF camera module.
  • the transmitter chip 120 may be a light source such as a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), a light emitting diode (Light Emitting Diodes, LED), or an array composed of a plurality of the above light sources, and is used to send out optical signals.
  • the light signal may be a light signal carrying a spatial optical pattern that has been optically modulated, processed or controlled, it may be a light signal that has been optically modulated, processed or controlled for sub-area illumination, or it may be a periodic light signal that has been optically modulated, processed or controlled light signal for sexual illumination, or a combination of the above light signals.
  • VCSEL is a semiconductor diode laser.
  • the emitted laser beam generally leaves the device from the top surface and in a substantially vertical manner.
  • VCSEL has many advantages such as small size, high power, small beam divergence angle, and stable operation.
  • the embodiment of this application uses VCSEL is illustrated as an example.
  • the transmitter chip 120 may be a VCSEL chip that emits light at multiple points on a single chip, and multiple light-emitting points are arranged in a two-dimensional matrix, correspondingly emitting multiple laser signals to form a matrix laser signal array.
  • the ceramic substrate 180 may be disposed on the circuit board 110 first, and then the transmitter chip 120 is disposed on the ceramic substrate 180 .
  • the ceramic substrate 180 can be pasted on the circuit board 110 by surface mount technology (Surface Mounted Technology, SMT), for example, a pad array can be set on the lower surface of the ceramic substrate 180, and the The ceramic substrate 180 is soldered to the circuit board 110 .
  • the emitter chip 120 may be bonded to the ceramic substrate 180 by a die bond (DB) process.
  • DB die bond
  • the optical device 160 includes a shaping lens, which is used to shape the optical path of the optical signal emitted by the transmitter chip 120 to obtain a shaped optical signal, for example, convert the optical signal emitted by the VCSEL into a collimated optical signal.
  • the shaping lens may be a collimating mirror, a projection objective lens, or any optical element that can achieve a beam shaping effect.
  • the embodiment of the present application takes a collimating mirror as an example. By configuring the collimating mirror, the diameter and divergence angle of the beam can be changed in the dimming system, so that the beam becomes a collimated parallel beam, and the energy of the beam is more concentrated, so that a small high power density spot can be obtained.
  • the TOF camera module can make the height of the transmitting module close to the height of the receiving module without adding other structures, which is beneficial to reduce the cost of the TOF camera module.
  • the shaping lens may include one lens. At this time, the cost of the shaping lens can be minimized, which can further reduce the cost of the TOF camera module.
  • the shaping lens can consist of a plurality of lenses arranged back and forth along the optical axis to form a lens group, for example, the shaping lens can include 3 lenses formed of common transparent materials. The performance of the TOF camera module is better when the shaping lens includes 3 lenses.
  • the shape of the shaping lens may be a square or another shape, which is not specifically limited in this embodiment of the present application.
  • the shaping lens can be made of glass or plastic. Considering that the plastic lens is not resistant to high temperature when the plastic lens is made of plastic, the thermal deformation temperature is about 120 degrees. Since the ceramic substrate 180 can be attached to the circuit board 110 through the SMT process, the temperature required by the SMT process is generally above 200 degrees. In addition, usually the shaping lens is fixed in the lens holder through a lens barrel, and the lens barrel is usually made of polycarbonate (PC) material, and the temperature resistance of the PC material is below 200 degrees. If the shaping lens is firstly fixed in the first lens holder 140 through the lens barrel and the first lens holder 140 is arranged on the ceramic substrate 180, and then the ceramic substrate 180 is arranged on the circuit board 110, the shaping lens and the mirror holder may be damaged .
  • PC polycarbonate
  • the ceramic substrate 180 is first installed on the circuit board 110, and after the transmitter chip 120 is arranged on the ceramic substrate 180, the shaping lens passes through the mirror The cylinder is accommodated in the first mirror holder 140 , and finally, the first mirror holder 140 is disposed on the ceramic substrate 180 , so that the shaping lens and the first mirror holder 140 can be effectively protected.
  • the imaging lens 170 may include a lens or a lens group composed of multiple lenses, and the multiple lenses are arranged forward and backward along the optical axis to form a lens group to image the depth light signal formed after reflection and/or scattering from the target object to the image sensor chip 130 .
  • the imaging lens 170 is made of plastic, and of course it can also be an optical lens made of other materials.
  • the imaging lens 170 is accommodated in the second mirror holder 150 .
  • the optical device 160 may further include a filter, which is located in the second mirror holder 150 and disposed between the image sensor chip 130 and the imaging lens 170 .
  • the optical device 160 may further include an optical signal replicating element, which is fixed in the first mirror holder 140 and arranged above the collimating mirror, for replicating the collimated optical signal to obtain the speckle optical signal.
  • the optical signal replication element can be at least one or more of a diffractive optical element (Diffractive Optical Elements, DOE), a micro lens array (Micro Lens Array, MLA), a grating or any other optical element that can form spot light combination of optical elements.
  • DOE diffractive Optical Elements
  • MLA Micro Lens Array
  • grating any other optical element that can form spot light combination of optical elements.
  • the embodiment of the present application uses the DOE as an example for description.
  • the DOE is usually made of glass or plastic, and is used to replicate the light beam emitted by the transmitter chip 120 at a certain multiple and project it outward into speckle light signals in multiple regions.
  • the diffraction capability of DOE determines the measurement range of the TOF camera module.
  • the speckle optical signal can be spatially modulated by configuring the optical signal replication element, which expands the measurement range of the TOF camera module and improves the measurement accuracy of the depth measurement.
  • the transmitter chip 120 can emit 20 light spots to form an optical signal
  • the optical signal is converted into a collimated optical signal after passing through a collimator
  • the optical signal replication element is a 3x3 DOE, it can achieve 3x3 light spots
  • the speckle light signal composed of 180 light spots will be projected onto the target object.
  • the TOF camera module 100 may further include an auxiliary device 190 for assisting the emitter chip 120 in generating an optical signal.
  • the auxiliary device 190 may include a driver chip for driving the emitter chip to emit light.
  • the auxiliary device 190 may also include other components, such as inductors, capacitors, resistors, and boost converters (boost).
  • the auxiliary device 190 is disposed on a third area of the circuit board 110, and the third area does not overlap with the first area and the second area respectively.
  • the third area may be located on the upper surface of the circuit board 110 .
  • the size of the first area and the third area in the first direction may be larger than the size of the second area in the first direction, the first direction being the center point of the optical axis of the image sensor chip 130 and the transmitter chip 120.
  • the direction perpendicular to the line connecting the optical axis center points (Baseline).
  • the third area may be located on the lower surface of the circuit board 110 .
  • the third area located on the lower surface of the circuit board 110 can be set on any area of the lower surface of the circuit board 110, for example, it can be the area opposite to the first area as shown in FIG. The opposite area of the two areas.
  • the space on the upper surface of the circuit board can be saved, which is conducive to reducing the size of the circuit board, thereby further reducing the size of the TOF camera module.
  • the TOF camera module 100 may further include a shielding case, wherein at least part of the auxiliary devices 190 are disposed in the shielding case.
  • the driver chip and the boost device can be arranged in the shielding case.
  • the shield only shields the heat in the third region and does not shield other regions (such as the first region), so that the size and production cost of the shield can be reduced.
  • the launch module and the shield are two independent components and are located in different areas of the circuit board, so it is not necessary to consider when the shield is installed on the circuit board 110 through the SMT process. Whether the shaping lens and mirror mount in the launch module will be damaged by high temperature.
  • the embodiment of the present application does not specifically limit the installation sequence of the shielding cover and the transmitting module.
  • the shielding cover can be pasted on the circuit board 110 before the ceramic substrate 180 , or, the entire transmitting module can be pasted on the circuit board 110 through the ceramic substrate 180 and then the shielding cover can be installed on the circuit board 110 .
  • the shielding case will affect the heat dissipation of the components inside the shielding case.
  • the driver chip is arranged in the shielding case, the heat of the driver chip is very concentrated, and the driver chip is too small to directly add a heat sink.
  • the shielding cover may be provided with an opening, so as to inject heat-conducting silicone grease through the opening.
  • thermally conductive silicone grease can be injected from the opening on the shield using a needle, and the inner space of the shield can be filled or filled into part of the space of the shield by using the flow characteristics of the silicone grease.
  • the imported silicone grease can be filled into the driver Between the chip and the shield.
  • the opening can be located on the top or the side wall of the shielding case.
  • the size and shape of the opening may be set according to actual applications, which is not specifically limited in this embodiment of the present application.
  • the heat-conducting silicone grease is injected into the shielding cover through openings, so that the heat-conducting silicone grease can quickly transfer the heat in the shielding cover to the external space, realizing the rapid cooling of the components in the shielding cover, and improving the TOF imaging performance.
  • the heat dissipation efficiency of the module is a technical solution.
  • a heat dissipation device may also be provided outside the shield, for example, a heat dissipation device may be provided on an outer surface of the shield.
  • the heat dissipation device may include a heat conduction pad and/or a heat dissipation copper sheet.
  • a heat dissipation device is arranged outside the shielding case, so that the heat is transmitted outward through the thermal conductive silicone grease and then through the heat dissipation device, which effectively improves the heat dissipation speed.
  • the small-area concentrated heat emitted by the driver chip passes through the heat-conducting silicone grease and then passes through the large-area heat dissipation device, which can further increase the heat dissipation area.
  • the structure of the TOF camera module 100 has been introduced in detail above, and the manufacturing process flow of the TOF camera module 100 will be described below with reference to FIG. 6 .
  • the receiving module adopts the conventional focusing process
  • the transmitting module adopts the automatic alignment (Active Alignment, AA) process.
  • the ceramic substrate 180 is first pasted on the circuit board 110 through the SMT process. Specifically, as described above, the ceramic substrate 180 can be soldered to the circuit board through the pad array by setting the pad array on the lower surface of the ceramic substrate 180. board 110.
  • the transmitter chip 120 is bonded to the ceramic substrate 180 by the DB process, and the image sensor chip 130 is also bonded to the circuit board 110 by the DB process.
  • the transmitter chip 120 and the image sensor chip 130 can be bonded with reference to a common mark point, which can greatly reduce the size of the transmitter chip 120. and the alignment tolerance of the image sensor chip 130, thereby reducing the rotation angle of the optical axis.
  • the transmitter chip 120 and the image sensor chip 130 may be referred to each other.
  • the image sensor chip 130 is pasted on the circuit board 110 with reference to the sticking position of the emitter chip 120 , which can also reduce the alignment tolerance between the emitter chip 120 and the image sensor chip 130 .
  • the emitter chip 120 is circuit-connected to the ceramic substrate 180 through a wire bond (WB) process using a wire bonding device.
  • WB wire bond
  • the pads on the emitter chip 120 and the pads on the ceramic substrate 180 are connected by gold wires.
  • the image sensor chip 130 is also electrically connected to the circuit board 110 through a WB process.
  • the imaging lens 170 is fixed in the second lens holder 150 through the lens barrel.
  • the filter can be fixed in the second mirror seat 150 first.
  • the bracket installation (Holder Mount, HM) and focusing steps that is to say, the pre-lock assembly obtained in the previous step (that is, the second mirror holder 150 with the imaging lens 170 installed) is arranged on the circuit board 110, And the imaging lens 170 is adjusted to a certain fixed position near the best imaging position through the thread between the imaging lens 170 and the second mirror holder 150 , that is, the imaging lens 170 is adjusted to a certain fixed height.
  • the optical device 160 is installed in the first mirror mount 140 .
  • the DOE is then assembled in the first mirror holder 140 with the shaping lens, and then the first mirror holder 140 with the DOE and the shaping lens installed on the ceramic substrate 180 on.
  • the optical device 160 and the emitter chip 120 are adjusted using the AA process, so that the optical device 160 is aligned with the emitter chip 120, so as to ensure that all the optical signals emitted by the emitter chip 120 can pass through the optical device 160 to form speckle light Signal.
  • the image sensor chip 130 can also be used to capture images in real time to optimize the AA process. Specifically, when using the AA process to adjust the optical device 160 and the transmitter chip 120, the image sensor chip 130 can collect the depth light signal in real time to determine whether the field of view of the transmitting module matches the field of view of the receiving module , that is, determine whether the image sensor chip 130 has collected all the depth light signals through the number of effective spot lights collected. If the image sensor chip 130 collects all the depth light signals, it can be determined that the optical device 160 and the emitter chip 120 are adjusted to an optimal position. If the image sensor chip 130 does not collect all the depth light signals, it can be determined that the optical device 160 and the emitter chip 120 have not been adjusted to the optimal position, and continue to use the AA process to adjust the optical device 160 and the emitter chip 120 .
  • the emitter chip and the image sensor chip share a circuit board and are arranged on the same surface of the circuit board, so that when the emitter chip and the image sensor chip are arranged on the circuit board, they can refer to a common mark point Or refer to each other, which is beneficial to reduce the alignment tolerance between the transmitter chip and the image sensor chip, thereby greatly reducing the rotation angle of the optical axis of the transmitting module and the optical axis of the receiving module, and improving the TOF camera module. Imaging function or distance detection function.
  • the TOF camera module in the embodiment of the present application only includes one circuit board, which can reduce the cost of circuit board materials and procedures.
  • the group and receiving module no longer need a metal bracket during the assembly process, which not only helps to reduce the bracket cost of the TOF camera module, but also does not require an additional metal bracket assembly process between the transmitter chip and the image sensor chip , It is also beneficial to reduce the assembly process cost of the TOF camera module.
  • the transmitting module and the receiving module do not share the mirror base, that is, the respective optical components of the transmitting module and the receiving module are independent structural parts. In this way, if a certain structural part is damaged, only the damaged structural part needs to be replaced. Yes, there is no need to replace the entire mirror base, which effectively reduces the cost of the TOF camera module.
  • the emitter chip and the first mirror base are arranged on the circuit board through the ceramic substrate. Since the ceramic substrate itself is an insulator and has good heat dissipation performance, the problem of thermoelectric separation of the transmitter module can be solved through the ceramic substrate. In addition, only the transmitter chip is set on the ceramic substrate, and the image sensor chip is set on the lower-cost circuit board, which is beneficial to further reduce the cost of the TOF camera module. In general, the heat dissipation of the launch module and the overall cost of the module can be taken into account.
  • the embodiment of the present application also provides an electronic device.
  • the electronic device 200 may include a TOF camera module 210 and a control unit 220 .
  • the TOF camera module 210 can be the TOF camera module 100 in the aforementioned embodiment, which is used to measure the depth information of the target object, and the control unit 220 can receive the depth information to operate at least one function of the electronic device 200 For example, distance-based camera focusing can be performed according to the measured depth information of the human face, or electronic devices can be unlocked according to the depth information, and so on.
  • the electronic devices in the embodiments of the present application may include devices that can realize complete or partial functions, such as smart phones, smart watches, or smart glasses; Devices used in conjunction with other devices such as smartphones, such as various smart bracelets and smart jewelry for physical sign monitoring.
  • the disclosed systems and devices can be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
  • the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium.
  • the technical solution of the present application is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of software products, and the computer software products are stored in a storage medium
  • several instructions are included to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disc and other media that can store program codes. .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)

Abstract

La présente invention concerne un module de caméra TOF (100) et un dispositif électronique qui peuvent atténuer efficacement, à faible coût, le décalage d'un axe optique entre un module d'émission et un module de réception. Le module de caméra TOF (100) comprend : une carte de circuit (110) qui comprend une surface supérieure et une surface inférieure, la surface supérieure comprenant au moins une première zone et une seconde zone qui ne se chevauchent pas ; une puce d'émetteur (120) qui est disposée dans la première zone au moyen d'un substrat en céramique (180), la zone d'une saillie du substrat en céramique (180) sur la surface supérieure de la carte de circuit (110) étant plus petite que la zone de la surface supérieure ; un premier support de lentille (140) qui est fixé sur le substrat en céramique (180), la puce d'émetteur (120) étant logée dans le premier support de lentille (140) ; un dispositif optique qui est fixé dans le premier support de lentille (140) et qui est disposé au-dessus de la puce d'émetteur (120) ; une puce de capteur d'image (130) disposée dans la seconde zone ; un second support de lentille (150) qui est fixé sur la surface supérieure de la carte de circuit (110), la puce de capteur d'image (130) étant logée dans le second support de lentille (150) ; et une lentille d'imagerie (170) qui est fixée dans le second support de lentille (150) et qui est disposée au-dessus de la puce de capteur d'image (130).
PCT/CN2022/074027 2021-05-21 2022-01-26 Module de caméra à temps de vol et dispositif électronique WO2022242225A1 (fr)

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CN215599370U (zh) * 2021-05-21 2022-01-21 深圳市汇顶科技股份有限公司 飞行时间摄像模组和电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107490842A (zh) * 2017-09-26 2017-12-19 北京地平线信息技术有限公司 摄像模组、成像设备和图像处理方法
CN111123292A (zh) * 2020-03-31 2020-05-08 深圳市汇顶科技股份有限公司 飞行时间发射模组、飞行时间检测装置和电子设备
US20200195909A1 (en) * 2018-12-14 2020-06-18 Sony Corporation Depth of field adjustment in images based on time of flight depth maps
CN211603554U (zh) * 2019-11-21 2020-09-29 南昌欧菲生物识别技术有限公司 Tof模组、摄像装置及电子设备
CN212694038U (zh) * 2020-04-20 2021-03-12 奥比中光科技集团股份有限公司 一种tof深度测量装置及电子设备
CN112532809A (zh) * 2019-08-28 2021-03-19 宁波舜宇光电信息有限公司 Tof摄像模组及其投射模块和电子设备
CN215599370U (zh) * 2021-05-21 2022-01-21 深圳市汇顶科技股份有限公司 飞行时间摄像模组和电子设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107490842A (zh) * 2017-09-26 2017-12-19 北京地平线信息技术有限公司 摄像模组、成像设备和图像处理方法
US20200195909A1 (en) * 2018-12-14 2020-06-18 Sony Corporation Depth of field adjustment in images based on time of flight depth maps
CN112532809A (zh) * 2019-08-28 2021-03-19 宁波舜宇光电信息有限公司 Tof摄像模组及其投射模块和电子设备
CN211603554U (zh) * 2019-11-21 2020-09-29 南昌欧菲生物识别技术有限公司 Tof模组、摄像装置及电子设备
CN111123292A (zh) * 2020-03-31 2020-05-08 深圳市汇顶科技股份有限公司 飞行时间发射模组、飞行时间检测装置和电子设备
CN212694038U (zh) * 2020-04-20 2021-03-12 奥比中光科技集团股份有限公司 一种tof深度测量装置及电子设备
CN215599370U (zh) * 2021-05-21 2022-01-21 深圳市汇顶科技股份有限公司 飞行时间摄像模组和电子设备

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