WO2020125388A1 - Module à temps de vol et dispositif électronique - Google Patents

Module à temps de vol et dispositif électronique Download PDF

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Publication number
WO2020125388A1
WO2020125388A1 PCT/CN2019/122350 CN2019122350W WO2020125388A1 WO 2020125388 A1 WO2020125388 A1 WO 2020125388A1 CN 2019122350 W CN2019122350 W CN 2019122350W WO 2020125388 A1 WO2020125388 A1 WO 2020125388A1
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WO
WIPO (PCT)
Prior art keywords
base
module
time
plate portion
rigid plate
Prior art date
Application number
PCT/CN2019/122350
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English (en)
Chinese (zh)
Inventor
唐玮
王娜
张绍刚
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2020125388A1 publication Critical patent/WO2020125388A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This application relates to the technical field of electronic products, in particular to a time-of-flight module and an electronic device applying the time-of-flight module.
  • an embodiment of the present application provides a time-of-flight module, including a base, a circuit board, a transmitting module, and a driving chip.
  • the base includes top and bottom surfaces disposed opposite to each other. Part of the bottom surface of the base is recessed to form a receiving space.
  • the circuit board includes an upper rigid board portion and a lower rigid board portion. The upper rigid plate portion is fixed to the top surface of the base. The lower rigid plate portion is fixed to the bottom surface of the base and covers the receiving space.
  • the transmitting module is fixed on a side of the upper rigid plate part away from the base.
  • the driving chip is accommodated in the accommodation space and fixed to the lower rigid plate portion. The driving chip is used to drive the transmitting module to emit a detection light signal.
  • the projection of the driving chip on the lower rigid plate portion and the projection of the transmitting module on the lower rigid plate portion at least partially overlap.
  • the transmitting module is fixed to the upper rigid plate portion
  • the driving chip is fixed to the lower rigid plate portion, the projection of the driving chip on the lower rigid plate portion and the projection of the transmitting module on the lower rigid plate portion at least partially overlap, so the The transmitting module is stacked on top of the driving chip, and the time-of-flight module can be stacked with the driving chip and placed side by side with the receiving module, so that the length of the time-of-flight module can be reduced ,
  • the projection area of the time-of-flight module on its installation plane is reduced, and the installation area of the electronic device for installing the time-of-flight module is reduced, so the time-of-flight module and the application of the time-of-flight module
  • the electronic devices of the group can be miniaturized.
  • the height of the receiving module is greater than the sum of the height of the transmitting module and the height of the driving chip, after the transmitting module and the driving chip are stacked, the height of the two may be less than or equal to the receiving
  • the height of the module reduces its length without increasing the height of the time-of-flight module, which is beneficial to miniaturization.
  • the base further includes a peripheral side surface connected between the top surface of the base and the bottom surface of the base, and the peripheral side surface of the base is provided with a heat dissipation notch.
  • the heat dissipation part is exposed from the heat dissipation notch. At this time, the heat generated by the transmitting module can be directly radiated from the peripheral space of the base through the heat dissipation portion, and the heat dissipation efficiency is high.
  • the number of the heat dissipation parts is two.
  • the two heat dissipation parts are respectively connected to opposite sides of the heat absorption part.
  • the number of the heat dissipation notches on the peripheral side surface of the base is also two, and the two heat dissipation notches are opposite to each other.
  • the heat dissipation frame can dissipate heat more uniformly using the space on the peripheral side of the base through the two heat dissipation portions provided opposite to each other, and the heat dissipation efficiency is high.
  • the heat dissipation frame further includes a fixing portion connected to the heat dissipation portion.
  • the fixing portion is connected to a peripheral edge of the heat dissipation portion that is not in contact with the heat absorption portion.
  • the base wraps the fixed part. At this time, the base can fix the heat dissipation portion by fixing the fixing portion, and the heat dissipation frame and the base have a higher firmness.
  • the heat absorbing part, the heat radiating part and the fixing part of the heat dissipation frame are integrally formed.
  • the heat dissipation frame can form a corresponding structure by bending an integrated plate. At this time, the heat dissipation frame has low processing difficulty and low cost.
  • the circuit board further includes a first reinforcement board and a second reinforcement board.
  • the upper surface of the first reinforcing plate is fixed to the side of the upper rigid plate portion facing away from the launch module through an adhesive layer.
  • the lower surface of the first reinforcing plate is fixed to the heat absorption portion of the heat dissipation frame through an adhesive layer. That is, the first reinforcement plate is located between the upper rigid plate portion and the heat absorption portion.
  • the first reinforcing plate can not only increase the structural strength of the upper rigid plate portion, but also quickly conduct the heat of the upper rigid plate portion to the heat absorption portion to increase the heat dissipation of the flight time module rate.
  • the first reinforcing plate may use metal materials such as stainless steel material, aluminum foil material or copper material.
  • the upper surface of the second reinforcing plate is fixed to the side of the lower rigid plate portion facing away from the base through an adhesive layer.
  • the second reinforcing plate can not only increase the structural strength of the lower rigid plate portion, but also participate in the heat dissipation of the flight time module to increase the heat dissipation speed of the flight time module.
  • the second reinforcing plate may use metal materials such as stainless steel material, aluminum foil material or copper material.
  • the material of the second reinforcement plate may be the same as the material of the first reinforcement plate, so as to reduce the types of materials and reduce the cost of the flight time module.
  • the aforementioned adhesive layer may be formed by a dispensing process or a coating process, or a double-sided adhesive material may also be used.
  • heat conductive particles such as graphite particles or metal particles
  • the transmitting module includes a substrate and a transmitter.
  • the substrate is fixed to the upper rigid plate portion.
  • the emitter is fixed to a side of the substrate facing away from the upper rigid plate portion.
  • the emitter may be a vertical cavity surface emitting laser.
  • the substrate may be a ceramic substrate. The substrate transfers the heat dissipated during the operation of the transmitter to the upper rigid plate portion.
  • the top surface of the base is provided with a raised limit post.
  • the heat absorption part is provided with a first hole.
  • the upper rigid plate portion is provided with a second hole communicating with the first hole.
  • the limit post extends into the first hole and the second hole. At this time, the cooperation of the limit post and the first hole makes the upper rigid plate part fixed to the base and the heat absorption part.
  • the number of the limit posts may be one or more.
  • the number of the first holes and the second holes is adapted to the number of the limit posts. For example, when the number of the limit posts is at least two, after the upper rigid plate portion is installed on the top surface of the base, the upper rigid plate portion will not rotate relative to the top surface of the base.
  • the first hole is staggered from the projection of the emitter on the upper rigid plate portion. At this time, the heat of the emitter can be transferred to the heat absorbing part more quickly.
  • the limiting arm is formed in a partial square ring shape.
  • the limit arm includes three first parts, a second part, and a third part connected in sequence, and the first part is disposed opposite to the third part.
  • a gap is formed between the end of the first part away from the second part and the end of the third part away from the second part.
  • the circuit board may extend from the gap into the inside of the limit arm.
  • the limit post is located inside the limit arm.
  • the limit arm when the limit arm has a square ring shape, the limit arm is provided with a mounting hole, so that the upper rigid plate portion can pass through the mounting hole and extend into the inside of the limit arm.
  • the first fixing glue can also be connected between the limit arm and the upper rigid plate portion.
  • the first fixing glue may also be connected between the limiting arm and the first reinforcing plate.
  • the first fixing glue may also be connected to the heat absorption part.
  • the first fixing glue may be doped with heat conductive particles (such as graphite particles or metal particles) to improve the heat conduction efficiency of the first fixing glue, so that the heat dissipation efficiency of the time-of-flight module is higher.
  • the circuit board further includes a flexible board portion connected between the upper rigid board portion and the lower rigid board portion.
  • the flexible board part is made of rolled copper with high bendability.
  • the flexible board portion may adopt a double-layer board structure to take into account both high bending performance and circuit transmission requirements.
  • a supporting block is protruded on the peripheral side surface of the base.
  • the top surface of the supporting block facing away from the peripheral side surface is a curved surface.
  • the top surface of the support block can be used to support the flex board portion to reduce the risk of damage to the flex board portion due to accidental bending.
  • the base integrates the lens mount structure of a traditional camera module, so that the lens can be mounted on the base, so that no additional lens mount is required in the time-of-flight module, thereby The amount of materials of the flight time module is saved, which is beneficial to reduce the cost of the flight time module.
  • FIG. 4 is a schematic structural view of the base of the flight time module shown in FIG. 3;
  • FIG. 1 is a rear view of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 involved in this application may be a mobile phone, a tablet computer, an e-reader, a notebook computer, a vehicle-mounted device, a wearable device, or the like.
  • the electronic device 100 is a mobile phone as an example.
  • the electronic device 100 includes a housing 10 and a display screen 20.
  • the housing 10 may include a back cover 101 and a frame 102.
  • the frame 102 is connected to the periphery of the back cover 101.
  • the frame 102 can be integrally formed with the rear cover 101 or can be assembled to form an integrated structure.
  • the display screen 20 is installed on a side of the frame 102 facing away from the rear cover 101.
  • the display screen 20 integrates display and touch functions.
  • the electronic device 100 further includes a time of flight (TOF) module 30.
  • the time-of-flight module 30 is installed on the housing 10 and is located inside the housing 10.
  • the time-of-flight module 30 includes a transmitting module 1 and a receiving module 2.
  • the transmitting module 1 is used to emit a detection light signal.
  • the receiving module 2 is used to receive the induced light signal.
  • the sensing optical signal is an optical signal formed by reflecting the detected optical signal by the object to be measured.
  • the sensing light signal carries depth information of the object to be measured.
  • the distance between the object to be measured and the time-of-flight module 30 can be calculated by calculating the time difference or phase difference between the time-of-flight module 30 transmitting the detection light signal and the reception of the sensing light signal.
  • the time-of-flight module 30 can be applied to environments such as ranging, face recognition, avatar unlocking, gesture recognition, object modeling, 3D games, and smart home.
  • the orientation of the time-of-flight module 30 may also be the same as the orientation of the display screen 20.
  • the display screen 20 faces the front position of the electronic device 100.
  • the time-of-flight module 30 can photograph the object to be measured located in front of the electronic device 100.
  • the installation plane of the flight time module 30 is a plane on which other components are used to install the flight time module 30.
  • the XY plane may be parallel or substantially parallel to the display screen 20.
  • the circuit board 4 includes an upper rigid plate portion 41, a lower rigid plate portion 42, and a flexible plate portion 43 connected between the upper rigid plate portion 41 and the lower rigid plate portion 42.
  • the upper rigid plate portion 41 and the lower rigid plate portion 42 are hardly bendable.
  • the flexible plate portion 43 can be bent. When the flexible plate portion 43 is deformed, the relative positional relationship between the upper rigid plate portion 41 and the lower rigid plate portion 42 can be changed.
  • the circuit board 4 may be a printed circuit board combining hard and soft.
  • the upper rigid plate portion 41 and the lower rigid plate portion 42 may be a rigid printed circuit board portion of a rigid-flexible printed circuit board, and the flexible plate portion 43 may be flexible in the rigid-flexible printed circuit board.
  • Printed circuit board part is a printed circuit board part.
  • the circuit board 4 further includes a first reinforcement board 44 and a second reinforcement board 45.
  • the upper surface of the second reinforcing plate 45 is fixed to the side of the lower rigid plate portion 42 facing away from the base 3 through an adhesive layer 451.
  • the second reinforcing plate 45 can not only increase the structural strength of the lower rigid plate portion 42, but also participate in the heat dissipation of the time-of-flight module 30 to increase the speed of heat dissipation of the time-of-flight module 30.
  • the second reinforcing plate 45 may use metal materials such as stainless steel material, aluminum foil material or copper material.
  • the material of the second reinforcement plate 45 may be the same as the material of the first reinforcement plate 44 to reduce the types of materials and reduce the cost of the flight time module 30.
  • the reinforcing rubber strip 410 When the reinforcing rubber strip 410 is also connected to the launch module 1, the firmness of the connection between the circuit board 4 and the launch module 1 is increased, and at the same time, the bending stress at the junction can be further increased Scattered to reduce the risk of damage to the circuit board 4.
  • the cross-sectional shape of the reinforcing rubber strip 410 may be triangular to improve the reinforcing effect.
  • the reinforcing rubber strip 410 can be formed by dispensing.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un module à temps de vol (30) et un dispositif électronique (100) le comprenant. Le module à temps de vol (30) comprend une base (3), une carte de circuit imprimé (4), un module de transmission (1) et une puce de pilotage (5). Une partie de la surface inférieure (32) de la base (3) est évidée pour former un espace de logement (38). La carte de circuit imprimé (4) comprend une partie plaque rigide supérieure (41) et une partie plaque rigide inférieure (42). La partie plaque rigide supérieure (41) est fixée à la surface supérieure (31) de la base (3), et la partie plaque rigide inférieure (42) est fixée à la surface inférieure (32) de la base (3) et recouvre l'espace de logement (38). Le module de transmission (1) est fixé sur le côté de la partie plaque rigide supérieure (41) à distance de la base (3). La puce de pilotage (5) est logée dans l'espace de logement (38) et est fixée à la partie plaque rigide inférieure (42). La puce de pilotage (5) sert à piloter le module de transmission (1) pour envoyer un signal lumineux de détection. La projection de la puce de pilotage (5) sur la partie plaque rigide inférieure (42) chevauche au moins partiellement la saillie du module de transmission (1) sur la partie plaque rigide inférieure (42). Le module à temps de vol (30) comprend en outre un cadre de dissipation thermique (6) intégré dans la base (3). Le dispositif de dissipation thermique (6) comprend une partie absorption de chaleur (61) et une partie dissipation de chaleur (62) connectée à la partie absorption de chaleur (61). La partie absorption de chaleur (61) est située entre la partie plaque rigide supérieure (41) et la base (3), et la partie dissipation de chaleur (62) est exposée à l'extérieur de la base (3). Le module à temps de vol (30) peut être miniaturisé.
PCT/CN2019/122350 2018-12-21 2019-12-02 Module à temps de vol et dispositif électronique WO2020125388A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811573237.3A CN109737868A (zh) 2018-12-21 2018-12-21 飞行时间模组及电子设备
CN201811573237.3 2018-12-21

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WO2021195978A1 (fr) * 2020-03-31 2021-10-07 深圳市汇顶科技股份有限公司 Module de transmission de temps de vol, dispositif de mesure de temps de vol, et dispositif électronique
WO2021195980A1 (fr) * 2020-03-31 2021-10-07 深圳市汇顶科技股份有限公司 Module de transmission de temps de vol, appareil de détection de temps de vol, et dispositif électronique
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CN111123292B (zh) * 2020-03-31 2020-06-26 深圳市汇顶科技股份有限公司 飞行时间发射模组、飞行时间检测装置和电子设备
CN111487729A (zh) * 2020-04-10 2020-08-04 武汉昱升光器件有限公司 一种光器件耦合uv胶水点胶方法
CN117321381A (zh) * 2021-10-26 2023-12-29 京东方科技集团股份有限公司 飞行时间相机模组及显示设备
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