WO2022231106A1 - Laser processing apparatus for monitoring laser power - Google Patents

Laser processing apparatus for monitoring laser power Download PDF

Info

Publication number
WO2022231106A1
WO2022231106A1 PCT/KR2022/002828 KR2022002828W WO2022231106A1 WO 2022231106 A1 WO2022231106 A1 WO 2022231106A1 KR 2022002828 W KR2022002828 W KR 2022002828W WO 2022231106 A1 WO2022231106 A1 WO 2022231106A1
Authority
WO
WIPO (PCT)
Prior art keywords
power
laser
laser beam
unit
workpiece
Prior art date
Application number
PCT/KR2022/002828
Other languages
French (fr)
Korean (ko)
Inventor
김명진
박명수
이정운
Original Assignee
주식회사 휴비스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 휴비스 filed Critical 주식회사 휴비스
Publication of WO2022231106A1 publication Critical patent/WO2022231106A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity

Definitions

  • the present invention relates to a laser processing apparatus that monitors the power of a laser beam irradiated to a workpiece to monitor an abnormal state of each part and whether the laser beam is output normally, and monitors the laser power capable of laser processing.
  • a laser processing device is a device widely used in the processing industry such as welding, cutting, or surface treatment. It contains an optical fiber for transmission to the head.
  • the laser oscillator detects the power, waveform, wavelength, etc. of the output laser beam as disclosed in Patent Registration No. 10-1259638 and adjusts the output so that the measured value of the output detection unit maintains the output value set according to the processing purpose By configuring it so that the laser processing quality can be guaranteed.
  • the laser processing quality depends on the laser beam emitted through the processing head.
  • Patent Registration No. 10-1138454 by measuring the power of the laser beam just before it is emitted from the processing head and comparing it with the output of the laser oscillator, contamination, damage, deterioration, etc. in the optical fiber and processing head are monitored. It can also be used to adjust the output of the laser oscillator.
  • the quality of laser processing is determined by whether there is an abnormality in the laser oscillator itself or the suitability of output control in the laser oscillator, it is difficult to monitor the overall abnormality occurring in the laser processing apparatus only by monitoring the output laser beam power. In general, it is difficult to monitor the various factors affecting the quality of laser processing.
  • Patent Document 1 KR 10-1259638 B1 2013.04.24.
  • Patent Document 2 KR 10-1138454 B1 2012.04.13.
  • the present invention can monitor the power of the laser beam irradiated to the workpiece to determine whether there is an abnormality in each part as a whole, and monitor the laser beam irradiated to the workpiece in real time and adjust the power of the laser beam to improve the quality of laser processing. It aims to provide a laser processing device that can guarantee
  • the present invention transmits a laser beam oscillated and output by the laser oscillator 1 to the processing head 3 through the optical fiber 2, and collimating the laser beam in the processing head 3
  • the laser beam power emitted through the laser emitting unit 33 is calculated from the power measured by the power detection unit 4, and the laser beam power, the laser beam power and the laser beam power output to the laser oscillator 1 are a monitoring unit 7 that monitors the amount of power change during transmission and the pattern of the laser beam power appearing as a difference, and determines whether the laser beam is suitable for emitting and whether there is an abnormality from the laser oscillator 1 to the vent mirror 32 ; further includes.
  • the monitoring unit 7 adjusts the output of the laser oscillator 1 according to at least one of the laser beam power, the amount of power change during transmission, and the pattern of the laser beam power.
  • the monitoring unit 7 extracts a ripple component according to a pattern of laser beam power, and determines whether laser beam emission is appropriate according to the size of the ripple component.
  • the monitoring unit 7 determines the output suitability of the laser oscillator 1 according to the pattern of the laser beam power.
  • the monitoring unit 7 adjusts a control parameter applied to control the output of the laser oscillator 1 according to a pattern of laser beam power.
  • the power is measured by detecting the reflected light that is generated by irradiating the laser beam on the workpiece W, flows into the laser emitting part 33 and then passes through the vent mirror 32, but , a reflected light detection unit 5 that allows the transmission of visible light or infrared light flowing along the inflow path of the reflected light; and a processing point detection unit 6 that detects visible light or infrared light transmitted through the reflected light detection unit 5 to obtain an image of the workpiece (W) or a temperature of the workpiece (W).
  • the monitoring unit 7 calculates the power of the reflected light generated when the laser beam is reflected on the workpiece W according to the power measured by the reflected light detection unit 5, the reflected light power, It is determined whether the laser beam is suitable for emitting the laser beam and whether the laser emitting unit 33 is abnormal by monitoring the amount of power change during emission, the image of the workpiece, or the temperature, which appears according to the difference between the laser beam power and the reflected light power.
  • the monitoring unit 7 adjusts the output of the laser oscillator 1 according to the amount of power change during emission, the image of the workpiece, or the temperature.
  • the present invention configured as described above analyzes the pattern of the laser beam as well as the power of the laser beam irradiated toward the workpiece, and analyzes the amount of power change on the optical path, and monitors the laser oscillator and the overall optical path for emitting the laser beam. In addition, it is possible to ensure the quality of laser processing by monitoring whether the output of the laser beam substantially irradiated to the workpiece is normal.
  • FIG. 1 is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a block diagram of a monitoring unit 7
  • FIG. 3 is a waveform diagram (a) of the laser beam power measured by the power detection unit (4), and a waveform diagram (b) of the laser beam power obtained by suppressing noise by the monitoring unit (7).
  • the laser processing apparatus includes a laser oscillator 1 for laser processing, an optical fiber 2 and a processing head 3 in addition to the processing head 3 . Further comprising a power detection unit 4 for detecting the power of the laser beam emitted to irradiate the work W, and a monitoring unit 7 for monitoring the detected power of the laser beam, and additionally the work W It may also include a reflected light detection unit 5 for detecting the laser beam reflected in the light and a workpiece state detection unit 6 for detecting the processing state of the workpiece (W) to which the laser beam is irradiated.
  • the laser oscillator 1, the optical fiber 2 and the processing head 3 are known components in the technical field related to the laser processing apparatus, and can be deformed according to a processing method such as welding, cutting, surface treatment, etc. Components are also well known, so we briefly describe them first.
  • the laser oscillator 1 includes an oscillation unit 11 that generates a laser beam of a preset power according to a processing method, a detection unit 13 that detects the power of the generated laser beam, and a detection unit 13 that detects the power of the generated laser beam. ) and a controller 12 for controlling to output a laser beam of a set power by adjusting according to the detected power.
  • the controller 12 controls the oscillator 11 PID (Proportional-Integral-Differential) according to the error between the power detected by the detection unit 13 and the set power to output a laser beam of the set power.
  • PID control calculates the control value by combining the proportional term that multiplies the error signal by the proportional parameter, the integral term that multiplies the signal obtained by integrating the error signal by the integral parameter, and the differential term that multiplies the signal obtained by differentiating the error signal by the differential parameter.
  • the detector 13 may be configured to detect a waveform or wavelength of the generated laser beam, and the controller 12 may be configured to generate and output a laser beam having a preset waveform or wavelength.
  • the optical fiber 2 forms an optical path for transmitting the laser beam generated and output by the laser oscillator 1 to the processing head 3 .
  • the processing head 3 has a collimation lens 31 that converts and collimates a laser beam radially emitted from the end of the optical fiber 2 into parallel light, and is converted into parallel light by the collimation lens 31 .
  • a vent mirror 32 that redirects the laser beam in a direction deflected by 90° and guides it toward the laser emitting unit 33, and the laser beam reflected by the vent mirror 32 is emitted toward the workpiece W, and the workpiece W ) includes a laser emitting unit 33 for processing. Accordingly, the laser beam emitted from the optical fiber 2 is irradiated to the workpiece W through the collimation lens 31 , the vent mirror 32 , and the laser emission unit 33 sequentially.
  • the laser emitting unit 33 shows an embodiment configured as a galvanometer scanner to scan the workpiece W and irradiate a laser beam. That is, the laser emission unit 33 includes a focus lens 332 facing the workpiece 332 to focus the laser beam toward the processing point WP of the workpiece W, the focus lens 332 and the workpiece. A protective lens 333 disposed between 332 to protect the focus lens 332, and a focus lens 333 disposed opposite the vent mirror 32 to reflect the laser beam reflected from the vent mirror 32 It includes a total reflection mirror 331 that faces 332 and is rotatable by at least two orthogonal rotation axes to change the output direction of the laser beam.
  • total reflection mirror 331 Although only one total reflection mirror 331 is shown in the drawing, it is known that at least one of the plurality of total reflection mirrors can be rotated to sequentially reflect the plurality of total reflection mirrors to face the focus lens 332 . Since it is a technology, further detailed description will be omitted.
  • the vent mirror 32 is configured to partially transmit the laser beam.
  • the transmittance of the laser beam that is not reflected by the vent mirror 32 and is transmitted may be approximately 1%.
  • a beam splitter having a relatively small ratio of transmitted light power to reflected light power may be used.
  • the vent mirror 32 transmits infrared or visible light to obtain the processing point WP temperature or image of the workpiece W, so that the transmittance of infrared or visible light is high. It is good to be configured.
  • the power detection unit 4 the reflected light detection unit 5, the processing point detection unit 6 and the monitoring unit 7, which are characteristic components of the present invention, will be described.
  • the power detection unit 4 receives and photoelectrically converts a part of the laser beam that is incident on the vent mirror 32 and transmitted without being reflected among the laser beams that have passed through the collimation lens 31 as parallel light.
  • the power of the laser beam is output as an electrical signal.
  • a laser beam of low power passes through the vent mirror 32 according to the laser beam transmittance of the vent mirror 32 .
  • the power detection unit 4 includes a light attenuation unit 41 for passing the laser beam passing through the vent mirror 32 while power attenuating, and a laser beam attenuated by the light attenuation unit 41 . It is composed of a vent mirror 42 that reflects and converts the reflection by 90°, and a photoelectric conversion unit 43 that photoelectrically converts the laser beam reflected by the vent mirror 42 and outputs the power of the laser beam as an electrical signal. .
  • the light attenuation means 41 may be, for example, a light diffusion plate or an ND (Neutral Density) filter, and may be implemented in a way that the reflective surface of the vent mirror 42 is surface-treated to lower the reflectance.
  • the light attenuation means 41 further attenuates the laser beam transmitted by the vent mirror 32 to a power suitable for light reception by the photoelectric conversion unit 43 .
  • the photoelectric conversion unit 43 includes a photodiode that receives the laser beam and converts it into an electrical signal, and an amplifier that amplifies the electrical signal, so as to measure the power of the laser beam into an electrical signal, and measure The power of one laser beam is transmitted to the monitoring unit 4 .
  • a photodiode that receives the laser beam and converts it into an electrical signal
  • an amplifier that amplifies the electrical signal, so as to measure the power of the laser beam into an electrical signal, and measure The power of one laser beam is transmitted to the monitoring unit 4 .
  • the reflected light detector 5 is a component that receives and measures the power of the laser beam reflected by the vent mirror 32 and emitted to the laser emitting unit 33 is reflected on the workpiece (W). It is arranged to receive the reflected light passing through the vent mirror 32 after traveling in the reverse direction along the path of the laser beam that is incident on the laser emitting unit 33 among the reflected light.
  • W workpiece
  • the reflected light detection unit 5 includes the vent mirror 51 that reflects the reflected light passing through the vent mirror 32 so as to change the traveling direction by 90°, and the power of the reflected light reflected by the vent mirror 51 . It is composed of a light attenuation unit 52 that attenuates and transmits the light, and a photoelectric conversion unit 53 that receives the reflected light whose power is attenuated by the light attenuation unit 52 and outputs it as an electrical signal.
  • the light attenuation unit 51 and the photoelectric conversion unit 53 of the reflected light detection unit 5 may be configured in the same manner as the light attenuation unit 41 and the photoelectric conversion unit 43 of the power detection unit 4 .
  • the light attenuation means 51 of the reflected light detection unit 5 and the light attenuation means 41 of the power detection unit 4 may have different attenuation rates according to the power of the incident beam.
  • the vent mirror 51 of the reflected light detection unit 5 also has a high transmittance for visible light and infrared light like the vent mirror 32, so that visible light and Infrared light is transmitted to the following processing point detection unit 6 .
  • the processing point detection unit 6 is a camera for photographing a portion irradiated with a laser beam from the laser emitting unit 33 in the workpiece W, or an infrared sensor for detecting the processing state of the corresponding portion, or a camera and an infrared ray. It may be configured to include all sensors. In the embodiment of the present invention, it will be described that the processing point detection unit 6 is configured to include both a camera and an infrared sensor.
  • the vent mirror 32 and the vent mirror 51 of the reflected light detection unit 5 use a mirror having high transmittance of infrared radiation and visible light, so that the vent mirror 52 of the reflected light detection unit 5 is By disposing the processing point detection unit 6 behind it, it is possible to detect infrared radiation and visible light.
  • the processing point detection unit 6 includes a filter 61 that blocks the laser beam and transmits infrared radiation and visible light among the light transmitted through the vent pre-51 of the reflected light detection unit 5; It includes a vent mirror 62 that reflects the light filtered by the filter 61 to change a light path by 90°, and a sensor unit 63 that receives the light reflected by the vent mirror 62 .
  • the sensor unit 63 includes a camera and an infrared sensor, and obtains an image and a temperature of a portion irradiated with a laser beam in the workpiece W.
  • the monitoring unit 7 includes the laser beam power measured by the power detection unit 4, the laser reflected light power measured by the reflected light detection unit 5, the image and temperature obtained by the processing point detection unit 6, and the The oscillation laser beam power measured by the detection unit 13 of the laser oscillator 1 is received and output to a monitor (not shown).
  • the monitoring unit 7 includes a noise removing unit 71 that removes noise with respect to the received laser beam power, laser reflected light power, and temperature, and preset laser beam power.
  • a laser power conversion unit 72 that converts the laser beam power emitted to the laser emission unit 33 according to the conversion ratio, and the laser reflected light power to the reflected light power from the workpiece W according to a preset conversion ratio.
  • a reflected light power conversion unit 73 an output verification unit 74 that compares and verifies the laser beam power converted by the laser power conversion unit 72 with the laser beam power oscillated by the laser oscillator 1, and the laser power
  • An absorption verification unit 75 that calculates and verifies the laser beam power absorbed by the workpiece W according to the laser beam power converted by the conversion unit 72 and the reflected light power converted by the reflected light power conversion unit 73; It includes a processing state verification unit 76 for verifying the laser processing state of the workpiece (W) according to the image and temperature, and will be described in more detail as follows.
  • the laser beam power before noise is removed by the noise removing unit 71 is mixed with noise.
  • noise may be generated by the photodiode of the photoelectric conversion unit 43 , an optical path until reaching the photodiode, and the like.
  • the laser beam power of which noise is suppressed by filtering with a filter that removes high frequency shows a waveform as shown in FIG. 3(b).
  • the preset conversion ratio applied by the laser power conversion unit 72 is, for example, a laser measured by the power detection unit 4 by performing an experiment for measuring the laser beam power emitted from the laser emission unit 33 . It can be obtained according to the relative ratio with the beam power.
  • the preset conversion ratio applied by the reflected light power conversion unit 73 is, for example, the ratio of the light incident to the laser emission unit 33 among the reflected light generated by being reflected from the workpiece W to the workpiece W and the laser emission. It is estimated according to the relative position of the part 33 and the size of the exit hole of the laser emitting part 33 , and may be obtained by additionally reflecting the transmittance of the vent mirror 32 . Alternatively, it can be obtained according to a relative ratio with the power measured by the reflected light detector 5 by performing an experiment for measuring the reflected light reflected from the workpiece W.
  • the output verification unit 74 includes a power verification unit 741 that verifies the size suitability of the laser beam power according to the difference between the laser beam power and the oscillation laser beam power, and the pattern suitability of the laser beam power according to the pattern of the laser beam power. and a pattern verification unit 742 that verifies
  • the oscillating laser beam oscillated and output by the laser oscillator 1 is attenuated through the optical fiber 2, the collimation lens 31 and the vent mirror 32 and is detected by the power detection unit 4, the When the contamination, damage or deterioration of the optical fiber 2, the collimation lens 31, and the vent mirror 32 does not occur, the amount of power attenuation is measured by an experiment, and the range of the allowable power attenuation ratio is appropriately pre-set. can be set.
  • the power verification unit 741 is suitable if the power attenuation ratio obtained by the difference between the laser beam power measured through the power detection unit 4 and the oscillation laser beam power measured through the laser oscillator 1 is within a set range. If it is out of the set range, it can be judged as non-conforming. Here, it can be seen that the non-conformity determination is made when at least one of the optical fiber 2 , the collimation lens 31 , and the vent mirror 32 is contaminated, damaged, or deteriorated.
  • the power verification part 741 is the workpiece. The suitability of the laser beam power irradiated to (W) can be judged.
  • the laser beam power converted into the laser beam power irradiated to the workpiece W may be different from the laser beam power actually irradiated to the workpiece W due to contamination, damage or deterioration of the laser emitting part 33, but contamination, As described later, damage or deterioration can be indirectly determined by the absorption verification unit 75 or the processing state verification unit 76 .
  • the pattern verification unit 742 may verify a change in laser beam power appearing over time, and specifically determine suitability according to a size of a ripple component of the laser beam power.
  • the laser beam power measured by the power detection unit 4 is not constant and the ripple ingredients appear.
  • the laser oscillator 1 Since, for example, the size of the ripple component may vary according to control parameters applied to the proportional term, the integral term and the derivative term when the output is adjusted according to the PID control in the laser oscillator 1, the laser oscillator 1 ) can be used to verify the output of In addition, the ripple component generated by the laser oscillator 1 may be generated under the influence of the optical fiber 2 in the optical path of the laser beam.
  • the pattern verification unit 742 sets a value that is a standard for determining suitability for the magnitude of the ripple component of the measured laser beam power in advance, and determines the ripple component obtained by pattern analysis. It was configured to judge the suitability of the laser output according to the result of comparison with the set ripple component size.
  • the absorption verification unit 75 is a laser absorbed by the workpiece W as a difference between the laser beam power obtained by converting the laser power conversion unit 72 and the laser reflected light power obtained by converting the reflected light source conversion unit 73 .
  • the power is calculated, and it is determined whether an abnormal state is generated according to the contamination, damage, or deterioration of the laser emitting unit 33 according to the variation of the difference.
  • the energy can be calculated by integrating the laser beam power and the laser reflected light power over time, respectively, and the energy absorbed by the workpiece W can be calculated according to the difference in the calculated energy, and according to the change in the energy difference It may be determined whether an abnormal state of the laser emitting unit 33 has occurred.
  • the processing state verification unit 76 may determine the suitability of the processing state according to the image of the processing part of the workpiece W, and may determine the suitability of the processing state according to the temperature of the processing part.
  • the processing site temperature is known to be appropriately adjusted according to the processing method classified into welding, cutting, surface treatment, etc., or the material and thickness of the workpiece (W). By setting a suitable value according to the temperature, it is possible to determine the suitability by comparing it with the measured temperature of the processed part.
  • the laser beam power, the laser reflected light power, the image of the processing part, the temperature of the processing part, and the power absorbed by the processing part described above are obtained in real time and output to the monitor so that they can be compared with each other, as well as the output verification unit ( 74), the absorption verification unit 75 and the processing state verification unit 76 may output the suitability determined by the monitor.
  • the monitoring unit 7 may adjust the output of the laser oscillator 1 according to the laser beam power, the laser reflected light power, and the processing site absorption power, and according to the ripple component of the laser beam power, the laser oscillator 1 ) can be adjusted.
  • laser emission unit 331 total reflection mirror 332: focus lens
  • vent mirror 52 light attenuation means 53: photoelectric conversion unit

Abstract

The present invention relates to a laser processing apparatus for monitoring laser power, the apparatus monitoring the power of a laser beam emitted at an object to be processed, so as to be capable of performing laser processing while monitoring for abnormal states of individual parts and whether a laser beam is normally outputted, and, more specifically, comprises: a power detection unit (4) for measuring the power of a portion of a laser beam to be outputted from a laser processing apparatus composed of a laser oscillator (1), an optical fiber (2), and a processing head (3); and a monitoring unit (7) for determining whether the power of the laser beam is normal and whether an optical path is abnormal, according to laser beam power calculated on the basis of the measured power, power variation while transmitting the laser beam, and a laser beam pattern.

Description

레이저 파워를 모니터링하는 레이저 가공 장치Laser processing unit monitoring laser power
본 발명은 가공물에 조사하는 레이저 빔의 파워를 모니터링하여 각 부위의 이상 상태 및 레이저 빔의 정상 출력 여부를 감시하며 레이저 가공할 수 있는 레이저 파워를 모니터링하는 레이저 가공 장치에 관한 것이다.The present invention relates to a laser processing apparatus that monitors the power of a laser beam irradiated to a workpiece to monitor an abnormal state of each part and whether the laser beam is output normally, and monitors the laser power capable of laser processing.
레이저 가공 장치는 용접, 절단 또는 표면 처리 등의 가공업 분야에서 널리 사용되는 장치로서, 레이저 빔을 생성하여 출력하는 레이저 발진기, 레이저 빔을 가공물에 출사하는 가공 헤드, 레이저 발진기에서 생성한 레이저 빔을 가공 헤드에 전송하기 위한 광섬유를 포함한다.A laser processing device is a device widely used in the processing industry such as welding, cutting, or surface treatment. It contains an optical fiber for transmission to the head.
여기서, 레이저 발진기는 등록특허 제10-1259638호에 개시된 바와 같이 출력하는 레이저 빔의 파워, 파형, 파장 등을 검출하여 출력 검출부의 측정 값이 가공 목적에 따라 설정한 출력 값을 유지하도록 출력을 조정하게 구성함으로써, 레이저 가공 품질을 보장할 수 있다.Here, the laser oscillator detects the power, waveform, wavelength, etc. of the output laser beam as disclosed in Patent Registration No. 10-1259638 and adjusts the output so that the measured value of the output detection unit maintains the output value set according to the processing purpose By configuring it so that the laser processing quality can be guaranteed.
그런데, 레이저 발진기에서 출력하는 레이저 빔은 광섬유 및 가공 헤드를 경유하여 출사되므로, 광섬유 및 가공 헤드가 오염되거나 손상 또는 열화되면, 레이저 가공 품질이 저하된다. 즉, 레이저 가공 품질은 가공 헤드를 통해 출사하는 레이저 빔에 의해 좌우된다.However, since the laser beam output from the laser oscillator is emitted via the optical fiber and the processing head, if the optical fiber and the processing head are contaminated, damaged, or deteriorated, the laser processing quality is deteriorated. That is, the laser processing quality depends on the laser beam emitted through the processing head.
이에 따라, 등록특허 제10-1138454호에 개시된 바와 같이 가공 헤드에서 출사하기 직전의 레이저 빔의 파워를 측정하여 레이저 발진기의 출력과 비교함으로써, 광섬유 및 가공 헤드에서의 오염, 손상, 열화 등을 감시할 수 있고, 레이저 발진기의 출력을 조정하는 데 이용할 수도 있다.Accordingly, as disclosed in Patent Registration No. 10-1138454, by measuring the power of the laser beam just before it is emitted from the processing head and comparing it with the output of the laser oscillator, contamination, damage, deterioration, etc. in the optical fiber and processing head are monitored. It can also be used to adjust the output of the laser oscillator.
하지만, 레이저 발진기 자체에서 이상 여부 또는 레이저 발진기에서의 출력 제어 적합성에 따라 레이저 가공의 품질을 결정되므로, 출사하는 레이저 빔 파워의 모니터링하는 것만으로는 레이저 가공 장치에서 발생하는 이상 여부 전반을 감시하기 어렵고, 레이저 가공의 품질에 영향을 주는 다양한 요인에 대해서도 전반적으로 감시하기 어렵다.However, since the quality of laser processing is determined by whether there is an abnormality in the laser oscillator itself or the suitability of output control in the laser oscillator, it is difficult to monitor the overall abnormality occurring in the laser processing apparatus only by monitoring the output laser beam power. In general, it is difficult to monitor the various factors affecting the quality of laser processing.
[선행기술문헌][Prior art literature]
[특허문헌][Patent Literature]
(특허문헌 1) KR 10-1259638 B1 2013.04.24.(Patent Document 1) KR 10-1259638 B1 2013.04.24.
(특허문헌 2) KR 10-1138454 B1 2012.04.13.(Patent Document 2) KR 10-1138454 B1 2012.04.13.
따라서, 본 발명은 가공물에 조사하는 레이저 빔의 파워를 모니터링하여 각 부위의 이상 여부를 전반적으로 판정할 수 있고, 가공물에 조사되는 레이저 빔을 실시간 감시하며 레이저 빔의 파워를 조절함으로써 레이저 가공의 품질을 보장할 수 있는 레이저 가공 장치를 제공하는 데 목적을 둔다.Therefore, the present invention can monitor the power of the laser beam irradiated to the workpiece to determine whether there is an abnormality in each part as a whole, and monitor the laser beam irradiated to the workpiece in real time and adjust the power of the laser beam to improve the quality of laser processing. It aims to provide a laser processing device that can guarantee
상기 목적을 달성하기 위해 본 발명은 레이저 발진기(1)에서 발진하여 출력한 레이저 빔을 광섬유(2)를 통해 가공 헤드(3)에 전송하고, 가공 헤드(3)에서 레이저 빔을 시준을 위한 콜리메이션 렌즈(31), 반사시켜 방향 전환하는 벤트 미러(32) 및 가공물(W)을 향해 집광하여 출사하는 레이저 출사부(33)에 순차적으로 경유시켜 가공물(W)을 향해 조사하는 레이저 가공 장치에 있어서, 상기 레이저 출사부(33)에서 출사하려는 레이저 빔 중에 상기 벤트 미러(32)에서 반사되지 않고 투과하는 레이저 빔을 수광하여 파워를 측정하는 파워 검출부(4); 상기 레이저 출사부(33)를 통해 출사하는 레이저 빔 파워를 상기 파워 검출부(4)로 측정한 파워로부터 연산하고, 레이저 빔 파워, 레이저 빔 파워와 상기 레이저 발진기(1)에 출력하는 레이저 빔 파워의 차이로 나타나는 전송 중 파워 변화량, 및 레이저 빔 파워의 패턴에 대해 모니터링하며 레이저 빔 출사의 적합성 여부와 레이저 발진기(1)부터 상기 벤트 미러(32)까지의 이상 여부를 판정하는 모니터링부(7);를 더욱 포함한다.In order to achieve the above object, the present invention transmits a laser beam oscillated and output by the laser oscillator 1 to the processing head 3 through the optical fiber 2, and collimating the laser beam in the processing head 3 The mation lens 31, the vent mirror 32 that reflects and changes the direction, and the laser processing device that irradiates toward the work W by sequentially passing through the laser emitting unit 33 that condenses and emits light toward the work W. In the laser emitting unit 33, a power detection unit (4) for measuring power by receiving a laser beam that is transmitted without being reflected by the vent mirror (32) among the laser beam to be emitted; The laser beam power emitted through the laser emitting unit 33 is calculated from the power measured by the power detection unit 4, and the laser beam power, the laser beam power and the laser beam power output to the laser oscillator 1 are a monitoring unit 7 that monitors the amount of power change during transmission and the pattern of the laser beam power appearing as a difference, and determines whether the laser beam is suitable for emitting and whether there is an abnormality from the laser oscillator 1 to the vent mirror 32 ; further includes.
본 발명의 일 실시 예에 따르면, 상기 모니터링부(7)는 레이저 빔 파워, 전송 중 파워 변화량 및 레이저 빔 파워의 패턴 중에 적어도 어느 하나에 따라 상기 레이저 발진기(1)의 출력을 조절하게 한다.According to an embodiment of the present invention, the monitoring unit 7 adjusts the output of the laser oscillator 1 according to at least one of the laser beam power, the amount of power change during transmission, and the pattern of the laser beam power.
본 발명의 일 실시 예에 따르면, 상기 모니터링부(7)은 레이저 빔 파워의 패턴에 따라 리플(ripple) 성분을 추출하여, 리플 성분의 크기에 따라 레이저 빔 출사의 적합성 여부를 판정한다.According to an embodiment of the present invention, the monitoring unit 7 extracts a ripple component according to a pattern of laser beam power, and determines whether laser beam emission is appropriate according to the size of the ripple component.
본 발명의 일 실시 예에 따르면, 상기 모니터링부(7)는 레이저 빔 파워의 패턴에 따라 상기 레이저 발진기(1)의 출력 적합성을 판정한다.According to an embodiment of the present invention, the monitoring unit 7 determines the output suitability of the laser oscillator 1 according to the pattern of the laser beam power.
본 발명의 일 실시 예에 따르면, 상기 모니터링부(7)는 상기 레이저 발진기(1)에서 출력 제어하는 데 적용되는 제어 파라메타를 레이저 빔 파워의 패턴에 따라 조절한다.According to an embodiment of the present invention, the monitoring unit 7 adjusts a control parameter applied to control the output of the laser oscillator 1 according to a pattern of laser beam power.
본 발명의 일 실시 예에 따르면, 레이저 빔을 가공물(W)에 조사함에 따라 발생하여 상기 레이저 출사부(33)로 유입된 후 상기 벤트 미러(32)를 투과하는 반사광을 검출하여 파워를 측정하되, 반사광의 유입 경로를 따라 유입되는 가시광 또는 적외선의 투과를 허용하는 반사광 검출부(5); 및 상기 반사광 검출부(5)를 투과한 가시광 또는 적외선을 검출하여 가공물(W) 영상 또는 가공물(W) 온도를 얻는 가공점 검출부(6);를 더욱 포함한다.According to an embodiment of the present invention, the power is measured by detecting the reflected light that is generated by irradiating the laser beam on the workpiece W, flows into the laser emitting part 33 and then passes through the vent mirror 32, but , a reflected light detection unit 5 that allows the transmission of visible light or infrared light flowing along the inflow path of the reflected light; and a processing point detection unit 6 that detects visible light or infrared light transmitted through the reflected light detection unit 5 to obtain an image of the workpiece (W) or a temperature of the workpiece (W).
본 발명의 일 실시 예에 따르면, 상기 모니터링부(7)는 레이저 빔이 가공물(W)에 반사되어 발생하는 반사광의 파워를 상기 반사광 검출부(5)에서 측정한 파워에 따라 연산하고, 반사광 파워, 레이저 빔 파워와 반사광 파워의 차이에 따라 나타나는 출사 중 파워 변화량, 가공물 영상 또는 온도에 대해 모니터링하여 레이저 빔 출사의 적합성 여부와 상기 레이저 출사부(33)의 이상 여부를 판정한다.According to an embodiment of the present invention, the monitoring unit 7 calculates the power of the reflected light generated when the laser beam is reflected on the workpiece W according to the power measured by the reflected light detection unit 5, the reflected light power, It is determined whether the laser beam is suitable for emitting the laser beam and whether the laser emitting unit 33 is abnormal by monitoring the amount of power change during emission, the image of the workpiece, or the temperature, which appears according to the difference between the laser beam power and the reflected light power.
본 발명의 일 실시 예에 따르면, 상기 모니터링부(7)는 출사 중 파워 변화량, 가공물 영상 또는 온도에 따라 상기 레이저 발진기(1)의 출력을 조절한다.According to an embodiment of the present invention, the monitoring unit 7 adjusts the output of the laser oscillator 1 according to the amount of power change during emission, the image of the workpiece, or the temperature.
상기와 같이 구성되는 본 발명은 가공물을 향해 조사하는 레이저 빔의 파워 뿐만 아니라 레이저 빔의 패턴을 분석하고, 광경로 상의 파워 변화량을 분석하여, 레이저 발진기 및 레이저 빔 출사를 위한 광경로 전반에 대해 모니터링하며, 가공물에 실질적으로 조사되는 레이저 빔의 출력 정상여부도 모니터링하여, 레이저 가공의 품질을 보장할 수 있다.The present invention configured as described above analyzes the pattern of the laser beam as well as the power of the laser beam irradiated toward the workpiece, and analyzes the amount of power change on the optical path, and monitors the laser oscillator and the overall optical path for emitting the laser beam. In addition, it is possible to ensure the quality of laser processing by monitoring whether the output of the laser beam substantially irradiated to the workpiece is normal.
도 1은 본 발명의 실시 예에 따른 레이저 가공 장치의 구성도.1 is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention.
도 2는 모니터링부(7)의 블록 구성도.2 is a block diagram of a monitoring unit 7;
도 3은 파워 검출부(4)로 측정한 레이저 빔 파워의 파형도(a)와, 모니터링부(7)에서 노이즈 억제한 레이저 빔 파워의 파형도(b).3 is a waveform diagram (a) of the laser beam power measured by the power detection unit (4), and a waveform diagram (b) of the laser beam power obtained by suppressing noise by the monitoring unit (7).
이하, 본 발명의 실시 예들에 대하여 첨부한 도면을 참고로 하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 구체적이고 다양한 예시들을 보여주며 설명한다. 그러나, 본 발명의 실시 예들은 본 발명의 범위 내에서 다양한 변경이나 수정을 통해 실시될 수 있음도 분명하므로, 설명하는 실시 예들에 한정되지는 않는다. 그리고, 본 발명의 실시예들은 잘 알려진 부품, 회로, 기능, 방법, 전형적인 상세한 내용에 대해서는 본 발명이 속한 기술 분야에서 통상의 지식을 가진 자가 추가하여 실시할 수 있으므로, 자세히 기술하지 않기로 한다.Hereinafter, specific and various examples are shown and described so that those of ordinary skill in the art to which the present invention pertains can easily carry out the embodiments of the present invention with reference to the accompanying drawings. However, since it is also clear that the embodiments of the present invention can be practiced through various changes or modifications within the scope of the present invention, it is not limited to the described embodiments. Further, the embodiments of the present invention will not be described in detail because well-known parts, circuits, functions, methods, and typical details can be implemented by those of ordinary skill in the art to which the present invention pertains.
도 1에 도시한 구성도를 참조하면, 본 발명의 실시 예에 따른 레이저 가공 장치는 레이저 가공을 위한 레이저 발진기(1), 광섬유(2) 및 가공 헤드(3)에 더하여 가공 헤드(3)에서 가공물(W)에 조사하기 위해 출사하는 레이저 빔의 파워를 검출하기 위한 파워 검출부(4)와 검출한 레이저 빔의 파워를 모니터링하는 모니터링부(7)를 더욱 포함하고, 부가적으로 가공물(W)에 반사된 레이저 빔을 검출하기 위한 반사광 검출부(5) 및 레이저 빔이 조사된 가공물(W)의 가공 상태를 검출하기 위한 가공물 상태 검출부(6)도 포함할 수 있다.Referring to the configuration diagram shown in FIG. 1 , the laser processing apparatus according to an embodiment of the present invention includes a laser oscillator 1 for laser processing, an optical fiber 2 and a processing head 3 in addition to the processing head 3 . Further comprising a power detection unit 4 for detecting the power of the laser beam emitted to irradiate the work W, and a monitoring unit 7 for monitoring the detected power of the laser beam, and additionally the work W It may also include a reflected light detection unit 5 for detecting the laser beam reflected in the light and a workpiece state detection unit 6 for detecting the processing state of the workpiece (W) to which the laser beam is irradiated.
상기 레이저 발진기(1), 광섬유(2) 및 가공 헤드(3)는 레이저 가공 장치에 관련된 기술분야에서 공지의 구성요소이고, 용접, 절단, 표면 처리 등을 예로 들수 있는 가공법에 따라 변형할 수 있는 구성요소라는 점도 잘 알려져 있으므로, 먼저 간략하게 설명한다.The laser oscillator 1, the optical fiber 2 and the processing head 3 are known components in the technical field related to the laser processing apparatus, and can be deformed according to a processing method such as welding, cutting, surface treatment, etc. Components are also well known, so we briefly describe them first.
상기 레이저 발진기(1)는 가공법에 따라 미리 설정된 파워의 레이저 빔을 생성하는 발진부(11)와, 생성하는 레이저 빔의 파워를 검출하는 검출부(13)와, 생성하는 레이저 빔의 파워를 검출부(13)로 검출한 파워에 따라 조절하여 설정 파워의 레이저 빔을 출력하도록 제어하는 컨트롤러(12)를 포함한다. The laser oscillator 1 includes an oscillation unit 11 that generates a laser beam of a preset power according to a processing method, a detection unit 13 that detects the power of the generated laser beam, and a detection unit 13 that detects the power of the generated laser beam. ) and a controller 12 for controlling to output a laser beam of a set power by adjusting according to the detected power.
예를 들어, 컨트롤러(12)는 검출부(13)에서 검출한 파워와 설정 파워 사이의 오차에 따라 발진부(11)를 PID(Proportional-Integral-Differential) 제어하여 설정 파워의 레이저 빔을 출력하게 할 수 있다. PID 제어는 오차 신호에 비례 파라메터를 곱하는 비례항, 오차 신호를 적분하여 얻는 신호에 적분 파라메타를 곱하는 적분항 및 오차 신호를 미분하여 얻는 신호에 미분 파라메타를 곱하는 미분항을 조합하여 제어값을 연산하며, 제어 파라메터을 적절하게 적용함으로써, 하여, 제어값에 따라 제어하는 출력의 정상상태(steady-state) 오차와 오버슛(overshoot)을 줄일 수 있다.For example, the controller 12 controls the oscillator 11 PID (Proportional-Integral-Differential) according to the error between the power detected by the detection unit 13 and the set power to output a laser beam of the set power. have. PID control calculates the control value by combining the proportional term that multiplies the error signal by the proportional parameter, the integral term that multiplies the signal obtained by integrating the error signal by the integral parameter, and the differential term that multiplies the signal obtained by differentiating the error signal by the differential parameter. By properly applying the control parameter, it is possible to reduce the steady-state error and overshoot of the output controlled according to the control value.
또한, 검출부(13)는 생성하는 레이저 빔의 파형 또는 파장을 검출하게 구성하고, 컨트롤러(12)는 미리 설정하여 둔 파형 또는 파장의 레이저 빔을 생성하여 출력하도록 제어하게 구성할 수도 있다.In addition, the detector 13 may be configured to detect a waveform or wavelength of the generated laser beam, and the controller 12 may be configured to generate and output a laser beam having a preset waveform or wavelength.
상기 광섬유(2)는 상기 레이저 발진기(1)에서 생성하여 발진 출력하는 레이저 빔을 상기 가공 헤드(3)에 전송하기 위한 광경로를 형성한다.The optical fiber 2 forms an optical path for transmitting the laser beam generated and output by the laser oscillator 1 to the processing head 3 .
상기 가공 헤드(3)는 상기 광섬유(2)의 단부에서 방사상으로 출사하는 레이저 빔을 평행광으로 변환하여 시준하는 콜리메이션 렌즈(31)와, 콜리메이션 렌즈(31)에 의해 평행광으로 변환된 레이저 빔을 90°편향된 방향으로 방향 전환시켜 레이저 출사부(33)를 향해 유도하는 벤트 미러(32)와, 벤트 미러(32)에 반사된 레이저 빔을 가공물(W)을 향해 출사하여 가공물(W)을 가공하는 레이저 출사부(33)를 포함한다. 이에 따라, 광섬유(2)에서 출사되는 레이저 빔은 콜리메이션 렌즈(31), 벤트 미러(32) 및 레이저 출사부(33)를 순차적으로 경유하여 가공물(W)에 조사된다.The processing head 3 has a collimation lens 31 that converts and collimates a laser beam radially emitted from the end of the optical fiber 2 into parallel light, and is converted into parallel light by the collimation lens 31 . A vent mirror 32 that redirects the laser beam in a direction deflected by 90° and guides it toward the laser emitting unit 33, and the laser beam reflected by the vent mirror 32 is emitted toward the workpiece W, and the workpiece W ) includes a laser emitting unit 33 for processing. Accordingly, the laser beam emitted from the optical fiber 2 is irradiated to the workpiece W through the collimation lens 31 , the vent mirror 32 , and the laser emission unit 33 sequentially.
예시적으로 상기 레이저 출사부(33)는 가공물(W)을 스캔하며 레이저 빔을 조사하도록 갈바노미터 스캐너(Galvanometer scanner)로 구성한 실시 예를 보여주었다. 즉, 상기 레이저 출사부(33)는 레이저 빔을 가공물(W)의 가공점(WP)을 향해 집광하기 위해 가공물(332)과 마주하게 한 포커스 렌즈(332)와, 포커스 렌즈(332)와 가공물(332) 사이에 배치하여 포커스 렌즈(332)를 보호하는 보호 렌즈(333)와, 상기 벤트 미러(32)와 대향하게 배치하며 상기 벤트 미러(32)에서 반사된 레이저 빔을 반사시켜 포커스 렌즈(332)를 향하게 하되 적어도 직교하는 2개 회전축으로 회동 가능하여 레이저 빔의 출력 방향을 가변할 수 있게 한 전반사 미러(331)를 포함한다. 도면에는 하나의 전반사 미러(331)만 도시하였으나, 복수의 전반사 미러 중에 적어도 어느 하나를 회동 가능하게 하여 복수의 전반사 미러에 순차적으로 반사되게 하여 포커스 렌즈(332)를 향하게 구성할 수 있음은 공지의 기술이므로 더 이상의 상세 설명은 생략한다.Illustratively, the laser emitting unit 33 shows an embodiment configured as a galvanometer scanner to scan the workpiece W and irradiate a laser beam. That is, the laser emission unit 33 includes a focus lens 332 facing the workpiece 332 to focus the laser beam toward the processing point WP of the workpiece W, the focus lens 332 and the workpiece. A protective lens 333 disposed between 332 to protect the focus lens 332, and a focus lens 333 disposed opposite the vent mirror 32 to reflect the laser beam reflected from the vent mirror 32 It includes a total reflection mirror 331 that faces 332 and is rotatable by at least two orthogonal rotation axes to change the output direction of the laser beam. Although only one total reflection mirror 331 is shown in the drawing, it is known that at least one of the plurality of total reflection mirrors can be rotated to sequentially reflect the plurality of total reflection mirrors to face the focus lens 332 . Since it is a technology, further detailed description will be omitted.
다만, 본 발명의 실시 예에서는 상기 벤트 미러(32)에서 레이저 빔을 부분 투과시키게 구성한다. 예를 들어, 상기 벤트 미러(32)에서 반사되지 아니하고 투과하는 레이저 빔의 투과율을 대략 1%으로 되게 구성할 수 있다. 하지만 예시한 투과율 값으로 한정하는 것은 아니며, 예를 들어 반사광 파워 대비 투과광 파워의 비율이 상대적으로 매우 작은 빔 스플리터로 구성할 수 있다.However, in the embodiment of the present invention, the vent mirror 32 is configured to partially transmit the laser beam. For example, the transmittance of the laser beam that is not reflected by the vent mirror 32 and is transmitted may be approximately 1%. However, it is not limited to the exemplified transmittance value, and for example, a beam splitter having a relatively small ratio of transmitted light power to reflected light power may be used.
한편, 본 발명의 실시 예에서는 후술하는 바와 같이, 상기 벤트 미러(32)가 적외선 또는 가시광을 투과시켜 가공물(W)의 가공점(WP) 온도 또는 영상을 얻으므로, 적외선 또는 가시광의 투과율이 높게 구성되는 것이 좋다.On the other hand, in the embodiment of the present invention, as will be described later, the vent mirror 32 transmits infrared or visible light to obtain the processing point WP temperature or image of the workpiece W, so that the transmittance of infrared or visible light is high. It is good to be configured.
이하, 본 발명의 특징적 구성요소인 파워 검출부(4), 반사광 검출부(5), 가공점 검출부(6) 및 모니터링부(7)에 대해 설명한다.Hereinafter, the power detection unit 4, the reflected light detection unit 5, the processing point detection unit 6 and the monitoring unit 7, which are characteristic components of the present invention, will be described.
상기 파워 검출부(4)는 상기 콜리메이션 렌즈(31)를 통과하여 평행광으로 된 레이저 빔 중에 상기 벤트 미러(32)에 입사되어 반사되지 아니하고 투과하는 일부 레이저 빔을 수광하여 광전 변환함으로써, 투과한 레이저 빔의 파워를 전기적 신호로 출력한다. 앞서 설명한 바와 같이 상기 벤트 미러(32)의 레이저 빔 투과율에 따라 적은 파워의 레이저 빔이 상기 벤트 미러(32)를 투과한다.The power detection unit 4 receives and photoelectrically converts a part of the laser beam that is incident on the vent mirror 32 and transmitted without being reflected among the laser beams that have passed through the collimation lens 31 as parallel light. The power of the laser beam is output as an electrical signal. As described above, a laser beam of low power passes through the vent mirror 32 according to the laser beam transmittance of the vent mirror 32 .
구체적인 실시 예에 따르면, 상기 파워 검출부(4)는 상기 벤트 미러(32)를 투과한 레이저 빔을 파워 감쇄하며 통과시키는 광감쇄 수단(41)과, 광감쇄 수단(41)에 의해 감쇄된 레이저 빔을 반사시켜 90°반향 전환하는 벤트 미러(42)와, 벤트 미러(42)에 의해 반사된 레이저 빔을 광전 변환하여서, 레이저 빔의 파워를 전기적 신호로 출력하는 광전 변환부(43)로 구성된다. According to a specific embodiment, the power detection unit 4 includes a light attenuation unit 41 for passing the laser beam passing through the vent mirror 32 while power attenuating, and a laser beam attenuated by the light attenuation unit 41 . It is composed of a vent mirror 42 that reflects and converts the reflection by 90°, and a photoelectric conversion unit 43 that photoelectrically converts the laser beam reflected by the vent mirror 42 and outputs the power of the laser beam as an electrical signal. .
상기 광감쇄 수단(41)은 예를 들어, 광 확산판 아니면 ND(Neutral Density) 필터로 구성할 수 있고, 벤트 미러(42)의 반사면을 표면처리하여 반사율을 낮추는 방식으로 구현할 수도 있다. 이러한 광감쇄 수단(41)은 상기 벤트 미러(32)에 의해 투과된 레이저 빔을 광전 변환부(43)로 수광하기에 적절한 파워로 좀더 감쇄시킨다.The light attenuation means 41 may be, for example, a light diffusion plate or an ND (Neutral Density) filter, and may be implemented in a way that the reflective surface of the vent mirror 42 is surface-treated to lower the reflectance. The light attenuation means 41 further attenuates the laser beam transmitted by the vent mirror 32 to a power suitable for light reception by the photoelectric conversion unit 43 .
상기 광전 변환부(43)는 레이저 빔을 수광하여 전기신호로 변환하는 포토 다이오드(photodiode)와, 전기신호를 증폭하는 증폭기를 구비하게 구성하여, 레이저 빔의 파워를 전기신호로 측정하게 하고, 측정한 레이저 빔의 파워를 상기 모니터링부(4)에 전달하게 한다. 여기서, 포토 다이오드로 레이저 빔의 파워를 얻음으로, 레이저 빔의 파워가 순시적으로 가변하더라도 순시적으로 변화하는 레이저 빔의 파워를 정확하게 검출할 수 있다. The photoelectric conversion unit 43 includes a photodiode that receives the laser beam and converts it into an electrical signal, and an amplifier that amplifies the electrical signal, so as to measure the power of the laser beam into an electrical signal, and measure The power of one laser beam is transmitted to the monitoring unit 4 . Here, by obtaining the power of the laser beam with the photodiode, it is possible to accurately detect the instantaneously changing power of the laser beam even if the power of the laser beam is instantaneously changed.
상기 반사광 검출부(5)는 상기 벤트 미러(32)에 반사되어 상기 레이저 출사부(33)로 출사한 레이저 빔이 가공물(W)에 반사되어 형성되는 레이저 반사광을 수광하여 파워 측정하는 구성요소로서, 반사광 중에 상기 레이저 출사부(33)로 입사되어서 출사한 레이저 빔의 경로를 따라 역방향으로 진행한 후 상기 벤트 미러(32)를 투과하는 반사광을 수광하도록 배치된다. 여기서도, 상기에서 설명한 바와 같이 상기 벤트 미러(32)에 입사된 레이저 반사빔 중에 일부만 투과하여 수광된다.The reflected light detector 5 is a component that receives and measures the power of the laser beam reflected by the vent mirror 32 and emitted to the laser emitting unit 33 is reflected on the workpiece (W). It is arranged to receive the reflected light passing through the vent mirror 32 after traveling in the reverse direction along the path of the laser beam that is incident on the laser emitting unit 33 among the reflected light. Here too, as described above, only a portion of the reflected laser beam incident on the vent mirror 32 is transmitted and received.
구체적인 실시 예에 따르면 상기 반사광 검출부(5)는 상기 벤트 미러(32)를 투과한 반사광의 진행방향을 90°전환시키도록 반사시키는 벤트 미러(51), 벤트 미러(51)에 반사된 반사광의 파워를 감쇄시키며 투과시키는 광감쇄 수단(52) 및 광감쇄 수단(52)에 의해 파워 감쇄된 반사광을 수광하여 전기적 신호로 출력하는 광전 변환부(53)으로 구성된다. According to a specific embodiment, the reflected light detection unit 5 includes the vent mirror 51 that reflects the reflected light passing through the vent mirror 32 so as to change the traveling direction by 90°, and the power of the reflected light reflected by the vent mirror 51 . It is composed of a light attenuation unit 52 that attenuates and transmits the light, and a photoelectric conversion unit 53 that receives the reflected light whose power is attenuated by the light attenuation unit 52 and outputs it as an electrical signal.
여기서, 상기 반사광 검출부(5)의 광감쇄 수단(51) 및 광전 변환부(53)는 상기 파워 검출부(4)의 광감쇄 수단(41) 및 광전 변환부(43)와 동일하게 구성할 수 있다. 다만, 상기 반사광 검출부(5)의 광감쇄 수단(51)과 상기 파워 검출부(4)의 광감쇄 수단(41)은 입사하는 빔의 파워에 따라 감쇄율을 달리할 수 있다.Here, the light attenuation unit 51 and the photoelectric conversion unit 53 of the reflected light detection unit 5 may be configured in the same manner as the light attenuation unit 41 and the photoelectric conversion unit 43 of the power detection unit 4 . . However, the light attenuation means 51 of the reflected light detection unit 5 and the light attenuation means 41 of the power detection unit 4 may have different attenuation rates according to the power of the incident beam.
또한, 본 발명의 실시 예에서는 상기 반사광 검출부(5)의 벤트 미러(51)도 상기 벤트 미러(32)와 마찬가지로 가시광 및 적외선광을 투과율을 높게 구성하여서, 반사광의 유입 경로를 따라 유입되는 가시광 및 적외선광이 하기의 가공점 검출부(6)로 전송되게 한다.In addition, in the embodiment of the present invention, the vent mirror 51 of the reflected light detection unit 5 also has a high transmittance for visible light and infrared light like the vent mirror 32, so that visible light and Infrared light is transmitted to the following processing point detection unit 6 .
상기 가공점 검출부(6)는 가공물(W) 중에 상기 레이저 출사부(33)에서 레이저 빔을 조사한 부위를 촬영하기 위한 카메라 아니면 해당 부위의 가공 상태를 검출하기 위한 적외선 센서로 구성되거나, 카메라 및 적외선 센서를 모두 포함하게 구성될 수 있다. 본 발명의 실시 예에서는 상기 가공점 검출부(6)가 카메라 및 적외선 센서를 모두 포함하게 구성하는 것으로 설명한다.The processing point detection unit 6 is a camera for photographing a portion irradiated with a laser beam from the laser emitting unit 33 in the workpiece W, or an infrared sensor for detecting the processing state of the corresponding portion, or a camera and an infrared ray. It may be configured to include all sensors. In the embodiment of the present invention, it will be described that the processing point detection unit 6 is configured to include both a camera and an infrared sensor.
가공물(W) 중에 레이저 빔을 조사한 부위에서 발생하는 적외선 복사광 및 해당 부위의 가시영역 영상을 보여주는 가시광은 가공물(W)에 조사하는 레이저 빔의 광 경로, 즉, 레이저 반사광과 동일한 루트를 따라 상기 벤트 미러(32)에 입사되므로, 상기 벤트 미러(32)에 입사한 광이 상기 벤트 미러(32) 및 상기 반사광 검출부(5)의 벤트 미리(51)를 순차적으로 투과한 후 상기 가공점 검출부(6)에 의해 검출되게 할 수 있다. 다시 말해서, 상기 벤트 미러(32) 및 상기 반사광 검출부(5)의 벤트 미리(51)는 적외선 복사광 및 가시광의 투과율이 높은 미러를 사용함으로서, 상기 반사광 검출부(5)의 벤트 미리(52)의 배후에 상기 가공점 검출부(6)를 배치하여 적외선 복사광 및 가시광을 검출하게 할 수 있다.Infrared radiation generated from the part irradiated with the laser beam in the workpiece W and the visible light showing the visible region image of the part follow the optical path of the laser beam irradiated to the workpiece W, that is, along the same route as the laser reflected light. Since it is incident on the vent mirror 32, the light incident on the vent mirror 32 sequentially passes through the vent mirror 51 of the vent mirror 32 and the reflected light detection unit 5, and then the processing point detection unit ( 6) can be detected. In other words, the vent mirror 32 and the vent mirror 51 of the reflected light detection unit 5 use a mirror having high transmittance of infrared radiation and visible light, so that the vent mirror 52 of the reflected light detection unit 5 is By disposing the processing point detection unit 6 behind it, it is possible to detect infrared radiation and visible light.
구체적인 실시 예에 따르면, 상기 가공점 검출부(6)는 상기 반사광 검출부(5)의 벤트 미리(51)를 투과한 광 중에 레이저 빔은 차단하고 적외선 복사광 및 가시광은 투과시키는 필터(61)와, 필터(61)에 의해 필터링된 광을 반사시켜 광 경로를 90°전환시키는 벤트 미러(62)와, 벤트 미러(62)에 의해 반사된 광을 수광하는 센서부(63)를 포함한다. 물론, 센서부(63)는 카메라와 적외선 센서를 포함하여서, 가공물(W) 중에 레이저 빔이 조사된 부분의 영상과 온도를 얻는다.According to a specific embodiment, the processing point detection unit 6 includes a filter 61 that blocks the laser beam and transmits infrared radiation and visible light among the light transmitted through the vent pre-51 of the reflected light detection unit 5; It includes a vent mirror 62 that reflects the light filtered by the filter 61 to change a light path by 90°, and a sensor unit 63 that receives the light reflected by the vent mirror 62 . Of course, the sensor unit 63 includes a camera and an infrared sensor, and obtains an image and a temperature of a portion irradiated with a laser beam in the workpiece W.
상기 모니터링부(7)는 상기 파워 검출부(4)에서 측정한 레이저 빔 파워와, 상기 반사광 검출부(5)에서 측정한 레이저 반사광 파워와, 상기 가공점 검출부(6)에서는 얻는 영상 및 온도와, 상기 레이저 발진기(1)의 검출부(13)에서 측정한 발진 레이저 빔 파워를 전달받아서, 모니터(미도시)로 출력한다.The monitoring unit 7 includes the laser beam power measured by the power detection unit 4, the laser reflected light power measured by the reflected light detection unit 5, the image and temperature obtained by the processing point detection unit 6, and the The oscillation laser beam power measured by the detection unit 13 of the laser oscillator 1 is received and output to a monitor (not shown).
도 2에 도시한 블록 구성도를 참조하면, 상기 모니터링부(7)는 전달받는 레이저 빔 파워, 레이저 반사광 파워 및 온도에 대해 노이즈를 제거하는 노이즈 제거부(71)와, 레이저 빔 파워를 기설정 환산 비율에 따라 상기 레이저 출사부(33)로 출사되는 레이저 빔 파워로 환산하는 레이저 파워 환산부(72)와, 레이저 반사광 파워를 기설정 환산 비율에 따라 가공물(W)에서의 반사광 파워로 환산하는 반사광 파워 환산부(73)와, 레이저 파워 환산부(72)에서 환산한 레이저 빔 파워와 상기 레이저 발진기(1)에서 발진하는 레이저 빔 파워를 비교하여 검증하는 출력 검증부(74)와, 레이저 파워 환산부(72)에서 환산한 레이저 빔 파워와 상기 반사광 파워 환산부(73)에서 환산한 반사광 파워에 따라 가공물(W)에 흡수된 레이저 빔 파워를 연산하여 검증하는 흡수 검증부(75)와, 영상 및 온도에 다라 가공물(W)의 레이저 가공 상태를 검증하는 가공 상태 검증부(76)를 포함하며, 보다 상세하게 설명하면 다음과 같다.Referring to the block diagram shown in FIG. 2 , the monitoring unit 7 includes a noise removing unit 71 that removes noise with respect to the received laser beam power, laser reflected light power, and temperature, and preset laser beam power. A laser power conversion unit 72 that converts the laser beam power emitted to the laser emission unit 33 according to the conversion ratio, and the laser reflected light power to the reflected light power from the workpiece W according to a preset conversion ratio. A reflected light power conversion unit 73, an output verification unit 74 that compares and verifies the laser beam power converted by the laser power conversion unit 72 with the laser beam power oscillated by the laser oscillator 1, and the laser power An absorption verification unit 75 that calculates and verifies the laser beam power absorbed by the workpiece W according to the laser beam power converted by the conversion unit 72 and the reflected light power converted by the reflected light power conversion unit 73; It includes a processing state verification unit 76 for verifying the laser processing state of the workpiece (W) according to the image and temperature, and will be described in more detail as follows.
도 3(a)에 예시한 바와 같이 상기 노이즈 제거부(71)에 의해 노이즈를 제거하기 전의 레이저 빔 파워는 노이즈가 섞여 있다. 이러한 노이즈는 광전 변환부(43)의 포토 다이오이드, 포토 다이오드에 도달하기까지의 광 경로 등에 의해 발생할 수 있다. 그렇지만, 예를 들어 고주파를 제거하는 필터로 필터링하여 노이즈를 억제한 레이저 빔 파워는 도 3(b)와 같은 파형을 보여준다. 도면으로 보여주지는 아니하였지만, 레이저 반사광 파워 및 온도에 대해서도 노이즈를 적절한 필터링에 의해 억제할 수 있다.As illustrated in FIG. 3A , the laser beam power before noise is removed by the noise removing unit 71 is mixed with noise. Such noise may be generated by the photodiode of the photoelectric conversion unit 43 , an optical path until reaching the photodiode, and the like. However, for example, the laser beam power of which noise is suppressed by filtering with a filter that removes high frequency shows a waveform as shown in FIG. 3(b). Although not shown in the drawings, it is possible to suppress noise with respect to laser reflected light power and temperature by appropriate filtering.
상기 레이저 파워 환산부(72)에서 적용하는 기설정 환산 비율은 예를 들어 상기 레이저 출사부(33)에서 출사되는 레이저 빔 파워를 측정하는 실험을 수행하여, 상기 파워 검출부(4)로 측정한 레이저 빔 파워와의 상대적 비율에 따라 얻을 수 있다.The preset conversion ratio applied by the laser power conversion unit 72 is, for example, a laser measured by the power detection unit 4 by performing an experiment for measuring the laser beam power emitted from the laser emission unit 33 . It can be obtained according to the relative ratio with the beam power.
상기 반사광 파워 환산부(73)에서 적용하는 기설정 환산 비율은 예를 들어 가공물(W)에서 반사되어 발생하는 반사광 중에 상기 레이저 출사부(33)로 입사되는 광의 비율을 가공물(W)과 레이저 출사부(33)의 상대적 위치 및 레이저 출사부(33)의 출사구 크기 등에 따라 추정하고, 상기 벤트 미러(32)의 투과율을 추가 반영하여 얻을 수 있다. 아니면, 가공물(W)에서 반사되는 반사광을 측정하는 실험을 수행하여 상기 반사광 검출부(5)에서 측정되는 파워와의 상대적 비율에 따라 얻을 수 있다.The preset conversion ratio applied by the reflected light power conversion unit 73 is, for example, the ratio of the light incident to the laser emission unit 33 among the reflected light generated by being reflected from the workpiece W to the workpiece W and the laser emission. It is estimated according to the relative position of the part 33 and the size of the exit hole of the laser emitting part 33 , and may be obtained by additionally reflecting the transmittance of the vent mirror 32 . Alternatively, it can be obtained according to a relative ratio with the power measured by the reflected light detector 5 by performing an experiment for measuring the reflected light reflected from the workpiece W.
상기 출력 검증부(74)는 레이저 빔 파워와 발진 레이저 빔 파워의 차이에 따라 레이저 빔 파워의 크기 적합성을 검증하는 파워 검증부(741)와, 레이저 빔 파워의 패턴에 따라 레이저 빔 파워의 패턴 적합성을 검증하는 패턴 검증부(742)를 포함한다.The output verification unit 74 includes a power verification unit 741 that verifies the size suitability of the laser beam power according to the difference between the laser beam power and the oscillation laser beam power, and the pattern suitability of the laser beam power according to the pattern of the laser beam power. and a pattern verification unit 742 that verifies
상기 레이저 발진기(1)에서 발진하여 출력하는 발진 레이저 빔은 상기 광섬유(2), 콜리메이션 렌즈(31) 및 벤트 미러(32)를 경유하며 감쇄되어 상기 파워 검출부(4)에 의해 검출되므로, 상기 광섬유(2), 콜리메이션 렌즈(31) 및 벤트 미러(32)의 오염, 손상 및 열화가 발생하진 않을 시의 파워 감쇄량을 실험에 의해 측정하여 허용할 수 있는 파워 감쇄 비율의 범위를 적절하게 미리 설정하여 둘 수 있다. Since the oscillating laser beam oscillated and output by the laser oscillator 1 is attenuated through the optical fiber 2, the collimation lens 31 and the vent mirror 32 and is detected by the power detection unit 4, the When the contamination, damage or deterioration of the optical fiber 2, the collimation lens 31, and the vent mirror 32 does not occur, the amount of power attenuation is measured by an experiment, and the range of the allowable power attenuation ratio is appropriately pre-set. can be set.
상기 파워 검증부(741)는 상기 파워 검출부(4)를 통해 측정한 레이저 빔 파워와 상기 레이저 발진기(1)를 통해 측정하는 발진 레이저 빔 파워의 차이로 얻는 파워 감쇄 비율이 설정 범위 내에 있으면 적합으로 판정하고, 설정 범위를 벗어나면 부적합으로 판정하게 할 수 있다. 여기서, 부적합 판정은 상기 광섬유(2), 콜리메이션 렌즈(31) 및 벤트 미러(32) 중에 적어도 어느 하나가 오염되거나 손상 또는 열화될 시에 내려진다고 볼 수 있다.The power verification unit 741 is suitable if the power attenuation ratio obtained by the difference between the laser beam power measured through the power detection unit 4 and the oscillation laser beam power measured through the laser oscillator 1 is within a set range. If it is out of the set range, it can be judged as non-conforming. Here, it can be seen that the non-conformity determination is made when at least one of the optical fiber 2 , the collimation lens 31 , and the vent mirror 32 is contaminated, damaged, or deteriorated.
또한, 상기 파워 검출부(4)를 통해 측정한 레이저 빔 파워는 상기 레이저 출사부(33)를 통해 가공물(W)에 조사되는 레이저 빔 파워로 환산한 파워이므로, 상기 파워 검증부(741)는 가공물(W)에 조사되는 레이저 빔 파워의 적합성을 판정할 수 있다. In addition, since the laser beam power measured by the power detector 4 is converted into the laser beam power irradiated to the workpiece W through the laser emitting part 33 , the power verification part 741 is the workpiece. The suitability of the laser beam power irradiated to (W) can be judged.
가공물(W)에 조사되는 레이저 빔 파워로 환산한 레이저 빔 파워는 레이저 출사부(33)의 오염, 손상 또는 열화에 의해서 실제로 가공물(W)에 조사되는 레이저 빔 파워와 차이날 수 있으나, 오염, 손상 또는 열화를 후술하는 바와 같이 흡수 검증부(75) 또는 가공 상태 검증부(76)에 의해서 간접적으로 판정할 수 있다.The laser beam power converted into the laser beam power irradiated to the workpiece W may be different from the laser beam power actually irradiated to the workpiece W due to contamination, damage or deterioration of the laser emitting part 33, but contamination, As described later, damage or deterioration can be indirectly determined by the absorption verification unit 75 or the processing state verification unit 76 .
상기 패턴 검증부(742)는 시간 경과에 따라 나타나는 레이저 빔 파워의 변화를 검증하며, 구체적으로서 레이저 빔 파워의 리플(ripple) 성분 크기에 따라 적합성을 판정하게 할 수 있다.The pattern verification unit 742 may verify a change in laser beam power appearing over time, and specifically determine suitability according to a size of a ripple component of the laser beam power.
상기 도 3(b)에 도시한 바와 같이 상기 레이저 발진기(1)에서 발진하여 출사할 레이저 빔을 일정하게 유지하도록 제어하더라도, 상기 파워 검출부(4)를 통해 측정되는 레이저 빔 파워는 일정하지 아니하고 리플 성분이 나타난다. As shown in FIG. 3(b) , even when the laser oscillator 1 oscillates and controls to keep the laser beam to be emitted constant, the laser beam power measured by the power detection unit 4 is not constant and the ripple ingredients appear.
이러한 리플 성분은 예를 들어, 상기 레이저 발진기(1)에서 PID 제어에 따라 출력을 조절할 시에 비례항, 적분항 및 미분항에 적용되는 제어 파라메터에 따라 그 크기가 달라질 수 있으므로, 상기 레이저 발진기(1)의 출력을 검증하는 데 사용할 수 있다. 또한, 상기 레이저 발진기(1)에 의해 발생하는 리플 성분은 레이저 빔의 광 경로 중에 광섬유(2)의 영향을 받아 발생할 수도 있다Since, for example, the size of the ripple component may vary according to control parameters applied to the proportional term, the integral term and the derivative term when the output is adjusted according to the PID control in the laser oscillator 1, the laser oscillator 1 ) can be used to verify the output of In addition, the ripple component generated by the laser oscillator 1 may be generated under the influence of the optical fiber 2 in the optical path of the laser beam.
이에, 본 발명의 실시 예에서 상기 패턴 검증부(742)는 측정한 레이저 빔 파워의 리플 성분의 크기에 대해 적합성 판단의 기준이 되는 값을 미리 설정하여 두어서, 패턴 분석에 의해 얻는 리플 성분을 설정한 리플 성분 크기와 비교한 결과에 따라 레이저 출력의 적합성을 판단하게 구성하였다.Accordingly, in the embodiment of the present invention, the pattern verification unit 742 sets a value that is a standard for determining suitability for the magnitude of the ripple component of the measured laser beam power in advance, and determines the ripple component obtained by pattern analysis. It was configured to judge the suitability of the laser output according to the result of comparison with the set ripple component size.
상기 흡수 검증부(75)는 상기 레이저 파워 환산부(72)에서 환산하여 얻은 레이저 빔 파워와 상기 반사광 파원 환산부(73)에서 환산하여 얻은 레이저 반사광 파워의 차이로 가공물(W)에 흡수된 레이저 파워를 연산하며, 그 차이의 변동에 따라 상기 레이저 출사부(33)의 오염, 파손 또는 열화에 따라 발행하는 이상 상태의 발생 여부를 판정한다. 물론, 레이저 빔 파워와 레이저 반사광 파워를 각각 시간 경과에 따라 적분하여 에너지를 연산하고, 연산한 에너지의 차이에 따라 가공물(W)에 흡수된 에너지를 연산할 수 있고, 그 에너지 차이의 변동에 따라 상기 레이저 출사부(33)의 이상 상태가 발생하였는지를 판정할 수도 있다.The absorption verification unit 75 is a laser absorbed by the workpiece W as a difference between the laser beam power obtained by converting the laser power conversion unit 72 and the laser reflected light power obtained by converting the reflected light source conversion unit 73 . The power is calculated, and it is determined whether an abnormal state is generated according to the contamination, damage, or deterioration of the laser emitting unit 33 according to the variation of the difference. Of course, the energy can be calculated by integrating the laser beam power and the laser reflected light power over time, respectively, and the energy absorbed by the workpiece W can be calculated according to the difference in the calculated energy, and according to the change in the energy difference It may be determined whether an abnormal state of the laser emitting unit 33 has occurred.
상기 가공 상태 검증부(76)는 가공물(W)의 가공 부위 영상에 따라 가공 상태의 적합성에 대해 판정할 수 있고, 또한, 가공 부위 온도에 따라 가공 상태의 적합성에 대해 판정할 수 있다. 가공 부위 온도는 예를 들어 용접, 절단, 표면처리 등으로 분류하는 가공법 또는 가공물(W)의 재질, 두께 등으로 할 수 있는 가공물 특성에 따라 적절하게 조절되게 하는 것으로 알려져 있으므로, 가공법 또는 가공물 특성에 따라 적합한 값을 설정하여 둠으로써, 측정한 가공 부위 온도와 비교하여 적합성을 판정하게 할 수 있다.The processing state verification unit 76 may determine the suitability of the processing state according to the image of the processing part of the workpiece W, and may determine the suitability of the processing state according to the temperature of the processing part. The processing site temperature is known to be appropriately adjusted according to the processing method classified into welding, cutting, surface treatment, etc., or the material and thickness of the workpiece (W). By setting a suitable value according to the temperature, it is possible to determine the suitability by comparing it with the measured temperature of the processed part.
이상에서 설명한 레이저 빔 파워와, 레이저 반사광 파워와, 가공 부위 영상과, 가공 부위 온도와, 가공 부위에 흡수된 파워는 실시간으로 얻어 상호 비교할 수 있도록 모니터에 출력함은 물론이고, 상기 출력 검증부(74), 흡수 검증부(75) 및 가공 상태 검증부(76)에서 판정한 적합성 여부를 모니터를 통해 출력하게 할 수 있다.The laser beam power, the laser reflected light power, the image of the processing part, the temperature of the processing part, and the power absorbed by the processing part described above are obtained in real time and output to the monitor so that they can be compared with each other, as well as the output verification unit ( 74), the absorption verification unit 75 and the processing state verification unit 76 may output the suitability determined by the monitor.
아울러, 상기 모니터링부(7)는 레이저 빔 파워, 레이저 반사광 파워 및 가공 부위 흡수 파워에 따라 상기 레이저 발진기(1)의 출력을 조절하게 할 수 있고, 레이저 빔 파워의 리플 성분에 따라 레이저 발진기(1)의 제어 파라메터를 조절하게 할 수도 있다.In addition, the monitoring unit 7 may adjust the output of the laser oscillator 1 according to the laser beam power, the laser reflected light power, and the processing site absorption power, and according to the ripple component of the laser beam power, the laser oscillator 1 ) can be adjusted.
이상에서 본 발명의 기술적 사상을 예시하기 위해 구체적인 실시 예로 도시하고 설명하였으나, 본 발명은 상기와 같이 구체적인 실시 예와 동일한 구성 및 작용에만 국한되지 않고, 여러가지 변형이 본 발명의 범위를 벗어나지 않는 한도 내에서 실시될 수 있다. 따라서, 그와 같은 변형도 본 발명의 범위에 속하는 것으로 간주해야 하며, 본 발명의 범위는 후술하는 특허청구범위에 의해 결정되어야 한다.In the above, specific embodiments have been shown and described to illustrate the technical idea of the present invention, but the present invention is not limited to the same configuration and operation as the specific embodiments as described above, and various modifications are within the limits that do not depart from the scope of the present invention. can be carried out in Accordingly, such modifications should also be considered to fall within the scope of the present invention, and the scope of the present invention should be determined by the following claims.
[부호의 설명][Explanation of code]
W : 가공물 WP : 가공점W : Workpiece WP : Processing point
1 : 레이저 발진기1: laser oscillator
11 : 발진부 12 : 컨트롤러 13 : 검출부 11: oscillation unit 12: controller 13: detection unit
2 : 광섬유2: optical fiber
3 : 가공 헤드3: machining head
31 : 콜리메이션 렌즈 31: collimation lens
32 : 벤트 미러 32: vent mirror
33 : 레이저 출사부 331 : 전반사 미러 332 : 포커스 렌즈 33: laser emission unit 331: total reflection mirror 332: focus lens
333 : 보호 렌즈 333: protective lens
4 : 파워 검출부4: power detection unit
41 : 광감쇄 수단 42 : 벤트 미러 43 : 광전 변환부 41: light attenuation means 42: vent mirror 43: photoelectric conversion unit
5 : 반사광 검출부5: reflected light detection unit
51 : 벤트 미러 52 : 광감쇄 수단 53 : 광전 변환부 51: vent mirror 52: light attenuation means 53: photoelectric conversion unit
6 : 가공점 검출부6: processing point detection unit
61 : 필터 62 : 벤트 미러 63 : 센서부 61: filter 62: vent mirror 63: sensor unit
7 : 모니터링부7: monitoring unit
71 : 노이즈 제거부 71: noise removal unit
72 : 레이저 파워 환산부 72: laser power conversion unit
73 : 반사광 파워 환산부 73: reflected light power conversion unit
74 : 출력 검증부 741 : 파워 검증부 742 : 패턴 검증부 74: output verification unit 741: power verification unit 742: pattern verification unit
75 : 흡수 검증부 75: absorption verification unit
76 : 가공 상태 검증부 76: processing state verification unit

Claims (7)

  1. 레이저 발진기(1)에서 발진하여 출력한 레이저 빔을 광섬유(2)를 통해 가공 헤드(3)에 전송하고, 가공 헤드(3)에서 레이저 빔을 시준을 위한 콜리메이션 렌즈(31), 반사시켜 방향 전환하는 벤트 미러(32) 및 가공물(W)을 향해 집광하여 출사하는 레이저 출사부(33)에 순차적으로 경유시켜 가공물(W)을 향해 조사하는 레이저 가공 장치에 있어서, The laser beam oscillated and output from the laser oscillator 1 is transmitted to the processing head 3 through the optical fiber 2, and the laser beam is collimated by the processing head 3 by a collimation lens 31 for collimating and reflecting the direction. In the laser processing apparatus for irradiating toward the workpiece (W) by sequentially passing through the switching vent mirror (32) and the laser emitting unit (33) that condenses and emits light toward the workpiece (W),
    상기 레이저 출사부(33)에서 출사하려는 레이저 빔 중에 상기 벤트 미러(32)에서 반사되지 않고 투과하는 레이저 빔을 수광하여 파워를 측정하는 파워 검출부(4); a power detection unit 4 for measuring power by receiving a laser beam transmitted without being reflected from the vent mirror 32 among the laser beams to be emitted from the laser emission unit 33;
    상기 레이저 출사부(33)를 통해 출사하는 레이저 빔 파워를 상기 파워 검출부(4)로 측정한 파워로부터 연산하고, 레이저 빔 파워, 레이저 빔 파워와 상기 레이저 발진기(1)에 출력하는 레이저 빔 파워의 차이로 나타나는 전송 중 파워 변화량, 및 레이저 빔 파워의 패턴에 대해 모니터링하며 레이저 빔 출사의 적합성 여부와 레이저 발진기(1)부터 상기 벤트 미러(32)까지의 이상 여부를 판정하는 모니터링부(7);The laser beam power emitted through the laser emitting unit 33 is calculated from the power measured by the power detection unit 4, and the laser beam power, the laser beam power and the laser beam power output to the laser oscillator 1 are a monitoring unit 7 that monitors the amount of power change during transmission and the pattern of the laser beam power appearing as a difference, and determines whether the laser beam is suitable for emitting and whether there is an abnormality from the laser oscillator 1 to the vent mirror 32 ;
    를 포함하는 레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device for monitoring laser power comprising a.
  2. 제 1항에 있어서,The method of claim 1,
    상기 모니터링부(7)는 The monitoring unit 7
    레이저 빔 파워, 전송 중 파워 변화량 및 레이저 빔 파워의 패턴 중에 적어도 어느 하나에 따라 상기 레이저 발진기(1)의 출력을 조절하게 하는 adjusting the output of the laser oscillator 1 according to at least one of a laser beam power, a power change amount during transmission, and a pattern of laser beam power
    레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device that monitors laser power.
  3. 제 1항에 있어서,The method of claim 1,
    상기 모니터링부(7)은 The monitoring unit 7 is
    레이저 빔 파워의 패턴에 따라 리플(ripple) 성분을 추출하여, 리플 성분의 크기에 따라 레이저 빔 출사의 적합성 여부를 판정하는 Extracting a ripple component according to the pattern of the laser beam power, and determining whether the laser beam is suitable for emitting a laser beam according to the size of the ripple component
    레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device that monitors laser power.
  4. 제 1항에 있어서,The method of claim 1,
    상기 모니터링부(7)는 The monitoring unit 7
    레이저 빔 파워의 패턴에 따라 상기 레이저 발진기(1)의 출력 적합성을 판정하는 To determine the output suitability of the laser oscillator 1 according to the pattern of the laser beam power
    레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device that monitors laser power.
  5. 제 1항에 있어서,The method of claim 1,
    상기 모니터링부(7)는 The monitoring unit 7 is
    상기 레이저 발진기(1)에서 출력 제어하는 데 적용되는 제어 파라메타를 레이저 빔 파워의 패턴에 따라 조절하는 Adjusting the control parameter applied to the output control of the laser oscillator 1 according to the pattern of the laser beam power
    레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device that monitors laser power.
  6. 제 1항에 있어서,The method of claim 1,
    레이저 빔을 가공물(W)에 조사함에 따라 발생하여 상기 레이저 출사부(33)로 유입된 후 상기 벤트 미러(32)를 투과하는 반사광을 검출하여 파워를 측정하되, 반사광의 유입 경로를 따라 유입되는 가시광 또는 적외선의 투과를 허용하는 반사광 검출부(5); 및 The power is measured by detecting the reflected light that is generated by irradiating the laser beam on the workpiece (W) and flows into the laser emitting unit 33 and then passes through the vent mirror 32, but is introduced along the inflow path of the reflected light. a reflected light detection unit 5 that allows transmission of visible or infrared light; and
    상기 반사광 검출부(5)를 투과한 가시광 또는 적외선을 검출하여 가공물(W) 영상 또는 가공물(W) 온도를 얻는 가공점 검출부(6);a processing point detection unit 6 that detects visible light or infrared light that has passed through the reflected light detection unit 5 to obtain an image of a workpiece (W) or a temperature of the workpiece (W);
    를 더욱 포함하고, further comprising,
    상기 모니터링부(7)는 The monitoring unit 7
    레이저 빔이 가공물(W)에 반사되어 발생하는 반사광의 파워를 상기 반사광 검출부(5)에서 측정한 파워에 따라 연산하고, 반사광 파워, 레이저 빔 파워와 반사광 파워의 차이에 따라 나타나는 출사 중 파워 변화량, 가공물 영상 또는 온도에 대해 모니터링하여 레이저 빔 출사의 적합성 여부와 상기 레이저 출사부(33)의 이상 여부를 판정하는 The power of the reflected light generated by the reflection of the laser beam on the workpiece W is calculated according to the power measured by the reflected light detection unit 5, and the power change during output appears according to the difference between the reflected light power, the laser beam power and the reflected light power, It monitors the image or temperature of the workpiece to determine whether the laser beam is suitable for emitting and whether the laser emitting unit 33 is abnormal.
    레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device that monitors laser power.
  7. 제 6항에 있어서,7. The method of claim 6,
    상기 모니터링부(7)는 The monitoring unit 7
    출사 중 파워 변화량, 가공물 영상 또는 온도에 따라 상기 레이저 발진기(1)의 출력을 조절하는 Controlling the output of the laser oscillator 1 according to the amount of power change during emission, the image of the workpiece or the temperature
    레이저 파워를 모니터링하는 레이저 가공 장치.A laser processing device that monitors laser power.
PCT/KR2022/002828 2021-04-30 2022-02-25 Laser processing apparatus for monitoring laser power WO2022231106A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210056141A KR102528969B1 (en) 2021-04-30 2021-04-30 Laser machining apparatus having laser power monitoring device
KR10-2021-0056141 2021-04-30

Publications (1)

Publication Number Publication Date
WO2022231106A1 true WO2022231106A1 (en) 2022-11-03

Family

ID=83846990

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/002828 WO2022231106A1 (en) 2021-04-30 2022-02-25 Laser processing apparatus for monitoring laser power

Country Status (2)

Country Link
KR (1) KR102528969B1 (en)
WO (1) WO2022231106A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727900A (en) * 2023-08-11 2023-09-12 中国人民解放军空军工程大学 Laser hole making and opening method and device for aviation composite material

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920006391A (en) * 1990-09-14 1992-04-27 빈터, 트리쉬만 Polymer reaction products
KR20030075246A (en) * 2002-03-18 2003-09-26 (주) 포코 A precision processing tool and method by use of femtosecond laser
KR20120017527A (en) * 2010-08-19 2012-02-29 (주)큐엠씨 Laser processing apparatus and control method of the same
KR102114359B1 (en) * 2019-09-02 2020-05-22 모니텍주식회사 A laser welding quality monitoring system and its method by using high speed thermal image camera
KR20210025479A (en) * 2019-08-27 2021-03-09 가부시기가이샤 디스코 Laser machining apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4838530B2 (en) 2005-04-21 2011-12-14 サイバーレーザー株式会社 Femtosecond laser device with output stabilization mechanism
KR101138454B1 (en) 2010-05-31 2012-04-26 (주)한빛레이저 Laser system for output measurement and prevention of exit-hole damage and method of check normality.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920006391A (en) * 1990-09-14 1992-04-27 빈터, 트리쉬만 Polymer reaction products
KR20030075246A (en) * 2002-03-18 2003-09-26 (주) 포코 A precision processing tool and method by use of femtosecond laser
KR20120017527A (en) * 2010-08-19 2012-02-29 (주)큐엠씨 Laser processing apparatus and control method of the same
KR20210025479A (en) * 2019-08-27 2021-03-09 가부시기가이샤 디스코 Laser machining apparatus
KR102114359B1 (en) * 2019-09-02 2020-05-22 모니텍주식회사 A laser welding quality monitoring system and its method by using high speed thermal image camera

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727900A (en) * 2023-08-11 2023-09-12 中国人民解放军空军工程大学 Laser hole making and opening method and device for aviation composite material
CN116727900B (en) * 2023-08-11 2023-10-20 中国人民解放军空军工程大学 Laser hole making and opening method and device for aviation composite material

Also Published As

Publication number Publication date
KR20220149027A (en) 2022-11-08
KR102528969B1 (en) 2023-05-03

Similar Documents

Publication Publication Date Title
US5272312A (en) Process for quality control of laser beam welding and cutting
US8237922B2 (en) Laser beam analysis apparatus
US8094036B2 (en) Monitoring device for a laser machining device
JP2000094166A (en) Laser device
WO2022231106A1 (en) Laser processing apparatus for monitoring laser power
WO2004087362A3 (en) Centralized control architecture for a laser materials processing system
JP2008119716A (en) Laser beam machining apparatus, and focus maintaining method therein
JP2006247681A (en) Monitoring device for laser beam machining
JPS61154771A (en) Welding position detector
JP3368427B2 (en) Laser processing state measuring device
JP2000221108A (en) Soundness inspection instrument for optical fibers
US20100258533A1 (en) Method and apparatus for the processing, in particular the separating, of workpieces
JP2005031678A (en) Arrangement for catching lighting beam in laser scanning microscope and its method
JP2003139507A5 (en)
JP2000225481A (en) Measuring unit for laser beam welding state
JPH08267261A (en) Laser beam machine provided with fiber damage monitor
WO2023096147A1 (en) Laser welding part monitoring system using swept laser source
CN115941110B (en) Method for reducing optical crosstalk of optical module
JP2002521656A (en) Method for testing the function of a spectrometer and a spectrometer having a fault detection device
JP2020006442A (en) Reflection light detection method of laser processing head
JP2004337943A (en) Laser beam machining apparatus
JP2008032524A (en) Laser beam machining device, and focal point detection method of laser light for measurement
GB2178163A (en) Detecting flaws in optical fibres
KR0160374B1 (en) Method of deciding optical ferrule location and apparatus of detecting optical fiber for repairing optical line
JP2709946B2 (en) Foreign matter inspection method and foreign matter inspection device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22795940

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE