WO2022231106A1 - Appareil de traitement laser pour la surveillance de puissance laser - Google Patents

Appareil de traitement laser pour la surveillance de puissance laser Download PDF

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Publication number
WO2022231106A1
WO2022231106A1 PCT/KR2022/002828 KR2022002828W WO2022231106A1 WO 2022231106 A1 WO2022231106 A1 WO 2022231106A1 KR 2022002828 W KR2022002828 W KR 2022002828W WO 2022231106 A1 WO2022231106 A1 WO 2022231106A1
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Prior art keywords
power
laser
laser beam
unit
workpiece
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PCT/KR2022/002828
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English (en)
Korean (ko)
Inventor
김명진
박명수
이정운
Original Assignee
주식회사 휴비스
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Publication of WO2022231106A1 publication Critical patent/WO2022231106A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity

Definitions

  • the present invention relates to a laser processing apparatus that monitors the power of a laser beam irradiated to a workpiece to monitor an abnormal state of each part and whether the laser beam is output normally, and monitors the laser power capable of laser processing.
  • a laser processing device is a device widely used in the processing industry such as welding, cutting, or surface treatment. It contains an optical fiber for transmission to the head.
  • the laser oscillator detects the power, waveform, wavelength, etc. of the output laser beam as disclosed in Patent Registration No. 10-1259638 and adjusts the output so that the measured value of the output detection unit maintains the output value set according to the processing purpose By configuring it so that the laser processing quality can be guaranteed.
  • the laser processing quality depends on the laser beam emitted through the processing head.
  • Patent Registration No. 10-1138454 by measuring the power of the laser beam just before it is emitted from the processing head and comparing it with the output of the laser oscillator, contamination, damage, deterioration, etc. in the optical fiber and processing head are monitored. It can also be used to adjust the output of the laser oscillator.
  • the quality of laser processing is determined by whether there is an abnormality in the laser oscillator itself or the suitability of output control in the laser oscillator, it is difficult to monitor the overall abnormality occurring in the laser processing apparatus only by monitoring the output laser beam power. In general, it is difficult to monitor the various factors affecting the quality of laser processing.
  • Patent Document 1 KR 10-1259638 B1 2013.04.24.
  • Patent Document 2 KR 10-1138454 B1 2012.04.13.
  • the present invention can monitor the power of the laser beam irradiated to the workpiece to determine whether there is an abnormality in each part as a whole, and monitor the laser beam irradiated to the workpiece in real time and adjust the power of the laser beam to improve the quality of laser processing. It aims to provide a laser processing device that can guarantee
  • the present invention transmits a laser beam oscillated and output by the laser oscillator 1 to the processing head 3 through the optical fiber 2, and collimating the laser beam in the processing head 3
  • the laser beam power emitted through the laser emitting unit 33 is calculated from the power measured by the power detection unit 4, and the laser beam power, the laser beam power and the laser beam power output to the laser oscillator 1 are a monitoring unit 7 that monitors the amount of power change during transmission and the pattern of the laser beam power appearing as a difference, and determines whether the laser beam is suitable for emitting and whether there is an abnormality from the laser oscillator 1 to the vent mirror 32 ; further includes.
  • the monitoring unit 7 adjusts the output of the laser oscillator 1 according to at least one of the laser beam power, the amount of power change during transmission, and the pattern of the laser beam power.
  • the monitoring unit 7 extracts a ripple component according to a pattern of laser beam power, and determines whether laser beam emission is appropriate according to the size of the ripple component.
  • the monitoring unit 7 determines the output suitability of the laser oscillator 1 according to the pattern of the laser beam power.
  • the monitoring unit 7 adjusts a control parameter applied to control the output of the laser oscillator 1 according to a pattern of laser beam power.
  • the power is measured by detecting the reflected light that is generated by irradiating the laser beam on the workpiece W, flows into the laser emitting part 33 and then passes through the vent mirror 32, but , a reflected light detection unit 5 that allows the transmission of visible light or infrared light flowing along the inflow path of the reflected light; and a processing point detection unit 6 that detects visible light or infrared light transmitted through the reflected light detection unit 5 to obtain an image of the workpiece (W) or a temperature of the workpiece (W).
  • the monitoring unit 7 calculates the power of the reflected light generated when the laser beam is reflected on the workpiece W according to the power measured by the reflected light detection unit 5, the reflected light power, It is determined whether the laser beam is suitable for emitting the laser beam and whether the laser emitting unit 33 is abnormal by monitoring the amount of power change during emission, the image of the workpiece, or the temperature, which appears according to the difference between the laser beam power and the reflected light power.
  • the monitoring unit 7 adjusts the output of the laser oscillator 1 according to the amount of power change during emission, the image of the workpiece, or the temperature.
  • the present invention configured as described above analyzes the pattern of the laser beam as well as the power of the laser beam irradiated toward the workpiece, and analyzes the amount of power change on the optical path, and monitors the laser oscillator and the overall optical path for emitting the laser beam. In addition, it is possible to ensure the quality of laser processing by monitoring whether the output of the laser beam substantially irradiated to the workpiece is normal.
  • FIG. 1 is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a block diagram of a monitoring unit 7
  • FIG. 3 is a waveform diagram (a) of the laser beam power measured by the power detection unit (4), and a waveform diagram (b) of the laser beam power obtained by suppressing noise by the monitoring unit (7).
  • the laser processing apparatus includes a laser oscillator 1 for laser processing, an optical fiber 2 and a processing head 3 in addition to the processing head 3 . Further comprising a power detection unit 4 for detecting the power of the laser beam emitted to irradiate the work W, and a monitoring unit 7 for monitoring the detected power of the laser beam, and additionally the work W It may also include a reflected light detection unit 5 for detecting the laser beam reflected in the light and a workpiece state detection unit 6 for detecting the processing state of the workpiece (W) to which the laser beam is irradiated.
  • the laser oscillator 1, the optical fiber 2 and the processing head 3 are known components in the technical field related to the laser processing apparatus, and can be deformed according to a processing method such as welding, cutting, surface treatment, etc. Components are also well known, so we briefly describe them first.
  • the laser oscillator 1 includes an oscillation unit 11 that generates a laser beam of a preset power according to a processing method, a detection unit 13 that detects the power of the generated laser beam, and a detection unit 13 that detects the power of the generated laser beam. ) and a controller 12 for controlling to output a laser beam of a set power by adjusting according to the detected power.
  • the controller 12 controls the oscillator 11 PID (Proportional-Integral-Differential) according to the error between the power detected by the detection unit 13 and the set power to output a laser beam of the set power.
  • PID control calculates the control value by combining the proportional term that multiplies the error signal by the proportional parameter, the integral term that multiplies the signal obtained by integrating the error signal by the integral parameter, and the differential term that multiplies the signal obtained by differentiating the error signal by the differential parameter.
  • the detector 13 may be configured to detect a waveform or wavelength of the generated laser beam, and the controller 12 may be configured to generate and output a laser beam having a preset waveform or wavelength.
  • the optical fiber 2 forms an optical path for transmitting the laser beam generated and output by the laser oscillator 1 to the processing head 3 .
  • the processing head 3 has a collimation lens 31 that converts and collimates a laser beam radially emitted from the end of the optical fiber 2 into parallel light, and is converted into parallel light by the collimation lens 31 .
  • a vent mirror 32 that redirects the laser beam in a direction deflected by 90° and guides it toward the laser emitting unit 33, and the laser beam reflected by the vent mirror 32 is emitted toward the workpiece W, and the workpiece W ) includes a laser emitting unit 33 for processing. Accordingly, the laser beam emitted from the optical fiber 2 is irradiated to the workpiece W through the collimation lens 31 , the vent mirror 32 , and the laser emission unit 33 sequentially.
  • the laser emitting unit 33 shows an embodiment configured as a galvanometer scanner to scan the workpiece W and irradiate a laser beam. That is, the laser emission unit 33 includes a focus lens 332 facing the workpiece 332 to focus the laser beam toward the processing point WP of the workpiece W, the focus lens 332 and the workpiece. A protective lens 333 disposed between 332 to protect the focus lens 332, and a focus lens 333 disposed opposite the vent mirror 32 to reflect the laser beam reflected from the vent mirror 32 It includes a total reflection mirror 331 that faces 332 and is rotatable by at least two orthogonal rotation axes to change the output direction of the laser beam.
  • total reflection mirror 331 Although only one total reflection mirror 331 is shown in the drawing, it is known that at least one of the plurality of total reflection mirrors can be rotated to sequentially reflect the plurality of total reflection mirrors to face the focus lens 332 . Since it is a technology, further detailed description will be omitted.
  • the vent mirror 32 is configured to partially transmit the laser beam.
  • the transmittance of the laser beam that is not reflected by the vent mirror 32 and is transmitted may be approximately 1%.
  • a beam splitter having a relatively small ratio of transmitted light power to reflected light power may be used.
  • the vent mirror 32 transmits infrared or visible light to obtain the processing point WP temperature or image of the workpiece W, so that the transmittance of infrared or visible light is high. It is good to be configured.
  • the power detection unit 4 the reflected light detection unit 5, the processing point detection unit 6 and the monitoring unit 7, which are characteristic components of the present invention, will be described.
  • the power detection unit 4 receives and photoelectrically converts a part of the laser beam that is incident on the vent mirror 32 and transmitted without being reflected among the laser beams that have passed through the collimation lens 31 as parallel light.
  • the power of the laser beam is output as an electrical signal.
  • a laser beam of low power passes through the vent mirror 32 according to the laser beam transmittance of the vent mirror 32 .
  • the power detection unit 4 includes a light attenuation unit 41 for passing the laser beam passing through the vent mirror 32 while power attenuating, and a laser beam attenuated by the light attenuation unit 41 . It is composed of a vent mirror 42 that reflects and converts the reflection by 90°, and a photoelectric conversion unit 43 that photoelectrically converts the laser beam reflected by the vent mirror 42 and outputs the power of the laser beam as an electrical signal. .
  • the light attenuation means 41 may be, for example, a light diffusion plate or an ND (Neutral Density) filter, and may be implemented in a way that the reflective surface of the vent mirror 42 is surface-treated to lower the reflectance.
  • the light attenuation means 41 further attenuates the laser beam transmitted by the vent mirror 32 to a power suitable for light reception by the photoelectric conversion unit 43 .
  • the photoelectric conversion unit 43 includes a photodiode that receives the laser beam and converts it into an electrical signal, and an amplifier that amplifies the electrical signal, so as to measure the power of the laser beam into an electrical signal, and measure The power of one laser beam is transmitted to the monitoring unit 4 .
  • a photodiode that receives the laser beam and converts it into an electrical signal
  • an amplifier that amplifies the electrical signal, so as to measure the power of the laser beam into an electrical signal, and measure The power of one laser beam is transmitted to the monitoring unit 4 .
  • the reflected light detector 5 is a component that receives and measures the power of the laser beam reflected by the vent mirror 32 and emitted to the laser emitting unit 33 is reflected on the workpiece (W). It is arranged to receive the reflected light passing through the vent mirror 32 after traveling in the reverse direction along the path of the laser beam that is incident on the laser emitting unit 33 among the reflected light.
  • W workpiece
  • the reflected light detection unit 5 includes the vent mirror 51 that reflects the reflected light passing through the vent mirror 32 so as to change the traveling direction by 90°, and the power of the reflected light reflected by the vent mirror 51 . It is composed of a light attenuation unit 52 that attenuates and transmits the light, and a photoelectric conversion unit 53 that receives the reflected light whose power is attenuated by the light attenuation unit 52 and outputs it as an electrical signal.
  • the light attenuation unit 51 and the photoelectric conversion unit 53 of the reflected light detection unit 5 may be configured in the same manner as the light attenuation unit 41 and the photoelectric conversion unit 43 of the power detection unit 4 .
  • the light attenuation means 51 of the reflected light detection unit 5 and the light attenuation means 41 of the power detection unit 4 may have different attenuation rates according to the power of the incident beam.
  • the vent mirror 51 of the reflected light detection unit 5 also has a high transmittance for visible light and infrared light like the vent mirror 32, so that visible light and Infrared light is transmitted to the following processing point detection unit 6 .
  • the processing point detection unit 6 is a camera for photographing a portion irradiated with a laser beam from the laser emitting unit 33 in the workpiece W, or an infrared sensor for detecting the processing state of the corresponding portion, or a camera and an infrared ray. It may be configured to include all sensors. In the embodiment of the present invention, it will be described that the processing point detection unit 6 is configured to include both a camera and an infrared sensor.
  • the vent mirror 32 and the vent mirror 51 of the reflected light detection unit 5 use a mirror having high transmittance of infrared radiation and visible light, so that the vent mirror 52 of the reflected light detection unit 5 is By disposing the processing point detection unit 6 behind it, it is possible to detect infrared radiation and visible light.
  • the processing point detection unit 6 includes a filter 61 that blocks the laser beam and transmits infrared radiation and visible light among the light transmitted through the vent pre-51 of the reflected light detection unit 5; It includes a vent mirror 62 that reflects the light filtered by the filter 61 to change a light path by 90°, and a sensor unit 63 that receives the light reflected by the vent mirror 62 .
  • the sensor unit 63 includes a camera and an infrared sensor, and obtains an image and a temperature of a portion irradiated with a laser beam in the workpiece W.
  • the monitoring unit 7 includes the laser beam power measured by the power detection unit 4, the laser reflected light power measured by the reflected light detection unit 5, the image and temperature obtained by the processing point detection unit 6, and the The oscillation laser beam power measured by the detection unit 13 of the laser oscillator 1 is received and output to a monitor (not shown).
  • the monitoring unit 7 includes a noise removing unit 71 that removes noise with respect to the received laser beam power, laser reflected light power, and temperature, and preset laser beam power.
  • a laser power conversion unit 72 that converts the laser beam power emitted to the laser emission unit 33 according to the conversion ratio, and the laser reflected light power to the reflected light power from the workpiece W according to a preset conversion ratio.
  • a reflected light power conversion unit 73 an output verification unit 74 that compares and verifies the laser beam power converted by the laser power conversion unit 72 with the laser beam power oscillated by the laser oscillator 1, and the laser power
  • An absorption verification unit 75 that calculates and verifies the laser beam power absorbed by the workpiece W according to the laser beam power converted by the conversion unit 72 and the reflected light power converted by the reflected light power conversion unit 73; It includes a processing state verification unit 76 for verifying the laser processing state of the workpiece (W) according to the image and temperature, and will be described in more detail as follows.
  • the laser beam power before noise is removed by the noise removing unit 71 is mixed with noise.
  • noise may be generated by the photodiode of the photoelectric conversion unit 43 , an optical path until reaching the photodiode, and the like.
  • the laser beam power of which noise is suppressed by filtering with a filter that removes high frequency shows a waveform as shown in FIG. 3(b).
  • the preset conversion ratio applied by the laser power conversion unit 72 is, for example, a laser measured by the power detection unit 4 by performing an experiment for measuring the laser beam power emitted from the laser emission unit 33 . It can be obtained according to the relative ratio with the beam power.
  • the preset conversion ratio applied by the reflected light power conversion unit 73 is, for example, the ratio of the light incident to the laser emission unit 33 among the reflected light generated by being reflected from the workpiece W to the workpiece W and the laser emission. It is estimated according to the relative position of the part 33 and the size of the exit hole of the laser emitting part 33 , and may be obtained by additionally reflecting the transmittance of the vent mirror 32 . Alternatively, it can be obtained according to a relative ratio with the power measured by the reflected light detector 5 by performing an experiment for measuring the reflected light reflected from the workpiece W.
  • the output verification unit 74 includes a power verification unit 741 that verifies the size suitability of the laser beam power according to the difference between the laser beam power and the oscillation laser beam power, and the pattern suitability of the laser beam power according to the pattern of the laser beam power. and a pattern verification unit 742 that verifies
  • the oscillating laser beam oscillated and output by the laser oscillator 1 is attenuated through the optical fiber 2, the collimation lens 31 and the vent mirror 32 and is detected by the power detection unit 4, the When the contamination, damage or deterioration of the optical fiber 2, the collimation lens 31, and the vent mirror 32 does not occur, the amount of power attenuation is measured by an experiment, and the range of the allowable power attenuation ratio is appropriately pre-set. can be set.
  • the power verification unit 741 is suitable if the power attenuation ratio obtained by the difference between the laser beam power measured through the power detection unit 4 and the oscillation laser beam power measured through the laser oscillator 1 is within a set range. If it is out of the set range, it can be judged as non-conforming. Here, it can be seen that the non-conformity determination is made when at least one of the optical fiber 2 , the collimation lens 31 , and the vent mirror 32 is contaminated, damaged, or deteriorated.
  • the power verification part 741 is the workpiece. The suitability of the laser beam power irradiated to (W) can be judged.
  • the laser beam power converted into the laser beam power irradiated to the workpiece W may be different from the laser beam power actually irradiated to the workpiece W due to contamination, damage or deterioration of the laser emitting part 33, but contamination, As described later, damage or deterioration can be indirectly determined by the absorption verification unit 75 or the processing state verification unit 76 .
  • the pattern verification unit 742 may verify a change in laser beam power appearing over time, and specifically determine suitability according to a size of a ripple component of the laser beam power.
  • the laser beam power measured by the power detection unit 4 is not constant and the ripple ingredients appear.
  • the laser oscillator 1 Since, for example, the size of the ripple component may vary according to control parameters applied to the proportional term, the integral term and the derivative term when the output is adjusted according to the PID control in the laser oscillator 1, the laser oscillator 1 ) can be used to verify the output of In addition, the ripple component generated by the laser oscillator 1 may be generated under the influence of the optical fiber 2 in the optical path of the laser beam.
  • the pattern verification unit 742 sets a value that is a standard for determining suitability for the magnitude of the ripple component of the measured laser beam power in advance, and determines the ripple component obtained by pattern analysis. It was configured to judge the suitability of the laser output according to the result of comparison with the set ripple component size.
  • the absorption verification unit 75 is a laser absorbed by the workpiece W as a difference between the laser beam power obtained by converting the laser power conversion unit 72 and the laser reflected light power obtained by converting the reflected light source conversion unit 73 .
  • the power is calculated, and it is determined whether an abnormal state is generated according to the contamination, damage, or deterioration of the laser emitting unit 33 according to the variation of the difference.
  • the energy can be calculated by integrating the laser beam power and the laser reflected light power over time, respectively, and the energy absorbed by the workpiece W can be calculated according to the difference in the calculated energy, and according to the change in the energy difference It may be determined whether an abnormal state of the laser emitting unit 33 has occurred.
  • the processing state verification unit 76 may determine the suitability of the processing state according to the image of the processing part of the workpiece W, and may determine the suitability of the processing state according to the temperature of the processing part.
  • the processing site temperature is known to be appropriately adjusted according to the processing method classified into welding, cutting, surface treatment, etc., or the material and thickness of the workpiece (W). By setting a suitable value according to the temperature, it is possible to determine the suitability by comparing it with the measured temperature of the processed part.
  • the laser beam power, the laser reflected light power, the image of the processing part, the temperature of the processing part, and the power absorbed by the processing part described above are obtained in real time and output to the monitor so that they can be compared with each other, as well as the output verification unit ( 74), the absorption verification unit 75 and the processing state verification unit 76 may output the suitability determined by the monitor.
  • the monitoring unit 7 may adjust the output of the laser oscillator 1 according to the laser beam power, the laser reflected light power, and the processing site absorption power, and according to the ripple component of the laser beam power, the laser oscillator 1 ) can be adjusted.
  • laser emission unit 331 total reflection mirror 332: focus lens
  • vent mirror 52 light attenuation means 53: photoelectric conversion unit

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un appareil de traitement laser permettant de surveiller la puissance laser, l'appareil surveillant la puissance d'un faisceau laser émis au niveau d'un objet à traiter, pour pouvoir effectuer un traitement laser tout en surveillant les états anormaux de parties individuelles et si un faisceau laser est normalement produit et, plus spécifiquement, comprend : une unité de détection de puissance (4), permettant de mesurer la puissance d'une partie d'un faisceau laser à produire à partir d'un appareil de traitement laser composé d'un oscillateur laser (1), d'une fibre optique (2) et d'une tête de traitement (3) ; et une unité de surveillance (7), permettant de déterminer si la puissance du faisceau laser est normale et si un chemin optique est anormal ou non, selon la puissance de faisceau laser calculée d'après la puissance mesurée, la variation de puissance pendant la transmission du faisceau laser et un motif de faisceau laser.
PCT/KR2022/002828 2021-04-30 2022-02-25 Appareil de traitement laser pour la surveillance de puissance laser WO2022231106A1 (fr)

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KR1020210056141A KR102528969B1 (ko) 2021-04-30 2021-04-30 레이저 파워를 모니터링하는 레이저 가공 장치
KR10-2021-0056141 2021-04-30

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