WO2022230901A1 - 固体電池パッケージ - Google Patents

固体電池パッケージ Download PDF

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Publication number
WO2022230901A1
WO2022230901A1 PCT/JP2022/018944 JP2022018944W WO2022230901A1 WO 2022230901 A1 WO2022230901 A1 WO 2022230901A1 JP 2022018944 W JP2022018944 W JP 2022018944W WO 2022230901 A1 WO2022230901 A1 WO 2022230901A1
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WIPO (PCT)
Prior art keywords
substrate
solid
electrode layer
layer
battery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/018944
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English (en)
French (fr)
Japanese (ja)
Inventor
浩史 石川
治彦 池田
俊孝 林
俊矢 川手
與之 戸波
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Priority to JP2023517575A priority Critical patent/JP7639898B2/ja
Publication of WO2022230901A1 publication Critical patent/WO2022230901A1/ja
Priority to US18/487,269 priority patent/US20240047792A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/116—Primary casings; Jackets or wrappings characterised by the material
    • H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
    • H01M50/126—Primary casings; Jackets or wrappings characterised by the material having a layered structure comprising three or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
    • H01M10/0561—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
    • H01M10/0562—Solid materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H01M10/0585—Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/11—Primary casings; Jackets or wrappings characterised by their shape or physical structure having a chip structure, e.g. micro-sized batteries integrated on chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/116—Primary casings; Jackets or wrappings characterised by the material
    • H01M50/117—Inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/116—Primary casings; Jackets or wrappings characterised by the material
    • H01M50/121—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/547—Terminals characterised by the disposition of the terminals on the cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to solid-state battery packages. More specifically, the present invention relates to solid state batteries packaged to facilitate board mounting.
  • Secondary batteries that can be repeatedly charged and discharged have been used for various purposes.
  • secondary batteries are used as power sources for electronic devices such as smartphones and notebook computers.
  • liquid electrolytes are generally used as a medium for ion transfer that contributes to charging and discharging. That is, a so-called electrolytic solution is used in the secondary battery.
  • electrolytic solution is used in the secondary battery.
  • safety is generally required in terms of preventing electrolyte leakage.
  • organic solvent and the like used in the electrolytic solution are combustible substances, safety is required in this respect as well.
  • solid-state batteries will be used together with other electronic components mounted on printed wiring boards, etc.
  • a structure suitable for mounting is required.
  • a package in which a solid-state battery is arranged on a substrate contributes to mounting by making the substrate responsible for electrical connection with the outside.
  • a solid battery includes a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the electrode layers of the positive electrode layer and the negative electrode layer, and end-face electrodes provided on the battery element. Further, in a solid battery, the electrode layers (positive electrode layer/negative electrode layer) may expand and contract during charging and discharging.
  • the inventors of the present application have noticed that the previously proposed solid-state batteries still have problems to be overcome, and have found the need to take countermeasures therefor.
  • the battery element expands and contracts due to the expansion and contraction of the electrode layers.
  • the end face electrodes provided on the battery elements themselves are difficult to expand and contract. Due to the difference in degree of expansion and contraction, stress may act from the solid battery side to the substrate side. In particular, this stress can increase from the central region side of the battery element toward the interface region side between the electrode layers and the end face electrodes. That is, among the stresses acting from the solid-state battery side to the substrate side, the stress along the interface region between the electrode layer and the edge electrode is relatively the largest. Therefore, the largest stress acts on a predetermined portion of the main surface of the substrate located below the edge electrode, which may cause cracks in the substrate. As a result, such cracks in the substrate may lead to the infiltration of moisture from the external environment, which may lead to the deterioration of battery characteristics.
  • a main object of the present invention is to provide a solid battery package capable of suitably suppressing cracking of the substrate.
  • the present invention comprising a substrate and a solid-state battery provided on the substrate;
  • the solid battery comprises a battery element comprising a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the solid battery electrode layers of the positive electrode layer and the negative electrode layer; a connected end face electrode;
  • the substrate has a positive electrode side substrate electrode layer which can be electrically connected to the solid state battery and a negative electrode side electrode layer which is spaced apart from and faces the positive electrode side substrate electrode layer.
  • the distance between the end surface of the end surface electrode on the side of the same polarity and the side surface of the solid battery electrode layer on the side of the counter electrode that is separated and opposed to the end surface is greater than or equal to the minimum distance.
  • cracking of the substrate can be suitably suppressed.
  • FIG. 1 is a cross-sectional view schematically showing the internal configuration of a solid-state battery.
  • FIG. 2 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to one embodiment of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • FIG. 4 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view schematically showing the structure of a packaged solid-state battery according to another embodiment of the invention.
  • FIG. 6 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • FIG. 1 is a cross-sectional view schematically showing the internal configuration of a solid-state battery.
  • FIG. 2 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to
  • FIG. 7 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • FIG. 8 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • FIG. 9 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • FIG. 10 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the invention.
  • FIG. 11 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the invention.
  • FIG. 12 is a cross-sectional view schematically showing a solid-state battery package, and is a schematic diagram particularly showing a certain substrate configuration example.
  • FIG. 13A is a process cross-sectional view schematically showing the manufacturing process of the solid battery package according to one embodiment of the present invention.
  • FIG. 13B is a process cross-sectional view schematically showing the manufacturing process of the solid battery package according to one embodiment of the present invention.
  • FIG. 13C is a process cross-sectional view schematically showing the manufacturing process of the solid battery package according to one embodiment of the present invention.
  • FIG. 13D is a process cross-sectional view schematically showing the manufacturing process of the solid battery package according to one embodiment of the present invention.
  • FIG. 13E is a process cross-sectional view schematically showing the manufacturing process of the solid battery package according to one embodiment of the present invention.
  • solid battery package broadly refers to a solid battery device (or solid battery product) configured to protect the solid battery from the external environment. It refers to a solid-state battery product that is provided with a substrate that contributes to mounting and that protects the solid-state battery from the external environment.
  • cross-sectional view refers to a form captured from a direction substantially perpendicular to the stacking direction in the stacking structure of a solid-state battery (straightforwardly, when cut in a plane parallel to the thickness direction of the layer) morphology).
  • planar view or “planar view shape” used herein refers to a sketch of the object when viewed from above or below along the thickness direction of the layer (that is, the lamination direction described above). ing.
  • Up-down direction and “left-right direction” used directly or indirectly in this specification correspond to the up-down direction and left-right direction in the drawing, respectively.
  • the same reference numerals or symbols indicate the same members/parts or the same meanings.
  • the downward vertical direction that is, the direction in which gravity acts
  • the opposite direction corresponds to the “upward direction”/“top side”.
  • solid battery as used in the present invention broadly refers to a battery whose components are solid, and narrowly refers to an all-solid-state battery whose components (particularly preferably all components) are solid.
  • the solid-state battery in the present invention is a stacked-type solid-state battery in which layers constituting battery structural units are stacked with each other, and preferably each such layer is made of a sintered body.
  • Solid battery includes not only a so-called “secondary battery” that can be repeatedly charged and discharged, but also a "primary battery” that can only be discharged.
  • the "solid battery” is a secondary battery.
  • Secondary battery is not limited to its name, and can include, for example, power storage devices.
  • the solid battery included in the package can also be referred to as a "solid battery element".
  • a solid battery includes at least positive and negative electrode layers and a solid electrolyte.
  • the solid battery 100 includes a solid battery stack including battery structural units composed of a positive electrode layer 110, a negative electrode layer 120, and at least a solid electrolyte 130 interposed therebetween.
  • each layer that constitutes it may be formed by firing, and the positive electrode layer, the negative electrode layer, the solid electrolyte, and the like may form the fired layers.
  • the positive electrode layer, the negative electrode layer, and the solid electrolyte are each co-fired with each other, and therefore the solid battery laminate preferably constitutes an co-fired body.
  • the positive electrode layer 110 is an electrode layer containing at least a positive electrode active material.
  • the positive electrode layer may further comprise a solid electrolyte.
  • the positive electrode layer is composed of a sintered body containing at least positive electrode active material particles and solid electrolyte particles.
  • the negative electrode layer is an electrode layer containing at least a negative electrode active material.
  • the negative electrode layer may further comprise a solid electrolyte.
  • the negative electrode layer is composed of a sintered body containing at least negative electrode active material particles and solid electrolyte particles.
  • the positive electrode active material and negative electrode active material are substances involved in the transfer of electrons in solid-state batteries. Ions are transferred (conducted) between the positive electrode layer and the negative electrode layer via the solid electrolyte, and electrons are transferred, whereby charging and discharging are performed.
  • Each of the positive electrode layer and the negative electrode layer is preferably a layer capable of intercalating and deintercalating lithium ions or sodium ions. That is, the solid-state battery is preferably an all-solid-state secondary battery in which charge and discharge are performed by moving lithium ions or sodium ions between the positive electrode layer and the negative electrode layer via a solid electrolyte.
  • Examples of the positive electrode active material contained in the positive electrode layer 110 include a lithium-containing phosphate compound having a Nasicon type structure, a lithium-containing phosphate compound having an olivine type structure, a lithium-containing layered oxide, and lithium having a spinel type structure. At least one selected from the group consisting of contained oxides and the like can be mentioned.
  • Li3V2 ( PO4) 3 etc. are mentioned as an example of the lithium containing phosphate compound which has a Nasicon type structure.
  • Examples of lithium-containing phosphate compounds having an olivine structure include Li3Fe2 ( PO4) 3 , LiFePO4 , and/or LiMnPO4 .
  • lithium - containing layered oxides examples include LiCoO2 and/or LiCo1 / 3Ni1 / 3Mn1 / 3O2 .
  • lithium-containing oxides having a spinel structure examples include LiMn 2 O 4 and/or LiNi 0.5 Mn 1.5 O 4 .
  • the type of lithium compound is not particularly limited, for example, a lithium transition metal composite oxide and a lithium transition metal phosphate compound may be used.
  • Lithium transition metal composite oxide is a general term for oxides containing lithium and one or more transition metal elements as constituent elements
  • lithium transition metal phosphate compounds are lithium and one or more transition metal elements.
  • the types of transition metal elements are not particularly limited, but examples include cobalt (Co), nickel (Ni), manganese (Mn) and iron (Fe).
  • the positive electrode active material capable of occluding and releasing sodium ions includes a sodium-containing phosphate compound having a Nasicon-type structure, a sodium-containing phosphate compound having an olivine-type structure, a sodium-containing layered oxide, and a spinel-type structure. At least one selected from the group consisting of sodium-containing oxides and the like can be mentioned.
  • Na3V2 (PO4) 3 NaCoFe2 (PO4) 3 , Na2Ni2Fe ( PO4) 3 , Na3Fe2 ( PO4 ) 3 , Na 2 FeP 2 O 7 , Na 4 Fe 3 (PO 4 ) 2 (P 2 O 7 ), and at least one selected from the group consisting of NaFeO 2 as the sodium-containing layered oxide.
  • the positive electrode active material may be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer.
  • the oxide may be, for example, titanium oxide, vanadium oxide, manganese dioxide, or the like.
  • Disulfides are, for example, titanium disulfide or molybdenum sulfide.
  • the chalcogenide may be, for example, niobium selenide.
  • the conductive polymer may be, for example, disulfide, polypyrrole, polyaniline, polythiophene, polyparastyrene, polyacetylene, polyacene, or the like.
  • the negative electrode active material contained in the negative electrode layer 120 includes, for example, titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb), and molybdenum (Mo).
  • Examples of lithium alloys include Li—Al and the like.
  • Li3V2 ( PO4) 3 and/or LiTi2 ( PO4) 3 etc. are mentioned as an example of the lithium containing phosphate compound which has a Nasicon type structure.
  • Examples of lithium - containing phosphate compounds having an olivine structure include Li3Fe2 (PO4)3 and /or LiCuPO4 .
  • Li4Ti5O12 etc. are mentioned as an example of the lithium containing oxide which has a spinel type structure.
  • a sodium-containing phosphate compound having a Nasicon-type structure a sodium-containing phosphate compound having an olivine-type structure, a sodium-containing oxide having a spinel-type structure, and the like. At least one selected from the group consisting of
  • the positive electrode layer and the negative electrode layer may be made of the same material.
  • the positive electrode layer and/or the negative electrode layer may contain a conductive material. At least one of metal materials such as silver, palladium, gold, platinum, aluminum, copper and nickel, and carbon can be used as the conductive material contained in the positive electrode layer and the negative electrode layer.
  • the positive electrode layer and/or the negative electrode layer may contain a sintering aid.
  • Sintering aids include at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide and phosphorus oxide.
  • the thicknesses of the positive electrode layer and the negative electrode layer are not particularly limited, for example, they may be independently 2 ⁇ m or more and 50 ⁇ m or less, particularly 5 ⁇ m or more and 30 ⁇ m or less.
  • the positive electrode layer 110 and the negative electrode layer 120 may each include a positive current collecting layer and a negative current collecting layer.
  • the positive current collecting layer and the negative current collecting layer may each have the form of a foil.
  • the positive electrode current collecting layer and the negative electrode current collecting layer are in the form of fired bodies, respectively.
  • the positive electrode current collector that constitutes the positive electrode current collecting layer and the negative electrode current collector that constitutes the negative electrode current collecting layer it is preferable to use materials having high electrical conductivity, such as silver, palladium, gold, platinum, aluminum, and copper. , and/or nickel, etc. may be used.
  • Each of the positive electrode current collector and the negative electrode current collector may have an electrical connection portion for electrical connection with the outside, and may be configured to be electrically connectable to the end face electrode.
  • the positive electrode current collecting layer and the negative electrode current collecting layer may be composed of a fired body containing a conductive material and a sintering aid.
  • the conductive material contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same conductive materials that can be contained in the positive electrode layer and the negative electrode layer.
  • the sintering aid contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected, for example, from materials similar to those of the sintering aid that can be contained in the positive electrode layer and the negative electrode layer.
  • a positive electrode current collecting layer and a negative electrode current collecting layer are not essential in a solid battery, and a solid battery without such a positive electrode current collecting layer and a negative electrode current collecting layer is also conceivable. That is, the solid-state battery included in the package of the present invention may be a solid-state battery without a current collecting layer.
  • a solid electrolyte is a material that can conduct lithium ions or sodium ions.
  • the solid electrolyte 130 forming a battery structural unit in a solid battery may form a layer capable of conducting lithium ions between the positive electrode layer 110 and the negative electrode layer 120 .
  • the solid electrolyte may be provided at least between the positive electrode layer and the negative electrode layer. That is, the solid electrolyte may exist around the positive electrode layer and/or the negative electrode layer so as to protrude from between the positive electrode layer and the negative electrode layer.
  • Specific solid electrolytes include, for example, one or more of crystalline solid electrolytes, glass-based solid electrolytes, glass-ceramics-based solid electrolytes, and the like.
  • Crystalline solid electrolytes include, for example, oxide-based crystal materials and sulfide-based crystal materials.
  • oxide-based crystal materials include lithium-containing phosphate compounds having a Nasicon structure, oxides having a perovskite structure, oxides having a garnet-type or garnet-like structure, oxide glass-ceramics-based lithium ion conductors, and the like. be done.
  • lithium-containing phosphate compounds having a Nasicon structure include LixMy (PO4) 3 ( 1 ⁇ x ⁇ 2 , 1 ⁇ y ⁇ 2 , M is titanium (Ti), germanium (Ge), aluminum (Al ), at least one selected from the group consisting of gallium (Ga) and zirconium (Zr)).
  • An example of the lithium-containing phosphate compound having a Nasicon structure includes Li 1.2 Al 0.2 Ti 1.8 (PO 4 ) 3 and the like.
  • An example of an oxide having a perovskite structure is La 0.55 Li 0.35 TiO 3 or the like.
  • An example of an oxide having a garnet - type or garnet - like structure is Li7La3Zr2O12 .
  • the sulfide - based crystal materials include thio - LISICON , such as Li3.25Ge0.25P0.75S4 and Li10GeP2S12 .
  • the crystalline solid electrolyte may contain a polymeric material (eg, polyethylene oxide (PEO), etc.).
  • Glass-based solid electrolytes include, for example, oxide-based glass materials and sulfide-based glass materials.
  • oxide-based glass materials include 50Li 4 SiO 4 and 50Li 3 BO 3 .
  • sulfide-based glass materials include, for example, 30Li 2 S.26B 2 S 3.44LiI, 63Li 2 S.36SiS 2.1Li 3 PO 4 , 57Li 2 S.38SiS 2.5Li 4 SiO 4 , 70Li 2 S. 30P2S5 and 50Li2S.50GeS2 .
  • Glass-ceramics solid electrolytes include, for example, oxide-based glass-ceramics materials and sulfide-based glass-ceramics materials.
  • oxide-based glass-ceramics material for example, a phosphate compound (LATP) containing lithium, aluminum and titanium as constituent elements and a phosphate compound (LAGP) containing lithium, aluminum and germanium as constituent elements can be used.
  • LATP is, for example , Li1.07Al0.69Ti1.46 ( PO4 ) 3 .
  • LAGP is, for example, Li 1.5 Al 0.5 Ge 1.5 (PO 4 ).
  • sulfide glass-ceramic materials include Li 7 P 3 S 11 and Li 3.25 P 0.95 S 4 .
  • Solid electrolytes capable of conducting sodium ions include, for example, sodium-containing phosphate compounds having a Nasicon structure, oxides having a perovskite structure, and oxides having a garnet-type or garnet-like structure.
  • the sodium-containing phosphate compound having a Nasicon structure includes Na x My (PO 4 ) 3 ( 1 ⁇ x ⁇ 2 , 1 ⁇ y ⁇ 2, M is selected from the group consisting of Ti, Ge, Al, Ga and Zr). selected at least one).
  • the solid electrolyte may contain a sintering aid.
  • the sintering aid contained in the solid electrolyte may be selected, for example, from materials similar to those of the sintering aid that can be contained in the positive electrode layer and the negative electrode layer.
  • the thickness of the solid electrolyte is not particularly limited.
  • the thickness of the solid electrolyte layer positioned between the positive electrode layer and the negative electrode layer may be, for example, 1 ⁇ m or more and 15 ⁇ m or less, particularly 1 ⁇ m or more and 5 ⁇ m or less.
  • End face electrode A solid-state battery is generally provided with end face electrodes 140 .
  • end-face electrodes are provided on the side faces of the solid-state battery. More specifically, a positive end surface electrode 140A connected to the positive electrode layer 110 and a negative end surface electrode 140B connected to the negative electrode layer 120 are provided (see FIG. 1).
  • Such edge electrodes preferably comprise a material with high electrical conductivity. Specific materials for the end face electrodes are not particularly limited, but at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin and nickel can be mentioned.
  • the present invention is a packaged solid state battery.
  • it is a solid battery package that includes a substrate that contributes to mounting and that has a structure in which the solid battery is protected from the external environment.
  • FIG. 2 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to one embodiment of the present invention.
  • a solid state battery package 1000 according to one embodiment of the invention comprises a substrate 200 on which the solid state battery 100 is supported.
  • the solid-state battery package 1000 includes a substrate 200 that contributes to mounting, and the solid-state battery 100 provided on the substrate 200 and protected from the external environment.
  • the inventors of the present application have diligently studied solutions for suitably suppressing cracking of the substrate 200 in the solid battery package 1000, and as a result, have come up with the present invention having the following technical ideas. Arrived.
  • the present invention is based on the idea that "a portion of the solid-state battery 100 found by the inventor of the present application that can easily be subjected to stress from the side of the solid-state battery 100 to the side of the substrate 200 during charging and discharging of the solid-state battery 100 is applied to the substrate.
  • the technical idea is to dare to provide a member that makes it difficult to act on 200.
  • the present invention has the following technical features (see Fig. 2).
  • the substrate 200 has a positive electrode side substrate electrode layer 210A and a positive electrode side substrate electrode layer 210A that can be electrically connected to the solid battery 100 on one main surface 230 facing the solid battery 100.
  • 210A and at least one of the substrate electrode layer 210B on the negative electrode side arranged to face and be spaced apart from each other.
  • the substrate 200 has, on the other main surface 240, a substrate electrode layer 220 for mounting the solid battery package 1000 on an external substrate, specifically a substrate electrode layer 220A on the positive electrode side and a substrate electrode on the positive electrode side. It includes a substrate electrode layer 220B on the negative electrode side spaced apart from and opposed to the layer 220A.
  • the substrate electrode layer 210 on the solid battery installation side and the substrate electrode layer 220 on the mounting side are configured to be electrically connectable via a metal member provided inside the substrate 220 .
  • the metal member may be made of, for example, at least one metal material selected from the group consisting of copper, aluminum, stainless steel, nickel, silver, gold and tin.
  • the end surface electrode 140 of the solid battery 100 and the substrate electrode layer 210 of the substrate 200 are connected via the bonding member 600.
  • the joint member 600 serves at least for electrical connection between the end surface electrode 140 of the solid battery 100 and the substrate 200, and may contain, for example, a conductive adhesive.
  • the joining member 600 may be composed of an epoxy-based conductive adhesive containing a metal filler such as Ag.
  • 210 is used as the reference numeral of the substrate electrode layer.
  • positive electrode layer 110 and the negative electrode layer 120 are not particularly distinguished, they are expressed as a solid electrode layer, and reference numeral 115 is used as the reference numeral for the same solid electrode layer.
  • reference numeral 140 is used as the end surface electrode.
  • At least one side surface 211 of the substrate electrode layer 210 and the end surface 141 of the end surface electrode 140 are substantially on the same line.
  • the distance L1 between the side surface 211 and the other side surface 212 is the distance between the end surface 141 of the end surface electrode 140 on the same polarity side and the side surface 115a of the solid battery electrode layer 115 on the counter electrode side facing the end surface 141 with a gap. is greater than or equal to the minimum distance L2 at which is the minimum.
  • the term "solid battery electrode layer” as used herein refers to an electrode layer that is a component of a solid battery, and may also be referred to as an electrode layer on the solid battery side.
  • substrate electrode layer refers to an electrode layer that is a component of the substrate, and may also be referred to as an electrode layer on the substrate side.
  • substrate electrode layer refers to, of the two main surfaces of the substrate facing each other, the main surface on the side facing the solid battery opposite to the main surface on which the external substrate is mounted.
  • an electrode layer disposed on a surface which may also be referred to as the upper major surface.
  • One side surface of the substrate electrode layer and the end surface of the end surface electrode are substantially on the same line means that the end surface of the end surface electrode and one side surface of the substrate electrode layer are substantially aligned via a bonding member or directly.
  • the one side surface of the substrate electrode layer referred to here is not only the actual one side surface of the substrate electrode layer, but also the apparent one side that can be arranged in series with the end surface of the end surface electrode. refers to those that include aspects of Each of the end face of the end face electrode and one side face of the substrate electrode layer may be linear or curved.
  • the term “interface region” broadly includes a boundary portion where the solid battery electrode layer 115 and the end face electrode 140 are in contact with each other and a portion near the boundary portion.
  • the distance L1 (corresponding to the width dimension of the substrate electrode layer 210) between one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is the same.
  • the minimum distance L2 between the end face 141 of the end face electrode 140 on the pole side and the side face 115a of the solid battery electrode layer 115 on the counter pole side is longer than or equal to L2.
  • the other side surface 212 of the substrate electrode layer 210 and the side surface 115a of the solid battery electrode layer 115 on the counter electrode side can be positioned substantially on the same line.
  • minimum distance as used herein means the minimum linear horizontal distance connecting a predetermined point on the end face of the end face electrode and a predetermined point on the side surface of the solid battery electrode layer on the counter electrode side facing the end face electrode. point to something
  • the other side surface 212 of the substrate electrode layer 210 is located inside the interface region 180 between the solid battery electrode layer 115 and the end face electrode 140 on the same pole side. Therefore, the greatest stress that can act on the substrate 200 side along the interface region 180 between the solid battery electrode layer 115 and the end face electrode 140 on the same pole side is received by the substrate electrode layer 210 not at a “point” but at a “surface”. It will be done. That is, the substrate electrode layer 210 can function as a "stress-receiving layer", specifically a "stress "planar” receptive layer".
  • the substrate electrode layer 210 itself can be electrically connected to the solid-state battery 100, it can be made of a metal layer with relatively high strength.
  • This metal layer is, for example, copper (Cu) plated with gold (Au) (Cu—Au), or copper (Cu) plated with nickel (Ni) and gold (Au) (Cu— Ni—Au) or the like.
  • the thickness of the substrate electrode layer 210 can be 2 to 50 ⁇ m, eg, 30 ⁇ m.
  • the greatest stress that can act on the substrate 200 side along the interface region 180 between the solid battery electrode layer 115 and the end surface electrode 140 on the same pole side is applied to the relatively high strength "plane" substrate. It can be received by electrode layer 210 . Such stress reception by the substrate electrode layer 210 can suppress the stress from acting on a predetermined portion of the main surface 230 of the substrate 200 along the interface region 180 between the solid battery electrode layer 115 and the end face electrode 140 . As a result, according to one embodiment of the present invention, cracking of the substrate 200 can be suitably suppressed. By suppressing cracking of the substrate, it is possible to suppress the infiltration of moisture from the external environment into the solid-state battery 100 through the substrate 200 . Therefore, according to one embodiment of the present invention, it is possible to improve battery characteristics.
  • the solid state battery package 1000 may also have water vapor permeation resistance properties as follows. Therefore, the content of such prevention of water vapor permeation will be described below.
  • the term "steam” as used herein is not particularly limited to water in a gaseous state, and includes water in a liquid state.
  • water vapor is used to broadly encompass items related to water regardless of its physical state. Therefore, “water vapor” can also be referred to as moisture, and in particular, water in a liquid state may include condensed water in which water in a gaseous state is condensed.
  • the substrate 200 is configured to support the solid-state battery 100. Therefore, the substrate 200 is provided so as to shield the main surface of the solid-state battery 100 from the external environment. The presence of the substrate 200 can also prevent water vapor from entering the solid-state battery 100 .
  • the substrate 200 has a main surface larger than, for example, a solid-state battery.
  • the substrate 200 may be a resin substrate.
  • substrate 200 may be a ceramic substrate.
  • substrate 200 may fall within the categories of printed wiring board, flexible substrate, LTCC substrate, or HTCC substrate.
  • the substrate 200 may be a substrate configured to contain a resin as a base material, for example, a laminate structure of substrates including a resin layer.
  • the resin material of such resin layers may be any thermoplastic and/or any thermosetting resin.
  • the resin layer may be formed by impregnating a glass fiber cloth with a resin material such as an epoxy resin, for example.
  • the substrate is preferably a member for external terminals of the packaged solid-state battery.
  • the substrate serves as a terminal substrate for external terminals of the solid-state battery.
  • a solid-state battery package with such a substrate can mount the solid-state battery on another external substrate (ie, secondary substrate) such as a printed wiring board in such a manner that the substrate is interposed.
  • the solid-state battery can be surface-mounted through the support substrate, such as through solder reflow.
  • the solid battery package of the present invention is preferably an SMD (SMD: Surface Mount Device) type battery package.
  • the solid state battery package 1000 not only the substrate 200 but also the solid state battery package 1000 itself as a whole may be configured to be water vapor permeable.
  • the solid state battery package 1000 according to one embodiment of the present invention can be covered with a covering material 150 to entirely surround the solid state battery 100 provided on the substrate 200 .
  • solid-state battery 100 on substrate 200 may be packaged such that main surface 100A and side surface 100B are surrounded by covering material 150 . According to such a configuration, all the surfaces forming the solid-state battery 100 are not exposed to the outside, and it is possible to more preferably prevent water vapor permeation.
  • the covering material 150 may be composed of an insulating covering layer and an inorganic covering layer, and at least the solid-state battery 100 is covered with an insulating covering layer 160 and an inorganic covering layer 170 as the covering material 150 . can.
  • the covering insulating layer 160 is a layer provided so as to cover the main surface 100A and side surfaces 100B of the solid battery 100 .
  • the covering insulating layer 160 largely envelops the solid battery 100 on the substrate 200 as a whole.
  • the material of the insulating coating layer may be of any type as long as it exhibits insulating properties.
  • the insulating cover layer 160 may contain a resin, which may be either a thermosetting resin or a thermoplastic resin.
  • the insulating cover layer 160 may contain an inorganic filler. Although this is merely an example, the insulating coating layer 160 may be made of an epoxy-based resin containing an inorganic filler such as SiC.
  • the covering inorganic layer 170 is provided so as to cover the covering insulating layer 160 . As shown in FIG. 2 , the covering inorganic layer 170 is positioned on the covering insulating layer 160 , and thus has a shape that largely envelops the solid battery 100 on the substrate 200 as a whole together with the covering insulating layer 160 .
  • This covering inorganic layer may, for example, have the form of a film.
  • the covering inorganic layer 170 can take a form that also covers the side surfaces 250 of the substrate 200 .
  • the insulating coating layer 160 works together with the inorganic coating layer 170 to form a suitable water vapor barrier, and the inorganic coating layer 170 also works together with the insulating coating layer 160 to form a suitable water vapor barrier.
  • the material of the coating inorganic layer 170 is not particularly limited, and may be metal, glass, oxide ceramics, or a mixture thereof.
  • the covering inorganic layer 170 may correspond to an inorganic layer having the form of a thin film, in which case it is preferably a metal film, for example.
  • the covering inorganic layer 170 may be formed of a Cu-based and/or Ni-based material having a thickness of 2 ⁇ m or more and 50 ⁇ m or less by plating.
  • the other side surface 212 of the substrate electrode layer 210 is located inside the side surface 115a of the solid battery electrode layer 115 on the counter electrode side in a cross-sectional view (see FIG. 3).
  • FIG. 3 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the other side surface 212 of the substrate electrode layer 210 and the side surface 115a of the solid battery electrode layer 115 on the counter electrode side are substantially on the same line in a cross-sectional view. It is based on the case where it can be located.
  • the other side surface 212 of the substrate electrode layer 210 is located inside the side surface 115a of the solid battery electrode layer 115 on the counter electrode side, as compared with the embodiment shown in FIG. characterized by
  • the stress acting from the solid battery 100 side to the substrate 200 side can increase toward the interface region 180 side between the electrode layer 115 and the edge electrode 140 . From this, the stress can be greatest along the interface region 180 and gradually decrease from the interface region 180 toward the central region of the cell element 100X.
  • the term "battery element” refers to an element including the positive electrode layer 110, the negative electrode layer 120, and the solid electrolyte 130, excluding end face electrodes.
  • the other side surface 212 of the substrate electrode layer 210 is positioned inside the side surface 115a of the solid battery electrode layer 115 on the counter electrode side. That is, the substrate electrode layer 210 is extended to a position where it can face the solid battery electrode layer 115 on the counter electrode side in a cross-sectional view. As a result, compared to the basic embodiment shown in FIG. 2, the area of the substrate electrode layer 210 that can function as a planar stress-receiving layer can be expanded.
  • the stress along the region between the interface region 180 and the central region 100X1 of the battery element 100X is also relatively high in strength, and the “plane”-shaped substrate electrode layer 210.
  • the stress along the region between the interface region 180 and the central region 100X1 of the battery element 100X can be suppressed from acting on a predetermined portion of the principal surface 230 of the substrate 200.
  • the distance L1 (corresponding to the width dimension) between one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is set to 1.5 times or more the above-described minimum distance L2. is preferred (see FIG. 4).
  • FIG. 4 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the stress that can act on the substrate 200 side has the property of gradually decreasing from the interface region 180 toward the central region of the battery element 100X. Therefore, among the regions between the interface region 180 and the central region 100X1 of the battery element 100X, the stress along the region adjacent to the interface region 180 is relatively slightly smaller than the stress along the interface region 180. It's nothing more than Therefore, the stress along the region within this range also affects the substrate 200 side.
  • region adjacent to the interface region refers to the width of the region between the interface region 180 and the central region 100X1 of the battery element 100X, which is greater than 5% and 20%, based on the interface region 180. % or less.
  • the width dimension of the substrate electrode layer 210 is set to 1.5 times or more the above-described minimum distance L2.
  • the area of the substrate electrode layer 210 that can function as a planar stress-receiving layer can be expanded.
  • stresses along regions adjacent to the interface region 180 can also be favorably accommodated by the relatively strong “flat” substrate electrode layer 210 .
  • the distance L1 (corresponding to the width dimension) between one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is set to the end surface 141 of the end surface electrode 140 on the same pole side. It is preferable that the distance between the side surface 115a of the solid battery electrode layer 115 on the side of the counter electrode and the spaced opposite side is the maximum distance L3 or more (see FIG. 5).
  • FIG. 5 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the stress acting on the substrate 200 side has the property of gradually increasing toward the interface region 180 side between the electrode layer 115 and the edge electrode 140 .
  • the width of substrate electrode layer 210 is preferably greater than in the basic embodiment shown in FIG. It is preferable that the dimensions are secured. Specifically, it is preferable that the width dimension of the substrate electrode layer 210 is equal to or greater than the maximum distance L3.
  • the area of the substrate electrode layer 210 that can function as a planar stress-receiving layer can be expanded.
  • the distance L1 (corresponding to the width dimension) between one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is set to 2.0 times or more the above-described minimum distance L2. is more preferable (see FIG. 6).
  • FIG. 6 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the stress that can act on the substrate 200 side has the property of gradually decreasing from the interface region 180 toward the central region of the battery element 100X. Therefore, with the interface region 180 as a reference, the stress along the region of more than 20% and 50% or less of the width of the region between the interface region 180 and the central region 100X1 of the cell element 100X also approaches the interface region 180. It is only relatively slightly less than the stress along the region. Therefore, the stress along the region within this range also affects the substrate 200 side.
  • the width dimension of the substrate electrode layer 210 is set to 2.0 times or more the above-described minimum distance L2.
  • the region of the substrate electrode layer 210 that can function as a planar stress-receiving layer can be further expanded.
  • the stress along the region of 50% or less of the width of the region between the interface region 180 and the central region 100X1 of the battery element 100X is favorably controlled by the “plane”-shaped substrate electrode layer 210 having relatively high strength. can be accepted.
  • the substrate electrode layer 210 extends along the main surface 230 of the substrate 200 on the side facing the solid battery 100 to such an extent that it does not contact the substrate electrode layer 210 on the counter electrode side ( See Figure 7).
  • FIG. 7 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the stress acting on the substrate 200 side gradually increases from the central region 100X1 of the battery element 100X toward the interface region 180 between the electrode layer 115 and the end surface electrode 140.
  • stress can act from the solid battery 100 side to the substrate 200 side along the entire region from the interface region 180 to the central region 100X1 side of the battery element 100X. . For this reason, as shown in FIG.
  • the substrate electrode layer 210 extends along the main surface 230 of the substrate 200 to such an extent that it does not come into contact with the substrate electrode layer 210 on the counter electrode side. Thereby, the substrate electrode layer 210 can receive stress that can act on the substrate 200 side along the entire region from the interface region 180 to the central region 100X1 side of the battery element 100X.
  • both the positive electrode side substrate electrode layer 210A and the negative electrode side substrate electrode layer 210B adopt the above configuration, the total width of the both substrate electrode layers 210A and 210B can be brought close to the full width of the solid battery 100 in a cross-sectional view. . Therefore, both substrate electrode layers 210A, 210B can receive almost all stress that may act on the substrate 200. FIG. As a result, cracking of the substrate 200 can be more suitably suppressed.
  • one side surface 211 of the substrate electrode layer 210 is located outside the end surface 141 of the end surface electrode 140 and inside the end portion 231 of the principal surface 230 of the substrate 200 in a cross-sectional view. (see Figure 8).
  • FIG. 8 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the substrate electrode layer 210 can be positioned not only inside but also outside the end face 141 of the end face electrode 140 as a reference.
  • the substrate electrode layer 210 is arranged along the main surface 230 of the substrate 200 by the distance L4 between one side surface 211 and the end surface 141 of the end surface electrode 140, relative to the end surface 141 of the end surface electrode 140. can extend outward.
  • the inner portion 210 ⁇ of the substrate electrode layer 210 located inside the end face 141 of the end face electrode 140 functions as a planar stress receiving layer as described above.
  • the outer portion 210 ⁇ of the substrate electrode layer 210 located outside the end face 141 of the end face electrode 140 can be a portion relatively impermeable to water vapor because the substrate electrode layer 210 itself is a metal layer. This can prevent water vapor from entering the solid battery 100 through the substrate 200 from the external environment.
  • the coating inorganic layer 170 also covers the side surface 250 of the substrate 200 and can be, for example, a metal film. Therefore, from the viewpoint of ensuring electrical insulation between the substrate electrode layer 210 and the covering inorganic layer 170 without contacting them, one side surface 211 of the substrate electrode layer 210 is located inside the side surface of the substrate 200, that is, the substrate. It is preferably located inside the end 231 of the major surface 230 of 200 .
  • the substrate 200 has a dummy substrate electrode layer 210 ⁇ /b>C that is spaced apart from and faces the substrate electrode layer 210 and that is not electrically connected to the solid battery 100 , on the main surface 230 of the substrate 200 facing the solid battery 100 . Further provision is made (see FIG. 9).
  • FIG. 9 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • the substrate electrode layer 210 that can function at least as a planar stress receiving layer, and the dummy substrate electrode layer 210C spaced therefrom are formed.
  • the substrate electrode layer 220 on the mounting side is provided with a predetermined spacing.
  • the presence of the dummy substrate electrode layer 210C has the following advantages over the absence thereof. Specifically, the arrangement patterns of the electrode layers respectively arranged on the two opposing main surfaces 230 and 240 of the substrate 200 can be made similar.
  • the rigidity of the substrate 200 itself can be increased.
  • the dummy substrate electrode layer 210C itself is a metal layer, it can be a portion through which water vapor is relatively difficult to permeate. This can prevent water vapor from entering the solid battery 100 through the substrate 200 from the external environment.
  • the dummy substrate electrode layer 210C can be further arranged between the substrate electrode layer 210A on the positive electrode side and the substrate electrode layer 210B on the negative electrode side with a gap that does not come in contact with both. can. According to such arrangement, the rigidity of the substrate 200 itself can be improved and the water vapor barrier property can be further improved. Furthermore, since the dummy substrate electrode layer 210C in this case is located inside the end face 141 of the end face electrode 140 as a reference, it can also function as a planar stress receiving layer.
  • a water vapor barrier layer 300 between the substrate 200 and the solid-state battery 100 (see FIG. 11).
  • FIG. 11 is a cross-sectional view schematically showing the configuration of a packaged solid-state battery according to another embodiment of the present invention.
  • solid-state battery package 1000 includes substrate 200 and solid-state battery 100 provided on substrate 200 .
  • the substrate 200 is provided so as to shield the main surface of the solid-state battery 100 from the external environment. Therefore, it is generally believed that the presence of the substrate can prevent water vapor infiltration into the solid-state battery. In this regard, the substrate 200 alone may not be sufficient to prevent water vapor permeation. This is because the substrate 200 may be permeable to water vapor in the external environment due to the material and/or structure of the substrate 200 .
  • This water vapor barrier layer 300 may, for example, have the form of a film.
  • This water vapor barrier layer 300 it is possible to effectively suppress water vapor permeation through the substrate 200 to the solid battery 100 side. As a result, it is possible to suppress a decrease in the ionic conductivity of the solid electrolyte 130 due to a reaction between the solid electrolyte 130 and water vapor (moisture) that has entered from the substrate 200, for example.
  • the water vapor barrier layer 300 may be provided so as to be in contact with the covering insulating layer 160 .
  • the insulating coating layer 160 is preferably provided so as to cover not only the side surfaces of the solid battery 100 but also the bottom surface of the solid battery. It's okay. This means that a water vapor barrier layer is provided between the sealing resin surrounding the solid-state battery and the substrate.
  • the water vapor barrier layer 300 may be arranged between the insulating coating layer 160 and the resist layer 400 .
  • the thickness for each layer of the water vapor barrier layer and the solid state battery and substrate may be based on electron microscopic images.
  • the thickness of the water vapor barrier layer and the thickness of the layers composing the substrate and the solid-state battery are determined by cutting out a cross section with an ion milling device (manufactured by Hitachi High-Tech Co., model number IM4000PLUS) and scanning electron microscope (SEM) (manufactured by Hitachi High-Tech Co., Ltd. model number SU-). 8040) may be based on images acquired using That is, the thickness dimension in this specification may refer to a value calculated from a dimension measured from an image acquired by such a method.
  • the term “barrier” as used herein means having a property of preventing water vapor permeation to the extent that water vapor in the external environment does not pass through the substrate and cause deterioration of properties that are undesirable for solid-state batteries. In a narrow sense, it means that the water vapor transmission rate is less than 5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ Day). Therefore, in short, the water vapor barrier layer preferably has a water vapor transmission rate of 0 g/(m 2 ⁇ Day) or more and less than 5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ Day) (for example, 0.5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ Day) or more and less than 5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ Day)). As used herein, the term "water vapor transmission rate” refers to the transmission rate obtained by the MORESCO Co., Ltd. model WG-15S gas transmission rate measurement device under the measurement conditions of 85°C and 85% RH MA method. pointing.
  • the water vapor barrier layer 300 is arranged so as to extend along the extending direction of the main surface 230 of the substrate 200 (see FIG. 11).
  • the water vapor barrier layer 300 extends in the direction orthogonal to the stacking direction of the solid-state battery.
  • the water vapor barrier layer 300 widely extending along the direction of the main surface 230 of the substrate 300 can more effectively block water vapor entering from the external environment through the substrate 200 .
  • the water vapor barrier layer 300 can more preferably act so that water vapor from the outside of the package does not finally reach the solid battery 100, and in the long term, the deterioration of the solid battery characteristics can be suppressed.
  • a solid state battery package 1000 is provided.
  • the water vapor barrier layer 300 extending in the direction along the main surface of the substrate 200 is provided widely to the outer region of the solid battery 100 . That is, it is preferable that the water vapor barrier layer 300 is provided widely so as to protrude from the solid battery 100 .
  • the water vapor barrier layer 300 may extend to the covering material covering the solid state battery 100 .
  • the water vapor barrier layer 300 may extend to the outer surface of the covering insulating layer 160 covering the solid state battery 100 on the substrate 200 . That is, when the solid battery package 1000 has the covering insulating layer 160 provided on the substrate 200 so as to cover at least the main surface 100A and the side surface 100B of the solid battery 100, the covering insulating layer covering the side surface 100B of the solid battery 100, Water vapor barrier layer 300 preferably extends to outer surface 160A of 160 (see FIG. 11). As a result, the water vapor entering from the external environment via the substrate 200 can be more preferably prevented. In other words, the water vapor barrier layer 300 can work more reliably to prevent external water vapor entering through the substrate 200 from reaching the solid battery 100 .
  • the water vapor barrier layer 300 is an insulating layer having electrical insulation. That is, the water vapor barrier layer 300 may be a film containing a material with high electrical insulation. This is because it becomes easier to suppress an inconvenient event such as a short circuit. In other words, it is possible to prevent the water vapor permeation while suppressing the electrically disadvantageous influence caused by the water vapor permeation.
  • a water vapor barrier layer 300 is not particularly limited as long as it is a material exhibiting insulation properties, and specific examples of the material include glass, inorganic insulators such as alumina, and organic insulators such as resin. These may be used singly or in combination of two or more.
  • the water vapor barrier layer 300 may have the form of a single layer.
  • the water vapor barrier layer 300 may have a multi-layer configuration (ie, a multi-layer configuration as described below). They are not particularly limited so long as they provide the desired properties of preventing water vapor transmission.
  • the water vapor barrier layer 300 is an insulating multilayer film. By forming multiple layers, the water vapor barrier property of the water vapor barrier layer 300 can be improved. For such an insulating multilayer film, the same film may be formed multiple times, or different films may be formed. In the case of different films, an organic insulating barrier layer may be formed on an inorganic insulating barrier layer.
  • the water vapor barrier layer 300 is provided so as to occupy substantially a large planar view area of the solid battery package 1000 .
  • a large water vapor barrier layer 300 may be provided so as to occupy the entire area of the solid battery 100 excluding the connection area between the end surface electrode 140 and the substrate electrode layer 210 .
  • the water vapor barrier layer 300 having such a large area in plan view can more reliably prevent water vapor from entering through the substrate 200 from the external environment.
  • the water vapor barrier layer is preferably a layer containing silicon. This is because it is likely to be a suitable layer in terms of electrical insulation.
  • the water vapor barrier layer containing silicon may be a layer composed of a molecular structure containing not only silicon atoms but also nitrogen atoms and oxygen atoms. This is because it tends to be a suitable layer in terms of electrical insulation and thinning.
  • a water vapor barrier layer comprises both Si--O bonds and Si--N bonds. That is, both Si--O bonds and Si--N bonds may exist in the molecular structure constituting the material of the water vapor barrier layer.
  • the layer is likely to be a dense layer even though it is thin, and is likely to be a water vapor barrier layer capable of exhibiting even better water vapor permeation prevention properties.
  • the water vapor barrier layer containing silicon and the water vapor barrier layer having both Si--O bonds and Si--N bonds are not based on siloxane.
  • the water vapor barrier layer according to the present invention has a molecular structure that contains silicon and Si—O bonds but does not contain a siloxane skeleton.
  • Si--O bond and Si--N bond refer to those that can be confirmed based on Fourier transform infrared spectroscopy (FT-IR), for example. That is, in the water vapor barrier layer according to this aspect, Si—O bonds and Si—N bonds can be confirmed by measuring the absorption of light in the infrared region.
  • FT-IR refers to measurement by a microscopic ATR method using, for example, Spotlight 150 manufactured by PerkinElmer.
  • a water vapor barrier layer having Si--O bonds and Si--N bonds can be a layer with relatively high toughness. This means that the water vapor barrier layer works well during charging and discharging of the solid battery. During charging and discharging of solid-state batteries, the movement of ions between the positive and negative electrode layers through the solid electrolyte layer can cause the solid-state batteries to expand and contract. The layer is hard to break or crack. Normally, a layer with high water vapor barrier properties is dense and hard and tends to crack or crack easily due to stress, while a relatively flexible layer that does not crack or crack is a water vapor barrier. may have a tendency to be less aggressive.
  • a water vapor barrier layer having Si—O bonds and Si—N bonds is less susceptible to cracks and cracks even when subjected to the stress of expansion and contraction of a solid-state battery, and even so, it has high water vapor permeability. Since it becomes a layer, it becomes a highly reliable solid battery package.
  • the water vapor barrier layer having Si--O bonds and Si--N bonds is formed from liquid raw materials. Specifically, it is preferable to form a water vapor barrier layer having both Si--O bonds and Si--N bonds by applying a liquid raw material to a substrate and irradiating it with light. As a result, the water vapor barrier layer can be formed without subjecting the substrate to higher temperatures, and adverse thermal effects on the substrate can be suppressed.
  • the vacuum deposition method or the like requires an expensive deposition apparatus, but the formation using such a liquid source does not require such an expensive apparatus, and the cost can be kept relatively low.
  • a layer produced by a vacuum deposition method or the like may warp the substrate due to the stress acting on it, the layer produced from a liquid raw material as described above has less such stress. Substantially no such stress occurs. Therefore, the possibility of warping of the substrate is reduced or prevented when the water vapor barrier layer is produced from the liquid raw material.
  • a resist layer 400 can be arranged between the substrate 200 and the solid-state battery 100 (see FIG. 2, etc.).
  • a resist layer 400 may be provided between the substrate 200 and the solid-state battery 100 .
  • the resist layer 400 is particularly provided on the main surface of the substrate 200 .
  • the resist layer 400 is a layer that at least partially covers the substrate surface to protect it from physical processing or chemical reaction. Therefore, the resist layer may be an insulating layer containing a resin material provided on the main surface of the substrate 200 .
  • Such a resist layer can also be regarded as equivalent to a heat-resistant coating provided on the main surface of substrate 200 .
  • it may be a resist that maintains insulation when connecting the solid battery and the substrate and serves to protect the conductor portion such as the substrate electrode layer.
  • the resist layer 400 provided on the main surface of the substrate 200 may be, for example, a layer of solder resist.
  • the resist layer 400 may be provided on the main surface of the substrate 200 .
  • the water vapor barrier layer 300 may be arranged at least on the resist layer 400 .
  • the water vapor barrier layer 300 is arranged so as to be in direct contact with the resist layer 400 so that the water vapor barrier layer 300 and the resist layer 400 are stacked on each other.
  • the water vapor barrier layer is provided on the resist layer in this way, it is possible to more effectively prevent water vapor from entering from the external environment via the substrate 200 and the resist layer 400 thereon.
  • An object of the present invention is obtained by preparing a solid battery including a battery structural unit having a positive electrode layer, a negative electrode layer, and a solid electrolyte between the electrodes, and then packaging the solid battery. be able to.
  • the production of the solid-state battery of the present invention can be broadly divided into the production of the solid-state battery itself (hereinafter also referred to as the "pre-packaged battery"), which corresponds to the pre-packaging stage, the preparation of the substrate, and the packaging. .
  • the prepackaged battery can be manufactured by a printing method such as a screen printing method, a green sheet method using a green sheet, or a combination thereof. That is, the pre-packaged battery itself may be produced according to a conventional solid-state battery production method (thus, solid electrolytes, organic binders, solvents, optional additives, positive electrode active materials, negative electrode active materials, etc. described below). may be those used in the manufacture of known solid-state batteries).
  • a slurry is prepared by mixing a solid electrolyte, an organic binder, a solvent and optional additives.
  • a sheet comprising a solid electrolyte is then formed from the prepared slurry by sintering.
  • a positive electrode paste is prepared by mixing a positive electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent and optional additives.
  • a negative electrode paste is prepared by mixing a negative electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent and optional additives.
  • a negative electrode paste is printed on the sheet, and a current collection layer and/or a negative layer are printed as necessary.
  • a laminate is obtained by alternately laminating a sheet printed with the positive electrode paste and a sheet printed with the negative electrode paste.
  • the outermost layer (uppermost layer and/or lowermost layer) of the laminate may be an electrolyte layer, an insulating layer, or an electrode layer.
  • the laminate is integrated by pressure bonding, it is cut into a predetermined size.
  • the obtained cut laminate is subjected to degreasing and firing.
  • a fired laminate is thus obtained.
  • the laminate may be subjected to degreasing and baking before cutting, and then cutting may be performed.
  • the end surface electrode on the positive electrode side can be formed by applying a conductive paste to the side surface of the fired laminate where the positive electrode is exposed.
  • the end surface electrode on the negative electrode side can be formed by applying a conductive paste to the negative electrode exposed side surface of the fired laminate.
  • the end surface electrodes on the positive electrode side and the negative electrode side may be provided so as to reach the main surface of the fired laminate.
  • a component of the end face electrode can be selected from at least one selected from silver, gold, platinum, aluminum, copper, tin and nickel.
  • end surface electrodes on the positive electrode side and the negative electrode side are not limited to being formed after firing the laminate, and may be formed before firing and subjected to simultaneous firing.
  • a desired prepackaged battery (corresponding to the solid battery 100 shown in FIG. 13A) can finally be obtained through the steps described above.
  • a substrate is prepared.
  • a resin substrate when used as the substrate, it may be prepared by laminating a plurality of layers and subjecting them to heat and pressure treatment.
  • a substrate precursor is formed using a resin sheet formed by impregnating a fiber cloth serving as a base material with a resin raw material. After forming the substrate precursor, the substrate precursor is subjected to heat and pressure in a press.
  • a ceramic substrate when used as the substrate, it is prepared, for example, by thermocompression bonding a plurality of green sheets to form a green sheet laminate, and firing the green sheet laminate to obtain a ceramic substrate. can be done.
  • the ceramic substrate can be prepared, for example, according to the production of the LTCC substrate.
  • a semi-rack substrate may have vias and/or lands.
  • holes are formed in the green sheet by a punch press or a carbon dioxide gas laser, and the holes are filled with a conductive paste material, or vias, lands, etc. are formed by printing or the like. may form a precursor of the conductive portion of the The land and the like can also be formed after firing the green sheet laminate.
  • a substrate electrode layer 210 is formed on the main surface 230 of the substrate 200 for electrical connection (see FIG. 13B).
  • the substrate electrode layer may be appropriately patterned. Specifically, in a cross-sectional view, one side surface of the substrate electrode layer and the end surface of the end surface electrode of the same polarity side of the solid battery to be mounted later are substantially on the same line. The distance between one side surface and the other side surface is the minimum distance between the end surface of the end surface electrode on the side of the same polarity and the side surface of the solid battery electrode layer on the counter electrode side that faces the end surface with a distance.
  • a substrate electrode layer 210 is formed on the main surface of the substrate so as to be at least the minimum distance.
  • a resist layer 400 made of, for example, a solder resist may be formed on the main surface 230 of the substrate 200 excluding the substrate electrode layer (see FIG. 13C).
  • the step of forming the resist layer 400 may be omitted. Through the steps described above, a desired substrate can be finally obtained.
  • the prepackaged battery 100 is placed on the substrate 200 (see FIG. 13D). That is, an "unpackaged solid battery” is placed on the substrate (hereinafter, the battery used for packaging is also simply referred to as a "solid battery”).
  • the solid state battery is arranged on the substrate so that the substrate electrode layer and the end face electrodes of the solid state battery are electrically connected to each other.
  • the solid-state battery is placed while adjusting so that the end face of the end-face electrode of the solid-state battery placed on the substrate and one side surface of the substrate electrode layer are aligned substantially on the same line.
  • the end surface of the end surface electrode of the solid battery and one side surface of the substrate electrode layer do not necessarily have to be on the same line. may also be positioned outside.
  • a conductive paste (e.g., Ag conductive paste) is provided on the substrate electrode layer of the substrate before placement of the solid-state battery, thereby connecting the conductive portion of the supporting substrate and the end face electrode of the solid-state battery to each other. It may be electrically connected.
  • the precursor 600 ′ of the bonding member that is responsible for electrical connection between the solid-state battery 100 and the substrate 200 may be provided in advance.
  • Such a bonding member precursor 600′ can be provided by printing a conductive paste that does not require washing such as flux after formation, such as Ag conductive paste, nanopaste, alloy paste, brazing material, etc. can.
  • the precursor 600′ After disposing the solid battery 100 on the substrate so that the end face electrode of the solid battery and the precursor 600′ of the bonding member are in contact with each other, the precursor 600′ is subjected to a heat treatment, thereby separating the solid battery 100 and the substrate 200 from the precursor 600′. A joint member 600 contributing to electrical connection is formed.
  • the covering material 150 is formed.
  • a covering insulating layer 160 and a covering inorganic layer 170 may be provided (see FIG. 13E).
  • a covering insulating layer 160 is formed so as to cover the solid battery 100 on the substrate 200 . Therefore, the raw material for the covering insulating layer is provided such that the solid state battery on the substrate is wholly covered.
  • the insulating coating layer is made of a resin material
  • a resin precursor is provided on the substrate and subjected to curing or the like to form the insulating coating layer.
  • the covering insulating layer may be molded through application of pressure with a mold.
  • an overlying insulating layer may be molded through compression molding to encapsulate the solid state battery on the substrate.
  • the raw material for the insulating coating layer may be in the form of granules, and may be of thermoplastic type.
  • Such molding is not limited to mold molding, and may be performed through polishing, laser processing and/or chemical treatment.
  • the covering inorganic layer 170 is formed. Specifically, the covering inorganic layer 170 is formed on the "covering precursor in which the individual solid-state batteries 100 are covered with the covering insulating layer 160 on the substrate 200".
  • dry plating may be performed to form a dry plated film as the coating inorganic layer. More specifically, dry plating is performed to form a coating inorganic layer on exposed surfaces other than the bottom surface of the coating precursor (that is, other than the bottom surface of the support substrate).
  • the "solid battery package" according to the present invention can be finally obtained.
  • the present invention may have a form in which the solid state battery 100 is largely covered with the covering material 150 .
  • the covering inorganic layer 170 provided on the covering insulating layer 160 covering the solid battery 100 on the substrate 200 may extend to the lower main surface of the substrate 200 (see FIG. 2).
  • the covering inorganic layer 170 on the covering insulating layer 160 as the covering material 150 extends to the side surface of the substrate 200 and extends beyond the side of the substrate 200 to the lower main surface of the substrate 200 (especially its peripheral edge). part).
  • the coating inorganic layer 170 can also be provided as a multi-layer structure consisting of at least two layers.
  • FIG. 11 shows the covering inorganic layer 170 having a two-layer structure of 170A and 170B.
  • Such a multilayer structure is not limited to between different materials, but may be between same materials.
  • a water vapor barrier layer may be formed on the substrate. That is, a water vapor barrier may be formed on the substrate prior to packaging the combination of the substrate and the solid state battery.
  • the water vapor barrier layer is not particularly limited as long as the desired barrier layer can be formed.
  • a water vapor barrier layer having Si--O bonds and Si--N bonds it is preferably formed by applying a liquid raw material and irradiating ultraviolet rays.
  • the water vapor barrier layer is formed under relatively low temperature conditions (for example, temperature conditions of about 100° C.) without using a vapor deposition method such as CVD or PVD.
  • a raw material containing, for example, silazane is prepared as a liquid raw material, the liquid raw material is applied to a substrate by spin coating or spray coating, and dried to form a barrier precursor.
  • the barrier precursor is then subjected to UV irradiation in an ambient atmosphere containing nitrogen to obtain a “water vapor barrier layer having Si—O and Si—N bonds”.
  • a mask may be used to prevent the formation of a water vapor barrier layer at the joint.
  • a mask may be applied to the regions to be joined, the water vapor barrier layer may be formed on the entire surface, and then the mask may be removed.
  • a water vapor barrier layer may be formed on the resist layer 400 .
  • a conductive paste is used to electrically connect the conductive portion of the substrate and the end surface electrode of the solid-state battery to each other. You may finally have a form as shown in.
  • the solid-state battery 100 and the substrate 200 are electrically connected via the conductive paste, the solid-state battery 100 applies a pressing force to the conductive paste. It tends to be a form that slightly bites into. In other words, the conductive paste tends to have a shape (“M" portion in FIG. 12) that is pressed against the end face electrode 140 and slightly raised on the outside thereof.
  • the part 600A of the conductive paste flows over the resist layer 400 due to the pressure. obtain. This is related to the resist layer 400 acting as a "dam" for the conductive paste.
  • the openings in the resist layer 400 that expose the conductive portion of the substrate are such that the edges forming the openings partially prevent the movement of the conductive paste. Since the conductive paste acts to block, while a portion 600A of the conductive paste once applied to the opening portion flows onto the resist layer 400 as the pressure is applied, most of the conductive paste 600B remains in the opening of the resist layer 400. can stay in place.
  • the resist layer for example, solder resist layer
  • the resist layer preferably acts as a dam to suppress bleeding of the conductive paste.
  • the joining member 600 can be arranged across the upper main surface electrode layer 210 and the resist layer 400 of the substrate as shown in FIG. 12 . That is, the part 600A of the joining member 600 can be arranged even inside the resist layer 400 . Specifically, the part 600A of the joining member 600 can be arranged inside the part of the resist layer 400 that is in contact with the upper main surface electrode layer 210 .
  • such a package may be provided as an electronic device mounted on an external substrate separate from its substrate.
  • the substrate of the solid battery package can serve as a terminal substrate for the external terminals of the solid battery.
  • a solid state battery package may be provided for such an electronic device.
  • the solid battery package of the present invention can be used in various fields where battery use or power storage is assumed. Although it is only an example, the solid battery package of the present invention can be used in the electric, information, and communication fields where mobile devices are used (for example, mobile phones, smartphones, laptop computers and digital cameras, activity meters, arm computers, electronic devices, etc.). Paper, RFID tags, card-type electronic money, electric and electronic equipment fields including small electronic devices such as smart watches, or mobile equipment fields), household and small industrial applications (for example, power tools, golf carts, household / Nursing care and industrial robots), large industrial applications (e.g. forklifts, elevators, harbor cranes), transportation systems (e.g.
  • hybrid vehicles electric vehicles, buses, trains, electrically assisted bicycles, electric motorcycles, etc.
  • power system applications e.g., various power generation, load conditioners, smart grids, general household electrical storage systems, etc.
  • medical applications medical equipment such as earphone hearing aids
  • pharmaceutical applications medication management systems, etc.
  • IoT field space/deep sea applications (for example, fields such as space probes and submersible research vessels).

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  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Secondary Cells (AREA)
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Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2002334692A (ja) * 2001-05-09 2002-11-22 Kyocera Corp 電 池
WO2012002359A1 (ja) * 2010-06-28 2012-01-05 株式会社村田製作所 蓄電デバイスとその製造方法
JP2015196783A (ja) * 2014-04-02 2015-11-09 株式会社ダイセル シート状組成物
WO2019156117A1 (ja) * 2018-02-09 2019-08-15 株式会社村田製作所 電子部品実装基板、電池パックおよび電子機器
WO2020031424A1 (ja) * 2018-08-10 2020-02-13 株式会社村田製作所 固体電池
WO2020202928A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 固体電池

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7626136B2 (ja) 2020-07-01 2025-02-04 株式会社村田製作所 固体電池
WO2022230900A1 (ja) 2021-04-26 2022-11-03 株式会社村田製作所 固体電池パッケージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002334692A (ja) * 2001-05-09 2002-11-22 Kyocera Corp 電 池
WO2012002359A1 (ja) * 2010-06-28 2012-01-05 株式会社村田製作所 蓄電デバイスとその製造方法
JP2015196783A (ja) * 2014-04-02 2015-11-09 株式会社ダイセル シート状組成物
WO2019156117A1 (ja) * 2018-02-09 2019-08-15 株式会社村田製作所 電子部品実装基板、電池パックおよび電子機器
WO2020031424A1 (ja) * 2018-08-10 2020-02-13 株式会社村田製作所 固体電池
WO2020202928A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 固体電池

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