WO2022227350A1 - 晶圆盒、晶圆传送系统及晶圆传送方法 - Google Patents

晶圆盒、晶圆传送系统及晶圆传送方法 Download PDF

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Publication number
WO2022227350A1
WO2022227350A1 PCT/CN2021/114096 CN2021114096W WO2022227350A1 WO 2022227350 A1 WO2022227350 A1 WO 2022227350A1 CN 2021114096 W CN2021114096 W CN 2021114096W WO 2022227350 A1 WO2022227350 A1 WO 2022227350A1
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WIPO (PCT)
Prior art keywords
wafer
cassette
scanning device
box body
wafers
Prior art date
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Ceased
Application number
PCT/CN2021/114096
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English (en)
French (fr)
Inventor
李言彬
杨苏
洪兴峰
李义群
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Publication date
Application filed by Changxin Memory Technologies Inc filed Critical Changxin Memory Technologies Inc
Priority to US17/667,654 priority Critical patent/US20220351996A1/en
Publication of WO2022227350A1 publication Critical patent/WO2022227350A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0614—Marking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application relates to the technical field of semiconductor fabrication, and in particular, to a wafer cassette, a wafer transfer system and a wafer transfer method.
  • the advanced integrated circuit manufacturing process generally consists of hundreds of steps, and a small error in any link will lead to the failure of the entire chip, especially as the critical dimensions of the circuit continue to shrink, the more stringent the requirements for process control.
  • the wafers in the wafer box need to be scanned before the wafer box is loaded on the machine and before leaving the machine to confirm the position and quantity of the wafers.
  • An embodiment of the present application provides a wafer cassette, and the wafer cassette includes:
  • the box body is provided with an opening that communicates with the inside of the box body;
  • the wafer scanning device includes a first wafer scanning device, the wafer scanning device is arranged on the inner wall of the box body, and is used to scan the storage situation of the wafers in the box body;
  • the box cover is buckled at the opening.
  • the embodiment of the present application also provides a wafer transfer system, the wafer transfer system includes:
  • a machine table including a carrier table and a wafer transfer device;
  • the wafer cassette is located on the carrier table, and the wafer transfer device is used for transferring the wafer into the wafer box;
  • a control system connected with the first wafer scanning device and the machine table, for driving the first wafer scanning device to move in the wafer cassette to scan the inside of the cassette body, Obtain wafer information in the wafer cassette according to the scanning result of the first wafer scanning device, and send the wafer information to the machine, where the wafer information includes the information in the wafer cassette. The number and location of the wafers.
  • Embodiments of the present application further provide a wafer transfer method based on the wafer transfer system described in the above embodiments, the method comprising:
  • the wafer information includes the number and position of the wafers in the wafer cassette.
  • the inner wall of the box body of the wafer box is provided with a wafer scanning device, and the wafer scanning device scans the storage quantity and storage position of the wafers in the box in real time. It replaces the need for the robot arm of the machine to scan the wafers in the wafer box every time the wafer box is loaded on the machine to confirm the storage quantity and storage location of the wafers. In this way, a lot of time can be saved, thereby increasing production capacity, and there is no need to purchase a relatively complete set of robotic arm equipment, which saves equipment costs.
  • FIG. 1 is a schematic diagram of the internal structure of a wafer cassette in one embodiment
  • FIG. 2 is a top view of the internal structure of a wafer cassette in one embodiment
  • FIG. 3 is a schematic diagram of a wafer transfer system in another embodiment
  • FIG. 4 is a schematic diagram of a wafer back with a back number in one embodiment
  • FIG. 5 is a schematic diagram of a wafer transfer system in yet another embodiment.
  • 100 wafer cassette; 102, cassette body; 104, first wafer scanning device; 1042, first sliding assembly; 1044, second sliding assembly; 1046, signal transmitter; 1048, signal receiver 106, the second wafer scanning device; 108, the support assembly; 1082, the support block; 200, the machine; 300, the control system; 400, the wafer transfer device; 500, the wafer;
  • a wafer cassette 100 is provided.
  • the wafer cassette 100 includes a box body 102 , a wafer scanning device, and a box cover.
  • the box body 102 is provided with an opening that communicates with the inside of the box body 102 .
  • the wafer scanning device includes a first wafer scanning device 104 .
  • the wafer scanning device is disposed on the inner wall of the box body 102 for scanning the storage conditions of the wafers 500 in the box body 102 .
  • the box cover is buckled at the opening.
  • the box body 102 is provided with an opening that communicates with the inside of the box body 102 , so that the wafers 500 can enter the inside of the box body 102 through the opening and leave the wafer box 100 through the opening.
  • a wafer scanning device is provided on the inner wall of the wafer cassette 100 , and the wafer scanning device includes a first wafer scanning device 104 .
  • the wafer scanning device scans the wafers in the wafer cassette 100 by 500 lines to confirm the storage status of the wafers 500 in the wafer cassette 100 .
  • a box cover is provided at the opening of the wafer box 100. The box cover can be opened or closed when the wafers 500 enter and leave the box body 102. The box cover isolates the inner space of the wafer box 100 from the external environment, which can avoid The wafer 500 in the cassette is contaminated.
  • a wafer scanning device is provided on the inner wall of the box body 102 of the wafer cassette 100 , and the wafer scanning device scans and confirms the storage status of the wafers 500 in the wafer cassette 100 in real time. Instead, each time the wafer cassette 100 is loaded on the machine 200 , the robot arm of the machine 200 is required to scan the wafers 500 in the wafer cassette 100 to confirm the storage status of the wafers 500 in the wafer cassette 100 . In this way, a lot of time can be saved, which in turn can increase productivity. Moreover, there is no need to purchase a relatively complete set of robotic arm equipment, which saves equipment costs. There is no need to set up a mechanical arm device, which saves the space on the machine 200 .
  • the first wafer scanning device 104 includes: a first sliding component 1042, a signal transmitter 1046, a second sliding component 1044, a signal receiver 1048, and a driving device.
  • the first sliding component 1042 is located on the inner wall of the box body 102 , and the first sliding component 1042 extends along the height direction of the box body 102 .
  • the signal transmitter 1046 is located on the first sliding component 1042 and can slide along the first sliding component 1042, and the signal transmitter 1046 is used for transmitting detection signals.
  • the second sliding component 1044 is located on the inner wall of the box body 102 and is disposed opposite to the first sliding component 1042 , and the second sliding component 1044 extends along the height direction of the box body 102 .
  • the signal receiver 1048 is located on the second sliding assembly 1044 and can slide along the second sliding assembly 1044, and the signal receiver 1048 is used for receiving the detection signal.
  • the driving device is connected to the signal transmitter 1046 and the signal receiver 1048 for driving the signal transmitter 1046 and the signal receiver 1048 to slide synchronously.
  • the first sliding component 1042 extends along the height direction of the wafer cassette 100 and is disposed on the inner wall of the wafer cassette 100
  • the signal transmitter 1046 is slidably disposed on the first sliding component 1042 along the first sliding component 1042
  • the second sliding element 1044 is also extended on the inner wall of the wafer cassette 100 along the height direction of the wafer cassette 100 , and is opposite to the first sliding element 1042
  • the signal receiver 1048 is slidably disposed on the second sliding element 1044 .
  • the driving device is connected to the signal transmitter 1046 and the signal receiver 1048 , and the driving device drives the signal transmitter 1046 and the signal receiver 1048 to move synchronously on the first sliding component 1042 and the second sliding component 1044 respectively.
  • the signal transmitter 1046 is used for transmitting the detection signal
  • the signal receiver 1048 is used for receiving the detection signal transmitted by the signal transmitter 1046, wherein the detection signal may be infrared or other detection signal, which is not limited herein.
  • the driving device drives the signal transmitter 1046 and the signal receiver 1048 to move synchronously on the first sliding component 1042 and the second sliding component 1044, respectively.
  • the moving signal receiver 1048 in the assembly 1044 is capable of receiving the detection signals transmitted during the synchronized movement in the first sliding assembly 1042 .
  • the detection signal transmitted by the signal transmitter 1046 is blocked by the wafer 500 in the wafer cassette 100 to form a detection signal with varying intensity.
  • the received detection signal of the intensity change records the storage situation of the wafers 500 in the wafer cassette 100 .
  • both the first sliding component 1042 and the second sliding component 1044 include sliding rails or sliding frames.
  • the first sliding component 1042 and the second sliding component 1044 are sliding guide rails.
  • the sliding guide rails extend along the height direction of the wafer cassette 100 and are oppositely disposed on the inner wall of the wafer cassette 100.
  • the signal transmitter 1046 and the signal receiver 1048 They are respectively slidably arranged on the sliding guide rails.
  • the signal transmitter 1046 and the signal receiver 1048 are disposed opposite to each other to ensure that the detection signal transmitted by the signal transmitter 1046 is received by the signal receiver 1048 after passing through the wafer 500 in the wafer cassette 100 .
  • the sliding guide ensures that the signal transmitter 1046 and the signal receiver 1048 move along the height direction of the wafer cassette 100 under the driving of the driving device.
  • the sliding guide can also use other sliding components, which are not limited herein.
  • the first sliding component 1042 and the second sliding component 1044 are sliding frames.
  • the sliding frames extend along the height direction of the wafer cassette 100 and are oppositely disposed on the inner wall of the wafer cassette 100.
  • the signal transmitter 1046 and the signal receiver 1048 They are respectively slidably arranged on the sliding frame.
  • the signal transmitter 1046 and the signal receiver 1048 are disposed opposite to each other to ensure that the detection signal transmitted by the signal transmitter 1046 is received by the signal receiver 1048 after passing through the wafer 500 in the wafer cassette 100 .
  • the sliding frame ensures that the signal transmitter 1046 and the signal receiver 1048 move along the height direction of the wafer cassette 100 under the driving of the driving device.
  • the sliding frame can also adopt other sliding components, which are not limited herein.
  • the signal transmitter 1046 includes an infrared signal transmitter 1046 ; the signal receiver 1048 includes an infrared signal receiver 1048 .
  • the signal transmitter 1046 is an infrared signal transmitter 1046
  • the signal receiver 1048 is an infrared signal receiver 1048 .
  • the infrared detection signal emitted by the infrared signal transmitter 1046 is the infrared detection signal.
  • the infrared detection signal with intensity change is formed by being blocked by the wafer 500 in the wafer box 100.
  • the detection signal is used to record the storage status of the wafers 500 in the wafer cassette 100 . In this way, the infrared signal transmitter 1046 and the infrared signal receiver 1048 can scan the wafers 500 in the wafer cassette 100 to confirm the storage status of the wafers 500 in the wafer cassette 100 .
  • the first sliding component 1042 and the second sliding component 1044 both extend from the top of the box body 102 to the bottom of the box body 102 .
  • the first sliding component 1042 and the second sliding component 1044 extend along the height direction of the wafer cassette 100 and are disposed on the inner wall of the wafer cassette 100 .
  • the first sliding component 1042 and the second sliding component 1044 both extend from the top of the box body 102 to the bottom of the box body 102 .
  • the signal transmitter 1046 disposed on the first sliding assembly 1042 and the signal receiver 1048 disposed on the second sliding assembly 1044 can slide along the top of the box body 102 to the bottom of the box body 102 to ensure that the crystal
  • the circular scanning device can scan all the wafers 500 placed in the wafer cassette 100 .
  • the storage conditions of the scanned wafers 500 are more accurate, and the production efficiency is guaranteed.
  • a plurality of groups of support assemblies 108 for supporting the wafer 500 are further included, which are fixed on the inner wall of the accommodating space, and the plurality of groups of support assemblies 108 are arranged in parallel and spaced apart along the height direction of the box body 102;
  • Each of the assemblies 108 includes a plurality of support blocks 1082, and the plurality of support blocks 1082 are arranged at intervals along the circumference of the accommodating space.
  • the wafer cassette 100 further includes a plurality of groups of supporting components 108 for supporting the wafers 500 .
  • the plurality of groups of support assemblies 108 are arranged at intervals along the height direction of the box body 102 , and each group of support assemblies 108 is parallel to each other, and the plurality of support blocks 1082 of each group of support assemblies 108 are arranged at intervals along the circumferential direction of the accommodating space.
  • the first sliding component 1042 and the second sliding component 1044 are oppositely disposed on the inner wall of the wafer cassette 100, adjacent to the supporting components 108 disposed oppositely in each group, and the first sliding component 1042 and the second sliding component 108 in each group of supporting components 108
  • the support assembly 108 adjacent to the sliding assembly 1044 is arranged in a direction parallel to the detection signal.
  • the wafers 500 placed on each set of support components 108 can be arranged in the wafer box 100 in parallel and spaced apart along the height direction of the box body 102, so that the signal transmitter 1046 and the signal receiver 1048 are arranged along the wafer box.
  • the detection signal emitted by the signal transmitter 1046 is blocked by the wafer 500 , and a detection signal with varying intensity is generated, thereby recording the storage situation of the wafer 500 .
  • the supporting components 108 adjacent to the first sliding component 1042 and the second sliding component 1044 in each group of supporting components 108 are arranged in a direction parallel to the detection signal to prevent the wafer 500 from being caused by the supporting component 108 blocking the detection signal. storage is inaccurate.
  • the wafer scanning device further includes: a second wafer scanning device 106 .
  • the second wafer scanning device 106 is disposed at the bottom of the box body 102 and is located at the opening; the second wafer scanning device 106 is used to scan and record the back engraving number of the wafer 500 when the wafer 500 is transferred into the box body 102 502.
  • the second wafer scanning device 106 is disposed at the bottom of the opening of the box body 102 , and scans and records the back engraved number 502 of the wafer 500 when the wafer 500 is transferred to the box body 102 . It is ensured that the transferred wafers 500 are consistent with the billing materials, so as to avoid mis-transfer errors, reduce personnel workload, save production costs, and further improve transfer efficiency.
  • the present application further provides a wafer transfer system
  • the wafer transfer system includes: the wafer cassette 100 , the machine 200 and the control system 300 according to any of the above embodiments.
  • the machine 200 includes a carrier table and a wafer transfer device 400 ; the wafer cassette 100 is located on the carrier table, and the wafer transfer device 400 is used to transfer the wafers 500 into the wafer box 100 .
  • the control system 300 is connected with the first wafer scanning device 104 and the machine table 200, and is used for driving the first wafer scanning device 104 to move in the wafer cassette 100 to scan the inside of the box body 102, according to the first wafer
  • the scanning result of the scanning device 104 obtains wafer information in the wafer cassette 100 , and sends the wafer information to the machine 200 .
  • the wafer information includes the number and position of the wafers 500 in the wafer cassette 100 .
  • the wafer cassette 100 is located on the carrier table, and the control system 300 is connected to the first wafer scanning device 104 and the machine table 200 .
  • the detection signal transmitted by the signal transmitter 1046 is blocked by the wafer 500 in the wafer cassette 100, and a detection signal with varying intensity is formed.
  • the detection signal of the received intensity change is used to scan the inside of the box body 102 .
  • the wafer information in the wafer cassette 100 is obtained according to the scanning result of the first wafer scanning device 104 , the wafer information includes the number and position of the wafers 500 in the wafer cassette 100 , and the wafer information is sent to the machine 200 .
  • the wafer cassette 100 is scanned by the first scanning device, and the storage conditions of the wafers 500 in the wafer cassette 100 are recorded.
  • This design replaces the need for the robotic arm of the machine 200 to scan the wafers 500 in the wafer cassette 100 every time the wafer cassette 100 is loaded on the machine 200 to confirm the storage of the wafers 500 in the wafer cassette 100 happensing. It can save a lot of robotic arm scanning time, thereby increasing productivity.
  • a communication device is further included, and the communication device is connected to the control system 300 for sending the scanning result to the control system 300 .
  • the communication device may be a wired communication device or a wireless communication device, which is not limited herein.
  • the communication device sends the scanning result, that is, the storage status of the wafers 500 in the wafer cassette 100 to the control system 300 .
  • wafer transfer apparatus 400 includes a robotic arm.
  • the wafer transfer device 400 transfers the wafers 500 into the wafer cassette 100 , or transfers the wafers 500 out of the wafer cassette 100 .
  • the wafer scanning device further includes: a second wafer scanning device 106 disposed at the bottom of the box body 102 and located at the opening; the second wafer scanning device 106 is used for When the wafer is transferred into the box body 102, the back engraving number 502 of the wafer 500 is scanned and recorded; the control system 300 is also connected with the second wafer scanning device, and the control system 300 is also used to scan and record the back engraving number 502 scanning device.
  • the recorded back engraving number 502 is compared with the target back engraving number 502, and when the comparison result is inconsistent, an alarm control message is sent to the machine 200, and the machine 200 alarms and stops the transfer of the wafer 500 after receiving the alarm control message.
  • the second wafer scanning device 106 is disposed at the bottom of the opening of the box body 102 .
  • the control system 300 controls the second wafer scanning device 106 to scan and record the back engraved number 502 of the wafer 500 when the wafer 500 is transferred to the cassette 102 .
  • the control system 300 compares the scanned back number 502 with the target back number 502, and sends an alarm control message to the machine 200 when the comparison result does not match, and the machine 200 alarms and stops the wafer after receiving the alarm control message. 500 teleportation.
  • the back engraving number 502 obtained by scanning with the target back engraving number 502 it is ensured that the transferred wafer 500 is consistent with the account material, so as to avoid mistransmission errors, reduce the workload of personnel, and further improve the transfer efficiency.
  • control system 300 includes a central control system of the machine 200 .
  • the detection signal transmitted by the signal transmitter 1046 is blocked by the wafer 500 in the wafer cassette 100 to form a detection signal with varying intensity, and the signal is received.
  • the controller 1048 generates the wafer information in the wafer cassette 100 according to the received detection signal of the intensity change, the wafer information includes the number and position of the wafers 500 in the wafer cassette 100, and sends the wafer information to Machine 200.
  • the central control system controls the second wafer scanning device 106 to scan and record the back engraving number 502 of the wafer 500 when the wafer 500 is transferred to the cassette body 102 .
  • the central control system compares the scanned back engraving number 502 with the target back engraving number 502, and sends an alarm control message to the machine 200 when the comparison result does not match, and the machine 200 alarms and stops the wafer after receiving the alarm control message. 500 teleportation.
  • By comparing the back engraving number 502 obtained by scanning with the target back engraving number 502 it is ensured that the transferred wafer 500 is consistent with the account material, so as to avoid mistransmission errors, reduce the workload of personnel, and further improve the transfer efficiency.
  • the present application also provides a wafer transfer method based on the wafer transfer system according to any of the above embodiments, the method includes: using the first wafer scanning device 104 to scan the inside of the box body 102, and according to the wafer scanning device
  • the wafer information in the wafer cassette 100 is obtained from the scanning result, and the wafer information is sent to the machine 200 .
  • the wafer information includes the number and position of the wafers 500 in the wafer cassette 100 .
  • the control system 300 controls the first wafer scanning device 104 to scan the inside of the box body 102, and generates wafer information in the wafer box 100, wherein the wafer information is the number of wafers in the wafer box 100 and the number of wafers in the wafer box 100. position and send the wafer information to the machine 200 .
  • the wafer scanning device further includes: a second wafer scanning device 106 disposed at the bottom of the box body 102 and located at the opening; the wafer transfer method further includes: transferring the wafer 500 to the box body 102, use the second wafer scanning device 106 to scan and record the back engraving number 502 of the wafer 500; compare the back engraving number 502 scanned and recorded by the back engraving number 502 scanning device with the target back engraving number 502, and When the comparison results are inconsistent, alarm control information is sent to the machine 200 .
  • the second wafer scanning device 106 uses the second wafer scanning device 106 to scan and record the back engraving number 502 of the wafer 500, compare the back engraving number 502 obtained by scanning with the target back engraving number 502, and report to the machine when the comparison result does not match Station 200 transmits alarm control information.
  • the back engraving number 502 obtained by scanning with the target back engraving number 502 it is ensured that the transferred wafer 500 is consistent with the account material, so as to avoid mistransmission errors, reduce the workload of personnel, and further improve the transfer efficiency.
  • the wafer transfer method further includes: after the machine 200 receives the alarm control information, alarm and stop the transfer of the wafer 500 .
  • the machine 200 after receiving the alarm control information, the machine 200 alarms and stops the transfer of the wafers 500 , to ensure that the transferred wafers 500 are consistent with the billing materials, and avoid mistransmission errors.
  • the steps are not strictly limited to the order in which they are performed, and that the steps may be performed in other orders. Moreover, at least a part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but may be executed at different times. The execution sequence of these sub-steps or stages It is also not necessarily performed sequentially, but may be performed alternately or alternately with other steps or at least a portion of sub-steps or stages of other steps.
  • Nonvolatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory.
  • Volatile memory may include random access memory (RAM) or external cache memory.
  • RAM is available in various forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous chain Road (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.
  • SRAM static RAM
  • DRAM dynamic RAM
  • SDRAM synchronous DRAM
  • DDRSDRAM double data rate SDRAM
  • ESDRAM enhanced SDRAM
  • SLDRAM synchronous chain Road (Synchlink) DRAM
  • SLDRAM synchronous chain Road (Synchlink) DRAM
  • Rambus direct RAM
  • DRAM direct memory bus dynamic RAM
  • RDRAM memory bus dynamic RAM

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本申请涉及半导体制备技术领域，特别是涉及一种晶圆盒、晶圆传送系统及晶圆传送方法，该晶圆盒包括：盒体、晶圆扫描装置、盒盖。盒体上设有与盒体内部相连通的开口。晶圆扫描装置包括第一晶圆扫描装置，晶圆扫描装置设置于盒体的内壁上，用于扫描盒体内晶圆的存放情况。盒盖扣设于开口处。晶圆盒的盒体的内壁上设有晶圆扫描装置，晶圆扫描装置实时扫描确认晶圆盒内的晶圆的存放情况。取代了晶圆盒每次上机台时，都需要机台的机械手臂对晶圆盒中的晶圆进行扫描，确认晶圆盒内的晶圆的存放情况。如此，可以节约大量时间，进而提高产能。并且，无需购买一套相对完整的机械手臂设备，节约了设备成本。无需设置机械手臂设备，节约了机台上的空间。

Description

晶圆盒、晶圆传送系统及晶圆传送方法
本申请要求于2021年4月29日提交中国专利局，申请号为2021104747752，申请名称为“晶圆盒、晶圆传送系统及晶圆传送方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及半导体制备技术领域，特别是涉及一种晶圆盒、晶圆传送系统及晶圆传送方法。
背景技术
先进的集成电路制造工艺一般都包含几百步的工序，任何环节的微小错误都将导致整个芯片的失效，特别是随着电路关键尺寸的不断缩小，其对工艺控制的要求就越严格。为了避免造成误操作的情况产生，晶圆盒上机台以及离开机台之前都需要对晶圆盒中的晶圆进行扫描，确认晶圆的位置和数量。
在现有技术中，采用机械手臂对晶圆的位置和数量进行扫描，每次扫描大约需要十几秒的时间，如此，在整个制造工艺中，浪费了大量时间，降低了产能。
发明内容
本申请实施例提供了一种晶圆盒，所述晶圆盒包括：
盒体，所述盒体上设有与所述盒体内部相连通的开口；
晶圆扫描装置，所述晶圆扫描装置包括第一晶圆扫描装置，所述晶圆扫描装置设置于所述盒体的内壁上，用于扫描所述盒体内晶圆的存放情况；
盒盖，扣设于所述开口处。
本申请实施例还提供了一种晶圆传送系统，所述晶圆传送系统包括：
如上述实施例所述的晶圆盒；
机台，包括承载台及晶圆传送装置；所述晶圆盒位于所述承载台上，所述晶圆传送装置用于向所述晶圆盒内传送所述晶圆；
控制系统，与所述第一晶圆扫描装置及所述机台相连接，用于驱动所述第一晶圆扫描 装置在所述晶圆盒内移动，以对所述盒体内部进行扫描，根据所述第一晶圆扫描装置的扫描结果得到所述晶圆盒中的晶圆信息，并将所述晶圆信息发送至所述机台，所述晶圆信息包括所述晶圆盒中所述晶圆的数量及位置。
本申请实施例还提供了一种基于如上述实施例所述的晶圆传送系统的晶圆传送方法，所述方法包括：
使用所述第一晶圆扫描装置对盒体内部进行扫描，根据所述晶圆扫描装置的扫描结果得到所述晶圆盒中的晶圆信息，并将所述晶圆信息发送至所述机台，所述晶圆信息包括所述晶圆盒中所述晶圆的数量及位置。
上述的晶圆盒、晶圆传送系统及晶圆传送方法，晶圆盒的盒体的内壁上设有晶圆扫描装置，晶圆扫描装置实时扫描盒体内晶圆的存放数量和存放位置。取代了晶圆盒每次上机台时，都需要机台的机械手臂对晶圆盒中的晶圆进行扫描，确认晶圆的存放数量和存放位置。如此，可以节约大量时间，进而提高产能，并且，无需购买一套相对完整的机械手臂设备，节约了设备成本。
附图说明
为了更清楚地说明本申请实施例或传统技术中的技术方案，下面将对实施例或传统技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一个实施例中晶圆盒的内部结构示意图；
图2为一个实施例中晶圆盒的内部结构俯视图；
图3为另一个实施例中的晶圆传送系统的示意图；
图4为一个实施例中具有背刻号的晶圆背的示意图；
图5为又一个实施例中晶圆传送系统的示意图。
附图标记说明：100、晶圆盒；102、盒体；104、第一晶圆扫描装置；1042、第一滑动组件；1044、第二滑动组件；1046、信号发射器；1048、信号接收器；106、第二晶圆扫描装置；108、支撑组件；1082、支撑块；200、机台；300、控制系统；400、晶圆传送装置；500、晶圆；502、背刻号。
具体实施方式
下面结合附图对本申请作进一步说明。
为了便于理解本申请，下面将参照相关附图对本申请权利要求所限定的各种实施例进行更全面的描述。附图中给出了本申请的较佳实施例，其包含各种特定的细节以助于该理解，但这些细节应当被视为仅是示范性的。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相应地，本领域普通技术人员将认识到，在不背离由随附的权利要求所限定的本申请的范围的情况下，可以对本文所描述的各种实施例作出变化和改进。此外，为了清楚和简洁起见，可能省略对熟知的功能和构造的描述。
对本领域技术人员显而易见的是，提供对本申请的各种实施例的下列描述，仅是为了解释的目的，而不是为了限制由随附的权利要求所限定的本申请。
贯穿本申请文件的说明书和权利要求，词语“包括”和“包含”以及词语的变型，例如“包括有”和“包括”意味着“包含但不限于”，而不意在(且不会)排除其他部件、整体或步骤。结合本申请的特定的方面、实施例或示例所描述的特征、整体或特性将被理解为可应用于本文所描述的任意其他方面、实施例或示例，除非与其不兼容。
应当理解的是，单数形式“一”、“一个”和“该”包含复数的指代，除非上下文明确地另有其他规定。在本申请中所使用的表述“包含”和/或“可以包含”意在表示相对应的功能、操作或元件的存在，而非意在限制一个或多个功能、操作和/或元件的存在。此外，在本申请中，术语“包含”和/或“具有”意在表示申请文件中公开的特性、数量、操作、元件和部件，或它们的组合的存在。因此，术语“包含”和/或“具有”应当被理解为，存在一个或多个其他特性、数量、操作、元件和部件、或它们的组合的额外的可能性。
在本申请中，表述“或”包含一起列举的词语的任意或所有的组合。例如，“A或B”可以包含A或者B，或可以包含A和B两者。
应当理解的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件；当一个元件被认为是“连接”或“耦合”另一个元件，它可以是直接或耦合到另一个元件或者可能同时存在居中元件。
文中提到的“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
除非另有定义，本文所使用的所有的技术术语和科学术语与属于本申请的技术领域的技术人员所通常理解的含义相同。还应理解的是，术语(比如常用词典中限定的那些术语)，应解释为具有与相关领域和本说明书的上下文中一致的含义，并且不应以理想化或过于形式化的意义来解释，除非在本文中明确地这样限定。本文所使用的术语“及/或”包括一个或 多个相关的所列项目的任意的和所有的组合。
可以理解，本申请所使用的术语“第一”、“第二”等可在本文中用于描述各种元件，但这些元件不受这些术语限制。这些术语仅用于将第一个元件与另一个元件区分。
如图1至图3所示，本申请一实施例中，提供一种晶圆盒100，晶圆盒100包括：盒体102、晶圆扫描装置、盒盖。盒体102上设有与盒体102内部相连通的开口。晶圆扫描装置包括第一晶圆扫描装置104，晶圆扫描装置设置于盒体102的内壁上，用于扫描盒体102内晶圆500的存放情况。盒盖扣设于开口处。
具体地，盒体102上设有与盒体102内部相连通的开口，能够让晶圆500通过该开口进入盒体102内部，并通过该开口离开晶圆盒100体。在晶圆盒100体的内壁上设有晶圆扫描装置，该晶圆扫描装置包括第一晶圆扫描装置104。当晶圆盒100上机台200时以及离开机台200之前，晶圆扫描装置对晶圆盒100中的晶圆进500行扫描，确认晶圆盒100内的晶圆500的存放情况。在晶圆盒100体的开口处设有盒盖，盒盖可在晶圆500进入与离开盒体102内部时开启或关闭，盒盖使晶圆盒100体内部空间与外部环境隔离，能够避免盒内晶圆500受到污染。
具体地，晶圆盒100的盒体102的内壁上设有晶圆扫描装置，晶圆扫描装置实时扫描确认晶圆盒100内的晶圆500的存放情况。取代了晶圆盒100每次上机台200时，都需要机台200的机械手臂对晶圆盒100中的晶圆500进行扫描，确认晶圆盒100内的晶圆500的存放情况。如此，可以节约大量时间，进而提高产能。并且，无需购买一套相对完整的机械手臂设备，节约了设备成本。无需设置机械手臂设备，节约了机台200上的空间。
在其中一个实施例中，第一晶圆扫描装置104包括：第一滑动组件1042、信号发射器1046、第二滑动组件1044、信号接收器1048、驱动装置。其中，第一滑动组件1042位于盒体102的内壁上，第一滑动组件1042沿盒体102的高度方向延伸。信号发射器1046位于第一滑动组件1042上，可沿第一滑动组件1042滑动，信号发射器1046用于发射探测信号。第二滑动组件1044位于盒体102的内壁上，与第一滑动组件1042相对设置，第二滑动组件1044沿盒体102的高度方向延伸。信号接收器1048位于第二滑动组件1044上，可沿第二滑动组件1044滑动，信号接收器1048用于接收探测信号。驱动装置与信号发射器1046及信号接收器1048相连接，用于驱动信号发射器1046及信号接收器1048同步滑动。
具体地，第一滑动组件1042沿晶圆盒100的高度方向延伸，设置于晶圆盒100的内壁上，信号发射器1046可沿第一滑动组件1042滑动地设置于第一滑动组件1042上。第 二滑动组件1044亦沿晶圆盒100的高度方向延伸设置于晶圆盒100内壁，并且与第一滑动组件1042相对设置，信号接收器1048可滑动地设置于第二滑动组件1044上。驱动装置连接信号发射器1046及信号接收器1048，驱动装置驱动信号发射器1046及信号接收器1048分别在第一滑动组件1042与第二滑动组件1044上同步运动。
具体地，信号发射器1046用于发射探测信号，信号接收器1048用于接收信号发射器1046发射的探测信号，其中，探测信号可以为红外线或者其他探测信号在此不做限定。驱动装置驱动信号发射器1046及信号接收器1048分别在第一滑动组件1042与第二滑动组件1044上同步运动，其中，信号发射器1046及信号接收器1048同步运动，是为了确保在第二滑动组件1044内运动的信号接收器1048，能够接收到在第一滑动组件1042内同步运动过程中发射的探测信号。
驱动装置驱动信号发射器1046及信号接收器1048同步运动过程中，信号发射器1046发射的探测信号被晶圆盒100内的晶圆500遮挡，形成强度变化的探测信号，信号接收器1048根据接收到的强度变化的探测信号，记录晶圆盒100内晶圆500的存放情况。如此设计，取代了晶圆盒100每次上机台200时，都需要机台200的机械手臂对晶圆盒100中的晶圆500进行扫描，确认晶圆盒100内的晶圆500的存放情况。可以节约大量机械手臂扫描时间，进而提高产能。
在其中一个实施例中，第一滑动组件1042及第二滑动组件1044均包括滑动导轨或滑动架。
具体地，第一滑动组件1042及第二滑动组件1044为滑动导轨，滑动导轨沿晶圆盒100的高度方向延伸，相对设置于晶圆盒100的内壁上，信号发射器1046及信号接收器1048分别可滑动地设置于滑动导轨上。信号发射器1046及信号接收器1048相对设置，保证信号发射器1046发射的探测信号经过晶圆盒100内的晶圆500后，被信号接收器1048接收。滑动导轨确保信号发射器1046及信号接收器1048在驱动装置的驱动下沿晶圆盒100的高度方向运动，滑动导轨也可采用其他滑动组件，在此不做限定。
具体地，第一滑动组件1042及第二滑动组件1044为滑动架，滑动架沿晶圆盒100的高度方向延伸，相对设置于晶圆盒100的内壁上，信号发射器1046及信号接收器1048分别可滑动地设置于滑动架上。信号发射器1046及信号接收器1048相对设置，保证信号发射器1046发射的探测信号经过晶圆盒100内的晶圆500后，被信号接收器1048接收。滑动架确保信号发射器1046及信号接收器1048在驱动装置的驱动下沿晶圆盒100的高度方向运动，滑动架也可采用其他滑动组件，在此不做限定。
在其中一个实施例中，信号发射器1046包括红外信号发射器1046；信号接收器1048包括红外信号接收器1048。
具体地，信号发射器1046为红外信号发射器1046，信号接收器1048为红外信号接收器1048。红外信号发射器1046及红外信号接收器1048在驱动装置的驱动下，分别在第一滑动组件1042与第二滑动组件1044上同步运动过程中，红外信号发射器1046发射的红外探测信号，红外探测信号在晶圆盒100内传输过程中，被晶圆盒100内的晶圆500遮挡形成强度变化的红外探测信号，红外信号接收器1048根据接收到的被晶圆500遮挡形成的强度变化的红外探测信号，记录晶圆盒100内晶圆500的存放情况。如此实现了红外信号发射器1046及红外信号接收器1048对晶圆盒100中的晶圆500进行扫描，确认晶圆盒100内的晶圆500的存放情况。
请参阅图2，在其中一个实施例中，第一滑动组件1042及第二滑动组件1044均自盒体102的顶部延伸至盒体102的底部。
具体地，第一滑动组件1042及第二滑动组件1044沿晶圆盒100的高度方向延伸，设置于晶圆盒100的内壁上。其中，第一滑动组件1042及第二滑动组件1044均自盒体102的顶部延伸至盒体102的底部。如此设计，使设置于第一滑动组件1042上的信号发射器1046以及设置于第二滑动组件1044上的信号接收器1048，均能够沿盒体102的顶部滑动至盒体102的底部，确保晶圆扫描装置能够扫描到晶圆盒100体内所有放置的晶圆500。使扫描得到的晶圆500存放情况更加准确，保证了生产效率。
在其中一个实施例中，还包括多组用于支撑晶圆500的支撑组件108，固定于容纳空间的内壁上，多组支撑组件108沿盒体102的高度方向平行间隔排布；各组支撑组件108均包括多个支撑块1082，多个支撑块1082沿容纳空间的周向间隔排布。
具体地，晶圆盒100还包括多组用于支撑晶圆500的支撑组件108。多组支撑组件108沿盒体102的高度方向间隔设置，且每组支撑组件108之间平行，各组支撑组件108的多个支撑块1082沿容纳空间的周向间隔排布。第一滑动组件1042及第二滑动组件1044相对设置于晶圆盒100的内壁，与各组中相对设置的支撑组件108相邻，在各组支撑组件108中与第一滑动组件1042及第二滑动组件1044相邻的支撑组件108，沿与探测信号平行的方向设置。
如此设计，使放置于每组支撑组件108上的晶圆500，能够沿盒体102高度方向平行间隔地设置于晶圆盒100内部，使信号发射器1046及信号接收器1048在沿晶圆盒100高度方向同步运动过程中，信号发射器1046发射的探测信号被晶圆500遮挡，产生强度变 化的探测信号，进而记录晶圆500的存放情况。其中，在各组支撑组件108中与第一滑动组件1042及第二滑动组件1044相邻的支撑组件108，沿与探测信号平行的方向设置，防止由于支撑组件108遮挡探测信号而导致晶圆500的存放情况不准确。
在其中一个实施例中，晶圆扫描装置还包括：第二晶圆扫描装置106。第二晶圆扫描装置106设置于盒体102的底部，且位于开口处；第二晶圆扫描装置106用于在晶圆500传送至盒体102内时扫描并记录晶圆500的背刻号502。
具体地，第二晶圆扫描装置106设置于盒体102开口处的底部，在晶圆500传送至盒体102时，扫描记录晶圆500的背刻号502。确保传送的晶圆500与帐料相符，避免误传送错误，减少人员工作量，节约生产成本，进一步提高传送效率。
请参阅图3，本申请还提供一种晶圆传送系统，晶圆传送系统包括：如上述任一项实施例的晶圆盒100、机台200及控制系统300。其中，机台200包括承载台及晶圆传送装置400；晶圆盒100位于承载台上，晶圆传送装置400用于向晶圆盒100内传送晶圆500。控制系统300与第一晶圆扫描装置104及机台200相连接，用于驱动第一晶圆扫描装置104在晶圆盒100内移动，以对盒体102内部进行扫描，根据第一晶圆扫描装置104的扫描结果得到晶圆盒100中的晶圆信息，并将晶圆信息发送至机台200，晶圆信息包括晶圆盒100中晶圆500的数量及位置。
具体地，晶圆盒100位于承载台上，控制系统300与第一晶圆扫描装置104及机台200相连接。控制系统300驱动信号发射器1046及信号接收器1048同步运动过程中，信号发射器1046发射的探测信号被晶圆盒100内的晶圆500遮挡，形成强度变化的探测信号，信号接收器1048根据接收到的强度变化的探测信号，以对盒体102内部进行扫描。根据第一晶圆扫描装置104的扫描结果得到晶圆盒100中的晶圆信息，晶圆信息包括晶圆盒100中晶圆500的数量及位置，并将晶圆信息发送至机台200。
通过第一扫描装置对晶圆盒100进行扫描，记录晶圆盒100内晶圆500的存放情况。如此设计，取代了晶圆盒100每次上机台200时，都需要机台200的机械手臂对晶圆盒100中的晶圆500进行扫描，确认晶圆盒100内的晶圆500的存放情况。可以节约大量机械手臂扫描时间，进而提高产能。
在其中一个实施例中，还包括通讯装置，通讯装置与控制系统300相连接，用于将的扫描结果发送至控制系统300。其中，通讯装置可以是有线通讯设备或无线通讯设备，在此不做限定。通讯装置将扫描结果，即晶圆盒100内的晶圆500的存放情况发送至控制系统300。
在其中一个实施例中，晶圆传送装置400包括机械手臂。晶圆传送装置400将晶圆500传送至晶圆盒100内，或者将晶圆500传出晶圆盒100。
请参阅图3，在其中一个实施例中，晶圆扫描装置还包括：第二晶圆扫描装置106，设置于盒体102的底部，且位于开口处；第二晶圆扫描装置106用于在晶圆传送至盒体102内时扫描并记录晶圆500的背刻号502；控制系统300还与第二晶圆扫描装相连接，控制系统300还用于将背刻号502扫描装置扫描并记录的背刻号502与目标背刻号502进行比对，并在比对结果不符时向机台200发送报警控制信息，机台200收到报警控制信息后报警并停止晶圆500的传送。
具体地，第二晶圆扫描装置106设置于盒体102开口处的底部。控制系统300控制第二晶圆扫描装置106在晶圆500传送至盒体102时，扫描记录晶圆500的背刻号502。控制系统300将扫描得到的背刻号502与目标背刻号502进行比对，在比对结果不符时向机台200发送报警控制信息，机台200收到报警控制信息后报警并停止晶圆500的传送。通过将扫描得到的背刻号502与目标背刻号502进行比对，确保传送的晶圆500与帐料相符，避免误传送错误，减少人员工作量，进一步提高传送效率。
请参阅图5，在其中一个实施例中，控制系统300包括机台200的中控系统。
具体地，中控系统驱动信号发射器1046及信号接收器1048同步运动过程中，信号发射器1046发射的探测信号被晶圆盒100内的晶圆500遮挡，形成强度变化的探测信号，信号接收器1048根据接收到的强度变化的探测信号，中控系统生成晶圆盒100中的晶圆信息，晶圆信息包括晶圆盒100中晶圆500的数量及位置，并将晶圆信息发送至机台200。
具体地，中控系统控制第二晶圆扫描装置106在晶圆500传送至盒体102时，扫描记录晶圆500的背刻号502。中控系统将扫描得到的背刻号502与目标背刻号502进行比对，在比对结果不符时向机台200发送报警控制信息，机台200收到报警控制信息后报警并停止晶圆500的传送。通过将扫描得到的背刻号502与目标背刻号502进行比对，确保传送的晶圆500与帐料相符，避免误传送错误，减少人员工作量，进一步提高传送效率。
本申请还提供一种基于如上述任一项实施例的晶圆传送系统的晶圆传送方法，方法包括：使用第一晶圆扫描装置104对盒体102内部进行扫描，根据晶圆扫描装置的扫描结果得到晶圆盒100中的晶圆信息，并将晶圆信息发送至机台200，晶圆信息包括晶圆盒100中晶圆500的数量及位置。
具体地，控制系统300控制第一晶圆扫描装置104对盒体102内部进行扫描，并生成晶圆盒100中的晶圆信息，其中，晶圆信息为晶圆盒100中晶圆的数量及位置，并将晶圆 信息发送至机台200。如此无需在晶圆盒100每次上机台200时，都需要机台200的机械手臂对晶圆盒100中的晶圆500进行扫描，确认晶圆盒100内的晶圆500的存放情况。可以节约大量机械手臂扫描时间，进而提高产能。
在其中一个实施例中，晶圆扫描装置还包括：第二晶圆扫描装置106，设置于盒体102的底部，且位于开口处；晶圆传送方法还包括：在晶圆500传送至盒体102内时，使用第二晶圆扫描装置106扫描并记录晶圆500的背刻号502；将背刻号502扫描装置扫描并记录的背刻号502与目标背刻号502进行比对，并在比对结果不符时向机台200发送报警控制信息。
具体地，使用第二晶圆扫描装置106扫描并记录晶圆500的背刻号502，将扫描得到的背刻号502与目标背刻号502进行比对，并在比对结果不符时向机台200发送报警控制信息。通过将扫描得到的背刻号502与目标背刻号502进行比对，确保传送的晶圆500与帐料相符，避免误传送错误，减少人员工作量，进一步提高传送效率。
在其中一个实施例中，晶圆传送方法还包括：机台200收到报警控制信息后报警并停止晶圆500的传送。
具体地，机台200收到报警控制信息后报警并停止晶圆500的传送，确保传送的晶圆500与帐料相符，避免误传送错误。
应该理解的是，除非本文中有明确的说明，的步骤的执行并没有严格的顺序限制，这些步骤可以以其它的顺序执行。而且，的步骤的至少一部分步骤可以包括多个子步骤或者多个阶段，这些子步骤或者阶段并不必然是在同一时刻执行完成，而是可以在不同的时刻执行，这些子步骤或者阶段的执行顺序也不必然是依次进行，而是可以与其它步骤或者其它步骤的子步骤或者阶段的至少一部分轮流或者交替地执行。
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程，是可以通过计算机程序来指令相关的硬件来完成，所述的计算机程序可存储于一非易失性计算机可读取存储介质中，该计算机程序在执行时，可包括如上述各方法的实施例的流程。其中，本申请所提供的各实施例中所使用的对存储器、存储、数据库或其它介质的任何引用，均可包括非易失性和/或易失性存储器。非易失性存储器可包括只读存储器(ROM)、可编程ROM(PROM)、电可编程ROM(EPROM)、电可擦除可编程ROM(EEPROM)或闪存。易失性存储器可包括随机存取存储器(RAM)或者外部高速缓冲存储器。作为说明而非局限，RAM以多种形式可得，诸如静态RAM(SRAM)、动态RAM(DRAM)、同步DRAM(SDRAM)、双数据率SDRAM(DDRSDRAM)、增强型SDRAM(ESDRAM)、同步链路 (Synchlink)DRAM(SLDRAM)、存储器总线(Rambus)直接RAM(RDRAM)、直接存储器总线动态RAM(DRDRAM)、以及存储器总线动态RAM(RDRAM)等。
以上实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (15)

  1. 一种晶圆盒，包括：
    盒体，所述盒体上设有与所述盒体内部相连通的开口；
    晶圆扫描装置，所述晶圆扫描装置包括第一晶圆扫描装置，所述晶圆扫描装置设置于所述盒体的内壁上，用于扫描所述盒体内晶圆的存放情况；
    盒盖，扣设于所述开口处。
  2. 根据权利要求1所述的晶圆盒，其中，所述第一晶圆扫描装置包括：
    第一滑动组件，位于所述盒体的内壁上，所述第一滑动组件沿所述盒体的高度方向延伸；
    信号发射器，位于所述第一滑动组件上，可沿所述第一滑动组件滑动；所述信号发射器用于发射探测信号；
    第二滑动组件，位于所述盒体的内壁上，与所述第一滑动组件相对设置；所述第二滑动组件沿所述盒体的高度方向延伸；
    信号接收器，位于所述第二滑动组件上，可沿所述第二滑动组件滑动；所述信号接收器用于接收所述探测信号；
    驱动装置，与所述信号发射器及所述信号接收器相连接，用于驱动所述信号发射器及所述信号接收器同步滑动。
  3. 根据权利要求2所述的晶圆盒，其中，所述第一滑动组件及所述第二滑动组件均包括滑动导轨或滑动架。
  4. 根据权利要求2所述的晶圆盒，其中，所述信号发射器包括红外信号发射器；所述信号接收器包括红外信号接收器。
  5. 根据权利要求2所述的晶圆盒，其中，所述第一滑动组件及所述第二滑动组件均自所述盒体的顶部延伸至所述盒体的底部。
  6. 根据权利要求1所述的晶圆盒，还包括多组用于支撑晶圆的支撑组件，固定于所述容纳空间的内壁上，多组所述支撑组件沿所述盒体的高度方向平行间隔排布；各组所述支撑组件均包括多个支撑块，多个所述支撑块沿所述容纳空间的周向间隔排布。
  7. 根据权利要求1至6中任一项所述的晶圆盒，其中，所述晶圆扫描装置还包括：
    第二晶圆扫描装置，设置于所述盒体的底部，且位于所述开口处；所述第二晶圆扫描装置用于在所述晶圆传送至所述盒体内时扫描并记录所述晶圆的背刻号。
  8. 一种晶圆传送系统，包括：
    如权利要求1至6中任一项所述的晶圆盒；
    机台，包括承载台及晶圆传送装置；所述晶圆盒位于所述承载台上，所述晶圆传送装置用于向所述晶圆盒内传送所述晶圆；
    控制系统，与所述第一晶圆扫描装置及所述机台相连接，用于驱动所述第一晶圆扫描装置在所述晶圆盒内移动，以对所述盒体内部进行扫描，根据所述第一晶圆扫描装置的扫描结果得到所述晶圆盒中的晶圆信息，并将所述晶圆信息发送至所述机台，所述晶圆信息包括所述晶圆盒中所述晶圆的数量及位置。
  9. 根据权利要求8所述的晶圆传送系统，其中，还包括通讯装置，所述通讯装置与所述控制相连接，用于将所述的扫描结果发送至所述控制系统。
  10. 根据权利要求8所述的晶圆传送系统，其中，所述晶圆传送装置包括机械手臂。
  11. 根据权利要求8所述的晶圆传送系统，其中，所述晶圆扫描装置还包括：第二晶圆扫描装置，设置于所述盒体的底部，且位于所述开口处；所述第二晶圆扫描装置用于在所述晶圆传送至所述盒体内时扫描并记录所述晶圆的背刻号；
    所述控制系统还与所述第二晶圆扫描装相连接，所述控制系统还用于将所述背刻号扫描装置扫描并记录的背刻号与目标背刻号进行比对，并在比对结果不符时向所述机台发送报警控制信息，所述机台收到所述报警控制信息后报警并停止晶圆的传送。
  12. 根据权利要求8至11中任一项所述的晶圆传送系统，其中，所述控制系统包括所述机台的中控系统。
  13. 一种基于如权利要求8至12中任一项所述的晶圆传送系统的晶圆传送方法，包括：
    使用所述第一晶圆扫描装置对盒体内部进行扫描，根据所述晶圆扫描装置的扫描结果得到所述晶圆盒中的晶圆信息，并将所述晶圆信息发送至所述机台，所述晶圆信息包括所述晶圆盒中所述晶圆的数量及位置。
  14. 根据权利要求13所述的晶圆传送方法，其中，所述晶圆扫描装置还包括：第二晶圆扫描装置，设置于所述盒体的底部，且位于所述开口处；所述晶圆传送方法还包括：
    在所述晶圆传送至所述盒体内时，使用所述第二晶圆扫描装置扫描并记录所述晶圆的背刻号；
    将所述背刻号扫描装置扫描并记录的背刻号与目标背刻号进行比对，并在比对结果不符时向所述机台发送报警控制信息。
  15. 根据权利要求14所述的晶圆传送方法，还包括：
    所述机台收到所述报警控制信息后报警并停止晶圆的传送。
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