WO2022223674A3 - Leistungshalbleiteranordnung und wechselrichterbrücke mit leistungshalbleiteranordnung - Google Patents
Leistungshalbleiteranordnung und wechselrichterbrücke mit leistungshalbleiteranordnung Download PDFInfo
- Publication number
- WO2022223674A3 WO2022223674A3 PCT/EP2022/060515 EP2022060515W WO2022223674A3 WO 2022223674 A3 WO2022223674 A3 WO 2022223674A3 EP 2022060515 W EP2022060515 W EP 2022060515W WO 2022223674 A3 WO2022223674 A3 WO 2022223674A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power semiconductor
- semiconductor assembly
- circuit board
- inverter bridge
- assembly
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Combinations Of Printed Boards (AREA)
- Inverter Devices (AREA)
Abstract
Es wird eine Leistungshalbleiteranordnung (10, 20, 30) mit einer ersten Leiterplatte (14), einer zweiten Leiterplatte (16) und einem Leistungshalbleiter (12) beschrieben, wobei die erste Leiterplatte (14) mit der zweiten Leiterplatte (16) elektrisch leitend verbunden ist und der Leistungshalbleiter (12) mit der zweiten Leiterplatte (16) elektrisch leitend verbunden ist, und wobei die erste Leiterplatte (14) mit der zweiten Leiterplatte (16) mechanisch über eine leitfähige Kurzdistanzverbindung (18) verbunden ist. Eine Wechselrichterbrücke weist eine solche Leistungshalbleiteranordnung (10, 20, 30), ein Wechselrichter eine solche Wechselrichterbrücke auf.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021110251.0 | 2021-04-22 | ||
DE102021110251.0A DE102021110251A1 (de) | 2021-04-22 | 2021-04-22 | Leistungshalbleiteranordnung und wechselrichterbrücke mit leistungshalbleiteranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2022223674A2 WO2022223674A2 (de) | 2022-10-27 |
WO2022223674A3 true WO2022223674A3 (de) | 2023-01-26 |
Family
ID=81748228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2022/060515 WO2022223674A2 (de) | 2021-04-22 | 2022-04-21 | Leistungshalbleiteranordnung und wechselrichterbrücke mit leistungshalbleiteranordnung |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102021110251A1 (de) |
WO (1) | WO2022223674A2 (de) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5644103A (en) * | 1994-11-10 | 1997-07-01 | Vlt Corporation | Packaging electrical components having a scallop formed in an edge of a circuit board |
EP1211730A2 (de) * | 2000-11-29 | 2002-06-05 | Nokia Corporation | Gestapeltes Leistungsverstärkermodul |
CN101415297A (zh) * | 2007-10-19 | 2009-04-22 | 华为技术有限公司 | 一种印制板组件及其加工方法 |
DE102012217905B3 (de) * | 2012-10-01 | 2013-11-07 | Semikron Elektronik Gmbh & Co. Kg | 3-Level-Stromrichterhalbbrücke |
DE102016210650A1 (de) * | 2016-06-15 | 2017-12-21 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer leistungselektronischen Schaltung und leistungselektronische Schaltung. |
EP3364456A2 (de) * | 2016-12-30 | 2018-08-22 | At&S (China) Co., Ltd. | Folie mit nano- und/oder mikrostrukturen für komponententräger |
EP3751605A1 (de) * | 2019-06-11 | 2020-12-16 | Siemens Aktiengesellschaft | Elektronischer schaltkreis und verfahren zur herstellung eines elektronischen schaltkreises |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4326104A1 (de) | 1993-08-04 | 1995-02-09 | Blaupunkt Werke Gmbh | Elektrische Baugruppe |
JP5338830B2 (ja) | 2011-03-15 | 2013-11-13 | 株式会社豊田自動織機 | 半導体装置 |
CN202276549U (zh) | 2011-09-26 | 2012-06-13 | 番禺得意精密电子工业有限公司 | 电连接组件 |
JP5803961B2 (ja) | 2013-03-21 | 2015-11-04 | 株式会社豊田自動織機 | 基板間隔保持部材及びインバータ装置 |
DE102013215647A1 (de) | 2013-08-08 | 2015-02-12 | Siemens Aktiengesellschaft | Leistungselektronisches Modul und Verfahren zur Herstellung eines leistungselektronischen Moduls |
US9681558B2 (en) | 2014-08-12 | 2017-06-13 | Infineon Technologies Ag | Module with integrated power electronic circuitry and logic circuitry |
DE102017126724A1 (de) | 2017-11-14 | 2019-05-16 | Nanowired Gmbh | Verfahren und Verbindungselement zum Verbinden von zwei Bauteilen sowie Anordnung von zwei verbundenen Bauteilen |
-
2021
- 2021-04-22 DE DE102021110251.0A patent/DE102021110251A1/de active Pending
-
2022
- 2022-04-21 WO PCT/EP2022/060515 patent/WO2022223674A2/de active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5644103A (en) * | 1994-11-10 | 1997-07-01 | Vlt Corporation | Packaging electrical components having a scallop formed in an edge of a circuit board |
EP1211730A2 (de) * | 2000-11-29 | 2002-06-05 | Nokia Corporation | Gestapeltes Leistungsverstärkermodul |
CN101415297A (zh) * | 2007-10-19 | 2009-04-22 | 华为技术有限公司 | 一种印制板组件及其加工方法 |
DE102012217905B3 (de) * | 2012-10-01 | 2013-11-07 | Semikron Elektronik Gmbh & Co. Kg | 3-Level-Stromrichterhalbbrücke |
DE102016210650A1 (de) * | 2016-06-15 | 2017-12-21 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer leistungselektronischen Schaltung und leistungselektronische Schaltung. |
EP3364456A2 (de) * | 2016-12-30 | 2018-08-22 | At&S (China) Co., Ltd. | Folie mit nano- und/oder mikrostrukturen für komponententräger |
EP3751605A1 (de) * | 2019-06-11 | 2020-12-16 | Siemens Aktiengesellschaft | Elektronischer schaltkreis und verfahren zur herstellung eines elektronischen schaltkreises |
Also Published As
Publication number | Publication date |
---|---|
WO2022223674A2 (de) | 2022-10-27 |
DE102021110251A1 (de) | 2022-10-27 |
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