ATE372043T1 - Laminierte kontakte in sockel - Google Patents

Laminierte kontakte in sockel

Info

Publication number
ATE372043T1
ATE372043T1 AT03716189T AT03716189T ATE372043T1 AT E372043 T1 ATE372043 T1 AT E372043T1 AT 03716189 T AT03716189 T AT 03716189T AT 03716189 T AT03716189 T AT 03716189T AT E372043 T1 ATE372043 T1 AT E372043T1
Authority
AT
Austria
Prior art keywords
panel
power
conductive
connectors
sockets
Prior art date
Application number
AT03716189T
Other languages
English (en)
Inventor
Hong Xie
Ram Viswanath
Priyavadan Patel
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE372043T1 publication Critical patent/ATE372043T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Ceramic Capacitors (AREA)
  • Cable Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Organic Insulating Materials (AREA)
AT03716189T 2002-02-26 2003-02-25 Laminierte kontakte in sockel ATE372043T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/082,881 US6575766B1 (en) 2002-02-26 2002-02-26 Laminated socket contacts

Publications (1)

Publication Number Publication Date
ATE372043T1 true ATE372043T1 (de) 2007-09-15

Family

ID=22174046

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03716189T ATE372043T1 (de) 2002-02-26 2003-02-25 Laminierte kontakte in sockel

Country Status (7)

Country Link
US (3) US6575766B1 (de)
EP (1) EP1479274B1 (de)
CN (1) CN100534276C (de)
AT (1) ATE372043T1 (de)
AU (1) AU2003219905A1 (de)
DE (1) DE60315954T2 (de)
WO (1) WO2003073814A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6731493B2 (en) * 2002-03-28 2004-05-04 Intel Corporation Low impedance inter-digital capacitor and method of using
US6979208B2 (en) * 2002-12-19 2005-12-27 Intel Corporation Laminated socket contacts
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
TWI226735B (en) * 2003-10-03 2005-01-11 Asustek Comp Inc Adaption board
US7291896B2 (en) * 2004-06-24 2007-11-06 Rajendran Nair Voltage droop suppressing active interposer
US8485511B2 (en) * 2009-03-11 2013-07-16 Centipede Systems, Inc. Method and apparatus for holding microelectronic devices
US8212350B2 (en) * 2009-04-06 2012-07-03 Intel Corporation Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
JP2013258044A (ja) * 2012-06-12 2013-12-26 Molex Inc コネクタ
JP6090930B2 (ja) * 2013-09-17 2017-03-08 日本航空電子工業株式会社 コネクタ
US9824505B2 (en) 2014-02-25 2017-11-21 Ford Global Technologies, Llc Method for triggering a vehicle system monitor
US9832876B2 (en) 2014-12-18 2017-11-28 Intel Corporation CPU package substrates with removable memory mechanical interfaces
US10741951B2 (en) 2017-11-13 2020-08-11 Te Connectivity Corporation Socket connector assembly for an electronic package

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951495A (en) * 1974-09-23 1976-04-20 Advanced Memory Systems, Inc. Leadless package receptacle
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
JPS62113608A (ja) 1985-11-09 1987-05-25 Isao Terunuma 猫爪式タイヤ
US4814857A (en) * 1987-02-25 1989-03-21 International Business Machines Corporation Circuit module with separate signal and power connectors
JPS63280432A (ja) * 1987-05-12 1988-11-17 Fujitsu Ltd Ｉｃパツケ−ジ
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5104327A (en) * 1991-02-28 1992-04-14 Amp Incorporated Wire form socket connector
US5528463A (en) * 1993-07-16 1996-06-18 Dallas Semiconductor Corp. Low profile sockets and modules for surface mountable applications
US5483099A (en) * 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5714801A (en) * 1995-03-31 1998-02-03 Kabushiki Kaisha Toshiba Semiconductor package
US5892275A (en) 1995-08-29 1999-04-06 Intel Corporation High performance power and ground edge connect IC package
US5864478A (en) 1996-06-28 1999-01-26 Intel Corporation Power pod/power delivery system
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices
US6210175B1 (en) * 1998-02-20 2001-04-03 Hewlett-Packard Company Socket rails for stacking integrated circuit components
JP2001203470A (ja) * 2000-01-21 2001-07-27 Toshiba Corp 配線基板、半導体パッケージ、および半導体装置
US6495911B1 (en) * 2000-08-17 2002-12-17 International Business Machines Corporation Scalable high frequency integrated circuit package
US6992378B2 (en) 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US6600220B2 (en) * 2001-05-14 2003-07-29 Hewlett-Packard Company Power distribution in multi-chip modules
US6328574B1 (en) * 2001-07-27 2001-12-11 Hon Hai Precision Ind. Co., Ltd. High current capacity socket with side contacts
US6379172B1 (en) * 2001-07-27 2002-04-30 Hon Hai Precision Ind. Co., Ltd. High current capacity socket with side contacts
US6437431B1 (en) * 2001-08-07 2002-08-20 Lsi Logic Corporation Die power distribution system
US6521846B1 (en) * 2002-01-07 2003-02-18 Sun Microsystems, Inc. Method for assigning power and ground pins in array packages to enhance next level routing

Also Published As

Publication number Publication date
WO2003073814A3 (en) 2004-08-26
AU2003219905A1 (en) 2003-09-09
AU2003219905A8 (en) 2003-09-09
US20030162419A1 (en) 2003-08-28
US20030162420A1 (en) 2003-08-28
EP1479274B1 (de) 2007-08-29
US6672880B2 (en) 2004-01-06
US6575766B1 (en) 2003-06-10
CN100534276C (zh) 2009-08-26
US6854979B2 (en) 2005-02-15
DE60315954D1 (de) 2007-10-11
DE60315954T2 (de) 2007-12-20
WO2003073814A2 (en) 2003-09-04
EP1479274A2 (de) 2004-11-24
CN1640217A (zh) 2005-07-13

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties