WO2022222298A1 - 研磨液供给系统、研磨设备、排气方法及研磨方法 - Google Patents

研磨液供给系统、研磨设备、排气方法及研磨方法 Download PDF

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Publication number
WO2022222298A1
WO2022222298A1 PCT/CN2021/109119 CN2021109119W WO2022222298A1 WO 2022222298 A1 WO2022222298 A1 WO 2022222298A1 CN 2021109119 W CN2021109119 W CN 2021109119W WO 2022222298 A1 WO2022222298 A1 WO 2022222298A1
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Prior art keywords
grinding
filter
supply system
exhaust
liquid supply
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PCT/CN2021/109119
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English (en)
French (fr)
Inventor
张鹏
廖帆伟
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长鑫存储技术有限公司
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Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Priority to US17/486,619 priority Critical patent/US20220339757A1/en
Publication of WO2022222298A1 publication Critical patent/WO2022222298A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D36/00—Filter circuits or combinations of filters with other separating devices
    • B01D36/001—Filters in combination with devices for the removal of gas, air purge systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition

Definitions

  • the present application relates to the technical field of semiconductor manufacturing, and in particular, to a polishing liquid supply system, polishing equipment, an exhaust method, and a polishing method.
  • CMP Chemical Mechanical Polishing
  • the grinding liquid generally contains hydrogen peroxide and other components that can be naturally decomposed into water and oxygen. There is often some gas in the grinding liquid filter. When replacing the grinding liquid filter, it is necessary to manually remove the bubbles from the grinding liquid filter. .
  • the polishing liquid is a chemical agent, which has the risk of being splashed on personnel, which will endanger personal safety, and the operation procedure of air bubble removal is complicated, which results in the loss of manpower and machine utilization rate.
  • the application provides a polishing liquid supply system, comprising:
  • a controller connected with the grinding machine table and the sensor, for sending an exhaust signal when the grinding machine table is in an idle state and the sensor detects the existence of air bubbles in the grinding fluid filter;
  • the exhaust unit includes an exhaust pipeline and a control valve
  • the exhaust pipeline is communicated with the interior of the grinding fluid filter
  • the control valve is arranged on the exhaust pipeline and is connected to the The controller is connected to open for venting upon receipt of the venting signal.
  • the application also provides a grinding device, comprising:
  • the grinding machine table is connected with the controller.
  • the present application also provides an exhaust method, which is applied to the polishing liquid supply system provided in the above-mentioned embodiments; the exhaust method includes the following steps:
  • the control valve is opened to exhaust after receiving the exhaust signal.
  • the present application also provides a grinding method, the grinding method is performed based on the grinding equipment provided in the above embodiment, and the grinding method includes the following steps:
  • the filtered grinding liquid is supplied to the grinding table.
  • the grinding liquid supply system, grinding equipment, exhaust method and grinding method of the present application have the following beneficial effects:
  • the exhaust unit accepts the exhaust signal from the controller and exhausts the air.
  • the air bubble removal procedure is simple and avoids manpower and machine operation.
  • the grinding fluid supply system does not require manual operation of removing air bubbles from the grinding fluid filter, which can avoid the risk of splashing on the operator and avoid endangering personal safety.
  • the liquid level sensor is used to monitor whether there are air bubbles in the grinding fluid filter. Because the liquid level sensor is easy to install, the structure of the grinding fluid supply system is simpler; the liquid level sensor can work in unfavorable environments such as pollution, humidity and air bubbles. , well matched with the measured object, strong adaptability to the measured environment, does not destroy the state of the measured object, and the monitoring signal is not disturbed by the measured environment, with high reliability. In addition, because the CMP slurry contains hydrogen peroxide, the hydrogen peroxide will naturally decompose into water and oxygen in the slurry filter, which cannot be predicted or discharged in time, which will cause the flow of the slurry to be unstable. The liquid level sensor is used to monitor the filtration of the slurry. Whether there are air bubbles in the filter, even if there is water and oxygen in the slurry filter, it will not affect the accuracy of monitoring the existence of air bubbles in the slurry filter.
  • the structure of the polishing liquid supply system is made more compact, and the working space required for the polishing liquid supply system can be saved.
  • the use of corrosion-resistant pneumatic valve with adjustable opening can prevent the valve body from being corroded by acid and alkali and affect its working performance, and ensure the reliability of the grinding fluid supply system.
  • the exhaust method of the present application can send an exhaust signal to control the exhaust unit to exhaust when the grinding machine table is in an idle state and the sensor detects the existence of air bubbles in the polishing liquid filter.
  • the exhaust method has a simple procedure and avoids manual labor. At the same time, this exhaust method does not require manual operation of air bubble removal on the grinding fluid filter, which can avoid the risk of splashing on the operator and avoid endangering personal safety.
  • FIG. 1 is a schematic structural diagram of a grinding fluid supply system provided by one of the embodiments of the present application, and is also a schematic structural diagram of a grinding device provided by one of the embodiments of the present application;
  • FIG. 2 is a schematic flowchart of an exhaust method provided by one of the embodiments of the present application.
  • FIG. 3 is a schematic flowchart of a grinding method provided in one embodiment of the present application.
  • a first element, component or section discussed below could be termed a second element, component or section; for example, a first supply line could be referred to as a second supply pipeline, and similarly, the second liquid supply pipeline can be referred to as the first liquid supply pipeline; the first liquid supply pipeline and the second liquid supply pipeline are different liquid supply pipelines, for example, the first liquid supply pipeline
  • the liquid pipeline can be used to supply the grinding liquid into the grinding liquid filter, and the second liquid supply pipeline can be used to provide the filtered grinding liquid to the grinding machine table.
  • the present application provides a polishing liquid supply system 1 for providing polishing liquid to a grinding machine table 2 , including: a polishing liquid filter 10 ; a sensor 11 , and the sensor 11 is used to monitor whether the polishing liquid filter 10 There are air bubbles; the controller 12, the controller 12 is connected with the grinding machine table 2 and the sensor 11, for the grinding machine table 2 is in an idle state and the sensor 11 monitors the existence of air bubbles in the grinding fluid filter 10 Send out an exhaust signal; discharge The air unit 13, the air discharge unit 13 includes an air discharge line 131 and a control valve 132, the air discharge line 131 communicates with the interior of the grinding fluid filter 10, and the control valve 132 is arranged on the air discharge line 131, and communicates with the controller 12 is connected to open for exhaust after receiving the exhaust signal.
  • the exhaust unit 13 accepts the exhaust signal of the controller 12 and conducts the exhaust, and the bubble exhaust procedure is simple and convenient, The loss of manpower and machine utilization rate is avoided; at the same time, the grinding fluid supply system 1 does not need to manually perform the bubble removal operation on the grinding fluid filter 10, which can avoid the risk of splashing on the operator and avoid endangering personal safety.
  • the senor 11 may include, but is not limited to, a liquid level sensor.
  • the grinding liquid supply system 1 uses a liquid level sensor to monitor whether there are air bubbles in the grinding liquid filter 10. Because the liquid level sensor is easy to install, the structure of the grinding liquid supply system 1 is simpler; It can work in unfavorable environments such as pollution, humidity, air bubbles, etc. It matches well with the measured object, has strong adaptability to the measured environment, does not destroy the state of the measured object, and the monitoring signal is not disturbed by the measured environment. It is reliable Sex is high.
  • the liquid supply system 1 adopts a liquid level sensor. Even if water and oxygen exist in the polishing liquid filter 10 , it will not affect the accuracy of monitoring whether there are air bubbles in the polishing liquid filter 10 .
  • the liquid level sensor may include, but is not limited to, an optical fiber liquid level sensor, an ultrasonic liquid level sensor, a capacitive liquid level sensor, a photoelectric liquid level sensor, or a microwave optical liquid level sensor, etc.
  • Liquid level sensor can choose fiber optic liquid level sensor.
  • the polishing liquid supply system 1 further includes a filter support 14 ; the polishing liquid filter 10 is disposed on the filter support 14 .
  • the polishing liquid filter 10 is arranged on the filter holder 14 , so that the structure of the polishing liquid supply system 1 is more compact, and the working space required by the polishing liquid supply system 1 can be saved.
  • the senor 11 is disposed on the filter holder 14 .
  • the sensor 11 is arranged on the filter holder 14, and the sensor 11 does not need to add other supporting structures, which can make the structure of the polishing liquid supply system 1 more compact and can save polishing liquid. Supply the workspace required by System 1.
  • control valve 132 may include, but is not limited to, a pneumatic valve.
  • the pneumatic valve has a fast execution speed, and the switch is light and small.
  • the grinding liquid supply system 1 provided in the above-mentioned embodiment receives the exhaust signal through a pneumatic valve, and opens it to exhaust after receiving the exhaust signal, which not only makes the bubble discharge procedure simple and reliable, but also makes the maintenance of the grinding liquid supply system 1 possible. convenient.
  • the pneumatic valve may include, but is not limited to, a pneumatic valve that is corrosion-resistant and has an adjustable opening.
  • the polishing liquid supply system 1 provided in the above embodiment adopts a pneumatic valve with corrosion resistance and adjustable opening, which can prevent the valve body from being corroded by acid and alkali and affect its working performance, and ensure the reliability of the polishing liquid supply system 1 .
  • control valve 132 may also include a pneumatic valve and a solenoid valve.
  • the pneumatic valve is provided on the exhaust line 131, and the solenoid valve may be located on the connection line between the pneumatic valve and the controller 12, as shown in FIG. 1 . Show.
  • the controller 12 is also used for the process of opening the control valve 132 to exhaust, when the grinding machine table 2 enters the working state from the idle state or the sensor 11 monitors the polishing liquid
  • the close signal is issued when no air bubbles are present in the filter 10; the control valve 132 is also used to close after receiving the close signal to stop venting.
  • the grinding liquid supply system 1 provided in the above-mentioned embodiment only performs the operation of discharging air bubbles when the grinding machine table 2 is in an idle state, which will not affect the working state of the grinding machine table 2 and avoid the operation of the grinding machine table 2. rate loss.
  • the exhaust is stopped, which can ensure the safety of the grinding machine table 2 .
  • the controller 12 may include, but is not limited to, the machine controller of the grinding machine 2 .
  • the controller 12 may also be an independent controller added to the machine controller of the grinding machine 2 .
  • the polishing liquid supply system 1 further includes: a polishing liquid supply device (not shown in the figure); a first liquid supply pipeline 15 , one end of the first liquid supply pipeline 15 Connected with the grinding liquid supply device, the other end of the first liquid supply pipeline 15 is connected with the grinding liquid filter 10 for providing grinding liquid to the grinding liquid filter 10; the second liquid supply pipeline 16, the second One end of the liquid supply pipeline 16 is connected to the grinding liquid filter 10, the other end of the second liquid supply pipeline 16 extends to the grinding machine table 2, and the second liquid supply pipeline 16 is used to provide the filtered grinding liquid to the grinding machine table 2.
  • Grinder table 2 is used to provide the filtered grinding liquid to the grinding machine table 2.
  • the present application also provides a grinding equipment, including: the grinding liquid supply system 1 provided in any of the above-mentioned embodiments;
  • the grinding machine 2 is any machine used in the existing semiconductor field, and the specific structure of the grinding machine 2 will not be described again here.
  • the present application also provides an exhaust method, which is applied to the grinding fluid supply system 1 provided in any one of the above-mentioned embodiments, and the exhaust method includes the following steps:
  • S20 use the sensor 11 to monitor whether there are air bubbles in the grinding fluid filter 10;
  • S21 use the controller 12 to monitor the state of the grinding machine table 2 in real time, and send out an exhaust signal when the grinding machine table 2 is in an idle state and the sensor 11 monitors the existence of air bubbles in the grinding fluid filter 10;
  • the exhaust method provided in the above-mentioned embodiment can send an exhaust signal when the grinding machine table 2 is in an idle state and the sensor 11 monitors the existence of air bubbles in the grinding fluid filter 10, so as to control the exhaust unit 13 to exhaust the exhaust.
  • the gas method has simple procedures and avoids the loss of manpower and machine utilization rate; at the same time, the gas exhaust method does not require manual operation of air bubble removal on the grinding fluid filter 10, which can avoid the risk of splashing on the operator and avoid endangerment. to personal safety.
  • the sensor 11 can determine whether there are air bubbles in the polishing liquid filter 10 by monitoring the liquid level in the polishing liquid filter 10 .
  • the structure of the grinding liquid supply system 1 is simpler. And, because the CMP grinding liquid contains hydrogen peroxide, the hydrogen peroxide will naturally decompose into water and oxygen in the grinding liquid filter 10, which cannot be expected and can not be discharged in time by itself, which can cause the grinding liquid flow to be unstable;
  • the gas method determines whether there are air bubbles in the grinding liquid filter 10 by monitoring the liquid level in the grinding liquid filter 10. Even if water and oxygen exist in the grinding liquid filter 10, it will not affect the monitoring of grinding liquid filtration in the exhaust method. The accuracy of the presence or absence of air bubbles in the device 10.
  • step S22 the following steps may be further included:
  • the operation of exhausting air bubbles is performed only when the grinding machine table 2 is in an idle state, which will not affect the working state of the grinding machine table 2 and avoid the operation rate of the grinding machine table 2. loss.
  • the present application also provides a grinding method, which is performed based on the grinding equipment provided in the above-mentioned embodiment, and the grinding method includes the following steps:
  • the grinding fluid can be supplied to the grinding fluid filter 2 when the grinding machine table 2 is in an idle state.
  • the grinding method provided in the above-mentioned embodiment provides grinding liquid to the grinding liquid filter 2 when the grinding machine table 2 is in an idle state, so as to avoid the lack of grinding liquid when the grinding machine table 2 is in the working state, and to avoid the lack of grinding liquid when the grinding machine table 2 is in the working state.
  • the machine 2 supplies the grinding fluid, which causes the loss of the machine's utilization rate.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

一种研磨液供给系统（1）、研磨设备、排气方法及研磨方法，研磨液供给系统包括：研磨液过滤器（10）；传感器（11），用于监测研磨液过滤器中是否存在气泡；控制器（12），与研磨机台（2）及传感器相连接，用于研磨机台处于闲置状态且传感器监测到研磨液过滤器中存在气泡时发出排气信号；排气单元（13），包括排气管路（131）及控制阀（132），排气管路与研磨液过滤器的内部相连通，控制阀设置于排气管路上，与控制器相连接，用于在接收排气信号后打开以进行排气。这种研磨液供给系统、研磨设备、排气方法及研磨方法排气泡程序简便，避免了人力和机台稼动率的损失；无需人工对研磨液过滤器进行排气泡的操作，能够规避喷溅到操作人员的风险，避免危及到人身安全。

Description

研磨液供给系统、研磨设备、排气方法及研磨方法
本申请要求于2021年4月23日提交中国专利局，申请号为2021104409101，申请名称为“研磨液供给系统、研磨设备、排气方法及研磨方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及半导体制造技术领域，特别是涉及一种研磨液供给系统、研磨设备、排气方法及研磨方法。
背景技术
随着集成电路制造过程中特征尺寸的缩小和金属互联的增加，对晶圆表面平整度的要求也越来越高。化学机械研磨(Chemical Mechanical Polishing，CMP)是将机械研磨和化学腐蚀结合的技术，是目前最有效的晶圆平坦化方法，其广泛应用于半导体工业制造生产中。
研磨过程中，会需要根据研磨工艺的需求过滤掉研磨液中的大颗粒浆料，这需要借助研磨液过滤器来实现。又研磨液中一般含有双氧水等可以自然分解成水和氧气的成分，研磨液过滤器中经常会存在一些气体，在更换研磨液过滤器时，需要人工对研磨液过滤器进行排气泡的操作。
然而，研磨液是化学药剂，有喷溅到人员的风险，会危及到人身安全，并且排气泡的操作程序复杂，这造成人力和机台稼动率的损失。
发明内容
一方面，本申请提供了一种研磨液供给系统，包括：
研磨液过滤器；
传感器，用于监测所述研磨液过滤器中是否存在气泡；
控制器，与所述研磨机台及所述传感器相连接，用于所述研磨机台处于闲置状态且所述传感器监测到所述研磨液过滤器中存在气泡时发出排气信号；
排气单元，所述排气单元包括排气管路及控制阀，所述排气管路与所述研磨液过滤器的内部相连通，所述控制阀设置于所述排气管路上，与所述控制器相连接，用于在接收所述排气信号后打开以进行排气。
另一方面，本申请还提供了一种研磨设备，包括：
上述实施例中提供的研磨液供给系统；
研磨机台，与所述控制器相连接。
再一方面，本申请还提供了一种排气方法，应用于上述实施例中提供的研磨液供给系统；所述排气方法包括如下步骤：
使用所述传感器监测所述研磨液过滤器中是否存在气泡；
使用所述控制器实时监测所述研磨机台的状态，并在所述研磨机台处于闲置状态且所述传感器监测到所述研磨液过滤器中存在气泡时发出排气信号；
所述控制阀在接收所述排气信号后打开以进行排气。
又一方面，本申请还提供了一种研磨方法，所述研磨方法基于上述实施例中提供的研磨设备而执行，所述研磨方法包括如下步骤：
向所述研磨液过滤器中提供研磨液；
使用上述任意一个方法实施例中提供的排气方法进行排气；
将过滤后的研磨液提供至所述研磨机台。
本申请的研磨液供给系统、研磨设备、排气方法及研磨方法具有如下有益效果：
本申请的研磨液供给系统，当传感器监测到研磨液过滤器中存在气泡时，排气单元接受控制器的排气信号并进行排气，排气泡程序简便，避免了人力和机台稼动率的损失；同时，该研磨液供给系统无需人工对研磨液过滤器进行排气泡的操作，能够规避喷溅到操作人员的风险，避免危及到人身安全。
通过采用液位传感器监测研磨液过滤器中是否有气泡存在，由于液位传感器易于安装，使得研磨液供给系统的结构更加简单；液位传感器在污染、潮湿、有气泡等不利环境下均能工作，与被测物体匹配好，对被测环境适应能力强，不破坏被测物体的状态，且监测信号也不受被测环境的干扰，可靠性高。并且，由于CMP研磨液中含有双氧水，双氧水会自然分解成水和氧气在研磨液过滤器中，无法预料也无法及时自行排放，这会造成研磨液流量不稳，采用液位传感器监测研磨液过滤器中是否有气泡存在，即使有水和氧气存在于研磨液过滤器中，也不会影响其监测研磨液过滤器中是否存在气泡的准确程度。
通过将研磨液过滤器设置于过滤器支架上，使得研磨液供给系统的结构更加紧凑，能够节省研磨液供给系统所需的工作空间。
通过气动阀接收排气信号，并在接收排气信号后打开以进行排气，不仅使得排气泡程序简便可靠，还使得研磨液供给系统维修方便。采用耐腐蚀且开度可调的气动阀，能够防 止阀体被酸碱腐蚀而影响其工作性能，保证研磨液供给系统的可靠性。
本申请的排气方法，能够在研磨机台处于闲置状态且传感器监测到研磨液过滤器中存在气泡时发出排气信号以控制排气单元进行排气，该排气方法程序简便，避免了人力和机台稼动率的损失；同时，该排气方法无需人工对研磨液过滤器进行排气泡的操作，能够规避喷溅到操作人员的风险，避免危及到人身安全。
附图说明
为了更清楚地说明本申请实施例或传统技术中的技术方案，下面将对实施例或传统技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请其中一个实施例提供的研磨液供给系统的结构示意图，同时也是本申请其中一个实施例提供的研磨设备的结构示意图；
图2为本申请其中一个实施例提供的排气方法的流程示意图；
图3为本申请其中一个实施例提供的研磨方法的流程示意图。
附图标记说明：
1-研磨液供给系统，10-研磨液过滤器，11-传感器，12-控制器，13-排气单元，131-排气管路，132-控制阀，14-过滤器支架，15-第一供液管路，16-第二供液管路，2-研磨机台。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的首选实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
应当明白，当元件被称为“在...上”、“与...相邻”或“连接到”其它元件，其可以直接地在其它元件上、与之相邻或连接到其它元件，或者可以存在居间的元件。相反，当元件被称 为“直接在...上”、“与...直接相邻”或“直接连接到”其它元件时，则不存在居间的元件。应当明白，尽管可使用术语第一和第二等描述各种元件、部件和/或部分，这些元件、部件和/或部分不应当被这些术语限制。这些术语仅仅用来区分一个元件、部件或部分与另一个元件、部件或部分。因此，在不脱离本申请教导之下，下面讨论的第一元件、部件或部分可表示为第二元件、部件或部分；举例来说，可以将第一供液管路称为第二供液管路，且类似地，可以将第二供液管路称为第一供液管路；第一供液管路与第二供液管路为不同的供液管路，譬如，第一供液管路可以用于向研磨液过滤器内提供研磨液，且第二供液管路可以用于将过滤后的研磨液提供至研磨机台。
空间关系术语例如“在...下”、“在...下面”、“下面的”、“在...之下”、“在...之上”、“上面的”等，在这里可以用于描述图中所示的一个元件或特征与其它元件或特征的关系。应当明白，除了图中所示的取向以外，空间关系术语还包括使用和操作中的器件的不同取向。
在此使用时，单数形式的“一”、“一个”和“所述/该”也可以包括复数形式，除非上下文清楚指出另外的方式。还应明白，当术语“组成”和/或“包括”在该说明书中使用时，可以确定所述特征、整数、步骤、操作、元件和/或部件的存在，但不排除一个或更多其它的特征、整数、步骤、操作、元件、部件和/或组的存在或添加。同时，在此使用时，术语“和/或”包括相关所列项目的任何及所有组合。
请参阅图1，本申请提供一种研磨液供给系统1，用于向研磨机台2提供研磨液，包括：研磨液过滤器10；传感器11，传感器11用于监测研磨液过滤器10中是否存在气泡；控制器12，控制器12与研磨机台2及传感器11相连接，用于研磨机台2处于闲置状态且传感器11监测到研磨液过滤器10中存在气泡时发出排气信号；排气单元13，排气单元13包括排气管路131及控制阀132，排气管路131与研磨液过滤器10的内部相连通，控制阀132设置于排气管路131上，与控制器12相连接，用于在接收排气信号后打开以进行排气。
上述实施例中提供的研磨液供给系统1，当传感器11监测到研磨液过滤器10中存在气泡时，排气单元13接受控制器12的排气信号并进行排气，排气泡程序简便，避免了人力和机台稼动率的损失；同时，研磨液供给系统1无需人工对研磨液过滤器10进行排气泡的操作，能够规避喷溅到操作人员的风险，避免危及到人身安全。
在其中一个实施例中，传感器11可以包括但不仅限于液位传感器。
上述实施例中提供的研磨液供给系统1，采用液位传感器监测研磨液过滤器10中是否有气泡存在，由于液位传感器易于安装，使得研磨液供给系统1的结构更加简单；液位 传感器在污染、潮湿、有气泡等不利环境下均能工作，与被测物体匹配好，对被测环境适应能力强，不破坏被测物体的状态，且监测信号也不受被测环境的干扰，可靠性高。并且，由于CMP研磨液中含有双氧水，双氧水会自然分解成水和氧气在研磨液过滤器10中，无法预料也无法及时自行排放，这会造成研磨液流量不稳；上述实施例中提供的研磨液供给系统1采用液位传感器，即使有水和氧气存在于研磨液过滤器10中，也不会影响其监测研磨液过滤器10中是否存在气泡的准确程度。
具体的，在一些实施例中，液位传感器可以包括但不仅限于光纤液位传感器、超声波液位传感器、电容式液位传感器、光电液位传感器或微波光学液位传感器等等，本申请中的液位传感器可以选择光纤液位传感器。
请继续参阅图1，在其中一个实施例中，研磨液供给系统1还包括过滤器支架14；研磨液过滤器10设置于过滤器支架14上。
上述实施例中提供的研磨液供给系统1，将研磨液过滤器10设置于过滤器支架14上，使得研磨液供给系统1的结构更加紧凑，能够节省研磨液供给系统1所需的工作空间。
请继续参阅图1，在其中一个实施例中，传感器11设置于过滤器支架14上。
上述实施例中提供的研磨液供给系统1，将传感器11设置于过滤器支架14上，传感器11不需要额外增加其他的支撑结构，可以使得研磨液供给系统1的结构更加紧凑，能够节省研磨液供给系统1所需的工作空间。
在其中一个实施例中，控制阀132可以包括但不仅限于气动阀。
气动阀的执行速度快，并且开关轻便，体积小。上述实施例中提供的研磨液供给系统1，通过气动阀接收排气信号，并在接收排气信号后打开以进行排气，不仅使得排气泡程序简便可靠，还使得研磨液供给系统1维修方便。
具体的，在其中一个实施例中，气动阀可以包括但不限于耐腐蚀且开度可调的气动阀。
上述实施例中提供的研磨液供给系统1，采用耐腐蚀且开度可调的气动阀，能够防止阀体被酸碱腐蚀而影响其工作性能，保证研磨液供给系统1的可靠性。
在其他示例中，控制阀132还可以包括气动阀及电磁阀，此时，气动阀设于排气管路131上，电磁阀可以位于气动阀与控制器12的连接线路上，如图1所示。
在其中一个实施例提供的研磨液供给系统1中，控制器12还用于在控制阀132打开进行排气的过程中，研磨机台2由闲置状态进入工作状态时或传感器11监测到研磨液过滤器10中不存在气泡时发出关闭信号；控制阀132还用于在接收到关闭信号后关闭以停止排气。
上述实施例中提供的研磨液供给系统1，在研磨机台2处于闲置状态时才进行排气泡的操作，对研磨机台2的工作状态不会产生影响，避免研磨机台2的稼动率的损失。研磨机台2由闲置状态进入工作状态时或传感器11监测到研磨液过滤器10中不存在气泡时停止排气，可以保证研磨机台2工作的安全性。
在其中一个实施例中，控制器12可以包括但不仅限于所述研磨机台2的机台控制器。当然，在其他示例中，控制器12也可以为增设于研磨机台2的机台控制器之外的独立的控制器。
请继续参阅图1，在其中一个实施例中，研磨液供给系统1还包括：研磨液供给装置(图中未示出)；第一供液管路15，第一供液管路15的一端与研磨液供给装置相连接，第一供液管路15的另一端与研磨液过滤器10相连接，用于向研磨液过滤器10内提供研磨液；第二供液管路16，第二供液管路16的一端与研磨液过滤器10相连接，第二供液管路16的另一端延伸至研磨机台2，第二供液管路16用于将过滤后的研磨液提供至研磨机台2。
请继续参阅图1，本申请还提供一种研磨设备，包括：上述任意一个实施例中提供的研磨液供给系统1；研磨机台2，研磨机台2与控制器12相连接。
具体的，研磨液供给系统1的具体结构请参阅上述内容，此处不再累述。研磨机台2为现有半导体领域使用的任意一种机台，研磨机台2的具体结构此处不再累述。
请参阅图2，本申请还提供一种排气方法，排气方法应用于上述任意一个实施例中提供的研磨液供给系统1，该排气方法包括如下步骤：
S20：使用传感器11监测研磨液过滤器10中是否存在气泡；
S21：使用控制器12实时监测研磨机台2的状态，并在研磨机台2处于闲置状态且传感器11监测到研磨液过滤器10中存在气泡时发出排气信号；
S22：控制阀132在接收排气信号后打开以进行排气。
上述实施例中提供的排气方法，能够在研磨机台2处于闲置状态且传感器11监测到研磨液过滤器10中存在气泡时发出排气信号，以控制排气单元13进行排气，该排气方法程序简便，避免了人力和机台稼动率的损失；同时，该排气方法无需人工对研磨液过滤器10进行排气泡的操作，能够规避喷溅到操作人员的风险，避免危及到人身安全。
在其中一个实施例中，传感器11可以通过监测研磨液过滤器10中的液位判断研磨液过滤器10中是否存在气泡。
上述实施例中提供的排气方法，通过监测研磨液过滤器10中的液位判断研磨液过滤 器10中是否存在气泡，由于液位传感器易于安装，使得研磨液供给系统1的结构更加简单。并且，由于CMP研磨液中含有双氧水，双氧水会自然分解成水和氧气在研磨液过滤器10中，无法预料也无法及时自行排放，这会造成研磨液流量不稳；上述实施例中提供的排气方法通过监测研磨液过滤器10中的液位判断研磨液过滤器10中是否存在气泡，即使有水和氧气存在于研磨液过滤器10中，也不会影响该排气方法监测研磨液过滤器10中是否存在气泡的准确程度。
请继续参阅图2，在其中一个实施例中，步骤S22之后还可以包括如下步骤：
S23：研磨机台2由闲置状态进入工作状态时或传感器11监测到研磨液过滤器10中不存在气泡时，控制阀132关闭以停止排气。
上述实施例中提供的排气方法，在研磨机台2处于闲置状态时才进行排气泡的操作，对研磨机台2的工作状态不会产生影响，避免研磨机台2的稼动率的损失。
请参阅图3，本申请还提供一种研磨方法，该研磨方法基于上述实施例中提供的研磨设备而执行，该研磨方法包括如下步骤：
S1：向研磨液过滤器10中提供研磨液；
S2：使用上述任意一个实施例中提供的排气方法进行排气；
S3：将过滤后的研磨液提供至研磨机台2。
在其中一个实施例中，可以在研磨机台2处于闲置状态时向研磨液过滤器2提供研磨液。
上述实施例中提供的研磨方法，在研磨机台2处于闲置状态时向研磨液过滤器2提供研磨液，避免研磨机台2在工作状态时缺少研磨液，并且避免由于在工作状态时向研磨机台2提供研磨液而造成机台稼动率的损失。
应该理解的是，虽然图2和图3的流程图中的各个步骤按照箭头的指示依次显示，但是这些步骤并不是必然按照箭头指示的顺序依次执行。除非本文中有明确的说明，这些步骤的执行并没有严格的顺序限制，这些步骤可以以其它的顺序执行。而且，图2和图3中的至少一部分步骤可以包括多个步骤或者多个阶段，这些步骤或者阶段并不必然是在同一时刻执行完成，而是可以在不同的时刻执行，这些步骤或者阶段的执行顺序也不必然是依次进行，而是可以与其它步骤或者其它步骤中的步骤或者阶段的至少一部分轮流或者交替地执行。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾， 都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (15)

  1. 一种研磨液供给系统，用于向研磨机台提供研磨液，包括：
    研磨液过滤器；
    传感器，用于监测所述研磨液过滤器中是否存在气泡；
    控制器，与所述研磨机台及所述传感器相连接，用于所述研磨机台处于闲置状态且所述传感器监测到所述研磨液过滤器中存在气泡时发出排气信号；
    排气单元，所述排气单元包括排气管路及控制阀，所述排气管路与所述研磨液过滤器的内部相连通，所述控制阀设置于所述排气管路上，与所述控制器相连接，用于在接收所述排气信号后打开以进行排气。
  2. 根据权利要求1所述的研磨液供给系统，其中，所述传感器包括液位传感器。
  3. 根据权利要求1所述的研磨液供给系统，还包括过滤器支架；所述研磨液过滤器设置于所述过滤器支架上。
  4. 根据权利要求3所述的研磨液供给系统，其中，所述传感器设置于所述过滤器支架上。
  5. 根据权利要求1所述的研磨液供给系统，其中，所述控制阀包括气动阀。
  6. 根据权利要求5所述的研磨液供给系统，其中，所述气动阀包括耐腐蚀且开度可调的气动阀。
  7. 根据权利要求1所述的研磨液供给系统，其中，所述控制器还用于在所述控制阀打开进行排气的过程中，所述研磨机台由闲置状态进入工作状态时或所述传感器监测到所述研磨液过滤器中不存在气泡时发出关闭信号；所述控制阀还用于在接收到所述关闭信号后关闭以停止排气。
  8. 根据权利要求1所述的研磨液供给系统，其中，所述控制器包括所述研磨机台的机台控制器。
  9. 根据权利要求1至8中任一项所述的研磨液供给系统，还包括：
    研磨液供给装置；
    第一供液管路，一端与所述研磨液供给装置相连接，另一端与所述研磨液过滤器相连接，用于向所述研磨液过滤器内提供研磨液；
    第二供液管路，一端与所述研磨液过滤器相连接，另一端延伸至所述研磨机台，用于将过滤后的研磨液提供至所述研磨机台。
  10. 一种研磨设备，包括：
    如权利要求1至9中任一项所述的研磨液供给系统；
    研磨机台，与所述控制器相连接。
  11. 一种排气方法，应用于如权利要求1至9中任一项所述的研磨液供给系统；所述排气方法包括如下步骤：
    使用所述传感器监测所述研磨液过滤器中是否存在气泡；
    使用所述控制器实时监测所述研磨机台的状态，并在所述研磨机台处于闲置状态且所述传感器监测到所述研磨液过滤器中存在气泡时发出排气信号；
    所述控制阀在接收所述排气信号后打开以进行排气。
  12. 根据权利要求11所述的排气方法，其中，所述传感器通过监测所述研磨液过滤器中的液位判断所述研磨液过滤器中是否存在气泡。
  13. 根据权利要求11或12所述的排气方法，其中，所述控制阀打开进行排气后还包括如下步骤：
    所述研磨机台由闲置状态进入工作状态时或所述传感器监测到所述研磨液过滤器中不存在气泡时，所述控制阀关闭以停止排气。
  14. 一种研磨方法，所述研磨方法基于如权利要求10所述的研磨设备而执行，所述研磨方法包括如下步骤：
    向所述研磨液过滤器中提供研磨液；
    使用如权利要求11至13中任一项所述的排气方法进行排气；
    将过滤后的研磨液提供至所述研磨机台。
  15. 根据权利要求14所述的研磨方法，其中，在所述研磨机台处于闲置状态时向所述研磨液过滤器提供所述研磨液。
PCT/CN2021/109119 2021-04-23 2021-07-29 研磨液供给系统、研磨设备、排气方法及研磨方法 WO2022222298A1 (zh)

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