WO2022217634A1 - 蒸镀装置 - Google Patents

蒸镀装置 Download PDF

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Publication number
WO2022217634A1
WO2022217634A1 PCT/CN2021/088622 CN2021088622W WO2022217634A1 WO 2022217634 A1 WO2022217634 A1 WO 2022217634A1 CN 2021088622 W CN2021088622 W CN 2021088622W WO 2022217634 A1 WO2022217634 A1 WO 2022217634A1
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WO
WIPO (PCT)
Prior art keywords
crucible
vapor deposition
discharge pipe
cylinder
substrate
Prior art date
Application number
PCT/CN2021/088622
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English (en)
French (fr)
Inventor
何瑞亭
李晓康
Original Assignee
武汉华星光电技术有限公司
武汉华星光电半导体显示技术有限公司
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Publication date
Application filed by 武汉华星光电技术有限公司, 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US17/293,052 priority Critical patent/US20240271269A1/en
Publication of WO2022217634A1 publication Critical patent/WO2022217634A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Definitions

  • the present application relates to a heating device, in particular to an evaporation device used as an evaporation source to heat and vaporize and deposit a coating material on the surface of a substrate or a workpiece.
  • the OLED display screen has the advantages of thinness, low power consumption, high contrast ratio, high color gamut, and can realize flexible display, which is the development trend of the next generation display.
  • OLED display includes PMOLED (passive matrix) display and AMOLED (active matrix) display, among which AMOLED display is realized by LTPS backplane + fine metal mask (FMM Mask) method, and oxide (Oxide) backplane + WOLED ( White Organic Light-Emtting Diode, White Organic Light Emitting Diode) + Color Film.
  • the former is mainly used in small-size panels, corresponding to mobile phones and mobile applications; the latter is mainly used in large-size panels, corresponding to applications such as monitors and TVs.
  • the method of LTPS backplane + fine metal mask has been initially mature and mass production has been achieved.
  • the countries and regions of OLED display technology and industry are mainly concentrated in Asia, and the OLED market has broad prospects.
  • the fine metal mask (FMM Mask) mode is to vaporize the OLED material on the LTPS backplane according to a predetermined procedure by vapor deposition, and use the patterns on the fine metal mask to form red, green and blue devices. Evaporation is carried out in a vacuum chamber.
  • a linear evaporation source is used in mass production.
  • a linear crucible is used for the crucible, which is heated by an external heating wire.
  • the evaporation source is located under the evaporation substrate, and fine metal is placed between the evaporation substrate and the evaporation source. mask.
  • the vapor deposition surface of the vapor deposition substrate faces down, and the fixed point is around the substrate.
  • the vapor deposition substrate has a large sag, and is aligned with the fine metal mask that is welded flat, resulting in easy misalignment of alignment and loose fitting. This leads to poor OLED color mixing, which seriously affects the yield.
  • the hardware (Finger) for fixing the vapor deposition substrate will be loose and dislocated as the production volume increases due to the weight of the substrate. Periodic position correction is required, resulting in a lot of manpower and waste of production capacity.
  • the purpose of the present invention is to provide a vapor deposition device to solve the problems of easy dislocation and poor bonding between the vapor deposition substrate and the fine metal mask, and the easy loosening and dislocation of the hardware fixing the substrate.
  • the present invention provides a vapor deposition device, comprising: a crucible body, which is a hollow plate and includes a cavity; a plurality of discharge pipes, which are evenly distributed on the bottom surface of the crucible body, and the nozzles at one end are connected to each other.
  • each crucible cylinder is arranged between two or more adjacent discharge pipes;
  • the crucible cylinder includes a cylinder opening, which is connected to the The cavity of the hollow plate; and a plurality of feeding ports, which are arranged on the top surface of the crucible body and communicate with the cavity, and each feeding port is arranged opposite to the barrel mouth of a crucible cylinder.
  • the crucible body is a flat plate; the ratio of the volume of the cavity to the volume of the crucible body is 0.7-0.95.
  • the discharge pipe is linear, and the central axis of the discharge pipe is perpendicular to the plane where the bottom surface of the hollow plate is located.
  • the distance between two adjacent discharge pipes is 10-40mm.
  • the vapor deposition device further comprises: a spray head, which is connected to the nozzle of the end of the discharge pipe facing the ground.
  • the ratio of the aperture of the spray head to the inner diameter at the mouth of the discharge pipe is less than 0.5; or the ratio of the aperture of the spray head to the inner diameter of the mouth of the discharge pipe is 1.
  • the crucible cylinder is a cylinder, and its height is less than or equal to the length of the discharge pipe.
  • the evaporation device further includes: an evaporation source, which is an electric heating wire, surrounding the crucible cylinder and/or the discharge pipe.
  • an evaporation source which is an electric heating wire, surrounding the crucible cylinder and/or the discharge pipe.
  • a plurality of discharge pipes and a plurality of crucible cylinders are arranged in a crucible matrix; the evaporation source, which is an electric heating wire, surrounds the crucible matrix.
  • the vapor deposition device further includes: a stage for placing a substrate; a fixing device, mounted on the edge of the stage, for fixing the substrate; and a mask plate, arranged above the substrate .
  • the technical effect of the present invention is to provide an evaporation device, the substrate is placed on a flat stage, the discharge pipe is arranged on the crucible body, the spray head faces the ground, and the evaporation source is located at the Above the substrate, a mask is placed between the substrate and the evaporation source, with the evaporation surface of the substrate facing upward.
  • the substrate is evaporated under the condition of zero sag, and the mask plate will not be pressed by the substrate, so as to improve the stability and service life of the mask plate.
  • the fixing device can be simple hardware, does not need to bear the weight of the substrate itself, is not easy to loosen or dislocate, and does not require frequent calibration. Therefore, the vapor deposition device can effectively improve the yield, increase the productivity, save manpower, improve the stability and lifespan of the fine mask, and have a qualitative improvement for the OLED industry.
  • FIG. 1 is a schematic structural diagram of an evaporation device provided in Embodiment 1 of the present application.
  • Example 2 is a schematic structural diagram of a crucible body provided in Example 1 of the present application.
  • FIG. 3 is a schematic structural diagram of the vapor deposition apparatus provided in Embodiment 2 of the present application.
  • FIG. 1 is a schematic structural diagram of an evaporation device provided in an embodiment of the application
  • FIG. 2 is a schematic structural diagram of a crucible body provided in an embodiment of the application.
  • the present embodiment provides an evaporation device 100a, which includes a crucible body 1, a plurality of discharge pipes 2, a plurality of crucible cylinders 3, a plurality of feeding ports 4, a shower head 5, a sealing cover 6, an evaporation
  • the plating source 7 , the stage 8 , the fixing device 9 and the mask plate 10 is not limited to a crucible body 1, a plurality of discharge pipes 2, a plurality of crucible cylinders 3, a plurality of feeding ports 4, a shower head 5, a sealing cover 6, an evaporation
  • the plating source 7 the stage 8 , the fixing device 9 and the mask plate 10 .
  • the crucible body 1 is a hollow plate, including a cavity 101 .
  • the crucible body 1 is a flat plate, and the ratio of the volume of the cavity 101 to the volume of the crucible body 1 is 0.7-0.95.
  • the height of the crucible body 1 is reduced and the evaporation device 100a is reduced.
  • the movement space of the evaporation material in the cavity 101 is reduced to prevent heat dissipation and ensure that the evaporation material can effectively form a film on a substrate 11 . .
  • a plurality of discharge pipes 2 are evenly distributed on the bottom surface of the crucible body 1, which is beneficial to the uniformity of subsequent film formation.
  • the nozzle 201 at one end of the discharge pipe 2 is connected to the cavity 101 , and the nozzle 201 at the other end faces the ground, so that the substrate 11 is disposed below the discharge port.
  • the discharge pipe 2 is linear, and the central axis of the discharge pipe 2 is perpendicular to the plane where the bottom surface of the hollow plate is located, so as to ensure that the direction of each discharge port is consistent.
  • the distance between the two adjacent discharge pipes 2 is 10-40 mm, so as to further ensure that any position on the substrate 11 can effectively form a film.
  • Each crucible cylinder 3 is disposed between two or more adjacent discharge pipes 2; the crucible cylinder 3 includes a cylinder opening 301, which is connected to the cavity 101 of the hollow plate.
  • the crucible barrel 3 is a cylinder, and its height is less than or equal to the length of the discharge pipe 2, so as to ensure that the material ejected from the discharge pipe 2 is not blocked by the crucible barrel 3 and improve the uniformity of film formation sex.
  • a plurality of feeding ports 4 are arranged on the top surface of the crucible body 1 and communicate with the cavity 101. Each feeding port 4 is arranged opposite to the barrel mouth 301 of a crucible barrel 3, which is convenient for adding materials. The feeding port 4 enters into the crucible barrel 3 and does not overflow from the crucible barrel 3 to the discharging pipe 2 .
  • the nozzle 5 is connected to the nozzle 201 of the end of the discharge pipe 2 facing the ground.
  • the ratio of the aperture of the nozzle 5 to the inner diameter of the nozzle 201 of the discharge pipe 2 is 1, that is, the nozzle 5 and the discharge pipe 2 can be an integral structure.
  • the one-piece structure is detachably mounted to the crucible body 1 , which facilitates cleaning and replacement of the spray head 5 and the discharge pipe 2 .
  • the spray head 5 is detachably installed at the nozzle 201 of the discharge pipe, so that the spray head 5 can also be cleaned and replaced.
  • the sealing cover 6 is detachably installed to the feed inlet 4 , and the size of the sealing cover 6 is consistent with the size of the feed inlet 4 .
  • the sealing cover 6 can be unscrewed to facilitate adding materials.
  • the sealing cover 6 can be tightened to ensure the sealing of the crucible body 1 and prevent the material to be evaporated from overflowing from the feeding port 4 .
  • the evaporation source 7 is used to heat the crucible barrel 3 .
  • a plurality of discharge pipes 2 and a plurality of crucible cylinders 3 are arranged in a crucible matrix; the evaporation source 7 is an electric heating wire, surrounding the crucible matrix.
  • the evaporation source 7 is a heating wire, which surrounds the crucible cylinder 3 or the discharge pipe 2 , or the heating wire surrounds the crucible cylinder 3 and the discharge pipe 2 .
  • the stage 8 is used for placing a substrate 11 .
  • the fixing device 9 is installed on the edge of the carrier 8 to fix the substrate 11 .
  • the mask 10 is disposed above the substrate 11 , and the mask 10 is a fine mask 10 (FMM).
  • This embodiment provides an evaporation device 100a, the substrate 11 is placed on a flat stage 8, the discharge pipe 2 is arranged on the crucible body 1, the spray head 5 faces the ground, and the evaporation source 7 is located above the substrate 11, and a mask 10 is placed between the substrate 11 and the evaporation source 7, and the evaporation surface of the substrate 11 faces upward.
  • the upward evaporation method of the traditional process is changed to the downward evaporation method, so that the substrate 11 can be evaporated under the condition of zero sag of the substrate 11 during the evaporation process, which is an effective improvement.
  • the problem of poor color mixing caused by the large sagging of the substrate 11 .
  • the vapor deposition device 100 a for downward vapor deposition can prevent the substrate 11 from pressing the mask plate 10 , so as to improve the stability and service life of the mask plate 10 .
  • the substrate 11 and the mask plate realize plane-to-plane alignment, and local alignment is not easy to dislocate, and the fitting is more closely.
  • the fixing device 9 in this embodiment can be simple hardware, does not need to bear the weight of the substrate 11 itself, is not easy to loosen or dislocate, and does not require frequent calibration.
  • the present embodiment provides an evaporation apparatus 100a, which can effectively improve yield, increase productivity, save manpower, improve the stability and lifespan of the fine mask 10, and have qualitative improvements to the OLED industry.
  • FIG. 3 is a schematic structural diagram of an evaporation device provided by an embodiment of the present application.
  • this embodiment provides an evaporation device 100b, which includes most of the technical features of Embodiment 1, and the difference lies in that the aperture of the nozzle 5 is different from the diameter of the nozzle 201 of the discharge pipe.
  • the ratio of the inner diameter is less than 0.5.
  • the ratio of the aperture of the nozzle 5 to the inner diameter of the nozzle 201 of the discharge pipe in this embodiment is less than 0.5, which can alleviate the impact of the discharge pipe 2 . pressure, thereby reducing the risk of clogging of the nozzle.
  • the height of the crucible barrel 3 is less than or equal to the height of the discharge pipe 2 to ensure that the material ejected from the discharge pipe 2 is not blocked by the crucible barrel 3, thereby further improving the uniformity of film formation sex. .
  • the technical effect of the present invention is to provide an evaporation device, the substrate is placed on a flat stage, the discharge pipe is arranged on the crucible body, the spray head faces the ground, and the evaporation source is located at the Above the substrate, a mask is placed between the substrate and the evaporation source, with the evaporation surface of the substrate facing upward.
  • the substrate is evaporated under the condition of zero sag, and the mask plate will not be pressed by the substrate, so as to improve the stability and service life of the mask plate.
  • the fixing device can be simple hardware, does not need to bear the weight of the substrate itself, is not easy to loosen or dislocate, and does not require frequent calibration. Therefore, the vapor deposition device can effectively improve the yield, increase the productivity, save manpower, improve the stability and lifespan of the fine mask, and have a qualitative improvement for the OLED industry.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

公开一种蒸镀装置，包括坩埚本体；多个出料管均匀分布于坩埚本体的底面，其一端的管口连通至腔体，其另一端的管口朝向地面；多个坩埚筒，每一坩埚筒设置于两个以上相邻的出料管之间；坩埚筒包括一筒口，连通至坩埚本体的中空板的腔体；以及多个入料口设于坩埚本体的顶面，连通至腔体，每一入料口与一坩埚筒的筒口相对设置。

Description

蒸镀装置 技术领域
本申请涉及一种加热装置，具体涉及一种作为蒸镀源来加热使镀膜材料气化沉积在基体或工件表面的蒸镀装置。
 背景技术
目前，市场上广泛使用的屏幕包括液晶显示（Liquid Crystal Display，LCD）和OLED显示，而OLED显示主要应用于小尺寸面板。OLED显示的屏幕与液晶显示的屏幕相比，其显示具有轻薄，低功耗，高对比度，高色域，可以实现柔性显示等优点，是下一代显示器的发展趋势。
OLED显示包括PMOLED（被动矩阵）显示和AMOLED（有源矩阵）显示，其中AMOLED显示的实现方式有LTPS背板+精细金属掩模(FMM Mask)方式，和氧化物（Oxide）背板+WOLED（White Organic Light-Emtting Diode，白光有机发光二极管）+彩膜的方式。前者主要应用于小尺寸面板，对应手机和移动应用；后者主要应用于大尺寸面板，对应显示屏（Monitor）和电视等应用。现在LTPS背板+精细金属掩模的方式已经初步成熟，实现了量产。OLED显示技术和产业的国家和地区主要集中在亚洲，OLED市场前景广阔。
精细金属掩模(FMM Mask)模式，是通过蒸镀方式将OLED材料按照预定程序蒸镀到LTPS背板上，利用精细金属掩模板上的图形，形成红绿蓝器件。蒸镀是在真空腔体中进行，量产中使用线性蒸发源，坩埚使用线性坩埚，外部加热丝对其进行加热，蒸发源位于蒸镀基板下方，蒸镀基板与蒸发源之间放置精细金属掩模板。蒸镀基板蒸镀面朝下，固定点位为基板四周，蒸镀基板具有较大的下垂量，与焊接平整的精细金属掩模板对位，导致出现对位易错位、贴合不紧密现象，导致产生OLED 混色不良，严重影响良率。另外，固定蒸镀基板的硬件（Finger）因承担基板重量随着生产量增加会松动、错位，需要定期进行位置校正，产生大量人力、产能浪费。
 技术问题
本发明的目的在于，提供一种蒸镀装置，以解决蒸镀基板与精细金属掩模板对位易错位、贴合不紧密的问题，以及固定基板的硬件容易松动、错位等技术问题。
 技术解决方案
为实现上述目的，本发明提供一种蒸镀装置，包括：坩埚本体，其为中空板，包括腔体；多个出料管，均匀分布于所述坩埚本体的底面，其一端的管口连通至所述腔体，其另一端的管口朝向地面；多个坩埚筒，每一坩埚筒设置于两个以上相邻的出料管之间；所述坩埚筒包括一筒口，连通至所述中空板的腔体；以及多个入料口，设于所述坩埚本体的顶面，连通至所述腔体，每一入料口与一坩埚筒的筒口相对设置。
进一步地，所述坩埚本体为扁平状的板；所述腔体的容积与所述坩埚本体的体积的比值为0.7-0.95。
进一步地，所述出料管为直线形，所述出料管的中轴线垂直于所述中空板的底面所处平面。
进一步地，相邻两根所述出料管的距离为10-40mm。
进一步地，所述的蒸镀装置还包括：喷头，连通至所述出料管朝向地面一端的管口。
进一步地，所述喷头的孔径与所述出料管的管口处的内径的比值小于0.5；或者所述喷头的孔径与所述出料管的管口处的内径的比值为1。
进一步地，所述坩埚筒为柱体，其高度小于或等于所述出料管的长度。
进一步地，所述的蒸镀装置还包括：蒸镀源，其为电热丝，围绕所述坩埚筒和/或所述出料管。
进一步地，多个出料管及多个坩埚筒排列成坩埚矩阵；蒸镀源，其为电热丝，围绕所述坩埚矩阵。
进一步地，所述的蒸镀装置还包括：载台，用以放置一基板；固定装置，安装在所述载台的边缘，用以固定所述基板；以及掩模板，设于所述基板上方。
 有益效果
本发明的技术效果在于，提供一种蒸镀装置，所述基板被放置在平整的载台上，所述出料管设置在所述坩埚本体上，所述喷头朝向地面，蒸镀源位于所述基板上方，在所述基板和蒸镀源之间放置掩模板，所述基板的蒸镀面朝上。所述基板在零下垂量的条件下进行蒸镀，所述掩模板不会受到所述基板挤压，以提高所述掩模板的稳定性和使用寿命。所述固定装置可以为简单的硬件，无需承受所述基板自身的重量，不易松动、错位，且不需要频繁校正。因此，所述蒸镀装置，可能够有效提高良率、提高产能、节约人力，提高精细掩模板的稳定性和寿命，对OLED行业具有质的改善。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例1提供的蒸镀装置的结构示意图；
图2为本申请实施例1提供的坩埚本体的结构示意图；
图3是本申请实施例2提供的蒸镀装置的结构示意图。
附图标记说明：
100a、100b蒸镀装置；
1、坩埚本体；            2、出料管；
3、坩埚筒；              4、入料口；
5、喷头；                6、密封盖；
7、蒸镀源；              8、载台；
9、固定装置；            10、掩模板；
11、基板；               101、腔体；
201、管口；              301、筒口。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请的描述中，需要理解的是，“多个”的含义是两个或两个以上，除非另有明确具体的限定。术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
实施例1
图1为本申请实施例提供的蒸镀装置的结构示意图；图2为本申请实施例提供的坩埚本体的结构示意图。
如图1所示，本实施例提供一种蒸镀装置100a，包括坩埚本体1、多个出料管2、多个坩埚筒3、多个入料口4、喷头5、密封盖6、蒸镀源7、载台8、固定装置9以及掩模板10。
所述坩埚本体1为中空板，包括腔体101。其中，所述坩埚本体1为扁平状的板，所述腔体101的容积与所述坩埚本体1的体积的比值为0.7-0.95，一方面，降低坩埚本体1的高度，减少蒸镀装置100a的占用空间；另一方面，在蒸镀的过程中，减少蒸镀材料在腔体101的运动空间，以防止热量的散发，确保蒸镀材料在一基板11上有效成膜。。
多个出料管2均匀分布于所述坩埚本体1的底面，这样有利于后续成膜的均一性。所述出料管2一端的管口201连通至所述腔体101，其另一端的管口201朝向地面，以使基板11设置在所述出料口的下方。所述出料管2为直线形，所述出料管2的中轴线垂直于所述中空板的底面所处平面，以确保每一出料口的方向一致。相邻两根所述出料管2的距离为10-40mm，以进一步确保基板11上的任一处位置都能有效成膜。
每一坩埚筒3设置于两个以上相邻的出料管2之间；所述坩埚筒3包括一筒口301，连通至所述中空板的腔体101。所述坩埚筒3为柱体，其高度小于或等于所述出料管2的长度，从而确保从所述出料管2喷出的材料不被所述坩埚筒3阻挡，提高成膜的均匀性。
多个入料口4设于所述坩埚本体1的顶面，连通至所述腔体101，每一入料口4与一坩埚筒3的筒口301相对设置，便于添加材料，材料可以直接从所述入料口4进入至所述坩埚筒3内，且不会从所述坩埚筒3溢出至所述出料管2。
所述喷头5连通至所述出料管2朝向地面一端的管口201。在本实施例中，所述喷头5的孔径与所述出料管2的管口201处的内径的比值为1，即所述喷头5与所述出料管2可以为一体式结构，该一体式结构可拆卸式地安装至所述坩埚本体1，便于清洗和更换所述喷头5和所述出料管2。在其他实施例中，所述喷头5可拆卸式安装至所述出料管的管口201处，这样也可以清洗和更换所述喷头5。
所述密封盖6可拆卸式安装至所述入料口4，所述密封盖6的尺寸与所述入料口4的尺寸一致。在添加材料时，可以拧开所述密封盖6，便于添加材料。在蒸镀时，可以拧紧所述密封盖6，以确保所述坩埚本体1的密封性，防止被蒸镀的材料从所述入料口4中溢出去。
所述蒸镀源7用以加热所述坩埚筒3。多个出料管2及多个坩埚筒3排列成坩埚矩阵；所述蒸镀源7为电热丝，围绕所述坩埚矩阵。在其他实施例中，蒸镀源7为电热丝，围绕所述坩埚筒3或者所述出料管2，或者所述电热丝围绕所述坩埚筒3和所述出料管2。
所述载台8用以放置一基板11。所述固定装置9安装在所述载台8的边缘，用以固定所述基板11。所述掩模板10设于所述基板11上方，该掩模板10为精细掩模板10（FMM）。
本实施例提供一种蒸镀装置100a，所述基板11被放置在平整的载台8上，所述出料管2设置在所述坩埚本体1上，所述喷头5朝向地面，蒸镀源7位于所述基板11上方，在所述基板11和蒸镀源7之间放置掩模板10，所述基板11的蒸镀面朝上。
与现有技术相比，将传统工艺向上蒸镀的方式改为向下蒸镀的方式，使得所述基板11在蒸镀过程中能够在基板11零下垂量的条件下进行蒸镀，有效改善所述基板11下垂量大导致的混色不良的问题。向下蒸镀的蒸镀装置100a，可以使得所述基板11不会挤压所述掩模板10，以提高所述掩模板10的稳定性和使用寿命。在对位过程中，所述基板11与所述掩膜板实现平面对平面的对位，局部对位不易错位且贴合更加紧密。本实施例的所述固定装置9可以为简单的硬件，无需承受所述基板11自身的重量，不易松动、错位，且不需要频繁校正。
因此，本实施例提供一种蒸镀装置100a，可能够有效提高良率、提高产能、节约人力，提高精细掩模板10的稳定性和寿命，对OLED行业具有质的改善。
实施例2
图3为本申请实施例提供的蒸镀装置的结构示意图。
如图3所示，本实施例提供一种蒸镀装置100b，其包括实施例1的大部分技术特征，其区别在于，所述喷头5的孔径与所述出料管的管口201处的内径的比值小于0.5。
需要说明的是，参照图1，实施例1的所述喷头5的孔径与所述出料管的管口201处的内径的比值为1时，所述坩埚本体1的气流量较大，所述出料管2所受到的压力较大，所述喷头5无法及时将材料喷出，从而容易导致所述喷嘴堵塞。
与实施例1相比，请继续参照图3，本实施例的喷头5的孔径与所述出料管的管口201处的内径的比值小于0.5，可以缓解所述出料管2所受到的压力，从而降低所述喷嘴堵塞的风险。另外，所述坩埚筒3的高度小于或等于所述出料管2的高度，以确保从所述出料管2喷出的材料不被所述坩埚筒3阻挡，进一步地提高成膜的均匀性。。
本发明的技术效果在于，提供一种蒸镀装置，所述基板被放置在平整的载台上，所述出料管设置在所述坩埚本体上，所述喷头朝向地面，蒸镀源位于所述基板上方，在所述基板和蒸镀源之间放置掩模板，所述基板的蒸镀面朝上。所述基板在零下垂量的条件下进行蒸镀，所述掩模板不会受到所述基板挤压，以提高所述掩模板的稳定性和使用寿命。所述固定装置可以为简单的硬件，无需承受所述基板自身的重量，不易松动、错位，且不需要频繁校正。因此，所述蒸镀装置，可能够有效提高良率、提高产能、节约人力，提高精细掩模板的稳定性和寿命，对OLED行业具有质的改善。
以上对本申请实施例所提供的一种蒸镀装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (10)

  1. 一种蒸镀装置，其中，包括：
    坩埚本体，其为中空板，包括腔体；
    多个出料管，均匀分布于所述坩埚本体的底面，其一端的管口连通至所述腔体，其另一端的管口朝向地面；
    多个坩埚筒，每一坩埚筒设置于两个以上相邻的出料管之间；所述坩埚筒包括一筒口，连通至所述中空板的腔体；以及
    多个入料口，设于所述坩埚本体的顶面，连通至所述腔体，每一入料口与一坩埚筒的筒口相对设置。
  2. 根据权利要求1所述的蒸镀装置，其中，
    所述坩埚本体为扁平状的板；
    所述腔体的容积与所述坩埚本体的体积的比值为0.7-0.95。
  3. 根据权利要求1所述的蒸镀装置，其中，
    所述出料管为直线形，
    所述出料管的中轴线垂直于所述中空板的底面所处平面。
  4. 根据权利要求1所述的蒸镀装置，其中，
    相邻两根所述出料管的距离为10-40mm。
  5. 根据权利要求1所述的蒸镀装置，其中，还包括：
    喷头，连通至所述出料管朝向地面一端的管口。
  6. 根据权利要求5所述的蒸镀装置，其中，
    所述喷头的孔径与所述出料管的管口处的内径的比值小于0.5；或者
    所述喷头的孔径与所述出料管的管口处的内径的比值为1。
  7. 根据权利要求1所述的蒸镀装置，其中，
    所述坩埚筒为柱体，其高度小于或等于所述出料管的长度。
  8. 根据权利要求1所述的蒸镀装置，其中，还包括：
    蒸镀源，其为电热丝，围绕所述坩埚筒和/或所述出料管。
  9. 根据权利要求1所述的蒸镀装置，其中，
    多个出料管及多个坩埚筒排列成坩埚矩阵；
    蒸镀源，其为电热丝，围绕所述坩埚矩阵。
  10. 根据权利要求1所述的蒸镀装置，其中，还包括：
    载台，用以放置一基板；
    固定装置，安装在所述载台的边缘，用以固定所述基板；以及
    掩模板，设于所述基板上方。
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