WO2022213698A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2022213698A1
WO2022213698A1 PCT/CN2022/071405 CN2022071405W WO2022213698A1 WO 2022213698 A1 WO2022213698 A1 WO 2022213698A1 CN 2022071405 W CN2022071405 W CN 2022071405W WO 2022213698 A1 WO2022213698 A1 WO 2022213698A1
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WO
WIPO (PCT)
Prior art keywords
antenna
middle frame
electronic device
metal part
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/071405
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English (en)
French (fr)
Inventor
霍国亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Publication of WO2022213698A1 publication Critical patent/WO2022213698A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to an electronic device.
  • the metal parts in the middle frame are used as antennas to receive and transmit signals, but with the continuous improvement of the overall appearance competitiveness of electronic equipment, the design of the narrow middle frame has become the mainstream.
  • the metal part in the narrow middle frame has a small volume, and when the metal part is used as an antenna, the radiator and the radiating area of the antenna are too small, resulting in poor radiated signal strength of the electronic device.
  • the present application relates to an electronic device, which aims to improve the strength of the radiated signal of the electronic device.
  • the application provides an electronic device, the electronic device includes:
  • the antenna includes an antenna part arranged on the surface of the middle frame and a metal part part arranged on the middle frame, and the metal part is electrically connected to the circuit board, or the The antenna part is electrically connected to the circuit board, or the metal part and the antenna part are both electrically connected to the circuit board, so as to enhance the radiation intensity of the signal;
  • the metal part also serves as a support of the middle frame to improve the strength of the middle frame
  • the surface of the middle frame is provided with a groove, and the antenna part is arranged in the groove, so as to enhance the radiation intensity of the antenna part arranged on the middle frame under the condition that the thickness of the middle frame remains unchanged ;
  • the middle frame has an inner surface and an outer surface
  • the antenna part includes a first antenna and a second antenna
  • the first antenna and the second antenna are used for radiating signals
  • the first antenna is arranged on the The inner surface
  • the second antenna is arranged on the outer surface
  • the first antenna, the second antenna and the metal part are not connected, so that the three are used as antennas alone to radiate signals, or the first antenna, the second antenna and the metal part are not connected.
  • An antenna, the second antenna and the metal part are electrically connected to enhance the length of the antenna.
  • the antenna part is a metal antenna, and the antenna part is electrically connected to the metal part.
  • the antenna used for radiating signals in this application includes the antenna part arranged on the surface of the middle frame and the main antenna formed by the metal part, so as to Boost the radiant intensity of the signal.
  • the metal part is arranged inside the middle frame, and the antenna part is arranged on the surface of the middle frame.
  • the surface of the middle frame includes an inner surface and an outer surface, the first antenna is arranged on the inner surface, the first antenna is electrically connected with the metal part, and the intensity of the radiated signal of the electronic device is increased by arranging the first antenna; the second antenna is arranged on the outer surface. On the surface, the second antenna is connected with the metal part, and the intensity of the radiated signal of the electronic device is increased by arranging the second antenna.
  • the second antenna is arranged on the outer surface of the middle frame, so that the second antenna is far away from the electronic device in the electronic device, and the influence of the electronic device on the radiated signal of the second antenna is reduced.
  • the present application further enhances the strength of the radiated signal of the electronic device by arranging the first antenna and the second antenna.
  • the first antenna and the second antenna are arranged in the corresponding grooves.
  • the groove By arranging the groove on the middle frame, in the case of adding the first antenna and the second antenna to the electronic device, there is no need to increase the thickness, width or length of the electronic device.
  • the inner surface of the middle frame is the surface on which the middle frame is arranged inside the electronic device
  • the outer surface of the middle frame is the surface where the middle frame is arranged outside the electronic device, which is the appearance surface of the middle frame.
  • the electronic device further includes a back cover connected to the middle frame;
  • a gap is provided between the middle frame and the back cover, and the first antenna is arranged in the gap.
  • a gap is set between the two, and the gap is used for setting the first antenna, and the gap can be the space reserved for setting the first antenna when the middle frame and the back cover are connected, It can also be the installation error between the middle frame and the rear cover when the two are installed, that is, a gap is formed between the two.
  • a plurality of the first antennas are provided, and the plurality of first antennas are distributed on the inner surface and are electrically connected to the metal part;
  • connection between the first antenna and the metal part may be in one area, that is, one first antenna is provided, one end of the first antenna is electrically connected to one end of the metal part, and the connection between the first antenna and the metal part is There may also be multiple areas, that is, multiple first antennas are provided, and multiple first antennas are distributed on the inner surface and are all electrically connected to the metal piece.
  • the plurality of first antennas can be enclosed in a ring structure along the inner surface, so as to increase the radiation area of the first antennas, thereby improving the radiation signal of the electronic device.
  • the first antenna and the middle frame are connected by welding, printing or electroless plating.
  • the first antenna may be disposed on the inner surface of the middle frame by welding.
  • metal such as copper foil, copper sheet, and steel sheet may be used for welding on the middle frame, and the metal welded on the middle frame may be used.
  • a first antenna is formed.
  • the first antenna can be arranged on the inner surface of the middle frame by printing, specifically, metal such as silver paste, copper paste, gold paste, etc. can be printed on the middle frame, and the metal printed on the middle frame forms the first antenna .
  • the first antenna can be disposed on the inner surface of the middle frame by means of electroless plating. Specifically, metal ions in the plating solution can be reduced to metal by means of a suitable reducing agent under the condition of no applied current, and deposited on the middle frame. On the surface, the metal plated on the middle frame forms the first antenna.
  • the outer surface is provided with a coating
  • the second antenna is located inside the coating
  • the outer surface of the middle frame is provided with a coating
  • the second antenna is arranged under the coating, so as to maintain the integrity and flatness of the appearance of the middle frame, and reduce the unevenness of unevenness after the second antenna is installed on the outer surface of the middle frame. the risk of Qi phenomenon.
  • a plurality of the second antennas are provided, and the plurality of the second antennas are distributed on the outer surface and are electrically connected to the metal part;
  • connection between the second antenna and the metal part may be one area, that is, the second antenna is set to one, one end of the second antenna is electrically connected to one end of the metal part, and the connection between the second antenna and the metal part is There may also be multiple areas, that is, multiple second antennas are provided, and multiple second antennas are distributed on the outer surface and are electrically connected to the metal part.
  • the radiation area of the second antenna is to improve the radiated signal of the electronic equipment.
  • the second antenna and the middle frame are connected by printing and electroless plating.
  • the second antenna may be arranged on the outer surface of the middle frame by printing, specifically, silver paste, copper paste, gold paste and other metals may be used to print on the middle frame, and the metal printed on the middle frame A second antenna is formed.
  • the second antenna can be disposed on the outer surface of the middle frame by means of electroless plating. Specifically, metal ions in the plating solution can be reduced to metal by means of a suitable reducing agent without an applied current, and deposited on the middle frame. On the surface, the metal plated on the middle frame forms the second antenna.
  • the middle frame further includes a body portion, and the body portion is made of plastic material;
  • the body part wraps at least part of the metal part, and at least part of the metal part protrudes from the body part and is electrically connected to the antenna part.
  • the body part is made of plastic material, and the metal part not only serves as the antenna of the electronic device, but also serves as a support of the middle frame to support the middle frame, improve the strength of the middle frame, and further improve the impact resistance of the electronic device.
  • FIG. 1 is a schematic structural diagram of an electronic device in an embodiment of the prior art
  • FIG. 2 is a schematic structural diagram of an electronic device provided by the application in an embodiment
  • FIG. 3 is a schematic structural diagram of the electronic device in FIG. 2 with the second antenna removed;
  • FIG. 4 is a schematic structural diagram of the electronic device in FIG. 2 with the first antenna removed;
  • FIG. 5 is a schematic structural diagram of the electronic device in FIG. 2 with the antenna removed.
  • 1-electronic equipment 11-middle frame, 111-metal part, 112-inner surface, 113-outer surface, 114-groove, 115-body part, 12-antenna part, 121-first antenna, 122-th Two antennas, 13-back cover, 14-clearance.
  • the electronic device 1 ′ includes a middle frame 11 ′ and a circuit board.
  • the middle frame 11 ′ is provided with a body portion 115 ′ and a metal portion 112 ′, and the body portion 115 ′ wraps the metal portion 112 ′.
  • the material is plastic.
  • At least a part of the metal part 112 ′ penetrates through the body part 115 ′ and is connected to a circuit board, and the circuit board is electrically connected to the components in the electronic device 1 ′.
  • the metal part 112 ′ is the antenna of the electronic device 1 ′, and the signal of the electronic device 1 ′ is transmitted through the antenna. The signal is transmitted from the circuit board to the antenna, and then radiated to the space through the antenna.
  • the middle frame 11 ′ As the thickness of the electronic device 1 ′ is gradually reduced, the middle frame 11 ′ is continuously narrowed.
  • the metal part 112 ′ is used as an antenna, the radiation volume of the antenna provided in the middle frame 11 ′ is continuously reduced, thereby making the radiation of the antenna decrease continuously.
  • the area is continuously reduced, which reduces the performance of the antenna and makes the signal transmitted by the antenna weaker.
  • the middle frame 11' is made of metal.
  • this embodiment provides an electronic device 1, which can be a mobile phone, a tablet computer, a notebook computer, an e-book reader, a game console, an artificial intelligence device, a wearable device, or a vehicle-mounted device. , smart home equipment and/or smart city equipment, and the specific types of the electronic equipment 1 are not particularly limited in this embodiment of the present application.
  • the electronic device 1 includes a middle frame 11 , a circuit board and an antenna, the circuit board is mounted on the middle frame 11 , and the antenna includes an antenna part 12 arranged on the surface of the middle frame 11 and a metal part 111 arranged on the middle frame 11 .
  • the part 111 is electrically connected to the circuit board, or the antenna part 12 is electrically connected to the circuit board, or the metal part 111 and the antenna part 12 are both electrically connected to the circuit board;
  • the middle frame 11 has an inner surface 112 and an outer surface 113, and the antenna part 12 includes The first antenna 121 and the second antenna 122, the first antenna 121 is disposed on the inner surface 112, the second antenna 122 is disposed on the outer surface 113, the first antenna 121, the second antenna 122 and the metal part 111 are electrically connected.
  • the middle frame 11 further includes a body portion 115 , the body portion 115 is made of plastic material, the body portion 115 wraps at least part of the metal part 111 , and at least part of the metal part 111 protrudes from the body part 115 and is electrically connected to the antenna part 12 .
  • the metal part 111 also serves as a support for the middle frame 11 to support the middle frame 11 , improve the strength of the middle frame 11 , and further improve the impact resistance of the electronic device 1 .
  • the material of the metal part 111 can be aluminum, copper, aluminum alloy, copper alloy, or the like.
  • the manufacturing method of the middle frame 11 is as follows: the metal part 111 is placed in an injection mold for injection molding to form the middle frame 11 .
  • the antenna part 12 is a metal antenna, and the antenna part 12 is electrically connected to the metal part 111.
  • the antenna used for radiating signals in this embodiment includes the antenna part 12 and the metal part 111, so as to enhance the signal radiation intensity.
  • the metal part 111 is arranged inside the middle frame 11, the antenna part 12 is arranged on the surface of the middle frame 11, and the structure of the middle frame 11 is fully utilized. Radiation intensity of the antenna portion 12 .
  • the antenna part 12, the metal part 111 and the circuit board can be connected in the following way: the metal part 111 can be electrically connected to the circuit board, so that the antenna part 12 can be electrically connected to the circuit board through the metal part 111, and the circuit board is connected to the electronic device.
  • the antenna part 12 can be connected with the circuit
  • the board is connected, so that the metal part 111 can be electrically connected with the circuit board through the antenna part 12, and the circuit board is electrically connected with the electronic device, so that the signal generated by the electronic device is radiated outward from the antenna part 12 and the metal part 111, and the The signals received by the antenna part 12 and the metal part 111 are transmitted to the electronic device; alternatively, both the metal part 111 and the antenna part 12 are electrically connected with a circuit board, and the circuit board is electrically connected with the electronic device, so that the signal generated by the electronic device is The antenna part 12 and the metal part 111 radiate outward, and transmit the signals received by the antenna part 12 and the metal part 111 to the electronic device.
  • the circuit board is electrically connected to the metal part 111 and/or the antenna part 12, so that the circuits are connected to ensure the smoothness of the circuit, reduce power loss and improve the quality of power supply, thereby improving the stability of the signal transmission of the electronic device 1.
  • the material of the antenna part 12 can be a metal with conductive properties such as silver, copper, gold, steel, etc.
  • the antenna part 12, the metal part 111 and the circuit board can be directly electrically connected, or can be electrically connected through a connecting part.
  • the connecting piece can be an elastic piece, a fixing piece and the like.
  • the metal part 111 or/and the antenna part 12 can be electrically connected to the circuit board through an elastic part
  • the elastic part can be an elastic piece
  • one end of the elastic part can be connected to the circuit board, and the other end is connected to the metal part 111 or/and The antenna portion 12 abuts.
  • the surface of the middle frame 11 includes an inner surface 112 and an outer surface 113 , the first antenna 121 is arranged on the inner surface 112 , the first antenna 121 is electrically connected with the metal part 111 , and the radiation signal of the electronic device 1 is increased by arranging the first antenna 121
  • the second antenna 122 is arranged on the outer surface 113, the second antenna 122 is connected with the metal part 111, and the strength of the radiated signal of the electronic device 1 is increased by setting the second antenna 122.
  • the second antenna 122 is disposed on the outer surface of the middle frame 11 , so that the second antenna 122 is far away from the electronic device in the electronic device 1 , and the influence of the electronic device 1 on the radiated signal of the second antenna 122 is reduced.
  • the present embodiment further enhances the electronic device by arranging the first antenna 121 and the second antenna 122 1 The strength of the radiated signal.
  • the inner surface 112 of the middle frame 11 is the surface of the middle frame 11 disposed inside the electronic device 1
  • the outer surface of the middle frame 11 is the surface of the middle frame 11 disposed outside the electronic device, which is the appearance surface of the middle frame 11 .
  • the electronic device 1 further includes a back cover 13 , the back cover 13 is connected to the middle frame 11 , a gap 14 is provided between the middle frame 11 and the back cover 13 , and the first antenna 121 is arranged on the The gap 14 .
  • a gap 14 is set between them, and the gap 14 is used to set the first antenna 121 .
  • the gap reserved for the first antenna 121 may also be an installation error between the middle frame 11 and the rear cover 13 when they are installed, that is, a gap 14 is formed between the two. It can be set according to the radiation volume of the first antenna 121 required by the electronic device 1.
  • the first antenna 121 has a larger volume and occupies a larger space, there will be space between the middle frame 11 and the back cover 13 when the two are installed. If the volume of the first antenna 121 is small and the space occupied is small, the gap 14 is the gap 14 caused by the installation error of the first antenna 121 between the middle frame 11 and the back cover 13 .
  • the inner surface 112 of the middle frame 11 may be provided with a groove 114 , the first antenna 121 is disposed in the groove 114 , and at least part of the first antenna 121 is electrically connected to the metal part 111 through the sidewall of the groove 114 .
  • the back cover 13 and the middle frame 11 are connected by an adhesive, and the adhesive can be back glue.
  • the connection between the first antenna 121 and the metal part 111 may be an area, that is, one first antenna 121 is provided, and one end of the first antenna 121 is electrically connected to one end of the metal part 111,
  • the connection between the first antenna 121 and the metal part 111 can also be in multiple areas, that is, there are multiple first antennas 121, and the multiple first antennas 121 are distributed on the inner surface 112 and are all electrically connected to the metal part 111.
  • the radiation signal of the electronic device 1 is further improved.
  • the first antenna 121 and the middle frame 11 are connected by welding, printing or electroless plating.
  • the first antenna 121 may be disposed on the inner surface 112 of the middle frame 11 by welding.
  • the metal on the middle frame 11 forms the first antenna 121 .
  • the first antenna 121 can be arranged on the inner surface 112 of the middle frame 11 by printing. Specifically, it can be printed on the middle frame 11 by using metals such as silver paste, copper The metal forms the first antenna 121 .
  • the first antenna 121 may be disposed on the inner surface 112 of the middle frame 11 by means of electroless plating.
  • the metal ions in the plating solution are reduced to metal by means of a suitable reducing agent, and deposited On the surface of the middle frame 11 , the metal plated on the middle frame 11 forms the first antenna 121 .
  • the first antenna 121 and the metal part 111 can be connected by a laser engraving process, and the surface of the metal part 111 can be processed by laser engraving to form a molten state to be connected with the first antenna 121; or the first antenna 121 Conductive glue can also be used to connect with the metal part 111 .
  • the outer surface 113 is provided with a coating, and the second antenna 122 is located inside the coating.
  • the outer surface 113 of the middle frame 11 is provided with a coating, and the second antenna 122 is arranged under the coating, so as to maintain the integrity and flatness of the appearance of the middle frame 11 and reduce the number of installations on the outer surface 113 of the middle frame 11 There is a risk of unevenness after the second antenna 122 .
  • the outer surface 113 may be provided with a groove 114, the second antenna 122 is disposed in the groove 114, and at least part of the second antenna 122 is connected to the metal part 111 through the groove 114.
  • connection between the second antenna 122 and the metal part 111 may be one area, that is, one second antenna 122 is provided, and one end of the second antenna 122 is electrically connected to one end of the metal part 111,
  • the connection between the second antenna 122 and the metal part 111 can also be in multiple areas, that is, there are multiple second antennas 122 , and the plurality of second antennas 122 are distributed on the outer surface 113 and are electrically connected to the metal part 111 to The radiation area of the second antenna 122 is increased to improve the radiation signal of the electronic device 1 .
  • the second antenna 122 and the middle frame 11 are connected by printing and electroless plating.
  • the second antenna 122 can be arranged on the outer surface 113 of the middle frame 11 by printing. Specifically, it can be printed on the middle frame 11 by using metals such as silver paste, copper paste, gold paste, etc.
  • the metal on the middle frame 11 forms the second antenna 122 .
  • the second antenna 122 may be disposed on the outer surface 113 of the middle frame 11 by means of electroless plating. Specifically, in the absence of an applied current, the metal ions in the plating solution are reduced to metal by means of a suitable reducing agent, and deposited On the surface of the middle frame 11 , the metal plated on the middle frame 11 forms the second antenna 122 .
  • the second antenna 122 and the metal part 111 can be connected by a laser engraving process, and the surface of the metal part 111 can be processed by laser engraving to form a molten state to connect with the second antenna 122; or the second antenna 122 Conductive glue can also be used to connect with the metal part 111 .
  • the first antenna 121 and the second antenna 122 can be used independently, that is, the inner surface 112 of the middle frame 11 is provided with the first antenna 121 or the outer surface 113 of the middle frame 11 is provided with the second antenna 122, the first The antenna 121 or the second antenna 122 is electrically connected to the metal part 111; the first antenna 121 and the second antenna 122 can also be used simultaneously.
  • the surface of the middle frame 11 is provided with a groove 114 , and the antenna portion 12 is provided in the groove 114 .
  • the inner surface 112 and the outer surface 113 of the middle frame 11 are both provided with grooves 114 , and the first antenna 121 and the second antenna 122 are provided in the corresponding grooves 114 .

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Abstract

本申请涉及电子设备技术领域，尤其涉及一种电子设备。电子设备包括：中框；电路板，安装于中框；天线，天线包括设置于中框表面的天线部分以及设置于中框的金属件部分，金属件部分与电路板电连接，或天线部分与电路板电连接，或金属件部分与天线部分均与电路板电连接；其中，中框具有内表面和外表面，天线部分包括第一天线和第二天线，第一天线设置于内表面，第二天线设置于外表面，第一天线、第二天线和金属件部分电连接。

Description

一种电子设备 技术领域
本申请涉及电子设备技术领域，尤其涉及一种电子设备。
背景技术
随着电子设备的发展，天线信号性能的提升变得越来越重要。现有技术中，中框中的金属件作为天线来接收和发射信号，但随着电子设备整机外观竞争力的不断提升，窄中框的设计成为主流。但是，窄中框中金属件的体积较小，该金属件作为天线时导致天线的辐射体和辐射面积均过小，从而导致电子设备的辐射信号强度较差。
申请内容
本申请涉及一种电子设备，旨在提高电子设备辐射信号的强度。
本申请提供了一种电子设备，所述电子设备包括：
中框；
电路板，安装于所述中框；
天线，用于辐射信号，所述天线包括设置于所述中框表面的天线部分以及设置于所述中框的金属件部分，且所述金属件部分与所述电路板电连接，或所述天线部分与所述电路板电连接，或所述金属部分与所述天线部分均和所述电路板电连接，以增强信号的辐射强度；
所述金属件部分还作为所述中框的支撑件，用于提高所述中框的强度；
所述中框的表面设有凹槽，所述天线部分设置于所述凹槽，以在所述中框厚度的不变情况下，增强所述中框上设置的所述天线部分的辐射强度；
其中，所述中框具有内表面和外表面，所述天线部分包括第一天线和第二天线，所述第一天线和所述第二天线用于辐射信号，所述第一天线设置于所述内表面，所述第二天线设置于所述外表面，所述第一天线、所述第二天线和所述金属件部分无连接，以使三者单独作为天线辐射信号，或者所述第一天线、所述第二天线和所述金属件部分电连接，以增强所述天线的长度。
本申请中，天线部分为金属天线，天线部分与金属件部分电连接，此时，该申请中用于辐射信号的天线包括设置于中框表面的天线部分以及金属件部分构成的主天线，从而增强信号的辐射强度。金属件部分设置在中框的内部，天线部分设置在中框的表面，充分利用中框的结构，在减小中框厚度的情况下，能够增加中框上设置的天线的辐射强度。中框的表面包括内表面和外表面，第一天线设置于内表面，第一天线与金属件部分电连接，通过设置该第一天线增加电子设备的辐射信号的强度；第二天线设置于外表面，第二天线与金属件部分连接，通过设置该第二天线增加了电子设备的辐射信号的强度。并且，该第二天线设置在中框的外表面，使第二天线远离电子设备中的电子器件，减小电子器件对第二天线辐射信号的影响。相比于中框的内表面设 有第一天线或中框的外表面设有第二天线，本申请通过设置第一天线和第二天线进一步增强了电子设备辐射信号的强度。
第一天线和第二天线设置在对应的凹槽内。通过在中框上设置凹槽，在电子设备增加第一天线和第二天线的情况下，无需增加电子设备的厚度或宽度或长度。
需要说明的是，中框的内表面为中框设置在电子设备内部的表面，中框的外表面为中框设置在电子设备外部的表面，为中框的外观面。
在一种可能的设计中，所述电子设备还包括后盖，所述后盖与所述中框连接；
所述中框与所述后盖之间设有间隙，所述第一天线设置于所述间隙。
本申请中，中框与后盖安装后，二者之间设置有间隙，该间隙用于设置第一天线，该间隙可以为中框与后盖连接时为设置第一天线预留的空隙，也可以为中框与后盖安装时二者之间的安装误差，即二者之间形成间隙。
在一种可能的设计中，所述第一天线设置有多个，多个所述第一天线分布于所述内表面，并与所述金属件部分电连接；
本申请中，第一天线与金属件部分的连接可以是一个区域，即第一天线设置为一个，一个第一天线的一端与金属件部分的一端电连接，第一天线与金属件部分的连接也可以是多个区域，即第一天线设置有多个，多个第一天线分布于内表面，并均与金属件电连接。其中，多个第一天线可以沿内表面围成环形结构，增加第一天线的辐射面积，进而提高电子设备的辐射信号。
在一种可能的设计中，所述第一天线和所述中框采用焊接或者印刷或者化学镀方式连接。
本申请中，第一天线可以采用焊接的方式设置在中框的内表面上，具体地，可以采用铜箔、铜片、钢片等金属焊接在中框上，该焊接在中框上的金属形成第一天线。第一天线可以采用印刷的方式设置在中框的内表面上，具体地，可以采用银浆、铜浆、金浆等金属印刷在中框上，该印刷在中框上的金属形成第一天线。第一天线可以采用化学镀的方式设置在中框的内表面上，具体地，在无外加电流的情况下借助合适的还原剂，使镀液中的金属离子还原成金属，并沉积到中框表面上，该镀在中框上的金属形成第一天线。
在一种可能的设计中，所述外表面设有涂层，所述第二天线位于所述涂层的内侧。
本申请中，中框的外表面设有涂层，第二天线设置于涂层的下方，保持中框外观的完整性和平整度，减小中框的外表面设置第二天线后出现凹凸不齐现象的风险。
在一种可能的设计中，所述第二天线设置有多个，多个所述第二天线分布于所述外表面，并与所述金属件部分电连接；
本申请中，第二天线与金属件部分的连接可以是一个区域，即第二天线设置为一个，一个第二天线的一端与金属件部分的一端电连接，第二天线与金属件部分的连接也可以是多个区域，即第二天线设置有多个，多个第二天线分布于外表面，并与金属件部分电连接，多个第二天线可以沿外表面围成环形结构，增加第二天线的辐射面积，以提高电子设备的辐射信号。
在一种可能的设计中，所述第二天线和所述中框采用印刷、化学镀方式连接。
本申请中，第二天线可以采用印刷的方式设置在中框的外表面上，具体地，可以 采用银浆、铜浆、金浆等金属印刷在中框上，该印刷在中框上的金属形成第二天线。第二天线可以采用化学镀的方式设置在中框的外表面上，具体地，在无外加电流的情况下借助合适的还原剂，使镀液中的金属离子还原成金属，并沉积到中框表面上，该镀在中框上的金属形成第二天线。
在一种可能的设计中，所述中框还包括本体部，所述本体部为塑胶材质；
所述本体部包裹所述金属件部分的至少部分，所述金属件部分的至少部分伸出所述本体部与所述天线部分电连接。
本申请中，本体部为塑胶材质，金属件部分除了作为电子设备的天线外，还作为中框的支撑件，以支撑中框，提高中框的强度，进而提高电子设备的抗冲击性。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为现有技术中电子设备在一种实施例中的结构示意图；
图2为本申请所提供电子设备在一种实施例中的结构示意图；
图3为图2中电子设备去除第二天线的结构示意图；
图4为图2中电子设备去除第一天线的结构示意图；
图5为图2中电子设备去除天线的结构示意图。
附图标记：
1′-电子设备、11′-中框、112′-金属部、115′-本体部；
1-电子设备、11-中框、111-金属件部分、112-内表面、113-外表面、114-凹槽、115-本体部、12-天线部分、121-第一天线、122-第二天线、13-后盖、14-间隙。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
在一种具体实施例中，下面通过具体的实施例并结合附图对本申请做进一步的详细描述。
如图1所示，电子设备1′包括中框11′和电路板，中框11′设有本体部115′和金属部112′，本体部115′包裹金属部112′，其中，本体部115′的材质为塑胶。金属部112′的至少部分穿出本体部115′与电路板连接，电路板与电子设备1′中的器件电连接。该金属部112′为电子设备1′的天线，通过天线进行电子设备1′信号的传输，信号从电路板传递至天线，再经过天线向空间辐射。随着电子设备1′厚度的逐渐减薄，使中框11′不断变窄，该金属部112′作为天线时导致中框11′内设置的天线的辐射体积不断减小，进而使天线的辐射面积不断减小，使天线性能下降，使天线传输的信号较弱。
现有技术中为增加中框11′中金属部112′的体积，中框11′采用金属制作。
如图2所示，本实施例提供了一种电子设备1，该电子设备1可以为手机、平板电脑、笔记本电脑、电子书阅读器、游戏机、人工智能设备、可穿戴式设备、车载设备、 智能家居设备和/或智慧城市设备，本申请实施例对该电子设备1的具体类型不作特殊限制。该电子设备1包括中框11、电路板和天线，电路板安装于中框11，天线包括设置于中框11表面的天线部分12以及设置于所述中框11的金属件部分111，金属件部分111与电路板电连接，或天线部分12与电路板电连接，或金属件部分111与天线部分12均和电路板电连接；中框11具有内表面112和外表面113，天线部分12包括第一天线121和第二天线122，第一天线121设置于内表面112，第二天线122设置于外表面113，第一天线121、第二天线122和金属件部分111电连接。
中框11还包括本体部115，本体部115为塑胶材质，本体部115包裹金属件部分111的至少部分，金属件部分111的至少部分伸出本体部115与天线部分12电连接。金属件部分111除了作为电子设备1的天线外，还作为中框11的支撑件，以支撑中框11，提高中框11的强度，进而提高电子设备1的抗冲击性。
其中，金属件部分111的材质可以采用铝、铜、铝合金、铜合金等。该中框11的制作方法为，金属件部分111放置在注塑模具中进行注塑形成中框11。
本实施例中，天线部分12为金属天线，天线部分12与金属件部分111电连接，此时，该实施例中用于辐射信号的天线包括天线部分12和金属件部分111，从而增强信号的辐射强度。金属件部分111设置在中框11的内部，天线部分12设置在中框11的表面，充分利用中框11的结构，在减小中框11厚度的情况下，能够增加中框11上设置的天线部分12的辐射强度。天线部分12、金属件部分111和电路板的连接方式可以为：金属件部分111可以与电路板电连接，以使天线部分12通过金属件部分111能够与电路板电连接，电路板与电子器件电连接，以将电子器件产生的信号由天线部分12和金属件部分111向外辐射，并将天线部分12和金属件部分111接收到的信号传递至电子器件；或者，天线部分12可以与电路板连接，以使金属件部分111通过天线部分12能够与电路板电连接，电路板与电子器件电连接，以将电子器件产生的信号由天线部分12和金属件部分111向外辐射，并将天线部分12和金属件部分111接收到的信号传递至电子器件；或者，金属件部分111与天线部分12均与电路板电连接，电路板与电子器件电连接，以将电子器件产生的信号由天线部分12和金属件部分111向外辐射，并将天线部分12和金属件部分111接收到的信号传递至电子器件。通过在中框11的设计基础上增加天线部分12，进而增加中框11中天线的辐射体积，提高电子设备1的辐射强度。并且，电路板与金属部件111和/或天线部件12采用电连接的方式连接，使各电路连接起来，保证电路的畅通，减少电能损耗提高供电质量，进而提高电子设备1信号传递的稳定性。
其中，该天线部分12的材质可以为银、铜、金、钢等具有导电性能的金属。
进一步地，天线部分12与金属件部分111和电路板可以直接电连接，也可以通过连接件电连接。该连接件可以为弹性件、固定件等。具体地，金属件部分111或/和天线部分12可以与电路板通过弹性件电连接，该弹性件可以为弹片，弹性件的一端可以与电路板连接，另一端与金属件部分111或/和天线部分12抵接。
中框11的表面包括内表面112和外表面113，第一天线121设置于内表面112，第一天线121与金属件部分111电连接，通过设置该第一天线121增加电子设备1的辐射信号的强度；第二天线122设置于外表面113，第二天线122与金属件部分111连接， 通过设置该第二天线122增加了电子设备1的辐射信号的强度。并且，该第二天线122设置在中框11的外表面，使第二天线122远离电子设备1中的电子器件，减小电子器件1对第二天线122辐射信号的影响。相比于中框11的内表面112设有第一天线121或中框11的外表面113设有第二天线122，本实施例通过设置第一天线121和第二天线122进一步增强了电子设备1辐射信号的强度。
需要说明的是，中框11的内表面112为中框11设置在电子设备1内部的表面，中框11的外表面为中框设置在电子设备外部的表面，为中框11的外观面。
如图3和图5所示，具体地，电子设备1还包括后盖13，后盖13与中框11连接，中框11与后盖13之间设有间隙14，第一天线121设置于该间隙14。本实施例中，中框11与后盖13安装后，二者之间设置有间隙14，该间隙14用于设置第一天线121，该间隙14可以为中框11与后盖13连接时为设置第一天线121预留的空隙，也可以为中框11与后盖13安装时二者之间的安装误差，即二者之间形成间隙14。可根据电子设备1所需第一天线121的辐射体积来设定，若第一天线121的体积较大，所占空间较大，则在中框11与后盖13安装时二者之间空出该间隙14；若第一天线121的体积较小，所占空间较小，则该间隙14为第一天线121设置在中框11与后盖13之间安装误差产生的间隙14。
或者，中框11的内表面112可以设置凹槽114，第一天线121设置在凹槽114内，且第一天线121的至少部分穿过凹槽114的侧壁与金属件部分111电连接。
其中，后盖13与中框11通过粘胶剂连接，该粘胶剂可以采用背胶。
在一种可能的设计中，第一天线121与金属件部分111的连接可以是一个区域，即第一天线121设置为一个，一个第一天线121的一端与金属件部分111的一端电连接，第一天线121与金属件部分111的连接也可以是多个区域，即第一天线121设置有多个，多个第一天线121分布于内表面112，并均与金属件部分111电连接，以增加第一天线121的辐射面积，进而提高电子设备1的辐射信号。
在一种可能的设计中，第一天线121和中框11采用焊接或者印刷或者化学镀方式连接。本实施例中，第一天线121可以采用焊接的方式设置在中框11的内表面112上，具体地，可以采用铜箔、铜片、钢片等金属焊接在中框11上，该焊接在中框11上的金属形成第一天线121。第一天线121可以采用印刷的方式设置在中框11的内表面112上，具体地，可以采用银浆、铜浆、金浆等金属印刷在中框11上，该印刷在中框11上的金属形成第一天线121。第一天线121可以采用化学镀的方式设置在中框11的内表面112上，具体地，在无外加电流的情况下借助合适的还原剂，使镀液中的金属离子还原成金属，并沉积到中框11表面上，该镀在中框11上的金属形成第一天线121。
其中，第一天线121与金属件部分111可采用镭雕工艺连接，通过镭雕将金属件部分111的表面进行处理，可使其形成熔融状态以与第一天线121连接；或者第一天线121与金属件部分111也可采用导电胶连接。
其中，外表面113设有涂层，第二天线122位于涂层的内侧。本实施例中，中框11的外表面113设有涂层，第二天线122设置于涂层的下方，保持中框11外观的完整性和平整度，减小中框11的外表面113设置第二天线122后出现凹凸不齐现象的风险。
如图5所示，具体地，外表面113可以设置有凹槽114，第二天线122设置在凹槽 114内，且第二天线122的至少部分穿过凹槽114与金属件部分111连接。
在一种可能的设计中，第二天线122与金属件部分111的连接可以是一个区域，即第二天线122设置为一个，一个第二天线122的一端与金属件部分111的一端电连接，第二天线122与金属件部分111的连接也可以是多个区域，即第二天线122设置有多个，多个第二天线122分布于外表面113，并与金属件部分111电连接，以增加第二天线122的辐射面积，以提高电子设备1的辐射信号。
在一种可能的设计中，第二天线122和中框11采用印刷、化学镀方式连接。本实施例中，第二天线122可以采用印刷的方式设置在中框11的外表面113上，具体地，可以采用银浆、铜浆、金浆等金属印刷在中框11上，该印刷在中框11上的金属形成第二天线122。第二天线122可以采用化学镀的方式设置在中框11的外表面113上，具体地，在无外加电流的情况下借助合适的还原剂，使镀液中的金属离子还原成金属，并沉积到中框11表面上，该镀在中框11上的金属形成第二天线122。
其中，第二天线122与金属件部分111可采用镭雕工艺连接，通过镭雕将金属件部分111的表面进行处理，可使其形成熔融状态以与第二天线122连接；或者第二天线122与金属件部分111也可采用导电胶连接。
在以上实施例中，第一天线121与第二天线122可以单独使用，即中框11的内表面112设有第一天线121或中框11的外表面113设有第二天线122，第一天线121或第二天线122与金属件部分111电连接；第一天线121与第二天线122也可以同时使用。
其中，中框11的表面设有凹槽114，天线部分12设置于凹槽114。本实施例中，中框11的内表面112和外表面113均设置有凹槽114，第一天线121和第二天线122设置在对应的凹槽114内。通过在中框11上设置凹槽114，在电子设备1增加第一天线121和第二天线122的情况下，无需增加电子设备1的厚度或宽度或长度。
需要指出的是，本专利申请文件的一部分包含受著作权保护的内容。除了对专利局的专利文件或记录的专利文档内容制作副本以外，著作权人保留著作权。

Claims (8)

  1. 一种电子设备，其特征在于，所述电子设备包括：
    中框；
    电路板，安装于所述中框；
    天线，用于辐射信号，所述天线包括设置于所述中框表面的天线部分以及设置于所述中框的金属件部分，所述金属件部分与所述电路板电连接，或所述天线部分与所述电路板电连接，或所述金属件部分与所述天线部分均和所述电路板电连接，以增强信号的辐射强度；
    所述金属件部分还作为所述中框的支撑件，用于提高所述中框的强度；
    所述中框的表面设有凹槽，所述天线部分设置于所述凹槽，以在所述中框厚度的不变情况下，增强所述中框上设置的所述天线部分的辐射强度；
    其中，所述中框具有内表面和外表面，所述天线部分包括第一天线和第二天线，所述第一天线和所述第二天线用于辐射信号，所述第一天线设置于所述内表面，所述第二天线设置于所述外表面，所述第一天线、所述第二天线和所述金属件部分无连接，以使三者单独作为天线辐射信号，或者所述第一天线、所述第二天线和所述金属件部分电连接，以增强所述天线的长度。
  2. 根据权利要求1所述的电子设备，其特征在于，所述电子设备还包括后盖，所述后盖与所述中框连接；
    所述中框与所述后盖之间设有间隙，所述第一天线设置于所述间隙。
  3. 根据权利要求1所述的电子设备，其特征在于，所述第一天线设置有多个，多个所述第一天线分布于所述内表面，并与所述金属件部分电连接。
  4. 根据权利要求1所述的电子设备，其特征在于，所述第一天线和所述中框采用焊接或者印刷或者化学镀方式连接。
  5. 根据权利要求1所述的电子设备，其特征在于，所述外表面设有涂层，所述第二天线位于所述涂层的内侧。
  6. 根据权利要求1所述的电子设备，其特征在于，所述第二天线设置有多个，多个所述第二天线分布于所述外表面，并与所述金属件部分电连接。
  7. 根据权利要求1所述的电子设备，其特征在于，所述第二天线和所述中框采用印刷、化学镀方式连接。
  8. 根据权利要求1～7中任一项所述的电子设备，其特征在于，所述中框还包括本体部，所述本体部为塑胶材质；
    所述本体部包裹所述金属件部分的至少部分，所述金属件部分的至少部分伸出所述本体部与所述天线部分电连接。
PCT/CN2022/071405 2021-04-07 2022-01-11 一种电子设备 Ceased WO2022213698A1 (zh)

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