WO2022210940A1 - Substrate conveying device, coating processing device, and substrate conveying method - Google Patents

Substrate conveying device, coating processing device, and substrate conveying method Download PDF

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Publication number
WO2022210940A1
WO2022210940A1 PCT/JP2022/016187 JP2022016187W WO2022210940A1 WO 2022210940 A1 WO2022210940 A1 WO 2022210940A1 JP 2022016187 W JP2022016187 W JP 2022016187W WO 2022210940 A1 WO2022210940 A1 WO 2022210940A1
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Prior art keywords
substrate
unit
suction
along
pair
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Application number
PCT/JP2022/016187
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French (fr)
Japanese (ja)
Inventor
陽介 三根
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東京エレクトロン株式会社
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Publication date
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Publication of WO2022210940A1 publication Critical patent/WO2022210940A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present disclosure relates to a substrate transfer apparatus, a coating treatment apparatus, and a substrate transfer method.
  • Patent Document 1 discloses that a substrate is transported along two guide rails extending in the transport direction of the substrate, and droplets of functional liquid are ejected onto the substrate.
  • the present disclosure provides a technique for reducing errors in substrate transfer.
  • a substrate transport apparatus includes a pair of guide rails, a pair of moving parts, a plurality of main holding parts, and a sub-holding part.
  • the pair of guide rails extends along the substrate transport direction.
  • a pair of moving parts respectively move along a pair of guide rails.
  • a plurality of main holding parts are provided on the pair of moving parts, respectively, and hold the substrate from below.
  • the sub-holding part is provided between adjacent main holding parts on each moving part, and holds the substrate from below.
  • the plurality of main holding portions includes first suction portions that hold the substrate by suction, and adjustment portions that adjust the positions of the first suction portions.
  • the sub-holding section includes a second suction section that suction-holds the substrate, and a follower section that adjusts the position of the second suction section by following the movement of the substrate based on the adjustment of the position of the first suction section.
  • FIG. 1 is a schematic plan view showing part of the substrate processing apparatus according to the embodiment.
  • FIG. 2 is a schematic plan view of a main holding portion according to the embodiment;
  • FIG. 3 is a schematic side view of the main holding portion according to the embodiment;
  • FIG. 4 is a schematic plan view of a sub-holding portion according to the embodiment;
  • FIG. 5 is a schematic side view of the sub-holding portion according to the embodiment;
  • FIG. 6 is a flow chart showing the procedure of processing executed by the substrate processing apparatus according to the embodiment.
  • FIG. 7 is a schematic plan view showing part of a substrate processing apparatus according to a modification.
  • FIG. 8 is a schematic plan view of a sub-holding portion according to a modification.
  • FIG. 9 is a schematic plan view of a sub-holding portion according to a modification.
  • Each drawing referred to below shows an orthogonal coordinate system in which the X-axis direction, the Y-axis direction, and the Z-axis direction are defined to be orthogonal to each other, and the Z-axis positive direction is the vertically upward direction, in order to make the explanation easier to understand.
  • the front-rear direction is defined with the positive direction of the Y-axis as the front and the negative direction of the Y-axis as the rear, and the left-right direction with the positive direction of the X-axis as the right and the negative direction of the X-axis as the left.
  • a vertical direction is defined in which the positive direction of the Z-axis is upward and the negative direction of the Z-axis is downward.
  • the substrate processing apparatus 1 processes the substrate S while transporting the substrate S forward and backward along the front-rear direction. That is, the substrate processing apparatus 1 processes the substrate S while transporting the substrate S along the transport direction (Y-axis direction).
  • FIG. 1 is a schematic plan view showing part of a substrate processing apparatus 1 according to an embodiment.
  • the substrate processing apparatus 1 performs drawing on the substrate S by an inkjet method while horizontally transporting the substrate S as a work.
  • the substrate S is, for example, a substrate used for flat panel displays.
  • the substrate processing apparatus 1 includes a floating stage 2, a first guide rail 3_1, and a second guide rail 3_2.
  • the substrate processing apparatus 1 also includes a first moving section 4_1 and a second moving section 4_2. Further, the substrate processing apparatus 1 includes a first main holding portion 5_1, a second main holding portion 5_2, a third main holding portion 5_3, a fourth main holding portion 5_4, a first sub holding portion 6_1, and a second main holding portion 5_1. and a sub holding portion 6_2.
  • the substrate processing apparatus 1 also includes a plurality of coating units 7 , a maintenance unit 8 , and a control device 9 .
  • first guide rail 3_1 and the second guide rail 3_2 may be collectively referred to as "the guide rail 3".
  • the first moving section 4_1 and the second moving section 4_2 may be collectively referred to as the "moving section 4".
  • the first main holding portion 5_1 to the fourth main holding portion 5_4 may be collectively referred to as the "main holding portion 5".
  • the first sub-retaining portion 6_1 and the second sub-retaining portion 6_2 may be collectively referred to as the "sub-retaining portion 6".
  • the levitation stage 2 has a large number of ejection ports (not shown).
  • the levitation stage 2 blows compressed gas (for example, air) from an ejection port toward the lower surface of the substrate S to apply a force acting upward on the substrate S (hereinafter referred to as “levitation force”).
  • the levitation stage 2 adjusts the levitation height of the substrate S held by the main holding section 5 and the sub holding section 6 by applying a levitation force. That is, the floating stage 2 adjusts the floating height of the substrate S by spraying gas from below onto the substrate S held by the main holding portion 5 and the sub-holding portion 6 .
  • the floating stage 2 includes a loading stage into which the substrate S is loaded and a loading stage into which the substrate S is loaded.
  • the loading stage is provided on the rear side of the substrate processing apparatus 1 .
  • the carry-out stage is provided on the front side of the substrate processing apparatus 1 .
  • a plurality of levitation stages 2 may be provided along the transport direction (Y-axis direction).
  • the floating height range of the substrate S in the floating stage 2 positioned below the coating section 7 is narrower than the floating height range of the substrate S in the other floating stages 2 .
  • the floating height range of the substrate S on the floating stage 2 located below the coating section 7 is 30 to 60 ⁇ m.
  • the floating height range of the substrate S in the other floating stages 2 is 200 to 2000 ⁇ m.
  • the floating stage 2 located below the coating section 7 discharges compressed air toward the lower surface of the substrate S, and sucks the air between the substrate S and the floating stage 2, so that the substrate S may be adjusted.
  • the first guide rail 3_1 and the second guide rail 3_2 are arranged in the horizontal direction (X-axis direction) and extend along the transport direction (Y-axis direction).
  • the first guide rail 3_1 and the second guide rail 3_2 are arranged so as to sandwich the levitation stage 2 in the left-right direction (X-axis direction).
  • the first guide rail 3_1 is arranged on the X-axis positive direction side of the levitation stage 2
  • the second guide rail 3_2 is arranged on the X-axis negative direction side of the levitation stage 2 .
  • the first guide rail 3_1 and the second guide rail 3_2 are made of granite, for example.
  • a cross section of the guide rail 3 orthogonal to the transport direction (Y-axis direction) is, for example, rectangular.
  • the first moving part 4_1 is provided on the first guide rail 3_1 and moves along the first guide rail 3_1.
  • the second moving part 4_2 is provided on the second guide rail 3_2 and moves along the second guide rail 3_2.
  • the first moving part 4_1 and the second moving part 4_2 each have a driving part such as a motor, and can move independently.
  • a plurality of main holding parts 5 are provided on the first moving part 4_1 and the second moving part 4_2, respectively, and hold the substrate S from below.
  • the first main holding portion 5_1 and the second main holding portion 5_2 are provided on the first moving portion 4_1, and the third main holding portion 5_3 and the fourth main holding portion 5_3 are provided on the first moving portion 4_1.
  • the part 5_4 is provided on the second moving part 4_2.
  • the first main holding portion 5_1 and the second main holding portion 5_2 are arranged in the order of the first main holding portion 5_1 and the second main holding portion 5_2 along the transport direction (Y-axis direction) on the first moving portion 4_1. be done.
  • the third main holding portion 5_3 and the fourth main holding portion 5_4 are arranged on the second moving portion 4_2 in the order of the third main holding portion 5_3 and the fourth main holding portion 5_4 along the transport direction (Y-axis direction). be sorted by Note that the number of main holding portions 5 is not limited to four.
  • the sub-holding part 6 is provided between the adjacent main holding parts 5 on each moving part 4 and holds the substrate S from below.
  • first sub holding portion 6_1 is provided between the first main holding portion 5_1 and the second main holding portion 5_2 adjacent to each other on the first moving portion 4_1.
  • the second sub-retaining portion 6_2 is provided between the third main retaining portion 5_3 and the fourth main retaining portion 5_4 adjacent to each other on the second moving portion 4_2.
  • the number of the plurality of sub holding portions 6 is not limited to two.
  • a plurality of (here, four) main holding parts 5 hold the four corners of the substrate S from below.
  • the plurality of (here, two) sub-holding portions 6 hold the side edges of the substrate S that are not held by the main holding portion 5 from below.
  • the substrate S is held at its four corners by a plurality of main holding portions 5, held at its side edges by a plurality of sub-holding portions 6, and floated by the levitation stage 2.
  • 4_2 is transported along the transport direction (Y-axis positive direction).
  • the sub-holding portion 6 holds the side edge of the substrate S that is not held by the main holding portion 5 while the substrate S is being conveyed, thereby reducing the bending of the substrate S being conveyed. can be suppressed.
  • the coating unit 7 applies the functional liquid to the substrate S transported along the transport direction (Y-axis positive direction).
  • the functional liquid is ink.
  • the application unit 7 applies the functional liquid to the substrate S whose floating height is adjusted by the floating stage 2 . Specifically, the coating unit 7 coats the substrate S with the functional liquid by discharging the functional liquid onto the substrate S.
  • a plurality of application units 7 are arranged along the left-right direction (X-axis direction). Although the example shown in FIG. 1 shows a state in which seven application units 7 are arranged along the left-right direction (X-axis direction), the number of application units 7 is not limited to this.
  • the coating unit 7 has a plurality of heads for ejecting functional liquid, and the functional liquid is ejected onto the substrate S from each head.
  • the applicator 7 is movable along a pair of rails 10 arranged in the Y-axis direction and extending along the X-axis direction.
  • a pair of rails 10 are provided, for example, so as to extend rightward with respect to the levitation stage 2 .
  • a maintenance section 8 is provided between the pair of rails 10 on the right side of the levitation stage 2 .
  • the application unit 7 is movable between a position above the maintenance unit 8 and a position where the functional liquid is discharged onto the substrate S. As shown in FIG.
  • the application unit 7 is moved laterally along a pair of rails 10 by a driving device such as a linear motor.
  • the plurality of application units 7 may move independently in the left-right direction, or may move together in the left-right direction.
  • the maintenance section 8 performs maintenance of the head of the coating section 7 and eliminates or prevents ejection failures of the head of the coating section 7 . Note that the maintenance section 8 may be provided above the levitation stage 2 .
  • the control device 9 is, for example, a computer, and includes a control section 91 and a storage section 92 .
  • the storage unit 92 stores programs for controlling various processes executed in the substrate processing apparatus 1 .
  • the control unit 91 controls the operation of the substrate processing apparatus 1 by reading and executing programs stored in the storage unit 92 .
  • the program may be recorded in a computer-readable storage medium and installed in the storage unit 92 of the control device 9 from the storage medium.
  • Examples of computer-readable storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.
  • FIG. 2 is a schematic plan view of the main holding portion 5 according to the embodiment.
  • FIG. 3 is a schematic side view of the main holding portion 5 according to the embodiment.
  • FIGS. 2 and 3 show the first main holding portion 5_1 as an example, the configurations of the second main holding portion 5_2 to the fourth main holding portion 5_4 are similar to that of the first main holding portion 5_1. .
  • the main holding portion 5 includes a base portion 50, a first adjustment portion 51, a second adjustment portion 52, a rotating portion 53, an arm portion 54, and a first suction portion. 55.
  • the first adsorption part 55 adsorbs and holds the substrate S.
  • the first suction unit 55 includes a plurality of suction pads 551 .
  • a plurality of suction pads 551 are provided side by side in the horizontal direction (here, Y-axis direction). Although an example in which the first suction unit 55 includes three suction pads 551 is shown here, the number of suction pads 551 is not limited to three.
  • the first suction unit 55 holds the substrate S by sucking the lower surface of the substrate S with a plurality of suction pads 551 .
  • the base portion 50 , the first adjusting portion 51 , the second adjusting portion 52 , the rotating portion 53 and the arm portion 54 are examples of adjusting portions that adjust the relative position of the first suction portion 55 with respect to the moving portion 4 .
  • the base part 50 is fixed on the moving part 4 .
  • the first adjusting portion 51 is provided on the base portion 50 and is movable on the base portion 50 along the left-right direction (X-axis direction).
  • the second adjuster 52 is provided on the first adjuster 51 and is movable on the first adjuster 51 in the front-rear direction (Y-axis direction).
  • the rotating portion 53 is provided on the second adjusting portion 52 and is rotatable around the vertical axis (Z-axis).
  • the arm portion 54 is a member that extends in the horizontal direction, is supported by the rotating portion 53 at its proximal end, and supports the first adsorption portion 55 at its distal end.
  • the adjustment section can move the first suction section 55 in the left-right direction (X-axis direction) by moving the first adjustment section 51 in the left-right direction (X-axis direction). That is, the first adjusting portion 51 can adjust the position of the first suction portion 55 with respect to the moving portion 4 along the left-right direction (X-axis direction).
  • the adjustment section can move the first suction section 55 in the front-rear direction (Y-axis direction) by moving the second adjustment section 52 in the front-rear direction (Y-axis direction). That is, the second adjustment section 52 can adjust the position of the first suction section 55 with respect to the moving section 4 along the front-rear direction (Y-axis direction).
  • the adjusting section moves the first adsorption section 55 supported by the rotating section 53 via the arm section 54 to the vertical axis (Z-axis) by rotating the rotating section 53 about the vertical axis (Z-axis).
  • the rotating portion 53 is an example of a third adjusting portion, and can adjust the position of the first suction portion 55 with respect to the moving portion 4 along the circumferential direction centered on the vertical axis (Z-axis direction). .
  • first adjusting section 51 and the second adjusting section 52 each have a driving section such as a motor, and can move independently.
  • the rotating portion 53 is, for example, a bearing and does not have a driving portion, and rotates the first adsorption portion 55 so as to follow the movements of the first adjusting portion 51 and the second adjusting portion 52.
  • a drive part may be provided in the rotation part 53.
  • the pair of guide rails 3 extends along the front-rear direction (Y-axis direction), which is the transport direction of the substrate S.
  • the length of the pair of guide rails 3 in the front-rear direction (Y-axis direction) is approximately 3 to 7 m.
  • the pair of guide rails 3 since the pair of guide rails 3 is long, it is difficult to form them completely straight, and there is a possibility that a distortion of, for example, several ⁇ m may occur in the left-right direction (X-axis direction). Similarly, the pair of guide rails 3 may be distorted by several ⁇ m in the vertical direction (Z-axis direction). Moreover, even if the pair of guide rails 3 can be formed straight, there is a possibility that they will be distorted afterward due to environmental changes (for example, temperature changes).
  • the distance between two adjacent main holding portions 5 among the plurality of (here, four) main holding portions 5 changes. That is, the relative positions of the plurality of main holding portions 5 change. In other words, the relative positions of the plurality of first adsorption portions 55 change.
  • the relative positions of the plurality of first suction units 55 change, the positional relationship between the first suction units 55 and the substrate S changes. As a result, the first suction unit 55 is displaced with respect to the substrate S, making it difficult to convey the substrate S with high accuracy.
  • the distortion of the guide rails 3 causes the relative positions of the plurality of main holding parts 5 to change. slips easily.
  • each of the main holding portions 5 is arranged such that the distance between two adjacent main holding portions 5 among the plurality of main holding portions 5 is a predetermined distance while the substrate S is being transported.
  • the position of the first adsorption portion 55 with respect to the moving portion 4 is adjusted by the first adjusting portion 51 and the second adjusting portion 52 of .
  • FIG. 4 is a schematic plan view of the sub-holding portion 6 according to the embodiment.
  • FIG. 5 is a schematic side view of the sub-holding portion 6 according to the embodiment.
  • FIGS. 4 and 5 show the first sub-retaining portion 6_1 as an example, the configuration of the second sub-retaining portion 6_2 is the same as that of the first sub-retaining portion 6_1.
  • the sub-holding section 6 includes a pair of base sections 61, an arm section 62, and a second suction section 63. As shown in FIGS. 4 and 5, the sub-holding section 6 includes a pair of base sections 61, an arm section 62, and a second suction section 63. As shown in FIGS. 4 and 5, the sub-holding section 6 includes a pair of base sections 61, an arm section 62, and a second suction section 63. As shown in FIGS.
  • the second adsorption part 63 adsorbs and holds the substrate S.
  • the second suction unit 63 includes a plurality of suction pads 631 .
  • the plurality of suction pads 631 are provided side by side in the horizontal direction (here, the Y-axis direction). Although an example in which the second suction unit 63 includes three suction pads 631 is shown here, the number of suction pads 631 is not limited to three.
  • the second suction unit 63 holds the substrate S by sucking the lower surface of the substrate S with a plurality of suction pads 631 .
  • the second suction part 63 is longer than the first suction part 55 in the front-rear direction (Y-axis direction), which is the transport direction of the substrate S.
  • the length of the second suction portion 63 along the front-rear direction (Y-axis direction) may be the same as the length of the first suction portion 55 along the front-rear direction (Y-axis direction). It may be shorter than the length along the front-rear direction (Y-axis direction) of the portion 55 .
  • the pair of base portion 61 and arm portion 62 is an example of a following portion that adjusts the relative position of the second suction portion 63 with respect to the moving portion 4 by following the movement of the substrate S based on the adjustment of the position of the first suction portion 55 . be.
  • a pair of base parts 61 are fixed on the moving part 4 .
  • the arm portion 62 is a substantially T-shaped member extending in the horizontal direction, and a pair of base end portions thereof are supported in the pair of base portions 61 via a spherical body 61a so as to be horizontally movable and rotatable.
  • One tip supports the second adsorption portion 63 .
  • the follow-up portion moves the arm portion 62 in the left-right direction (X-axis direction) following the movement of the substrate S along the left-right direction (X-axis direction).
  • 63 can be moved in the left-right direction (X-axis direction). That is, the arm part 62 follows the movement of the substrate S along the horizontal direction (X-axis direction) based on the adjustment of the position of the first suction part 55, and moves the position of the second suction part 63 with respect to the moving part 4 in the horizontal direction. (X-axis direction).
  • the follow-up portion moves the arm portion 62 in the front-rear direction (Y-axis direction) by following the movement of the substrate S along the front-rear direction (Y-axis direction), whereby the second substrate supported by the arm portion 62 moves.
  • the suction portion 63 can be moved in the front-rear direction (Y-axis direction). That is, the arm part 62 follows the movement of the substrate S along the front-rear direction (Y-axis direction) based on the adjustment of the position of the first suction part 55 and changes the position of the second suction part 63 with respect to the moving part 4 in the front-rear direction. (Y-axis direction).
  • the follow-up portion follows the movement of the substrate S along the circumferential direction about the vertical axis (Z-axis) and rotates the arm portion 62 around the vertical axis (Z-axis). can be rotated around the vertical axis (Z-axis). That is, the arm part 62 follows the movement of the substrate S along the circumferential direction about the vertical axis (Z-axis) based on the adjustment of the position of the first suction part 55 and moves the second suction part 63 relative to the moving part 4 . can be adjusted in the circumferential direction about the vertical axis (Z-axis).
  • the substrate processing apparatus 1 the side edges of the substrate S that are not held by the main holding portion 5 are held by the sub-holding portion 6 while the substrate S is being transferred, thereby suppressing the bending of the substrate S being transferred. ing. Further, in the substrate processing apparatus 1 , the position of the first suction portion 55 with respect to the moving portion 4 is adjusted by the first adjusting portion 51 and the second adjusting portion 52 of each main holding portion 5 .
  • the substrate S is moved by adjusting the position of the first suction part 55 with respect to the moving part 4 .
  • the positional relationship between the second suction portion 63 of the sub-holding portion 6 and the substrate S changes.
  • the substrate S is displaced with respect to the second suction unit 63, making it difficult to convey the substrate S with high accuracy.
  • the movement of the substrate S based on the adjustment of the position of the first suction unit 55 is followed by the arm unit 62 of the sub-holding unit 6 to move the moving unit 4 .
  • bending of the transported substrate S can be suppressed, and displacement of the substrate S with respect to the second suction unit 63 can be suppressed. That is, even when the position of the first suction unit 55 with respect to the moving unit 4 is adjusted while the substrate S is transported, the positional relationship between the second suction unit 63 and the substrate S can be properly maintained.
  • FIG. 6 is a flow chart showing the procedure of processing executed by the substrate processing apparatus 1 according to the embodiment. Each process shown in FIG. 6 is executed under the control of the control device 9 .
  • the substrate processing apparatus 1 performs a holding process (step S101).
  • the substrate processing apparatus 1 holds the substrate S conveyed to the floating stage 2 by a plurality of main holding parts 5 and sub holding parts 6 .
  • the substrate processing apparatus 1 sucks the four corners of the substrate S with the first suction portions 55 of the main holding portions 5 and the side edges of the substrate S with the second suction portions 63 of the sub-holding portions 6 .
  • the substrate S is held.
  • the substrate processing apparatus 1 performs a transfer process (step S102).
  • the substrate processing apparatus 1 transports the substrate S along the transport direction by moving the pair of moving parts 4 along the pair of guide rails 3 .
  • the substrate processing apparatus 1 performs an adjustment process (step S103).
  • the substrate processing apparatus 1 adjusts the position of the first suction section 55 with respect to the moving section 4 by the first adjustment section 51 and the second adjustment section 52 of each main holding section 5 while the substrate S is being transported.
  • the substrate processing apparatus 1 adjusts the position of the second suction portion 63 by following the movement of the substrate S based on the adjustment of the position of the first suction portion 55 by the arm portion 62 of the sub-holding portion 6 .
  • the substrate processing apparatus 1 performs a coating process (step S104).
  • the substrate processing apparatus 1 applies the functional liquid to the substrate S by discharging the functional liquid from the application unit 7 onto the substrate S that is transported along the transport direction.
  • the substrate S coated with the functional liquid is unloaded from the floating stage 2 .
  • FIG. 7 is a schematic plan view showing part of a substrate processing apparatus 1A according to a modification.
  • FIG. 8 is a schematic plan view of the sub-holding portion 11 according to the modification.
  • FIG. 9 is a schematic plan view of the sub-holding portion 11 according to the modification.
  • FIGS. 8 and 9 show the first sub-retaining portion 11_1 as an example, the configuration of the second sub-retaining portion 11_2 is similar to that of the first sub-retaining portion 11_1.
  • a substrate processing apparatus 1A includes a first sub-holding portion 11_1 and a second sub-holding portion instead of the first sub-holding portion 6_1 and second sub-holding portion 6_2 shown in FIG. 11_2.
  • the first sub-retaining portion 11_1 and the second sub-retaining portion 11_2 may be collectively referred to as the "sub-retaining portion 11".
  • the sub-holding part 11 is provided between adjacent main holding parts 5 in each moving part 4 and holds the substrate S from below.
  • first sub holding portion 11_1 is provided between the first main holding portion 5_1 and the second main holding portion 5_2 adjacent to each other on the first moving portion 4_1.
  • the second sub-retaining portion 11_2 is provided between the third main retaining portion 5_3 and the fourth main retaining portion 5_4 adjacent to each other on the second moving portion 4_2.
  • the number of the plurality of sub holding portions 11 is not limited to two.
  • the sub-holding portion 11 includes a base portion 110, a first follower portion 111, a second follower portion 112, a rotating portion 113, an arm portion 114, and a second attracting portion. 63A.
  • the second suction part 63A has the same configuration as the second suction part 63 shown in FIGS. 4 and 5 except for the thickness and the length along the front-rear direction (Y-axis direction).
  • the length of the second suction portion 63A along the front-rear direction (Y-axis direction) is the same as the length of the first suction portion 55 along the front-rear direction (Y-axis direction).
  • the length of the second suction portion 63A along the front-rear direction (Y-axis direction) may be longer than the length of the first suction portion 55 along the front-rear direction (Y-axis direction).
  • the second suction part 63 ⁇ /b>A holds the substrate S by sucking the lower surface of the substrate S with the plurality of suction pads 551 similarly to the second suction part 63 .
  • the base portion 110 , the first follower portion 111 , the second follower portion 112 , the rotating portion 113 , and the arm portion 114 follow the movement of the substrate S based on the adjustment of the position of the first adsorption portion 55 and follow the movement of the moving portion 4 .
  • 2 is an example of a following unit that adjusts the relative position of the suction unit 63.
  • the base part 110 is fixed on the moving part 4 .
  • the first follower portion 111 is provided on the base portion 50 and is movable on the base portion 50 along the left-right direction (X-axis direction).
  • the second follower 112 is provided on the first follower 111 and is movable on the first follower 111 in the front-rear direction (Y-axis direction).
  • the rotating portion 113 is provided on the second follower portion 112 and is rotatable around the vertical axis (Z-axis).
  • the arm portion 114 is a member that extends in the horizontal direction, is supported by the rotating portion 113 at its proximal end, and supports the second adsorption portion 63A at its distal end.
  • the follow-up portion moves the second suction portion 63A left and right by moving the first follow-up portion 111 along the left-right direction (X-axis direction) following the movement of the substrate S along the left-right direction (X-axis direction).
  • direction (X-axis direction) That is, the first follow-up portion 111 follows the movement of the substrate S along the left-right direction (X-axis direction) based on the adjustment of the position of the first suction portion 55 to adjust the position of the second suction portion 63A with respect to the moving portion 4. It can be adjusted along the left-right direction (X-axis direction).
  • the following portion moves the second following portion 112 in the front-rear direction (Y-axis direction) by following the movement of the substrate S in the front-rear direction (Y-axis direction).
  • the follow-up portion follows the movement of the substrate S along the circumferential direction about the vertical axis (Z-axis), and rotates by rotating the rotating portion 113 around the vertical axis (Z-axis).
  • the second adsorption portion 63A supported by the portion 113 via the arm portion 114 can be rotated around the vertical axis (Z-axis). That is, the rotating portion 113 is an example of a third follower portion, and follows the movement of the substrate S along the front-rear direction (Y-axis direction) based on the adjustment of the position of the first suction portion 55 to move the moving portion 4 relative to the moving portion 4 .
  • the position of the second adsorption portion 63A can be adjusted along the circumferential direction around the vertical axis (Z-axis direction).
  • first follower portion 111, the second follower portion 112 and the rotating portion 113 correspond to the first adjusting portion 51, the second adjusting portion 52 and the rotating portion 53 of the main holding portion 5 (see FIGS. 2 and 3), respectively.
  • first follower section 111 and the second follower section 112 do not have driving sections and do not move independently.
  • present invention is not limited to this, and a drive section may be provided for each of the first follower section 111 and the second follower section 112 .
  • the substrate transfer apparatus (for example, the substrate processing apparatus 1, 1A) according to the embodiment includes a pair of guide rails (for example, the first guide rail 3_1 and the second guide rail 3_2) and a pair of moving parts (for example, first moving portion 4_1 and second moving portion 4_2), a plurality of main holding portions (for example, first main holding portion 5_1 to fourth main holding portion 5_4), and a sub holding portion (for example, first sub holding portions 6_1, 11_1 and second sub-holding portions 6_2, 11_2).
  • the pair of guide rails extends along the transport direction (eg, Y-axis direction) of the substrate (eg, substrate S).
  • a pair of moving parts respectively move along a pair of guide rails.
  • a plurality of main holding parts are provided on the pair of moving parts, respectively, and hold the substrate from below.
  • the sub-holding part is provided between adjacent main holding parts on each moving part, and holds the substrate from below.
  • the plurality of main holding portions include a first adsorption portion (eg, first adsorption portion 55) that adsorbs and holds the substrate, and an adjustment portion (eg, first adjustment portion 51 and second adjustment portion) that adjusts the position of the first adsorption portion. 52).
  • the sub-holding section includes a second suction section (for example, the second suction sections 63 and 63A) that suction-holds the substrate, and a position of the second suction section that follows the movement of the substrate based on the adjustment of the position of the first suction section. is provided (for example, the arm portion 62, the first follower portion 111, the second follower portion 112, and the rotating portion 113).
  • the substrate transport device transports the substrate while holding the side edge of the substrate by the sub-holding part, the distance between the side edge of the substrate and the coating part (for example, the coating part 7) is kept constant. , the functional liquid can be discharged from the application portion onto the substrate. Therefore, according to the substrate transfer apparatus according to the embodiment, it is possible to perform drawing on the substrate with high accuracy.
  • the adjusting unit includes a first adjusting unit (for example, the first adjusting unit 51) that adjusts the position of the first suction unit along a direction (for example, the X-axis direction) orthogonal to the conveying direction;
  • a second adjustment unit e.g., second adjustment unit 52
  • a third adjusting portion (for example, rotating portion 53) may be provided.
  • the following part (for example, the arm part 62) follows the movement of the substrate along the direction perpendicular to the transport direction, the transport direction, and the circumferential direction centered on the vertical axis to move the second suction part (for example, the second suction part). 63) may be adjusted. This makes it possible to adjust the position of the second suction unit by following the movement of the substrate along the direction orthogonal to the transport direction, the transport direction, and the circumferential direction centered on the vertical axis.
  • the adjusting unit includes a first adjusting unit that adjusts the position of the first suction unit along a direction orthogonal to the conveying direction, a second adjusting unit that adjusts the position of the first sucking unit along the conveying direction, A third adjustment section may be provided for adjusting the position of the first suction section along the circumferential direction about the vertical axis.
  • the follower unit is a first follower unit (for example, the first follower unit 111) that adjusts the position of the second adsorption unit (for example, the second adsorption unit 63A) by following the movement of the substrate along the direction orthogonal to the transport direction.
  • a second follower for example, a second follower 112 that adjusts the position of the second suction portion by following the movement of the substrate along the transport direction
  • a third follow-up portion for example, rotating portion 113 that follows the movement of the substrate and adjusts the position of the second suction portion
  • the second adsorption section may be longer in the transport direction than the first adsorption section. As a result, even when the number of sub-holding portions provided between the adjacent main holding portions is small, it is possible to suppress the deflection of the transported substrate and the displacement of the substrate with respect to the second adsorption portion. can.
  • the substrate processing apparatus 1 includes the coating unit 7, and the coating unit 7 performs drawing on the substrate S using an inkjet method.
  • the processing of the substrate S is not limited to this.
  • the present disclosure techniques are applicable.
  • Control device 50 Base portion 51 First adjustment portion 52 Second adjustment portion 53 Rotating portion 54 Arm portion 55 First adsorption portion 61, 110 base portion 62 arm portion 63, 63A second adsorption portion 91 control portion 92 storage portion 111 first follower portion 112 second follower portion 113 rotating portion 114 arm portion

Abstract

This substrate conveying device is provided with a pair of guide rails, a pair of movement units, a plurality of main holding units, and auxiliary holding units. The pair of guide rails extend in a substrate conveying direction. The pair of movement units move respectively along the pair of guide rails. The plurality of main holding units are each provided on the pair of movement units, to hold the substrate from below the substrate. Each auxiliary holding unit is provided between the main holding units that are adjacent to one another on each movement unit, to hold the substrate from below the substrate. Each of the plurality of main holding units includes a first suction attachment unit for suction-attaching the substrate, and an adjusting unit for adjusting the position of the first suction attachment unit. Each auxiliary holding unit includes a second suction attachment unit for suction-attaching the substrate, and a tracking unit for adjusting the position of the second suction attachment unit by tracking the movement of the substrate based on the adjustments of the positions of the first suction attachment units.

Description

基板搬送装置、塗布処理装置および基板搬送方法SUBSTRATE TRANSPORTING APPARATUS, COATING PROCESSING APPARATUS, AND SUBSTRATE TRANSPORTING METHOD
　本開示は、基板搬送装置、塗布処理装置および基板搬送方法に関する。 The present disclosure relates to a substrate transfer apparatus, a coating treatment apparatus, and a substrate transfer method.
　特許文献１には、基板の搬送方向に延びる２本のガイドレールに沿って基板を搬送し、基板に機能液の液滴を吐出することが開示されている。 Patent Document 1 discloses that a substrate is transported along two guide rails extending in the transport direction of the substrate, and droplets of functional liquid are ejected onto the substrate.
特開２０１８－１２６７１８号公報JP 2018-126718 A
　本開示は、基板搬送における誤差を低減する技術を提供する。 The present disclosure provides a technique for reducing errors in substrate transfer.
　本開示の一態様による基板搬送装置は、一対のガイドレールと、一対の移動部と、複数の主保持部と、副保持部とを備える。一対のガイドレールは、基板の搬送方向に沿って延在する。一対の移動部は、一対のガイドレールに沿ってそれぞれ移動する。複数の主保持部は、一対の移動部上にそれぞれ設けられ、基板の下方から基板を保持する。副保持部は、各移動部上において隣り合う主保持部の間に設けられ、基板の下方から基板を保持する。複数の主保持部は、基板を吸着保持する第１吸着部と、第１吸着部の位置を調整する調整部とを備える。副保持部は、基板を吸着保持する第２吸着部と、第１吸着部の位置の調整に基づく基板の移動に追従して第２吸着部の位置を調整する追従部とを備える。 A substrate transport apparatus according to one aspect of the present disclosure includes a pair of guide rails, a pair of moving parts, a plurality of main holding parts, and a sub-holding part. The pair of guide rails extends along the substrate transport direction. A pair of moving parts respectively move along a pair of guide rails. A plurality of main holding parts are provided on the pair of moving parts, respectively, and hold the substrate from below. The sub-holding part is provided between adjacent main holding parts on each moving part, and holds the substrate from below. The plurality of main holding portions includes first suction portions that hold the substrate by suction, and adjustment portions that adjust the positions of the first suction portions. The sub-holding section includes a second suction section that suction-holds the substrate, and a follower section that adjusts the position of the second suction section by following the movement of the substrate based on the adjustment of the position of the first suction section.
　本開示によれば、基板搬送における誤差を低減することができる。 According to the present disclosure, errors in substrate transfer can be reduced.
図１は、実施形態に係る基板処理装置の一部を示す模式的な平面図である。FIG. 1 is a schematic plan view showing part of the substrate processing apparatus according to the embodiment. 図２は、実施形態に係る主保持部の模式的な平面図である。FIG. 2 is a schematic plan view of a main holding portion according to the embodiment; 図３は、実施形態に係る主保持部の模式的な側面図である。FIG. 3 is a schematic side view of the main holding portion according to the embodiment; 図４は、実施形態に係る副保持部の模式的な平面図である。FIG. 4 is a schematic plan view of a sub-holding portion according to the embodiment; 図５は、実施形態に係る副保持部の模式的な側面図である。FIG. 5 is a schematic side view of the sub-holding portion according to the embodiment; 図６は、実施形態に係る基板処理装置が実行する処理の手順を示すフローチャートである。FIG. 6 is a flow chart showing the procedure of processing executed by the substrate processing apparatus according to the embodiment. 図７は、変形例に係る基板処理装置の一部を示す模式的な平面図である。FIG. 7 is a schematic plan view showing part of a substrate processing apparatus according to a modification. 図８は、変形例に係る副保持部の模式的な平面図である。FIG. 8 is a schematic plan view of a sub-holding portion according to a modification. 図９は、変形例に係る副保持部の模式的な平面図である。FIG. 9 is a schematic plan view of a sub-holding portion according to a modification.
　以下、添付図面を参照して、本願の開示する基板搬送装置、塗布処理装置および基板搬送方法の実施形態を詳細に説明する。なお、以下に示す実施形態により開示される基板搬送装置、塗布処理装置および基板搬送方法が限定されるものではない。 Hereinafter, embodiments of a substrate transfer apparatus, a coating treatment apparatus, and a substrate transfer method disclosed in the present application will be described in detail with reference to the accompanying drawings. It should be noted that the substrate transfer apparatus, the coating treatment apparatus, and the substrate transfer method disclosed by the embodiments shown below are not limited.
　以下参照する各図面では、説明を分かりやすくするために、互いに直交するＸ軸方向、Ｙ軸方向およびＺ軸方向を規定し、Ｚ軸正方向を鉛直上向き方向とする直交座標系を示す。 Each drawing referred to below shows an orthogonal coordinate system in which the X-axis direction, the Y-axis direction, and the Z-axis direction are defined to be orthogonal to each other, and the Z-axis positive direction is the vertically upward direction, in order to make the explanation easier to understand.
　また、ここでは、Ｙ軸正方向を前方とし、Ｙ軸負方向を後方とする前後方向を規定し、Ｘ軸正方向を右方とし、Ｘ軸負方向を左方とする左右方向を規定する。また、Ｚ軸正方向を上方とし、Ｚ軸負方向を下方とする上下方向を規定する。基板処理装置１は、基板Ｓを後方から前方に向けて前後方向に沿って搬送しながら基板Ｓを処理する。すなわち、基板処理装置１は、搬送方向（Ｙ軸方向）に沿って基板Ｓを搬送しながら、基板Ｓを処理する。 Here, the front-rear direction is defined with the positive direction of the Y-axis as the front and the negative direction of the Y-axis as the rear, and the left-right direction with the positive direction of the X-axis as the right and the negative direction of the X-axis as the left. . A vertical direction is defined in which the positive direction of the Z-axis is upward and the negative direction of the Z-axis is downward. The substrate processing apparatus 1 processes the substrate S while transporting the substrate S forward and backward along the front-rear direction. That is, the substrate processing apparatus 1 processes the substrate S while transporting the substrate S along the transport direction (Y-axis direction).
＜全体構成＞
　実施形態に係る基板処理装置１の全体構成について図１を参照して説明する。図１は、実施形態に係る基板処理装置１の一部を示す模式的な平面図である。基板処理装置１は、ワークである基板Ｓを水平方向に搬送しながら、インクジェット方式で基板Ｓに描画を行う。基板Ｓは、例えば、フラットパネルディスプレイに用いられる基板である。 <Overall composition>
An overall configuration of a substrate processing apparatus 1 according to an embodiment will be described with reference to FIG. FIG. 1 is a schematic plan view showing part of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 performs drawing on the substrate S by an inkjet method while horizontally transporting the substrate S as a work. The substrate S is, for example, a substrate used for flat panel displays.
　基板処理装置１は、浮上ステージ２と、第１ガイドレール３＿１と、第２ガイドレール３＿２とを備える。また、基板処理装置１は、第１移動部４＿１と、第２移動部４＿２とを備える。また、基板処理装置１は、第１主保持部５＿１と、第２主保持部５＿２と、第３主保持部５＿３と、第４主保持部５＿４と、第１副保持部６＿１と、第２副保持部６＿２とを備える。また、基板処理装置１は、複数の塗布部７と、メンテナンス部８と、制御装置９とを備える。 The substrate processing apparatus 1 includes a floating stage 2, a first guide rail 3_1, and a second guide rail 3_2. The substrate processing apparatus 1 also includes a first moving section 4_1 and a second moving section 4_2. Further, the substrate processing apparatus 1 includes a first main holding portion 5_1, a second main holding portion 5_2, a third main holding portion 5_3, a fourth main holding portion 5_4, a first sub holding portion 6_1, and a second main holding portion 5_1. and a sub holding portion 6_2. The substrate processing apparatus 1 also includes a plurality of coating units 7 , a maintenance unit 8 , and a control device 9 .
　なお、以下では、第１ガイドレール３＿１および第２ガイドレール３＿２を総称して「ガイドレール３」と記載することがある。また、第１移動部４＿１および第２移動部４＿２を総称して「移動部４」と記載することがある。また、第１主保持部５＿１～第４主保持部５＿４を総称して「主保持部５」と記載することがある。また、第１副保持部６＿１および第２副保持部６＿２を総称して「副保持部６」と記載することがある。 It should be noted that hereinafter, the first guide rail 3_1 and the second guide rail 3_2 may be collectively referred to as "the guide rail 3". Also, the first moving section 4_1 and the second moving section 4_2 may be collectively referred to as the "moving section 4". Also, the first main holding portion 5_1 to the fourth main holding portion 5_4 may be collectively referred to as the "main holding portion 5". Also, the first sub-retaining portion 6_1 and the second sub-retaining portion 6_2 may be collectively referred to as the "sub-retaining portion 6".
　浮上ステージ２は、多数の噴出口（図示せず）を有する。浮上ステージ２は、圧縮されたガス（例えば、空気）を噴出口から基板Ｓの下面に向けて吹き付け、基板Ｓに対して上方へ作用する力（以下、「浮上力」と記載する）を与える。浮上ステージ２は、浮上力を与えることで、主保持部５および副保持部６に保持された基板Ｓの浮上高を調整する。すなわち、浮上ステージ２は、主保持部５および副保持部６に保持された基板Ｓに対して下方からガスを吹き付けて、基板Ｓの浮上高を調整する。 The levitation stage 2 has a large number of ejection ports (not shown). The levitation stage 2 blows compressed gas (for example, air) from an ejection port toward the lower surface of the substrate S to apply a force acting upward on the substrate S (hereinafter referred to as “levitation force”). . The levitation stage 2 adjusts the levitation height of the substrate S held by the main holding section 5 and the sub holding section 6 by applying a levitation force. That is, the floating stage 2 adjusts the floating height of the substrate S by spraying gas from below onto the substrate S held by the main holding portion 5 and the sub-holding portion 6 .
　浮上ステージ２は、基板Ｓが搬入される搬入ステージ、および基板Ｓが搬出される搬出ステージを含む。搬入ステージは、基板処理装置１の後方側に設けられる。搬出ステージは、基板処理装置１の前方側に設けられる。 The floating stage 2 includes a loading stage into which the substrate S is loaded and a loading stage into which the substrate S is loaded. The loading stage is provided on the rear side of the substrate processing apparatus 1 . The carry-out stage is provided on the front side of the substrate processing apparatus 1 .
　なお、浮上ステージ２は、搬送方向（Ｙ軸方向）に沿って複数設けられてもよい。塗布部７の下方に位置する浮上ステージ２における基板Ｓの浮上高の範囲は、他の浮上ステージ２における基板Ｓの浮上高の範囲よりも狭い。例えば、塗布部７の下方に位置する浮上ステージ２における基板Ｓの浮上高の範囲は、３０～６０μｍである。他の浮上ステージ２における基板Ｓの浮上高の範囲は、２００～２０００μｍである。 A plurality of levitation stages 2 may be provided along the transport direction (Y-axis direction). The floating height range of the substrate S in the floating stage 2 positioned below the coating section 7 is narrower than the floating height range of the substrate S in the other floating stages 2 . For example, the floating height range of the substrate S on the floating stage 2 located below the coating section 7 is 30 to 60 μm. The floating height range of the substrate S in the other floating stages 2 is 200 to 2000 μm.
　例えば、塗布部７の下方に位置する浮上ステージ２では、圧縮された空気を基板Ｓの下面に向けて吐出するとともに、基板Ｓと浮上ステージ２との間の空気を吸引することによって、基板Ｓの浮上高を調整してもよい。 For example, the floating stage 2 located below the coating section 7 discharges compressed air toward the lower surface of the substrate S, and sucks the air between the substrate S and the floating stage 2, so that the substrate S may be adjusted.
　第１ガイドレール３＿１および第２ガイドレール３＿２は、左右方向（Ｘ軸方向）に並べられ、且つ、搬送方向（Ｙ軸方向）に沿って延在する。 The first guide rail 3_1 and the second guide rail 3_2 are arranged in the horizontal direction (X-axis direction) and extend along the transport direction (Y-axis direction).
　第１ガイドレール３＿１および第２ガイドレール３＿２は、左右方向（Ｘ軸方向）において、浮上ステージ２を挟むように配置される。第１ガイドレール３＿１は、浮上ステージ２のＸ軸正方向側に配置され、第２ガイドレール３＿２は、浮上ステージ２のＸ軸負方向側に配置される。第１ガイドレール３＿１および第２ガイドレール３＿２は、例えば、グラナイトによって構成される。搬送方向（Ｙ軸方向）に直交するガイドレール３の断面は、たとえば矩形状である。 The first guide rail 3_1 and the second guide rail 3_2 are arranged so as to sandwich the levitation stage 2 in the left-right direction (X-axis direction). The first guide rail 3_1 is arranged on the X-axis positive direction side of the levitation stage 2 , and the second guide rail 3_2 is arranged on the X-axis negative direction side of the levitation stage 2 . The first guide rail 3_1 and the second guide rail 3_2 are made of granite, for example. A cross section of the guide rail 3 orthogonal to the transport direction (Y-axis direction) is, for example, rectangular.
　第１移動部４＿１は、第１ガイドレール３＿１上に設けられ、第１ガイドレール３＿１に沿って移動する。第２移動部４＿２は、第２ガイドレール３＿２上に設けられ、第２ガイドレール３＿２に沿って移動する。なお、第１移動部４＿１および第２移動部４＿２は、それぞれモータ等の駆動部を有しており、各々独立して移動することが可能である。 The first moving part 4_1 is provided on the first guide rail 3_1 and moves along the first guide rail 3_1. The second moving part 4_2 is provided on the second guide rail 3_2 and moves along the second guide rail 3_2. The first moving part 4_1 and the second moving part 4_2 each have a driving part such as a motor, and can move independently.
　複数の主保持部５は、第１移動部４＿１および第２移動部４＿２上にそれぞれ設けられ、基板Ｓの下方から基板Ｓを保持する。 A plurality of main holding parts 5 are provided on the first moving part 4_1 and the second moving part 4_2, respectively, and hold the substrate S from below.
　具体的には、複数の主保持部５のうち、第１主保持部５＿１および第２主保持部５＿２は、第１移動部４＿１上に設けられ、第３主保持部５＿３および第４主保持部５＿４は、第２移動部４＿２上に設けられる。第１主保持部５＿１および第２主保持部５＿２は、第１移動部４＿１上において、搬送方向（Ｙ軸方向）に沿って第１主保持部５＿１および第２主保持部５＿２の順番で並べられる。また、第３主保持部５＿３および第４主保持部５＿４は、第２移動部４＿２上において、搬送方向（Ｙ軸方向）に沿って第３主保持部５＿３および第４主保持部５＿４の順番で並べられる。なお、複数の主保持部５の数は、４つに限定されない。 Specifically, among the plurality of main holding portions 5, the first main holding portion 5_1 and the second main holding portion 5_2 are provided on the first moving portion 4_1, and the third main holding portion 5_3 and the fourth main holding portion 5_3 are provided on the first moving portion 4_1. The part 5_4 is provided on the second moving part 4_2. The first main holding portion 5_1 and the second main holding portion 5_2 are arranged in the order of the first main holding portion 5_1 and the second main holding portion 5_2 along the transport direction (Y-axis direction) on the first moving portion 4_1. be done. Further, the third main holding portion 5_3 and the fourth main holding portion 5_4 are arranged on the second moving portion 4_2 in the order of the third main holding portion 5_3 and the fourth main holding portion 5_4 along the transport direction (Y-axis direction). be sorted by Note that the number of main holding portions 5 is not limited to four.
　副保持部６は、各移動部４上において隣り合う主保持部５の間に設けられ、基板Ｓの下方から基板Ｓを保持する。 The sub-holding part 6 is provided between the adjacent main holding parts 5 on each moving part 4 and holds the substrate S from below.
　具体的には、第１副保持部６＿１は、第１移動部４＿１上において隣り合う第１主保持部５＿１および第２主保持部５＿２の間に設けられる。また、第２副保持部６＿２は、第２移動部４＿２上において隣り合う第３主保持部５＿３および第４主保持部５＿４の間に設けられる。なお、複数の副保持部６の数は、２つに限定されない。 Specifically, the first sub holding portion 6_1 is provided between the first main holding portion 5_1 and the second main holding portion 5_2 adjacent to each other on the first moving portion 4_1. The second sub-retaining portion 6_2 is provided between the third main retaining portion 5_3 and the fourth main retaining portion 5_4 adjacent to each other on the second moving portion 4_2. Note that the number of the plurality of sub holding portions 6 is not limited to two.
　実施形態において複数（ここでは４つ）の主保持部５は、基板Ｓの四隅を基板Ｓの下方から保持する。また、複数（ここでは、２つ）の副保持部６は、基板Ｓのうち主保持部５によって保持されてない側縁を基板Ｓの下方から保持する。基板Ｓは、複数の主保持部５によって四隅を保持され、複数の副保持部６によって側縁を保持され、且つ、浮上ステージ２によって浮上した状態で、第１移動部４＿１および第２移動部４＿２によって搬送方向（Ｙ軸正方向）に沿って搬送される。 In the embodiment, a plurality of (here, four) main holding parts 5 hold the four corners of the substrate S from below. In addition, the plurality of (here, two) sub-holding portions 6 hold the side edges of the substrate S that are not held by the main holding portion 5 from below. The substrate S is held at its four corners by a plurality of main holding portions 5, held at its side edges by a plurality of sub-holding portions 6, and floated by the levitation stage 2. 4_2 is transported along the transport direction (Y-axis positive direction).
　このように、基板処理装置１では、基板Ｓの搬送中に基板Ｓのうち主保持部５によって保持されてない側縁を副保持部６によって保持することにより、搬送される基板Ｓの撓みを抑制することができる。 As described above, in the substrate processing apparatus 1, the sub-holding portion 6 holds the side edge of the substrate S that is not held by the main holding portion 5 while the substrate S is being conveyed, thereby reducing the bending of the substrate S being conveyed. can be suppressed.
　塗布部７は、搬送方向（Ｙ軸正方向）に沿って搬送される基板Ｓに対して機能液を塗布する。機能液は、インクである。塗布部７は、浮上ステージ２によって浮上高が調整された基板Ｓに機能液を塗布する。具体的には、塗布部７は、基板Ｓに機能液を吐出することによって、機能液を基板Ｓに塗布する。塗布部７は、左右方向（Ｘ軸方向）に沿って複数配置される。図１に示す例では、左右方向（Ｘ軸方向）に沿って７つの塗布部７が配置された状態を示しているが、塗布部７の数は、これに限られない。塗布部７は、機能液を吐出する複数のヘッドを有し、各ヘッドから機能液を基板Ｓに吐出する。 The coating unit 7 applies the functional liquid to the substrate S transported along the transport direction (Y-axis positive direction). The functional liquid is ink. The application unit 7 applies the functional liquid to the substrate S whose floating height is adjusted by the floating stage 2 . Specifically, the coating unit 7 coats the substrate S with the functional liquid by discharging the functional liquid onto the substrate S. As shown in FIG. A plurality of application units 7 are arranged along the left-right direction (X-axis direction). Although the example shown in FIG. 1 shows a state in which seven application units 7 are arranged along the left-right direction (X-axis direction), the number of application units 7 is not limited to this. The coating unit 7 has a plurality of heads for ejecting functional liquid, and the functional liquid is ejected onto the substrate S from each head.
　塗布部７は、Ｙ軸方向に並べられ、且つ、Ｘ軸方向に沿って延在する一対のレール１０に沿って移動可能である。一対のレール１０は、例えば、浮上ステージ２に対して右方に延びるように設けられる。浮上ステージ２の右方における一対のレール１０間には、メンテナンス部８が設けられる。塗布部７は、メンテナンス部８の上方となる位置と、基板Ｓに機能液を吐出する位置との間を移動可能である。塗布部７は、駆動装置、例えば、リニアモータによって、一対のレール１０に沿って左右方向に移動する。複数の塗布部７は、独立して左右方向に移動してもよく、一体に左右方向に移動してもよい。 The applicator 7 is movable along a pair of rails 10 arranged in the Y-axis direction and extending along the X-axis direction. A pair of rails 10 are provided, for example, so as to extend rightward with respect to the levitation stage 2 . A maintenance section 8 is provided between the pair of rails 10 on the right side of the levitation stage 2 . The application unit 7 is movable between a position above the maintenance unit 8 and a position where the functional liquid is discharged onto the substrate S. As shown in FIG. The application unit 7 is moved laterally along a pair of rails 10 by a driving device such as a linear motor. The plurality of application units 7 may move independently in the left-right direction, or may move together in the left-right direction.
　メンテナンス部８は、塗布部７のヘッドのメンテナンスを行い、塗布部７のヘッドの吐出不良などを解消、または防止する。なお、メンテナンス部８は、浮上ステージ２の上方に設けられてもよい。 The maintenance section 8 performs maintenance of the head of the coating section 7 and eliminates or prevents ejection failures of the head of the coating section 7 . Note that the maintenance section 8 may be provided above the levitation stage 2 .
　制御装置９は、たとえばコンピュータであり、制御部９１と記憶部９２とを備える。記憶部９２には、基板処理装置１において実行される各種の処理を制御するプログラムが格納される。制御部９１は、記憶部９２に記憶されたプログラムを読み出して実行することによって基板処理装置１の動作を制御する。 The control device 9 is, for example, a computer, and includes a control section 91 and a storage section 92 . The storage unit 92 stores programs for controlling various processes executed in the substrate processing apparatus 1 . The control unit 91 controls the operation of the substrate processing apparatus 1 by reading and executing programs stored in the storage unit 92 .
　なお、かかるプログラムは、コンピュータによって読み取り可能な記憶媒体に記録されていたものであって、記憶媒体から制御装置９の記憶部９２にインストールされたものであってもよい。コンピュータによって読み取り可能な記憶媒体としては、たとえばハードディスク（ＨＤ）、フレキシブルディスク（ＦＤ）、コンパクトディスク（ＣＤ）、マグネットオプティカルディスク（ＭＯ）、メモリカードなどがある。 The program may be recorded in a computer-readable storage medium and installed in the storage unit 92 of the control device 9 from the storage medium. Examples of computer-readable storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.
＜主保持部＞
　次に、主保持部５の構成について図２および図３を参照して説明する。図２は、実施形態に係る主保持部５の模式的な平面図である。また、図３は、実施形態に係る主保持部５の模式的な側面図である。なお、図２および図３には、一例として第１主保持部５＿１を示しているが、第２主保持部５＿２～第４主保持部５＿４の構成も第１主保持部５＿１と同様である。 <Main holding part>
Next, the configuration of the main holding portion 5 will be described with reference to FIGS. 2 and 3. FIG. FIG. 2 is a schematic plan view of the main holding portion 5 according to the embodiment. Moreover, FIG. 3 is a schematic side view of the main holding portion 5 according to the embodiment. Although FIGS. 2 and 3 show the first main holding portion 5_1 as an example, the configurations of the second main holding portion 5_2 to the fourth main holding portion 5_4 are similar to that of the first main holding portion 5_1. .
　図２および図３に示すように、主保持部５は、ベース部５０と、第１調整部５１と、第２調整部５２と、回動部５３と、アーム部５４と、第１吸着部５５とを備える。 As shown in FIGS. 2 and 3, the main holding portion 5 includes a base portion 50, a first adjustment portion 51, a second adjustment portion 52, a rotating portion 53, an arm portion 54, and a first suction portion. 55.
　第１吸着部５５は、基板Ｓを吸着保持する。具体的には、第１吸着部５５は、複数の吸着パッド５５１を備える。複数の吸着パッド５５１は、水平方向（ここでは、Ｙ軸方向）に並んで設けられる。なお、ここでは、第１吸着部５５が３つの吸着パッド５５１を備える場合の例を示しているが、吸着パッド５５１の数は、３つに限定されない。第１吸着部５５は、複数の吸着パッド５５１によって、基板Ｓの下面を吸着し、基板Ｓを保持する。 The first adsorption part 55 adsorbs and holds the substrate S. Specifically, the first suction unit 55 includes a plurality of suction pads 551 . A plurality of suction pads 551 are provided side by side in the horizontal direction (here, Y-axis direction). Although an example in which the first suction unit 55 includes three suction pads 551 is shown here, the number of suction pads 551 is not limited to three. The first suction unit 55 holds the substrate S by sucking the lower surface of the substrate S with a plurality of suction pads 551 .
　ベース部５０、第１調整部５１、第２調整部５２、回動部５３およびアーム部５４は、移動部４に対する第１吸着部５５の相対位置を調整する調整部の一例である。 The base portion 50 , the first adjusting portion 51 , the second adjusting portion 52 , the rotating portion 53 and the arm portion 54 are examples of adjusting portions that adjust the relative position of the first suction portion 55 with respect to the moving portion 4 .
　ベース部５０は、移動部４上に固定される。第１調整部５１は、ベース部５０上に設けられ、ベース部５０上を左右方向（Ｘ軸方向）に沿って移動可能である。第２調整部５２は、第１調整部５１上に設けられ、第１調整部５１上を前後方向（Ｙ軸方向）に沿って移動可能である。回動部５３は、第２調整部５２上に設けられ、鉛直軸（Ｚ軸）周りに回転可能である。アーム部５４は、水平方向に延在する部材であり、基端部において回動部５３に支持され、先端部において第１吸着部５５を支持する。 The base part 50 is fixed on the moving part 4 . The first adjusting portion 51 is provided on the base portion 50 and is movable on the base portion 50 along the left-right direction (X-axis direction). The second adjuster 52 is provided on the first adjuster 51 and is movable on the first adjuster 51 in the front-rear direction (Y-axis direction). The rotating portion 53 is provided on the second adjusting portion 52 and is rotatable around the vertical axis (Z-axis). The arm portion 54 is a member that extends in the horizontal direction, is supported by the rotating portion 53 at its proximal end, and supports the first adsorption portion 55 at its distal end.
　このように、調整部は、第１調整部５１を左右方向（Ｘ軸方向）に沿って移動させることにより、第１吸着部５５を左右方向（Ｘ軸方向）に移動させることができる。すなわち、第１調整部５１は、移動部４に対する第１吸着部５５の位置を左右方向（Ｘ軸方向）に沿って調整することができる。 In this way, the adjustment section can move the first suction section 55 in the left-right direction (X-axis direction) by moving the first adjustment section 51 in the left-right direction (X-axis direction). That is, the first adjusting portion 51 can adjust the position of the first suction portion 55 with respect to the moving portion 4 along the left-right direction (X-axis direction).
　また、調整部は、第２調整部５２を前後方向（Ｙ軸方向）に沿って移動させることにより、第１吸着部５５を前後方向（Ｙ軸方向）に移動させることができる。すなわち、第２調整部５２は、移動部４に対する第１吸着部５５の位置を前後方向（Ｙ軸方向）に沿って調整することができる。 In addition, the adjustment section can move the first suction section 55 in the front-rear direction (Y-axis direction) by moving the second adjustment section 52 in the front-rear direction (Y-axis direction). That is, the second adjustment section 52 can adjust the position of the first suction section 55 with respect to the moving section 4 along the front-rear direction (Y-axis direction).
　また、調整部は、回動部５３が鉛直軸（Ｚ軸）まわりに回動することにより、回動部５３にアーム部５４を介して支持された第１吸着部５５を鉛直軸（Ｚ軸）まわりに回動させることができる。すなわち、回動部５３は、第３調整部の一例であり、移動部４に対する第１吸着部５５の位置を鉛直軸（Ｚ軸方向）を中心とする周方向に沿って調整することができる。 In addition, the adjusting section moves the first adsorption section 55 supported by the rotating section 53 via the arm section 54 to the vertical axis (Z-axis) by rotating the rotating section 53 about the vertical axis (Z-axis). ). That is, the rotating portion 53 is an example of a third adjusting portion, and can adjust the position of the first suction portion 55 with respect to the moving portion 4 along the circumferential direction centered on the vertical axis (Z-axis direction). .
　なお、第１調整部５１および第２調整部５２は、それぞれモータ等の駆動部を有しており、各々独立して移動することが可能である。一方、回動部５３は、たとえば軸受であって、駆動部を有しておらず、第１調整部５１および第２調整部５２の動きに追従するように第１吸着部５５を回動させる。なお、これに限らず、回動部５３に駆動部が設けられてもよい。 It should be noted that the first adjusting section 51 and the second adjusting section 52 each have a driving section such as a motor, and can move independently. On the other hand, the rotating portion 53 is, for example, a bearing and does not have a driving portion, and rotates the first adsorption portion 55 so as to follow the movements of the first adjusting portion 51 and the second adjusting portion 52. . In addition, not only this but a drive part may be provided in the rotation part 53. FIG.
　ところで、一対のガイドレール３は、基板Ｓの搬送方向である前後方向（Ｙ軸方向）に沿って延在している。一例として、一対のガイドレール３の前後方向（Ｙ軸方向）における長さは、３～７ｍ程度である。このように、一対のガイドレール３は長いため、完全に真っ直ぐに形成することは難しく、左右方向（Ｘ軸方向）にたとえば数μｍ程度の歪みが生じるおそれがある。同様に、一対のガイドレール３には、鉛直方向（Ｚ軸方向）にも数μｍ程度の歪みが生じるおそれがある。また、仮に一対のガイドレール３を真っ直ぐに形成できたとしても、環境変化（たとえば、温度変化）によって事後的に歪みが生じるおそれがある。 By the way, the pair of guide rails 3 extends along the front-rear direction (Y-axis direction), which is the transport direction of the substrate S. As an example, the length of the pair of guide rails 3 in the front-rear direction (Y-axis direction) is approximately 3 to 7 m. As described above, since the pair of guide rails 3 is long, it is difficult to form them completely straight, and there is a possibility that a distortion of, for example, several μm may occur in the left-right direction (X-axis direction). Similarly, the pair of guide rails 3 may be distorted by several μm in the vertical direction (Z-axis direction). Moreover, even if the pair of guide rails 3 can be formed straight, there is a possibility that they will be distorted afterward due to environmental changes (for example, temperature changes).
　このように、一対のガイドレール３に歪みが存在していると、複数（ここでは、４つ）の主保持部５のうち隣り合う２つの主保持部５の間の距離が変化する。すなわち、複数の主保持部５の相対位置が変化する。言い換えれば、複数の第１吸着部５５の相対位置が変化する。複数の第１吸着部５５の相対位置が変化すると、第１吸着部５５と基板Ｓとの位置関係が変化する。これにより、基板Ｓに対して第１吸着部５５がずれることで、基板Ｓを高精度に搬送することが困難となる。特に、実施形態に係る基板処理装置１のように、第１移動部４＿１および第２移動部４＿２が一体ではなく独立している場合、ガイドレール３の歪みによって複数の主保持部５の相対位置がずれやすい。 Thus, when the pair of guide rails 3 is distorted, the distance between two adjacent main holding portions 5 among the plurality of (here, four) main holding portions 5 changes. That is, the relative positions of the plurality of main holding portions 5 change. In other words, the relative positions of the plurality of first adsorption portions 55 change. When the relative positions of the plurality of first suction units 55 change, the positional relationship between the first suction units 55 and the substrate S changes. As a result, the first suction unit 55 is displaced with respect to the substrate S, making it difficult to convey the substrate S with high accuracy. In particular, when the first moving part 4_1 and the second moving part 4_2 are not integrated but independent as in the substrate processing apparatus 1 according to the embodiment, the distortion of the guide rails 3 causes the relative positions of the plurality of main holding parts 5 to change. slips easily.
　そこで、基板処理装置１では、基板Ｓを搬送する間、複数の主保持部５のうち隣り合う２つの主保持部５間の距離が予め定められた距離となるように、各主保持部５の第１調整部５１および第２調整部５２によって移動部４に対する第１吸着部５５の位置を調整する。 Therefore, in the substrate processing apparatus 1, each of the main holding portions 5 is arranged such that the distance between two adjacent main holding portions 5 among the plurality of main holding portions 5 is a predetermined distance while the substrate S is being transported. The position of the first adsorption portion 55 with respect to the moving portion 4 is adjusted by the first adjusting portion 51 and the second adjusting portion 52 of .
＜副保持部＞
　次に、副保持部６の構成について図４および図５を参照して説明する。図４は、実施形態に係る副保持部６の模式的な平面図である。また、図５は、実施形態に係る副保持部６の模式的な側面図である。なお、図４および図５には、一例として第１副保持部６＿１を示しているが、第２副保持部６＿２の構成も第１副保持部６＿１と同様である。 <Secondary holding part>
Next, the configuration of the sub-holding portion 6 will be described with reference to FIGS. 4 and 5. FIG. FIG. 4 is a schematic plan view of the sub-holding portion 6 according to the embodiment. Moreover, FIG. 5 is a schematic side view of the sub-holding portion 6 according to the embodiment. Although FIGS. 4 and 5 show the first sub-retaining portion 6_1 as an example, the configuration of the second sub-retaining portion 6_2 is the same as that of the first sub-retaining portion 6_1.
　図４および図５に示すように、副保持部６は、一対のベース部６１と、アーム部６２と、第２吸着部６３とを備える。 As shown in FIGS. 4 and 5, the sub-holding section 6 includes a pair of base sections 61, an arm section 62, and a second suction section 63. As shown in FIGS.
　第２吸着部６３は、基板Ｓを吸着保持する。具体的には、第２吸着部６３は、複数の吸着パッド６３１を備える。複数の吸着パッド６３１は、水平方向（ここでは、Ｙ軸方向）に並んで設けられる。なお、ここでは、第２吸着部６３が３つの吸着パッド６３１を備える場合の例を示しているが、吸着パッド６３１の数は、３つに限定されない。第２吸着部６３は、複数の吸着パッド６３１によって、基板Ｓの下面を吸着し、基板Ｓを保持する。 The second adsorption part 63 adsorbs and holds the substrate S. Specifically, the second suction unit 63 includes a plurality of suction pads 631 . The plurality of suction pads 631 are provided side by side in the horizontal direction (here, the Y-axis direction). Although an example in which the second suction unit 63 includes three suction pads 631 is shown here, the number of suction pads 631 is not limited to three. The second suction unit 63 holds the substrate S by sucking the lower surface of the substrate S with a plurality of suction pads 631 .
　第２吸着部６３は、第１吸着部５５よりも基板Ｓの搬送方向である前後方向（Ｙ軸方向）に沿った長さが長い。なお、第２吸着部６３の前後方向（Ｙ軸方向）に沿った長さは、第１吸着部５５の前後方向（Ｙ軸方向）に沿った長さと同一であってもよく、第１吸着部５５の前後方向（Ｙ軸方向）に沿った長さよりも短くてもよい。 The second suction part 63 is longer than the first suction part 55 in the front-rear direction (Y-axis direction), which is the transport direction of the substrate S. The length of the second suction portion 63 along the front-rear direction (Y-axis direction) may be the same as the length of the first suction portion 55 along the front-rear direction (Y-axis direction). It may be shorter than the length along the front-rear direction (Y-axis direction) of the portion 55 .
　一対のベース部６１およびアーム部６２は、第１吸着部５５の位置の調整に基づく基板Ｓの移動に追従して移動部４に対する第２吸着部６３の相対位置を調整する追従部の一例である。 The pair of base portion 61 and arm portion 62 is an example of a following portion that adjusts the relative position of the second suction portion 63 with respect to the moving portion 4 by following the movement of the substrate S based on the adjustment of the position of the first suction portion 55 . be.
　一対のベース部６１は、移動部４上に固定される。アーム部６２は、水平方向に延在する略Ｔ字状の部材であり、一対の基端部が一対のベース部６１内に球体６１ａを介してそれぞれ水平移動可能且つ回動可能に支持され、１つの先端部において第２吸着部６３を支持する。 A pair of base parts 61 are fixed on the moving part 4 . The arm portion 62 is a substantially T-shaped member extending in the horizontal direction, and a pair of base end portions thereof are supported in the pair of base portions 61 via a spherical body 61a so as to be horizontally movable and rotatable. One tip supports the second adsorption portion 63 .
　追従部は、左右方向（Ｘ軸方向）に沿った基板Ｓの移動に追従してアーム部６２が左右方向（Ｘ軸方向）に移動することにより、アーム部６２に支持された第２吸着部６３を左右方向（Ｘ軸方向）に移動させることができる。すなわち、アーム部６２は、第１吸着部５５の位置の調整に基づく左右方向（Ｘ軸方向）に沿った基板Ｓの移動に追従して移動部４に対する第２吸着部６３の位置を左右方向（Ｘ軸方向）に調整することができる。 The follow-up portion moves the arm portion 62 in the left-right direction (X-axis direction) following the movement of the substrate S along the left-right direction (X-axis direction). 63 can be moved in the left-right direction (X-axis direction). That is, the arm part 62 follows the movement of the substrate S along the horizontal direction (X-axis direction) based on the adjustment of the position of the first suction part 55, and moves the position of the second suction part 63 with respect to the moving part 4 in the horizontal direction. (X-axis direction).
　また、追従部は、前後方向（Ｙ軸方向）に沿った基板Ｓの移動に追従してアーム部６２が前後方向（Ｙ軸方向）に移動することにより、アーム部６２に支持された第２吸着部６３を前後方向（Ｙ軸方向）に移動させることができる。すなわち、アーム部６２は、第１吸着部５５の位置の調整に基づく前後方向（Ｙ軸方向）に沿った基板Ｓの移動に追従して移動部４に対する第２吸着部６３の位置を前後方向（Ｙ軸方向）に調整することができる。 Further, the follow-up portion moves the arm portion 62 in the front-rear direction (Y-axis direction) by following the movement of the substrate S along the front-rear direction (Y-axis direction), whereby the second substrate supported by the arm portion 62 moves. The suction portion 63 can be moved in the front-rear direction (Y-axis direction). That is, the arm part 62 follows the movement of the substrate S along the front-rear direction (Y-axis direction) based on the adjustment of the position of the first suction part 55 and changes the position of the second suction part 63 with respect to the moving part 4 in the front-rear direction. (Y-axis direction).
　また、追従部は、鉛直軸（Ｚ軸）を中心とする周方向に沿った基板Ｓの移動に追従してアーム部６２が鉛直軸（Ｚ軸）まわりに回動することにより、アーム部６２に支持された第２吸着部６３を鉛直軸（Ｚ軸）まわりに回動させることができる。すなわち、アーム部６２は、第１吸着部５５の位置の調整に基づく鉛直軸（Ｚ軸）を中心とする周方向に沿った基板Ｓの移動に追従して移動部４に対する第２吸着部６３の位置を鉛直軸（Ｚ軸）を中心とする周方向に調整することができる。 In addition, the follow-up portion follows the movement of the substrate S along the circumferential direction about the vertical axis (Z-axis) and rotates the arm portion 62 around the vertical axis (Z-axis). can be rotated around the vertical axis (Z-axis). That is, the arm part 62 follows the movement of the substrate S along the circumferential direction about the vertical axis (Z-axis) based on the adjustment of the position of the first suction part 55 and moves the second suction part 63 relative to the moving part 4 . can be adjusted in the circumferential direction about the vertical axis (Z-axis).
　ところで、基板処理装置１では、基板Ｓの搬送中に基板Ｓのうち主保持部５によって保持されてない側縁を副保持部６によって保持することにより、搬送される基板Ｓの撓みを抑制している。さらに、基板処理装置１では、各主保持部５の第１調整部５１および第２調整部５２によって移動部４に対する第１吸着部５５の位置を調整する。 By the way, in the substrate processing apparatus 1, the side edges of the substrate S that are not held by the main holding portion 5 are held by the sub-holding portion 6 while the substrate S is being transferred, thereby suppressing the bending of the substrate S being transferred. ing. Further, in the substrate processing apparatus 1 , the position of the first suction portion 55 with respect to the moving portion 4 is adjusted by the first adjusting portion 51 and the second adjusting portion 52 of each main holding portion 5 .
　このように、移動部４に対する第１吸着部５５の位置が調整されることにより、基板Ｓが移動する。基板Ｓが移動すると、副保持部６の第２吸着部６３と基板Ｓとの位置関係が変化する。これにより、第２吸着部６３に対して基板Ｓがずれることで、基板Ｓを高精度に搬送することが困難となる。 Thus, the substrate S is moved by adjusting the position of the first suction part 55 with respect to the moving part 4 . When the substrate S moves, the positional relationship between the second suction portion 63 of the sub-holding portion 6 and the substrate S changes. As a result, the substrate S is displaced with respect to the second suction unit 63, making it difficult to convey the substrate S with high accuracy.
　そこで、実施形態に係る基板処理装置１では、基板Ｓを搬送する間、副保持部６のアーム部６２によって第１吸着部５５の位置の調整に基づく基板Ｓの移動に追従して移動部４に対する第２吸着部６３の位置を調整する。これにより、搬送される基板Ｓの撓みを抑制するとともに、第２吸着部６３に対する基板Ｓの位置ずれを抑制することができる。すなわち、基板Ｓを搬送する間、移動部４に対する第１吸着部５５の位置が調整される場合であっても、第２吸着部６３と基板Ｓとの位置関係を適切に保つことができる。 Therefore, in the substrate processing apparatus 1 according to the embodiment, while the substrate S is being transported, the movement of the substrate S based on the adjustment of the position of the first suction unit 55 is followed by the arm unit 62 of the sub-holding unit 6 to move the moving unit 4 . Adjust the position of the second adsorption portion 63 with respect to the . As a result, bending of the transported substrate S can be suppressed, and displacement of the substrate S with respect to the second suction unit 63 can be suppressed. That is, even when the position of the first suction unit 55 with respect to the moving unit 4 is adjusted while the substrate S is transported, the positional relationship between the second suction unit 63 and the substrate S can be properly maintained.
＜基板処理装置の処理フロー＞
　次に、実施形態に係る基板処理装置１が実行する処理の手順について図６を参照して説明する。図６は、実施形態に係る基板処理装置１が実行する処理の手順を示すフローチャートである。図６に示す各処理は、制御装置９による制御に従って実行される。 <Processing Flow of Substrate Processing Apparatus>
Next, a procedure of processing executed by the substrate processing apparatus 1 according to the embodiment will be described with reference to FIG. FIG. 6 is a flow chart showing the procedure of processing executed by the substrate processing apparatus 1 according to the embodiment. Each process shown in FIG. 6 is executed under the control of the control device 9 .
　基板処理装置１は、保持工程を行う（ステップＳ１０１）。基板処理装置１は、浮上ステージ２に搬送された基板Ｓを複数の主保持部５および副保持部６によって保持する。具体的には、基板処理装置１は、基板Ｓの四隅を各主保持部５の第１吸着部５５によって吸着し且つ基板Ｓの側縁を副保持部６の第２吸着部６３によって吸着することにより、基板Ｓを保持する。 The substrate processing apparatus 1 performs a holding process (step S101). The substrate processing apparatus 1 holds the substrate S conveyed to the floating stage 2 by a plurality of main holding parts 5 and sub holding parts 6 . Specifically, the substrate processing apparatus 1 sucks the four corners of the substrate S with the first suction portions 55 of the main holding portions 5 and the side edges of the substrate S with the second suction portions 63 of the sub-holding portions 6 . Thus, the substrate S is held.
　基板処理装置１は、搬送工程を行う（ステップＳ１０２）。基板処理装置１は、一対のガイドレール３に沿って一対の移動部４を移動させることにより、基板Ｓを搬送方向に沿って搬送する。 The substrate processing apparatus 1 performs a transfer process (step S102). The substrate processing apparatus 1 transports the substrate S along the transport direction by moving the pair of moving parts 4 along the pair of guide rails 3 .
　基板処理装置１は、調整工程を行う（ステップＳ１０３）。基板処理装置１は、基板Ｓを搬送する間、各主保持部５の第１調整部５１および第２調整部５２によって移動部４に対する第１吸着部５５の位置を調整する。このとき、基板処理装置１は、副保持部６のアーム部６２によって第１吸着部５５の位置の調整に基づく基板Ｓの移動に追従して第２吸着部６３の位置を調整する。 The substrate processing apparatus 1 performs an adjustment process (step S103). The substrate processing apparatus 1 adjusts the position of the first suction section 55 with respect to the moving section 4 by the first adjustment section 51 and the second adjustment section 52 of each main holding section 5 while the substrate S is being transported. At this time, the substrate processing apparatus 1 adjusts the position of the second suction portion 63 by following the movement of the substrate S based on the adjustment of the position of the first suction portion 55 by the arm portion 62 of the sub-holding portion 6 .
　基板処理装置１は、塗布工程を行う（ステップＳ１０４）。基板処理装置１は、搬送方向に沿って搬送される基板Ｓに塗布部７から機能液を吐出し、基板Ｓに機能液を塗布する。機能液が塗布された基板Ｓは、浮上ステージ２から搬出される。 The substrate processing apparatus 1 performs a coating process (step S104). The substrate processing apparatus 1 applies the functional liquid to the substrate S by discharging the functional liquid from the application unit 7 onto the substrate S that is transported along the transport direction. The substrate S coated with the functional liquid is unloaded from the floating stage 2 .
＜変形例＞
　基板処理装置の構成は、実施形態において示した構成に限定されない。そこで、以下では、実施形態の変形例に係る基板処理装置の構成について図７～図９を参照して説明する。図７は、変形例に係る基板処理装置１Ａの一部を示す模式的な平面図である。また、図８は、変形例に係る副保持部１１の模式的な平面図である。また、図９は、変形例に係る副保持部１１の模式的な平面図である。なお、図８および図９には、一例として第１副保持部１１＿１を示しているが、第２副保持部１１＿２の構成も第１副保持部１１＿１と同様である。 <Modification>
The configuration of the substrate processing apparatus is not limited to the configuration shown in the embodiment. Therefore, the configuration of a substrate processing apparatus according to a modification of the embodiment will be described below with reference to FIGS. 7 to 9. FIG. FIG. 7 is a schematic plan view showing part of a substrate processing apparatus 1A according to a modification. Also, FIG. 8 is a schematic plan view of the sub-holding portion 11 according to the modification. Also, FIG. 9 is a schematic plan view of the sub-holding portion 11 according to the modification. Although FIGS. 8 and 9 show the first sub-retaining portion 11_1 as an example, the configuration of the second sub-retaining portion 11_2 is similar to that of the first sub-retaining portion 11_1.
　図７に示すように、変形例に係る基板処理装置１Ａは、図１に示す第１副保持部６＿１および第２副保持部６＿２に代えて、第１副保持部１１＿１および第２副保持部１１＿２を備える。なお、以下では、第１副保持部１１＿１および第２副保持部１１＿２を総称して「副保持部１１」と記載することがある。 As shown in FIG. 7, a substrate processing apparatus 1A according to the modification includes a first sub-holding portion 11_1 and a second sub-holding portion instead of the first sub-holding portion 6_1 and second sub-holding portion 6_2 shown in FIG. 11_2. In the following description, the first sub-retaining portion 11_1 and the second sub-retaining portion 11_2 may be collectively referred to as the "sub-retaining portion 11".
　副保持部１１は、各移動部４において隣り合う主保持部５の間に設けられ、基板Ｓの下方から基板Ｓを保持する。 The sub-holding part 11 is provided between adjacent main holding parts 5 in each moving part 4 and holds the substrate S from below.
　具体的には、第１副保持部１１＿１は、第１移動部４＿１上において隣り合う第１主保持部５＿１および第２主保持部５＿２の間に設けられる。また、第２副保持部１１＿２は、第２移動部４＿２上において隣り合う第３主保持部５＿３および第４主保持部５＿４の間に設けられる。なお、複数の副保持部１１の数は、２つに限定されない。 Specifically, the first sub holding portion 11_1 is provided between the first main holding portion 5_1 and the second main holding portion 5_2 adjacent to each other on the first moving portion 4_1. The second sub-retaining portion 11_2 is provided between the third main retaining portion 5_3 and the fourth main retaining portion 5_4 adjacent to each other on the second moving portion 4_2. Note that the number of the plurality of sub holding portions 11 is not limited to two.
　図８および図９に示すように、副保持部１１は、ベース部１１０と、第１追従部１１１と、第２追従部１１２と、回動部１１３と、アーム部１１４と、第２吸着部６３Ａとを備える。 As shown in FIGS. 8 and 9, the sub-holding portion 11 includes a base portion 110, a first follower portion 111, a second follower portion 112, a rotating portion 113, an arm portion 114, and a second attracting portion. 63A.
　第２吸着部６３Ａは、厚さおよび前後方向（Ｙ軸方向）に沿った長さを除き、図４および図５に示す第２吸着部６３の構成と同様である。第２吸着部６３Ａの前後方向（Ｙ軸方向）に沿った長さは、第１吸着部５５の前後方向（Ｙ軸方向）に沿った長さと同一である。なお、第２吸着部６３Ａの前後方向（Ｙ軸方向）に沿った長さは、第１吸着部５５の前後方向（Ｙ軸方向）に沿った長さよりも長くてもよい。第２吸着部６３Ａは、第２吸着部６３と同様に、複数の吸着パッド５５１によって、基板Ｓの下面を吸着し、基板Ｓを保持する。 The second suction part 63A has the same configuration as the second suction part 63 shown in FIGS. 4 and 5 except for the thickness and the length along the front-rear direction (Y-axis direction). The length of the second suction portion 63A along the front-rear direction (Y-axis direction) is the same as the length of the first suction portion 55 along the front-rear direction (Y-axis direction). The length of the second suction portion 63A along the front-rear direction (Y-axis direction) may be longer than the length of the first suction portion 55 along the front-rear direction (Y-axis direction). The second suction part 63</b>A holds the substrate S by sucking the lower surface of the substrate S with the plurality of suction pads 551 similarly to the second suction part 63 .
　ベース部１１０、第１追従部１１１、第２追従部１１２、回動部１１３およびアーム部１１４は、第１吸着部５５の位置の調整に基づく基板Ｓの移動に追従して移動部４に対する第２吸着部６３の相対位置を調整する追従部の一例である。 The base portion 110 , the first follower portion 111 , the second follower portion 112 , the rotating portion 113 , and the arm portion 114 follow the movement of the substrate S based on the adjustment of the position of the first adsorption portion 55 and follow the movement of the moving portion 4 . 2 is an example of a following unit that adjusts the relative position of the suction unit 63. FIG.
　ベース部１１０は、移動部４上に固定される。第１追従部１１１は、ベース部５０上に設けられ、ベース部５０上を左右方向（Ｘ軸方向）に沿って移動可能である。第２追従部１１２は、第１追従部１１１上に設けられ、第１追従部１１１上を前後方向（Ｙ軸方向）に沿って移動可能である。回動部１１３は、第２追従部１１２上に設けられ、鉛直軸（Ｚ軸）周りに回転可能である。アーム部１１４は、水平方向に延在する部材であり、基端部において回動部１１３に支持され、先端部において第２吸着部６３Ａを支持する。 The base part 110 is fixed on the moving part 4 . The first follower portion 111 is provided on the base portion 50 and is movable on the base portion 50 along the left-right direction (X-axis direction). The second follower 112 is provided on the first follower 111 and is movable on the first follower 111 in the front-rear direction (Y-axis direction). The rotating portion 113 is provided on the second follower portion 112 and is rotatable around the vertical axis (Z-axis). The arm portion 114 is a member that extends in the horizontal direction, is supported by the rotating portion 113 at its proximal end, and supports the second adsorption portion 63A at its distal end.
　追従部は、左右方向（Ｘ軸方向）に沿った基板Ｓの移動に追従して第１追従部１１１が左右方向（Ｘ軸方向）に沿って移動することにより、第２吸着部６３Ａを左右方向（Ｘ軸方向）に移動させることができる。すなわち、第１追従部１１１は、第１吸着部５５の位置の調整に基づく左右方向（Ｘ軸方向）に沿った基板Ｓの移動に追従して移動部４に対する第２吸着部６３Ａの位置を左右方向（Ｘ軸方向）に沿って調整することができる。 The follow-up portion moves the second suction portion 63A left and right by moving the first follow-up portion 111 along the left-right direction (X-axis direction) following the movement of the substrate S along the left-right direction (X-axis direction). direction (X-axis direction). That is, the first follow-up portion 111 follows the movement of the substrate S along the left-right direction (X-axis direction) based on the adjustment of the position of the first suction portion 55 to adjust the position of the second suction portion 63A with respect to the moving portion 4. It can be adjusted along the left-right direction (X-axis direction).
　また、追従部は、前後方向（Ｙ軸方向）に沿った基板Ｓの移動に追従して第２追従部１１２を前後方向（Ｙ軸方向）に沿って移動させることにより、第２吸着部６３Ａを前後方向（Ｙ軸方向）に移動させることができる。すなわち、第２追従部１１２は、第１吸着部５５の位置の調整に基づく前後方向（Ｙ軸方向）に沿った基板Ｓの移動に追従して移動部４に対する第２吸着部６３Ａの位置を前後方向（Ｙ軸方向）に沿って調整することができる。 In addition, the following portion moves the second following portion 112 in the front-rear direction (Y-axis direction) by following the movement of the substrate S in the front-rear direction (Y-axis direction). can be moved in the front-rear direction (Y-axis direction). That is, the second follow-up portion 112 follows the movement of the substrate S along the front-rear direction (Y-axis direction) based on the adjustment of the position of the first suction portion 55, and adjusts the position of the second suction portion 63A with respect to the moving portion 4. It can be adjusted along the front-rear direction (Y-axis direction).
　また、追従部は、鉛直軸（Ｚ軸）を中心とする周方向に沿った基板Ｓの移動に追従して回動部１１３が鉛直軸（Ｚ軸）まわりに回動することにより、回動部１１３にアーム部１１４を介して支持された第２吸着部６３Ａを鉛直軸（Ｚ軸）まわりに回動させることができる。すなわち、回動部１１３は、第３追従部の一例であり、第１吸着部５５の位置の調整に基づく前後方向（Ｙ軸方向）に沿った基板Ｓの移動に追従して移動部４に対する第２吸着部６３Ａの位置を鉛直軸（Ｚ軸方向）を中心とする周方向に沿って調整することができる。 In addition, the follow-up portion follows the movement of the substrate S along the circumferential direction about the vertical axis (Z-axis), and rotates by rotating the rotating portion 113 around the vertical axis (Z-axis). The second adsorption portion 63A supported by the portion 113 via the arm portion 114 can be rotated around the vertical axis (Z-axis). That is, the rotating portion 113 is an example of a third follower portion, and follows the movement of the substrate S along the front-rear direction (Y-axis direction) based on the adjustment of the position of the first suction portion 55 to move the moving portion 4 relative to the moving portion 4 . The position of the second adsorption portion 63A can be adjusted along the circumferential direction around the vertical axis (Z-axis direction).
　なお、第１追従部１１１、第２追従部１１２および回動部１１３は、それぞれ各主保持部５の第１調整部５１、第２調整部５２および回動部５３（図２および図３参照）と基本的には同様の構成である。ただし、第１追従部１１１および第２追従部１１２は、それぞれ駆動部を有しておらず、各々独立して移動しない。なお、これに限らず、第１追従部１１１および第２追従部１１２にそれぞれ駆動部が設けられてもよい。 Note that the first follower portion 111, the second follower portion 112 and the rotating portion 113 correspond to the first adjusting portion 51, the second adjusting portion 52 and the rotating portion 53 of the main holding portion 5 (see FIGS. 2 and 3), respectively. ) is basically the same configuration. However, the first follower section 111 and the second follower section 112 do not have driving sections and do not move independently. It should be noted that the present invention is not limited to this, and a drive section may be provided for each of the first follower section 111 and the second follower section 112 .
＜効果＞
　上述してきたように、実施形態に係る基板搬送装置（例えば、基板処理装置１、１Ａ）は、一対のガイドレール（例えば、第１ガイドレール３＿１および第２ガイドレール３＿２）と、一対の移動部（例えば、第１移動部４＿１および第２移動部４＿２）と、複数の主保持部（例えば、第１主保持部５＿１～第４主保持部５＿４）と、副保持部（例えば、第１副保持部６＿１，１１＿１および第２副保持部６＿２，１１＿２）とを備える。一対のガイドレールは、基板（例えば、基板Ｓ）の搬送方向（例えば、Ｙ軸方向）に沿って延在する。一対の移動部は、一対のガイドレールに沿ってそれぞれ移動する。複数の主保持部は、一対の移動部上にそれぞれ設けられ、基板の下方から基板を保持する。副保持部は、各移動部上において隣り合う主保持部の間に設けられ、基板の下方から基板を保持する。複数の主保持部は、基板を吸着保持する第１吸着部（例えば、第１吸着部５５）と、第１吸着部の位置を調整する調整部（例えば、第１調整部５１および第２調整部５２）とを備える。副保持部は、基板を吸着保持する第２吸着部（例えば、第２吸着部６３，６３Ａ）と、第１吸着部の位置の調整に基づく基板の移動に追従して第２吸着部の位置を調整する追従部（例えば、アーム部６２、第１追従部１１１、第２追従部１１２および回動部１１３）とを備える。 <effect>
As described above, the substrate transfer apparatus (for example, the substrate processing apparatus 1, 1A) according to the embodiment includes a pair of guide rails (for example, the first guide rail 3_1 and the second guide rail 3_2) and a pair of moving parts (for example, first moving portion 4_1 and second moving portion 4_2), a plurality of main holding portions (for example, first main holding portion 5_1 to fourth main holding portion 5_4), and a sub holding portion (for example, first sub holding portions 6_1, 11_1 and second sub-holding portions 6_2, 11_2). The pair of guide rails extends along the transport direction (eg, Y-axis direction) of the substrate (eg, substrate S). A pair of moving parts respectively move along a pair of guide rails. A plurality of main holding parts are provided on the pair of moving parts, respectively, and hold the substrate from below. The sub-holding part is provided between adjacent main holding parts on each moving part, and holds the substrate from below. The plurality of main holding portions include a first adsorption portion (eg, first adsorption portion 55) that adsorbs and holds the substrate, and an adjustment portion (eg, first adjustment portion 51 and second adjustment portion) that adjusts the position of the first adsorption portion. 52). The sub-holding section includes a second suction section (for example, the second suction sections 63 and 63A) that suction-holds the substrate, and a position of the second suction section that follows the movement of the substrate based on the adjustment of the position of the first suction section. is provided (for example, the arm portion 62, the first follower portion 111, the second follower portion 112, and the rotating portion 113).
　これにより、基板を搬送する間、第１吸着部の位置が調整される場合であっても、搬送される基板の撓みを抑制し且つ第２吸着部に対する基板の位置ずれを抑制することができることから、第２吸着部と基板との位置関係を適切に保つことができる。したがって、実施形態に係る基板搬送装置によれば、基板搬送における誤差を低減することができる。 As a result, even when the position of the first suction unit is adjusted while the substrate is being transferred, it is possible to suppress the bending of the transferred substrate and the positional deviation of the substrate with respect to the second suction unit. Therefore, the positional relationship between the second adsorption portion and the substrate can be properly maintained. Therefore, according to the substrate transfer apparatus according to the embodiment, errors in substrate transfer can be reduced.
　また、基板搬送装置は、副保持部によって基板の側縁を保持しながら基板を搬送することから、基板の側縁と塗布部（例えば、塗布部７）との間隔が一定に保たれた状態で塗布部から基板に機能液を吐出することができる。したがって、実施形態に係る基板搬送装置によれば、精度良く基板に描画を行うことができる。 In addition, since the substrate transport device transports the substrate while holding the side edge of the substrate by the sub-holding part, the distance between the side edge of the substrate and the coating part (for example, the coating part 7) is kept constant. , the functional liquid can be discharged from the application portion onto the substrate. Therefore, according to the substrate transfer apparatus according to the embodiment, it is possible to perform drawing on the substrate with high accuracy.
　また、調整部は、第１吸着部の位置を搬送方向と直交する方向（例えば、Ｘ軸方向）に沿って調整する第１調整部（例えば、第１調整部５１）と、第１吸着部の位置を搬送方向に沿って調整する第２調整部（例えば、第２調整部５２）と、第１吸着部の位置を鉛直軸（例えば、Ｚ軸）を中心とする周方向に沿って調整する第３調整部（例えば、回動部５３）とを備えてもよい。追従部（例えば、アーム部６２）は、搬送方向と直交する方向、搬送方向および鉛直軸を中心とする周方向に沿った基板の移動に追従して第２吸着部（例えば、第２吸着部６３）の位置を調整してもよい。これにより、搬送方向と直交する方向、搬送方向および鉛直軸を中心とする周方向に沿った基板の移動に追従して第２吸着部の位置を調整することができる。 In addition, the adjusting unit includes a first adjusting unit (for example, the first adjusting unit 51) that adjusts the position of the first suction unit along a direction (for example, the X-axis direction) orthogonal to the conveying direction; A second adjustment unit (e.g., second adjustment unit 52) that adjusts the position of along the conveying direction, and adjusts the position of the first adsorption unit along the circumferential direction centered on the vertical axis (e.g., Z axis) A third adjusting portion (for example, rotating portion 53) may be provided. The following part (for example, the arm part 62) follows the movement of the substrate along the direction perpendicular to the transport direction, the transport direction, and the circumferential direction centered on the vertical axis to move the second suction part (for example, the second suction part). 63) may be adjusted. This makes it possible to adjust the position of the second suction unit by following the movement of the substrate along the direction orthogonal to the transport direction, the transport direction, and the circumferential direction centered on the vertical axis.
　また、調整部は、第１吸着部の位置を搬送方向と直交する方向に沿って調整する第１調整部と、第１吸着部の位置を搬送方向に沿って調整する第２調整部と、第１吸着部の位置を鉛直軸を中心とする周方向に沿って調整する第３調整部とを備えてもよい。追従部は、搬送方向と直交する方向に沿った基板の移動に追従して第２吸着部（例えば、第２吸着部６３Ａ）の位置を調整する第１追従部（例えば、第１追従部１１１）と、搬送方向に沿った基板の移動に追従して第２吸着部の位置を調整する第２追従部（例えば、第２追従部１１２）と、鉛直軸を中心とする周方向に沿った基板の移動に追従して第２吸着部の位置を調整する第３追従部（例えば、回動部１１３）とを備えてもよい。これにより、搬送方向と直交する方向、搬送方向および鉛直軸を中心とする周方向に沿った基板の移動に追従して第２吸着部の位置を調整することができる。 Further, the adjusting unit includes a first adjusting unit that adjusts the position of the first suction unit along a direction orthogonal to the conveying direction, a second adjusting unit that adjusts the position of the first sucking unit along the conveying direction, A third adjustment section may be provided for adjusting the position of the first suction section along the circumferential direction about the vertical axis. The follower unit is a first follower unit (for example, the first follower unit 111) that adjusts the position of the second adsorption unit (for example, the second adsorption unit 63A) by following the movement of the substrate along the direction orthogonal to the transport direction. ), a second follower (for example, a second follower 112) that adjusts the position of the second suction portion by following the movement of the substrate along the transport direction, and a A third follow-up portion (for example, rotating portion 113) that follows the movement of the substrate and adjusts the position of the second suction portion may be provided. This makes it possible to adjust the position of the second suction unit by following the movement of the substrate along the direction orthogonal to the transport direction, the transport direction, and the circumferential direction centered on the vertical axis.
　また、第２吸着部は、第１吸着部よりも搬送方向に沿った長さが長くてもよい。これにより、隣り合う主保持部の間に設けられる副保持部の数が少ない場合であっても、搬送される基板の撓みを抑制し且つ第２吸着部に対する基板の位置ずれを抑制することができる。 Also, the second adsorption section may be longer in the transport direction than the first adsorption section. As a result, even when the number of sub-holding portions provided between the adjacent main holding portions is small, it is possible to suppress the deflection of the transported substrate and the displacement of the substrate with respect to the second adsorption portion. can.
　上述してきた実施形態では、基板処理装置１が塗布部７を備えており、塗布部７がインクジェット方式で基板Ｓに描画を行う例について説明したが、基板Ｓに対する加工処理はこれに限らない。例えば、基板Ｓに対して光を照射する処理や除去液を吐出する処理を行うことにより基板Ｓの表面を改質又は表層の膜を除去する等、各種加工処理を行う場合においても、本開示の技術は適用可能である。 In the above-described embodiments, the substrate processing apparatus 1 includes the coating unit 7, and the coating unit 7 performs drawing on the substrate S using an inkjet method. However, the processing of the substrate S is not limited to this. For example, even when performing various processing such as modifying the surface of the substrate S or removing a film on the surface layer by performing a process of irradiating the substrate S with light or a process of discharging a removing liquid, the present disclosure techniques are applicable.
　なお、今回開示された実施形態は全ての点で例示であって制限的なものではないと考えられるべきである。実に、上記した実施形態は多様な形態で具現され得る。また、上記の実施形態は、添付の請求の範囲及びその趣旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。 It should be noted that the embodiments disclosed this time should be considered as examples in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in many different forms. Also, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.
１、１Ａ　　　　　基板処理装置
２　　　　　　　　浮上ステージ
３＿１　　　　　　第１ガイドレール
３＿２　　　　　　第２ガイドレール
４＿１　　　　　　第１移動部
４＿２　　　　　　第２移動部
５＿１　　　　　　第１主保持部
５＿２　　　　　　第２主保持部
５＿３　　　　　　第３主保持部
５＿４　　　　　　第４主保持部
６＿１、１１＿１　第１副保持部
６＿２、１１＿２　第２副保持部
７　　　　　　　　塗布部
９　　　　　　　　制御装置
５０　　　　　　　ベース部
５１　　　　　　　第１調整部
５２　　　　　　　第２調整部
５３　　　　　　　回動部
５４　　　　　　　アーム部
５５　　　　　　　第１吸着部
６１、１１０　　　ベース部
６２　　　　　　　アーム部
６３、６３Ａ　　　第２吸着部
９１　　　　　　　制御部
９２　　　　　　　記憶部
１１１　　　　　　第１追従部
１１２　　　　　　第２追従部
１１３　　　　　　回動部
１１４　　　　　　アーム部 1, 1A Substrate processing apparatus 2 Levitation stage 3_1 First guide rail 3_2 Second guide rail 4_1 First moving part 4_2 Second moving part 5_1 First main holding part 5_2 Second main holding part 5_3 Third main holding part 5_4 Fourth Main holding portions 6_1, 11_1 First sub-holding portions 6_2, 11_2 Second sub-holding portion 7 Application portion 9 Control device 50 Base portion 51 First adjustment portion 52 Second adjustment portion 53 Rotating portion 54 Arm portion 55 First adsorption portion 61, 110 base portion 62 arm portion 63, 63A second adsorption portion 91 control portion 92 storage portion 111 first follower portion 112 second follower portion 113 rotating portion 114 arm portion

Claims (6)

  1. 　基板の搬送方向に沿って延在する一対のガイドレールと、
    　前記一対のガイドレールに沿ってそれぞれ移動する一対の移動部と、
    　前記一対の移動部上にそれぞれ設けられ、前記基板の下方から前記基板を保持する複数の主保持部と、
    　各前記移動部上において隣り合う前記主保持部の間に設けられ、前記基板の下方から前記基板を保持する副保持部と
    　を備え、
    　前記複数の主保持部は、
    　前記基板を吸着保持する第１吸着部と、
    　前記第１吸着部の位置を調整する調整部と
    　を備え、
    　前記副保持部は、
    　前記基板を吸着保持する第２吸着部と、
    　前記第１吸着部の位置の調整に基づく前記基板の移動に追従して前記第２吸着部の位置を調整する追従部と
    　を備える、基板搬送装置。     a pair of guide rails extending along the substrate transport direction;
    a pair of moving parts that respectively move along the pair of guide rails;
    a plurality of main holding portions respectively provided on the pair of moving portions and holding the substrate from below;
    a sub-holding portion provided between the adjacent main holding portions on each of the moving portions and holding the substrate from below;
    The plurality of main holding portions are
    a first adsorption unit that adsorbs and holds the substrate;
    an adjustment unit that adjusts the position of the first adsorption unit,
    The sub-holding part is
    a second adsorption unit that adsorbs and holds the substrate;
    A substrate transfer apparatus comprising: a follower unit that adjusts the position of the second attracting unit by following movement of the substrate based on adjustment of the position of the first attracting unit.
  2. 　前記調整部は、
    　前記第１吸着部の位置を前記搬送方向と直交する方向に沿って調整する第１調整部と、
    　前記第１吸着部の位置を前記搬送方向に沿って調整する第２調整部と、
    　前記第１吸着部の位置を鉛直軸を中心とする周方向に沿って調整する第３調整部と
    　を備え、
    　前記追従部は、
    　前記搬送方向と直交する方向、前記搬送方向および前記鉛直軸を中心とする周方向に沿った前記基板の移動に追従して前記第２吸着部の位置を調整する、請求項１に記載の基板搬送装置。     The adjustment unit
    a first adjustment unit that adjusts the position of the first suction unit along a direction orthogonal to the conveying direction;
    a second adjustment unit that adjusts the position of the first suction unit along the transport direction;
    a third adjustment unit that adjusts the position of the first adsorption unit along the circumferential direction centered on the vertical axis,
    The following unit is
    2. The substrate according to claim 1, wherein the position of said second suction unit is adjusted by following movement of said substrate along a direction orthogonal to said transport direction, said transport direction, and a circumferential direction centered on said vertical axis. Conveyor.
  3. 　前記調整部は、
    　前記第１吸着部の位置を前記搬送方向と直交する方向に沿って調整する第１調整部と、
    　前記第１吸着部の位置を前記搬送方向に沿って調整する第２調整部と、
    　前記第１吸着部の位置を鉛直軸を中心とする周方向に沿って調整する第３調整部と
    　を備え、
    　前記追従部は、
    　前記搬送方向と直交する方向に沿った前記基板の移動に追従して前記第２吸着部の位置を調整する第１追従部と、
    　前記搬送方向に沿った前記基板の移動に追従して前記第２吸着部の位置を調整する第２追従部と、
    　前記鉛直軸を中心とする周方向に沿った前記基板の移動に追従して前記第２吸着部の位置を調整する第３追従部と
    　を備える、請求項１に記載の基板搬送装置。     The adjustment unit
    a first adjustment unit that adjusts the position of the first suction unit along a direction orthogonal to the conveying direction;
    a second adjustment unit that adjusts the position of the first suction unit along the transport direction;
    a third adjustment unit that adjusts the position of the first adsorption unit along the circumferential direction centered on the vertical axis,
    The following unit is
    a first follower that adjusts the position of the second attractor by following movement of the substrate along a direction perpendicular to the transport direction;
    a second follower that adjusts the position of the second suction unit by following the movement of the substrate along the transport direction;
    2. The substrate transfer apparatus according to claim 1, further comprising a third follow-up section that adjusts the position of the second suction section by following movement of the substrate along the circumferential direction about the vertical axis.
  4. 　前記第２吸着部は、前記第１吸着部よりも前記搬送方向に沿った長さが長い、請求項１～３のいずれか一つに記載の基板搬送装置。 The substrate transfer apparatus according to any one of claims 1 to 3, wherein the second suction part is longer in the transfer direction than the first suction part.
  5. 　請求項１～４のいずれか一つに記載の基板搬送装置と、
    　前記基板搬送装置によって搬送される前記基板に対して機能液を塗布する塗布部と
    　を備える、塗布処理装置。     a substrate transfer apparatus according to any one of claims 1 to 4;
    and a coating unit that applies a functional liquid to the substrate conveyed by the substrate conveying device.
  6. 　基板の搬送方向に沿って延在する一対のガイドレールと、
    　前記一対のガイドレールに沿ってそれぞれ移動する一対の移動部と、
    　前記一対の移動部上にそれぞれ設けられ、前記基板の下方から前記基板を保持する複数の主保持部と、
    　各前記移動部上において隣り合う前記主保持部の間に設けられ、前記基板の下方から前記基板を保持する副保持部と
    　を備え、
    　前記複数の主保持部は、
    　前記基板を吸着保持する第１吸着部と、
    　前記第１吸着部の位置を調整する調整部と
    　を備え、
    　前記副保持部は、
    　前記基板を吸着保持する第２吸着部と、
    　前記第１吸着部の位置の調整に基づく前記基板の移動に追従して前記第２吸着部の位置を調整する追従部と
    　を備える基板搬送装置における基板搬送方法であって、
    　前記基板を前記複数の主保持部および前記副保持部によって保持する工程と、
    　前記一対のガイドレールに沿って前記一対の移動部を移動させることにより、前記基板を搬送する工程と、
    　前記基板を搬送する間、前記調整部によって前記第１吸着部の位置を調整するとともに、前記追従部によって前記第１吸着部の位置の調整に基づく前記基板の移動に追従して前記第２吸着部の位置を調整する工程と
    　を含む、基板搬送方法。     a pair of guide rails extending along the substrate transport direction;
    a pair of moving parts that respectively move along the pair of guide rails;
    a plurality of main holding portions respectively provided on the pair of moving portions and holding the substrate from below;
    a sub-holding portion provided between the adjacent main holding portions on each of the moving portions and holding the substrate from below;
    The plurality of main holding portions are
    a first adsorption unit that adsorbs and holds the substrate;
    an adjustment unit that adjusts the position of the first adsorption unit,
    The sub-holding part is
    a second adsorption unit that adsorbs and holds the substrate;
    A substrate transfer method in a substrate transfer apparatus, comprising:
    holding the substrate by the plurality of main holding portions and the sub-holding portions;
    a step of transporting the substrate by moving the pair of moving parts along the pair of guide rails;
    While the substrate is conveyed, the position of the first suction unit is adjusted by the adjustment unit, and the movement of the substrate based on the adjustment of the position of the first suction unit is followed by the follower unit to perform the second suction. A substrate transfer method, comprising the step of adjusting the position of the part.
PCT/JP2022/016187 2021-03-31 2022-03-30 Substrate conveying device, coating processing device, and substrate conveying method WO2022210940A1 (en)

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