WO2022206379A1 - Module émetteur de lumière, module d'affichage, écran d'affichage et unité d'affichage - Google Patents

Module émetteur de lumière, module d'affichage, écran d'affichage et unité d'affichage Download PDF

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Publication number
WO2022206379A1
WO2022206379A1 PCT/CN2022/081061 CN2022081061W WO2022206379A1 WO 2022206379 A1 WO2022206379 A1 WO 2022206379A1 CN 2022081061 W CN2022081061 W CN 2022081061W WO 2022206379 A1 WO2022206379 A1 WO 2022206379A1
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Prior art keywords
light
sub
pixels
isolation structure
emitting module
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PCT/CN2022/081061
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English (en)
Chinese (zh)
Inventor
刁鸿浩
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北京芯海视界三维科技有限公司
视觉技术创投私人有限公司
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Publication of WO2022206379A1 publication Critical patent/WO2022206379A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present application relates to the field of optical technology, such as light emitting modules, display modules, display screens and displays.
  • light conversion layers are usually used for color display.
  • a part of the light emitted by the light conversion layer will be conducted in an undesired direction, and the light conducted in the undesired direction will affect the display effect.
  • Embodiments of the present disclosure provide a light emitting module, a display module, a display screen and a display to solve the technical problem that a part of the light emitted by the light conversion layer is conducted in an undesired direction, which affects the display effect.
  • Embodiments of the present disclosure provide a light-emitting module, including:
  • a light conversion layer including a plurality of pixels
  • the pixel includes a plurality of composite sub-pixels, and the composite sub-pixel includes a plurality of sub-pixels with the same color;
  • a first isolation structure is provided between two adjacent composite sub-pixels in the plurality of composite sub-pixels
  • a second isolation structure is disposed between two adjacent sub-pixels in the plurality of sub-pixels.
  • the first isolation structure may be disposed in part or all of the area between two adjacent composite sub-pixels.
  • a first spacer region may exist between two adjacent composite sub-pixels, and part or all of the first spacer region may be provided with a first isolation structure.
  • the first isolation structure may include at least one of a light isolation structure and a light transmission structure.
  • the optical isolation structure may include an optical isolation material.
  • the light transmissive structure may comprise a light transmissive material.
  • the second isolation structure may be disposed in part or all of the area between two adjacent sub-pixels.
  • a second spacer area may exist between two adjacent sub-pixels, and part or all of the second spacer area may be provided with a second isolation structure.
  • the second isolation structure may include an optical isolation body.
  • the light-isolating body may comprise a light-isolating material.
  • the second isolation structure may be provided with a first spacer structure, and the first spacer structure may be provided between the optical isolation body and the sub-pixels to be isolated.
  • the first spacer structure may be disposed between the optical isolation body and at least one of two adjacent sub-pixels.
  • the first spacer structure may cover part or all of the optical isolation body.
  • part or all of the cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer may include at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
  • the cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer may include a trapezoid, and the upper base of the trapezoid may face the light incident side of the light conversion layer.
  • an accommodation space may be provided between the first isolation structure and at least one of the two adjacent second isolation structures.
  • part or all of the area in the accommodating space may be provided with a light conversion material corresponding to a sub-pixel isolated by at least one of two adjacent second isolation structures.
  • it may further include: a light-emitting layer; wherein, the light conversion layer may be disposed on the light-emitting surface of the light-emitting layer.
  • the first isolation structure may be in direct contact with the light emitting layer, or a second spacer structure may be disposed between the first isolation structure and the light emitting layer.
  • the light-emitting layer may include a plurality of light-emitting units.
  • the multiple light-emitting units may come from the same continuous area of the same wafer, and the relative positions of the multiple light-emitting units on the light-emitting module may be consistent with the relative positions of the multiple light-emitting units on the wafer.
  • the plurality of light-emitting units may include at least one of LEDs, Mini LEDs, and Micro LEDs.
  • it may further include: a substrate; wherein, the light conversion layer may be disposed on the substrate.
  • the first isolation structure may be in direct contact with the substrate, or a third spacer structure may be disposed between the first isolation structure and the substrate.
  • it may further include: a grating structure; wherein, the grating structure may be disposed on the substrate.
  • Embodiments of the present disclosure further provide a display module, including the above-mentioned light-emitting module.
  • Embodiments of the present disclosure also provide a display screen, including the above-mentioned display module.
  • Embodiments of the present disclosure further provide a display, including the above-mentioned display screen.
  • the light-emitting module, display module, display screen and display provided by the embodiments of the present disclosure can achieve the following technical effects:
  • the first isolation structure between two adjacent composite sub-pixels in the plurality of composite sub-pixels in the light conversion layer and by arranging the second isolation structure between two adjacent sub-pixels in the plurality of sub-pixels, it is possible to Try to avoid the light emitted by the light conversion layer from being conducted in an undesired direction, for example, try to prevent a part of the light emitted by a certain composite sub-pixel from entering another adjacent composite sub-pixel, or try to avoid a certain sub-pixel from emitting light. A part of the light enters into another adjacent sub-pixel, which is beneficial to improve the display effect.
  • FIG. 1 is a schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure
  • FIGS. 2A, 2B, and 2C are schematic structural diagrams of a first isolation structure provided by an embodiment of the present disclosure
  • 3A, 3B, and 3C are another schematic structural diagram of the first isolation structure provided by the embodiment of the present disclosure.
  • 4A, 4B, and 4C are schematic structural diagrams of a second isolation structure provided by an embodiment of the present disclosure.
  • 5A, 5B, and 5C are another schematic structural diagram of the second isolation structure provided by an embodiment of the present disclosure.
  • 6A, 6B, 6C, and 6D are still another schematic structural diagrams of the second isolation structure provided by an embodiment of the present disclosure.
  • FIG. 7A, 7B, and 7C are schematic structural diagrams of a first spacing structure provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a accommodating space provided by an embodiment of the present disclosure.
  • FIG. 9 is another schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure.
  • FIG. 10 is another schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure.
  • FIG. 11 is another schematic structural diagram of the light-emitting module provided by the embodiment of the present disclosure.
  • FIG. 13 is a schematic structural diagram of a display module provided by the implementation of the present disclosure.
  • FIG. 14 is a schematic structural diagram of a display screen provided by the implementation of the present disclosure.
  • FIG. 15 is a schematic structural diagram of a display provided by the implementation of the present disclosure.
  • FIG. 1 shows a schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure.
  • An embodiment of the present disclosure provides a light-emitting module 100, including:
  • the light conversion layer 200 includes a plurality of pixels 201;
  • the pixel 201 includes a plurality of composite sub-pixels 202, and the composite sub-pixel 202 includes a plurality of sub-pixels 203 having the same color;
  • a first isolation structure 301 is provided between two adjacent composite sub-pixels 202 in the plurality of composite sub-pixels 202;
  • a second isolation structure 302 is disposed between two adjacent sub-pixels 203 in the plurality of sub-pixels 203 .
  • the first isolation structure 301 between two adjacent composite sub-pixels 202 in the plurality of composite sub-pixels 202 of the light conversion layer 200 , and by disposing the first isolation structure 301 between adjacent two sub-pixels 203 in the plurality of sub-pixels 203 Disposing the second isolation structure 302 between the pixels 203 can try to prevent the light emitted by the light conversion layer 200 from being conducted in an undesired direction.
  • the composite sub-pixel 202 or try to prevent a part of the light emitted by a certain sub-pixel 203 from entering another adjacent sub-pixel 203, it is beneficial to improve the display effect.
  • two adjacent composite sub-pixels 202 of the plurality of composite sub-pixels 202 include the same or different light conversion materials 510 .
  • two adjacent sub-pixels 203 of the plurality of sub-pixels 203 contain the same light conversion material 510 .
  • the plurality of composite sub-pixels 202 are arranged in an array, or are arranged irregularly;
  • the plurality of sub-pixels 203 are arranged in an array, or irregularly arranged.
  • the light conversion layer 200 can realize the color conversion of light by means of wavelength selection, for example: at least one pair of the multiple composite sub-pixels 202 and sub-pixels 203 included in the light conversion layer 200 comes from the light-emitting layer 400 light for color conversion.
  • the first isolation structure 301 may be disposed in part or all of the area between two adjacent composite sub-pixels 202 .
  • the first isolation structure 301 may be disposed in a partial area between two adjacent composite sub-pixels 202 , and the partial area is located between the two adjacent composite sub-pixels 202 between and close to one of the composite sub-pixels 202 (the composite sub-pixel 202 on the left in the figure).
  • the first isolation structure 301 may be disposed in a partial area between two adjacent composite sub-pixels 202 , and the partial area is located between the two adjacent composite sub-pixels 202 and is opposite to the position of the first isolation structure 301 in FIG. 2A (close to the composite sub-pixel 202 on the right side in the figure).
  • the first isolation structure 301 may be disposed in the entire area between two adjacent composite sub-pixels 202 .
  • the area where the first isolation structure 301 is arranged between two adjacent composite sub-pixels 202 may be determined according to actual conditions such as process requirements, as long as the first isolation structure 301 can avoid two adjacent composite sub-pixels
  • the light emitted by the pixel 202 may be conducted in an undesired direction (for example, the light emitted by two adjacent composite sub-pixels may be conducted toward each other).
  • a first spacer area 401 may exist between two adjacent composite sub-pixels 202 , and some or all of the first spacer area 401 may be provided with a first spacer area 401 .
  • Isolated structure 301 may be provided between two adjacent composite sub-pixels 202 , and some or all of the first spacer area 401 may be provided with a first spacer area 401 .
  • the first spacer area 401 having a rectangular shape may be used as the spacer area between two adjacent composite sub-pixels 202 , so that the adjacent two composite sub-pixels may be
  • the projection jointly formed by the 202 and the first spacing region 401 may form a regular shape such as a right-angled quadrilateral as shown in FIG. 3A .
  • the position, shape, size, etc. of the first spacing region 401 between two adjacent composite sub-pixels 202 may be determined according to actual conditions such as process requirements.
  • the first isolation structure 301 may be provided in the entire area of the first spacer region 401 between two adjacent composite sub-pixels 202 .
  • the first isolation structure 301 may be disposed in a partial area of the first spacing area 401 between two adjacent composite sub-pixels 202 , and the partial area is located in the adjacent area. Between and close to one of the two composite sub-pixels 202 (the composite sub-pixel 202 on the left in the figure).
  • the first isolation structure 301 may be disposed in a partial area of the first spacer area 401 between two adjacent composite sub-pixels 202 , and the partial area is located in the adjacent area. Between the two composite sub-pixels 202 and opposite to the position of the first isolation structure 301 in FIG. 3B (close to the composite sub-pixel 202 on the right side in the figure).
  • the first isolation structure 301 may include at least one of a light isolation structure and a light transmission structure.
  • the optical isolation structure may include an optical isolation material.
  • the light isolating material may include at least one of a light absorbing material and a light reflecting material.
  • the light-reflecting material includes metal Ag, Al, Ag/Cu, Al/Cu structures with high reflectivity.
  • the light reflective material includes a composite reflective structure of metal and non-metal, such as Ag/ITO, Al/ITO structure.
  • the light transmissive structure may comprise a light transmissive material.
  • the second isolation structure 302 may be disposed in part or all of the area between two adjacent sub-pixels 203 .
  • the second isolation structure 302 may be disposed in a partial area between two adjacent sub-pixels 203 , and the partial area is located between the two adjacent sub-pixels 203 and is close to One of the sub-pixels 203 (the sub-pixel 203 on the left in the figure).
  • the second isolation structure 302 may be disposed in a partial area between two adjacent sub-pixels 203 , and the partial area is located between the two adjacent sub-pixels 203 and is different from the adjacent two sub-pixels 203 .
  • the position of the second isolation structure 302 in FIG. 4A is opposite (close to the sub-pixel 203 on the right side in the figure).
  • the second isolation structure 302 may be disposed in the entire area between two adjacent sub-pixels 203 .
  • a second spacer area 402 may exist between two adjacent sub-pixels 203, and some or all of the second spacer area 402 may be provided with a second isolation structure 302.
  • the second spacer area 402 having a rectangular shape may be used as the spacer area between two adjacent sub-pixels 203, so that the adjacent two sub-pixels 203 and the second spacer
  • the projections collectively formed by the spaced regions 402 may form a regular shape such as a right-angled quadrilateral as shown in FIG. 5A .
  • the position, shape, size, etc. of the second spacing region 402 between two adjacent sub-pixels 203 may be determined according to actual conditions such as process requirements.
  • the second isolation structure 302 may be provided in the entire area of the second spacer area 402 between two adjacent sub-pixels 203 .
  • the second isolation structure 302 may be disposed in a partial area of the second spacing area 402 between two adjacent sub-pixels 203 , and the partial area is located in the two adjacent sub-pixels 203 . Between the pixels 203 and close to one of the sub-pixels 203 (the sub-pixel 203 on the left side in the figure).
  • the second isolation structure 302 may be disposed in a partial area of the second spacer area 402 between two adjacent sub-pixels 203 , and the partial area is located in the two adjacent sub-pixels 203 . between the pixels 203 and opposite to the position of the second isolation structure 302 in FIG. 5B (close to the sub-pixel 203 on the right side in the figure).
  • two adjacent sub-pixels 203 may include a first sub-pixel 2031 and a second sub-pixel 2032, and the first sub-pixel 2031 may include a second sub-pixel close to the second sub-pixel 2031.
  • the first side 2034 of the sub-pixel 2032 and the second sub-pixel 2032 may include a second side 2035 adjacent to the first sub-pixel 2031 .
  • the second isolation structure 302 may be disposed on at least one of the first surface 2034 and the second surface 2035 , or not in contact with the first surface 2034 and the second surface 2035 .
  • the second isolation structure 302 is disposed on the first side 2034 of the first sub-pixel 2031 , in contact with the first side 2034 of the first sub-pixel 2031 , and not in contact with the second sub-pixel The second side 2035 of 2032 is in contact.
  • the second isolation structure 302 is disposed on the second side 2035 of the second sub-pixel 2032 , in contact with the second side 2035 of the second sub-pixel 2032 , and not in contact with the first sub-pixel The first side 2034 of 2031 is in contact.
  • the second isolation structure 302 is disposed on the first side 2034 of the first sub-pixel 2031 and the second side 2035 of the second sub-pixel 2032 , and the second side of the first sub-pixel 2031 The first side 2034 is in contact with the second side 2035 of the second sub-pixel 2032 .
  • the second isolation structure 302 is disposed between the first surface 2034 of the first sub-pixel 2031 and the second surface 2035 of the second sub-pixel 2032 , and is not connected to the first sub-pixel 2032 .
  • the first side 2034 of the 2031 is in contact with the second side 2035 of the second sub-pixel 2032 .
  • the arrangement relationship between the second isolation structure 302 and the first sub-pixel 2031 and the second sub-pixel 2032 can be determined according to actual conditions such as process requirements, as long as the second isolation structure 302 can avoid the first sub-pixel 2031
  • the light emitted by the second sub-pixel 2032 may be conducted in an undesired direction (for example, the light emitted by the first sub-pixel 2031 and the second sub-pixel 2032 may be conducted toward each other).
  • the second isolation structure 302 may include an optical isolation body 3021 .
  • the light-isolating body 3021 may contain a light-isolating material.
  • the second isolation structure 302 may be provided with a first spacer structure 3022, and the first spacer structure 3022 may be disposed between the optical isolation body 3021 and the sub-pixels 203 to be isolated.
  • At least one of the light isolation body 3021 and the first spacer structure 3022 includes a light isolation material.
  • the first spacer structure 3022 may be disposed between the optical isolation body 3021 and at least one of the two adjacent sub-pixels 203.
  • two adjacent sub-pixels 203 may include a first sub-pixel 2031 and a second sub-pixel 2032 , and a first spacer structure 3022 may be disposed between the optical isolation body 3021 and the first sub-pixel 2031 between.
  • the first spacer structure 3022 may be disposed between the optical isolation body 3021 and the second sub-pixel 2032 .
  • the first spacer structure 3022 may be disposed between the optical isolation body 3021 and the first sub-pixel 2031 , and between the optical isolation body 3021 and the second sub-pixel 2032 .
  • the first spacer structure 3022 may cover part or all of the light isolation body 3021 .
  • the first spacer structure 3022 may cover the whole of the light isolation body 3021 .
  • the first spacer structure 3022 may cover a portion of the light isolation body 3021 .
  • part or all of the cross-sectional shape of the second isolation structure 302 along the light incident direction of the light conversion layer 200 may include at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
  • the cross-sectional shape of the second isolation structure 302 along the light incident direction of the light conversion layer 200 may include a trapezoid, and the upper base of the trapezoid may face the light incident side of the light conversion layer 200 .
  • an accommodation space 500 may be provided between the first isolation structure 301 and at least one of the two adjacent second isolation structures 302 .
  • part or all of the area in the accommodating space 500 may be provided with the light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302 .
  • the accommodating space 500 is used for accommodating the light conversion material 510 that may overflow from the first isolation structure 301 and the second isolation structure 302 .
  • the entire area in the accommodating space 500 may be provided with the light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302 .
  • a partial area in the accommodating space 500 may be provided with a light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302 .
  • the light-emitting module 100 may further include: a light-emitting layer 600 ; wherein, the light conversion layer 200 may be disposed on the light-emitting surface S of the light-emitting layer 600 .
  • the light emitting layer 600 may include a plurality of light emitting units 610 .
  • At least one first isolation structure 301 may be in direct contact with the light emitting layer 600 .
  • a second spacer structure 3011 may be disposed between at least one of the first isolation structures 301 and the light emitting layer 600 .
  • the plurality of light-emitting units 610 may come from the same continuous area of the same wafer, and the relative positions of the plurality of light-emitting units 610 on the light-emitting module 100 may be the same as the positions of the plurality of light-emitting units 610 on the wafer. The relative positions are the same.
  • the plurality of light emitting units 610 may include at least one of LEDs, Mini LEDs, and Micro LEDs.
  • the plurality of light emitting units 610 may include at least one LED.
  • the plurality of light emitting units 111 may include at least one Mini LED.
  • the plurality of light emitting units 610 may include at least one Micro LED.
  • the plurality of light emitting units 610 may include at least one LED and at least one Mini LED.
  • the plurality of light emitting units 610 may include at least one LED, and at least one Micro LED.
  • the plurality of light emitting units 610 may include at least one Mini LED and at least one Micro LED.
  • the plurality of light emitting units 610 may include at least one LED, at least one Mini LED, and at least one Micro LED.
  • the plurality of light-emitting units 610 may include other light-emitting devices other than LEDs, Mini LEDs, and Micro LEDs.
  • the light emitting module 100 may further include: a substrate 700 ; wherein, the light conversion layer 200 may be disposed on the substrate 700 .
  • the first isolation structure 301 may be in direct contact with the substrate 700 .
  • a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700 .
  • the first isolation structure 301 may be in direct contact with the substrate 700 , and the first isolation structure 301 may not be in contact with the light emitting layer 600 .
  • the first isolation structure 301 may be in direct contact with the light emitting layer 600 , and the first isolation structure 301 may not be in contact with the substrate 700 .
  • a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700 , and the first isolation structure 301 is not in contact with the light emitting layer 600 .
  • a third spacer structure 3012 may be disposed between the first isolation structure 301 and the light emitting layer 600 , and the first isolation structure 301 is not in contact with the substrate 700 .
  • the first isolation structure 301 may be in direct contact with the substrate 700 and the light emitting layer 600 .
  • the first isolation structure 301 may be in direct contact with the substrate 700
  • a third spacer structure 3012 may be disposed between the first isolation structure 301 and the light emitting layer 600 .
  • a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700 , and the first isolation structure 301 and the light emitting layer 600 may be in direct contact.
  • the light emitting module 100 may further include: a grating structure 800 ; wherein, the grating structure 800 may be disposed on the substrate 700 .
  • the grating structure 800 may include at least one of a slit grating, a lenticular lens grating, and a spherical lens grating.
  • the grating structure 800 is used to project the emitted light of the sub-pixels 203 at different positions in the same composite sub-pixel 202 to different directions, so as to form a 3D display effect based on the principle of binocular parallax.
  • an embodiment of the present disclosure further provides a display module 900 , including the above-mentioned light-emitting module 100 .
  • an embodiment of the present disclosure further provides a display screen 901 including the above-mentioned display module 900 .
  • an embodiment of the present disclosure further provides a display 902 including the above-mentioned display screen 901 .
  • the first isolation structure is arranged between two adjacent composite sub-pixels among the plurality of composite sub-pixels of the light conversion layer, and, in The second isolation structure is arranged between two adjacent sub-pixels in the plurality of sub-pixels, which can try to prevent the light emitted by the light conversion layer from being conducted in an undesired direction. For example, try to prevent a part of the light emitted by a composite sub-pixel from entering In another adjacent composite sub-pixel, or try to prevent a part of the light emitted by a certain sub-pixel from entering another adjacent sub-pixel, it is beneficial to improve the display effect.
  • a first element could be termed a second element, and similarly, a second element could be termed a first element, so long as all occurrences of "the first element” were consistently renamed and all occurrences of "the first element” were named consistently
  • the “second element” can be renamed consistently.
  • the first element and the second element are both elements, but may not be the same element.
  • the terms used in this application are used to describe the embodiments only and not to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a” (a), “an” (an) and “the” (the) are intended to include the plural forms as well, unless the context clearly dictates otherwise. .
  • the term “and/or” as used in this application is meant to include any and all possible combinations of one or more of the associated listings.
  • the term “comprise” and its variations “comprises” and/or including and/or the like refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these.
  • an element qualified by the phrase “comprising a" does not preclude the presence of additional identical elements in the process, method, or device that includes the element.
  • each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments may refer to each other.
  • the methods, products, etc. disclosed in the embodiments if they correspond to the method section disclosed in the embodiments, reference may be made to the description of the method section for relevant parts.
  • the disclosed methods and products may be implemented in other ways.
  • the apparatus embodiments described above are only illustrative.
  • the division of units may only be a logical function division.
  • multiple units or components may be combined or may be Integration into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.
  • Units described as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. This embodiment may be implemented by selecting some or all of the units according to actual needs.
  • each functional unit in the embodiment of the present disclosure may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Control Of El Displays (AREA)

Abstract

La présente demande se rapporte au domaine technique de l'optique, et divulgue un module émetteur de lumière comprenant : une couche de conversion de lumière, qui comprend une pluralité de pixels ; les pixels comprenant une pluralité de sous-pixels composites, les sous-pixels composites comprenant une pluralité de sous-pixels de la même couleur ; une première structure d'isolation est disposée entre deux sous-pixels composites adjacents dans la pluralité de sous-pixels composites ; et une seconde structure d'isolation est disposée entre deux sous-pixels adjacents dans la pluralité de sous-pixels. Dans le module émetteur de lumière décrit dans la présente demande, au moyen d'une première structure d'isolation et d'une seconde structure d'isolation, une lumière émise par une couche de conversion de lumière peut être empêchée autant que possible d'être transmise dans une direction non souhaitée, par exemple, une partie de la lumière émise par un certain sous-pixel composite est empêchée autant que possible d'entrer dans un autre sous-pixel composite adjacent ; en variante, une partie de la lumière émise par un certain sous-pixel est empêchée autant que possible d'entrer dans un autre sous-pixel adjacent, ce qui est avantageux pour améliorer l'effet d'affichage. La présente demande concerne également un module d'affichage, un écran d'affichage et une unité d'affichage.
PCT/CN2022/081061 2021-03-30 2022-03-16 Module émetteur de lumière, module d'affichage, écran d'affichage et unité d'affichage WO2022206379A1 (fr)

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