WO2022206379A1 - Light-emitting module, display module, display screen, and display - Google Patents

Light-emitting module, display module, display screen, and display Download PDF

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WO2022206379A1
WO2022206379A1 PCT/CN2022/081061 CN2022081061W WO2022206379A1 WO 2022206379 A1 WO2022206379 A1 WO 2022206379A1 CN 2022081061 W CN2022081061 W CN 2022081061W WO 2022206379 A1 WO2022206379 A1 WO 2022206379A1
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light
sub
pixels
isolation structure
emitting module
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PCT/CN2022/081061
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French (fr)
Chinese (zh)
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刁鸿浩
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北京芯海视界三维科技有限公司
视觉技术创投私人有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0058Processes relating to semiconductor body packages relating to optical field-shaping elements

Abstract

The present application relates to the technical field of optics, and disclosed therein is a light-emitting module comprising: a light conversion layer, which comprises a plurality of pixels; the pixels comprise a plurality of composite sub-pixels, the composite sub-pixels comprising a plurality of sub-pixels of the same color; a first isolation structure is disposed between two adjacent composite sub-pixels in the plurality of composite sub-pixels; and a second isolation structure is disposed between two adjacent sub-pixels in the plurality of sub-pixels. In the light-emitting module provided in the present application, by means of a first isolation structure and a second isolation structure, light emitted by a light conversion layer can be prevented as much as possible from being transmitted in an undesired direction, for example, a portion of the light emitted by a certain composite sub-pixel is prevented as much as possible from entering another adjacent composite sub-pixel; alternatively, a portion of the light emitted by a certain sub-pixel is prevented as much as possible from entering another adjacent sub-pixel, which is beneficial for improving the display effect. The present application also discloses a display module, a display screen, and a display.

Description

发光模组、显示模组、显示屏和显示器Lighting modules, display modules, display screens and displays
本申请要求在2021年03月30日提交中国知识产权局、申请号为202110337167.7、发明名称为“发光模组、显示模组、显示屏和显示器”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with the application number 202110337167.7 and the invention name "light emitting module, display module, display screen and display" submitted to the China Intellectual Property Office on March 30, 2021, the entire content of which is approved by Reference is incorporated in this application.
技术领域technical field
本申请涉及光学技术领域,例如涉及发光模组、显示模组、显示屏和显示器。The present application relates to the field of optical technology, such as light emitting modules, display modules, display screens and displays.
背景技术Background technique
目前,在光学领域,通常采用光转换层进行彩色显示。At present, in the field of optics, light conversion layers are usually used for color display.
在实现本公开实施例的过程中,发现相关技术中至少存在如下问题:In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
光转换层发出的光中的一部分会向不希望的方向传导,向不希望的方向传导的光将影响显示效果。A part of the light emitted by the light conversion layer will be conducted in an undesired direction, and the light conducted in the undesired direction will affect the display effect.
发明内容SUMMARY OF THE INVENTION
为了对披露的实施例的一些方面有基本的理解,下面给出了简单的概括。该概括不是泛泛评述,也不是要确定关键/重要组成元素或描绘这些实施例的保护范围,而是作为后面的详细说明的序言。In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended to be an extensive review, nor to identify key/critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.
本公开实施例提供了一种发光模组、显示模组、显示屏和显示器,以解决光转换层发出的光中的一部分会向不希望的方向传导,导致影响显示效果的技术问题。Embodiments of the present disclosure provide a light emitting module, a display module, a display screen and a display to solve the technical problem that a part of the light emitted by the light conversion layer is conducted in an undesired direction, which affects the display effect.
本公开实施例提供了一种发光模组,包括:Embodiments of the present disclosure provide a light-emitting module, including:
光转换层,包括多个像素;a light conversion layer, including a plurality of pixels;
其中,像素包括多个复合子像素,复合子像素包括具有相同颜色的多个子像素;Wherein, the pixel includes a plurality of composite sub-pixels, and the composite sub-pixel includes a plurality of sub-pixels with the same color;
在多个复合子像素中相邻的两个复合子像素之间设置有第一隔离结构;A first isolation structure is provided between two adjacent composite sub-pixels in the plurality of composite sub-pixels;
在多个子像素中相邻的两个子像素之间设置有第二隔离结构。A second isolation structure is disposed between two adjacent sub-pixels in the plurality of sub-pixels.
在一些实施例中,第一隔离结构可以设置于相邻的两个复合子像素之间的部分或全部区域。In some embodiments, the first isolation structure may be disposed in part or all of the area between two adjacent composite sub-pixels.
在一些实施例中,相邻的两个复合子像素之间可以存在第一间隔区域,第一间隔区域中的部分或全部可以设置有第一隔离结构。In some embodiments, a first spacer region may exist between two adjacent composite sub-pixels, and part or all of the first spacer region may be provided with a first isolation structure.
在一些实施例中,第一隔离结构可以包括光隔离结构、透光结构中至少之一。In some embodiments, the first isolation structure may include at least one of a light isolation structure and a light transmission structure.
在一些实施例中,光隔离结构可以包含光隔离材料。In some embodiments, the optical isolation structure may include an optical isolation material.
在一些实施例中,透光结构可以包含透光材料。In some embodiments, the light transmissive structure may comprise a light transmissive material.
在一些实施例中,第二隔离结构可以设置于相邻的两个子像素之间的部分或全部区域。In some embodiments, the second isolation structure may be disposed in part or all of the area between two adjacent sub-pixels.
在一些实施例中,相邻的两个子像素之间可以存在第二间隔区域,第二间隔区域中的部分或全部可以设置有第二隔离结构。In some embodiments, a second spacer area may exist between two adjacent sub-pixels, and part or all of the second spacer area may be provided with a second isolation structure.
在一些实施例中,第二隔离结构可以包括光隔离主体。In some embodiments, the second isolation structure may include an optical isolation body.
在一些实施例中,光隔离主体可以包含光隔离材料。In some embodiments, the light-isolating body may comprise a light-isolating material.
在一些实施例中,第二隔离结构可以设置有第一间隔结构,第一间隔结构可以设置于光隔离主体和需要进行隔离的子像素之间。In some embodiments, the second isolation structure may be provided with a first spacer structure, and the first spacer structure may be provided between the optical isolation body and the sub-pixels to be isolated.
在一些实施例中,第一间隔结构可以设置于光隔离主体和相邻的两个子像素中至少之一之间。In some embodiments, the first spacer structure may be disposed between the optical isolation body and at least one of two adjacent sub-pixels.
在一些实施例中,第一间隔结构可以覆盖光隔离主体的部分或全部。In some embodiments, the first spacer structure may cover part or all of the optical isolation body.
在一些实施例中,第二隔离结构沿光转换层的入光方向的截面形状中的部分或全部形状可以包括矩形、三角形、梯形、倒梯形中至少之一。In some embodiments, part or all of the cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer may include at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
在一些实施例中,第二隔离结构沿光转换层的入光方向的截面形状可以包括梯形,梯形的上底边可以朝向光转换层的入光侧。In some embodiments, the cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer may include a trapezoid, and the upper base of the trapezoid may face the light incident side of the light conversion layer.
在一些实施例中,第一隔离结构和相邻的两个第二隔离结构中至少之一之间可以设置有容纳空间。In some embodiments, an accommodation space may be provided between the first isolation structure and at least one of the two adjacent second isolation structures.
在一些实施例中,容纳空间中的部分或全部区域,可以设置有与相邻的两个第二隔离结构中至少之一所隔离的子像素对应的光转换材料。In some embodiments, part or all of the area in the accommodating space may be provided with a light conversion material corresponding to a sub-pixel isolated by at least one of two adjacent second isolation structures.
在一些实施例中,还可以包括:发光层;其中,光转换层可以设置于发光层的出光面。In some embodiments, it may further include: a light-emitting layer; wherein, the light conversion layer may be disposed on the light-emitting surface of the light-emitting layer.
在一些实施例中,第一隔离结构可以与发光层直接接触,或,第一隔离结构与发光层之间可以设置有第二间隔结构。In some embodiments, the first isolation structure may be in direct contact with the light emitting layer, or a second spacer structure may be disposed between the first isolation structure and the light emitting layer.
在一些实施例中,发光层可以包括多个发光单元。In some embodiments, the light-emitting layer may include a plurality of light-emitting units.
在一些实施例中,多个发光单位可以来自于同一个晶圆的同一个连续区域,多个发光单元在发光模组上的相对位置可以与多个发光单元在晶圆上的相对位置一致。In some embodiments, the multiple light-emitting units may come from the same continuous area of the same wafer, and the relative positions of the multiple light-emitting units on the light-emitting module may be consistent with the relative positions of the multiple light-emitting units on the wafer.
在一些实施例中,多个发光单元可以包括:LED、Mini LED、Micro LED中至少之一。In some embodiments, the plurality of light-emitting units may include at least one of LEDs, Mini LEDs, and Micro LEDs.
在一些实施例中,还可以包括:基板;其中,光转换层可以设置于基板。In some embodiments, it may further include: a substrate; wherein, the light conversion layer may be disposed on the substrate.
在一些实施例中,第一隔离结构可以与基板直接接触,或,第一隔离结构与基板之间可以设置有第三间隔结构。In some embodiments, the first isolation structure may be in direct contact with the substrate, or a third spacer structure may be disposed between the first isolation structure and the substrate.
在一些实施例中,还可以包括:光栅结构;其中,光栅结构可以设置于基板。In some embodiments, it may further include: a grating structure; wherein, the grating structure may be disposed on the substrate.
本公开实施例还提供了一种显示模组,包括上述的发光模组。Embodiments of the present disclosure further provide a display module, including the above-mentioned light-emitting module.
本公开实施例还提供了一种显示屏,包括上述的显示模组。Embodiments of the present disclosure also provide a display screen, including the above-mentioned display module.
本公开实施例还提供了一种显示器,包括上述的显示屏。Embodiments of the present disclosure further provide a display, including the above-mentioned display screen.
本公开实施例提供的发光模组、显示模组、显示屏和显示器,可以实现以下技术效果:The light-emitting module, display module, display screen and display provided by the embodiments of the present disclosure can achieve the following technical effects:
通过在光转换层的多个复合子像素中相邻的两个复合子像素之间设置第一隔离结构,以及,在多个子像素中相邻的两个子像素之间设置第二隔离结构,可以尽量避免光转换层发出的光向不希望的方向传导,例如,尽量避免某一复合子像素发出的光中的一部分进入相邻的另一复合子像素中,或者,尽量避免某一子像素发出的光中的一部分进入相邻的另一子像素中,有利于改善显示效果。By arranging the first isolation structure between two adjacent composite sub-pixels in the plurality of composite sub-pixels in the light conversion layer, and by arranging the second isolation structure between two adjacent sub-pixels in the plurality of sub-pixels, it is possible to Try to avoid the light emitted by the light conversion layer from being conducted in an undesired direction, for example, try to prevent a part of the light emitted by a certain composite sub-pixel from entering another adjacent composite sub-pixel, or try to avoid a certain sub-pixel from emitting light. A part of the light enters into another adjacent sub-pixel, which is beneficial to improve the display effect.
以上的总体描述和下文中的描述仅是示例性和解释性的,不用于限制本申请。The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.
附图说明Description of drawings
至少一个实施例通过与之对应的附图进行示例性说明,这些示例性说明和附图并不构成对实施例的限定,附图中具有相同参考数字标号的元件示为类似的元件,附图不构成比例限制,并且其中:At least one embodiment is exemplified by the accompanying drawings, which are not intended to limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. does not constitute a proportional limit, and where:
图1是本公开实施例提供的发光模组的一种结构示意图;FIG. 1 is a schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure;
图2A、图2B、图2C是本公开实施例提供的第一隔离结构的一种结构示意图;2A, 2B, and 2C are schematic structural diagrams of a first isolation structure provided by an embodiment of the present disclosure;
图3A、图3B、图3C是本公开实施例提供的第一隔离结构的另一种结构示意图;3A, 3B, and 3C are another schematic structural diagram of the first isolation structure provided by the embodiment of the present disclosure;
图4A、图4B、图4C是本公开实施例提供的第二隔离结构的一种结构示意图;4A, 4B, and 4C are schematic structural diagrams of a second isolation structure provided by an embodiment of the present disclosure;
图5A、图5B、图5C是本公开实施例提供的第二隔离结构的另一种结构示意图;5A, 5B, and 5C are another schematic structural diagram of the second isolation structure provided by an embodiment of the present disclosure;
图6A、图6B、图6C、图6D是本公开实施例提供的第二隔离结构的又一种结构示意图;6A, 6B, 6C, and 6D are still another schematic structural diagrams of the second isolation structure provided by an embodiment of the present disclosure;
图7A、图7B、图7C是本公开实施例提供的第一间隔结构的一种结构示意图;7A, 7B, and 7C are schematic structural diagrams of a first spacing structure provided by an embodiment of the present disclosure;
图8是本公开实施例提供的容纳空间的结构示意图;FIG. 8 is a schematic structural diagram of a accommodating space provided by an embodiment of the present disclosure;
图9是本公开实施例提供的发光模组的另一种结构示意图;FIG. 9 is another schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure;
图10是本公开实施例提供的发光模组的另一种结构示意图;FIG. 10 is another schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure;
图11是本公开实施例提供的发光模组的又一种结构示意图;11 is another schematic structural diagram of the light-emitting module provided by the embodiment of the present disclosure;
图12是本公开实施例提供的发光模组的再一种结构示意图;12 is another schematic structural diagram of the light-emitting module provided by the embodiment of the present disclosure;
图13是本公开实施提供的一种显示模组的结构示意图;13 is a schematic structural diagram of a display module provided by the implementation of the present disclosure;
图14是本公开实施提供的一种显示屏的结构示意图;14 is a schematic structural diagram of a display screen provided by the implementation of the present disclosure;
图15是本公开实施提供的一种显示器的结构示意图。FIG. 15 is a schematic structural diagram of a display provided by the implementation of the present disclosure.
附图标记:Reference number:
100:发光模组;200:光转换层;201:像素;202:复合子像素;203:子像素;2031:第一子像素;2032:第二子像素;301:第一隔离结构;3011:第二间隔结构;3012:第三间隔结构;302:第二隔离结构;3021:光隔离主体;3022:第一间隔结构;401:第一间隔区域;402:第二间隔区域;500:容纳空间;510:光转换材料;600:发光层;610:发光单元;700:基板;800:光栅结构;900:显示模组;901:显示屏;902:显示器;S:出光面。100: light emitting module; 200: light conversion layer; 201: pixel; 202: composite sub-pixel; 203: sub-pixel; 2031: first sub-pixel; 2032: second sub-pixel; 301: first isolation structure; 3011: 3012: third spacer structure; 302: second spacer structure; 3021: optical isolation body; 3022: first spacer structure; 401: first spacer area; 402: second spacer area; 500: accommodating space 510: light conversion material; 600: light emitting layer; 610: light emitting unit; 700: substrate; 800: grating structure; 900: display module; 901: display screen;
具体实施方式Detailed ways
为了能够更加详尽地了解本公开实施例的特点与技术内容,下面结合附图对本公开实施例的实现进行详细阐述,所附附图仅供参考说明之用,并非用来限定本公开实施例。在以下的技术描述中,为方便解释起见,通过多个细节以提供对所披露实施例的充分理解。然而,在没有这些细节的情况下,至少一个实施例仍然可以实施。在其它情况下,为简化附图,熟知的结构和装置可以简化展示。In order to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings, which are for reference only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, numerous details are provided to provide a thorough understanding of the disclosed embodiments. However, at least one embodiment may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.
参见图1,图1示出了本公开实施例提供的发光模组的结构示意图,本公开实施例提供了一种发光模组100,包括:Referring to FIG. 1, FIG. 1 shows a schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure. An embodiment of the present disclosure provides a light-emitting module 100, including:
光转换层200,包括多个像素201;The light conversion layer 200 includes a plurality of pixels 201;
其中,像素201包括多个复合子像素202,复合子像素202包括具有相同颜色的多个子像素203;Wherein, the pixel 201 includes a plurality of composite sub-pixels 202, and the composite sub-pixel 202 includes a plurality of sub-pixels 203 having the same color;
在多个复合子像素202中相邻的两个复合子像素202之间设置有第一隔离结构301;A first isolation structure 301 is provided between two adjacent composite sub-pixels 202 in the plurality of composite sub-pixels 202;
在多个子像素203中相邻的两个子像素203之间设置有第二隔离结构302。A second isolation structure 302 is disposed between two adjacent sub-pixels 203 in the plurality of sub-pixels 203 .
本公开实施例,通过在光转换层200的多个复合子像素202中相邻的两个复合子像素202之间设置第一隔离结构301,以及,在多个子像素203中相邻的两个子像素203之间设置第二隔离结构302,可以尽量避免光转换层200发出的光向不希望的方向传导,例如,尽量避免某一复合子像素202发出的光中的一部分进入相邻的另一复合子像素202中,或者,尽量避免某一子像素203发出的光中的一部分进入相邻的另一子像素203中,有利于改善显示效果。In this embodiment of the present disclosure, by disposing the first isolation structure 301 between two adjacent composite sub-pixels 202 in the plurality of composite sub-pixels 202 of the light conversion layer 200 , and by disposing the first isolation structure 301 between adjacent two sub-pixels 203 in the plurality of sub-pixels 203 Disposing the second isolation structure 302 between the pixels 203 can try to prevent the light emitted by the light conversion layer 200 from being conducted in an undesired direction. In the composite sub-pixel 202, or try to prevent a part of the light emitted by a certain sub-pixel 203 from entering another adjacent sub-pixel 203, it is beneficial to improve the display effect.
在一些实施例中,多个复合子像素202中相邻的两个复合子像素202包含相同或不同的光转换材料510。In some embodiments, two adjacent composite sub-pixels 202 of the plurality of composite sub-pixels 202 include the same or different light conversion materials 510 .
在一些实施例中,多个子像素203中相邻的两个子像素203包含相同的光转换材料510。In some embodiments, two adjacent sub-pixels 203 of the plurality of sub-pixels 203 contain the same light conversion material 510 .
在一些实施例中,多个复合子像素202呈阵列排布,或不规则排布;In some embodiments, the plurality of composite sub-pixels 202 are arranged in an array, or are arranged irregularly;
在一些实施例中,多个子像素203呈阵列排布,或不规则排布。In some embodiments, the plurality of sub-pixels 203 are arranged in an array, or irregularly arranged.
在一些实施例中,光转换层200可以通过波长选择等方式实现光的颜色转换,例如:光转换层200中所包括的多个复合子像素202、子像素203中至少之一对来自发光层400的光进行颜色转换。In some embodiments, the light conversion layer 200 can realize the color conversion of light by means of wavelength selection, for example: at least one pair of the multiple composite sub-pixels 202 and sub-pixels 203 included in the light conversion layer 200 comes from the light-emitting layer 400 light for color conversion.
参见图2A、图2B、图2C,在一些实施例中,第一隔离结构301可以设置于相邻的两个复合子像素202之间的部分或全部区域。Referring to FIG. 2A , FIG. 2B , and FIG. 2C , in some embodiments, the first isolation structure 301 may be disposed in part or all of the area between two adjacent composite sub-pixels 202 .
在一些实施例中,如图2A中所示,第一隔离结构301可以设置于相邻的两个复合子像素202之间的部分区域,该部分区域位于相邻的两个复合子像素202之间,且靠近其中的一个复合子像素202(位于图中左侧的复合子像素202)。In some embodiments, as shown in FIG. 2A , the first isolation structure 301 may be disposed in a partial area between two adjacent composite sub-pixels 202 , and the partial area is located between the two adjacent composite sub-pixels 202 between and close to one of the composite sub-pixels 202 (the composite sub-pixel 202 on the left in the figure).
在一些实施例中,如图2B中所示,第一隔离结构301可以设置于相邻的两个复合子像素202之间的部分区域,该部分区域位于相邻的两个复合子像素202之间,且与第一隔离结构301在图2A中所处的位置相对(靠近位于图中右侧的复合子像素202)。In some embodiments, as shown in FIG. 2B , the first isolation structure 301 may be disposed in a partial area between two adjacent composite sub-pixels 202 , and the partial area is located between the two adjacent composite sub-pixels 202 and is opposite to the position of the first isolation structure 301 in FIG. 2A (close to the composite sub-pixel 202 on the right side in the figure).
在一些实施例中,如图2C中所示,第一隔离结构301可以设置于相邻的两个复合子像素202之间的全部区域。In some embodiments, as shown in FIG. 2C , the first isolation structure 301 may be disposed in the entire area between two adjacent composite sub-pixels 202 .
在一些实施例中,可以根据工艺需求等实际情况确定在相邻的两个复合子像素202之间设置第一隔离结构301的区域,只要第一隔离结构301能够避免相邻的两个复合子像素202发出的光向不希望的方向传导(例如:相邻的两个复合子像素发出的光向彼此传导)即可。In some embodiments, the area where the first isolation structure 301 is arranged between two adjacent composite sub-pixels 202 may be determined according to actual conditions such as process requirements, as long as the first isolation structure 301 can avoid two adjacent composite sub-pixels The light emitted by the pixel 202 may be conducted in an undesired direction (for example, the light emitted by two adjacent composite sub-pixels may be conducted toward each other).
参见图3A、图3B、图3C,在一些实施例中,相邻的两个复合子像素202之间可以存在第一间隔区域401,第一间隔区域401中的部分或全部可以设置有第一隔离结构301。Referring to FIG. 3A , FIG. 3B , and FIG. 3C , in some embodiments, a first spacer area 401 may exist between two adjacent composite sub-pixels 202 , and some or all of the first spacer area 401 may be provided with a first spacer area 401 . Isolated structure 301 .
在一些实施例中,如图3A中所示,可以将具有矩形形状的第一间隔区域401作为相邻的两个复合子像素202之间的间隔区域,可以使得相邻的两个复合子像素202与第一间隔区域401所共同形成的投影可以构成如图3A中所示的直角四边形等规则形状。In some embodiments, as shown in FIG. 3A , the first spacer area 401 having a rectangular shape may be used as the spacer area between two adjacent composite sub-pixels 202 , so that the adjacent two composite sub-pixels may be The projection jointly formed by the 202 and the first spacing region 401 may form a regular shape such as a right-angled quadrilateral as shown in FIG. 3A .
在一些实施例中,可以根据工艺需求等实际情况确定相邻的两个复合子像素202之间的第一间隔区域401的位置、形状、尺寸等。In some embodiments, the position, shape, size, etc. of the first spacing region 401 between two adjacent composite sub-pixels 202 may be determined according to actual conditions such as process requirements.
在一些实施例中,如图3A中所示,相邻的两个复合子像素202之间的第一间隔区域401中的全部区域,可以设置第一隔离结构301。In some embodiments, as shown in FIG. 3A , the first isolation structure 301 may be provided in the entire area of the first spacer region 401 between two adjacent composite sub-pixels 202 .
在一些实施例中,如图3B中所示,第一隔离结构301可以设置于相邻的两个复合子像素202之间的第一间隔区域401中的部分区域,该部分区域位于相邻的两个复合子像素202之间且靠近其中的一个复合子像素202(位于图中左侧的复合子像素202)。In some embodiments, as shown in FIG. 3B , the first isolation structure 301 may be disposed in a partial area of the first spacing area 401 between two adjacent composite sub-pixels 202 , and the partial area is located in the adjacent area. Between and close to one of the two composite sub-pixels 202 (the composite sub-pixel 202 on the left in the figure).
在一些实施例中,如图3C中所示,第一隔离结构301可以设置于相邻的两个复合子像素202之间的第一间隔区域401中的部分区域,该部分区域位于相邻的两个复合子像素202之间,且与第一隔离结构301在图3B中所处的位置相对(靠近位于图中右侧的复合子像素202)。In some embodiments, as shown in FIG. 3C , the first isolation structure 301 may be disposed in a partial area of the first spacer area 401 between two adjacent composite sub-pixels 202 , and the partial area is located in the adjacent area. Between the two composite sub-pixels 202 and opposite to the position of the first isolation structure 301 in FIG. 3B (close to the composite sub-pixel 202 on the right side in the figure).
在一些实施例中,第一隔离结构301可以包括光隔离结构、透光结构中至少之一。In some embodiments, the first isolation structure 301 may include at least one of a light isolation structure and a light transmission structure.
在一些实施例中,光隔离结构可以包含光隔离材料。可选地,光隔离材料可以包括光吸收材料、光反射材料中至少之一。可选地,光反射材料包括高反射率的金属Ag、Al、Ag/Cu、Al/Cu结构。可选地,光反射材料包括金属与非金属的复合反射结构,例如Ag/ITO,Al/ITO结构。In some embodiments, the optical isolation structure may include an optical isolation material. Optionally, the light isolating material may include at least one of a light absorbing material and a light reflecting material. Optionally, the light-reflecting material includes metal Ag, Al, Ag/Cu, Al/Cu structures with high reflectivity. Optionally, the light reflective material includes a composite reflective structure of metal and non-metal, such as Ag/ITO, Al/ITO structure.
在一些实施例中,透光结构可以包含透光材料。In some embodiments, the light transmissive structure may comprise a light transmissive material.
参见图4A、图4B、图4C,在一些实施例中,第二隔离结构302可以设置于相邻的两个子像素203之间的部分或全部区域。Referring to FIG. 4A , FIG. 4B , and FIG. 4C , in some embodiments, the second isolation structure 302 may be disposed in part or all of the area between two adjacent sub-pixels 203 .
在一些实施例中,如图4A中所示,第二隔离结构302可以设置于相邻的两个子像素203之间的部分区域,该部分区域位于相邻的两个子像素203之间,且靠近其中的一个子像素203(位于图中左侧的子像素203)。In some embodiments, as shown in FIG. 4A , the second isolation structure 302 may be disposed in a partial area between two adjacent sub-pixels 203 , and the partial area is located between the two adjacent sub-pixels 203 and is close to One of the sub-pixels 203 (the sub-pixel 203 on the left in the figure).
在一些实施例中,如图4B中所示,第二隔离结构302可以设置于相邻的两个子像素203之间的部分区域,该部分区域位于相邻的两个子像素203之间,且与第二隔离结构302在图4A中所处的位置相对(靠近位于图中右侧的子像素203)。In some embodiments, as shown in FIG. 4B , the second isolation structure 302 may be disposed in a partial area between two adjacent sub-pixels 203 , and the partial area is located between the two adjacent sub-pixels 203 and is different from the adjacent two sub-pixels 203 . The position of the second isolation structure 302 in FIG. 4A is opposite (close to the sub-pixel 203 on the right side in the figure).
在一些实施例中,如图4C中所示,第二隔离结构302可以设置于相邻的两个子像素203之间的全部区域。In some embodiments, as shown in FIG. 4C , the second isolation structure 302 may be disposed in the entire area between two adjacent sub-pixels 203 .
参见图5A、图5B、图5C,在一些实施例中,相邻的两个子像素203之间可以存在第二间隔区域402,第二间隔区域402中的部分或全部可以设置有第二隔离结构302。Referring to FIGS. 5A , 5B and 5C, in some embodiments, a second spacer area 402 may exist between two adjacent sub-pixels 203, and some or all of the second spacer area 402 may be provided with a second isolation structure 302.
在一些实施例中,如图5A中所示,可以将具有矩形形状的第二间隔区域402作为相邻的两个子像素203之间的间隔区域,可以使得相邻的两个子像素203与第二间隔区域402所共同形成的投影可以构成如图5A中所示的直角四边形等规则形状。In some embodiments, as shown in FIG. 5A , the second spacer area 402 having a rectangular shape may be used as the spacer area between two adjacent sub-pixels 203, so that the adjacent two sub-pixels 203 and the second spacer The projections collectively formed by the spaced regions 402 may form a regular shape such as a right-angled quadrilateral as shown in FIG. 5A .
在一些实施例中,可以根据工艺需求等实际情况确定相邻的两个子像素203之间的第二间隔区域402的位置、形状、尺寸等。In some embodiments, the position, shape, size, etc. of the second spacing region 402 between two adjacent sub-pixels 203 may be determined according to actual conditions such as process requirements.
在一些实施例中,如图5A中所示,相邻的两个子像素203之间的第二间隔区域402中的全部区域,可以设置第二隔离结构302。In some embodiments, as shown in FIG. 5A , the second isolation structure 302 may be provided in the entire area of the second spacer area 402 between two adjacent sub-pixels 203 .
在一些实施例中,如图5B中所示,第二隔离结构302可以设置于相邻的两个子像素203之间的第二间隔区域402中的部分区域,该部分区域位于相邻的两个子像素203之间 且靠近其中的一个子像素203(位于图中左侧的子像素203)。In some embodiments, as shown in FIG. 5B , the second isolation structure 302 may be disposed in a partial area of the second spacing area 402 between two adjacent sub-pixels 203 , and the partial area is located in the two adjacent sub-pixels 203 . Between the pixels 203 and close to one of the sub-pixels 203 (the sub-pixel 203 on the left side in the figure).
在一些实施例中,如图5C中所示,第二隔离结构302可以设置于相邻的两个子像素203之间的第二间隔区域402中的部分区域,该部分区域位于相邻的两个子像素203之间,且与第二隔离结构302在图5B中所处的位置相对(靠近位于图中右侧的子像素203)。In some embodiments, as shown in FIG. 5C , the second isolation structure 302 may be disposed in a partial area of the second spacer area 402 between two adjacent sub-pixels 203 , and the partial area is located in the two adjacent sub-pixels 203 . between the pixels 203 and opposite to the position of the second isolation structure 302 in FIG. 5B (close to the sub-pixel 203 on the right side in the figure).
参见图6A、图6B、图6C、图6D,在一些实施例中,相邻的两个子像素203可以包括第一子像素2031、第二子像素2032,第一子像素2031可以包括靠近第二子像素2032的第一面2034,第二子像素2032可以包括靠近第一子像素2031的第二面2035。可选地,第二隔离结构302可以设置于第一面2034、第二面2035中至少之一,或不与第一面2034、第二面2035接触。Referring to FIGS. 6A , 6B, 6C, and 6D, in some embodiments, two adjacent sub-pixels 203 may include a first sub-pixel 2031 and a second sub-pixel 2032, and the first sub-pixel 2031 may include a second sub-pixel close to the second sub-pixel 2031. The first side 2034 of the sub-pixel 2032 and the second sub-pixel 2032 may include a second side 2035 adjacent to the first sub-pixel 2031 . Optionally, the second isolation structure 302 may be disposed on at least one of the first surface 2034 and the second surface 2035 , or not in contact with the first surface 2034 and the second surface 2035 .
在一些实施例中,如图6A中所示,第二隔离结构302设置于第一子像素2031的第一面2034,与第一子像素2031的第一面2034接触,不与第二子像素2032的第二面2035接触。In some embodiments, as shown in FIG. 6A , the second isolation structure 302 is disposed on the first side 2034 of the first sub-pixel 2031 , in contact with the first side 2034 of the first sub-pixel 2031 , and not in contact with the second sub-pixel The second side 2035 of 2032 is in contact.
在一些实施例中,如图6B中所示,第二隔离结构302设置于第二子像素2032的第二面2035,与第二子像素2032的第二面2035接触,不与第一子像素2031的第一面2034接触。In some embodiments, as shown in FIG. 6B , the second isolation structure 302 is disposed on the second side 2035 of the second sub-pixel 2032 , in contact with the second side 2035 of the second sub-pixel 2032 , and not in contact with the first sub-pixel The first side 2034 of 2031 is in contact.
在一些实施例中,如图6C中所示,第二隔离结构302设置于第一子像素2031的第一面2034、以及第二子像素2032的第二面2035,与第一子像素2031的第一面2034接触,与第二子像素2032的第二面2035接触。In some embodiments, as shown in FIG. 6C , the second isolation structure 302 is disposed on the first side 2034 of the first sub-pixel 2031 and the second side 2035 of the second sub-pixel 2032 , and the second side of the first sub-pixel 2031 The first side 2034 is in contact with the second side 2035 of the second sub-pixel 2032 .
在一些实施例中,如图6D中所示,第二隔离结构302设置于第一子像素2031的第一面2034与第二子像素2032的第二面2035之间,不与第一子像素2031的第一面2034接触,不与第二子像素2032的第二面2035接触。In some embodiments, as shown in FIG. 6D , the second isolation structure 302 is disposed between the first surface 2034 of the first sub-pixel 2031 and the second surface 2035 of the second sub-pixel 2032 , and is not connected to the first sub-pixel 2032 . The first side 2034 of the 2031 is in contact with the second side 2035 of the second sub-pixel 2032 .
在一些实施例中,可以根据工艺需求等实际情况确定第二隔离结构302与第一子像素2031、第二子像素2032之间的设置关系,只要第二隔离结构302能够避免第一子像素2031、第二子像素2032发出的光向不希望的方向传导(例如:第一子像素2031、第二子像素2032发出的光向彼此传导)即可。In some embodiments, the arrangement relationship between the second isolation structure 302 and the first sub-pixel 2031 and the second sub-pixel 2032 can be determined according to actual conditions such as process requirements, as long as the second isolation structure 302 can avoid the first sub-pixel 2031 The light emitted by the second sub-pixel 2032 may be conducted in an undesired direction (for example, the light emitted by the first sub-pixel 2031 and the second sub-pixel 2032 may be conducted toward each other).
在一些实施例中,第二隔离结构302可以包括光隔离主体3021。In some embodiments, the second isolation structure 302 may include an optical isolation body 3021 .
在一些实施例中,光隔离主体3021可以包含光隔离材料。In some embodiments, the light-isolating body 3021 may contain a light-isolating material.
在一些实施例中,第二隔离结构302可以设置有第一间隔结构3022,第一间隔结构3022可以设置于光隔离主体3021和需要进行隔离的子像素203之间。In some embodiments, the second isolation structure 302 may be provided with a first spacer structure 3022, and the first spacer structure 3022 may be disposed between the optical isolation body 3021 and the sub-pixels 203 to be isolated.
可选地,光隔离主体3021和第一间隔结构3022中至少之一包含光隔离材料。Optionally, at least one of the light isolation body 3021 and the first spacer structure 3022 includes a light isolation material.
参见图7A、图7B、图7C,在一些实施例中,第一间隔结构3022可以设置于光隔离 主体3021和相邻的两个子像素203中至少之一之间。7A , 7B and 7C, in some embodiments, the first spacer structure 3022 may be disposed between the optical isolation body 3021 and at least one of the two adjacent sub-pixels 203.
参见图7A,在一些实施例中,相邻的两个子像素203可以包括第一子像素2031、第二子像素2032,第一间隔结构3022可以设置于光隔离主体3021和第一子像素2031之间。Referring to FIG. 7A , in some embodiments, two adjacent sub-pixels 203 may include a first sub-pixel 2031 and a second sub-pixel 2032 , and a first spacer structure 3022 may be disposed between the optical isolation body 3021 and the first sub-pixel 2031 between.
参见图7B,在一些实施例中,第一间隔结构3022可以设置于光隔离主体3021和第二子像素2032之间。Referring to FIG. 7B , in some embodiments, the first spacer structure 3022 may be disposed between the optical isolation body 3021 and the second sub-pixel 2032 .
参见图7C,在一些实施例中,第一间隔结构3022可以设置于光隔离主体3021和第一子像素2031之间,以及,设置于光隔离主体3021和第二子像素2032之间。Referring to FIG. 7C , in some embodiments, the first spacer structure 3022 may be disposed between the optical isolation body 3021 and the first sub-pixel 2031 , and between the optical isolation body 3021 and the second sub-pixel 2032 .
在一些实施例中,第一间隔结构3022可以覆盖光隔离主体3021的部分或全部。In some embodiments, the first spacer structure 3022 may cover part or all of the light isolation body 3021 .
参见图7A、图7B、图7C,第一间隔结构3022可以覆盖光隔离主体3021的全部。可选地,第一间隔结构3022可以覆盖光隔离主体3021的部分。Referring to FIG. 7A , FIG. 7B , and FIG. 7C , the first spacer structure 3022 may cover the whole of the light isolation body 3021 . Optionally, the first spacer structure 3022 may cover a portion of the light isolation body 3021 .
在一些实施例中,第二隔离结构302沿光转换层200的入光方向的截面形状中的部分或全部形状可以包括矩形、三角形、梯形、倒梯形中至少之一。In some embodiments, part or all of the cross-sectional shape of the second isolation structure 302 along the light incident direction of the light conversion layer 200 may include at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
在一些实施例中,第二隔离结构302沿光转换层200的入光方向的截面形状可以包括梯形,梯形的上底边可以朝向光转换层200的入光侧。In some embodiments, the cross-sectional shape of the second isolation structure 302 along the light incident direction of the light conversion layer 200 may include a trapezoid, and the upper base of the trapezoid may face the light incident side of the light conversion layer 200 .
在一些实施例中,第一隔离结构301和相邻的两个第二隔离结构302中至少之一之间可以设置有容纳空间500。In some embodiments, an accommodation space 500 may be provided between the first isolation structure 301 and at least one of the two adjacent second isolation structures 302 .
在一些实施例中,容纳空间500中的部分或全部区域,可以设置有与相邻的两个第二隔离结构302中至少之一所隔离的子像素203对应的光转换材料510。容纳空间500用于容纳第一隔离结构301、第二隔离结构302可能溢出的光转换材料510。In some embodiments, part or all of the area in the accommodating space 500 may be provided with the light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302 . The accommodating space 500 is used for accommodating the light conversion material 510 that may overflow from the first isolation structure 301 and the second isolation structure 302 .
参见图8,在一些实施例中,容纳空间500中的全部区域,可以设置有与相邻的两个第二隔离结构302中至少之一所隔离的子像素203对应的光转换材料510。可选地,容纳空间500中的部分区域,可以设置有与相邻的两个第二隔离结构302中至少之一所隔离的子像素203对应的光转换材料510。Referring to FIG. 8 , in some embodiments, the entire area in the accommodating space 500 may be provided with the light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302 . Optionally, a partial area in the accommodating space 500 may be provided with a light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302 .
参见图9,在一些实施例中,该发光模组100还可以包括:发光层600;其中,光转换层200可以设置于发光层600的出光面S。可选地,发光层600可以包括多个发光单元610。Referring to FIG. 9 , in some embodiments, the light-emitting module 100 may further include: a light-emitting layer 600 ; wherein, the light conversion layer 200 may be disposed on the light-emitting surface S of the light-emitting layer 600 . Optionally, the light emitting layer 600 may include a plurality of light emitting units 610 .
参见图9,在一些实施例中,至少一个第一隔离结构301可以与发光层600直接接触。Referring to FIG. 9 , in some embodiments, at least one first isolation structure 301 may be in direct contact with the light emitting layer 600 .
参见图10,在一些实施例中,至少一个第一隔离结构301与发光层600之间可以设置有第二间隔结构3011。Referring to FIG. 10 , in some embodiments, a second spacer structure 3011 may be disposed between at least one of the first isolation structures 301 and the light emitting layer 600 .
在一些实施例中,多个发光单位610可以来自于同一个晶圆的同一个连续区域,多个发光单元610在发光模组100上的相对位置可以与多个发光单元610在晶圆上的相对位置一致。In some embodiments, the plurality of light-emitting units 610 may come from the same continuous area of the same wafer, and the relative positions of the plurality of light-emitting units 610 on the light-emitting module 100 may be the same as the positions of the plurality of light-emitting units 610 on the wafer. The relative positions are the same.
在一些实施例中,多个发光单元610可以包括:LED、Mini LED、Micro LED中至少之一。可选地,多个发光单元610可以包括至少一个LED。可选地,多个发光单元111可以包括至少一个Mini LED。可选地,多个发光单元610可以包括至少一个Micro LED。可选地,多个发光单元610可以包括至少一个LED、以及至少一个Mini LED。可选地,多个发光单元610可以包括至少一个LED、以及至少一个Micro LED。可选地,多个发光单元610可以包括至少一个Mini LED、以及至少一个Micro LED。可选地,多个发光单元610可以包括至少一个LED、至少一个Mini LED、以及至少一个Micro LED。可选地,多个发光单元610可以包括除了LED、Mini LED、Micro LED以外的其他发光器件。In some embodiments, the plurality of light emitting units 610 may include at least one of LEDs, Mini LEDs, and Micro LEDs. Optionally, the plurality of light emitting units 610 may include at least one LED. Optionally, the plurality of light emitting units 111 may include at least one Mini LED. Optionally, the plurality of light emitting units 610 may include at least one Micro LED. Optionally, the plurality of light emitting units 610 may include at least one LED and at least one Mini LED. Optionally, the plurality of light emitting units 610 may include at least one LED, and at least one Micro LED. Optionally, the plurality of light emitting units 610 may include at least one Mini LED and at least one Micro LED. Optionally, the plurality of light emitting units 610 may include at least one LED, at least one Mini LED, and at least one Micro LED. Optionally, the plurality of light-emitting units 610 may include other light-emitting devices other than LEDs, Mini LEDs, and Micro LEDs.
参见图11,在一些实施例中,该发光模组100还可以包括:基板700;其中,光转换层200可以设置于基板700。Referring to FIG. 11 , in some embodiments, the light emitting module 100 may further include: a substrate 700 ; wherein, the light conversion layer 200 may be disposed on the substrate 700 .
参见图11,在一些实施例中,第一隔离结构301可以与基板700直接接触。Referring to FIG. 11 , in some embodiments, the first isolation structure 301 may be in direct contact with the substrate 700 .
第一隔离结构301与基板700之间可以设置有第三间隔结构3012。A third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700 .
可选地,第一隔离结构301可以与基板700直接接触,且第一隔离结构301不与发光层600接触。可选地,第一隔离结构301可以与发光层600直接接触,且第一隔离结构301不与基板700接触。可选地,第一隔离结构301与基板700之间可以设置有第三间隔结构3012,且第一隔离结构301不与发光层600接触。可选地,第一隔离结构301与发光层600之间可以设置有第三间隔结构3012,且第一隔离结构301不与基板700接触。可选地,第一隔离结构301可以与基板700和发光层600直接接触。可选地,第一隔离结构301可以与基板700直接接触,且第一隔离结构301与发光层600之间可以设置有第三间隔结构3012。可选地,第一隔离结构301与基板700之间可以设置有第三间隔结构3012,且第一隔离结构301与发光层600可以直接接触。Optionally, the first isolation structure 301 may be in direct contact with the substrate 700 , and the first isolation structure 301 may not be in contact with the light emitting layer 600 . Optionally, the first isolation structure 301 may be in direct contact with the light emitting layer 600 , and the first isolation structure 301 may not be in contact with the substrate 700 . Optionally, a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700 , and the first isolation structure 301 is not in contact with the light emitting layer 600 . Optionally, a third spacer structure 3012 may be disposed between the first isolation structure 301 and the light emitting layer 600 , and the first isolation structure 301 is not in contact with the substrate 700 . Optionally, the first isolation structure 301 may be in direct contact with the substrate 700 and the light emitting layer 600 . Optionally, the first isolation structure 301 may be in direct contact with the substrate 700 , and a third spacer structure 3012 may be disposed between the first isolation structure 301 and the light emitting layer 600 . Optionally, a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700 , and the first isolation structure 301 and the light emitting layer 600 may be in direct contact.
参见图12,在一些实施例中,该发光模组100还可以包括:光栅结构800;其中,光栅结构800可以设置于基板700。Referring to FIG. 12 , in some embodiments, the light emitting module 100 may further include: a grating structure 800 ; wherein, the grating structure 800 may be disposed on the substrate 700 .
可选地,该光栅结构800可以包括狭缝光栅、柱状透镜光栅、球状透镜光栅中至少之一。光栅结构800用于将同一复合子像素202中不同位置子像素203的发射光投射向不同的方向,基于双眼视差原理形成3D显示效果。Optionally, the grating structure 800 may include at least one of a slit grating, a lenticular lens grating, and a spherical lens grating. The grating structure 800 is used to project the emitted light of the sub-pixels 203 at different positions in the same composite sub-pixel 202 to different directions, so as to form a 3D display effect based on the principle of binocular parallax.
参见图13,本公开实施例还提供了一种显示模组900,包括上述的发光模组100。Referring to FIG. 13 , an embodiment of the present disclosure further provides a display module 900 , including the above-mentioned light-emitting module 100 .
参见图14,本公开实施例还提供了一种显示屏901,包括上述的显示模组900。Referring to FIG. 14 , an embodiment of the present disclosure further provides a display screen 901 including the above-mentioned display module 900 .
参见图15,本公开实施例还提供了一种显示器902,包括上述的显示屏901。Referring to FIG. 15 , an embodiment of the present disclosure further provides a display 902 including the above-mentioned display screen 901 .
本公开实施例提供的发光模组、显示模组、显示屏和显示器,通过在光转换层的多个复合子像素中相邻的两个复合子像素之间设置第一隔离结构,以及,在多个子像素中相邻 的两个子像素之间设置第二隔离结构,可以尽量避免光转换层发出的光向不希望的方向传导,例如,尽量避免某一复合子像素发出的光中的一部分进入相邻的另一复合子像素中,或者,尽量避免某一子像素发出的光中的一部分进入相邻的另一子像素中,有利于改善显示效果。In the light-emitting module, display module, display screen and display provided by the embodiments of the present disclosure, the first isolation structure is arranged between two adjacent composite sub-pixels among the plurality of composite sub-pixels of the light conversion layer, and, in The second isolation structure is arranged between two adjacent sub-pixels in the plurality of sub-pixels, which can try to prevent the light emitted by the light conversion layer from being conducted in an undesired direction. For example, try to prevent a part of the light emitted by a composite sub-pixel from entering In another adjacent composite sub-pixel, or try to prevent a part of the light emitted by a certain sub-pixel from entering another adjacent sub-pixel, it is beneficial to improve the display effect.
以上描述和附图充分地示出了本公开的实施例,以使本领域技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求,否则单独的部件和功能是可选的,并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围,以及权利要求书的所有可获得的等同物。当用于本申请中时,虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件,但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如,在不改变描述的含义的情况下,第一元件可以叫做第二元件,并且同样地,第二元件可以叫做第一元件,只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件,但可以不是相同的元件。而且,本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的,除非上下文清楚地表明,否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地,如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外,当用于本申请中时,术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素,和/或组件的存在,但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下,由语句“包括一个…”限定的要素,并不排除在包括该要素的过程、方法或者设备中还存在另外的相同要素。本文中,每个实施例重点说明的可以是与其他实施例的不同之处,各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言,如果其与实施例公开的方法部分相对应,那么相关之处可以参见方法部分的描述。The foregoing description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. The examples are only representative of possible variations. Unless expressly required, individual components and functions are optional and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of the disclosed embodiments includes the full scope of the claims, along with all available equivalents of the claims. When used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without changing the meaning of the description, a first element could be termed a second element, and similarly, a second element could be termed a first element, so long as all occurrences of "the first element" were consistently renamed and all occurrences of "the first element" were named consistently The "second element" can be renamed consistently. The first element and the second element are both elements, but may not be the same element. Also, the terms used in this application are used to describe the embodiments only and not to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a" (a), "an" (an) and "the" (the) are intended to include the plural forms as well, unless the context clearly dictates otherwise. . Similarly, the term "and/or" as used in this application is meant to include any and all possible combinations of one or more of the associated listings. Additionally, as used in this application, the term "comprise" and its variations "comprises" and/or including and/or the like refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, or device that includes the element. Herein, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments may refer to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, reference may be made to the description of the method section for relevant parts.
本领域技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,可以取决于技术方案的特定应用和设计约束条件。本领域技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能,但是这种实现不应认为超出本公开实施例的范围。本领域技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的系统、装置和单元的工作过程,可以参考前述方法实施例中的对应过程,在此不再赘 述。Those skilled in the art can realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. Skilled artisans may use different methods for implementing the described functionality for each particular application, but such implementations should not be considered beyond the scope of the disclosed embodiments. Those skilled in the art can clearly understand that, for the convenience and brevity of description, the working process of the above-described systems, devices and units may refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here.
本文所披露的实施例中,所揭露的方法、产品(包括但不限于装置、设备等),可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,单元的划分,可以仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另外,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外,在本公开实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。In the embodiments disclosed herein, the disclosed methods and products (including but not limited to apparatuses, devices, etc.) may be implemented in other ways. For example, the apparatus embodiments described above are only illustrative. For example, the division of units may only be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or may be Integration into another system, or some features can be ignored, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms. Units described as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. This embodiment may be implemented by selecting some or all of the units according to actual needs. In addition, each functional unit in the embodiment of the present disclosure may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
在附图中,考虑到清楚性和描述性,可以夸大元件或层等结构的宽度、长度、厚度等。当元件或层等结构被称为“设置在”(或“安装在”、“铺设在”、“贴合在”、“涂布在”等类似描述)另一元件或层“上方”或“上”时,该元件或层等结构可以直接“设置在”上述的另一元件或层“上方”或“上”,或者可以存在与上述的另一元件或层之间的中间元件或层等结构,甚至有一部分嵌入上述的另一元件或层。In the drawings, the width, length, thickness, etc. of structures such as elements or layers may be exaggerated for clarity and descriptiveness. When an element or layer or the like is referred to as being "disposed on" (or "mounted on," "laying on," "adhering to," "coating on," and the like) another element or layer "over" or "above" When referring to “on”, the element or layer and other structures may be directly “disposed on” “above” or “on” the above-mentioned another element or layer, or there may be intervening elements or layers between the above-mentioned another element or layer, etc. structure, even partially embedded in another element or layer as described above.

Claims (28)

  1. 一种发光模组,包括:A light-emitting module, comprising:
    光转换层,包括多个像素;a light conversion layer, including a plurality of pixels;
    其中,所述像素包括多个复合子像素,所述复合子像素包括具有相同颜色的多个子像素;Wherein, the pixel includes a plurality of composite sub-pixels, and the composite sub-pixel includes a plurality of sub-pixels with the same color;
    在所述多个复合子像素中相邻的两个复合子像素之间设置有第一隔离结构;A first isolation structure is provided between two adjacent composite sub-pixels in the plurality of composite sub-pixels;
    在所述多个子像素中相邻的两个子像素之间设置有第二隔离结构。A second isolation structure is provided between two adjacent sub-pixels in the plurality of sub-pixels.
  2. 根据权利要求1所述的发光模组,其中,所述第一隔离结构设置于相邻的两个复合子像素之间的部分或全部区域。The light emitting module according to claim 1, wherein the first isolation structure is disposed in part or all of the area between two adjacent composite sub-pixels.
  3. 根据权利要求1所述的发光模组,其中,相邻的两个复合子像素之间存在第一间隔区域,第一间隔区域中的部分或全部设置有所述第一隔离结构。The light emitting module according to claim 1, wherein a first spacing area exists between two adjacent composite sub-pixels, and a part or all of the first spacing area is provided with the first isolation structure.
  4. 根据权利要求1所述的发光模组,其中,所述第一隔离结构包括光隔离结构、透光结构中至少之一。The light emitting module according to claim 1, wherein the first isolation structure comprises at least one of a light isolation structure and a light transmission structure.
  5. 根据权利要求4所述的发光模组,其中,所述光隔离结构包含光隔离材料。The light emitting module of claim 4, wherein the light isolation structure comprises a light isolation material.
  6. 根据权利要求4所述的发光模组,其中,所述透光结构包含透光材料。The light-emitting module of claim 4, wherein the light-transmitting structure comprises a light-transmitting material.
  7. 根据权利要求1所述的发光模组,其中,所述第二隔离结构设置于相邻的两个子像素之间的部分或全部区域。The light emitting module according to claim 1, wherein the second isolation structure is disposed in part or all of the area between two adjacent sub-pixels.
  8. 根据权利要求7所述的发光模组,其中,相邻的两个子像素之间存在第二间隔区域,所述第二间隔区域中的部分或全部设置有所述第二隔离结构。The light emitting module according to claim 7, wherein a second spacing area exists between two adjacent sub-pixels, and a part or all of the second spacing area is provided with the second isolation structure.
  9. 根据权利要求1所述的发光模组,其中,所述第二隔离结构包括光隔离主体。The lighting module of claim 1, wherein the second isolation structure comprises an optical isolation body.
  10. 根据权利要求9所述的发光模组,其中,所述光隔离主体包含光隔离材料。The light-emitting module of claim 9, wherein the light-isolating body comprises a light-isolating material.
  11. 根据权利要求9所述的发光模组,其中,所述第二隔离结构设置有第一间隔结构,所述第一间隔结构设置于所述光隔离主体和需要进行隔离的子像素之间。The light emitting module according to claim 9, wherein the second isolation structure is provided with a first spacing structure, and the first spacing structure is provided between the optical isolation main body and the sub-pixels to be isolated.
  12. 根据权利要求11所述的发光模组,其中,所述第一间隔结构设置于所述光隔离主体和相邻的两个所述子像素中至少之一之间。The light emitting module of claim 11, wherein the first spacer structure is disposed between the light isolation body and at least one of the two adjacent sub-pixels.
  13. 根据权利要求11所述的发光模组,其中,所述第一间隔结构覆盖所述光隔离主体的部分或全部。The light emitting module of claim 11, wherein the first spacing structure covers part or all of the light isolation body.
  14. 根据权利要求1所述的发光模组,其中,所述第二隔离结构沿所述光转换层的入光方向的截面形状中的部分或全部形状包括矩形、三角形、梯形、倒梯形中至少之一。The light emitting module according to claim 1, wherein part or all of the cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer comprises at least one of rectangle, triangle, trapezoid, and inverted trapezoid. one.
  15. 根据权利要求14所述的发光模组,其中,所述第二隔离结构沿所述光转换层的入光方向的截面形状包括梯形,所述梯形的上底边朝向所述光转换层的入光侧。The light emitting module according to claim 14, wherein the cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer comprises a trapezoid, and the upper bottom of the trapezoid faces the entrance of the light conversion layer. light side.
  16. 根据权利要求1所述的发光模组,其中,所述第一隔离结构和相邻的两个第二隔离结构中至少之一之间设置有容纳空间。The light emitting module according to claim 1, wherein an accommodation space is provided between the first isolation structure and at least one of the two adjacent second isolation structures.
  17. 根据权利要求16所述的发光模组,其中,所述容纳空间中的部分或全部区域,设置有与相邻的两个第二隔离结构中至少之一所隔离的子像素对应的光转换材料。The light-emitting module according to claim 16, wherein a part or all of the area in the accommodating space is provided with a light conversion material corresponding to a sub-pixel isolated by at least one of the two adjacent second isolation structures .
  18. 根据权利要求1至17任一项所述的发光模组,还包括:发光层;The light-emitting module according to any one of claims 1 to 17, further comprising: a light-emitting layer;
    其中,所述光转换层设置于所述发光层的出光面。Wherein, the light conversion layer is disposed on the light emitting surface of the light emitting layer.
  19. 根据权利要求18所述的发光模组,其中,The lighting module according to claim 18, wherein,
    所述第一隔离结构与所述发光层直接接触,或,The first isolation structure is in direct contact with the light emitting layer, or,
    所述第一隔离结构与所述发光层之间设置有第二间隔结构。A second spacer structure is disposed between the first isolation structure and the light emitting layer.
  20. 根据权利要求18所述的发光模组,其中,所述发光层包括多个发光单元。The light-emitting module of claim 18, wherein the light-emitting layer comprises a plurality of light-emitting units.
  21. 根据权利要求20所述的发光模组,其中,多个发光单位来自于同一个晶圆的同一个连续区域,多个发光单元在显示器件上的相对位置与多个发光单元在晶圆上的相对位置一致。The light-emitting module according to claim 20, wherein the plurality of light-emitting units are from the same continuous area of the same wafer, and the relative positions of the plurality of light-emitting units on the display device are the same as the relative positions of the plurality of light-emitting units on the wafer. The relative positions are the same.
  22. 根据权利要求21所述的发光模组,其中,所述多个发光单元包括:The light-emitting module of claim 21, wherein the plurality of light-emitting units comprise:
    LED、Mini LED、Micro LED中至少之一。At least one of LED, Mini LED, and Micro LED.
  23. 根据权利要求1至17任一项所述的发光模组,还包括:基板;The light-emitting module according to any one of claims 1 to 17, further comprising: a substrate;
    其中,所述光转换层设置于所述基板。Wherein, the light conversion layer is disposed on the substrate.
  24. 根据权利要求23所述的发光模组,其中,The lighting module according to claim 23, wherein,
    所述第一隔离结构与所述基板直接接触,或,The first isolation structure is in direct contact with the substrate, or,
    所述第一隔离结构与所述基板之间设置有第三间隔结构。A third spacer structure is disposed between the first isolation structure and the substrate.
  25. 根据权利要求23所述的发光模组,还包括:光栅结构;The light-emitting module according to claim 23, further comprising: a grating structure;
    其中,所述光栅结构设置于所述基板。Wherein, the grating structure is disposed on the substrate.
  26. 一种显示模组,包括如权利要求1至25任一项所述的发光模组。A display module, comprising the light-emitting module according to any one of claims 1 to 25.
  27. 一种显示屏,包括如权利要求26所述的显示模组。A display screen, comprising the display module as claimed in claim 26 .
  28. 一种显示器,包括如权利要求27所述的显示屏。A display comprising the display screen of claim 27.
PCT/CN2022/081061 2021-03-30 2022-03-16 Light-emitting module, display module, display screen, and display WO2022206379A1 (en)

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