Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
  • C08K5/3472—Five-membered rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
  • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
  • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
  • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
  • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Definitions

• the present invention relates to a photosensitive resin composition, a resin film and an electronic device.
• photosensitive resin compositions containing polyamide resins and/or polyimide resins are sometimes used to form cured films such as insulating layers. Therefore, photosensitive resin compositions containing polyamide resins and/or polyimide resins have been investigated.
• US Pat. No. 5,300,002 discloses at least one fully imidized polyimide polymer having a weight average molecular weight ranging from about 20,000 Daltons to about 70,000 Daltons; at least one solubility-switching compound; at least one A photosensitive composition is described which comprises a photoinitiator; and at least one solvent and is capable of forming a film exhibiting a dissolution rate of greater than about 0.15 ⁇ m/sec when cyclopentanone is used as a developer. ing.
• Patent Documents 2, 3, 4, etc. also describe photosensitive resin compositions containing polyamide resins and/or polyimide resins.
• the photosensitive resin composition When forming a cured film in an electronic device using a photosensitive resin composition, first, the photosensitive resin composition is applied onto a substrate to form a film, and the film is patterned by exposure and development. Then, a cured film is formed by heat-treating the patterned film. In the formation of the cured film as described above, it is preferable that the adhesion between the photosensitive resin composition and the substrate is high. In particular, in recent years, there has been a demand for forming a flat cured film on a base material having steps, so there is a further demand for improved adhesion between the photosensitive resin composition and the base material.
• An object of the present invention is to provide a photosensitive resin composition having good adhesion to a substrate.
• a photosensitive resin composition comprising:
• a resin film comprising a cured product of the above photosensitive resin composition is provided.
• An electronic device comprising the above resin film is provided.
• a photosensitive resin composition having good adhesion to a substrate is provided.
• X to Y in the description of numerical ranges means X or more and Y or less, unless otherwise specified.
• “1 to 5% by mass” means “1% by mass or more and 5% by mass or less”.
• alkyl group includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups).
• (meth)acryl used herein represents a concept that includes both acryl and methacryl.
• organic group as used herein means an atomic group obtained by removing one or more hydrogen atoms from an organic compound, unless otherwise specified.
• a "monovalent organic group” represents an atomic group obtained by removing one hydrogen atom from an arbitrary organic compound.
• electronic device refers to elements to which electronic engineering technology is applied, such as semiconductor chips, semiconductor elements, printed wiring boards, electric circuit display devices, information communication terminals, light-emitting diodes, physical batteries, and chemical batteries. , devices, final products, etc.
• the photosensitive resin composition of the present embodiment includes at least one or more resins selected from the group consisting of polyimide resins and their precursors, polybenzoxazole resins and their precursors, polyamide resins, novolak resins, and cycloolefin resins ( A) and a compound (C) having at least one or more reactive groups selected from the group consisting of epoxy groups and (meth)acryloyl groups and a 5-membered nitrogen-containing heterocyclic group.
• a cured film in an electronic device is required to have adhesion to a substrate.
• a cured film formed from the photosensitive resin composition of the present embodiment has good adhesion to a metal substrate.
• the details are unknown, it is believed that the interaction between the nitrogen-containing heterocycle of the compound (C) and the substrate surface contributes to the improvement of the adhesion between the cured film and the substrate.
• the compound (C) has a reactive group selected from an epoxy group and a (meth)acryloyl group, the compound (C) reacts with other components contained in the resin composition, or the compound (C ), and the compound (C) becomes closely entangled with the resin composition. It is believed that this further improves the adhesion between the cured film and the substrate.
• the photosensitive resin composition of the present embodiment is preferably used for forming insulating layers in electronic devices.
• the photosensitive resin composition of the present embodiment includes one or more resins selected from the group consisting of polyimide resins and their precursors, polybenzoxazole resins and their precursors, polyamide resins, novolac resins, and cycloolefin resins ( A).
• the photosensitive resin composition of the present embodiment may contain only one resin (A), or may contain two or more resins (A).
• the content of the resin (A) in the photosensitive resin composition of the present embodiment is preferably 1% by mass or more, more preferably 5% by mass or more, more preferably 5% by mass or more, based on the total solid content of the photosensitive resin composition. is 10% by mass or more.
• the upper limit of resin (A) is not particularly limited, but is usually 60% by mass or less, preferably 50% by mass or less.
• the photosensitive resin composition of the present embodiment preferably contains a polyimide resin as the resin (A).
• polyimide resin When using a polyimide resin, only one polyimide resin may be used, or two or more polyimide resins may be used together.
• the conversion rate is preferably 90% or higher, more preferably 95% or higher, and still more preferably 98% or higher.
• the polyimide resin preferably has no or little amide structure and many imide ring structures.
• the imide cyclization rate can be known, for example, from the area of the peak corresponding to the amide group and the area of the peak corresponding to the imide ring group in the NMR spectrum.
• the imide cyclization rate can be known from the area of the peak corresponding to the amide group, the area of the peak corresponding to the imide ring group, and the like in the infrared absorption spectrum.
• the polyimide resin preferably contains a structural unit represented by the following general formula (PI-1).
• X is a divalent organic group
• Y is a tetravalent organic group
• At least one of X and Y is a fluorine atom-containing group.
• the divalent organic group of X and/or the tetravalent organic group of Y preferably contains an aromatic ring structure, more preferably a benzene ring structure. This tends to further increase the heat resistance. From the viewpoint of solubility in organic solvents, both X and Y are preferably fluorine atom-containing groups.
• the divalent organic group of X and/or the tetravalent organic group of Y preferably has a structure in which 2 to 6 benzene rings are linked via a single bond or a divalent linking group. Examples of the divalent linking group here include an alkylene group, a fluorinated alkylene group, an ether group, and the like.
• Alkylene groups and fluorinated alkylene groups may be linear or branched.
• the number of carbon atoms in the divalent organic group of X is, for example, 6-30.
• the number of carbon atoms in the tetravalent organic group of Y is, for example, 6-20.
• Each of the two imide rings in general formula (PI-1) is preferably a 5-membered ring.
• the polyimide resin more preferably contains a structural unit represented by the following general formula (PI-2).
• X is synonymous with X in the general formula (PI-1), Y' represents a single bond or an alkylene group.
• the alkylene group of Y' may be linear or branched. Some or all of the hydrogen atoms in the alkylene group of Y' are preferably substituted with fluorine atoms.
• the number of carbon atoms in the alkylene group of Y' is, for example, 1-6, preferably 1-4, more preferably 1-3.
• a polyimide resin can be obtained by subjecting a polyimide resin precursor to a ring closure reaction.
• a polyamide resin can be used as the polyimide precursor.
• the weight average molecular weight of the polyimide resin and/or polyimide resin precursor is, for example, 5,000 to 100,000, preferably 7,000 to 75,000, and more preferably 10,000 to 50,000.
• the weight average molecular weight of the polyimide resin and/or the polyimide resin precursor is large to some extent, for example, sufficient heat resistance of the cured film can be obtained.
• the weight average molecular weight of the polyimide resin and/or the polyimide resin precursor is not too large, the polyimide resin and/or the polyimide resin precursor can be easily dissolved in the organic solvent.
• the weight average molecular weight can usually be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance.
• polybenzoxazole resin preferably contains a structural unit represented by the following general formula (PB01).
• a polybenzoxazole resin can be obtained by subjecting a polybenzoxazole resin precursor to a ring-closure reaction.
• a polyamide resin can be used as the polybenzoxazole resin precursor.
• polyamide resin The polyamide resin preferably contains a structural unit represented by general formula (PA-1) below.
• polyamide resin When a polyamide resin is used, only one polyamide resin may be used, or two or more polyamide resins may be used together.
• X is a divalent organic group
• Y is a tetravalent organic group
• at least one of X and Y is preferably a fluorine atom-containing group.
• both X and Y in general formula (PA-1) are preferably fluorine atom-containing groups.
• the divalent organic group of X and/or the tetravalent organic group of Y preferably contains an aromatic ring structure, more preferably a benzene ring structure. This tends to further increase the heat resistance.
• the benzene ring here may be substituted with a fluorine atom-containing group such as a fluorine atom or a fluorinated alkyl group (preferably a trifluoromethyl group), or may be substituted with other groups.
• the divalent organic group for X and/or the tetravalent organic group for Y in general formula (PA-1) preferably has 2 to 6 benzene rings via a single bond or a divalent linking group. It has a combined structure.
• Examples of the divalent linking group here include an alkylene group, a fluorinated alkylene group, an ether group, and the like. Alkylene groups and fluorinated alkylene groups may be linear or branched.
• the number of carbon atoms in the divalent organic group of X is, for example, 6-30.
• the tetravalent organic group of Y has, for example, 6 to 20 carbon atoms.
• the polyamide resin more preferably contains a structural unit represented by the following general formula (PA-2).
• X is synonymous with X in the general formula (PA-1), Y' represents a single bond or an alkylene group.
• the polyamide resin can also be used as a polyimide resin precursor or a polybenzoxazole resin precursor.
• the novolak resin can be appropriately selected according to the application as long as it is a resin obtained by reacting phenols and aldehydes in the absence of a catalyst or in the presence of an acidic catalyst or the like.
• a random novolak type or a high ortho novolac type can be used.
• novolak resin When using a novolak resin, only one novolak resin may be used, or two or more novolak resins may be used in combination.
• the novolak resin can be obtained by reacting the aldehydes to the phenols at a molar ratio (aldehydes/phenols) of 0.5 to 1.0.
• phenols used in preparing novolak resins include phenol, o-cresol, m-cresol, p-cresol, xylenol, alkylphenols, catechol, and resorcinol. These phenols may be used singly or in combination of two or more.
• Aldehydes used in preparing the novolac resin include, for example, aldehyde compounds such as formaldehyde, paraformaldehyde, and benzaldehyde, substances that are sources of these aldehyde compounds, and solutions of these aldehyde compounds. can be used. These aldehydes may be used alone or in combination of two or more.
• cycloolefin resin As the cycloolefin resin, general resins having a cycloolefin structure can be appropriately used.
• cycloolefin resin When using a cycloolefin resin, only one cycloolefin resin may be used, or two or more cycloolefin resins may be used in combination.
• the cycloolefin-based resin preferably contains a structural unit derived from a monomer having a cycloolefin structure described below. More preferably, it contains a structural unit derived from a monomer having a cyclic acid anhydride structure described below.
• Structural units derived from monomers having a cycloolefin structure are preferably structural units derived from norbornene-based monomers represented by the following general formula (a1).
• R 6 , R 7 , R 8 and R 9 are each independently hydrogen, a halogen atom or an organic group having 1 to 30 carbon atoms, and n is 0, 1 or 2.
• R 6 to R 9 in general formula (a1) can be, for example, each independently hydrogen, a halogen atom, or an organic group having 1 to 30 carbon atoms.
• R 6 to R 9 are preferably each independently hydrogen, halogen atoms or organic groups having 1 to 10 carbon atoms, more preferably each independently hydrogen, halogen atoms or 1 to 3 carbon atoms and more preferably each independently a hydrogen atom, a halogen atom, or an organic group having 1 carbon atoms.
• the organic group (for example, an organic group having 1 to 30 carbon atoms) constituting R 6 to R 9 may contain one or more atoms selected from O, N, S, P and Si in its structure. . Any two of R 6 to R 9 may combine with each other to form an alkylidene group or a monocyclic or polycyclic structure.
• the photosensitive resin composition of the present embodiment is a compound (C) having at least one or more reactive groups selected from the group consisting of epoxy groups and (meth)acryloyl groups, and a 5-membered nitrogen-containing heterocyclic group.
• the photosensitive resin composition of the present embodiment may contain only one type of compound (C), or may contain two or more types.
• the adhesion between the photosensitive resin composition and the substrate tends to be improved.
• the interaction between the nitrogen-containing heterocycle of the compound (C) and the surface of the substrate contributes to the improvement of adhesion between the cured film and the substrate.
• the compound (C) has a reactive group selected from an epoxy group and a (meth)acryloyl group, the compound (C) reacts with other components contained in the resin composition, or the compound (C ), and the compound (C) becomes closely entangled with the resin composition. It is believed that this further improves the adhesion between the cured film and the substrate.
• the photosensitive resin composition of the present embodiment can be , the adhesiveness to substrates having copper on the substrate surface tends to be particularly excellent.
• the compound (C) is preferably a compound having at least one group selected from the group consisting of a triazole group and a tetrazole group as a five-membered nitrogen-containing heterocyclic group.
• a triazole group is a heterocyclic group containing three nitrogen atoms in a five-membered ring. There are two isomers with different positions of nitrogen atoms, which are called 1,2,3-triazole group and 1,2,4-triazole group, respectively.
• a tetrazole group is a heterocyclic group containing four nitrogen atoms in a five-membered ring.
• a triazole group and a tetrazole group are weakly basic as compared with other nitrogen-containing heterocyclic groups such as an imidazole group. It is advantageous from the viewpoint of improving storage stability.
• the compound (C) is preferably a compound having the above reactive group at the molecular end.
• the reactivity between the compound (C) and the resin (A) tends to be improved.
• the compound (C) preferably contains a compound represented by general formula (I).
• R 1 is a hydrogen atom or a methyl group
• R 2 is a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 15 carbon atoms, or 6 to 20 carbon atoms; is a substituted or unsubstituted aromatic hydrocarbon group
• X is -S- or -NH-
• A is —O—(CH2) m — or a single bond
• m is a positive integer from 1 to 10
• n is a positive integer from 1 to 10;
• X is preferably -S-.
• compound (C) examples include the following. Of course, compound (C) is not limited to these.
• the content of the compound (C) is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, relative to 100 parts by mass of the resin (A).
• the content of the compound (C) is, for example, 30 parts by mass or less, preferably 20 parts by mass or less, more preferably 10 parts by mass or less with respect to 100 parts by mass of the resin (A).
• the content of the compound (C) is 30 parts by mass or less, the ratio of the resin (A) in the photosensitive resin composition is maintained, and the resin film formed from the photosensitive resin composition has sufficient strength. become.
• the photosensitive resin composition of the present embodiment can optionally contain additives other than the resin (A) and compound (C) described above.
• the photosensitive resin composition of this embodiment preferably contains a polyfunctional (meth)acrylic compound.
• a polyfunctional (meth)acrylic compound refers to a resin having two or more (meth)acryloyl groups. It is believed that the polyfunctional (meth)acrylic compound forms a network structure that "wraps" the skeleton of the resin (A) by polymerization. It is presumed that the formation of such a complexly entangled structure improves the performance of the resin film.
• a polyfunctional (meth)acrylic compound represented by the following general formula can be used as an example of the polyfunctional (meth)acrylic compound.
• R' is a hydrogen atom or a methyl group
• n is 0 to 3
• R is a hydrogen atom or a (meth)acryloyl group.
• polyfunctional (meth)acrylic compounds include the following. Of course, polyfunctional (meth)acrylic compounds are not limited to these.
• Aronix M-400, Aronix M-460, Aronix M-402, Aronix M-510, Aronix M-520 (manufactured by Toagosei Co., Ltd.), KAYARAD T-1420, KAYARAD DPHA, KAYARAD DPCA20, KAYARAD DPCA30, KAYARAD DPCA60, KAYARAD DPCA120 (manufactured by Nippon Kayaku Co., Ltd.), Viscoat #230, Viscoat #300, Viscoat #802, Viscoat #2500, Viscoat #1000, Viscoat #1080 (manufactured by Osaka Organic Chemical Industry Co., Ltd.), NK Ester A-BPE-10 , NK Ester A-GLY-9E, NK Ester A-9550, and NK Ester A-DPH (manufactured by Shin-Nakamura Chemical Co., Ltd.).
• the amount of the polyfunctional (meth)acrylate compound relative to 100 parts by mass of the resin (A) is preferably 1 to 150 parts by mass, more preferably 20 to 120 parts by mass, and even more preferably 50 to 100 parts by mass.
• the resin (A) and the polyfunctional (meth)acrylate form an “entangled structure” upon curing.
• the resin (A) and the polyfunctional (meth) acrylate compound are moderately entangled, and the amount of extra components not involved in entanglement is thought to decrease. . And it is considered that the performance is further improved.
• the photosensitive resin composition contains a polyfunctional (meth)acrylic compound
• it may contain only one polyfunctional (meth)acrylate compound, or may contain two or more polyfunctional (meth)acrylate compounds. In the latter case, it is preferable to use together polyfunctional (meth)acrylate compounds having different numbers of functional groups.
• polyfunctional (meth)acrylate compounds having different numbers of functional groups By using polyfunctional (meth)acrylate compounds having different numbers of functional groups together, it is believed that a more complicated "entangled structure" is formed and the properties of the cured film are further improved.
• the resin (A) and a polyfunctional (meth)acrylic compound are used together, a polymerization reaction of the polyfunctional (meth)acrylic compound can be employed as the curing mechanism. Since this polymerization reaction does not involve dehydration in principle, the combined use of the resin (A) and the polyfunctional (meth)acrylic compound is also advantageous in that shrinkage due to heating is small.
• the photosensitive resin composition of this embodiment preferably contains a photosensitive agent.
• the photosensitive agent is not particularly limited as long as it can generate active species by light and cure the photosensitive resin composition.
• the photosensitizer preferably contains a photoradical generator.
• Photoradical generators are particularly effective in polymerizing polyfunctional (meth)acrylate compounds.
• the photoradical generator that can be used is not particularly limited, and known ones can be used as appropriate.
• Biimidazole compounds 1,2-octanedione, 1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime), ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)- 9H-carbazol-3-yl]-,1-(O-acetyloxime) and other oxime ester compounds; bis( ⁇ 5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3 -(1H-pyrrol-1-yl)-phenyl) titanocene compounds such as titanium; benzoic acid ester compounds such as p-dimethylaminobenzoic acid and p-diethylaminobenzoic acid; acridine compounds such as 9-phenylacridine; etc. can be mentioned.
• oxime ester compounds can be preferably used.
• photosensitive agent When using a photosensitive agent, only one photosensitive agent may be used, or two or more photosensitive agents may be used.
• the content of the photosensitizer is, for example, 1 to 30 parts by weight, preferably 5 to 20 parts by weight, per 100 parts by weight of the polyfunctional (meth)acrylate compound.
• the photosensitive resin composition of this embodiment may contain a thermal radical initiator.
• a thermal radical initiator accelerates the polymerization reaction of the polyfunctional (meth)acrylic compound and improves the heat resistance of the cured film. and/or the chemical resistance (resistance to organic solvents and the like) of the cured film can be increased.
• the thermal radical initiator preferably contains an organic peroxide.
• Organic peroxides include octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, 1,1,3,3-tetramethylbutylperoxy 2-ethylhexanoate, oxalic acid peroxide, 2,5-dimethyl- 2,5-di(2-ethylhexanoylperoxy)hexane, 1-cyclohexyl-1-methylethylperoxy 2-ethylhexanoate, t-hexylperoxy 2-ethylhexanoate, t-butylperoxy 2-ethylhexanoate, m-toluyl peroxide, benzoyl peroxide, benzoyl peroxide, methyl ethyl ketone peroxide, acetyl peroxide, t-butyl hydroperoxide, di-t-butyl per
• thermal radical initiator when a thermal radical initiator is used, only one thermal radical initiator may be used, or two or more thermal radical initiators may be used. When a thermal radical initiator is used, its amount is preferably 0.1 to 30 parts by weight, more preferably 1 to 20 parts by weight, based on 100 parts by weight of the polyfunctional (meth)acrylic compound.
• the photosensitive resin composition of this embodiment may contain an epoxy resin.
• the epoxy resin is believed to form a bond with the resin (A), and the bond thus formed can enhance the mechanical properties (tensile elongation, etc.) of the cured film.
• epoxy resins include the following. Of course, epoxy resins are not limited to these. Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylene isopridien) bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylenediisopridiene) bisphenol type epoxy resin), bisphenol Z type epoxy resin (4,4'-cyclohexane Bisphenol-type epoxy resins such as cydiene bisphenol-type epoxy resin) and tetramethylbisphenol F-type epoxy resin; Resins, novolac type epoxy resins such as novolak type epoxy resins having a condensed ring aromatic hydrocarbon structure; biphenyl type epoxy resins; xylylene type epoxy resins, aralkyl type epoxy resins such as biphenyl aralkyl type epoxy resins; naphthylene
• an epoxy resin When an epoxy resin is used as an additive, its amount is, for example, 0.5 to 100 parts by mass, preferably 1 to 50 parts by mass, more preferably 3 to 20 parts by mass, relative to 100 parts by mass of the resin (A). be.
• epoxy resin when used as an additive, only one epoxy resin may be used, or two or more epoxy resins may be used together.
• the photosensitive resin composition of this embodiment may contain a curing catalyst.
• a curing catalyst promotes the polymerization reaction of the epoxy resin, and can further improve, for example, the tensile elongation of the cured film.
• Curing catalysts include compounds known as curing catalysts for epoxy resins (often called curing accelerators). For example, diazabicycloalkenes such as 1,8-diazabicyclo[5,4,0]undecene-7 and derivatives thereof; amine compounds such as tributylamine and benzyldimethylamine; imidazole compounds such as 2-methylimidazole; triphenyl Organic phosphines such as phosphine and methyldiphenylphosphine; tetra-substituted phosphonium salts such as phosphonium/tetranaphthyloxyborate and tetraphenylphosphonium/4,4'-sulfonyldiphenolate; and triphenylphosphine obtained by adducting benzoquinone. Among them, organic phosphines are preferred.
• its amount is, for example, 1 to 80 parts by mass, preferably 5 to 50 parts by mass, and more preferably 5 to 30 parts by mass with respect to 100 parts by mass of the epoxy resin.
• the photosensitive resin composition of this embodiment may contain a silane coupling agent.
• silane coupling agent By using the silane coupling agent, the adhesion between the resin film formed from the photosensitive resin composition and the substrate can be further enhanced.
• Silane coupling agents include, for example, amino group-containing silane coupling agents, epoxy group-containing silane coupling agents, (meth)acryloyl group-containing silane coupling agents, mercapto group-containing silane coupling agents, and vinyl group-containing silane coupling agents.
• a silane coupling agent such as a ureido group-containing silane coupling agent, a sulfide group-containing silane coupling agent, and a silane coupling agent having a cyclic anhydride structure can be used.
• a silane coupling agent having a cyclic anhydride structure is preferably used.
• the cyclic anhydride structure is likely to react with the main chain, side chains and/or terminals of the polyimide, and for this reason a particularly good effect of improving adhesion can be obtained.
• silane coupling agent When a silane coupling agent is used, it may be used alone, or two or more silane coupling agents may be used in combination.
• the amount used is, for example, 0.1 to 20 parts by mass, preferably 0.3 to 15 parts by mass, more preferably 0.3 to 15 parts by mass, when the amount of resin (A) used is 100 parts by mass. 0.4 to 12 parts by mass, more preferably 0.5 to 10 parts by mass.
• the photosensitive resin composition of this embodiment may contain a surfactant.
• a surfactant further enhances the applicability of the photosensitive resin composition and the flatness of the resin film formed from the photosensitive resin composition.
• surfactants include fluorine-based surfactants, silicone-based surfactants, alkyl-based surfactants, and acrylic surfactants.
• the surfactant is preferably nonionic. The use of nonionic surfactants is preferable, for example, from the viewpoint of suppressing unintentional reactions with other components in the composition and enhancing the storage stability of the composition.
• the surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom. This contributes to obtaining a uniform resin film (improvement of coatability), improvement of developability, and improvement of adhesive strength.
• a surfactant is preferably, for example, a nonionic surfactant containing at least one of a fluorine atom and a silicon atom. Examples of commercial products that can be used as surfactants include F-251, F-253, F-281, F-430, and F-477 of "Megafac (registered trademark)" series manufactured by DIC Corporation.
• fluorine-containing oligomer structure surfactants fluorine-containing nonionic surfactants such as Phthagent 250 and Phthagent 251 manufactured by Neos Co., Ltd., SILFOAM (registered trademark) series manufactured by Wacker Chemie ( Examples include silicone surfactants such as SD 100 TS, SD 670, SD 850, SD 860, SD 882).
• FC4430 and FC4432 manufactured by 3M are also preferable surfactants.
• a surfactant When a surfactant is used, it may be used alone, or two or more surfactants may be used in combination.
• the photosensitive resin composition of the present embodiment contains a surfactant
• its amount is, for example, 0.001 to 1 part by mass, preferably 0.005, when the content of the resin (A) is 100 parts by mass. ⁇ 0.5 parts by mass.
• the photosensitive resin composition of this embodiment may contain water.
• the presence of water facilitates the hydrolysis reaction of the silane coupling agent, and tends to further increase the adhesion between the substrate and the cured film.
• the amount is preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the total solid content (non-volatile components) of the photosensitive resin composition. It is preferably 0.2 to 3 parts by mass, more preferably 0.5 to 2 parts by mass.
• the water content of the photosensitive resin composition can be quantified by the Karl Fischer method.
• the photosensitive resin composition of this embodiment preferably contains a solvent. This makes it possible to easily form a photosensitive resin film on a base material (particularly, a base material having steps) by a coating method.
• a solvent usually contains an organic solvent.
• the organic solvent is not particularly limited as long as it can dissolve or disperse each component described above and does not substantially chemically react with each component.
• organic solvents include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, benzyl Alcohol, propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, ⁇ -butyrolactone, methyl lactate, ethyl lactate, butyl lactate and the like. . These may be used singly or in combination.
• the photosensitive resin composition of the present embodiment contains a solvent
• the photosensitive resin composition of the present embodiment is usually in the form of varnish. Since the photosensitive resin composition of the present embodiment is in the form of varnish, it is possible to form a uniform film by coating. Moreover, it is preferable that the photosensitive resin composition of the present embodiment is in the form of a varnish and that at least the resin (A) is dissolved in a solvent.
• the concentration of the total solid content in the photosensitive resin composition is preferably 10 to 50% by mass, more preferably 20 It is used so as to be ⁇ 45% by mass. By setting it as this range, each component can fully be melt
• the photosensitive resin composition of the present embodiment may contain components other than those listed above, if necessary.
• examples of such components include antioxidants, fillers such as silica, sensitizers, film-forming agents, and the like.
• the resin film of the present embodiment is made of a cured product of the above photosensitive resin composition.
• the above photosensitive resin composition can be applied onto a base material of an electronic device and cured to form a resin film.
• the electronic device of this embodiment includes the resin film described above.
• the electronic device of this embodiment can be manufactured by the following manufacturing process.
• the manufacturing process of the electronic device of this embodiment includes: A film forming step of forming a photosensitive resin film on a substrate using the photosensitive resin composition described above; an exposure step of exposing the photosensitive resin film; a developing step of developing the exposed photosensitive resin film; including.
• the method for manufacturing an electronic device of the present embodiment includes a thermosetting step of heating and curing the exposed photosensitive resin film after the above-described developing step. Thereby, a cured film having good heat resistance can be obtained.
• the film forming step is usually performed by applying a photosensitive resin composition onto the substrate.
• the film forming step can be performed using a spin coater, bar coater, spray device, inkjet device, or the like.
• Appropriate heating is preferably performed for the purpose of drying the solvent in the coated photosensitive resin composition before the next exposure step.
• the heating at this time is performed, for example, at a temperature of 80 to 150° C. for 1 to 60 minutes.
• the thickness of the photosensitive resin film after drying varies depending on the structure of the final electronic device to be obtained.
• the amount of exposure in the exposure step is not particularly limited. 100 to 2000 mJ/cm 2 is preferred, and 200 to 1000 mJ/cm 2 is more preferred.
• the light source used for exposure is not particularly limited as long as it emits light of a wavelength (eg, g-line or i-line) with which the photosensitive agent in the photosensitive resin composition reacts.
• a high pressure mercury lamp is typically used.
• Post-exposure baking may be performed as necessary.
• the post-exposure baking temperature is not particularly limited. It is preferably 50 to 150°C, more preferably 50 to 130°C, still more preferably 55 to 120°C, and particularly preferably 60 to 110°C.
• the post-exposure bake time is preferably 1 to 30 minutes, more preferably 1 to 20 minutes, still more preferably 1 to 15 minutes.
• a photomask can be used in the exposure step. Thereby, a desired "pattern" can be formed using the photosensitive resin composition.
• the developer used in the development process examples include an organic developer and a water-soluble developer.
• the developer preferably contains an organic solvent. More specifically, the developer is preferably a developer containing an organic solvent as a main component (a developer in which 95% by mass or more of the component is an organic solvent). By developing with a developer containing an organic solvent, swelling of the pattern due to the developer can be suppressed more than in the case of developing with an alkaline developer (aqueous). That is, it is easy to obtain a finer pattern.
• ketone solvents such as cyclopentanone
• ester solvents such as propylene glycol monomethyl ether acetate (PGMEA) and butyl acetate
• ether solvents such as propylene glycol monomethyl ether, etc.
• an organic solvent developer containing only an organic solvent and containing only unavoidable impurities may be used as the developer.
• Impurities that are unavoidably contained include metal elements and moisture, but from the viewpoint of preventing contamination of electronic devices, it is better that the impurities that are unavoidably contained are as small as possible.
• the method of bringing the developer into contact with the photosensitive resin film is not particularly limited.
• a generally known dipping method, paddle method, spray method, or the like can be appropriately applied.
• the time for the development process is usually in the range of about 5 to 300 seconds, preferably about 10 to 120 seconds, and is appropriately adjusted based on the film thickness of the resin film, the shape of the pattern to be formed, and the like.
• the conditions for the heat curing process are not particularly limited, but for example, the heating temperature can be about 160 to 250° C. for about 30 to 240 minutes.
• Resin (A-1) had a weight average molecular weight (Mw) of 50,000 by GPC measurement.
• Resin (A) (A-1) Resin synthesized above (imide ring structure-containing polyimide resin) (A-2) Resin synthesized above (polyamide acid ester resin)
• Polyfunctional (meth) acrylic compound (D-1) Viscoat #802 (manufactured by Osaka Organic Industry Co., Ltd., polyfunctional acrylic compound) (D-2) A-9550 (manufactured by Shin-Nakamura Chemical Co., Ltd., polyfunctional acrylic compound) (D-3) Viscoat #300 (manufactured by Osaka Organic Industry Co., Ltd., polyfunctional acrylic compound) (D-4) Viscoat #230 (manufactured by Osaka Organic Industry Co., Ltd., polyfunctional acrylic compound)
• Photosensitive agent (E-1) Irugacure OXE02 (manufactured by BASF, oxime ester type photoradical generator)
• Curing catalyst (H-1) Curing catalyst synthesized above (phosphonium salt)
• J-2) KBM-503 manufactured by Shin-Etsu Chemical Co., Ltd.
• ⁇ Tape test> Using a cutter, 100 patterns of 1 mm ⁇ 1 mm were formed on the film on the substrate obtained in the preparation of the tape test substrate. Next, after affixing Cellotape (registered trademark) with a peel strength of 3.0 mN/10 mm to the surface of the pattern, Cellotape (registered trademark) was peeled off vertically. Then, the number of peeled patterns was counted. In this evaluation, it was evaluated that the adhesion to copper was better as the number of peeled patterns was smaller.
• Cellotape registered trademark
• the substrate obtained in the preparation of the 90-degree peel strength evaluation substrate is set in a 90-degree peel strength measuring device (manufactured by Shimadzu Corporation, AUTOGRAPH AG-Xplus), and 1 cm is peeled at a peeling speed of 20 mm / min. and evaluated the average value of the peel strength.
• the unit of 90 degree peel strength is N/cm. A higher 90-degree peel strength is preferable from the standpoint of reliability.
• test piece 50 mm ⁇ 5 mm ⁇ 10 ⁇ m thick.
• Tg glass transition temperature
• a test piece was prepared in the same manner as in ⁇ Measurement of glass transition temperature (Tg)>.
• the resulting test piece was subjected to a tensile test using a tensile tester (Tensilon RTC-1210A, manufactured by Orientec Co., Ltd.) in an atmosphere of 23° C. in accordance with JIS K 7161, and the tensile elongation of the test piece was measured. It was measured.
• the drawing speed in the tensile test was 5 mm/min.
• the unit of tensile elongation is %.
• the photosensitive resin composition was spin-coated on a 12-inch silicon wafer having a plated copper layer of 3000 ⁇ on the surface so that the film thickness after drying was 5 ⁇ m, and dried on a hot plate at 100° C. for 3 minutes. , to obtain a photosensitive resin film.
• This photosensitive resin film is passed through a Toppan Printing Co., Ltd. mask (test chart No. 1: a left pattern and a blank pattern with a width of 0.5 to 50 ⁇ m are drawn), an i-line stepper (NSR-4425i manufactured by Nikon Corporation). ) was used to irradiate the i-line while changing the exposure amount.
• the film was developed with cyclopentanone at 2500 rpm for 30 seconds, and then with propylene glycol monomethyl ether acetate at 2500 rpm for 10 seconds. Further, after air-drying by spin drying at 2500 rpm for 10 seconds, drying was performed on a hot plate at 120° C. for 2 minutes. After that, heat treatment was performed at 200° C. for 90 minutes in a nitrogen atmosphere to obtain a patterned cured film.
• the obtained pattern was observed, and the pattern with a via hole of 7 ⁇ m ⁇ was evaluated as ⁇ (very good), the pattern with a via hole with a diameter of 10 ⁇ m was evaluated as ⁇ (good), and the pattern with a via hole with a diameter of 10 ⁇ m was evaluated as ⁇ (bad). evaluated.
• Viscosity change rate [%] ⁇ (viscosity A - viscosity B) / viscosity A ⁇ x 100
• a Cu wiring substrate was prepared by forming comb-shaped Cu wiring having a width of 5 ⁇ m, a pitch of 5 ⁇ m, and a height of 5 ⁇ m on a 12-inch silicon wafer with an oxide film.
• the photosensitive resin composition is applied onto the Cu wiring substrate by spin coating so that the film thickness after drying (the thickness of the portion without wiring) is 10 ⁇ m, and dried at 120° C. for 3 minutes to make it photosensitive.
• a resin film was formed.
• the resulting photosensitive resin film was exposed to light at 300 mJ/cm 2 using an i-line stepper without passing through a photomask.
• the test sample obtained in the preparation of the thermal cycle test sample is set in a temperature cycle test device (TCT device) (manufactured by Espec, TSA-72EH-W), and the temperature is raised from -60 ° C. to 200 ° C. and then The treatment was performed for 200 cycles, one cycle being a temperature drop to -60°C. Subsequently, a cross section of the Cu wiring portion was taken out by FIB (focused ion beam) processing and observed by SEM. In each example and comparative example, a total of 10 interfaces between the wiring and the resin film were observed. When peeling was not observed at all 10 locations, it was evaluated as ⁇ (good), and when peeling was observed at even one location, it was evaluated as x (bad).
• TCT device temperature cycle test device
• FIB focused ion beam
• the photosensitive resin compositions of Examples 1 to 7 were superior to Comparative Example 1 in all of the tape test, 90° peel strength, and thermal cycle test results. From these evaluation results, it is understood that the photosensitive resin compositions of Examples 1 to 7 are excellent in adhesion to substrates.

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• 2022
  • 2022-03-23 JP JP2023509250A patent/JPWO2022202907A1/ja active Pending
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