WO2022198515A1 - 电子雾化装置及供电组件和支架组件 - Google Patents

电子雾化装置及供电组件和支架组件 Download PDF

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Publication number
WO2022198515A1
WO2022198515A1 PCT/CN2021/082792 CN2021082792W WO2022198515A1 WO 2022198515 A1 WO2022198515 A1 WO 2022198515A1 CN 2021082792 W CN2021082792 W CN 2021082792W WO 2022198515 A1 WO2022198515 A1 WO 2022198515A1
Authority
WO
WIPO (PCT)
Prior art keywords
bracket
conductive
accommodating cavity
electrode
assembly according
Prior art date
Application number
PCT/CN2021/082792
Other languages
English (en)
French (fr)
Inventor
徐文孝
汪新宇
Original Assignee
深圳麦克韦尔科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳麦克韦尔科技有限公司 filed Critical 深圳麦克韦尔科技有限公司
Priority to PCT/CN2021/082792 priority Critical patent/WO2022198515A1/zh
Publication of WO2022198515A1 publication Critical patent/WO2022198515A1/zh
Priority to US18/471,904 priority patent/US20240008556A1/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/70—Manufacture
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/10—Devices using liquid inhalable precursors
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/42—Cartridges or containers for inhalable precursors
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/90—Arrangements or methods specially adapted for charging batteries thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to an atomizing device, and more particularly, to an electronic atomizing device, a power supply assembly and a bracket assembly.
  • the battery cell of the electronic atomization device in the related art is complicated to operate during the assembly process, for example, manual welding of wires is required. Therefore, a simple structure, fast assembly operation, safe and reliable cell structure is required, so as to realize the automation of the cell. Production.
  • the technical problem to be solved by the present invention is to provide an improved electronic atomization device, a power supply assembly and a bracket assembly.
  • the technical solution adopted by the present invention to solve the technical problem is: constructing a bracket assembly, including a bracket for accommodating battery cells, and a conductive structure arranged on the bracket;
  • the conductive structure is formed on the support by a laser direct molding process and forms an integral structure with the support.
  • the bracket includes a bottom wall, and at least part of the conductive structure is formed on the inner surface of the bottom wall.
  • the bracket includes a side wall
  • At least part of the conductive structure is formed on the inner surface of the sidewall.
  • the cell includes a first end extending along the length direction, and a second end opposite to the first end;
  • the conductive structure extends from the first end to the second end of the cell.
  • the bracket includes a first accommodating cavity for accommodating the electric core
  • the conductive structure is formed in the first accommodating cavity.
  • the bracket includes a second accommodating cavity for accommodating the first circuit board
  • the conductive structure extends from the first accommodating cavity to the second accommodating cavity.
  • the bracket includes a third accommodating cavity for accommodating the second circuit board
  • the conductive structure extends from the first accommodating cavity to the third accommodating cavity.
  • the conductive structure includes a first electrode extending toward the second accommodating cavity;
  • the first electrode is formed in the second accommodating cavity by the laser direct molding process to abut against the first elastic electrode provided on the first circuit board.
  • the second accommodating cavity is provided with a first positioning boss
  • the first electrode is formed on the first positioning boss by the laser direct molding process.
  • the conductive structure includes a second electrode extending toward the third accommodating cavity;
  • the second electrode is formed in the third accommodating cavity by the laser direct molding process to abut against the second elastic electrode provided on the second circuit board.
  • the third accommodating cavity is provided with a second positioning boss
  • the second electrode is formed on the second positioning boss by the laser direct molding process.
  • the conductive structure includes at least one conductive member
  • the conductive member includes an elongated conductive connection portion, and the entire length of the conductive connection portion is formed on the bracket by the laser direct molding process.
  • one end of the conductive connecting portion of each of the conductive members is provided with a first electrode, and the other end is provided with a second electrode.
  • the conductive connection portion, the first electrode, and the second electrode are integrally formed on the support by the laser direct molding process, and form an integral structure with the support.
  • the conductive structure includes at least two conductive members
  • a first electrode is provided on each of the conductive members
  • the first electrodes on the two adjacent conductive members are arranged in mirror symmetry.
  • the conductive structure includes at least two conductive members
  • a second electrode is provided on each of the conductive members
  • the second electrodes on the two adjacent conductive members are arranged in mirror symmetry.
  • the present invention also constructs a power supply assembly, which includes the bracket assembly described in the present invention, and a battery cell disposed on the bracket assembly.
  • the present invention also constructs an electronic atomization device, comprising the power supply assembly of the present invention, and an atomizer connected to the power supply assembly.
  • the electronic atomizing device, power supply assembly and bracket assembly of the present invention have the following beneficial effects: the bracket assembly is formed by forming a conductive structure on the bracket through a laser direct molding process and forms an integrated structure with the bracket, thereby facilitating the realization of the battery cell. automatic installation, improve the efficiency of automatic cell installation.
  • FIG. 1 is a schematic structural diagram of an electronic atomization device according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a power supply assembly of the electronic atomization device shown in FIG. 1;
  • Fig. 3 is the partial structure schematic diagram of the power supply assembly shown in Fig. 2;
  • Fig. 4 is the partial structure exploded schematic diagram of the power supply assembly shown in Fig. 3;
  • FIG. 5 is a schematic structural diagram of a bracket assembly of the power supply assembly shown in FIG. 4;
  • Fig. 6 is the structural schematic diagram of the bracket of the bracket assembly shown in Fig. 5;
  • FIG. 7 is a schematic structural diagram of the conductive structure of the bracket assembly shown in FIG. 5;
  • FIG. 8 is a schematic structural diagram of a first circuit board of the power supply assembly shown in FIG. 4;
  • FIG. 9 is a schematic structural diagram of a second circuit board of the power supply assembly shown in FIG. 4;
  • FIG. 10 is a schematic structural diagram of a bracket assembly of an electronic atomization device according to a second embodiment of the present invention.
  • FIG. 1 shows a first embodiment of the electronic atomizing device of the present invention.
  • the electronic atomization device includes an atomizer A and a power supply assembly B; the atomizer A can be used to heat the atomizing medium.
  • the power supply assembly B can be mechanically and/or electrically connected to the atomizer A, and can provide electrical energy to the atomizer A.
  • the power supply assembly includes a housing 10 , a bracket assembly 20 , a battery cell 30 , a first circuit board 40 , and a second circuit board 50 .
  • the casing 10 is used for accommodating the bracket assembly 20 , the cell 30 and the first circuit board 40 .
  • the bracket assembly 20 is disposed in the housing 10 to support the battery cell 30 and the first circuit board 40 .
  • the battery 30 is disposed on the bracket assembly 20 and located at the lower part of the bracket assembly 20 , and can provide electrical energy to the atomizer A.
  • the first circuit board 40 can be disposed on the bracket assembly 20 and can be electrically connected to the battery core 30 .
  • the second circuit board 50 can be disposed on the bracket assembly 20 , can be electrically connected to the first circuit board 40 , and can be connected to an external power source to charge the battery cells 30 .
  • the housing 10 is a cylindrical structure with an opening at one end.
  • the housing 10 can be an injection molded part, of course, it is understood that in other embodiments, the housing 10 can also be a metal housing.
  • the bracket assembly 20 may include a bracket 21 and a conductive structure 22 .
  • the bracket 21 can be used to accommodate the battery cell 30 and the first circuit board 40 .
  • the conductive structure 22 can be disposed on the bracket 21 and can be integrally formed with the bracket 21 .
  • the bracket 21 may be substantially flat, and in some embodiments, the cross section of the bracket 21 may be oval.
  • the bracket 21 can be an insulating member, specifically, in some embodiments, the bracket 21 can be an injection molded part, preferably, the bracket 21 is a plastic that can be activated by laser.
  • the plastic is a plastic containing an additive in the form of a special organometallic compound, which can be activated by a physical and chemical reaction under the irradiation of a focused laser beam. After activation, an organic copper plating soak is performed to form conductive traces.
  • the bracket 21 may not be limited to a plastic material, but may be a ceramic or other material.
  • the bracket 21 may not be limited to an insulating member, and can be insulated from the conductive structure 22 by providing an insulating member.
  • the bracket 21 may include a bottom wall 211 , a side wall 212 , a first end wall 213 and a second end wall 214 .
  • the bottom wall 211 may be a long bottom wall, and there are two side walls 212 , and the two side walls 212 may be disposed on two opposite sides of the bottom wall 211 and may be spaced from the bottom wall 211 .
  • the side wall 212 can be integrally formed with the bottom wall 211 , and a hollow structure 2110 can be disposed between the side wall 212 and the bottom wall 211 , and the hollow structure 2110 can facilitate demolding of the entire bracket 21 .
  • the first end wall 213 can be disposed at one end of the bottom wall 211 and connected with the two side walls 212 and can be connected with the atomizer.
  • the second end wall 214 can be disposed at the other end of the bottom wall 211 , connected with the two side walls 212 , and disposed opposite to the first end wall 213 .
  • the bottom wall 211 , the side wall 212 , the first end wall 213 and the second end wall 214 can surround and form a cavity.
  • the bracket 21 may further include a first partition wall 215 and a second partition wall 216; the first partition wall 215 may be disposed on the bottom wall 211 and disposed close to the first end wall 213, and It can be spaced from and parallel to the first end wall 213 .
  • the second partition wall 216 is disposed on the bottom wall 211 , close to the second end wall 214 , and can be spaced from and parallel to the second end wall 214 .
  • the first partition wall 215 and the second partition wall 216 can divide the cavity formed by the bottom wall 211 , the side wall 212 , the first end wall 213 and the second end wall 214 into three cavities.
  • the bracket 21 may include a first accommodating cavity 2101 , a second accommodating cavity 2102 and a third accommodating cavity 2103 .
  • the first accommodating cavity 2101 can be used for accommodating the cells 30, the first accommodating cavity 2101 can be located between the first partition wall 215 and the second partition wall 216; the second accommodating cavity 2102 can be used for accommodating the second partition wall 2102.
  • a circuit board 40 may be located between the first end wall 213 and the first partition wall 215 .
  • the third accommodating cavity 2103 can be used for accommodating the second circuit board 50 and can be located between the second end wall 214 and the second partition wall 216 .
  • the conductive structure 22 can be formed on the support 21 by a laser direct structuring process (LDS process), and form an integral structure with the support 21 .
  • LDS process laser direct structuring process
  • the entire conductive structure 22 may be formed on the bottom wall 211 , located on the inner surface of the bottom wall 211 , and integrally formed with the bottom wall 211 .
  • the conductive structure 22 may be partially formed on the bottom wall 211 and may be integrally formed with the bottom wall 211 .
  • the conductive structure 22 may not be limited to formed on the inner surface of the bottom wall 211 .
  • the conductive structure 22 can be formed in the first accommodating cavity 2101, one end can extend from the first accommodating cavity 2101 to the second accommodating cavity 2102, and the other end can extend from the first accommodating cavity 2101 to the second accommodating cavity 2102.
  • the accommodating cavity 2101 extends to the third accommodating cavity 2103 and is electrically connected to the first circuit board 40 and the second circuit board 50 respectively.
  • the conductive structure 22 may not be limited to being disposed in the first accommodating cavity 2101, and not limited to extending from the first accommodating cavity 2101 to the second accommodating cavity 2102, and extending from the first accommodating cavity 2101 to the second accommodating cavity 2103 .
  • the conductive structure 22 may include two conductive members 22a, 22b.
  • the two conductive members 22a, 22b may include a first conductive member 22a and a second conductive member 22b; the first conductive member 22a may be a positive conductive member, and the positive conductive member of the first circuit board 40 and the second circuit board 50 Extreme connection.
  • the second conductive member 22b can be a negative conductive member, and can be connected to the negative terminals of the first circuit board 40 and the second circuit board 50 . It can be understood that, in other embodiments, the number of the conductive members 22a, 22b is not limited to two, and may be one or more than two.
  • the structures of the first conductive member 22a and the second conductive member 22b are substantially the same.
  • the two conductive members 22a, 22b can be formed on the bottom wall 211 of the bracket 21 by a laser direct structuring process (LDS process).
  • LDS process laser direct structuring process
  • the conductive members 22 a and 22 b may include conductive connecting portions 221 , a first electrode 222 , and a second electrode 223 .
  • the conductive connecting portion 221 , the first electrode 222 and the second electrode 223 can be integrally formed, and can be formed on the bracket 21 by a laser direct structuring process (LDS process), and can form an integral structure with the bracket 21 respectively.
  • LDS process laser direct structuring process
  • the first electrodes 222 on the two conductive members 22a, 22b can be arranged in mirror symmetry, and the second electrodes 223 on the two conductive members 22a, 22b can be arranged in mirror symmetry; of course, it can be understood that In other embodiments, the first electrodes 222 of the two conductive members 22a, 22b may not be limited to be arranged in mirror symmetry, and the second electrodes 223 of the two conductive members 22a, 22b may not be limited to be arranged in mirror symmetry.
  • the conductive connection portion 221 may be a slender sheet-like structure, and may be formed on the bracket 21 through a laser direct structuring process (LDS process) along its entire length.
  • the conductive connection portion 221 may be formed by a laser direct structuring process (LDS process). It is formed on the inner surface of the bottom wall 211 and can be located in the first accommodating cavity 2101 , and two ends thereof extend toward the second accommodating cavity 2102 and the second accommodating cavity 2103 respectively.
  • LDS process laser direct structuring process
  • the conductive connection portion is not limited to be formed on the bracket 21 by a laser direct structuring process (LDS process) in its entire length.
  • the first electrode 222 can be disposed at one end of the conductive connection portion 221 and can be connected to the conductive connection portion 221. Specifically, in this embodiment, the first electrode 222 can extend toward the second accommodating cavity 2102, It can be formed in the second accommodating cavity 2102 through a laser direct structuring process (LDS process), and can be used for conductive connection with the first circuit board 40 . Specifically, in this embodiment, the bottom wall 211 is provided with a first positioning boss 2111 , and the first positioning boss 2111 can protrude toward the second accommodating cavity 2102 and be located in the second accommodating cavity In 2102 , the first positioning boss 2111 can be integrally formed with the bottom wall 211 . The first electrode 222 can be formed on the first positioning boss 2111 by a laser direct structuring process (LDS process) so as to be in contact with the first circuit board 40 .
  • LDS process laser direct structuring process
  • the second electrode 223 can be disposed on the other end of the conductive connecting portion 221 and can be connected to the conductive connecting portion 221 .
  • the second electrode 223 can extend toward the third accommodating cavity 2103 , and can be formed in the third accommodating cavity 2103 by a laser direct structuring process (LDS process), and can be used for conductive connection with the second circuit board 50 .
  • the bottom wall 211 is provided with The second positioning boss 2112 , the second positioning boss 2112 can protrude toward the third accommodating cavity 2103 , and can be located in the third accommodating cavity 2103 .
  • the second positioning boss 2112 can be integrally formed with the bottom wall 211 .
  • the second electrode 223 may be formed on the second positioning boss 2112 by a laser direct structuring process (LDS process), so as to be conductively connected to the second circuit board 50 .
  • LDS process laser direct structuring process
  • the battery 30 can be accommodated in the first accommodating cavity 2101 , the battery 30 can be a rechargeable battery, and can be powered by an external power supply, so as to continuously supply the atomizer to the atomizer.
  • the electric power is provided, thereby improving the cyclicity of the power supply component and reducing the waste of resources.
  • the cell 30 may include a cell body 31 and an electrode sheet 32 , the cell body 31 may be accommodated in the first accommodating cavity 2101 , and the electrode sheet 32 may be disposed in the cell body One end of the 31 can extend toward the second accommodating cavity 2102 and can be connected to the first circuit board 40 .
  • the number of the electrode sheets 311 can be two, which can be a positive electrode sheet and a negative electrode sheet, and can be welded on the first circuit board 40 .
  • the cell 30 may include a first end 3101 and a second end 3102 ; the first end 3101 and the second end 3102 may extend along the length direction of the cell 30 .
  • the conductive structure may extend from the first end 3101 of the cell 30 toward the second end 3102 of the cell 30 , and at least two of the first electrodes 222 of the conductive structure 22 are located at the first end 3101 of the cell 30 , Specifically, the first electrode 222 can extend from the bottom wall 211 along the first end 3101 of the cell 30 , and at least two of the second electrodes 223 of the conductive structure 22 are located at the second end of the cell 30 . Specifically Ground, the second electrode 223 may extend from the bottom wall 211 along the second end 3102 of the cell 30 .
  • the first circuit board 40 can be accommodated in the second accommodating cavity 2102 , and the first circuit board 40 can include a first board body 41 and a set of The first elastic electrodes 42 on the first board body 41 can be disposed in a one-to-one correspondence with the first electrodes 222 , and can then elastically abut with the first electrodes 222 .
  • the first elastic electrode 42 may be an elastic sheet structure, which may be disposed on the first board body 41 through an SMT chip process, so as to realize the conductive connection between the conductive structure 22 and the first circuit board 40 .
  • an airflow sensing device 43 can be disposed on the first plate body 41 of the cover.
  • the airflow sensing device 43 can be located on the side opposite to the first elastic electrode 42.
  • the airflow sensing device 43 can be connected to the first elastic electrode 42.
  • a circuit board 40 is electrically connected and can be used to activate the atomizer A.
  • the airflow sensing device 43 may be a microphone or a MEMS sensor.
  • the second circuit board 50 can be accommodated in the second accommodating cavity 2102 , and the second circuit board 50 can include a second board body 51 disposed in the The charging interface 52 on the second board body 51 and the second elastic electrode 53 disposed on the second board body 51 .
  • the second board body 51 can be electrically connected to the charging interface 52 .
  • the charging port 52 can be accommodated in the second accommodating cavity 2102 , and the second end wall 214 can be disposed on the plug port 2141 corresponding to the charging port 52 .
  • the charging interface 52 can be a USB interface, which can be connected to an external power source, so as to supply power to the second circuit board 50 , so as to charge the battery cell 30 .
  • the charging interface 52 may not be limited to a USB interface.
  • the second elastic electrode 53 can be disposed on the second plate body 51 , and can be disposed in a one-to-one correspondence with the second electrode 223 , and can then elastically abut with the second electrode 223 .
  • the second electrode 223 may be an elastic sheet structure, which may be disposed on the second board body 51 through an SMT patch process, and elastically abutted with the second electrode 223 to realize the second electrode 223 .
  • the circuit board 50 is conductively connected to the conductive structure 22 .
  • the power supply assembly may further include an air guide member 60 .
  • the air guide member 60 can be used to guide air to the airflow sensing device 43 so as to facilitate the activation of the airflow sensing device 43 .
  • the air guide member 60 may be located in the second accommodating cavity 2102 , and in some embodiments, the air guide member 60 may be a silicone piece.
  • the air guide member 60 may not be limited to a silicone piece, but may be made of other soft materials.
  • the air guide member 60 can be disposed on the side of the first circuit board 40 opposite to the airflow sensing device 43 , and can communicate with the airflow sensing device 43 .
  • the bracket 21 can also be provided with a liquid leakage prevention structure 217, and the leakage prevention structure 217 can be integrally formed with the bracket 21, and can be used to prevent the leakage of the liquid medium in the airflow channel; the leakage prevention liquid
  • the structure 217 can be located in the second accommodating cavity 2102 of the bracket 21 , can be located on the bottom wall 211 , and can be integrally formed with the bottom wall 211 by injection molding.
  • the anti-leakage structure 217 can be integrally formed with the bottom wall 211 by injection molding.
  • the anti-leakage structure 217 may be disposed toward the air guide member 60 , and may form the main channel of the air flow channel with the air guide member 60 .
  • the anti-leakage structure 217 may include a liquid suction groove 2171, and the liquid suction groove 2171 may be disposed on the bracket 21, and may be located in the second accommodating cavity 2102, and may be located on the bottom wall
  • the suction groove 2171 can be a capillary groove, which can absorb the liquid medium flowing out of the airflow channel by generating capillary force, thereby reducing the corrosion of the liquid medium to the airflow sensing device 42 and the first circuit board 40.
  • there may be multiple suction grooves 2171 and the multiple suction grooves 2171 are arranged side by side in a direction away from the ventilation hole 2131 , so that the liquid medium can be gradually stored.
  • the gas flow directions in are set side by side.
  • the first end wall 213 is provided with a ventilation hole 2131
  • the suction groove 2171 can be a strip-shaped groove
  • the suction groove 2171 can be along the ventilation hole along the air intake direction perpendicular to the ventilation hole 2131
  • the two sides of 2131 are extended, that is, transversely slotted, so that the time for the condensate to flow down can be slowed down.
  • the anti-leakage structure 217 may further include a groove wall 2172.
  • the groove wall 2172 may have a substantially cuboid structure, may be a frame, and may be disposed on the outer periphery of the liquid suction groove 2171, so that the A plurality of liquid suction grooves 2172 are disposed therein, and the groove walls 2172 can surround and form embedded grooves 2173 , and the embedded grooves 2173 can be used for embedded installation of the air guide member 60 .
  • the power supply assembly B may further include a sealing member 70, and the sealing cover 70 may cover the opening of the second accommodating cavity 2102, and may be press-fitted on the first circuit board 40,
  • the bracket 21 can be connected and fixed by screws.
  • the power supply assembly B may further include a sealing sleeve 80 , and the sealing sleeve 80 may be sleeved on the first end wall 213 and may be sealedly connected with the housing 10 .
  • the sealing sleeve 80 may be a silicone sleeve.
  • the power supply assembly B may further include a thimble 90, the two thimbles 90 can be mounted on the first end wall 213, one end is in contact with the atomizer A, and the other end is in contact with the first end wall 213.
  • the circuit board 40 is electrically connected.
  • the first end wall 213 can be provided with through holes 2132 for the thimbles 90 to pass through in a one-to-one correspondence, and the through holes 2132 can communicate with the second accommodating cavity 2102 .
  • the power supply component B may further include a lamp post 100, which may be disposed on the sealing member 70, and may be disposed through the casing 10, and may be connected with the first circuit
  • the board 40 is connected and can be used to display the use status of the atomizer A.
  • FIG. 10 shows a second embodiment of the electronic atomization device of the present invention, which is different from the first embodiment in that the conductive structure 22 can be partially formed on the sidewall 212 by a laser direct structuring process (LDS process).
  • the conductive structure 22 is formed on the inner surface of the sidewall 212 , specifically, the conductive connection structure of the conductive structure 22 is formed on the inner surface of the sidewall 212 , the first electrode 222
  • the laser direct structuring process (LDS process) is formed on the inner surface of the bottom wall 211 on the first positioning boss 2111
  • the second electrode 222 is formed on the inner surface of the bottom wall 211 by the laser direct structuring process (LDS process). and located on the second positioning boss 2111 .
  • the two conductive members 22a, 22b may be disposed in a one-to-one correspondence with the two side walls 212 .

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Battery Mounting, Suspending (AREA)
  • Hybrid Cells (AREA)

Abstract

一种电子雾化装置及供电组件和支架组件；支架组件(20)包括用于收容电芯(30)的支架(21)、以及设置于所述支架(21)上的导电结构(22)；所述导电结构(22)通过激光直接成型工艺形成于所述支架(21)上且与所述支架(21)形成一体结构。该支架组件(20)通过将导电结构(22)通过激光直接成型工艺形成于支架(21)上并与该支架(21)形成一体结构，从而可便于实现电芯(30)的自动化安装，提高电芯(30)自动化安装效率。

Description

电子雾化装置及供电组件和支架组件 技术领域
本发明涉及雾化装置，更具体地说，涉及一种电子雾化装置及供电组件和支架组件。
 背景技术
相关技术中的电子雾化装置的电芯在装配的过程中，操作繁琐，例如需要人工焊接导线，因此需要一种结构简单、组装操作快捷、安全可靠的电芯结构，从而实现电芯的自动化生产。
 技术问题
相关技术中的电子雾化装置的电芯在装配的过程中，操作繁琐，例如需要人工焊接导线。
 技术解决方案
本发明要解决的技术问题在于，提供一种改进的电子雾化装置及供电组件和支架组件。
本发明解决其技术问题所采用的技术方案是：构造一种支架组件，包括用于收容电芯的支架、以及设置于所述支架上的导电结构；
所述导电结构通过激光直接成型工艺形成于所述支架上且与所述支架形成一体结构。
优选地，所述支架包括底壁，至少部分所述导电结构形成于所述底壁的内表面。
优选地，所述支架包括侧壁；
至少部分所述导电结构形成于所述侧壁的内表面。
优选地，所述电芯包括沿长度方向延伸的第一端、以及与所述第一端相对设置的第二端；
所述导电结构从所述电芯的所述第一端延伸至所述第二端。
优选地，所述支架包括容置所述电芯的第一容置腔；
所述导电结构形成于所述第一容置腔中。
优选地，所述支架包括容置第一线路板的第二容置腔；
所述导电结构从所述第一容置腔延伸至所述第二容置腔。
优选地，所述支架包括容置第二线路板的第三容置腔；
所述导电结构从所述第一容置腔延伸至所述第三容置腔。
优选地，所述导电结构包括朝所述第二容置腔延伸的第一电极；
所述第一电极通过所述激光直接成型工艺形成于所述第二容置腔中以与所述第一线路板上设置的第一弹性电极抵接。
优选地，所述第二容置腔中设有第一定位凸台；
所述第一电极通过所述激光直接成型工艺形成于所述第一定位凸台上。
优选地，所述导电结构包括朝所述第三容置腔延伸的第二电极；
所述第二电极通过所述激光直接成型工艺形成于所述第三容置腔中以与所述第二线路板上设置的第二弹性电极抵接。
优选地，所述第三容置腔中设有第二定位凸台；
所述第二电极通过所述激光直接成型工艺形成于所述第二定位凸台上。
优选地，所述导电结构包括至少一个导电件；
所述导电件包括细长的导电连接部，所述导电连接部整个长度通过所述激光直接成型工艺形成于所述支架上。
优选地，每一所述导电件的所述导电连接部的一端设有第一电极，另一端设有第二电极。
优选地，所述导电连接部、所述第一电极、以及所述第二电极通过所述激光直接成型工艺一体成型所述支架上，并与所述支架形成一体结构。
优选地，所述导电结构包括至少两个导电件；
每个所述导电件上设有第一电极；
相邻设置的两个所述导电件上的所述第一电极呈镜像对称设置。
优选地，所述导电结构包括至少两个导电件；
每个所述导电件上设有第二电极；
相邻设置的两个所述导电件上的所述第二电极呈镜像对称设置。
本发明还构造一种供电组件，包括本发明所述的支架组件、以及设置于所述支架组件上的电芯。
本发明还构造一种电子雾化装置，包括本发明所述的供电组件、以及与所述供电组件连接的雾化器。
 有益效果
实施本发明的电子雾化装置及供电组件和支架组件，具有以下有益效果：该支架组件通过将导电结构通过激光直接成型工艺形成于支架上并与该支架形成一体结构，从而可便于实现电芯的自动化安装，提高电芯自动化安装效率。
 附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明第一实施例电子雾化装置的结构示意图；
图2是图1所示电子雾化装置的供电组件的结构示意图；
图3是图2所示供电组件的局部结构示意图；
图4是图3所示供电组件的局部结构分解示意图；
图5是图4所示供电组件的支架组件的结构示意图；
图6是图5所示支架组件的支架的结构示意图；
图7是图5所示支架组件的导电结构的结构示意图；
图8是图4所示供电组件的第一线路板的结构示意图；
图9是图4所示供电组件的第二线路板的结构示意图；
图10是本发明第二实施例电子雾化装置的支架组件的结构示意图。
 本发明的最佳实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
图1示出了本发明电子雾化装置的第一实施例。在本实施例中，该电子雾化装置包括雾化器A以及供电组件B；该雾化器A可用于加热雾化介质。该供电组件B可与该雾化器A机械地和/或电性地连接，可向该雾化器A提供电能。
如图2至图4所示，进一步地，在本实施例中，该供电组件包括外壳10、支架组件20、电芯30、第一线路板40、以及第二线路板50。该外壳10用于收容该支架组件20、电芯30以及第一线路板40。该支架组件20设置于该外壳10中，可支撑该电芯30和该第一线路板40。该电芯30设置于该支架组件20上，位于该支架组件20的下部，可向雾化器A提供电能。该第一线路板40可设置于该支架组件20上，且可与该电芯30导电连接。该第二线路板50可设置于该支架组件20上，且可该第一线路板40电连接，可接入外部电源给所述电芯30充电。
进一步地，在本实施例中，该外壳10为一端具有开口的筒状结构。该外壳10可为注塑件，当然，可以理解地，在其他一些实施例中，该外壳10也可以为金属外壳。
如图5至图6所示，进一步地，在本实施例中，该支架组件20可包括支架21以及导电结构22。该支架21可用于收容电芯30、第一线路板40。该导电结构22可设置于该支架21上，可与该支架21一体成型。
进一步地，在本实施例中，该支架21可大致呈扁平状，在一些实施例中，该支架21的横截面可呈椭圆形。该支架21可以为绝缘件，具体地，在一些实施例中，该支架21可以为注塑件，优选地，该支架21为可进行激光活化的塑料。该塑料为含有一种特殊的有机金属复合物形态的添加物的塑料，这种添加物在聚焦激光束的照射下可以物理化学反应而被活化。在活化后，进行有机镀铜浸泡以形成导电线路。当然，可以理解地，在其他一些实施例中，该支架21可不限于塑胶材质，可以为陶瓷或者其他材质。当然，可以理解地，在一些实施例中，该支架21也可不限于绝缘件，可通过设置绝缘件与该导电结构22绝缘设置。
在本实施例中，该支架21可包括底壁211、侧壁212、第一端壁213以及第二端壁214。该底壁211可以为长底壁，该侧壁212为两个，该两个侧壁212可设置于该底壁211的两相对侧，且可与该底壁211间隔设置。该侧壁212可与该底壁211一体成型，该侧壁212与该底壁211之间可设置镂空结构2110，该镂空结构2110可便于整个支架21脱模。该第一端壁213可设置于该底壁211的一端，且与该两个侧壁212相连接，并可与该雾化器相接。该第二端壁214可设置于该底壁211的另一端，并与两个侧壁212相连接，且与该第一端壁213相对设置。该底壁211、侧壁212、第一端壁213以及第二端壁214可围设形成腔体。进一步地，在一些实施例中，该支架21还可包括第一隔壁215以及第二隔壁216；该第一隔壁215可设置于该底壁211上，且靠近该第一端壁213设置，并可与该第一端壁213间隔且平行设置。该第二隔壁216设置于该底壁211上，且靠近该第二端壁214设置，并可与该第二端壁214间隔且平行设置。该第一隔壁215和第二隔壁216可将该底壁211、侧壁212、第一端壁213以及第二端壁214可围设形成的腔体分隔为三个腔体。进一步地，在一些实施例中，该支架21可包括第一容置腔2101、第二容置腔2102以及第三容置腔2103。该第一容置腔2101可用于容置电芯30，该第一容置腔2101可位于该第一隔壁215和该第二隔壁216之间；该第二容置腔2102可用于容置第一线路板40，可位于该第一端壁213和第一隔壁215之间。该第三容置腔2103可用于容置第二电路板50，可位于该第二端壁214和该第二隔壁216之间。
如图5及图7所示，进一步地，在本实施例中，该导电结构22可通过激光直接成型工艺（LDS工艺）形成于该支架21上，且与该支架21形成一体结构。具体地，在本实施例中，该导电结构22整个可形成于该底壁211上，且位于该底壁211的内表面，与该底壁211一体成型。当然，可以理解地，在其他一些实施例中，该导电结构22可部分形成于该底壁211上，并可与该底壁211一体成型，在其他一些实施例中，该导电结构22可不限于形成于该底壁211的内表面。在本实施例中，该导电结构22可形成于该第一容置腔2101中，且一端可从该第一容置腔2101延伸至第二容置腔2102，另一端可从该第一容置腔2101延伸至第三容置腔2103，分别与该第一线路板40和第二线路板50导电连接。当然，可以理解地，在其他一些实施例中，该导电结构22可不限于设置于该第一容置腔2101中，且不限于从该第一容置腔2101延伸至第二容置腔2102，以及从第一容置腔2101延伸至第二容置腔2103。
进一步地，在本实施例中，该导电结构22可包括两个导电件22a，22b。该两个导电件22a，22b可包括第一导电件22a和第二导电件22b；该第一导电件22a可以为正极导电件，与该第一线路板40和该第二线路板50的正极端连接。该第二导电件22b可以为负极导电件，可与该第一线路板40和该第二线路板50的负极端连接。可以理解的，在其他一些实施例中，该导电件22a，22b可不限于两个，可以为一个或者大于两个。在本实施例中，该第一导电件22a和该第二导电件22b的结构大致相同。在本实施例中，该两个导电件22a，22b均可通过激光直接成型工艺（LDS工艺）形成于该支架21的底壁211上。
进一步地，在本实施例中，该导电件22a，22b可包括导电连接部221、第一电极222、以及第二电极223。该导电连接部221、第一电极222以及第二电极223可一体成型，并可通过激光直接成型工艺（LDS工艺）形成于该支架21上，且可分别与该支架21形成一体结构。在本实施例中，该两个导电件22a，22b上的第一电极222可呈镜像对称设置，该两个导电件22a，22b上的第二电极223可呈镜像对称设置；当然，可以理解地，在其他一些实施例中，该两个导电件22a，22b的第一电极222可不限于呈镜像对称设置，该两个导电件22a，22b的第二电极223可不限于呈镜像对称设置。
该导电连接部221可为细长的片状结构，可整个长度通过激光直接成型工艺（LDS工艺）形成于该支架21上，具体地，该导电连接部221可激光直接成型工艺（LDS工艺）形成于该底壁211的内表面，且可位于该第一容置腔2101中，其两端分别朝该第二容置腔2102和第二容置腔2103延伸设置。当然可以理解地，在其他一些实施例中，该导电连接部不限于整个长度通过激光直接成型工艺（LDS工艺）形成于该支架21上。
该第一电极222可设置于该导电连接部221的一端，可与该导电连接部221连接，具体地，在本实施例中，该第一电极222可朝该第二容置腔2102延伸，并可通过激光直接成型工艺（LDS工艺）形成于该第二容置腔2102中，可用于与该第一线路板40导电连接。具体地，在本实施例中，该底壁211上设有第一定位凸台2111，该第一定位凸台2111可朝该第二容置腔2102凸出设置，位于该第二容置腔2102中，该第一定位凸台2111可与该底壁211一体成型。该第一电极222可通过激光直接成型工艺（LDS工艺）形成于该第一定位凸台2111上，以便于与该第一线路板40抵接。
该第二电极223可设置于该导电连接部221的另一端，可与该导电连接部221连接，具体地，在本实施例中，该第二电极223可朝该第三容置腔2103延伸，并可通过激光直接成型工艺（LDS工艺）形成于第三容置腔2103中，可用于与该第二线路板50导电连接，具体地，在本实施例中，该底壁211上设有第二定位凸台2112，该第二定位凸台2112可朝该第三容置腔2103凸出设置，且可位于该第三容置腔2103中。该第二定位凸台2112可与该底壁211一体成型。该第二电极223可通过激光直接成型工艺（LDS工艺）形成于第二定位凸台2112上，以便于与该第二线路板50导电连接。
进一步地，在本实施例中，该电芯30可容置于该第一容置腔2101中，该电芯30可以为充电电池，可通过外接电源进行供电，从而可持续给该雾化器提供电能，进而可提高该供电组件的循环性，减少资源浪费。在本实施例中，该电芯30可包括电芯本体31以及电极片32，该电芯本体31可容置于该第一容置腔2101中，该电极片32可设置于该电芯本体31的一端，可朝该第二容置腔2102延伸，可与该第一线路板40连接。该电极片311可以为两个，可以为正极片和负极片，并可焊接于该第一线路板40上。该电芯30可包括第一端3101以及第二端3102；该第一端3101和该第二端3102可沿该电芯30的长度方向延伸。该导电结构可从该电芯30的第一端3101朝该电芯30的第二端3102延伸，该导电结构22的至少两个该第一电极222位于该电芯30的第一端3101，具体地，该第一电极222可沿电芯30的第一端3101从该底壁211延伸出，该导电结构22的至少两个该第二电极223位于该电芯30的第二端，具体地，该第二电极223可沿电芯30的第二端3102从该底壁211延伸出。
如图8所示，进一步地，在本实施例中，该第一线路板40可容置于该第二容置腔2102中，该第一线路板40可包括第一板本体41、以及设置于该第一板本体41上的第一弹性电极42，该第一弹性电极42可与该第一电极222一一对应设置，进而可与该第一电极222弹性抵接。在一些实施例中，该第一弹性电极42可以为弹片结构，可通过通过SMT贴片工艺设置于该第一板本体41上，从而实现该导电结构22与该第一线路板40导电连接。在本实施例中面盖第一板本体41上可设置气流感应装置43，该气流感应装置43可位于与该第一弹性电极42相背设置的一侧，该气流感应装置43可与该第一线路板40导电连接，可用于启动该雾化器A。在一些实施例中，该气流感应装置43可以为咪头或者MEMS传感器。
如图9所示，进一步地，在本实施例中，该第二线路板50可容置于该第二容置腔2102中，该第二线路板50可包括第二板本体51、设置于该第二板本体51上的充电接口52、设置于该第二板本体51上的第二弹性电极53。该第二板本体51可与该充电接口52导电连接。该充电接口52可收容于该第二容置腔2102中，该第二端壁214上可设置于该充电接口52对应设置的插接口2141。在一些实施例中，该充电接口52可以为USB接口，可与外置电源连接，以接入电能至该第二线路板50上，进而可给该电芯30充电。可以理解地，在其他一些实施例中，该充电接口52可不限于USB接口。在本实施例中，该第二弹性电极53可设置于该第二板本体51上，可与该第二电极223一一对应设置，进而可与该第二电极223弹性抵接。在一些实施例中，该第二电极223可以为弹片结构，可通过通过SMT贴片工艺设置于该第二板本体51上，并通过与该第二电极223弹性抵接，从而实现该第二线路板50与该导电结构22导电连接。
进一步地，在本实施例中，该供电组件还可包括导气构件60。该导气构件60可用于给该气流感应装置43导气，便于启动该气流感应装置43。进一步地，在本实施例中，该导气构件60可位于该第二容置腔2102中，在一些实施例中，该导气构件60可以为硅胶件。当然，可以理解地，在其他一些实施例中，该导气构件60可以不限于硅胶件，可采用其他的软质材料制成。该导气构件60可设置于该第一线路板40与该气流感应装置43相背设置的一侧，并可与该气流感应装置43导通。
进一步地，在本实施例中，该支架21上还可设置防漏液结构217，该防漏液结构217可与该支架21一体成型，可用于防止气流通道的液态介质漏出；该防漏液结构217可位于该支架21的第二容置腔2102中，并可位于该底壁211上，且可与该底壁211通过注塑一体成型。具体地，在一些实施例中，该防漏液结构217可与该底壁211通过注塑一体成型。在本实施例中，该防漏液结构217可朝向导气构件60设置，可与该导气构件60形成气流通道的主通道。
在本实施例中，该防漏液结构217可包括吸液槽2171，该吸液槽2171可设置于该支架21上，且可位于该第二容置腔2102中，并可位于该底壁211上，该吸液槽2171可以为毛细槽，可通过产生毛细力吸附气流通道流出的液态介质，进而可减少液态介质对气流感应装置42和第一线路板40的腐蚀。在一些实施例中，该吸液槽2171可以为多个，该多个吸液槽2171朝远离该通气孔2131的方向并排设置，进而可逐步储存液态介质，具体地，其可沿气流通道100中的气体流动方向并排设置。在本实施例中，该第一端壁213上设有通气孔2131，该吸液槽2171可以为条形槽，该吸液槽2171可沿垂直于该通气孔2131的进气方向沿通气孔2131的两侧延伸设置，也即横向开槽，从而可以减缓冷凝液下流的时间。
进一步地，在本实施例中，该防漏液结构217还可包括槽壁2172，该槽壁2172可大致呈长方体结构，可以为框体，可设置于该吸液槽2171的外周，使得该多个吸液槽2172设置于其中，该槽壁2172可围设形成嵌设槽2173，该嵌设槽2173可用于供导气构件60嵌设安装。
进一步地，在本实施例中，该供电组件B还可包括密封件70，该密封盖70可盖合该第二容置腔2102的开口，并可压设于该第一线路板40上，可通过螺丝与该支架21连接固定。
进一步地，在本实施例中，该供电组件B还可包括密封套80，该密封套80可套设于该第一端壁213上，且可与该外壳10密封连接。在一些实施例中，该密封套80可以为硅胶套。
进一步地，在本实施例中，该供电组件B还可包括顶针90，该两个顶针90可安装与该第一端壁213上，一端与该雾化器A抵接，另一端与第一线路板40导电连接。该第一端壁213上可设置供该顶针90一一对应穿设的穿孔2132，该穿孔2132可与该第二容置腔2102连通。
进一步地，在本实施例中，该供电组件B还可包括灯柱100，该灯柱100可设置于该密封件70上，且可从该外壳10穿出设置，并可与该第一线路板40连接，可用于显示该雾化器A的使用状态。
图10示出了本发明电子雾化装置的第二实施例，其与该第一实施例的区别在于，该导电结构22可部分通过激光直接成型工艺（LDS工艺）形成于该侧壁212上，进一步地，在本实施例中，该导电结构22形成于该侧壁212的内表面，具体地，该导电结构22的导电连接结构形成于该侧壁212的内表面，该第一电极222激光直接成型工艺（LDS工艺）形成于该底壁211的内表面，位于该第一定位凸台2111上，该第二电极222激光直接成型工艺（LDS工艺）形成于该底壁211的内表面且位于该第二定位凸台2111上。该两个导电件22a，22b可与该两个侧壁212一一对应设置。
可以理解的，以上实施例仅表达了本发明的优选实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制；应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，可以对上述技术特点进行自由组合，还可以做出若干变形和改进，这些都属于本发明的保护范围；因此，凡跟本发明权利要求范围所做的等同变换与修饰，均应属于本发明权利要求的涵盖范围。

Claims (18)

  1. 一种支架组件，其特征在于，包括用于收容电芯（30）的支架（21）、以及设置于所述支架（21）上的导电结构（22）；
    所述导电结构（22）通过激光直接成型工艺形成于所述支架（21）上且与所述支架（21）形成一体结构。
  2. 根据权利要求1所述的支架组件，其特征在于，所述支架（21）包括底壁（211），至少部分所述导电结构（22）形成于所述底壁（211）的内表面。
  3. 根据权利要求1所述的支架组件，其特征在于，根据权利要求1所述的支架组件，其特征在于，所述支架（21）包括侧壁（212）；
    至少部分所述导电结构（22）形成于所述侧壁（212）的内表面。
  4. 根据权利要求1所述的支架组件，其特征在于，所述电芯（30）包括沿长度方向延伸的第一端（3101）、以及与所述第一端（3101）相对设置的第二端（3102）；
    所述导电结构（22）从所述电芯（30）的所述第一端（3101）延伸至所述第二端（3102）。
  5. 根据权利要求1所述的支架组件，其特征在于，所述支架（21）包括容置所述电芯（30）的第一容置腔（2101）；
    所述导电结构（22）形成于所述第一容置腔（2101）中。
  6. 根据权利要求5所述的支架组件，其特征在于，所述支架（21）包括容置第一线路板（40）的第二容置腔（2102）；
    所述导电结构（22）从所述第一容置腔（2101）延伸至所述第二容置腔（2102）。
  7. 根据权利要求5所述的支架组件，其特征在于，所述支架（21）包括容置第二线路板（50）的第三容置腔（2103）；
    所述导电结构（22）从所述第一容置腔（2101）延伸至所述第三容置腔（2103）。
  8. 根据权利要求6所述的支架组件，其特征在于，所述导电结构（22）包括朝所述第二容置腔（2102）延伸的第一电极（222）；
    所述第一电极（222）通过所述激光直接成型工艺形成于所述第二容置腔（2102）中，以与所述第一线路板（40）上设置的第一弹性电极（42）抵接。
  9. 根据权利要求8所述的支架组件，其特征在于，所述第二容置腔（2102）中设有第一定位凸台（2111）；
    所述第一电极（222）形成于所述第一定位凸台（2111）上。
  10. 根据权利要求7所述的支架组件，其特征在于，所述导电结构（22）包括朝所述第三容置腔（2103）延伸的第二电极（223）；
    所述第二电极（223）通过所述激光直接成型工艺形成于所述第三容置腔（2103）中，以与所述第二线路板（50）上设置的第二弹性电极（52）抵接。
  11. 根据权利要求10所述的支架组件，其特征在于，所述第三容置腔（2103）中设有第二定位凸台（2112）；
    所述第二电极（223）形成于所述第二定位凸台（2112）上。
  12. 根据权利要求1所述的支架组件，其特征在于，所述导电结构（22）包括至少一个导电件（22a,22b）；
    所述导电件（22a,22b）包括细长的导电连接部（221），所述导电连接部（221）整个长度通过所述激光直接成型工艺形成于所述支架（21）上。
  13. 根据权利要求12所述的支架组件，其特征在于，每一所述导电件（22a,22b）的所述导电连接部（221）的一端设有第一电极（222），另一端设有第二电极（223）。
  14. 根据权利要求13所述的支架组件，其特征在于，所述导电连接部（221）、所述第一电极（222）、以及所述第二电极（223）通过所述激光直接成型工艺一体成型所述支架（21）上，并与所述支架（21）形成一体结构。
  15. 根据权利要求1所述的支架组件，其特征在于，所述导电结构（22）包括至少两个导电件（22a,22b）；
    每个所述导电件（22a,22b）上设有第一电极（222）；
    相邻设置的两个所述导电件（22a,22b）上的所述第一电极（222）呈镜像对称设置。
  16. 根据权利要求1所述的支架组件，其特征在于，所述导电结构（22）包括至少两个导电件（22a,22b）；
    每个所述导电件（22a,22b）上设有第二电极（223）；
    相邻设置的两个所述导电件（22a,22b）上的所述第二电极（223）呈镜像对称设置。
  17. 一种供电组件，其特征在于，包括权利要求1至16任一项所述的支架组件（20）、以及设置于所述支架组件（20）上的电芯（30）。
  18. 一种电子雾化装置，其特征在于，包括权利要求17所述的供电组件、以及与所述供电组件连接的雾化器。
PCT/CN2021/082792 2021-03-24 2021-03-24 电子雾化装置及供电组件和支架组件 WO2022198515A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190082736A1 (en) * 2017-09-19 2019-03-21 Rai Strategic Holdings, Inc Differential pressure sensor for an aerosol delivery device
CN110693087A (zh) * 2019-10-18 2020-01-17 深圳麦克韦尔科技有限公司 电子雾化装置及其雾化器
CN112490592A (zh) * 2020-11-18 2021-03-12 深圳麦克韦尔科技有限公司 电子雾化装置及其供电组件和支架
CN112490590A (zh) * 2020-11-18 2021-03-12 深圳麦克韦尔科技有限公司 电子雾化装置及其供电组件和支架

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190082736A1 (en) * 2017-09-19 2019-03-21 Rai Strategic Holdings, Inc Differential pressure sensor for an aerosol delivery device
CN110693087A (zh) * 2019-10-18 2020-01-17 深圳麦克韦尔科技有限公司 电子雾化装置及其雾化器
CN112490592A (zh) * 2020-11-18 2021-03-12 深圳麦克韦尔科技有限公司 电子雾化装置及其供电组件和支架
CN112490590A (zh) * 2020-11-18 2021-03-12 深圳麦克韦尔科技有限公司 电子雾化装置及其供电组件和支架

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