WO2022198486A1

WO2022198486A1 - Controller apparatus

Info

Publication number: WO2022198486A1
Application number: PCT/CN2021/082649
Authority: WO
Inventors: 洪永芳; 李国荣; 林继谦
Original assignee: 威刚科技股份有限公司
Priority date: 2021-03-24
Filing date: 2021-03-24
Publication date: 2022-09-29

Abstract

A controller apparatus (U), comprising a conductive module (1) and a power source distribution module (2), wherein the conductive module comprises a first circuit substrate (10), a plurality of first conductive posts (11), a plurality of second conductive posts (12) and a plurality of fixing posts (13); the plurality of first conductive posts and the plurality of second conductive posts are arranged on the first circuit substrate and are distributed at two sides of a first slot (101) in the first circuit substrate; the plurality of fixing posts are arranged on the first circuit substrate and are adjacent to the first slot; the height of the first conductive post is higher than the height of the second conductive post; the power source distribution module comprises a capacitor plate (20) and a plurality of first capacitor components (21), wherein the capacitor plate covers the first slot, and the plurality of first capacitor components are arranged on the capacitor plate; and the projection area of the first circuit substrate is greater than the projection area of the capacitor plate, and the first circuit substrate and the capacitor plate are bonded to each other by means of a surface mount process.

Description

Controller device

technical field

The present invention relates to a controller device, in particular to a controller device made by using surface adhesive technology.

Background technique

First of all, with the global issue of energy saving and carbon reduction, various countries have higher and higher requirements for the quality and performance of new energy vehicles. In order to meet the needs of different regulations and different customer groups, the specifications of various parts and components are also becoming more and more demanding. Come higher. Therefore, how to make highly integrated and modular drives to meet different specifications has become increasingly important.

In the prior art, the internal components of the driver of the electric vehicle, such as the aluminum substrate and the capacitor plate, are all independent modular components, which are electrically conductive and pressed together by two DC copper bars. The advantage of independent modular components is that material waste can be eliminated during the development phase. However, once in mass production, if there is no need to disassemble or replace the modular components, the manufacturing cost of the current technical means for fixing the capacitor plate and the aluminum substrate is relatively high.

Therefore, how to optimize the process steps of bonding the capacitor plate and the aluminum substrate to overcome the above-mentioned defects by improving the structure design has become one of the important issues to be solved in this field.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a controller device aiming at the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a controller device, which includes: a conductive module and a power distribution module. The conductive module includes a first circuit substrate, a plurality of first conductive columns, a plurality of second conductive columns and a plurality of fixing columns, the circuit substrate defines a first slot, a plurality of first conductive columns and a plurality of second conductive columns Disposed on the first circuit substrate and distributed on both sides of the first slot hole, a plurality of fixing columns are arranged on the first circuit substrate and adjacent to the first slot hole, wherein the height of any first conductive column is higher than that of any first conductive column. The height of the two conductive pillars. The power distribution module is arranged on the conductive module, the power distribution module includes a capacitor plate and a plurality of first capacitor components, the capacitor plate covers the first slot hole, and the multiple first capacitor components are arranged on the capacitor plate. The projected area of the first circuit substrate is larger than the projected area of the capacitor plate, and the first circuit substrate and the capacitor plate are joined by a surface adhesive process.

Preferably, the controller device includes a control module, the control module is arranged on the conductive module, the control module includes a second circuit substrate and an electronic component, the electronic component is arranged on the second circuit substrate, and the second circuit substrate is provided with corresponding multiple A plurality of through holes of the first conductive pillars and a second slot corresponding to a plurality of first capacitor elements; wherein the plurality of first conductive pillars respectively pass through the plurality of through holes, and the plurality of first capacitor elements pass through second slot.

Preferably, the electronic components include a power management chip, a microprocessor or a signal port.

Preferably, the second circuit substrate abuts against the fixing column and the plurality of second conductive columns, and the control module abuts against the second circuit substrate through the plurality of second conductive columns to electrically connect the conductive modules.

Preferably, the controller device includes a plurality of current sensing components, and the plurality of current sensing components are disposed on the control module and correspond to the plurality of first conductive pillars respectively.

Preferably, the capacitor plate includes two positive plates and two negative plates arranged in layers, and the two negative plates are arranged between the two positive plates.

Preferably, the capacitor plate is a glass fiber plate, the surface of each positive plate and the surface of each negative plate are respectively covered with a layer of copper foil, and the area of the copper foil laid on each negative plate is larger than the copper foil laid on each positive plate. foil area.

Preferably, the power distribution module further includes a plurality of second capacitance components, and the plurality of second capacitance components are arranged on the capacitance plate and are adjacent to the plurality of first capacitance components.

Preferably, the second capacitor component is a surface mount film capacitor.

Preferably, the conductive module further includes a plurality of power chips, and the plurality of power chips are arranged on the first circuit substrate and evenly distributed on both sides of each first conductive column.

Preferably, the constituent material of the first circuit substrate contains aluminum.

Preferably, the first capacitor component is a solid aluminum electrolytic capacitor.

One of the beneficial effects of the present invention is that in the controller device provided by the present invention, the projected area of the first circuit substrate is larger than the projected area of the capacitor plate and the first circuit substrate and the capacitor plate are formed by the surface adhesion process. In order to optimize the process steps and technical means of the bonding between the capacitor plate and the first circuit substrate, and thus reduce the manufacturing cost.

For further understanding of the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only for reference and description, not for limiting the present invention.

Description of drawings

FIG. 1 is a schematic perspective view of one viewing angle of the controller device of the present invention.

FIG. 2 is a schematic perspective view of another viewing angle of the controller device of the present invention.

FIG. 3 is a schematic exploded perspective view of the controller device of the present invention.

FIG. 4 is a perspective exploded schematic view of a power distribution module of the controller device of the present invention.

Detailed ways

The following are specific embodiments to illustrate the implementation of the “controller device” disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that, although the terms "first", "second", "third" and the like may be used herein to describe various elements, these elements should not be limited by these terms. These terms are primarily used to distinguish one element from another. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Example

First, referring to FIG. 1 to FIG. 3 , FIG. 1 and FIG. 2 are front and rear schematic views of the controller device of the present invention, respectively, and FIG. 3 is an exploded perspective view of the controller device of the present invention. An embodiment of the present invention provides a controller device U, which includes a conductive module 1 and a power distribution module 2 . The conductive module 1 includes a first circuit substrate 10 , a plurality of first conductive columns 11 , a plurality of second conductive columns 12 and a plurality of fixing columns 13 . As shown in FIG. 2 and FIG. 3 , the first circuit substrate 10 defines a first slot 101 . For example, the first circuit substrate 10 can be mounted with another housing base (not shown in the figure) through the first slot 101, that is, a dual-in-line package process (DIP) ). A plurality of first conductive pillars 11 and a plurality of second conductive pillars 12 are disposed on the first circuit substrate 10 and are distributed on both sides of the first slot 101 , and a plurality of fixing pillars 13 are disposed on the first circuit substrate 10 and adjacent to the first circuit substrate 10 . A slot 101 . The height of any one of the first conductive pillars 11 is higher than that of any of the second conductive pillars 12 . The power distribution module 2 is arranged on the conductive module 1 . The power distribution module 2 includes a capacitor plate 20 and a plurality of first capacitor components 21 , the capacitor plate 20 covers the first slot 101 , and the plurality of first capacitor components 21 are disposed on the capacitor plate 20 . For example, the constituent material of the first circuit substrate 10 includes aluminum (that is, the first circuit substrate 10 is an aluminum substrate), and the first capacitor element 21 is a solid aluminum electrolytic capacitor, and the number of the first capacitor element 21 is eight. The controller device U provided by the embodiment of the present invention can preferably be applied to the drive of the electric vehicle, but the present invention is not limited to this. In addition, the controller device U provided by the embodiment of the present invention can also be applied to a system that requires high heat dissipation efficiency.

Specifically, as shown in FIG. 3 , the present invention takes five first conductive pillars 11 and two second conductive pillars 12 as an example. The three first conductive pillars 11 are arranged on one side of the first slot 101 , and the other two first conductive pillars 11 and the two second conductive pillars 12 are arranged on the other side of the first slot 101 , And the two first conductive pillars 11 are disposed between the two second conductive pillars 12 .

It is worth mentioning that, in the present invention, the first circuit substrate 10 and the capacitor plate 20 are joined together by a surface-mount technology (SMT). Compared with the prior art, which requires the DC copper bars to be compressed, the bonding method of the first circuit substrate 10 and the capacitor plate 20 of the present invention can save the manufacturing cost of the copper bars, and can even reduce the overall volume of the controller device U. .

In addition, as shown in FIG. 3 , the first circuit substrate 10 can form a projected area S1 on a projected surface, and the capacitor plate 20 can form a projected area S2 on a projected surface, wherein the projected area S1 is larger than the projected area S2. That is, the size of the first circuit substrate 10 is larger than that of the capacitor plate 20 . Therefore, when the power distribution module 2 is disposed on the conductive module 1 , the capacitor plate 20 only covers a part of the first circuit substrate 10 . For example, the first circuit substrate 10 and the capacitor plate 20 can be further fixed on the first circuit substrate 10 by means of screwing (not shown) in addition to the surface adhesion process. , so that the tin material of the junction between the capacitor plate 20 and the first circuit substrate 10 (ie, the junction of the SMT process) will not be cracked due to the swing of the controller device U of the capacitor plate 20 .

Based on the above, as shown in FIG. 3 , the conductive module 1 may further include a plurality of power chips 14 . The plurality of power chips 14 are disposed on the first circuit substrate 10 and evenly distributed on both sides of each first conductive column 11 . For example, there are three power chips 14 on both sides of each of the first conductive pillars 11 respectively. The power chip 14 can be, for example, but not limited to, a MOS power field effect transistor (MOSFET Power Transistor), which is used to control the transmission to the motor through a plurality of first conductive pillars 11 (in this embodiment, three first conductive pillars 11 are used as an example) The plurality of first capacitor components 21 can be used for voltage regulation of the power supply and provision of instantaneous current, but the present invention is not limited to this.

The controller device U further includes a control module 3 , and the control module 3 is arranged on the conductive module 1 . The control module 3 includes a second circuit substrate 30 and an electronic component 31 , and the electronic component 31 is disposed on the second circuit substrate 30 . The second circuit substrate 30 may be, for example, but not limited to, a fiberglass board (FR4 board). The second circuit substrate 30 is provided with a plurality of through holes 301 corresponding to the plurality of first conductive pillars 11 and a second slot hole 302 corresponding to the plurality of first capacitor elements 21 . When the control module 3 is disposed on the conductive module 1 , the plurality of first conductive pillars 11 respectively pass through the plurality of through holes 301 , and the plurality of first capacitor elements 21 pass through the second slot holes 302 , so that the second circuit substrate 30 contacts the It rests on the fixed post 13 and the plurality of second conductive posts 12 . The fixing pillars 13 are mainly used to support the control module 3 , so that the control module 3 abuts against the second circuit substrate 30 through the plurality of second conductive pillars 12 to electrically connect the conductive module 1 . For example, the number of the second conductive pillars 12 can be two (respectively used as positive and negative electrodes during conduction), and the control module 3 conducts electricity to the conductive module 1 through the contact of the second conductive pillars 12 with the second circuit substrate 30 . .

For example, the electronic component 31 includes a power management chip 311 , a microprocessor (MCU) 312 or a signal port 313 . However, it should be noted that although the above content takes the electronic component 31 including the power management chip 311, the microprocessor (MCU) 312 or the signal port 313 as an example, in other embodiments, the electronic component 31 may also include other electronic components. Components.

Continuing to refer to FIG. 1 and FIG. 3 , the controller device U further includes a plurality of current sensing components 4 . A plurality of current sensing components 4 are disposed on the control module 3 and coupled to the second circuit substrate 30 . The plurality of current sensing components 4 correspond to the plurality of first conductive pillars 11 respectively. For example, the current sensing element 4 can be, for example, but not limited to, a Hall Current Sensor, which is mainly a sensor for measuring alternating current. Preferably, as shown in FIG. 1 , when the plurality of first conductive pillars 11 respectively pass through the plurality of through holes 301 , each current sensing element 4 (CT current sensor) is disposed around each first conductive pillar 11 , so as to The current value passing through each of the first conductive pillars 11 is detected respectively. However, it should be noted that the present invention is not limited by whether the current sensing components 4 are provided or not, and also is not limited by the form and quantity of the current sensing components 4 .

Referring to FIG. 4 , FIG. 4 is a schematic exploded perspective view of the power distribution module of the controller device of the present invention. The power distribution module 2 further includes a plurality of second capacitance components 22 , and the plurality of second capacitance components 22 are disposed on the capacitance plate 20 and are adjacent to the plurality of first capacitance components 21 . For example, the second capacitor element 22 is a surface mount film capacitor. Capacitive plate 20 may be, for example, but not limited to, a fiberglass plate (FR4 plate). The capacitor plate 20 includes two

positive plates

201 , 204 and two

negative plates

202 , 203 arranged in layers, and the two

negative plates

202 , 203 are arranged between the two

positive plates

201 , 204 . In other words, the capacitor plate 20 includes four inner-layer plates, which are arranged in the order of positive plate 201 , negative plate 202 , negative plate 203 , and positive plate 204 respectively from top to bottom. The surface of each positive plate 201 and the surface of each negative plate 202 are respectively covered with a layer of copper foil C, and the area of the copper foil C laid on each negative plate 202 is larger than that of the copper foil C laid on each positive plate 201. area.

Further as shown in FIG. 4 , copper foils C are respectively laid on the two disconnected areas on the surface of the first layer of positive plates 201 , and copper foils C are respectively laid on the two disconnected areas on the surface of the fourth layer of positive plates 204 , and A large-area copper foil C is laid on the surfaces of the second-layer positive electrode plate 202 and the third-layer positive electrode plate 202 respectively. When the four inner-layer plates are stacked, the two copper foils C laid on the surfaces of the first-layer positive plate 201 and the fourth-layer positive plate 204 will be connected with the second-layer positive plate 202 and the third-layer positive plate 202 . The copper foils C laid on the surface are in contact to form a heat conduction path.

Therefore, the heat energy generated by the power chip 14 is conducted to the heat dissipation structure of the housing base through the first circuit substrate 10 (aluminum substrate), thereby greatly improving the heat dissipation efficiency of the power chip 14 . The heat generated by the first capacitor element 21 and the second capacitor element 22 can be conducted to the heat dissipation structure of the housing base through the copper foil in the inner layer of the capacitor plate 20 . In general, the controller device U of the present invention uses the power distribution module 2 (capacitor plate 20 , the first capacitor element 21 and the second capacitor element 22 ) to replace the physical copper bars of the prior art for power distribution. Furthermore, the present invention lays large-area copper foils on the inner positive and negative electrode plates of the capacitor plate 20 , and cooperates with the SMT process to join the capacitor plate 20 and the first circuit substrate 10 to enhance the heat dissipation effect of the capacitor plate 20 . In addition, in the power distribution module 2, the area of the copper foil C laid on the

negative plates

202, 203 of the capacitor plate 20 is larger (compared with the area of the copper foil C laid on the positive plates 201, 204), which is beneficial to avoid Electromagnetic interference (Electromagnetic Interference, EMI) generation.

Beneficial Effects of Embodiments

One of the beneficial effects of the present invention is that the controller device provided by the present invention can pass through “the projected area S1 of the first circuit substrate 10 is greater than the projected area S2 of the capacitor plate 20” and “the first circuit substrate 10 and the capacitor plate” 20 through a surface-adhesive process” technical solution, so as to optimize the process steps and technical means of the bonding between the capacitor plate 20 and the first circuit substrate 10, thereby reducing the manufacturing cost.

Furthermore, the controller device U of the present invention utilizes the power distribution module 2 (capacitor plate 20 , the first capacitor element 21 and the second capacitor element 22 ) to replace the physical copper bars of the prior art for power distribution. Further, in the present invention, large-area copper foils C are laid on the positive and negative electrode plates ( 201 - 204 ) in the inner layer of the capacitor plate 20 , and the capacitor plate 20 is joined with the first circuit substrate 10 in conjunction with the SMT process to strengthen the capacitor. The heat dissipation effect of the board 20. In addition, in the power distribution module 2, the area of the copper foil C on which the

negative plates

202 and 203 of the capacitor plate 20 are laid is larger, which is beneficial to avoid the generation of electromagnetic interference.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the protection scope of the claims of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and the accompanying drawings of the present invention are included in the present invention. within the protection scope of the claims of the invention.

Claims

A controller device, characterized in that the controller device comprises:

A conductive module includes a first circuit substrate, a plurality of first conductive columns, a plurality of second conductive columns and a plurality of fixing columns, the first circuit substrate defines a first slot, the plurality of first conductive columns and A plurality of second conductive pillars are arranged on the first circuit substrate and distributed on both sides of the first slot hole, and a plurality of the fixing pillars are arranged on the first circuit substrate and adjacent to the first slot a hole, the height of any of the first conductive pillars is higher than the height of any of the second conductive pillars; and

A power distribution module, disposed on the conductive module, the power distribution module includes a capacitor plate and a plurality of first capacitor components, the capacitor plate covers the first slot, and a plurality of the first capacitors components are arranged on the capacitor plate;

Wherein, the projected area of the first circuit substrate is larger than the projected area of the capacitor plate, and the first circuit substrate and the capacitor plate are joined by a surface adhesion process.
The controller device according to claim 1, wherein the controller device further comprises: a control module, the control module is arranged on the conductive module, the control module comprises a second circuit substrate and An electronic component, the electronic component is disposed on the second circuit substrate, and the second circuit substrate is provided with a plurality of through holes corresponding to a plurality of the first conductive pillars and a plurality of the first capacitor components a second slot hole; wherein, a plurality of the first conductive pillars respectively pass through the plurality of through holes, and a plurality of the first capacitor components pass through the second slot hole.
The controller device according to claim 2, wherein the electronic component comprises a power management chip, a microprocessor or a signal port.
The controller device according to claim 2, wherein the second circuit substrate abuts against the fixing column and a plurality of the second conductive columns, and the control module passes through the plurality of the second conductive columns The post abuts against the second circuit substrate to electrically connect the conductive module.
The controller device according to claim 2, characterized in that, the controller device further comprises: a plurality of current sensing assemblies, a plurality of the current sensing assemblies are disposed on the control module and correspond to a plurality of current sensing assemblies respectively the first conductive column.
The controller device according to claim 1, wherein the capacitor plate comprises two positive plates and two negative plates arranged in layers, and the two negative plates are arranged between the two positive plates.
The controller device according to claim 6, wherein the capacitor plate is a glass fiber plate, the surface of each positive plate and the surface of each negative plate are respectively covered with a layer of copper foil, and each The area of copper foil laid on one of the negative electrode plates is larger than the area of copper foil laid on each of the positive electrode plates.
The controller device according to claim 6, wherein the power distribution module further comprises a plurality of second capacitance components, and a plurality of the second capacitance components are arranged on the capacitance plate and are adjacent to each other. a plurality of the first capacitor components.
The controller device according to claim 8, wherein the second capacitor component is a surface mount film capacitor.
The controller device according to claim 1, wherein the conductive module further comprises a plurality of power chips, and the plurality of the power chips are disposed on the first circuit substrate and are evenly distributed in each of the power chips. on both sides of the first conductive column.
The controller device according to claim 1, wherein a constituent material of the first circuit substrate comprises aluminum.
The controller device according to claim 1, wherein the first capacitor component is a solid aluminum electrolytic capacitor.