WO2022193707A1 - 触控显示装置和显示系统 - Google Patents

触控显示装置和显示系统 Download PDF

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Publication number
WO2022193707A1
WO2022193707A1 PCT/CN2021/131697 CN2021131697W WO2022193707A1 WO 2022193707 A1 WO2022193707 A1 WO 2022193707A1 CN 2021131697 W CN2021131697 W CN 2021131697W WO 2022193707 A1 WO2022193707 A1 WO 2022193707A1
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WO
WIPO (PCT)
Prior art keywords
touch
binding
display
area
pin
Prior art date
Application number
PCT/CN2021/131697
Other languages
English (en)
French (fr)
Inventor
李泽文
牛文骁
梁恒镇
陆旭
刘练彬
王志强
李仁东
王予
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Publication of WO2022193707A1 publication Critical patent/WO2022193707A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a touch display device and a display system including the touch display device.
  • the touch panel has been changed from an external type to an on-cell structure.
  • the touch control structure is integrated on the encapsulation layer (TFE) of the display substrate, reducing an OCA (Optically Clear Adhesive) optical adhesive layer and a COP (Cyclo Olefin Polymer, a cyclic olefin polymer) optical material layer.
  • OCA Optically Clear Adhesive
  • COP Cyclo Olefin Polymer, a cyclic olefin polymer
  • multi-layer flexible circuit boards in turn lead to increased thickness, increased cost, less bending, as well as signal attenuation and new interference problems.
  • the purpose of the present disclosure is to overcome the above-mentioned shortcomings of the prior art that are prone to signal interference, and to provide a touch display device that is not prone to signal interference and a display system including the touch display device.
  • a touch display device comprising:
  • the touch display substrate has a display area and a non-display area arranged adjacent to the display area, and a display binding area and a touch binding area are arranged in the non-display area;
  • a flexible circuit board on which a touch signal line, a touch chip and a display signal line are arranged, the touch signal line is connected with the touch chip, and the flexible circuit board and the touch display substrate are in the
  • the display binding area is bound to the touch binding area, the touch chip is connected to the touch binding area through the touch signal line, and the display signal line is connected to the display binding area ;
  • the touch chip, the touch signal line and the touch binding area are arranged on the same side of the display signal line.
  • the flexible circuit board is configured as a two-layer board, and the two-layer board includes at least a first functional layer, a second functional layer, and a The base layer between the second functional layers, the display signal lines are arranged on the first functional layer, and the touch signal lines are arranged on the second functional layer.
  • the touch display substrate in the touch binding area, includes a plurality of touch binding pins, and at least two of the touch binding pins are in the first Arranged in two directions to form a group, a plurality of groups of the touch binding pins are arranged along a first direction, and the first direction intersects with the second direction.
  • the touch binding pins include a first touch driving binding pin, a second touch driving binding pin, and a first touch sensing binding pin , the first touch drive binding pin, the second touch drive binding pin and the first touch sensing binding pin are arranged at intervals, and the first touch drive binding pin is located in the between the second touch drive binding pin and the first touch sensing binding pin; or the touch binding pin includes the first touch driving binding pin and the first touch sensing binding pin The first touch driving binding pin and the first touch sensing binding pin are arranged at intervals.
  • the touch display substrate in the touch binding area, further includes a plurality of ground binding pins and a plurality of protection binding pins, at least two of the The touch binding pins are arranged in the second direction to form a group whose length is less than or equal to the length of the ground binding pins or the protection binding pins in the second direction.
  • the touch display substrate in the display area, includes:
  • each of the pixel units includes at least three sub-pixels, each of the sub-pixels includes a thin film transistor, and the thin film transistor includes a gate electrode, a gate insulating layer, an active layer, a source electrode and a drain electrode ;
  • the touch control structure is arranged on one side of the pixel unit, and the touch control structure includes a plurality of first touch control units and a plurality of second touch control units.
  • the first touch unit is a touch driving unit
  • the second touch unit is a touch sensing unit
  • one end of the first touch unit passes through the first touch
  • the touch driving leads are connected to the first touch driving binding pins
  • the second touch unit is connected to the first touch sensing binding pins through the touch sensing leads.
  • the opposite end of the first touch unit is connected to the second touch drive binding pin through a second touch drive lead.
  • the second touch driving lead and the source electrode and the drain electrode are provided in the same layer and the same material.
  • a bending area and a lead area are further provided in the non-display area, and the bending area is located between the display binding area and the touch binding area and the lead Between the regions, in the lead region, the first touch driving lead and the second touch metal layer of the touch structure are arranged in the same layer and the same material.
  • the touch sensing lead and the first touch metal layer of the touch structure are provided in the same layer and the same material.
  • the touch sensing lead and the first touch driving lead are provided in the same layer and material as the source electrode and the drain electrode.
  • a third touch driving binding pin, a fourth touch driving binding pin and a second touch sensing binding pin are provided on the flexible circuit board ;
  • the third touch drive binding pin is bound or orthographically overlapped with the first touch drive binding pin, and the fourth touch drive binding pin and the second touch
  • the drive binding pin is bound or orthographically overlapped, and the second touch-sensing binding pin is bound or orthographically overlapped with the first touch-sensing binding pin.
  • a display system including the touch display device according to any one of the above.
  • the touch chip, the touch signal line and the touch binding area are arranged on the same side of the display signal line, and the touch chip is directly connected to the touch binding through the touch signal line In the area, the touch signal line and the display signal line will not cross, so there will be no signal interference between the touch signal line and the display signal line, and there is no need to use a multi-layer flexible circuit board to avoid signal interference. There will be no problems of increased thickness, increased cost, and difficulty in bending, which are caused by the use of multi-layer flexible circuit boards, and will not cause signal attenuation and new interference problems.
  • FIG. 1 is a schematic structural diagram of a touch display device with an external touch panel.
  • FIG. 2 is a schematic structural diagram of a touch panel that is a cover-surface type touch display device.
  • FIG. 3 is a schematic top-view structure diagram of the touch display device of the cover-surface type when unfolded.
  • FIG. 4 is a schematic top view of a touch display substrate.
  • FIG. 5 is a schematic structural diagram of an exemplary embodiment of the disclosed touch display device.
  • FIG. 6 is a schematic diagram of a layered structure of a touch control structure.
  • FIG. 7 is a schematic structural diagram of an exemplary embodiment of a touch control structure in a touch display device of the present disclosure.
  • FIG. 8 is a schematic structural diagram of another exemplary embodiment of a touch control structure in a touch display device of the present disclosure.
  • FIG. 9 is a schematic cross-sectional view of the flexible circuit board in the touch display device of the present disclosure.
  • FIG. 10 is a schematic structural diagram of touch binding pins on the touch display substrate in the touch display device of the present disclosure.
  • FIG. 11 is a schematic structural diagram of a touch binding pin on a flexible circuit board in a touch display device of the present disclosure.
  • FIG. 12 is a schematic cross-sectional view taken along line A-A in FIG. 5 .
  • FIG. 13 is a schematic cross-sectional view taken along line B-B in FIG. 5 .
  • Substrate substrate 1.
  • Heat dissipation film 2.
  • Encapsulation layer 6. First optical adhesive layer; 7. COP optical material layer;
  • the first touch unit 811, the first touch electrode; 812, the first touch drive lead; 813, the second touch drive lead; 814, the first touch drive binding pin; 815, the second Touch driver binding pin;
  • the second touch unit 821, the second touch electrode; 822, the touch sensing lead; 823, the first touch sensing binding pin;
  • the first connection part 83, the first insulating layer; 84, the second insulating layer; 85, the buffer layer; 86, the ground binding pin; 87, the protection binding pin; 88, the first connection part;
  • Polarizer 10. Second optical adhesive layer; 11. Cover plate;
  • shielding layer 182, protective layer; 183, base layer; 184, first functional layer; 185, second functional layer.
  • AA display area
  • FA non-display area
  • BOD1 display binding area
  • BOD2 touch binding area
  • GR interference area
  • C1 first side area
  • C2, second side area C3, third side area
  • C4 fourth side area
  • R resistance
  • C capacitance
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments can be embodied in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.
  • the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.
  • parallel refers to a state where the angle formed by two straight lines is -10° or more and 10° or less, and therefore includes a state where the angle is -5° or more and 5° or less.
  • perpendicular refers to a state in which the angle formed by two straight lines is 80° or more and 100° or less, and therefore also includes a state in which an angle of 85° or more and 95° or less is included.
  • the touch display device may include a base substrate 1, a heat dissipation film 2 disposed on one side of the base substrate 1, and disposed on the heat dissipation film
  • the first substrate 31 on the side far from the base substrate 1 of encapsulation layer 5.
  • the first optical adhesive layer 6 disposed on the side of the encapsulation layer 5 away from the base substrate 1, and the COP (Cyclo Olefin Polymer) disposed on the side of the first optical adhesive layer 6 away from the base substrate 1 is a cycloolefin polymer.
  • optical material layer 7 disposed on the touch structure 8 on the side of the COP optical material layer 7 away from the base substrate 1, disposed on the polarizer 9 on the side of the touch structure 8 away from the base substrate 1, disposed on the polarizer 8
  • the second optical adhesive layer 10 on the side of the sheet 9 away from the base substrate 1 is disposed on the cover plate 11 on the side away from the base substrate 1 of the second optical adhesive layer 10 .
  • a second substrate 32 is provided on the other side of the base substrate 1 opposite to the heat dissipation film 2 , and the display structure 4 is bent to the side of the second substrate 32 away from the base substrate 1 and bound to the flexible circuit board 121 , the flexible circuit board 121 is disposed on the side of the display structure 4 away from the base substrate 1 .
  • a protective adhesive layer 15 is provided on the outer side of the bending where the display structure 4 is bent.
  • One end of the touch flexible circuit board 122 is bound to the touch control structure 8 .
  • the opposite end of the touch flexible circuit board 122 is bound to the flexible circuit board 121 , and is located away from the base substrate 1 of the flexible circuit board 121 . side.
  • the touch panel is a schematic structural diagram of a surface-covered touch display device.
  • the touch display device may include a base substrate 1 , a heat dissipation film 2 disposed on one side of the base substrate 1 , and disposed on a heat dissipation surface.
  • the first substrate 31 of the film 2 on the side away from the base substrate 1 is arranged on the display structure 4 on the side away from the base substrate 1 of the first substrate 31, and is arranged on the side of the display structure 4 away from the base substrate 1 the encapsulation layer 5.
  • the touch control structure 8 is disposed on the side of the encapsulation layer 5 away from the base substrate 1
  • the polarizer 9 is disposed on the side of the touch control structure 8 away from the base substrate 1
  • the polarizer 9 is disposed on the side of the polarizer 9 away from the base substrate 1
  • the second optical adhesive layer 10 on the side of the second optical adhesive layer 10 is disposed on the cover plate 11 on the side away from the base substrate 1 of the second optical adhesive layer 10 .
  • a second substrate 32 is provided on the other side of the base substrate 1 opposite to the heat dissipation film 2 , and the display structure 4 is bent to the side of the second substrate 32 away from the base substrate 1 and bound to the flexible circuit board 121 , the flexible circuit board 121 is disposed on the side of the display structure 4 away from the base substrate 1 .
  • a protective adhesive layer 15 is provided on the outer side of the bending where the display structure 4 is bent.
  • the touch control structure 8 is connected to the display structure 4 , and the signal of the touch control structure 8 is connected to the flexible circuit board 121 through the display structure 4 .
  • the surface-covered touch display device omits the first optical adhesive layer 6 and the COP optical material layer 7 compared to the external touch display device, thus reducing the thickness and thickness of the touch display device. cost.
  • the touch flexible circuit board 122 is omitted, and the components on the original touch flexible circuit board 122 need to be arranged on the flexible circuit board 121. Due to the increase in the number of components, the flexible circuit board 121 is not limited by the space of the whole machine. In addition, in order to avoid the interference problem of display signals and touch signals, a multi-layer flexible circuit board 121 needs to be used.
  • the touch chip 13 also needs to be disposed on the flexible circuit board 121, and the touch chip 13 needs to be bound with the touch structure; a display signal line 1211 is disposed on the flexible circuit board 121, and the display signal line 1211 starts from the BTB connector 16. Extend all the way up to the display binding pins.
  • the touch binding pins bound with the touch chip 13 are arranged on both sides of the display binding pins bound with the display signal lines 1211 . Therefore, the display signal lines 1211 and the touch signal lines 131 will intersect, so that the There is a risk of interference between the GR display signal and the touch signal at the interference point.
  • the flexible circuit board 121 can use a multi-layer board to avoid the interference between the display signal and the touch signal, that is, by distributing the touch signal line 131 and the display signal line 1211 on different layers, and adding an entire ground layer in the middle, it can be avoided.
  • the purpose of signal interference In theory, the thicker/more ground layer, the better the shielding effect.
  • the most commonly used multilayer flexible circuit boards 121 are six layers, four layers, and three layers.
  • the multilayer flexible circuit boards 121 mainly have two problems: the first problem is that the thickness increases exponentially, the cost increases, and it is not easy to fold.
  • the device area is located on the first layer, the components are connected to the display and touch signal interfaces through binding pins, and the binding pins are set on the third layer,
  • the binding pins of the third layer are connected to the device area of the first layer, and long-distance vias need to be used to connect and conduct.
  • the length of the signal channel increases, resulting in an increase in channel impedance and serious signal attenuation; Vias lead to an increase in parasitic capacitance (noise), which further increases signal attenuation and affects display and touch performance; on the other hand, via fabrication related defects (disconnection, short circuit, etc.) will also increase.
  • FIG. 5 is a schematic structural diagram of the touch display device of the present disclosure.
  • the arrows in the figure show the direction of the touch binding leads.
  • the touch display device may include: The touch display substrate and the flexible circuit board 121; the touch display substrate has a display area AA and a non-display area FA arranged adjacent to the display area AA, and a display binding area BOD1 and a touch panel are arranged in the non-display area FA.
  • the control binding area BOD2; the flexible circuit board 121 is provided with a touch signal line 131, a touch chip 13 and a display signal line 1211, the touch signal line 131 is connected with the touch chip 13, and the flexible circuit board 121 is bound to the touch display substrate in the display binding area BOD1 and the touch binding area BOD2, and the touch chip 13 is connected to the touch binding through the touch signal line 131 area BOD2, the display signal line 1211 is connected to the display binding area BOD1; wherein the touch chip 13, the touch signal line 131 and the touch binding area BOD2 are set in the display signal Same side of line 1211.
  • the touch chip 13 , the touch signal line 131 and the touch binding area BOD2 are arranged on the same side of the display signal line 1211 , and the touch chip 13 is directly connected to the touch screen through the touch signal line 131 .
  • the touch signal line 131 and the display signal line 1211 will not cross, therefore, there will be no signal interference between the touch signal line 131 and the display signal line 1211, and there is no need to use multiple devices to avoid signal interference. Therefore, the problems of increased thickness, increased cost, and difficulty in bending, which are caused when the multilayer flexible circuit board 121 is used, will not occur, nor will signal attenuation and new interference problems occur.
  • the touch display substrate may include a base substrate 1, and the base substrate 1 may be a rigid substrate, such as a glass substrate, a plastic substrate, etc., or a flexible substrate, such as a polyimide substrate.
  • the touch display substrate has a display area AA and a non-display area FA adjacent to the display area AA, and the display area AA may be rectangular, circular, or the like.
  • the non-display area FA a lead area, a bending area, a display binding area BOD1 and a touch binding area BOD2 are set.
  • the bending area is located between the lead area, the display binding area BOD1 and the touch binding area BOD2.
  • the control display substrate can be bent to form an arc in the bending area.
  • the lead area may surround the display area AA.
  • the lead area may include a first side area layer C1, a second side area C2, a third side area C3 and a fourth side area C4, wherein the first side area layer C1, the second side area C2, the third side area C3 and the fourth side area C4
  • the side area layer C1 is disposed between the display area AA, the display binding area BOD1 and the touch binding area BOD2, and the second side area C2, the third side area C3 and the fourth side area C4 are arranged counterclockwise in turn.
  • a touch control structure 8 and a display structure 4 are disposed, the display structure 4 is a plurality of pixel units arranged in an array, and the touch control structure 8 is disposed on the display structure 4 away from the base substrate 1 side.
  • Each pixel unit may include at least three sub-pixels, wherein each sub-pixel may include a thin film transistor, and the thin film transistor may include a gate electrode, a gate insulating layer 42 , an active layer, a source electrode and a drain electrode, and the gate electrode is connected by a gate line 41
  • the source or drain is connected to the display binding area BOD1 through the data line 43 .
  • the touch control structure 8 may include a buffer layer 85 disposed on the encapsulation layer 5 , and a first touch control layer disposed on the side of the buffer layer 85 away from the encapsulation layer 5 .
  • the metal layer 8a is provided on the first insulating layer 83 on the side of the first touch metal layer 8a away from the encapsulation layer 5, and the second touch metal layer 8b on the side of the first insulating layer 83 away from the encapsulation layer 5,
  • the second insulating layer 84 is disposed on the side of the second touch metal layer 8b away from the encapsulation layer 5 .
  • the touch structure 8 may be a mutual capacitance structure.
  • the touch control structure 8 may include a plurality of first touch control units 81 and a plurality of second touch control units 82 .
  • the second touch units 82 have a line shape extending along the first direction X, and the plurality of second touch units 82 are arranged in sequence along the second direction Y.
  • the first touch unit 81 has a line shape extending along the second direction Y, and the plurality of first touch units 81 are arranged in sequence along the first direction X, and the first direction X and the second direction Y intersect.
  • Each first touch unit 81 may include a plurality of first touch electrodes 811 and a first connection portion 88 arranged in sequence along the second direction Y, the plurality of first touch electrodes 811 are arranged at intervals, and adjacent first touch electrodes 811 The gate electrodes 811 are connected to each other through the first connection portion 88 .
  • Each second touch unit 82 may include a plurality of second touch electrodes 821 and a second connection portion arranged in sequence along the first direction X, the plurality of second touch electrodes 821 are arranged at intervals, and adjacent second touch electrodes 821 are arranged at intervals. The electrodes 821 are connected to each other through the second connection portion.
  • the first touch electrodes 811 and the second touch electrodes 821 are alternately arranged in the third direction Z to form a capacitance. By detecting the change in this capacitance, the location of the touch point can be determined.
  • the third direction Z intersects the first direction X and the second direction Y, preferably, the third direction Z is perpendicular to the plane formed by the first direction X and the second direction Y.
  • the first touch electrodes 811 , the second touch electrodes 821 and the second connection parts are provided in the same layer and can be formed by a single patterning process.
  • the second touch electrodes 821 and the second connection parts are In the integrated structure, the first connecting portion 88 may be disposed on the bridge layer to form a bridge structure, and an insulating layer is disposed between the first connecting portion 88 and the second connecting portion.
  • the first touch electrodes 811 , the first connection parts 88 and the second touch electrodes 821 are disposed in the same layer, and can be formed through a single patterning process.
  • the first touch electrodes 811 and the first connection The part 88 is an integral structure, the second connecting part can be disposed on the bridge layer to form a bridge structure, and an insulating layer is disposed between the first connecting part 88 and the second connecting part.
  • the first touch electrodes 811 may be driving electrodes, and the second touch electrodes 821 may be sensing electrodes.
  • the first touch electrodes 811 may be sensing electrodes, and the second touch electrodes 821 may be driving electrodes.
  • a plurality of first touch units 81 and a plurality of second touch units 82 constitute M rows of drive electrodes*N columns of sense electrodes, that is, M first touch units 81 and N second touch units 82, M and N columns of sensing electrodes.
  • N is a positive integer greater than two.
  • the first touch electrodes 811 and the second touch electrodes 821 may have a rhombus shape, for example, a regular rhombus, a horizontal rhombus, or a vertically elongated rhombus.
  • the first touch electrodes 811 and the second touch electrodes 821 may have any one or more of triangles, squares, trapezoids, parallelograms, pentagons, hexagons and other polygons , the present disclosure is not limited herein.
  • the first touch electrodes 811 and the second touch electrodes 821 may be in the form of transparent conductive electrodes.
  • the first touch electrodes 811 and the second touch electrodes 821 may be in the form of metal meshes, the metal meshes are formed by interweaving a plurality of metal wires, the metal meshes include a plurality of mesh patterns, and the meshes A pattern is a polygon made up of multiple metal lines.
  • the first touch electrodes 811 and the second touch electrodes 821 in the metal mesh format have the advantages of small resistance, small thickness and fast response speed.
  • the touch control structure 8 may include a plurality of first touch driving leads 812 , a plurality of second touch The driving lead 813 and a plurality of touch sensing leads 822 (for the sake of clarity, different leads in the figure are distinguished by different line types).
  • a plurality of touch binding pins are arranged in the touch binding area BOD2.
  • the touch binding pins include a first touch sensing binding pin 823 , a first touch driving binding pin 814 and a second touch driving binding pin 815 .
  • the first end of the first touch driving lead 812 is correspondingly connected to the first touch unit 81 , and the second end of the first touch driving lead 812 is led out to the first touch driving binding pin 814 through the edge area.
  • the second touch driving lead 813 is correspondingly connected to the opposite end of the first touch unit 81 , and the second end of the second touch driving lead 813 is led out to the second touch driving binding pin 815 .
  • the first end of the touch sensing lead 822 is correspondingly connected to one end of the second touch unit 82 , and the second end of the touch sensing lead 822 is led out to the first touch sensing binding pin 823 .
  • the first end of the first touch drive wire 812 is connected to one end of the first touch unit 81 adjacent to the binding area, and the second end of the first touch drive wire 812 is directly led out to the first touch control unit 81 .
  • Touch drive binding pin 814 The first end of the second touch drive wire 813 is connected to the end of the first touch unit 81 away from the binding area, and the second touch drive wire 813 passes through the third side area C3 , the second side area C2 and the first side area
  • the layer C1 is led out to the second touch drive binding pin 815 .
  • the first end of the touch sensing lead 822 is connected to one end of the second touch unit 82 , and the touch sensing lead 822 is led out to the first touch sensing binding pin 823 through the fourth side area C4 and the first side area layer C1 .
  • the touch structure 8 includes N touch sensing leads 822 , M first touch driving leads 812 and M second touch driving leads 813 .
  • the touch detection signal is input to the second touch electrodes 821 in each row through the N touch sensing leads 822 , so as to detect the second touch electrodes 821 in each row.
  • the touch detection signals are input to the first touch electrodes 811 in each column through the M first touch driving leads 812 and the M second touch driving leads 813 , so as to jointly detect the first touch electrodes 811 in each column.
  • this connection method may be called 2T1R.
  • the exemplary embodiments of the present disclosure are not limited to the above description, for example, only one end of the two ends of the first touch units 81 in each column may be drawn out.
  • the first touch sensing binding pin 823 , the first touch driving binding pin 814 and the second touch driving binding pin 815 are all located on the same side of the display driver chip 14 , for example, as shown in FIG. 7 ,
  • the touch binding area BOD2 may be located on the left side of the display driving chip 14 ; as shown in FIG. 8 , the touch binding area BOD2 may also be located on the right side of the display driving chip 14 .
  • the flexible circuit board 121 may be configured as a two-layer board, that is, the flexible circuit board 121 includes a base layer 183 and is disposed on opposite sides of the base layer 183
  • the first functional layer 184 and the second functional layer 185 are provided with a protective layer 182 on the side of the first functional layer 184 and the second functional layer 185 away from the base layer 183.
  • a shielding layer 181 is provided on both sides.
  • Components such as the touch chip 13, the resistor R, and the capacitor C are located on the uppermost layer of the flexible circuit board 121.
  • the touch chip 13 is connected to the first functional layer 184 through underfill (underfill), and the underfill is mainly through "non-contact spraying" Dispensing glue, the resistor R and the capacitor C are connected to the first functional layer 184 through UV (ultraviolet light curing) glue.
  • the first functional layer 184 is connected to the second functional layer 185 through via holes, and the touch signal lines 131 are disposed on the second functional layer 185 .
  • the display signal line 1211 is provided on the first functional layer 184 .
  • the thickness of the flexible circuit board 121 is about 0.12 mm, which is much thinner than the thickness of the six-layer board in the prior art, which is about 0.36 mm, and the thickness of the four-layer board, which is about 0.24 mm.
  • the height of the touch chip 13 is about 0.427mm to 0.777mm, and the touch chip 13 is disposed in the groove on the flexible circuit board 121 , so the overall maximum thickness of the flexible circuit board 121 does not exceed 0.9mm.
  • the flexible circuit board 121 is provided with a second touch sensing binding pin 173 , a third touch driving binding pin 171 and a fourth touch driving binding pin 172 .
  • the drive binding pin 171 is bound to the first touch drive binding pin 814
  • the fourth touch drive binding pin 172 is bound to the second touch drive binding pin 815
  • the second touch drive binding pin 815 is bound.
  • the sensing binding pin 173 is bound to the first touch sensing binding pin 823 .
  • the second touch sensing binding pin 173 , the third touch driving binding pin 171 and the fourth touch driving binding pin 172 are connected to the touch chip 13 through the touch signal line 131 .
  • the touch chip 13 , the touch signal line 131 , the second touch sensing binding pin 173 , the third touch driving binding pin 171 and the fourth touch driving binding pin 172 are arranged on the display signal line 1211 .
  • the touch signal lines 131 connecting the touch chip 13 and the second touch sensing binding pins 173 , the third touch driving binding pins 171 and the fourth touch driving binding pins 172 do not need to be It is arranged to cross the display signal line 1211. Therefore, there will be no signal interference between the touch signal line 131 and the display signal line 1211, and there is no need to use a multi-layer board to avoid the signal between the touch signal line 131 and the display signal line 1211. interference.
  • two first touch drive binding pins 814 are arranged in the second direction Y to form a group, that is, the length of the first touch drive binding pins 814 is reduced so that the current
  • one first touch drive binding pin 814 can be set within the area of two first touch drive binding pins 814, and multiple groups of first touch drive binding pins 814 are located along the first direction X.
  • the first direction X and the second direction Y intersect, preferably, the first direction X and the second direction Y are perpendicular.
  • three or more first touch drive binding pins 814 may also be arranged in the second direction Y to form a group.
  • the third touch drive binding pin 171 disposed on the flexible circuit board 121 is also set to a structure adapted to the first touch drive binding pin 814 , that is, the third touch drive binding pin 814 is reduced.
  • the area of the pin 171 is determined, at least two third touch driving binding pins 171 are arranged in the second direction Y to form a group, and multiple groups of the third touch driving binding pins 171 are arranged along the first direction X.
  • the two second touch drive binding pins 815 are arranged in the second direction Y to form a group, that is, the length of the second touch drive binding pins 815 is reduced so that in the prior art, one second touch drive is provided.
  • Two second touch drive binding pins 815 can be set within the area of the control drive binding pins 815 , and a plurality of groups of second touch drive binding pins 815 are arranged along the first direction X, and the first direction X and the second touch drive binding pins 815
  • the directions Y intersect, preferably, the first direction X is perpendicular to the second direction Y.
  • three or more second touch drive binding pins 815 may also be arranged in the second direction Y to form a group.
  • the fourth touch drive binding pin 172 disposed on the flexible circuit board 121 is also set to a structure adapted to the second touch drive binding pin 815 , that is, the fourth touch drive binding pin 815 is reduced.
  • the area of the pin 172 is determined, at least two fourth touch driving binding pins 172 are arranged in the second direction Y to form a group, and a plurality of groups of third touch driving binding pins 171 are arranged along the first direction X.
  • the two first touch sensing binding pins 823 are arranged in the second direction Y to form a group, that is, the length of the first touch sensing binding pins 823 is reduced so that a first touch sensing binding pin 823 is set in the prior art.
  • Two first touch sensing binding pins 823 can be set within the area of one touch sensing binding pin 823 , and a plurality of groups of first touch sensing binding pins 823 are arranged along the first direction X, and the first direction X and the The second direction Y intersects, preferably, the first direction X is perpendicular to the second direction Y.
  • three or more first touch sensing binding pins 823 may also be arranged in the second direction Y to form a group.
  • the second touch-sensing binding pin 173 disposed on the flexible circuit board 121 is also set to a structure adapted to the first touch-sensing binding pin 823 , that is, the second touch-sensing binding pin 823 is reduced.
  • the area of the pin 173 is determined, at least two second touch sensing binding pins 173 are arranged in the second direction Y to form a group, and multiple groups of the second touch sensing binding pins 173 are arranged along the first direction X.
  • the ground binding pin and the protection binding pin can be set as longer structures, and the first touch driving binding pin 814 and the second touch driving binding pin 815 and the first touch sensing binding pin 823 is set to a shorter structure.
  • the length of at least two touch binding pins arranged in the second direction Y to form a group is less than or equal to the length of the ground binding pins 86 or the protection binding pins 87 in the second direction Y.
  • the length of the group refers to is the sum of the lengths of the three touch binding pins in the second direction Y and the sum of the distances between two adjacent touch binding pins.
  • grounding binding pins 86 are provided on the outer sides of the plurality of first touch sensing binding pins 823 , and the plurality of first touch driving binding pins 814 and Ground binding pins 86 are also provided on the outer sides of the plurality of second touch driving binding pins 815 .
  • a protection binding pin 87 is provided between the ground binding pin 86 and the first touch sensing binding pin 823 , and the ground binding pin 86 and the first touch sensing can be isolated by the protection binding pin 87 . Bind pin 823 to avoid interference to ground signals.
  • a protection binding pin 87 is also provided between the ground binding pin 86 and the first touch drive binding pin 814 , and between the ground binding pin 86 and the second touch drive binding pin 815 .
  • the protection binding pin 87 can isolate the ground binding pin 86 from the first touch driving binding pin 814 and the second touch driving binding pin 815 to avoid interference to the ground signal.
  • a protection binding pin 87 is also set between the adjacent pins of the first touch driving binding pin 814 and the second touch driving binding pin 815 . It should be noted that the ground binding pin 86 is connected to a ground binding lead, and the protection binding pin 87 is connected to a protection binding lead; the leads on both sides of the ground binding lead and the protection binding lead are connected to the ground binding pin. 86 and the pins on both sides of the protection binding pin 87 correspond to each other.
  • the touch sensing lead 822 and the first touch metal layer 8a are provided in the same layer and the same material, and the second touch driving lead 813 is connected to the source and drain electrodes ( The data lines 43) are arranged in the same layer and the same material.
  • a first planarization layer 44 is disposed on a side of the second touch driving lead 813 away from the base substrate 1 .
  • the first touch driving lead 812 and the second touch metal layer 8b are provided in the same layer and the same material.
  • the first touch metal layer 8a and the second touch metal layer 8b are not provided in the bending area, and the first touch metal layer 8a and the second touch metal layer 8b are connected to the data lines 43 through vias, and the data lines 43 is connected to the binding pin, thereby reducing the thickness of the bending area, which is conducive to bending.
  • the touch sensing leads can also adopt a structure similar to that of the first touch driving leads, that is, the touch sensing leads and the first touch driving leads are provided with the same layer and material as the source and drain electrodes.
  • a second planarization layer 45 is provided on the side of the gate insulating layer 42 away from the base substrate 1 .
  • the second touch metal layer 8b may include the first connection portion 88, so the first connection portion 88 and the first touch control are directly formed during the formation.
  • the structure of connecting the driving lead 812 connects the first touch driving lead 812 with the first touch unit 81; similarly, the touch sensing lead 822 and the second touch unit 82 need to be connected, so the touch is also directly formed during the formation.
  • the first touch metal layer 8a may include the second touch unit 82 and the first touch electrodes 811 arranged at intervals.
  • the second touch driving lead 813 also needs to be connected to the first touch unit 81, but is not formed through the same patterning process as the first touch unit 81, and can be connected by a bridge structure. In this way, the second touch driving lead 813 and the touch sensing lead 822 can be arranged on different layers on the same side to avoid signal interference, and the second side region C2 can be made narrower to meet the requirement of a narrow frame.
  • the first touch unit 81 is entirely disposed on the first touch metal layer 8a
  • the second touch unit 82 is configured by
  • the first touch driving lead 812 and the first touch metal layer 8a of the touch structure can be provided in the same layer and the same material
  • the touch sensing lead 822 and The second touch metal layer 8b of the touch structure is provided with the same layer and material.
  • the second touch driving leads 813 may also be provided with the same layer and material as the first touch unit 81 .
  • the second touch driving leads 813 and the touch sensing leads 822 are disposed on opposite sides of the display area AA, that is, the second touch driving leads 813 pass through the second side region C2, and the touch sensing leads 822 pass through the fourth side region C4 .
  • virtual binding pins or other functional test pins may also be set on the other side of the display driver chip 14 where the touch binding area BOD2 is not set.
  • an embodiment of the present disclosure provides a display system, and the display system may include the touch display device described in any one of the above.
  • the specific structure of the touch display device has been described in detail above, so it will not be repeated here.
  • the specific type of the display system is not particularly limited, and any type of display system commonly used in the art can be used, such as mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc.
  • the specific use of the device should be selected accordingly, which will not be repeated here.
  • the display system also includes other necessary components and components. Taking a display as an example, such as a casing, a circuit board, a power cord, etc., those skilled in the art can use the display according to the The specific use requirements of the system are supplemented accordingly, and are not repeated here.
  • the beneficial effects of the display system provided by the exemplary embodiments of the present invention are the same as the beneficial effects of the touch display device provided by the above-mentioned exemplary embodiments, which will not be repeated here.

Abstract

本公开涉及显示技术领域，公开了一种触控显示装置和显示系统，该触控显示装置包括触控显示基板和柔性电路板；触控显示基板具有显示区以及与显示区相邻设置的非显示区，在非显示区设置有显示绑定区和触控绑定区；柔性电路板上设置有触控信号线、触控芯片以及显示信号线，触控信号线与触控芯片连接，柔性电路板与触控显示基板在显示绑定区和触控绑定区绑定，触控芯片通过触控信号线连接至触控绑定区，显示信号线连接至显示绑定区；触控芯片、触控信号线和触控绑定区设于显示信号线的同一侧。触控芯片通过触控信号线直接连接至触控绑定区，触控信号线与显示信号线之间不会产生信号干扰。 (图5)

Description

触控显示装置和显示系统
交叉引用
本公开要求于2021年3月17日提交的申请号为202110286297.2名称为“触控显示装置和显示系统”的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及显示技术领域，具体而言，涉及一种触控显示装置和包括该触控显示装置的显示系统。
背景技术
近年来，出于降低成本和技术升级缘故，触控面板由外挂式转向覆盖表面式(on cell)结构。触控结构集成于显示基板的封装层(TFE)之上，减少了一层OCA(Optically Clear Adhesive)光学胶层和一层COP(Cyclo Olefin Polymer，是一种环烯烃聚合物)光学材料层共两层，降低了触控显示装置的厚度和成本。这样，就需要将原来触控柔性电路板上的元器件设置在柔性电路板上，由于元器件数量增加，而柔性电路板受整机空间限制并没有增加，为了避免显示信号和触控信号的干扰问题，需要使用多层柔性电路板。
但是，多层柔性电路板反过来又会导致厚度增加、成本增加、不易折弯，而且还是会产生信号衰减和新的干扰问题。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
公开内容
本公开的目的在于克服上述现有技术的容易产生信号干扰的不足，提供一种不容易产生信号干扰的触控显示装置和包括该触控显示装置的显示系统。
根据本公开的一个方面，提供了一种触控显示装置，包括：
触控显示基板，具有显示区以及与所述显示区相邻设置的非显示区，在所述非显示区设置有显示绑定区和触控绑定区；
柔性电路板，其上设置有触控信号线、触控芯片以及显示信号线，所述触控信号线与所述触控芯片连接，所述柔性电路板与所述触控显示基板在所述显示绑定区和所述触控绑定区绑定，所述触控芯片通过所述触控信号线连接至所述触控绑定区，所述显示信号线连接至所述显示绑定区；
其中，所述触控芯片、所述触控信号线和所述触控绑定区设于所述显示信号线的同一侧。
在本公开的一种示例性实施例中，所述柔性电路板设置为两层板，所述两层板至少包括第一功能层、第二功能层以及设置在所述第一功能层和所述第二功能层之间的基底层，所述显示信号线设置在第一功能层，所述触控信号线设置在第二功能层。
在本公开的一种示例性实施例中，在所述触控绑定区，所述触控显示基板包括多个触控绑定引脚，至少两个所述触控绑定引脚在第二方向上排列形成一组，多组所述触控绑定引脚沿第一方向排列，所述第一方向与所述第二方向相交。
在本公开的一种示例性实施例中，所述触控绑定引脚包括第一触控驱动绑定引脚、第二触控驱动绑定引脚和第一触控感应绑定引脚，所述第一触控驱动绑定引脚、第二触控驱动绑定引脚和第一触控感应绑定引脚均间隔设置，所述第一触控驱动绑定引脚位于所述第二触控驱动绑定引脚和第一触控感应绑定引脚之间；或所述触控绑定引脚包括第一触控驱动绑定引脚和第一触控感应绑定引脚，所述第一触控驱动绑定引脚和所述第一触控感应绑定引脚间隔设置。
在本公开的一种示例性实施例中，在所述触控绑定区，所述触控显示基板还包括多个接地绑定引脚和多个保护绑定引脚，至少两个所述触控绑定引脚在第二方向上排列形成一组的组长度小于或等于所述接地绑定引脚或所述保护绑定引脚在第二方向上的长度。
在本公开的一种示例性实施例中，在所述显示区，所述触控显示基 板包括：
多个阵列排布的像素单元，各个所述像素单元包括至少三个子像素，各个所述子像素包括薄膜晶体管，所述薄膜晶体管包括栅极、栅绝缘层、有源层、源极和漏极；
触控结构，设于所述像素单元的一侧，所述触控结构包括多个第一触控单元和多个第二触控单元。
在本公开的一种示例性实施例中，所述第一触控单元为触控驱动单元，所述第二触控单元为触控感应单元，所述第一触控单元的一端通过第一触控驱动引线连接至所述第一触控驱动绑定引脚，所述第二触控单元通过触控感应引线连接至所述第一触控感应绑定引脚。
在本公开的一种示例性实施例中，所述第一触控单元的相对另一端通过第二触控驱动引线连接至所述第二触控驱动绑定引脚。
在本公开的一种示例性实施例中，所述第二触控驱动引线与所述源极和漏极同层同材料设置。
在本公开的一种示例性实施例中，在所述非显示区还设置有折弯区和引线区，所述折弯区位于所述显示绑定区和触控绑定区与所述引线区之间，在所述引线区，所述第一触控驱动引线与所述触控结构的第二触控金属层同层同材料设置。
在本公开的一种示例性实施例中，在所述引线区，所述触控感应引线与所述触控结构的第一触控金属层同层同材料设置。
在本公开的一种示例性实施例中，在所述折弯区，所述触控感应引线和所述第一触控驱动引线与所述源极和漏极同层同材料设置。
在本公开的一种示例性实施例中，在所述柔性电路板上设置有第三触控驱动绑定引脚、第四触控驱动绑定引脚和第二触控感应绑定引脚；所述第三触控驱动绑定引脚与所述第一触控驱动绑定引脚绑定或正投影交叠，所述第四触控驱动绑定引脚与所述第二触控驱动绑定引脚绑定或正投影交叠，所述第二触控感应绑定引脚与所述第一触控感应绑定引脚绑定或正投影交叠。
根据本公开的另一个方面，提供了一种显示系统，包括上述任意一项所述的触控显示装置。
本公开的触控显示装置和显示系统，将触控芯片、触控信号线和触控绑定区设于显示信号线的同一侧，触控芯片通过触控信号线直接连接至触控绑定区，触控信号线与显示信号线不会产生交叉，因此，触控信号线与显示信号线之间不会产生信号干扰，不需要为了避免信号干扰而采用多层柔性电路板，因此，也不会产生采用多层柔性电路板时产生的厚度增加、成本增加、不易折弯的问题，也不会产生信号衰减和新的干扰问题。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为触控面板为外挂式的触控显示装置的结构示意图。
图2为触控面板为覆盖表面式的触控显示装置的结构示意图。
图3为覆盖表面式的触控显示装置展开时的俯视结构示意图。
图4为触控显示基板的俯视结构示意图。
图5为本公开触控显示装置一示例实施方式的结构示意图。
图6为触控结构的层状结构示意图。
图7为本公开触控显示装置中触控结构一示例实施方式的结构示意图。
图8为本公开触控显示装置中触控结构另一示例实施方式的结构示意图。
图9为本公开触控显示装置中柔性电路板剖视示意图。
图10为本公开触控显示装置中触控显示基板上的触控绑定引脚的结构示意图。
图11为本公开触控显示装置中柔性电路板上的触控绑定引脚的结 构示意图。
图12为按照图5中的A-A剖切的剖视示意图。
图13为按照图5中的B-B剖切的剖视示意图。
附图标记说明：
1、衬底基板；2、散热膜；
31、第一基片；32、第二基片；
4、显示结构；41、栅线；42、栅绝缘层；43、数据线；44、第一平坦化层；45、第二平坦化层；
5、封装层；6、第一光学胶层；7、COP光学材料层；
8、触控结构；8a、第一触控金属层；8b、第二触控金属层；
81、第一触控单元；811、第一触控电极；812、第一触控驱动引线；813、第二触控驱动引线；814、第一触控驱动绑定引脚；815、第二触控驱动绑定引脚；
82、第二触控单元；821、第二触控电极；822、触控感应引线；823、第一触控感应绑定引脚；
83、第一绝缘层；84、第二绝缘层；85、缓冲层；86、接地绑定引脚；87、保护绑定引脚；88、第一连接部；
9、偏光片；10、第二光学胶层；11、盖板；
121、柔性电路板；1211、显示信号线；122、触控柔性电路板；
13、触控芯片；131、触控信号线；
14、显示驱动芯片；15、保护胶层；16、BTB连接器；
171、第三触控驱动绑定引脚；172、第四触控驱动绑定引脚；173、第二触控感应绑定引脚；
181、屏蔽层；182、保护层；183、基底层；184、第一功能层；185、第二功能层。
AA、显示区；FA、非显示区；BOD1、显示绑定区；BOD2、触控绑定区；GR、干扰处；C1、第一侧区域；C2、第二侧区域；C3、第三侧区域；C4、第四侧区域；
R、电阻；C、电容。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本公开将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。此外，附图仅为本公开的示意性图解，并非一定是按比例绘制。
虽然本说明书中使用相对性的用语，例如“上”“下”来描述图标的一个组件对于另一组件的相对关系，但是这些术语用于本说明书中仅出于方便，例如根据附图中所述的示例的方向。能理解的是，如果将图标的装置翻转使其上下颠倒，则所叙述在“上”的组件将会成为在“下”的组件。当某结构在其它结构“上”时，有可能是指某结构一体形成于其它结构上，或指某结构“直接”设置在其它结构上，或指某结构通过另一结构“间接”设置在其它结构上。
用语“一个”、“一”、“该”、“所述”和“至少一个”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等；用语“第一”、“第二”和“第三”等仅作为标记使用，不是对其对象的数量限制。
在本说明书中，“平行”是指两个直线形成的角度为-10°以上且10°以下的状态，因此，也包括该角度为-5°以上且5°以下的状态。另外，“垂直”是指两个直线形成的角度为80°以上且100°以下的状态，因此，也包括85°以上且95°以下的角度的状态。
参照图1所示的触控面板为外挂式的触控显示装置的结构示意图，该触控显示装置可以包括衬底基板1，设置在衬底基板1一侧的散热膜2，设置在散热膜2的远离衬底基板1一侧的第一基片31，设置在第一基片31的远离衬底基板1一侧的显示结构4，设置在显示结构4的远离衬底基板1一侧的封装层5。设置在封装层5的远离衬底基板1一侧的第一光学胶层6，设置在第一光学胶层6的远离衬底基板1一侧的COP(Cyclo Olefin Polymer，是一种环烯烃聚合物)光学材料层7，设置在COP光学 材料层7的远离衬底基板1一侧的触控结构8，设置在触控结构8的远离衬底基板1一侧的偏光片9，设置在偏光片9的远离衬底基板1一侧的第二光学胶层10，设置在第二光学胶层10的远离衬底基板1一侧的盖板11。在衬底基板1的与散热膜2相对的另一侧设置有第二基片32，显示结构4折弯至第二基片32的远离衬底基板1一侧并与柔性电路板121绑定，柔性电路板121设于显示结构4的远离衬底基板1一侧。在显示结构4折弯处的折弯外侧设置有保护胶层15。触控柔性电路板122的一端与触控结构8绑定，触控柔性电路板122折弯后，其相对另一端与柔性电路板121绑定，并位于柔性电路板121的远离衬底基板1的一侧。
参照图2所示的触控面板为覆盖表面式的触控显示装置的结构示意图，该触控显示装置可以包括衬底基板1，设置在衬底基板1一侧的散热膜2，设置在散热膜2的远离衬底基板1一侧的第一基片31，设置在第一基片31的远离衬底基板1一侧的显示结构4，设置在显示结构4的远离衬底基板1一侧的封装层5。设置在封装层5的远离衬底基板1一侧的触控结构8，设置在触控结构8的远离衬底基板1一侧的偏光片9，设置在偏光片9的远离衬底基板1一侧的第二光学胶层10，设置在第二光学胶层10的远离衬底基板1一侧的盖板11。在衬底基板1的与散热膜2相对的另一侧设置有第二基片32，显示结构4折弯至第二基片32的远离衬底基板1一侧并与柔性电路板121绑定，柔性电路板121设于显示结构4的远离衬底基板1一侧。在显示结构4折弯处的折弯外侧设置有保护胶层15。触控结构8连接于显示结构4，触控结构8的信号通过显示结构4连接至柔性电路板121。
从图中可以得到：覆盖表面式的触控显示装置相对于外挂式的触控显示装置，省略了第一光学胶层6和COP光学材料层7，因此，降低了触控显示装置的厚度和成本。而且，省略了触控柔性电路板122，需要将原来触控柔性电路板122上的元器件设置在柔性电路板121上，由于元器件数量增加，而柔性电路板121受整机空间限制并没有增加，为了避免显示信号和触控信号的干扰问题，需要使用多层柔性电路板121。
另外，参照图3所示的覆盖表面式的触控显示装置展开时的俯视结 构示意图，图中箭头所示为触控绑定引线的走向，以及图4所示的触控显示基板的俯视结构示意图，触控芯片13也需要设置在柔性电路板121上，触控芯片13需要与触控结构绑定；在柔性电路板121上设置有显示信号线1211，显示信号线1211起于BTB连接器16，往上一直延伸到显示绑定引脚。与触控芯片13绑定的触控绑定引脚设置在与显示信号线1211绑定的显示绑定引脚的两侧，因此，显示信号线1211与触控信号线131会有交叉，从而在干扰处GR显示信号与触控信号会有干扰的风险。
柔性电路板121可以采用多层板以避免显示信号与触控信号的干扰，即通过将触控信号线131和显示信号线1211分布在不同层，中间加以整面的地线层，可以达到规避信号干扰的目的。理论上地线层越厚/多，屏蔽效果越好。当前使用的多层柔性电路板121最常见为六层、四层、三层，但是，多层柔性电路板121主要有两个问题：第一个问题，厚度成倍增加、成本增加、不易折弯；第二个问题，信号衰减和新的干扰问题，器件区位于第一层，元器件通过绑定引脚与显示、触控信号接口相连接，而绑定引脚设置在第三层，第三层的绑定引脚连接至第一层的器件区，需要使用长距离过孔连接导通，一方面使信号通道长度增加，导致通道阻抗增加，信号衰减严重；另一方面，长距离过孔导致寄生电容增大(噪声)，进一步增大信号衰减，影响显示和触控性能；再一方面，过孔制作相关不良(断开、短路等)也会随之增加。
本公开实施方式提供了一种触控显示装置，如图5所示的本公开触控显示装置的结构示意图，图中箭头所示为触控绑定引线的走向，该触控显示装置可以包括触控显示基板和柔性电路板121；触控显示基板具有显示区AA以及与所述显示区AA相邻设置的非显示区FA，在所述非显示区FA设置有显示绑定区BOD1和触控绑定区BOD2；柔性电路板121上设置有触控信号线131、触控芯片13以及显示信号线1211，所述触控信号线131与所述触控芯片13连接，所述柔性电路板121与所述触控显示基板在所述显示绑定区BOD1和所述触控绑定区BOD2绑定，所述触控芯片13通过所述触控信号线131连接至所述触控绑定区BOD2，所述显示信号线1211连接至所述显示绑定区BOD1；其中，所述触控芯 片13、所述触控信号线131和所述触控绑定区BOD2设于所述显示信号线1211的同一侧。
本公开的触控显示装置，将触控芯片13、触控信号线131和触控绑定区BOD2设于显示信号线1211的同一侧，触控芯片13通过触控信号线131直接连接至触控绑定区BOD2，触控信号线131与显示信号线1211不会产生交叉，因此，触控信号线131与显示信号线1211之间不会产生信号干扰，不需要为了避免信号干扰而采用多层柔性电路板121，因此，也不会产生采用多层柔性电路板121时产生的厚度增加、成本增加、不易折弯的问题，也不会产生信号衰减和新的干扰问题。
触控显示基板可以包括衬底基板1，衬底基板1可以为硬质基板，例如，玻璃基板、塑料基板等等；也可以是柔性基板，例如，聚酰亚胺基板。
触控显示基板具有显示区AA和与显示区AA相邻的非显示区FA，显示区AA可以呈矩形、圆形等。在非显示区FA设置有引线区、折弯区、显示绑定区BOD1和触控绑定区BOD2，折弯区位于引线区与显示绑定区BOD1和触控绑定区BOD2之间，触控显示基板在折弯区可以折弯形成弧形。引线区可以围绕显示区AA，在显示区AA为矩形的情况下，引线区可以包括第一侧区域层C1、第二侧区域C2、第三侧区域C3以及第四侧区域C4，其中，第一侧区域层C1设于显示区AA与显示绑定区BOD1和触控绑定区BOD2之间，第二侧区域C2、第三侧区域C3以及第四侧区域C4依次逆时针排列。
在显示区AA设置有触控结构8和显示结构4(图中未示出)，显示结构4为多个阵列排布的像素单元，触控结构8设于显示结构4的远离衬底基板1的一侧。每个像素单元可以包括至少三个子像素，其中，每个子像素可以包括薄膜晶体管，薄膜晶体管可以包括栅极、栅绝缘层42、有源层、源极和漏极，栅极通过栅线41连接至显示绑定区BOD1，源极或漏极通过数据线43连接至显示绑定区BOD1。
参照图6所述的触控结构的层状结构示意图，触控结构8可以包括设置在封装层5之上的缓冲层85，设置在缓冲层85的远离封装层5一侧的第一触控金属层8a，设置在第一触控金属层8a的远离封装层5一 侧的第一绝缘层83，设置在第一绝缘层83的远离封装层5一侧的第二触控金属层8b，设置在第二触控金属层8b的远离封装层5一侧的第二绝缘层84。
触控结构8可以为互容式结构。参照图7和图8所示，触控结构8可以包括多个第一触控单元81和多个第二触控单元82。第二触控单元82具有沿第一方向X延伸的线形状，多个第二触控单元82沿第二方向Y依次排列。第一触控单元81具有沿第二方向Y延伸的线形状，多个第一触控单元81沿第一方向X依次排列，第一方向X与第二方向Y交叉。每个第一触控单元81可以包括沿第二方向Y依次排列的多个第一触控电极811和第一连接部88，多个第一触控电极811间隔设置，相邻的第一触控电极811通过第一连接部88彼此连接。每个第二触控单元82可以包括沿第一方向X依次排列的多个第二触控电极821和第二连接部，多个第二触控电极821间隔设置，相邻的第二触控电极821通过第二连接部彼此连接。
第一触控电极811和第二触控电极821在第三方向Z上交替布置形成电容。通过检测该电容的变化，可以确定触摸点的位置。第三方向Z与第一方向X和第二方向Y交叉，优选地，第三方向Z与第一方向X和第二方向Y形成的平面垂直。
在一些示例实施方式中，第一触控电极811、第二触控电极821和第二连接部同层设置，并且可以通过一次图案化工艺形成，第二触控电极821和第二连接部为一体结构，第一连接部88可以设置于桥连层形成桥接结构，第一连接部88和第二连接部之间设置有绝缘层。在另一些示例实施方式中，第一触控电极811、第一连接部88和第二触控电极821同层设置，并且可以通过一次图案化工艺形成，第一触控电极811和第一连接部88为一体结构，第二连接部可以设置于桥连层形成桥接结构，第一连接部88和第二连接部之间设置有绝缘层。
在一些示例实施方式中，第一触控电极811可以是驱动电极，第二触控电极821可以是感应电极。或者，第一触控电极811可以是感应电极，第二触控电极821可以是驱动电极。多个第一触控单元81和多个第二触控单元82构成M行驱动电极*N列感应电极，即包括M个第一触 控单元81和N个第二触控单元82，M和N为大于二的正整数。
在一些示例实施方式中，第一触控电极811和第二触控电极821可以具有菱形状，例如可以是正菱形，或者是横长的菱形，或者是纵长的菱形。在一些可能的实现方式中，第一触控电极811和第二触控电极821可以具有三角形、正方形、梯形、平行四边形、五边形、六边形和其它多边形中的任意一种或多种，本公开在此不做限定。
在一些示例实施方式中，第一触控电极811和第二触控电极821可以是透明导电电极形式。在一些示例实施方式中，第一触控电极811和第二触控电极821可以是金属网格形式，金属网格由多个金属线交织形成，金属网格包括多个网格图案，网格图案是由多个金属线构成的多边形。金属网格式的第一触控电极811和第二触控电极821具有电阻小、厚度小和反应速度快等优点。
在一些示例实施方式中，如图7、图8、图9和图10所示，在非显示区FA，触控结构8可以包括多个第一触控驱动引线812、多个第二触控驱动引线813和多个触控感应引线822(为了表示清楚，图中不同的引线采用不同的线型来区分)。在触控绑定区BOD2设置有多个触控绑定引脚。触控绑定引脚包括第一触控感应绑定引脚823、第一触控驱动绑定引脚814和第二触控驱动绑定引脚815。
第一触控驱动引线812的第一端与第一触控单元81对应连接，第一触控驱动引线812的第二端经边缘区域引出到第一触控驱动绑定引脚814。第二触控驱动引线813与第一触控单元81的相对另一端对应连接，第二触控驱动引线813的第二端引出到第二触控驱动绑定引脚815。触控感应引线822的第一端与第二触控单元82的一端对应连接，触控感应引线822的第二端引出到第一触控感应绑定引脚823。
在一些示例实施方式中，第一触控驱动引线812的第一端与第一触控单元81邻近绑定区域的一端连接，第一触控驱动引线812的的第二端直接引出到第一触控驱动绑定引脚814。第二触控驱动引线813的第一端与第一触控单元81远离绑定区域的一端连接，第二触控驱动引线813经第三侧区域C3、第二侧区域C2和第一侧区域层C1经引出到第二触控驱动绑定引脚815。触控感应引线822的第一端与第二触控单元82的 一端连接，触控感应引线822经第四侧区域C4和第一侧区域层C1引出到第一触控感应绑定引脚823。
在非显示区FA，触控结构8包括N个触控感应引线822、M个第一触控驱动引线812和M个第二触控驱动引线813。当触控操作时，触控检测信号通过N个触控感应引线822输入到每行第二触控电极821，实现检测每行第二触控电极821。触控检测信号通过M个第一触控驱动引线812和M个第二触控驱动引线813输入到每列第一触控电极811，实现共同检测每列第一触控电极811。当第一触控电极811为驱动电极，第二触控电极821为感应电极时，这种连接方式可称为2T1R。然而，本公开的示例实施方式不限于上述说明，例如每一列第一触控单元81的两端中也可以只有一端引出。
第一触控感应绑定引脚823、第一触控驱动绑定引脚814和第二触控驱动绑定引脚815均位于显示驱动芯片14的同一侧，例如，参照图7所示，触控绑定区BOD2可以位于显示驱动芯片14的左侧；参照图8所示，触控绑定区BOD2也可以位于显示驱动芯片14的右侧。
在一些示例实施方式中，参照图9所示的柔性电路板的结构示意图，柔性电路板121可以设置为两层板，即柔性电路板121包括基底层183，设置在基底层183的相对两侧的第一功能层184和第二功能层185，在第一功能层184和第二功能层185的远离基底层183的一侧均设置有保护层182，在保护层182的远离基底层183的一侧均设置有屏蔽层181。触控芯片13、电阻R、电容C等元器件位于柔性电路板121的最上层，触控芯片13通过underfill(底部填充)连接于第一功能层184，底部填充主要通过“非接触喷射式”点胶，电阻R和电容C通过UV(紫外光固化)胶连接于第一功能层184。第一功能层184通过过孔与第二功能层185连接，触控信号线131设置在第二功能层185。显示信号线1211设置在第一功能层184。
柔性电路板121的厚度大约为0.12mm，相对于现有技术中六层板的厚度大约为0.36mm，四层板的厚度大约为0.24mm，减薄很多。触控芯片13的高度大约为0.427mm至0.777mm，而且触控芯片13设置在柔性电路板121上的凹槽内，因此，柔性电路板121整体的最大厚度不超过 0.9mm。
参照图11所示，柔性电路板121上设置有第二触控感应绑定引脚173、第三触控驱动绑定引脚171和第四触控驱动绑定引脚172，第三触控驱动绑定引脚171对应于第一触控驱动绑定引脚814绑定，第四触控驱动绑定引脚172对应于第二触控驱动绑定引脚815绑定，第二触控感应绑定引脚173对应于第一触控感应绑定引脚823绑定。第二触控感应绑定引脚173、第三触控驱动绑定引脚171和第四触控驱动绑定引脚172通过触控信号线131连接至触控芯片13。触控芯片13、触控信号线131、第二触控感应绑定引脚173、第三触控驱动绑定引脚171和第四触控驱动绑定引脚172设于显示信号线1211的同一侧，使得连接触控芯片13与第二触控感应绑定引脚173、第三触控驱动绑定引脚171和第四触控驱动绑定引脚172的触控信号线131不需要和显示信号线1211交叉设置，因此，触控信号线131与显示信号线1211之间不会产生信号干扰，不需要采用多层板来避免触控信号线131与显示信号线1211之间的信号干扰。
参照图10和图11所示，两个第一触控驱动绑定引脚814在第二方向Y上排列形成一组，即减小第一触控驱动绑定引脚814的长度使得在现有技术中的设置一个第一触控驱动绑定引脚814面积内可以设置两个第一触控驱动绑定引脚814，多组第一触控驱动绑定引脚814沿第一方向X排列，第一方向X与第二方向Y相交，优选地，第一方向X与第二方向Y垂直。当然，也可以设置为三个或更多个第一触控驱动绑定引脚814在第二方向Y上排列形成一组。对应的，设置在柔性电路板121上的第三触控驱动绑定引脚171也设置为与第一触控驱动绑定引脚814相适配的结构，即减小第三触控驱动绑定引脚171的面积，至少两个第三触控驱动绑定引脚171在第二方向Y上排列形成一组，多组第三触控驱动绑定引脚171沿第一方向X排列。
两个第二触控驱动绑定引脚815在第二方向Y上排列形成一组，即减小第二触控驱动绑定引脚815的长度使得在现有技术中的设置一个第二触控驱动绑定引脚815面积内可以设置两个第二触控驱动绑定引脚815，多组第二触控驱动绑定引脚815沿第一方向X排列，第一方向X与第二方向Y相交，优选地，第一方向X与第二方向Y垂直。当然， 也可以设置为三个或更多个第二触控驱动绑定引脚815在第二方向Y上排列形成一组。对应的，设置在柔性电路板121上的第四触控驱动绑定引脚172也设置为与第二触控驱动绑定引脚815相适配的结构，即减小第四触控驱动绑定引脚172的面积，至少两个第四触控驱动绑定引脚172在第二方向Y上排列形成一组，多组第三触控驱动绑定引脚171沿第一方向X排列。
两个第一触控感应绑定引脚823在第二方向Y上排列形成一组，即减小第一触控感应绑定引脚823引脚的长度使得在现有技术中的设置一个第一触控感应绑定引脚823面积内可以设置两个第一触控感应绑定引脚823，多组第一触控感应绑定引脚823沿第一方向X排列，第一方向X与第二方向Y相交，优选地，第一方向X与第二方向Y垂直。当然，也可以设置为三个或更多个第一触控感应绑定引脚823在第二方向Y上排列形成一组。对应的，设置在柔性电路板121上的第二触控感应绑定引脚173也设置为与第一触控感应绑定引脚823相适配的结构，即减小第二触控感应绑定引脚173的面积，至少两个第二触控感应绑定引脚173在第二方向Y上排列形成一组，多组第二触控感应绑定引脚173沿第一方向X排列。
在本示例实施方式中，可以将接地绑定引脚和保护绑定引脚设置为较长的结构，而将第一触控驱动绑定引脚814、第二触控驱动绑定引脚815和第一触控感应绑定引脚823设置为较短的结构。且至少两个触控绑定引脚在第二方向Y上排列形成一组的组长度小于或等于接地绑定引脚86或保护绑定引脚87在第二方向Y上的长度。
需要说明的是，组长度L指的是两个触控绑定引脚在第二方向Y上的长度之和(L1+L2)与相邻两个触控绑定引脚之间的间距(S1)之和，即L＝L1+L2+S1。当然，在三个或更多个触控绑定引脚在第二方向Y上排列形成一组的情况下，三个触控绑定引脚之间设置有两个间距，因此，组长度指的是三个触控绑定引脚在第二方向Y上的长度之和与两个相邻两个触控绑定引脚之间的间距之和的和，更多个触控绑定引脚在第一方向上排列形成一组的情况，可以以此类推，在此不再赘述。
在本示例实施方式中，参照图9所示，多个第一触控感应绑定引脚 823的外侧设置有接地绑定引脚86，在多个第一触控驱动绑定引脚814和多个第二触控驱动绑定引脚815的外侧也设置有接地绑定引脚86。在接地绑定引脚86与第一触控感应绑定引脚823之间设置有保护绑定引脚87，通过保护绑定引脚87可以隔离接地绑定引脚86与第一触控感应绑定引脚823，避免对接地信号的干扰。在接地绑定引脚86与第一触控驱动绑定引脚814，以及接地绑定引脚86与第二触控驱动绑定引脚815之间也设置有保护绑定引脚87，通过保护绑定引脚87可以隔离接地绑定引脚86与第一触控驱动绑定引脚814和第二触控驱动绑定引脚815，避免对接地信号的干扰。在第一触控驱动绑定引脚814与第二触控驱动绑定引脚815的相邻引脚之间也设置有保护绑定引脚87。需要说明的是，接地绑定引脚86连接有接地绑定引线，保护绑定引脚87连接有保护绑定引线；接地绑定引线和保护绑定引线两侧的引线与接地绑定引脚86和保护绑定引脚87两侧的引脚对应一致。
在本示例实施方式中，参照图12所示，在引线区，触控感应引线822与第一触控金属层8a同层同材料设置，第二触控驱动引线813与源极和漏极(数据线43)同层同材料设置。在第二触控驱动引线813的远离衬底基板1的一侧设置有第一平坦化层44。参照图13所示，在引线区，第一触控驱动引线812与第二触控金属层8b同层同材料设置。在折弯区没有设置第一触控金属层8a和第二触控金属层8b，将第一触控金属层8a和第二触控金属层8b通过过孔连接至数据线43，通过数据线43连接至绑定引脚，从而减薄折弯区的厚度，有利于折弯。在折弯区，触控感应引线也可以采用与第一触控驱动引线相类似的结构，即触控感应引线和第一触控驱动引线与源极和漏极同层同材料设置。在栅绝缘层42的远离衬底基板1的一侧设置有第二平坦化层45。
所谓的同层同材料设置就是通过同一次构图工艺形成。由于，第一触控驱动引线812与第一触控单元81需要连接，第二触控金属层8b可以包括第一连接部88，因此在形成时直接形成第一连接部88与第一触控驱动引线812连接的结构，将第一触控驱动引线812与第一触控单元81连接；同理，触控感应引线822与第二触控单元82需要连接，因此在形成时也直接形成触控感应引线822与第二触控单元82连接的结构， 第一触控金属层8a可以包括第二触控单元82和间隔设置的第一触控电极811。第二触控驱动引线813也需要与第一触控单元81连接，但是没有与第一触控单元81通过同一次构图工艺形成，可以通过桥接结构连接。如此设置，可以使第二触控驱动引线813与触控感应引线822设置在同一侧不同的层，避免信号干扰，而且可以使第二侧区域C2制作的较窄，满足窄边框的要求。
当然，根据第一触控单元81与第二触控单元82设置的不同，即在第一触控单元81整体都设置在第一触控金属层8a，而第二触控单元82是通过设置在第二触控金属层8b上的桥接结构连接的情况下，可以将第一触控驱动引线812与触控结构的第一触控金属层8a同层同材料设置，触控感应引线822与触控结构的第二触控金属层8b同层同材料设置。
当然，在本公开的另一些示例实施方式中，可以将第二触控驱动引线813也与第一触控单元81同层同材料设置。第二触控驱动引线813与触控感应引线822设置在显示区AA的相对两侧，即第二触控驱动引线813经第二侧区域C2，而触控感应引线822线第四侧区域C4。
另外，需要说明的是，在显示驱动芯片14的没有设置触控绑定区BOD2的另一侧还可以设置虚拟绑定引脚，或其他功能性测试引脚。
进一步的，本公开实施方式提供了一种显示系统，该显示系统可以包括上述任意一项所述的触控显示装置。触控显示装置的具体结构上述已经进行了详细说明，因此，此处不再赘述。
而该显示系统的具体类型不受特别的限制，本领域常用的显示系统类型均可，具体例如手机等移动装置、手表等可穿戴设备、VR装置等等，本领域技术人员可根据该显示设备的具体用途进行相应地选择，在此不再赘述。
需要说明的是，该显示系统除了触控显示装置以外，还包括其他必要的部件和组成，以显示器为例，具体例如外壳、电路板、电源线，等等，本领域技术人员可根据该显示系统的具体使用要求进行相应地补充，在此不再赘述。
与现有技术相比，本发明示例实施方式提供的显示系统的有益效果与上述示例实施方式提供的触控显示装置的有益效果相同，在此不做赘 述。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。

Claims (14)

  1. 一种触控显示装置，其中，包括：
    触控显示基板，具有显示区以及与所述显示区相邻设置的非显示区，在所述非显示区设置有显示绑定区和触控绑定区；
    柔性电路板，其上设置有触控信号线、触控芯片以及显示信号线，所述触控信号线与所述触控芯片连接，所述柔性电路板与所述触控显示基板在所述显示绑定区和所述触控绑定区绑定，所述触控芯片通过所述触控信号线连接至所述触控绑定区，所述显示信号线连接至所述显示绑定区；
    其中，所述触控芯片、所述触控信号线和所述触控绑定区设于所述显示信号线的同一侧。
  2. 根据权利要求1所述的触控显示装置，其中，所述柔性电路板设置为两层板，所述两层板至少包括第一功能层、第二功能层以及设置在所述第一功能层和所述第二功能层之间的基底层，所述显示信号线设置在第一功能层，所述触控信号线设置在第二功能层。
  3. 根据权利要求1所述的触控显示装置，其中，在所述触控绑定区，所述触控显示基板包括多个触控绑定引脚，至少两个所述触控绑定引脚在第二方向上排列形成一组，多组所述触控绑定引脚沿第一方向排列，所述第一方向与所述第二方向相交。
  4. 根据权利要求3所述的触控显示装置，其中，所述触控绑定引脚包括第一触控驱动绑定引脚、第二触控驱动绑定引脚和第一触控感应绑定引脚，所述第一触控驱动绑定引脚、第二触控驱动绑定引脚和第一触控感应绑定引脚均间隔设置，所述第一触控驱动绑定引脚位于所述第二触控驱动绑定引脚和第一触控感应绑定引脚之间；或所述触控绑定引脚包括第一触控驱动绑定引脚和第一触控感应绑定引脚，所述第一触控驱动绑定引脚和所述第一触控感应绑定引脚间隔设置。
  5. 根据权利要求3所述的触控显示装置，其中，在所述触控绑定区，所述触控显示基板还包括多个接地绑定引脚和多个保护绑定引脚，至少两个所述触控绑定引脚在第二方向上排列形成一组的组长度小于或等于所述接地绑定引脚或所述保护绑定引脚在第二方向上的长度。
  6. 根据权利要求4所述的触控显示装置，其中，在所述显示区，所述触控显示基板包括：
    多个阵列排布的像素单元，各个所述像素单元包括至少三个子像素，各个所述子像素包括薄膜晶体管，所述薄膜晶体管包括栅极、栅绝缘层、有源层、源极和漏极；
    触控结构，设于所述像素单元的一侧，所述触控结构包括多个第一触控单元和多个第二触控单元。
  7. 根据权利要求6所述的触控显示装置，其中，所述第一触控单元为触控驱动单元，所述第二触控单元为触控感应单元，所述第一触控单元的一端通过第一触控驱动引线连接至所述第一触控驱动绑定引脚，所述第二触控单元通过触控感应引线连接至所述第一触控感应绑定引脚。
  8. 根据权利要求7所述的触控显示装置，其中，所述第一触控单元的相对另一端通过第二触控驱动引线连接至所述第二触控驱动绑定引脚。
  9. 根据权利要求8所述的触控显示装置，其中，所述第二触控驱动引线与所述源极和漏极同层同材料设置。
  10. 根据权利要求7所述的触控显示装置，其中，在所述非显示区还设置有折弯区和引线区，所述折弯区位于所述显示绑定区和触控绑定区与所述引线区之间，在所述引线区，所述第一触控驱动引线与所述触控结构的第二触控金属层同层同材料设置。
  11. 根据权利要求10所述的触控显示装置，其中，在所述引线区，所述触控感应引线与所述触控结构的第一触控金属层同层同材料设置。
  12. 根据权利要求10所述的触控显示装置，其中，在所述折弯区，所述触控感应引线和所述第一触控驱动引线与所述源极和漏极同层同材料设置。
  13. 根据权利要求4所述的触控显示装置，其中，在所述柔性电路板上设置有第三触控驱动绑定引脚、第四触控驱动绑定引脚和第二触控感应绑定引脚；所述第三触控驱动绑定引脚与所述第一触控驱动绑定引脚绑定或正投影交叠，所述第四触控驱动绑定引脚与所述第二触控驱动绑定引脚绑定或正投影交叠，所述第二触控感应绑定引脚与所述第一触控感应绑定引脚绑定或正投影交叠。
  14. 一种显示系统，其中，包括权利要求1～13任意一项所述的触控显示装置。
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