WO2022193162A1 - Led显示模块的封装工艺 - Google Patents
Led显示模块的封装工艺 Download PDFInfo
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- WO2022193162A1 WO2022193162A1 PCT/CN2021/081207 CN2021081207W WO2022193162A1 WO 2022193162 A1 WO2022193162 A1 WO 2022193162A1 CN 2021081207 W CN2021081207 W CN 2021081207W WO 2022193162 A1 WO2022193162 A1 WO 2022193162A1
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- WIPO (PCT)
- Prior art keywords
- display module
- packaging process
- pcb
- filler
- glue
- Prior art date
Links
- 238000012858 packaging process Methods 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 34
- 239000000945 filler Substances 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 15
- 239000011324 bead Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 235000012149 noodles Nutrition 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 11
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Definitions
- the invention relates to the technical field of LED display screens, in particular to a packaging process of an LED display module.
- Patent document CN 106683578 A discloses an LED display screen capable of eliminating color differences between modules and a manufacturing method thereof.
- This patent document [0045] ⁇ [0049] discloses a kind of manufacturing method of the LED display screen that can eliminate the color difference between modules, specifically comprises the following steps: 1, utilize vacuum encapsulation device, encapsulate glue (equivalent to in the present invention) The filling glue) is encapsulated on the surface of the driving circuit board where the LED lamp module is fixed; 2. The silver is evaporated on the encapsulation glue by vacuum coating as a metal coating; The urethane acrylate resin of the glare particles is sprayed on the metal plating layer as an anti-glare layer; 4.
- a PET base film is used as a transparent protective film. Among them, the metal plating layer, the anti-glare layer and the protective film together form the one-way perspective layer.
- the encapsulation glue, metal coating, anti-glare layer and protective film all require separate processes and equipment, the process is complex, the steps are many, the packaging efficiency is low, and it is difficult to meet production requirements.
- the technical problem to be solved by the present invention is to propose a packaging process for an LED display module based on the above-mentioned shortcomings of the prior art, which solves the problems of many packaging processes and low packaging efficiency of the existing LED display module.
- the packaging process of the LED display module includes the following steps:
- the display module includes a PCB, LED lamp beads and a driver IC, a plurality of the LED lamp beads are arranged on the bottom surface of the PCB, and a plurality of the driver ICs are arranged on the top of the PCB noodle.
- the beneficial effect of the present invention is that: by curing the filling glue, the filling glue and the bottom surface of the PCB, the filling glue and the light guide film can be bonded at one time, only one process is needed, and the packaging efficiency is improved. meet production needs.
- Fig. 1 is the process schematic diagram of steps a) ⁇ c) in the embodiment.
- Fig. 2 is a process schematic diagram of step d) in the embodiment.
- Fig. 3 is a process schematic diagram of step f) in the embodiment.
- Fig. 4 is the process schematic diagram of step g) in the embodiment.
- 10-display module 11-PCB, 12-LED lamp beads, 13-driver IC, 20-base plate, 30-protective film, 40-light guide film, 50-dam, 60-filling glue.
- the packaging process of the LED display module includes the following steps:
- a display module 10 As shown in FIG. 1, a display module 10 is provided.
- the display module 10 includes a PCB 11, LED lamp beads 12 and a driving IC 13.
- a plurality of LED lamp beads 12 are arranged on the bottom surface of the PCB 11, and a plurality of driving ICs 13 are arranged on the top surface of the PCB 11 .
- a bottom plate 20 is provided; on the top surface of the bottom plate 20, the protective film 30, the light guide film 40 and the dam 50 are sequentially laid from bottom to top.
- the filling glue 60 is a transparent glue, and the light transmittance is 90%-100%;
- the material of the filling glue 60 is epoxy resin, silicone resin or silica gel;
- the defoaming treatment is any one of vacuum defoaming and centrifugal defoaming or a combination of both.
- the curing process is heating and curing; the heat is transferred to the filler 60 through the bottom plate 20 , so that the filler 60 is heated and cured.
- the display module 10 is subjected to outline processing, and the light guide film 40 , the filler 60 , the protective film 30 and the dam 50 protruding from the side of the display module 10 are cut off.
- the light guide film 40 is a one-way reflection film, the top surface is a light-transmitting surface, and the bottom surface is a light-reflecting surface.
- the light emitted by the LED lamp beads 12 can pass through the light guide film 40 to the outside, and the light from the outside will be reflected when it irradiates the light guide film 40 .
- the second embodiment provided by the present invention is a packaging process of an LED display module.
- the curing process is ultraviolet curing;
- the base plate 20 is made of a transparent material, and the ultraviolet rays pass through the base plate 20 and irradiate the filling glue 60 to cure the filling glue 60 .
- the third embodiment provided by the present invention is a packaging process of an LED display module.
- the difference between the third embodiment and the first embodiment is that: in the third embodiment, the curing process is room temperature curing;
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
本发明公开了一种LED显示模块的封装工艺，包括如下步骤：a)提供一显示模块，显示模块包括有PCB、LED灯珠以及驱动IC，多个LED灯珠设置于PCB的底面；b)提供一底板；在底板的顶面从下往上依次铺设保护膜、导光膜以及围坝；c)向围坝内注入液态的填充胶，并对填充胶进行消泡处理；d)将显示模块置入围坝内，使PCB的底面、LED灯珠浸泡在填充胶中；e)对填充胶进行固化处理；f)将底板与保护膜进行分离；g)对显示模块进行外形加工处理，切除凸出显示模块侧面的导光膜、填充胶、保护膜以及围坝。通过对填充胶进行固化处理，使填充胶与PCB的底面、填充胶与导光膜实现一次性粘合，提高了封装效率，满足生产需求。
Description
本发明涉及LED显示屏技术领域，特别是指一种LED显示模块的封装工艺。
专利文献CN 106683578 A公开了一种可消除模块间色彩差异的LED显示屏及其制造方法。该专利文献[0045]~[0049]公开了一种可消除模块间色彩差异的LED显示屏的制造方法，具体包括下述步骤：一、利用真空封装装置，将封装胶（相当于本发明中的填充胶）灌封在驱动电路板的固定有LED灯模组的表面；二、采用真空镀膜的方式将银蒸镀在封装胶上，作为金属镀层；三、使用UV涂覆设备将含有防眩粒子的聚氨酯丙烯酸酯树脂喷涂在金属镀层上，作为防眩层；四、使用PET基膜，作为透明保护膜。其中，金属镀层、防眩层、保护膜共同形成单向透视层。
由此可见，在制作方法中，封装胶、金属镀层、防眩层以及保护膜均需要单独的工序和设备，工艺复杂，步骤较多，封装效率低，难以满足生产需求。
本发明要解决的技术问题是根据上述现有技术的不足，提出一种LED显示模块的封装工艺，解决了现有LED显示模块封装工艺工序多，封装效率低的问题。
发明的技术方案是这样实现的：
LED显示模块的封装工艺，包括如下步骤：
a) 提供一显示模块，所述显示模块包括有PCB、LED灯珠以及驱动IC，多个所述LED灯珠设置于所述PCB的底面，多个所述驱动IC设置于所述PCB的顶面。
b) 提供一底板；在所述底板的顶面从下往上依次铺设保护膜、导光膜以及围坝。
c) 向所述围坝内注入液态的填充胶，并对所述填充胶进行消泡处理。
d) 将所述显示模块置入所述围坝内，使所述PCB的底面、所述LED灯珠浸泡在所述填充胶中。
e) 对所述填充胶进行固化处理。
f) 将所述底板与保护膜进行分离。
g) 对所述显示模块进行外形加工处理，切除凸出所述显示模块侧面的导光膜、填充胶、保护膜以及围坝。
采用上述技术方案，本发明的有益效果在于：通过对填充胶进行固化处理，使填充胶与PCB的底面、填充胶与导光膜实现一次性粘合，只需一个工序，提高了封装效率，满足生产需求。
图1为实施例中步骤a)~c)的工艺示意图。
图2为实施例中步骤d)的工艺示意图。
图3为实施例中步骤f)的工艺示意图。
图4为实施例中步骤g)的工艺示意图。
图中，10-显示模块，11-PCB，12-LED灯珠，13-驱动IC，20-底板，30-保护膜，40-导光膜，50-围坝，60-填充胶。
如图1~4所示，本发明提供的第一实施例，LED显示模块的封装工艺，包括如下步骤：
a) 如图1所示，提供一显示模块10，显示模块10包括有PCB 11、LED灯珠12以及驱动IC 13，多个LED灯珠12设置于PCB 11的底面，多个驱动IC 13设置于PCB 11的顶面。
b) 如图1所示，提供一底板20；在底板20的顶面从下往上依次铺设保护膜30、导光膜40以及围坝50。
c) 如图1所示，向围坝50内注入液态的填充胶60，并对填充胶60进行消泡处理。其中，填充胶60为透明胶，且透光率为90%~100%；填充胶60的材料为环氧树脂、硅树脂或硅胶；消泡处理为真空消泡、离心消泡中的任意一者或两者结合。
d) 如图2所示，将显示模块10置入围坝50内，使PCB 11的底面、LED灯珠12浸泡在填充胶60中。其中，填充胶60的液面位于PCB 11的底面与顶面之间。
e) 对填充胶60进行固化处理。固化处理为加热固化；热量通过底板20传递到填充胶60，使填充胶60升温固化。
f) 如图3所示，将底板20与保护膜30进行分离。
g) 如图4所示，对显示模块10进行外形加工处理，切除凸出显示模块10侧面的导光膜40、填充胶60、保护膜30以及围坝50。
在该LED显示模块10中，导光膜40为单向反射膜，顶面为透光面，底面为反光面。LED灯珠12发出的光线可以穿过导光膜40到达外部，外部的光线照射到导光膜40时会被反射。
本发明提供的第二实施例，LED显示模块的封装工艺。第二实施例与第一实施例的不同点在于：第二实施例中，固化处理为紫外固化；底板20由透明材料制成，紫外线穿过底板20照射到填充胶60，使填充胶60固化。
本发明提供的第三实施例，LED显示模块的封装工艺。第三实施例与第一实施例的不同点在于：第三实施例中，固化处理为室温固化；将填充胶60静置在室温环境下，使填充胶60固化。
Claims (8)
- LED显示模块的封装工艺，其特征在于，包括如下步骤：a) 提供一显示模块，所述显示模块包括有PCB、LED灯珠以及驱动IC，多个所述LED灯珠设置于所述PCB的底面，多个所述驱动IC设置于所述PCB的顶面；b) 提供一底板；在所述底板的顶面从下往上依次铺设保护膜、导光膜以及围坝；c) 向所述围坝内注入液态的填充胶，并对所述填充胶进行消泡处理；d) 将所述显示模块置入所述围坝内，使所述PCB的底面、所述LED灯珠浸泡在所述填充胶中；e) 对所述填充胶进行固化处理；f) 将所述底板与保护膜进行分离；g) 对所述显示模块进行外形加工处理，切除凸出所述显示模块侧面的导光膜、填充胶、保护膜以及围坝。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，步骤c)中，所述消泡处理为真空消泡、离心消泡中的任意一者或两者结合。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，步骤d)中，所述填充胶的液面位于所述PCB的底面与顶面之间。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，步骤e)中，所述固化处理为加热固化；热量通过所述底板传递到所述填充胶，使所述填充胶升温固化。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，步骤e)中，所述固化处理为紫外固化；所述底板由透明材料制成，紫外线穿过所述底板照射到所述填充胶，使所述填充胶固化。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，步骤e)中，所述固化处理为室温固化；将所述填充胶静置在室温环境下，使所述填充胶固化。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，所述导光膜为单向反射膜，顶面为透光面，底面为反光面。
- 根据权利要求1所述LED显示模块的封装工艺，其特征在于，所述填充胶为透明胶，且透光率为90%~100%。
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544312A (zh) * | 2010-12-15 | 2012-07-04 | 日东电工株式会社 | 光学半导体器件 |
| US20130154474A1 (en) * | 2011-12-14 | 2013-06-20 | Toyoda Gosei Co., Ltd. | Light-emitting device and method of manufacturing the same |
| CN110649010A (zh) * | 2019-09-07 | 2020-01-03 | 东莞阿尔泰显示技术有限公司 | 一种显示模块的oca薄膜封装工艺 |
-
2021
- 2021-03-17 WO PCT/CN2021/081207 patent/WO2022193162A1/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544312A (zh) * | 2010-12-15 | 2012-07-04 | 日东电工株式会社 | 光学半导体器件 |
| US20130154474A1 (en) * | 2011-12-14 | 2013-06-20 | Toyoda Gosei Co., Ltd. | Light-emitting device and method of manufacturing the same |
| CN110649010A (zh) * | 2019-09-07 | 2020-01-03 | 东莞阿尔泰显示技术有限公司 | 一种显示模块的oca薄膜封装工艺 |
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