WO2022191506A1

WO2022191506A1 - Packaged implant surface modification method using plasma, and packaged implant surface modification system

Info

Publication number: WO2022191506A1
Application number: PCT/KR2022/003041
Authority: WO
Inventors: 김정성; 신태진; 김용화
Original assignee: 주식회사 코렌텍
Priority date: 2021-03-08
Filing date: 2022-03-03
Publication date: 2022-09-15
Also published as: KR20220126821A; KR102569322B1

Abstract

The present invention relates to a packaged implant surface modification method using plasma, and a packaged implant surface modification system, and, more specifically, to a packaged implant surface modification method using plasma, and a packaged implant surface modification system, the method comprising: an implant provision step of providing an implant-packaging body in plasma discharge equipment, which has a chamber therein and can discharge plasma in the chamber; an air-pressure-lowering step of discharging air from the chamber through an air vent part connected to the chamber; a current application step of applying current to the plasma discharge equipment to generate plasma; and a modification step in which the discharged plasma modifies the surface of an implant so that the surface has a hydrophilic property, wherein the implant-packaging body includes at least one implant, and the implant is connected to the plasma discharge equipment to allow current to flow therebetween so that the surface thereof is modified, and thus bones and/or adjacent tissue are easily stuck to the implant to shorten a synostosis period so that the initial stability of the implant is improved and, simultaneously, the implant can be prevented from being exposed to air and becoming polluted during surface modification of the implant.

Description

Packaged implant surface modification method and packaged implant surface modification system through plasma

The present invention relates to a packaged implant surface modification method and a packaged implant surface modification system through plasma, and more particularly, to an implant in a plasma discharge device having a chamber therein and capable of discharging plasma in the chamber. The implant providing step of providing a package, the atmospheric pressure lowering step of withdrawing air from the chamber through the air outlet connected to the chamber, the current applying step of generating plasma by applying a current to the plasma discharge device, and the discharged plasma is applied to the surface of the implant and a modifying step of modifying the to be hydrophilic, wherein the implant package includes at least one implant, wherein the implant is connected to a plasma discharge device and an electric current passes through it so that the surface is modified so that the bone and/or surrounding tissue is implanted The packaged implant surface modification method and the packaged implant through plasma that can easily adhere to the implant and shorten the osseointegration period to improve the initial stability of the implant and at the same time prevent the implant from being exposed to air and contamination during the surface modification process. It relates to a surface modification system.

Dental implants or implants used in artificial joints are fixed to the body and support the movement of the joints around the implant. These implants secure initial stability by mechanical fixation, and secure long-term stability by osseointegration that adheres to the implant or combines with the implant as the bone or surrounding tissue recovers. 1 is a view showing the stability after implantation of the implant. The dotted line in FIG. 1 indicates stability by mechanical fixation of the implant, and the dashed-dotted line indicates stability by osseointegration. Referring to FIG. 1 , although the strength due to mechanical fixation decreases over time, the bone adheres to the surface of the implant and is supported by the bone and surrounding muscle tissue. This ensures long-term stability.

The material mainly used for implants is titanium. In the body, titanium forms a titanium oxide film on the surface, and the titanium oxide film has the properties of a cathode and thus has hydrophilicity. Hydrophilicity, which allows for easy contact with water, can be expressed as a contact angle of a liquid with respect to a metal substrate when any liquid contacts the metal substrate. The contact angle is the angle between the free surface of the liquid and the solid plane when the liquid is in contact with the solid, and is determined by the cohesive force between liquid molecules and the adhesion force between the liquid and the solid. When the contact angle between the liquid and the solid plane exceeds 90˚, the solid plane can be defined as hydrophobicity, which is a property of low affinity for water, and when the liquid and the solid plane's contact angle is less than 90˚ A plane can be defined as hydrophilicity, the property of having an affinity for water.

When titanium is left in the air, carbon in the air combines with titanium oxide to suppress the hydrophilicity of the titanium film, and the hydrophilicity of the titanium film decreases, which is called biologic aging. When the hydrophilicity of the implant decreases, the bone osseointegration ability decreases and the initial stability of the implant decreases. Therefore, there is a problem in that the initial movement ability of the implanted patient is lowered. Post-rehabilitation has a significant impact on the long-term patient's exercise ability.

Therefore, a surface treatment method is required to maintain the hydrophilicity of the surface of the implant. There is a method of supplying the implant by putting the implant in saline to prevent exposure to air, but there is a disadvantage in that the shelf life of the saline is short if the quality of the implant is deteriorated when the saline is contaminated.

Next, as in Korean Patent Registration No. 10-1196171, hydrophilic surface modification can be performed by irradiating ultraviolet rays on the titanium surface of the implant. However, in the case of hydrophilic surface modification through UV, the material of the packaging material must be quartz glass in order for ultraviolet rays to pass through the packaging material surrounding the implant. In the case of a small dental implant, the implant can be placed in a quartz glass housing or case and supplied to the operation room. It has the disadvantages of high cost and poor economic feasibility.

In addition, in general, implants are supplied while surrounded by a packaging material to prevent contamination. However, when a hydrophilic treatment is performed on the surface of the implant through ultraviolet (UV) light, the sterilization state is released and contamination is caused because the packaging of the implant must be removed. there is

On the other hand, the surface can be modified by colliding particles with high energy in the plasma state onto the surface of the material. Plasma is composed of electrons, ions, and neutral particles (atoms and molecules) generated by applying high temperature and high pressure through glow plasma, arc discharge, etc., which ionizes air by electric discharge by passing electric current through gas in a state close to vacuum. It can be classified as partially ionized thermal plasma, etc., and is an aggregate of charged particles having physical electrical conductivity and collectively reacts to an external electromagnetic field.

By applying a high voltage to the gas, atoms or molecules can be ionized even at low temperatures. For example, in the case of argon (Ar) gas, at a pressure of 1 mTorr to 100 Torr, even if there is an electric field of 100 V or more per 1 cm, plasma can be generated. When a gas containing oxygen is plasmaized, positive and negative ions, single oxygen atoms, ozone, and ionized oxygen atoms are generated. By removing carbon adsorbed on the surface of the implant by plasma (radical), the hydrophilicity of the implant can be improved.

Therefore, in the art, a surface modification method that can modify the surface of the implant in a packaged state to prevent contamination by air exposure while securing initial stability during implant operation by modifying the surface of the implant to be hydrophilic through plasma are demanding

(Patent Document 1) Korean Patent Publication No. 10-1196171 (October 24, 2012)

The present invention has been devised to solve the above problems,

An object of the present invention is an implant providing step of providing an implant package in a plasma discharge device having a conductor electrode and a contact portion provided to allow current to flow with the chamber therein, and providing an implant package in the plasma discharge device provided to discharge plasma in the chamber, the chamber A step of lowering the atmospheric pressure to withdraw air from the chamber through an air outlet connected to a step of lowering the pressure, a step of applying a current to generate plasma by applying a current to the plasma discharge device, and a modifying step in which the discharged plasma reforms the surface of the implant into hydrophilicity, The implant package includes at least one implant and a first package surrounding the implant, wherein the implant is connected to a plasma discharge device and an electric current passes through it so that the surface is modified so that the bone and/or surrounding tissue is easily attached to the implant. An object of the present invention is to provide a method for modifying the implant surface through plasma that can shorten the period of osseointegration by adhesion and improve the initial stability of the implant, and at the same time, prevent the implant from being contaminated by exposure to air during the surface modification of the implant.

It is an object of the present invention, wherein the method for surface modification of the implant through the plasma further comprises a contact step of connecting the contact portion to the implant so that a current passes before the step of applying the current, the step of applying the current to the conductor electrode and the contact portion To provide a method for surface modification of an implant through plasma that generates plasma by applying an electric current so that the implant functions as an electrode and enables efficient surface modification.

An object of the present invention is that the contacting step connects the implant and the contact part in the first package so that an electric current passes through it, so that the implant functions as an electrode while the implant is packaged and the surface is modified through plasma so that the hydrophilicity of the implant does not decrease after the surface modification. An object of the present invention is to provide a method for surface modification of an implant.

An object of the present invention is that the implant package further includes a first package surrounding the implant, and the contacting step is performed by connecting the implant and the contact portion in the first package so that an electric current passes through the implant, thereby supplying an electric current to the implant through a plasma discharge device. An object of the present invention is to provide a method for modifying the implant surface through plasma that can be applied.

An object of the present invention, the contact step is to penetrate the first packaging from the outside to the inside of the contact portion extending from one side of the chamber to the inside of the chamber to contact the implant, so that it is easy to contact the implant through plasma. to provide a modification method.

It is an object of the present invention, in the contact step, one end of the contact part is brought into contact with the implant in the first package and the other end is brought into contact with the other end of the conductor post provided so as to be exposed to the outside of the first package, thereby packaging surrounding the implant. An object of the present invention is to provide a method for modifying the implant surface through plasma that can generate plasma by functioning as an electrode without damaging the implant.

An object of the present invention is that the implant providing step provides a plasma permeable part through which the plasma formed in the first package can pass to face the conductor electrode of the plasma discharge equipment so that the air in the chamber outside the first package can pass through the first package. An object of the present invention is to provide a method for surface modification of an implant through plasma, which is incident into an implant to perform surface modification of the implant.

An object of the present invention, the implant providing step provides an implant package further comprising a second package surrounding the first package from the outside of the first package into the plasma discharge device, wherein the implant providing step is the implant package In the step of removing the second packaging, the first packaging and the implant inside are provided into the plasma discharge device so that the implant in the first packaging can be surface-modified without being contaminated from the outside. will do

An object of the present invention includes at least one implant accommodated therein, a first packaging surrounding the implant and occluding the inside, and a second packaging surrounding the first packaging from the outside of the first packaging and occluding the inside. An object of the present invention is to provide an implant package in which the implant surface accommodated therein can be modified to be hydrophilic in a state in which the implant is not contaminated.

An object of the present invention is that the first package includes a conductor post provided so that one end is in contact with the implant in the first package and the other end is exposed to the outside of the first package. To provide an implant package capable of ionizing gas by functioning as an electrode in the implant.

An object of the present invention, the first packaging surrounds at least a portion of the implant and includes a plasma transmitting portion provided to allow plasma to pass through, a plasma shielding portion provided to surround at least another portion of the implant and not allowing plasma to pass through It is to provide an implant package that efficiently performs surface modification of the implant by moving plasma through the first package, including.

An object of the present invention is to generate plasma in a chamber, including an implant package, a plasma discharge device for accommodating a chamber formed inside the implant package and discharging plasma to the chamber to modify the surface of the implant in the implant package. It is to provide a packaged implant surface modification system that generates.

An object of the present invention is that the plasma discharge device is connected to a conductive electrode provided to face the inside of the chamber from one side of the inner side, a contact portion extending from one side of the chamber to the inside of the chamber, and the inner space to draw air from the inner space. It is to provide a packaged implant surface modification system including an air withdrawing unit provided, wherein a current is applied to the conductor electrode and the contact unit to generate plasma in the internal space.

An object of the present invention is a packaged implant surface modification system that allows the implant to function as an electrode by penetrating the first package from the outside to the inside and allowing current to pass through the implant by contacting the implant inside the first package. is to provide

It is an object of the present invention to provide a packaged implant surface modification system in which the contact part is provided to be detachable from the inside of the plasma discharge device, and the shape can be changed according to the type of the implant package.

The present invention is implemented by an embodiment having the following configuration in order to achieve the above object.

According to one embodiment of the present invention, the present invention provides an implant package in a plasma discharge device having a conductor electrode and a contact portion provided to allow current to flow with the chamber therein, and provided to discharge plasma in the chamber. a step of providing an implant, a step of lowering the atmospheric pressure of withdrawing air from the chamber through an air outlet connected to the chamber, a step of applying a current to generate plasma by applying a current to the plasma discharge device, and the discharged plasma modifying the surface of the implant to be hydrophilic wherein the implant package includes at least one implant and a first package surrounding the implant, wherein the implant is connected to a plasma discharge device to allow current to pass through, and the surface is modified. .

According to an embodiment of the present invention, the method for surface modification of the implant through the plasma further comprises a contact step of connecting the contact portion so that the current passes with the implant before the current applying step, wherein the current applying step includes: Plasma is generated by applying a current to the conductor electrode and the contact portion.

According to an embodiment of the present invention, the contacting step is characterized in that the implant and the contact portion in the first package are connected so that an electric current passes.

According to an embodiment of the present invention, in the contacting step, a contact portion extending from one side of the chamber to the inside of the chamber penetrates the first package from the outside to the inside to contact the implant.

According to one embodiment of the present invention, in the present invention, in the contacting step, one end of the contact part is in contact with the implant in the first package and the other end is in contact with the other end of the conductor post provided to be exposed to the outside of the first package. characterized by approaching it.

According to one embodiment of the present invention, the implant providing step is characterized in that it provides a plasma transmission part through which the plasma formed in the first packaging can pass so as to face the conductor electrode of the plasma discharge device.

According to an embodiment of the present invention, in the present invention, the implant providing step provides an implant package further comprising a second package surrounding the first package from the outside of the first package into the plasma discharge device, the implant The providing step is characterized in that it comprises the steps of removing the second package from the implant package, and providing the first package and the implant inside the plasma discharge device.

According to an embodiment of the present invention, at least one implant accommodated therein, a first package surrounding the implant and occluding the inside, and a first package from the outside of the first package to the inside It is characterized in that it includes a second packaging to occlude.

According to an embodiment of the present invention, the first package comprises a conductor post provided such that one end is in contact with the implant in the first package and the other end is exposed to the outside of the first package. do.

According to an embodiment of the present invention, the first packaging surrounds at least a portion of the implant and a plasma transmission unit provided to allow plasma to pass through, and surrounds at least another portion of the implant to allow plasma to pass through. It is characterized in that it includes a plasma shield that is not provided.

According to an embodiment of the present invention, the plasma transmitting part is formed of a flexible membrane, and the plasma shielding part is made of plastic.

According to an embodiment of the present invention, an implant package body, a plasma discharge device for accommodating a chamber formed therein and discharging plasma to the chamber to modify the surface of the implant in the implant package body It is characterized in that it includes.

According to one embodiment of the present invention, the plasma discharge device is connected to a conductive electrode provided to face the inside of the chamber from one side of the inside, a contact portion extending from one side of the chamber to the inside of the chamber, and the inner space. It is characterized in that it includes an air withdrawing unit provided to take out air from the inner space, and a current is applied to the conductor electrode and the contact portion to generate plasma in the inner space.

According to an embodiment of the present invention, the contact portion penetrates the first package from the outside to the inside and comes into contact with the implant inside the first package, characterized in that the current passes through the implant.

According to one embodiment of the present invention, the contact portion is in contact with the conductor post formed in the first packaging, it is characterized in that the current passes through the implant.

According to one embodiment of the present invention, the contact portion is provided so as to be detachable from the inside of the plasma discharge equipment, it is characterized in that the shape can be changed.

The present invention can obtain the following effects by the configuration, combination, and use relationship described below with the present embodiment.

The present invention provides an implant providing step of providing an implant package in a plasma discharge device having a conductor electrode and a contact portion provided to allow current to flow with a chamber therein, and providing an implant package in a plasma discharge device provided to discharge plasma in the chamber, connected to the chamber A step of lowering atmospheric pressure to withdraw air from the chamber through an air outlet, a current applying step of generating plasma by applying a current to the plasma discharge device, and a modifying step in which the discharged plasma reforms the surface of the implant to be hydrophilic; The package includes at least one implant and a first package surrounding the implant, wherein the implant is connected to a plasma discharge device and an electric current passes through it so that the surface is modified so that the bone and/or surrounding tissue easily adheres to the implant. It has the effect of improving the initial stability of the implant by shortening the period of osseointegration, and at the same time, preventing the implant from being contaminated by exposure to air during the surface modification of the implant.

The present invention, the implant surface modification method through the plasma further comprises a contact step of connecting the contact portion and the implant so that a current passes before the current applying step, wherein the current applying step is a current applied to the conductor electrode and the contact portion By applying plasma, the implant functions as an electrode, enabling efficient surface modification.

In the present invention, in the contact step, the implant and the contact part in the first package are connected so that an electric current passes through it, so that the implant functions as an electrode in the packaged state and the surface is modified so that the hydrophilicity of the implant does not decrease after the surface modification.

In the present invention, the implant package further includes a first package surrounding the implant, and the contacting step is to apply a current to the implant through a plasma discharge device by connecting the implant and the contact portion in the first package so that current passes through. produce possible effects.

In the present invention, in the contacting step, the contact portion extending from one side of the chamber to the inside of the chamber penetrates the first package from the outside to the inside to make contact with the implant, thereby making it easy to contact the implant.

In the present invention, in the contacting step, one end of the contact part is brought into contact with the implant in the first package and the other end is brought into contact with the other end of the conductor post provided to be exposed to the outside of the first package, thereby damaging the packaging surrounding the implant. Without it, the implant can function as an electrode and generate plasma.

In the present invention, in the step of providing the implant, the plasma transmitting part through which the plasma formed in the first package can pass is provided to face the conductor electrode of the plasma discharge equipment, so that the air in the chamber outside the first package enters the first package Thus, it is possible to perform surface modification of the implant.

In the present invention, the implant providing step provides an implant package further comprising a second package surrounding the first package from the outside of the first package into the plasma discharge device, wherein the implant providing step is performed in the implant package. The step of removing the second package, providing the first package and the implant inside the plasma discharge device, gives the effect that the implant in the first package is surface-modified without being contaminated from the outside.

The present invention includes at least one implant accommodated therein, a first packaging surrounding the implant and occluding the inside, and a second packaging surrounding and occluding the inside of the first packaging from the outside of the first packaging. The surface of the implant accommodated therein may be modified to be hydrophilic in the uncontaminated state.

In the present invention, the first package includes a conductor post provided so that one end contacts the implant in the first package and the other end is exposed to the outside of the first package. It functions as an electrode and has the effect of ionizing the gas.

In the present invention, the first package includes a plasma transmitting part that surrounds at least a portion of the implant and is provided to allow plasma to pass through, and a plasma shield that surrounds at least another part of the implant so that plasma cannot pass through it. Plasma moves through the first packaging to efficiently perform surface modification of the implant.

The present invention includes an implant package body, a plasma discharge device for accommodating a chamber formed inside the implant package body, and discharging plasma to the chamber to modify the surface of the implant in the implant package body to generate plasma in the chamber have an effect

According to the present invention, the plasma discharge device is connected to a conductive electrode provided to face the inside of the chamber from one side of the inner side, a contact portion extending from one side of the chamber to the inside of the chamber, and connected to the inner space to extract air from the inner space An air outlet may be included, and a current may be applied to the conductor electrode and the contact portion to generate plasma in the inner space.

The present invention has the effect of allowing the implant to function as an electrode by penetrating the first package from the outside to the inside and allowing the current to flow through the implant by contacting the implant inside the first package.

In the present invention, the contact portion is provided to be detachable from the inside of the plasma discharge device, so that the shape can be changed according to the type of the implant package.

1 is a view showing the stability after implantation of the implant;

Figure 2 is a flow chart of the implant surface modification method through plasma according to the present invention

3 is a view showing that the implant package 30 is provided to the plasma discharge device 10 in the implant surface modification method (S) through plasma according to the present invention

4 is a cross-sectional view of a plasma discharge device 10 according to an embodiment of the present invention.

5 is a cross-sectional view of the implant package 30 according to an embodiment of the present invention.

6 is a cross-sectional view of the implant package 30 according to an embodiment of the present invention.

7 is a cross-sectional view of the implant package 30 according to another embodiment of the present invention.

8 is a cross-sectional view of the implant package 30 according to another embodiment of the present invention.

9 is a flowchart of an implant providing step (S10) according to an embodiment of the present invention;

10 is a view showing the contact between the contact portion 133 and the implant 31 in the contact step (S2) according to an embodiment of the present invention.

11 is a view showing the connection between the contact portion 133 and the implant 31 through the conductor post 335 in the contact step (S2) according to an embodiment of the present invention.

12 is a flowchart of an implant surface modification method through plasma according to another embodiment of the present invention;

13 is a view showing that plasma proceeds to the surface of the implant 31 in the reforming step (S7) according to an embodiment of the present invention;

14 is a view comparing the contact of water to the implant surface treated according to an embodiment of the present invention and the implant surface that is not surface treated.

Hereinafter, preferred embodiments of the implant surface modification method through plasma according to the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. Unless otherwise defined, all terms in this specification have the same general meaning as understood by those of ordinary skill in the art to which the present invention belongs, and in case of conflict with the meaning of the terms used in this specification, the According to the definition used in the specification.

Throughout the specification, when a part "includes" a certain component, it does not exclude other components unless otherwise stated, and it means that other components may also be further included, The described terms such as “~ unit” mean a unit that processes at least one function or operation. In addition, when it is said to be "connected" between certain components, it is not limited to being fastened in direct contact with each other, but includes fastening through other components, and can transmit a predetermined force or energy even if it is not fastened. It may mean that it is placed so that Hereinafter, the present invention will be described in detail by describing preferred embodiments of the present invention with reference to the accompanying drawings.

Figure 2 is a flow chart of the implant surface modification method (S) through plasma according to an embodiment of the present invention. The implant surface modification method (S) through plasma improves the initial stability of the implant by shortening the period of osseointegration by modifying the surface of the implant to be hydrophilic while the implant is packaged and sealed, so that the bone and/or surrounding tissues easily adhere to the implant. At the same time, it is possible to prevent contamination of the implant from exposure to air during the surface modification process of the implant. The implant surface modification method (S) through the plasma includes an implant providing step (S1), a contact step (S2), a pressure drop step (S3), a current application step (S5) and a modification step (S7).

Prior to describing the implant surface modification method (S) through plasma below, the plasma discharge device 10 and the implant package body 30 used in the implant surface modification method (S) through plasma with reference to FIGS. 3 to 8 . ) will be explained. The plasma discharge device 10 is provided to discharge plasma in the chamber and accommodates the implant packaging body 30 and can modify the surface of the implant to be hydrophilic through plasma discharge from the inside. As shown in Figure 3, the implant package 30 is accommodated in the plasma discharge device 10 when the surface is modified, at least one or more implants can be modified to have a hydrophilic surface in the plasma discharge device 10, Preferably, the implant may be provided into the plasma discharge device 10 in a packaged state. The plasma discharge device 10 includes a housing 11 , a chamber 12 , a discharge unit 13 , and an air outlet 15 .

3 and 4, the housing 11 constitutes the overall appearance of the plasma discharge device 10, and forms an opening on one side and closes the opening by operating a button, etc. The chamber 12 formed in the space may be provided to be sealed. The housing 11 preferably has a predetermined size so that the implant package 30 used for artificial joint surgery is accommodated therein.

The chamber 12 is formed in the inner space of the plasma discharge device 10 and can be blocked from the outside by being sealed by the housing 11 . An implant package 30 to be described later is accommodated in the chamber 12 , and plasma is discharged by an electric current in the chamber 12 to modify the implant surface to be hydrophilic. The atmospheric pressure inside the chamber 12 may be lowered to close to vacuum by an air outlet 15 to be described later, and preferably, a pressure of about 3 torr may be maintained.

The discharge unit 13 is provided so that current can be applied inside the plasma discharge device 10 . The discharge unit 13 is formed of a conductor through which current can flow, and may have a metal plate having a predetermined width or a bent metal plate. The discharge unit 13 may have a protruding shape to contact the implant so that the implant accommodated in the chamber 12 can function as an electrode during discharge. In a preferred embodiment of the present invention, the implant package 30 is accommodated in the chamber 12, and at this time, the size corresponding to or larger than the plane of the implant package 30 or the area projected on the implant package 30 is orthogonal. A discharging unit having an excitation may be formed. When a current is applied to the discharge unit 13 through an external power source, the discharge unit 13 functions as an electrode to discharge plasma in the chamber 12 . The discharge unit 13 includes a conductor electrode 131 and a contact unit 133 .

The conductor electrode 131 is provided so as to face the chamber 12 side from one inner side of the plasma discharge device 10 . In one embodiment of the present invention, the conductive electrode 131 may be provided on one surface of the housing to face the chamber from the upper side of the chamber 12, and may be provided to face the inside of the chamber 12 at another position within the chamber. may be The conductor porcelain 131 may extend while having the shape of a plate. The conductive electrode 131 preferably extends over a larger area than the implant or implant package accommodated in the chamber 12 .

The contact part 133 is provided so that current flows while facing the chamber 12 side from the other side of the inside of the plasma discharge device 10. 31) to allow current to flow through the implant. The implant may be made of a conductive material, preferably titanium, so that the implant functions as an electrode when the current is applied after being connected to the contact portion 133 to allow current to flow through the chamber 12 or the air in the implant packaging body 30 . may be ionized to generate plasma. To this end, as shown in FIG. 4 , the contact part 133 may be formed to extend from one side of the chamber to the inside of the chamber. The contact portion 133 may be formed in a probe shape extending from the bottom or one side of the chamber 12 toward the chamber 12 in which the implant package 30 is accommodated, and may be formed in a probe shape that extends while having a constant cross-sectional area. It may be formed in the shape of a post. The contact portion 133 may penetrate the first packaging 33 from the outside to the inside and contact the implant 31 in the first packaging so that an electric current flows through the implant. The contact portion 133 may be in contact with the conductor post formed in the first packaging to allow current to flow through the implant. In addition, the contact portion 133 is provided so as to be detachable inside the plasma discharge device 10, the probe shape and the post shape change depending on the type of the implant package 30 accommodated in the plasma discharge device 10, so that the implant and may be contacted.

The conductor electrode 131 and the contact portion 133 function as an anode and a cathode when a current is applied, so that the gas in the chamber under a predetermined pressure is ionized into plasma. The conductive electrode 131 and the contact portion 133 may be made of a metal material. Plasma discharge may be DC glow discharge through direct current, AC or RF glow discharge through AC voltage application. In a preferred embodiment of the present invention, a high-voltage current is applied to the conductor electrode 131 and the contact portion 133 in alternating current so that plasma can be discharged from the chamber 12 in a state close to vacuum.

The conductor electrode 131 may be provided to face the contact portion 133 . In one embodiment of the present invention, the conductive electrode 131 is provided facing downward from the upper side of the chamber 12 , and the contact portion 133 faces upward from the lower side of the chamber 12 to face the conductor electrode 131 . In another embodiment of the present invention, if the conductive electrode 131 is provided on one side of the chamber 12, the contact portion 133 may be provided while facing the inside from the opposite side of the chamber 12. have. In another embodiment of the present invention, the conductor electrode 131 and the contact portion 133 may be provided so as not to face each other.

The air outlet 15 may be connected to the chamber 12 of the plasma discharge device to extract or supply air from the chamber 12 . The air outlet 15 is connected in fluid communication with the chamber 12 . The air outlet 15 may lower the atmospheric pressure of the chamber 12 to close to vacuum by withdrawing the gas from the chamber 12 to the outside or a space configured separately from the chamber 12 through a vacuum pump or the like. The gas in the chamber 12 whose atmospheric pressure is lowered by the air outlet 15 may be ionized into plasma when a current is applied to the conductor electrode 131 and the contact portion 133 .

Next, the implant package 30 accommodated in the plasma discharge device 10 of the present invention will be described with reference to FIGS. 5 to 8 . The implant package 30 is provided in the plasma discharge device 10 so that the surface of the implant can be modified to be hydrophilic by the plasma discharged from the chamber 12 . The implant package 30 may include at least one implant 31 , a first package 33 , a fixing member 34 , and a second package 35 . In a preferred embodiment of the present invention, the implant package 30 accommodated in the plasma discharge device 10 is provided with the implant 31 accommodated therein so that the implant 31 is not contaminated by external contaminants. can be

The implant 31 is provided to the plasma discharge device 10 in the implant package 30, and the surface is modified by the implant surface modification method (S) through plasma according to the present invention. The implant 31 may be a dental implant or an implant used in an artificial joint. The implant may preferably have a titanium surface. The implant 31 may have a porous surface. In this case, the surface of the implant 31 may be modified without contacting the inner surface of the plasma discharge device 10 . As can be seen in FIG. 5 , the implant 31 is accommodated in the first packaging 33 , and the first packaging 33 surrounds the outside of the implant 31 so that contamination is prevented from external contaminants. can be prevented. The implant 31 may be double packaged by the second packaging 35 .

The first packaging 33 may be formed to surround the implant 31 . The first packaging 33 may be provided to prevent contamination of the implant 31 . The first package 33 may be provided into the plasma discharge device 10 while accommodating the implant 31 therein. Contamination of the implant by the first packaging 33 after the surface modification of the implant 31 can be prevented. The first package 33 may include a plasma transmitting part 331 and a plasma shielding part 333 .

5 and 6 , the plasma transmitting part 331 surrounds at least a portion of the implant 31 and is provided to configure the packaging of the implant 31 . The plasma transmitting part 331 may be formed of a material through which plasma can pass. In a preferred embodiment of the present invention, the plasma transmitting part 331 may be formed of a flexible membrane. The plasma transmitting part 331 may be provided so that air passes through the implant packaging body 30 inside and outside, and foreign substances such as bacteria and dust do not pass through. The plasma transmitting part 331 may be formed to prevent external moisture from entering the inside while discharging the internal moisture to the outside. The plasma transmitting part 331 may be provided with moisture permeable paper. Moisture inside may be discharged to the outside, and the discharged plasma may pass through the moisture permeable paper and proceed toward the implant 31 . In another embodiment of the present invention, the plasma transmitting part 331 may be provided in both directions rather than in one direction of the implant. When the plasma transmitting part 331 is provided on both sides of the implant 31, for example, on the upper and lower sides, the plasma transmitting part 331 may be provided to face the first conductive electrode 131 and the second conductive electrode 133, Surface modification by plasma can be further promoted. In this case, the plasma generated by the ionization of air in the inner space 12 proceeds to the inside of the implant package 31 through the plasma transmitting part 331 to modify the surface of the implant 31 .

The plasma shield 333 surrounds another portion of the implant 31 and constitutes the packaging of the implant 31 . The plasma shield 333 may be made of a plastic that plasma cannot pass through, and preferably may be a blister packaging made of a PET (polyethylene terephthalate) or PVC (polyvinyl chloride) plastic pack. The second packaging 333 may be provided to be relatively hard compared to the first packaging 331 to maintain the overall appearance of the first packaging 33 . The plasma shield 333 may have an atypical shape, and may have a substantially complementary shape to the implant 31 accommodated therein. At least a portion of the plasma transmitting part 331 and the plasma shielding part 333 may be provided to be detachable from each other. In a preferred embodiment of the present invention, the plasma transmitting part 331 formed of a moisture permeable paper is provided to be removable from the plasma shielding part 333 formed of plastic, so that the implant 31 after surface modification of the implant is first packaged ( 33) can be taken out from within.

Referring to another embodiment of the present invention shown in FIGS. 7 and 8 , the first packaging 33 may further include a conductor post 335 . The conductor post 335 may be provided such that one end contacts the implant in the first package and the other end is exposed to the outside of the first package. The conductor post 335 may function as a medium connecting the inside and the outside of the first packaging 33 so that current passes between the implant 31 and the outside of the first packaging 33 surrounding the implant 31 . . As will be described later, the conductor post 335 is disposed between the contact portion 133 and the implant 31 through one end contacting the implant 31 as the other end exposed to the outside of the first packaging 33 comes into contact with the contact portion 133 . current can pass through. In another embodiment of the present invention, the other end of the conductor post 335 may extend to the outside of the second packaging 35 so that the other end is exposed to the outside of the second packaging 35 .

The fixing member 34 may be provided to fix the implant 31 between the first packaging 33 and the implant 31 described above. The fixing member 34 may be composed of a plurality of elements, but as a single element connected to each other, the implant 31 is fixed between the implant 31 and the first packaging 33 for packaging the implant 31 . You may. The fixing member 34 prevents movement or shaking of the implant 31 , such as a filler or a reinforcing material. A porous structure may be formed on at least a portion of the surface of the implant 31 , and as the implant 31 shakes in the first packaging 33 or collides with the first packaging 33 , the surface may collect on the surface. or the porous structure may be damaged. The fixing member 34 can prevent damage to the implant by fixing the implant 31 in the first packaging 33 .

The fixing member 34 may be formed while having a structure through which plasma can pass. As can be seen in FIGS. 5 to 8 , the fixing member 34 may be provided so that plasma can flow into the space between the fixing members by being formed by a set of a plurality of elements spaced apart from each other, and the fixing members are separated from each other. Even if it is formed integrally connected, it may have voids and/or empty spaces so that plasma can communicate from the outside of the fixing member to the implant 31 on the inside. The structure through which the plasma formed in this way can pass is preferably facing the plasma transmitting part 331, and the plasma flowing into the first package 33 through the plasma transmitting part 331 to be described later can modify the implant surface. .

The second packaging 35 may be formed to surround the first packaging 33 . The second packaging 35 may be provided to prevent contamination of the implant 31 as in the case of the first packaging 33 . In the operating room, it is important not to contaminate the patient's body. For this purpose, the first packaging 33 and the implant 31 may be provided into the operating room with the first packaging 33 and the implant 31 accommodated in the second packaging 35, and the second packaging ( After 35) is removed, the first package 33 and the implant 31 may be provided to the plasma discharge device 10 . In another embodiment of the present invention, the first packaging 33 and the second packaging 35 for packaging the implant 31 may also be provided to the plasma discharge device 10 together. The second packaging 35 may include a plasma transmitting part 351 and a plasma shielding part 353 .

The plasma transmission part 351 is provided to surround at least a portion of the first packaging 33 and constitute an outer packaging of the implant 31 . The plasma transmitting part 351 may be formed of a material through which plasma can pass. In a preferred embodiment of the present invention, the plasma transmitting part 351 may be provided with a moisture permeable paper. The plasma transmissive part 351 may be configured to face the plasma transmissive part 331 . In another embodiment of the present invention, the plasma transmitting part 351 may be provided in both directions rather than in one direction of the implant.

The plasma shield 353 surrounds another portion of the first packaging 33 and constitutes the outer packaging of the implant 31 . The plasma shield 353 may be made of a plastic that plasma cannot pass through, and may preferably be a blister packaging made of a PET (polyethylene terephthalate) or PVC (polyvinyl chloride) plastic pack. As in the case of the first packaging 33 , the plasma transmitting part 351 and the plasma shielding part 353 may be provided such that at least a portion thereof is detachable from each other.

Referring back to Figure 2, the implant providing step (S1) is a step of providing the implant package 30 in the plasma discharge device 10, as described above, at least one or more implants 31 are plasma discharge device ( 10) can be hydrophilic surface-modified within. In this case, the plasma transmitting part 331 may be provided to face the conductor electrode 131 or the contact part 133 in the chamber 12 . The plasma transmitting unit 331 is preferably provided in the chamber 12 to face upward in the implant providing step (S1) so that the discharged plasma can proceed into the first package 33 through the plasma transmitting unit 331 . In one embodiment of the present invention, the implant providing step (S1) is provided so that at least a part of the plasma can pass through, the implant package body 30 further comprising a first package 33 surrounding the implant 31. ) may be provided in the plasma discharge device 10 . In addition, in the implant providing step (S1), the plasma transmitting part 331 of the first packaging 33 may be provided to face the conductor electrode 131 in the internal space of the plasma discharge device.

Referring to FIG. 9 , the implant providing step (S1) includes removing the second package from the implant package as described above (S11), and providing the first package and the implant inside the plasma discharge device (S13). ), including, after removing the second packaging 35, the surface of the implant 31 in the first packaging 33 can be modified. In another embodiment of the present invention, the second packaging 35 is provided in the plasma discharge device 10 together with the first packaging 33 and the implant 31 without going through the step (S11) of removing the second packaging. You may.

Referring to FIGS. 10 and 11 , the contacting step S2 is a step of connecting the above-described contact portion 133 and the implant 31 so that current passes through them. At this time, as shown in FIG. 10 , the probe-shaped contact portion 133 penetrates the first packaging 33 and penetrates the first packaging from the outside to the inside, thereby making contact with the implant 31 so that current flows. To this end, the contact portion 133 may be formed to extend from one side of the chamber to the inside of the chamber. In another embodiment of the present invention, as shown in FIG. 11 , the contact portion 133 is in contact with the end of the conductor post 335 formed in the first packaging 33 so that current can pass through the implant 31 . have. In the contact step S2 according to the present invention, the contact portion 133 may be replaced depending on whether the conductor post 335 is provided in the first package 33 of the received implant package 30 . Accordingly, the contacting step ( S2 ) may include a step (not shown) of replacing the contact part 133 before the contact part comes into contact.

The air pressure lowering step (S3) is a process of withdrawing air from the chamber 12 through the air outlet 15 connected to the chamber of the plasma discharge device 10, and the air pressure so that the chamber 12 has an atmospheric pressure close to vacuum. to facilitate the generation of plasma. In a preferred embodiment of the present invention, the chamber 12 may have an atmospheric pressure of about 3 torr through the air outlet 15 .

In another embodiment of the present invention, as shown in Fig. 12, the contact step (S2) may be performed after the atmospheric pressure lowering step (S3). After the air pressure in the chamber 12 is lowered through the air outlet 15 , the contact portion 133 comes into contact with the implant 31 or is connected through a conductor post 335 between the contact portion 133 and the implant 31 . can be connected to conduct current.

The current application step (S5) is a process of generating plasma by applying a current to the plasma discharge equipment. By applying a current to the conductor electrode 131 and the contact portion 133 , the gas in the chamber 12 in a state close to vacuum is ionized into plasma. DC glow discharge through DC or AC or RF glow discharge through application of AC voltage may be performed. In a preferred embodiment of the present invention, a high-voltage current is applied to the conductor electrode 131 and the contact portion 133 as AC. By doing so, the plasma can be discharged in the chamber 12 in a state close to vacuum.

The reforming step (S7) is a process in which the discharged plasma reforms the surface of the implant 31 to be hydrophilic. In a preferred embodiment of the present invention, oxygen in the chamber 12 may be ionized to generate a plasma including ozone. As the implant 31 in the first packaging 33 functions as an electrode, even if the implant is blocked from the outside by the first packaging 33, a strong voltage is applied between the implant 31 and the conductor electrode 131. Accordingly, the gas inside the first package 33 may be ionized to generate plasma. Plasma removes carbon on the titanium surface from the inside of the first package 33, so that the surface of the implant can be modified to be hydrophilic. In another embodiment of the present invention, the first packaging 33 of the implant package 30 is composed of a plasma transmitting portion 331 through which plasma can pass and a plasma shielding portion 333 through which plasma cannot pass. In this case, as shown in FIG. 13 , the plasma formed by ionizing the gas in the chamber 12 and/or the first packaging 33 flows between the conductor electrode 131 and the contact portion 133 by an electric field, in this process The plasma transmission portion 331 of the first package 33 can pass through the plasma so that the plasma can proceed to the inside of the first package 33 . Furthermore, since the plasma shield 333 is formed of a material through which plasma cannot pass, the surface of the implant may be further modified by the plasma returning after colliding with the plasma shield 333 .

Accordingly, the initial stability of the implant can be secured by allowing the bone and surrounding tissues growing around the implant to be more quickly merged with the implant.

Hereinafter, the effects of the present invention will be described in detail through examples. However, these examples are for illustrative purposes of one or more embodiments, and the scope of the invention is not limited to these examples.

(Example 1)

The implant 31 having a machined titanium surface is provided into the plasma discharge device 10 while being accommodated in the first package 33, and the contact part 133 is brought into contact with the implant 31 so that an electric current flows through the chamber. (12) was allowed to have a pressure of 3 torr, and an electric current was applied for 120 seconds to modify the surface of the implant. The carbon content of the implant surface-treated through the implant surface modification method (S) through the plasma and the implant without surface treatment were compared with the degree of water spreading on the implant surface, that is, the hydrophilicity of the implant surface. The surface carbon content of the surface-treated implant and the non-surface-treated implant is shown in Table 1 below, and the degree of water spreading on the implant surface is as shown in FIG. 14 . As can be seen in Table 1 and FIG. 14, the carbon content of the surface was reduced by about 50%, and the water in contact with the implant surface spread widely and the hydrophilicity was improved.

	XPS(Carbon Ratio)(%)XPS(Carbon Ratio)(%)	Decreased Ratio(%)Decreased Ratio (%)
표면처리하지 않음No surface treatment	32.2832.28	--
120초동안 표면처리Surface treatment for 120 seconds	16.2816.28	50%50%

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed as including other embodiments.

Claims

An implant providing step of providing an implant package in a plasma discharge device having a conductor electrode and a contact portion provided to allow current to pass through the chamber therein, and provided to discharge plasma in the chamber;

A pressure lowering step of withdrawing air from the chamber through an air outlet connected to the chamber;

A current application step of generating plasma by applying a current to the plasma discharge equipment; and

A reforming step in which the discharged plasma modifies the surface of the implant to be hydrophilic,

The implant package includes at least one implant and a first package surrounding the implant, wherein the implant is connected to a plasma discharge device to allow current to pass through, and the surface of the implant is modified through plasma. .
According to claim 1, wherein the implant surface modification method through the plasma further comprises a contact step of connecting the contact portion so that the current passes through the implant before the step of applying the current,

The current applying step is an implant surface modification method through plasma, characterized in that the plasma is generated by applying a current to the conductor electrode and the contact portion.
[Claim 3] The method of claim 2, wherein the contacting step connects the implant and the contact portion in the first package so that an electric current passes through them.
[4] The method of claim 3, wherein in the contacting step, a contact portion extending from one side of the chamber to the inside of the chamber penetrates from the outside of the first package to the inside to contact the implant.
[4] The plasma according to claim 3, wherein in the contacting step, the contact part is brought into contact with the other end of the conductor post provided so that one end contacts the implant in the first package and the other end is exposed to the outside of the first package. Implant surface modification method through
The method of claim 1 , wherein the implant providing step provides a plasma permeable portion through which the plasma formed in the first packaging can pass so as to face the conductor electrode of the plasma discharge device.
According to claim 1, wherein the implant providing step provides an implant package further comprising a second package surrounding the first package from the outside of the first package into the plasma discharge device, the implant providing step is the implant package Removing the second packaging from the implant, the implant surface modification method through plasma, characterized in that it comprises the step of providing the first packaging and the implant inside the plasma discharge equipment.
An implant whose surface is modified to be hydrophilic by the method of any one of claims 1 to 7.
An implant package comprising at least one implant accommodated therein, a first packaging surrounding the implant and occluding the inside, and a second packaging surrounding the first packaging from the outside of the first packaging and occluding the inside.
[10] The implant package according to claim 9, wherein the first package includes a conductor post having one end in contact with the implant in the first package and the other end exposed to the outside of the first package.
11. The method of claim 10, wherein the first package surrounds at least a portion of the implant, a plasma transmitting portion provided to allow plasma to pass through, and a plasma shielding portion provided to surround at least another portion of the implant so that plasma cannot pass through it. Implant package, characterized in that it comprises.
The implant package according to claim 11, wherein the plasma transmitting part is formed of a flexible membrane, and the plasma shielding part is made of plastic.
The implant package of any one of claims 9 to 12,

A packaged implant surface modification system including a plasma discharge device for accommodating the implant package body and a chamber formed therein, and discharging plasma to the chamber to modify the surface of the implant in the implant package body.
[Claim 14] The method of claim 13, wherein the plasma discharge device is connected to a conductive electrode provided to face the inside of the chamber from one inner side, a contact portion extending from one side of the chamber to the inside of the chamber, and the inner space to extract air from the inner space. Including an air outlet provided,

A packaged implant surface modification system, characterized in that a current is applied to the conductor electrode and the contact portion to generate plasma in the inner space.
15. The system of claim 14, wherein the contact part penetrates the first package from the outside to the inside and comes into contact with the implant inside the first package so that an electric current flows through the implant.
15. The system of claim 14, wherein the contact portion is in contact with the conductor post formed in the first package to allow an electric current to pass through the implant.
[Claim 15] The system of claim 14, wherein the contact part is provided so as to be detachable from the inside of the plasma discharge device, so that its shape can be changed.