WO2022188932A1 - Dispositif d'éclairage doté d'un corps de refroidissement - Google Patents

Dispositif d'éclairage doté d'un corps de refroidissement Download PDF

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Publication number
WO2022188932A1
WO2022188932A1 PCT/DE2022/200036 DE2022200036W WO2022188932A1 WO 2022188932 A1 WO2022188932 A1 WO 2022188932A1 DE 2022200036 W DE2022200036 W DE 2022200036W WO 2022188932 A1 WO2022188932 A1 WO 2022188932A1
Authority
WO
WIPO (PCT)
Prior art keywords
lighting device
electrically conductive
conductor tracks
heat sink
conductive substrate
Prior art date
Application number
PCT/DE2022/200036
Other languages
German (de)
English (en)
Inventor
Philippe Becker
Erich Mattmann
Original Assignee
Continental Automotive Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Technologies GmbH filed Critical Continental Automotive Technologies GmbH
Priority to DE112022001436.9T priority Critical patent/DE112022001436A5/de
Publication of WO2022188932A1 publication Critical patent/WO2022188932A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Definitions

  • the present invention relates to a lighting device with a heat sink and at least one light source.
  • a backlight is often required for image generation by an image generator of a head-up display, i.e. background lighting.
  • the backlight usually uses LEDs (LED: Light Emitting Diode; light-emitting diode).
  • LEDs Light Emitting Diode; light-emitting diode.
  • the light from the LEDs is directed through a lens system.
  • the positioning of the LEDs to the lens system, which is positioned above the LEDs, is of great importance.
  • the LEDs are operated with high currents so that the image is sufficiently bright. This leads to an enormous amount of waste heat from the LEDs, which has to be dissipated.
  • US 2019/0182994 A1 describes a head-up display with air cooling.
  • the head-up display has a head-up display module with an image generator for emitting light.
  • a heat sink is attached to the head-up display module to remove heat from the imager by conduction and to remove heat by convection.
  • the head-up display has an HVAC duct (HVAC: heating, ventilation and air conditioning) with an outlet. The outlet serves to direct airflow from the HVAC duct onto the heatsink.
  • HVAC heating, ventilation and air conditioning
  • a thermal connection to a heat sink can be implemented instead of air cooling.
  • the LEDs are mounted on a printed circuit board. This printed circuit board can be thermally connected to the heat sink by means of a thermally conductive medium.
  • DE 100 16 817 A1 describes a color head-up display in which the light from a light source is sent through an at least partially translucent display and is projected onto a pane.
  • a heat dissipation device with a copper carrier is provided for cooling the light-emitting diodes.
  • the thermal connection to the copper carrier is made with a conductive adhesive or a layer of solder.
  • DE 102004 013 680 A1 describes a light source with a lighting module and a control module with control electronics.
  • the light-emitting module and the control module each have their own carrier element, which is connected to a common carrier so that it can be fastened to one another.
  • the light-emitting module is connected to the control module by means of first electrical lines, which are designed in such a way that thermally caused relative movements between the control module and the light-emitting module are absorbed by the deformation of the lines in a non-destructive manner.
  • DE 102017 130 362 A1 describes an electronic assembly with a thermally conductive heat sink and an electronic component attached to the heat sink.
  • the heat sink is designed to dissipate heat generated by the electronic component.
  • the electronic assembly is produced by creating an electrically non-conductive surface layer in at least one area of the surface of the heat sink by treating the surface of the heat sink and attaching the electronic component to the heat sink, preferably on the surface of the heat sink, in particular on the electrically non-conductive surface layer of the heat sink.
  • KR 10 1 055 383 B1 describes an optical assembly for a lighting device.
  • a groove is made on one side of a substrate.
  • an insulating layer is formed on at least one surface of the substrate, excluding the side where the Groove is formed.
  • An electrode layer is formed on top of the insulating layer.
  • An optical element is formed on top of the substrate and is electrically connected to the electrode layer.
  • a lighting device has:
  • the conductor tracks for the lamps are coated directly onto the heat sink.
  • the lighting means are arranged directly on the electrically conductive substrate. This creates a thermally more direct contact between the lamps and the heat sink, especially since the substrates are metal-based and can be very thin.
  • there is no printed circuit board so that the handling of a heat-conducting medium is no longer necessary during the manufacture of the lighting device.
  • the structural height is reduced.
  • the electrical poles of the lamps are each connected to a suitable conductor track.
  • the various conductor tracks connected to one another by means of the light-emitting diodes are provided with associated connection lines, for which electrical contacting is provided in each case.
  • the conductor tracks are formed by flat areas of the electrically conductive substrate. This has the advantage that there is a certain amount of leeway for the placement of the light source on the heat sink, as long as the electrical poles of the light source are each connected to a suitable conductor track. In addition, the planar design of the conductor tracks reduces the demands on the accuracy of production.
  • At least the electrically conductive substrate is applied by means of cold gas spraying.
  • Cold gas spraying also known as “cold gas technology” or “cold gas spraying”
  • Cold gas spraying can be used to apply very homogeneous and dense layers, especially metallic layers. The physical and chemical properties of these metallic layers hardly differ from those of the metal used. Another great advantage is that the metal sprayed on is not melted or melted during the process. This minimizes the thermal influence on the layer and the heat sink.
  • the insulating substrate can also be applied by means of a spraying process. In this case, a method is preferably selected that allows the spray material to melt, in order to thermally support mechanical clawing when it hits the heat sink.
  • the insulating substrate includes an aluminum oxide layer.
  • Aluminum oxide is a very good insulator and also has good thermal conductivity.
  • the thickness of the aluminum oxide layer can be, for example, of the order of about 125 ⁇ m.
  • the electrically conductive substrate comprises an aluminum layer and a copper layer. Both materials can be easily applied by cold gas spraying.
  • the copper layer facilitates the electrical connection of the lamp and is also characterized by high electrical conductivity.
  • the aluminum layer improves the adhesion of the copper compared to direct copper application, resulting in better long-term stability.
  • the thickness of the aluminum layer can, for example of the order of about 250 gm, that of the copper layer of the order of about 50 ⁇ m.
  • the lighting means are soldered to the conductor tracks. In this way, both a very good electrical connection and a very good thermal connection are achieved.
  • the lighting means are light-emitting diodes.
  • the use of a large number of light-emitting diodes as lighting means makes it possible to realize planar lighting on the heat sink, as is required for a backlight of a display device, for example.
  • the lighting device is designed as a backlight for an image generator.
  • the very smooth and flat surface of the heatsink leads to a very good alignment of the light-emitting diodes relative to each other along the z-axis. This leads to better optical performance of the image generator, which is particularly important when used in a head-up display.
  • the number of parts in the production line is also reduced to one assembly.
  • Such an image generator is preferably used in a head-up display for a means of transportation.
  • FIG. 1 schematically shows a lighting device according to the invention
  • FIG. 2 schematically shows a section through the lighting device from FIG. 1 ; and Fig. 3 shows schematically a backlight for an image generator of a
  • the lighting device 1 comprises a heat sink 2 on which an insulating substrate 3 is arranged.
  • An electrically conductive substrate 4 is arranged on the insulating substrate 3 .
  • the electrically conductive substrate 4 is structured in such a way that it forms conductor tracks 5 for a light source 6, which are coated directly onto the heat sink 2.
  • the conductor tracks 5 for the lighting means 6 are formed by flat areas of the electrically conductive substrate 4 .
  • FIG. 2 schematically shows a section through the lighting device 1 from FIG. 1 .
  • the heat sink 2 can again be seen with the insulating substrate 3 arranged on it and the electrically conductive substrate 4.
  • the electrically conductive substrate 4 forms two separate conductor tracks 5, with which the two poles of the light-emitting diode 60 are connected by means of the soldered connection 7 are. Since the two substrates 3, 4 are metal-based and can be made very thin, there is very good heat dissipation.
  • the insulating substrate 3 includes an aluminum oxide layer 30. Aluminum oxide is a very good insulator and also has good thermal conductivity. The thickness of the aluminum oxide layer 30 can be, for example, of the order of about 125 ⁇ m.
  • the electrically conductive substrate 4 here comprises an aluminum layer 40 and a copper layer 41 .
  • the copper layer 41 facilitates the electrical connection of the illuminant 6 and is also characterized by high electrical conductivity.
  • the thickness of the aluminum layer 40 can be, for example, on the order of about 250 ⁇ m, and that of the copper layer 41 on the order of about 50 ⁇ m.
  • the electrically conductive substrate 4 can be applied, for example, by means of cold gas spraying. With this technology, very homogeneous and dense layers can be applied, especially metallic layers. The physical and chemical properties of these metallic layers hardly differ from those of the metal used. However, other coating technologies are also possible.
  • the insulating substrate 3 can also be applied by means of plasma spraying.
  • the lighting device 1 comprises a multiplicity of light-emitting diodes 60 as lighting means 6.
  • the very smooth and flat surface of the heat sink 2 leads to a very good alignment of the light-emitting diodes 60 relative to one another along the z-axis. This leads to better optical performance of the image generator, which is particularly important when used in a head-up display.
  • the insulating substrate 3 occupies a large continuous area of the heat sink 2, while the electrically conductive substrate 4 is divided into a plurality of flat areas through which the conductor tracks 5 are formed.
  • the flat design of the conductor tracks 5 has the advantage that there is a certain amount of leeway for the placement of the lamps 6 on the heat sink 2 as long as only the electrical poles of the lamps 6 are each connected to a suitable conductor track 5 .
  • the various conductor tracks 5 connected to one another by means of the light-emitting diodes 60 are provided with associated connection lines 9, for which an electrical contact 8 is provided in each case.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage (1) ayant un corps de refroidissement (2) et une pluralité de moyens d'éclairage (6). Un substrat isolant (3) et un substrat électriquement conducteur (4) sont disposés sur le corps de refroidissement (2). Le substrat électriquement conducteur forme des pistes conductrices (5). La pluralité de moyens d'éclairage (6) est disposée sur le substrat électriquement conducteur (4) et est électriquement connectée aux pistes conductrices (5). Les moyens d'éclairage (6) sont reliés entre eux par l'intermédiaire des pistes conductrices (5).
PCT/DE2022/200036 2021-03-11 2022-03-08 Dispositif d'éclairage doté d'un corps de refroidissement WO2022188932A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112022001436.9T DE112022001436A5 (de) 2021-03-11 2022-03-08 Beleuchtungsvorrichtung mit Kühlkörper

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021202388.6A DE102021202388A1 (de) 2021-03-11 2021-03-11 Beleuchtungsvorrichtung mit Kühlkörper
DE102021202388.6 2021-03-11

Publications (1)

Publication Number Publication Date
WO2022188932A1 true WO2022188932A1 (fr) 2022-09-15

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Application Number Title Priority Date Filing Date
PCT/DE2022/200036 WO2022188932A1 (fr) 2021-03-11 2022-03-08 Dispositif d'éclairage doté d'un corps de refroidissement

Country Status (2)

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DE (2) DE102021202388A1 (fr)
WO (1) WO2022188932A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10016817A1 (de) 2000-04-05 2001-10-18 Mannesmann Vdo Ag Farb-Head-up Display, insbesondere für ein Fahrzeug
DE102004013680A1 (de) 2004-03-18 2005-10-20 Siemens Ag Lichtquelle für Bilderzeugungseinheit
KR101055383B1 (ko) 2010-03-15 2011-08-08 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
EP2843719A2 (fr) * 2013-08-30 2015-03-04 Toshiba Lighting & Technology Corporation Dispositif électroluminescent
US20170018697A1 (en) * 2014-04-04 2017-01-19 Sharp Kabushiki Kaisha Substrate for light emitting devices and light emitting device
US20170040519A1 (en) * 2014-04-23 2017-02-09 Sharp Kabushiki Kaisha Light-emitting device substrate, light-emitting device, and method for manufacturing light-emitting device substrate
KR20190022101A (ko) * 2017-08-25 2019-03-06 엘지이노텍 주식회사 발광 소자 패키지, 발광 소자 패키지 제조 방법 및 광원 장치
US20190182994A1 (en) 2017-12-13 2019-06-13 Panasonic Automotive Systems Company Of America, Division Of Panasonic Corporation Of North America Head up display cooling
DE102017130362A1 (de) 2017-12-18 2019-07-11 Valeo Schalter Und Sensoren Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe, Bilderzeugungsvorrichtung, Head-Up-Display und Fahrzeug mit Head-Up-Display

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10016817A1 (de) 2000-04-05 2001-10-18 Mannesmann Vdo Ag Farb-Head-up Display, insbesondere für ein Fahrzeug
DE102004013680A1 (de) 2004-03-18 2005-10-20 Siemens Ag Lichtquelle für Bilderzeugungseinheit
KR101055383B1 (ko) 2010-03-15 2011-08-08 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
EP2843719A2 (fr) * 2013-08-30 2015-03-04 Toshiba Lighting & Technology Corporation Dispositif électroluminescent
US20170018697A1 (en) * 2014-04-04 2017-01-19 Sharp Kabushiki Kaisha Substrate for light emitting devices and light emitting device
US20170040519A1 (en) * 2014-04-23 2017-02-09 Sharp Kabushiki Kaisha Light-emitting device substrate, light-emitting device, and method for manufacturing light-emitting device substrate
KR20190022101A (ko) * 2017-08-25 2019-03-06 엘지이노텍 주식회사 발광 소자 패키지, 발광 소자 패키지 제조 방법 및 광원 장치
US20190182994A1 (en) 2017-12-13 2019-06-13 Panasonic Automotive Systems Company Of America, Division Of Panasonic Corporation Of North America Head up display cooling
DE102017130362A1 (de) 2017-12-18 2019-07-11 Valeo Schalter Und Sensoren Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe, Bilderzeugungsvorrichtung, Head-Up-Display und Fahrzeug mit Head-Up-Display

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DE112022001436A5 (de) 2023-12-28
DE102021202388A1 (de) 2022-09-15

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