WO2019121084A1 - Procédé de fabrication d'un module électronique, module électronique, dispositif de production d'image, afficheur à tête haute et véhicule à afficheur à tête haute - Google Patents

Procédé de fabrication d'un module électronique, module électronique, dispositif de production d'image, afficheur à tête haute et véhicule à afficheur à tête haute Download PDF

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Publication number
WO2019121084A1
WO2019121084A1 PCT/EP2018/084093 EP2018084093W WO2019121084A1 WO 2019121084 A1 WO2019121084 A1 WO 2019121084A1 EP 2018084093 W EP2018084093 W EP 2018084093W WO 2019121084 A1 WO2019121084 A1 WO 2019121084A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
electronic assembly
display
head
electronic
Prior art date
Application number
PCT/EP2018/084093
Other languages
German (de)
English (en)
Inventor
Steffen KLARMANN
Original Assignee
Valeo Schalter Und Sensoren Gmbh
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Filing date
Publication date
Application filed by Valeo Schalter Und Sensoren Gmbh filed Critical Valeo Schalter Und Sensoren Gmbh
Publication of WO2019121084A1 publication Critical patent/WO2019121084A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for producing an electronic construction group, wherein the electronic assembly has a heat-conducting heat sink and we least one attached to the heat sink electronic component, and wherein the heat sink is designed for dissipation of heat generated by the electronic component.
  • the invention relates to an above-described electronic assembly, an image generating device, in particular for a head-up display, a head-up display with egg ner projection surface and with an image forming apparatus and a vehicle with a head-up display.
  • Head-up displays are basically known from the prior art, for example from WO 2015/159031 A1.
  • Head-up displays are display devices in which an image information to be displayed to an observer, for example a driver of a motor vehicle, is projected into his main field of view so that the observer hardly has to change his head posture or viewing direction to the displayed one
  • Head-up displays used in motor vehicles generally project information to be displayed in a line of sight of the driver on the windshield so that the image information can be perceived by the driver as superimposed image information with an image of the real environment of the motor vehicle.
  • That the driver can view the image information simultaneously with the traffic
  • Head-up displays typically comprise an image generating device for generating the image information to be displayed, an optical system and a projection surface, wherein the optical system is designed to project the generated image information to be displayed onto the projection surface so that it can be displayed the driver is visible and displayed as a readable display.
  • the projection surface can be formed by a so-called combiner, a reflective, translucent pane.
  • the combiner is usually in the main field of view of the viewer arranged so that the viewer simultaneously projected onto the combiner
  • Image information perceives and the underlying objects.
  • the image generation device of a head-up display has a customarily designed LCD display, in particular a TFT display, as well as LEDs as light sources for the required background illumination. Due to their design, LCD or TFT displays, especially when using LEDs as light sources, high transmission losses and generate during their operation a lot of heat. For a long life of the LEDs, the heat should be dissipated as much as possible to reduce the temperature load on the LEDs.
  • heat sink use as heat and reduce the electronic components to be cooled as low as possible Distance to connect to the heat sink, so that a heat transfer from the electronic component rule can be done on the heat sink and the heat can be passed through the heat sink from, for example, to the environment.
  • the aforementioned WO 2015/159031 A1 proposes, for example, the LEDs of a head-up display with the aid of a thermally conductive adhesive directly on a
  • IMS Insulated Metal Substratej printed circuit board to electrically contact
  • a printed circuit board with a metallic core or Support which is coated with an electrically insulating layer, on which the conductor tracks and contacts are applied.
  • an object of the invention to provide an alternative method for producing an electronic assembly with a heat-conducting heat sink and at least one attached to the heat sink electronic component, in particular a method which allows a simplified contacting of the electronic components to be cooled. Furthermore, it is an object of the invention to provide an alternative assembly, in particular improved and / or a simpler and thus more cost-effective to manufacture assembly and an alternative, in particular the improved image forming apparatus, an alternative, in particular improved head-up display and a vehicle with such a head-up display.
  • An inventive method for producing an electronic assembly having a heat-conducting heat sink and at least one fixed to the heat sink electro-American component, wherein the heat sink is designed for dissipation of a heat generated by the electro-magnetic component is characterized by the steps:
  • Attaching the electronic component on the heat sink preferably on the surface of the heat sink, in particular on the electrically non-conductive surface layer of the heat sink.
  • the inventive generating an electrically non-conductive surface layer in at least a portion of the surface of the heat sink by a Oberflä chen adaptation of the heat sink can be produced in a particularly simple and reliable manner, in particular in a reproducible manner, an electrically non-conductive surface layer on the heat sink surface become.
  • a defined, electrically non-conductive surface layer with defi ned layer thickness can be generated in this way, which is not only electrically non-conductive, but also still has a defined thermal conductivity.
  • the heat sink has an electrically nonconductive surface layer
  • the application of an additional insulating layer to the heat sink prior to the application of electrical contacts is no longer necessary since this function, i. the electrical insulation of the heat sink, can be met by the electrically non-conductive surface layer of the heat sink. That Compared to IMS printed circuit boards, the required insulation layer can be omitted. This saves costs.
  • an improved heat transfer can be achieved by attached to the heat sink construction share in the heat sink.
  • electrically non-conductive surface layers with layer thicknesses of only 20 pm to 30 pm and a thermal conductivity of more than 10 W / mK can be achieved, in particular with more than 13 W / mK, while the insulation layers of the prior art usually have a layer thickness of about 70 pm and only a thermal conductivity of about 1 W / mK to a maximum of 9 W / mK.
  • a method according to the invention enables a particularly simple fastening movement of the electronic components on the heat sink, in particular a fastening with good heat conduction properties.
  • a "heat sink” in the sense of the present invention is a thermally conductive component, which is in particular designed to emit a heat introduced into the heat sink to the environment.
  • a heat sink according to the invention can serve, in particular, to enlarge a heat-emitting surface of a heat-producing component, wherein the heat sink is preferably designed to be connected directly to the heat-producing component in order to allow the best possible heat transfer from the heat-producing component into the heat sink.
  • the heat sink of an electronic assembly according to the invention is preferably solid and preferably has a metallic base material or consists of or contains metal particles.
  • the heat sink contains aluminum and / or copper and / or silver and / or another material with good heat-conducting properties or consists of one, wherein the heat sink preference, a thermal conductivity of> 200 watts / mK has.
  • the heat sink may alternatively or additionally also have one or more ceramic materials or be it be.
  • a "surface treatment" of the heat sink in the context of the present inven tion is understood to mean a treatment of the surface of the heat sink, in wel cher the existing, natural surface layer of the heat sink, with or without Zuhil fe salad of auxiliaries such. Electrolytes or the like, at least partially in ei ne electrically non-conductive layer is converted, in particular in a defined, electrically non-conductive surface layer.
  • the mere application of an additional layer for producing the electrically non-conductive surface layer on thedekör, for example, the application of a dielectric as an insulating layer is NOT a surface treatment in the context of the present invention.
  • the inventive generating the electrically non-conductive surface layer is carried out, in particular in aluminum, preferably by anodizing, in particular by hard anodizing, and / or by plasma treatment.
  • anodizing in particular by hard anodizing, and / or by plasma treatment.
  • plasma treatment can be used with which the existing surface layer of the heat sink can be at least partially converted into an electrically non-conductive layer, in particular in a defined, electrically non-conductive de surface layer.
  • “Anodizing” in the context of the present invention is understood to mean a process in which the surface is electrolytically oxidized, in particular by anodic Oxida tion, wherein the anodization no additional layer is applied to the body to be treated, but the existing surface layer in a defined oxide layer is converted.
  • the term "anodizing” in the context of the present invention includes optionally before the anodization possibly required Maschinensschrit te surface pretreatment, as far as they are required, such as fat and / or pickling Ent, with a.
  • plasma treatment in the context of the present invention, a process is ver, in which the surface to be treated is irradiated with a plasma.
  • the production according to the invention of the electrically non-conductive surface layer takes place in the case of copper or silver, preferably by a polymer-based method.
  • An “electronic component” in the sense of the present invention is a component that is basically designed to be arranged on a printed circuit board or the like and in particular to be electrically contacted with a printed circuit board or the like, in particular with at least one printed conductor of a printed circuit board, wherein the at least one electronic component is preferably an SMD component.
  • Electronic components within the meaning of the invention are, for example, LEDs, ICs, transistors, IC components, electrical resistors, capacitors, in particular Eikos, or the like.
  • SMD Surface Mounted Device
  • An electronic assembly according to the invention is preferably ariessvor direction, in particular for a background lighting device for backlighting a backlit display device.
  • An electronic construction group according to the invention can be designed, in particular, for use in a background illumination device for an image generation device, in particular for use in an image generation device for a head-up display.
  • the at least one electronic component of an electronic construction group according to the invention is preferably a light beam emitting light source, in particular an LED.
  • LEDs are basically known from the prior art.
  • vorzugswei se means of a thermally conductive and / or an electrically conductive adhesive.
  • the at least one electronic component is preferably glued to the surface of the heat sink, in particular to the electrically non-conductive layer, particularly preferably be preferred directly and without another, electrically insulating layer in between.
  • a "thermally conductive adhesive” in the context of the present invention is an adhesive which has a thermal conductivity of> 3 W / mK, in particular of> 5 W / mK, preferably of> 10 W / mK, particularly preferably of> 15 W / mK.
  • An “electrically conductive adhesive” in the context of the invention is an adhesive which has an electrical conductivity of at least 10-10 6 S / m, preferably of at least 30-10 6 S / m, in particular of at least 50- 10 6 S / m , in each case based on room temperature.
  • a heat conductive layer for example, by applying a thin layer of thermal paste or the like and the electronic component in a different manner than by gluing ben are attached to the heat sink.
  • at least one conductor track is applied to the heat sink in a further step on the electrically non-conductive surface layer, preferably by defined Aufbrin conditions of an electrically conductive adhesive, in particular such that the applied electrically conductive adhesive forms at least one conductor track. That is, at least one conductor track is formed by electrically conductive adhesive, in which way as many tracks as necessary can be applied to the heat sink.
  • the manufactured by the surface treatment of the heat sink, electricallyebenssen notion de surface layer allows the direct application of the conductors on the cooling body, in particular without having to apply an additional layer of insulation before. This can be dispensed with without any negative effects on the heat dissipation on an IMS circuit board for contacting. Rather, the heat dissipation of the heat sink can be improved in the environment by the direct on the conductor tracks on the heat sink. On the one hand, the heat output of the heat sink in the environment can be improved by eliminating the insulation layer, on the other las sen thinner adhesive layers, in particular thinner interconnect layers, reali ren.
  • a "conductor track" in the context of the present invention is an electrically conductive connec tion preferably with two-dimensional course for the connection of electronic components on printed circuit boards for power and / or power supply and / or signal transmission and / or temperature dissipation.
  • the at least one electronic component with the at least one electrical conductor web electrically contacted, preferably by gluing, in particular by means of an electrically conductive adhesive.
  • the electronic components are bonded by means of the same adhesive material with the conductor tracks, which has been used for applying the conductor tracks, wherein the application of at least one conductor track and the bonding and / or contacting at least one electronic component with at least one Lei terbahn preferably in one Work step done.
  • An electronic assembly has a heat-conducting heat sink and at least one attached to the heat sink electronic component, wherein the cooling body is formed outgoing from a heat generated by the electronic component out.
  • the cooling body has in at least one area of its surface an electrically non-conductive surface layer produced by a surface treatment of the cooling body.
  • the electronic assembly is produced by an inventive, prescribed method wor the.
  • the electronic assembly of a lighting device in particular for a background lighting device for backlighting a backlit display device
  • the electronic assembly is preferably removable det for use in a background lighting device for an image forming apparatus, in particular for use in an image forming apparatus for a head-up display.
  • the electronic component is a light beam emitting light source, preferably a light source that emits light beams having a defined wavelength, in particular an LED.
  • an electronic assembly is at least one conductor track on the electrically non-conductive surface layer of the heat sink applied, preferably by defined application of an electrically conductive adhesive material, wherein in particular at least one conductor is formed by an electrically conductive adhesive.
  • the at least one electronic component is fixed by gluing to the heat sink, preferably by means of a thermally conductive and / or electrically conduct the adhesive.
  • the electronic component is adhesively bonded to the heat sink on the electrically non-conductive layer, preferably without an electrically insulating layer therebetween.
  • a heat conductive layer may be provided therebetween, for example, a thin layer of thermal grease or the like.
  • An image-forming device in particular for a head-up display, has at least one electronic module designed according to the invention.
  • the image forming device has a backlit display device, in particular a special LCD or TFT display, and a background lighting device, where in the at least one electronic module is part of the background lighting device and formed to backlight the display device is.
  • the at least one electronic component of the electronic assembly (30) is a light source emitting light beams (13), preferably a light source (13) emitting light beams having a defined wavelength, in particular an LED (13).
  • a head-up display according to the invention has a projection surface and an imaging device according to the invention, wherein the image generation device is designed to project an image onto the projection surface.
  • the operation of a head-up display according to the invention basically corresponds to the operation of a known from the prior art head-up display with a backlit display device.
  • a vehicle according to the invention has a head-up display according to the invention and preferably a windshield, the windshield of the vehicle in particular forming the projection surface of the head-up display.
  • FIG. 1 is a schematic representation of an embodiment of a vehicle according to the invention with a head-up display according to the invention with an inventive imaging device
  • FIG. 2 is a schematic representation in a perspective view of an embodiment of an image forming apparatus according to the invention with anintersbei game designed as a lighting device according to the invention, electronic assembly according to the invention as part of a background lighting device,
  • FIG. 3 is a schematic, greatly enlarged view of a detail of the fiction, contemporary electronic assembly of FIG. 2,
  • FIG. 4 is a schematic representation in plan view of the inventive electronic assembly of FIG. 2,
  • FIGS. 2 to 4 is a scanning electron micrograph of the electrically non-conductive, generated by hard anodizing surface layer of the heat sink of the erfindungsge MAESSEN electronic assembly of FIGS. 2 to 4,
  • FIG. 6 is a schematic sectional view of a detail of an applied to the heat sink as an adhesive layer trace
  • Fig. 7 is a scanning electron micrograph of an electrically non-conductive Oberflä chen für of a heat sink of a second embodiment of a elec tronic assembly in which the electrically non-conductive surface layer has been generated by a plasma treatment.
  • FIG. 1 shows a motor vehicle 1 according to the invention with a head-up display according to the invention, the head-up display having a projection surface 5 and an imaging device 10 according to the invention, which is designed to image the projection surface 5 of the head-up display.
  • the projection surface 5 is formed by a region of the windscreen 3 and the image generation device 10 according to the invention is integrated in a region below the windscreen 3 in a dashboard of the motor vehicle 1.
  • the Head-up display is arranged in such a way in the motor vehicle 1 that the image information to be displayed can be projected into a main field of view 4 of a driver 2.
  • the image information to be displayed can be superimposed with existing in the main field of view 4 of the driver 2 objects, so that the driver 2 with a view both in the main field of view 4 located objects as well as the display can perceive the image information.
  • Fig. 2 shows a schematic representation in a perspective view of a gamewhosbei an image forming apparatus 10 according to the invention with a lighting device 30 as formed, inventive electronic assembly 30 as part of a background lighting device 12th
  • the inventive imaging device 10 has a backlit display device 1 1 in the form of an LCD display 1 1, i. a liquid crystal screen 1 1, wherein the backlit display device 1 1 for displaying an image requires a backlight and can be electronically connected via a ribbon cable 24 with a corresponding control device.
  • the background lighting device 12 is provided for backlighting of the display device 1 1, the background lighting device 12 is provided.
  • the background lighting device 12 has an inventive electronic assembly 30, which is designed as a lighting device 30 and a plurality of light-emitting diodes in the form of LEDs 13, which are attached to a heat sink 15, the nenden heat sink 16 made of aluminum.
  • the heat sink 16 has on its underside a plurality of cooling fins 17 with spaces 18 in between.
  • the light-emitting diodes 13 are designed to emit light beams 20 with defined wavelengths, which can be bundled or scattered with the aid of lenses 21 and a diffuser 23, in particular in such a way that the back-lit display device 1 1 is illuminated from the back or can be illuminated.
  • the housing 22 is made of polycarbonate Herge and has on its inside a reflective surface, in particular a polished surface.
  • an electrically conductive adhesive 25 which is shown schematically in FIG. greatly enlarged view of an off section of the electronic assembly according to the invention of Fig. 2 shows, well nen to erken is.
  • an electrically conductive adhesive 25 for loading fastening of the electronic components 13 on the surface 14 of the heat sink 16 alter native and a thermally conductive adhesive can be used. This may be particularly useful if the thermal conductivity of the electrically conductive adhesive 25 is not sufficient to remove the heat generated by the electronic components 13, in particular the LEDs 13 in the heat sink 16. However, an electrically conductive adhesive layer 25 makes it easier to realize electrical contacting.
  • the heat sink 16 of the assembly 30 according to the invention has been inven tion according to a surface treatment, in this case hard anodized, resulting in a uniform, stable oxide layer 16 '(see Fig. 3 and 5) has formed with a honeycomb structure, in particular with a layer thickness of about 20 to 30 pm, which is electrically non-conductive and serves as an insulating layer, in which case the entire heat sink 16 with this electrically non-conductive oxide layer 16 'is surrounded.
  • 5 shows a scanning electron micrograph of the electrically non-conductive surface layer 16 'of the heat sink 16 produced by hard anodizing of the inventive electronic assembly from FIGS. 2 to 4.
  • the LEDs 13 For contacting the electronic components 13 of the assembly 30 according to the invention, in particular the LEDs 13, with a circuit not shown here, after the surface treatment of the heat sink 16 traces 19 are applied directly to the electrically non-conductive surface layer 16 'of the heat sink 16 (see FIG. 4), also by means of an electrically conductive adhesive, wherein the conductor tracks 19 have been electrically contacted, also by means of an electrically conductive adhesive, with the LEDs.
  • the printed conductors 19 can be easily recognized by means of which the LEDs 13 can be electrically contacted with a control device, with FIG. 4 being easily conceivable as the printed conductors 19 are applied to the surface 14 by applying an electrically conductive adhesive. in particular on the electrically non-conductive upper surface layer 16 'of the heat sink 16, have been applied.
  • adhesive is applied to the electrically nonconductive surface layer 16 'of the heat sink 16 which can easily be seen in FIG. 5, it penetrates, with the appropriate adhesive properties (viscosity), as shown schematically in FIG. 6, into the open pores of the electrically non-conducting Surface layer 16 ', in particular up to about 50%, which can be very thin adhesive layers and thus a good heat transfer reali ren, both for the dissipation of heat in the heat sink 16 of thedekör by glued electronic components 13 through the adhesive layer 25 through also for a discharge of the heat into the environment through the printed conductors 19.
  • viscosity viscosity
  • conductor tracks 19 with a layer thickness of only about 50 gm can be produced in this manner.
  • layer thicknesses of conductor tracks on IMS printed circuit boards known from the prior art usually have layer thicknesses of up to 250 gm and are therefore generally much worse in terms of heat emission into the environment.
  • the surface of an aluminum heat sink is plasma-treated instead of anodized hard, the structure of an electrically non-conductive structure illustrated by way of example in FIG. conductive surface layer 16 "with a nearly closed surface.
  • an applied adhesive may not penetrate deep into the Oberflä chen für 16 "as explained with reference to FIG. 6. That is, with such a treated surface can not be achieved as thin adhesive layers as with a treated by hard anodizing surface, creating a honeycomb, offenpo rige surface layer 16 'is formed. Due to the almost closed surface structure of forming in a plasma treatment, especially of aluminum, surface layer 16 "but a total of a significantly larger contact surface for the heat transfer is available, which in some applications, the larger adhesive layer thickness compensated or even overcompensated.
  • Heat sink generated by plasma treatment
  • Conductor tracks made of electrically conductive adhesive

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un module électronique (30), un module électronique (30), un dispositif de production d'images, en particulier pour un afficheur à tête haute, un afficheur à tête haute pourvu d'une surface de projection et d'un dispositif de production d'images ainsi qu'un véhicule pourvu d'un afficheur à tête haute. Le module électronique (30) comporte un corps réfrigérant (16) conducteur de chaleur et au moins un composant (13) électronique fixé au corps réfrigérant (16), le corps réfrigérant (16) servant à l'évacuation d'une chaleur produite par le composant (13) électronique. Le module électronique (30) est fabriqué en produisant une couche superficielle (16', 16") non électriquement conductrice dans au moins une zone de la surface (14) du corps réfrigérant (16) par traitement de la surface (14) du corps réfrigérant (16) et en fixant le composant (13) électronique au corps réfrigérant (16), de préférence sur la surface (14) du corps réfrigérant, en particulier sur la couche superficielle (16', 16") non électriquement conductrice du corps réfrigérant (16).
PCT/EP2018/084093 2017-12-18 2018-12-10 Procédé de fabrication d'un module électronique, module électronique, dispositif de production d'image, afficheur à tête haute et véhicule à afficheur à tête haute WO2019121084A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017130362.6 2017-12-18
DE102017130362.6A DE102017130362A1 (de) 2017-12-18 2017-12-18 Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe, Bilderzeugungsvorrichtung, Head-Up-Display und Fahrzeug mit Head-Up-Display

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WO2019121084A1 true WO2019121084A1 (fr) 2019-06-27

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WO (1) WO2019121084A1 (fr)

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DE102021202388A1 (de) 2021-03-11 2022-09-15 Continental Automotive Technologies GmbH Beleuchtungsvorrichtung mit Kühlkörper

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0521720A1 (fr) * 1991-07-02 1993-01-07 Chomerics, Inc. Circuit imprimé multicouche dissipant la chaleur
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
GB2471497A (en) * 2009-07-01 2011-01-05 Tdk Lambda Uk Ltd Double sided multi-layer metal substrate PCB with SMD components mounted to top traces and lead wire components mounted to opposite side for heat dissipation
EP2330872A1 (fr) * 2009-12-03 2011-06-08 Yi-Chang Chen Substrat de diode électroluminescente et procédé de production de celui-ci
WO2015159031A1 (fr) 2014-04-17 2015-10-22 Valeo Comfort And Driving Assistance Dispositif de rétroéclairage notamment pour afficheur tête haute et afficheur tête haute pour véhicule automobile

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193055A1 (en) * 2002-04-10 2003-10-16 Martter Robert H. Lighting device and method
DE202011050976U1 (de) * 2011-08-12 2012-11-15 Alanod Aluminium-Veredlung Gmbh & Co. Kg Hochreflektierendes Trägermaterial für lichtemittierende Dioden und lichtemittierende Vorrichtung mit einem derartigen Trägermaterial
WO2013040652A1 (fr) * 2011-09-22 2013-03-28 The Silanna Group Pty Ltd Ensemble source de lumière et procédé pour produire un ensemble source de lumière

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0521720A1 (fr) * 1991-07-02 1993-01-07 Chomerics, Inc. Circuit imprimé multicouche dissipant la chaleur
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
GB2471497A (en) * 2009-07-01 2011-01-05 Tdk Lambda Uk Ltd Double sided multi-layer metal substrate PCB with SMD components mounted to top traces and lead wire components mounted to opposite side for heat dissipation
EP2330872A1 (fr) * 2009-12-03 2011-06-08 Yi-Chang Chen Substrat de diode électroluminescente et procédé de production de celui-ci
WO2015159031A1 (fr) 2014-04-17 2015-10-22 Valeo Comfort And Driving Assistance Dispositif de rétroéclairage notamment pour afficheur tête haute et afficheur tête haute pour véhicule automobile

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