WO2022185612A1 - ライナー付両面粘着シート - Google Patents
ライナー付両面粘着シート Download PDFInfo
- Publication number
- WO2022185612A1 WO2022185612A1 PCT/JP2021/040264 JP2021040264W WO2022185612A1 WO 2022185612 A1 WO2022185612 A1 WO 2022185612A1 JP 2021040264 W JP2021040264 W JP 2021040264W WO 2022185612 A1 WO2022185612 A1 WO 2022185612A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liner
- sensitive adhesive
- pressure
- adhesive layer
- double
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 63
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 63
- 229920000103 Expandable microsphere Polymers 0.000 claims abstract description 58
- 239000012790 adhesive layer Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000003746 surface roughness Effects 0.000 claims abstract description 17
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 169
- 239000010410 layer Substances 0.000 claims description 123
- 239000002245 particle Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 229920005601 base polymer Polymers 0.000 claims description 14
- 230000001186 cumulative effect Effects 0.000 claims description 13
- 230000009477 glass transition Effects 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 abstract description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 68
- -1 polyethylene Polymers 0.000 description 44
- 239000000178 monomer Substances 0.000 description 42
- 239000003795 chemical substances by application Substances 0.000 description 32
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- 239000003431 cross linking reagent Substances 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 21
- 238000000034 method Methods 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 19
- 239000000049 pigment Substances 0.000 description 18
- 229920000058 polyacrylate Polymers 0.000 description 18
- 229920001296 polysiloxane Polymers 0.000 description 16
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 15
- 229920001519 homopolymer Polymers 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 239000002985 plastic film Substances 0.000 description 14
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 239000012948 isocyanate Substances 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 150000002513 isocyanates Chemical class 0.000 description 10
- 229920006255 plastic film Polymers 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000004005 microsphere Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000003522 acrylic cement Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000004040 coloring Methods 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 239000003086 colorant Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 238000007373 indentation Methods 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000004760 aramid Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 239000004088 foaming agent Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 229920006243 acrylic copolymer Polymers 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N 2,2-dimethylbutane Chemical compound CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical group CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005194 fractionation Methods 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002650 laminated plastic Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 125000005487 naphthalate group Chemical group 0.000 description 2
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- KYPOHTVBFVELTG-OWOJBTEDSA-N (e)-but-2-enedinitrile Chemical compound N#C\C=C\C#N KYPOHTVBFVELTG-OWOJBTEDSA-N 0.000 description 1
- OKIYQFLILPKULA-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane Chemical compound COC(F)(F)C(F)(F)C(F)(F)C(F)(F)F OKIYQFLILPKULA-UHFFFAOYSA-N 0.000 description 1
- NOPJRYAFUXTDLX-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-methoxypropane Chemical compound COC(F)(F)C(F)(F)C(F)(F)F NOPJRYAFUXTDLX-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- IAUGBVWVWDTCJV-UHFFFAOYSA-N 1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C=C IAUGBVWVWDTCJV-UHFFFAOYSA-N 0.000 description 1
- XTKZBPGQKMDFMC-UHFFFAOYSA-N 1-butyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCCCN1C(=O)CC(=C)C1=O XTKZBPGQKMDFMC-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- DFUYAWQUODQGFF-UHFFFAOYSA-N 1-ethoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane Chemical compound CCOC(F)(F)C(F)(F)C(F)(F)C(F)(F)F DFUYAWQUODQGFF-UHFFFAOYSA-N 0.000 description 1
- BMZZOWWYEBTMBX-UHFFFAOYSA-N 1-ethyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCN1C(=O)CC(=C)C1=O BMZZOWWYEBTMBX-UHFFFAOYSA-N 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- QSWFISOPXPJUCT-UHFFFAOYSA-N 1-methyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CN1C(=O)CC(=C)C1=O QSWFISOPXPJUCT-UHFFFAOYSA-N 0.000 description 1
- CQSQUYVFNGIECQ-UHFFFAOYSA-N 1-n,4-n-dimethyl-1-n,4-n-dinitrosobenzene-1,4-dicarboxamide Chemical compound O=NN(C)C(=O)C1=CC=C(C(=O)N(C)N=O)C=C1 CQSQUYVFNGIECQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- IQEWHTMQTSAPLG-UHFFFAOYSA-N 10-hydroxydecyl prop-2-enoate Chemical compound OCCCCCCCCCCOC(=O)C=C IQEWHTMQTSAPLG-UHFFFAOYSA-N 0.000 description 1
- FLTJDUOFAQWHDF-UHFFFAOYSA-N 2,2-dimethylhexane Chemical class CCCCC(C)(C)C FLTJDUOFAQWHDF-UHFFFAOYSA-N 0.000 description 1
- KQSMCAVKSJWMSI-UHFFFAOYSA-N 2,4-dimethyl-1-n,1-n,3-n,3-n-tetrakis(oxiran-2-ylmethyl)benzene-1,3-diamine Chemical compound CC1=C(N(CC2OC2)CC2OC2)C(C)=CC=C1N(CC1OC1)CC1CO1 KQSMCAVKSJWMSI-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- OYUNTGBISCIYPW-UHFFFAOYSA-N 2-chloroprop-2-enenitrile Chemical compound ClC(=C)C#N OYUNTGBISCIYPW-UHFFFAOYSA-N 0.000 description 1
- PGMMQIGGQSIEGH-UHFFFAOYSA-N 2-ethenyl-1,3-oxazole Chemical compound C=CC1=NC=CO1 PGMMQIGGQSIEGH-UHFFFAOYSA-N 0.000 description 1
- MZNSQRLUUXWLSB-UHFFFAOYSA-N 2-ethenyl-1h-pyrrole Chemical compound C=CC1=CC=CN1 MZNSQRLUUXWLSB-UHFFFAOYSA-N 0.000 description 1
- ZDHWTWWXCXEGIC-UHFFFAOYSA-N 2-ethenylpyrimidine Chemical compound C=CC1=NC=CC=N1 ZDHWTWWXCXEGIC-UHFFFAOYSA-N 0.000 description 1
- RVBFWXYFXKDVKG-UHFFFAOYSA-N 2-ethoxyprop-2-enenitrile Chemical compound CCOC(=C)C#N RVBFWXYFXKDVKG-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QENRKQYUEGJNNZ-UHFFFAOYSA-N 2-methyl-1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CC(C)C(S(O)(=O)=O)NC(=O)C=C QENRKQYUEGJNNZ-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- BLJHFERYMGMXSC-UHFFFAOYSA-N 3-[3-(hydrazinesulfonyl)phenyl]sulfonylbenzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC(S(=O)(=O)C=2C=C(C=CC=2)S(=O)(=O)NN)=C1 BLJHFERYMGMXSC-UHFFFAOYSA-N 0.000 description 1
- RDRWAAIUFCYJPH-UHFFFAOYSA-N 3-methylidene-1-octylpyrrolidine-2,5-dione Chemical compound CCCCCCCCN1C(=O)CC(=C)C1=O RDRWAAIUFCYJPH-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- GRRGMQBIAJCOBQ-UHFFFAOYSA-N 4-(thiatriazol-5-yl)morpholine Chemical compound C1COCCN1C1=NN=NS1 GRRGMQBIAJCOBQ-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- CFZDMXAOSDDDRT-UHFFFAOYSA-N 4-ethenylmorpholine Chemical compound C=CN1CCOCC1 CFZDMXAOSDDDRT-UHFFFAOYSA-N 0.000 description 1
- JSZCJJRQCFZXCI-UHFFFAOYSA-N 6-prop-2-enoyloxyhexanoic acid Chemical compound OC(=O)CCCCCOC(=O)C=C JSZCJJRQCFZXCI-UHFFFAOYSA-N 0.000 description 1
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 150000004008 N-nitroso compounds Chemical class 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- KAOQCJIKVJCWDU-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CCC(CO)CC1 KAOQCJIKVJCWDU-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000980 acid dye Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000783 alginic acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- CAMXVZOXBADHNJ-UHFFFAOYSA-N ammonium nitrite Chemical compound [NH4+].[O-]N=O CAMXVZOXBADHNJ-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- LSNDGFYQJRXEAR-UHFFFAOYSA-N benzenesulfonamidourea Chemical compound NC(=O)NNS(=O)(=O)C1=CC=CC=C1 LSNDGFYQJRXEAR-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000005354 coacervation Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- UMNKXPULIDJLSU-UHFFFAOYSA-N dichlorofluoromethane Chemical compound FC(Cl)Cl UMNKXPULIDJLSU-UHFFFAOYSA-N 0.000 description 1
- 229940099364 dichlorofluoromethane Drugs 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000000982 direct dye Substances 0.000 description 1
- 239000000986 disperse dye Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical compound C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 238000011085 pressure filtration Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 239000000985 reactive dye Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 150000003349 semicarbazides Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 229940029284 trichlorofluoromethane Drugs 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Definitions
- the present invention relates to a liner-attached double-sided pressure-sensitive adhesive sheet.
- the members are temporarily fixed to adhesive sheets.
- a member such as an electronic component is fixed, the member is processed (for example, resin sealing, cutting, cutting, polishing, etching, printing, etc.), and after processing , the processed product is peeled off from the pedestal.
- the member may be pressurized in the processing of the member.
- the pressurization it is often required that the pressurization be uniform.
- the present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a double-sided pressure-sensitive adhesive sheet that can be used as a temporary fixing material during processing of a member, and the member is pressurized. Another object of the present invention is to provide a double-sided pressure-sensitive adhesive sheet capable of improving the uniformity of the pressure.
- the lined double-sided pressure-sensitive adhesive sheet of the present invention comprises a first liner, a first pressure-sensitive adhesive layer, a substrate, a second pressure-sensitive adhesive layer, and a second liner in this order.
- the pressure-sensitive adhesive layer contains heat-expandable microspheres, the surface of the first liner facing the first pressure-sensitive adhesive layer has an arithmetic surface roughness Ra of 1 nm to 100 nm, and the second liner
- the arithmetic surface roughness Ra of the surface facing the second pressure-sensitive adhesive layer is 1 nm to 100 nm, and the maximum height Rz of the surface facing the first pressure-sensitive adhesive layer of the first liner is 5 nm to 1000 nm.
- the maximum height Rz of the second pressure-sensitive adhesive layer side surface of the second liner is 5 nm to 1000 nm.
- the heat-expandable microspheres have a volume cumulative particle diameter D50 of 5 ⁇ m to 30 ⁇ m.
- the volume cumulative particle diameter D80 of the heat-expandable microspheres is 10 ⁇ m to 50 ⁇ m.
- the product of the cube of the thickness of the substrate and the elastic modulus of the substrate is 1 ⁇ 10 ⁇ 7 (N/m) to 1 ⁇ 10 ⁇ 2 (N/m). be.
- the first pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive containing a base polymer, and the base polymer has a glass transition temperature of -50°C to 0°C.
- the liner-attached double-sided pressure-sensitive adhesive sheet is used as a sheet for temporarily fixing a semiconductor chip during the manufacture of CSP (Chip Size/Scale Package).
- the liner-attached double-sided pressure-sensitive adhesive sheet is used as a sheet for temporarily fixing a semiconductor chip during the manufacture of a WLP (Wafer Level Package).
- the semiconductor chip is press processed.
- a double-sided pressure-sensitive adhesive sheet that can be used as a temporary fixing material during member processing, and that can improve the uniformity of pressure when the member is pressed. can be done.
- FIG. 1 is a schematic cross-sectional view of a liner-attached double-sided pressure-sensitive adhesive sheet according to one embodiment of the present invention
- FIG. 1 is a schematic cross-sectional view of a liner-attached double-sided pressure-sensitive adhesive sheet according to one embodiment of the present invention.
- the liner-attached double-sided pressure-sensitive adhesive sheet 100 comprises a first liner 10, a first pressure-sensitive adhesive layer 21, a substrate 22, a second pressure-sensitive adhesive layer 23, and a second liner 30 in this order.
- the first pressure-sensitive adhesive layer 21 , the base material 22 and the second pressure-sensitive adhesive layer 23 constitute the double-sided pressure-sensitive adhesive sheet 20 .
- the arithmetic surface roughness Ra of the surface of the first liner 10 on the side of the first pressure-sensitive adhesive layer 21 is 1 nm to 100 nm.
- the arithmetic surface roughness Ra of the surface of the second liner 30 on the second adhesive layer 23 side is 1 nm to 100 nm.
- the maximum height Rz of the first adhesive layer 21 side surface of the first liner 10 is 5 nm to 1000 nm.
- the maximum height Rz of the second adhesive layer 23 side surface of the second liner 30 is 5 nm to 1000 nm.
- the double-sided pressure-sensitive adhesive sheet 20 is composed of the first pressure-sensitive adhesive layer 21, the base material 22, and the second pressure-sensitive adhesive layer 23.
- the double-sided pressure-sensitive adhesive sheet 20 may further include any appropriate other layers as long as the effects of the present invention are obtained.
- a primer layer can be placed between the second adhesive layer and the substrate.
- the double-sided pressure-sensitive adhesive sheet can be used as a temporary fixing material when a member such as an electronic component is placed on the first pressure-sensitive adhesive layer and the member is processed.
- the first pressure-sensitive adhesive layer having excellent surface smoothness is formed.
- the uniformity of the pressure can be improved.
- the surface condition of the second liner is specified as described above, the surface of the first pressure-sensitive adhesive layer (the surface opposite to the base material) is smooth, and the pressure applied to the member to be pressed is uniform. sex will be better.
- the second adhesive layer contains heat-expandable microspheres.
- the pressure-sensitive adhesive layer containing heat-expandable microspheres is heated, the heat-expandable microspheres expand or foam to form irregularities on the pressure-sensitive adhesive surface, resulting in reduced or lost adhesive strength.
- the first liner when using the liner-attached double-sided pressure-sensitive adhesive sheet, the first liner is removed first. More specifically, the liner-equipped double-sided pressure-sensitive adhesive sheet is prepared by first peeling off the first liner, and attaching a workpiece (for example, an electronic component) to the exposed pressure-sensitive adhesive surface (for example, the surface of the first pressure-sensitive adhesive layer). It can be used by sticking, then peeling off the second liner, and sticking the surface of the second pressure-sensitive adhesive layer on another adherend (for example, a pedestal).
- a workpiece for example, an electronic component
- the adherend (e.g., electronic component) is temporarily fixed to the pedestal via the double-sided adhesive sheet; the adherend is subjected to a predetermined process; The double-sided pressure-sensitive adhesive sheet attached to the adherend is peeled off from the pedestal.
- first liner and the second liner each comprise a liner substrate and a release treatment layer disposed on at least one side of the liner substrate.
- the first liner and the second liner are arranged so that the release treated layer is on the double-sided pressure-sensitive adhesive sheet side.
- the first liner and the second liner may have the same configuration, or may have different configurations.
- the surface of the first liner facing the first pressure-sensitive adhesive layer has an arithmetic surface roughness Ra of 1 nm to 100 nm.
- the arithmetic surface roughness Ra of the first pressure-sensitive adhesive layer side surface of the first liner is preferably 1 nm to 60 nm, more preferably 1 nm to 45 nm, even more preferably 15 nm to 45 nm, particularly preferably 15 nm. ⁇ 35 nm. Within such a range, the effect of the present invention is remarkable.
- Arithmetic surface roughness Ra can be measured according to JIS B 0601.
- the arithmetic surface roughness Ra of the second adhesive layer side surface of the second liner is 1 nm to 100 nm.
- the arithmetic surface roughness Ra of the first pressure-sensitive adhesive layer side surface of the first liner is preferably 1 nm to 60 nm, more preferably 1 nm to 45 nm, even more preferably 15 nm to 45 nm, particularly preferably 25 nm. ⁇ 45 nm. Within such a range, the effect of the present invention is remarkable.
- the maximum height Rz of the first pressure-sensitive adhesive layer side surface of the first liner is 5 nm to 1000 nm.
- the maximum height Rz of the first pressure-sensitive adhesive layer side surface of the first liner is preferably 10 nm to 800 nm, more preferably 30 nm to 600 nm, even more preferably 50 nm to 400 nm, and particularly preferably 50 nm to 200 nm. Within such a range, the effect of the present invention is remarkable.
- Maximum height Rz can be measured according to JIS B 0601.
- the maximum height Rz of the second adhesive layer side surface of the second liner is 5 nm to 1000 nm.
- the maximum height Rz of the second pressure-sensitive adhesive layer side surface of the second liner is preferably 10 nm to 800 nm, more preferably 30 nm to 600 nm, even more preferably 50 nm to 500 nm, and particularly preferably 150 nm to 500 nm. Within such a range, the effect of the present invention is remarkable.
- the peel force of the first liner to the double-sided pressure-sensitive adhesive sheet is preferably 0.001N/50mm to 2N/50mm, more preferably 0.01N/50mm to 1.5N/50mm, and still more preferably 0.05N. /50 mm to 1 N/50 mm, particularly preferably 0.1 N/50 mm to 0.8 N/50 mm.
- the release force of the first liner to the double-sided pressure-sensitive adhesive sheet (and the release force of the second liner to the double-sided pressure-sensitive adhesive sheet) was measured in an environment of 23°C. (Peeling angle: 180°, peeling speed (tensile speed): 300 mm/min) means the adhesive force measured.
- the release force of the liner to the double-sided PSA sheet can be adjusted by any appropriate method, such as the composition of the PSA layer, the type of liner, and the surface treatment applied to the liner.
- the peel force of the second liner to the double-sided pressure-sensitive adhesive sheet is preferably 0.001N/50mm to 2N/50mm, more preferably 0.01N/50mm to 1.5N/50mm, and still more preferably 0.05N. /50 mm to 1 N/50 mm, particularly preferably 0.1 N/50 mm to 0.8 N/50 mm.
- the release force of the first liner to the double-sided PSA sheet and the release force of the second liner to the double-sided PSA sheet may be the same or different.
- the thickness of the first liner is preferably 5 ⁇ m to 250 ⁇ m, more preferably 10 ⁇ m to 200 ⁇ m, even more preferably 20 ⁇ m to 150 ⁇ m, most preferably 30 ⁇ m to 100 ⁇ m.
- the thickness of the second liner is preferably 5 ⁇ m to 250 ⁇ m, more preferably 10 ⁇ m to 200 ⁇ m, even more preferably 20 ⁇ m to 150 ⁇ m, most preferably 30 ⁇ m to 100 ⁇ m.
- the thickness of the first liner and the thickness of the second liner may be the same or different.
- the elastic modulus of the first liner (substantially the liner base material) is 500 MPa to 5000 MPa, more preferably 500 MPa to 4000 MPa, still more preferably 700 MPa to 4000 MPa.
- the elastic modulus means the elastic modulus measured by the nanoindentation method in a 23° C. environment.
- the elastic modulus by the nanoindentation method is obtained by continuously measuring the load applied to the indenter and the indentation depth during loading and unloading when the indenter is pushed into the sample (which may be a liner base material). It refers to the modulus of elasticity obtained from the obtained applied load-indentation depth curve. The conditions for measuring the elastic modulus by the nanoindentation method will be described later.
- the elastic modulus of the second liner (substantially the liner base material) is 500 MPa to 5000 MPa, more preferably 500 MPa to 4000 MPa, still more preferably 700 MPa to 4000 MPa.
- the modulus of elasticity of the first liner and the modulus of elasticity of the second liner may be the same or different.
- the liner base material can be composed of any appropriate material.
- the liner base material for example, in addition to plastic films and plastic sheets, various sheet-like materials such as paper, cloth, nonwoven fabric, metal foil, plastic laminates thereof, and laminates of plastics can be used. .
- plastic films and plastic sheets are most preferable from the viewpoint of handling and cost.
- the material for the plastic film can be selected according to need from the viewpoint of strength, heat resistance, and the like.
- polyethylene polyethylene
- PP polypropylene
- EVA ethylene-vinyl acetate copolymer
- PBT polyethylene terephthalate
- PET polyethylene
- Polyesters such as naphthalate (PEN) and polybutylene terephthalate (PBT)
- PVC polyvinyl chloride
- PPS polyphenylene sulfide
- amide resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); Ketone (PEEK), polyimide, polyetherimide, polystyrene, acrylic resin and the like.
- a liner base material composed of a polyester resin is used, and a liner base material composed of polyethylene terephthalate is more preferably used.
- the above materials can be used alone or in combination of two or more.
- the plastic film any of an unstretched film, a uniaxially oriented film, and a biaxially oriented film may be used.
- these films may be laminated films composed of two or more film layers.
- a film to which a lubricant such as inert particles is added may be used as appropriate.
- inorganic fine particles composed of antimony, silica gel, or the like can be used as the lubricant.
- the release treated layer is a silicone treated layer.
- a reactive silicone compound containing a dimethylpolysiloxane as a main component and having a functional group necessary for cross-linking (curing) can be preferably used. This is because it can be applied to a film in a low-molecular-weight state, and can be cured after application to form a release treated layer that is resistant to rubbing and the like.
- functional groups of reactive silicone compounds include vinyl groups, epoxy groups, alkoxy groups, isocyanato groups, and the like.
- the silicone-treated layer is formed, for example, by diluting the above-mentioned reactive silicone compound with a solvent or the like to adjust the concentration, and applying and heating with a gravure coater or the like. Heating accelerates solvent drying and curing reactions.
- a catalyst that accelerates the curing reaction. Examples of catalysts that can be used include metal complexes such as platinum, palladium, rhodium, zirconium and tin, organic bases such as amines, and organic acids such as acetic acid.
- the first liner and/or the second liner (substantially the release treatment layer of each liner) has a Si—K ⁇ ray intensity of 0.01 by fluorescent X-ray analysis. ⁇ 500 kcps (preferably 0.5 to 250 kcps, more preferably 1.0 to 150 kcps, still more preferably 1.05 to 100 kcps, particularly preferably 5 to 100 kcps). Within this range, the release treatment is sufficiently and uniformly performed, and a liner with a preferably adjusted surface condition can be obtained.
- the intensity of the Si-K ⁇ ray obtained by the above fluorescent X-ray analysis is obtained by measuring the Si intensity of the release agent layer and the non-release agent layer by the fluorescence X-ray analysis, and calculating the intensity of the release agent layer from the intensity of the non-release agent. It is a value obtained by reducing the strength of the layer.
- the strength can be adjusted by controlling the release treatment layer forming conditions such as the coating amount, concentration, coating speed and drying of the release treatment agent. It is preferable that the first liner and the second liner have different Si-K ⁇ ray intensities.
- the absolute value of the difference in Si—K ⁇ ray intensity between the first liner and the second liner is preferably 0.1 to 500, more preferably 0.1 to 200, still more preferably 0.1 to 150. , particularly preferably from 1 to 80.
- the first liner and the second liner are different colors.
- a liner-equipped double-sided pressure-sensitive adhesive sheet having such a structure can be obtained, for example, by coloring one of the liners (for example, the liner substrate). If both liners are of different colors, the front and back of the liner-attached double-sided pressure-sensitive adhesive sheet can be clearly distinguished, making it easy to identify the liner to be peeled off.
- Double-sided pressure-sensitive adhesive sheet As described above, the double-sided pressure-sensitive adhesive sheet comprises a first pressure-sensitive adhesive layer, a substrate, and a second pressure-sensitive adhesive layer in this order.
- the double-sided PSA sheet further comprises a primer layer disposed between the second PSA layer and the substrate.
- a double-faced pressure-sensitive adhesive sheet having excellent conformability to adherends can be obtained by providing an undercoat layer.
- the second pressure-sensitive adhesive layer containing heat-expandable microspheres is heated, the heat-expandable microspheres expand and deform due to expansion in the thickness direction. is suppressed, so the releasability is improved.
- the adhesive force at 23° C. when the first adhesive layer of the double-sided PSA sheet is attached to polyethylene terephthalate is preferably 0.5 N/20 mm or more, more preferably 0.5 N/20 mm to 20 N/20 mm. and more preferably 0.5 N/20 mm to 15 N/20 mm.
- Adhesive strength refers to adhesive strength measured by a method according to JIS Z 0237:2000 (bonding conditions: one reciprocation of a 2 kg roller, peeling speed: 300 mm/min, peeling angle of 180°).
- the initial adhesive force at 23° C. when the second adhesive layer of the double-sided adhesive sheet is adhered to polyethylene terephthalate is preferably 0.5 N/20 mm or more, more preferably 0.5 N/20 mm to 20 N/ 20 mm, more preferably 0.5 N/20 mm to 15 N/20 mm.
- a double-sided pressure-sensitive adhesive sheet useful as a temporary fixing sheet used in the manufacture of electronic components can be obtained.
- the initial adhesive strength is the adhesive strength in a state where the adhesive strength has not decreased due to the expansion of the heat-expandable microspheres, and means the adhesive strength in the state where the heat history of 50° C. or more has not been passed. .
- the pressure-sensitive adhesive strength is preferably reduced to 0.2 N/20 mm or less (preferably 0.1 N/20 mm or less) by heating.
- the heating temperature is preferably 90°C to 300°C, more preferably 100°C to 280°C.
- the thickness of the double-sided pressure-sensitive adhesive sheet is preferably 3 ⁇ m to 300 ⁇ m, more preferably 5 ⁇ m to 150 ⁇ m, still more preferably 10 ⁇ m to 100 ⁇ m.
- At least one of the layers constituting the double-sided pressure-sensitive adhesive sheet is a colored layer.
- each layer has a different color.
- Coloring means a state of absorbing and/or reflecting any or all light in the visible region (250 nm to 700 nm). Any appropriate method can be adopted as a method for coloring any one layer.
- a pigment, a dye, or the like can be used as the coloring agent.
- the pigment include organic pigments such as acrylic pigments, azo pigments, polyazo pigments, anthraquinone pigments, quinacridone pigments, isoindoline pigments, isoindolinone pigments, phthalocyanine pigments, perylene pigments, and DPP pigments.
- Pigments, fluorescent pigments, condensed polycyclic pigments, colored resin particles, etc., and inorganic pigments include known pigments such as carbon black, synthetic silica, chromium oxide, iron oxide, titanium oxide, zinc sulfide, calcined pigments, and natural mica. mentioned.
- Dyes include acid dyes, reactive dyes, direct dyes, disperse dyes, cationic dyes, polymer dyes and the like.
- the ink commercially available products such as "NB300" manufactured by Dainichiseika may be used.
- Coloring is also possible by mixing a coloring agent into the pressure-sensitive adhesive layer.
- the composition of the pressure-sensitive adhesive layer has a fine structure with a size of about the wavelength of visible light, for example, by microphase separation between a hydrophilic composition and a hydrophobic composition, depending on the size
- a phenomenon of coloring that is, a so-called structural color, may be exhibited, and coloring using this is also possible.
- the first adhesive layer is composed of any suitable adhesive.
- the adhesive that constitutes the first adhesive layer include acrylic adhesives, rubber adhesives, silicone adhesives, and the like. Among them, an acrylic pressure-sensitive adhesive can be preferably used.
- an active energy ray-curable acrylic adhesive hereinafter referred to as an active energy ray-curable adhesive
- Details of the adhesive are described, for example, in JP-A-2015-168711. The description of the publication is incorporated herein by reference.
- an acrylic adhesive is used as the adhesive.
- the acrylic pressure-sensitive adhesive include, for example, an acrylic pressure-sensitive adhesive whose base polymer is an acrylic polymer (homopolymer or copolymer) using one or more of (meth)acrylic acid alkyl esters as a monomer component. etc.
- (meth)acrylic acid alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, ( isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (meth)acrylic acid Octyl, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (meth)acrylic undecyl acid, dodecyl (meth)acrylate,
- (meth)acrylic acid alkyl esters having a linear or branched alkyl group having 4 to 20 carbon atoms (more preferably 6 to 20, particularly preferably 8 to 18 carbon atoms) are more preferable.
- the acrylic polymer may optionally be a unit corresponding to another monomer component copolymerizable with the (meth)acrylic acid alkyl ester.
- monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride and icotanic anhydride; Acid anhydride monomers such as; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, (meth)acrylate Hydroxyl group-containing monomers such as hydroxydecyl acrylate, hydroxyllauryl (meth)acrylate, (4
- cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate; polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, (meth)acrylic acid Glycol-based acrylic ester monomers such as methoxyethylene glycol and methoxypolypropylene glycol (meth)acrylate; heterocycles such as tetrahydrofurfuryl (meth)acrylate, fluorine (meth)acrylate, and silicone (meth)acrylate, halogen atoms, silicon atoms Acrylic acid ester-based monomers having, etc.; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol Polyfunctional mono
- a carboxyl group-containing monomer (particularly preferably acrylic acid) or a hydroxyl group-containing monomer (particularly preferably hydroxyethyl (meth)acrylate) is more preferred.
- the content of structural units derived from a carboxyl group-containing monomer is preferably 0.1% by weight to 10% by weight, more preferably 0.5% by weight to 5% by weight, based on all structural units constituting the acrylic polymer. % by weight, particularly preferably 1% to 4% by weight.
- the content of the structural units derived from the hydroxyl group-containing monomer is preferably 0.1% by weight to 20% by weight, more preferably 0.5% by weight, based on all the structural units constituting the acrylic polymer. to 10% by weight, particularly preferably 1% to 7% by weight.
- (meth)acryl means acryl and/or methacryl.
- the glass transition temperature (Tg) of the base polymer is preferably -50°C to 0°C, more preferably -40°C to -5°C, More preferably -35°C to -5°C.
- Tg glass transition temperature
- the base polymer is a copolymer
- the glass transition temperature is determined by the Fox equation.
- the Fox calculation formula is, as shown below, the glass transition temperature Tg (° C.) of the copolymer and the homopolymer (homopolymer ) and the glass transition temperature Tgi (°C).
- Tg (°C) is the glass transition temperature of the copolymer
- Wi is the weight fraction of the monomer i
- Tgi (°C) is the temperature of the homopolymer formed from the monomer i. Indicates the glass transition temperature.
- the glass transition temperatures of the homopolymers formed from the monomers are acrylonitrile homopolymer (AN): 97°C, methyl methacrylate homopolymer (MMA): 102°C, methacryloylnitrile homopolymer (MAN): 120.
- the acrylic pressure-sensitive adhesive may contain any suitable additive as necessary.
- the additives include, for example, cross-linking agents, tackifiers, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, release modifiers, softeners, surfactants, flame retardants, antioxidants, and the like.
- cross-linking agent contained in the acrylic pressure-sensitive adhesive examples include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide cross-linking agents, Examples include metal chelate cross-linking agents, metal salt cross-linking agents, carbodiimide cross-linking agents, oxazoline cross-linking agents, aziridine cross-linking agents, and amine cross-linking agents. Among them, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is preferable.
- the isocyanate-based cross-linking agent contained in the acrylic pressure-sensitive adhesive include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; group isocyanates; 2,4-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic isocyanates; name "Coronate L”), trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL”), isocyanurate of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., product isocyanate adducts such as the name "Coronate HX");
- the content of the isocyanate-based cross-linking agent can be set to any appropriate amount depending on the
- epoxy-based cross-linking agent contained in the acrylic pressure-sensitive adhesive examples include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N- glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C”), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolite 1600"), neopentyl glycol diglycidyl ether ( Kyoeisha Chemical Co., Ltd., trade name "Epolite 1500NP”), ethylene glycol diglycidyl ether (Kyoeisha Chemical Co., Ltd., trade name "Epolite 40E”), propylene glycol diglycidyl ether (Kyoeisha Chemical Co., Ltd., trade
- the thickness of the first adhesive layer is preferably 5 ⁇ m to 70 ⁇ m, more preferably 7 ⁇ m to 60 ⁇ m, still more preferably 15 ⁇ m to 55 ⁇ m, most preferably 20 ⁇ m to 50 ⁇ m. Within such a range, it is possible to obtain a double-faced PSA sheet that is excellent in liner peeling operability, operability in adhesion, adhesiveness, smoothness, and deformability in heating.
- the elastic modulus of the first adhesive layer is preferably 0.001 MPa to 10 MPa, more preferably 0.01 MPa to 8 MPa. Within such a range, it is possible to obtain a double-faced PSA sheet that is excellent in liner peeling operability, operability in adhesion, adhesiveness, smoothness, and deformability in heating.
- the first pressure-sensitive adhesive layer may be cured by irradiation with an active energy ray to have an elastic modulus of 1 MPa to 200 MPa. It is preferably 5 MPa to 150 MPa, and even more preferably 10 MPa to 100 MPa.
- the second adhesive layer may contain any appropriate adhesive and heat-expandable microspheres.
- the adhesive that constitutes the second adhesive layer include acrylic adhesives, rubber adhesives, silicone adhesives, and the like. Among them, an acrylic pressure-sensitive adhesive can be preferably used.
- an active energy ray-curable acrylic adhesive hereinafter referred to as an active energy ray-curable adhesive
- Details of the adhesive are described, for example, in JP-A-2015-168711. The description of the publication is incorporated herein by reference.
- the thickness of the second adhesive layer is preferably 1 ⁇ m to 60 ⁇ m, more preferably 2 ⁇ m to 50 ⁇ m, even more preferably 3 ⁇ m to 35 ⁇ m, most preferably 5 ⁇ m to 35 ⁇ m. Within such a range, it is possible to obtain a double-sided pressure-sensitive adhesive sheet that is excellent in liner peeling operability, operability during application, adhesiveness, and smoothness.
- the elastic modulus of the second adhesive layer is preferably 0.001 MPa to 10 MPa, more preferably 0.01 MPa to 8 MPa. Within such a range, it is possible to obtain a double-sided pressure-sensitive adhesive sheet that is excellent in liner peeling operability, operability during application, adhesiveness, and smoothness.
- the second adhesive layer contains the acrylic adhesive described in Section C-1.
- acrylic pressure-sensitive adhesives contain an acrylic polymer as a base polymer.
- Heat-expandable microspheres Any appropriate heat-expandable microspheres can be used as the heat-expandable microspheres as long as they can be expanded or foamed by heating.
- the heat-expandable microspheres for example, microspheres in which a substance (volatile substance) that easily expands by heating is encapsulated in an elastic shell can be used.
- Such heat-expandable microspheres can be produced by any appropriate method such as coacervation, interfacial polymerization, and the like.
- the volatile substance contained in the shell is typically an organic solvent.
- the organic solvent include linear aliphatic hydrocarbons having 3 to 8 carbon atoms and fluorinated products thereof, branched aliphatic hydrocarbons having 3 to 8 carbon atoms and fluorinated products thereof, and 3 to 8 carbon atoms. straight-chain alicyclic hydrocarbons and fluorinated products thereof, ether compounds having a hydrocarbon group with 2 to 8 carbon atoms, or compounds in which a portion of the hydrogen atoms in the hydrocarbon group are substituted with fluorine atoms, etc. is mentioned.
- the organic solvent is propane, cyclopropane, butane, cyclobutane, isobutane, pentane, cyclopentane, neopentane, isopentane, hexane, cyclohexane, 2-methylpentane, 2,2-dimethylbutane, heptane, cyclo Hydrocarbons composed only of hydrogen atoms and carbon atoms such as heptane, octane, cyclooctane, methylheptanes and trimethylpentanes; hydrofluoroethers such as C3F7OCH3, C4F9OCH3 and C4F9OC2H5; These organic solvents may be used alone or in combination of two or more.
- the boiling point of the organic solvent is preferably -50°C to 100°C, more preferably -20°C to 100°C. Within such a range, heat-expandable microspheres can be obtained in which the shell can be expanded satisfactorily without breaking. If the boiling point of the organic solvent is too low, the operation for suppressing volatilization during production of thermally expandable microspheres may become complicated. When two or more organic solvents (mixed solvent) are used, the "boiling point of the organic solvent" means the boiling point of the solvent with the highest weight ratio.
- the content of the organic solvent is preferably 5% to 35% by weight, more preferably 10% to 30% by weight, based on the weight of the heat-expandable microspheres before heating. Within such a range, the heat-expandable microspheres will be dispersed with high uniformity in the pressure-sensitive adhesive layer. If the content is less than 5% by weight, the heat-expandable microspheres tend to be unevenly distributed on the surface of the adhesive layer during the production of the adhesive layer due to low density, etc. It may occur on the surface of the agent layer. If the content exceeds 35% by weight, the density is high and sedimentation occurs in the adhesive layer. Even if the adhesive layer is heated, sufficient unevenness cannot be formed on the surface of the adhesive layer, and the desired peelability may not be obtained. Also, there is a possibility that adhesive residue may occur.
- Examples of materials that make up the shell include resin, glass, and metal. Resin is particularly preferred.
- Examples of the resin constituting the shell include nitrile monomers such as acrylonitrile, methacrylonitrile, ⁇ -chloroacrylonitrile, ⁇ -ethoxyacrylonitrile, and fumaronitrile; acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, Carboxylic acid monomers such as citraconic acid; vinylidene chloride; vinyl acetate; methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, (Meth)acrylic acid esters such as isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, ⁇ -carboxyethy
- the copolymer examples include vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, methyl methacrylate-acrylonitrile copolymer, acrylonitrile-methacrylonitrile-itaconic acid copolymer, A polymer etc. are mentioned.
- the resin forming the shell may be a crosslinked body. Cross-linking can adjust the excluded free volume of the polymer, thereby controlling the diffusivity of the encapsulated volatiles, the expandability of the shell, and the like.
- the resin constituting the shell is an isobornyl acrylate-derived structural unit, a methacrylonitrile-derived structural unit, an acrylonitrile-derived structural unit, a methyl (meth) acrylate-derived structural unit, or a vinylidene chloride-derived structural unit. and at least one selected from the group consisting of structural units derived from (meth)acrylic acid.
- a resin having these structural units it has low solubility in the internal organic solvent and can form a shell that is difficult for the organic solvent to permeate or infiltrate before heating.
- thermally expandable microspheres having good deformability by heating can be obtained.
- methyl (meth)acrylate is preferably used from the viewpoint of ease of control of shell hardness. If methyl (meth)acrylate is used, the hardness of the shell can be easily controlled by cross-linking such as electron beam cross-linking.
- the content of methyl (meth)acrylate is preferably less than 65 parts by weight, more preferably 1 to 55 parts by weight, relative to 100 parts by weight of the resin forming the shell. parts, particularly preferably 1 to 50 parts by weight.
- Vinylidene chloride is preferably used for imparting flexibility to the shell. The amount of pyrylidene chloride used can be any appropriate amount depending on the desired glass transition temperature of the resin.
- An inorganic foaming agent or an organic foaming agent may be used as the thermally expandable microspheres.
- inorganic foaming agents include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, and various azides.
- organic foaming agents include chlorofluoroalkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; and azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate.
- hydrazine compounds such as paratoluenesulfonyl hydrazide, diphenylsulfone-3,3′-disulfonyl hydrazide, 4,4′-oxybis(benzenesulfonyl hydrazide), allylbis(sulfonyl hydrazide); p-toluylenesulfonyl semicarbazide, 4, Semicarbazide compounds such as 4'-oxybis(benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; N,N'-dinitrosopentamethylenetetramine, N,N' -dimethyl-N,N'-dinitrosoterephthalamide; and other N-nitroso compounds.
- the thickness of the shell is preferably 15 ⁇ m or less, more preferably 7 ⁇ m or less, still more preferably 5 ⁇ m or less, and particularly preferably 4 ⁇ m or less.
- the glass transition temperature (Tg) of the resin constituting the shell is preferably 50°C to 250°C, more preferably 60°C to 200°C, and still more preferably 80°C to 150°C.
- the particle size of the heat-expandable microspheres before heating is preferably 0.5 ⁇ m to 80 ⁇ m, more preferably 5 ⁇ m to 45 ⁇ m, even more preferably 10 ⁇ m to 20 ⁇ m, and particularly preferably 10 ⁇ m to 15 ⁇ m. .
- the volume cumulative particle diameter D50 (particle diameter at 50% cumulative volume) of the heat-expandable microspheres is preferably 5 ⁇ m to 30 ⁇ m, more preferably 7 ⁇ m to 24 ⁇ m. Within such a range, a pressure-sensitive adhesive layer having excellent peelability after heating and excellent surface smoothness before heating can be formed. By using a double-sided pressure-sensitive adhesive sheet having such a pressure-sensitive adhesive layer, when a member is pressed on the double-sided pressure-sensitive adhesive sheet, the uniformity of the pressure can be improved. Volume cumulative particle diameters D50 and D80 (described later) are particle diameters before heating.
- the volume cumulative particle diameter D80 (particle diameter at 80% cumulative volume) of the heat-expandable microspheres is preferably 10 ⁇ m to 50 ⁇ m, more preferably 15 ⁇ m to 40 ⁇ m, still more preferably 15 ⁇ m to 35 ⁇ m. With such a range, it is possible to obtain a double-sided pressure-sensitive adhesive sheet that can improve the uniformity of pressure when members are pressed on the double-sided pressure-sensitive adhesive sheet.
- the inventors of the present invention have found that not only the surface state of the first pressure-sensitive adhesive layer, but also the surface state of the second pressure-sensitive adhesive layer containing thermally expandable microspheres is arranged on the first pressure-sensitive adhesive layer. It was found that the pressure uniformity on the workpiece was affected. By adjusting the volume cumulative particle diameter D50 and/or D80 of the heat-expandable microspheres as described above, the surface state of the second pressure-sensitive adhesive layer can be more appropriately controlled, and the above effects of the present invention can be further enhanced. become conspicuous.
- a group of thermally expandable microspheres having a desired particle size can be obtained by fractionation using the difference in sedimentation velocity in an air stream or liquid, fractionation by centrifugation, or sieving using a sieve.
- the heat-expandable microspheres can be dispersed in a solvent before being mixed with the adhesive, or dispersed in an adhesive solution, from the viewpoint of industrial mass production. preferable.
- a filter system used for pressure filtration for example, it is inserted into a pressure-resistant housing (for example, NF-1P, manufactured by Chisso Filter) such as Kanefeel R series (Fuji Chemical Co., Ltd.) and Chisso CPII filter (manufactured by Chisso Filter).
- a system using a pump such as a diaphragm pump (e.g., AOD series pump, manufactured by Takato Technica Co., Ltd.) can be employed here, and the thermally expanded fine particles mixed in a solvent or adhesive solution are fed into the system and classified. be able to.
- the mesh value of the filter is preferably 5-35 ⁇ m, more preferably 10-25 ⁇ m.
- the particle size distribution range of the heat-expandable microspheres will be widened, or the average particle size of the heat-expandable microspheres will exceed 30 ⁇ m, and the heat-releasable pressure-sensitive adhesive layer will not be formed. This causes a problem that unevenness increases. If the mesh diameter is less than 5 ⁇ m, the heat-expandable microspheres are densely packed in the pressure-sensitive adhesive, resulting in a decrease in the adhesive strength of the heat-releasable pressure-sensitive adhesive layer, and the heat-expandable microspheres during heating. Since the expansion of the film is small, the thermal releasability is deteriorated.
- Filtration may be performed only once, and a plurality of filters may be connected in series.
- the average particle size and particle size distribution can be measured by the following method using X-ray CT of the pressure-sensitive adhesive layer before heating. i) The sample is fixed on a holder with the second adhesive layer facing upward, and 1601 continuous transmission images are taken from 0 to 180° by X-ray CT. ii) Reconstruction was performed based on the obtained total transmission image to create a tomographic image, and analysis software was used to create a three-dimensional reconstructed image (TIF stack image) and a reconstructed cross-sectional image (three views). .
- Image processing was performed on the obtained three-dimensional reconstructed image (TIF stack image) to identify thermally expandable microspheres. From the result of identification, the volume of each thermally expandable microsphere is determined, and from that value, the equivalent sphere diameter of each individual is calculated to determine the average particle diameter and particle size distribution.
- the thermally expandable microspheres have an appropriate strength such that they do not burst until the volume expansion coefficient is preferably 5 times or more, more preferably 7 times or more, and still more preferably 10 times or more.
- the adhesive strength can be efficiently reduced by heat treatment.
- the content of the heat-expandable microspheres in the pressure-sensitive adhesive layer can be appropriately set according to the desired decrease in adhesive force.
- the content of the thermally expandable microspheres is, for example, 1 part by weight to 150 parts by weight, preferably 10 parts by weight to 130 parts by weight, more preferably 100 parts by weight of the base polymer forming the pressure-sensitive adhesive layer. is 25 to 100 parts by weight.
- the arithmetic surface roughness Ra of the first adhesive layer before the thermally expandable microspheres are expanded is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. is.
- the undercoat layer contains any suitable adhesive.
- the adhesive that constitutes the undercoat layer include acrylic adhesives, rubber adhesives, silicone adhesives, and the like. Among them, an acrylic pressure-sensitive adhesive can be preferably used.
- an active energy ray-curable acrylic adhesive (hereinafter referred to as an active energy ray-curable adhesive) may be used.
- the same pressure-sensitive adhesive as the pressure-sensitive adhesive forming the first pressure-sensitive adhesive layer is used as the pressure-sensitive adhesive forming the undercoat layer.
- the thickness of the undercoat layer is preferably 1 ⁇ m to 40 ⁇ m, more preferably 5 ⁇ m to 35 ⁇ m, still more preferably 10 ⁇ m to 30 ⁇ m. Within such a range, it is possible to obtain a double-sided pressure-sensitive adhesive sheet which is excellent in liner peeling operability and in which the effect of heating the thermally expandable microspheres on the substrate side is suppressed.
- the elastic modulus of the undercoat layer is preferably 0.001 MPa to 10 MPa, more preferably 0.01 MPa to 8 MPa, and more preferably 0.5 MPa to 5 MPa. Within such a range, it is possible to obtain a double-sided pressure-sensitive adhesive sheet which is excellent in liner peeling operability and in which the effect of heating the thermally expandable microspheres on the substrate side is suppressed.
- the undercoat layer contains an active energy ray-curable pressure-sensitive adhesive
- the undercoat layer is cured by irradiation with an active energy ray, and its elastic modulus is preferably 1 MPa to 200 MPa, and 5 MPa to 150 MPa. is more preferable, and 10 MPa to 100 MPa is even more preferable.
- the substrate may be composed of any suitable material.
- Various sheet materials such as plastic film, plastic sheet, paper, cloth, nonwoven fabric, metal foil, a plastic laminate thereof, and a laminate of plastics can be used as the base material.
- plastic films and plastic sheets are most preferable from the viewpoint of handling and cost.
- the material for the plastic film can be selected according to need from the viewpoint of strength, heat resistance, and the like.
- polyethylene polyethylene
- PP polypropylene
- EVA ethylene-vinyl acetate copolymer
- PBT polyethylene terephthalate
- PET polyethylene
- Polyesters such as naphthalate (PEN) and polybutylene terephthalate (PBT)
- PVC polyvinyl chloride
- PPS polyphenylene sulfide
- amide resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); Ketone (PEEK), polyimide, polyetherimide, polystyrene, acrylic resin and the like.
- any of an unstretched film, a uniaxially oriented film, and a biaxially oriented film may be used.
- these films may be laminated films composed of two or more film layers, or films to which a lubricant such as inert particles is appropriately added may be used from the viewpoint of handleability.
- the product of the cube of the thickness of the substrate and the elastic modulus of the substrate is preferably 1 ⁇ 10 ⁇ 7 (N/m) to 5 ⁇ 10 ⁇ 2 (N/m ), more preferably 6 ⁇ 10 ⁇ 6 (N/m) to 3 ⁇ 10 ⁇ 2 (N/m), still more preferably 2 ⁇ 10 ⁇ 5 (N/m) to 2.5 ⁇ 10 ⁇ 2 (N/m).
- the thickness of the base material is preferably 20 ⁇ m to 250 ⁇ m, more preferably 30 ⁇ m to 200 ⁇ m, still more preferably 35 ⁇ m to 190 ⁇ m. Within such a range, it is possible to obtain a double-faced PSA sheet that is excellent in strength, flexibility, flexibility, buckling resistance, operability, and the like.
- the elastic modulus of the base material is preferably 500 MPa to 5000 MPa, more preferably 650 MPa to 4500 MPa, and still more preferably 750 MPa to 4000 MPa. Within such a range, it is possible to obtain a double-faced PSA sheet that is excellent in strength, flexibility, flexibility, buckling resistance, operability, and the like.
- the base material may be surface-treated.
- surface treatment include corona treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, and coating treatment with a primer.
- the substrate may be printed with ink or the like in order to enhance the liner edge recognition and to enhance the anchoring property between the substrate and the adhesive layer.
- ink "NB300" manufactured by Dainichi Seika Co., Ltd. can be used.
- the double-sided PSA sheet can be produced by any appropriate method.
- the double-sided pressure-sensitive adhesive sheet of the present invention is, for example, a laminate formed by coating a composition containing a pressure-sensitive adhesive on a liner (first liner/first pressure-sensitive adhesive layer, second pressure-sensitive adhesive layer/second 2 liner) to the substrate.
- a composition containing an adhesive may contain any suitable solvent.
- the second adhesive layer can be formed by coating a substrate with a composition containing thermally expandable microspheres, an adhesive, and any suitable solvent. Alternatively, after sprinkling heat-expandable microspheres on the adhesive coating layer, the heat-expandable microspheres are embedded in the adhesive using a laminator or the like to form an adhesive layer containing the heat-expandable microspheres. may be formed.
- the undercoat layer is formed, for example, by applying a composition (adhesive) for forming the undercoat layer onto the substrate or onto the second pressure-sensitive adhesive layer. can do.
- each layer can be formed by coating and then drying.
- the coating method include coating methods using a multi-coater, die coater, gravure coater, applicator, and the like. Drying methods include, for example, natural drying and heat drying.
- the heating temperature for drying by heating can be set to any suitable temperature depending on the properties of the substance to be dried.
- the liner-attached double-sided pressure-sensitive adhesive sheet can be preferably used as a temporary fixing sheet when processing any appropriate member (for example, electronic parts such as semiconductor chips).
- the liner-attached double-sided pressure-sensitive adhesive sheet can be used as a sheet for temporarily fixing a semiconductor chip during the manufacture of CSP (Chip Size/Scale Package) or WLP (Wafer Level Package).
- the liner-attached double-sided pressure-sensitive adhesive sheet is used for processing including the step of peeling off the second liner first.
- the semiconductor chip is pressure processed.
- the liner-attached double-sided pressure-sensitive adhesive sheet is roll-shaped.
- a PET film manufactured by Toray Industries, Inc., trade name “Lumirror S10”, thickness 38 ⁇ m
- the Si-K ⁇ ray intensity of the obtained liner was 8 (kcps) (the measuring method will be described later).
- a PET film manufactured by Toray Industries, Inc., trade name “Lumirror S10”, thickness 38 ⁇ m
- the release treatment agent solution is coated with the above-mentioned release treatment agent solution using a gravure method, dried using a hot air oven, and the thickness A liner b of 38 ⁇ m was obtained.
- the Si-K ⁇ ray intensity of the resulting liner was 84 (kcps).
- the sandblasted surface of the PET film was coated with the release agent solution described above using a gravure method, and dried using a hot air oven to obtain a liner c having a thickness of 38 ⁇ m.
- the Si-K ⁇ ray intensity of the resulting liner was 18 (kcps).
- the sandblasted surface of the PET film was coated with the release agent solution described above using a gravure method, and dried using a hot air oven to obtain a liner d having a thickness of 38 ⁇ m.
- the Si-K ⁇ ray intensity of the resulting liner was 184 (kcps).
- Example 1 Preparation of first liner/first pressure-sensitive adhesive layer/substrate laminate
- a toluene solution of polymer 1 (acrylic polymer 1: 100 parts), 3 parts of an isocyanate cross-linking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L”), and a plasticizer (manufactured by DIC, trade name "Monocizer W700”) ”) was mixed with 10 parts to prepare a mixed liquid A.
- polymer 1 acrylic polymer 1: 100 parts
- 3 parts of an isocyanate cross-linking agent manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L
- a plasticizer manufactured by DIC, trade name "Monocizer W700”
- the undercoat layer is transferred to the substrate surface of the first liner/first pressure-sensitive adhesive layer/substrate laminate to form a laminate consisting of the first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer got a body (Preparation of second pressure-sensitive adhesive layer/second liner)
- a toluene solution of polymer 1 polymer 1: 100 parts
- an isocyanate cross-linking agent manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L”
- a tackifying resin manufactured by Sumitomo Bakelite Co., Ltd., trade name "Sumilite PR12603
- 30 parts of thermally expandable microspheres manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere FN-180SSD
- a coloring agent manufactured by Dainichiseika Co., Ltd., trade name "DYMICS SZ-
- Example 2 instead of the substrate (stretched polypropylene film (OPP film), manufactured by Toray Industries, Inc., trade name “Torayfan”, thickness: 38 ⁇ m), the substrate (PET film, manufactured by Toray Industries, Inc., trade name “Lumirror S10”, thickness: 75 ⁇ m ) was used to obtain a double-sided pressure-sensitive adhesive sheet with a liner in the same manner as in Example 1.
- OHP film polypropylene film
- Torayfan thickness: 38 ⁇ m
- PET film manufactured by Toray Industries, Inc., trade name “Lumirror S10”, thickness: 75 ⁇ m
- Example 3 instead of the substrate (stretched polypropylene film (OPP film), manufactured by Toray Industries, trade name “Torayfan”, thickness: 38 ⁇ m), the substrate (PET film, manufactured by Toray Industries, trade name “Lumirror S10”, thickness: 188 ⁇ m ) was used to obtain a double-sided pressure-sensitive adhesive sheet with a liner in the same manner as in Example 1.
- OHP film stretched polypropylene film
- Torayfan thickness: 38 ⁇ m
- PET film manufactured by Toray Industries, trade name “Lumirror S10”, thickness: 188 ⁇ m
- Example 4 Except for using the heat-expanded microspheres classified by putting the trade name "Matsumoto Microsphere FN-180SSD” manufactured by Matsumoto Yushi Seiyaku Co., Ltd. into a centrifugal force type wind classifier and classifying them so that D50 is 7 ⁇ m and D80 is 15 ⁇ m. , in the same manner as in Example 1 to obtain a liner-attached double-sided pressure-sensitive adhesive sheet.
- Example 5 Except for the use of thermally expanded microspheres classified by putting the trade name "Matsumoto Microsphere FN-180SSD” manufactured by Matsumoto Yushi Seiyaku Co., Ltd. into a centrifugal force type wind classifier and classifying them so that D50 is 28 ⁇ m and D80 is 45 ⁇ m. , in the same manner as in Example 1 to obtain a liner-attached double-sided pressure-sensitive adhesive sheet.
- Example 6 A toluene solution of polymer 2 (acrylic polymer 2: 100 parts), an epoxy cross-linking agent (manufactured by Mitsubishi Gas Co., Ltd., trade name "Tetrad C”) 0.8 parts, and a tackifier (manufactured by Yasuhara Chemical Co., trade name " A mixed solution A' was prepared by mixing 5 parts of YS Polyster S145").
- a double-sided pressure-sensitive adhesive sheet with a liner was obtained in the same manner as in Example 1, except that the mixture A′ was used instead of the mixture A to form a first pressure-sensitive adhesive layer having a thickness of 5 ⁇ m.
- Example 7 A toluene solution of polymer 3 (acrylic polymer 3: 100 parts), an epoxy cross-linking agent (manufactured by Mitsubishi Gas Co., Ltd., trade name "Tetrad C") 1.2 parts, and a tackifier (manufactured by Yasuhara Chemical Co., trade name " A mixed solution A'' was prepared by mixing 5 parts of YS Polyster S145'').
- a liner-equipped double-sided pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the mixture A′′ was used instead of the mixture A to form a first pressure-sensitive adhesive layer having a thickness of 5 ⁇ m.
- Example 1 A liner was prepared in the same manner as in Example 1, except that liner c was used instead of liner a, and "Matsumoto Microsphere FN-180D” manufactured by Matsumoto Yushi Seiyaku Co., Ltd. was used as thermally expandable microspheres. A double-sided pressure-sensitive adhesive sheet was obtained.
- Example 2 A liner was prepared in the same manner as in Example 1, except that liner d was used instead of liner a, and "Matsumoto Microsphere FN-180D” manufactured by Matsumoto Yushi Seiyaku Co., Ltd. was used as thermally expandable microspheres. A double-sided pressure-sensitive adhesive sheet was obtained.
- i) The sample was fixed on a holder with the second pressure-sensitive adhesive layer facing upward, and 1601 continuous transmission images were taken from 0 to 180° by X-ray CT.
- X-ray CT was measured using ZEISS Xradia 520 Versa at a tube voltage of 40 kV, a tube current of 73 ⁇ A, and a pixel size of 0.3 ⁇ m/Pixel.
- ii) Reconstruction is performed based on the obtained total transmission image to create a tomographic image, and the analysis software ImageJ. was used to create a three-dimensional reconstructed image (TIF stack image) and a reconstructed cross-sectional image (three views).
- Apparatus and measurement conditions/apparatus Nanoindenter; Triboindenter manufactured by Hysitron Inc.
- ⁇ Measurement method single indentation method
- ⁇ Measurement temperature 25°C
- Indentation speed about 1000 nm/sec
- ⁇ Indentation depth about 800 nm
- ⁇ Probe Diamond, Berkovich type (triangular pyramid type)
- Adhesive layer surface shape evaluation UV curable adhesive tape (manufactured by Nitto Denko, trade name “UB-3102D”) is shaped into the first adhesive layer surface shape to form the first adhesive layer. The morphology of the surface was evaluated. Specifically, it was evaluated by the following methods.
- the liner of the liner-equipped double-sided pressure-sensitive adhesive sheet is peeled off, the second pressure-sensitive adhesive layer is adhered to the glass plate, and the first pressure-sensitive adhesive layer is coated with a UV curable pressure-sensitive adhesive tape (manufactured by Nitto Denko Co., Ltd., trade name "UB-3102D"). pasted together. After that, the adhesive surface of the UV-curable adhesive tape was cured. The curing was performed by irradiating ultraviolet rays (irradiation amount: 460 mJ/cm 2 ) from the substrate side of UB-3102D using an ultraviolet irradiation device (UM-810 manufactured by Nitto Seiki Co., Ltd.).
- the UV-curable adhesive tape was peeled off, and the maximum peak height Rp of the surface attached to the first adhesive layer was measured.
- a sample having a maximum peak height Rp of 3 ⁇ m or less was evaluated as acceptable ( ⁇ in the table).
- Si-K ⁇ Ray Intensity Measurement of Liner Fluorescent X-ray analysis was performed on 100 randomly selected points on the surface of the liner (release-treated surface).
- the intensity (i) of the Si—K ⁇ ray of the surface of the liner in contact with the adhesive layer (the surface coated with the release agent) and the surface not in contact with the adhesive layer (the surface coated with the release agent) Measure the intensity (ii) of the Si-K ⁇ ray of the surface that is not exposed), obtain the absolute value of the value obtained by subtracting the value of (ii) from the value of (i), and calculate the average value of 100 measurements of the value.
- the Si—K ⁇ ray intensity of the liner was used.
- the intensity of the Si-K ⁇ ray is the intensity at a wavelength of 7.125 angstroms as measured by the following equipment.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
1つの実施形態においては、上記熱膨張性微小球の体積累積粒子径D50が、5μm~30μmである。
1つの実施形態においては、上記熱膨張性微小球の体積累積粒子径D80が、10μm~50μmである。
1つの実施形態においては、上記基材の厚みの3乗と、該基材の弾性率との積が、1×10-7(N/m)~1×10-2(N/m)である。
1つの実施形態においては、上記第1の粘着剤層が、ベースポリマーを含む粘着剤から構成され、該ベースポリマーのガラス転移温度が、-50℃~0℃である。
1つの実施形態においては、上記ライナー付両面粘着シートは、CSP(Chip Size/Scale Package)の製造の際に、半導体チップを仮固定するシートとして用いられる。
1つの実施形態においては、上記ライナー付両面粘着シートは、WLP(Wafer Level Package)の製造の際に、半導体チップを仮固定するシートとして用いられる。
1つの実施形態においては、上記半導体チップが加圧加工される。
図1は、本発明の1つの実施形態によるライナー付両面粘着シートの概略断面図である。ライナー付両面粘着シート100は、第1のライナー10と、第1の粘着剤層21と、基材22と、第2の粘着剤層23と、第2のライナー30とをこの順に備える。第1の粘着剤層21と、基材22と、第2の粘着剤層23とは、両面粘着シート20を構成する。第1のライナー10の第1の粘着剤層21側の面の算術表面粗さRaは、1nm~100nmである。第2のライナー30の第2の粘着剤層23側の面の算術表面粗さRaは、1nm~100nmである。第1のライナー10の第1の粘着剤層21側の面の最大高さRzは、5nm~1000nmである。第2のライナー30の第2の粘着剤層23側の面の最大高さRzは、5nm~1000nmである。
代表的には、上記第1のライナーおよび第2のライナーは、ライナー基材と、ライナー基材の少なくとも片面に配置された剥離処理層とを備える。第1のライナーおよび第2のライナーは、上記剥離処理層が両面粘着シート側となるようにして配置される。なお、第1のライナーおよび第2のライナーは、同じ構成であってもよく、それぞれ異なる構成であってもよい。
上記のとおり、両面粘着シートは、第1の粘着剤層と、基材と、第2の粘着剤層とをこの順に備える。1つの実施形態においては、両面粘着シートは、第2の粘着剤層と基材との間に配置された下塗層をさらに備える。下塗層を備えていていれば、被着体に対する追従性に優れる両面粘着シートを得ることができる。また、熱膨張性微小球を含む第2の粘着剤層は、加熱されると熱膨張微小球の膨張にともない、厚み方法に膨張しようと変形が生じるが、下塗り層により基材方向への変形が抑制されるため、剥離性が向上する。
第1の粘着剤層は、任意の適切な粘着剤から構成される。第1の粘着剤層を構成する粘着剤としては、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤等が挙げられる。なかでも、アクリル系粘着剤が好ましく用いられ得る。また、粘着剤として、活性エネルギー線硬化型のアクリル系粘着剤(以下、活性エネルギー線硬化型粘着剤)を用いてもよい。粘着剤の詳細は、例えば、特開2015-168711号公報に記載されている。当該公報の記載は、本明細書に参考として援用される。
1つの実施形態においては、上記粘着剤として、アクリル系粘着剤が用いられる。上記アクリル系粘着剤としては、例えば、(メタ)アクリル酸アルキルエステルの1種または2種以上を単量体成分として用いたアクリル系ポリマー(ホモポリマーまたはコポリマー)をベースポリマーとするアクリル系粘着剤等が挙げられる。
1/(273+Tg)=Σ(Wi/(273+Tgi))
単量体から形成される単重合体のガラス転移温度としては、アクリロニトリル単重合体(AN):97℃、メチルメタクリレート単重合体(MMA):102℃、メタクリロイルニトリル単重合体(MAN):120℃、塩化ビニリデン単重合体:75℃、イソボルニルアクリレート単重合体:97℃、メチルアクリレート単重合体:10℃、ブチルアクリレート単重合体:-53℃、エチルアクリレート単重合体:-23℃、アクリル酸単重合体:101℃、2エチルヘキシルアクリレート単重合体:-52℃、2‐ヒドロキシエチルアクリレート:-14℃である。また、これら以外の単重合体のガラス転移温度としては、「Polymer Handbook」(第4版、John Wiley & Sons,Inc、1999年)に記載された値を使用することができる。なお、この文献中、複数のTgの値が記載されている場合は、「conventional」の値を採用する。さらに、前述文献で値の記載が無い場合には、https://polymerdatabase.comに記載の値を採用し、複数のTgが記載されている場合には「PREFERRED」の値を採用する。
上記第2の粘着剤層は、任意の適切な粘着剤および熱膨張性微小球を含み得る。第2の粘着剤層を構成する粘着剤としては、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤等が挙げられる。なかでも、アクリル系粘着剤が好ましく用いられ得る。また、粘着剤として、活性エネルギー線硬化型のアクリル系粘着剤(以下、活性エネルギー線硬化型粘着剤)を用いてもよい。粘着剤の詳細は、例えば、特開2015-168711号公報に記載されている。当該公報の記載は、本明細書に参考として援用される。
上記熱膨張性微小球としては、加熱により膨張または発泡し得る微小球である限りにおいて、任意の適切な熱膨張性微小球を用いることができる。上記熱膨張性微小球としては、例えば、加熱により容易に膨張する物質(揮発性物質)を、弾性を有する殻内に内包させた微小球が用いられ得る。このような熱膨張性微小球は、任意の適切な方法、例えば、コアセルベーション法、界面重合法等により製造できる。
i)第2の粘着剤層を上に向けた状態で試料をホルダーに固定し、X線CTにより0~180°に対し1601枚の連続透過像を撮影する。
ii)得られた全透過像を元に再構成を行って断層像を作成し、解析ソフトを用いて三次元再構成像(TIFスタック像)と再構成断面像(3面図)を作成した。
iii)得られた三次元再構成像(TIFスタック像)について画像処理を施し、熱膨張性微小球の識別を行った。識別結果より、個々の熱膨張性微小球の体積を求め、その値から個々の球相当直径を算出して、平均粒径および粒度分布を求める。
上記下塗り層は、任意の適切な粘着剤を含む。下塗り層を構成する粘着剤としては、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤等が挙げられる。なかでも、アクリル系粘着剤が好ましく用いられ得る。また、粘着剤として、活性エネルギー線硬化型のアクリル系粘着剤(以下、活性エネルギー線硬化型粘着剤)を用いてもよい。好ましくは、下塗り層を構成する粘着剤として、上記第1の粘着剤層を構成する粘着剤と同様の粘着剤が用いられる。
上記基材は、任意の適切な材料から構成され得る。基材は、例えば、プラスチックフィルム、プラスチックシートの他、紙、布、不織布、金属箔、あるいはそれらのプラスチックラミネート体、プラスチック同士の積層体など、様々なシート状物を用いることが可能である。中でも、取り扱い性やコストの観点から、プラスチックフィルムやプラスチックシート(以下、プラスチックフィルムという)が最も好ましい。プラスチックフィルムの素材としては、強度、耐熱性などの観点から、必要に応じて選択できる。例えば、ポリエチレン(PE)、ポリプロピレン(PP)、エチレン-プロピレン共重合体、エチレン-酢酸ビニル共重合体(EVA)等のα-オレフィンをモノマー成分とするオレフィン系樹脂;ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリブチレンテレフタレート(PBT)等のポリエステル;ポリ塩化ビニル(PVC);ポリフェニレンスルフィド(PPS);ポリアミド(ナイロン)、全芳香族ポリアミド(アラミド)等のアミド系樹脂;ポリエーテルエーテルケトン(PEEK)、ポリイミド、ポリエーテルイミド、ポリスチレン、アクリル樹脂などが挙げられる。これらの素材は単独で又は2種以上組み合わせて使用することができる。また、プラスチックフィルムとしては、未延伸フィルム、1軸配向フィルム、2軸配向フィルムのいずれを用いてもよい。また、これらのフィルムは2層以上のフィルム層からなる積層フィルムでもよいし、取り扱い性の観点から、適宜、不活性粒子などの滑剤を添加したフィルムを用いてもよい。
上記両面粘着シートは、任意の適切な方法により製造することができる。本発明の両面粘着シートは、例えば、ライナー上に粘着剤を含む組成物を塗工し形成された積層体(第1のライナ-/第1の粘着剤層、第2の粘着剤層/第2のライナー)を基材に貼り合せる方法により得られ得る。粘着剤を含む組成物は、任意の適切な溶媒を含み得る。
上記ライナー付両面粘着シートは、任意の適切な部材(例えば、半導体チップ等の電子部品)を加工する際の仮固定用シートとして好ましく用いられ得る。1つの実施形態においては、上記ライナー付両面粘着シートは、CSP(Chip Size/Scale Package)またはWLP(Wafer Level Package)の製造の際に、半導体チップを仮固定するシートとして用いられ得る。1つの実施形態においては、上記ライナー付両面粘着シートは、上記第2のライナーが先に剥離される工程を含む加工に用いられる。1つの実施形態においては、上記半導体チップは加圧加工される。
付加型シリコーン処理剤(信越シリコーン社製、主剤「KS-774」:100重量部、触媒「CAT PL-3」:0.4重量部)を、ヘプタンとヘキサンの混合溶媒(混合重量比1:1)に溶解し、処理剤の濃度を0.3%に調整した剥離処理剤溶液を作製した。
次に、PETフィルム(東レ社製、商品名「ルミラーS10」、厚み38μm)の一方の面に、グラビア法を用いて前述の剥離処理剤溶液塗布し、熱風オーブンを用いて乾燥を行い、厚み38μmのライナーaを得た。得られたライナーのSi-Kα線の強度は8(kcps)であった(測定方法は後述)。
付加型シリコーン処理剤(信越シリコーン社製、主剤「KS-774」:100重量部、触媒「CAT PL-3」:0.4重量部)を、ヘプタンとヘキサンの混合溶媒(混合重量比1:1)に溶解し、処理剤の濃度を1.8%に調整した剥離処理剤溶液を作製した。
次に、PETフィルム(東レ社製、商品名「ルミラーS10」、厚み38μm)の一方の面に、グラビア法を用いて前述の剥離処理剤溶液塗布し、熱風オーブンを用いて乾燥を行い、厚み38μmのライナーbを得た。得られたライナーのSi-Kα線の強度は84(kcps)であった。
PETフィルム(東レ社製、商品名「ルミラーS10」、厚み38μm)の一方の面に、ソニー製「パウダービーム」を用いてサンドブラスト加工をした。
付加型シリコーン処理剤(信越シリコーン社製、主剤「KS-774」:100重量部、触媒「CAT PL-3」:0.4重量部)を、ヘプタンとヘキサンの混合溶媒(混合重量比1:1)に溶解し、処理剤の濃度を0.3%に調整した剥離処理剤溶液を作製した。
次に、上記PETフィルムのサンドブラスト加工面に、グラビア法を用いて前述の剥離処理剤溶液塗布し、熱風オーブンを用いて乾燥を行い、厚み38μmのライナーcを得た。得られたライナーのSi-Kα線の強度は18(kcps)であった。
PETフィルム(東レ社製、商品名「ルミラーS10」、厚み38μm)の一方の面に、ソニー製「パウダービーム」を用いてサンドブラスト加工をした。
付加型シリコーン処理剤(信越シリコーン社製、主剤「KS-774」:100重量部、触媒「CAT PL-3」:0.4重量部)を、ヘプタンとヘキサンの混合溶媒(混合重量比1:1)に溶解し、処理剤の濃度を1.8%に調整した剥離処理剤溶液を作製した。
次に、上記PETフィルムのサンドブラスト加工面に、グラビア法を用いて前述の剥離処理剤溶液塗布し、熱風オーブンを用いて乾燥を行い、厚み38μmのライナーdを得た。得られたライナーのSi-Kα線の強度は184(kcps)であった。
トルエン中に、エチルアクリレート70部と、ブチルアクリレート3部と、2-エチルヘキシルアクリレート30部と、メチルメタクリレート5部と、2-ヒドロキシエチルアクリレート3.5部と、重合開始剤として過酸化ベンゾイル0.2部とを加えた後、加熱して、アクリル系共重合体(アクリル系ポリマー1)のトルエン溶液を得た。なお、アクリル系ポリマー1を構成するモノマー由来の繰り返し単位のうち3.1重量%が活性水素基を有すモノマー由来の繰り返し単位である。また、当該アクリル系ポリマー1のTgは-31℃である。
トルエン中に、ブチルアクリレート50部と、エチルアクリレート50部と、アクリル酸5部と、2-ヒドロキシエチルアクリレート0.2部と、重合開始剤として過酸化ベンゾイル0.2部とを加えた後、加熱して、アクリル系共重合体(アクリル系ポリマー2)のトルエン溶液を得た。なお、アクリル系ポリマー2を構成するモノマー由来の繰り返し単位のうち4.9重量%が活性水素基を有すモノマー由来の繰り返し単位である。また、当該アクリル系ポリマー2のTgは-35℃である。
酢酸エチル中に、メチルアクリレート70部と、ブチルアクリレート2部と、2-エチルヘキシルアクリレート30 部と、アクリル酸10部と、重合開始剤として過酸化ベンゾイル0.2部とを加えた後、加熱して、アクリル系共重合体(アクリル系ポリマー3)の酢酸エチル溶液を得た。なお、アクリル系ポリマー3を構成するモノマー由来の繰り返し単位のうち8.9重量%が活性水素基を有すモノマー由来の繰り返し単位である。また、当該アクリル系ポリマー3のTgは-6℃である。
(第1のライナー/第1の粘着剤層/基材積層体の作製)
ポリマー1のトルエン溶液(アクリル系ポリマー1:100部)と、イソシアネート系架橋剤(日本ポリウレタン社製、商品名「コロネートL」)3部と、可塑剤(DIC社製、商品名「モノサイザーW700」)10部とを混合した混合液Aを作製した。
上記ライナーaの剥離処理剤塗布面に、混合液Aを塗工して、厚み7μmの粘着剤層を形成し、第1のライナー/第1の粘着剤層からなる積層体を得た。
さらに、第1のライナー/第1の粘着剤層積層体の第1の粘着剤層表面に、基材(延伸ポリプロピレンフィルム(OPPフィルム)、東レ社製、商品名「トレファン」、厚み:38μm)を貼り合せて、第1のライナー/第1の粘着剤層/基材からなる積層体を得た。
(第1のライナー/第1の粘着剤層/基材/下塗り層積層体の作製)
ポリマー1のトルエン溶液(ポリマー1:100部)と、イソシアネート系架橋剤(日本ポリウレタン社製、商品名「コロネートL」)3部を混合した混合液Bを作成した。
シリコーン系の剥離処理が施されたPETフィルムに、混合液Bを塗布して、厚みが13μmの下塗り層を形成した。当該下塗り層を、第1のライナー/第1の粘着剤層/基材積層体の基材表面に転写して、第1のライナー/第1の粘着剤層/基材/下塗り層からなる積層体を得た。
(第2の粘着剤層/第2のライナーの作製)
ポリマー1のトルエン溶液(ポリマー1:100部)と、イソシアネート系架橋剤(日本ポリウレタン社製、商品名「コロネートL」)1.5部と、粘着付与樹脂(住友ベークライト社製、商品名「スミライトPR12603」)10部と、熱膨張性微小球(松本油脂製薬社製、商品名「マツモトマイクロスフェアーFN-180SSD」)30部と、着色剤(大日精化社製、商品名「DYMICS SZ-7510グリーン」)0.5部とを混合した混合液Cを作製した。
上記ライナーbの剥離処理剤塗布面に、混合液Cを塗工して、厚み35μmの粘着剤層を形成し、第2の粘着剤層/第2のライナーからなる積層体を得た。
(ライナー付両面粘着シートの作製)
第1のライナー/第1の粘着剤層/基材/下塗り層積層体と、第2の粘着剤層/第2のライナーとを、下塗り層と第2の粘着剤層とが対向するように貼り合せて、ライナー付両面粘着シート(第1のライナー/両面粘着シート(第1の粘着剤層/基材/下塗り層/第2の粘着剤層)/第2のライナー)を得た。
基材(延伸ポリプロピレンフィルム(OPPフィルム)、東レ社製、商品名「トレファン」、厚み:38μm)に代えて、基材(PETフィルム、東レ社製、商品名「ルミラーS10」、厚み:75μm)を用いたこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
基材(延伸ポリプロピレンフィルム(OPPフィルム)、東レ社製、商品名「トレファン」、厚み:38μm)に代えて、基材(PETフィルム、東レ社製、商品名「ルミラーS10」、厚み:188μm)を用いたこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
松本油脂製薬社製の商品名「マツモトマイクロスフェアーFN-180SSD」を遠心力型風力分級機に投入し、D50が7μm、D80が15μmとなるよう分級した熱膨張微小球を用いたこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
松本油脂製薬社製の商品名「マツモトマイクロスフェアーFN-180SSD」を遠心力型風力分級機に投入し、D50が28μm、D80が45μmとなるよう分級した熱膨張微小球を用いたこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
ポリマー2のトルエン溶液(アクリル系ポリマー2:100部)と、エポキシ系架橋剤(三菱ガス社製、商品名「テトラッドC」)0.8部と、粘着付与剤(ヤスハラケミカル社製、商品名「YSポリスターS145」)5部とを混合した混合液A’を作製した。
混合液Aに代えて、混合液A’を用いて、厚みが5μmの第1の粘着剤層を形成したこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
ポリマー3のトルエン溶液(アクリル系ポリマー3:100部)と、エポキシ系架橋剤(三菱ガス社製、商品名「テトラッドC」)1.2部と、粘着付与剤(ヤスハラケミカル社製、商品名「YSポリスターS145」)5部とを混合した混合液A’’を作製した。
混合液Aに代えて、混合液A’’を用いて、厚みが5μmの第1の粘着剤層を形成したこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
ライナーaに代えてライナーcを用い、熱膨張性微小球として、松本油脂製薬社製の商品名「マツモトマイクロスフェアーFN-180D」を用いたこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
ライナーaに代えてライナーdを用い、熱膨張性微小球として、松本油脂製薬社製の商品名「マツモトマイクロスフェアーFN-180D」を用いたこと以外は、実施例1と同様にして、ライナー付両面粘着シートを得た。
実施例および比較例で得られたライナー付両面粘着シートを以下の評価に供した。結果を表1に示す。
(1)算術表面粗さRa、最大高さRz
第1のライナーおよび第2のライナーの剥離処理剤塗布面(すなわち、粘着剤層側の面)の算術表面粗さRaおよび最大高さRzを、をJIS B 0601に準じ、光学式表面粗さ計(Veeco Metrogy Group社製、商品 名「Wyko NT9100」)を用いて、測定した。
(2)熱膨張性微小球の体積累積粒子径D50、D80
X線CTを用い、以下の方法で、熱膨張性微小球の体積累積粒子径D50を測定した。
i)第2の粘着剤層を上に向けた状態で試料をホルダーに固定し、X線CTにより0~180°に対し1601枚の連続透過像を撮影した。X線CTはZEISS, Xradia 520 Versaを用いて、管電圧40kV、管電流73μA、ピクセルサイズ0.3μm/Pixelで測定した。
ii)得られた全透過像を元に再構成を行って断層像を作成し、解析ソフトImageJ.を用いて三次元再構成像(TIFスタック像)と再構成断面像(3面図)を作成した。
iii)得られた三次元再構成像(TIFスタック像)について画像処理を施し、熱膨張性微小球の識別を行った。識別結果より、個々の熱膨張性微小球の体積を求め、その値から個々の球相当直径を算出して、熱膨張性微小球の体積累積粒子径D50、D80を求めた。
(3)弾性率
測定対象(基材)に探針(圧子)を押し当てることで得られる変位―荷重ヒステリシス曲線を、測定装置付帯のソフトウェア(triboscan)で数値処理することで弾性率を得た(3回測定の平均値)。
ナノインデンター装置ならびに測定条件は下記のとおりである。
装置および測定条件・装置:ナノインデンター;Hysitron Inc社製 Triboindenter
・測定方法:単一押し込み法
・測定温度:25℃
・押し込み速度:約1000nm/sec
・押し込み深さ:約800nm
・探針:ダイヤモンド製、Berkovich型(三角錐型)
(4)粘着剤層表面形状評価
UV硬化型粘着テープ(日東電工社製、商品名「UB-3102D」)に、第1の粘着剤層表面形状を賦形して、第1の粘着剤層表面の形状を評価した。具体的には、以下の方法により評価した。
ライナー付両面粘着シートのライナーを剥離し、第2の粘着剤層をガラス板に張り付け、第1の粘着剤層に、UV硬化型粘着テープ(日東電工社製、商品名「UB-3102D」)を貼り合せた。
その後、UV硬化型粘着テープの粘着面を硬化させた。当該硬化は、紫外線照射装置(日東精機社製UM-810)を用いて紫外線(照射量460mJ/cm2)を、UB-3102Dの基材側から照射して行った。
次いで、当該UV硬化型粘着テープを剥離し、第1の粘着剤層に貼着していた面の最大山高さRpを測定した。最大山高さRpが3μm以下のものを合格(表中:〇)とした。
この操作により評価される粘着剤層表面形状が平滑であるほど、両面粘着シート上で部材を加圧する場合において、当該加圧の均一性を高めることができる。
(5)ライナーのSi-Kα線強度測定
ライナー表面(剥離処理面)で無作為に抽出した100点について、蛍光X線分析を行った。より詳細には、ライナーの粘接着剤層に接する面(剥離処理剤を塗布した面)のSi-Kα線の強度(i)および粘接着剤層と接しない面(剥離処理剤を塗布していない面)のSi-Kα線の強度(ii)を測定し、(i)の値から(ii)の値を引いた値の絶対値を求め、当該値の100点測定の平均値をライナーのSi-Kα線強度とした。
なお、Si-Kα線の強度とは下記装置での測定で波長7.125オングストロームにおける強度である。
装置 : Rigaku製 ZSX100e
分析面積 : 30mmφ
分析元素 : Si
分析結晶 : RX4
出力 : 50kV、70mA
20 両面粘着シート
21 第1の粘着剤層
22 基材
23 第2の粘着剤層
30 第2のダイナー
100 粘着シート
Claims (8)
- 第1のライナーと、第1の粘着剤層と、基材と、第2の粘着剤層と、第2のライナーとをこの順に備え、
該第2の粘着剤層が、熱膨張性微小球を含み、
該第1のライナーの該第1の粘着剤層側の面の算術表面粗さRaが、1nm~100nmであり、
該第2のライナーの該第2の粘着剤層側の面の算術表面粗さRaが、1nm~100nmであり、
該第1のライナーの第1の粘着剤層側の面の最大高さRzが、5nm~1000nmであり、
該第2のライナーの第2の粘着剤層側の面の最大高さRzが、5nm~1000nmである、
ライナー付両面粘着シート。 - 前記熱膨張性微小球の体積累積粒子径D50が、5μm~30μmである、請求項1に記載のライナー付両面粘着シート。
- 前記熱膨張性微小球の体積累積粒子径D80が、10μm~50μmである、請求項1または2に記載のライナー付両面粘着シート。
- 前記基材の厚みの3乗と、該基材の弾性率との積が、1×10-7(N/m)~1×10-2(N/m)である、請求項1から3のいずれかに記載のライナー付両面粘着シート。
- 上記第1の粘着剤層が、ベースポリマーを含む粘着剤から構成され、
該ベースポリマーのガラス転移温度が、-50℃~0℃である、請求項1から4のいずれかに記載のライナー付両面粘着シート。 - CSP(Chip Size/Scale Package)の製造の際に、半導体チップを仮固定するシートとして用いられる、請求項1から5のいずれかに記載のライナー付両面粘着シート。
- WLP(Wafer Level Package)の製造の際に、半導体チップを仮固定するシートとして用いられる、請求項1から5のいずれかに記載のライナー付両面粘着シート。
- 上記半導体チップが加圧加工される、請求項6または7に記載のライナー付両面粘着シート。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020237029745A KR20230141838A (ko) | 2021-03-05 | 2021-11-01 | 라이너 구비 양면 점착 시트 |
JP2023503374A JPWO2022185612A1 (ja) | 2021-03-05 | 2021-11-01 | |
CN202180095229.6A CN116917431A (zh) | 2021-03-05 | 2021-11-01 | 带衬垫的双面粘合片 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021035437 | 2021-03-05 | ||
JP2021-035437 | 2021-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022185612A1 true WO2022185612A1 (ja) | 2022-09-09 |
Family
ID=83154247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/040264 WO2022185612A1 (ja) | 2021-03-05 | 2021-11-01 | ライナー付両面粘着シート |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022185612A1 (ja) |
KR (1) | KR20230141838A (ja) |
CN (1) | CN116917431A (ja) |
TW (1) | TW202235563A (ja) |
WO (1) | WO2022185612A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002220569A (ja) * | 2001-01-24 | 2002-08-09 | Nitto Denko Corp | 加熱剥離型粘着シートの製造方法 |
JP2006152308A (ja) * | 2005-12-28 | 2006-06-15 | Nitto Denko Corp | 電子部品の切断方法 |
WO2008133120A1 (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corporation | 熱剥離型両面粘着シート |
JP2009035609A (ja) * | 2007-07-31 | 2009-02-19 | Nitto Denko Corp | 熱剥離型粘着シートを使用する被着体の加工方法。 |
WO2010122942A1 (ja) * | 2009-04-21 | 2010-10-28 | 日東電工株式会社 | 加熱膨張型再剥離性アクリル系粘着テープ又はシート |
JP2021006635A (ja) * | 2020-09-18 | 2021-01-21 | 日東電工株式会社 | 粘着シート |
WO2021024850A1 (ja) * | 2019-08-06 | 2021-02-11 | 日東電工株式会社 | 粘着テープ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4069625B2 (ja) | 2002-01-09 | 2008-04-02 | 日立化成工業株式会社 | セパレータ付き感圧型接着シート及び光学部材組立体並びにその組立方法 |
-
2021
- 2021-11-01 WO PCT/JP2021/040264 patent/WO2022185612A1/ja active Application Filing
- 2021-11-01 CN CN202180095229.6A patent/CN116917431A/zh active Pending
- 2021-11-01 KR KR1020237029745A patent/KR20230141838A/ko unknown
- 2021-11-01 JP JP2023503374A patent/JPWO2022185612A1/ja active Pending
-
2022
- 2022-01-14 TW TW111101661A patent/TW202235563A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002220569A (ja) * | 2001-01-24 | 2002-08-09 | Nitto Denko Corp | 加熱剥離型粘着シートの製造方法 |
JP2006152308A (ja) * | 2005-12-28 | 2006-06-15 | Nitto Denko Corp | 電子部品の切断方法 |
WO2008133120A1 (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corporation | 熱剥離型両面粘着シート |
JP2009035609A (ja) * | 2007-07-31 | 2009-02-19 | Nitto Denko Corp | 熱剥離型粘着シートを使用する被着体の加工方法。 |
WO2010122942A1 (ja) * | 2009-04-21 | 2010-10-28 | 日東電工株式会社 | 加熱膨張型再剥離性アクリル系粘着テープ又はシート |
WO2021024850A1 (ja) * | 2019-08-06 | 2021-02-11 | 日東電工株式会社 | 粘着テープ |
JP2021006635A (ja) * | 2020-09-18 | 2021-01-21 | 日東電工株式会社 | 粘着シート |
Also Published As
Publication number | Publication date |
---|---|
TW202235563A (zh) | 2022-09-16 |
JPWO2022185612A1 (ja) | 2022-09-09 |
CN116917431A (zh) | 2023-10-20 |
KR20230141838A (ko) | 2023-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105907317B (zh) | 热剥离型粘合片 | |
US7635516B2 (en) | Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet | |
US7811647B2 (en) | Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet | |
JP5349803B2 (ja) | 熱剥離型両面粘着テープ又はシートおよび被着体の加工方法 | |
JP2000248240A (ja) | 加熱剥離型粘着シート | |
JP5921927B2 (ja) | 加熱剥離型粘着シート | |
WO2012099121A1 (ja) | 両面粘着テープ又はシート、および被着体の加工方法 | |
TW200305624A (en) | Heat-peelable pressure-sensitive adhesive sheet for electronic part, method of processing electronic part, and electronic part | |
JP2001323228A (ja) | 加熱剥離型粘着シート | |
JP2012184292A (ja) | 加熱剥離型粘着シート | |
TW201348393A (zh) | 電子零件切斷用加熱剝離型黏著片材及電子零件加工方法 | |
JPH11166164A (ja) | 加熱剥離型粘着シート | |
WO2022123932A1 (ja) | 粘着シート | |
WO2020049986A1 (ja) | 粘着シート | |
EP3363872A1 (en) | Separator-fitted adhesive tape and separator | |
JP7133355B2 (ja) | 粘着シート | |
JP2005314708A (ja) | 加熱剥離型粘着シート | |
JP2005200505A (ja) | 加熱剥離型粘着シートおよび被着体の加工方法 | |
WO2022185612A1 (ja) | ライナー付両面粘着シート | |
WO2022185610A1 (ja) | ライナー付き両面粘着シート | |
JP7428473B2 (ja) | 電子部品の製造方法 | |
WO2022185611A1 (ja) | 粘着シート | |
WO2023021773A1 (ja) | 粘着シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21929172 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2023503374 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20237029745 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202180095229.6 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21929172 Country of ref document: EP Kind code of ref document: A1 |