WO2022183893A1 - 屏幕模组、显示组件及电子设备 - Google Patents

屏幕模组、显示组件及电子设备 Download PDF

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Publication number
WO2022183893A1
WO2022183893A1 PCT/CN2022/075894 CN2022075894W WO2022183893A1 WO 2022183893 A1 WO2022183893 A1 WO 2022183893A1 CN 2022075894 W CN2022075894 W CN 2022075894W WO 2022183893 A1 WO2022183893 A1 WO 2022183893A1
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WO
WIPO (PCT)
Prior art keywords
layer
screen module
support plate
thickness
panel
Prior art date
Application number
PCT/CN2022/075894
Other languages
English (en)
French (fr)
Inventor
吕焱
严斌
周国统
马冬
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US17/790,347 priority Critical patent/US20240177641A1/en
Priority to EP22731463.0A priority patent/EP4083788B1/en
Publication of WO2022183893A1 publication Critical patent/WO2022183893A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/03—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays
    • G09G3/035—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays for flexible display surfaces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the present application relates to the field of display technology, and in particular, to a screen module, a display assembly and an electronic device.
  • COP chip on plastic packaging technology
  • the display panel will be bent to form a bending area.
  • the bending area formed by the bending of the display panel needs to ensure a certain bending radius.
  • the bending area of the display panel can be supported by the support layer, and a display driver chip is also arranged in the lower area of the display panel, and the thickness of the display driver chip cannot be reduced, so the flexible screen electronic
  • the thickness of the equipment is generally larger.
  • Embodiments of the present application provide a screen module, a display assembly, and an electronic device, which can reduce the thickness of the screen module and the display assembly.
  • the present application provides a screen module.
  • the screen module includes a display panel, a support layer and a display driver chip. After the display panel is bent, a first panel layer and a second panel layer spaced up and down are formed; the first panel layer and the second panel layer are connected by the bending area.
  • a support layer is located between the first panel layer and the second panel layer.
  • the display driving chip is located on the side of the second panel layer away from the first panel layer.
  • the thickness of the support layer near the bending area is greater than the thickness of the first area of the support layer; the projection of the first area of the support layer on the first panel layer overlaps the projection of the display driver chip on the first panel layer.
  • the screen module adopts a bendable display panel, and the bent display panel, that is, the first panel layer and the second panel layer, is aligned with the support layer to ensure the bending radius of the bending area.
  • the bent display panel that is, the first panel layer and the second panel layer
  • the support layer is aligned with the support layer to ensure the bending radius of the bending area.
  • a support layer of unequal thickness is used, that is, the thickness of the support layer near the bending area is thicker, which can ensure the bending radius of the bending area.
  • the thickness of the support layer near the display driver chip is thinner. After lamination, the thickness of the screen module can be reduced to meet the user's requirement for low thickness of electronic devices.
  • the support layer may include a first support plate and a second support plate, the first support plate and the second support plate are stacked, and the second support plate is located near the bending area
  • the length of the second support plate is smaller than the distance from the display driver chip to the bending area.
  • the thickness of the support layer near the bending area is the sum of the thickness of the first support plate and the thickness of the second support plate, so as to ensure the bending of the bending area.
  • the thickness of the support layer close to the display driver chip is only the thickness of the first support plate, so as to reduce the thickness of each layer structure in the screen module after stacking, so as to reduce the thickness of the screen module.
  • the second support plate may be located on a side of the first support plate away from the first panel layer. In this way, the thickness of the screen module can be reduced, and the stability of the structure of the screen module can also be improved.
  • the support layer may include a first support plate and a second support plate, and the first support plate and the second support plate are arranged side by side; the thickness of the second support plate is greater than that of the first support plate the thickness of the board, and the second support board is arranged close to the bending area; the length of the second support board is less than the distance from the display driver chip to the bending area.
  • the thickness of the support layer near the bending area is the thickness of the second support plate.
  • the thickness of the support layer close to the display driver chip is the thickness of the first support plate, in order to reduce the thickness of each layer structure in the screen module after stacking, in order to reduce the screen module. thickness of.
  • the support layer may include a first support plate, and the first support plate is a support plate of unequal thickness.
  • the bending radius of the bending region is less than 0.3 mm.
  • the bending radius of the bending region may be 0.2 mm to 0.3 mm.
  • the present application provides a display assembly.
  • the display assembly includes a glass cover plate and any possible screen module as described in the first aspect above.
  • the glass cover plate covers the screen module and is located on the side of the first panel layer away from the display driver chip.
  • the screen module further includes a polarizer layer; the polarizer layer is located on the side of the first panel layer away from the display driver chip.
  • the polarizer layer of the screen module is bonded to the glass cover plate through an optical adhesive layer.
  • the present application provides an electronic device.
  • the electronic device includes a battery cover and any possible display assembly of the second aspect above.
  • the battery cover is located on the side of the screen module away from the glass cover.
  • Fig. 1 is the structural representation of a kind of mobile phone
  • FIG. 2 is a schematic structural diagram 1 of a screen module provided by an embodiment of the present application.
  • FIG. 3 is a second structural schematic diagram of a screen module provided by an embodiment of the present application.
  • FIG. 4 is a third structural schematic diagram of a screen module provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram 1 of a display assembly provided by an embodiment of the present application.
  • FIG. 6 is a second schematic structural diagram of a display assembly provided by an embodiment of the present application.
  • FIG. 7 is a third schematic structural diagram of a display assembly provided by an embodiment of the present application.
  • FIG. 8 is a fourth schematic structural diagram of a display assembly provided by an embodiment of the present application.
  • orientation terms such as “upper” and “lower” are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative In the description and clarification of the drawings, it may change correspondingly according to the change of the orientation in which the components are placed in the drawings.
  • COP packaging technology is usually used. COP packaging technology is where part of the display panel of an electronic device is bent, thereby shrinking the bezel.
  • FIG. 1 is a schematic structural diagram of a mobile phone.
  • the mobile phone 10 includes a display component 11 , a subscriber identity module (SIM) 12 , a mobile phone small board 13 , and a battery cover 14 .
  • SIM subscriber identity module
  • the battery cover 14 , the small board of the mobile phone, the SIM card and the display assembly are stacked in sequence.
  • the above-mentioned display assembly includes a glass cover plate 200 and a screen module 100 , and the glass cover plate 200 covers the screen module 100 .
  • the structure of the above-mentioned mobile phone 10 is not limited to the structure of the above-mentioned display assembly 11 and other structures, and may also include other structures, such as a middle frame, a PCB board, a camera module and other structures, which are not particularly limited in the embodiments of the present application.
  • the screen module 100 includes a display panel 101 that can be bent.
  • a display panel 101 that can be bent.
  • the bending region 1013 of the display panel 101 can be supported by the support layer 102 , and the bending radius of the display panel 101 after bending can be controlled by the thickness of the support layer 102 .
  • a display driver chip 103 is also provided in the lower area of the display panel 101, and the thickness of the display driver chip 103 cannot be reduced, so the thickness of the flexible screen electronic device (the mobile phone shown in FIG. 1) is Generally larger.
  • the embodiment of the present application provides an improved screen module.
  • the screen module provided by the embodiment of the present application will be described in detail below with reference to FIG. 2 to FIG. 4 .
  • the screen module 100 includes a display panel 101 , a support layer 102 and a display driver chip 103 .
  • the display panel 101 is a flexible and bendable panel, and the display panel 101 is bent to form a first panel layer 1011 and a second panel layer 1012 spaced up and down.
  • the first panel layer 1011 and the second panel layer 1012 are connected by a bending region 1013 .
  • the bending region 1013 is formed by bending the display panel 101 .
  • the support layer 102 is used to form a support between the first panel layer 1011 and the second panel layer 1012 to ensure the bending radius of the bending area 1013 .
  • the bending radius of the bending region 1013 may be less than 0.3 mm, and specifically may be 0.2 mm to 0.3 mm. Therefore, the support layer 102 is located between the first panel layer 1011 and the second panel layer 1012 .
  • the display driving chip 103 is used to drive the display panel 101 to display characters, patterns, colors, and the like. When the COP package is used, the display driver chip 103 is located below the display panel 101, that is, the display driver chip 103 is located on the side of the second panel layer 1012 away from the first panel layer 1011.
  • the thickness of the support layer 102 near the bending region 1013 is greater than the thickness of the first region in the support layer 102 .
  • the projection of the first region of the support layer 102 on the first panel layer 1011 overlaps with the projection of the display driving chip 103 on the first panel layer 1011 . That is to say, the thickness of the support layer 102 near the bending region 1013 is thicker, which can ensure the bending radius of the bending region 1013 .
  • the thickness of the support layer 102 near the display driver chip 103 is thinner, and after lamination, the thickness of the screen module 100 can be reduced to meet the requirement of low thickness for electronic devices.
  • the material of the support layer 102 can be a metal material or a non-metal material, such as polyethylene terephthalate (PET), foam, silica gel, aluminum alloy, copper alloy , stainless steel or iron, etc., or a combination of many different materials. Therefore, the material of the support layer 102 is not particularly limited in this embodiment of the present application.
  • PET polyethylene terephthalate
  • foam silica gel
  • aluminum alloy aluminum alloy
  • copper alloy copper alloy
  • stainless steel or iron etc.
  • the material of the support layer 102 is not particularly limited in this embodiment of the present application.
  • hierarchical structures such as a substrate and a super clean film (SCF), may also be disposed between the above-mentioned first panel layer 1011 and the support layer 102, which are not particularly limited in the embodiments of the present application.
  • SCF super clean film
  • the present application provides various implementations as shown in FIGS. 2 to 4 . Way.
  • the support layer 102 shown in FIG. 1 may include a first support plate 1021 and a second support plate 1022 , wherein the size of the first support plate 1021 is larger and the size of the second support plate 1022 is smaller.
  • the second support plate 1022 is located on the side close to the bending area 1013 , so that the thickness of the support layer 102 close to the bending area 1013 is thicker.
  • the size of the second support plate 1022 is smaller than the distance from the display driver chip 103 to the bending region 1013 , so that the second support plate 1022 is not within the overlapping range of the display driver chip 103 and the display panel 101 , avoiding the support layer 102 and the display driver chip. After 103 is stacked, the thickness of the screen module 100 is increased.
  • the thickness of the support layer 102 near the bending region 1013 is the sum of the thickness of the first support plate 1021 and the thickness of the second support plate 1022, In order to ensure the bending radius of the bending area 1013, and to make the thickness of the support layer 102 close to the display driver chip 103 only the thickness of the first support plate 1021, so as to reduce the thickness of each layer structure in the screen module 100 after stacking , so as to reduce the thickness of the screen module 100 .
  • the material of the support layer 102 may be a hard material such as stainless steel or iron, the first support plate 1021 may not be able to be bent. If the second support plate 1022 is located on the side of the first support plate 1021 close to the first panel layer 1011 , that is, the second support plate 1022 is located between the first support plate 1021 and the first panel layer 1011 , because the first support plate 1021 It cannot be bent. After the first support plate 1021 and the second support plate 1022 are stacked, the thickness of the screen module 100 cannot be significantly reduced.
  • the second support plate 1022 is located on the side of the first support plate 1021 away from the first panel layer 1011 . In this way, the thickness of the screen module 100 can be reduced, and the structural stability of the screen module 100 can be improved.
  • the solution of two supporting plates with different sizes is still adopted, that is, the supporting layer 102 shown in FIG. 1 may include a first supporting plate 1021 and a second supporting plate 1022. Different from the solution shown in FIG. 2 , the first support plate 1021 and the second support plate 1022 are arranged side by side. As shown in FIG. 3
  • the second supporting plate near the bending area 1013
  • the thickness of the 1022 is greater than the thickness of the first supporting plate 1021
  • the length of the second supporting plate 1022 is smaller than the distance from the display driving chip 103 to the bending region 1013 .
  • the thickness of the support layer 102 near the bending region 1013 is the first The thickness of the second support plate 1022 is to ensure the bending radius of the bending region 1013 , and the thickness of the support layer 102 near the display driver chip 103 is the thickness of the first support plate 1021 , so as to reduce the thickness of the screen module 100 .
  • a support plate with unequal thickness is used as the support layer 102 shown in FIG. 1 , that is, the support layer 102 includes a first support plate 1021 , and the first support plate 1021 is a The thickness of the supporting plate is unequal, and the thickness of the side of the first supporting plate 1021 close to the bending area 1013 is greater than the thickness of the side away from the bending area 1013 .
  • the flexible printed circuit (FPC) connected to the display panel (panel) will also be bent to form a bending area.
  • the above-mentioned support layer solution in FIG. 2 , FIG. 3 or FIG. 4 can also be used to reduce the thickness of the screen module.
  • the COF chip on film connected to the display panel (panel) is also bent to form a bent area.
  • the above-mentioned support layer solution in FIG. 2 , FIG. 3 or FIG. 4 can also be used to reduce the thickness of the screen module.
  • an embodiment of the present application provides a display assembly.
  • the display assembly includes a glass cover plate 200 and the screen module 100 as shown in FIG. 2 , FIG. 3 or FIG. 4 .
  • the glass cover plate 200 covers the screen module 100 and is located in the The first panel layer 1011 is away from the side of the display driving chip 103 .
  • the screen module 100 further includes a polarizer layer 104 .
  • the polarizer layer 104 is located on the side of the first panel layer 1011 away from the display driving chip 103 .
  • the polarizer layer 104 of the screen module 100 is bonded to the glass cover plate 200 through the optical adhesive layer 105 .
  • the glass cover plate 200 may be a flat surface or a curved surface. As shown in FIG. 8 , when the cover glass 200 is a curved surface, the bending area 1013 of the display panel 101 is not on the same plane as the first panel layer 1011 . At this time, the support layer 102 in the screen module 100 can still be used as shown in FIG. 2. The solution in FIG. 3 or FIG. 4 is used to reduce the thickness of the entire screen module, and the specific solution will not be repeated here.
  • the present application provides an electronic device.
  • the electronic device includes a battery cover 14 and a display assembly as shown in FIG. 5 , FIG. 6 or FIG. 7 .
  • the battery cover 14 is located on the side of the screen module 100 away from the glass cover 200 .

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Signal Processing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

本申请提供一种屏幕模组、显示组件及电子设备，能够降低屏幕模组以及显示组件的厚度。该屏幕模组采用可弯折的显示面板，并通过支撑层对弯折后的显示面板，即第一面板层和第二面板层，以保证弯折区域的弯折半径。为了降低屏幕模组的厚度，采用不等厚的支撑层，即靠近弯折区域的支撑层的厚度更厚，可以保证弯折区域的弯折半径。靠近显示驱动芯片处的支撑层的厚度更薄，经过层叠后，可以降低屏幕模组的厚度，以满足用户对电子设备低厚度的需求。

Description

屏幕模组、显示组件及电子设备
本申请要求于2021年3月3日提交国家知识产权局、申请号为202120461785.8、申请名称为“一种Panel模组及屏幕”的中国专利申请的优先权，以及于2021年5月8日提交国家知识产权局、申请号为202120970530.4、申请名称为“屏幕模组、显示组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种屏幕模组、显示组件及电子设备。
背景技术
在柔性屏电子设备中，为了减小柔性屏电子设备的下黑边，一般采用COP(chip on plastic)封装技术。采用COP封装时，会将显示面板(panel)弯折形成弯折区域，为保证显示面板的可靠性，显示面板弯折形成的弯折区域需保证一定的弯折半径。
为了控制显示面板的弯折半径，可以通过支撑层对显示面板的弯折区域形成支撑，在显示面板的下方区域还设置有显示驱动芯片，并且显示驱动芯片的厚度无法减薄，因此柔性屏电子设备的厚度一般较大。
发明内容
本申请实施例提供一种屏幕模组、显示组件及电子设备，能够降低屏幕模组以及显示组件的厚度。
第一方面，本申请提供一种屏幕模组。该屏幕模组包括显示面板、支撑层和显示驱动芯片。显示面板经弯折后形成上下间隔的第一面板层和第二面板层；第一面板层和第二面板层通过弯折区域连接。支撑层位于第一面板层和第二面板层之间。显示驱动芯片位于第二面板层远离第一面板层的一侧。靠近弯折区域的支撑层的厚度，大于支撑层的第一区域的厚度；支撑层的第一区域在第一面板层的投影，与显示驱动芯片在第一面板层的投影重叠。
基于上述屏幕模组，该屏幕模组采用可弯折的显示面板，并通过支撑层对弯折后的显示面板，即第一面板层和第二面板层，以保证弯折区域的弯折半径。为了降低屏幕模组的厚度，采用不等厚的支撑层，即靠近弯折区域的支撑层的厚度更厚，可以保证弯折区域的弯折半径。靠近显示驱动芯片处的支撑层的厚度更薄，经过层叠后，可以降低屏幕模组的厚度，以满足用户对电子设备低厚度的需求。
结合第一方面，在一种可能的设计方式中，支撑层可以包括第一支撑板和第二支撑板，第一支撑板和第二支撑板层叠设置，并且第二支撑板位于靠近弯折区域的一侧，第二支撑板的长度小于显示驱动芯片到弯折区域的距离。如此，将第一支撑板和第二支撑板层叠后，使得靠近弯折区域出的支撑层的厚度为第一支撑板的厚度和第二支撑板的厚度之和，以保证弯折区域的弯折半径，并且使得靠近显示驱动芯片出的支撑层的厚度仅仅为第一支撑板的厚度，以便减小屏幕模组中各层结构层叠后的厚度，以降低屏幕模组的厚度。
结合第一方面，在一种可能的设计方式中，第二支撑板可以位于第一支撑板远离第一面板层的一侧。如此，可以降低屏幕模组的厚度，还能够提高屏幕模组结构的稳定性。
结合第一方面，在一种可能的设计方式中，支撑层可以包括第一支撑板和第二支撑板，第一支撑板和第二支撑板并排设置；第二支撑板的厚度大于第一支撑板的厚度，且第二支撑板靠近弯折区域设置；第二支撑板的长度小于显示驱动芯片到弯折区域的距离。如此，将第一支撑板和第二支撑板并排设置后，由于第一支撑板的厚度大于第二支撑板的厚度，使得靠近弯折区域出的支撑层的厚度为第二支撑板的厚度，以保证弯折区域的弯折半径，并且使得靠近显示驱动芯片出的支撑层的厚度为第一支撑板的厚度，以便减小屏幕模组中各层结构层叠后的厚度，以降低屏幕模组的厚度。
结合第一方面，在一种可能的设计方式中，支撑层可以包括第一支撑板，第一支撑板为一不等厚的支撑板。
结合第一方面，在一种可能的设计方式中，弯折区域的弯折半径小于0.3毫米。具体地，弯折区域的弯折半径可以为0.2毫米至0.3毫米。
第二方面，本申请提供一种显示组件。该显示组件包括玻璃盖板以及如上第一方面任一种可能的屏幕模组，玻璃盖板覆盖于屏幕模组上，且位于第一面板层远离显示驱动芯片的一侧。
结合第二方面，在一种可能的设计方式中，屏幕模组还包括偏光片层；偏光片层位于第一面板层远离显示驱动芯片的一侧。
结合第二方面，在一种可能的设计方式中，屏幕模组的偏光片层通过光学胶层与玻璃盖板粘接。
第三方面，本申请提供一种电子设备。该电子设备包括电池盖以及如上第二方面任一种可能的显示组件。其中，电池盖位于屏幕模组远离玻璃盖板的一侧。
可以理解地，上述提供的第二方面所述的显示组件，第三方面所述的电子设备所能达到的有益效果，可参考如第一方面及其任一种可能的设计方式中的有益效果，此处不再赘述。
附图说明
图1为一种手机的结构示意图；
图2为本申请实施例提供的屏幕模组的结构示意图一；
图3为本申请实施例提供的屏幕模组的结构示意图二；
图4为本申请实施例提供的屏幕模组的结构示意图三；
图5为本申请实施例提供的显示组件的结构示意图一；
图6为本申请实施例提供的显示组件的结构示意图二；
图7为本申请实施例提供的显示组件的结构示意图三；
图8为本申请实施例提供的显示组件的结构示意图四。
附图标记：10-手机；11-显示组件；12-用户识别卡；13-手机小板；14-电池盖；100-屏幕模组；200-玻璃盖板；101-显示面板；1011-第一面板层；1012-第二面板层；1013-弯折区域；102-支撑层；1021-第一支撑板；1022-第二支撑板；103-显示驱动芯片；104-偏光片层；105-光学胶层。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
此外，本申请中，“上”、“下”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
目前，为了提高电子设备的屏占比，会采用柔性屏幕作为电子设备的显示面板。在采用柔性屏幕的电子设备中，为减小电子设备下边框出的黑边，通常采用COP封装技术。COP封装技术是电子设备的显示面板的一部分弯曲，从而缩小边框。
下面以手机为例对电子设备的结构进行说明。示例性地，图1为一种手机的结构示意图。如图1所示，该手机10包括显示组件11、用户识别卡(subscriber identity module，SIM)12、手机小板13、电池盖14。其中，电池盖14、手机小板、SIM卡和显示组件依次层叠设置。上述显示组件包括玻璃盖板200和屏幕模组100，玻璃盖板200覆盖于屏幕模组100上。
应理解，上述手机10中的结构并不限于上述显示组件11等结构，还可以包括其他结构，如中框、PCB板、摄像头模组等结构，本申请实施例不做特殊限制。
对于屏幕模组100，该屏幕模组100中包括可以弯折的显示面板(panel)101，为保证显示面板101的可靠性，在采用COP封装技术进行封装时，需要保证显示面板101的弯曲部分具有一定的弯折半径。为了控制显示面板101的弯折半径，可以通过支撑层102对显示面板101的弯折区域1013形成支撑，并通过支撑层102的厚度控制显示面板101弯折后的弯折半径。此外，在屏幕模组100中，显示面板101的下方区域还设置有显示驱动芯片103，并且显示驱动芯片103的厚度无法减薄，因此柔性屏电子设备(如图1所示的手机)的厚度一般较大。
为了降低电子设备的厚度，可以通过降低屏幕模组100的厚度实现。为降低屏幕模组100的厚度，本申请实施例提供一种改进的屏幕模组。下面结合图2至图4对本申请实施例提供的屏幕模组进行详细说明。
如图2、图3和图4所示，该屏幕模组100包括显示面板101、支撑层102和显示驱动芯片103。其中，显示面板101为柔性可弯曲的面板，显示面板101经弯折后形成上下间隔的第一面板层1011和第二面板层1012。第一面板层1011和第二面板层1012通过弯折区域1013连接。
该弯折区域1013是显示面板101经过弯折后形成的。支撑层102用于在第一面板层1011和第二面板层1012之间形成支撑，以保证弯折区域1013的弯折半径。一般情况下，该弯折区域1013的弯折半径可以小于0.3毫米，具体可以为0.2毫米至0.3毫米。因此，支撑层102位于第一面板层1011和第二面板层1012之间。显示驱动芯片103用于驱动显示面板101显示文字、图案以及颜色等。在采用COP封装 时，显示驱动芯片103位于显示面板101的下方，也即显示驱动芯片103位于第二面板层1012远离第一面板层1011的一侧。
对于上述支撑层102，靠近弯折区域1013的支撑层102的厚度，大于支撑层102中的第一区域的厚度。支撑层102的第一区域在第一面板层1011的投影，与显示驱动芯片103在第一面板层1011的投影重叠。也就是说，靠近弯折区域1013的支撑层102的厚度更厚，可以保证弯折区域1013的弯折半径。靠近显示驱动芯片103处的支撑层102的厚度更薄，经过层叠后，可以降低屏幕模组100的厚度，以满足用于对电子设备低厚度的需求。
需要说明的是，上述支撑层102的材质可以为金属材料或者非金属材料，如可以是聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)、泡棉、硅胶、铝合金、铜合金、不锈钢或铁等，也可以是多种不同材料的组合。因此本申请实施例对支撑层102的材质不做特殊限定。
应理解，上述第一面板层1011与支撑层102之间还可以设置其他层级结构，例如基材、超洁净膜(super clean foam，SCF)，本申请实施例不做特殊限制。
为实现靠近弯折区域1013处的支撑层102的厚度更厚，靠近显示驱动芯片103处的支撑层102的厚度更薄的目的，本申请提供了如图2至图4所示的多种实施方式。
在一些实施例中，可以采用两块尺寸不同的支撑板的方案。即如图2所示，图1所示的支撑层102可以包括第一支撑板1021和第二支撑板1022，其中第一支撑板1021的尺寸更大，第二支撑板1022的尺寸更小。将第一支撑板1021和第二支撑板1022层叠设置之后，第二支撑板1022位于靠近弯折区域1013的一侧，从而使得靠近弯折区域1013的支撑层102的厚度更厚。并且，第二支撑板1022的尺寸小于显示驱动芯片103到弯折区域1013的距离，使得第二支撑板1022不在显示驱动芯片103与显示面板101重叠的范围内，避免支撑层102与显示驱动芯片103层叠后，增加屏幕模组100的厚度。如此，将第一支撑板1021和第二支撑板1022层叠后，使得靠近弯折区域1013处的支撑层102的厚度为，第一支撑板1021的厚度和第二支撑板1022的厚度之和，以保证弯折区域1013的弯折半径，并且使得靠近显示驱动芯片103出的支撑层102的厚度仅仅为第一支撑板1021的厚度，以便减小屏幕模组100中各层结构层叠后的厚度，以降低屏幕模组100的厚度。
进一步地，由于支撑层102的材质可能为不锈钢或铁等硬质材料，第一支撑板1021可能不能弯折。若第二支撑板1022位于第一支撑板1021靠近第一面板层1011的一侧，即第二支撑板1022位于第一支撑板1021和第一面板层1011之间，则由于第一支撑板1021不能弯折，当第一支撑板1021和第二支撑板1022层叠后，屏幕模组100的厚度并不能够明显降低。此外，若第一支撑板1021不能弯折且第一支撑板1021的尺寸大于第二支撑板1022，则第一支撑板1021与第一面板层1011之间会有一部分间隙，不利于屏幕模组100结构的稳定性。因此，如图2所示，第二支撑板1022位于第一支撑板1021远离第一面板层1011的一侧。如此，可以降低屏幕模组100的厚度，还能够提高屏幕模组100结构的稳定性。
在一些实施例中，如图3所示，依然采用两块尺寸不同的支撑板的方案，即如图 1所示的支撑层102可以包括第一支撑板1021和第二支撑板1022。与图2所示的方案不同的是，第一支撑板1021和第二支撑板1022并排设置。如图3所示，为实现靠近弯折区域1013处的支撑层102的厚度更厚，靠近显示驱动芯片103出的支撑层102的厚度更薄的目的，靠近弯折区域1013的第二支撑板1022的厚度大于第一支撑板1021的厚度，且第二支撑板1022的长度小于显示驱动芯片103到弯折区域1013的距离。如此，将第一支撑板1021和第二支撑板1022并排设置后，由于第一支撑板1021的厚度大于第二支撑板1022的厚度，使得靠近弯折区域1013出的支撑层102的厚度为第二支撑板1022的厚度，以保证弯折区域1013的弯折半径，并且使得靠近显示驱动芯片103出的支撑层102的厚度为第一支撑板1021的厚度，以便减小屏幕模组100中各层结构层叠后的厚度，以降低屏幕模组100的厚度。
在一些实施例中，如图4所示，采用一块不等厚的支撑板作为如图1所示的支撑层102，也即支撑层102包括第一支撑板1021，第一支撑板1021为一不等厚的支撑板，且第一支撑板1021靠近弯折区域1013的一侧的厚度大于远离弯折区域1013的一侧的厚度。
可以理解地，在采用COG工艺实现屏幕封装工艺的屏幕模组中，与显示面板(panel)连接的柔性印刷电路板(flexible printed circuit，FPC)也会弯折而形成弯折区域。为了保证弯折区域的弯折半径，也可以采用上述图2、图3或图4中的支撑层方案，来降低屏幕模组的厚度。类似地，在采用COF工艺实现屏幕封装工艺的屏幕模组中，与显示面板(panel)连接的COF覆晶薄膜也会弯折而形成弯折区域。为了保证COF覆晶薄膜中弯折区域的弯折半径，也可以采用上述图2、图3或图4中的支撑层方案，来降低屏幕模组的厚度。
另一方面，本申请实施例提供一种显示组件。如图5、图6或图7所示，该显示组件包括玻璃盖板200以及如图2、图3或图4的屏幕模组100，玻璃盖板200覆盖于屏幕模组100上，且位于第一面板层1011远离显示驱动芯片103的一侧。
此外，屏幕模组100还包括偏光片层104。偏光片层104位于第一面板层1011远离显示驱动芯片103的一侧。并且，屏幕模组100的偏光片层104通过光学胶层105与玻璃盖板200粘接。
需要说明的是，玻璃盖板200可以为平面，也可以为曲面。如图8所示，当玻璃盖板200为曲面时，显示面板101的弯折区域1013与第一面板层1011不在同一平面上，此时屏幕模组100中的支撑层102仍然可以采用如图2、图3或图4中的方案，来降低整个屏幕模组的厚度，具体方案此处不再赘述。
应理解，本申请实施例提供的显示组件的技术效果，可以参考上述如图2、图3或图4所示的屏幕模组100的技术效果，此处不再赘述。
再一方面，本申请提供一种电子设备。该电子设备包括电池盖14以及如图5、图6或图7所示的显示组件。其中，电池盖14位于屏幕模组100远离玻璃盖板200的一侧。
应理解，本申请实施例提供的显示组件的技术效果，可以参考上述如图2、图3或图4所示的屏幕模组100的技术效果，此处不再赘述。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任 何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种屏幕模组，其特征在于，包括显示面板、支撑层和显示驱动芯片；所述显示面板经弯折后形成上下间隔的第一面板层和第二面板层；所述第一面板层和所述第二面板层通过弯折区域连接；
    所述支撑层位于所述第一面板层和所述第二面板层之间；
    所述显示驱动芯片位于所述第二面板层远离所述第一面板层的一侧；
    靠近所述弯折区域的所述支撑层的厚度，大于所述支撑层的第一区域的厚度；所述支撑层的所述第一区域在所述第一面板层的投影，与所述显示驱动芯片在所述第一面板层的投影重叠。
  2. 根据权利要求1所述的屏幕模组，其特征在于，所述支撑层包括第一支撑板和第二支撑板，所述第一支撑板和所述第二支撑板层叠设置，并且所述第二支撑板位于靠近所述弯折区域的一侧。
  3. 根据权利要求2所述的屏幕模组，其特征在于，所述第二支撑板位于所述第一支撑板远离所述第一面板层的一侧。
  4. 根据权利要求1所述的屏幕模组，其特征在于，所述支撑层包括第一支撑板和第二支撑板，所述第一支撑板和所述第二支撑板并排设置；所述第二支撑板的厚度大于所述第一支撑板的厚度，且所述第二支撑板靠近所述弯折区域设置；所述第二支撑板的长度小于所述显示驱动芯片到所述弯折区域的距离。
  5. 根据权利要求1所述的屏幕模组，其特征在于，所述支撑层包括第一支撑板，所述第一支撑板为一不等厚的支撑板。
  6. 根据权利要求1至5任一项所述的屏幕模组，其特征在于，所述弯折区域的弯折半径小于0.3毫米。
  7. 根据权利要求1至5任一项所述的屏幕模组，其特征在于，所述弯折区域的弯折半径为0.2毫米至0.3毫米。
  8. 一种显示组件，其特征在于，包括玻璃盖板以及如权利要求1至7任意一项所述的屏幕模组，所述玻璃盖板覆盖于所述屏幕模组上，且位于所述第一面板层远离所述显示驱动芯片的一侧。
  9. 根据权利要求8所述的显示组件，其特征在于，所述屏幕模组还包括偏光片层；所述偏光片层位于所述第一面板层远离所述显示驱动芯片的一侧。
  10. 根据权利要求9所述的显示组件，其特征在于，所述屏幕模组的偏光片层通过光学胶层与所述玻璃盖板粘接。
  11. 一种电子设备，其特征在于，电池盖以及如权利要求8至10任一项所述的显示组件；所述电池盖位于所述屏幕模组远离所述玻璃盖板的一侧。
PCT/CN2022/075894 2021-03-03 2022-02-10 屏幕模组、显示组件及电子设备 WO2022183893A1 (zh)

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