WO2022182327A1 - Substrats revêtus d'isolation thermique pour dispositifs électroniques - Google Patents

Substrats revêtus d'isolation thermique pour dispositifs électroniques Download PDF

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Publication number
WO2022182327A1
WO2022182327A1 PCT/US2021/019155 US2021019155W WO2022182327A1 WO 2022182327 A1 WO2022182327 A1 WO 2022182327A1 US 2021019155 W US2021019155 W US 2021019155W WO 2022182327 A1 WO2022182327 A1 WO 2022182327A1
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WIPO (PCT)
Prior art keywords
heat insulating
layer
substrate
basecoat
polymeric resin
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Application number
PCT/US2021/019155
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English (en)
Inventor
Kuan-Ting Wu
Chi Hao Chang
Kuo Chih Huang
Original Assignee
Hewlett-Packard Development Company, L.P.
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Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2021/019155 priority Critical patent/WO2022182327A1/fr
Publication of WO2022182327A1 publication Critical patent/WO2022182327A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories

Definitions

  • Electronic devices and circuitry can generate excess heat. Appropriate heat management can increase reliability of electronic devices and can prevent premature failure. Accordingly, a variety of heat transfer methodologies have been developed to manage the excess heat generated by these electronic devices and circuitry. Non-limiting examples can include heat sinks, cold plates, convective air cooling, forced air cooling, heat pipes, Peltier cooling plates, etc.
  • Many smaller electronic devices such as laptop computers, tablet computers, and smartphones incorporate passive heat management components such as head spreaders and insulation films.
  • a layer of metal foil such as copper foil can be used with or without an additional heat spread layer such as a graphite head spreader.
  • FIG.1 is a cross-sectional view of an example heat insulating coated substrate in accordance with examples of the present disclosure
  • FIG.2 is another cross-sectional view of an example heat insulating coated substrate in accordance with examples of the present disclosure
  • FIG.3 is yet another cross-sectional view of an example heat insulating coated substrate in accordance with examples of the present disclosure
  • FIG.4 is another cross-sectional view of an example heat insulating coated substrate in accordance with examples of the present disclosure
  • FIG.5 is another cross-sectional view of an example heat insulating coated substrate in accordance with examples of the present disclosure
  • FIG.5 is a flowchart illustrating an example method of making a heat insulating coated substrate for an electronic device in accordance with examples of the present disclosure
  • FIG.6 is a schematic view of an example electronic device
  • the present disclosure describes heat insulating coated substrates for electronic devices, methods of making heat insulating coated substrates for electronic devices, and electronic devices that include the heat insulating coated substrates.
  • the heat insulating coated substrates can include a heat insulating coating that can help to manage heat in electronic devices.
  • a heat insulating coated substrate for an electronic device includes a substrate, a heat insulating primer layer on the substrate, and a basecoat layer over the primer layer.
  • the heat insulating primer layer includes heat insulating particles dispersed in a first polymeric resin.
  • the heat insulating particles include fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or a combination thereof.
  • the basecoat layer includes pigment particles dispersed in a second polymeric resin.
  • the heat insulating particles can have a thermal conductivity from about 0.03 W/mK to about 0.15 W/mK.
  • the heat insulating particles can be present in the heat insulating primer layer in an amount from about 15 wt% to about 75 wt% with respect to the total weight of the heat insulating primer layer, and the pigment particles can be present in the basecoat layer in an amount from about 10 wt% to about 60 wt% with respect to the total weight of the basecoat layer.
  • the basecoat layer can also include from about 15 wt% to about 50 wt% of the heat insulating particles.
  • the first polymeric resin and the second polymeric resin can be thermally cured, and the first polymeric resin, the second polymeric resin, or both can include polyacrylic, polyurethane, polyester, epoxy, epoxy-polyester, alkyd, polyester-imide, or a combination thereof.
  • the substrate can include plastic, carbon fiber, aluminum, aluminum alloy, magnesium, magnesium alloy, lithium, lithium alloy, titanium, titanium alloy, or a combination thereof.
  • the substrate can include aluminum, aluminum alloy, magnesium, magnesium alloy, lithium, lithium alloy, titanium, or titanium alloy, and the substrate can include a passivation layer, a micro-arc oxidation layer, or both on a surface of the substrate.
  • the heat insulating coated substrate can include a topcoat layer over the basecoat layer.
  • the topcoat layer can include a resin that is a thermally cured polymeric resin or an ultraviolet cured polymeric resin, and an anti-fingerprint material that includes a fluoropolymer, a silane, or a combination thereof.
  • the present disclosure also describes methods of making heat insulating coated substrates for electronic devices.
  • a method of making a heat insulating coated substrate for an electronic device includes applying a heat insulating primer composition onto a substrate to form a heat insulating primer layer.
  • the heat insulating primer composition includes water, a first polymeric resin, and heat insulating particles, wherein the heat insulating particles include fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or a combination thereof.
  • the method also includes applying a basecoat composition onto the heat insulating primer layer to form a basecoat layer.
  • the basecoat composition includes water, a second polymeric resin, and pigment particles.
  • the heat insulating particles can have a thermal conductivity from about 0.03 W/mK to about 0.15 W/mK.
  • the heat insulating primer composition can include from about 50 wt% to about 70 wt% of the water, from about 10 wt% to about 30 wt% of the first polymeric resin, and from about 5 wt% to about 30 wt% of the heat insulating particles, and wherein the basecoat composition includes from about 50 wt% to about 70 wt% water, from about 10 wt% to about 30 wt% of the second polymeric resin, and from about 3 wt% to about 20 wt% of the pigment particles.
  • the method can include curing the heat insulating primer composition and the basecoat composition by heating at from about 80 °C to about 140 °C for about 10 minutes to about 30 minutes per layer.
  • a topcoat composition can also be applied onto the basecoat layer to form a topcoat layer.
  • the topcoat composition can include a resin that is a thermally curable polymeric resin or an ultraviolet curable polymeric resin, and an anti-fingerprint material including a fluoropolymer, a silane, or a combination thereof.
  • an electronic device includes a housing carrying electronic components of the electronic device, wherein the housing includes a heat insulating coated substrate.
  • the heat insulating coated substrate includes a substrate, a heat insulating primer layer over the substrate, and a basecoat layer over the primer layer.
  • the heat insulating primer layer includes heat insulating particles dispersed in a first polymeric resin.
  • the heat insulating particles include fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or a combination thereof.
  • the basecoat layer includes pigment particles dispersed in a second polymeric resin.
  • the heat insulating particles can be present in the heat insulating primer layer in an amount from about 15 wt% to about 75 wt% with respect to the total weight of the heat insulating primer layer, and the pigment particles can be present in the basecoat layer in an amount from about 10 wt% to about 60 wt% with respect to the total weight of the basecoat layer.
  • the electronic device can include a display, a personal computer, a laptop computer, a tablet, a media player, a smart device, a keyboard, or a combination thereof.
  • the heat insulating coated substrates, methods of making heat insulating coated substrates and the electronic devices will be described in greater detail below. It is also noted that when discussing the heat insulating coated substrates, methods of making coated substrates, and electronic devices described herein, these relative discussions can be considered applicable to the other examples, whether or not they are explicitly discussed in the context of that example.
  • the heat insulating coated substrates described herein can include certain coating layers that can give the substrates useful properties.
  • the coated substrates can include a coating layer or multiple coating layers that include heat insulating material.
  • a heat insulating primer composition can be applied to a substrate to form a heat insulating primer layer.
  • a heat insulating basecoat composition can be applied over the heat insulating primer layer.
  • the heat insulating coated substrate can be used in a cover for an electronic device, and the heat insulating primer and basecoat layers can effectively reduce the exterior temperature, or “skin temperature,” of the cover.
  • electronic components often include components that can generate excess heat.
  • a variety of heat management components have been designed and included in electronic devices to prevent overheating of the electronic device. Many heat management components can occupy a significant amount of space inside an electronic device. Accordingly, heat management components can reduce the amount of space available for other electronic components inside a given electronic device enclosure.
  • Many electronic devices include a heat spreader such as a graphite heat spreader, a metal foil film such as a copper foil film, an insulation film, or a combination thereof. These components can be placed inside a cover of an electronic device to spread out heat and reduce heat transfer through the cover.
  • the insulation film, metal foil, and heat spreader film can be relatively thin. In some cases, these components can have a thickness from about 0.1 mm to about 0.35 mm. However, this can be a significant thickness and can occupy a significant amount of space inside some types of electronic devices, such as laptop computers, smartphones, and tablet computers. Accordingly, it can be useful to reduce the thickness of these layers or to eliminate these layers from the electronic device.
  • the heat insulating coated substrates described herein can be used as the housing of an electronic device, in some examples.
  • the heat insulating coated substrate can include a heat insulating primer layer.
  • a heat insulating basecoat layer can be added over the primer layer.
  • the primer and basecoat layers can have a much smaller thickness compared to metal foils, heat spreader films, and insulation films.
  • the primer and basecoat layers together can have a thickness of about 25 ⁇ m to about 75 ⁇ m.
  • housings for electronic devices already include various coatings for protective and/or decorative purposes.
  • the heat insulating primer and basecoat layers described herein can be used in an electronic device without occupying any thickness that would not have been occupied by another coating anyway.
  • the heat insulating primer and heat insulating basecoat layers can provide sufficient insulation so that the other components (e.g., metal foil, heat spreader film, and insulation film) can be removed from the electronic device.
  • the heat insulating primer and basecoat layers can allow the other components to be thinner, such as by using a thinner insulation film inside the electronic device.
  • the heat insulating primer and basecoat layers can be used together with other heat management components to provide even better heat management capabilities.
  • a coating that includes a heat insulating primer layer, with or without a heat insulating basecoat layer can reduce the exterior temperature of an electronic device. It has been found experimentally that one example coated substrate that includes the heat insulating primer layer can reduce the exterior temperature of an electronic device by about 1.7 °C to about 2.4 °C. This example included a heat insulating primer layer with a thickness of about 30 ⁇ m. Accordingly, even better heat insulation capabilities can be expected with thicker primer layers or with coatings that also include a heat insulating basecoat layer.
  • the heat insulating coated substrate described herein can be useful for: reducing the exterior “skin” temperature of electronic devices; reducing thickness of heat management components in electronic devices to increase available space for electronic components; reducing hot spots; preventing skin burning; extending the lifetime of electronic components such as liquid crystal display panels, light emitting diodes, central processing units, batteries and others; increasing loading speed and power efficiency of electronic devices; reducing risk of battery explosion; and so on.
  • the heat insulating primer layer can be formed from a heat insulating primer composition that includes heat insulating particles. These particles can be a powder form of a variety of heat insulating materials.
  • the heat insulating particles can include fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or a combination thereof. In certain examples, these materials can have a thermal conductivity from about 0.03 W/mK to about 0.15 W/mK. In some examples, the amount of the heat insulating particles in the heat insulating primer layer can be from about 15 wt% to about 75 wt% with respect to the total dry weight of the primer layer. Other materials that can be included in the primer layer include polymeric resins, surfactants and fillers. [0017] The heat insulating primer layer can be formed by applying a heat insulating primer composition.
  • the heat insulating primer composition can be a waterborne composition.
  • Waterborne coating compositions can include water as a majority of solvent in the compositions.
  • the primer compositions described herein can include water in an amount of 50 wt% or more.
  • the primer composition can include water in an amount from about 50 wt% to about 70 wt%.
  • the primer compositions can also include organic solvent in some examples. The amount of organic solvent in the primer compositions can be relatively small. In some examples, organic solvent can make up 20 wt% or less of the primer compositions based on the total weight of the primer compositions.
  • the waterborne primer compositions can have low volatile organic compound (VOC) content.
  • FIG.1 shows a schematic view of one example coated substrate 100 in accordance with examples of the present disclosure.
  • This example includes a substrate 110, a heat insulating primer layer 120 on the substrate, and a basecoat layer 130 over the primer layer.
  • the heat insulating primer layer can include heat insulating particles 122 dispersed in a first polymeric resin.
  • the heat insulating particles can include fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or a combination thereof.
  • the basecoat layer can include pigment particles dispersed in a second polymeric resin.
  • the coated substrates described herein can include additional layers.
  • a topcoat layer can be applied over the basecoat layer. The topcoat layer can provide surface properties such as anti-fingerprint, anti-smudge, durability and hardness.
  • FIG.2 shows one such example heat insulating coated substrate 100.
  • This example includes a substrate 110 with a heat insulating primer layer 120 on the substrate.
  • the heat insulating primer layer includes heat insulating particles 122 dispersed in a polymeric resin.
  • a basecoat layer 130 is formed over the heat insulating primer layer.
  • a topcoat layer 140 is then formed over the basecoat layer.
  • the topcoat layer can include a polymeric resin that is either a thermally cured polymeric resin or an ultraviolet cured polymeric resin.
  • the topcoat layer can also include an anti-fingerprint material.
  • the anti-fingerprint material can include a fluoropolymer, a silane, or a combination thereof.
  • the substrate can include a rigid material such as plastic, carbon fiber, composite, metal, metal alloy, and so on.
  • the substrate can be made of a metal such as a light metal.
  • protective layers can be formed on one or both sides of the metal substrate.
  • the protective layers can include a passivation layer or a micro-arc oxidation layer. Passivation layers can protect the metal substrate from corrosion or other chemical reactions in some examples. In some cases, passivation layers can be formed by treating the metal substrate with a passivation chemical such as a molybdate, vanadate, phosphate, chromate, stannate, manganese salt, or others.
  • FIG.3 shows an example coated substrate 100 that includes a substrate 110, such as a metal substrate.
  • the substrate is treated with passivation chemicals to form a passivation layer 112 (or layers) on one or both sides of the substrate, e.g., metal substrate.
  • a heat insulating primer layer 120 is applied over the passivation layer.
  • the heat insulating primer layer can include a first polymeric resin and heat insulating particles 122 as described above.
  • a basecoat layer 130 is applied over the heat insulating primer layer.
  • the basecoat layer is also a heat insulating coating, and the basecoat layer includes heat insulating particles 132.
  • a topcoat layer 140 is then applied over the basecoat layer.
  • the topcoat layer can include a polymeric resin that is thermally cured or ultraviolet cured and an anti-fingerprint material as described above.
  • Micro-arc oxidation is another treatment that can be applied to certain metal substrates.
  • a high voltage is applied to the metal substrate while in an electrolyte solution.
  • the surface of the metal substrate becomes oxidized, forming a protective oxide layer.
  • a metal substrate can be treated with micro-arc oxidation before the coatings described herein are applied.
  • FIG.4 shows another example coated substrate 100 that includes a substrate 110, such as a metal substrate, with micro-arc oxidation layers 114 on both sides of the substrate.
  • a heat insulating primer layer 120 is applied to one side of the substrate over the micro-arc oxidation layer.
  • a base coat layer 130 is applied over the primer layer.
  • a topcoat layer 140 is then applied over the basecoat layer.
  • the primer layer, basecoat layer, and topcoat layer can include the components described above. Examples of ingredients that can be included in these coating compositions are also described in more detail below. It is noted that in any of the examples described herein, the basecoat layer can be a heat insulating basecoat layer, which includes heat insulating particles, or a non-insulating basecoat layer, which does not include the heat insulating particles.
  • Methods of Making Coated Substrates for Electronic Devices [0022] The present disclosure also describes methods of making coated substrates for electronic devices. These methods can include providing a substrate and applying coating layers to the substrate as described herein. As explained above, a heat insulating primer layer can be applied onto the substrate. This can be accomplished by coating the substrate with a heat insulating primer composition.
  • the heat insulating primer composition can be cured after the composition has been applied to the substrate. After the heat insulating primer layer has been formed, a basecoat composition can be applied over the primer layer. In some examples, the basecoat composition can also be cured to form the basecoat layer.
  • FIG.5 is a flowchart of a particular example method 200 of making a heat insulating coated substrate for an electronic device.
  • This method includes: applying a heat insulating primer composition onto a substrate to form a heat insulating primer layer, wherein the heat insulating primer composition includes water, a first polymeric resin, and heat insulating particles, wherein the heat insulating particles include fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or a combination thereof 210; and applying a basecoat composition onto the heat insulating primer layer to form a basecoat layer, wherein the basecoat composition includes water, a second polymeric resin, and pigment particles 220.
  • the heat insulating primer composition and the basecoat composition can be applied in a liquid form by a variety of application process, such as spin coating, dipping, spraying, spreading, and so on. After applying these coating compositions, the polymeric resins can be cured by heating at a curing temperature for a period of time. In some examples, the curing temperature can be from about 80 °C to about 140 °C and the curing time can be from about 10 minutes to about 30 minutes. The thickness of the coating layers can be from about 10 ⁇ m to about 60 ⁇ m. [0025] In some examples, the heat insulating primer layer and the basecoat layer can be cured separately. In other words, the primer composition can be applied and then cured.
  • the basecoat composition can be applied and cured.
  • the primer layer can be cured by heating at a first curing temperature from about 80 °C to about 140 °C for a first curing time from about 10 minutes to about 30 minutes.
  • the basecoat layer can be cured by heating at a second curing temperature from about 80 °C to about 140 °C for a second curing time from about 10 minutes to about 30 minutes.
  • the first and second curing temperatures can be the same or different temperatures in various examples.
  • the first and second curing times can also be the same or different in various examples.
  • the heat insulating primer layer can have a thickness from about 15 ⁇ m to about 60 ⁇ m and the basecoat layer can have a thickness from about 10 ⁇ m to about 25 ⁇ m.
  • the heat insulating primer composition can include the first polymeric resin in an amount from about 10 wt% to about 30 wt% and the heat insulating particles in an amount from about 5 wt% to about 30 wt%.
  • the heat insulating primer composition can also include water in an amount from about 50 wt% to about 70 wt%, an organic co-solvent in an amount from about 10 wt% to 20 wt%, and a surfactant in an amount from about 0.3 wt% to about 3 wt%.
  • the basecoat composition can include the second polymeric resin in an amount from about 10 wt% about 30 wt% and pigment particles in an amount from about 3 wt% to about 20 wt%.
  • the basecoat composition can be a heat insulating basecoat composition, and the composition can include heat insulating particles in an amount from about 5 wt% to about 15 wt%.
  • the basecoat composition can also include water in an amount from about 50 wt% to 70 wt%, an organic co-solvent in an amount from about 10 wt% to about 20 wt%, and a surfactant in an amount from about 0.3 wt% to about 3 wt%.
  • a topcoat composition can also be applied onto the basecoat layer to form a topcoat layer.
  • the topcoat layer can provide anti-fingerprint properties.
  • the topcoat composition can include a resin that is a thermally curable polymeric resin or an ultraviolet curable polymeric resin, and an anti-fingerprint material that includes a fluoropolymer, a silane, or a combination thereof.
  • the topcoat composition can be a waterborne thermally curable composition.
  • This composition can include a thermally curable polymeric resin such as polyacrylic, polyurethane, epoxy, polyester, or others.
  • the topcoat composition can also include an anti-fingerprint material, such as a fluoropolymer or a long chain silane.
  • the waterborne thermally curable topcoat composition can include the thermally curable polymeric resin in an amount from about 10 wt% to about 35 wt%, the anti-fingerprint material in an amount from about 0.1 wt% to about 5 wt%, the matting compound in an amount from about 0 wt% to about 3 wt%, a surfactant in an amount from about 0.1 wt% to about 2 wt%, water in an amount from about 50 wt% to about 75 wt% and an organic co-solvent in an amount from about 10 wt% to about 20 wt%.
  • the topcoat composition can be applied to the coated substrate using a coating method such as spin coating, dipping, spraying, spreading, and so on.
  • the composition can then be cured by heating to a curing temperature from about 80 °C to about 140 °C for a curing time of about 10 minutes to about 30 minutes.
  • the topcoat composition can be a waterborne ultraviolet (UV) curable composition.
  • This example composition can include an ultraviolet curable polymeric resin, which can be cured using ultraviolet radiation. This polymeric resin may be in an uncured state prior to forming the topcoat layer.
  • a topcoat composition can include a UV-curable resin mixed with an anti-fingerprint material, such as a silane, a fluorinated polymer, or a combination thereof.
  • the UV curable topcoat composition can include the UV-curable polymeric resin in an amount from about 10 wt% to about 35 wt%, the anti-fingerprint material in an amount from about 0.1 wt% to about 5 wt%, a matting compound in an amount from about 0 wt% to about 2 wt%, a surfactant in an amount from about 0.1 wt% to about 2 wt%, an organic co-solvent in an amount from about 10 wt% to about 20 wt%, and water in an amount from about 50 wt% to about 70 wt%.
  • the composition can be applied to the surface of the coated substrate by a variety of application processes, such as spin coating, dipping, spraying, spreading, and so on.
  • the composition can then be cured by exposure to UV radiation.
  • the composition can be baked at a temperature from about 50 °C to about 80 °C for a period of time from about 10 minutes to about 15 minutes before exposure to UV radiation. After baking, the layer can be exposed to UV radiation at an intensity from about 700 mJ/cm 2 to about 1,300 mJ/cm 2 for about 10 seconds to about 30 seconds.
  • the topcoat layer can have a thickness from about 15 ⁇ m to about 25 ⁇ m, or from about 15 ⁇ m to about 20 ⁇ m, or from about 20 ⁇ m to about 25 ⁇ m.
  • methods can include forming additional coating layers on the substrate, such as passivation layers, micro-arc oxidation layers, primer layers, and base coat layers.
  • a method of making a coated substrate can include forming a passivation layer on a light metal substrate.
  • a heat insulating primer layer can be formed over the passivation layer, and a basecoat layer can be formed over the heat insulating primer layer as described above.
  • a topcoat layer can also be formed over the basecoat layer.
  • a passivation layer can be formed on a light metal substrate by immersing the substrate in a bath including a passivation chemical.
  • passivation chemicals can include molybdates, vanadates, phosphates, chromates, stannates, and manganese salts.
  • the concentration of the passivation chemical in the bath can be from about 3 wt% to about 15 wt%.
  • the passivation treatment can be performed for a time from about 20 seconds to about 120 seconds.
  • the resulting passivation layer can have a thickness from about 0.3 ⁇ m to about 3 ⁇ m.
  • a method of making a coated substrate for an electronic device can include forming a micro-arc oxidation layer on a light metal substrate.
  • a heat insulating primer layer and basecoat layer can then be formed over the micro-arc oxidation layer.
  • a topcoat layer can also be formed over the basecoat layer.
  • a micro-arc oxidation layer can be formed by applying a voltage to a light metal substrate submerged in an electrolyte bath. In some examples, the voltage applied can be from about 150 V to about 550 V.
  • Chemicals that can be included in the electrolyte bath can include sodium silicate, metal phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, ferric ammonium oxalate, phosphoric acid salts, graphite powder, silicon dioxide powder, aluminum oxide powder, metal powder, or combinations thereof.
  • the chemicals can be mixed with water at a concentration of about 0.3 wt% to about 15 wt% of the chemical in water.
  • the pH of the electrolyte bath can be from about 8 to about 13.
  • the light metal substrate can be immersed in the electrolyte bath and the voltage can be applied for a time period from about 2 minutes to about 25 minutes.
  • the temperature of the electrolyte bath can be from about 10 °C to about 45 °C.
  • the thickness of the micro-arc oxidation layer can be from about 2 ⁇ m to about 15 ⁇ m.
  • the heat insulating coated substrates described herein can be used in a variety of electronic devices.
  • the substrates can be used as a housing, a cover, a frame, a support structure, the like, or a combination thereof for a variety of electronic devices.
  • the coated substrates can be used with a display, a personal computer, a laptop computer, a tablet, a media player, a smart device, a keyboard, the like, or a combination thereof.
  • FIG.6 One non-limiting example of an electronic device in accordance with the present disclosure is presented in FIG.6.
  • the electronic device 300 is a laptop computer.
  • a heat insulating coated metal substrate 100 forms the housing of the laptop computer.
  • a magnified cross-sectional view 102 of the coated metal substrate is also shown.
  • the coated metal substrate includes a substrate 110, such as a metal substrate, with micro-arc oxidation layers 114 on both sides.
  • a heat insulating primer layer 120 and a base coat layer 130 are applied to the substrate.
  • a topcoat layer 140 is applied over the basecoat layer.
  • the heat insulating primer layer can include a first polymeric resin and heat insulating particles, such as fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or combinations thereof.
  • the basecoat layer can also include heat insulating particles to provide additional insulation.
  • the substrate can be a rigid material. Some examples of substrate materials can include plastic, carbon fiber, glass, composites, metals, and combinations thereof. In certain examples, the substrate can include a light metal such as aluminum, magnesium, titanium, lithium, niobium, or an alloy thereof.
  • alloys of these metals can include additional metals, such as bismuth, copper, cadmium, iron, thorium, strontium, zirconium, manganese, nickel, lead, silver, chromium, silicon, tin, gadolinium, yttrium, calcium, antimony, zinc, cerium, lanthanum, or others.
  • the substrate can include carbon fiber.
  • the substrate can be a carbon fiber composite.
  • the carbon fiber composite can include carbon fibers in a plastic material such as a thermoset resin or a thermoplastic polymer.
  • Non-limiting examples of the polymer can include epoxies, polyesters, polyacrylic, polycarbonate, vinyl esters, and polyamides.
  • the substrate can be formed by molding, casting, machining, bending, working, or another process.
  • the substrate can be a housing or chassis for an electronic device that is milled from a single block of metal or metal alloy.
  • an electronic device housing can be made from multiple panels.
  • the substrate is not particularly limited with respect to thickness.
  • the thickness of the substrate chosen can be selected as appropriate for a specific type of electronic device, e.g., lightweight materials and thickness chosen for housings where lightweight properties may be commercially competitive, heavier more durable materials chosen for housings where more protection may be useful, etc.
  • the thickness of the substrate can be from about 0.5 mm to about 2 cm, from about 1 mm to about 1.5 cm, from about 1.5 mm to about 1.5 cm, from about 2 mm to about 1 cm, from about 3 mm to about 1 cm, from about 4 mm to about 1 cm, or from about 1 mm to about 5 mm, though thicknesses outside of these ranges can be used.
  • Passivation Layers [0040]
  • the substrate can be treated with a passivation treatment to form a passivation layer before other layers are coated onto the substrate. Passivation can be particularly useful for substrates made of light metals.
  • the passivation treatment can include immersing the substrate in a bath including a passivation chemical.
  • passivation chemicals can include molybdates, vanadates, phosphates, chromates, stannates, and manganese salts.
  • concentration of the passivation chemical in the bath can be from about 3 wt% to about 15 wt%. In other examples, the concentration can be from about 3 wt% to about 6 wt%, or from about 3 wt% to about 9 wt%, or from about 8 wt% to about 12 wt%, or from about 8 wt% to about 15 wt%.
  • the remainder of the bath can be water.
  • the passivation treatment can be performed for a time from about 20 seconds to about 120 seconds.
  • the passivation treatment can be performed for a time from about 20 seconds to about 60 seconds, or from about 60 seconds to about 120 seconds, or from about 30 seconds to about 90 seconds.
  • the resulting passivation layer can have a thickness from about 0.3 ⁇ m to about 5 ⁇ m in some examples.
  • the passivation layer thickness can be from about 0.3 ⁇ m to about 3 ⁇ m, or from about 1 ⁇ m to about 5 ⁇ m, or from about 2 ⁇ m to about 4 ⁇ m.
  • the passivation chemicals can include a chelating agent.
  • Non-limiting examples of chelating agents can include ethylenediaminetetraacetic acid (EDTA), ethylenediamine, nitrilotriacetic acid (NTA), diethylenetriaminepenta (methylenephosphonic acid) (DTPPH), nitrilotris(methylenephosphonic acid) (NTMP), 1-hydroxyethane-1,1-diphosphonic acid (HEDP), phosphoric acid, the like, or a combination thereof.
  • the passivation layer can include an organic acid in combination with aluminum, nickel, chromium, tin, indium, zinc, the like, or a combination thereof.
  • EDTA ethylenediaminetetraacetic acid
  • NTA ethylenediamine
  • NTA diethylenetriaminepenta
  • NTMP nitrilotris(methylenephosphonic acid)
  • HEDP 1-hydroxyethane-1,1-diphosphonic acid
  • phosphoric acid the like, or a combination thereof.
  • the passivation layer can
  • Micro-arc Oxidation Layers [0042]
  • the substrate can be treated with a micro-arc oxidation treatment to form a micro-arc oxidation layer in some examples. This treatment is also particularly useful for light metal substrates.
  • Micro-arc oxidation also called plasma electrolytic oxidation, is an electrochemical process where the surface of a metal is oxidized using micro-discharges of compounds on the surface of the substrate when immersed in a chemical or electrolytic bath, for example.
  • the electrolytic bath may include predominantly water with about 0.3 wt% to about 15 wt% electrolytic compound(s), e.g., alkali metal silicates, alkali metal hydroxide, alkali metal fluorides, alkali metal phosphates, alkali metal aluminates, the like, and combinations thereof.
  • the electrolytic compounds may likewise be included at from about 1.5 wt% to about 3.5 wt%, or from about 2 wt% to about 3 wt%, though these ranges are not considered limiting.
  • a high-voltage alternating current can be applied to the substrate to create plasma on the surface of the substrate.
  • the substrate can act as one electrode immersed in the electrolyte solution
  • the counter electrode can be any other electrode that is also in contact with the electrolyte.
  • the counter electrode can be an inert metal such as stainless steel.
  • the bath holding the electrolyte solution can be conductive and the bath itself can be used as the counter electrode.
  • a high direct current or alternating voltage can be applied to the substrate and the counter electrode.
  • the voltage can be 150 V or higher, such as about 150 V to about 550 V, about 250 V to about 550 V, about 250 V to about 500 V, or about 200 V to about 300 V.
  • Temperatures can be from about 10 oC to about 45 oC, or from about 25 oC to about 35 oC, for example, though temperatures outside of these ranges can be used.
  • This process can oxidize the surface to form an oxide layer from the substrate material.
  • Various metal or metal alloy substrates can be used, including aluminium, titanium, lithium, magnesium, and/or alloys thereof, for example.
  • the oxidation can extend below the surface to form thick layers, as thick as 30 ⁇ m or more.
  • the oxide layer can have a thickness from about 2 ⁇ m to about 15 ⁇ m, from about 2 ⁇ m to about 12 ⁇ m, or from about 2 ⁇ m to about 10 ⁇ m, or from about 3 ⁇ m to about 10 ⁇ m, or from about 4 ⁇ m to about 7 ⁇ m.
  • the oxide layer can, in some instances, enhance the mechanical, wear, thermal, dielectric, and corrosion properties of the substrate.
  • the electrolyte solution can include a variety of electrolytes, such as a solution of potassium hydroxide.
  • the electrolyte solution can include sodium silicate, metal phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, ferric ammonium oxalate, phosphoric acid salts, graphite powder, silicon dioxide powder, aluminum oxide powder, metal powder, or combinations thereof.
  • the substrate can include a micro-arc oxidation layer on one side, or on both sides.
  • Heat Insulating Primer Layers [0043] The coated substrates described herein can include a heat insulating primer layer.
  • the heat insulating primer layer can be applied directly on the substrate, or directly on a passivation layer or micro-arc oxidation layer if one of these layers is present on the substrate.
  • the heat insulating primer layer can be formed by applying a liquid heat insulating primer composition.
  • the heat insulating primer composition can be applied in a liquid form by a variety of application processes, such as spin coating, dipping, spraying, spreading, and so on.
  • the composition can include heat insulating particles and a polymeric resin.
  • the heat insulating particles can include powdered materials such as fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or combinations thereof.
  • the polymeric resin of the heat insulating primer composition can be a thermally curable polymeric resin.
  • the polymer can include epoxy, epoxy-polyester, polyester, polyurethane, polyacrylic, or others.
  • the polymer can be cured by heating at a curing temperature for a period of time.
  • the curing temperature can be from about 80 °C to about 140 °C.
  • the curing temperature can be from about 80 °C to about 100 °C or from about 100 °C to about 140 °C.
  • the primer layer can be heated at the curing temperature for a curing time.
  • the curing time can be from about 10 minutes to about 30 minutes, or from about 10 minutes to about 20 minutes, or from about 20 minutes to about 30 minutes.
  • the thickness of the heat insulating primer layer can be from about 15 ⁇ m to about 60 ⁇ m, or from about 15 ⁇ m to about 40 ⁇ m, or from about 20 ⁇ m to about 40 ⁇ m, or from about 30 ⁇ m to about 60 ⁇ m.
  • the heat insulating primer composition can be a waterborne composition. Therefore, water can make up a majority of the solvent in the composition.
  • the heat insulating primer composition can include from about 50 wt% to about 70 wt% water.
  • the polymeric resin can be included in an amount from about 10 wt% to about 30 wt% based on the total weight of the primer composition.
  • the heat insulating particles can be included in an amount from about 5 wt% to about 30 wt%.
  • the primer composition can also include an organic co-solvent in an amount from about 10 wt% to about 20 wt%, and a surfactant in an amount from about 0.3 wt% to about 3 wt%. If the primer composition includes a pigment, then the pigment can be present in an amount from about 0.3 wt% to about 10 wt%.
  • the heat insulating particles can include a powdered form of fiberglass, glass wool, cellulose, calcium silicate, elastomeric foam, phenolic foam, polyurethane foam, polystyrene foam, hollow sphere glass, or combinations thereof.
  • the heat insulating particles can have an average particle size from about 0.1 ⁇ m to about 15 ⁇ m. These materials can have a thermal conductivity from about 0.03 W/mK to about 0.15 W/mK. Additionally, in some examples the heat insulating particles can include other materials with a thermal conductivity in this range.
  • the thermal conductivity of the heat insulating particles can be from about 0.03 W/mK to about 0.1 W/mK, or from about 0.03 W/mK to about 0.06 W/mK.
  • a base coat layer can be applied over the substrate.
  • the base coat layer can be applied over a heat-insulating primer layer on the substrate.
  • the base coat layer can be applied by similar coating processes as the primer layer, such as spin coating, dipping, spraying, spreading, and so on.
  • the base coat layer can include a pigment dispersed in a polymeric resin.
  • the pigment used in the base coat can be a solid particulate material such as carbon black, titanium dioxide, clay, mica, talc, barium sulfate, calcium carbonate, synthetic pigment, metallic powder, aluminum oxide, organic powder, inorganic powder, plastic beads, and color pigments.
  • the base coat layer can also include a dye.
  • the polymeric resin can be a liquid resin that can include monomers that polymerize to form a polymer, and/or already polymerized polymers that can cure to form a solid polymer layer. Some examples of polymers that can be included in the polymeric resin include polyester, polyacrylic, polyurethane, and epoxy.
  • the thickness of the base coat layer can be from about 10 ⁇ m to about 25 ⁇ m. In other examples, the thickness can be from about 10 ⁇ m to about 15 ⁇ m or from about 15 ⁇ m to about 25 ⁇ m.
  • the layer can be cured. In some examples, the layer can be cured by heating to a temperature from about 80 °C to about 140 °C. In other examples, the curing temperature can be from about 80 °C to about 100 °C, or from about 80 °C to about 120 °C, or from about 120 °C to about 140 °C. The layer can be heated at the curing temperature for a curing time.
  • the curing time can be from about 10 minutes to about 30 minutes, or from about 15 minutes to about 30 minutes, or from about 20 minutes to about 30 minutes.
  • the basecoat composition can also be a waterborne composition in which water can make up a majority of the solvent in the composition.
  • the basecoat composition can include from about 50 wt% to about 70 wt% water.
  • the polymeric resin in the basecoat composition can be included in an amount from about 10 wt% to about 30 wt% based on the total weight of the basecoat composition.
  • the pigment particles can be included in an amount from about 3 wt% to about 20 wt%.
  • the basecoat composition can also include heat insulating particles.
  • the heat insulating particles can be the same heat insulating material that is in the primer layer, or the basecoat composition can include a different heat insulating material. If heat insulating particles are included in the basecoat, then in some examples the amount of heat insulating particles can be from about 5 wt% to about 15 wt%.
  • the basecoat composition can also include an organic co-solvent in an amount from about 10 wt% to about 20 wt%, and a surfactant in an amount from about 0.3 wt% to about 3 wt%.
  • Topcoat Layers [0052] A topcoat layer can be applied over the basecoat layer in some examples.
  • the topcoat layer can include a resin that is a thermally cured polymeric resin or an ultraviolet cured polymeric resin.
  • the topcoat can also include an anti-fingerprint material.
  • Anti-fingerprint materials can include materials such as silanes, fluorinated polymers, and hydrophobic polymers.
  • silanes such as hexadecyl trimethoxy silane.
  • the anti-fingerprint material can include a fluorinated polyolefin, a fluoroacrylate, a fluorosilicone acrylate, a fluorourethane, a perflouropolyether, a perfluoropolyoxetane, a fluorotelomer, polytetrafluoroethylene, polyvinylidenefluoride, a fluorosiloxane, a fluorinated ultraviolet radiation-curable polymer, or a combination thereof.
  • fluorotelomers can be C-6 or lower in size.
  • the anti-fingerprint material can be a hydrophobic polymer that is C-7 or greater in size.
  • the polymeric resin in the topcoat layer can include a polyacrylic, a polyurethane, epoxy, polyester, urethane acrylate, acrylic acrylate, epoxy acrylate, or a combination thereof.
  • the topcoat layer can include the anti-fingerprint material in an amount of about 5 wt% to about 25 wt% by dry weight of the topcoat layer and the remainder can be the cured polymeric resin.
  • the amount of the anti-fingerprint material can be from about 5 wt% to about 15 wt% or from about 15 wt% to about 25 wt% by dry weight of the topcoat layer.
  • the topcoat layer can be formed by applying a topcoat composition using a variety of application processes, such as spin coating, dipping, spraying, spreading, and so on.
  • the topcoat composition can then be cured. If the topcoat composition is thermally curable, then the topcoat composition can be cured by heating to a curing temperature. If the topcoat composition is ultraviolet curable, then the topcoat composition can be cured by exposure to UV radiation. In some examples, a combination of UV radiation and heating can be used.
  • the composition can be baked at a temperature from about 50 °C to about 80 °C for a period of time from about 10 minutes to about 15 minutes before exposure to UV radiation.
  • the layer After baking, the layer can be exposed to UV radiation at an intensity from about 700 mJ/cm 2 to about 1,300 mJ/cm 2 . In other examples the UV radiation intensity can be from about 800 mJ/cm 2 to about 1,100 mJ/cm 2 .
  • the irradiation time can be from about 10 seconds to about 30 seconds in some examples. In other examples, the irradiation time can be from about 10 seconds to about 20 seconds, or from about 20 seconds to about 30 seconds.
  • the topcoat composition can be cured by heating to a curing temperature from about 80 °C to about 140 °C for a curing time from about 10 minutes to about 30 minutes.
  • the curing temperature can be from about 80 °C to about 100 °C or from about 100 °C to about 140 °C.
  • the curing time can be from about 10 minutes to about 20 minutes or from about 20 minutes to about 30 minutes.
  • the polymer resin can be included in an amount from about 10 wt% to about 30 wt% based on the total weight of the topcoat composition.
  • the anti-fingerprint material can be included in an amount from about 0.1 wt% to about 5 wt% based on the total weight of the topcoat composition.
  • the topcoat composition can also include water in an amount from about 50 wt% to about 70 wt%, an organic co-solvent in an amount from about 10 wt% to about 20 wt%, and a surfactant in an amount from about 0.1 wt% to about 2 wt%.
  • the anti-fingerprint topcoat composition can also include a matting compound such as silica nanoparticles, titania nanoparticles, alumina nanoparticles, or combinations thereof.
  • the matting compound can be present in an amount up to about 3 wt% based on the total weight of the topcoat composition.
  • the topcoat composition can include a pigment.
  • the pigment can be included in an amount up to about 10 wt% based on the total weight of the topcoat composition.
  • definitions [0056] It is noted that, as used in this specification and the appended claims, the singular forms "a,” “an,” and “the” include plural referents unless the content clearly dictates otherwise.
  • the term “about” is used to provide flexibility to a numerical range endpoint by providing that a given value may be “a little above” or “a little below” the endpoint. The degree of flexibility of this term can be dictated by the particular variable based on experience and the associated description herein.
  • thermal conductivity refers to the ability of a material to conduct heat.
  • Thermal conductivity can be reported in units of watts per meter-kelvin, or W/mK or W/(mK). Thermal conductivity can be measured using a thermal conductivity tester such as a TRIDENTTM thermal conductivity instrument from C-Therm Technologies Ltd. (Canada).
  • a thermal conductivity tester such as a TRIDENTTM thermal conductivity instrument from C-Therm Technologies Ltd. (Canada).
  • an atomic ratio range of about 1 at% to about 20 at% should be interpreted to include the explicitly recited limits of about 1 at% and about 20 at%, but also to include individual atomic percentages such as 2 at%, 11 at%, 14 at%, and sub-ranges such as 10 at% to 20 at%, 5 at% to 15 at%, etc.
  • Example 1 – Skin Temperature of Heat Insulating Coated Magnesium Alloy Substrate An example coated substrate for an electronic device was prepared using a magnesium alloy plate that was treated with a micro-arc oxidation treatment. A heat insulating primer layer was formed over the micro-arc oxidation layer using a heat insulating primer composition as described herein. A basecoat layer is formed using a basecoat composition that did not include heat insulating particles.
  • a topcoat layer was then formed over the basecoat layer using a topcoat composition as described herein.
  • the coated magnesium alloy plate was placed over a heater to test the heat insulating capability of the plate.
  • a control plate was also prepared for comparison.
  • the control plate was a magnesium alloy plate that was also treated with a micro-arc oxidation treatment.
  • a primer layer, basecoat layer, and topcoat layer were applied to the control plate.
  • the primer layer, basecoat layer, and topcoat layer of the control plate were identical to the primer layer, basecoat layer, and topcoat layer of the heat insulating sample plate, except that the control plate primer layer did not include heat insulating particles.
  • the steady-state temperature was measured at three different locations on the sample plate.
  • a substrate is made from magnesium alloy by CNC milling, forging, stamping, or thixomolding.
  • a micro-arc oxidation layer is formed on the substrate by submerging the substrate in a bath of 0.3 wt% to 15 wt% of a micro-arc oxidation chemical in water, and then applying a voltage of 150 V to 550 V for a time of 3 minutes to 25 minutes.
  • the micro-arc oxidation chemical is sodium silicate, metal phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, ferric ammonium oxalate, phosphoric acid salt, graphite powder, silicon dioxide powder, aluminum oxide powder, metal powder, or a combination thereof.
  • the temperature of the bath is from 10 °C to 45 °C and the pH of the bath is from 8 to 13.
  • a heat insulating primer composition is applied onto the micro-arc oxidation layer on the substrate.
  • the primer composition includes 10 wt% to 30 wt% of a thermally curable resin as described above, 5 wt% to 30 wt% heat insulating particles, 50 wt% to 70 wt% water, 10 wt% to 20 wt% organic co-solvent, and 0.3 wt% to 3 wt% surfactant.
  • the primer composition is then cured by heating to a temperature from 80 °C to 140 °C for 10 minutes to 30 minutes.
  • a heat insulating basecoat composition is applied over the primer layer.
  • the basecoat composition includes another thermally curable resin that may be the same as or different from the thermally curable resin in the primer layer.
  • the basecoat composition includes the thermally curable resin in an amount from 10 wt% to 30 wt%, heat insulating particles in an amount from 5 wt% to 15 wt%, and 50 wt% to 70 wt% water, 10 wt% to 20 wt% organic co-solvent, 3 wt% to 20 wt% pigment, and 0.3 wt% to 3 wt% surfactant.
  • the basecoat composition is then cured by heating to a temperature from 80 °C to 140 °C for 10 minutes to 30 minutes.
  • An anti-fingerprint topcoat composition is applied over the basecoat layer.
  • the topcoat composition also includes a thermally curable polymeric resin that may be the same as or different from the polymeric resins in the primer and the basecoat layers.
  • the topcoat composition includes the polymeric resin in an amount from 10 wt% to 30 wt%, and 0.1 wt% to 5 wt% of an anti-fingerprint material such as fluoropolymer or silanes, 50 wt% to 70 wt% water, 10 wt% to 20 wt% organic co-solvent, 0 wt% to 3 wt% matting compound, and 0.1 wt% to 2 wt% surfactant.
  • an anti-fingerprint material such as fluoropolymer or silanes
  • the anti-fingerprint topcoat composition is cured by heating to a temperature from 80 °C to 140 °C for 10 minutes to 30 minutes.
  • Example 3 – Heat Insulating Coated Carbon Fiber Substrate with Heat Insulating Basecoat [0070] Another example coated substrate for an electronic device is made using the following process. A substrate is made from carbon fiber. A heat insulating primer composition is applied onto the substrate. The primer composition includes 10 wt% to 30 wt% of a thermally curable resin as described above, 5 wt% to 30 wt% heat insulating particles, 50 wt% to 70 wt% water, 10 wt% to 20 wt% organic co-solvent, and 0.3 wt% to 3 wt% surfactant.
  • the primer composition is then cured by heating to a temperature from 80 °C to 140 °C for 10 minutes to 30 minutes.
  • a heat insulating basecoat composition is applied over the primer layer.
  • the basecoat composition includes another thermally curable resin that may be the same as or different from the thermally curable resin in the primer layer.
  • the basecoat composition includes the thermally curable resin in an amount from 10 wt% to 30 wt%, heat insulating particles in an amount from 5 wt% to 15 wt%, and 50 wt% to 70 wt% water, 10 wt% to 20 wt% organic co-solvent, 3 wt% to 20 wt% pigment, and 0.3 wt% to 3 wt% surfactant.
  • the basecoat composition is then cured by heating to a temperature from 80 °C to 140 °C for 10 minutes to 30 minutes.
  • An anti-fingerprint topcoat composition is applied over the basecoat layer.
  • the topcoat composition also includes a thermally curable polymeric resin that may be the same as or different from the polymeric resins in the primer and the basecoat layers.
  • the topcoat composition includes the polymeric resin in an amount from 10 wt% to 30 wt%, and 0.1 wt% to 5 wt% of an anti-fingerprint material such as fluoropolymer or silanes, 50 wt% to 70 wt% water, 10 wt% to 20 wt% organic co-solvent, 0 wt% to 3 wt% matting compound, and 0.1 wt% to 2 wt% surfactant.
  • the anti-fingerprint topcoat composition is cured by heating to a temperature from 80 °C to 140 °C for 10 minutes to 30 minutes.

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Abstract

Un substrat revêtu d'isolation thermique pour un dispositif électronique peut comprendre un substrat, une couche d'apprêt d'isolation thermique sur le substrat, et une couche de revêtement de base sur la couche d'apprêt. La couche d'apprêt d'isolation thermique peut comprendre des particules d'isolation thermique dispersées dans une première résine polymère. Les particules d'isolation thermique peuvent comprendre de la fibre de verre, de la laine de verre, de la cellulose, du silicate de calcium, de la mousse élastomère, de la mousse phénolique, de la mousse de polyuréthane, de la mousse de polystyrène, du verre sphérique creux, ou une combinaison de ceux-ci. La couche de revêtement de base peut comprendre des particules de pigment dispersées dans une seconde résine polymère.
PCT/US2021/019155 2021-02-23 2021-02-23 Substrats revêtus d'isolation thermique pour dispositifs électroniques WO2022182327A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996034411A1 (fr) * 1995-04-25 1996-10-31 Siemens Aktiengesellschaft Couvercele de puce
JP2006121051A (ja) * 2004-09-22 2006-05-11 Fuji Polymer Industries Co Ltd 熱伝導性シート及びその製造方法
JP2015019051A (ja) * 2013-06-14 2015-01-29 株式会社日本触媒 放熱シート
US20160372400A1 (en) * 2014-03-04 2016-12-22 Dexerials Corporation Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996034411A1 (fr) * 1995-04-25 1996-10-31 Siemens Aktiengesellschaft Couvercele de puce
JP2006121051A (ja) * 2004-09-22 2006-05-11 Fuji Polymer Industries Co Ltd 熱伝導性シート及びその製造方法
JP2015019051A (ja) * 2013-06-14 2015-01-29 株式会社日本触媒 放熱シート
US20160372400A1 (en) * 2014-03-04 2016-12-22 Dexerials Corporation Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet

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