WO2022179375A1 - Fil isolé, son procédé de fabrication, bobine et équipement électronique et électrique - Google Patents

Fil isolé, son procédé de fabrication, bobine et équipement électronique et électrique Download PDF

Info

Publication number
WO2022179375A1
WO2022179375A1 PCT/CN2022/074023 CN2022074023W WO2022179375A1 WO 2022179375 A1 WO2022179375 A1 WO 2022179375A1 CN 2022074023 W CN2022074023 W CN 2022074023W WO 2022179375 A1 WO2022179375 A1 WO 2022179375A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulated wire
conductor
peek
adhesive
wire according
Prior art date
Application number
PCT/CN2022/074023
Other languages
English (en)
Chinese (zh)
Inventor
叶惠敏
朱祚茂
Original Assignee
佳腾电业（赣州）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳腾电业（赣州）有限公司 filed Critical 佳腾电业（赣州）有限公司
Priority to EP22721260.2A priority Critical patent/EP4080525A4/fr
Priority to US17/840,462 priority patent/US12031066B2/en
Publication of WO2022179375A1 publication Critical patent/WO2022179375A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/16—Condensation polymers of aldehydes or ketones with phenols only of ketones with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/16—Condensation polymers of aldehydes or ketones with phenols only of ketones with phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/14—Insulating conductors or cables by extrusion
    • H01B13/145—Pretreatment or after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/427—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
    • C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Definitions

  • the invention relates to the technical field of wire and cable production, in particular to an insulated wire resistant to high frequency and high voltage, a preparation method thereof, a coil and electronic and electrical equipment.
  • Insulated wires in which conductors are covered with an insulating film are used to assemble coils in various electrical and electronic devices. Coils are especially commonly used in electrical and electronic equipment represented by motors and transformers.
  • Polyamide-imide (PAI) has excellent mechanical properties, its tensile strength exceeds 172MPa, and the thermal deformation temperature is 274°C under a load of 1.8MPa.
  • PAI resin Imide enamelled copper wire (AIW) has excellent insulating properties, heat resistance and mechanical properties.
  • a layer of polyetheretherketone is also used to wrap the outer side of the enameled wire, thereby greatly improving the temperature resistance and radiation resistance of the enameled wire.
  • PEEK is a single-component material, which will form a lubricating surface layer after heating, and the adhesion with other materials is very weak, and the PAI coating will also form a smoother surface layer after baking and cross-linking; AIW and PEEK are both After each reaction, a smoother surface layer is formed, and it is difficult for the two to bond closely; therefore, the traditional PEEK insulated wire often cracks and falls off during application, resulting in the lack of wire insulation performance.
  • the present invention expects to provide an insulated wire and a method for preparing the same, a coil using the insulated wire, and an electrical/electronic device using the coil, with excellent adhesion between insulating layers, which can effectively solve the stretching and de-piping of products. and winding cracks.
  • An insulated wire comprises a conductor, an adhesive layer and a PEEK resin insulating layer sequentially arranged on the outer side of the conductor, the adhesive layer is located between the conductor and the polyether ether ketone (PEEK) resin insulating layer; the PEEK resin insulating layer It is formed of PEEK resin material; wherein the adhesive constituting the adhesive layer includes organic solvent, polyamideimide (PAI) resin and PEEK nano powder material.
  • PEEK polyether ether ketone
  • a PAI primer layer which is formed by sintering the PAI resin on the conductor to form the primer layer; but for cost reasons, more preferably, the adhesive layer is directly Coated on the conductor surface without the need for a separate PAI primer layer.
  • the adhesive is coated on the surface of the conductor bare wire to form an adhesive layer, and the average thickness is 5 ⁇ m or more and 30 ⁇ m or less; preferably 10 ⁇ m or more and 20 ⁇ m or less.
  • the organic solvent includes a nitrogen-containing polar solvent, an ether-based solvent, xylene or a mixture thereof; preferably, the nitrogen-containing polar solvent is specifically selected from: N-methyl-2-pyrrolidone, N,N- One or more solvents selected from dimethylformamide, N,N-dimethylacetamide, tetramethyl urea and dimethyl ethylene urea; preferably, the ether-based solvent is specifically selected from: diethylene diethylene glycol A solvent of one or more of glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol and triethylene glycol.
  • the average particle size of the PEEK nano-powder is 50-100 nm.
  • a dispersant is preferably added.
  • the adhesive comprises 50-80 parts of organic solvent, 20-30 parts of polyamideimide resin and 2-8 parts of PEEK nano powder material.
  • the thickness of the PEEK resin insulating layer is 10-1000 ⁇ m, preferably 25-750 ⁇ m, particularly preferably 30-500 ⁇ m, especially 50-250 ⁇ m.
  • the glass transition temperature of the PEEK resin material forming the PEEK resin insulating layer is 320-360° C.
  • its melting viscosity at 400° C. is 120-140pa.s, preferably 130pa.s.
  • PEEK resin material has good melt extrusion effect with balanced mechanical properties and processability.
  • the insulated wire of the present invention can be used for insulated wires of flat type, round type and the like.
  • the invention also discloses a preparation method of the above insulated wire, which specifically includes the following steps:
  • Step 1 Coating an adhesive on the outside of the conductor to form an adhesive layer covering the conductor to obtain a core wire;
  • Step 2 extruding the PEEK resin material on the outside of the adhesive layer of the core wire to form a PEEK resin insulating layer to obtain an insulated wire.
  • step 1 an enameling machine is used to apply the adhesive on the bare conductor wire.
  • the organic solvent in the adhesive is volatilized, and the adhesive is cured to form an adhesive layer.
  • the core wire is preheated, and the preheating temperature should reach above 400 °C. During this process, the organic solvent in the adhesive is further volatilized.
  • step 2 the PEEK resin material is heated to a molten state, and then through the rotation of the screw of the screw extruder, the PEEK resin material flows evenly in the barrel, and the preheated core wire is placed on the screw for extrusion.
  • the PEEK resin material is evenly wrapped on the surface of the core wire through different specifications of the mold at the head, and the PEEK resin insulating layer is formed after cooling and crystallization.
  • step 1 the adhesive is prepared in the following manner; the polyamideimide resin is dissolved in an organic solvent, after heating and stirring to dissolve, the PEEK nano powder material is added, and after fully stirring and dissolving, the organic solvent is added again. Solvent to adjust solids content and viscosity.
  • the PEEK resin insulating layer is formed by melt extrusion at a temperature of 380-410° C. During the extrusion process, the melted PEEK resin material can be mixed with the PEEK nano-powder material in the adhesive layer. Contact fusion, so that a tight bond is formed between the adhesive layer and the PEEK resin insulating layer.
  • the solid content of the adhesive is 20-40%, and the viscosity at a temperature of 30°C is 2500-3500cp, preferably 3000cp.
  • an adhesive is coated on the surface of the bare conductor wire to form an adhesive layer covering the bare conductor wire to obtain the core wire.
  • a PAI primer layer is formed on the bare conductor wire
  • An adhesive is coated on the PAI primer layer to form an adhesive layer covering the conductor to obtain a core wire.
  • the bare conductor wires provided in the step 1 are bare conductor wires formed of copper, aluminum and their alloys.
  • the present invention further provides a coil comprising the insulated wire of the present invention.
  • the present invention also further provides an electronic/electrical device comprising the coil of the present invention.
  • the invention provides an insulated wire.
  • the adhesive forming the adhesive layer comprises mixed organic solvent, polyamideimide resin and PEEK nano-powder material
  • the bonding layer can be well bonded to the conductor bare wire material, and can also be well bonded to the PEEK resin insulating layer, so that the produced insulated wire has good adhesion;
  • the adhesive layer is mainly PAI resin, which can play a common interlayer insulation function in the prior art, so there is no need to bake a separate PAI primer layer on the surface layer of the conductor bare wire.
  • Fig. 1 is the sectional structure schematic diagram of the insulated wire of the present invention
  • Fig. 2 is the schematic flow chart of the preparation method of the insulated wire of the present invention
  • Fig. 3 is the schematic diagram that the insulated wire of the embodiment of the present invention and comparative example carry out U-bend test;
  • FIG. 4 is a schematic diagram of the winding test of the insulated wires of the embodiment and the comparative example of the present invention.
  • the preparation method of the insulated wire of the present invention specifically includes the following steps:
  • Step 1 Use an enameling machine to coat an adhesive on the outside of the conductor bare wire 1.
  • the organic solvent in the adhesive is volatilized, and the adhesive is cured to form an adhesive layer 2 covering the conductor bare wire 1 to obtain
  • the core wire is then preheated before entering the head of the screw extruder.
  • the preheating temperature should reach above 400 °C. During this process, the organic solvent in the adhesive will be further volatilized.
  • the specific manufacturing process of the adhesive is as follows: dissolving the polyamideimide resin in an organic solvent, heating and stirring to dissolve, adding PEEK nano powder material, fully stirring and dissolving, adding an organic solvent again to adjust the solid content and viscosity to obtain an adhesive.
  • Step 2 Add the polyetheretherketone (PEEK) resin material into the barrel of the screw extruder, heat the PEEK resin material to a molten state at a temperature of 380-410°C, and then rotate the screw of the screw extruder to make the PEEK resin material.
  • the resin material flows uniformly in the barrel, and the preheated core wire is placed in front of the screw extruder head, and the PEEK resin material is evenly wrapped on the surface of the core wire through different specifications of the die at the head, and formed after cooling and crystallization PEEK resin insulating layer 3 to obtain an insulated wire with the structure shown in FIG. 1 .
  • the cross-section of the conductor bare wire 1 in the present invention may be circular or rectangular, including the case where the corners of the rectangle have arcs, and the material is the conductor bare wire formed of copper, aluminum and their alloys. Conductors of low-oxygen copper or oxygen-free copper with an oxygen content of 30 ppm or less.
  • the adhesive layer 2 in the present invention can be directly coated on the conductor bare wire 1, and a PAI primer layer can be set on the conductor bare wire 1 first, which is obtained by coating the conductor with PAI varnish and then baking it.
  • a PAI primer layer can be set on the conductor bare wire 1 first, which is obtained by coating the conductor with PAI varnish and then baking it.
  • the adhesive layer is directly coated on the surface of the conductor without the need for a separate PAI primer layer; and the adhesive layer is mainly PAI resin, which can play the role of common interlayer in the prior art. Insulation, so there is no need to bake a separate PAI primer layer on the bare conductor surface.
  • the components of the adhesive include organic solvent, polyamide-imide (PAI) resin and PEEK nano-powder material; wherein, in parts by weight, 50-80 parts of organic solvent, 20-30 parts of polyamide-imide resin and PEEK nano powder material 2-8 parts.
  • organic solvents For the selection of organic solvents, consider the types that can dissolve PAI resin and also enable PEEK nano-powders to be well dispersed in the PAI resin matrix, including nitrogen-containing polar solvents, ether-based solvents, xylene or their mixtures, wherein nitrogen-containing polar solvents
  • the solvent is specifically selected from: one or two of N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, tetramethylurea and dimethylethylene urea
  • the ether-based solvent is specifically selected from: one or more in diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol and triethylene glycol. two or more solvents.
  • a dispersant can also be added, and the dispersant is a surfactant commonly used in the field, more preferably: cetyltrimethylammonium bromide, One or more of base phenol ethylene oxide condensate emulsifier, sodium dodecyl sulfate, sodium dodecyl sulfonate, and sodium dodecyl benzene sulfonate.
  • PAI resin for the consideration of replacing the primer layer with an adhesive layer and having good tensile and bending properties, PAI is preferably an amorphous resin with a glass transition temperature of 200°C or more and 300°C or less. When the glass transition temperature is too low, the electrical properties may be lowered in the heat resistance test. On the other hand, if the glass transition temperature is too high, it may remain incompletely melted during welding, thereby deteriorating weldability.
  • the elastic modulus is 100 MPa to 1000 MPa, preferably 300 to 800 MPa. Good mechanical strength and bending properties.
  • the thickness of the adhesive layer 2 is 5 ⁇ m or more and 30 ⁇ m or less; more preferably 10 ⁇ m or more and 20 ⁇ m or less. If the thickness of the adhesive layer 2 is too thin, its adhesion to the bare conductor wire and the PEEK insulating layer is insufficient. If the thickness of the adhesive layer 2 is too thick, it becomes difficult to bend the electric wire when bending it.
  • the following table shows the comparative experimental data of the adhesion of different adhesive layer thicknesses. It can be seen from the following comparative experiments that when the thickness of the adhesive layer 2 of the insulated wire of the present invention is more than 5 ⁇ m and less than 30 ⁇ m, all test results are qualified, and the loss of adhesion length is shorter, indicating that the adhesion of the adhesive layer. better.
  • the loss of adhesion length is defined as the length of the insulating film from which the adhesion is lost from the cut, and the shorter the length value, the better the adhesion performance of the adhesive layer.
  • the PEEK nano-powder of the present invention can be prepared by methods such as cryogenic pulverization, sol-gel method, dissolution and sedimentation method common in the prior art, the average particle size of the PEEK nano-powder is 50-100 nm, and the PEEK nano-powder used in the present invention is Commercially available products.
  • the glass transition temperature of PEEK resin material is 320-360°C, and the melting viscosity at 400°C is 120-140pa.s, preferably 130pa.s. PEEK resin in this melting viscosity range
  • the material has good melt extrusion effect, and has balanced mechanical properties and processability.
  • a PEEK insulating resin layer with glass transition temperature and melt index meeting different conditions can be obtained.
  • the thickness of the PEEK insulating resin layer is 10-1000 ⁇ m, preferably 25-750 ⁇ m, particularly preferably 30-500 ⁇ m, especially 50-250 ⁇ m.
  • the adhesive is coated on the flat copper conductor bare wire with an enameling machine, and the coating thickness is 15 ⁇ m. During the coating process, the organic solvent in the adhesive is volatilized, and the adhesive is cured to form an adhesive layer to obtain a core. wire, and then preheat the core wire to 400°C.
  • a PEEK resin material with a glass transition temperature of 340 ° C add the PEEK resin material into the barrel of the screw extruder, and heat it to a molten state of 380 ° C, and then rotate the screw of the screw extruder to make the PEEK resin material in the material.
  • the preheated core wire is placed in front of the head of the screw extruder.
  • the PEEK resin material is evenly wrapped on the surface of the core wire through a die.
  • a PEEK resin with a thickness of 100 ⁇ m is formed.
  • the insulating layer is obtained to obtain a flat-type insulated wire.
  • Example 2 Compared with Example 1, before coating to form an adhesive layer, a 10 ⁇ m PAI primer layer was formed on the bare copper conductors, and other technical features were the same as those in Example 1, which will not be repeated here.
  • Example 1 Compared with Example 1, the surfactant cetyl trimethyl ammonium bromide of 5g was also added in the prepared adhesive, and other technical features were the same as in Example 1, and will not be repeated here.
  • the coating thickness of the adhesive layer is 25 ⁇ m, and other technical features are the same as those of Embodiment 1, and will not be repeated here.
  • the thickness of the PEEK resin insulating layer is 200 ⁇ m, and other technical features are the same as those of Embodiment 1, which will not be repeated here.
  • the copper conductor bare wire is directly coated with a PEEK resin insulating layer with a thickness of 100 ⁇ m by melt extrusion to obtain a comparative wire.
  • the insulated wires of Examples 1-5 and Comparative Example 1 were respectively subjected to a U-bend test and a wire winding test according to the following methods.
  • Example 1 ⁇ 2mm qualified qualified
  • Example 2 ⁇ 2mm qualified qualified
  • Example 3 ⁇ 2mm qualified qualified
  • Example 4 ⁇ 2mm qualified qualified
  • Example 5 ⁇ 2mm qualified qualified Comparative Example 1 >2mm Failed Failed
  • the insulated wire of the present invention has good processing performance and excellent adhesion between insulating layers, which can effectively solve the problems of product drawing off tube and winding cracking.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)

Abstract

L'invention concerne un fil isolé, son procédé de fabrication, une bobine et un équipement électronique et électrique. Pour le fil isolé de la présente invention, une couche adhésive contenant une nanopoudre de PEEK est disposée entre un conducteur et une couche isolante de résine PEEK, l'adhésif formant la couche adhésive comprend un solvant organique mixte, une résine de polyamide-imide, et un matériau de nanopoudre de PEEK, et la couche adhésive non seulement permet une excellente adhérence à un matériau conducteur, mais permet également une excellente adhérence à la couche isolante en résine PEEK, ce qui permet d'obtenir un matériau de fil isolé produit avec une excellente adhésivité, et d'empêcher le matériau de fil de subir les phénomènes de fissuration et de dégainage pendant l'application.
PCT/CN2022/074023 2021-02-24 2022-01-26 Fil isolé, son procédé de fabrication, bobine et équipement électronique et électrique WO2022179375A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP22721260.2A EP4080525A4 (fr) 2021-02-24 2022-01-26 Fil isolé, son procédé de fabrication, bobine et équipement électronique et électrique
US17/840,462 US12031066B2 (en) 2021-02-24 2022-06-14 Insulated wire and preparation method thereof, coil and electronic/electrical device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110207170.7 2021-02-24
CN202110207170.7A CN113012847B (zh) 2021-02-24 2021-02-24 一种绝缘电线及其制备方法、线圈和电子/电气设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/840,462 Continuation US12031066B2 (en) 2021-02-24 2022-06-14 Insulated wire and preparation method thereof, coil and electronic/electrical device

Publications (1)

Publication Number Publication Date
WO2022179375A1 true WO2022179375A1 (fr) 2022-09-01

Family

ID=76385782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/074023 WO2022179375A1 (fr) 2021-02-24 2022-01-26 Fil isolé, son procédé de fabrication, bobine et équipement électronique et électrique

Country Status (4)

Country Link
US (1) US12031066B2 (fr)
EP (1) EP4080525A4 (fr)
CN (2) CN114334289B (fr)
WO (1) WO2022179375A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118398283A (zh) * 2024-06-28 2024-07-26 佳腾电业(赣州)股份有限公司 绝缘电线及其制备方法、绕线组、电气设备
CN118398282A (zh) * 2024-06-28 2024-07-26 佳腾电业(赣州)股份有限公司 一种绝缘电线及其制备方法、线圈及其应用和波绕电机

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114334289B (zh) * 2021-02-24 2023-03-10 佳腾电业（赣州）有限公司 一种绝缘电线制备方法、绝缘电线和电子/电气设备
CN114203343B (zh) * 2021-11-30 2024-04-26 金杯电工电磁线有限公司 Peek绝缘电磁线及其制备方法
CN114420345A (zh) * 2022-01-24 2022-04-29 松田电工（台山）有限公司 一种高耐压复合绝缘电线及其制备方法
GB202216867D0 (en) * 2022-11-11 2022-12-28 Victrex Mfg Ltd Improvements relating to the extrusion of polymeric material
WO2024160303A1 (fr) * 2023-01-31 2024-08-08 佳腾电业(赣州)股份有限公司 Fil isolé, bobine et dispositif électronique/électrique
CN116622069B (zh) * 2023-07-24 2023-10-03 佳腾电业(赣州)股份有限公司 一种聚双醚醚酰亚胺粘结剂及其制备方法、应用
CN118398285B (zh) * 2024-06-28 2024-09-06 佳腾电业(赣州)股份有限公司 一种绝缘电线及其制备方法、线圈和电子/电气设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157433A (ja) * 2008-12-26 2010-07-15 Sumitomo Electric Wintec Inc 絶縁電線
CN106489183A (zh) * 2014-06-03 2017-03-08 古河电气工业株式会社 绝缘电线及其制造方法
JP2017117681A (ja) * 2015-12-24 2017-06-29 古河電気工業株式会社 自己融着性絶縁電線、コイル及び電気・電子機器
CN108292542A (zh) * 2015-11-20 2018-07-17 古河电气工业株式会社 集合电线及其制造方法以及电气设备
CN113012847A (zh) * 2021-02-24 2021-06-22 佳腾电业（赣州）有限公司 一种绝缘电线及其制备方法、线圈和电子/电气设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5320639B2 (ja) * 2008-02-13 2013-10-23 日立電線株式会社 絶縁電線
JP5922571B2 (ja) * 2010-03-25 2016-05-24 古河電気工業株式会社 発泡電線及びその製造方法
JP5454804B2 (ja) * 2011-08-12 2014-03-26 古河電気工業株式会社 絶縁ワイヤ
JP5391324B1 (ja) * 2012-11-30 2014-01-15 古河電気工業株式会社 耐インバータサージ絶縁ワイヤ及びその製造方法
JP5651161B2 (ja) * 2012-12-20 2015-01-07 住友電気工業株式会社 多層熱回復物品、ワイヤスプライス及びワイヤハーネス
WO2015098639A1 (fr) * 2013-12-26 2015-07-02 古河電気工業株式会社 Fil isolé multicouche, bobine et dispositif électrique/électronique
KR101988092B1 (ko) * 2013-12-26 2019-06-11 후루카와 덴키 고교 가부시키가이샤 절연 와이어, 코일 및 전기전자기기와 피막박리 방지 절연 와이어의 제조방법
US9324476B2 (en) * 2014-02-05 2016-04-26 Essex Group, Inc. Insulated winding wire
JP5778332B1 (ja) * 2014-12-26 2015-09-16 古河電気工業株式会社 耐曲げ加工性に優れる絶縁電線、それを用いたコイルおよび電子・電気機器
MY188171A (en) * 2016-02-19 2021-11-24 Furukawa Magnet Wire Co Ltd Insulated wire, motor coil, and electrical or electronic equipment
JP2017157460A (ja) * 2016-03-03 2017-09-07 古河電気工業株式会社 絶縁電線、コイル及び電気・電子機器
PT3226258T (pt) * 2016-04-01 2019-01-09 Gebauer & Griller Metallwerk Gmbh Condutor elétrico isolado
CN109716451B (zh) * 2016-09-13 2021-01-29 埃赛克斯古河电磁线日本有限公司 绝缘电线、线圈和电气/电子设备
CN110136895B (zh) * 2019-05-09 2020-12-11 无锡锡洲电磁线有限公司 一种peek漆包线加工工艺
CN111554443B (zh) * 2020-03-27 2021-06-11 铜陵精达特种电磁线股份有限公司 一种peek电磁线的加工工艺

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157433A (ja) * 2008-12-26 2010-07-15 Sumitomo Electric Wintec Inc 絶縁電線
CN106489183A (zh) * 2014-06-03 2017-03-08 古河电气工业株式会社 绝缘电线及其制造方法
CN108292542A (zh) * 2015-11-20 2018-07-17 古河电气工业株式会社 集合电线及其制造方法以及电气设备
JP2017117681A (ja) * 2015-12-24 2017-06-29 古河電気工業株式会社 自己融着性絶縁電線、コイル及び電気・電子機器
CN113012847A (zh) * 2021-02-24 2021-06-22 佳腾电业（赣州）有限公司 一种绝缘电线及其制备方法、线圈和电子/电气设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4080525A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118398283A (zh) * 2024-06-28 2024-07-26 佳腾电业(赣州)股份有限公司 绝缘电线及其制备方法、绕线组、电气设备
CN118398282A (zh) * 2024-06-28 2024-07-26 佳腾电业(赣州)股份有限公司 一种绝缘电线及其制备方法、线圈及其应用和波绕电机

Also Published As

Publication number Publication date
EP4080525A4 (fr) 2023-05-31
US12031066B2 (en) 2024-07-09
CN113012847B (zh) 2021-11-23
US20220306921A1 (en) 2022-09-29
EP4080525A1 (fr) 2022-10-26
CN114334289B (zh) 2023-03-10
CN113012847A (zh) 2021-06-22
CN114334289A (zh) 2022-04-12

Similar Documents

Publication Publication Date Title
WO2022179375A1 (fr) Fil isolé, son procédé de fabrication, bobine et équipement électronique et électrique
US11615914B2 (en) Magnet wire with thermoplastic insulation
JP6030832B2 (ja) 高温高周波マグネットワイヤー及び製造方法
TW201535427A (zh) 絕緣電線，線圈及電氣、電子機器以及防止皮膜剝離之絕緣電線之製造方法
WO2024141111A1 (fr) Matériau composite à base de plastique résistant à l'effet corona et son procédé de préparation, feuille composite résistante à l'effet corona et stator de moteur électrique
JP2013033607A (ja) 絶縁電線及びその製造方法
JP2013206648A (ja) 絶縁電線
WO2024120545A1 (fr) Feuille composite résistante à l'effet couronne pour moteur électrique de véhicule à énergie nouvelle, et son procédé de préparation
US8809684B2 (en) Insulated wire
US20230083970A1 (en) Magnet wire with thermoplastic insulation
CN114724744B (zh) 用于电机的耐电晕漆包线及其制备方法及扁线电机
JP5516303B2 (ja) 絶縁電線およびその製造方法
CN117877791A (zh) 绝缘电线、线圈和电子/电气设备
KR101708498B1 (ko) 절연전선
CN220252858U (zh) 一种扁平绝缘电线、制造设备及电子设备
CN217606579U (zh) 异型绝缘电线、线圈和电子/电气设备
KR20230004822A (ko) 권선에 사용하기 위한 절연 도체, 그로부터 유래된 권선 및 상응하는 제조 방법
JP5561238B2 (ja) 絶縁電線及びその製造方法
CN217468019U (zh) 一种高导热耐电晕漆包线
CN114203343B (zh) Peek绝缘电磁线及其制备方法
CN117438140A (zh) 绝缘电线及其制备方法、线圈、电子/电气设备
CN117965106B (zh) 耐电晕绝缘膜及其制备方法、电磁线及其制备方法
CN117275803A (zh) 耐电晕绝缘电线及其制备方法、线圈和电子/电气设备
JP2017068971A (ja) 絶縁電線
CN117912751A (zh) 绝缘电线及其制备方法、线圈和电子/电气设备

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2022721260

Country of ref document: EP

Effective date: 20220516

NENP Non-entry into the national phase

Ref country code: DE