WO2022179092A1 - 一种用于芯片焊接的快速冷却的真空共晶炉 - Google Patents

一种用于芯片焊接的快速冷却的真空共晶炉 Download PDF

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Publication number
WO2022179092A1
WO2022179092A1 PCT/CN2021/119193 CN2021119193W WO2022179092A1 WO 2022179092 A1 WO2022179092 A1 WO 2022179092A1 CN 2021119193 W CN2021119193 W CN 2021119193W WO 2022179092 A1 WO2022179092 A1 WO 2022179092A1
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Prior art keywords
cooling
carrier
power shaft
vacuum eutectic
bosses
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PCT/CN2021/119193
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English (en)
French (fr)
Inventor
邓燕
赵永先
张延忠
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北京中科同志科技股份有限公司
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Publication of WO2022179092A1 publication Critical patent/WO2022179092A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Definitions

  • the utility model relates to the technical field of chip welding, in particular to a rapid cooling vacuum eutectic furnace for chip welding.
  • the first is air cooling.
  • air cooling that is, in the cooling stage, inert protective gas is filled into the equipment, and the welding workpiece is cooled by gas heat exchange.
  • the cost of the gas itself is relatively high, and the specific heat capacity of the gas itself is small, and the heat that can be taken away is small. It takes a long time to reach the ideal temperature, which affects the production efficiency. For some processes that require a higher cooling rate, the air cooling method is difficult to meet.
  • the second is the water-cooling structure.
  • the metal carrier is cast or processed, and the cooling pipeline is directly arranged inside the carrier. High, cooling takes a long time, and at the same time to ensure the heating rate, a larger power heater is required, and the energy consumption is large.
  • a cooling water pipe is installed at the bottom of the non-metallic stage, and the cooling speed is improved. However, if the cooling tube is used for a long time, the cooling tube is deformed, and the contact with the stage is poor, and the cooling speed is obviously reduced.
  • the third air-cooled and water-cooled structures coexist, and the cooling rate is improved, but the above two shortcomings or deficiencies cannot be avoided.
  • the utility model provides a rapid cooling vacuum eutectic furnace for chip welding, which has fast heating and cooling rates and high reliability.
  • the utility model provides the following technical solutions:
  • a rapid cooling vacuum eutectic furnace for chip bonding comprising:
  • cooling bosses are arranged on the lower shell, and cooling medium channels are arranged in the cooling bosses;
  • heating devices a plurality of heating devices, the heating devices and the cooling bosses are arranged at intervals one by one;
  • the stage is arranged in the cavity
  • the driving mechanism is in driving connection with the carrier to drive the carrier to disengage or contact the cooling boss.
  • cooling bosses are elongated, and the cooling bosses are arranged in parallel in sequence; an accommodation groove for accommodating the heating device is formed between two adjacent cooling bosses.
  • the upper edge of the cooling boss is higher than the upper edge of the heating device.
  • the driving mechanism includes a cam provided on the lower casing, the cam abuts on the carrier, and the cam rotates to drive the carrier to disengage or contact the cooling boss.
  • the driving mechanism includes a power shaft and cams arranged on both sides of the cooling boss, each cooling boss is provided with an escape groove/hole, and the power shaft penetrates through each of the escape grooves/holes.
  • the holes are arranged, the cam is connected to the power shaft, and the rotation of the power shaft drives the cam to rotate.
  • the cooling medium channel is perpendicular to the avoidance groove/hole, and the cooling medium channel is located higher than the avoidance groove/hole.
  • a guide post is provided on the lower casing, and the carrier is slidably connected to the guide post.
  • an elastic member is installed on the guide column, and one end of the elastic member elastically abuts on the carrier.
  • the drive mechanism includes a drive motor, a side wall of the lower casing is provided with a through hole, the power shaft is disposed through the through hole, and the power shaft and the through hole are connected by a movement.
  • the seal is connected; the end of the power shaft extending out of the lower casing is connected with the drive motor in a transmission manner.
  • the drive motor is connected with a driving wheel
  • the power shaft is connected with a driven wheel
  • the driving wheel and the driven wheel are connected by a transmission belt.
  • the utility model has the following beneficial effects:
  • the carrier in the vacuum eutectic furnace of the present application can be detached from or contact with the cooling boss, and the carrier rises and detaches from the cooling boss during heating, heating is rapid, and is not affected by the cooling pipe, so that the heating is uniform. If rapid cooling is required after heating, the carrier is lowered to fit the cooling boss, and the cooling speed is fast.
  • FIG. 1 is a schematic three-dimensional structure diagram of a vacuum eutectic furnace for rapid cooling of chip welding provided by the present invention after removing an upper casing and a carrier;
  • FIG. 2 is a schematic three-dimensional structure diagram of the vacuum eutectic furnace for rapid cooling of chip welding provided by the present invention after removing the upper shell;
  • Fig. 3 is the sectional view of Fig. 2 when heating
  • Fig. 4 is the sectional view of Fig. 2 when cooling
  • FIG. 5 is a diagram of the cooperation between the cooling medium channel and the avoidance groove/hole of the rapid cooling vacuum eutectic furnace for chip bonding provided by the present invention.
  • the terms “installation” and “connection” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection, or It can be connected integrally; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium.
  • installation and “connection” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection, or It can be connected integrally; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium.
  • an embodiment of the present application provides a rapid cooling vacuum eutectic furnace for chip bonding, including a lower casing 1 , an upper casing 2 , a plurality of heating devices 3 , a carrier 4 and drive mechanism 5.
  • a plurality of cooling bosses 6 are provided on the lower casing 1 , and cooling medium channels 62 are provided in the cooling bosses 6 .
  • the upper casing 2 and the lower casing 1 are connected, and a cavity is formed between the upper casing 2 and the lower casing 1 .
  • the heating device 3 and the cooling boss 6 are arranged at intervals one by one, and the carrier 4 is arranged in the cavity.
  • the driving mechanism 5 is connected with the carrier 4 in a driving manner, so as to drive the carrier 4 to disengage or contact the cooling boss 6 .
  • the carrier 4 in the vacuum eutectic furnace of the present application can be detached from or contacted with the cooling boss 6.
  • the carrier 4 is lifted and separated from the cooling boss 6, and the heating is rapid and will not be affected by the cooling pipe, so that the heating is uniform. If rapid cooling is required after heating, the carrier 4 is lowered to fit with the cooling boss 6, and the cooling speed is fast.
  • the heating device 3 and the cooling boss 6 are arranged at intervals one by one, so that the heating or cooling can be performed quickly and uniformly during heating or cooling.
  • the cooling bosses 6 are elongated, and the cooling bosses 6 are arranged in parallel in sequence; an accommodation groove for accommodating the heating device 3 is formed between two adjacent cooling bosses 6 .
  • the cooling boss 6 is elongated so that the cooling area is larger.
  • the upper edge of the cooling boss 6 is higher than the upper edge of the heating device 3 .
  • the stage 4 When the stage 4 is lowered, it can fully contact the cooling boss 6 and does not contact the heating device 3, and the cooling speed is faster.
  • the driving mechanism 5 includes a cam 51 provided on the lower casing 1, the cam 51 abuts on the carrier 4, and the cam 51 rotates to drive the carrier 4 to disengage or Contact the cooling boss 6 .
  • the cam 51 to drive the stage 4, the structure is simple, the lifting position is fixed, and the work is stable.
  • the drive mechanism 5 includes a power shaft 52 and cams 51 disposed on both sides of the cooling boss 6 , each cooling boss 6 is provided with an escape groove/hole 61 , and the power shaft 52
  • the cam 51 is connected to the power shaft 52 , and the power shaft 52 rotates to drive the cam 51 to rotate.
  • the cooling medium channel 62 is perpendicular to the avoidance groove/hole 61 , and the cooling medium channel 62 is located higher than the avoidance groove/hole 61 .
  • the cooling medium channel 62 is located high and close to the carrier 4, and the cooling effect is good.
  • the lower casing 1 is provided with a guide column 11 , and the carrier 4 is slidably connected to the guide column 11 .
  • the guide posts 11 maintain the stability of the stage 4 .
  • four guide columns 11 are provided, and the four guide columns 11 are respectively arranged on the four corners of the lower casing 1 , which does not affect the setting of other internal structures, and has the best effect of maintaining stability.
  • an elastic member is installed on the guide column 11 , and one end of the elastic member elastically abuts on the carrier 4 . Further, the other end of the elastic member abuts on the upper casing 2 , so that when the cam 51 drives the carrier 4 to descend, the spring provides a downward force to the carrier 4 , so that the carrier 4 can fully contact the cooling boss 6 .
  • the drive mechanism 5 includes a drive motor 53 , a through hole 12 is provided on the side wall of the lower casing 1 , the power shaft 52 is disposed through the through hole 12 , and the power shaft 52 is connected to the through hole 12 .
  • the through holes 12 are connected by a dynamic seal 7 ; one end of the power shaft 52 protruding from the lower casing 1 is connected to the drive motor 53 in a driving manner. The seal ensures the tightness in the vacuum eutectic furnace cavity.
  • the base is provided with a support base 8 adapted to the cam 51 , and the cam 51 is rotatably connected to the support base 8 .
  • the support seat 8 provides support for the cam 51 to prevent the power shaft 52 from being overstressed and affecting the stability.
  • the driving motor 53 is connected with a driving wheel 54
  • the power shaft 52 is connected with a driven wheel 55
  • the driving wheel 54 and the driven wheel 55 are connected by a transmission belt 56 .
  • the structure is simple, and the maintenance and repair are convenient.
  • the upper casing 2 is provided with a plurality of upper heating devices 9 evenly arranged.
  • the upper heating device 9 and the heating device 3 are a plurality of tubular heating bodies arranged evenly.
  • the heating body of the upper heating device 9 and the heating device The heating bodies of the device 3 are distributed vertically. This way the heating is more uniform.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Furnace Details (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

一种用于芯片焊接的快速冷却的真空共晶炉，包括下壳体（1）、上壳体（2）、多个加热装置（3）、载台（4）和驱动机构（5）。下壳体上设置有多个冷却凸台，冷却凸台内设置有冷却介质通道（62）。上壳体和下壳体相连接，上壳体和下壳体之间形成空腔。加热装置和冷却凸台逐一间隔设置，载台设置在空腔内。驱动机构和载台传动连接，以驱动载台脱离或接触冷却凸台。真空共晶炉中的载台可脱离或接触冷却凸台，加热时载台升起脱离冷却凸台，加热迅速，且不会受冷却管道的影响，使得受热均匀。加热后需要快速进行冷却，就将载台下降与冷却凸台贴合，降温速度快。

Description

一种用于芯片焊接的快速冷却的真空共晶炉 技术领域
本实用新型涉及芯片焊接技术领域，具体的说，涉及一种用于芯片焊接的快速冷却的真空共晶炉。
背景技术
真空共晶设备冷却使用过程中其一，升温的速度与温度均匀性，二降温速度。为保证这两个指标，各个设备厂家采用各种方式方法对设备进行升级，效果均不十分理想，尤其是冷却速度。
现在主流的冷却方式有三种，第一种是气冷，现在大多数设备的冷却采用气冷，即在冷却阶段，向设备内部充入惰性保护气体，通过气体热交换实现给焊接工件进行冷却的目的，但气体本身成本较高，而且气体本身比热容较小，可带走的热量较小，要想达到理想的温度，需要较长时间，影响生产效率。对于有些对冷却速度要求较高的工艺，气冷方式很难满足。
第二种是水冷结构，目前水冷结构主要有两种方式：其一，金属载台铸造或加工，将冷却管路直接设置在载台内部，缺点，加工成本高，整个载台热储能较高，冷却需要较长时间，同时要保证升温速度，需要较大功率的加热器，能源消耗较大。其二，非金属载台底部设置冷却水管，冷却速度有所提升，但长时间使用，冷却管变形，与载台接触不良，冷却速度明显下降。第三种气冷和水冷结构共存，冷却速度有所改善，但上述两个缺点或不足无法避免。
有鉴于此，特提出本实用新型。
实用新型内容
本实用新型提供一种用于芯片焊接的快速冷却的真空共晶炉，升温和降温速率快，可靠性高。
为了实现上述实用新型目的，本实用新型提供了以下技术方案：
一种用于芯片焊接的快速冷却的真空共晶炉，包括：
下壳体，所述下壳体上设置有多个冷却凸台，所述冷却凸台内设置有冷却介质通道；
上壳体，所述上壳体和所述下壳体相连接，所述上壳体和所述下壳体之间形成空腔；
多个加热装置，所述加热装置和所述冷却凸台逐一间隔设置；
载台，所述载台设置在所述空腔内；
驱动机构，所述驱动机构和所述载台传动连接，以驱动所述载台脱离或接触所述冷却凸台。
可选的，所述冷却凸台为长条状，各所述冷却凸台依次平行设置；相邻两个冷却凸台之间形成容纳所述加热装置的容纳槽。
可选的，所述冷却凸台的上沿高于所述加热装置的上沿。
可选的，所述驱动机构包括设置在所述下壳体上的凸轮，所述凸轮抵顶在所述载台上，所述凸轮转动驱动所述载台脱离或接触所述冷却凸台。
可选的，所述驱动机构包括动力轴和设置在所述冷却凸台两侧的凸轮，各所述冷却凸台上均设置有避让槽/孔，所述动力轴贯穿各所述避让槽/孔设置，所述凸轮连接在所述动力轴上，所述动力轴转动带动所述凸轮转动。
可选的，所述冷却介质通道和所述避让槽/孔相垂直，所述冷却介质通道位置高于所述避让槽/孔。
可选的，所述下壳体上设置有导向柱，所述载台可滑动地连接在所述导向柱上。
可选的，所述导向柱上安装有弹性部件，所述弹性部件的一端弹性抵顶在所述载台上。
可选的，所述驱动机构包括驱动电机，所述下壳体的侧壁上设置有通孔，所述动力轴贯穿所述通孔设置，所述动力轴和所述通孔之间通过动密封件连接；所述动力轴伸出所述下壳体的一端和所述驱动电机传动连接。
可选的，所述驱动电机连接有主动轮，所述动力轴上连接有从动轮，所述主动轮和所述从动轮之间通过传动带连接。
通过采用上述技术方案，使得本实用新型具有以下有益效果：
本申请的真空共晶炉中的载台可脱离或接触冷却凸台，加热时载台升起脱离冷却凸台，加热迅速，且不会受冷却管道的影响，使得受热均匀。加热后需要快速进行冷却，就将载台下降与冷却凸台贴合，降温速度快。
下面结合附图对本实用新型的具体实施方式作进一步详细的描述。
附图说明
附图作为本申请的一部分，用来提供对本实用新型的进一步的理解，本实用新型的示意性实施例及其说明用于解释本实用新型，但不构成对本实用新型的不当限定。显然，下面描述中的附图仅仅是一些实施例，对于本领域普通技术人员来说，在不付出创造性劳动的前提下，还可以根据这些附图获得其他附图。在附图中：
图1是本实用新型提供的用于芯片焊接的快速冷却的真空共晶炉去除上壳体和载台后的立体结构示意图；
图2是本实用新型提供的用于芯片焊接的快速冷却的真空共晶炉去除上壳体后的立体结构示意图；
图3是加热时图2的剖视图；
图4是冷却时图2的剖视图；
图5是本实用新型提供的芯片焊接的快速冷却的真空共晶炉冷却介质通道与避让槽/孔之间的配合图。
图中，下壳体1、导向柱11、通孔12、上壳体2、加热装置3、载台4、驱动机构5、凸轮51、动力轴52、驱动电机53、主动轮54、从动轮55、传动带56、冷却凸台6、避让槽/孔61、冷却介质通道62、动密封件7、支撑座8、上加热装置9。
需要说明的是，这些附图和文字描述并不旨在以任何方式限制本实用新型的构思范围，而是通过参考特定实施例为本领域技术人员说明本实用新型的概念。
具体实施方式
为使本实用新型实施例的目的、技术方案和优点更加清楚，下面将结合本实用新型实施例中的附图，对实施例中的技术方案进行清楚、完整地描述，以下实施例用于说明本实用新型，但不用来限制本实用新型的范围。
在本实用新型的描述中，需要说明的是，术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本实用新型和简化描述，而不是指示或暗示所指的装置或组件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本实用新型的限制。
在本实用新型的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本实用新型中的具体含义。
参见图1至图5所示，本申请实施例提供一种用于芯片焊接的快速冷却的真空共晶炉，包括下壳体1、上壳体2、多个加热装置3、载台4和驱动机构5。所述下壳体1上设置有多个冷却凸台6，所述冷却凸台6内设置有冷却介质通道62。所述上壳体2和所述下壳体1相连接，所述上壳体2和所述下壳体1之间形成空腔。所述加热装置3和所述冷却凸台6逐一间隔设置，所述载台4设置在所述空腔内。所述驱动机构5和所述载台4传动连接，以驱动所述载台4脱离或接触所述冷却凸台6。本申请的真空共晶炉中的载台4可脱离或接触冷却凸台6，加热时载台4升起脱离冷却凸台6，加热迅速，且不会受冷却管道的影响，使得受热均匀。加热后需要快速进行冷却，就将载台4下降与冷却凸台6贴合，降温速度快。加热装置3和冷却凸台6逐一间隔设置使得加热或冷却时均加热或冷却的快速又均匀。
可选的，所述冷却凸台6为长条状，各所述冷却凸台6依次平行设置；相邻两个冷却凸台6之间形成容纳所述加热装置3的容纳槽。冷却凸台6呈长条状使其可冷却的面积更大。
可选的，所述冷却凸台6的上沿高于所述加热装置3的上沿。载台4时下降可充分与冷却凸台6相接触，且不与加热装置3接触，冷却速度更快。
可选的，所述驱动机构5包括设置在所述下壳体1上的凸轮51，所述凸轮51抵顶在所述载台4上，所述凸轮51转动驱动所述载台4脱离或接触所述冷却凸台6。使用凸轮51驱动载台4，结构简单，升降位置固定，工作稳定。
可选的，所述驱动机构5包括动力轴52和设置在所述冷却凸台6两侧的凸轮51，各所述冷却凸台6上均设置有避让槽/孔61，所述动力轴52贯穿各所述避让槽/孔61设置，所述凸轮51连接在所述动力轴52上，所述动力轴52转动带动所述凸轮51转动。
可选的，所述冷却介质通道62和所述避让槽/孔61相垂直，所述冷却介质通道62位置高于所述避让槽/孔61。冷却介质通道62位置高距离载台4距离近，冷却效果好。
可选的，所述下壳体1上设置有导向柱11，所述载台4可滑动地连接在所述导向柱11上。导向柱11保持载台4的稳定性。优选的，设置有四个导向柱11，四个导向柱11分别设置在下壳体1的四角上，不影响内部其他结构的设置，并且保持稳定性的效果最好。
可选的，所述导向柱11上安装有弹性部件，所述弹性部件的一端弹性抵顶在所述载台4上。进一步的，弹性部件的另一端抵顶在上壳体2上，如此凸轮51驱动载台4下降时弹簧提供给载台4向下的力，使载台4可充分与冷却凸台6接触。
可选的，所述驱动机构5包括驱动电机53，所述下壳体1的侧壁上设置有通孔12，所述动力轴52贯穿所述通孔12设置，所述动力轴52和所述通孔12之间通过动密封件7连接；所述动力轴52伸出所述下壳体1的一端和所述驱动电机53传动连接。密封件保证真空共晶炉腔体内的密封性。
进一步的，包括两个动力轴52，两动力轴52分别设置在所述驱动电机53两侧，包括四个凸轮51，每个动力轴52上套设有两个凸轮51，两个凸轮51分别下壳体1内靠近相对的两侧边设置。底座上设置有与凸轮51适配的支撑座8，所述凸轮51可转动的与所述支撑座8连接。支撑座8给凸轮51提供支撑作用，防止动力轴52受到压力过大，影响稳定性。
可选的，所述驱动电机53连接有主动轮54，所述动力轴52上连接有从动轮55，所述主动轮54和所述从动轮55之间通过传动带56连接。通过传动带56连接，结构简单，便于维护和维修。
进一步的，上壳体2和下壳体1之间设置有密封圈。上壳体2内设置均匀设置有若干上加热装置9，所述上加热装置9与所述加热装置3均为均匀排列的若干管状加热体，所述上加热装置9的加热体与所述加热装置3的加热体垂直分布。如此加热更加均匀。
以上所述仅是本实用新型的较佳实施例而已，并非对本实用新型作任何形式上的限制，虽然本实用新型已以较佳实施例揭露如上，然而并非用以限定本实用新型，任何熟悉本专利的技术人员在不脱离本实用新型技术方案范围内，当可利用上述提示的技术内容做出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本实用新型技术方案的内容，依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本实用新型方案的范围内。

Claims (10)

  1. 一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，包括：
    下壳体，所述下壳体上设置有多个冷却凸台，所述冷却凸台内设置有冷却介质通道；
    上壳体，所述上壳体和所述下壳体相连接，所述上壳体和所述下壳体之间形成空腔；
    多个加热装置，所述加热装置和所述冷却凸台逐一间隔设置；
    载台，所述载台设置在所述空腔内；
    驱动机构，所述驱动机构和所述载台传动连接，以驱动所述载台脱离或接触所述冷却凸台。
  2. 根据权利要求1所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述冷却凸台为长条状，各所述冷却凸台依次平行设置；相邻两个冷却凸台之间形成容纳所述加热装置的容纳槽。
  3. 根据权利要求1所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述冷却凸台的上沿高于所述加热装置的上沿。
  4. 根据权利要求1所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述驱动机构包括设置在所述下壳体上的凸轮，所述凸轮抵顶在所述载台上，所述凸轮转动驱动所述载台脱离或接触所述冷却凸台。
  5. 根据权利要求4所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述驱动机构包括动力轴和设置在所述冷却凸台两侧的凸轮，各所述冷却凸台上均设置有避让槽/孔，所述动力轴贯穿各所述避让槽/孔设置，所述凸轮连接在所述动力轴上，所述动力轴转动带动所述凸轮转动。
  6. 根据权利要求5所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述冷却介质通道和所述避让槽/孔相垂直，所述冷却介质通道位置高于所述避让槽/孔。
  7. 根据权利要求1所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述下壳体上设置有导向柱，所述载台可滑动地连接在所述导向柱上。
  8. 根据权利要求7所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述导向柱上安装有弹性部件，所述弹性部件的一端弹性抵顶在所述载台上。
  9. 根据权利要求5所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述驱动机构包括驱动电机，所述下壳体的侧壁上设置有通孔，所述动力轴贯穿所述通孔设置，所述动力轴和所述通孔之间通过动密封件连接；所述动力轴伸出所述下壳体的一 端和所述驱动电机传动连接。
  10. 根据权利要求9所述的一种用于芯片焊接的快速冷却的真空共晶炉，其特征在于，所述驱动电机连接有主动轮，所述动力轴上连接有从动轮，所述主动轮和所述从动轮之间通过传动带连接。
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