WO2022178676A1 - 显示面板及其制造方法、显示装置 - Google Patents

显示面板及其制造方法、显示装置 Download PDF

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Publication number
WO2022178676A1
WO2022178676A1 PCT/CN2021/077504 CN2021077504W WO2022178676A1 WO 2022178676 A1 WO2022178676 A1 WO 2022178676A1 CN 2021077504 W CN2021077504 W CN 2021077504W WO 2022178676 A1 WO2022178676 A1 WO 2022178676A1
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Prior art keywords
organic layer
display area
thickness
base substrate
display panel
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PCT/CN2021/077504
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English (en)
French (fr)
Inventor
石博
于池
周瑞
官慧
龙跃
王本莲
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202180000297.XA priority Critical patent/CN115244703A/zh
Priority to US17/618,005 priority patent/US20230172001A1/en
Priority to PCT/CN2021/077504 priority patent/WO2022178676A1/zh
Publication of WO2022178676A1 publication Critical patent/WO2022178676A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing the same, and a display device.
  • the under-screen camera technology is a brand-new technology proposed to increase the screen-to-body ratio of the display device.
  • the base substrate generally has a first display area and a second display area that can transmit light.
  • the camera in the display device can be arranged in the second display area.
  • the camera needs to be arranged close to the edge of the base substrate, that is, the second display area is located at the edge of the base substrate.
  • the imaging resolution of the camera in the current display device with the under-screen camera is low, and the imaging effect is poor.
  • the present application provides a display panel, a manufacturing method thereof, and a display device.
  • the technical solution is as follows:
  • a display panel comprising:
  • a base substrate having a first display area and a second display area, the first display area at least partially surrounds the second display area, the first display area includes a first sub-display area and a second sub-display area, and the second sub-display area is close to the edge of the base substrate relative to the first sub-display area;
  • a plurality of pixels arranged on the base substrate and located in the first display area and the second display area, respectively, at least two pixels in the plurality of pixels include target electrodes and are respectively arranged in the first display area
  • the display area and the second display area the size of the target electrode located in the second display area is smaller than the size of the target electrode located in the first display area, and/or, the target electrode located in the second display area
  • the density of is less than the density of the target electrode located in the first display area
  • an encapsulation layer disposed on a side of the plurality of pixels away from the base substrate, the encapsulation layer includes a first organic layer, and the first organic layer is located at the maximum thickness of the first part of the second display area The thickness difference from the minimum thickness is smaller than the thickness difference between the maximum thickness and the minimum thickness of the second portion of the first organic layer located in the second sub-display area.
  • the first display area surrounds the second display area;
  • the base substrate at least includes a first side and a second side that are parallel to each other;
  • the distance between the geometric center of the second display area and the first side of the base substrate is smaller than the distance between the geometric center of the second display area and the second side of the base substrate.
  • the base substrate is a rectangle, and both the first side and the second side are short sides of the rectangle.
  • the thickness of the first organic layer gradually decreases; and the average thickness of the first part of the first organic layer is greater than the thickness of the first organic layer. The average thickness of the two parts.
  • the thickness difference between the maximum thickness and the minimum thickness of the second portion of the first organic layer is smaller than a first difference threshold.
  • the thickness difference between the maximum thickness and the minimum thickness of the first portion of the first organic layer is smaller than a second difference threshold.
  • the display panel further includes: a second organic layer located on a side of the base substrate away from the plurality of pixels;
  • the thickness variation of the first organic layer and the thickness variation of the second organic layer are both smaller than the variation threshold.
  • the thickness variation of the first organic layer is the same as the thickness variation of the second organic layer.
  • the difference between the thickness of the first organic layer and the thickness of the second organic layer is less than or equal to a third difference threshold
  • the target cross section is a cross section of the display panel in a target direction, and the target direction is perpendicular to the arrangement direction of the first display area and the second display area.
  • the thickness of the first organic layer is the same as the thickness of the second organic layer.
  • the materials of the first organic layer and the second organic layer are both polymethyl methacrylate.
  • the encapsulation layer further includes: a first inorganic layer located between the plurality of pixels and the first organic layer.
  • the display panel further includes: a second inorganic layer located between the second organic layer and the base substrate.
  • the encapsulation layer further includes: a third inorganic layer located on a side of the first organic layer away from the plurality of pixels.
  • the display panel further includes: a fourth inorganic layer located on a side of the second organic layer away from the base substrate.
  • the thickness difference between the maximum thickness and the minimum thickness of the first inorganic layer included in the display panel and the thickness difference between the maximum thickness and the minimum thickness of the second inorganic layer are both within the first difference range;
  • the thickness difference between the maximum thickness and the minimum thickness of the third inorganic layer included in the display panel and the thickness difference between the maximum thickness and the minimum thickness of the fourth inorganic layer are both within the second difference range.
  • the material of the inorganic layer included in the display panel includes at least one of silicon oxide, silicon nitride and silicon oxynitride.
  • the target electrode is an anode.
  • a method for manufacturing a display panel comprising:
  • a base substrate is provided, the base substrate has a first display area and a second display area, the first display area at least partially surrounds the second display area, the first display area includes a first sub-display area and a second sub-display area, and the second sub-display area is close to the edge of the base substrate relative to the first sub-display area;
  • a plurality of pixels are formed on one side of the base substrate, the plurality of pixels are respectively disposed in the first display area and the second display area, and at least two of the plurality of pixels include target electrodes, and are respectively arranged in the first display area and the second display area, the size of the target electrode located in the second display area is smaller than the size of the target electrode located in the first display area, and/or, the size of the target electrode located in the The density of the target electrodes in the second display area is smaller than the density of the target electrodes in the first display area;
  • An encapsulation layer is formed on a side of the plurality of pixels away from the base substrate, the encapsulation layer includes a first organic layer, and the maximum thickness of the first portion of the first organic layer located in the second display area is equal to The thickness difference of the minimum thickness is smaller than the thickness difference between the maximum thickness and the minimum thickness of the second portion of the first organic layer located in the second sub-display area.
  • forming the first organic layer on the side of the plurality of pixels away from the base substrate includes:
  • target curing treatment is performed on the first organic layer material to form the first organic layer.
  • performing targeted curing treatment on the first organic layer material to form the first organic layer includes:
  • Target curing treatment is performed on the pre-cured first organic layer material to form the first organic layer.
  • the method further includes:
  • the difference between the thickness variation of the first organic layer and the thickness variation of the second organic layer is smaller than the variation threshold.
  • the forming the second organic layer on the side of the base substrate away from the plurality of pixels includes:
  • a target curing process is performed on the second organic layer material to form a second organic layer
  • the encapsulation layer further includes: a first inorganic layer located between the plurality of pixels and the first organic layer; the method further includes:
  • the forming the second organic layer on the side of the base substrate away from the plurality of pixels includes:
  • a second organic layer is formed on a side of the second inorganic layer away from the base substrate.
  • the encapsulation layer further includes: a third inorganic layer located on a side of the first organic layer away from the plurality of pixels; the method further includes:
  • a fourth inorganic layer is formed on the side of the second organic layer away from the base substrate.
  • a display device comprising: a photosensitive sensor, and the display panel according to the above aspect, the photosensitive sensor is located in a second display area of the display panel.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of still another display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of still another display panel provided by an embodiment of the present application.
  • FIG. 6 is an imaging schematic diagram of a display panel in the related art
  • FIG. 7 is an imaging schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of still another display panel provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of still another display panel provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of still another display panel provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of still another display panel provided by an embodiment of the present application.
  • FIG. 12 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • FIG. 13 is a flowchart of a method for forming a first organic layer provided by an embodiment of the present application.
  • 15 is a flowchart of another method for forming a first organic layer provided by an embodiment of the present application.
  • FIG. 16 is a process flow diagram of forming a display panel provided by an embodiment of the present application.
  • FIG. 17 is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present application.
  • 19 is another process flow diagram of forming a display panel provided by an embodiment of the present application.
  • FIG. 20 is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present application.
  • 21 is another process flow diagram of forming a display panel provided by an embodiment of the present application.
  • FIG. 22 is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present application.
  • FIG. 23 is a schematic diagram of an optional structure for forming an organic layer provided by an embodiment of the present application.
  • FIG. 24 is another schematic diagram of an optional structure for forming an organic layer provided by an embodiment of the present application.
  • FIG. 25 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • notch or hole screens with bangs cannot meet users' demands for a high screen-to-body ratio. Accordingly, a series of display panels with light-transmitting display areas have emerged as the times require. .
  • hardware structures such as a camera can be directly disposed in the light-transmitting display area, so that a true full-screen display is possible.
  • This type of display panel can also be called an FDC (full display vis camera) display panel.
  • the camera may include a photosensitive sensor.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel may include: a base substrate 00 , and the base substrate 00 may have a first display area A1 and a second display area A2 .
  • the first display area A1 may at least partially surround the second display area A2, the first display area A1 may include a first sub-display area A11 and a second sub-display area A12, and the second sub-display area A12 is opposite to the first sub-display area A12
  • the display area A11 is close to the edge of the base substrate 00 .
  • the base substrate 00 shown is a rectangle
  • the second display area A2 is located at the top middle position of the base substrate 00
  • either side of the second display area A2 is surrounded by the first display area A1 is surrounded, that is, the second display area A2 is surrounded by the first display area A1.
  • the illustrated second sub-display area A12 is closer to the upper border of the base substrate 00 than the first sub-display area A11.
  • the base substrate 00 may also have other shapes.
  • the second display area A2 may not be located at the top middle position of the base substrate 00, but may be located at other positions. As shown in FIG. 1 , the second display area A2 may be located at the upper left corner or the upper right corner of the base substrate 00 .
  • FIG. 2 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present application. It can be seen in conjunction with FIG. 2 and FIG. 3 that the display panel may further include: a plurality of pixels P1 disposed on the base substrate 00 and located in the first display area A1 and the second display area A2 respectively. At least two pixels P1 among the plurality of pixels P1 may include target electrodes P11, and at least two pixels P1 including the target electrodes P11 may be disposed in the first display area A1 and the second display area A2, respectively.
  • FIG. 2 only schematically shows the display panel, and the actual ratio of each area can be referred to FIG. 1 .
  • the size of the target electrode P11 located in the second display area A2 may be smaller than the size of the target electrode P11 located in the first display area A1, and/or the target electrode located in the second display area A2.
  • the density of the electrodes P11 may be smaller than the density of the target electrodes P11 located in the first display area A1. That is, the size and/or density of the target electrodes P11 located in the second display area A2 are different.
  • the density of the target electrodes P11 in each display area may refer to the number of target electrodes P11 included in a unit area.
  • the light transmittance of the second display area A2 may be greater than that of the first display area A1, that is, the second display area A2 described in the embodiments of the present application may be the light-transmitting display areas described in the above embodiments.
  • hardware structures such as a camera may be arranged in the second display area A2.
  • the first display area A1 may also be referred to as a normal display area
  • the second display area A2 may be referred to as a camera display area for both shooting and display functions.
  • the size of the target electrode P11 located in the second display area A2 is smaller than that of the target electrode P11 located in the first display area A1 .
  • the density of the target electrodes P11 located in the second display area A2 is the same as the density of the target electrodes P11 located in the first display area A1. That is, the first display area A1 and the second display area A2 include the same number of target electrodes P11 per inch. Density can also be expressed in terms of resolution (per pixel inch, PPI).
  • the structure shown in FIG. 3 can also be understood as: the light transmittance of the second display area A2 is improved by reducing the size of the target electrode P11 in the second display area A2 without changing the PPI.
  • the density of the target electrodes P11 located in the first display area A1 is greater than the density of the target electrodes P11 located in the second display area A2.
  • the size of the target electrode P11 located in the first display area A1 is the same as the size of the target electrode P11 located in the second display area A2. That is, the light transmittance of the second display area A2 can be improved by reducing the PPI of the second display area A2 without changing the size of the target electrode P11.
  • the density of the target electrodes P11 located in the first display area A1 is greater than the density of the target electrodes P11 located in the second display area A2.
  • the size of the target electrode P11 located in the second display area A2 is smaller than the size of the target electrode P11 located in the first display area A1. That is, the light transmittance of the second display area A2 can be improved by reducing the PPI of the second display area A2 and reducing the size of the target electrode P11 in the second display area A2.
  • the display panel described in the embodiments of the present application may further include: an encapsulation layer 01 disposed on the side of the plurality of pixels P1 away from the base substrate 00 , and the encapsulation layer 01 may be used to The plurality of pixels P1 are isolated from the outside world to avoid water and oxygen intrusion and ensure the service life of the display panel.
  • the encapsulation layer 01 may include at least a first organic layer 011 .
  • the second display area A2 is located at the edge of the base substrate 00 (eg, the upper edge shown in FIG. 2 ), the part of the first organic layer 011 located in the second display area A2 has a relatively steep lower The slope extends towards the edge. That is, the thickness variation of the portion of the first organic layer 011 located in the second display area A2 is relatively large.
  • the thickness of the part of the first organic layer 011 located in the second display area A2 and away from the edge is about 10 micrometers ( ⁇ m) to 14 ⁇ m, and the first organic layer 011 located in the second display area A2 And the thickness of the portion near the edge is about 4 ⁇ m to 7 ⁇ m. That is, the thickness difference between the maximum thickness and the minimum thickness of the part of the first organic layer 011 located in the second display area A2 is about 6 ⁇ m to 7 ⁇ m.
  • the above thickness variation phenomenon of the first organic layer 011 will cause the portion of the first organic layer 011 in the second display area A2 to have a wedge-shaped plate structure with “front and back surfaces are not parallel and have a certain angle”.
  • the wedge-shaped plate structure further causes the light emitted by the camera disposed in the second display area A2 to be refracted and deviated from the main optical axis, and the diffraction light spot is elongated, that is, the central diffraction spot is elliptical.
  • the resolution deviation between the stretching direction (ie, the meridional plane direction) and the sagittal plane direction imaged by the camera is relatively large. In this way, the overall imaging resolution of the camera is poor, that is, the imaging effect is poor.
  • the thickness difference between the maximum thickness and the minimum thickness of the first portion 011A of the first organic layer 011 located in the second display area A2 may be smaller than that of the first organic layer 011 located in the The thickness difference between the maximum thickness and the minimum thickness of the second portion 011B of the two sub-display areas A12. That is, the first portion 011A of the first organic layer 011 has a relatively small degree of steepness (which may also be referred to as a degree of inclination) relative to the second portion 011B, that is, relatively flat.
  • the part of the first organic layer 011 located in the second display area A2 still extends downhill in the direction close to the upper edge, the climbing distance of the first organic layer 011 located in the first part 011A of the second display area A2 slow down.
  • the light emitted by the camera can be effectively prevented from deviating from the main optical axis, so that the central diffraction spot of the light beam emitted by the camera is as circular as possible, and the resolution deviation of the images in the meridional and sagittal directions of the camera is small.
  • the overall imaging resolution of the camera is better.
  • FIG. 6 and FIG. 7 respectively show a schematic diagram of the imaging effect of the display panel of the related art and the schematic diagram of the imaging effect of the display panel provided by the embodiment of the present application, taking the same imaging screen as an example. Comparing FIG. 6 and FIG. 7 , it can be seen that the embodiment of the present application effectively improves the imaging resolution of the display panel, and the imaging effect of the display panel is better.
  • an embodiment of the present application provides a display panel, the display panel includes a base substrate, the base substrate has a first display area and a second display area, and the first display area includes a first sub-display area , and a second sub-display area close to the edge of the base substrate relative to the first sub-display area. And, it includes a plurality of pixels on one side of the base substrate and an encapsulation layer, and the encapsulation layer includes a first organic layer.
  • the thickness difference between the maximum thickness and the minimum thickness of the first part of the first organic layer located in the second display area is smaller than the thickness difference between the maximum thickness and the minimum thickness of the second part of the first organic layer located in the second sub-display area That is, the portion of the first organic layer located in the second display area is relatively flat, thus effectively preventing the focus of light emitted by the camera disposed in the second display area from deviating from the main optical axis due to refraction. In this way, it is ensured that the imaging resolution of the camera is better, and the imaging effect of the display panel is better.
  • the base substrate 00 may be rectangular, that is, the base substrate 00 may include a first side B1 and a second side B2 that are parallel to each other. .
  • the first display area A1 may surround the second display area A2.
  • the distance d1 between the geometric center J of the second display area A2 and the first side B1 of the base substrate 00 may be smaller than the distance d2 between the geometric center J of the second display area A2 and the second side B2 of the base substrate 00 .
  • the base substrate 00 may be a rectangle as shown in FIG. 2 , and both the first side B1 and the second side B2 may be short sides of the rectangle, that is, the first side B1 and the second side B2 may be the width of the rectangle .
  • the second display area A2 may be close to the upper edge of the base substrate 00 .
  • the thickness of the first organic layer 011 may gradually decrease in the direction close to the first side B1 , that is, in the direction close to the upper edge of the base substrate 00 .
  • the average thickness of the first portion 011A of the first organic layer 011 may be greater than the average thickness of the second portion 011B of the first organic layer 011 . That is, along a direction close to the second side B2, the first organic layer 011 may gradually become flat.
  • the thickness difference between the maximum thickness and the minimum thickness of the second portion 011B of the first organic layer 011 may be less than The first difference threshold, which can be greater than or equal to 0. That is, the second portion 011B of the first organic layer 011 located in the second sub-display area A12 (ie, close to the edge) may also be relatively flat, that is, the inclination may be smaller.
  • the thickness difference between the maximum thickness and the minimum thickness of the first portion 011A of the first organic layer 011 may also be smaller than the second difference threshold and also greater than or equal to 0. In this way, it can be ensured that the first portion 011A can also be relatively flat. Further improve the diffraction spot deformation problem and improve the imaging resolution.
  • the first difference threshold may be 2, and the thickness difference between the maximum thickness and the minimum thickness of the second portion 011B of the first organic layer 011 is less than 2, such as may be 1.
  • the second difference threshold may be 1, and the thickness difference between the maximum thickness and the minimum thickness of the second portion 011B of the first organic layer 011 is less than 1, for example, may be 0.
  • the display panel may further include: a second organic layer 02 located on a side of the base substrate 00 away from the plurality of pixels P1.
  • the thickness variation of the first organic layer 011 and the thickness variation of the second organic layer 02 may both be smaller than the variation threshold. That is, the overall flatness of the first organic layer 011 is similar to the overall flatness of the second organic layer 02 .
  • the variation in thickness may refer to: the difference between the thicknesses of the film layer at the first place and the second place, and the difference between the thickness differences between the third place and the fourth place of the film layer.
  • the thickness variation of the first organic layer 011 is shown to be the same as the thickness variation of the second organic layer 02 .
  • the reverse symmetrical climbing feature can be used to eliminate the problem of the light emitted by the camera refracting away from the main optical axis due to the wedge-shaped plate structure of the first organic layer 011 in the related art, improve the deformation of the diffraction spot, and improve the imaging resolution. .
  • the difference between the thickness of the first organic layer 011 and the thickness of the second organic layer 02 may be smaller than a third difference threshold and greater than or equal to 0.
  • the target cross section may be an interface of the display panel in a target direction, and the target direction may be perpendicular to the arrangement direction of the first display area A1 and the second display area A2.
  • the target interface may be a section located in the second display area A2.
  • the third difference threshold may be 1, and in the target cross section, the difference between the thickness of the first organic layer 011 and the thickness of the second organic layer 02 may be smaller than the third difference threshold 1, such as may be 0 . That is, as shown in FIG. 9, in the target cross section MM', the thickness h1 of the first organic layer 011 is the same as the thickness of the second organic layer 02h2. In this way, better imaging resolution of the display panel can be further ensured.
  • the materials of the first organic layer 011 and the second organic layer 02 may be the same.
  • they can both be polymethyl methacrylate, that is, the first organic layer 011 and the second organic layer 02 can both be made of acrylic.
  • both the first organic layer 011 and the second organic layer 02 may be formed by an inkjet-printed (IJP) technology.
  • both the first organic layer 011 and the second organic layer 02 may be referred to as IJP layers.
  • the encapsulation layer 01 described in the embodiments of the present application may further include: a first inorganic layer 012 located between the plurality of pixels P1 and the first organic layer 011 .
  • the display panel may further include: a second inorganic layer 03 located between the second organic layer 02 and the base substrate 00 .
  • both the first organic layer 011 and the second organic layer 02 are attached to the inorganic layer, it can ensure that the first organic layer 011 and the second organic layer 02 have similar surface tensions, which is more conducive to the formation of the first organic layer 011 and the second organic layer 02.
  • the two organic layers 02 have relatively similar climbing gradients. That is, in the target cross section MM', the thickness of the first organic layer 011 and the thickness of the second organic layer 02 may be the same as possible.
  • it can further ensure that the imaging resolution of the display panel is better.
  • the encapsulation layer 01 described in the embodiments of the present application may further include: a third inorganic layer 013 located on the side of the first organic layer 011 away from the plurality of pixels P1.
  • the display panel may further include: a fourth inorganic layer 04 located on a side of the second organic layer 02 away from the base substrate 00 .
  • the thickness difference between the maximum thickness and the minimum thickness of the first inorganic layer 012 and the thickness difference between the maximum thickness and the minimum thickness of the second inorganic layer 03 may both be located in the first difference. value range. That is, the thicknesses of the first inorganic layer 012 and the second inorganic layer 03 may be similar, eg, may be the same. And/or, the thickness difference between the maximum thickness and the minimum thickness of the third inorganic layer 013 and the thickness difference between the maximum thickness and the minimum thickness of the fourth inorganic layer 04 may both be within the second difference range. That is, the thicknesses of the third inorganic layer 013 and the fourth inorganic layer 04 may be similar, eg, may be the same. In this way, it is further advantageous that the formed first organic layer 011 and the second organic layer 02 have relatively similar climbing gradients.
  • each inorganic layer included in the display panel may be the same or different.
  • at least one of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiNO) may be included.
  • each inorganic layer can be formed by chemical vapor deposition (chemical vapor deposition, CVD).
  • CVD chemical vapor deposition
  • each inorganic layer may be referred to as a CVD layer.
  • the first inorganic layer 012 and the second inorganic layer 03 may be referred to as CVD1
  • the third inorganic layer 013 and the fourth inorganic layer 04 may be referred to as CVD2.
  • the pixel P1 may further include a pixel circuit P12.
  • a pixel circuit P12 is identified by a hierarchical structure G+SD composed of poles (source & drain, SD).
  • the pixel circuit P12 may be connected to the target electrode P11 included in the pixel P1 (the connection relationship is not shown in the figure).
  • the pixel circuit P12 can be used to provide a driving signal to the target electrode P12, so that a potential difference is formed between the target electrode P12 and another electrode included in the pixel P1, and the pixel P1 emits light.
  • the target electrode P11 may be an anode.
  • the other electrode described in the above embodiment may be a cathode.
  • the target electrode 20 may also be a cathode, and correspondingly, the other electrode described in the above embodiment may be an anode.
  • the pixel circuits P12 included in each pixel P1 in the second display area A2 may be externally placed in the first display area A1 . In this way, it can be further ensured that the light transmittance of the second display area A2 is better.
  • the pixel circuits P12 included in each pixel P1 in the second display area A2 may also be built in the second display area A2. This embodiment of the present application does not limit this.
  • the display panel may further include: between the pixel circuit P12 and the target electrode P11 and stacked in sequence along the direction away from the base substrate 00 .
  • PDL planarization layer
  • an embodiment of the present application provides a display panel, the display panel includes a base substrate, the base substrate has a first display area and a second display area, and the first display area includes a first sub-display area , and a second sub-display area close to the edge of the base substrate relative to the first sub-display area. And, it includes a plurality of pixels on one side of the base substrate and an encapsulation layer, and the encapsulation layer includes a first organic layer.
  • the thickness difference between the maximum thickness and the minimum thickness of the first part of the first organic layer located in the second display area is smaller than the thickness difference between the maximum thickness and the minimum thickness of the second part of the first organic layer located in the second sub-display area That is, the portion of the first organic layer located in the second display area is relatively flat, thus effectively preventing the focus of light emitted by the camera disposed in the second display area from deviating from the main optical axis due to refraction. In this way, it is ensured that the imaging resolution of the camera is better, and the imaging effect of the display panel is better.
  • FIG. 12 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application, which can be used to manufacture the display panel described in the above-mentioned embodiment of the present application. As shown in Figure 12, the method may include:
  • Step 1201 providing a base substrate.
  • the base substrate 00 may have a first display area A1 and a second display area A2, the first display area A1 at least partially surrounds the second display area A2, and the first display area A1 includes a first sub-area The display area A11 and the second sub-display area A12, and the second sub-display area A12 is closer to the edge of the base substrate 00 than the first sub-display area A11.
  • the material of the base substrate 00 may be a flexible material, such as polyimide (polyimide, PI).
  • the base substrate 00 may also be referred to as a PI substrate.
  • Step 1202 forming a plurality of pixels on one side of the base substrate.
  • a plurality of pixels P1 may be disposed in the first display area A1 and the second display area A2 respectively. At least two pixels P1 may include target electrodes P11, and may be disposed in the first display area A1 and the second display area A2, respectively.
  • the size of the target electrode P11 in the second display area A2 may be smaller than the size of the target electrode P11 in the first display area A1, and/or the density of the target electrode P11 in the second display area A2 may be smaller than that in the first display area A2.
  • Step 1203 forming an encapsulation layer on the side of the plurality of pixels away from the base substrate.
  • the encapsulation layer 01 may include a first organic layer 011, and the first organic layer 011 is located at the thickness difference between the maximum thickness and the minimum thickness of the first portion 011A of the second display area A2 The value may be smaller than the thickness difference between the maximum thickness and the minimum thickness of the second portion 011B of the first organic layer 011 located in the second sub-display area A12.
  • the embodiments of the present application provide a method for manufacturing a display panel.
  • the first organic layer is located in a relatively flat first portion of the second display area with a large transmittance, so it is effective. It is avoided that the focus of the light emitted by the camera disposed in the second display area deviates from the main optical axis due to refraction. In this way, it is ensured that the imaging resolution of the camera is better, and the imaging effect of the display panel is better.
  • FIG. 13 is a flowchart of a method for forming a first organic layer provided by an embodiment of the present application.
  • FIG. 14 shows a process flow diagram of forming the first organic layer (ie, the IJP layer described in the above embodiment) by taking the method shown in FIG. 13 as an example.
  • Step 1301 printing a first organic layer material on the side of the plurality of pixels away from the base substrate.
  • a substrate is used to replace the side of the plurality of pixels away from the base substrate.
  • a material eg, acrylic
  • an organic layer may be printed on the substrate by a printing device beforehand.
  • Step 1302 After the material of the first organic layer is planarized, a target curing process is performed on the material of the first organic layer to form a first organic layer.
  • the first organic layer material After the first organic layer material is obtained by printing, referring to FIG. 14 , the first organic layer material will gradually extend to both sides under the action of surface tension, that is, gradually flatten.
  • the first organic layer material can be subjected to targeted curing treatment to form the first organic layer.
  • the target curing treatment may be the photo curing treatment shown in FIG. 14 . That is, the first organic layer can be obtained by irradiating the planarized first organic layer material with a light source.
  • step 1302 may include:
  • Step 13021 providing a mask with through holes.
  • the through hole K1 of the mask M1 may be located in the second sub-display area A12.
  • Step 13022 pre-curing the material of the first organic layer by using a mask.
  • the pre-curing treatment can also be a photo-curing treatment.
  • a light source may be used to irradiate in advance from the position of the through hole K1 of the mask M1 to pre-cur the first organic material in the region. This process may also be referred to as pre-exposure of the first organic layer material.
  • Step 13023 Perform target curing treatment on the pre-cured first organic layer material to form a first organic layer.
  • the mask M1 is removed again, and the pre-cured first organic layer material is irradiated with a light source to obtain a first organic layer.
  • the second portion 011B of the first organic layer 011 located in the second sub-display area A12 can be made relatively flat, that is, the display panel shown in FIG. 8 is obtained.
  • the method may further include:
  • Step 1204 forming a second organic layer on the side of the base substrate away from the plurality of pixels.
  • the thickness variation of the first organic layer and the thickness variation of the second organic layer may both be smaller than the variation threshold.
  • the method shown in FIG. 18 may be used to form the second organic layer. That is, the above step 1204 may include:
  • Step 12041 printing the second organic layer material on the side of the base substrate away from the plurality of pixels.
  • Step 12042 After the second organic layer material is planarized, a target curing process is performed on the second organic layer material to form a second organic layer.
  • FIG. 19 shows an overall process flow chart of forming the second organic layer.
  • a carrier substrate 09 is generally provided for carrying each layer structure, and the side of the base substrate 00 away from the carrier substrate 09 further includes a glass substrate 10 .
  • a lift-off technique such as a laser lift off (LLO) technique, may be used to lift off the glass substrate 10 to expose the base substrate 00 .
  • LLO laser lift off
  • the second organic layer material for forming the second organic layer 02 may be printed on the exposed base substrate 00 through the first step shown in FIG. 14 .
  • the other two steps shown in FIG. 14 can be used to process the printed material, so as to obtain the second organic layer 02 on the side of the base substrate 00.
  • This method provides another method for manufacturing a display panel with improved imaging resolution provided by the embodiments of the present application.
  • the encapsulation layer 01 may further include: a first inorganic layer 012 located between the plurality of pixels P1 and the first organic layer 011 .
  • the display panel may further include a second inorganic layer 03 located between the base substrate 00 and the second organic layer 02 . That is, referring to the flowchart of another method for manufacturing a display panel shown in FIG. 20 , the method may further include:
  • Step 1205 using a deposition process to form a second inorganic layer on the side of the base substrate away from the plurality of pixels.
  • step 1204 may be: forming a second organic layer on the side of the second inorganic layer away from the base substrate.
  • FIG. 21 shows a process flow diagram of forming the second inorganic layer. Compared with the process flow shown in FIG. 19 , this process flow only adds a new step between the first step and the second step: firstly, a second inorganic layer 02 is deposited on the base substrate 00 by using the CVD method.
  • the encapsulation layer 01 may further include: a third inorganic layer 013 located on the side of the first organic layer 011 away from the plurality of pixels.
  • the display panel may further include a fourth inorganic layer 04 located on the side of the second organic layer 02 away from the base substrate 00 . That is, referring to the flowchart of another method for manufacturing a display panel shown in FIG. 22 , the method may further include:
  • Step 1206 using a deposition process to form a fourth inorganic layer on the side of the second organic layer away from the base substrate.
  • the side of the encapsulation layer 01 away from the base substrate 00 further includes: an encapsulation film layer 11 .
  • the printing cut-off position can affect the climbing starting point of the first organic layer 011 .
  • the printing amount may affect the thickness of the first organic layer 011 .
  • FIG. 23 shows the climbing starting point of the first organic layer 011 corresponding to different print cutoff positions.
  • FIG. 24 shows the thickness of the first organic layer 011 corresponding to different printing volumes. Referring to FIG. 23 , it can be seen that the closer the printing cut-off position is to the edge of the substrate, the closer the climbing starting point of the first organic layer 011 is to the edge. Referring to FIG. 24 , it can be seen that the greater the printing volume, the greater the thickness of the first organic layer 011 , that is, the thicker the first organic layer 011 . In this way, the thickness and position of the first organic layer 011 can also be improved by adjusting the print cut-off position and the print volume.
  • the embodiments of the present application provide a method for manufacturing a display panel.
  • the first organic layer is located in a relatively flat first portion of the second display area with a large transmittance, so it is effective. It is avoided that the focus of the light emitted by the camera disposed in the second display area deviates from the main optical axis due to refraction. In this way, it is ensured that the imaging resolution of the camera is better, and the imaging effect of the display panel is better.
  • FIG. 25 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the display device may include: a photosensitive sensor Y0, and the display panel described in the above-mentioned embodiment.
  • the photosensitive sensor Y0 may be located in the second display area A2 of the display panel, and the photosensitive sensor Y0 may be used to realize the function of photographing and imaging.
  • the display device can be: an organic light-emitting diode (organic light-emitting diode, OLED) display device, a liquid crystal display device, an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED) display device, Any product or component with display function, such as mobile phone, tablet computer, flexible display device, TV and monitor.
  • OLED organic light-emitting diode
  • AMOLED active-matrix organic light-emitting diode

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Abstract

提供了一种显示面板及其制造方法、显示装置，涉及显示技术领域。其中，该显示面板包括具有第一显示区和第二显示区的衬底基板，以及沿远离衬底基板一侧依次排布的多个像素和封装层，该封装层包括第一有机层，且该第二显示区的透光率较大。第二显示区包括第一子显示区，以及相对于第一子显示区靠近衬底基板边缘的第二子显示区。由于该第一有机层位于第二显示区的第一部分的最大厚度与最小厚度的差值，小于位于第二子显示区的第二部分的最大厚度与最小厚度的差值，因此有效避免了设置于第二显示区内的摄像头发出光线的焦点因折射而偏离主光轴。如此，即确保了摄像头的成像解析度较好，显示面板的成像效果较好。

Description

显示面板及其制造方法、显示装置 技术领域
本申请涉及显示技术领域，特别涉及一种显示面板及其制造方法、显示装置。
背景技术
屏下摄像头技术是为了提高显示装置的屏占比所提出的一种全新的技术。
目前，具有屏下摄像头的显示装置所包括的显示面板中，衬底基板一般具有第一显示区和可透光的第二显示区。该显示装置中的摄像头可以设置于第二显示区内。并且，为确保显示面板的有效显示，该摄像头需要靠近衬底基板的边缘设置，即，第二显示区位于衬底基板的边缘处。
但是，受设置位置的影响，目前具有屏下摄像头的显示装置中摄像头的成像解析度较低，成像效果较差。
发明内容
本申请提供了一种显示面板及其制造方法、显示装置。所述技术方案如下：
一方面，提供了一种显示面板，所述显示面板包括：
衬底基板，具有第一显示区和第二显示区，所述第一显示区至少部分围绕所述第二显示区，所述第一显示区包括第一子显示区和第二子显示区，且所述第二子显示区相对于所述第一子显示区靠近所述衬底基板的边缘；
多个像素，设置在所述衬底基板上分别位于所述第一显示区和所述第二显示区，所述多个像素中至少两个像素包括目标电极，且分别设置于所述第一显示区和所述第二显示区，位于所述第二显示区的目标电极的尺寸小于位于所述第一显示区的目标电极的尺寸，和/或，位于所述第二显示区的目标电极的密度小于位于所述第一显示区的目标电极的密度；
封装层，设置在所述多个像素远离所述衬底基板的一侧，所述封装层包括第一有机层，且所述第一有机层位于所述第二显示区的第一部分的最大厚度与 最小厚度的厚度差值，小于所述第一有机层位于所述第二子显示区的第二部分的最大厚度与最小厚度的厚度差值。
可选的，所述第一显示区围绕所述第二显示区；所述衬底基板至少包括相互平行的第一边和第二边；
并且，所述第二显示区的几何中心与所述衬底基板的第一边的距离，小于所述第二显示区的几何中心与所述衬底基板的第二边的距离。
可选的，所述衬底基板为长方形，所述第一边和所述第二边均为所述长方形的短边。
可选的，沿靠近所述第一边的方向，所述第一有机层的厚度逐渐变小；并且，所述第一有机层的第一部分的平均厚度，大于所述第一有机层的第二部分的平均厚度。
可选的，所述第一有机层的第二部分的最大厚度与最小厚度的厚度差值小于第一差值阈值。
可选的，所述第一有机层的第一部分的最大厚度与最小厚度的厚度差值小于第二差值阈值。
可选的，所述显示面板还包括：位于所述衬底基板远离所述多个像素一侧的第二有机层；
其中，所述第一有机层的厚度变化量与所述第二有机层的厚度变化量均小于变化量阈值。
可选的，所述第一有机层的厚度变化量与所述第二有机层的厚度变化量相同。
可选的，在至少一个目标截面中，所述第一有机层的厚度与所述第二有机层的厚度的差值小于等于第三差值阈值；
其中，所述目标截面为所述显示面板在目标方向上的截面，且所述目标方向垂直于所述第一显示区和所述第二显示区的排布方向。
可选的，在所述至少一个目标截面中，所述第一有机层的厚度与所述第二有机层的厚度相同。
可选的，所述第一有机层和所述第二有机层的材料均为聚甲基丙烯酸甲酯。
可选的，所述封装层还包括：位于所述多个像素与所述第一有机层之间的第一无机层。
可选的，所述显示面板还包括：位于所述第二有机层与所述衬底基板之间的第二无机层。
可选的，所述封装层还包括：位于所述第一有机层远离所述多个像素一侧的第三无机层。
可选的，所述显示面板还包括：位于所述第二有机层远离所述衬底基板一侧的第四无机层。
可选的，所述显示面板包括的第一无机层的最大厚度与最小厚度的厚度差值，和第二无机层的最大厚度与最小厚度的厚度差值，均位于第一差值范围内；
和/或，
所述显示面板包括的第三无机层的最大厚度与最小厚度的厚度差值，和，第四无机层的最大厚度与最小厚度的厚度差值，均位于第二差值范围内。
可选的，所述显示面板包括的无机层的材料包括：氧化硅、氮化硅和氮氧化硅中的至少一种。
可选的，所述目标电极为阳极。
另一方面，提供了一种显示面板的制造方法，所述方法包括：
提供衬底基板，所述衬底基板具有第一显示区和第二显示区，所述第一显示区至少部分围绕所述第二显示区，所述第一显示区包括第一子显示区和第二子显示区，且所述第二子显示区相对于所述第一子显示区靠近所述衬底基板的边缘；
在所述衬底基板的一侧形成多个像素，所述多个像素分别设置于所述第一显示区和所述第二显示区，所述多个像素中至少两个像素包括目标电极，且分别设置于所述第一显示区和所述第二显示区，位于所述第二显示区的目标电极的尺寸小于位于所述第一显示区的目标电极的尺寸，和/或，位于所述第二显示区的目标电极的密度小于位于所述第一显示区的目标电极的密度；
在所述多个像素远离所述衬底基板的一侧形成封装层，所述封装层包括第一有机层，且所述第一有机层位于所述第二显示区的第一部分的最大厚度与最小厚度的厚度差值，小于所述第一有机层位于所述第二子显示区的第二部分的最大厚度与最小厚度的厚度差值。
可选的，在所述多个像素远离所述衬底基板的一侧形成所述第一有机层，包括：
在所述多个像素远离所述衬底基板的一侧打印第一有机层材料；
在所述第一有机层材料平坦化后，对所述第一有机层材料进行目标固化处理，形成所述第一有机层。
可选的，所述对所述第一有机层材料进行目标固化处理，形成所述第一有机层，包括：
提供具有通孔的掩膜版，所述通孔位于所述第二子显示区；
采用所述掩膜版对所述第一有机层材料进行预固化处理；
对预固化处理后的第一有机层材料进行目标固化处理，形成所述第一有机层。
可选的，所述方法还包括：
在所述衬底基板远离所述多个像素的一侧形成第二有机层；
其中，所述第一有机层的厚度变化量与所述第二有机层的厚度变化量的差值小于变化量阈值。
可选的，所述在所述衬底基板远离所述多个像素的一侧形成第二有机层，包括：
在所述衬底基板远离所述多个像素的一侧打印第二有机层材料；
在所述第二有机层材料平坦化后，对所述第二有机层材料进行目标固化处理，形成第二有机层；
可选的，所述封装层还包括：位于所述多个像素与所述第一有机层之间的第一无机层；所述方法还包括：
采用沉积工艺，在所述衬底基板远离所述多个像素的一侧形成第二无机层；
所述在所述衬底基板远离所述多个像素的一侧形成第二有机层，包括：
在所述第二无机层远离所述衬底基板的一侧形成第二有机层。
可选的，所述封装层还包括：位于所述第一有机层远离所述多个像素一侧的第三无机层；所述方法还包括：
采用沉积工艺，在所述第二有机层远离所述衬底基板一侧形成第四无机层。
又一方面，提供了一种显示装置，所述显示装置包括：感光传感器，以及如上述方面所述的显示面板，所述感光传感器位于所述显示面板的第二显示区内。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种显示面板的结构示意图；
图2是本申请实施例提供的另一种显示面板的结构示意图；
图3是本申请实施例提供的又一种显示面板的结构示意图；
图4是本申请实施例提供的再一种显示面板的结构示意图；
图5是本申请实施例提供的再一种显示面板的结构示意图；
图6是相关技术中的显示面板的成像示意图；
图7是本申请实施例提供的显示面板的成像示意图；
图8是本申请实施例提供的再一种显示面板的结构示意图；
图9是本申请实施例提供的再一种显示面板的结构示意图；
图10是本申请实施例提供的再一种显示面板的结构示意图；
图11是本申请实施例提供的再一种显示面板的结构示意图；
图12是本申请实施例提供的一种显示面板的制造方法流程图；
图13是本申请实施例提供的一种形成第一有机层的方法流程图；
图14是本申请实施例提供的一种形成有机层的工艺流程图；
图15是本申请实施例提供的另一种形成第一有机层的方法流程图；
图16是本申请实施例提供的一种形成显示面板的工艺流程图；
图17是本申请实施例提供的另一种显示面板的制造方法流程图；
图18是本申请实施例提供的一种形成第二有机层的方法流程图；
图19是本申请实施例提供的另一种形成显示面板的工艺流程图；
图20是本申请实施例提供的又一种显示面板的制造方法流程图；
图21是本申请实施例提供的又一种形成显示面板的工艺流程图；
图22是本申请实施例提供的再一种显示面板的制造方法流程图；
图23是本申请实施例提供的一种形成有机层的可选结构示意图；
图24是本申请实施例提供的另一种形成有机层的可选结构示意图；
图25是本申请实施例提供的一种显示装置的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
随着显示技术的发展，具有刘海的异形(notch)屏或打孔(hole)屏均无法满足用户对高屏占比的需求，相应的，一系列具有透光显示区的显示面板应运而生。该类显示面板中，摄像头(camera)等硬件结构可以直接设置于透光显示区，如此，使得真全面屏成为可能。该类显示面板也可以称为FDC(full display vis camera)显示面板。可选的，摄像头可以包括感光传感器。
图1是本申请实施例提供的一种显示面板的结构示意图。如图1所示，该显示面板可以包括：衬底基板00，该衬底基板00可以具有第一显示区A1和第二显示区A2。该第一显示区A1可以至少部分围绕第二显示区A2，该第一显示区A1可以包括第一子显示区A11和第二子显示区A12，且第二子显示区A12相对于第一子显示区A11靠近衬底基板00的边缘。
例如，参考图1，其示出的衬底基板00呈矩形，第二显示区A2位于衬底基板00的顶部正中间位置，并且，第二显示区A2的任一侧均被第一显示区A1围绕，即第二显示区A2被第一显示区A1包围。此外，其示出的第二子显示区A12相对于第一子显示区A11更靠近衬底基板00的上边缘(border)。下述实施例均以显示面板为图1所示结构为例进行说明。
当然，在一些实施例中，衬底基板00也可以呈其他形状。该第二显示区A2也可以不位于衬底基板00的顶部正中间位置处，而是位于其他位置。如结合图1，第二显示区A2可以位于衬底基板00的左上角或右上角位置处。
图2是本申请实施例提供的另一种显示面板的结构示意图。图3是本申请实施例提供的又一种显示面板的结构示意图。结合图2和图3可以看出，该显示面板还可以包括：设置于衬底基板00上且分别位于第一显示区A1和第二显示区A2的多个像素P1。该多个像素P1中至少两个像素P1可以包括目标电极P11，且包括目标电极P11的至少两个像素P1可以分别设置于第一显示区A1和第二显示区A2。图2仅是示意性示出显示面板，各区域真实比例可参考图1。
可选的，在本申请实施例中，位于第二显示区A2的目标电极P11的尺寸可以小于位于第一显示区A1的目标电极P11的尺寸，和/或，位于第二显示区A2的目标电极P11的密度可以小于位于第一显示区A1的目标电极P11的密度。即， 位于第二显示区A2的目标电极P11的尺寸和/或密度不同。各显示区中目标电极P11的密度可以是指单位面积内所包括的目标电极P11的数量。如此，可以使得第二显示区A2的透光率大于第一显示区A1的透光率，即本申请实施例记载的第二显示区A2可以为上述实施例记载的透光显示区。相应的，如上述实施例记载，可以将摄像头等硬件结构设置于该第二显示区A2内。进而，在本申请实施例中，还可以将第一显示区A1称为正常(normal)显示区，且将第二显示区A2称为用于兼顾拍摄及显示功能的摄像头(camera)显示区。
例如，参考图3，其示出的显示面板中，位于第二显示区A2的目标电极P11的尺寸小于位于第一显示区A1的目标电极P11的尺寸。且位于第二显示区A2的目标电极P11的密度与位于第一显示区A1的目标电极P11的密度相同。即，第一显示区A1和第二显示区A2每英寸所包括的目标电极P11的数量相同。密度也可以用分辨率(per pixel inch，PPI)表示。相应的，图3所示结构也可以理解为：以在不改变PPI的前提下，通过缩小第二显示区A2中目标电极P11的尺寸，来提高第二显示区A2的透光率。
又例如，参考图4，其示出的显示面板中，位于第一显示区A1的目标电极P11的密度大于位于第二显示区A2的目标电极P11的密度。且位于第一显示区A1的目标电极P11的尺寸与位于第二显示区A2的目标电极P11的尺寸相同。即，可以在不改变目标电极P11的尺寸的前提下，通过降低第二显示区A2的PPI，来提高第二显示区A2的透光率。
再例如，参考图5，其示出的显示面板中，位于第一显示区A1的目标电极P11的密度大于位于第二显示区A2的目标电极P11的密度。且位于第二显示区A2的目标电极P11的尺寸小于位于第一显示区A1的目标电极P11的尺寸。即，可以通过既降低第二显示区A2的PPI，又缩小第二显示区A2中目标电极P11的尺寸，来提高第二显示区A2的透光率。
可选的，继续结合图2至图5，本申请实施例记载的显示面板还可以包括：设置在多个像素P1远离衬底基板00一侧的封装层01，该封装层01可以用于将多个像素P1与外界隔绝，避免水氧入侵，确保显示面板使用寿命。可选的，参考图3至图5，该封装层01可以至少包括第一有机层011。
但是，因第二显示区A2位于衬底基板00的边缘(如，图2所示的上边缘)，故导致第一有机层011位于该第二显示区A2内的部分，呈较为陡峭的下坡状向 边缘延伸。即，第一有机层011位于第二显示区A2部分的厚度变化量较大。
经实验测试，目前的显示面板中，第一有机层011位于第二显示区A2且远离边缘的部分的厚度约为10微米(μm)至14μm，而第一有机层011位于第二显示区A2且靠近边缘的部分的厚度约为4μm至7μm。即第一有机层011位于第二显示区A2的部分最大厚度与最小厚度的厚度差值约为6μm至7μm。
此外，经实验测试，以上第一有机层011的厚度变化现象，会导致第一有机层011位于第二显示区A2的部分呈“正反面不平行，且具有一定夹角”的楔形板结构。该楔形板结构进一步导致设置于第二显示区A2内的摄像头发射的光线发生折射且偏离主光轴，衍射光斑被拉长，即中心衍射斑呈椭圆状。相应的，摄像头所成像在拉伸方向(即，子午面方向)和弧矢面方向的解析度偏差较大。如此，摄像头的整体成像解析度较差，即成像效果较差。
继续参考图3至图5，在本申请实施例中，第一有机层011位于第二显示区A2的第一部分011A的最大厚度与最小厚度的厚度差值，可以小于第一有机层011位于第二子显示区A12的第二部分011B的最大厚度与最小厚度的厚度差值。即，第一有机层011的第一部分011A相对于第二部分011B的陡峭程度(也可以称为倾斜程度)较小，即较为平坦。换言之，虽然第一有机层011位于第二显示区A2的部分，依然沿靠近上边缘的方向呈下坡状延伸，但是第一有机层011位于第二显示区A2的第一部分011A的爬坡距离减缓。如此，可以有效避免摄像头发射光线偏离主光轴，使得摄像头发射的光线射束的中心衍射斑尽可能呈圆形，以及使得摄像头所成像在子午面方向和弧矢面方向的解析度偏差较小。进而，摄像头的整体成像解析度即较好。
例如，图6和图7以同一副成像画面为例，分别示出了相关技术显示面板的成像效果示意图，以及本申请实施例提供的显示面板的成像效果示意图。对比图6和图7可以看出，本申请实施例有效改善了显示面板的成像解析度，显示面板的成像效果较好。
综上所述，本申请实施例提供了一种显示面板，该显示面板包括衬底基板，该衬底基板具有第一显示区和第二显示区，该第一显示区包括第一子显示区，以及相对于第一子显示区靠近衬底基板边缘的第二子显示区。以及，包括位于衬底基板一侧的多个像素和封装层，该封装层包括第一有机层。由于该第一有机层位于第二显示区的第一部分的最大厚度与最小厚度的厚度差值，小于该第 一有机层位于第二子显示区的第二部分的最大厚度与最小厚度的厚度差值，即该第一有机层位于第二显示区的部分较为平坦，因此有效避免了设置于第二显示区内的摄像头发出光线的焦点因折射而偏离主光轴。如此，即确保了摄像头的成像解析度较好，显示面板的成像效果较好。
可选的，如图1和图2所示，本申请实施例记载的显示面板中，衬底基板00可以呈矩形，即衬底基板00可以包括相互平行的第一边B1和第二边B2。第一显示区A1可以围绕第二显示区A2。并且，第二显示区A2的几何中心J与衬底基板00的第一边B1的距离d1，可以小于第二显示区A2的几何中心J与衬底基板00的第二边B2的距离d2。
例如，该衬底基板00可以为图2所示的长方形，且第一边B1和第二边B2可以均为该长方形的短边，即第一边B1和第二边B2可以为长方形的宽。相应的，如上述实施例记载，该第二显示区A2可以靠近衬底基板00的上边缘。
此外，结合上述图2至图5所示显示面板可以看出，沿靠近第一边B1的方向，即沿靠近衬底基板00的上边缘的方向，第一有机层011的厚度可以逐渐变小，且第一有机层011的第一部分011A的平均厚度可以大于第一有机层011的第二部分011B的平均厚度。即，沿靠近第二边B2的方向，第一有机层011可以逐渐趋于平坦。
作为一种可选的实现方式，在本申请实施例中，参考图8所示的再一种显示面板，第一有机层011的第二部分011B的最大厚度与最小厚度的厚度差值可以小于第一差值阈值，且可以大于等于0。即，第一有机层011位于第二子显示区A12(即，靠近边缘)的第二部分011B也可以较为平坦，即倾斜程度可以较小。如此，可以进一步消除相关技术中因第一有机层011呈楔形板结构而导致摄像头发射的光线折射偏离主光轴的问题，改善衍射光斑形变问题，提高成像解析度。可选的，在图8所示结构的前提下，第一有机层011的第一部分011A的最大厚度与最小厚度的厚度差值也可以小于第二差值阈值，且同样大于等于0。如此，可以确保第一部分011A也能够较为平坦。进一步改善衍射光斑形变问题，提高成像解析度。
例如，该第一差值阈值可以为2，第一有机层011的第二部分011B的最大厚度与最小厚度的厚度差值小于2，如可以为1。该第二差值阈值可以为1，第 一有机层011的第二部分011B的最大厚度与最小厚度的厚度差值小于1，如可以为0。
作为另一种可选的实现方式，在本申请实施例中，参考图9所示的再一种显示面板。该显示面板还可以包括：位于衬底基板00远离多个像素P1一侧的第二有机层02。并且，该第一有机层011的厚度变化量与该第二有机层02的厚度变化量可以均小于变化量阈值。即，第一有机层011的整体平坦度与第二有机层02的整体平坦度相近。其中，厚度变化量可以是指：膜层在第一处与第二处的厚度差值，以及膜层在第三处与第四处的厚度差值的差值。
例如，参考图9，其示出的第一有机层011的厚度变化量与该第二有机层02的厚度变化量相同。如此，可以利用反向对称的攀爬特性，消除相关技术中因第一有机层011呈楔形板结构而导致摄像头发射的光线折射偏离主光轴的问题，改善衍射光斑形变问题，提高成像解析度。
可选的，在至少一个目标截面中，第一有机层011的厚度与第二有机层02的厚度的差值可以小于第三差值阈值，且大于等于0。其中，该目标截面可以为显示面板在目标方向上的界面，且该目标方向可以垂直于第一显示区A1和第二显示区A2的排布方向。且该目标界面可以为位于第二显示区A2中的截面。
例如，该第三差值阈值可以为1，且在目标截面中，第一有机层011的厚度与第二有机层02的厚度的差值可以小于该第三差值阈值1，如可以为0。即，如图9所示，在目标截面MM'中，第一有机层011的厚度h1与第二有机层02h2的厚度相同。如此，可以进一步确保显示面板的成像解析度较好。
可选的，第一有机层011和第二有机层02的材料可以相同。如，可以均为聚甲基丙烯酸甲酯，即第一有机层011和第二有机层02可以均为亚克力材质。
可选的，该第一有机层011和第二有机层02均可以通过(inkjet-printed，IJP)技术形成。相应的，该第一有机层011和第二有机层02均可以称为IJP层。
作为再一种可选的实现方式，参考图10所示的再一种显示面板。本申请实施例记载的封装层01还可以包括：位于多个像素P1与第一有机层011之间的第一无机层012。在该结构前提下，该显示面板还可以包括：位于第二有机层02与衬底基板00之间的第二无机层03。
通过设置第一有机层011和第二有机层02均附着无机层，可以确保第一有机层011和第二有机层02具有相似的表面张力，更有利于使得形成的第一有机 层011和第二有机层02具有较为相似的攀爬坡度。即，使得在目标截面MM'中，第一有机层011的厚度与第二有机层02的厚度可以尽可能相同。相应的，如上述实施例记载，可以进一步确保显示面板的成像解析度较好。
可选的，参考图11所示的再一种显示面板。本申请实施例记载的封装层01还可以包括：位于第一有机层011远离多个像素P1一侧的第三无机层013。相应的，显示面板还可以包括：位于第二有机层02远离衬底基板00一侧的第四无机层04。
可选的，在本申请实施例中，第一无机层012的最大厚度与最小厚度的厚度差值，和第二无机层03的最大厚度与最小厚度的厚度差值，可以均位于第一差值范围内。即，第一无机层012和第二无机层03的厚度可以相近，如可以相同。和/或，第三无机层013的最大厚度与最小厚度的厚度差值，和，第四无机层04的最大厚度与最小厚度的厚度差值，可以均位于第二差值范围内。即，第三无机层013和第四无机层04的厚度可以相近，如可以相同。如此，可以进一步有利于形成的第一有机层011和第二有机层02具有较为相似的攀爬坡度。
可选的，在本申请实施例中，显示面板包括的各个无机层的材料可以相同，也可以不同。如，可以包括氧化硅(SiO)、氮化硅(SiN)和氮氧化硅(SiNO)中的至少一种。并且，各个无机层均可以采用化学气相沉积法(chemical vapor deposition，CVD)形成。相应的，各个无机层均可以称为CVD层。如，在本申请实施例中，可以将第一无机层012和第二无机层03称为CVD1，并将第三无机层013和第四无机层04称为CVD2。
可选的，再结合图8至图11可以看出，对于每个像素P1而言，该像素P1还可以包括像素电路P12，图8至图11中均以由栅极(gate)和源漏极(source&drain，SD)组成的层级结构G+SD来标识一个像素电路P12。该像素电路P12可以与该像素P1所包括的目标电极P11连接(图中未示出连接关系)。该像素电路P12可以用于向目标电极P12提供驱动信号，以使得目标电极P12与该像素P1包括的另一电极之间形成电势差，像素P1发光。
可选的，该目标电极P11可以为阳极(anode)。相应的，上述实施例记载的另一电极即可以为阴极。当然，目标电极20也可以为阴极，相应的，上述实施例记载的另一电极即可以为阳极。
可选的，结合图8至图11所示结构，位于第二显示区A2中的各个像素P1 所包括的像素电路P12可以外置于第一显示区A1内。如此，可以进一步确保第二显示区A2的透光率较好。当然，位于第二显示区A2中的各个像素P1所包括的像素电路P12也可以内置于第二显示区A2内。本申请实施例对此不做限定。
可选的，再结合图8至图11可以看出，在本申请实施例中，显示面板还可以包括：位于像素电路P12与目标电极P11之间，且沿远离衬底基板00方向依次层叠的栅绝缘层(gate insulator，GI)05，层间介定层((inter-layer dielectric ILD)06和平坦层(planarization，PLN)07。以及位于目标电极P11与封装层01之间的像素介定层(pixel definition layer，PDL)08。
综上所述，本申请实施例提供了一种显示面板，该显示面板包括衬底基板，该衬底基板具有第一显示区和第二显示区，该第一显示区包括第一子显示区，以及相对于第一子显示区靠近衬底基板边缘的第二子显示区。以及，包括位于衬底基板一侧的多个像素和封装层，该封装层包括第一有机层。由于该第一有机层位于第二显示区的第一部分的最大厚度与最小厚度的厚度差值，小于该第一有机层位于第二子显示区的第二部分的最大厚度与最小厚度的厚度差值，即该第一有机层位于第二显示区的部分较为平坦，因此有效避免了设置于第二显示区内的摄像头发出光线的焦点因折射而偏离主光轴。如此，即确保了摄像头的成像解析度较好，显示面板的成像效果较好。
图12是本申请实施例提供的一种显示面板的制造方法的流程图，可以用于制造本申请上述实施例记载的显示面板。如图12所示，该方法可以包括：
步骤1201、提供衬底基板。
其中，如图1所示，该衬底基板00可以具有第一显示区A1和第二显示区A2，第一显示区A1至少部分围绕第二显示区A2，第一显示区A1包括第一子显示区A11和第二子显示区A12，且第二子显示区A12相对于第一子显示区A11更靠近衬底基板00的边缘。
可选的，该衬底基板00的材料可以为柔性材料，如聚酰亚胺(polyimide，PI)。相应的，该衬底基板00也可以称为PI基板。
步骤1202、在衬底基板的一侧形成多个像素。
其中，结合图2至图5，多个像素P1可以分别设置于第一显示区A1和第二显示区A2内。至少两个像素P1可以包括目标电极P11，且可以分别设置于 第一显示区A1和第二显示区A2。此外，位于第二显示区A2的目标电极P11的尺寸可以小于位于第一显示区A1的目标电极P11的尺寸，和/或，位于第二显示区A2的目标电极P11的密度可以小于位于第一显示区A1的目标电极P11的密度。如此，第二显示区A2的透光率即可以大于第一显示区A1的透光率。
步骤1203、在多个像素远离衬底基板的一侧形成封装层。
可选的，结合图3至图5，该封装层01可以包括第一有机层011，且该且第一有机层011位于第二显示区A2的第一部分011A的最大厚度与最小厚度的厚度差值，可以小于第一有机层011位于第二子显示区A12的第二部分011B的最大厚度与最小厚度的厚度差值。
综上所述，本申请实施例提供了一种显示面板的制造方法，该方法制成的显示面板中第一有机层位于透光率较大的第二显示区的第一部分较为平坦，因此有效避免了设置于第二显示区内的摄像头发出光线的焦点因折射而偏离主光轴。如此，即确保了摄像头的成像解析度较好，显示面板的成像效果较好。
可选的，图13是本申请实施例提供的一种形成第一有机层的方法流程图。图14以图13所示方法为例，示出了形成第一有机层(即，上述实施例记载的IJP层)的工艺流程图。
步骤1301、在多个像素远离衬底基板的一侧打印第一有机层材料。
可选的，结合图14，其以一基板代替多个像素远离衬底基板的一侧。在本申请实施例中，可以先于该基板上通过打印设备打印制成有机层的材料(如，亚克力)。
步骤1302、在第一有机层材料平坦化后，对第一有机层材料进行目标固化处理，形成第一有机层。
在打印得到第一有机层材料后，参考图14，该第一有机层材料会在表面张力的作用下逐渐向两侧延伸，即逐渐平坦化(flatting)。在平坦化后，即可以对第一有机层材料进行目标固化处理，形成第一有机层。如，该目标固化处理可以为图14所示的光固化处理。即，可以采用光源照射平坦化后的第一有机层材料，从而得到第一有机层。
可选的，参考图15所示方法流程图，以及图16所示工艺流程图。上述步骤1302可以包括：
步骤13021、提供具有通孔的掩膜版。
其中，参考图16，该掩膜版M1的通孔K1可以位于第二子显示区A12。
步骤13022、采用掩膜版对第一有机层材料进行预固化处理。
可选的，该预固化处理也可以为光固化处理。如此，在打印第一有机材料之后，可以采用光源从该掩膜版M1的通孔K1位置处提前照射以预固化该区域内的第一有机材料。该过程也可以称为对第一有机层材料的提前曝光。
步骤13023、对预固化处理后的第一有机层材料进行目标固化处理，形成第一有机层。
最后，再移开掩膜版M1，采用光源照射预固化处理后的第一有机层材料，以得到第一有机层。如此，可以使得第一有机层011位于第二子显示区A12的第二部分011B较为平坦，即得到图8所示显示面板。该方法为本申请实施例提供的一种改善成像解析度的方法。
可选的，参考图17所示的另一种方法流程图。在本申请实施例中，在步骤1203之后，方法还可以包括：
步骤1204、在衬底基板远离多个像素的一侧形成第二有机层。
其中，该第一有机层的厚度变化量和该第二有机层的厚度变化量可以均小于变化量阈值。
可选的，同上述图13示出的形成第一有机层的方法，可以采用图18所示的方法形成第二有机层。即上述步骤1204可以包括：
步骤12041、在衬底基板远离多个像素的一侧打印第二有机层材料。
可选的，该步骤的实现方式可以参考上述步骤1301，在此不再赘述。
步骤12042、在第二有机层材料平坦化后，对第二有机层材料进行目标固化处理，形成第二有机层。
可选的，该步骤的实现方式可以参考上述步骤1302，在此不再赘述。
以图18所示方法为例，图19示出了形成第二有机层的整体工艺流程图。如图19所示，在制作显示面板时，一般会提供一承载基板09用于承载各层结构，且衬底基板00远离承载基板09的一侧还包括玻璃(glass)基板10。如此，第一步，可以先采用剥离技术，如激光剥离(laser lift off，LLO)技术剥离玻璃基板10，以暴露衬底基板00。第二步，可以在暴露的衬底基板00上通过图14所示的第一步，打印用于形成第二有机层02的第二有机层材料。第三步，可以再继续采用图14所示的其他两步对所打印材料进行处理，从而得到位于衬底基 板00一侧的第二有机层02。该方法为本申请实施例提供的另一种改善成像解析度的显示面板制造方法。
结合上述装置侧实施例可知，在本申请实施例中，封装层01还可以包括：位于多个像素P1与第一有机层011之间的第一无机层012。在该结构前提下，显示面板还可以包括位于衬底基板00和第二有机层02之间的第二无机层03。即，参考图20示出的又一种显示面板的制造方法流程图，该方法还可以包括：
步骤1205、采用沉积工艺，在衬底基板远离多个像素的一侧形成第二无机层。
相应的，结合图20，步骤1204即可以为：在第二无机层远离衬底基板的一侧形成第二有机层。
可选的，图21示出了形成第二无机层的工艺流程图。相对于图19所示工艺流程而言，该工艺流程仅是在第一步和第二步之间新增了一步：采用CVD方法先在衬底基板00上沉积一层第二无机层02。
可选的，在本申请实施例中，封装层01还可以包括：位于第一有机层011远离多个像素一侧的第三无机层013。在该结构前提下，显示面板还可以包括位于第二有机层02远离衬底基板00一侧的第四无机层04。即，参考图22示出的又一种显示面板的制造方法流程图，该方法还可以包括：
步骤1206、采用沉积工艺，在第二有机层远离衬底基板一侧形成第四无机层。
需要说明的是，参考图19和图21可以看出，封装层01远离衬底基板00的一侧还包括：封装薄膜层11。
还需要说明的是，基于图13和图14所示对有机层制造方法的介绍可知，打印截止位置可以影响第一有机层011的攀爬起始点。打印量可以影响第一有机层011的厚度。
例如，为体现打印截止位置对攀爬起始点的影响，图23示出了不同打印截止位置对应的第一有机层011的攀爬起始点。为体现打印量对第一有机层011厚度的影响，图24示出了不同打印量对应的第一有机层011的厚度。参考图23可以看出，打印截止位置越靠近基板的边缘，第一有机层011的攀爬起始点则越靠近边缘。参考图24可以看出，打印量越多，第一有机层011的厚度越大，即第一有机层011越厚。如此，还可以通过调整打印截止位置和打印量，来改 善第一有机层011的厚度和位置。
综上所述，本申请实施例提供了一种显示面板的制造方法，该方法制成的显示面板中第一有机层位于透光率较大的第二显示区的第一部分较为平坦，因此有效避免了设置于第二显示区内的摄像头发出光线的焦点因折射而偏离主光轴。如此，即确保了摄像头的成像解析度较好，显示面板的成像效果较好。
可选的，图25是本申请实施例提供的一种显示装置的结构示意图。如图25所示，该显示装置可以包括：感光传感器Y0，以及如上述实施例记载的显示面板。其中，该感光传感器Y0可以位于显示面板的第二显示区A2内，该感光传感器Y0可以用于实现拍摄成像功能。
可选的，该显示装置可以为：有机发光二极管(organic light-emitting diode，OLED)显示装置、液晶显示装置、有源矩阵有机发光二极管(active-matrix organic light-emitting diode，AMOLED)显示装置、手机、平板电脑、柔性显示装置、电视机和显示器等任何具有显示功能的产品或部件。
在本申请实施例中，术语“第一”、“第二”、第三”和“第四”仅用于描述目的，而不能理解为指示或暗示相对重要性。
本申请实施例中术语“多个”的含义是指两个或两个以上。
本申请实施例中术语“和/或”，仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
以上所述仅为本申请的可选实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (26)

  1. 一种显示面板，其特征在于，所述显示面板包括：
    衬底基板，具有第一显示区和第二显示区，所述第一显示区至少部分围绕所述第二显示区，所述第一显示区包括第一子显示区和第二子显示区，且所述第二子显示区相对于所述第一子显示区靠近所述衬底基板的边缘；
    多个像素，设置在所述衬底基板上分别位于所述第一显示区和所述第二显示区，所述多个像素中至少两个像素包括目标电极，且分别设置于所述第一显示区和所述第二显示区，位于所述第二显示区的目标电极的尺寸小于位于所述第一显示区的目标电极的尺寸，和/或，位于所述第二显示区的目标电极的密度小于位于所述第一显示区的目标电极的密度；
    封装层，设置在所述多个像素远离所述衬底基板的一侧，所述封装层包括第一有机层，且所述第一有机层位于所述第二显示区的第一部分的最大厚度与最小厚度的厚度差值，小于所述第一有机层位于所述第二子显示区的第二部分的最大厚度与最小厚度的厚度差值。
  2. 根据权利要求1所述的显示面板，其特征在于，所述第一显示区围绕所述第二显示区；所述衬底基板至少包括相互平行的第一边和第二边；
    并且，所述第二显示区的几何中心与所述衬底基板的第一边的距离，小于所述第二显示区的几何中心与所述衬底基板的第二边的距离。
  3. 根据权利要求2所述的显示面板，其特征在于，所述衬底基板为长方形，所述第一边和所述第二边均为所述长方形的短边。
  4. 根据权利要求2所述的显示面板，其特征在于，沿靠近所述第一边的方向，所述第一有机层的厚度逐渐变小；并且，所述第一有机层的第一部分的平均厚度，大于所述第一有机层的第二部分的平均厚度。
  5. 根据权利要求1至4任一所述的显示面板，其特征在于，所述第一有机层的第二部分的最大厚度与最小厚度的厚度差值小于第一差值阈值。
  6. 根据权利要求1至5任一所述的显示面板，其特征在于，所述第一有机层的第一部分的最大厚度与最小厚度的厚度差值小于第二差值阈值。
  7. 根据权利要求1至6任一所述的显示面板，其特征在于，所述显示面板还包括：位于所述衬底基板远离所述多个像素一侧的第二有机层；
    其中，所述第一有机层的厚度变化量与所述第二有机层的厚度变化量均小于变化量阈值。
  8. 根据权利要求7所述的显示面板，其特征在于，所述第一有机层的厚度变化量与所述第二有机层的厚度变化量相同。
  9. 根据权利要求7所述的显示面板，其特征在于，在至少一个目标截面中，所述第一有机层与所述第二有机层的厚度的差值小于第三差值阈值；
    其中，所述目标截面为所述显示面板在目标方向上的截面，且所述目标方向垂直于所述第一显示区和所述第二显示区的排布方向。
  10. 根据权利要求9所述的显示面板，其特征在于，在所述至少一个目标截面中，所述第一有机层的厚度与所述第二有机层的厚度相同。
  11. 根据权利要求7所述的显示面板，其特征在于，所述第一有机层和所述第二有机层的材料均为聚甲基丙烯酸甲酯。
  12. 根据权利要求7所述的显示面板，其特征在于，所述封装层还包括：位于所述多个像素与所述第一有机层之间的第一无机层。
  13. 根据权利要求12所述的显示面板，其特征在于，所述显示面板还包括：位于所述第二有机层与所述衬底基板之间的第二无机层。
  14. 根据权利要求7所述的显示面板，其特征在于，所述封装层还包括：位于所述第一有机层远离所述多个像素一侧的第三无机层。
  15. 根据权利要求14所述的显示面板，其特征在于，所述显示面板还包括：位于所述第二有机层远离所述衬底基板一侧的第四无机层。
  16. 根据权利要求12至15任一所述的显示面板，其特征在于，
    所述显示面板包括的第一无机层的最大厚度与最小厚度的厚度差值，和第二无机层的最大厚度与最小厚度的厚度差值，均位于第一差值范围内；
    和/或，
    所述显示面板包括的第三无机层的最大厚度与最小厚度的厚度差值，和，第四无机层的最大厚度与最小厚度的厚度差值，均位于第二差值范围内。
  17. 根据权利要求12至16任一所述的显示面板，其特征在于，所述显示面板包括的无机层的材料包括：氧化硅、氮化硅和氮氧化硅中的至少一种。
  18. 根据权利要求1至17任一所述的显示面板，其特征在于，所述目标电极为阳极。
  19. 一种显示面板的制造方法，其特征在于，所述方法包括：
    提供衬底基板，所述衬底基板具有第一显示区和第二显示区，所述第一显示区至少部分围绕所述第二显示区，所述第一显示区包括第一子显示区和第二子显示区，且所述第二子显示区相对于所述第一子显示区靠近所述衬底基板的边缘；
    在所述衬底基板的一侧形成多个像素，所述多个像素分别设置于所述第一显示区和所述第二显示区，所述多个像素中至少两个像素包括目标电极，且分别设置于所述第一显示区和所述第二显示区，位于所述第二显示区的目标电极的尺寸小于位于所述第一显示区的目标电极的尺寸，和/或，位于所述第二显示区的目标电极的密度小于位于所述第一显示区的目标电极的密度；
    在所述多个像素远离所述衬底基板的一侧形成封装层，所述封装层包括第一有机层，且所述第一有机层位于所述第二显示区的第一部分的最大厚度与最小厚度的厚度差值，小于所述第一有机层位于所述第二子显示区的第二部分的 最大厚度与最小厚度的厚度差值。
  20. 根据权利要求19所述的方法，其特征在于，在所述多个像素远离所述衬底基板的一侧形成所述第一有机层，包括：
    在所述多个像素远离所述衬底基板的一侧打印第一有机层材料；
    在所述第一有机层材料平坦化后，对所述第一有机层材料进行目标固化处理，形成所述第一有机层。
  21. 根据权利要求20所述的方法，其特征在于，所述对所述第一有机层材料进行目标固化处理，形成所述第一有机层，包括：
    提供具有通孔的掩膜版，所述通孔位于所述第二子显示区；
    采用所述掩膜版对所述第一有机层材料进行预固化处理；
    对预固化处理后的第一有机层材料进行目标固化处理，形成所述第一有机层。
  22. 根据权利要求19至21任一所述的方法，其特征在于，所述方法还包括：
    在所述衬底基板远离所述多个像素的一侧形成第二有机层；
    其中，所述第一有机层的厚度变化量与所述第二有机层的厚度变化量均小于变化量阈值。
  23. 根据权利要求22所述的方法，其特征在于，所述在所述衬底基板远离所述多个像素的一侧形成第二有机层，包括：
    在所述衬底基板远离所述多个像素的一侧打印第二有机层材料；
    在所述第二有机层材料平坦化后，对所述第二有机层材料进行目标固化处理，形成第二有机层。
  24. 根据权利要求22所述的方法，其特征在于，所述封装层还包括：位于所述多个像素与所述第一有机层之间的第一无机层；所述方法还包括：
    采用沉积工艺，在所述衬底基板远离所述多个像素的一侧形成第二无机层；
    所述在所述衬底基板远离所述多个像素的一侧形成第二有机层，包括：
    在所述第二无机层远离所述衬底基板的一侧形成第二有机层。
  25. 根据权利要求22所述的方法，其特征在于，所述封装层还包括：位于所述第一有机层远离所述多个像素一侧的第三无机层；所述方法还包括：
    采用沉积工艺，在所述第二有机层远离所述衬底基板一侧形成第四无机层。
  26. 一种显示装置，其特征在于，所述显示装置包括：感光传感器，以及如权利要求1至18任一所述的显示面板，所述感光传感器位于所述显示面板的第二显示区内。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107180852A (zh) * 2017-05-18 2017-09-19 上海天马有机发光显示技术有限公司 一种触控显示面板及显示装置
CN110780375A (zh) * 2019-11-15 2020-02-11 京东方科技集团股份有限公司 偏光片及其制备方法、显示面板、显示装置
CN110911441A (zh) * 2018-09-14 2020-03-24 三星显示有限公司 有机发光二极管显示器
CN111752417A (zh) * 2020-06-29 2020-10-09 武汉天马微电子有限公司 一种显示面板及显示装置

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Publication number Priority date Publication date Assignee Title
CN107180852A (zh) * 2017-05-18 2017-09-19 上海天马有机发光显示技术有限公司 一种触控显示面板及显示装置
CN110911441A (zh) * 2018-09-14 2020-03-24 三星显示有限公司 有机发光二极管显示器
CN110780375A (zh) * 2019-11-15 2020-02-11 京东方科技集团股份有限公司 偏光片及其制备方法、显示面板、显示装置
CN111752417A (zh) * 2020-06-29 2020-10-09 武汉天马微电子有限公司 一种显示面板及显示装置

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