WO2022176879A1 - インダクタおよびその製造方法 - Google Patents

インダクタおよびその製造方法 Download PDF

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Publication number
WO2022176879A1
WO2022176879A1 PCT/JP2022/006068 JP2022006068W WO2022176879A1 WO 2022176879 A1 WO2022176879 A1 WO 2022176879A1 JP 2022006068 W JP2022006068 W JP 2022006068W WO 2022176879 A1 WO2022176879 A1 WO 2022176879A1
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WO
WIPO (PCT)
Prior art keywords
sheet
resin sheet
inductor
wiring
thickness direction
Prior art date
Application number
PCT/JP2022/006068
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English (en)
French (fr)
Japanese (ja)
Inventor
圭佑 奥村
佳宏 古川
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020237027894A priority Critical patent/KR20230147073A/ko
Priority to JP2023500873A priority patent/JPWO2022176879A1/ja
Priority to CN202280014893.8A priority patent/CN116897400A/zh
Publication of WO2022176879A1 publication Critical patent/WO2022176879A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips

Definitions

  • the present invention relates to an inductor and its manufacturing method.
  • a known sheet-shaped inductor includes two laterally adjacent wirings and a magnetic layer embedding them (for example, see Patent Document 1 below).
  • one surface in the thickness direction of the magnetic layer has a first facing portion that faces two wirings and a first concave portion that is recessed toward the other side between the two facing portions.
  • the other surface in the thickness direction of the magnetic layer has a second facing portion that faces the two wirings and a second recessed portion that is recessed toward one side between the two second facing portions.
  • the first recess is significantly deeper than the second recess. Then, due to the above-described difference in depth, the inductor is warped so that both ends of the inductor in the horizontal direction move to one side in the thickness direction with respect to the central portion in the horizontal direction. Then, it is difficult to mount the inductor on the external substrate, and it is difficult to mount the electronic element on the inductor. In other words, there is a problem that the mountability of the inductor is lowered.
  • the present invention provides an inductor capable of suppressing deterioration in mountability and handling, and a manufacturing method thereof.
  • the present invention (1) is an inductor having a sheet shape, comprising a first wiring and a second wiring adjacent to each other with a space therebetween in a direction orthogonal to a thickness direction, and the first wiring and the second wiring.
  • an embedded magnetic layer the magnetic layer having a first main surface exposed on one side in the thickness direction and a second main surface exposed on the other side in the thickness direction;
  • the surface has a first concave portion recessed between a first facing portion facing the first wiring in the thickness direction and a second facing portion facing the second wiring in the thickness direction.
  • the second principal surface includes a third facing portion facing the first wiring in the thickness direction and a fourth facing portion facing the second wiring in the thickness direction, and a third facing portion recessed therefrom.
  • the inductor has two recesses, and the ratio (L1/L2) of the depth L1 of the first recess to the depth L2 of the second recess is 0.67 or more and 1.50 or less.
  • the ratio (L1/L2) of the depth L1 of the first recess to the depth L2 of the second recess is 0.67 or more and 1.50 or less, warping of the inductor is suppressed. Therefore, the inductor can be reliably mounted on the external substrate. Moreover, since the warp of the inductor is suppressed, the electronic element can be reliably mounted on the inductor. Therefore, deterioration in mountability of the inductor is suppressed.
  • this inductor is excellent in the accuracy of processing dimensions in the post-process and in the positional accuracy during mounting.
  • the present invention (2) includes the inductor according to (1), wherein the warpage required for the following measurements is 200 ⁇ m or less.
  • a sample is produced by processing the inductor to a size of 60 mm in length and 60 mm in width.
  • the sample is placed on the horizontal table such that the second major surface of the sample faces the surface of the horizontal table.
  • a longest length L3 and a shortest length L4 from the surface of the horizontal base to the second main surface are obtained in an area of 30 mm long and 30 mm wide at the center of the inductor.
  • a difference (L3-L4) between the maximum height L3 and the minimum height L4 is obtained as warpage.
  • the difference (L3-L4) between the maximum height L3 and the minimum height L4 is 200 ⁇ m or less, so the warp can be reliably reduced.
  • the present invention (3) provides a laminate for pressing comprising a magnetic sheet containing magnetic particles and a thermosetting resin, and a plurality of wirings spaced apart from each other in a direction perpendicular to the thickness direction of the magnetic sheet.
  • a method for manufacturing an inductor including a step of hot pressing, wherein the pressing laminate further includes a first resin sheet and a second resin sheet sandwiching the magnetic sheet and the plurality of wirings in a thickness direction, and a fluid flexible sheet, the first resin sheet, and the second resin sheet are used, and in the step, the second resin sheet, the first resin sheet, and the fluid flexible sheet are arranged in the thickness direction.
  • the tensile storage modulus E' of the second resin sheet at the temperature of the hot press is lower than the tensile storage modulus E' of the first resin sheet at the temperature of the hot press, Including a method of manufacturing an inductor.
  • the present invention (4) is the inductor according to claim 3, wherein the tensile storage modulus E' of the second resin sheet at 170°C is lower than the tensile storage modulus E' of the first resin sheet at 170°C. Including manufacturing method.
  • the present invention there are a plurality of magnetic sheets, and in the laminate for pressing, the plurality of magnetic sheets sandwich the plurality of wirings in the thickness direction.
  • a method of manufacturing the described inductor is included.
  • the laminated sheet composed of the fluid flexible sheet and the first resin sheet and the second resin sheet are each , the manufacturing method of the inductor according to any one of claims 3 to 5, in which stress deformation of the same degree occurs.
  • the inductor manufactured by the manufacturing method of the present invention can suppress deterioration in mountability and handling.
  • FIG. 1 is a cross-sectional view of one embodiment of the inductor of the present invention.
  • FIG. 2 shows the orientation of magnetic grains in the magnetic layer of the inductor shown in FIG. 3A and 3B are schematic diagrams illustrating a method of measuring inductor warpage.
  • FIG. 3A shows a warp in which both ends in the first direction are arranged on the other side in the thickness direction with respect to the central portion.
  • FIG. 3B shows a warp in which both end portions in the first direction are arranged on one side in the thickness direction with respect to the central portion.
  • FIG. 4 is a schematic diagram illustrating a method of manufacturing an inductor.
  • FIG. 5 shows a step of setting the laminate for pressing in a heat press apparatus.
  • FIG. 6 shows the step of forming the reduced pressure space following FIG.
  • FIG. 7 shows the step of hot-pressing the magnetic sheet following FIG.
  • This inductor 1 has a sheet shape. Inductor 1 extends in a first direction perpendicular to the thickness direction. The thickness direction is the vertical direction in FIGS. The first direction is the left-right (horizontal) direction in FIGS. 1 and 2 .
  • the inductor 1 includes a first wiring 2 , a second wiring 3 and a magnetic layer 4 .
  • first wiring 2 and the second wiring 3 are adjacent to each other with a space therebetween in the first direction. Each of the first wiring 2 and the second wiring 3 is spaced apart from each other in the adjacent direction orthogonal to the longitudinal direction and the thickness direction.
  • the longitudinal direction mentioned above is the paper thickness direction in FIGS.
  • the first wiring 2 and the second wiring 3 the first wiring 2 is arranged on one side in the first direction.
  • the second wiring 3 is arranged on the other side in the first direction.
  • Each of the first wiring 2 and the second wiring 3 has, for example, a substantially circular cross-sectional shape. The configuration and dimensions of each of the first wiring 2 and the second wiring 3 are described, for example, in Japanese Unexamined Patent Application Publication No. 2020-150057.
  • the magnetic layer 4 has the same outer shape as the inductor 1 . Specifically, the magnetic layer 4 has a sheet shape extending in the first direction. The magnetic layer 4 embeds the first wiring 2 and the second wiring 3 . The magnetic layer 4 has a first principal surface 5 and a second principal surface 6 .
  • the first main surface 5 is exposed on one side in the thickness direction.
  • the first main surface 5 is one surface of the inductor 1 in the thickness direction.
  • the first main surface 5 is arranged on one side in the thickness direction with respect to the first wiring 2 and the second wiring 3 when projected in the first direction.
  • the first main surface 5 has a first facing portion 7 , a second facing portion 8 and a first recessed portion 9 .
  • the first facing portion 7 faces one side of the first wiring 2 in the thickness direction with a gap therebetween. Specifically, the first facing portion 7 curves along one surface of the first wiring 2 in the thickness direction.
  • the first facing portion 7 is a first raised portion.
  • the second facing portion 8 faces one side of the second wiring 3 in the thickness direction with a gap therebetween. Specifically, the second facing portion 8 curves along one surface of the second wiring 3 in the thickness direction.
  • the second facing portion 8 is a second raised portion. The second facing portion 8 is spaced apart from the first facing portion 7 on the other side in the first direction.
  • the first concave portion 9 is arranged between the first facing portion 7 and the second facing portion 8 .
  • the first concave portion 9 is recessed from the other edge of the first facing portion 7 in the first direction and one edge of the second facing portion 8 in the first direction toward the other side in the thickness direction.
  • the depth L1 of the first concave portion 9 is not limited as long as the later-described ratio (L1/L2) is within a desired range.
  • the depth L1 is, for example, 1 ⁇ m or more and, for example, 500 ⁇ m or less.
  • the depth L1 of the first recessed portion 9 is defined by the portion of the first opposing portion 7 and the second opposing portion 8 that is arranged on the most one side in the thickness direction, and the depth L1 of the first recessed portion 9 that is arranged on the othermost side in the thickness direction. It is the distance from the part where the
  • the second main surface 6 is exposed on the other side in the thickness direction.
  • the second main surface 6 is the other surface of the inductor 1 in the thickness direction.
  • the second main surface 6 is arranged on the other side in the thickness direction with respect to the first wiring 2 and the second wiring 3 when projected in the first direction.
  • the second major surface 6 has a third facing portion 10 , a fourth facing portion 11 and a second recessed portion 12 .
  • the third facing portion 10 faces the other side of the first wiring 2 in the thickness direction with a gap therebetween. Specifically, the third facing portion 10 curves along the other surface of the first wiring 2 in the thickness direction.
  • the third facing portion 10 is a third raised portion.
  • the third facing portion 10 is arranged on the opposite side of the first wiring 2 from the first facing portion 7 in the thickness direction.
  • the fourth facing portion 11 faces the other side of the second wiring 3 in the thickness direction with a gap therebetween. Specifically, the fourth facing portion 11 curves along the other surface of the second wiring 3 in the thickness direction.
  • the fourth facing portion 11 is a fourth raised portion.
  • the fourth facing portion 11 is arranged on the opposite side of the second wiring 3 from the second facing portion 8 in the thickness direction.
  • the fourth facing portion 11 is spaced from the other side of the third facing portion 10 in the first direction.
  • the second concave portion 12 is arranged between the third facing portion 10 and the fourth facing portion 11 .
  • the second concave portion 12 is recessed toward one side in the thickness direction from the other edge of the third opposing portion 10 in the first direction and one edge of the fourth opposing portion 11 in the first direction.
  • the depth L2 of the second concave portion 12 is not limited as long as the ratio (L1/L2) described below is within the desired range.
  • the depth L2 is, for example, 1 ⁇ m or more and, for example, 500 ⁇ m or less.
  • the depth L2 of the second recessed portion 12 is the portion of the third facing portion 10 and the fourth facing portion 11 that is arranged on the othermost side in the thickness direction, and the depth L2 of the second concave portion 12 that is arranged on the most one side in the thickness direction. It is the distance from the part where the
  • the ratio (L1/L2) of the depth L1 of the first recess 9 to the depth L2 of the second recess 12 is 0.67 or more and 1.50 or less. If the above ratio is less than 0.67 or more than 1.50, the warp of the inductor 1 increases.
  • the ratio (L1/L2) of the depth L1 of the first recess 9 to the depth L2 of the second recess 12 is preferably 0.75 or more, more preferably 0.85 or more, and still more preferably 0.90. That's it.
  • the above ratio is equal to or higher than the above lower limit, it is possible to reduce the warp (see FIG. 3B) in which both end portions 13 in the first direction are arranged on one side in the thickness direction from the central portion 14 .
  • the ratio (L1/L2) of the depth L1 of the first recess 9 to the depth L2 of the second recess 12 is preferably 1.30 or less, more preferably 1.20 or less, still more preferably 1.10. It is below.
  • the above ratio is equal to or less than the above upper limit, it is possible to reduce the warp (see FIG. 3A) in which both end portions 13 in the first direction are arranged on the other side in the thickness direction from the central portion.
  • the difference between the depth L1 of the first recess 9 and the depth L2 of the second recess 12 is, for example, 50 ⁇ m or less, preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, particularly preferably 5 ⁇ m or less, and most preferably 5 ⁇ m or less. Preferably, it is 2 ⁇ m or less.
  • the difference is
  • the magnetic layer 4 contains magnetic particles and resin.
  • Magnetic particles include, for example, carbonyl iron powder and Fe—Si alloys.
  • Specific examples of the shape of the magnetic particles include a spherical shape and a substantially flat shape (plate shape).
  • the magnetic particles preferably include carbonyl iron powder having a spherical shape.
  • Resins include, for example, thermosetting resins.
  • the magnetic layer 4 is a single layer or multiple layers. When the magnetic layer 4 is a multilayer, the magnetic layer 4 preferably contains spherical magnetic particles.
  • the magnetic layer 4 comprises, for example, a first magnetic layer 15, a second magnetic layer 16, and a third magnetic layer 17.
  • the third magnetic layer 17, the first magnetic layer 15, and the second magnetic layer 16 are arranged in order toward one side in the thickness direction.
  • the first magnetic layer 15 is in contact with the outer peripheral surfaces of the first wiring 2 and the second wiring 3 and embeds them. As shown in FIG. 2, the first magnetic layer 15 preferably contains spherical magnetic particles. As a result, the inductor 1 has excellent DC superposition characteristics.
  • the first magnetic layer 15 has one surface and the other surface spaced apart from each other in the thickness direction.
  • the second magnetic layer 16 is arranged on one surface of the first magnetic layer 15 in the thickness direction.
  • the second magnetic layer 16 includes the first main surface 5 described above.
  • the second magnetic layer 16 preferably contains flat magnetic particles.
  • the flat magnetic particles can be oriented in the curved shape of the first facing portion 7 and the second facing portion 8 . Therefore, the inductance of the inductor 1 can be improved.
  • the third magnetic layer 17 is arranged on the other side in the thickness direction of the first magnetic layer 15 .
  • the third magnetic layer 17 includes the second main surface 6 described above.
  • the third magnetic layer 17 preferably contains flat magnetic particles.
  • the flat magnetic particles can be oriented in the curved shapes of the third facing portion 10 and the fourth facing portion 11 . Therefore, the inductance of the inductor 1 can be improved.
  • the warp of the inductor 1 required for the following measurements is, for example, 250 ⁇ m or less, preferably 200 ⁇ m or less, more preferably 150 ⁇ m or less, even more preferably 100 ⁇ m or less, particularly preferably 75 ⁇ m or less, furthermore preferably 50 ⁇ m or less, Furthermore, 30 ⁇ m or less is preferable. If the warp of the inductor 1 is equal to or less than the above upper limit, the warp of the inductor 1 can be reliably reduced.
  • a sample 18 is produced by processing the inductor 1 to a size of 60 mm long and 60 mm wide. As shown in FIGS. 3A and 3B, sample 18 is placed on horizontal table 19 such that second major surface 6 of sample 18 faces surface 20 of horizontal table 19 .
  • a maximum length L3 and a minimum length L4 from the surface 20 of the horizontal base 19 to the first main surface 5 are obtained in the central area 21 of the inductor 1, which is 30 mm long and 30 mm wide.
  • a difference (L3-L4) between the maximum height L3 and the minimum height L4 is obtained as warpage.
  • FIG. 3A depicts a curve in which both ends 13 of the sample 18 are arranged on the other side in the thickness direction with respect to the central area 21, that is, a substantially inverted U-shaped curve.
  • the central area 21 is vertically spaced from the surface 20 of the horizontal platform 19 .
  • L3 is the distance from the surface 20 of the horizontal platform 19 to the central portion 14 of the first main surface 5 of the central area 21 .
  • L4 is the distance from the surface 20 of the horizontal platform 19 to the edge of the first main surface 5 of the central area 21;
  • FIG. 3B depicts a curvature in which both ends 13 of the sample 18 are arranged on the other side in the thickness direction with respect to the central area 21, ie, a substantially U-shaped curvature.
  • central area 21 includes the portion that contacts surface 20 .
  • L3 is the distance from the surface 20 of the horizontal platform 19 to the edge of the first main surface 5 of the central area 21 .
  • L4 is the distance from the surface 20 of the horizontal platform 19 to the central portion 14 of the first main surface 5 of the central area 21; L4 is, more specifically, the thickness T of the central portion 14 since the above-described portion and the surface 20 are in contact with each other.
  • the manufacturing method of the inductor 1 is not limited. For example, as shown in FIG. 4, there is a method of manufacturing the inductor 1 from the first wiring 2, the second wiring 3, and the magnetic sheet 30. FIG. Moreover, in this manufacturing method, the first resin sheet 25, the second resin sheet 26, and the fluid flexible sheet 81 are used. Specifically, the first resin sheet 25, the second resin sheet 26, and the fluid flexible sheet 81 are used in the hot press process, which will be described later.
  • the number of magnetic sheets 30 is singular or plural.
  • the magnetic sheet 30 is arranged on one side and/or the other side in the thickness direction with respect to the first wiring 2 and the second wiring 3 .
  • the magnetic sheets 30 include, for example, a first sheet 31, a second sheet 32, and a third sheet 33.
  • the first sheet 31 is, for example, a magnetic sheet for producing the first magnetic layer 15 (see FIGS. 1 and 2).
  • the second sheet 32 is a magnetic sheet for producing the second magnetic layer 16 (see FIGS. 1 and 2).
  • the third sheet 33 is a magnetic sheet for forming the third magnetic layer 17 (see FIGS. 1 and 2).
  • Each of the first sheet 31, the second sheet 32, and the third sheet 33 is singular or plural.
  • the magnetic sheet 30 is made of a magnetic composition described in JP-A-2020-150057.
  • the thermosetting resin in the magnetic composition forming the magnetic sheet 30 is in the B stage.
  • the second sheet 32, one first sheet 31, the first wiring 2 and the second wiring 3, the other first sheet 31, and the third sheet 33 are laminated in order toward the downstream side in the pressing direction.
  • the pressing direction is the vertical direction in FIGS.
  • Both the first resin sheet 25 and the second resin sheet 26 are not included in the inductor 1, but are cushioning sheets and release sheets used in hot press.
  • each of the first resin sheet 25, the second resin sheet 26, and the fluid flexible sheet 81 also has heat resistance and followability.
  • the first resin sheet 25 is arranged and used on one side in the thickness direction with respect to the first wiring 2 and the second wiring 3 .
  • the first resin sheet 25 is arranged on the side opposite to the first wirings 2 and the second wirings 3 with respect to one of the first sheet 31 and the second sheet 32 .
  • the tensile storage modulus E′ of the first resin sheet 25 at 170° C. is, for example, 1 ⁇ 10 5 Pa or more, preferably 2 ⁇ 10 5 Pa or more, more preferably 1 ⁇ 10 8 Pa or more, and particularly preferably , 2 ⁇ 10 8 Pa or more, and for example, 1 ⁇ 10 10 Pa or less, preferably 5 ⁇ 10 9 Pa or less.
  • the temperature “170° C.” of the tensile storage modulus E′ is a temperature included in the temperature range of hot press.
  • the second resin sheet 26 is arranged on the side opposite to the first resin sheet 25 with respect to the first wirings 2 and the second wirings 3 . That is, the second resin sheet 26 is arranged and used on the other side in the thickness direction with respect to the first wirings 2 and the second wirings 3 . When there are a plurality of magnetic sheets 30, the second resin sheet 26 is arranged on the side opposite to the first wirings 2 and the second wirings 3 with respect to the other first sheet 31 and the third sheet 33. .
  • the second resin sheet 26 is softer than the first resin sheet 25, for example. If the second resin sheet 26 has the same hardness (or a tensile storage elastic modulus E′ described later) as the first resin sheet 25, the first resin sheet 25 is flexibly supported by the fluid flexible sheet 81 described below. In some cases, the depth L1 of the first recess 9 of the first major surface 5 that contacts the is significantly deeper than the depth L2 of the second recess 12 . However, as described above, if the second resin sheet 26 is softer than the first resin sheet 25 , the second resin sheet 26 will be softer than the first resin sheet 25 flexibly contacted by the fluid flexible sheet 81 . Since the two main surfaces 6 can be flexibly brought into contact with each other, the depth L2 of the second concave portion 12 can be set to the same extent as the depth L1 of the first concave portion 9 .
  • the tensile storage modulus E′ of the second resin sheet 26 at 170° C. is, for example, 1 ⁇ 10 5 Pa or more, preferably 1 ⁇ 10 6 Pa or more, and for example, 1 ⁇ 10 9 Pa or less, preferably is 1 ⁇ 10 8 Pa or less.
  • a catalog value is adopted, or it can be measured.
  • the tensile storage modulus E' of the second resin sheet 26 at 170°C is preferably lower than the tensile storage modulus E' of the first resin sheet 25 at 170°C.
  • the ratio (L1/L2) of the depth L1 of 9 can be 1.50 or less.
  • the ratio of the tensile storage modulus E' of the first resin sheet 25 at 170°C to the tensile storage modulus E' of the second resin sheet 26 at 170°C is, for example, more than 1, preferably 2 or more, more preferably 3 or more, more preferably 4 or more, particularly preferably 5 or more, and most preferably 7 or more.
  • the above ratio is, for example, 10,000 or less, preferably 1,000 or less, more preferably 100 or less, and even more preferably 20 or less. If the ratio is equal to or higher than the lower limit or equal to or lower than the upper limit, the inductor 1 with reduced warpage can be manufactured.
  • the lowest value among the multiple layers is taken as the tensile storage modulus E'.
  • the layer with the lowest tensile storage modulus E′ will follow the magnetic layer 4 .
  • the thicknesses of the first resin sheet 25 and the second resin sheet 26 are not limited, for example, as long as the following ratio is satisfied.
  • the ratio of the thickness of the first resin sheet 25 to the thickness of the second resin sheet 26 is, for example, 0.01 or more, preferably 0.1 or more, more preferably 0.5 or more. Below, it is preferably 1 or less, more preferably less than 1, and still more preferably 0.8 or less. If the ratio is equal to or higher than the lower limit or equal to or lower than the upper limit, the warpage of the inductor 1 can be further reduced.
  • the thickness of the first resin sheet 25 has multiple layers
  • the thickness of the first resin sheet 25 is the total thickness of the multiple layers.
  • the second resin sheet 26 has multiple layers
  • the thickness of the second resin sheet 26 is the total thickness of the multiple layers.
  • the material of the first resin sheet 25 and the second resin sheet 26 is resin.
  • Resin is not limited.
  • resins include polyesters, polyolefins, and fluororesins.
  • Polyesters include, for example, polyethylene terephthalate (PET) and polybutylene terephthalate (PBT).
  • Polyester includes special polyester.
  • Polyolefins include, for example, polyethylene, polypropylene and polymethylpentene (TPX).
  • the first resin sheet 25 and the second resin sheet 26 are nonporous and/or porous, respectively.
  • the first resin sheet 25 is a single layer or multiple layers.
  • the second resin sheet 26 is a single layer or multiple layers.
  • the fluid flexible sheet 81 is arranged on one side of the first resin sheet 25 in the thickness direction.
  • the flexible flexible sheet 81 is arranged on the opposite side of the first sheet 31 and the second sheet 32 with respect to the first resin sheet 25 .
  • the material of the fluid flexible sheet 81 is not limited as long as it can exhibit fluidity and flexibility during hot pressing. Examples of materials for the fluid flexible sheet 81 include gels and soft elastomers.
  • the material of the flexible flexible sheet 81 may be a commercial product such as the ⁇ GEL series (manufactured by Taica) and the RIKEN ELASTOMER series (manufactured by RIKEN TECHNOS).
  • the thickness of the fluid flexible sheet 81 is not limited.
  • the lower limit of the thickness of the fluid flexible sheet 81 is, for example, 1 mm, preferably 2 mm
  • the upper limit of the thickness of the fluid flexible sheet 81 is, for example, 1,000 mm, preferably 100 mm.
  • the laminated sheet 28 composed of the fluid flexible sheet 81 and the first resin sheet 25 has the same softness (hardness) as the second resin sheet 26, for example.
  • the tensile storage modulus E′ at 170° C. of the laminated sheet 28 composed of the fluid flexible sheet 81 and the first resin sheet 25 is, for example, the tensile storage modulus E of the second resin sheet 26 at 170° C. '.
  • FIG. 5 a manufacturing method using a hot press device 50 will be described as an example of the method of manufacturing the inductor 1 with reference to FIGS. 5 to 7.
  • FIG. 5 a manufacturing method using a hot press device 50 will be described as an example of the method of manufacturing the inductor 1 with reference to FIGS. 5 to 7.
  • FIG. 5 a manufacturing method using a hot press device 50 will be described as an example of the method of manufacturing the inductor 1 with reference to FIGS. 5 to 7.
  • the magnetic sheet 30 , the first wiring 2 and the second wiring 3 are bonded together by the heat press machine 50 via the fluid flexible sheet 81 , the first resin sheet 25 and the second resin sheet 26 . heat press.
  • the hot press device 50 is, for example, an isostatic press capable of isotropically hot pressing (isostatic pressing) the magnetic sheet 30, the first wiring 2, and the second wiring 3 (see FIG. 5).
  • This hot press device 50 comprises a first mold 73 , a second mold 74 , an inner frame member 75 , an outer frame member 76 and a fluid flexible sheet 81 .
  • the hot press device 50 is configured so that the second mold 74, the inner frame member 75 and the outer frame member 76 can approach the first mold 73 and press (adhere). Note that the first die 73 is immovable in the pressing direction of the hot press device 50 .
  • the first mold 73 has a substantially plate shape.
  • the first die 73 has a first pressing surface 61 facing a second die 74 described below.
  • the first pressing surface 61 extends in a direction (surface direction) perpendicular to the pressing direction.
  • the first press surface 61 is flat.
  • the first mold 73 includes a heater (not shown).
  • the second die 74 is spaced apart from the first die 73 in the pressing direction.
  • the second die 74 is movable in the pressing direction with respect to the first die 73 .
  • the second mold 74 has a substantially plate shape smaller than the first mold 73 .
  • the second die 74 is included in the first die 73 when projected in the pressing direction.
  • the second die 74 overlaps the central portion of the first die 73 in the plane direction when projected in the pressing direction.
  • the second die 74 has a second pressing surface 62 facing the central portion of the first pressing surface 61 of the first die 73 in the plane direction.
  • the second press surface 62 extends in the planar direction.
  • the second pressing surface 62 is parallel to the first pressing surface 61 .
  • the second mold 74 also includes a heater (not shown).
  • the inner frame member 75 surrounds the second die 74 . Although not shown in detail, the inner frame member 75 surrounds the second die 74 entirely. In addition, the inner frame member 75 is spaced apart from the peripheral end portion of the first die 73 in the pressing direction. That is, the inner frame member 75 is opposed to the peripheral edge of the first mold 73 with a gap in the pressing direction.
  • the inner frame member 75 integrally has a third pressing surface 98 facing the peripheral end portion of the first pressing surface 61 and an inner side surface 99 facing inward.
  • the inner frame member 75 is movable in the pressing direction with respect to the first die 73 .
  • the inner frame member 75 is movable together with the second die 74 in the pressing direction.
  • the outer frame member 76 surrounds the inner frame member 75 . Although not shown in detail, the outer frame member 76 surrounds the inner frame member 75 entirely. Further, the outer frame member 76 is spaced apart from the peripheral end portion of the first die 73 in the pressing direction. That is, the outer frame member 76 is opposed to the peripheral edge of the first die 73 with a gap in the pressing direction.
  • the outer frame member 76 integrally has a contact surface 82 facing the peripheral end portion of the first pressing surface 61 and a chamber inner side surface 83 facing inward. The outer frame member 76 is movable in the pressing direction with respect to both the first die 73 and the inner frame member 75 .
  • the outer frame member 76 has an exhaust port 77 .
  • the exhaust port 77 faces the chamber inner side surface 83 at its upstream end in the exhaust direction.
  • the exhaust port 77 is connected to a vacuum pump 78 via an exhaust line 79 . Note that the exhaust line 79 is normally closed.
  • the fluid flexible sheet 81 is not provided in the press laminate 40 described later, but is provided in advance in the hot press device 50 .
  • a flowable flexible sheet 81 is placed on the second press surface 62 of the second die 74 .
  • the fluid flexible sheet 81 is also arranged on the inner side surface 99 of the inner frame member 75 . More specifically, the fluid flexible sheet 81 is in contact with the entire surface of the second pressing surface 62 and the downstream portion of the inner surface 99 in the pressing direction.
  • the inner frame member 75 is movable in the press direction with respect to the fluid flexible sheet 81 .
  • the hot press device 50 is described in detail, for example, in Japanese Unexamined Patent Application Publication No. 2004-296746.
  • a commercially available product can be used as the heat press device 50 .
  • As the hot press device 50 for example, a dry laminator series manufactured by Nikkiso Co., Ltd. is used.
  • a laminate 40 for pressing is prepared and set in a hot press device 50, as shown in FIG.
  • the press laminate 40 includes a first wiring 2 , a second wiring 3 , a magnetic sheet 30 , a first resin sheet 25 and a second resin sheet 26 .
  • the second resin sheet 26, the third sheet 33, the other first sheet 31, the first wirings 2 and the second wirings 3, and the one first sheet 31, the second sheet 32, and the first resin sheet 25 are arranged in order toward one side in the thickness direction.
  • the third sheet 33 and the other first sheet 31 are sequentially arranged on one side of the second resin sheet 26 in the thickness direction.
  • the first wirings 2 and the second wirings 3 are arranged on one side of the other first sheet 31 in the thickness direction.
  • one first sheet 31 and one second sheet 32 are arranged in order with respect to the first wiring 2 and the second wiring 3 .
  • the first resin sheet 25 is arranged on one side of the second sheet 32 in the thickness direction.
  • the laminated body 40 for pressing is prepared.
  • the prepared laminate 40 for pressing is set in the hot pressing device 50 .
  • the second resin sheet 26 is arranged on the first pressing surface 61 of the first die 73 .
  • the first resin sheet 25 in the press laminate 40 faces the fluid flexible sheet 81 .
  • the outer frame member 76 is brought into contact with the first mold 73 to form the reduced pressure space 85 .
  • the outer frame member 76 is pressed against the peripheral edge of the first pressing surface 61 of the first die 73 .
  • the contact surface 82 of the outer frame member 76 and the peripheral end portion of the first press surface 61 of the first die 73 are in close contact (preferably pressed) with each other.
  • a closed space 84 is thereby formed.
  • the closed space 84 is partitioned by the chamber inner side surface 83 of the outer frame member 76, the third pressing surface 98 of the inner frame member 75, the fluid flexible sheet 81, and the first pressing surface 61 of the first die 73. .
  • the pressure of the outer frame member 76 against the first mold 73 is set to such an extent that the tight contact between the contact surface 82 and the first press surface 61 can ensure the airtightness (not communicating with the outside) of the decompression space 85, which will be described later. Specifically, it is 0.1 MPa or more and 20 MPa or less.
  • a closed space 84 is thereby formed between the first mold 73 , the outer frame member 76 and the second mold 74 .
  • the closed space 84 is shielded from the outside. However, the exhaust line 79 can lead to the enclosed space 84 .
  • the first resin sheet 25 and the fluid flexible sheet 81 are still spaced apart in the pressing direction.
  • the sealed space 84 is decompressed to form a decompressed space 85 .
  • the vacuum pump 78 is driven, and then the exhaust line 79 is opened. As a result, the closed space 84 communicating with the exhaust port 77 is decompressed. As a result, the closed space 84 becomes the decompressed space 85 .
  • the upper limit of the difference obtained by subtracting the pressure of the pressure reduction space 85 (and the exhaust line 79) from the pressure of the environment where the hot press device 50 is installed is, for example, 1,000,000 Pa, and the lower limit of the difference is , for example 1 Pa.
  • the second mold 74 and the inner frame member 75 are brought closer to the first mold 73 to form the fluid flexible sheet 81, the first resin sheet 25 and the second resin sheet 26.
  • the magnetic sheet 30, the first wiring 2, and the second wiring 3 are hot-pressed via.
  • the second die 74 is moved in the pressing direction. Then, the fluid flexible sheet 81 approaches the first resin sheet 25 as the second mold 74 and the inner frame member 75 move. The inner frame member 75 interlocks with the second die 74 .
  • the fluid flexible sheet 81 flexibly comes into contact with all of the upstream side surface of the first resin sheet 25 in the press direction, except for the peripheral end portion. At this time, since the fluid flexible sheet 81 has fluidity and flexibility, it adheres along the shape of the first wiring 2 and the second wiring 3 together with the first resin sheet 25 . At this time, since the inner frame member 75 moves in conjunction with the second die 74 , part of the inner side surface 99 of the inner frame member 75 is in contact with the peripheral side surface of the fluid flexible sheet 81 . The third pressing surface 98 of the inner frame member 75 contacts the peripheral edge of the first pressing surface 61 of the first die 73 .
  • the second mold 74 is hot-pressed toward the first mold 73 .
  • the lower limit of the hot press pressure is, for example, 0.1 MPa, preferably 1 MPa, more preferably 2 MPa, and the upper limit is, for example, 30 MPa, preferably 20 MPa, more preferably 10 MPa.
  • the lower limit of the heating temperature is, for example, 100°C, preferably 110°C, more preferably 130°C, and the upper limit is, for example, 200°C, preferably 185°C, more preferably 175°C.
  • the lower limit of the heating time is, for example, 1 minute, preferably 5 minutes, more preferably 10 minutes, and the upper limit is, for example, 1 hour, preferably 30 minutes.
  • the magnetic sheet 30, the first wiring 2, and the second wiring 3 are pressed with equal pressure from both sides of the magnetic sheet 30 in the thickness direction and the surface direction. In short, the magnetic sheet 30, the first wiring 2 and the second wiring 3 are isostatically pressed.
  • the magnetic sheet 30 flows so as to embed the first wiring 2 and the second wiring 3 .
  • peripheral side surface of the magnetic sheet 30 is pressed from the side (outside) toward the inside by the fluid flexible sheet 81 . Therefore, the peripheral side surface of the magnetic sheet 30 is suppressed from flowing out.
  • the first resin sheet 25 is harder than the second resin sheet 26, but is supported by the fluid flexible sheet 81, which is flexible and fluid. Flexible support (contact).
  • the second resin sheet 26 is softer than the first resin sheet 25 , the first concave portion 9 of the inductor 1 can be supported (contacted) with the same degree of softness as the second resin sheet 26 .
  • an inductor 1 is manufactured with a first recess 9 and a second recess 12 having the above ratio.
  • the tensile storage modulus E′ at 170° C. of the laminated sheet 28 composed of the fluid flexible sheet 81 and the first resin sheet 25 is equal to the tensile storage modulus E′ of the second resin sheet 26 at 170° C.
  • the reaction force from the first wiring 2 and the second wiring 3 and the magnetic sheet 30 causes the laminated sheet 28 composed of the fluid flexible sheet 81 and the first resin sheet 25,
  • the same degree of stress deformation occurs in the second resin sheet 26, respectively.
  • the two sheet pressing surfaces 29A and 29B follow the shape of the magnetic sheet 30 and the first wiring 2 and the second wiring 3 to be pressed.
  • the ratio (L1/L2) of the depth L1 of one recess to the depth L2 of the second recess can be set within a predetermined range (specifically, 0.67 or more and 1.50 or less).
  • the above-described sheet pressing surface 29A in hot pressing is the other surface of the first resin sheet 25 in the thickness direction.
  • the above-described sheet pressing surface 29B in hot pressing is one surface of the second resin sheet 26 in the thickness direction.
  • the flow of the magnetic sheet 30 described above is due to the flow of the B-stage thermosetting resin and the flow of the thermoplastic resin blended as necessary based on the heating of the heaters of the first die 73 and the second die 74. to cause.
  • thermosetting resin to reach the C stage. That is, the magnetic layer 4 containing the magnetic particles and the hardened thermosetting resin (C stage) is formed.
  • the inductor 1 including the first wiring 2, the second wiring 3, and the magnetic layer 4 is manufactured.
  • the ratio (L1/L2) of the depth L1 of the first recess to the depth L2 of the second recess is 0.67 or more and 1.50 or less. Therefore, warping of the inductor 1 is suppressed. As a result, the inductor 1 can be reliably mounted on an external substrate (not shown). In addition, since warping of the inductor 1 is suppressed, an electronic element (not shown) can be mounted on the inductor 1 with certainty.
  • this inductor 1 is excellent in the precision of processing dimensions in the post-process and in the positional precision at the time of mounting.
  • the post-process includes, for example, a drilling process for providing alignment marks.
  • the depth of one recess relative to the depth L2 of the second recess can be 1.50 or less.
  • a plurality of magnetic sheets 30 are collectively heat-pressed.
  • the first sheet 31, the second sheet 32, and the third sheet 33 are each sequentially It can also be hot pressed.
  • Each of the first wiring 2 and the second wiring 3 can have, for example, a substantially polygonal cross-sectional shape, although not shown.
  • a polygonal shape includes a rectangular shape.
  • Examples of shapes of the first wiring 2 and the second wiring 3 include a spiral shape, a loop shape, a meandering shape, a U-shape, and a linear shape.
  • the number of wires may be 3 or more.
  • a release film can be arranged on the first press surface 61 of the first mold 73 and/or the other surface of the fluid flexible sheet 81 in the thickness direction.
  • a metal plate can also be arranged on the first pressing surface 61 of the first die 73 .
  • Materials for the metal plate include, for example, stainless steel, duralumin, and brass.
  • Preparation example 1 (Preparation of binder) 27 parts by mass of epoxy resin (main agent), 27 parts by mass of phenolic resin (curing agent), 1 part by mass of imidazole compound (curing accelerator), 44 parts by mass of acrylic resin (thermoplastic resin), and 1 part by mass of dispersant are mixed. , to prepare a binder. Details of each component described above are shown in Table 1.
  • Example 1 As shown in FIG. 5, first, a dry laminator (manufactured by Nikkiso Co., Ltd.) was prepared as the hot press device 50 described above.
  • the hot press device 50 was provided with ⁇ GEL (manufactured by Taica) as the flexible flexible sheet 81 .
  • the magnetic particles and the binder of Preparation Example 1 were compounded and mixed so as to have the volume ratios shown in Table 2, and the first sheet 31, the second sheet 32, and the third sheet 33 (the magnetic sheet 30 ) was made.
  • a laminate 40 for pressing was produced. Specifically, a second resin sheet 26 made of JRR120 (non-porous release film, product number: JRR120, material: special polyester, manufactured by Sekisui Chemical Co., Ltd.) having a thickness of 120 ⁇ m, four third sheets 33 and Two first sheets 31 were arranged. Next, the first wiring 2 and the second wiring 3 were arranged on the first sheet 31 . Each of the first wiring 2 and the second wiring 3 has a circular cross section and a diameter of 260 ⁇ m. After that, two more first sheets 31 and four second sheets 32 were arranged on one side of the thickness direction of the first wirings 2 and the second wirings 3 .
  • JRR120 non-porous release film, product number: JRR120, material: special polyester, manufactured by Sekisui Chemical Co., Ltd.
  • a first resin sheet 25 made of a 38 ⁇ m thick MRA film (polyethylene terephthalate, manufactured by Mitsubishi Chemical Corporation) was placed on the second sheet 32 .
  • a laminated body 40 for pressing was produced.
  • the produced laminate for pressing 40 was arranged in the first mold 73 .
  • the outer frame member 76 was brought into close contact with the first mold 73 to form a sealed space 84.
  • the vacuum pump 78 was driven to decompress the closed space 84 to form a decompressed space 85 .
  • the difference obtained by subtracting the atmospheric pressure in the reduced pressure space 85 from the atmospheric pressure in the environment where the hot press device 50 is installed was 101 kPa.
  • the second mold 74 and the inner frame member 75 are brought close to the first mold 73, and the magnetic material is formed through the fluid flexible sheet 81, the first resin sheet 25 and the second resin sheet 26.
  • the sheet 30, the first wiring 2 and the second wiring 3 were hot-pressed.
  • the hot press temperature is 170° C. and the time is 15 minutes.
  • the hot press pressure was 9.0 MPa.
  • the inductor 1 including the first wiring 2, the second wiring 3, and the magnetic layer 4 was manufactured.
  • Example 2 Inductor 1 was fabricated in the same manner as in Example 1. However, as the second resin sheet 26, a film (nonporous film) made of TPX with a thickness of 50 ⁇ m and a porous fluororesin film with a thickness of 1000 ⁇ m (FSB735N, manufactured by Maxell Kureha) were used. A non-porous film was brought into contact with the third sheet 33 .
  • Example 3 Inductor 1 was fabricated in the same manner as in Example 1. However, the thickness of the first resin sheet 25 was changed from 38 ⁇ m to 75 ⁇ m.
  • Example 4 Inductor 1 was fabricated in the same manner as in Example 1. However, the thickness of the first resin sheet 25 was changed from 38 ⁇ m to 150 ⁇ m.
  • Comparative example 1 Inductor 1 was fabricated in the same manner as in Example 1. However, as the second resin sheet 26, an OT film (soft film, polybutylene terephthalate, manufactured by Sekisui Chemical Co., Ltd.) with a thickness of 110 ⁇ m and a TPX film with a thickness of 50 ⁇ m were used. A film made of TPX was brought into contact with the third sheet 33 . As the first resin sheet 25, the OT film and the film made of TPX were used. A film made of TPX was brought into contact with the second sheet 32 .
  • OT film soft film, polybutylene terephthalate, manufactured by Sekisui Chemical Co., Ltd.
  • a sample 18 was produced by processing the inductor 1 to a size of 60 mm in length and 60 mm in width.
  • the sample 18 was placed on the horizontal table 19 such that the second major surface 6 of the sample 18 was in contact with the surface 20 of the horizontal table 19 .
  • a maximum length L3 and a minimum length L4 from the surface 20 of the horizontal base 19 to the first main surface 5 were determined in the central area 21 of the inductor 1 measuring 30 mm long and 30 mm wide.
  • the difference (L3-L4) between the longest height L3 and the shortest height L4 was obtained as warpage.
  • a shape measuring machine was used for the measurement. The equipment and conditions are shown below.
  • Example 1 and Comparative Example 1 both ends 13 of the sample 18 were curved such that they were arranged on the other side in the thickness direction with respect to the central area 21 .
  • Examples 2 to 4 as shown in FIG. 3B, both ends 13 of the sample 18 were curved so as to be arranged on one side of the central area 21 in the thickness direction.
  • the sheet had multiple layers, the lowest value among the multiple layers was obtained as the tensile storage modulus E'.
  • the tensile storage modulus E' of the porous fluororesin film was obtained.
  • the tensile storage modulus E' of the OT film was obtained.
  • Inductors are used in power supply circuits for electronic circuits that run on direct current.

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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
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PCT/JP2022/006068 2021-02-17 2022-02-16 インダクタおよびその製造方法 WO2022176879A1 (ja)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4537680B1 (enrdf_load_stackoverflow) * 1963-02-01 1970-11-28
JPH01146424U (enrdf_load_stackoverflow) * 1988-03-31 1989-10-09
WO2014132701A1 (ja) * 2013-02-26 2014-09-04 日東電工株式会社 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2020150059A (ja) * 2019-03-12 2020-09-17 日東電工株式会社 インダクタ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4537680B1 (enrdf_load_stackoverflow) * 1963-02-01 1970-11-28
JPH01146424U (enrdf_load_stackoverflow) * 1988-03-31 1989-10-09
WO2014132701A1 (ja) * 2013-02-26 2014-09-04 日東電工株式会社 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2020150059A (ja) * 2019-03-12 2020-09-17 日東電工株式会社 インダクタ

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