WO2022170785A1 - 液冷装置及设备 - Google Patents

液冷装置及设备 Download PDF

Info

Publication number
WO2022170785A1
WO2022170785A1 PCT/CN2021/125393 CN2021125393W WO2022170785A1 WO 2022170785 A1 WO2022170785 A1 WO 2022170785A1 CN 2021125393 W CN2021125393 W CN 2021125393W WO 2022170785 A1 WO2022170785 A1 WO 2022170785A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing
liquid cooling
cover plate
sealing cover
cooling device
Prior art date
Application number
PCT/CN2021/125393
Other languages
English (en)
French (fr)
Inventor
曲中江
郭广亮
薛冬锐
Original Assignee
华勤技术股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华勤技术股份有限公司 filed Critical 华勤技术股份有限公司
Priority to JP2023548279A priority Critical patent/JP2024506076A/ja
Priority to DE112021007051.7T priority patent/DE112021007051T5/de
Publication of WO2022170785A1 publication Critical patent/WO2022170785A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of heat dissipation of electronic equipment, for example, to a liquid cooling device and equipment.
  • the power consumption of electronic equipment is increasing. Due to the continuous increase of its single-chip power consumption, the current air cooling technology has reached the limit of heat dissipation, so it is necessary to develop a new generation of liquid cooling technology to solve the problem.
  • the heat dissipation problem of high-power chips For example, the CPU, the core component of electronic equipment, is mainly responsible for the operation and calculation of electronic equipment. The workload is large and it is easy to generate a lot of heat, which will slow down the running speed of electronic equipment, and even burn the CPU in severe cases. Therefore, heat dissipation is required.
  • the device cools and dissipates heat from the CPU of the electronic device. Most of the CPU radiators on the market are air-cooled.
  • the purpose of some embodiments of the present application is to provide a liquid cooling device and equipment, which have excellent sealing performance, eliminate the reliability problem caused by water leakage in the first sealing cavity, and improve the safety of the liquid cooling device.
  • An embodiment of the present application provides a liquid cooling device, including: a first sealing body, the first sealing body includes a cooling base plate, a first sealing cover plate and a first sealing tube; the cooling base plate is used for contacting a component to be radiated to cooling the device to be radiated; the first sealing cover plate is fixed on the cooling base plate, and forms a first sealing cavity together with the cooling base plate; the first sealing tube is fixed on the first sealing The cover plate is communicated with the first sealing cavity, the first sealing tube and the first sealing cavity together form a liquid cooling channel for conveying liquid cooling medium; a second sealing body, the second sealing The body includes a second sealing cover plate with a receiving space and a second sealing tube, the second sealing cover plate is fixed on the cooling base plate and covers the first sealing cover plate inside; the second sealing cover plate is The sealing tube is fixed on the second sealing cover plate, the second sealing cover plate and the second sealing tube together form a second sealing cavity, and the liquid cooling channel is located in the second sealing cavity.
  • An embodiment of the present application further provides a device, including an electronic device, and the above-mentioned liquid cooling device, where the liquid cooling device is configured to be in contact with the to-be-cooled device to cool the to-be-cooled device.
  • the first sealing body is provided to realize the heat dissipation and cooling of the components to be radiated and the self; Two sealed cavities, so that even if part of the liquid cooling medium leaks from the first sealed body, the liquid cooling medium will not come into contact with the components to be radiated or other electronic devices, but will be accommodated in the second sealed cavity, avoiding the need for components to be radiated.
  • the second sealing cover plate covers the first sealing cover plate, and the liquid cooling channel is located in the second sealing cavity , that is to say, no matter where the liquid leakage occurs in the first sealing body, the leaked liquid can be ensured to be contained in the second sealing cavity, so that the liquid cooling device has excellent sealing performance and further improves the performance of the liquid cooling device. safety.
  • the second sealing cover plate includes: an upper plate located on the side of the first sealing cover plate facing away from the cooling substrate, a side plate that together with the upper plate surrounds and forms the receiving space, an abutment plate that is bent and extended from the edge of the side plate away from the upper plate in a direction away from the first sealing cover plate; the liquid cooling device further includes an adhesive part, the abutment plate and the cooling base plate are connected via The adhesive part is fixedly connected.
  • the contact plate is provided with a first screw hole
  • the cooling base plate is provided with a second screw hole
  • the first screw hole is facing the second screw hole
  • the liquid cooling device further includes a screw , the screw is fixed in the first screw hole and the second screw hole.
  • the liquid cooling device further includes a liquid leakage sensor, the liquid leakage sensor is disposed in the second sealed cavity and located outside the liquid cooling channel, and the liquid leakage sensor is used for sensing the When there is liquid in the second sealed cavity, alarm information is sent. In this way, alarm information can be issued in time when the first sealing body leaks, thereby further improving the safety and reliability of the liquid cooling device.
  • the second sealing tube is provided with an opening, and the liquid leakage sensor protrudes out of the second sealing cavity through the opening portion to be connected with an external circuit board;
  • the liquid cooling device further includes a sealing part, the sealing part is used for sealing the opening.
  • the second sealing tube communicates with the accommodating space and has an opening that communicates with the outside world, and the liquid in the second sealed cavity is discharged to the outside world through the opening.
  • the second sealing pipe can be used as a drain pipe to discharge the liquid in the second sealing cavity, which improves the practicability of the liquid cooling device.
  • the second sealing tube is a first hose
  • the first hose and the second sealing cover plate are reinforced by a first predetermined method
  • the first predetermined method includes welding fixing and/or sealing fixed.
  • the second sealing tube is a hard tube
  • the hard tube and the second sealing cover plate are reinforced by a second preset method
  • the second preset method includes welding fixing, sealing part fixing, screw fixing or One or more of riveting and fixing.
  • the first sealing tube includes a joint and a second hose, one end of the joint is fixed on the first sealing cover plate, and the other end of the joint is provided with a limiting portion, and the second hose passes through
  • the limiting portion is fixedly connected with the joint; wherein, the limiting portion is a hollow cone extending from the end of the joint away from the first sealing cover plate and extending in a direction away from the first sealing cover plate
  • the size of the hollow conical protrusion close to the first sealing cover plate is larger than the size of the hollow conical protrusion away from the first sealing cover plate.
  • FIG. 1 is a schematic structural diagram of a liquid-cooled cold plate in the prior art
  • Fig. 2 is another kind of structural schematic diagram of the liquid-cooled cold plate in the prior art
  • FIG. 3 is a schematic structural diagram of a liquid cooling device provided according to the first embodiment of the present application.
  • FIG. 4 is another schematic structural diagram of the liquid cooling device provided according to the first embodiment of the present application.
  • FIG 5 is another schematic structural diagram of the liquid cooling device provided according to the first embodiment of the present application.
  • Fig. 6 is another structural schematic diagram of the liquid cooling device provided according to the first embodiment of the present application.
  • Fig. 7 is another structural schematic diagram of the liquid cooling device provided according to the first embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a limiting portion provided according to the first embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a liquid cooling device and a CPU chip provided according to the first embodiment of the present application.
  • FIG. 10 is a top view of a liquid cooling device and a plurality of CPU chips provided according to the first embodiment of the present application;
  • FIG. 11 is a schematic structural diagram of a liquid cooling device and a memory provided according to the first embodiment of the present application;
  • FIG. 12 is a schematic structural diagram of a memory and a part of the first sealing body provided according to the first embodiment of the present application.
  • the cold plate type liquid cooling device includes two parts: the cold plate and the pipeline.
  • the cold plate and the pipeline are assembled together by welding (hard pipe) or clamping (hose), and there is liquid (usually pure water) inside the cold plate.
  • welding hard pipe
  • clamping hose
  • liquid usually pure water
  • the reasons for the damage to electronic devices include: the liquid in the liquid cooling device will flow directly to the electronic device after leakage; the liquid cooling device has many locations where there is a risk of liquid leakage.
  • an embodiment of the present application provides a liquid cooling device.
  • the liquid cooling medium will not come into contact with the components to be cooled or other electronic devices even if a part of the liquid cooling medium leaks from the first sealing body. , but will be accommodated in the second sealing cavity; in addition, the second sealing cover plate covers the first sealing cover plate, and the liquid cooling channel is located in the second sealing cavity, no matter which position of the first sealing body occurs Liquid leakage can ensure that the leaked liquid is contained in the second sealing cavity, so that the liquid cooling device has excellent sealing performance and further improves the safety of the liquid cooling device.
  • the first embodiment of the present application relates to a liquid cooling device.
  • the specific structure is shown in FIG. 3 , including:
  • the first sealing body 1, the first sealing body 1 includes a cooling base plate 11, a first sealing cover plate 12 and a first sealing tube 13; the cooling base plate 11 is used for contacting the device to be radiated to cool the device to be radiated; the first sealing The cover plate 12 is fixed on the cooling base plate 11 and forms the first sealing cavity 10 together with the cooling base plate 11; the first sealing tube 13 is fixed on the first sealing cover plate 12 and communicates with the first sealing cavity 10, the first sealing The tube 13 and the first sealing cavity 10 together form a liquid cooling channel for conveying liquid cooling medium; the second sealing body 2, the second sealing body 2 includes a second sealing cover plate 21 and a second sealing tube 22, the second sealing cover The plate 21 is fixed on the cooling base plate 11 and covers the first sealing cover plate 12; the second sealing tube 22 is fixed on the second sealing cover plate 21, and the second sealing cover plate 21 and the second sealing tube 22 work together A second sealed cavity 20 is formed, and the liquid cooling channel is located in the second sealed cavity 20 .
  • the materials of the first sealing cover 12 and the second sealing cover 21 may be the same or different, for example, the first sealing cover 12 and the second sealing cover 21 are both plastic materials, or
  • the first sealing cover plate 12 is made of plastic material, and the second sealing cover plate 21 is made of metal material. This embodiment does not specifically limit the materials of the first sealing cover plate 12 and the second sealing cover plate 21 .
  • components to be radiated may refer to integrated circuit boards such as CPU and GPU in electronic devices, and electronic devices include but are not limited to IT products (such as servers, storage devices) and communication devices.
  • the liquid cooling channel described in this embodiment is located in the second sealing cavity 20 , which can be regarded as the second sealing cavity 20 surrounding the liquid cooling channel.
  • the first sealing body 1 is provided to realize heat dissipation and cooling of the components to be radiated and itself; 22 together form the second sealed cavity 20, so that even if part of the liquid cooling medium leaks from the first sealing body 1, the liquid cooling medium will not come into contact with the components to be radiated or other electronic devices, but will be accommodated in the second sealed cavity 20, the damage to the components to be radiated or other electronic components due to contact with the liquid cooling medium is avoided, and the safety of the liquid cooling device 100 is improved; in addition, the second sealing cover 21 covers the first sealing cover 12 inside.
  • the liquid cooling channel is located in the second sealing cavity 20, that is to say, no matter where the liquid leakage occurs in the first sealing body 1, the leaked liquid can be ensured to be contained in the second sealing cavity 20, so that the liquid cooling
  • the device 100 has excellent sealing performance, which further improves the safety of the liquid cooling device 100 .
  • the second sealing cover plate 21 includes: an upper plate 211 located on the side of the first sealing cover plate 12 facing away from the cooling substrate 11 , a side plate 212 that together with the upper plate 211 surrounds the receiving space 30 , and a self-side plate 212 .
  • 212 is an abutment plate 213 that is bent and extended away from the edge of the upper plate 211 in a direction away from the first sealing cover 12 ;
  • the liquid cooling device 100 further includes an adhesive part 3 , and the abutment plate 213 and the cooling substrate 11 pass through the adhesive part 3 Fixed connection.
  • this embodiment does not specifically limit the contact area between the second sealing cover plate 21 and the cooling substrate 11 , which can be set according to actual requirements.
  • the material of the adhesive part 3 in this embodiment is preferably pressure-sensitive adhesive, which is a type of adhesive that is sensitive to pressure.
  • pressure-sensitive adhesive adheresive tape and The peeling force exhibited by the adhesive surface after pressing and pasting
  • the cohesive force of the adhesive the force between the pressure-sensitive adhesive molecules
  • the adhesive base force of the adhesive the adhesion between the adhesive and the substrate
  • the contact plate 213 is provided with a first screw hole 2130
  • the cooling base plate 11 is provided with a second screw hole 110
  • the first screw hole 2130 is facing the second screw hole 110
  • the liquid cooling device 100 further includes screws (not shown in the figure), the screws are fixed in the first screw holes 2130 and the second screw holes 110 .
  • the number of screws shown in FIG. 3 is one. In practical applications, the number of screws may be multiple (such as two, three, four...), and multiple screws may be arranged at equal intervals in the around the side plate 212 to further improve the stability of the liquid cooling device 100 .
  • the liquid cooling device 100 further includes a liquid leakage sensor 5.
  • the liquid leakage sensor 5 is disposed in the second sealed cavity 20 and is located outside the liquid cooling channel.
  • the liquid leakage sensor 5 is used for sensing the second sealed cavity Send an alarm message when there is liquid in 20.
  • the liquid leakage sensor 5 in this embodiment is in the shape of a rope, and the rope-shaped liquid leakage sensor 5 can be arranged at any position in the second sealed cavity 20 and outside the liquid cooling channel.
  • the liquid leakage sensor 5 is wound around the Each connection of the first sealing body 1 ensures that when liquid leakage occurs at any position of the first sealing body 1, the liquid leakage sensor 5 can sense the liquid in time and issue an alarm message in time, thereby further improving the performance of the liquid cooling device 100. Safety and reliability.
  • the second sealing tube 22 shown in FIG. 6 is provided with an opening 220, and the liquid leakage sensor 5 partially protrudes out of the second sealing cavity 20 through the opening 220 to be connected with the external circuit board; the liquid cooling device 100 It also includes a sealing portion (not shown) for sealing the opening 220 .
  • a sealing portion (not shown) for sealing the opening 220 .
  • the materials of the sealing part and the adhesive part 3 in this embodiment can be the same or different, for example, the sealing part can be OCA glue, etc., and the materials of the sealing part and the adhesive part 3 are not specific in this embodiment. limited.
  • the sealing portion in this embodiment may be a sealant, a sealing ring, or other sealing structures. That is to say, this embodiment does not specifically limit the shape and structure of the sealing portion, which can be set according to actual needs, and it is only necessary to ensure that the leaked liquid does not flow out from the joint between the liquid leakage sensor 5 and the opening 220 . .
  • liquid leakage sensor plug of the liquid leakage sensor 5 can be directly used with the socket on the PCB circuit board, and no additional sockets need to be provided, so that the liquid leakage sensor 5 can work normally while reducing the liquid leakage as much as possible.
  • the space to be occupied by the cooling device 100 The space to be occupied by the cooling device 100 .
  • the second sealing tube 22 in this embodiment has an opening communicating with the outside world, and the liquid in the second sealing cavity 20 is discharged to the outside world through the opening.
  • the second sealed pipe 21 can be used as a drain pipe to discharge the liquid in the second sealed cavity 20 , thereby improving the practicability of the liquid cooling device 100 .
  • the second sealing tube 22 in this embodiment is a first hose
  • the first hose and the second sealing cover plate 21 are reinforced by a first preset method
  • the first preset method includes welding and/or fixing. or the sealing part is fixed.
  • the second sealing cover plate 21 and the second sealing tube 22 can be fixed more stably. It should be noted that by setting the second sealing tube as the first hose, since the hose has a certain tensile property, the opening of the second sealing tube 22 can be ensured to communicate with the outside world, thereby ensuring the liquid in the second sealing cavity 20 It can be discharged via the second sealing tube 22 .
  • the second sealing tube 22 in this embodiment is a hard tube, and the hard tube and the second sealing cover plate 21 are reinforced by a second preset method, and the second preset method includes welding fixing, sealing part fixing, screwing One or more of fixing or riveting.
  • the second sealing cover plate 21 and the second sealing tube 22 can be fixed more stably.
  • the material of the second sealing tube 22 and the material of the second sealing cover plate 21 may be the same or different.
  • the second sealing cover plate 21 is made of plastic material, and the second sealing tube 22 is made of metal material.
  • the first sealing tube 12 includes a joint 121 and a hose 122.
  • One end of the joint 121 is fixed on the first sealing cover 11, and the other end of the joint 121 is provided with a limiting portion 7.
  • the hose 122 is fixedly connected to the joint 121 via the limiting portion 7 .
  • the joint 121 shown in FIG. 7 includes a first joint 1211 and a second joint 1212; one end of the first joint 1211 is fixed on the first sealing cover plate 12 by welding or fixing by a sealing part, and the first joint
  • the other end of the 1211 is provided with a first threaded portion 1211A; one end of the second joint 1212 is provided with a second threaded portion 1212A that cooperates with the first threaded portion 1211A, and the other end of the second joint 1212 is provided with a limiting portion 1212B.
  • the threaded portion 1211A and the second threaded portion 1212A cooperate with each other to fix the first joint 1211 and the second joint 1212 to each other.
  • the combination between the first joint 1211 and the second joint 1212, the second joint 1212 and the hose 122 is more stable, and the liquid flowing in the liquid cooling channel is prevented from flowing from the first joint 1211 and the second joint 1211 and the second joint 1212.
  • the connection between the second joint 1212 , the second joint 1212 and the hose 122 leaks, thereby improving the safety of the liquid cooling device 100 .
  • the limiting portion 7 shown in FIG. 8 is a hollow conical protrusion extending from the end of the joint 121 away from the first sealing cover plate 12 and extending in a direction away from the first sealing cover plate 12;
  • the size of the first sealing cover plate 12 is larger than the size of the hollow conical protrusion away from the first sealing cover plate 12 .
  • the hollow conical protrusions in this embodiment can be hollow conical protrusions, and the hollow conical protrusions can make it easier for the hose 122 to be connected with the joint 121, thereby reducing the difficulty of manufacturing the liquid cooling device 100;
  • the hollow cone-shaped protrusion can also be a hollow pyramid-shaped protrusion.
  • the hollow pyramid-shaped protrusion can make it difficult for the hose 122 to be displaced relative to the connector 121 after the hose 122 is sleeved on the joint 121, which further prevents the hose 122 from falling off. , the reliability of the liquid cooling device 100 is improved.
  • the second sealing cover plate 21 is fixed to the cooling substrate 11 (the adhesive portion 3 is provided on the contact plate 213 and then fixed by screws).
  • the second joint 1212 is connected and fixed on the first joint 1211 (the first threaded portion 1211A and the second threaded portion 1212A cooperate with each other).
  • the second sealing tube 22 is connected to the second sealing cover plate 21 to complete the assembly of the liquid cooling device 100 .
  • the purpose of providing the first joint 1211 and the second joint 1212 in this embodiment is that the accommodation space of the second sealing cover plate 21 is relatively small, and setting the first joint 1211 too long will cause the second sealing
  • the installation difficulty of the cover plate 21 increases (the first joint 1211 is located in the receiving space to facilitate the installation of the second sealing cover plate 21), and the short setting of the first joint 1211 will lead to unstable fixing of the hose 122. Therefore, By additionally disposing the second joint 1212, one end of the second joint 1212 is tightly fixed with the first joint 1211 through the thread, and the other end of the second joint 1212 is tightly fixed with the hose 122 through the limiting part 7, so that the lowering of the liquid cooling device is realized. While the installation difficulty of 100 is reduced, the combination between the first joint 1211 and the second joint 1212 and the second joint 1212 and the hose 122 is more stable, and the safety of the liquid cooling device 100 is improved.
  • this embodiment does not specifically limit the number of the joints 121 , for example, only one joint may be provided, which may be set according to actual needs.
  • FIG. 9 is a schematic structural diagram of the liquid cooling device 100 installed on the CPU chip in this embodiment.
  • the CPU chip shown in FIG. 9 is arranged on the PCB circuit board, and the cooling substrate 11 is in contact with the side of the CPU chip away from the PCB circuit board.
  • the PCB circuit board is also provided with a PCB socket, and the plug of the liquid leakage sensor 5 can be matched with the PCB socket. use.
  • FIG. 10 shows a system layout diagram of the first sealing body and the second sealing body. It can be seen from Figure 10 that the second sealing body fully seals the position where there may be liquid leakage in the first sealing body. At the same time, the hose of the second sealing body extends to the outside of the chassis, and the hose of the second sealing body is in the chassis. The outer ends are open and thus act as drains.
  • a quick connector is installed at the end of the hose of the first sealing cavity, and the quick connector can be connected with a water storage device (not shown in the figure), so as to realize the circulating water flow in the liquid cooling channel.
  • FIG. 11 is a schematic structural diagram of the liquid cooling device 100 installed on the memory according to this embodiment.
  • the memory shown in Fig. 11 is arranged on the PCB circuit board, the thermal conductive pad is in contact with the side of the memory facing away from the PCB circuit board, the cooling substrate 11 is in contact with the side of the thermal conductive pad facing away from the memory, there is also a PCB socket on the PCB circuit board, and the liquid The plug of the leak sensor 5 can be used with the PCB socket.
  • FIG. 12 is a schematic structural diagram of the memory and part of the first sealing body.
  • the heat of the memory chip is transferred to the memory heat-conducting plate through the memory heat-conducting pad, and the memory heat-conducting plate transmits the heat to the cooling substrate 11 through the heat-conducting pad.
  • a second embodiment of the present application relates to a device, comprising: a component to be radiated, and the liquid cooling device in the above embodiments, the liquid cooling device being used for contacting the component to be radiated to cool the component to be radiated cool down.
  • the devices described in this embodiment include, but are not limited to, IT products (eg, servers, storage devices), communication devices, and electrical devices/electrical devices capable of using liquid cooling devices.
  • IT products eg, servers, storage devices
  • communication devices e.g., communication devices
  • electrical devices/electrical devices capable of using liquid cooling devices.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本申请实施例涉及电子设备散热技术领域，公开了一种液冷装置及设备，包括：冷却基板、第一密封盖板以及第一密封管；冷却基板用于与待散热器件接触、以对待散热器件进行冷却；第一密封盖板固定在冷却基板上、且与冷却基板共同形成第一密封腔；第一密封管固定在第一密封盖板上、且与第一密封腔连通，第一密封管与第一密封腔共同形成用于输送液冷介质的液冷通道；第二密封盖板固定在冷却基板上、并将第一密封盖板罩设在内；第二密封管固定在第二密封盖板上，第二密封盖板和第二密封管共同形成第二密封腔，液冷通道位于第二密封腔内。本申请提供的液冷装置具有优越的密封性能，消除了因第一密封腔漏水而带来的可靠性问题，提高了液冷装置的安全性。

Description

液冷装置及设备
交叉引用
本申请基于申请号为“202110181444X”、申请日为2021年02月09日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此以引入方式并入本申请。
技术领域
本申请涉及电子设备散热技术领域，例如涉及一种液冷装置及设备。
背景技术
目前，随着电子产品的飞速发展，电子设备的功耗越来越大，由于其单芯片功耗的不断增加，目前的风冷技术已到达散热极限，因此需要发展新一代液冷技术来解决大功耗芯片的散热问题。如电子设备中的核心部件CPU，它主要负责电子设备的运行计算，工作量大，很容易产生大量的热，这会使得电子设备的运行速度变慢，严重时甚至会烧毁CPU，因此需要散热器对电子设备的CPU进行冷却散热。现在市场上的CPU散热器大多数是风冷式，随着CPU功耗的不断增加，目前风冷技术已难以解决CPU散热问题，需要进一步发展液冷技术，如冷板式液冷技术，来应对大功耗CPU的散热。
然而，水冷式CPU冷板的水管接头处的密封性如果不够好，冷却液很容易在接头处泄漏，而且CPU冷板自身的焊缝或接缝也有液体泄漏的风险，而一旦冷却液泄漏，会毁灭性的损坏电子设备，极大增加使用者经济损失，不利于大量推广使用。因此，有必要提供一种新的液冷装置解决上述问题。
发明内容
本申请部分实施例的目的在于提供一种液冷装置及设备，其具有优越的密封性能，消除了因第一密封腔漏水而带来的可靠性问题，从而提高了液冷装置 的安全性。
本申请实施例提供一种液冷装置，包括：第一密封体，第一密封体包括冷却基板、第一密封盖板以及第一密封管；所述冷却基板用于与待散热器件接触、以对所述待散热器件进行冷却；所述第一密封盖板固定在所述冷却基板上、且与所述冷却基板共同形成第一密封腔；所述第一密封管固定在所述第一密封盖板上、且与所述第一密封腔连通，所述第一密封管与所述第一密封腔共同形成用于输送液冷介质的液冷通道；第二密封体，所述第二密封体包括具有收容空间的第二密封盖板以及第二密封管，所述第二密封盖板固定在所述冷却基板上、并将所述第一密封盖板罩设在内；所述第二密封管固定在所述第二密封盖板上，所述第二密封盖板和所述第二密封管共同形成第二密封腔，所述液冷通道位于所述第二密封腔内。
本申请实施例还提供了一种设备，包括电子器件，上述的液冷装置，所述液冷装置用于与所述待散热器件接触、以对所述待散热器件进行冷却。
本申请实施例相对于相关技术而言，通过设置第一密封体，以实现对待散热器件及自身的散热冷却；通过设置第二密封体，由于第二密封盖板和第二密封管共同形成第二密封腔，使得即使存在部分液冷介质从第一密封体内泄漏，液冷介质也不会与待散热器件或其他电子器件接触，而是会收容于第二密封腔内，避免了待散热器件或其他电子器件因与液冷介质接触而损坏，提高了液冷装置的安全性；此外，第二密封盖板将第一密封盖板罩设在内，且液冷通道位于第二密封腔内，也就是说，无论第一密封体的哪个位置发生液体泄漏，均能够确保泄漏出来的液体收容于第二密封腔内，从而使液冷装置具有优越的密封性能，进一步提高了液冷装置的安全性。
另外，所述第二密封盖板包括：位于所述第一密封盖板背离所述冷却基板一侧的上板、与所述上板共同围设形成所述收容空间的侧板、自所述侧板远离所述上板的边缘朝远离所述第一密封盖板的方向弯折延伸的抵接板；所述液冷装置还包括粘胶部，所述抵接板与所述冷却基板经由所述粘胶部固定连接。通过此种结构的设置，能够增大第二密封盖板与冷却基板的接触面积，从而使第二密封盖板能够稳定的固定在冷却基板上。
另外，所述抵接板上开设有第一螺孔，所述冷却基板上开设有第二螺孔， 所述第一螺孔正对所述第二螺孔；所述液冷装置还包括螺钉，所述螺钉固定于所述第一螺孔和所述第二螺孔内。通过此种结构的设置，能够使第二密封盖板和冷却基板之间的固定得更加牢固，从而进一步提高液冷装置的稳定性。
另外，所述液冷装置还包括液体泄漏传感器，所述液体泄漏传感器设置在所述第二密封腔内、且位于所述液冷通道外，所述液体泄漏传感器用于在感测到所述第二密封腔内存在液体时发送告警信息。通过此种方式，能够在第一密封体发生泄漏时及时发出告警信息，从而进一步提高液冷装置的安全性和可靠性。
另外，所述第二密封管上设有开孔，所述液体泄漏传感器经由所述开孔部分伸出所述第二密封腔外、以与外界的电路板连接；所述液冷装置还包括密封部，所述密封部用于密封所述开孔。通过设置密封部密封开孔，也就是说，密封部密封液体泄漏传感器与开孔之间的接缝，使得泄漏的液体不会从接缝中流出，进而进一步提高了液冷装置的安全性。
另外，所述第二密封管与所述收容空间连通、且具有与外界连通的开口，所述第二密封腔内的液体通过所述开口排放至外界。通过此种结构的设置，使得第二密封管可以作为排水管将第二密封腔内的液体排出，提高了液冷装置的实用性。
另外，所述第二密封管为第一软管，所述第一软管和所述第二密封盖板经由第一预设方式加固，所述第一预设方式包括焊接固定和/或密封部固定。通过此种结构的设置，能够使第二密封盖板和第二密封管之间固定得更加稳定。
另外，所述第二密封管为硬管，所述硬管和所述第二密封盖板经由第二预设方式加固，所述第二预设方式包括焊接固定、密封部固定、螺钉固定或铆接固定中的一种或几种。
另外，所述第一密封管包括接头以及第二软管，所述接头的一端固定在所述第一密封盖板上，所述接头的另一端设有限位部，所述第二软管经由所述限位部与所述接头固定连接；其中，所述限位部为自所述接头远离所述第一密封盖板的末端、朝远离所述第一密封盖板的方向延伸的中空锥形凸起；所述中空锥形凸起靠近所述第一密封盖板的尺寸大于所述中空锥形凸起远离所述第一密封盖板的尺寸。通过此种结构的设置，使得软管与接头结合得更加牢稳，避免 了软管脱落，提高了液冷装置的可靠性。
附图说明
图1是现有技术中的液冷冷板的结构示意图；
图2是现有技术中的液冷冷板的另一种结构示意图；
图3是根据本申请第一实施例提供的液冷装置的结构示意图；
图4是根据本申请第一实施例提供的液冷装置的另一种结构示意图；
图5是根据本申请第一实施例提供的液冷装置的又一种结构示意图；
图6是根据本申请第一实施例提供的液冷装置的再一种结构示意图；
图7是根据本申请第一实施例提供的液冷装置的还一种结构示意图；
图8是根据本申请第一实施例提供的限位部的结构示意图；
图9是根据本申请第一实施例提供的液冷装置与CPU芯片的结构示意图；
图10是根据本申请第一实施例提供的液冷装置与多个CPU芯片的俯视图；
图11是根据本申请第一实施例提供的液冷装置与内存的结构示意图；
图12是根据本申请第一实施例提供的内存与部分第一密封体的结构示意图。
具体实施方式
冷板式液冷装置包括冷板和管路两部分，冷板和管路通过焊接(硬管)或卡接(软管)的方式组装在一起，冷板内部有液体(一般为纯水)。目前主要有两种服务器液冷冷板的设计方案，然而均难以有效防止液体泄漏，因而难以保证电子器件不会损坏。
分析第一种服务器液冷冷板的设计方案：请参见图1，冷板底板与冷板上盖焊接，接头与冷板上盖焊接，软管套设在接头上。不难发现，在上述方案中，在冷板底板与冷板上盖的焊缝、接头与冷板上盖的焊缝以及软管与接头的连接处都存在漏液的风险，当漏液之后，液体会直接流到机箱内部的电子器件上，造成电子器件损坏。
分析第二种服务器液冷冷板的设计方案：请参见图2，冷板底板与冷板上盖通过O型圈密封，接头与冷板上盖焊接，软管套设在接头上。在上述方案中， 在冷板底板与冷板上盖的接缝、接头与冷板上盖的焊缝以及软管与接头的连接处都存在漏液的风险，当漏液之后，液体会直接流到机箱内部的电子器件上，造成电子器件损坏。
由上述分析可知，导致电子器件损坏的原因包括：液冷装置内的液体泄漏后会直接流到电子器件上；液冷装置中具有多处存在漏液风险的位置。
为此，本申请实施例提供一种液冷装置，通过设置第二密封体，使得即使存在部分液冷介质从第一密封体内泄漏，液冷介质也不会与待散热器件或其他电子器件接触，而是会收容于第二密封腔内；此外，第二密封盖板将第一密封盖板罩设在内，且液冷通道位于第二密封腔内，无论第一密封体的哪个位置发生液体泄漏，均能够确保泄漏出来的液体收容于第二密封腔内，从而使液冷装置具有优越的密封性能，进一步提高了液冷装置的安全性。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请的各实施例进行详细的阐述。然而，本领域的普通技术人员可以理解，在本申请各实施例中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以下各实施例的种种变化和修改，也可以实现本申请所要求保护的技术方案。
本申请的第一实施例涉及一种液冷装置，具体结构如图3所示，包括：
第一密封体1，第一密封体1包括冷却基板11、第一密封盖板12以及第一密封管13；冷却基板11用于与待散热器件接触、以对待散热器件进行冷却；第一密封盖板12固定在冷却基板11上、且与冷却基板11共同形成第一密封腔10；第一密封管13固定在第一密封盖板12上、且与第一密封腔10连通，第一密封管13与第一密封腔10共同形成用于输送液冷介质的液冷通道；第二密封体2，第二密封体2包括第二密封盖板21以及第二密封管22，第二密封盖板21固定在冷却基板11上、并将第一密封盖板12罩设在内；第二密封管22固定在第二密封盖板21上，第二密封盖板21和第二密封管22共同形成第二密封腔20，液冷通道位于第二密封腔20内。
具体的说，本实施例中第一密封盖板12和第二密封盖板21的材质可以相同，也可以不同，如第一密封盖板12和第二密封盖板21均为塑料材质，或第一密封盖板12为塑料材质、第二密封盖板21为金属材质，本实施例并不对第 一密封盖板12和第二密封盖板21的材质做具体限定。
需要说明的是，待散热器件可以是指电子设备中的CPU、GPU等集成电路板，电子设备包括但不限于IT产品(如服务器，存储设备)和通讯设备。
可以理解的是，本实施例描述的液冷通道位于第二密封腔20内，可以看做第二密封腔20包围液冷通道。
本申请实施例相对于相关技术而言，通过设置第一密封体1，以实现对待散热器件及自身的散热冷却；通过设置第二密封体2，由于第二密封盖板21和第二密封管22共同形成第二密封腔20，使得即使存在部分液冷介质从第一密封体1内泄漏，液冷介质也不会与待散热器件或其他电子器件接触，而是会收容于第二密封腔20内，避免了待散热器件或其他电子器件因与液冷介质接触而损坏，提高了液冷装置100的安全性；此外，第二密封盖板21将第一密封盖板12罩设在内，且液冷通道位于第二密封腔20内，也就是说，无论第一密封体1的哪个位置发生液体泄漏，均能够确保泄漏出来的液体收容于第二密封腔20内，从而使液冷装置100具有优越的密封性能，进一步提高了液冷装置100的安全性。
请参见图4，第二密封盖板21包括：位于第一密封盖板12背离冷却基板11一侧的上板211、与上板211共同围设形成收容空间30的侧板212、自侧板212远离上板211的边缘朝远离第一密封盖板12的方向弯折延伸的抵接板213；液冷装置100还包括粘胶部3，抵接板213与冷却基板11经由粘胶部3固定连接。通过此种结构的设置，能够增大第二密封盖板21与冷却基板11的接触面积，从而使第二密封盖板21能够稳定的固定在冷却基板11上。可以理解的是，本实施例并不对第二密封盖板21与冷却基板11的接触面积做具体限定，可以根据实际需求设置。
值得说明的是，本实施例中的粘胶部3的材质优选为压敏胶，压敏胶是一类具有对压力有敏感性的胶粘剂，一般压敏胶的剥离力(胶粘带与被粘表面加压粘贴后所表现的剥离力)<胶粘剂的内聚力(压敏胶分子之间的作用力)<胶粘剂的粘基力(胶粘剂与基材之间的附着力)，从而使压敏胶在使用过程中不会出现脱胶等现象。
请参见图5，抵接板213上开设有第一螺孔2130，冷却基板11上开设有第 二螺孔110，第一螺孔2130正对第二螺孔110；液冷装置100还包括螺钉(图未示出)，螺钉固定于第一螺孔2130和第二螺孔110内。通过此种结构的设置，能够使第二密封盖板21和冷却基板11之间的固定得更加牢固，从而进一步提高液冷装置100的稳定性。
需要说明的是，图3所示的螺钉为一个，在实际应用中，螺钉的数量可以为多个(如两个、三个、四个...)，且多个螺钉可等间隔设置在侧板212的周围，以进一步提高液冷装置100的稳定性。
请参见图6，液冷装置100还包括液体泄漏传感器5，液体泄漏传感器5设置在第二密封腔20内、且位于液冷通道外，液体泄漏传感器5用于在感测到第二密封腔20内存在液体时发送告警信息。
具体的说，本实施例中的液体泄漏传感器5呈绳状，绳状的液体泄漏传感器5可设置在第二密封腔20内、液冷通道外的任意位置，如将液体泄漏传感器5缠绕在第一密封体1的各个连接处，以确保第一密封体1的任意位置发生液体泄漏时，液体泄漏传感器5均能及时感测到液体并及时发出告警信息，从而进一步提高液冷装置100的安全性和可靠性。
进一步的，图6所示的第二密封管22上设有开孔220，液体泄漏传感器5经由开孔220部分伸出第二密封腔20外、以与外界的电路板连接；液冷装置100还包括密封部(图未示出)，密封部用于密封开孔220。可以理解的是，液体泄漏传感器5穿过开孔220后，液体泄漏传感器5与开孔220之间可能存在接缝，导致泄漏的液体从接缝中流出，进而导致待散热器件因与液体接触而损坏。通过设置密封部密封开孔220，也就是说，密封部密封液体泄漏传感器5与开孔220之间的接缝，使得泄漏的液体不会从接缝中流出，进而进一步提高了液冷装置100的安全性。
需要注意的是，本实施例中密封部和粘胶部3的材质可以相同，也可以不同，如密封部可以为OCA胶等，本实施例并不对密封部和粘胶部3的材质做具体限定。
还需说明的是，本实施例中的密封部可以为密封胶，也可以为密封圈，还可以为其他密封结构。也就是说，本实施例并不对密封部的形状结构做具体限定，可以根据实际需求设置，仅需确保泄漏的液体不会从液体泄漏传感器5与 开孔220之间的接缝中流出即可。
值得一提的是，液体泄漏传感器5的液体泄漏传感器插头可以直接与PCB线路板上的插座配合使用，无需设置额外的插座，从而在实现液体泄漏传感器5的正常工作的同时，尽可能降低液冷装置100的需占用的空间。
请一并参见图3至图6，本实施例中的第二密封管22具有与外界连通的开口，第二密封腔20内的液体通过开口排放至外界。通过此种结构的设置，使得第二密封管21可以作为排水管将第二密封腔20内的液体排出，提高了液冷装置100的实用性。
优选地，本实施例中的第二密封管22为第一软管，第一软管和第二密封盖板21经由第一预设方式加固，所述第一预设方式包括焊接固定和/或密封部固定。通过此种结构的设置，能够使第二密封盖板21和第二密封管22之间固定得更加稳定。需要说明的是，通过设置第二密封管为第一软管，由于软管具有一定的拉伸性能，能够确保第二密封管22的开口与外界连通，从而确保第二密封腔20内的液体能够经由第二密封管22排出。
优选地，本实施例中的第二密封管22为硬管，硬管和第二密封盖板21经由第二预设方式加固，所述第二预设方式包括焊接固定、密封部固定、螺钉固定或铆接固定中的一种或几种。通过此种结构的设置，能够使第二密封盖板21和第二密封管22之间固定得更加稳定。需要说明的是，第二密封管22的材质与第二密封盖板21的材质可以相同，也可以不同，如第二密封管22与第二密封盖板21均为塑料材质，也可以是第二密封盖板21为塑料材质、第二密封管22为金属材质，通过设置第二密封管22为硬管，能够增强第二密封盖板21和第二密封管22的结合强度，进一步提高液冷装置100的稳定性。
请一并参见图7至图8，第一密封管12包括接头121以及软管122，接头121的一端固定在第一密封盖板11上，接头121的另一端设有限位部7，软管122经由限位部7与接头121固定连接。
具体的说，图7所示的接头121包括第一接头1211和第二接头1212；第一接头1211的一端经由焊接固定或者密封部固定的方式固定在第一密封盖板12上，第一接头1211的另一端设有第一螺纹部1211A；第二接头1212的一端设有与第一螺纹部1211A相互配合的第二螺纹部1212A，第二接头1212的另 一端设有限位部1212B，第一螺纹部1211A和第二螺纹部1212A相互配合以使第一接头1211和第二接头1212相互固定。通过此种结构的设置，使得第一接头1211和第二接头1212、第二接头1212和软管122之间结合的更加稳定，避免了在液冷通道内流动的液体从第一接头1211和第二接头1212、第二接头1212和软管122的连接处泄漏，从而提高了液冷装置100的安全性。
进一步的，图8所示的限位部7为自接头121远离第一密封盖板12的末端、朝远离第一密封盖板12的方向延伸的中空锥形凸起；中空锥形凸起靠近第一密封盖板12的尺寸大于中空锥形凸起远离第一密封12盖板的尺寸。通过此种结构的设置，使得软管122与接头121结合得更加牢稳，避免了软管122脱落，提高了液冷装置100的可靠性。
值得说明的是，本实施例中的中空锥形凸起可以为中空圆锥形凸起，中空圆锥形凸起能够使软管122更易于与接头121连接，降低了液冷装置100的制作难度；中空锥形凸起也可以为中空棱锥形凸起，中空棱锥形凸起能够使软管122套设在接头121上后，软管122难以与接头121发生相对位移，进一步避免了软管122脱落，提高了液冷装置100的可靠性。
为了便于理解，下面对本实施例的液冷装置100的装配过程进行详细的说明：
将第一密封盖板12焊接在冷却基板11上，再将第一接头1211焊接到第一密封盖板12上(第一接头1211远离第一密封盖板12的一端设有第一螺纹部1211A)。
将第二密封盖板21固定在冷却基板11上(在抵接板213上设置粘胶部3后打螺钉固定)。
将第二接头1212连接固定在第一接头1211上(通过第一螺纹部1211A和第二螺纹部1212A相互配合)。
将软管122连接在第二接头1212上。
将第二密封管22连接到第二密封盖板21上，完成液冷装置100的装配。
值得一提的是，本实施例设置第一接头1211和第二接头1212的目的是：第二密封盖板21的收容空间相对较小，将第一接头1211设置得过长会导致第二密封盖板21的安装难度增加(第一接头1211位于收容空间内才便于第二密 封盖板21的安装)，而第一接头1211设置的较短会导致软管122的固定不牢稳，因此，通过额外设置第二接头1212，第二接头1212的一端通过螺纹与第一接头1211紧密固定，第二接头1212的另一端通过限位部7与软管122紧密固定，实现了在降低液冷装置100的安装难度的同时，使得第一接头1211和第二接头1212、第二接头1212和软管122之间结合的更加稳定，提高了液冷装置100的安全性。
需要说明的是，本实施例并不对接头121的数量做具体限定，如也可以只设置一个接头，可以根据实际需求设置。
请参见图9，为本实施例液冷装置100安装在CPU芯片上的结构示意图。图9所示的CPU芯片设置在PCB线路板上，冷却基板11与CPU芯片背离PCB线路板的一侧接触，PCB线路板上还设有PCB插座，液体泄漏传感器5的插头可与PCB插座配合使用。
请参见图10，对于配置2个CPU芯片的服务器系统，图10给出了第一密封体与第二密封体的系统布局图。从图10可以看到，第二密封体将第一密封体中可能有液体泄漏的位置进行了充分的密封，同时第二密封体的软管延伸到了机箱外面，第二密封体软管在机箱外面的末端是开口的，因而可作为排水口。第一密封腔体的软管末端安装有快接头，快接头可与储水装置(图未示出)连接，以实现液冷通道内的循环水流动。
请参见图11，为本实施例液冷装置100安装在内存上的结构示意图。图11所示的内存设置在PCB线路板上，导热垫与内存背离PCB线路板的一侧接触，冷却基板11与导热垫背离内存的一侧接触，PCB线路板上还设有PCB插座，液体泄漏传感器5的插头可与PCB插座配合使用。
请进一步参见图12，为内存及部分第一密封体的结构示意图。内存芯片热量通过内存导热垫传递到内存导热板，内存导热板再通过导热垫将热量传递到冷却基板11。
本申请的第二实施例涉及一种设备，包括：待散热器件，上述实施例中的液冷装置，所述液冷装置用于与所述待散热器件接触、以对所述待散热器件进行冷却。
可以理解的是，本实施例所述的设备包括但不限于IT产品(如服务器，存储设备)、通讯设备以及能够使用液冷装置的电气设备/电力设备。
本领域的普通技术人员可以理解，上述各实施例是实现本申请的具体实施例，而在实际应用中，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。

Claims (10)

  1. 一种液冷装置，包括：
    第一密封体，第一密封体包括冷却基板、第一密封盖板以及第一密封管；所述冷却基板用于与待散热器件接触、以对所述待散热器件进行冷却；所述第一密封盖板固定在所述冷却基板上、且与所述冷却基板共同形成第一密封腔；所述第一密封管固定在所述第一密封盖板上、且与所述第一密封腔连通，所述第一密封管与所述第一密封腔共同形成用于输送液冷介质的液冷通道；
    第二密封体，所述第二密封体包括具有收容空间的第二密封盖板以及第二密封管，所述第二密封盖板固定在所述冷却基板上、并将所述第一密封盖板罩设在内；所述第二密封管固定在所述第二密封盖板上，所述第二密封盖板和所述第二密封管共同形成第二密封腔，所述液冷通道位于所述第二密封腔内。
  2. 根据权利要求1所述的液冷装置，其中，所述第二密封盖板包括：位于所述第一密封盖板背离所述冷却基板一侧的上板、与所述上板共同围设形成所述收容空间的侧板、自所述侧板远离所述上板的边缘朝远离所述第一密封盖板的方向弯折延伸的抵接板；
    所述液冷装置还包括粘胶部，所述抵接板与所述冷却基板经由所述粘胶部固定连接。
  3. 根据权利要求2所述的液冷装置，其中，所述抵接板上开设有第一螺孔，所述冷却基板上开设有第二螺孔，所述第一螺孔正对所述第二螺孔；
    所述液冷装置还包括螺钉，所述螺钉固定于所述第一螺孔和所述第二螺孔内。
  4. 根据权利要求1所述的液冷装置，其中，所述液冷装置还包括液体泄漏传感器，所述液体泄漏传感器设置在所述第二密封腔内、且位于所述液冷通道外，所述液体泄漏传感器用于在感测到所述第二密封腔内存在液体时发送告警信息。
  5. 根据权利要求4所述的液冷装置，其中，所述第二密封管上设有开孔，所述液体泄漏传感器经由所述开孔部分伸出所述第二密封腔外、以与外界的电路板连接；
    所述液冷装置还包括密封部，所述密封部用于密封所述开孔。
  6. 根据权利要求1至5任一项所述的液冷装置，其中，所述第二密封管与所述收容空间连通、且具有与外界连通的开口，所述第二密封腔内的液体通过所述开口排放至外界。
  7. 根据权利要求1至5任一项所述的液冷装置，其中，所述第二密封管为第一软管，所述第一软管和所述第二密封盖板经由第一预设方式加固，所述第一预设方式包括焊接固定和/或密封部固定。
  8. 根据权利要求1至5任一项所述的液冷装置，其中，所述第二密封管为硬管，所述硬管和所述第二密封盖板经由第二预设方式加固，所述第二预设方式包括焊接固定、密封部固定、螺钉固定或铆接固定中的一种或几种。
  9. 根据权利要求1所述的液冷装置，其中，所述第一密封管包括接头以及第二软管，所述接头的一端固定在所述第一密封盖板上，所述接头的另一端设有限位部，所述第二软管经由所述限位部与所述接头固定连接；
    其中，所述限位部为自所述接头远离所述第一密封盖板的末端、朝远离所述第一密封盖板的方向延伸的中空锥形凸起；所述中空锥形凸起靠近所述第一密封盖板的尺寸大于所述中空锥形凸起远离所述第一密封盖板的尺寸。
  10. 一种设备，包括：待散热器件，上述权利要求1至9中任一项所述的液冷装置，所述液冷装置用于与所述待散热器件接触、以对所述待散热器件进行冷却。
PCT/CN2021/125393 2021-02-09 2021-10-21 液冷装置及设备 WO2022170785A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023548279A JP2024506076A (ja) 2021-02-09 2021-10-21 液冷装置及び機器
DE112021007051.7T DE112021007051T5 (de) 2021-02-09 2021-10-21 Flüssigkeitskühleinrichtung und Vorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110181444.X 2021-02-09
CN202110181444.XA CN112860042A (zh) 2021-02-09 2021-02-09 液冷装置及设备

Publications (1)

Publication Number Publication Date
WO2022170785A1 true WO2022170785A1 (zh) 2022-08-18

Family

ID=75989580

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/125393 WO2022170785A1 (zh) 2021-02-09 2021-10-21 液冷装置及设备

Country Status (4)

Country Link
JP (1) JP2024506076A (zh)
CN (1) CN112860042A (zh)
DE (1) DE112021007051T5 (zh)
WO (1) WO2022170785A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112860042A (zh) * 2021-02-09 2021-05-28 华勤技术股份有限公司 液冷装置及设备
CN113641231A (zh) * 2021-08-17 2021-11-12 南昌华勤电子科技有限公司 一种冷板装置及一种服务器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658121A (zh) * 2004-02-16 2005-08-24 株式会社日立制作所 具有液冷系统的电子设备及其散热器和散热器的制造方法
JP2011075088A (ja) * 2009-10-02 2011-04-14 Fujitsu Ltd 管継手液漏れ防止構造及び管継手液漏れ防止構造を備えた電子機器
CN102317027A (zh) * 2009-02-23 2012-01-11 日本轻金属株式会社 液冷套的制造方法
US20130277008A1 (en) * 2012-04-19 2013-10-24 Hitachi, Ltd. Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system
CN111595536A (zh) * 2020-06-28 2020-08-28 中国工商银行股份有限公司 漏液检测装置、漏液处理设备、液冷系统和漏液处理方法
CN112860042A (zh) * 2021-02-09 2021-05-28 华勤技术股份有限公司 液冷装置及设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658121A (zh) * 2004-02-16 2005-08-24 株式会社日立制作所 具有液冷系统的电子设备及其散热器和散热器的制造方法
CN102317027A (zh) * 2009-02-23 2012-01-11 日本轻金属株式会社 液冷套的制造方法
JP2011075088A (ja) * 2009-10-02 2011-04-14 Fujitsu Ltd 管継手液漏れ防止構造及び管継手液漏れ防止構造を備えた電子機器
US20130277008A1 (en) * 2012-04-19 2013-10-24 Hitachi, Ltd. Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system
CN111595536A (zh) * 2020-06-28 2020-08-28 中国工商银行股份有限公司 漏液检测装置、漏液处理设备、液冷系统和漏液处理方法
CN112860042A (zh) * 2021-02-09 2021-05-28 华勤技术股份有限公司 液冷装置及设备

Also Published As

Publication number Publication date
JP2024506076A (ja) 2024-02-08
DE112021007051T5 (de) 2023-12-28
CN112860042A (zh) 2021-05-28

Similar Documents

Publication Publication Date Title
WO2022170785A1 (zh) 液冷装置及设备
US7142425B2 (en) Liquid cooling system including a liquid absorption and a leak detection device
TWI725422B (zh) 液冷導熱裝置、液冷循環系統以及漏液偵測方法
US7133284B2 (en) Power supply without cooling fan
US20070034355A1 (en) Heat-dissipation structure and method thereof
US6560104B2 (en) Portable computer and docking station cooling
WO2019001585A9 (zh) 电加热器
CN110459512A (zh) 散热主板及光模块
CN213579962U (zh) 测漏系统
US20100290189A1 (en) Heat dissipation structure for communication chassis
JP2006053914A (ja) 電子機器
US20190223325A1 (en) Optical module
CN104244682B (zh) 一种适用于雷达天线的液冷插箱
CN214623562U (zh) 液冷装置及设备
JP2007324544A (ja) 積層型半導体パッケージ
US7631686B2 (en) Liquid cooling device
CN216626417U (zh) 一种台区终端用一体式散热器
US7954541B2 (en) Heat dissipation module
US9648783B1 (en) Enhanced heat dissipation module having multi-layer heat isolation
CN211297488U (zh) 一种电子元件的散热结构
CN205611146U (zh) 一种用于变流器的散热器装置
US20060215366A1 (en) Apparatus, system, and method for removing excess heat from a component
CN110739282A (zh) 功率器件封装结构及模块电源
JP2000252657A (ja) 制御機器の放熱装置
JP2006245114A (ja) 冷却部材

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21925432

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023548279

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 112021007051

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21925432

Country of ref document: EP

Kind code of ref document: A1