WO2022166406A1 - 电镀装置及电镀方法 - Google Patents

电镀装置及电镀方法 Download PDF

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Publication number
WO2022166406A1
WO2022166406A1 PCT/CN2021/137466 CN2021137466W WO2022166406A1 WO 2022166406 A1 WO2022166406 A1 WO 2022166406A1 CN 2021137466 W CN2021137466 W CN 2021137466W WO 2022166406 A1 WO2022166406 A1 WO 2022166406A1
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WIPO (PCT)
Prior art keywords
coordinate
move
blades
electroplating
origin
Prior art date
Application number
PCT/CN2021/137466
Other languages
English (en)
French (fr)
Inventor
王晖
王坚
贾照伟
杨宏超
蔡军
陆陈华
李佳奇
吴勐
Original Assignee
盛美半导体设备(上海)股份有限公司
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Application filed by 盛美半导体设备(上海)股份有限公司 filed Critical 盛美半导体设备(上海)股份有限公司
Priority to JP2023547417A priority Critical patent/JP2024505683A/ja
Priority to US18/264,378 priority patent/US20240044038A1/en
Priority to KR1020237029986A priority patent/KR20230138010A/ko
Publication of WO2022166406A1 publication Critical patent/WO2022166406A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
    • H01L2224/1146—Plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7515—Means for applying permanent coating, e.g. in-situ coating
    • H01L2224/7518—Means for blanket deposition
    • H01L2224/75189—Means for plating, e.g. for electroplating, electroless plating

Definitions

  • the invention relates to the field of semiconductor equipment, in particular to an electroplating device and an electroplating method.
  • Electroplating is the primary process for completing copper interconnects.
  • horizontal spray cup plating and vertical rack plating.
  • Vertical rack plating is to immerse the wafer vertically in the plating solution, and one plating tank can perform multiple plating at the same time.
  • Cup plating is to cover the wafers in a cup-shaped plating tank, and the plating is performed in a cup-by-cup.
  • rack plating the process of cup plating is more controllable and can meet the needs of more complex and diverse products.
  • the chip area increases, and the number of bumps in the chip increases sharply. There are even tens of thousands or even more than 100,000 bumps in a chip.
  • the electroplating process has higher and higher requirements on the electroplating rate and output.
  • In-chip uniformity in the packaging area is also required to be higher.
  • intra-chip uniformity that is, the coplanarity of the bumps, is difficult to achieve without strong stirring.
  • the height of copper pillars can reach 250um, which puts forward higher requirements for quality transmission during the electroplating process.
  • the ordinary stirring quality transmission is not strong enough to meet the production capacity and quality requirements.
  • a paddle assembly can be installed in the electroplating device.
  • the paddle assembly includes a plurality of paddles parallel to the surface of the substrate.
  • the paddles reciprocate to stir the electroplating solution and fully mix the metal ions and electroplating.
  • the liquid additive is supplied to the surface of the substrate.
  • the purpose of the present invention is to provide an electroplating device and an electroplating method in view of the above technical problems, so as to improve the uniformity of electroplating height on the substrate.
  • an embodiment of the present invention proposes an electroplating device, the electroplating device includes a plurality of paddles arranged in parallel, the paddles move parallel to the substrate to stir the electroplating solution, and the electroplating device also It includes a controller and a driving mechanism, the driving mechanism is respectively connected with the controller and the blade, and the controller makes the blade perform periodic motion by controlling the driving mechanism so that each point on the base plate is accumulated by the blade. time equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • the electroplating device includes a plurality of paddles arranged in parallel, the paddles move parallel to the substrate to stir the electroplating solution, the electroplating device further includes a controller and a driving mechanism, the driving mechanism is respectively connected with the controller and the blade, and the controller makes the blade perform periodic motion by controlling the driving mechanism, so that the cumulative time of each point on the substrate being blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • the electroplating device includes a plurality of paddles arranged in parallel, the paddles move parallel to the substrate to stir the electroplating solution, the electroplating device further includes a controller and a driving mechanism, the driving mechanism is respectively connected with the controller and the blade, and the controller makes the blade perform periodic motion by controlling the driving mechanism, so that the cumulative time of each point on the substrate being blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • y x*(N+1)
  • N is a non-integer greater than 1
  • the value of x makes x*N an integer.
  • the electroplating device includes a plurality of paddles arranged in parallel, the paddles move parallel to the substrate to stir the electroplating solution, the electroplating device further includes a controller and a driving mechanism, the driving mechanism is respectively connected with the controller and the blade, and the controller makes the blade perform periodic motion by controlling the driving mechanism, so that the cumulative time of each point on the substrate being blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • y x*(N+1)
  • N is a non-integer greater than 1
  • the value of x makes x*N an integer.
  • An embodiment of the present invention provides an electroplating method, which includes: disposing a plurality of paddles arranged in parallel, the paddles move parallel to the substrate, agitating the electroplating solution, and controlling the movement of the paddles to make the paddles move parallel to the substrate.
  • the accumulated time for each corresponding point to be blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • Another embodiment of the present invention provides an electroplating method, which includes: disposing a plurality of paddles arranged in parallel, the paddles move parallel to the substrate, stirring the electroplating solution, and controlling the movement of the paddles to make the substrate The accumulated time for each point corresponding to the upper part to be blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • Another embodiment of the present invention provides an electroplating method, the electroplating method includes: disposing a plurality of paddles arranged in parallel, the paddles moving parallel to the substrate, stirring the electroplating solution, and controlling the movement of the paddles to make The cumulative time of each point on the substrate being blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • y x*(N+1)
  • N is a non-integer greater than 1
  • the value of x makes x*N an integer.
  • Yet another embodiment of the present invention provides an electroplating method, which includes: disposing a plurality of paddles arranged in parallel, the paddles move parallel to the substrate, stirring the electroplating solution, and controlling the movement of the paddles to make the substrate The accumulated time for each point corresponding to the upper part to be blocked by the blade is equal;
  • the movement steps of the blades are:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • y x*(N+1)
  • N is a non-integer greater than 1
  • the value of x makes x*N an integer.
  • the invention makes the time when each corresponding point on the substrate is blocked by the paddle is equal, and the received electricity is equal, thereby improving the consistency of the electroplating height.
  • FIG. 1 illustrates a schematic structural diagram of the electroplating apparatus in Example 1.
  • FIG. 2 illustrates a top view of the paddle plate in Embodiment 1.
  • FIG. 3A illustrates a cross-sectional view of the paddle plate in Embodiment 1.
  • FIG. 3B is an enlarged view of part D in FIG. 3A .
  • FIG. 4 illustrates a dimensional drawing of the blade in Embodiment 1.
  • FIG. 5 illustrates the position change of the paddle in Example 1 within one cycle.
  • FIG. 6 illustrates a dimensional drawing of the blade in Embodiment 2.
  • FIG. 7 illustrates the position change of the paddle in Example 2 within one cycle.
  • FIG. 8 illustrates a dimensional drawing of the blade in Embodiment 3.
  • FIG. 9 illustrates the position change of the paddle in Example 3 within one cycle.
  • FIG. 10 illustrates one way in which the position of the paddles in Example 4 varies within one cycle.
  • FIG. 11 illustrates a dimensional drawing of the blade in Embodiment 5.
  • FIG. 12 illustrates the position change of the blade in one cycle in Example 5.
  • FIG. 13 illustrates a schematic structural diagram of the electroplating apparatus in Example 7.
  • Fig. 14 illustrates a graph comparing the plating result curves of the electroplating apparatus with the diffuser plate and the electroplating apparatus without the diffuser plate in Example 7.
  • FIG. 15 illustrates a schematic diagram of the coordinate positions of the blades in Embodiment 8.
  • FIG. 16 illustrates a structural diagram of the connection between the paddle board and the guide rail in the ninth embodiment.
  • FIG. 17 illustrates the nitrogen protection box used to surround the eccentric bearing and the guide rail in Example 9.
  • FIG. 18 illustrates a schematic structural diagram of the paddle board in Embodiment 10.
  • FIG. 19A illustrates an electroplating effect diagram using a conventional electroplating apparatus.
  • FIG. 19B illustrates the electroplating effect diagram of the electroplating apparatus of the present invention.
  • FIG. 19C illustrates a comparison chart of the plating height data of the test points on the substrate when the conventional electroplating apparatus and the electroplating apparatus of the present invention are used.
  • a paddle in order to strengthen the stirring of the electroplating solution, a paddle can be installed at a position opposite to the substrate. During electroplating, the paddle reciprocates in a direction parallel to the substrate to enhance the stirring of the electroplating solution. Since the propeller itself blocks the electric field, the electric field can only pass through the gap between the propeller and the propeller. Therefore, the area on the substrate facing the propeller will have a "shadow", that is, the ratio of the amount of electricity received at the "shadow" Less power is received in places that are not “shaded”. If each point on the substrate is affected by the "shadow" to a different degree, and the amount of electricity received by each point is not equal, the plating height of the entire substrate will not be uniform.
  • the present invention aims to eliminate the effect of "shadow” and make the plating height of each point on the substrate uniform.
  • this embodiment discloses an electroplating apparatus, which includes an electroplating tank 101 , a substrate holder 102 and a plurality of strip-shaped paddles 103 arranged in parallel.
  • the substrate holder 102 is used for holding the substrate 104
  • the paddle 103 is located between the substrate 104 and the electrodes and is parallel to the substrate 104 .
  • the driving mechanism 105 may be a motor.
  • the direction of movement of the paddle 103 may be further limited by the guide rails 109 connected thereto.
  • the driving mechanism 105 is connected with a controller 106 , and the controller 106 controls the action of the driving mechanism 105 through a program, thereby controlling the movement of the paddle 103 .
  • the paddle 103 is formed by opening a bar-shaped through hole on a paddle plate 108 .
  • the paddle plate 108 is made of an insulator, such as PVC, PC, CPVC, PPS, PEEK, PTFE and other plastic materials.
  • strip-shaped through holes arranged parallel to each other are processed on the circular area in the middle of the paddle plate 108 , the through holes allow the liquid and the electric field to pass through, and the solid parts between adjacent through holes constitute the paddle 103 .
  • the size of the circular area matches the size of the substrate 104 .
  • the cross section of the paddles 103 may be roughly an isosceles trapezoid, the bases of each isosceles trapezoid are located on the same straight line, and the direction of the straight line is the arrangement direction of the paddles 103 .
  • the two waists of an isosceles trapezoid are slightly curved.
  • the cross section of the paddle 103 may also be triangular or rectangular.
  • the paddle plate with the triangular or trapezoidal paddle has a larger opening area, so that the side with the larger opening area of the paddle plate 108 faces the substrate 104, and the plating solution is This side stirring is more sufficient, thereby further improving the uniformity of the electroplating height; on the other hand, since the paddle 103 is prone to generate bubbles during the high-speed stirring process, the bubbles will adhere to the side of the paddle 103. If the side of the paddle 103 is designed as If the slope is inclined, the air bubbles are more easily discharged from the paddle plate 108 .
  • the width of the blade 103 is a.
  • the projection of the blade 103 on the coordinate axis is The width is a, that is, the dimension of the base of an isosceles triangle is a.
  • the narrowest width of the gap between the adjacent paddles 103 is b, in other words, the distance between the two points closest to each other on the adjacent paddles 103 is b, that is, the distance between the adjacent vertices of two adjacent isosceles triangles. The distance between them is b.
  • the moving direction of the paddles 103 is the same as the arrangement direction of the paddles 103 , and is also perpendicular to the length direction of the paddles 103 . Since the paddle 103 itself blocks the electric field between the electrode and the substrate 104, the area on the substrate 104 corresponding to the paddle 103 cannot receive electricity; since the gap between the adjacent paddles 103 does not block the electric field, therefore, The area on the substrate 104 corresponding to the gap may receive power. During the electroplating process, if each point on the substrate 104 can receive the same amount of electricity, the plating height of each point on the substrate 104 can be uniform. Applicants have found that this requires an optimal design of the size and movement of the paddle 103.
  • the triangles represent the cross-section of the blade 103 .
  • one of the paddles 103 is drawn as a black triangle. Since the relative positions of the paddles 103 remain unchanged, the movement modes of all paddles 103 are consistent with the movement modes of the selected black triangle paddles 103 .
  • the left end of the blade 103 is used as the coordinate At the origin, the blade 103 reciprocates along the direction of the coordinate axis, and returns at the following four coordinate points: ⁇ , a, ⁇ +a, 0.
  • Step 501 move from the coordinate origin to the right to coordinate ⁇ ;
  • Step 502 move to the left to coordinate a
  • Step 503 move to the right coordinate ⁇ +a;
  • Step 504 move to the left to return to the origin of the coordinates.
  • the paddle 103 moves alternately left and right. Since each point on the substrate 104 is blocked by the paddle 103 for an equal period of time, when the electric field is evenly distributed, each point on the substrate 104 receives the same amount of electricity, so The plating height of each point is the same.
  • ⁇ a+b that is, ⁇ 2a
  • This embodiment discloses an electroplating apparatus, and the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, as shown in FIG. 1 . It will not be repeated here.
  • the open area at the bottom of the blade 108 has a larger open area ratio of about 66.7%. Compared with the 50% aperture ratio, the shielding of the electric field by the blade 103 itself will be less. The way of movement of the paddle 103 is therefore different.
  • the blade 103 turns back at the following 6 coordinate points: ⁇ , a, ⁇ +a, 2a, ⁇ +2a, 0.
  • the action of the blade 103 is divided into the following 6 steps:
  • Step 701 move from the coordinate origin to the right to coordinate ⁇ ;
  • Step 702 move to the left to coordinate a
  • Step 703 move to the right coordinate ⁇ +a;
  • Step 704 move to the left to coordinate 2a;
  • Step 705 move to the right coordinate ⁇ +2a;
  • Step 706 move to the left to return to the origin of the coordinates.
  • the paddle 103 moves alternately left and right. Since each point on the substrate 104 is blocked by the paddle 103 for an equal period of time, when the electric field is evenly distributed, each point on the substrate 104 receives the same amount of electricity, so The plating height of each point is the same.
  • ⁇ a+b is required, that is, ⁇ 3a.
  • the blade 103 is folded back at the following six coordinate points: 20mm, 6mm, 26mm, 12mm, 32mm, and 0mm.
  • This embodiment discloses an electroplating apparatus, and the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, as shown in FIG. 1 . It will not be repeated here.
  • the opening area at the bottom of the blade 108 has a smaller opening ratio of about 33.3%.
  • This dimension design can be regarded as the size of the paddle 103 in the second embodiment and the size of the gap between the adjacent paddles 103 are reversed, so the movement of the paddle 103 can be the same as that described in the second embodiment.
  • the blade 103 turns back at the following 6 coordinate points: ⁇ , b, ⁇ +b, 2b, ⁇ +2b, 0.
  • the action of the paddle 103 is divided into the following 6 steps:
  • Step 901 move from the coordinate origin to the right to coordinate ⁇ ;
  • Step 902 move left to coordinate b
  • Step 903 move to the right coordinate ⁇ +b;
  • Step 904 move to the left to coordinate 2b;
  • Step 905 move to the right coordinate ⁇ +2b;
  • Step 906 move to the left to return to the origin of the coordinates.
  • the paddle 103 moves alternately left and right. Since each point on the substrate 104 is blocked by the paddle 103 for an equal period of time, when the electric field is evenly distributed, each point on the substrate 104 receives the same amount of electricity, so The plating height of each point is the same.
  • ⁇ a+b is required, that is, ⁇ 3b.
  • the coordinates at which the blade 103 stops are: 35mm, 10mm, 45mm, 20mm, 55mm, 0mm.
  • the multiples between the width a of the paddles 103 and the narrowest width b of the gaps between adjacent paddles 103 are all integers.
  • the present embodiment discloses the following electroplating method:
  • the forward and reverse motion of the paddle 103 can make the distribution of metal ions in the electroplating solution and the additives of the electroplating solution uniform.
  • the time for each corresponding point on the substrate 104 to be blocked by the paddle 103 is equal, so that the plating height of each corresponding point on the substrate 104 can be the same.
  • the paddle 103 may move according to the following steps:
  • Step 1001 move from the coordinate origin to the right to coordinate ⁇ ;
  • Step 1002 move to the left to coordinate a
  • Step 1003 move to the right coordinate ⁇ +a;
  • Step 1004 move to the left to coordinate 2a;
  • Step 1005 move to the right coordinate ⁇ +2a;
  • Step 1006 move to the left to coordinate 2a;
  • Step 1007 move to the right coordinate ⁇ +a
  • Step 1008 move to the left to coordinate a
  • Step 1009 move to the right coordinate ⁇ ;
  • Step 1010 move to the left to the coordinate origin
  • Step 1011 move to the right coordinate ⁇ +2a
  • Step 1012 move to the left to return to the origin of the coordinates.
  • each corresponding point on the substrate 104 is blocked by the paddle 103 for the same period of time, so that the received electricity is the same, and the plating height is the same.
  • This embodiment discloses an electroplating apparatus, and the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, as shown in FIG. 1 . It will not be repeated here.
  • b 1.5a, wherein the width of the paddles 103 is a, and the narrowest width of the gap between adjacent paddles 103 is b.
  • the action of the paddle 103 is divided into the following 10 steps:
  • Step 1201 move from the coordinate origin to the right to coordinate ⁇ ;
  • Step 1202 move to the left to coordinate a
  • Step 1203 move to the right coordinate ⁇ +a;
  • Step 1204 move to the left to coordinate 2a;
  • Step 1205 move to the right coordinate ⁇ +2a;
  • Step 1206, move to the left to coordinate 3a;
  • Step 1207 move to the right coordinate ⁇ +3a
  • Step 1208 move to the left to coordinate 4a;
  • Step 1209 move to the right coordinate ⁇ +4a
  • Step 1210 move to the left to return to the origin of the coordinates.
  • each corresponding point on the substrate 104 is blocked by the blade 103 is equal, and when the electric field is evenly distributed, each corresponding point on the substrate 104 receives the same amount of electricity, so the plating height of each point is the same.
  • the multiple between the width a of the paddles 103 and the narrowest width b of the gap between adjacent paddles 103 is a non-integer greater than 1.
  • the present embodiment discloses the following electroplating methods:
  • ⁇ a+b a is the blade width
  • b is the narrowest width of the gap between adjacent blades
  • y x*(N+1)
  • N is a non-integer greater than 1
  • the value of x makes x*N an integer.
  • c is the smaller of a and b, and use several small cells of width c to fill a large cell of width x*(a+b), where x is an integer , it is required that each small grid is arranged in the width direction, the covered positions do not overlap each other, and the large grid is just filled without leaving any gaps.
  • x is an integer
  • the requirements can be met when the width of x*(a+b) is an integer multiple of c.
  • the width of x*(a+b) is an integer multiple of c, which is equivalent to x*(N+1) being an integer, that is, x*N is an integer.
  • the small grid with width c is regarded as the blade 103 with width c
  • x*(N+1) is regarded as the number of a set of turning points
  • the large grid with width x*(a+b) is regarded as the The coordinate range covered by the paddle 103 at the set of turning points
  • the above description of filling the large grid with small grids can be regarded as obtaining the “each point corresponding to the substrate 104 is blocked by the paddle 103” mentioned in Example 5. time equal” effect. Since there are two groups of switchback points in one cycle, the number of switchback points in one cycle is 2*x*(N+1).
  • the coordinates of the first group of turning points are 0,c,2c,...,(y-2)*c,(y-1)*c
  • the second group The coordinates of the turning point are ⁇ , ⁇ +c, ⁇ +2c,..., ⁇ +(y-2)*c, ⁇ +(y-1)*c.
  • the movement steps of the paddle 103 may also be:
  • each corresponding point on the substrate 104 is blocked by the paddle 103 for the same period of time, so that the received electricity is the same, and the plating height is the same.
  • This embodiment discloses an electroplating apparatus, and the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, which will not be repeated here.
  • the electroplating apparatus in this embodiment further includes a diffusion plate 107 disposed between the paddle 103 and the substrate 104 .
  • the diffusion plate 107 is provided with a plurality of through holes, and the density of the through holes can be set by setting the density of the through holes. and aperture, further improving the consistency of plating height at each point on the substrate.
  • FIG. 14 shows the electroplating result curves of the two electroplating devices, and the horizontal axis in the figure is the test point and the substrate The distance from the center point, and the vertical axis is the plating height of the test point. It can be seen that the plating device containing the diffuser plate can achieve a more uniform plating height.
  • the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, as shown in FIG. 1 , which will not be repeated here.
  • the arrangement direction of the paddles 103 is the one-dimensional coordinate axis direction, and there is an included angle ⁇ between the movement direction of the paddles 103 and the coordinate axis, and ⁇ is less than 90°. Therefore, the coordinates of the paddle 103 are the projections of the actual position of the paddle 103 on the coordinate axis.
  • the coordinate position of the point is the projection point B of point A on the coordinate axis. It can be understood as follows: since only the component of the movement of the blade 103 in the direction of the coordinate axis will change the electric quantity received by the corresponding area on the substrate 104, only the coordinate change of the blade 103 on the coordinate axis is considered.
  • the size of the included angle ⁇ can be set according to the actual situation.
  • the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, as shown in FIG. 1 , which will not be repeated here.
  • one side of the paddle plate 108 is connected with the eccentric bearing 1010 through a connecting piece 1011 , the eccentric bearing 1010 is slidably connected with the guide rail 109 , and the paddle plate 108 is driven by the driving mechanism 105 to move, and the Without the eccentric bearing 1010 , the movement of the paddle plate 108 should be along the direction of the guide rail 109 . If the driving mechanism moves the paddle plate 108 in other directions, the paddle plate 108 will be stuck by the guide rail 109 .
  • the function of the eccentric bearing 1010 is to allow a slight deviation between the moving direction of the paddle plate 108 and the direction of the guide rail to prevent the movement of the paddle plate 108 from being blocked due to installation errors.
  • the driving mechanism 105 , the eccentric bearing 1010 and the guide rail 109 are surrounded by a nitrogen gas protective box 1012 .
  • Figure 17 shows the eccentric bearing 1010 and the guide rail 109 surrounded by a nitrogen protection box 1012, which is provided with a nitrogen gas inlet and a nitrogen gas outlet.
  • the nitrogen protection box 1012 is kept filled with nitrogen, and outside air cannot enter the nitrogen protection box 1012 and corrode the precise components inside.
  • the drive mechanism 105 can also be surrounded by another nitrogen protection box.
  • This embodiment discloses an electroplating apparatus, and the electroplating apparatus includes all the structures of the electroplating apparatus in Embodiment 1, as shown in FIG. 1 . It will not be repeated here.
  • Embodiment 1 The difference from Embodiment 1 is that, as shown in FIG. 18 , the shape of the paddle plate 108 is square, which is suitable for electroplating of a square substrate.
  • the paddle 103 has a strip-shaped through hole formed in the square area in the middle of the paddle plate 108 . formed.
  • the coordinates of the paddle 103 are limited in each embodiment of the present invention to reflect the translation distance of the paddle 103.
  • the origin of the coordinate axis can be arbitrarily specified.
  • FIGS. 19A , 19B and 19C respectively show the electroplating effect of the substrate using the existing electroplating device, the electroplating effect of the substrate using the electroplating device of the present invention, and the electroplating height data of the test point on the substrate. .
  • the concentric circles on the substrate in FIG. 19A are more obvious, and the plating height is not uniform.
  • the horizontal axis is the distance between the test point and the center point of the substrate, and the vertical axis is the plating height of the test point. As can be seen from Fig.
  • the plating height along the radial direction of the substrate appears larger
  • the fluctuation is more obvious in the area close to the center of the substrate; with the electroplating device of the present invention, the plating heights on the substrate are more uniform, and the small difference between the plating heights is related to other factors, and the difference is within an acceptable range .

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Abstract

本发明的一个实施例揭示了一种电镀装置和电镀方法，该电镀装置包括多个平行排列的桨叶，桨叶平行于基板而移动，对电镀液进行搅拌，一个周期内，桨叶以设定的行程进行往复运动，往复运动的折返点与桨叶的宽度以及相邻桨叶之间的间隙的最窄宽度有关。本发明通过设计桨叶的尺寸和运动方式，使基板上对应的每个点累计被桨叶遮挡的时间相等，从而接收到的电量相等，进而提高了电镀高度的一致性。

Description

电镀装置及电镀方法 技术领域
本发明涉及半导体设备领域，尤其涉及一种电镀装置及电镀方法。
背景技术
电镀是完成铜互连线的主要工艺。目前市场上的电镀装置有水平喷流式杯镀和垂直挂镀两种类型，垂直挂镀是将晶圆垂直浸入镀液中，一个镀槽可以同时进行多片电镀。杯镀则是将晶圆覆盖在一个杯状的镀槽里，电镀以一杯一片的方式进行。相对于挂镀，杯镀的工艺过程更加可控，可以满足更加复杂多样的产品需求。
随着技术发展，芯片面积增加，芯片内凸块数量急剧增加，一颗芯片内甚至有几万乃至十万个以上的凸块，电镀工艺对电镀速率和产出要求越来越高，在先进封装领域芯片内均匀性也要求更高。然而芯片内均匀性，也就是凸块的共面性在搅拌不强的情况下很难达到。同时，针对芯片之间互连线的先进封装工艺，铜柱的高度可达到250um，对电镀过程中的质量传输提出更高要求，普通的搅拌质量传输不强，无法满足产能和品质需求。
为了增强电镀液的搅拌，可在电镀装置中安装桨叶组件，桨叶组件包括多个与基板表面平行的桨叶，桨叶进行往复运动，对电镀液进行搅拌，充分的将金属离子和电镀液添加剂供给至基板表面。然而在实践中，普通的桨叶在搅拌过程中，对基板表面遮挡的时间没有控制，导致基板表面各点接收到的电量不均匀,仍然存在电镀高度不均匀的问题。
发明内容
本发明的目的是针对上述技术问题提出一种电镀装置及电镀方法，提高基板上电镀高度均匀性。
为实现上述目的，本发明的一个实施例提出一种电镀装置，该电镀装置包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶 遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(N-1)*c；
向左移动至坐标N*c；
向右移动至坐标Δ+N*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000001
b＝N*a或a＝N*b，N为整数。
本发明的另一个实施例提出一种电镀装置，该电镀装置包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(N-1)*c；
向左移动至坐标N*c；
向右移动至坐标Δ+N*c；
向左移动至坐标N*c；
向右移动至坐标Δ+(N-1)*c；
...
向左移动至坐标2c；
向右移动至坐标Δ+c；
向左移动至坐标c；
向右移动至坐标Δ；
向左移动至坐标原点；
向右移动至坐标Δ+N*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000002
b＝N*a或a＝N*b，N为整数。
本发明的另一个实施例提出一种电镀装置，该电镀装置包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(y-2)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-1)*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000003
y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
本发明的另一个实施例提出一种电镀装置，该电镀装置包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(y-2)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-1)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-2)*c；
...
向左移动至坐标2c；
向右移动至坐标Δ+c；
向左移动至坐标c；
向右移动至坐标Δ；
向左移动至坐标原点；
向右移动至坐标Δ+(y-1)*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000004
y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
本发明的一个实施例提出一种电镀方法，该方法包括：设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(N-1)*c；
向左移动至坐标N*c；
向右移动至坐标Δ+N*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000005
b＝N*a或a＝N*b，N为整数。
本发明的另一个实施例提出一种电镀方法，该方法包括：设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(N-1)*c；
向左移动至坐标N*c；
向右移动至坐标Δ+N*c；
向左移动至坐标N*c；
向右移动至坐标Δ+(N-1)*c；
...
向左移动至坐标2c；
向右移动至坐标Δ+c；
向左移动至坐标c；
向右移动至坐标Δ；
向左移动至坐标原点；
向右移动至坐标Δ+N*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000006
b＝N*a或a＝N*b，N为整数。
本发明的另一个实施例提出一种电镀方法，该电镀方法包括：设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(y-2)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-1)*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000007
y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
本发明的又一个实施例提出一种电镀方法，该方法包括：设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(y-2)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-1)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-2)*c；
...
向左移动至坐标2c；
向右移动至坐标Δ+c；
向左移动至坐标c；
向右移动至坐标Δ；
向左移动至坐标原点；
向右移动至坐标Δ+(y-1)*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000008
y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
本发明通过设计桨叶的运动方式，使基板上对应的每个点被桨叶遮挡的时间相等、接收到的电量相等，从而提高了电镀高度的一致性。
附图概述
图1示例了实施例1中的电镀装置的结构示意图。
图2示例了实施例1中的桨叶板的俯视图。
图3A示例了实施例1中的桨叶板的剖视图。
图3B为图3A中的D部的放大图。
图4示例了实施例1中的桨叶的尺寸图。
图5示例了实施例1中的桨叶在一个周期内的位置变化。
图6示例了实施例2中桨叶的尺寸图。
图7示例了实施例2中的桨叶在一个周期内的位置变化。
图8示例了实施例3中桨叶的尺寸图。
图9示例了实施例3中的桨叶在一个周期内的位置变化。
图10示例了实施例4中的桨叶在一个周期内的位置变化的一种方式。
图11示例了实施例5中桨叶的尺寸图。
图12示例了实施例5中桨叶在一个周期内的位置变化。
图13示例了实施例7中的电镀装置的结构示意图。
图14示例了实施例7中含有扩散板的电镀装置及不含扩散板的电镀装置的电 镀结果曲线对比图。
图15示例了实施例8中桨叶的坐标位置示意图。
图16示例了实施例9中的桨叶板与导轨连接结构图。
图17示例了实施例9中用于包围偏心轴承和导轨的氮气保护盒。
图18示例了实施例10中的桨叶板的结构示意图。
图19A示例了采用现有电镀装置的电镀效果图。
图19B示例了采用本发明电镀装置的电镀效果图。
图19C示例了采用现有电镀装置和本发明电镀装置时，基板上的测试点的电镀高度数据对比图。
本发明的较佳实施方式
为详细说明本发明的技术内容、构造特征、所达成目的及效果，下面将结合实施例并配合图式予以详细说明。
在电镀装置中，为了加强电镀液的搅动，可在与基板相对的位置安装桨叶，电镀时，桨叶沿着与基板平行的方向进行往复运动，以加强电镀液的搅动。由于桨叶本身对电场有遮挡，只有桨叶与桨叶之间的空隙处才能使电场通过，因此基板上正对桨叶的区域会有“阴影”，即“阴影”处接收到的电量比非“阴影”处接收到的电量少。若基板上各点受“阴影”的影响程度不同，各点接收到的电量不相等，则整个基板的电镀高度就不均匀。
由于电镀过程中，基板是旋转的，因此“阴影”造成的结果就表现为基板表面的同心环，即沿基板径向上的电镀高度出现明显的波动，如图19A中所示。本发明旨在消除“阴影”影响，使基板上各点电镀高度一致。
实施例1
如图1所示，本实施例揭示了一种电镀装置，包括电镀槽101、基板夹具102和多个平行排列的条形的桨叶103。其中，基板夹具102用于夹持基板104，桨叶103位于基板104与电极之间，并与基板104平行。电镀时，基板104和桨叶103浸泡于电镀槽101中的电镀液内，桨叶103在驱动机构105的驱动下，沿着与基板104平行的方向进行往复运动，对电镀液进行搅拌。驱动机构105 可以是马达。桨叶103的运动方向可以进一步通过与其连接的导轨109来限制。驱动机构105连接有控制器106，控制器106通过程序控制驱动机构105的动作，从而控制桨叶103的运动。
如图2所示，桨叶103由一桨叶板108上开设条形的通孔而形成，桨叶板108的材质为绝缘体，例如PVC、PC、CPVC、PPS、PEEK、PTFE等塑料材质。具体的，在桨叶板108中间的圆形区域上加工相互平行排列的条形的通孔，通孔供液体和电场穿过，相邻通孔之间的实体部分则构成桨叶103。圆形区域的尺寸与基板104的尺寸匹配。
如图3A、图3B所示，桨叶103的横截面可大致为等腰梯形，各等腰梯形的底边位于同一条直线上，该直线的方向即为桨叶103的排列方向。等腰梯形的两个腰略微带有弧度。
桨叶103的横截面还可以是三角形或者矩形。与具有矩形桨叶的桨叶板相比，具有三角形或梯形桨叶的桨叶板的开孔面积更大，使桨叶板108的开孔面积较大的一侧朝向基板104，电镀液在该侧搅拌更充分，从而进一步提高电镀高度均匀性；另一方面，由于桨叶103在高速搅拌过程中容易产生气泡，气泡会依附在桨叶103的侧面，若将桨叶103的侧面设计成斜面，则气泡更容易从桨叶板108中排出。
如图4所示，以等腰三角形的桨叶形状为例，桨叶103的宽度为a，换言之，以桨叶103的排列方向为坐标轴的方向，桨叶103在坐标轴上的投影的宽度为a，即等腰三角形的底边的尺寸为a。相邻桨叶103之间的间隙的最窄宽度为b，换言之，相邻桨叶103上相互最靠近的两点之间的距离为b，即相邻两个等腰三角形的相邻顶点之间的距离为b。
本实施例中，a＝b，即桨叶板108底部开孔区域的开孔率为50％。
如图4中箭头所示，桨叶103的运动方向与桨叶103的排列方向相同，也垂直于桨叶103的长度方向。由于桨叶103本身对电极与基板104之间的电场造成遮挡，因此基板104上与桨叶103对应的区域接收不到电量；由于相邻桨叶103之间的间隙对电场无遮挡，因此，基板104上与该间隙对应的区域可以接收到电量。在电镀过程中，若能使基板104上每个点都能接收到相同的电量，就可以使基板104上各点的电镀高度一致。申请人发现，这需要对桨叶103的 尺寸和运动方式进行优化设计。
如图5中所示，三角形表示桨叶103的横截面。为方便理解，将其中一个桨叶103绘制为黑色三角形。由于各桨叶103之间的相对位置不变，因此所有桨叶103的运动方式与所选取的黑色三角形的桨叶103的运动方式一致。以桨叶103的排列方向为一维坐标轴方向，以所选取的黑色三角形的桨叶103的起始点作为坐标原点，具体的，以所选取的黑色三角形的桨叶103的左边的端点作为坐标原点，桨叶103沿坐标轴方向进行往复运动，在以下4个坐标点折返：Δ,a,Δ+a,0。
为了便于观察桨叶103的坐标位置，图5中绘制有多条与坐标轴垂直的虚线，省略号表示未绘制的若干个桨叶103，带边框的箭头表示桨叶103发生的位移。从图5中可以看出，一个周期内，桨叶103的动作分为以下四步:
步骤501，从坐标原点向右移动至坐标Δ；
步骤502，向左移动至坐标a；
步骤503，向右移动至坐标Δ+a；
步骤504，向左移动回到坐标原点。
一个周期内，桨叶103左右交替移动，由于基板104上对应的每个点被桨叶103遮挡的时间相等，当电场均匀分布时，基板104上对应的每个点接收到的电量相等，因此各点的电镀高度相同。
一个周期内，为使桨叶103在各折返位置覆盖的坐标范围互不重叠，要求Δ≥a+b，即Δ≥2a，这样对电镀中各处的搅拌程度就更加均衡；桨叶103的宽度a的取值范围可为5mm-15mm，可根据基板104的尺寸和电镀装置的零件尺寸设定。以a＝5mm，Δ＝15mm为例，桨叶103在以下4个坐标点折返：15mm，5mm，20mm，0mm。
电镀工艺中，桨叶103完成一个周期运动后，立刻进入下一周期运动。
实施例2
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，如图1所示。在此不再重复。
与实施例1不同的是，如图6所示，b＝2a，其中，桨叶103的宽度为a， 相邻桨叶103之间的间隙的最窄宽度为b，即本实施例的桨叶板108底部的开孔区域有更大的开孔率，约为66.7％。与50％的开孔率相比，桨叶103本身对电场的遮挡会更少。桨叶103的运动方式也因此不同。在一个周期内，桨叶103在以下6个坐标点折返：Δ,a,Δ+a,2a,Δ+2a,0，如图7所示，桨叶103的动作分为以下6步:
步骤701，从坐标原点向右移动至坐标Δ；
步骤702，向左移动至坐标a；
步骤703，向右移动至坐标Δ+a；
步骤704，向左移动至坐标2a；
步骤705，向右移动至坐标Δ+2a；
步骤706，向左移动回到坐标原点。
一个周期内，桨叶103左右交替移动，由于基板104上对应的每个点被桨叶103遮挡的时间相等，当电场均匀分布时，基板104上对应的每个点接收到的电量相等，因此各点的电镀高度相同。
一个周期内，为使桨叶103在各折返位置覆盖的坐标范围互不重叠，要求Δ≥a+b，即Δ≥3a。以a＝6mm，Δ＝20mm为例，桨叶103在以下6个坐标点折返：20mm，6mm，26mm，12mm，32mm，0mm。
实施例3
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，如图1所示。在此不再重复。
与实施例1不同的是，如图8所示，a＝2b，其中，桨叶103的宽度为a，相邻桨叶103之间的间隙的最窄宽度为b，即本实施例的桨叶板108底部的开孔区域有更小的开孔率，约为33.3％。这种尺寸设计可看作是将实施例2中的桨叶103的尺寸与相邻桨叶103之间的间隙的尺寸对调，因此桨叶103的运动方式可与实施例2中所述的运动方式类似，桨叶103在以下6个坐标点折返：Δ,b,Δ+b,2b,Δ+2b,0。
如图9所示，一个周期内，桨叶103的动作分为以下6步:
步骤901，从坐标原点向右移动至坐标Δ；
步骤902，向左移动至坐标b；
步骤903，向右移动至坐标Δ+b；
步骤904，向左移动至坐标2b；
步骤905，向右移动至坐标Δ+2b；
步骤906，向左移动回到坐标原点。
一个周期内，桨叶103左右交替移动，由于基板104上对应的每个点被桨叶103遮挡的时间相等，当电场均匀分布时，基板104上对应的每个点接收到的电量相等，因此各点的电镀高度相同。
类似的，一个周期内，为使桨叶103折返的坐标尽量分散开，要求Δ≥a+b，即Δ≥3b。以b＝10mm，Δ＝35mm为例，桨叶103停顿的坐标为：35mm，10mm，45mm，20mm，55mm，0mm。
实施例4
实施例1至实施例3中，桨叶103的宽度a与相邻桨叶103之间的间隙的最窄宽度b之间的倍数均为整数。针对桨叶103的宽度a与相邻桨叶103之间的间隙的最窄宽度b之间的倍数为整数的电镀装置，本实施例揭示了以下电镀方法：
执行控制器中的程序，使桨叶103以如下方式运动：以桨叶103的排列方向为坐标轴方向，一个周期内，桨叶103的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(N-1)*c；
向左移动至坐标N*c；
向右移动至坐标Δ+N*c；
向左移动回到坐标原点。
其中，Δ≥a+b，
Figure PCTCN2021137466-appb-000009
b＝N*a或a＝N*b，N为整数。
一方面，桨叶103正反交替运动，能使电镀液中的金属离子和电镀液添加剂的分布均匀。另一方面，基板104上对应的每个点被桨叶103遮挡的时间相等，这样可使基板104上对应的每个点的电镀高度相同。
或者，一个周期内，桨叶103可以按照以下步骤运动：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(N-1)*c；
向左移动至坐标N*c；
向右移动至坐标Δ+N*c；
向左移动至坐标N*c；
向右移动至坐标Δ+(N-1)*c；
...
向左移动至坐标2c；
向右移动至坐标Δ+c；
向左移动至坐标c；
向右移动至坐标Δ；
向左移动至坐标原点；
向右移动至坐标Δ+N*c；
向左移动回到坐标原点。
为了更直观的显示桨叶103在各折返点的位置，以b＝2a为例，一个周期内，桨叶103的动作分为以下12步，如图10所示：
步骤1001，从坐标原点向右移动至坐标Δ；
步骤1002，向左移动至坐标a；
步骤1003，向右移动至坐标Δ+a；
步骤1004，向左移动至坐标2a；
步骤1005，向右移动至坐标Δ+2a；
步骤1006，向左移动至坐标2a；
步骤1007，向右移动至坐标Δ+a；
步骤1008，向左移动至坐标a；
步骤1009，向右移动至坐标Δ；
步骤1010，向左移动至坐标原点；
步骤1011，向右移动至坐标Δ+2a；
步骤1012，向左移动回到坐标原点。
同样的，基板104上对应的每个点被桨叶103遮挡的时间相等，从而接收到的电量相等，电镀高度一致。
实施例5
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，如图1所示。在此不再重复。
与实施例1不同的是，如图11所示，b＝1.5a，其中，桨叶103的宽度为a，相邻桨叶103之间的间隙的最窄宽度为b。
如图12所示，桨叶103在以下10个坐标点折返：
Δ,a,Δ+a,2a,Δ+2a,3a,Δ+3a,4a,Δ+4a,0。
一个周期内，桨叶103的动作分为以下10步：
步骤1201，从坐标原点向右移动至坐标Δ；
步骤1202，向左移动至坐标a；
步骤1203，向右移动至坐标Δ+a；
步骤1204，向左移动至坐标2a；
步骤1205，向右移动至坐标Δ+2a；
步骤1206，向左移动至坐标3a；
步骤1207，向右移动至坐标Δ+3a；
步骤1208，向左移动至坐标4a；
步骤1209，向右移动至坐标Δ+4a；
步骤1210，向左移动回到坐标原点。
一个周期内，基板104上对应的每个点被桨叶103遮挡的时间相等，当电 场均匀分布时，基板104上对应的每个点接收到的电量相等，因此各点的电镀高度相同。
实施例6
在实施例5中，桨叶103的宽度a与相邻桨叶103之间的间隙的最窄宽度b之间的倍数为大于1的非整数。针对a与b之间的倍数为大于1的非整数的电镀装置，本实施例公开了以下电镀方法：
执行控制器中的程序，使桨叶103以如下方式运动：以桨叶103的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(y-2)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-1)*c；
向左移动回到坐标原点；
其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
Figure PCTCN2021137466-appb-000010
y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
为理解该方法，可进行以下想象：c为a和b中的较小的那个值，用数个宽度为c的小格去填充宽度为x*(a+b)的大格，x为整数，要求每个小格沿宽度方向排列，覆盖的位置互不重叠，且刚好将大格填满，不留空隙。通过选取合适的x值，使x*(a+b)的宽度为c的整数倍时，可满足要求。而x*(a+b)的宽度为c的整数倍相当于x*(N+1)为整数，即x*N为整数。
将宽度为c的小格看作宽度为c的桨叶103，x*(N+1)看作一组折返点的个数，宽度为x*(a+b)的大格则看作该桨叶103在该组折返点覆盖的坐标范围，则上述关于用小格填充大格的描述可看作取得了实施例5中提到的“基板104上对应的每个点被桨叶103遮挡的时间相等”的效果。由于一个周期内的折返点 有两组，因此一个周期内的折返点个数为2*x*(N+1)。为简化表示，令y＝x*(N+1)，则第一组折返点坐标为0,c,2c,…,(y-2)*c,(y-1)*c,第二组折返点坐标为Δ,Δ+c,Δ+2c,…,Δ+(y-2)*c,Δ+(y-1)*c。
一个周期内，桨叶103的运动步骤还可以为：
从坐标原点向右移动至坐标Δ；
向左移动至坐标c；
向右移动至坐标Δ+c；
向左移动至坐标2c；
...
向右移动至坐标Δ+(y-2)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-1)*c；
向左移动至坐标(y-1)*c；
向右移动至坐标Δ+(y-2)*c；
...
向左移动至坐标2c；
向右移动至坐标Δ+c；
向左移动至坐标c；
向右移动至坐标Δ；
向左移动至坐标原点；
向右移动至坐标Δ+(y-1)*c；向左移动回到坐标原点。
同样的，基板104上对应的每个点被桨叶103遮挡的时间相等，从而接收到的电量相等，电镀高度一致。
实施例7
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，在此不再重复。
此外，如图13所示，本实施例中的电镀装置还包括设置在桨叶103与基板104之间的扩散板107，扩散板107上设有多个通孔，可通过设置通孔的密 度和孔径，进一步提高基板上各点的电镀高度的一致性。
将本发明一个实施例的不含扩散板107的电镀装置与安装有扩散板107的该电镀装置进行对比，图14展示了两个电镀装置的电镀结果曲线，图中横轴为测试点与基板中心点的距离，纵轴为测试点的电镀高度，可以看出，含有扩散板的电镀装置能取得更均匀的电镀高度。
实施例8
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，如图1所示，在此不再重复。
与实施例1不同的是，以桨叶103的排列方向为一维坐标轴方向，桨叶103的运动方向与坐标轴之间有一夹角α，α小于90°。因此，桨叶103的坐标是桨叶103的实际位置在坐标轴上的投影。如图15中所示，若桨叶103上某点的实际位置为点A，则该点的坐标位置为点A在坐标轴上的投影点B。可以这样理解：由于只有桨叶103的运动在坐标轴方向的分量会使基板104上的对应区域接收到的电量变化，因此只考虑桨叶103在该坐标轴上的坐标变化。
显然，由于夹角α的存在，桨叶103实际移动的距离更大，因此，可以根据实际情况来设置夹角α的大小。
实施例9
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，如图1所示，在此不再重复。
进一步的，如图16所示，桨叶板108的一侧通过一连接件1011与偏心轴承1010连接，偏心轴承1010与导轨109滑动连接，桨叶板108受驱动机构105的驱动而运动，在没有偏心轴承1010的情况下，桨叶板108的移动应当沿着导轨109方向，若驱动机构使桨叶板108沿其他方向运动，则桨叶板108会被导轨109卡住。偏心轴承1010的作用是允许桨叶板108的运动方向与导轨方向之间存在细微的偏差，防止由于安装误差而导致桨叶板108运动受阻。
为了防止腐蚀性气体腐蚀精密部件，驱动机构105、偏心轴承1010和导轨109被氮气保护盒1012包围。图17展示了被氮气保护盒1012包围的偏心轴承 1010和导轨109，氮气保护盒1012上设有氮气进口和氮气出口。氮气保护盒1012内保持充满氮气的状态，外部气体无法进入氮气保护盒1012而腐蚀内部的精密部件。同样的，驱动机构105也可以被另一个氮气保护盒包围。
实施例10
本实施例揭示了一种电镀装置，本电镀装置包含实施例1中电镀装置的所有结构，如图1所示。在此不再重复。
与实施例1不同的是，如图18所示，桨叶板108的形状为方形，适用于方形基板的电镀，相应的，桨叶103由桨叶板108中间的方形区域开设条形通孔而形成。
需要说明的是，本发明的各实施例中对桨叶103的坐标进行限定，是为了体现桨叶103的平移距离，在一个电镀工艺中，坐标轴的原点位置可以任意指定。
为了体现本发明的所达到的效果，图19A、图19B和图19C分别展示了采用现有电镀装置的基板电镀效果、采用本发明电镀装置的基板电镀效果和基板上的测试点的电镀高度数据。与图19B相比，图19A中基板上的同心圆比较明显，电镀高度不均匀。图19C中，横轴为测试点与基板中心点的距离，纵轴为测试点的电镀高度，从图19C中可以看出，采用现有电镀装置，沿基板径向上的电镀高度出现较大的波动，在靠近基板中心的区域更为明显；采用本发明的电镀装置，基板上各处的电镀高度更均匀，各处电镀高度之间小的差异与其他因素有关，该差异在可接受范围内。
综上所述，本发明通过上述实施方式及相关图式说明，己具体、详实的揭露了相关技术，使本领域的技术人员可以据以实施。而以上所述实施例只是用来说明本发明，而不是用来限制本发明的，本发明的权利范围，应由本发明的权利要求来界定。至于本文中所述元件数目的改变或等效元件的代替等仍都应属于本发明的权利范围。

Claims (14)

  1. 一种电镀装置，包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，其特征在于，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(N-1)*c；
    向左移动至坐标N*c；
    向右移动至坐标Δ+N*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100001
    b＝N*a或a＝N*b，N为整数。
  2. 根据权利要求1所述的电镀装置，其特征在于，所述桨叶与基板之间设有扩散板，所述扩散板上具有多个通孔。
  3. 根据权利要求1所述的电镀装置，其特征在于，所述电镀装置上设有导轨，所述桨叶由一桨叶板上开设条形的通孔而形成，所述桨叶板的一侧连接驱动机构，桨叶板的另一侧通过偏心轴承与导轨滑动连接。
  4. 根据权利要求3所述的电镀装置，其特征在于，所述驱动机构、偏心轴承和导轨被氮气保护盒包围，所述氮气保护盒上设有氮气进口和氮气出口。
  5. 一种电镀装置，包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，其特征在于，所述电镀装置还包括控制器和驱动机构，所述驱 动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(N-1)*c；
    向左移动至坐标N*c；
    向右移动至坐标Δ+N*c；
    向左移动至坐标N*c；
    向右移动至坐标Δ+(N-1)*c；
    ...
    向左移动至坐标2c；
    向右移动至坐标Δ+c；
    向左移动至坐标c；
    向右移动至坐标Δ；
    向左移动至坐标原点；
    向右移动至坐标Δ+N*c；
    向左移动回到坐标原点；其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100002
    b＝N*a或a＝N*b，N为整数。
  6. 根据权利要求5所述的电镀装置，其特征在于，所述桨叶与基板之间设有扩散板，所述扩散板上具有多个通孔。
  7. 根据权利要求5所述的电镀装置，其特征在于，所述电镀装置上设有导轨，所述桨叶由一桨叶板上开设条形的通孔而形成，所述桨叶板的一侧连接驱动机构，桨叶板的另一侧通过偏心轴承与导轨滑动连接。
  8. 根据权利要求7所述的电镀装置，其特征在于，所述驱动机构、偏心轴承和导轨被氮气保护盒包围，所述氮气保护盒上设有氮气进口和氮气出口。
  9. 一种电镀装置，包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，其特征在于，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(y-2)*c；
    向左移动至坐标(y-1)*c；
    向右移动至坐标Δ+(y-1)*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100003
    y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
  10. 一种电镀装置，包括多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，其特征在于，所述电镀装置还包括控制器和驱动机构，所述驱动机构分别与控制器和桨叶连接，所述控制器通过控制驱动机构而使桨叶进行周期运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(y-2)*c；
    向左移动至坐标(y-1)*c；
    向右移动至坐标Δ+(y-1)*c；
    向左移动至坐标(y-1)*c；
    向右移动至坐标Δ+(y-2)*c；
    ...
    向左移动至坐标2c；
    向右移动至坐标Δ+c；
    向左移动至坐标c；
    向右移动至坐标Δ；
    向左移动至坐标原点；
    向右移动至坐标Δ+(y-1)*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100004
    y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
  11. 一种电镀方法，其特征在于，设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(N-1)*c；
    向左移动至坐标N*c；
    向右移动至坐标Δ+N*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100005
    b＝N*a或a＝N*b，N为整数。
  12. 一种电镀方法，其特征在于，设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(N-1)*c；
    向左移动至坐标N*c；
    向右移动至坐标Δ+N*c；
    向左移动至坐标N*c；
    向右移动至坐标Δ+(N-1)*c；
    ...
    向左移动至坐标2c；
    向右移动至坐标Δ+c；
    向左移动至坐标c；
    向右移动至坐标Δ；
    向左移动至坐标原点；
    向右移动至坐标Δ+N*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100006
    b＝N*a或a＝N*b，N为整数。
  13. 一种电镀方法，其特征在于，设置多个平行排列的桨叶，所述桨叶平行于 基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(y-2)*c；
    向左移动至坐标(y-1)*c；
    向右移动至坐标Δ+(y-1)*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100007
    y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
  14. 一种电镀方法，其特征在于，设置多个平行排列的桨叶，所述桨叶平行于基板而移动，对电镀液进行搅拌，控制桨叶的运动以使基板上对应的每个点累计被桨叶遮挡的时间相等；
    以桨叶的排列方向为坐标轴方向，一个周期内，桨叶的运动步骤为：
    从坐标原点向右移动至坐标Δ；
    向左移动至坐标c；
    向右移动至坐标Δ+c；
    向左移动至坐标2c；
    ...
    向右移动至坐标Δ+(y-2)*c；
    向左移动至坐标(y-1)*c；
    向右移动至坐标Δ+(y-1)*c；
    向左移动至坐标(y-1)*c；
    向右移动至坐标Δ+(y-2)*c；
    ...
    向左移动至坐标2c；
    向右移动至坐标Δ+c；
    向左移动至坐标c；
    向右移动至坐标Δ；
    向左移动至坐标原点；
    向右移动至坐标Δ+(y-1)*c；
    向左移动回到坐标原点；
    其中，Δ≥a+b，a为桨叶宽度，b为相邻桨叶之间的间隙的最窄宽度，
    Figure PCTCN2021137466-appb-100008
    y＝x*(N+1)，b＝N*a或a＝N*b，N为大于1的非整数，x取值使x*N为整数。
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