WO2022154781A1 - Boîtiers pour dispositifs électroniques - Google Patents

Boîtiers pour dispositifs électroniques Download PDF

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Publication number
WO2022154781A1
WO2022154781A1 PCT/US2021/013164 US2021013164W WO2022154781A1 WO 2022154781 A1 WO2022154781 A1 WO 2022154781A1 US 2021013164 W US2021013164 W US 2021013164W WO 2022154781 A1 WO2022154781 A1 WO 2022154781A1
Authority
WO
WIPO (PCT)
Prior art keywords
recessed region
rigid substrate
antenna
housing
conductive metal
Prior art date
Application number
PCT/US2021/013164
Other languages
English (en)
Inventor
Chi Hao Chang
Chih Jen Huang
Kuan-Ting Wu
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2021/013164 priority Critical patent/WO2022154781A1/fr
Publication of WO2022154781A1 publication Critical patent/WO2022154781A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components

Definitions

  • FIG. 1 A is a cross-sectional view illustrating an example housing for an electronic device in accordance with examples of the present disclosure
  • FIG. 1 B is a top plan view of the example housing shown in FIG. 1A in accordance with examples of the present disclosure
  • FIG. 2 is a cross-sectional view of another example housing for an electronic device in accordance with examples of the present disclosure
  • FIG. 3 is a cross-sectional view of another example housing for an electronic device in accordance with examples of the present disclosure
  • FIG. 4 is a cross-sectional view of yet another example housing for an electronic device in accordance with examples of the present disclosure:
  • FIG. 5 is a cross-sectional view of still another example housing for an electronic device in accordance with examples of the present disclosure
  • FIG. 6 is a top plan view of an example electronic device in accordance with examples of the present disclosure.
  • FIG. 7 is an interior view of an example housing for an electronic device in accordance with examples of the present disclosure.
  • FIG. 8 is a flowchart illustrating an example method of making a housing for an electronic device in accordance with examples of the present disclosure
  • FIG. 9 is a cross-sectional view of another example housing for an electronic device in accordance with examples of the present disclosure.
  • FIG. 10 is a cross-sectional view of yet another example housing for an electronic device in accordance with examples of the present disclosure.
  • a housing for an electronic device includes a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate.
  • the housing also includes an electrically insulating primer coat deposited in the recessed region of the rigid substrate.
  • the housing also includes a conductive metal antenna conformally deposited on the electrically insulated primer coat within the recessed region and positioned at the opening of the rigid substrate.
  • the rigid substrate can include metal, plastic, carbon fiber, a composite, or a combination thereof.
  • the housing can also include a second electrically insulating primer coat deposited over the conductive metal antenna over the recessed region.
  • the housing can also include a solid filler layer between the conductive metal antenna and the second electrically insulating primer coat over the recessed region, wherein the solid filler layer has a surface flush with a region of the exterior surface of the rigid substrate adjacent to the recessed region.
  • the housing can also include a base coat, a top coat, or both, over the second electrically insulating primer coat and the exterior surface of the rigid substrate, wherein the base coat includes a polymer and a pigment and wherein the top coat comprises a thermal curing resin or an ultraviolet-curing resin.
  • the electrically insulating primer coat can be composed of polyester, polyurethane, epoxy, epoxy-polyester, and/or epoxy-polyamide in combination with electrically non-conductive pigments including titanium dioxide, clay, mica, talc, barium sulfate, and/or calcium carbonate.
  • the conductive metal antenna can extend from the recessed region into the opening.
  • an electronic device includes an electronic component and a housing enclosing the electronic component.
  • the housing includes a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate.
  • the housing also includes an electrically insulating primer coat deposited in the recessed region of the rigid substrate.
  • the housing also includes a conductive metal antenna conformally deposited on the electrically insulated primer coat within the recessed region and positioned at the opening of the rigid substrate.
  • the electronic device can be a laptop computer, a desktop computer, a tablet computer, a smartphone, a television, or a printer.
  • the conductive metal antenna can be a WiFi antenna, a Bluetooth® antenna, a cellular antenna, a global positioning system (GPS) antenna, a Millimeter wave (mmWave) antenna, or a combination thereof.
  • the electronic component can be electrically coupled with the conductive metal antenna through the opening.
  • a method of making a housing for an electronic device includes: forming a recessed region in an exterior surface of a rigid substrate, forming an opening through the rigid substrate connecting the exterior surface to an interior surface thereof, wherein the recessed region is positioned at the opening, depositing an electrically insulating primer coat in the recessed region of the rigid substrate, and conformally depositing a conductive metal on the electrically insulating primer coat in the recessed region to form a conductive metal antenna positioned at the opening and within the recessed region.
  • conformally depositing the layer of conductive metal can include electrolessly plating the conductive metal and thickening the conductive metal by electroplating to form the conductive metal antenna.
  • the method can also include depositing a solid filler layer over the conductive metal antenna within the recessed region, wherein the solid filler layer has a surface flush with a region of the exterior surface of the rigid substrate adjacent to the recessed region, and depositing a second electrically insulating primer coat over the solid filler layer.
  • the method can also include applying a base coat, a top coat, or both, over the second electrically insulating primer coat, wherein the base coat includes a polymer and a pigment, and wherein the top coat comprises a thermal curing resin or an ultraviolet-curing resin.
  • the present disclosure describes housings for electronic devices that can include an integrated antenna.
  • Many electronic devices include an antenna or multiple antennas to allow wireless connectivity.
  • the antennas can allow devices to transmit and receive data wirelessly to and from other devices and wireless networks.
  • Some examples of antennas that are often included in electronic devices include WiFi antennas, Bluetooth® antennas, cellular antennas, a global positioning system (GPS) antenna, a Millimeter wave (mmWave) antenna, and others.
  • GPS global positioning system
  • mmWave Millimeter wave
  • Many electronic devices are designed with the antenna or antennas located internally, inside a housing of the electronic device. This design can be used for aesthetic reasons, or to provide physical protection for the antennas, or for other reasons. However, in some cases the external housings of electronic devices can block, diminish, or otherwise interfere with the radio waves that are sent and received by the antennas. In particular, when the housing of the electronic device is made of metal, the housing can block radio waves from being received by or transmitted by the antennas. Some designs include a “window” in the metal housing that can include an opening in the metal housing with a plastic insert placed in the opening to provide a nonconductive area for the radio waves to pass through. However, these housings can still reduce the effectiveness of the antennas. This design also places an additional constraint on the design of the electronic device, because the antenna placement is constrained to locations near the plastic window. Additionally, the plastic window can increase the complexity of manufacturing the housing and may reduce the strength and/or aesthetic appeal provided by the metal housing.
  • the housings for electronic devices described herein can include an integrated antenna that is on or near an exterior surface of the housing. This can allow for stronger signal transmission, better signal receiving range, and a wider angle of transmission and receiving compared to designs having the antenna located inside the housing.
  • a metal housing can include an integrated antenna at or near the exterior surface so that the antenna can receive and transmit freely, without being blocked by the metal housing.
  • the antenna can also operate without a plastic window formed in the metal housing.
  • the housing can be made of other materials such as plastic, carbon fiber, or others. Placing the integrated antenna on or near the exterior surface in these examples can also help to increase the range of the antenna. This design can also increase the available space inside the housing for other electronic components because the internal space is not occupied by the antenna.
  • the housings for electronic devices described herein can include a rigid substrate such as metal, plastic, carbon fiber, or another rigid material.
  • the rigid substrate can have an exterior surface that can be formed with a recessed region.
  • a conductive metal antenna can be conformally carried by the recessed region, meaning that the conductive metal antenna can conform to the shape of the surface of the recessed region.
  • An electrically insulating primer coat can be deposited on the recessed region before the conductive metal antenna is conformally deposited such that the electrically insulating primer coat can separate the conductive metal antenna from the exterior surface of the housing.
  • the electrically insulating primer coat can also electrically insulate the antenna from the exterior surface including electrically insulating the antenna from the recessed region.
  • the conductive metal antenna can be formed by depositing a layer of conductive metal on the electrically insulating primer coat over the recessed region.
  • the rigid substrate can also include an opening that extends through the rigid substrate to connect the recessed region to an interior surface of the substrate.
  • the conductive metal antenna can be positioned at the opening. Therefore, the antenna can be electrically connected to electronic components by accessing the antenna through the opening.
  • the electrically insulating primer coat can be deposited to coat the surfaces of the opening and electrically insulate the antenna from the surfaces of opening.
  • the present technology allows for an antenna, such as a conductive metal antenna, to be formed in a wide variety of shapes and sizes on the exterior surface of the housing of an electronic device.
  • the antenna located on the exterior surface of the housing with an electrically insulating primer coat also can eliminate a plastic insert molding component on the metal enclosure used for the antenna.
  • the antenna on the exterior surface of the housing also allows for a wide antenna signal receiving function angle.
  • more than one antenna can be formed on the exterior surface of the housing.
  • FIG. 1 A is a cross-sectional view of one example of a housing 100 for an electronic device.
  • the housing includes a rigid substrate 110 having an exterior surface 112 and an interior surface 114.
  • a recessed region 120 is on the exterior surface.
  • the recessed region is positioned at an opening 130 that extends through the rigid substrate connecting the recessed region to the interior surface of the rigid substrate.
  • An electrically insulating primer coat 145 is deposited over the recessed region.
  • a conductive metal antenna 140 is conformally formed in the recessed region and positioned at the opening. The conductive metal antenna is electrically insulated from or separated from the exterior surface by the electrically insulating primer coat.
  • FIG. 1 B is a top-down view of the housing 100 shown in FIG. 1A.
  • the rigid substrate is shaped appropriately to enclose internal components of an electronic device.
  • the view shown in FIG. 1 B is facing toward the exterior surface 112 of the housing.
  • the recessed region 120 is on the exterior surface.
  • the recessed region may be coated by the electrically insulating primer coat 145.
  • the opening 130 is located in the recessed region, and the conductive metal antenna 140 is deposited on the electrically insulating primer coat and can be conformally carried by the recessed region and positioned at the opening.
  • the “exterior” and “interior” surfaces of a housing refer to the positions of the respective surfaces when the housing is assembled with electronic components to form an electronic device.
  • the interior surface is the surface of the housing facing inward, toward the electronic components that are enclosed by the housing.
  • the exterior surface is the surface facing outward.
  • the housings described herein can be combined with additional housings to form an electronic device in which the internal electronic components are fully enclosed within the housings. Accordingly, a single housing may not make up the entire outer shell of an electronic device. Rather, in some examples, the outer shell of the electronic devices can be made up of multiple housings.
  • a laptop computer can include multiple housing pieces, such as a housing for the bottom of the keyboard portion of the laptop, a housing for the top of the keyboard portion of the laptop, a housing for the front of the monitor portion of the laptop, and another housing for the back of the monitor portion of the laptop. These pieces can individually be referred to as a “housing,” and all these housings together can be used to enclose the electronic components of the laptop.
  • an electronic device when used with respect to a housing enclosing electronic components, can mean a single housing fully enclosing the electronic components, or a single housing partially enclosing the electronic components, or a housing that can fully enclose the electronic components when used together with additional housings, or a housing that can partially enclose the electronic components when used together with additional housings.
  • an electronic device can include various openings in the housing, such as input/output ports, power jacks, vents, microphone openings, camera openings, monitor bezels, and so on.
  • the electrically insulating primer coat 145 can be considered an insulating layer and can be useful when the rigid substrate is a conductive material, such as metal.
  • the electrically insulating primer coat can electrically isolate the conductive metal antenna from the rigid substrate.
  • the rigid substrate can include a metal, and the insulating layer can electrically separate the conductive metal antenna from the metal of the rigid substrate.
  • the recessed region can be formed on the exterior surface of the rigid substrate and then the electrically insulating primer coat can be formed so that the recessed region is coated by the electrically insulating primer coat. The conductive metal antenna can then be formed over the electrically insulating primer coat within the recessed region.
  • the opening 130 can be formed connecting the exterior surface to the interior surface before the insulating layer is formed.
  • the opening can be located in or adjacent to the recessed region so that the opening connects the recessed region to the interior surface of the substrate.
  • the opening can be a circular hole that is about 0.1 to about 0.5 mm in diameter.
  • the opening can also be other shapes and sizes.
  • the electrically insulating primer coat 145 can then be formed so that the electrically insulating primer coat can coat the recessed region and the surfaces of the opening.
  • the opening is a circular hole formed through the substrate, then the insulating material of the electrically insulating primer coat can coat the sides of the hole.
  • the insulating material can coat the sides of the hole and the coating can extend to the interior surface of the substrate.
  • the opening can be formed after the electrically insulating primer coat has been deposited, so that the surfaces of the opening are not coated with insulating material.
  • FIG. 2 is a cross-sectional view of another example housing 100 that includes an insulating layer 150 which is the electrically insulating primer coat.
  • the insulating layer separates the conductive metal antenna 140 from the rigid substrate 110.
  • the exterior surface 112 and the interior surface 114 are both coated by the insulating layer.
  • the opening 130 has surfaces within the opening that are also coated by the insulating layer.
  • the insulating layer may not cover every surface, portion, or region of the housing but may cover the recessed region 120.
  • the conductive metal antenna is shaped such that the antenna extends through the opening to the interior surface of the rigid substrate.
  • the insulating layer on the surfaces of the opening insulates the antenna from the rigid substrate throughout the opening.
  • the conductive metal antenna can be electrically coupled to internal electronic components of an electronic device by connecting the antenna at the opening.
  • the antenna can be connected by soldering a wire to the antenna, forming a conductive trace to the antenna, directly connecting an electronic component to the antenna, or by another method.
  • the recessed region can be smoothed over using a solid filler material, such as a hardening putty.
  • a solid filler material such as a hardening putty.
  • the filler material can be placed in the recessed region over the conductive metal antenna. The material can then be smoothed or sanded to form a smooth surface that is flush with the exterior surface of the rigid substrate around the recessed region.
  • FIG. 3 is a cross-sectional view of an example housing 100 that includes a solid filler layer 160 over the recessed region 120.
  • the solid filler layer covers the conductive metal antenna 140.
  • the solid filler layer has a surface that is flush with the exterior surface 112 adjacent to the recessed region.
  • the surface of the solid filler can be flush with the outermost surface, including such insulating layer or other layers.
  • the solid filler can have a surface flush with the exterior surface of the rigid substrate itself. In other words, the solid filler can be flush with whatever is the outermost surface of the housing at the time the solid filler is added. In this way, the solid filler can form a smooth surface that hides the recessed region and the conductive metal antenna.
  • additional coating layers can be applied over the rigid substrate. Additional layers can include, for example, an electrically insulating primer coat, a base coat, a top coat, or combinations thereof.
  • the electrically insulating primer coat of the additional coating layers may be formed or composed of the same material as the electrically insulating primer coat of the insulating layer 150.
  • the electrically insulating primer coat can be applied first, followed by a base coat, followed by a top coat. Example compositions of these layers are described in more detail below.
  • FIG. 4 shows one example housing 100 that includes an electrically insulating primer coat 170 and a base coat 172.
  • the electrically insulating primer coat 170 may be considered a second coat of the electrically insulating primer coat as compared to the insulating layer 150 which is composed of the electrically insulating primer coat.
  • the housing also includes a rigid substrate 110 as in the previous examples.
  • the rigid substrate includes a recessed region 120 and an opening 130 connecting the recessed region to the interior surface 114 of the substrate.
  • An insulating layer 150 is formed on the rigid substrate, and a conductive metal antenna 140 composed of the electrically insulating primer coat is formed over the insulating layer.
  • a solid filler layer 160 is formed over the conductive metal antenna. The solid filler layer is smoothed over to be flush with the surface surrounding the recessed region.
  • the electrically insulating primer coat can include a polymer and the base coat can include a polymer and a pigment.
  • the electrically insulating primer coat and/or base coat can be opaque to hide the solid filler in the recessed region.
  • FIG. 5 is a cross-sectional view of another example housing 100.
  • This example includes an electrically insulating primer coat 170 and a base coat 172 applied overthe solid filler 160 and the insulating layer 150, as in the previous example.
  • This example also includes a top coat 174 applied over the base coat.
  • the top coat can include a thermal curing resin or an ultraviolet-curing resin.
  • the top coat can provide additional protection and other properties to the housing.
  • the housings described herein can be assembled with electronic components to form electronic devices.
  • multiple housings can be used to enclose internal electronic components.
  • a device such as a smart phone, tablet computer, or television can include a front housing and a back housing.
  • Internal components such as processors, printed circuit boards, batteries, display screens, and others can be placed between the front housing and back housing so that the housings enclose the electronic components.
  • the electronic device can be a laptop computer that includes a keyboard portion and a monitor portion connected by a hinge. Laptop covers sometimes include four separate housing pieces referred to as covers.
  • cover A a housing that is placed over the back of the monitor portion of the laptop
  • cover B a housing placed over the front of the monitor portion
  • cover C a housing that is placed on the top of the keyboard portion
  • cover D a housing that is placed on the bottom of the keyboard portion
  • FIG. 6 shows an example electronic device 200 which is a laptop computer.
  • the laptop computer has a cover A 210, or in other words, a housing located on the back of the monitor portion of the laptop computer, that includes two integrated conductive metal antennas 140.
  • the cover includes two recessed regions 120 that conformally carry the conductive metal antennas.
  • the recessed regions are selectively coated by an electrically insulating primer coat 145 that electrically insulate the conductive metal antennas from the cover.
  • the surfaces of the cover other than the recessed regions are not coated by the electrically insulating primer coat.
  • all surfaces of the cover are coated using the electrically insulating primer coat.
  • the cover also includes two openings 130 that allow the antennas to be connected to electronic components inside the laptop computer.
  • the opening may also be coated with the electrically insulating primer coat.
  • the recessed regions can be filled in with a solid filler material and smoothed over, and then additional coatings can be applied such as the second electrically insulating primer coat, base coat, and top coat mentioned above. With these additional coatings, the recessed regions and the conductive metal antennas can be hidden so that the cover has a uniform, smooth surface.
  • FIG. 7 shows the example laptop cover A 210 from FIG. 6, as viewed facing toward the interior surface 114 of the cover.
  • the two openings 130 in this example are two small holes that extend from the recessed regions to the interior surface of the cover.
  • the conductive metal antennas 140 in this example also extend through the openings so that the antennas are exposed at the interior surface of the cover.
  • the antennas are connected to wires 142 that can be soldered to the antennas at the interior surface of the cover.
  • the wires can lead to an electronic component inside the laptop, such as a motherboard, WiFi adapter, Bluetooth® adapter, cellular modem, a global positioning system (GPS) antenna, a Millimeter wave (mmWave) antenna, or others. Connecting the antennas to the internal electronic components in this way can provide flexibility in the placement of the antennas.
  • the antennas can be placed at any location on the housing where wires can reach to connect to the antennas.
  • Electronic components of the electronic device can be enclosed by the housing.
  • multiple housings can be used to enclose the electronic components.
  • Electronic components that are “enclosed” by the housing can include electronic components that are completely enclosed or partially enclosed, by a single housing or by multiple housings.
  • Many electronic devices include openings for charging ports, input/output ports, headphone ports, and so on. Accordingly, in some examples the housing can include openings for these purposes.
  • Certain electronic components may be designed to be exposed through an opening in the housing, such as display screens, keyboard keys, buttons, track pads, fingerprint scanners, cameras, and so on. Accordingly, the housings described herein can include openings for these components.
  • Other electronic components may be designed to be completely enclosed, such as motherboards, batteries, sim cards, wireless transceivers, memory storage drives, and so on.
  • the electronic device can be a laptop, a desktop, a keyboard, a mouse, a printer, a smartphone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a variety of other types of electronic devices that include an antenna. Housings for these electronic devices can have a variety of designs, depending on the shape and size of the electronic device.
  • FIG. 8 is a flowchart of an example method 300 of making a housing for an electronic device.
  • the method includes: forming a recessed region in an exterior surface of a rigid substrate 310; forming an opening through the rigid substrate connecting the exterior surface to an interior surface thereof, wherein the recessed region is positioned at the opening 320; depositing an electrically insulating primer coat in the recessed region of the rigid substrate 330; and conformally depositing a conductive metal on the electrically insulating primer coat in the recessed region to form a conductive metal antenna positioned at the opening and within the recessed region 340.
  • conformally depositing the layer of conductive metal can include electrolessly plating the conductive metal and thickening the conductive metal by electroplating to form the conductive metal antenna.
  • the operations of the example method shown in FIG. 8 can further include depositing a solid filler layer over the conductive metal antenna within the recessed region, wherein the solid filler layer has a surface flush with a region of the exterior surface of the rigid substrate adjacent to the recessed region, and depositing a second electrically insulating primer coat over the solid filler layer.
  • the 8 can further include applying a base coat, a top coat, or both, over the second electrically insulating primer coat, wherein the base coat includes a polymer and a pigment, and wherein the top coat comprises a thermal curing resin or an ultraviolet-curing resin.
  • the operations in the example method shown in FIG. 8 can be performed in a variety of orders, not limited to the order listed in the figure.
  • the recessed region can be formed first, followed by forming the opening connecting the recessed region to the interior surface, followed by conformally depositing the conductive metal antenna.
  • the conductive metal antenna can be deposited after forming the recessed region but before forming the opening, in further examples, the opening can be formed before the recessed region. Accordingly, these operations can be performed in a variety of orders.
  • the rigid substrate used to make the housings described herein can include a variety of rigid materials.
  • the rigid substrate can include metal, plastic, carbon fiber, a composite, or a combination thereof.
  • the rigid substrate can include or consist of a light metal.
  • the term “light metal” refers to metals and alloys that can be any metal of relatively low density including metal that is less than about 5 g/cm 3 .
  • light metal can be a material including aluminum, magnesium, titanium, lithium, zinc, and alloys thereof.
  • the light metal substrate can include aluminum, an aluminum alloy, magnesium, or a magnesium alloy.
  • Non-limiting examples of elements that can be included in aluminum or magnesium alloys can include aluminum, magnesium, titanium, lithium, niobium, zinc, bismuth, copper, cadmium, iron, thorium, strontium, zirconium, manganese, nickel, lead, silver, chromium, silicon, tin, gadolinium, yttrium, calcium, antimony, cerium, lanthanum, or others.
  • the light metal substrate can include an aluminum magnesium alloy made up of about 0.5% to about 13% magnesium by weight and 87% to 99.5% aluminum by weight.
  • Examples of specific aluminum magnesium alloys can include 1050, 1060, 1199, 2014, 2024, 2219, 3004, 4041 , 5005, 5010, 5019, 5024, 5026, 5050, 5052, 5056, 5059, 5083, 5086, 5154, 5182, 5252, 5254, 5356, 5454, 5456, 5457, 5557, 5652, 5657, 5754, 6005, 6005A, 6060, 6061 , 6063, 6066, 6070, 6082, 6105, 6162, 6262 ,6351 , 6463, 7005, 7022, 7068, 7072, 7075 ,7079, 7116, 7129, and 7178.
  • the light metal substrate can include magnesium metal, a magnesium alloy that is 99% or more magnesium by weight, or a magnesium alloy that is from about 50% to about 99% magnesium by weight.
  • the light metal substrate can include an alloy including magnesium and aluminum.
  • magnesium-aluminum alloys can include alloys made up of from about 91 % to about 99% magnesium by weight and from about 1 % to about 9% aluminum by weight, and alloys made up of about 0.5% to about 13% magnesium by weight and 87% to 99.5% aluminum by weight.
  • magnesium-aluminum alloys can include AZ63, AZ81 , AZ91 , AM50, AM60, AZ31 , AZ61 , AZ80, AE44, AJ62A, ALZ391 , AMCa602, LZ91 , and Magnox.
  • the rigid substrate can be shaped to fit as a housing for any type of electronic device, including the specific types of electronic devices described herein.
  • the rigid substrate can have any thickness suitable for a particular type of electronic device.
  • the thickness of the rigid substrate can be selected to provide a desired level of strength and weight for the housing of the electronic device.
  • the rigid substrate can have a thickness from about 0.5 mm to about 2 cm, from about 1 mm to about 1 .5 cm, from about 1 .5 mm to about 1 .5 cm, from about 2 mm to about 1 cm, from about 3 mm to about 1 cm, from about 4 mm to about 1 cm, or from about 1 mm to about 5 mm, though thicknesses outside of these ranges can be used.
  • metal rigid substrates can be treated to include a protective oxide layer or a passivation layer. The treatment can be performed before the electrically insulating primer coat is deposited.
  • a metal rigid substrate can be treated using micro-arc oxidation (MAO).
  • Micro-arc oxidation also referred to as plasma electrolytic oxidation, is an electrochemical process in which the surface of a metal is oxidized using micro-discharges of compounds on the surface of the substrate when immersed in a chemical or electrolytic bath, for example.
  • the electrolytic bath may include predominantly water with about 1 wt% to about 5 wt% electrolytic compound(s), e.g., alkali metal silicates, alkali metal hydroxide, alkali metal fluorides, alkali metal phosphates, alkali metal aluminates, the like, and combinations thereof.
  • the electrolytic compounds may likewise be included at from about 1 .5 wt% to about 3.5 wt%, or from about 2 wt% to about 3 wt%, though these ranges are not considered limiting.
  • a high-voltage alternating current can be applied to the substrate to create plasma on the surface of the substrate.
  • the substrate can act as one electrode immersed in the electrolyte solution
  • the counter electrode can be any other electrode that is also in contact with the electrolyte.
  • the counter electrode can be an inert metal such as stainless steel.
  • the bath holding the electrolyte solution can be conductive and the bath itself can be used as the counter electrode.
  • a high direct current or alternating voltage can be applied to the substrate and the counter electrode.
  • the voltage can be about 200 V or higher, such as about 200 V to about 600 V, about 250 V to about 600 V, about 250 V to about 500 V, or about 200 V to about 300 V.
  • Temperatures can be from about 20 °C to about 40 °C, or from about 25 °C to about 35 °C, for example, though temperatures outside of these ranges can be used.
  • This process can oxidize the surface to form an oxide layer from the substrate material.
  • Various metal or metal alloy substrates can be used including aluminium, titanium, lithium, magnesium, and/or alloys thereof, for example.
  • the oxidation can extend below the surface to form thick layers, as thick as 30 ⁇ m or more.
  • the oxide layer can have a thickness from about 1 ⁇ m to about 25 ⁇ m , from about 1 ⁇ m to about 22 ⁇ m , or from about 2 ⁇ m to about 20 ⁇ m .
  • Thickness can likewise be from about 2 ⁇ m to about 15 ⁇ m , from about 3 ⁇ m to about 10 ⁇ m , or from about 4 ⁇ m to about 7 ⁇ m .
  • the oxide layer can, in some instances, enhance the mechanical, wear, thermal, dielectric, and corrosion properties of the substrate.
  • the electrolyte solution can include a variety of electrolytes, such as a solution of potassium hydroxide.
  • the rigid substrate can include a micro-arc oxidation layer on one side, or on both sides. [0046] In a particular example, the rigid substrate can include an alloy of aluminum, magnesium, or a combination thereof.
  • the rigid substrate can be treated with micro-arc oxidation with a voltage from about 300 V to about 800 V for a time from about 5 minutes to about 25 minutes or until an oxide layer having a thickness from about 2 ⁇ m to about 15 ⁇ m has formed.
  • the electrolytic bath used during micro-arc oxidation in this example can include sodium silicate, metal phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, ferric ammonium oxalate, phosphoric acid salt, graphite powder, silicon dioxide powder, polyethylene oxide alkylphenolic ether, or a combination thereof.
  • a recessed region can be formed on the exterior surface of the rigid substrate.
  • the recessed region can be formed by removing material from a flat rigid substrate, such as by milling, drilling, grinding, laser ablation, or another method.
  • the recessed region can have a bottom surface that is below the original exterior surface of the rigid substrate, but which does not extend all the way through the substrate to the interior surface. The exception to this can be the opening that can be located in the recessed region or adjacent to the recessed region, which penetrates through the substrate to the interior surface.
  • the recessed region can be formed by stamping. For example, a thin substrate material can be stamped to have an area of the substrate recessed compared to the remainder of the exterior surface of the substrate.
  • the rigid substrate can be prepared in such a way that the rigid substrate includes a recessed region.
  • the rigid substrate can be molded, die cast, or thixomolded, and the mold used to form the shape of the rigid substrate can include the shape of the recessed region.
  • the recessed region can be present at the moment the rigid substrate is formed.
  • the substrate can be treated with micro-arc oxidation either before or after the recessed region has been formed. If the substrate is treated with micro-arc oxidation first, and then the recessed region is formed by cutting into the exterior surface, for example by CNC milling, then the recessed region can penetrate through the micro-arc oxidation layer. Alternatively, the recessed region can be formed before performing the micro-arc oxidation, and the micro-arc oxidation layer can be present on the surfaces of the recessed region.
  • the dimensions of the recessed region can be selected to provide a suitable space for the conductive metal antenna.
  • the recessed region can have a length and width from about 5 mm to about 100 mm, or from about 5 mm to about 50 mm, or from about 5 mm to about 25 mm, or from about 5 mm to about 10 mm, or from about 10 mm to about 25 mm, or from about 25 mm to about 50 mm.
  • the depth of the recessed region can also be selected to provide a sufficient depth for deposition of the conductive metal antenna.
  • the recessed region can have a depth from about 0.1 mm to about 10 mm, or from about 0.1 mm to about 5 mm, or from about 0.1 mm to about 1 mm, or from about 0.1 mm to about 0.8 mm.
  • an insulating layer composed of an electrically insulating primer coat can be applied to the rigid substrate after the recessed region has been formed and before the conductive metal antenna has been deposited.
  • the insulating layer can be included when the rigid substrate includes a metal.
  • the insulating layer can electrically insulate the conductive metal antenna from the metal substrate.
  • the insulating layer can include a polymer that is non-conductive.
  • the polymer can include polycarbonate, polyimide, polyurethane, polyethylene, polyamide, and polyvinylchloride.
  • a composition for the electrically insulating primer coat can include from about 30 wt% to about 75 wt% of polyester, polyurethane, epoxy, epoxy-polyester, epoxy-polyamide or a combination thereof.
  • the composition for the electrically insulating primer coat can further be in combination with electrically non-conductive pigments such as titanium dioxide, clay, mica, talc, barium sulfate, and calcium carbonate.
  • the electrically insulating primer coat can be formed by applying an insulating coating composition.
  • the insulating coating composition can be applied by a coating method such as dip coating, spraying, or another method.
  • the electrically insulating primer coat can have a thickness of about 5 ⁇ m to about 15 ⁇ m.
  • the electrically insulating primer coat can be cured at a temperature of about 60 degrees Celsiu to about 120 degrees Celsius for a time period of about 20 minutes to 60 minutes.
  • the electrically insulating primer coat may be part of an insulating layer that can also include electrically insulating materials such as fiberglass, glass wool, ceramic fiber, cellulose, cellular glass, elastomeric foam, phenolic foam, polyurethane foam, polyacrylate foam, or polystyrene foam.
  • the electrically insulating material can be included in the composition in an amount from about 10 wt% to about 35 wt%.
  • the insulating coating composition can be a waterborne composition and the polymer can be an aqueous emulsion.
  • the thickness of the insulating layer can be from about 1 ⁇ m to about 20 ⁇ m in some examples.
  • the thickness can be from about 5 ⁇ m to about 15 ⁇ m .
  • a second electrically insulating primer coat can be deposited over the conductive metal antenna or over the solid fill material.
  • the second electrically insulating primer coat may be composed of the same material and have the same properties as the first electrically insulating primer coat.
  • a conductive metal antenna can be conformally carried by the recessed region in the rigid substrate.
  • methods of making housings for electronic devices can include forming the antenna by depositing a conductive metal in the recessed substrate.
  • the antenna can be formed by depositing a layer of conductive metal and then patterning the layer of conductive metal to form the shape of the antenna. If an insulating layer is present, then the conductive metal can be deposited over the insulating layer. If a non-conductive material is used for the rigid substrate, then the conductive metal can be deposited directly onto the rigid substrate without an insulating layer.
  • a layer of conductive metal can be deposited using an electroless plating process.
  • Electroless plating refers to a chemical process in which metal is deposited on a surface through chemical reactions without application of electric current (as is used in electroplating).
  • an electroless plating process can include reducing metal cations in a liquid bath.
  • the liquid bath can include a solution of a metal salt and a reducing agent that can react with metal cations in the solution. When the metal cations are reduced, the metal cations can form a metallic layer on surfaces in contact with the liquid.
  • Such a liquid composition can be applied to the rigid substrate (with or without an insulating layer as explained above).
  • any suitable application method can be used, such as dipping the substrate in the liquid composition, or spraying the liquid composition onto the substrate, or other methods.
  • the rigid substrate can be masked so that the metal deposits are in a selected area, which can be within the recessed region of the substrate.
  • the conductive metal deposited by electroless plating can include copper, gold, silver, palladium, nickel, or a combination thereof.
  • the conductive metal can be copper.
  • the rigid substrate can be treated with a catalyst before applying the electroless plating composition.
  • a palladium catalyst can be used.
  • a composition including copper cations and a reducing agent can be applied to form electroless plated copper metal.
  • Copper cations can be supplied from dissolved Cu 2+ salts, such as copper(ll) sulfate, copper(ll) chloride, or copper(ll) phosphate.
  • the reducing agent can include formaldehyde.
  • the electroless plating chemical reaction can be allowed to proceed until a thin coating of conductive copper has been formed.
  • the copper coating can have a thickness of from about 100 nm to about 5 ⁇ m .
  • the electroless plated conductive metal can be thickened by electroplating. Electroplating processes involve applying an electric current across two electrodes.
  • the electroless plated metal coating can serve as one of the electrodes, onto which additional metal is to be electroplated.
  • the additional metal deposited by electroplating can be the same as the metal in the electroless plated metal coating.
  • a different metal can be electroplated.
  • copper can be applied by electroless plating and then more copper can be deposited using electroplating.
  • copper electroplating can be performed by immersing the electroless plated copper coating in a liquid bath including copper sulfate and sulfuric acid.
  • a copper anode can also be immersed in the bath, and the copper anode can be connected to the electroless plated copper coating so that the electroless plated coating is the cathode. Copper atoms can be converted to cations at the anode and then reduced at the cathode to deposit additional copper metal atoms over the electroless plated copper coating.
  • the electroplating process can be continued until a desired thickness is reached. In some examples, the thickness of the metal coating after electroplating can be from about 5 ⁇ m to about 30 ⁇ m .
  • the metal coating formed by electroless plating and electroplating can then be patterned to form the antenna.
  • a lithographic process can be used to pattern the antenna.
  • a resist material and an etchant can be used to selectively remove portions of the metal coating, leaving behind the antenna having the desired shape.
  • a positive or negative photoresist can be used. The photoresist can be patterned using light to form a mask having the shape of the antenna, and then an etchant can be applied to remove excess metal to form the antenna.
  • an opening can be formed in the substrate to allow the antenna to be connected to electronic components inside the housing.
  • the opening can be located at the recessed region, meaning that the opening can be within the recessed region or adjacent to the recessed region.
  • the opening can be located so that the antenna can be electrically connected to electronic components through the opening. Therefore, the opening can contact the antenna in some way that allows the antenna to contact a wire, a trace, a pin, or some other type of connection to electrically connect the antenna to an internal electronic component of the electronic device.
  • the opening can be small as long as an electrical connection can be made to the antenna through the opening.
  • the opening can have a diameter or width from about 0.1 mm to about 1 mm, or from about 0.1 mm to about 0.5 mm.
  • the method of making a housing for an electronic device can include forming the opening before adding the antenna.
  • the opening can be formed by drilling or otherwise forming a hole through the rigid substrate. The formation of the opening can also be performed before or after forming the recessed region on the exterior surface of the rigid substrate.
  • the opening can be formed in the rigid substrate and then an insulating layer can be formed over the rigid substrate. The insulating layer can coat the surfaces of the substrate, including the sides of the opening. The conductive metal antenna can then be added in a location that is at the opening.
  • the antenna can be directly over the opening, or partially over the opening, or adjacent to the opening, or the antenna can have a shape that extends into the opening.
  • the antenna can extend into the opening and all the way to the interior surface of the substrate.
  • the antenna can be formed by electroless plating and electroplating processes, and these processes can deposit metal within the opening so that the antenna includes conductive metal lining the surfaces of the opening.
  • FIG. 9 shows a close-up cross-sectional view of one example housing 100 made in this way.
  • the housing includes a rigid substrate 110 with a recessed region 120.
  • An opening 130 (hole) is formed through the substrate in the recessed region.
  • An insulating layer 150 composed of the electrically insulating primer coat is then deposited onto the rigid substrate.
  • a conductive metal antenna 140 is formed by a process including electroless plating, electroplating, and lithographic patterning as described above.
  • the cross-section shown in this figure cuts through the middle of the opening to show the layers of insulating material and conductive metal on the inside surfaces of the opening.
  • the conductive metal is plated within the opening so that a layer of conductive metal extends through the opening to the interior surface of the substrate.
  • additional layers can be added over the antenna, such as the solid filler, primer, base coat, and top coat layers described above.
  • the method can include forming the opening after adding the antenna.
  • the antenna can be formed in the recessed region, and then a small hole can be drilled through the antenna or adjacent to the antenna. The hole can be located so that a wire, trace, pin, or other type of electronic connector can be connected to the antenna through the hole.
  • FIG. 10 shows one such example housing 100.
  • This housing includes a rigid substrate 110 with a recessed region 120, an insulating layer 150 over the substrate, and a conductive metal antenna 140 formed over the insulating layer.
  • An opening 130 is formed by drilling through the antenna, the insulating layer, and the rigid substrate. The edge of the antenna is exposed at the opening, so that an electrical connection can be made to the antenna through the opening.
  • the remaining recessed volume of the recessed region can be filled in using a filler composition.
  • this composition can be a “putty-like” material that can be placed in the recessed region over the antenna.
  • the filler composition can be smoothed over to form a surface that is flush with the surrounding exterior surface of the substrate. If an insulating layer has been applied, then the filler composition can form a surface that is flush with the insulating layer on the substrate.
  • the filler can be hardenable to form a solid filler that fills the recessed region.
  • the filler composition can include a resin and a particulate solid material.
  • the resin can include polyacrylic resin, polyester resin, polyurethane resin, and others.
  • Particulate materials that can be used can include clay, titanium dioxide, talc, calcium carbonate, calcium sulfate, glass microspheres, and combinations thereof.
  • the filler composition can include a surfactant, such as an alcohol sulfate surfactant, an alkylbenzene sulfonate surfactant, sodium caseinate, sodium polyacrylate, sodium polyoxyethylene, alkylether carboxylate, sodium dodecyl sulfate, or others.
  • the filler composition can also include a solvent, such as methyl ethyl ketone, methyl isobutyl ketone, 3-methoxy-3-methyl-1 -butyl acetate, ethyl acetate, butyl acetate, or others.
  • the filler composition can also include a biocide such as 2-mercaptobenzothiazole or glutaraldehyde.
  • the ingredients described above can be included in any combination in the filler composition.
  • the amounts of the ingredients can be: about 10 wt% to about 20 wt% resin; about 30 wt% to about 50 wt% particulate solid material; about 0.3 wt% to about 2 wt% surfactant; about 25 wt% to about 35 wt% solvent; and about 0.1 wt% to about 0.5 wt% biocide.
  • a second electrically insulating primer coat can be applied after the solid filler material.
  • the second electrically insulating primer coat can be composed of the same materials as described for the first electrically insulating primer coat described above and can be subjected to the same thermal curing.
  • a base coat can be applied.
  • the base coat can be applied over the second electrically insulating primer coat.
  • the base coat can be applied over the solid filler material, insulating layer, and/or the rigid substrate.
  • the base coat can include a polymer and a pigment.
  • the polymer can include polyester, polyacrylic, polyurethane, polyurethane copolymer, or a combination thereof.
  • the pigment can include carbon black, titanium dioxide, clay, mica, talc, barium sulfate, calcium carbonate, synthetic pigment, metallic powder, aluminum oxide, organic powder, inorganic powder, plastic beads, colored pigments, dyes, or combinations thereof.
  • the base coat can also be thermally cured.
  • the thermal curing can include heating at a temperature from about 60 °C to about 120 °C for a time from about 10 minutes to about 60 minutes.
  • the base coat can have a thickness from about 8 ⁇ m to about 20 ⁇ m .
  • a top coat can also be applied. If an electrically insulating primer coat and base coat are present, then the top coat can be applied over the electrically insulating primer coat and base coat.
  • the top coat can be thermally curable.
  • the top coat can be radiation curable.
  • Thermally curable top coat compositions can include a polymer such as polyester, acrylic, polyurethane, or polyurethane copolymer. These materials can be cured by heating at a temperature from about 60 °C to about 120 °C for a time from about 30 minutes to about 60 minutes.
  • Radiation curable top coat compositions can include polyacrylic, polyurethane, urethane acrylates, acrylic acrylates, or epoxy acrylates which can be cured by applying ultraviolet radiation.
  • the top coat composition can be cured by heating followed by applying ultraviolet radiation. Heating can be performed at a temperature from about 50 °C to about 60 °C for a time from about 5 minutes to about 10 minutes. Then, ultraviolet radiation can be applied with an exposure of from about 700 mJ/cm 2 to about 1 ,200 mJ/cm 2 in a time period from about 10 seconds to about 30 seconds.
  • the top coat can have a thickness from about 10 pm to about 25 ⁇ m .
  • a layer that is referred to as being “on” or “over” a lower layer can be directly applied to the lower layer, or an intervening layer or multiple intervening layers can be located between the layer and the lower layer.
  • a layer such as an electrically insulating primer coat can be referred to as being “on” or “over” the rigid substrate and can be directly in contact with the rigid substrate, or there can be an intervening layer or multiple intervening layers, such as the insulating layer described that can be applied to the rigid substrate before the electrically insulating primer coat.
  • a layer thickness from about 0.1 ⁇ m to about 0.5 ⁇ m should be interpreted to include the explicitly recited limits of 0.1 ⁇ m to 0.5 pm, and to include thicknesses such as about 0.1 ⁇ m and about 0.5 ⁇ m , as well as subranges such as about 0.2 ⁇ m to about 0.4 ⁇ m , about 0.2 ⁇ m to about 0.5 pm, about 0.1 ⁇ m to about 0.4 ⁇ m , etc.
  • An example housing for an electronic device is made as follows.
  • a light metal rigid substrate is made by molding magnesium alloy in the form of a laptop “cover A” shape.
  • a CNC milling machine is used to form a recessed region in the exterior surface of the light metal rigid substrate.
  • the light metal substrate is subjected to micro-arc oxidation to form a protective oxide coating on the light metal substrate.
  • An insulating layer is formed over the light metal substrate, by depositing an electrically insulating primer coat with a thickness of about 10 ⁇ m.
  • a layer of copper is deposited by electroless plating on the bottom of the recessed region.
  • the layer of copper is thickened by electroplating additional copper onto the layer.
  • the layer of copper is lithographically patterned to form an antenna conformally carried by the recessed region.
  • a hole is drilled through the substrate at the antenna to allow the antenna to be electrically connected to internal electronic components inside the housing.
  • a putty material is placed in the recessed region to fill the remaining volume of the recessed region. The putty material is smoothed and allowed to harden to form a solid filler that has a surface flush with the exterior surface of the rigid substrate.
  • a second electrically insulating primer coat is applied composed of the same material as the electrically insulating primer coat.
  • An example housing for an electronic device is made as follows.
  • a light metal rigid substrate is made by die casting magnesium alloy in the form of a laptop “cover A” shape.
  • a recessed region in the exterior surface of the light metal rigid substrate is formed when the light metal rigid substrate is die cast.
  • the light metal substrate is subjected to passivation to form a protective oxide coating on the light metal substrate.
  • An insulating layer is formed over the light metal substrate, by depositing an electrically insulating primer coat with a thickness of about 10 ⁇ m .
  • a layer of copper is deposited by electroless plating on the bottom of the recessed region.
  • the layer of copper is thickened by electroplating additional copper onto the layer.
  • the layer of copper is lithographically patterned to form an antenna conformally carried by the recessed region.
  • a hole is drilled through the substrate at the antenna to allow the antenna to be electrically connected to internal electronic components inside the housing.
  • a putty material is placed in the recessed region to fill the remaining volume of the recessed region. The putty material is smoothed and allowed to harden to form a solid filler that has a surface flush with the exterior surface of the rigid substrate.
  • a second electrically insulating primer coat is applied composed of the same material as the electrically insulating primer coat.
  • a base coat and top coat are applied.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

La présente invention concerne des boîtiers pour dispositifs électroniques. Dans un exemple, un boîtier pour un dispositif électronique peut comprendre un substrat rigide ayant une surface extérieure comprenant une région évidée positionnée au niveau d'une ouverture s'étendant dans le substrat rigide reliant la région évidée à une surface intérieure du substrat rigide. Une couche d'apprêt électriquement isolante peut être déposée dans la région évidée du substrat rigide. Une antenne métallique conductrice peut être déposée de manière conforme sur la couche d'apprêt électriquement isolée à l'intérieur de la région évidée et positionnée au niveau de l'ouverture du substrat rigide.
PCT/US2021/013164 2021-01-13 2021-01-13 Boîtiers pour dispositifs électroniques WO2022154781A1 (fr)

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Cited By (1)

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WO2004057699A1 (fr) * 2002-12-10 2004-07-08 Hueihsin Sun Antenne a large bande
CN102956962A (zh) * 2011-08-24 2013-03-06 启碁科技股份有限公司 便携式电子装置、天线结构及天线制作方法
US8406832B2 (en) * 2009-04-02 2013-03-26 Shenzhen Futaihong Precision Industry Co., Ltd. Housing for electronic device
US20140284096A1 (en) * 2013-03-21 2014-09-25 Htc Corporation Casing of electronic device and method of manufacturing the same
US20170110787A1 (en) * 2015-10-14 2017-04-20 Apple Inc. Electronic Devices With Millimeter Wave Antennas And Metal Housings
CN107896462A (zh) * 2017-11-13 2018-04-10 广东欧珀移动通信有限公司 壳体及其制作方法、移动终端
CN108598670A (zh) * 2018-04-26 2018-09-28 维沃移动通信有限公司 一种天线、终端设备及天线的制作方法
US10370576B2 (en) * 2015-05-07 2019-08-06 Dupont Teijin Films U.S. Limited Partnership Polyester film with electrical insulation and heat conduction properties

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Publication number Priority date Publication date Assignee Title
WO2004057699A1 (fr) * 2002-12-10 2004-07-08 Hueihsin Sun Antenne a large bande
US8406832B2 (en) * 2009-04-02 2013-03-26 Shenzhen Futaihong Precision Industry Co., Ltd. Housing for electronic device
CN102956962A (zh) * 2011-08-24 2013-03-06 启碁科技股份有限公司 便携式电子装置、天线结构及天线制作方法
US20140284096A1 (en) * 2013-03-21 2014-09-25 Htc Corporation Casing of electronic device and method of manufacturing the same
US10370576B2 (en) * 2015-05-07 2019-08-06 Dupont Teijin Films U.S. Limited Partnership Polyester film with electrical insulation and heat conduction properties
US20170110787A1 (en) * 2015-10-14 2017-04-20 Apple Inc. Electronic Devices With Millimeter Wave Antennas And Metal Housings
CN107896462A (zh) * 2017-11-13 2018-04-10 广东欧珀移动通信有限公司 壳体及其制作方法、移动终端
CN108598670A (zh) * 2018-04-26 2018-09-28 维沃移动通信有限公司 一种天线、终端设备及天线的制作方法

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