WO2022153845A1 - モジュール - Google Patents

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Publication number
WO2022153845A1
WO2022153845A1 PCT/JP2021/048312 JP2021048312W WO2022153845A1 WO 2022153845 A1 WO2022153845 A1 WO 2022153845A1 JP 2021048312 W JP2021048312 W JP 2021048312W WO 2022153845 A1 WO2022153845 A1 WO 2022153845A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
shaped portion
support portion
metal member
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/048312
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
翔太 林
伸明 小川
裕希 浅野
昭宏 村中
孝紀 上嶋
宏通 北嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202190000968.8U priority Critical patent/CN220233161U/zh
Priority to JP2022575511A priority patent/JP7563493B2/ja
Publication of WO2022153845A1 publication Critical patent/WO2022153845A1/ja
Priority to US18/351,751 priority patent/US12349327B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/273—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being between laterally adjacent chips, e.g. walls between chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Definitions

  • the present invention relates to a module including a substrate on which electronic components are mounted.
  • the circuit module described in Patent Document 1 As an invention relating to a conventional module, for example, the circuit module described in Patent Document 1 is known.
  • This circuit module includes a circuit board, a plurality of electronic components, a conductive partition and an insulating resin layer.
  • the circuit board has a plate shape having an upper main surface.
  • the conductive partition is provided on the upper main surface of the circuit board.
  • the conductive partition is a single metal plate extending upward from the upper main surface of the circuit board.
  • the conductive partition includes a first component, a second component and a third component.
  • the first component and the second component extend in the left-right direction when viewed in the vertical direction.
  • the first component is provided in front of the right side of the second component.
  • the front end of the third component is connected to the left end of the first component.
  • the rear end of the third component is connected to the right end of the second component.
  • one metal plate is bent at two places, the boundary between the first component and the third component and the boundary between the second component and the third component.
  • the conductive partition divides the space on the circuit board into a first block and a second block.
  • the first block is the space in front of the conductive partition.
  • the second block is the space after the conductive partition.
  • the insulating resin layer covers a plurality of electronic components and conductive partitions.
  • electromagnetic interference between a part of a plurality of electronic components and the rest of the plurality of electronic components is suppressed by a conductive partition.
  • an object of the present invention is to provide a module that can widen the area in which electronic components can be mounted.
  • the module according to one embodiment of the present invention
  • a substrate having an upper main surface and a lower main surface arranged in the vertical direction,
  • a first plate-shaped portion provided on the upper main surface of the substrate, including a first plate-shaped portion having a front main surface and a rear main surface arranged in the front-rear direction when viewed in the vertical direction.
  • a first metal member mounted on the upper main surface of the substrate and arranged in front of the first metal member.
  • a second electronic component mounted on the upper main surface of the substrate and arranged after the first metal member.
  • a sealing resin layer provided on the upper main surface of the substrate and covering the first metal member, the first electronic component, and the second electronic component.
  • the first metal member further includes a first left support portion, and the first metal member further includes a first left support portion.
  • the boundary between the first plate-shaped portion and the first left support portion is defined as the first left boundary.
  • the first left boundary is located on the left side of the first metal member.
  • the first left support portion is bent with respect to the first plate-shaped portion at the first left boundary so as to be located before or after the first plate-shaped portion.
  • the lower end of the first plate-shaped portion and the lower end of the first left support portion are fixed to the substrate.
  • the lower end of the first plate-shaped portion and the lower end of the first left support portion so that the lower end of the first left boundary is located above the lower end of the first plate-shaped portion and the lower end of the first left support portion.
  • a first lower left notch extending upward from is provided.
  • the module according to the present invention can widen the area in which electronic components can be mounted.
  • FIG. 1 is a perspective view of the module 10.
  • FIG. 2 is a top view of the module 10.
  • FIG. 3 is a cross-sectional view of the module 10 in AA.
  • FIG. 4 is a cross-sectional view of the module 10 in BB.
  • FIG. 5 is a perspective view of the first metal member 14.
  • FIG. 6 is a top view of the first metal member 14 and the mounting electrode 12a.
  • FIG. 7 is a cross-sectional view of the first metal member 14 and the mounting electrode 12a.
  • FIG. 8 is a combined view of the rear view of the first metal member 14 and the cross-sectional view of the substrate 12.
  • FIG. 9 is a perspective view of the first metal member 14 at the time of mounting.
  • FIG. 10 is a cross-sectional view of the module 10 at the time of manufacture.
  • FIG. 11 is a cross-sectional view of the module 10 at the time of manufacture.
  • FIG. 12 is a top view of the circuit module 500 and the module 10 described in Patent Document 1.
  • FIG. 13 is a top view of the first metal member 14a.
  • FIG. 14 is a top view of the first metal member 14b.
  • FIG. 15 is a top view of the first metal member 14c.
  • FIG. 16 is a top view of the first metal member 14d.
  • FIG. 17 is a perspective view of the first metal member 14e.
  • FIG. 18 is a top view of the first metal member 14, the mounting electrode 12a, and the solder 122 of the module 10a.
  • FIG. 19 is a top view of the first metal member 14, the mounting electrode 12a, and the solder 122 of the module 10b.
  • FIG. 20 is a top view of the first metal member 14, the mounting electrodes 12a, and the solders 122a to 122e of the module 10c.
  • FIG. 21 is a rear view of the first metal member 14f according to the ninth modification.
  • FIG. 22 is a rear view of the first metal member 14 g according to the tenth modification.
  • FIG. 23 is a rear view of the first metal member 14h according to the eleventh modification.
  • FIG. 24 is a rear view of the first metal member 14i according to the twelfth modification.
  • FIG. 25 is a rear view of the first metal member 14j according to the thirteenth modification.
  • FIG. 26 is a perspective view of the first metal member 14k according to the 14th modification.
  • FIG. 27 is a top view of the module 10d including the first metal member 14k.
  • FIG. 28 is a top view of the first metal member 14 and the second metal member 214 according to the fifteenth modification.
  • FIG. 29 is a top view of the first metal member 14 and the second metal member 214 according to the 16th modification.
  • FIG. 30 is a top view of the first metal member 14 and the second metal member 214 according to the 17th modification.
  • FIG. 1 is a perspective view of the module 10.
  • FIG. 2 is a top view of the module 10.
  • FIG. 3 is a cross-sectional view of the module 10 in AA.
  • FIG. 4 is a cross-sectional view of the module 10 in BB.
  • FIG. 5 is a perspective view of the first metal member 14.
  • FIG. 6 is a top view of the first metal member 14 and the mounting electrode 12a.
  • FIG. 7 is a cross-sectional view of the first metal member 14 and the mounting electrode 12a.
  • FIG. 8 is a combined view of the rear view of the first metal member 14 and the cross-sectional view of the substrate 12.
  • the substrate 12 of the module 10 has a plate shape. Therefore, the direction in which the upper main surface SU2 and the lower main surface SD2 of the substrate 12 are lined up is defined as the vertical direction. As shown in FIG. 2, when viewed in the vertical direction, the direction in which the front main surface SF3 and the rear main surface SB3 of the first plate-shaped portion 140 of the first metal member 14 are lined up is defined as the front-rear direction. Further, the direction orthogonal to the front-back direction and the up-down direction is defined as the left-right direction. The vertical, horizontal, and front-back directions are orthogonal to each other.
  • the vertical direction, the horizontal direction, and the front-rear direction do not have to coincide with the vertical direction, the left-right direction, and the front-rear direction when the module 10 is actually used.
  • the upward direction and the downward direction may be exchanged, the left direction and the right direction may be exchanged, and the front direction and the rear direction may be exchanged.
  • Reference numerals X to Z are members or parts constituting the module 10.
  • X and Y arranged in the front-rear direction indicate the following states. Looking at X and Y in the direction perpendicular to the front-back direction, both X and Y are arranged on an arbitrary straight line indicating the front-back direction.
  • X and Y arranged in the front-rear direction when viewed in the vertical direction indicate the following states. Looking at X and Y in the vertical direction, both X and Y are arranged on an arbitrary straight line indicating the front-back direction.
  • X and Y when X and Y are viewed from a left-right direction different from the up-down direction, one of X and Y may not be arranged on an arbitrary straight line indicating the front-back direction. In addition, X and Y may be in contact with each other. X and Y may be separated. Z may exist between X and Y. This definition also applies to directions other than the front-back direction.
  • X is placed before Y means the following state. At least a portion of X is located in the region through which Y translates forward. Therefore, X may be contained in the region through which Y is translated in the forward direction, or may protrude from the region through which Y is translated in the forward direction. In this case, X and Y are arranged in the front-rear direction. This definition also applies to directions other than the front-back direction.
  • X is placed before Y means the following state.
  • X is placed in front of a plane that passes through the front end of Y and is orthogonal to the front-back direction.
  • X and Y may or may not be aligned in the front-rear direction. This definition also applies to directions other than the front-back direction.
  • each part of X is defined as follows.
  • the front part of X means the front half of X.
  • the rear part of X means the rear half of X.
  • the left part of X means the left half of X.
  • the right part of X means the right half of X.
  • the upper part of X means the upper half of X.
  • the lower part of X means the lower half of X.
  • the front end of X means the front end of X.
  • the rear end of X means the rear end of X.
  • the left end of X means the left end of X.
  • the right end of X means the right end of X.
  • the upper end of X means the upper end of X.
  • the lower end of X means the lower end of X.
  • the front end portion of X means the front end portion of X and its vicinity.
  • the rear end portion of X means the rear end portion of X and its vicinity.
  • the left end portion of X means the left end portion of X and its vicinity.
  • the right end portion of X means the right end portion of X and its vicinity.
  • the upper end portion of X means the upper end portion of X and its vicinity.
  • the lower end of X means the lower end of X and its vicinity.
  • any two members are defined as X and Y in the present specification, the relationship between the two members has the following meaning.
  • X is supported by Y when X is immovably attached to (that is, fixed) to Y with respect to Y, and X is with respect to Y. This includes the case where it is movably attached to Y. Further, the case where X is supported by Y includes both the case where X is directly attached to Y and the case where X is attached to Y via Z.
  • X and Y are electrically connected means that electricity is conducted between X and Y. Therefore, X and Y may be in contact with each other, or X and Y may not be in contact with each other. When X and Y are not in contact with each other, a conductive Z is arranged between X and Y.
  • Module 10 is, for example, a high frequency module.
  • the high frequency module is, for example, an analog front-end module of a portable wireless communication device.
  • the module 10 is not limited to the high frequency module.
  • the module 10 includes a substrate 12, a first metal member 14, electronic components 16a to 16e, a sealing resin layer 18, and a shield 20.
  • the substrate 12 is a multilayer wiring board having a structure in which a plurality of insulator layers made of, for example, low-temperature co-fired ceramics, high-temperature co-fired ceramics, glass epoxy, etc. are laminated.
  • the substrate 12 has a plate shape. Therefore, as shown in FIGS. 2 to 4, the substrate 12 has an upper main surface SU2, a lower main surface SD2, a left surface SL2, a right surface SR2, a front surface SF2, and a rear surface SB2.
  • the substrate 12 has a rectangular shape when viewed in the vertical direction.
  • An electric circuit is provided inside the upper main surface SU2 of the substrate 12, the lower main surface SD2 of the substrate 12, and the substrate 12 by means of a conductor layer and an interlayer connecting conductor. However, the details of the electric circuit will be described later.
  • the first metal member 14 is provided on the upper main surface SU2 of the substrate 12.
  • the first metal member 14 has a structure in which one metal plate is bent.
  • the first metal member 14 is made of, for example, tough pitch copper. Instead of tough pitch copper, brass, phosphor bronze, SUS, aluminum and the like may be used.
  • the thickness of the first metal member 14 is, for example, 50 ⁇ m.
  • the first metal member 14 includes a first plate-shaped portion 140, a first left support portion 150, and a first right support portion 152.
  • the first plate-shaped portion 140 has a front main surface SF3 and a rear main surface SB3.
  • the front main surface SF3 and the rear main surface SB3 are arranged in the front-rear direction when viewed in the vertical direction.
  • the first plate-shaped portion 140 is provided on the upper main surface SU2 of the substrate 12.
  • the first plate-shaped portion 140 extends upward from the upper main surface SU2 of the substrate 12.
  • the first plate-shaped portion 140 is slightly inclined backward with respect to the vertical direction. That is, the normal vector of the front main surface SF3 of the first plate-shaped portion 140 has a slightly upward component.
  • the normal vector of the rear main surface SB3 of the first plate-shaped portion 140 has a slightly downward component.
  • the first plate-shaped portion 140 has a rectangular shape when viewed in the front-rear direction.
  • the first plate-shaped portion 140 is provided with the first plate-shaped portion upper cutouts 142a and 142b and the first plate-shaped portion lower cutouts 144a to 144d. Therefore, strictly speaking, the first plate-shaped portion 140 has a shape different from the rectangular shape when viewed in the front-rear direction. Therefore, as shown in FIG. 4, the line connecting the upper ends of the first plate-shaped portion 140 in the left-right direction when viewed in the front-rear direction is defined as the upper side LU of the first plate-shaped portion.
  • a line connecting the lower ends of the first plate-shaped portion 140 in the left-right direction when viewed in the front-rear direction is defined as the lower side LD of the first plate-shaped portion 140.
  • the upper side LU of the first plate-shaped portion exists at a position separated upward from the substrate 12 from the lower side LD of the first plate-shaped portion.
  • the notch is a depression formed on the outer edge of the first plate-shaped portion 140 due to a partial loss of the first plate-shaped portion 140.
  • the notches herein include, for example, U-shaped defects extending from the sides of a rectangular plate in a direction orthogonal to the sides, and angular U-shaped defects.
  • the notches 142a and 142b on the first plate-shaped portion extend downward from the upper side LU of the first plate-shaped portion.
  • the notches 142a and 142b on the first plate-shaped portion have a U shape when viewed in the front-rear direction. That is, the first plate-shaped upper cutouts 142a and 142b have a shape in which a rectangle having an upper side, a lower side, a left side, and a right side and a semicircle protruding downward from the lower side of the rectangle are combined.
  • the lower ends of the notches 142a and 142b on the first plate-shaped portion are located above the center of the first plate-shaped portion 140 in the vertical direction when viewed in the front-rear direction.
  • the first plate-shaped upper notch 142a is located to the left of the first plate-shaped upper notch 142b.
  • the vertical length of the first plate-shaped portion upper cutouts 142a and 142b is, for example, half or less of the vertical length of the first plate-shaped portion 140.
  • the width of the notches 142a and 142b on the first plate-shaped portion in the left-right direction is, for example, 150 ⁇ m.
  • the notches 144a to 144d under the first plate-shaped portion extend upward from the lower side LD of the first plate-shaped portion.
  • the lower notches 144a to 144d of the first plate-shaped portion have a U-shape that is upside down when viewed in the front-rear direction. That is, the first plate-shaped lower cutouts 144a to 144d have a shape in which a rectangle and a semicircle protruding upward from the upper side of the rectangle are combined.
  • the upper ends of the notches 144a to 144d under the first plate-shaped portion are located below the center of the first plate-shaped portion 140 in the vertical direction when viewed in the front-rear direction.
  • the notches 144a to 144d under the first plate-shaped portion are arranged in a row from left to right in this order.
  • the notches 144a to 144d under the first plate-shaped portion are arranged at equal intervals in the left-right direction when viewed in the front-rear direction.
  • the vertical length of the first plate-shaped portion lower notch 144a to 144d is, for example, half or less of the vertical length of the first plate-shaped portion 140.
  • the width of the first plate-shaped lower cutout 144a to 144d in the left-right direction is, for example, 150 ⁇ m.
  • the boundary between the first plate-shaped portion 140 and the first left support portion 150 is defined as the first left boundary B1.
  • the first left boundary B1 is located on the left side of the first plate-shaped portion 140. More precisely, the first left boundary B1 is located at the left end of the first plate-shaped portion 140. However, the vicinity of the boundary between the first plate-shaped portion 140 and the first left support portion 150 is curved. Hereinafter, this curved portion is referred to as a curved portion 151.
  • the first left boundary B1 is a portion located at the same distance from both ends of the curved portion 151 when viewed in the vertical direction.
  • the portion of the curved portion 151 located to the right of the first left boundary B1 is a part of the first plate-shaped portion 140.
  • the portion of the curved portion 151 located after the first left boundary B1 is a part of the first left support portion 150.
  • the first left support portion 150 is connected to the first plate-shaped portion 140 at the first left boundary B1.
  • the first left support portion 150 is bent with respect to the first plate-shaped portion 140 at the first left boundary B1 so as to be located behind the first plate-shaped portion 140.
  • the first left support portion 150 extends rearwardly from the first plate-shaped portion 140 at the first left boundary B1.
  • the extension of the first left support portion 150 in the rear direction includes the following two states. -A state in which the first left support portion 150 is parallel to the rear direction. -A state in which the first left support portion 150 forms an angle of 45 degrees or less in the rear direction and the clockwise direction when viewed in the vertical direction.
  • the first left support portion 150 forms an angle of 45 degrees or less in the rear direction and the counterclockwise direction when viewed in the vertical direction.
  • the first left support portion 150 is parallel to the rear direction. .. That is, the first left support portion 150 forms an angle of 90 ° with the first plate-shaped portion 140.
  • Such a first left support portion 150 is formed by bending the left end portion of the first metal member 14 in the rearward direction.
  • the first left support portion 150 cannot be bent at a portion other than the vicinity of the first left boundary B1. Therefore, the first left support portion 150 has a flat plate shape.
  • the first left support portion 150 includes a left main surface SL4 and a right main surface SR4.
  • the first left support portion 150 has a rectangular shape when viewed in the left-right direction.
  • the vertical position of the upper end of the first left support portion 150 coincides with the vertical position of the upper side LU of the first plate-shaped portion 140 of the first plate-shaped portion 140.
  • the vertical position of the lower end 150D of the first left support portion 150 coincides with the vertical position of the lower side LD of the first plate-shaped portion 140 of the first plate-shaped portion 140.
  • the first lower left notch 146 is provided in the first plate-shaped portion 140 and the first left support portion 150. More specifically, the lower end B1D of the first left boundary B1 is located above the lower end of the first plate-shaped portion 140 (that is, the lower side LD of the first plate-shaped portion) and the lower end 150D of the first left support portion 150. , The lower end of the first plate-shaped portion 140 (that is, the lower side LD of the first plate-shaped portion) and the first lower left notch 146 extending upward from the lower end 150D of the first left support portion 150 are provided.
  • the first lower left notch 146 has a U-shape that is upside down. That is, the first lower left notch 146 has a shape in which a rectangle and a semicircle protruding upward from the upper side of the rectangle are combined.
  • the first lower left notch 146 is formed so as to straddle the first plate-shaped portion 140 and the first left support portion 150.
  • the first left support portion 150 is bent rearward with respect to the first plate-shaped portion 140. Therefore, the first plate-shaped portion 140 is provided with a half of the U-shape that is upside down when viewed in the front-rear direction. When viewed in the left-right direction, the other half of the U-shape that is upside down is provided on the first left support portion 150.
  • the depth of the first lower left notch 146 is equal to the depth of the first plate-shaped lower notch 144a to 144d. Therefore, the position of the upper end 146U of the first lower left notch 146 in the vertical direction is the same as the position of the upper ends 144aU to 144dU of the first plate-shaped lower notch 144a to 144d in the vertical direction.
  • the boundary between the first plate-shaped portion 140 and the first right support portion 152 is defined as the first right boundary B2.
  • the first right support portion 152 has a structure symmetrical to that of the first left support portion 150. More specifically, the first right support portion 152 is connected to the first plate-shaped portion 140 at the first right boundary B2. The first right support portion 152 is bent with respect to the first plate-shaped portion 140 at the first right boundary B2 so as to be located behind the first plate-shaped portion 140. In the present embodiment, the first right support portion 152 extends rearwardly from the first plate-shaped portion 140 at the first right boundary B2.
  • the first right support portion 152 is parallel to the rear direction. That is, the first right support portion 152 forms an angle of 90 ° with the first plate-shaped portion 140.
  • Such a first right support portion 152 is formed by bending the right end portion of the first metal member 14 in the rearward direction.
  • the first right support portion 152 cannot be bent at a portion other than the vicinity of the first right boundary B2. Therefore, the first right support portion 152 has a flat plate shape.
  • the first right support portion 152 includes the left main surface SL5 and the right main surface SR5.
  • the first right support portion 152 has a rectangular shape when viewed in the left-right direction.
  • the vertical position of the upper end of the first right support portion 152 coincides with the vertical position of the upper side LU of the first plate-shaped portion 140 of the first plate-shaped portion 140.
  • the vertical position of the lower end 152D of the first right support portion 152 coincides with the vertical position of the lower side LD of the first plate-shaped portion 140 of the first plate-shaped portion 140.
  • the first lower right notch 148 is provided in the first plate-shaped portion 140 and the first right support portion 152. More specifically, as shown in FIG. 5, the lower end B2D of the first right boundary B2 is the lower end of the first plate-shaped portion 140 (that is, the lower side LD of the first plate-shaped portion) and the lower end 152D of the first right support portion 152. A first lower right notch 148 extending upward from the lower end of the first plate-shaped portion 140 (that is, the lower side LD of the first plate-shaped portion) and the lower end 152D of the first right support portion 152 so as to be located higher. It is provided.
  • the first lower right notch 148 has a U-shape that is upside down. That is, the first lower right notch 148 has a shape in which a rectangle and a semicircle protruding upward from the upper side of the rectangle are combined.
  • the first lower right notch 148 is formed so as to straddle the first plate-shaped portion 140 and the first right support portion 152.
  • the first right support portion 152 is bent in the rear direction with respect to the first plate-shaped portion 140. Therefore, the first plate-shaped portion 140 is provided with a half of the U-shape that is upside down when viewed in the front-rear direction. When viewed in the left-right direction, the other half of the U-shape that is upside down is provided on the first right support portion 152.
  • the depth of the first lower right notch 148 is equal to the depth of the first plate-shaped lower notch 144a to 144d. Therefore, the position of the upper end 148U of the first lower right notch 148 in the vertical direction is the same as the position of the upper ends 144aU to 144dU of the first plate-shaped lower cutout 144a to 144d in the vertical direction.
  • the first metal member 14 configured as described above is fixed to the substrate 12.
  • the fixing of the first metal member 14 to the substrate 12 will be described below.
  • the substrate 12 includes mounting electrodes 12a, as shown in FIGS. 3 and 5.
  • the mounting electrode 12a is provided on the upper main surface SU2 of the substrate 12.
  • the mounting electrode 12a includes a mounting electrode main portion 120a, a mounting electrode left end portion 120b, and a mounting electrode right end portion 120c.
  • the mounting electrode main portion 120a has a rectangular shape having a long side extending in the left-right direction when viewed in the up-down direction.
  • the left end portion 120b of the mounting electrode is connected to the left end portion of the mounting electrode main portion 120a.
  • the left end portion 120b of the mounting electrode extends rearward from the left end portion of the mounting electrode main portion 120a.
  • the right end portion 120c of the mounting electrode is connected to the right end portion of the mounting electrode main portion 120a.
  • the right end portion 120c of the mounting electrode extends rearward from the right end portion of the mounting electrode main portion 120a.
  • solder 122 is applied to the upper surface of the mounting electrode 12a.
  • the solder 122 overlaps the entire first metal member 14 when viewed in the vertical direction. More precisely, the solder 122 overlaps the entire lower end of the first metal member 14 when viewed in the vertical direction.
  • the lower end of the first plate-shaped portion 140 is fixed to the mounting electrode main portion 120a by the solder 122.
  • the solder 122 is wetted on the front main surface SF3 and the rear main surface SB3 at the lower end portion of the first plate-shaped portion 140.
  • the lower end of the first left support portion 150 is fixed to the left end portion 120b of the mounting electrode by solder 122.
  • the solder 122 is wetted to the left main surface SL4 and the right main surface SR4 at the lower end portion of the first left support portion 150.
  • the lower end of the first right support portion 152 is fixed to the right end portion 120c of the mounting electrode by solder 122.
  • the solder 122 is wetted to the left main surface SL5 and the right main surface SR5 at the lower end portion of the first right support portion 152.
  • the lower end of the first plate-shaped portion 140, the lower end of the first left support portion 150, and the lower end of the first right support portion 152 are fixed to the substrate 12.
  • the substrate 12 further includes the interlayer connecting conductors va to ve and the ground conductor layer G.
  • the ground conductor layer G is provided in the substrate 12.
  • the ground conductor layer G is exposed from the right side SR2 of the substrate 12.
  • the interlayer conductors va to ve electrically connect the mounting electrode 12a and the ground conductor layer G.
  • the interlayer connection conductors va to ve are arranged in a row in this order from left to right under the first metal member 14 when viewed in the front-rear direction.
  • the interlayer connecting conductors va to ve are arranged at equal intervals under the first metal member 14. The distance between the adjacent interlayer connection conductors va to ve is, for example, 1/4 of the wavelength of the high frequency signal transmitted through the signal conductor layer (not shown) of the substrate 12.
  • the interlayer connecting conductor va is located between the first lower left notch 146 and the first plate-shaped lower notch 144a in the left-right direction.
  • the interlayer connection conductor vb is located between the first plate-shaped lower cutout 144a and the first plate-shaped lower cutout 144b in the left-right direction.
  • the interlayer connecting conductor vc is located between the first plate-shaped lower cutout 144b and the first plate-shaped lower cutout 144c in the left-right direction.
  • the interlayer connection conductor vd is located between the first plate-shaped lower cutout 144c and the first plate-shaped lower cutout 144d in the left-right direction.
  • the interlayer connecting conductor v is located between the first plate-shaped lower notch 144d and the first lower right notch 148 in the left-right direction.
  • the electronic components 16a and 16b are mounted on the upper main surface SU2 of the substrate 12 as shown in FIGS. 1 and 3.
  • the mounting method of the electronic component 16a is, for example, mounting by soldering.
  • the electronic components 16a and 16b are chip components such as semiconductor elements such as ICs and PAs (power amplifiers), chip inductors, chip capacitors, and chip resistors.
  • the electronic components 16a and 16b are arranged before the first metal member 14.
  • the electronic components 16a and 16b are arranged in front of the first metal member 14. Therefore, the electronic components 16a and 16b overlap with the first metal member 14 when viewed in the front-rear direction.
  • the electronic components 16c to 16e (second electronic components) are mounted on the upper main surface SU2 of the substrate 12.
  • the mounting method of the electronic components 16c to 16e is, for example, mounting by soldering.
  • Electronic components 16c to 16e are chip components such as semiconductor elements such as ICs and PAs (power amplifiers), chip inductors, chip capacitors, and chip resistors.
  • the electronic components 16c to 16e are arranged after the first metal member 14.
  • the electronic components 16c to 16e are arranged after the first metal member 14. Therefore, the electronic components 16c to 16e overlap with the first metal member 14 when viewed in the front-rear direction.
  • the sealing resin layer 18 is provided on the upper main surface SU2 of the substrate 12.
  • the sealing resin layer 18 covers the first metal member 14 and the electronic components 16a to 16e.
  • the material of the sealing resin layer 18 is, for example, an epoxy resin.
  • the sealing resin layer 18 has a rectangular cuboid shape. Therefore, the sealing resin layer 18 has an upper surface SU1, a lower surface SD1, a left surface SL1, a right surface SR1, a front surface SF1, and a rear surface SB1.
  • the first left support portion 150 is not exposed from the sealing resin layer 18 on the left surface SL1 of the sealing resin layer 18.
  • the first right support portion 152 is not exposed from the sealing resin layer 18 on the right surface SR1 of the sealing resin layer 18.
  • the upper end of the first plate-shaped portion 140, the upper end of the first left support portion 150, and the upper end of the first right support portion 152 are exposed on the upper surface SU1 of the sealing resin layer 18.
  • the upper end of the first plate-shaped portion 140, the upper end of the first left support portion 150, and the upper end of the first right support portion 152 are exposed from the sealing resin layer 18 on the upper surface SU1 of the sealing resin layer 18. ..
  • the shield 20 covers the upper surface SU1 of the sealing resin layer 18.
  • the shield 20 covers the upper surface SU1, the left surface SL1, the right surface SR1, the front surface SF1 and the rear surface SB1, and the left surface SL2, the right surface SR2, the front surface SF2, and the rear surface SB2 of the substrate 12. ..
  • the shield 20 is electrically connected to the first metal member 14. Specifically, the shield 20 is in contact with a portion where the first metal member 14 is exposed from the sealing resin layer 18. Further, the shield 20 is connected to the ground conductor layer G exposed from the right side SR2 of the substrate 12. As a result, the shield 20 is connected to the ground potential.
  • the shield 20 has a multi-layer structure.
  • the shield 20 includes an adhesion layer, a conductive layer and a protective layer.
  • the adhesion layer, the conductive layer, and the protective layer are laminated in this order from the lower layer to the upper layer.
  • the adhesion layer plays a role of increasing the adhesion strength between the conductive layer and the sealing resin layer 18.
  • the material of the adhesion layer is, for example, SUS (Stainless Steel).
  • the conductive layer functions as a shield.
  • the material of the conductive layer is, for example, a metal such as Cu, Ag, or Al.
  • the protective layer serves to prevent corrosion of the conductive layer.
  • the material of the protective layer is, for example, SUS.
  • FIG. 9 is a perspective view of the first metal member 14 at the time of mounting.
  • 10 and 11 are cross-sectional views of the module 10 at the time of manufacture.
  • the first metal member 14 further includes a top surface portion 149.
  • the top surface portion 149 is located between the first plate-shaped portion upper notch 142a and the first plate-shaped portion upper notch 142b when viewed in the front-rear direction.
  • the top surface portion 149 extends in the rear direction from the upper side LU (see FIG. 4) of the first plate-shaped portion.
  • the top surface portion 149 is formed by bending a part of the first metal member 14 in the rear direction.
  • the top surface portion 149 is used for mounting the first metal member 14. Specifically, the top surface portion 149 is adsorbed using a mounting machine. Then, the first metal member 14 is moved by the mounting machine, and the lower end of the first plate-shaped portion 140, the lower end of the first left support portion 150, and the lower end of the first right support portion 152 are set on the mounting electrode 12a. After that, the lower end of the first plate-shaped portion 140, the lower end of the first left support portion 150, and the lower end of the first right support portion 152 are fixed to the mounting electrode 12a by the solder 122. At this time, solder is applied to each of the lower end of the first plate-shaped portion 140, the lower end of the first left support portion 150, and the lower end of the first right support portion 152, and the solder is also applied to the mounting electrode 12a.
  • the sealing resin layer 18 is formed on the upper main surface SU2 of the substrate 12.
  • the sealing resin layer 18 is formed so that the sealing resin layer 18 covers the entire surface of the upper main surface SU2 of the substrate 12.
  • the substrate 12 is set in the mold.
  • the molten resin molten resin
  • the molten resin passes through the first plate-shaped upper cutouts 142a and 142b and the first plate-shaped lower cutouts 144a to 144d, and spreads over the entire upper main surface SU2 of the substrate 12.
  • the electronic components 16a to 16e and the first metal member 14 are located in the sealing resin layer 18. That is, the electronic components 16a to 16e and the first metal member 14 are not exposed from the sealing resin layer 18.
  • the upper main surface SU of the sealing resin layer 18 is ground with a grindstone.
  • the grindstone grinds the upper surface SU1 of the sealing resin layer 18 while moving backward with respect to the upper surface SU1 of the sealing resin layer 18, for example.
  • the upper end of the first plate-shaped portion 140 is exposed from the upper surface SU1 of the sealing resin layer 18.
  • the top surface portion 149 of the first metal member 14 is ground.
  • the substrate 12 and the sealing resin layer 18 are separated by cutting the substrate 12 and the sealing resin layer 18 in the vertical direction using a dicer. At this time, the left surface SL1, the right surface SR1, the front surface SF1 and the rear surface SB1 of the sealing resin layer 18 are formed.
  • the shield 20 is formed on the upper surface SU1, the left surface SL1, the right surface SR1, the front surface SF1 and the rear surface SB1 of the sealing resin layer 18.
  • the adhesion layer, the conductive layer and the protective layer are formed by performing sputtering three times.
  • the surface roughness of the upper end, the left end, and the right end of the first metal member 14 is larger than the surface roughness of the front main surface SF3 and the rear main surface SB3 of the first plate-shaped portion 140. Therefore, the adhesion layer adheres to the upper end, the left end, and the right end of the first metal member 14 with high adhesion strength.
  • the module 10 is completed by the above steps.
  • the area in which the electronic component can be mounted can be widened. More specifically, the first left support portion 150 is bent with respect to the first plate-shaped portion 140 at the first left boundary B1 so as to be located behind the first plate-shaped portion 140. As a result, the first left support portion 150 is located at the left end portion of the first metal member 14. Further, the first right support portion 152 is bent with respect to the first plate-shaped portion 140 at the first right boundary B2 so as to be located behind the first plate-shaped portion 140. As a result, the first right support portion 152 is located at the right end portion of the first metal member 14.
  • the electronic component can be arranged close to the first plate-shaped portion 140.
  • the area in which the electronic component can be mounted can be widened.
  • FIG. 12 is a top view of the circuit module 500 and the module 10 described in Patent Document 1.
  • the conductive partition 514 includes a first component 514a, a second component 514b, and a third component 514c.
  • the first component 514a and the second component 514b extend in the left-right direction when viewed in the vertical direction.
  • the first component 514a is provided in front of the right side of the second component 514b.
  • the front end of the third component 514c is connected to the left end of the first component 514a.
  • the rear end of the third component 514c is connected to the right end of the second component 514b.
  • the conductive partition 514 and the first metal member 14 from the viewpoint of shielding property, it is often desired to arrange electronic components near the center of the conductive partition 514 in the left-right direction and near the center of the first metal member 14 in the left-right direction.
  • a portion A503 in which an electronic component cannot be arranged is formed in the center of the conductive partition 514 in the left-right direction.
  • the module 10 a portion A103 in which electronic components cannot be arranged is formed at the left end portion and the right end portion of the first metal member 14. Therefore, it is easy to arrange the electronic component near the center of the first metal member 14 in the left-right direction. From the above, according to the module 10, the area in which the electronic component can be mounted can be widened for the following reasons as well.
  • the module 10 has the following effects when an electronic component that generates magnetic flux is arranged in the vicinity of the first metal member 14. More specifically, the first metal member 14 may convert the magnetic flux into an eddy current to shield it. In this case, the magnetic flux may be incident perpendicular to the first metal member 14. Therefore, in the module 10, the first left support portion 150 is bent with respect to the first plate-shaped portion 140 at the first left boundary B1 so as to be located after the first plate-shaped portion 140. As a result, the first left support portion 150 is located at the left end portion of the first metal member 14. Similarly, the first right support portion 152 is bent with respect to the first plate-shaped portion 140 at the first right boundary B2 so as to be located behind the first plate-shaped portion 140.
  • the first right support portion 152 is located at the right end portion of the first metal member 14. Therefore, in the first metal member 14, there is no portion protruding in the front direction or the rear direction from the first plate-shaped portion 140 other than the left end portion and the right end portion of the first metal member 14. As a result, the magnetic flux tends to be vertically incident on the first plate-shaped portion 140. As a result, the shielding effect of the first metal member 14 is improved.
  • the first left support portion 150 and the first right support portion 152 extend in the rear direction from the first plate-shaped portion 140.
  • the magnetic flux entering the module 10 from the left or right direction of the module 10 can be shielded. Therefore, it becomes easy to arrange the electronic components in the vicinity of the left end portion and the right end portion of the first metal member 14.
  • the first left support portion 150 is formed by bending the left end portion of the first metal member 14.
  • a protrusion protruding downward is formed at the lower end of the first left boundary B1, which is the bending line of the first metal member 14.
  • the posture of the first metal member 14 varies.
  • the lower end of the first plate-shaped portion 140 and the lower end of the first plate-shaped portion 140 so that the lower end B1D of the first left boundary B1 is located above the lower end of the first plate-shaped portion 140 and the lower end 150D of the first left support portion 150.
  • a first lower left notch 146 extending upward from the lower end 150D of the first left support portion 150 is provided.
  • the protrusions are suppressed from protruding below the lower end of the first plate-shaped portion 140 and the lower end 150D of the first left support portion 150.
  • the protrusions are suppressed from coming into contact with the mounting electrode 12a. From the above, it is possible to suppress the occurrence of variation in the posture of the first metal member 14.
  • the first metal member 14 can be bent with high accuracy. More specifically, in the module 10, in the first plate-shaped portion 140, the lower end of the first left boundary B1 is located above the lower end of the first plate-shaped portion 140 and the lower end 150D of the first left support portion 150. A first lower left notch 146 extending upward from the lower end and the lower end 150D of the first left support portion 150 is provided. This reduces the amount of metal on the first left boundary B1. As a result, the first metal member 14 can be easily bent. Therefore, according to the module 10, the first metal member 14 can be bent with high accuracy.
  • the position of the upper end 146U of the first lower left notch 146 in the vertical direction is the same as the position of the upper ends 144aU to 144dU of the first plate-shaped lower notch 144a to 144d in the vertical direction. Therefore, the length of the first lower left notch 146 in the vertical direction is large. As a result, it is more effectively suppressed that the protrusions protrude below the lower end of the first plate-shaped portion 140 and the lower end 150D of the first left support portion 150. From the above, according to the module 10, it is possible to suppress the occurrence of variation in the posture of the first metal member 14.
  • the module 10 it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed. More specifically, in the module 10, the first left support portion 150 extends rearward from the left end of the first plate-shaped portion 140. As a result, when the first metal member 14 is pressured backward by the molten resin, the first metal member 14 is supported by the first left support portion 150. As a result, according to the module 10, it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed.
  • the substrate 12 includes interlayer connecting conductors va to ve and a ground conductor layer G.
  • the interlayer connecting conductors va to ve are arranged at equal intervals under the first metal member 14.
  • the distance between the adjacent interlayer connection conductors va to ve is, for example, 1/4 of the wavelength of the high frequency signal transmitted through the signal conductor layer (not shown) of the substrate 12.
  • the electromagnetic wave of the high-frequency signal transmitted through the signal conductor layer tends to generate a standing wave in the interlayer connection conductors va to ve.
  • the interlayer conductors va to ve are connected to the ground conductor layer.
  • the electromagnetic wave of the high-frequency signal transmitted through the signal conductor layer flows to the ground via the interlayer connecting conductors va to ve and the ground conductor layer G. Therefore, the electromagnetic wave of the high-frequency signal transmitted through the signal conductor layer does not easily pass through the interlayer connection conductors va to ve in the front-rear direction.
  • the shielding property between the region before the first metal member 14 and the region after the first metal member 14 in the substrate 12 is improved.
  • the module 10 it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed. More specifically, the first plate-shaped portion 140 is provided with the first plate-shaped portion lower notch 144a to 144d. As a result, the molten resin can pass through the notches 144a to 144d under the first plate-shaped portion. As a result, it is suppressed that a large pressure is applied to the first metal member 14. Therefore, it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed.
  • the module 10 it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed.
  • the first plate-shaped portion 140 is provided with notches 142a and 142b on the first plate-shaped portion extending downward from the upper side LU of the first plate-shaped portion.
  • the molten resin can pass through the notches 142a and 142b on the first plate-shaped portion.
  • the module 10 it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed. More specifically, the first plate-shaped portion 140 is provided with the first plate-shaped portion upper cutouts 142a and 142b and the first plate-shaped portion lower cutouts 144a to 144d. As a result, the magnitude of the pressure applied to the first plate-shaped portion 140 by the molten resin approaches uniform throughout the first plate-shaped portion 140. As a result, according to the module 10, it is possible to prevent the first metal member 14 from collapsing when the sealing resin layer 18 is formed.
  • the first metal member 14 is greatly tilted in the front-rear direction. More specifically, the first plate-shaped portion 140 forms an angle substantially perpendicular to the substrate 12. As a result, as shown in FIG. 7, the solder 122 evenly adheres to the front main surface SF3 and the rear main surface SB3 of the first plate-shaped portion 140. As a result, the magnitude of the force that pulls the first plate-shaped portion 140 in the forward direction due to the surface tension of the solder 122 and the magnitude of the force that pulls the first plate-shaped portion 140 in the backward direction due to the surface tension of the solder 122 are substantially defined. Become equal. As a result, the first metal member 14 is prevented from being greatly tilted in the front-rear direction.
  • the first metal member 14 includes the first left support portion 150.
  • the noise that is about to enter the module 10 from the left side of the module 10 is absorbed by the first left support portion 150.
  • noise is suppressed from entering the module 10.
  • the noise from the module 10 toward the left is absorbed by the first left support portion 150.
  • noise is suppressed from being emitted from the module 10. From the above, the shielding property of the module 10 is improved.
  • the amount of grinding of the upper surface SU1 of the sealing resin layer 18 is small. More specifically, in the module 10, the entire surface of the first metal member 14 of FIG. 9 is covered with the sealing resin layer 18, and then the upper surface SU1 of the sealing resin layer 18 is ground. At this time, the upper surface SU1 of the sealing resin layer 18 is ground until the height of the sealing resin layer 18 in the vertical direction reaches the design value.
  • the top surface portion 149 of FIG. 9 is slightly inclined upward with respect to the front-rear direction.
  • the top surface portion 149 is located above the upper end of the first plate-shaped portion 140. Therefore, it is necessary to increase the height of the sealing resin layer 18 in the vertical direction and cover the entire first metal member 14 with the sealing resin layer 18. As a result, if the upper surface SU1 of the sealing resin layer 18 is ground until the height of the sealing resin layer 18 in the vertical direction reaches the design value, the amount of cutting of the sealing resin layer 18 increases.
  • the first plate-shaped portion 140 is slightly inclined backward with respect to the vertical direction.
  • the top surface portion 149 of FIG. 9 is slightly inclined downward with respect to the front-rear direction.
  • the top surface portion 149 is located below the upper end of the first plate-shaped portion 140. Therefore, the entire first metal member 14 can be covered with the sealing resin layer 18 without increasing the height of the sealing resin layer 18 in the vertical direction. Therefore, when the upper surface SU1 of the sealing resin layer 18 is ground until the height of the sealing resin layer 18 in the vertical direction reaches the design value, the cutting amount of the sealing resin layer 18 can be small.
  • the mounting electrode 12a is composed of one electrode.
  • the interlayer connection conductors va to ve are electrically connected by the mounting electrode 12a. Therefore, the interlayer connection conductors va to ve may be arranged in any way as long as they are connected to the mounting electrode 12a. That is, the degree of freedom in arranging the interlayer connection conductors va to ve is increased. As a result, it becomes easy to adopt the arrangement of the interlayer connection conductors va to ve so as to improve the shielding property.
  • the lower end of the first left boundary B1 is located above the lower end of the first plate-shaped portion 140 (that is, the lower side LD of the first plate-shaped portion) and the lower end 150D of the first left support portion 150.
  • a first lower left notch 146 extending upward from the lower end of the plate-shaped portion 140 and the lower end 150D of the first left support portion 150 is provided. That is, the first lower left notch 146 is provided below the first left boundary B1 between the first plate-shaped portion 140 and the first left support portion 150.
  • the first plate-shaped portion 140 is slightly inclined backward with respect to the vertical direction. As a result, solder easily adheres to the first left support portion 150 and the first right support portion 152. As a result, the first metal member 14 is firmly fixed to the mounting electrode 12a.
  • FIG. 13 is a top view of the first metal member 14a.
  • the first metal member 14a is first at an angle formed by the first plate-shaped portion 140 and the first left support portion 150 and at an angle formed by the first plate-shaped portion 140 and the first right support portion 152. It is different from the metal member 14.
  • the angle formed by the first plate-shaped portion 140 and the first left support portion 150 and the angle formed by the first plate-shaped portion 140 and the first right support portion 152 are 45 ° as shown in FIG. be. That is, the first right support portion 152 is bent by 135 °. Since the other structures of the first metal member 14a are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 14 is a top view of the first metal member 14b.
  • the first metal member 14b is first at an angle formed by the first plate-shaped portion 140 and the first left support portion 150 and at an angle formed by the first plate-shaped portion 140 and the first right support portion 152. It is different from the metal member 14.
  • the angle formed by the first plate-shaped portion 140 and the first left support portion 150 and the angle formed by the first plate-shaped portion 140 and the first right support portion 152 are 30 ° as shown in FIG. be. That is, the first right support portion 152 is bent by 150 °. Since the other structures of the first metal member 14b are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 15 is a top view of the first metal member 14c.
  • the first metal member 14c is first at an angle formed by the first plate-shaped portion 140 and the first left support portion 150 and at an angle formed by the first plate-shaped portion 140 and the first right support portion 152. It is different from the metal member 14.
  • the angle formed by the first plate-shaped portion 140 and the first left support portion 150 and the angle formed by the first plate-shaped portion 140 and the first right support portion 152 are 0 ° as shown in FIG. be. That is, the first right support portion 152 is bent by 180 °. Since the other structures of the first metal member 14c are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 16 is a top view of the first metal member 14d.
  • the first metal member 14d is first at an angle formed by the first plate-shaped portion 140 and the first left support portion 150 and at an angle formed by the first plate-shaped portion 140 and the first right support portion 152. It is different from the metal member 14.
  • the angle formed by the first plate-shaped portion 140 and the first left support portion 150 and the angle formed by the first plate-shaped portion 140 and the first right support portion 152 are 135 ° as shown in FIG. be. That is, the first right support portion 152 is bent by 45 °. Since the other structures of the first metal member 14c are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 17 is a perspective view of the first metal member 14e.
  • the first metal member 14e is different from the first metal member 14 in the shapes of the first lower left notch 146 and the first lower right notch 148. More specifically, the upper end 146U of the first lower left notch 146 is located below the upper ends 144aU to 144dU of the first plate-shaped lower notch 144a to 144d. That is, the depth of the first lower left notch 146 is shallower than the depth of the first plate-shaped lower notch 144a to 144d. Similarly, the upper end 148U of the first lower right notch 148 is located below the upper ends 144aU to 144dU of the first plate-shaped lower notch 144a to 144d.
  • the depth of the first lower right notch 148 is shallower than the depth of the first plate-shaped lower notch 144a to 144d. Since the other structures of the first metal member 14e are the same as those of the first metal member 14, the description thereof will be omitted. Similarly to the first metal member 14, the first metal member 14e having such a structure also suppresses the occurrence of variation in the posture of the first metal member 14e.
  • FIG. 18 is a top view of the first metal member 14, the mounting electrode 12a, and the solder 122 of the module 10a.
  • the module 10a is different from the module 10 in the shapes of the solders 122a to 122e.
  • the solders 122a to 122c are provided on the mounting electrode main portion 120a.
  • the solders 122a to 122c are arranged in this order from left to right.
  • the solder 122d is provided on the left end portion 120b of the mounting electrode.
  • the solder 122e is provided on the right end portion 120c of the mounting electrode.
  • the solder does not overlap with the vicinity of the first left boundary B1 and the vicinity of the first right boundary B2 of the first metal member 14 when viewed in the vertical direction. It is possible to prevent solder from adhering to the first left boundary B1 and the first right boundary B2. Therefore, the first metal member 14 is less likely to fall forward or backward. Since the other structures of the module 10a are the same as those of the module 10, the description thereof will be omitted.
  • FIG. 19 is a top view of the first metal member 14, the mounting electrode 12a, and the solder 122 of the module 10b.
  • Module 10b is different from module 10 in the shape of the mounting electrode 12a.
  • the mounting electrode main portion 120a, the mounting electrode left end portion 120b, and the mounting electrode right end portion 120c are separated from each other.
  • the mounting electrode 12a does not overlap with the vicinity of the first left boundary B1 and the vicinity of the first right boundary B2 of the first metal member 14 when viewed in the vertical direction. Therefore, the solders 122a, 122d, and 122e do not overlap with the vicinity of the first left boundary B1 and the vicinity of the first right boundary B2 of the first metal member 14. Since the other structures of the module 10b are the same as those of the module 10, the description thereof will be omitted.
  • the mounting electrode 12a since the mounting electrode 12a is separated into the mounting electrode main portion 120a, the mounting electrode left end portion 120b, and the mounting electrode right end portion 120c, the solder does not easily get wet and spread on the mounting electrode 12a. Therefore, the possibility that the solder gets wet on the first left boundary B1 and the first right boundary B2 is further reduced.
  • FIG. 20 is a top view of the first metal member 14, the mounting electrodes 12a, and the solders 122a to 122e of the module 10c.
  • the module 10c is different from the module 10a in the shape of the mounting electrode 12a.
  • the mounting electrode main portion 120a, the mounting electrode left end portion 120b, and the mounting electrode right end portion 120c are separated from each other.
  • the mounting electrode 12a does not overlap with the vicinity of the first left boundary B1 and the vicinity of the first right boundary B2 of the first metal member 14 when viewed in the vertical direction.
  • the solders 122a to 122c are provided on the mounting electrode main portion 120a.
  • the solder 122d is provided on the left end portion 120b of the mounting electrode.
  • the solder 122e is provided on the right end portion 120c of the mounting electrode.
  • the solders 122a to 122e do not overlap with the vicinity of the first left boundary B1 and the vicinity of the first right boundary B2 of the first metal member 14. Since the other structures of the module 10c are the same as those of the module 10, the description thereof will be omitted.
  • FIG. 21 is a rear view of the first metal member 14f according to the ninth modification.
  • the first metal member 14f is different from the first metal member 14 in that the first plate-shaped lower cutouts 144a to 144d are not provided. Since the other structures of the first metal member 14f are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 22 is a rear view of the first metal member 14 g according to the tenth modification.
  • first metal member 14g a point where the first plate-shaped lower cutouts 144a and 144d are not provided and the first plate-shaped lower cutouts 144b and 144c are connected to form one first plate-shaped lower cutout 144e. In that respect, it differs from the first metal member 14. Since the other structures of the first metal member 14g are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 23 is a rear view of the first metal member 14h according to the eleventh modification.
  • the first metal member 14h is different from the first metal member 14g in that the left and right widths of the first plate-shaped lower cutout 144e are large. Since the other structures of the first metal member 14h are the same as those of the first metal member 14g, the description thereof will be omitted.
  • FIG. 24 is a rear view of the first metal member 14i according to the twelfth modification.
  • the first metal member 14i is different from the first metal member 14 in that notches 142c and 142d on the first plate-shaped portion are provided.
  • the first plate-shaped upper notch 142c is provided to the left of the first plate-shaped upper notch 142a.
  • the first plate-shaped upper notch 142d is provided to the right of the first plate-shaped upper notch 142b. Since the other structures of the first metal member 14i are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 25 is a rear view of the first metal member 14j according to the thirteenth modification.
  • the first metal member 14j is different from the first metal member 14 in that the first plate-shaped lower cutouts 144c and 144d are not provided. Since the other structures of the first metal member 14j are the same as those of the first metal member 14, the description thereof will be omitted.
  • FIG. 26 is a perspective view of the first metal member 14k according to the 14th modification.
  • FIG. 27 is a top view of the module 10d including the first metal member 14k.
  • the first metal member 14k is different from the first metal member 14 in that the length of the first left support portion 150 in the front-rear direction is long. More specifically, the first left support portion 150 extends rearwardly from the left end of the first plate-shaped portion 140. The length of the first left support portion 150 in the front-rear direction is equivalent to the length of the first plate-shaped portion 140 in the left-right direction. When viewed in the left-right direction, the side connecting the lower ends of the first left support portion 150 in the front-rear direction is defined as the lower side LD1 of the first left support portion.
  • the first left support portion 150 is provided with first left support portion lower notches 154a to 154d extending upward from the lower side LD1 of the first left support portion.
  • the side connecting the upper ends of the first left support portion 150 in the front-rear direction is defined as the upper side LU1 of the first left support portion.
  • the first left support portion 150 is provided with notches 156a to 156d on the first left support portion that extend downward from the upper side LU1 of the first left support portion.
  • the first metal member 14k does not include the first right support portion 152. Since the other structures of the first metal member 14k are the same as those of the first metal member 14, the description thereof will be omitted.
  • the first metal member 14a and the electronic components 16f and 16g are provided on the upper main surface SU2 of the substrate 12 of the module 10d.
  • the electronic component 16f is arranged in front of the first plate-shaped portion 140.
  • the electronic component 16g is arranged after the first plate-shaped portion 140. Further, the electronic component 16g is arranged to the right of the first left support portion 150. As a result, the electronic component 16g is surrounded by the first metal member 14a.
  • the electronic component 16g of the first metal member 14a has a high shielding effect in the forward direction and the left direction.
  • an L-shaped structure can be obtained without connecting a plurality of metal members. Therefore, in the first metal member 14a, a gap is not formed between the plurality of metal members, so that a high shielding effect of the first metal member 14a can be obtained.
  • FIG. 28 is a top view of the first metal member 14 and the second metal member 214 according to the fifteenth modification.
  • Module 10e differs from module 10 in that it further includes a second metal member 214.
  • the second metal member 214 has the same structure as the first metal member 14. More specifically, the second metal member 214 includes a second plate-shaped portion 240, a second left support portion 250, and a second right support portion 252.
  • the boundary between the second plate-shaped portion 240 and the second left support portion 250 is defined as the second left boundary B3.
  • the second left boundary B3 is located on the left side of the second metal member 214.
  • the boundary between the second plate-shaped portion 240 and the second right support portion 252 is defined as the second right boundary B4.
  • the second right boundary B4 is located on the right side of the second metal member 214.
  • the second plate-shaped portion 240 is provided on the upper main surface SU2 of the substrate 12.
  • the second plate-shaped portion 240 has a front main surface SF5 and a rear main surface SB5 that are arranged in the front-rear direction when viewed in the vertical direction.
  • the second left support portion 250 is bent with respect to the second plate-shaped portion 240 at the second left boundary B3 so as to extend forward from the second plate-shaped portion 240 at the second left boundary B3.
  • the second right support portion 252 is bent with respect to the second plate-shaped portion 240 at the second right boundary B4 so as to extend forward from the second plate-shaped portion 240 at the second right boundary B4.
  • the lower end of the second plate-shaped portion 240, the lower end of the second left support portion 250, and the lower end of the second right support portion 252 are fixed to the substrate 12.
  • the distance between the rear end of the first left support 150 and the front end of the second right support 252 is smaller than the length of the first left support 150 in the front-rear direction.
  • the rear end portion of the first left support portion 150 and the front end portion of the second right support portion 252 are in contact with each other.
  • the rear end portion of the first left support portion 150 and the front end portion of the second right support portion 252 are connected via a solder (conductive joint material).
  • the first left support portion 150 and the second right support portion 252 are fixed to the left end portion 120b of the mounting electrode. As a result, both the first metal member 14 and the second metal member 214 are stably connected to the ground potential.
  • the distance between the two electronic components in the front-rear direction can be shortened.
  • two electronic components can be arranged side by side in the left-right direction.
  • the first left support portion 150 of the first metal member 14 and the second right support portion 252 of the second metal member 214 are present between the two electronic components. Therefore, the space between the two electronic components is shielded. In this way, according to the module 10e, it is possible to shield between the two electronic components while reducing the distance between the two electronic components in the front-rear direction.
  • the first left support portion 150 and the second right support portion 252 can form a shield extending in the front-rear direction.
  • the gap formed between the first left support portion 150 and the second right support portion 252 can be reduced. More specifically, the first plate-shaped portion 140 is slightly inclined backward with respect to the vertical direction. The second plate-shaped portion 240 is slightly inclined forward with respect to the vertical direction. In this way, the first plate-shaped portion 140 and the second plate-shaped portion 240 are inclined so as to approach each other. Therefore, the first left support portion 150 and the second right support portion 252 come close to each other. As a result, according to the module 10e, the gap formed between the first left support portion 150 and the second right support portion 252 becomes smaller. As a result, the shielding effect of the first metal member 14 and the second metal member 214 is enhanced.
  • a metal member having a shape in which the first metal member 14 and the second metal member 214 are combined can be manufactured with high accuracy. More specifically, when a metal member having a shape obtained by combining the first metal member 14 and the second metal member 214 is manufactured by processing one metal plate, four bending points are one metal. Occurs on the board. If the number of bent parts of the metal member increases, it is difficult to form the metal member with high accuracy. Therefore, in the module 10e, the first metal member 14 having two bending points and the second metal member 214 having two bending points are combined. Each of the first metal member 14 and the second metal member 214 can be manufactured with high accuracy. Therefore, a metal member having a shape in which the first metal member 14 and the second metal member 214 are combined can be manufactured with high accuracy.
  • metal members having various shapes can be produced by combining the first metal member 14 and the second metal member 214 having the same shape. It is not necessary to prepare a plurality of types of metal members having various shapes. As a result, metal members having various shapes can be manufactured at low cost.
  • the rear end portion of the first left support portion 150 and the front end portion of the second right support portion 252 are connected via a solder (conductive joint material). Therefore, the potential of the first metal member 14 and the potential of the second metal member 214 tend to be the ground potential.
  • FIG. 29 is a top view of the first metal member 14 and the second metal member 214 according to the 16th modification.
  • the module 10f is different from the module 10e in that the second metal member 214 does not include the second right support portion 252. Therefore, the distance between the rear end portion of the first left support portion 150 and the right end portion of the second plate-shaped portion 240 is smaller than the length of the first left support portion 150 in the front-rear direction.
  • the rear end portion of the first left support portion 150 and the right end portion of the second plate-shaped portion 240 are in contact with each other.
  • the rear end portion of the first left support portion 150 and the right end portion of the second plate-shaped portion 240 are connected via a solder (conductive joint material).
  • the first left support portion 150 and the second plate-shaped portion 240 are fixed to the left end portion 120b of the mounting electrode. More specifically, the lower end of the second plate-shaped portion 240 and the lower end of the first left support portion 150 are fixed to the left end portion 120b of the mounting electrode of the substrate 12 by soldering.
  • the rear end portion of the first left support portion 150 and the right end portion of the second plate-shaped portion 240 are connected via a solder (conductive joint material). Therefore, the potential of the first metal member 14 and the potential of the second metal member 214 tend to be the ground potential.
  • FIG. 30 is a top view of the first metal member 14 and the second metal member 214 according to the 17th modification.
  • the module 10g is different from the module 10f in that the first metal member 14 does not include the first left support portion 150. Therefore, the distance between the left end portion of the first plate-shaped portion 140 and the right end portion of the second plate-shaped portion 240 is smaller than the length of the first right support portion 152 in the front-rear direction.
  • the left end portion of the first plate-shaped portion 140 and the right end portion of the second plate-shaped portion 240 are in contact with each other. Then, the left end portion of the first plate-shaped portion 140 and the right end portion of the second plate-shaped portion 240 are connected via a solder (conductive joint material). Further, the first plate-shaped portion 140 and the second plate-shaped portion 240 are fixed to the left end portion 120b of the mounting electrode.
  • the left end portion of the first plate-shaped portion 140 and the right end portion of the second plate-shaped portion 240 are connected via a solder (conductive joint material). Therefore, the potential of the first metal member 14 and the potential of the second metal member 214 tend to be the ground potential.
  • the module and the first metal member according to the present invention are not limited to the modules 10, 10a to 10g and the first metal members 14, 14a to 14k according to the embodiment, and can be changed within the scope of the gist thereof.
  • the structures of the modules 10, 10a to 10g may be arbitrarily combined, or the structures of the first metal members 14, 14a to 14k may be arbitrarily combined.
  • the substrate 12 may have a shape other than a rectangular shape when viewed in the vertical direction.
  • the number of electronic components 16a to 16e is not limited to five.
  • the module 10 does not have to be provided with the shield 20.
  • the shield 20 may cover at least the upper surface SU1 of the sealing resin layer 18. Therefore, the shield 20 may not cover, for example, a part or all of the left surface SL1, the right surface SR1, the front surface SF1, and the rear surface SB1 of the sealing resin layer 18.
  • the outer edge of the substrate 12 does not have to overlap so as to coincide with the outer edge of the sealing resin layer 18 when viewed in the vertical direction. That is, the front surface SF1 of the sealing resin layer 18 may be located in front of the front side SF2 of the substrate 12.
  • the rear surface SB1 of the sealing resin layer 18 may be located after the rear surface SB2 of the substrate 12.
  • the left surface SL1 of the sealing resin layer 18 may be located to the left of the left surface SL2 of the substrate 12.
  • the right side SR1 of the sealing resin layer 18 may be located to the right of the right side SR2 of the substrate 12.
  • the electronic components 16a to 16e do not project to the left or right from the first metal member 14 when viewed in the front-rear direction. However, a part of the electronic components 16a to 16e may protrude from the first metal member 14 to the left or right when viewed in the front-rear direction.
  • the first metal member 14 may include either the first left support portion 150 or the first right support portion 152.
  • the first left support portion 150 may be located before the first plate-shaped portion 140. Then, in the first metal member 14, the first left support portion 150 may extend forward from the first plate-shaped portion 140 at the first left boundary B1. Further, in the first metal member 14, the first right support portion 152 may be located before the first plate-shaped portion 140. Then, the first right support portion 152 may extend forward from the first plate-shaped portion 140 at the first right boundary B2.
  • the second left support portion 250 may be located before the second plate-shaped portion 240. Then, in the second metal member 214, the second left support portion 250 may extend forward from the second plate-shaped portion 240 at the second left boundary B3. The second left support portion 250 may be located after the second plate-shaped portion 240. Then, in the second metal member 214, the second left support portion 250 may extend backward from the second plate-shaped portion 240 at the second left boundary B3. Further, in the second metal member 214, the second right support portion 252 may be located before the second plate-shaped portion 240. Then, the second right support portion 252 may extend forward from the second plate-shaped portion 240 at the second right boundary B4. In the second metal member 214, the second right support portion 252 may be located after the second plate-shaped portion 240. Then, the second right support portion 252 may extend backward from the second plate-shaped portion 240 at the second right boundary B4.
  • the first metal member 14 may not be provided with the first plate-shaped lower cutout, or may be provided with one or more first plate-shaped lower cutouts.
  • the first left support portion 150 may extend backward from the first plate-shaped portion 140 at the first left boundary B1. Further, the first left support portion 150 may be provided with one or more notches below the first left support portion.
  • the angle formed by the first plate-shaped portion 140 and the first left support portion 150 may be different from the angle formed by the first plate-shaped portion 140 and the first right support portion 152.
  • the first left support portion 150 and the first right support portion 152 are not exposed from the sealing resin layer 18. However, the first left support portion 150 and the first right support portion 152 may be exposed from the sealing resin layer 18. However, when the first left support portion 150 is exposed from the sealing resin layer 18, the first left support portion 150 does not have to be fixed to the mounting electrode 12a by the solder 122. When the first right support portion 152 is exposed from the sealing resin layer 18, the first right support portion 152 does not have to be fixed to the mounting electrode 12a by the solder 122.
  • the first left support portion 150 may be bent with respect to the first plate-shaped portion 140 at the first left boundary B1 so as to be located in front of the first plate-shaped portion 140.
  • the first right support portion 152 may be bent with respect to the first plate-shaped portion 140 at the first right boundary B2 so as to be located in front of the first plate-shaped portion 140.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
PCT/JP2021/048312 2021-01-15 2021-12-24 モジュール Ceased WO2022153845A1 (ja)

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JPS58180696U (ja) * 1982-05-26 1983-12-02 日本電気ホームエレクトロニクス株式会社 仕切板取付構体
JPS6149495U (https=) * 1984-09-04 1986-04-03
JPH07183683A (ja) * 1993-12-24 1995-07-21 Nec Corp シールド構造
JP2007294965A (ja) * 2006-04-21 2007-11-08 Samsung Electro-Mechanics Co Ltd 金属壁を用いた高周波モジュール及びその製造方法
WO2020202841A1 (ja) * 2019-04-03 2020-10-08 株式会社村田製作所 モジュール、端子集合体、及びモジュールの製造方法

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JP2011258885A (ja) 2010-06-11 2011-12-22 Murata Mfg Co Ltd 高周波モジュール用シールドチップ
JP5229276B2 (ja) 2010-06-11 2013-07-03 株式会社村田製作所 回路モジュール
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
KR20200001102A (ko) * 2018-06-26 2020-01-06 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US11071196B2 (en) * 2019-04-05 2021-07-20 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing electronic device module

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Publication number Priority date Publication date Assignee Title
JPS5860998U (ja) * 1981-10-20 1983-04-25 松下電器産業株式会社 シ−ルド板取付装置
JPS58180696U (ja) * 1982-05-26 1983-12-02 日本電気ホームエレクトロニクス株式会社 仕切板取付構体
JPS6149495U (https=) * 1984-09-04 1986-04-03
JPH07183683A (ja) * 1993-12-24 1995-07-21 Nec Corp シールド構造
JP2007294965A (ja) * 2006-04-21 2007-11-08 Samsung Electro-Mechanics Co Ltd 金属壁を用いた高周波モジュール及びその製造方法
WO2020202841A1 (ja) * 2019-04-03 2020-10-08 株式会社村田製作所 モジュール、端子集合体、及びモジュールの製造方法

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JP7563493B2 (ja) 2024-10-08
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JPWO2022153845A1 (https=) 2022-07-21
US20230371219A1 (en) 2023-11-16

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