WO2022143280A1 - 图像传感器、摄像模组和电子设备 - Google Patents

图像传感器、摄像模组和电子设备 Download PDF

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Publication number
WO2022143280A1
WO2022143280A1 PCT/CN2021/139889 CN2021139889W WO2022143280A1 WO 2022143280 A1 WO2022143280 A1 WO 2022143280A1 CN 2021139889 W CN2021139889 W CN 2021139889W WO 2022143280 A1 WO2022143280 A1 WO 2022143280A1
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pixel
pixel area
image sensor
color
area
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PCT/CN2021/139889
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English (en)
French (fr)
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罗轶
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维沃移动通信有限公司
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Publication of WO2022143280A1 publication Critical patent/WO2022143280A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present application belongs to the technical field of image processing, and specifically relates to an image sensor, a camera module and an electronic device.
  • CMOS image sensors In complementary metal-oxide semiconductor (CMOS) image sensors, commonly used color filter arrays (Color Filter Array, CFA) include RGB (red, green and blue) arrays, RGB Bayer (Bayer) arrays, CMY (cyan purple) arrays Yellow) array, RGBW (red-green-blue-white) array, RYYB (red-yellow-blue) array.
  • CFA color filter array
  • RGB red, green and blue
  • RGB Bayer Bayer
  • CMY cyan purple arrays Yellow
  • RGBW red-green-blue-white
  • RYYB red-yellow-blue
  • the color image generated by the RGB Bayer array has better clarity, but the pixel signal-to-noise ratio is not ideal, resulting in a lower image brightness value.
  • RGBW can take into account the color and noise ratio, due to the limited number of RGB effective pixels, the full-resolution RGB image can only "guess" the missing pixels by the difference algorithm, which requires multiple difference processing.
  • the value algorithm is not powerful, and it is easy to lose sharpness and overexpose some scenes.
  • the embodiments of the present application provide an image sensor, a camera assembly, and an electronic device, which can take into account the color clarity and noise reduction of an image, avoid blurring and miscolored colors, and at the same time do not need multiple image sensor chips, effectively reducing the size of the image sensor. size and power consumption.
  • an image sensor including:
  • the color filter array includes a plurality of sampling pixel groups, each sampling pixel group includes a plurality of pixel areas, the plurality of pixel areas include a color pixel area and a white pixel area, and the color pixel area surrounds the white pixel area;
  • the color pixel area includes at least two first pixel areas, at least one second pixel area, and at least one third pixel area, and the first pixel area, the second pixel area, and the third pixel area are used to receive visible light with different wavelength ranges .
  • an embodiment of the present application proposes a camera module, including:
  • the image sensor provided by the embodiment of the first aspect is electrically connected to the circuit board;
  • the lens is arranged on the side of the image sensor away from the circuit board.
  • an embodiment of the present application provides an electronic device, including the camera module provided by the embodiment of the second aspect.
  • the image sensor includes: a color filter array, the color filter array includes a plurality of sampling pixel groups, each sampling pixel group includes a plurality of pixel areas, and the plurality of pixel areas includes a color pixel area and a white pixel area, the color pixel area surrounds the white pixel area; wherein, the color pixel area includes at least two first pixel areas, at least one second pixel area and at least one third pixel area, the first pixel area, the second pixel area, the third pixel area The pixel area is used to receive visible light in different wavelength ranges.
  • each pixel has 5 color areas, and can read color (RGB) signals and black and white (Mono) signals at the same time.
  • RGB color
  • Mono black and white
  • the signal-to-noise ratio of the image sensor is increased, and the photosensitive ability of the sensor is improved. Even in a dark light environment, higher-quality photos can be taken, which effectively improves the imaging quality of the image sensor; on the other hand, the Mono
  • the functions of the image sensor and the RGB image sensor are combined on one image sensor chip, which not only effectively reduces the manufacturing cost of the image sensor, but also facilitates the miniaturization of the image sensor, reduces the occupied space of the image sensor, and reduces the electronic equipment for image processing. computational burden.
  • FIG. 1 is a top view of a color filter array of an image sensor according to an embodiment of the present application
  • FIG. 2 is a top view of a sampling pixel group of an image sensor according to an embodiment of the present application
  • FIG. 3 is a top view of a sampling pixel group of an image sensor according to still another embodiment of the present application.
  • Fig. 4 is the structural representation of the 45 ° section of the sampling pixel group in Fig. 2;
  • FIG. 5 is a top view of a composite pixel group of an image sensor according to an embodiment of the present application.
  • FIG. 6 is a top view of a composite pixel group of an image sensor according to yet another embodiment of the present application.
  • FIG. 7 is a top view of a composite pixel group of an image sensor according to yet another embodiment of the present application.
  • FIG. 8 is a top view of a color filter array of an image sensor according to yet another embodiment of the present application.
  • FIG. 9 is a block diagram of a hardware structure of an electronic device according to an embodiment of the present application.
  • 1 color filter array 10 sample pixel groups, 110 color pixel areas, 112 first pixel areas, 114 second pixel areas, 116 third pixel areas, 120 white pixel areas, 130 first deep groove isolation, 140 sub-pixels, 150 second deep trench isolation, 20 photosensitive circuits, 22 photoelectric conversion elements, 24 filter elements, 26 microlenses.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • FIGS. 1 to 9 An image sensor, a camera module assembly, and an electronic device according to embodiments of the present application will be described below with reference to FIGS. 1 to 9 .
  • an image sensor comprising: a color filter array 1 , the color filter array 1 includes a plurality of sampling pixel groups 10 , each The sampling pixel group 10 includes a plurality of pixel areas, the plurality of pixel areas include a color pixel area 110 and a white pixel area 120, and the color pixel area 110 surrounds the white pixel area 120; wherein, the color pixel area 110 includes at least two first pixel areas 112 , at least one second pixel area 114 and at least one third pixel area 116, the first pixel area 112, the second pixel area 114, and the third pixel area 116 are used to receive visible light in different wavelength ranges.
  • the image sensor includes a color filter array 1 (Color Filter Array, CFA), and the color filter array 1 can complete the photoelectric conversion of the received visible light of various colors, thereby generating electrical signals, and then outputting Color image.
  • the color filter array 1 includes a plurality of sample pixel groups 10 .
  • Each sampling pixel group 10 includes a plurality of pixel regions, specifically, the plurality of pixel regions include a color pixel region 110 and a white pixel region 120 .
  • the color pixel area 110 is configured to receive visible light of each color corresponding to the color pixel area 110 .
  • the color pixel area 110 includes at least two first pixel areas 112, at least one second pixel area 114 and at least one third pixel area 116.
  • the second pixel area 114 and the third pixel area 116 receives visible light of different colors, and the wavelength range of visible light of each color is different, and the color information of the pixel can be obtained through the color pixel area 110 .
  • the white pixel area 120 is used to receive visible light of all colors, and the definition and detail information of the color information is obtained through the white pixel area 120, and the received color information can be denoised.
  • the pixel area As a color pixel area 110 and a white pixel area 120 .
  • each pixel has 5 color areas, which can read color signals and black and white (Mono) signals at the same time.
  • the signal-to-noise ratio of the image sensor is increased, and the acquired light is expanded.
  • the bandwidth of the sensor improves the photosensitive ability of the sensor, and even in a dark environment, it can take higher-quality photos, which effectively improves the image quality of the image sensor;
  • the functions of the Mono image sensor and the color image sensor are combined in the On the chip of an image sensor, color and Mono technology can be realized at the same time, which not only effectively reduces the manufacturing cost of the image sensor, but also facilitates the miniaturization of the image sensor, reduces the space occupied by the image sensor, and reduces the operation of the electronic equipment for image processing. burden.
  • the color pixel area 110 surrounds the white pixel area 120, that is, the color pixel area 110 is surrounded by the white pixel area 120, and the white pixel area 120 is located in the middle of the plurality of pixel areas, for example, on the basis of the RGB Bayer array , replacing parts of each colored area with white areas.
  • sampling pixel groups 10 are connected and arranged in an array.
  • the first pixel area 112 is a green pixel area; the second pixel area 114 is a red pixel area; and the third pixel area 116 is a blue pixel area.
  • the first pixel area 112 is a green pixel area for receiving visible light in a wavelength range corresponding to green; the second pixel area 114 is a red pixel area for receiving visible light in a wavelength range corresponding to red; the third pixel area 116
  • the blue pixel area is used to receive visible light in the wavelength range corresponding to blue.
  • the color pixel area 110 adopts the arrangement of 1 red, 2 green and 1 blue, which ensures the number of RGB effective pixels, avoids multiple difference processing, and improves the accuracy of the mosaic difference algorithm.
  • the resolution of the image sensor is improved, the resulting color image has better clarity, and the imaging quality of the image sensor is improved.
  • the four-in-one RGB pixel array arrangement can be improved into a five-in-one RGGBW pixel array arrangement. It can not only read RGB signals and Mono signals at the same time, but also improve the sensitivity of the sensor and effectively improve the imaging quality of the image sensor on the basis of ensuring the clarity of the color image; and combine the functions of the Mono image sensor and the RGB image sensor in On the chip of an image sensor, RGB and Mono technologies can be realized at the same time, which not only effectively reduces the manufacturing cost of the image sensor, but also facilitates the miniaturization of the image sensor, reduces the space occupied by the image sensor, and reduces the calculation of the image processing by the electronic equipment. burden.
  • the wavelength range of visible light is about 390nm ⁇ 700nm
  • the wavelength range of red light is about 620nm ⁇ 700nm
  • the wavelength range of orange light is about 590nm ⁇ 620nm
  • the wavelength range of yellow light is about 570nm ⁇ 590nm
  • the wavelength range of green light is about 570nm ⁇ 590nm.
  • the wavelength range of cyan light is about 450nm-490nm
  • the wavelength range of blue light is about 430nm-450nm
  • the wavelength range of violet light is about 390nm-450nm.
  • first pixel area 112 , the second pixel area 114 , and the third pixel area 116 may respectively correspond to RGB color areas, or may correspond to other color areas, such as CMY color areas.
  • the sampling pixel group 10 includes 2 green (G) pixel areas, 1 red (R) pixel area, 1 blue (B) pixel area and one white (W) pixel area.
  • the area of the white pixel area 120 is 1/4 of the area of the sampling pixel group 10
  • the areas of the red pixel area and the blue pixel area are respectively 3/16 of the area of the sampling pixel group 10
  • the sum of the areas of the two green pixel areas is the sampling area 3/8 of the area of the pixel group 10
  • the white pixel area 120 is located at the center of the sampling pixel group 10, which improves the applicability of the image sensor.
  • the area of the white pixel area 120 is 1/8 of the area of the sampling pixel group 10
  • the areas of the red pixel area and the blue pixel area are respectively 1/4 of the area of the sampling pixel group 10
  • the area of the two pixel areas is The area is 3/16 of the area of the sampling pixel group 10, that is, only the white area is embedded in the green pixel area, which can realize RGB+Mono and eliminate the light-receiving effect on the red pixel area and the blue area.
  • the sampling pixel group 10 further includes: a first deep trench isolation 130 disposed between two adjacent pixel regions.
  • the first deep trench isolation 130 (Deep Trench isolation, DTI) between two adjacent pixel regions, multiple pixel regions are isolated, so that the signal of one pixel region cannot affect other pixels.
  • the area has an effect, avoiding crosstalk between two adjacent pixel areas, and preventing the pixel area from giving erroneous image information while collecting more light in the auxiliary pixel area.
  • the first deep trench isolation 130 includes a deep trench in the semiconductor layer of the color filter array 1 and a liner layer on the bottom and sidewalls of the deep trench.
  • the material of the backing layer can be a metal material, such as tungsten, which can achieve a good light blocking effect.
  • the liner layer can also be oxide or oxynitride, such as silicon dioxide, so that the first deep trench isolation 130 process is simple and easy to implement.
  • the depth range of the deep trench can be reasonably set according to the thickness of the semiconductor layer of the color filter array 1 , for example, the depth range of the deep trench is 2 ⁇ m ⁇ 3 ⁇ m.
  • the sampling pixel group 10 is a composite pixel group; the color pixel area or the white pixel area 120 includes a plurality of sub-pixels 140 ; There is a second deep trench isolation 150 .
  • the optical and electrical performance of a single pixel is greatly reduced compared with that of a large size pixel due to the too small size of a single pixel.
  • the charge storage capacity of a pixel when the pixel size drops to the 0.6um level, a single pixel can only store about 5000 electrons.
  • the sample pixel groups 10 are set as composite pixel groups, ie the color pixel regions or white pixel regions 120 in each sample pixel group 10 are constructed by a plurality of sub-pixels 140 .
  • the white pixel area 120 in the pixel area reduces the design difficulty caused by the irregular-shaped pixel area and reduces the manufacturing cost of the color filter array 1 .
  • two adjacent sub-pixels 140 are isolated from each other by the second deep trench isolation 150, so that the photoelectrons generated by any sub-pixel 140 cannot enter its adjacent sub-pixels 140, and thus will not affect the adjacent sub-pixels 140.
  • the crosstalk noise between the sub-pixels 140 can be greatly reduced while the auxiliary sub-pixels 140 are condensing light.
  • the 2 ⁇ 2 composite pixel shown in FIG. 5 and FIG. 8 that is, four sub-pixels 140 form a pixel, one sub-pixel 140 is taken from one pixel as a white sub-pixel, and the other three sub-pixels A pixel is a color sub-pixel, three color sub-pixels form a color pixel area, and all white sub-pixels in a composite pixel group form a white pixel area 120 .
  • the difficulty of design and manufacture caused by the L-shaped color pixel area is avoided.
  • the positions of the white sub-pixels are not fixed and the number is not limited, and can be selected according to the actual requirements of the image sensor, which is not specifically limited here.
  • the color pixel area is constituted by a plurality of sub-pixels 140 .
  • the green pixel area, the red pixel area, and the blue pixel area are each constituted by three sub-pixels 140
  • the white pixel area is constituted by two sub-pixels 140 .
  • each pixel region or each sub-pixel is provided with a photosensitive circuit 20 , a photoelectric conversion element 22 and a filter element 24 stacked in sequence.
  • each pixel area or each sub-pixel is provided with a photosensitive circuit 20 , a photoelectric conversion element 22 and a filter element 24 which are sequentially stacked from bottom to top.
  • the filter element 24 is used to filter excess infrared light and ultraviolet light, and the visible light of the color corresponding to the pixel area is passed through the filter element 24, and is responded to by the photoelectric conversion element 22, so that unnecessary light in the color filter array can be removed.
  • Light filtering prevents the photoelectric sensor from forming false colors or ripples during the shooting process, thereby improving the effective resolution and color reproduction of the image.
  • the photosensitive circuit 20 and the photoelectric conversion element 22 convert the light signal received in the pixel area into an electrical signal and output it, thereby realizing the imaging of the image sensor.
  • each pixel area or each sub-pixel may have a separate photosensitive circuit 20, a photoelectric conversion element 22 and a filter element 24, so that the RGB signal can be read from the RGBB area and the Mono signal can be read from the W area at the same time.
  • RGB+Mono effect and avoid the blurring and wrong color of traditional RGBW array.
  • sub-pixels receiving visible light of the same color may share one filter element.
  • the photoelectric conversion element 22 is a photodiode
  • the filter element 24 is a color filter.
  • Set the corresponding color filter for each pixel area That is, a red color filter is set for the red pixel region, a green color filter is set for the green pixel region, a blue color filter is set for the blue pixel region, and a visible light filter is set for the white pixel region.
  • Each color filter is formed of resin with organic pigments added inside, and the thickness of the color filter can be reasonably set according to actual needs, such as 400nm to 1000nm.
  • the first deep groove isolation 130 is set as a U-shaped structure, which is used to completely isolate each photoelectric conversion element 22 in the sampling pixel group 10, and can block the light of the photoelectric conversion element 22, thereby preventing the image
  • the optical crosstalk phenomenon occurs in the sensor, which ensures the use performance of the image sensor and improves the imaging quality of the image sensor.
  • the image sensor further includes: a microlens layer disposed on the filter element 24 ; the microlens layer includes one or more microlenses 26 , The plurality of microlenses 26 are located on different pixel areas or on different sub-pixels 140 .
  • the microlens layer is located on the filter element 24, that is, the photosensitive surface of the sampling pixel group 10, and the microlens 26 is arranged to make the light converge on the pixel area or sub-pixel, thereby improving the pixel area or sub-pixel. photosensitive efficiency.
  • all pixel regions in one sampling pixel group 10 may share one microlens 26 .
  • different sub-pixels 140 are provided with independent micro-lenses 26 , and by separately providing micro-lenses 26 for different pixel areas or sub-pixels 140 , the pixel area can be assisted in concentrating light while reducing the distance between pixel areas.
  • the crosstalk effectively suppresses the noise in the image sensor.
  • the bottom contour of the pixel microlens 26 may be circular.
  • the color filter array further includes: a semiconductor layer, where the semiconductor layer is used to mount at least one of the photosensitive circuit, the photoelectric conversion element and the filter element.
  • an installation space is provided in the semiconductor layer, at least one of the photosensitive circuit, the photoelectric conversion element and the filter element can be installed in the installation space, and the first deep trench isolation and the second deep trench isolation are provided in the semiconductor layer to ensure the assembly stability of the color filter array.
  • the semiconductor layer may be a silicon substrate, but is not limited thereto. Different pixel regions or different sub-pixels can share one silicon substrate.
  • the image sensor is a complementary metal oxide semiconductor image sensor.
  • the image sensor is a complementary metal oxide semiconductor image sensor (CMOS Image Sensor, CIS) with a high dynamic range (HDR) mode.
  • CMOS Image Sensor CIS
  • HDR high dynamic range
  • the CMOS image sensor has the advantages of simple process, easy integration with other devices, small size, and light weight. , low power consumption, low cost and other advantages, can be widely used in different electronic equipment, such as digital cameras, camera phones, digital video cameras, medical imaging devices (gastroscopes), vehicle imaging devices, etc.
  • a demosaicing difference algorithm must be performed to calculate the missing pixels to generate the final color image.
  • the pixel area as the color pixel area 110 and the white pixel area 120, the number of effective pixels is increased, the accuracy of the mosaic difference algorithm is improved, the resolution of the image sensor is improved, and the imaging quality of the image sensor is improved.
  • a camera module including: a circuit board; the image sensor according to any one of the first aspect, electrically connected to the circuit board; a lens, disposed on the image sensor away from the circuit side of the board.
  • the photographing module includes a circuit board and a lens, wherein the lens is disposed on a side of the image sensor away from the circuit board, and is used for transmitting external light to the image sensor.
  • the image sensor After the image sensor generates a corresponding electrical signal based on the received light, it generates an image from the converted electrical signal by electrically connecting the circuit board with the image sensor, thereby realizing the imaging of the camera module.
  • the camera module also includes all the beneficial effects of the image sensor in any of the above-mentioned embodiments, which will not be repeated here.
  • an electronic device including the photographing module in the above-mentioned embodiment of the second aspect. Therefore, the electronic device also includes all the beneficial effects of the camera module in the above-mentioned embodiments, which will not be repeated here.
  • the electronic device is a mobile phone, a tablet computer, a smart bracelet, a notebook computer, a digital camera, or other devices with a camera function, and the like.
  • the electronic device in this embodiment of the present application may be an apparatus, or may be a component, an integrated circuit, or a chip in a terminal.
  • the apparatus may be a mobile electronic device or a non-mobile electronic device.
  • the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop computer, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (personal digital assistant).
  • UMPC ultra-mobile personal computer
  • PDA personal digital assistant
  • non-mobile electronic devices can be servers, network attached storage (Network Attached Storage, NAS), personal computer (personal computer, PC), television (television, TV), teller machine or self-service machine, etc., this application Examples are not specifically limited.
  • the electronic device in this embodiment of the present application may be an apparatus having an operating system.
  • the operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, which are not specifically limited in the embodiments of the present application.
  • FIG. 9 is a block diagram of a hardware structure of an electronic device 500 implementing an embodiment of the present application.
  • the electronic device 500 includes but is not limited to: a radio frequency unit 502, a network module 504, an audio output unit 506, an input unit 508, a sensor 510, a display unit 512, a user input unit 514, an interface unit 516, a memory 518, a processor 520 and other components .
  • the electronic device 500 may also include a power source (such as a battery) for supplying power to various components, and the power source may be logically connected to the processor 520 through a power management system, so that the power management system can manage charging, discharging, and power management. consumption management and other functions.
  • a power source such as a battery
  • the structure of the electronic device shown in FIG. 9 does not constitute a limitation on the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components.
  • electronic devices include, but are not limited to, mobile terminals, tablet computers, notebook computers, handheld computers, vehicle-mounted electronic devices, wearable devices, and pedometers.
  • the radio frequency unit 502 may be used to send and receive information or send and receive signals during a call, and specifically, receive downlink data from the base station or send uplink data to the base station.
  • the radio frequency unit 502 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like.
  • the network module 504 provides the user with wireless broadband Internet access, such as helping the user to send and receive emails, browse the web, access streaming media, and the like.
  • the audio output unit 506 may convert audio data received by the radio frequency unit 502 or the network module 504 or stored in the memory 518 into audio signals and output as sound. Also, the audio output unit 506 may also provide audio output related to a specific function performed by the electronic device 500 (eg, call signal reception sound, message reception sound, etc.).
  • the audio output unit 506 includes a speaker, a buzzer, a receiver, and the like.
  • the input unit 508 is used to receive audio or video signals.
  • the input unit 508 may include a graphics processor (Graphics Processing Unit, GPU) 5082 and a microphone 5084, and the graphics processor 5082 is used for still pictures or video images obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode.
  • data is processed.
  • the processed image frames may be displayed on the display unit 512, or stored in the memory 518 (or other storage medium), or transmitted via the radio frequency unit 502 or the network module 504.
  • the microphone 5084 can receive sound, and can process the sound into audio data, and the processed audio data can be converted into a format output that can be sent to a mobile communication base station via the radio frequency unit 502 in the case of a phone call mode.
  • the electronic device 500 also includes at least one sensor 510, such as a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, a light sensor, a motion sensor, and other sensors.
  • a sensor 510 such as a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, a light sensor, a motion sensor, and other sensors.
  • the display unit 512 is used to display information input by the user or information provided to the user.
  • the display unit 512 may include a display panel 5122, which may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like.
  • the user input unit 514 may be used to receive input numerical or character information, and generate key signal input related to user settings and function control of the electronic device.
  • the user input unit 514 includes a touch panel 5142 and other input devices 5144 .
  • the touch panel 5142 also referred to as a touch screen, collects the user's touch operations on or near it.
  • the touch panel 5142 may include two parts, a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and then sends it to the touch controller.
  • Other input devices 5144 may include, but are not limited to, physical keyboards, function keys (such as volume control keys, switch keys, etc.), trackballs, mice, and joysticks, which are not described herein again.
  • the touch panel 5142 may be covered on the display panel 5122.
  • the touch panel 5142 detects a touch operation on or near it, the touch panel 5142 transmits it to the processor 520 to determine the type of the touch event, and then the processor 520 determines the type of the touch event according to the touch
  • the type of event provides a corresponding visual output on display panel 5122.
  • the touch panel 5142 and the display panel 5122 can be used as two independent components, or can be integrated into one component.
  • the interface unit 516 is an interface for connecting an external device to the electronic device 500 .
  • external devices may include wired or wireless headset ports, external power (or battery charger) ports, wired or wireless data ports, memory card ports, ports for connecting devices with identification modules, audio input/output (I/O) ports, video I/O ports, headphone ports, and more.
  • the interface unit 516 may be used to receive input (eg, data information, power, etc.) from external devices and transmit the received input to one or more elements within the electronic device 500 or may be used between the electronic device 500 and external Transfer data between devices.
  • Memory 518 may be used to store application programs as well as various data.
  • the memory 518 may mainly include a stored program area and a stored data area, wherein the stored program area may store an operating system, an application program required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; Data (such as audio data, phone book, etc.) created by the use of the mobile terminal, etc.
  • memory 518 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
  • the processor 520 executes various functions of the electronic device 500 and processes data by running or executing the application programs and/or modules stored in the memory 518 and calling the data stored in the memory 518, so as to perform the overall operation of the electronic device 500. monitor.
  • the processor 520 may include one or more processing units; the processor 520 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes Operations that handle image processing.

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Abstract

本申请提供了一种图像传感器、摄像模组和电子设备，属于图像处理技术领域。其中，图像传感器包括：彩色滤光阵列，彩色滤光阵列包括多个采样像素组，每个采样像素组包括多个像素区域，多个像素区域包括彩色像素区域和白色像素区域，彩色像素区域包围白色像素区域；其中，彩色像素区域包括至少两个第一像素区域、至少一个第二像素区域和至少一个第三像素区域，第一像素区域、第二像素区域、第三像素区域用于接收不同波长范围的可见光。

Description

图像传感器、摄像模组和电子设备
相关申请的交叉引用
本申请要求享有于2020年12月28日提交的中国专利申请202011587866.9的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请属于图像处理技术领域，具体涉及一种图像传感器、摄像模组和电子设备。
背景技术
在互补金属氧化半导体(Complemerntary metal-oxide semiconductor，CMOS)图像传感器中，常用的彩色滤光阵列(Color Filter Array，CFA)包括RGB(红绿蓝)阵列，RGB Bayer(拜耳)阵列，CMY(青紫黄)阵列，RGBW(红绿蓝白)阵列，RYYB(红黄蓝)阵列。当CMOS图像传感器(CMOS image sensor，CIS)输出原始图像后，必须要进行去马赛克(Demosaic)处理才能产生最终的RGB彩色图像。
相关技术中，在Demosaic差值算法下，RGB Bayer阵列生成的彩色图像清晰度较好，但像素信号噪音比不理想，使得图像亮度值较低。RGBW虽然能够兼顾彩色和噪音比，但由于其RGB有效像素的个数有限，全分辨率的RGB图像只能靠差值算法“猜”出缺少的像素，需要进行多次差值处理，如果差值算法不强大，极易损失清晰度且使部分场景过曝。
发明内容
本申请实施例提供了一种图像传感器、摄像组件和电子设备，能够兼 顾图像的色彩清晰度和降噪，避免出现模糊和错色等问题，同时无需多个图像传感器芯片，有效减小图像传感器的体积和功耗。
第一方面，本申请实施例提出了一种图像传感器，包括：
彩色滤光阵列，彩色滤光阵列包括多个采样像素组，每个采样像素组包括多个像素区域，多个像素区域包括彩色像素区域和白色像素区域，彩色像素区域包围白色像素区域；
其中，彩色像素区域包括至少两个第一像素区域、至少一个第二像素区域和至少一个第三像素区域，第一像素区域、第二像素区域、第三像素区域用于接收不同波长范围的可见光。
第二方面，本申请实施例提出了一种摄像模组，包括：
电路板；
如第一方面实施例提供的图像传感器，与电路板电连接；
镜头，设置于图像传感器背离电路板的一侧。
第三方面，本申请实施例提出了一种电子设备，包括第二方面实施例提供的摄像模组。
在本申请的实施例中，图像传感器包括：彩色滤光阵列，彩色滤光阵列包括多个采样像素组，每个采样像素组包括多个像素区域，多个像素区域包括彩色像素区域和白色像素区域，彩色像素区域包围白色像素区域；其中，彩色像素区域包括至少两个第一像素区域、至少一个第二像素区域和至少一个第三像素区域，第一像素区域、第二像素区域、第三像素区域用于接收不同波长范围的可见光。通过将像素区域设置为彩色像素区域与白色像素区域，一方面，使得每个像素拥有5个颜色区域，能够同时读取彩色(RGB)信号和黑白(Mono)信号，在保证彩色图像清晰度的基础上，增大了图像传感器的信噪比，提高传感器的感光能力，即使在暗光环境下也能够拍摄出质量更高的照片，有效提升了图像传感器的成像质量；另一方面，将Mono图像传感器和RGB图像传感器的功能结合在一块图像传感器的芯片上，不仅有效降低图像传感器的制造成本，而且有利于图像传感器的小型化，减小图像 传感器的占用空间，降低了电子设备对于图像处理的运算负担。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本申请一个实施例的图像传感器的彩色滤光阵列的俯视图；
图2是根据本申请一个实施例图像传感器的采样像素组的俯视图；
图3是根据本申请又一个实施例图像传感器的采样像素组的俯视图；
图4是图2中采样像素组的45°剖面的结构示意图；
图5是根据本申请一个实施例图像传感器的合成像素组的俯视图；
图6是根据本申请又一个实施例图像传感器的合成像素组的俯视图；
图7是根据本申请又一个实施例图像传感器的合成像素组的俯视图；
图8是根据本申请又一个实施例的图像传感器的彩色滤光阵列的俯视图；
图9是根据本申请一个实施例的电子设备的硬件结构框图。
附图标记：
1彩色滤光阵列，10采样像素组，110彩色像素区域，112第一像素区域，114第二像素区域，116第三像素区域，120白色像素区域，130第一深槽隔离，140子像素，150第二深槽隔离，20感光电路，22光电转换元件，24滤光元件，26微透镜。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似 功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、“右”、等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
下面结合图1至图9描述根据本申请实施例的图像传感器、摄像模组件和电子设备。
如图1至图3所示，根据本申请的第一方面的实施例，提出了一种图像传感器，包括：彩色滤光阵列1，彩色滤光阵列1包括多个采样像素组10，每个采样像素组10包括多个像素区域，多个像素区域包括彩色像素区域110和白色像素区域120，彩色像素区域110包围白色像素区域120；其中，彩色像素区域110包括至少两个第一像素区域112、至少一个第二像 素区域114和至少一个第三像素区域116，第一像素区域112、第二像素区域114、第三像素区域116用于接收不同波长范围的可见光。
在该实施例中，图像传感器包括彩色滤光阵列1(Color Filter Array，CFA)，彩色滤光阵列1能够完成对接收到的多种不同颜色的可见光进行光电转换，从而生成电信号，进而输出彩色图像。彩色滤光阵列1包含多个采样像素组10。每个采样像素组10包括多个像素区域，具体地，多个像素区域包括彩色像素区域110和白色像素区域120。彩色像素区域110用于接收彩色像素区域110对应的每个颜色的可见光。其中，彩色像素区域110包括至少两个第一像素区域112、至少一个第二像素区域114和至少一个第三像素区域116，通过设置第一像素区域112、第二像素区域114和第三像素区域116接收不同颜色的可见光，每个颜色的可见光的波长范围不同，通过彩色像素区域110可以获取像素的色彩信息。白色像素区域120用于接收所有颜色的可见光，通过白色像素区域120获取色彩信息的清晰度细节信息，并且能够对接收到的色彩信息进行降噪。通过将像素区域设置为彩色像素区域110与白色像素区域120。一方面，使得每个像素拥有5个颜色区域，能够同时读取彩色信号和黑白(Mono)信号，在保证彩色图像清晰度的基础上，增大了图像传感器的信噪比，拓展所获取光线的带宽，提高传感器的感光能力，即使在暗光环境下也能够拍摄出质量更高的照片，有效提升了图像传感器的成像质量；另一方面，将Mono图像传感器和彩色图像传感器的功能结合在一块图像传感器的芯片上，可同时实现彩色和Mono技术，不仅有效降低图像传感器的制造成本，而且有利于图像传感器的小型化，减小图像传感器的占用空间，降低了电子设备对于图像处理的运算负担。
其中，彩色像素区域110包围白色像素区域120，也就是说，彩色像素区域110围设于白色像素区域120，白色像素区域120位于多个像素区域的中间位置，例如，在RGB Bayer阵列的基础上，将每个彩色区域的部分替换为白色区域。
进一步地，多个采样像素组10相连且呈阵列排布。
在一种可能的实施例中，如图1和图2所示，第一像素区域112为绿色像素区域；第二像素区域114为红色像素区域；第三像素区域116为蓝色像素区域。
在该实施例中，第一像素区域112为绿色像素区域，用于接收绿色对应波长范围的可见光；第二像素区域114为红色像素区域用于接收红色对应波长范围的可见光；第三像素区域116为蓝色像素区域，用于接收蓝色对应波长范围的可见光。通过模拟人眼对色彩的敏感程度，彩色像素区域110采用1红2绿1蓝的排列方式，保证了RGB有效像素的个数，避免进行多次差值处理，提高了马赛克差值算法的正确率，提高图像传感器的分辨率，使得生成的彩色图像清晰度较好，提高了图像传感器的成像质量。同时，能够将四合一的RGB像素阵列排布方式改进为五合一RGGBW像素阵列排布方式。不仅能够同时读取了RGB信号和Mono信号，在保证彩色图像清晰度的基础上，提高传感器的感光能力，有效提升了图像传感器的成像质量；而且将Mono图像传感器和RGB图像传感器的功能结合在一块图像传感器的芯片上，可同时实现RGB和Mono技术，不仅有效降低图像传感器的制造成本，而且有利于图像传感器的小型化，减小图像传感器的占用空间，降低了电子设备对于图像处理的运算负担。
其中，可见光的波长范围大约为390nm～700nm，红光的波长范围大约为620nm～700nm，橙光的波长范围大约为590nm～620nm，黄光的波长范围大约为570nm～590nm，绿光的波长范围大约为570nm～490nm，青光的波长范围大约为450nm～490nm，蓝光的波长范围大约为430nm～450nm，紫光的波长范围大约为390nm～450nm。
可以理解的是，第一像素区域112、第二像素区域114、第三像素区域116可以分别对应RGB彩色区域，也可以对应其它彩色区域，例如CMY彩色区域。
另外，采样像素组10中的每个区域的形状和位置大小可以根据实际情 况进行改变。例如，如图2所示，采样像素组10包括2个绿色(G)像素区域、1个红色(R)像素区域、1个蓝色(B)像素区域和一个白色(W)像素区域。白色像素区域120的面积为采样像素组10面积的1/4，红色像素区域和蓝色像素区域的面积分别为采样像素组10面积的3/16，两个绿色像素区域的面积之和为采样像素组10面积的3/8，白色像素区域120位于采样像素组10的中心位置，提高了图像传感器的适用性。如图3所示，白色像素区域120的面积为采样像素组10面积的1/8，红色像素区域和蓝色像素区域的面积分别为采样像素组10面积的1/4，2个像素区域的面积分别为采样像素组10面积的3/16，也即只在绿色像素区域内嵌入白色区域，可以实现RGB+Mono的同时消除对红色像素区域和蓝色区域的收光影响。
在一种可能的实施例中，如图1至图4所示，采样像素组10还包括：第一深槽隔离130，设置于相邻两个像素区域之间。
在该实施例中，通过将第一深槽隔离130(Deep trench isolation，DTI)设置于相邻两个像素区域之间，将多个像素区域进行隔离，使得一个像素区域的信号无法对其他像素区域产生影响，避免了相邻两个像素区域之间的串扰，在辅助像素区域收集更多的光的同时，防止像素区域给出错误的图像信息。
在具体应用中，第一深槽隔离130包括位于彩色滤光阵列1的半导体层中的深沟槽以及位于深沟槽底部和侧壁上的衬垫层。衬垫层的材料可以为金属材质，例如钨，能够实现良好的挡光效果。衬垫层还可以为氧化物或氮氧化物，例如二氧化硅，使得第一深槽隔离130工艺简单易于实现。深沟槽的深度范围可根据彩色滤光阵列1的半导体层的厚度合理设置，例如深沟槽的深度范围为2μm～3μm。
在一种可能的实施例中，如图5至图8所示，采样像素组10为合成像素组；彩色像素区域或白色像素区域120包括多个子像素140；相邻两个子像素140之间设置有第二深槽隔离150。
在该实施例中，考虑到图像对大分辨率的需求，像素尺寸不断缩小的 同时，由于单个像素尺寸过小导致其光学和电气性能相比大尺寸像素大幅下降。例如，像素的电荷存储能力，当像素大小下降至0.6um级别时，单个像素只能存储大约5000个电子。为此，将采样像素组10设置为合成像素组，也即通过多个子像素140构造每个采样像素组10中的彩色像素区域或白色像素区域120。一方面，提高像素的电荷存储能力，有利于减少噪音，提升图像的画质；另一方面，由于每个像素区域均由一个个子像素140组成，可通过设置多个子像素140可以灵活调配多个像素区域中的白色像素区域120，降低了异型像素区域带来的设计难度，减少了彩色滤光阵列1的制造成本。
进一步地，相邻两个子像素140之间通过第二深槽隔离150相互隔离，使得任一子像素140产生的光电子无法进入其相邻的子像素140，进而不会对相邻的子像素140产生影响，可以在辅助子像素140聚光的同时大幅减少子像素140间的串扰噪音。
具体举例来说，在图5和图8所示的2×2合成像素中，也即四个子像素140组成一个像素点，从一个像素点拿出一个子像素140作为白色子像素，其它三个子像素作为彩色子像素，三个彩色子像素构成一个彩色像素区域，一个合成像素组中的所有白色子像素构成白色像素区域120。从而避免了L型彩色像素区域带来的设计、制作难度。
具体地，作为白色子像素的位置不固定且数量不限，可根据图像传感器的实际需求选取，在此不作具体限定。例如，如图6所示，只有彩色像素区域由多个子像素140构成。如图7所示，绿色像素区域、红色像素区域、蓝色像素区域分别由3个子像素140构成，白色像素区域由2个子像素140构成。
在一种可能的实施例中，如图4所示，每个像素区域或每个子像素设置有依次堆叠的感光电路20、光电转换元件22和滤光元件24。
在该实施例中，每个像素区域或每个子像素设置有从下至上依次堆叠的感光电路20、光电转换元件22和滤光元件24。滤光元件24用于过滤多 余的红外光和紫外光，通过滤光元件24使得与像素区域对应的颜色的可见光通过，并被光电转换元件22响应，从而能够将彩色滤光阵列中不需要的光线滤除，从而防止光电传感器在拍摄过程中形成伪色或波纹，进而能够提高图像的有效分辨率和色彩的还原性。通过感光电路20和光电转换元件22将像素区域接收到的光信号转换为电信号并进行输出，进而实现了图像传感器的成像。
进一步地，每个像素区域或每个子像素可以具有单独的感光电路20、光电转换元件22和滤光元件24，从而能够同时从RGBB区域读取RGB信号和从W区域读取Mono信号，实现了RGB+Mono的效果，且避免了传统RGBW阵列的模糊和错色等问题。
需要说明的是，对于接收相同颜色可见光的子像素可共用一个滤光元件。
在具体应用中，光电转换元件22为光电二极管，滤光元件24为滤色片。针对每个像素区域设置对应颜色的滤色片。也就是说，针对红色像素区域设置红色滤色片，针对绿色像素区域设置绿色滤色片，针对蓝色像素区域设置蓝色滤色片，针对白色像素区域设置可见光滤色片。每个彩色滤色片是用内部添加有有机颜料的树脂形成的，滤色片的厚度可根据实际需求合理设置，例如400nm～1000nm。
可以理解的是，将第一深槽隔离130设置为U型结构，用于将采样像素组10中的每个光电转换元件22完全隔离开来，能够遮挡光电转换元件22的光线，进而防止图像传感器发生光串扰现象，确保了图像传感器的使用性能，提高图像传感器的成像质量。
在一种可能的实施例中，如图1、图4和图8所示，图像传感器还包括：微透镜层，设置于滤光元件24上；微透镜层包括一个或多个微透镜26，多个微透镜26位于不同的像素区域上或不同的子像素140上。
在该实施例中，微透镜层位于滤光元件24上，也即采样像素组10的感光表面，通过设置微透镜26使得光线汇聚到像素区域或子像素上，由此 提高像素区域或子像素的感光效率。
进一步地，如图1和图4所示，一个采样像素组10中的所有的像素区域可以共用一个微透镜26。或者，如图8所示，对不同的子像素140设置独立的微透镜26，通过对不同的像素区域或子像素140单独设置微透镜26，可以辅助像素区域聚光的同时减少像素区域之间的串扰，有效地抑制了图像传感器中的噪声。
具体地，在俯视彩色滤光阵列时，像素微透镜26的底部轮廓可以为圆形。
在一种可能的实施例中，彩色滤光阵列还包括：半导体层，半导体层用于安装感光电路、光电转换元件和滤光元件中至少之一。
在该实施例中，半导体层内设有安装空间，感光电路、光电转换元件和滤光元件中至少之一能够安装在安装空间中，第一深槽隔离和第二深槽隔离开设于半导体层上，从而保证彩色滤光阵列的组装稳定性。
具体地，半导体层可以为硅基板，但并不局限于此。不同像素区域或不同子像素可共用一块硅基板。
在一种可能的实施例中，图像传感器为互补金属氧化半导体图像传感器。
在该实施例中，图像传感器为具有高动态范围(HDR)模式的互补金属氧化半导体图像传感器(CMOS Image Sensor，CIS)，CMOS图像传感器具有工艺简单、易与其他器件集成、体积小、重量轻、功耗小、成本低等优点，可广泛应用于不同电子设备，例如，数码相机、照相手机、数码摄像机、医疗用摄像装置(胃镜)、车用摄像装置等。当互补金属氧化半导体图像传感器输出原始图像后，必须要进行去马赛克差值算法计算出缺少的像素，才能产生最终的彩色图像。通过将像素区域设置为彩色像素区域110与白色像素区域120，增加了有效像素的个数，提高了马赛克差值算法的正确率，提高图像传感器的分辨率，从而提升了图像传感器的成像质量。
根据本申请的第二方面的实施例，提出了一种摄像模组，包括：电路板；如第一方面中任一项的图像传感器，与电路板电连接；镜头，设置于图像传感器背离电路板的一侧。
在该实施例中，摄影模组包括电路板和镜头，其中，镜头设置于图像传感器背离电路板的一侧，用于将外界光线传输至图像传感器。图像传感器基于接收到的光线对应生成相应的电信号后，通过与图像传感器电连接电路板，将转换后的电信号生成图像，进而实现了摄像模组的成像。同时该摄像模组也包括如上述任一实施例中的图像传感器的全部有益效果，在此不再赘述。
根据本申请的第三方面的实施例，提出了一种电子设备，包括上述第二方面实施例中的摄影模组。因此，该电子设备同时也包括如上述实施例中的摄像模组的全部有益效果，在此不再赘述。
具体地，电子设备为手机、平板电脑、智能手环、笔记本电脑、数码相机或者其它具有摄像功能的设备等。
本申请实施例中的电子设备可以是装置，也可以是终端中的部件、集成电路、或芯片。该装置可以是移动电子设备，也可以为非移动电子设备。示例性的，移动电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，非移动电子设备可以为服务器、网络附属存储器(Network Attached Storage，NAS)、个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等，本申请实施例不作具体限定。
本申请实施例中的电子设备可以为具有操作系统的装置。该操作系统可以为安卓(Android)操作系统，可以为ios操作系统，还可以为其他可能的操作系统，本申请实施例不作具体限定。
图9为实现本申请实施例的一种电子设备500的硬件结构框图。该电子设备500包括但不限于：射频单元502、网络模块504、音频输出单元 506、输入单元508、传感器510、显示单元512、用户输入单元514、接口单元516、存储器518、处理器520等部件。
本领域技术人员可以理解，电子设备500还可以包括给各个部件供电的电源(比如电池)，电源可以通过电源管理系统与处理器520逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。图9中示出的电子设备结构并不构成对电子设备的限定，电子设备可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。在本申请实施例中，电子设备包括但不限于移动终端、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、以及计步器等。
应理解的是，本申请实施例中，射频单元502可用于收发信息或收发通话过程中的信号，具体的，接收基站的下行数据或向基站发送上行数据。射频单元502包括但不限于天线、至少一个放大器、收发信机、耦合器、低噪声放大器、双工器等。
网络模块504为用户提供了无线的宽带互联网访问，如帮助用户收发电子邮件、浏览网页和访问流式媒体等。
音频输出单元506可以将射频单元502或网络模块504接收的或者在存储器518中存储的音频数据转换成音频信号并且输出为声音。而且，音频输出单元506还可以提供与电子设备500执行的特定功能相关的音频输出(例如，呼叫信号接收声音、消息接收声音等等)。音频输出单元506包括扬声器、蜂鸣器以及受话器等。
输入单元508用于接收音频或视频信号。输入单元508可以包括图形处理器(Graphics Processing Unit，GPU)5082和麦克风5084，图形处理器5082对在视频捕获模式或图像捕获模式中由图像捕获装置(如摄像头)获得的静态图片或视频的图像数据进行处理。处理后的图像帧可以显示在显示单元512上，或者存储在存储器518(或其它存储介质)中，或者经由射频单元502或网络模块504发送。麦克风5084可以接收声音，并且能够将声音处理为音频数据，处理后的音频数据可以在电话通话模式的情况 下转换为可经由射频单元502发送到移动通信基站的格式输出。
电子设备500还包括至少一种传感器510，比如指纹传感器、压力传感器、虹膜传感器、分子传感器、陀螺仪、气压计、湿度计、温度计、红外线传感器、光传感器、运动传感器以及其他传感器。
显示单元512用于显示由用户输入的信息或提供给用户的信息。显示单元512可包括显示面板5122，可以采用液晶显示器、有机发光二极管等形式来配置显示面板5122。
用户输入单元514可用于接收输入的数字或字符信息，以及产生与电子设备的用户设置以及功能控制有关的键信号输入。具体地，用户输入单元514包括触控面板5142以及其他输入设备5144。触控面板5142也称为触摸屏，可收集用户在其上或附近的触摸操作。触控面板5142可包括触摸检测装置和触摸控制器两个部分。其中，触摸检测装置检测用户的触摸方位，并检测触摸操作带来的信号，将信号传送给触摸控制器；触摸控制器从触摸检测装置上接收触摸信息，并将它转换成触点坐标，再送给处理器520，接收处理器520发来的命令并加以执行。其他输入设备5144可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆，在此不再赘述。
进一步的，触控面板5142可覆盖在显示面板5122上，当触控面板5142检测到在其上或附近的触摸操作后，传送给处理器520以确定触摸事件的类型，随后处理器520根据触摸事件的类型在显示面板5122上提供相应的视觉输出。触控面板5142与显示面板5122可作为两个独立的部件，也可以集成为一个部件。
接口单元516为外部装置与电子设备500连接的接口。例如，外部装置可以包括有线或无线头戴式耳机端口、外部电源(或电池充电器)端口、有线或无线数据端口、存储卡端口、用于连接具有识别模块的装置的端口、音频输入/输出(I/O)端口、视频I/O端口、耳机端口等等。接口单元516可以用于接收来自外部装置的输入(例如，数据信息、电力等等)并且将 接收到的输入传输到电子设备500内的一个或多个元件或者可以用于在电子设备500和外部装置之间传输数据。
存储器518可用于存储应用程序程序以及各种数据。存储器518可主要包括存储程序区和存储数据区，其中，存储程序区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能、图像播放功能等)等；存储数据区可存储根据移动终端的使用所创建的数据(比如音频数据、电话本等)等。此外，存储器518可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。
处理器520通过运行或执行存储在存储器518内的应用程序程序和/或模块，以及调用存储在存储器518内的数据，执行电子设备500的各种功能和处理数据，从而对电子设备500进行整体监控。处理器520可包括一个或多个处理单元；处理器520可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等，调制解调处理器主要处理图像处理的操作。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。
以上仅为本申请的可选实施例而已，并不用于限制本申请，对于本领 域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种图像传感器，包括：
    彩色滤光阵列，所述彩色滤光阵列包括多个采样像素组，每个所述采样像素组包括多个像素区域，多个所述像素区域包括彩色像素区域和白色像素区域，所述彩色像素区域包围所述白色像素区域，
    其中，所述彩色像素区域包括至少两个第一像素区域、至少一个第二像素区域和至少一个第三像素区域，所述第一像素区域、所述第二像素区域、所述第三像素区域用于接收不同波长范围的可见光。
  2. 根据权利要求1所述的图像传感器，其中，
    所述第一像素区域为绿色像素区域；
    所述第二像素区域为红色像素区域；
    所述第三像素区域为蓝色像素区域。
  3. 根据权利要求1所述的图像传感器，其中，所述采样像素组还包括：
    第一深槽隔离，设置于相邻两个像素区域之间。
  4. 根据权利要求1至3中任一项所述的图像传感器，其中，
    多个所述采样像素组相连且呈阵列排布。
  5. 根据权利要求1至3中任一项所述的图像传感器，其中，所述采样像素组为合成像素组；
    所述彩色像素区域或所述白色像素区域包括多个子像素；
    相邻两个所述子像素之间设置有第二深槽隔离。
  6. 根据权利要求5所述的图像传感器，其中，
    每个所述像素区域或每个所述子像素设置有依次堆叠的感光电路、光电转换元件和滤光元件。
  7. 根据权利要求6所述的图像传感器，还包括：
    微透镜层，设置于所述滤光元件上；
    所述微透镜层包括一个或多个微透镜，多个所述微透镜位于不同的所 述像素区域上或不同所述的子像素上。
  8. 根据权利要求6所述的图像传感器，其中，所述彩色滤光阵列还包括：
    半导体层，所述半导体层用于安装所述感光电路、光电转换元件和滤光元件中至少之一。
  9. 一种摄像模组，包括：
    电路板；
    如权利要求1至8中任一项所述的图像传感器，与所述电路板电连接；
    镜头，设置于所述图像传感器背离所述电路板的一侧。
  10. 一种电子设备，包括如权利要求9所述的摄像模组。
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