WO2022139185A1 - Bague de retenue, procédé de fabrication de celle-ci et appareil cmp comprenant celle-ci - Google Patents

Bague de retenue, procédé de fabrication de celle-ci et appareil cmp comprenant celle-ci Download PDF

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Publication number
WO2022139185A1
WO2022139185A1 PCT/KR2021/016908 KR2021016908W WO2022139185A1 WO 2022139185 A1 WO2022139185 A1 WO 2022139185A1 KR 2021016908 W KR2021016908 W KR 2021016908W WO 2022139185 A1 WO2022139185 A1 WO 2022139185A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
synthetic resin
retainer ring
layer
frame layer
Prior art date
Application number
PCT/KR2021/016908
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English (en)
Korean (ko)
Inventor
최현석
한상효
한병희
Original Assignee
주식회사 에스엠티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 주식회사 에스엠티 filed Critical 주식회사 에스엠티
Priority to CN202180077435.4A priority Critical patent/CN116457929A/zh
Priority to JP2023530950A priority patent/JP2023551216A/ja
Publication of WO2022139185A1 publication Critical patent/WO2022139185A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D12/00—Producing frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins

Definitions

  • the present invention relates to a retainer ring, a method for manufacturing the same, and a CMP apparatus including the same, and more particularly, to a retainer ring including a frame layer and a synthetic resin layer, a method for manufacturing the same, and a CMP apparatus including the retainer ring .
  • CMP chemical mechanical polishing
  • the CMP process uses a chemical slurry and a polishing pad to cause a chemical reaction between the slurry and the wafer, and at the same time transfers the mechanical force of the polishing pad to the wafer to planarize the wafer.
  • a polishing head of a CMP apparatus includes a retainer ring and a wafer carrier.
  • the wafer carrier serves to place the wafer on the polishing pad while in contact with the lower surface of the polishing head, and then is polished while the wafer is rotated by the rotation of the polishing pad and the polishing head.
  • a retainer ring disposed at the lower end of the wafer carrier serves to prevent the wafer from being separated from the wafer carrier during wafer polishing.
  • the retainer ring is generally positioned at the bottom of the wafer carrier and is in the form of a ring surrounding the side of the wafer.
  • Current manufacturing methods include a manufacturing process of insert injection molding in which a synthetic resin is injected by inserting a metal core, or a manufacturing process of bonding a synthetic resin to a metal frame layer.
  • the retainer ring manufacturing process by insert injection molding using a metal core has problems with excessive defects and strength due to surface shrinkage when curing after injection during injection molding. manufacture
  • the manufacturing process of bonding the synthetic resin to the metal frame layer may cause quality problems as the bonding portion falls off during use.
  • An object of the present invention is to provide a retainer ring in which adhesive strength does not significantly decrease even after testing, a method for manufacturing the same, and a CMP apparatus including the same.
  • a retainer ring used in a CMP apparatus comprises: a frame layer coupled to a lower end of a carrier of the CMP apparatus, the frame layer including a thermosetting resin or a thermoplastic resin; and a synthetic resin layer disposed under the frame layer, the lower portion being in contact with the polishing pad to retain the wafer, wherein the synthetic resin layer has a plurality of grooves formed on one surface in the direction of the frame layer.
  • a depth of the plurality of grooves may be 0.1 micrometers or more and 500 micrometers or less.
  • the synthetic resin layer may be bonded to the frame layer.
  • the frame layer may include an epoxy resin and a thermosetting resin curing agent.
  • the epoxy resin is a bisphenol-type epoxy-based resin with chlorinated polypropylene, chlorinated ethyl-propyl copolymer, chloromethyl oxirane, butoxymethyl oxirane, butylaldehyde-acetalized polyvinyl alcohol akylene diisocyanate, butyl acrylate-glycidyl methacrylate copolymer, ethylene acrylate copolymer, butyl acrylate, ethenyl It may be a mixture of one or more thermosetting resins selected from benzene butadienestyrene, acrylonitrile-butadiene-styrene, and butyral vinyl acetal polymer.
  • thermosetting resin curing agent may include at least one of dimethyl aminomethyl phenol, trisco-methyl aminomethyl phenol, benzyl dimethyl amino polyethylene polyamine, cyanoethyl polyamine, and ketone terminated polyamine.
  • the synthetic resin layer is polyetheretherketone (PEEK), polymethylene (POM), polyphenylsulfide (PPS), polybenzimidazole (PBI), polyetherimide (PEI), polybutylene terephthalate (PBT), poly Ethyl terephthalate (PET), polyimide (PI), polyamideimide (PAI), polyketone (Poketone), perfluoroalkoxyalkane (PFA), polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene ( PCTFE), polyvinylidene fluoride (PVDF), and polyamide (PA) may be included.
  • PEEK polyetheretherketone
  • POM polymethylene
  • PPS polyphenylsulfide
  • PBI polybenzimidazole
  • PEI polyetherimide
  • PBT polybutylene terephthalate
  • PET poly Ethyl terephthalate
  • PI polyimide
  • PAI polyamideimide
  • the retainer ring may further include a primer resin layer positioned between the synthetic resin layer and the frame layer.
  • the primer resin layer is bisphenol A diglycidyl ether, 2,5 furandione, polypropylene, 1-methyl-2-pyrrolidone, diphenyldimethoxysilane, diphenylethoxysilane, methyltrimethoxysilane, At least one of dimethyldimethoxysilane, aminopropyltrimethoxysilane, aminopropyltriethoxysilane, glycidoxypropyltrimethoxysilane, glycidoxypropyltriethoxysilane, tetramethoxysilane and tetraethoxysilane may include
  • At least one protrusion may be formed on the synthetic resin layer, and the plurality of grooves may be formed on a surface of the protrusion.
  • the protrusion may include a first portion extending from the synthetic resin layer and a second portion extending from the first portion and having a width equal to or wider than that of the first portion.
  • One or more holes may be formed in the frame layer to be bolted to a lower end of the carrier.
  • One or more grooves may be formed in at least one of a lower end and a side surface of the synthetic resin layer.
  • One or more through-holes may be formed in at least one of a lower end and a side surface of the synthetic resin layer.
  • a method for manufacturing a retainer ring used in a CMP apparatus comprises: forming a synthetic resin layer; forming a plurality of grooves on one surface of the synthetic resin layer; and forming a frame layer on the synthetic resin layer.
  • the forming of the plurality of grooves may include forming the surface unevenness using at least one of a chemical etching method and a physical scratching method.
  • the surface unevenness means a plurality of grooves.
  • the chemical etching method may include at least one of an organic solvent cleaning method, a basic solution cleaning method, and an acidic solution cleaning method
  • the physical scratching method is a shot blasting method, a wire brushing method. ), a wire abrasion method, a sand blasting method (sand blasting), and may include at least one of machining (machining).
  • the synthetic resin layer may be formed by a molding method or an injection molding method using a mold.
  • the forming of the plurality of grooves may include roughening the surface of the mold to form a concave-convex structure and forming the synthetic resin layer in the mold, wherein the concave-convex structure is formed from the synthetic resin.
  • the plurality of grooves may be formed in the synthetic resin layer by being transferred to the surface of the layer.
  • a depth of the plurality of grooves may be 0.1 micrometers or more and 500 micrometers or less.
  • the method may further include a step of forming a primer resin layer by performing a primer treatment on the synthetic resin layer.
  • the synthetic resin layer is inserted into the molding mold, the thermosetting resin is filled in the molding mold, the thermosetting resin is cured, and the synthetic resin layer and the frame layer are laminated and combined from the molding mold. It may include the step of taking out.
  • the forming of the frame layer includes the steps of moving a liquid thermosetting resin from a cylinder to the tip of the cylinder, injecting and filling a cavity in a mold composed of male and female molds with the liquid thermosetting resin, and heating the mold to form the thermosetting resin After solidifying the resin, it may include the step of cooling and taking out.
  • a CMP apparatus includes the retainer ring; a carrier coupled to an upper end of the retainer ring; and a polishing pad in contact with a lower end of the retainer ring, and on which a wafer is disposed.
  • the bonding reliability between the layers can be improved, and ultimately, the bonding strength of the retainer ring can be increased.
  • FIG. 1 is a view showing a retainer ring according to an embodiment of the present invention.
  • FIG. 2 is a view illustrating a state in which a retainer ring is coupled to a carrier according to an embodiment of the present invention.
  • FIG. 3 is a partial cross-sectional view illustrating a part of a cross-section taken along the cutting line A-A' of FIG. 1 .
  • FIG. 4 is a view showing a retainer ring according to another embodiment of the present invention.
  • FIG. 5 is a partial cross-sectional view showing a part of the cross-section taken along the cutting line B-B' of FIG. 4 .
  • FIG. 6 is a view showing a synthetic resin layer according to an embodiment of the present invention.
  • FIG. 7 is a view illustrating a frame layer and a spiral coil inserted into a hole of the frame layer according to another embodiment of the present invention.
  • FIG. 8 is a partial cross-sectional view showing a synthetic resin layer and a frame layer according to a modified embodiment of the present invention.
  • FIG. 9 is a view showing the frame layer in which the projections of FIG. 8 are formed.
  • FIG. 10 is a view for explaining a method of coupling the lower end of the carrier and the upper end of the retainer ring using bolts.
  • FIG. 11 is a perspective view of a synthetic resin layer in which grooves or through-holes are formed according to another embodiment of the present invention.
  • a part of a layer, film, region, plate, etc. when a part of a layer, film, region, plate, etc. is said to be “on” or “on” another part, it includes not only cases where it is “directly on” another part, but also cases where another part is in the middle. . Conversely, when a part is said to be “right above” another part, it means that there is no other part in the middle. Also, to say that it is “on” or “on” the reference part is located above or below the reference part. It does not necessarily mean to be “on” or “on” toward the opposite direction of gravity.
  • planar view it means when the target part is viewed from above
  • cross-sectional view means when viewed from the side when a cross-section of the target part is vertically cut.
  • FIG. 1 is a view showing a retainer ring according to an embodiment of the present invention
  • FIG. 2 is a view showing a state in which the retainer ring according to an embodiment of the present invention is coupled to a carrier.
  • the retainer ring 110 includes a frame layer 112 and a synthetic resin layer 115 .
  • the retainer ring 110 used in the CMP apparatus is coupled to the lower end of the carrier 120 of the CMP apparatus 10 and includes a frame layer 112 including a thermosetting resin or a thermoplastic resin, and a frame layer 112 of It is disposed at the bottom and includes a synthetic resin layer 115 having the lower portion in contact with the polishing pad 200 to retain the wafer 300 .
  • the frame layer 112 may be in the form of an integrated circular ring, but may also be in the form of a divided circular ring according to an embodiment.
  • the retainer ring 110 When the retainer ring 110 is coupled to the carrier 120 , the upper end of the frame layer 112 and the lower end of the carrier 120 may be contacted and coupled, as shown in FIG. 1 , the frame layer 112 . At least one hole 113 for bolting the lower end of the carrier 120 may be formed therein.
  • FIG. 3 is a partial cross-sectional view showing a part of a cross-section taken along the cutting line A-A' of FIG. 1 .
  • the synthetic resin layer 115 has a plurality of grooves 119 formed on one surface in the direction of the frame layer 112 .
  • the synthetic resin layer 115 may be bonded to the frame layer 112 located at the top, and accordingly, the bonding surface of the frame layer 112 may also form a shape corresponding to the plurality of grooves 119 .
  • the depth d1 of the plurality of grooves 119 may be 0.1 micrometers or more and 500 micrometers or less. Specifically, the depth d1 of the groove portion 119 means the depth of the valley formed by the groove portion 119 with respect to the vertical direction as shown in the figure, and the vertical direction is the frame layer on the synthetic resin layer 115 . (112) may be a stacking direction. In addition, in the present specification, the depth d1 of the groove portion 119 is the degree of unevenness, and may be understood as the surface roughness Ra of the upper surface of the synthetic resin layer 115 .
  • the bonding strength between the frame layer 112 and the synthetic resin layer 115 is not sufficient, so that the adhesive strength may be significantly reduced after a long-term reliability test for the retainer ring. have.
  • the depth d1 of the groove portion 119 is greater than 500 micrometers, there may be a problem in that the adhesive strength decreases due to the lack of an anchoring effect of the molding liquid on the substrate.
  • the inventors of the present invention form a plurality of grooves 119 having a depth d1 of 0.1 micrometer or more and 500 micrometers or less on one surface of the synthetic resin layer 115, and form a frame layer 112 thereon, , it was confirmed that the bonding strength between the frame layer 112 and the synthetic resin layer 115 could be improved. More specifically, it was confirmed that there was no change in the adhesive strength of the retainer ring even after a long-term reliability test of 500 hours or more.
  • the retainer ring 110 moving together with the carrier 120 performs rotational movement and left-right movement (X, Y-axis directions) based on the central axis of the carrier 120 , and applies pressure to the wafer 300 .
  • vertical movement (Z-axis) is also performed, where the plurality of grooves 119 formed on one surface of the synthetic resin layer 115 are transmitted to the retainer ring 110 in the X, Y, and Z-axis directions.
  • a strong bonding force with the frame layer 112 may be provided.
  • the frame layer 112 may include a thermosetting resin or a thermoplastic resin, as described above.
  • the frame layer 112 may include an epoxy resin as a thermosetting resin and a thermosetting resin curing agent.
  • the epoxy resin is a bisphenol-type epoxy-based resin with chlorinated polypropylene, chlorinated ethyl-propyl copolymer, chloromethyl oxirane, butoxymethyl oxirane, butylaldehyde-acetalized polyvinyl alcohol akylene diisocyanate, butylacrylate-glycidyl methacrylate copolymer, ethylene acrylate copolymer, butylacrylate, ethenyl It may be a mixture of one or more thermosetting resins selected from among benzene butadiene-styrene, acrylonitrile-butadiene-styrene, and butyral vinyl acetal polymer.
  • the thermosetting resin curing agent may include at least one of di
  • Synthetic resin layer 115 is polyether ether ketone (PEEK), polymethylene (POM), polyphenyl sulfide (PPS), polybenzimidazole (PBI), polyether imide (PEI), polybutylene terephthalate (PBT) , polyethylene terephthalate (PET), polyimide (PI) and polyamideimide (PAI), polyketone (Poketone), perfluoroalkoxyalkane (PFA), polytetrafluoroethylene (PTFE), polychlorotrifluor at least one of ethylene (PCTFE), polyvinylidene fluoride (PVDF) and polyamide (PA).
  • PEEK polyether ether ketone
  • POM polymethylene
  • PPS polyphenyl sulfide
  • PBI polybenzimidazole
  • PEI polyether imide
  • PBT polybutylene terephthalate
  • PET polyethylene terephthalate
  • PI polyimide
  • PC polycarbonate
  • acetal engineering plastic resins having excellent heat resistance and abrasion resistance, acid resistance, and chemical resistance.
  • FIG. 4 is a view showing a retainer ring according to another embodiment of the present invention
  • FIG. 5 is a partial cross-sectional view showing a portion of the cross-section taken along the cutting line B-B' of FIG.
  • the retainer ring 110a may further include a primer resin layer 118 positioned between the synthetic resin layer 115 and the frame layer 112 .
  • the primer resin layer 118 may improve bonding strength between the synthetic resin layer 115 and the frame layer 112 .
  • a plurality of grooves 119 are formed on one surface in the direction of the frame layer 112 , and the depth d2 of the plurality of grooves 119 is 0.1 micrometers or more and 500 micrometers. may be below.
  • the primer resin layer 118 positioned on the synthetic resin layer 115 may be formed along the shape of the valleys and ridges formed by the plurality of grooves 119 .
  • the primer resin layer 118 serves to bond the frame layer 112 and the synthetic resin layer 115 , and the primer resin layer 118 is bisphenol A diglyceride to facilitate physical bonding with the frame layer 112 .
  • FIG. 6 is a view showing a synthetic resin layer according to an embodiment of the present invention.
  • the retainer ring 110 when the retainer ring 110 is coupled to the carrier 120, the upper end of the frame layer 112 and the lower end of the carrier 120 may be contacted and coupled, as shown in FIG. 1 , One or more holes 113 for bolting to the lower end of the carrier 120 may be formed in the frame layer 112 .
  • FIG. 6 is a view showing the upper end of the synthetic resin layer 115.
  • the coupling of the carrier 120 and the retainer ring 110 using a bolt will be described.
  • the bolt fixing part 117 formed on the upper end of the synthetic resin layer 115 can be seen.
  • the bolt fixing part 117 is a form including two or more protrusions, and as shown in FIG. 6 , a bolt (insert bolt) is placed inside the protruding part to fix the lower end of the insert bolt to the synthetic resin layer 115. do.
  • the frame layer 112 surrounds the upper part of the bolt, and a hole 113 is formed in the frame layer 112 that is hardened to include the bolt upper part.
  • the primer resin layer 118 is formed, the primer resin layer 118 and the frame layer 112 surround the upper portion of the bolt.
  • one or more bolt fixing parts 117 may be included in the synthetic resin layer 115 , and in this case, the frame layer 112 corresponding to each of the bolt fixing parts 117 may also be included.
  • One or more holes 113 will be formed.
  • the one or more holes 113 have bolts molded by the insert bolt molding method, and a bolt configuration that can be coupled to the bolt portion molded in the retainer ring 110 . It is possible to couple the retainer ring 110 and the lower end of the carrier 120 by using .
  • FIG. 7 is a view illustrating a frame layer and a spiral coil inserted into a hole of the frame layer according to another embodiment of the present invention.
  • FIG. 7 (a) is an enlarged view showing the hole 113 formed in the frame layer 112.
  • the frame layer 112 coupled to the lower end of the carrier 120 of the CMP apparatus.
  • one or more holes 113 into which a helical coil 114 is inserted may be formed at the upper end. It can be seen that the spiral coil 114 is inserted into the tapped hole 113 , and the inserted spiral coil 114 can be fastened to the lower end of the carrier 120 by bolting.
  • FIG. 7(b) is a view showing a spiral coil 114 inserted into the hole 113 of the frame layer 112.
  • the structure of the spiral coil 114 is a coil (coil), a tang for insertion, and a notch for removal of the tang after insertion.
  • the spiral coil 114 used in the present invention has strong durability, such as stainless steel, and a metal with strong acid resistance and chemical resistance may be used.
  • FIG. 7( c ) is a diagram illustrating a cross-section of the spiral coil 114 inserted into the hole 113 of the frame layer 112 . As shown in the portion of the spiral coil 114 that is not inserted into the hole 113 in FIG. 7C , it can be seen that the diameter of the spiral coil 114 before being inserted is larger than the diameter of the hole 113 . .
  • the process of inserting the spiral coil 114 into the hole 113 is possible by applying a torque to the tang of the spiral coil 114 and reducing the diameter of the first peak of the spiral coil 114, and after insertion, high tensile force
  • the mount of each coil with Due to such a fixing method, when the bolts fastened to the spiral coil 114 are removed, the spiral coil 114 itself may not fall out of the hole 113 .
  • the method for manufacturing a retainer ring according to an embodiment of the present invention includes forming a synthetic resin layer 115, a synthetic resin layer It includes the steps of forming a plurality of grooves 119 on one surface of the 115 and forming the frame layer 112 on the synthetic resin layer 115 .
  • the synthetic resin layer 115 in the present invention can be formed not only in the form of a circular ring of the injection product, but also in the form of a divided circular ring, and the synthetic resin layer 115 is an injection product or a rolled tube by a mold structure, It may be manufactured by machining a plate or the like.
  • the retainer ring may be machined to a standard of use, and according to an embodiment, the method may further include combining an upper end of the frame layer and a lower end of the carrier of the CMP device to bond the carrier to the retainer ring. .
  • the method may further include coupling an upper end of the frame layer 112 and a lower end of the carrier 120 of the CMP apparatus.
  • One or more holes 113 may be formed in the frame layer 112 disposed on the upper portion of the retainer ring 110 for coupling the lower end of the carrier 120 and the retainer ring 110 , and the hole 113 may be formed in the frame layer 112 . Through the carrier 120 and bolt coupling can be made.
  • the plurality of grooves 119 may be formed by roughening the synthetic resin layer 115 .
  • the forming of the plurality of grooves 119 may include forming the surface irregularities using at least one of a chemical etching method and a physical scratching method.
  • the chemical etching method may include at least one of an organic solvent cleaning method, a basic solution cleaning method, and an acidic solution cleaning method
  • the physical scratching method is a shot blasting method, a wire brushing method ( wire brushing), wire abrasion, sand blasting, and machining may be included.
  • the synthetic resin layer may be formed by a molding method or an injection molding method using a mold.
  • the forming of the plurality of grooves 119 may include roughening the surface of the mold to form an uneven structure and forming the synthetic resin layer in the mold. That is, the synthetic resin layer 115 may be manufactured using the above-described molding method or injection molding method in a mold having an uneven structure formed on the surface thereof. Accordingly, the concave-convex structure may be transferred to the surface of the synthetic resin layer 115 to form a plurality of grooves 119 in the synthetic resin layer 115 .
  • the roughening treatment performed on the surface of the mold may be applied without limitation by chemical or physical methods.
  • the frame layer 112 may be formed through a molding method, and the frame layer 112 may include a thermosetting resin.
  • the forming of the frame layer 112 may include inserting the synthetic resin layer 115 into the molding mold, then filling the molding mold with a thermosetting resin and curing the thermosetting resin.
  • thermosetting resin is prepared by adding silica (SiO 2 ) to the epoxy resin, then dispersing it using a high-speed stirrer, adding a thermosetting resin curing agent to the dispersed epoxy resin and mixing it at a mixing ratio of 50 phr to 100 phr to produce a solution It may be a molding solution generated through the steps of degassing the mixed solution at a vacuum degree of 10 0 to 10 -2 torr to complete the molding solution using a paste mixer.
  • This molding liquid is transferred to a molding die, into which the synthetic resin layer 115 is inserted, by a vacuum injector, molded in a vacuum state, and then cured at about 100° C. for 30 minutes to cure the thermosetting resin, that is, the molding liquid.
  • a frame layer 112 positioned thereon may be formed. The curing of the molding liquid may be performed in a vacuum oven, an air convection oven, or a belt-type oven.
  • the step of taking out the laminated synthetic resin layer 115 and the frame layer 112 from the molding frame may be further followed.
  • the frame layer 112 may be formed through an injection molding method, and the frame layer 112 may include a thermosetting resin or a thermoplastic resin.
  • an injection molding machine in which a screw is disposed in a heating cylinder, and a male and female mold may be used.
  • the injection molding method may consist of raw material metering, mold fastening, pressure maintenance, cooling, and mold taking out in the order of steps. After measuring a predetermined weight of the thermosetting resin or thermoplastic resin constituting the frame layer, it can be melted in the cylinder heating part and moved to the tip of the cylinder. Next, after the male and female molds are combined and fastened, the nozzle at the tip of the heating cylinder is connected to the gate of the mold, and then the molten thermosetting resin or the thermoplastic resin can be injected and filled into the cavity in the mold with high pressure. After that, the mold is cooled to solidify the thermosetting resin or the thermoplastic resin, and then the male and female molds are separated to take out the molded article.
  • a primer treatment is performed on the synthetic resin layer 115 to form a primer resin layer 118 .
  • the step of forming the primer resin layer 118 may be performed between the step of forming the plurality of grooves 119 and the step of forming the frame layer 112 on the synthetic resin layer 115 .
  • a plurality of grooves 119 are formed on one surface of the synthetic resin layer 115 through roughening treatment, and then the primer resin layer 118 can be formed by spraying on the upper surface of the synthetic resin layer 115 .
  • the frame layer 112 may be formed by a molding method or an injection molding method as described above.
  • the frame layer 112 including a thermosetting resin or a thermoplastic resin and a synthetic resin layer disposed under the frame layer 112 . It includes a retainer ring 110 having a 115 , and is in contact with the lower end of the carrier 120 and the retainer ring 110 coupled to the upper end of the retainer ring 110 and the wafer 300 is disposed at the upper end. It includes a pad 200 .
  • FIG. 8 is a partial cross-sectional view showing a synthetic resin layer and a frame layer according to a modified embodiment of the present invention. 9 is a view showing the frame layer in which the projections of FIG. 8 are formed.
  • the retainer ring may include a synthetic resin layer 115 and a frame layer 112 .
  • at least one protrusion 116 may be formed on the synthetic resin layer 115
  • a plurality of grooves 119 may be formed on the surface of the protrusion 116 .
  • the depth d1 of the plurality of grooves 119 may be 0.1 micrometers or more and 500 micrometers or less. The depth d1 of the groove portion 119 is omitted because it overlaps with the above description.
  • the contact area between the synthetic resin layer 115 and the frame layer 112 is widened, and the effect of increasing the friction force between the frame layer 112 and the synthetic resin layer 115 is obtained. can provide Ultimately, there is an effect of increasing the mutual fixation force.
  • the retainer ring 110 moving together with the carrier 120 also rotates and moves left and right (X, Y-axis directions) with respect to the central axis of the carrier 120 , and a process of applying pressure to the wafer 300 . It also moves up and down (Z axis).
  • the protrusion 116 formed on the synthetic resin layer 115 makes it possible to provide a strong bonding force with the frame layer 112 with respect to the force in the X, Y, and Z axis directions transmitted to the retainer ring 110 . is meaningful in
  • the protrusion 116 according to the present embodiment, the first portion 116a extending from the synthetic resin layer 115 and the first portion 116a extending from, the width equal to or wider than the first portion 116a.
  • a second portion 116b may be included.
  • the protrusion 116 including the first portion 116a and the second portion 116b is an exemplary structure and is not limited thereto, and may include various shapes to increase the contact area.
  • the second part 116b may have a shape extending to only one side, not to both sides as shown in FIGS. 8 and 9 .
  • the second part 116b is shown to be wider than the first part 116a in FIG. 8 , a shape in which the first part and the second part have the same width, that is, a shape protruding with the same width is also possible.
  • FIG. 10 is a view for explaining a method of coupling the lower end of the carrier and the upper end of the retainer ring using bolts.
  • FIG. 10 is a manufacturing method of a retainer ring using an insert bolt molding method. 10, the step of forming a bolt fixing part 117 on the upper end of the synthetic resin layer 115, and fixing the lower end of the bolt to the formed bolt fixing part 117 (FIG. 10 (a)), the inside of the fixed bolt Inserting a resin bolt into the (Fig. 10(b)), forming a primer resin layer 118 and a frame layer 112 on the upper surface of the synthetic resin layer 115 in a state in which the resin bolt is inserted ( 10(c)) can be seen. In this case, the space into which the resin bolt is inserted becomes the hole 113 in the frame layer 112 .
  • the step of removing the resin bolt to form the hole 113 in a state in which only the insert bolt is molded in the frame layer 112 may be included, and as a result, as shown in FIG.
  • One or more holes 113 may be formed.
  • the lower end of the carrier 120 of the CMP apparatus and the upper end of the retainer ring may be coupled to the hole 113 into which the bolt is inserted by using the insert bolt molding method formed in this way, using a bolt that can be combined.
  • the method further comprises the steps of forming a hole in the upper end of the frame layer taken out from the molding die, tapping the inner periphery of the hole, and inserting the spiral coil into the tapped hole, the hole in which the spiral coil is inserted.
  • the method may further include coupling the upper end of the frame layer and the lower end of the carrier of the CMP device using a bolt fastening method.
  • FIG. 11 is a perspective view of the synthetic resin layer 115 having grooves or through-holes formed therein according to another embodiment of the present invention.
  • one or more grooves 115G may be formed in at least one of the lower end and side surfaces of the synthetic resin layer 115 .
  • one or more through-holes 115H may be formed in at least one of a lower end and a side surface of the synthetic resin layer 115 .
  • the grooves 115G and the through-holes 115H shown in FIG. 11 are exemplary configurations for description, and if they are formed on at least one of the lower end and the side surface of the synthetic resin layer 115, there is no particular limitation on the position or number of the grooves 115G. It goes without saying that each may be configured in singular or plural according to embodiments of the present invention.
  • the groove 115G or the through hole 115H is to prevent the slurry liquid used in the wafer polishing process from pooling in the inner space of the retainer ring retaining the wafer.
  • the retainer rings of Examples 1 to 6 including the frame layer and the synthetic resin layer were manufactured. Specifically, a plurality of grooves were formed on one surface of the synthetic resin layer containing polyether ether ketone (PEEK) by using a sand blasting method. At this time, the depths of the grooves were respectively 0.1 micrometers, 1 micrometers, 10 micrometers, 100 micrometers, 250 micrometers, and 500 micrometers to prepare the synthetic resin layers of Examples 1 to 6.
  • PEEK polyether ether ketone
  • thermosetting resin and a thermosetting resin curing agent including an ethylene acrylate copolymer and polyethylene polyamine in a bisphenol-type epoxy-based resin was prepared. Thereafter, the mixed solution was defoamed at a vacuum degree of 100 to 10 -2 torr using a paste mixer to form a molding solution. After that, the molding solution was injected into a mold on the synthetic resin layer and cured to prepare a frame layer.
  • each adhesive strength was measured after leaving it to stand for 500 hours in a high-temperature and high-humidity (85°C/85%) environment.
  • 12 is a schematic diagram for explaining a method for measuring adhesive strength. Referring to FIG. 12 , the adhesive strength was measured by performing a compressive strength test in which a force is applied in one direction using a tensile tester for each specimen including the synthetic resin layer 115 and the frame layer 112 . The measured adhesive strength is shown in Table 1 below.
  • Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative Example 1 Comparative Example 2 Depth of groove (unit: ⁇ m) 0.1 One 10 100 250 500 0.01 1000 Adhesive strength before testing (unit: MPa) 9.1 9.3 9.7 9.8 8.3 8.1 4.8 3.4 Adhesive strength after test (unit: MPa) 8.7 8.8 9.2 9.5 8.2 8.0 2.1 1.4 rate of change -4.4% -5.4% -5.2% -3.1% -1.2% -1.2% -56.3% -58.8%
  • the degree of decrease in adhesive strength after the long-term reliability test was -6% or less.
  • the degree of decrease in adhesive strength after the long-term reliability test was -56.3%, confirming that a very large decrease occurred. This can be seen as a result of insufficient bonding strength between the frame layer and the synthetic resin layer because the depth of the groove is too shallow.
  • the degree of decrease in adhesive strength after the long-term reliability test was -58.8%, confirming that a very large decrease occurred. This can be seen as a result of a decrease in the adhesive strength between the frame layer and the synthetic resin layer due to the lack of anchoring effect of the molding liquid on the substrate because the depth of the groove is too deep.
  • the retainer rings of Examples 7 to 12 including the frame layer, the primary resin layer, and the synthetic resin layer were manufactured. Specifically, a plurality of grooves were formed on one surface of the synthetic resin layer containing polyether ether ketone (PEEK) by using a sand blasting method. At this time, the depths of the grooves were varied to 0.1 micrometer, 1 micrometer, 10 micrometer, 100 micrometer, 250 micrometer, and 500 micrometer, respectively, to prepare the synthetic resin layers of Examples 7 to 12.
  • PEEK polyether ether ketone
  • a material of methyltrimethoxysilane was applied by a spray method to form a primer resin layer. Thereafter, a frame layer was prepared in the same manner as in Examples 1 to 6.
  • Comparative Example 3 including a frame layer, a primary resin layer and a synthetic resin layer in the same manner as in Examples 7 to 12, except that the depths of the plurality of grooves formed in the synthetic resin layer were respectively 0.01 micrometers and 1000 micrometers. and 4 retainer rings were prepared.
  • Example 7 Example 8 Example 9 Example 10
  • Example 11 Example 12 Comparative Example 3 Comparative Example 4 depth of groove 2 (unit:: ⁇ m) 0.1
  • One 10 100 250 500 0.01 1000 Adhesive strength before testing (unit: MPa) 9.5 9.8 10.1 10.8 9.5 9.4 5.1 3.5
  • Adhesive strength after test (unit: MPa) 9.2 9.6 9.5 10.5 9.1 9.0 2.0 1.2 rate of change -3.2% -2.0% -5.9% -2.8% -4.2% -4.3% -60.8% -65.7%
  • the degree of decrease in adhesive strength after the long-term reliability test was -6% or less.
  • the degree of decrease in adhesive strength after the long-term reliability test was -60.8%, confirming that a very large decrease occurred. This can be seen as a result of insufficient bonding strength between the frame layer and the synthetic resin layer because the depth of the groove is too shallow.
  • the degree of decrease in adhesive strength after the long-term reliability test was -65.7%, confirming that a very large decrease occurred. This can be seen as a result of a decrease in the adhesive strength between the frame layer and the synthetic resin layer due to the lack of anchoring effect of the molding liquid on the substrate because the depth of the groove is too deep.
  • the retainer rings of Examples 13 to 18 including the frame layer and the synthetic resin layer were manufactured. Specifically, a plurality of grooves were formed on one surface of the synthetic resin layer containing polyether ether ketone (PEEK) by using a sand blasting method. At this time, the depths of the grooves were respectively 0.1 micrometers, 1 micrometers, 10 micrometers, 100 micrometers, 250 micrometers, and 500 micrometers to prepare the synthetic resin layers of Examples 1 to 6.
  • PEEK polyether ether ketone
  • the liquid thermosetting resin including the ethylene acrylate copolymer and polyethylene polyamine may be moved from the cylinder to the tip of the cylinder.
  • the nozzle at the tip of the cylinder is connected to the gate of the mold.
  • the liquid thermosetting resin may be injected and filled into the cavity in the mold in which the synthetic resin layer is embedded under high pressure.
  • the mold is heated to solidify the thermosetting resin, and after cooling, the male and female molds are separated to take out the frame layer.
  • Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Comparative Example 5 Comparative Example 6 depth of groove 2 (unit: ⁇ m) 0.1 One 10 100 250 500 0.01 1000 Adhesive strength before testing (unit: MPa) 8.4 8.7 9.1 9.5 9.4 8.3 3.0 2.1 Adhesive strength after test (unit: MPa) 7.9 8.2 8.7 8.9 8.6 8.0 1.2 0.8 rate of change -6.0% -5.7% -4.4% -6.3% -8.5% -3.6% -60.0% -61.9%
  • the degree of decrease in adhesive strength after the long-term reliability test was -7% or less.
  • the degree of decrease in adhesive strength after the long-term reliability test was -60.0%, confirming that a very large decrease occurred.
  • the degree of decrease in adhesive strength after the long-term reliability test was -61.9%, confirming that a very large decrease occurred.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Une bague de retenue selon un mode de réalisation de la présente invention, qui est une bague de retenue utilisée dans un appareil CMP, comprend : une couche de cadre qui est couplée à la partie inférieure d'un support de l'appareil CMP et comprend une résine thermodurcissable ou une résine thermoplastique ; et une couche de résine synthétique qui est disposée sur la partie inférieure de la couche de cadre et dont la portion inférieure vient en contact avec un tampon de polissage pour retenir une plaquette, la couche de résine synthétique ayant une pluralité d'évidements formés sur un côté dans la direction de la couche de cadre.
PCT/KR2021/016908 2020-12-24 2021-11-17 Bague de retenue, procédé de fabrication de celle-ci et appareil cmp comprenant celle-ci WO2022139185A1 (fr)

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CN202180077435.4A CN116457929A (zh) 2020-12-24 2021-11-17 挡圈及其制造方法、包括该挡圈的cmp装置
JP2023530950A JP2023551216A (ja) 2020-12-24 2021-11-17 リテーナーリング、これを製造する方法、及びこれを含むｃｍｐ装置

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KR100801371B1 (ko) * 1997-05-15 2008-02-05 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 연마 장치에 사용하기 위한 홈 패턴을 가지는연마 패드
KR101224539B1 (ko) * 2011-09-30 2013-01-21 한상효 웨이퍼 연마용 리테이너 링
JP2014110428A (ja) * 2012-11-30 2014-06-12 Ehwa Diamond Ind Co Ltd コンディショナー兼ウェハーリテーナリングおよびその製造方法
US20150367478A1 (en) * 2014-06-18 2015-12-24 Paul Andre Lefevre Polishing pad having porogens with liquid filler
KR20200007529A (ko) * 2018-07-13 2020-01-22 주식회사 에스엠티 Cmp 리테이너 링, 이를 제조하는 방법, 및 리테이너 링을 포함하는 cmp 장치

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KR101455310B1 (ko) * 2013-02-18 2014-10-27 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링
KR102708235B1 (ko) * 2019-06-03 2024-09-23 주식회사 케이씨텍 기판의 연마 장치용 캐리어 헤드의 리테이너 링

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Publication number Priority date Publication date Assignee Title
KR100801371B1 (ko) * 1997-05-15 2008-02-05 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 연마 장치에 사용하기 위한 홈 패턴을 가지는연마 패드
KR101224539B1 (ko) * 2011-09-30 2013-01-21 한상효 웨이퍼 연마용 리테이너 링
JP2014110428A (ja) * 2012-11-30 2014-06-12 Ehwa Diamond Ind Co Ltd コンディショナー兼ウェハーリテーナリングおよびその製造方法
US20150367478A1 (en) * 2014-06-18 2015-12-24 Paul Andre Lefevre Polishing pad having porogens with liquid filler
KR20200007529A (ko) * 2018-07-13 2020-01-22 주식회사 에스엠티 Cmp 리테이너 링, 이를 제조하는 방법, 및 리테이너 링을 포함하는 cmp 장치

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KR20220092099A (ko) 2022-07-01
CN116457929A (zh) 2023-07-18
TW202224854A (zh) 2022-07-01

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