WO2022138459A1 - Resin composition - Google Patents

Resin composition Download PDF

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Publication number
WO2022138459A1
WO2022138459A1 PCT/JP2021/046583 JP2021046583W WO2022138459A1 WO 2022138459 A1 WO2022138459 A1 WO 2022138459A1 JP 2021046583 W JP2021046583 W JP 2021046583W WO 2022138459 A1 WO2022138459 A1 WO 2022138459A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive layer
resin composition
present
Prior art date
Application number
PCT/JP2021/046583
Other languages
French (fr)
Japanese (ja)
Inventor
和通 加藤
周作 上野
高正 平山
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020216111A external-priority patent/JP2022101804A/en
Priority claimed from JP2021152594A external-priority patent/JP7084535B1/en
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN202180086591.7A priority Critical patent/CN116685656A/en
Priority to KR1020237024926A priority patent/KR20230125004A/en
Publication of WO2022138459A1 publication Critical patent/WO2022138459A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Definitions

  • the present invention relates to a resin composition. More specifically, the present invention relates to a resin composition that can be suitably used for forming an adhesive layer used for transfer of small electronic components such as semiconductor chips and LED chips.
  • a semiconductor wafer is individually prepared by dicing while temporarily fixed on a dicing tape, and the individualized semiconductor chip is pushed by a pin member from the dicing tape side on the back surface of the wafer to collet. It is picked up by a suction jig called, and mounted on a mounting board such as a circuit board (for example, Patent Document 1).
  • laser transfer As a means for solving the above problems, a technique called laser transfer is being studied (see, for example, Patent Document 2).
  • small electronic components such as semiconductor chips (for example, squares with a side of 100 ⁇ m or less) are arranged in a grid pattern on a temporary fixing material, and the surface on which the electronic components are arranged is arranged downward. ..
  • a transfer substrate for transferring (receiving) the electronic component is arranged with a gap facing the surface on which the electronic component of the temporary fixing material is arranged.
  • the temporary fixing is released, the electronic component is peeled off, and the electronic component is dropped onto the transfer substrate to transfer the component.
  • the electronic components transferred to the transfer board can be transferred to another carrier board and mounted on the mounting board, or can be mounted by transferring directly from the transfer board to the mounting board.
  • the temporary fixing material and the transfer board are arranged with a gap (clearance), so when the peeled electronic component collides with the transfer board, it is damaged by impact or bounces off the position.
  • the surface of the transfer substrate is required to have shock absorption for alleviating the impact when an electronic component collides with the transfer substrate.
  • adhesiveness is also required so as not to be misaligned or fall off. Therefore, a pressure-sensitive adhesive layer having both shock absorption and adhesiveness is provided on the surface of the transfer substrate (for example, Patent Document 2).
  • the surface (adhesive surface) of the adhesive layer is usually protected by a peeling liner, and the peeling liner is peeled off immediately before use and assembled to the device for use.
  • a peeling liner is peeled off and exposed to the atmospheric environment, there is a problem that the wettability of the adhesive surface changes with time, causing misalignment or dropping when transporting electronic components.
  • the present invention has been made in view of the above problems, and an object of the present invention is that the wettability of the adhesive surface does not easily change even when exposed to an air environment, and misalignment or dropout occurs when transporting electronic components. It is an object of the present invention to provide a resin composition for forming a pressure-sensitive adhesive layer that is unlikely to occur.
  • the first aspect of the present invention provides a resin composition.
  • the resin composition of the first aspect of the present invention is used to form a pressure-sensitive adhesive layer.
  • the resin composition of the present invention is referred to as "the resin composition of the present invention”
  • the pressure-sensitive adhesive layer formed by the resin composition of the first aspect of the present invention is referred to as "adhesive of the present invention”. It may be referred to as "agent layer”.
  • the pressure-sensitive adhesive layer of the present invention can be suitably used for receiving the electronic component arranged on the temporary fixing material, and more specifically, the pressure-sensitive adhesive layer faces the surface on which the electronic component is arranged on the temporary fixing material. It is arranged with a gap and can be suitably used for receiving electronic components. Therefore, the pressure-sensitive adhesive layer of the present invention has both shock absorption for alleviating the impact when receiving the electronic component and adhesiveness so as not to be displaced or fall off when transporting the received electronic component. Is.
  • the resin composition of the present invention can be suitably used for forming the pressure-sensitive adhesive layer of the present invention having such shock absorption and adhesiveness.
  • the adhesive layer of the present invention has its adhesive surface protected by a peeling liner.
  • the peeling liner is laminated on at least one adhesive surface in order to protect the impact absorption and adhesiveness of the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive layer of the present invention receives the electronic component. It is peeled off just before it is used for.
  • the peeling liner is exposed to the atmospheric environment after peeling, there is a problem that the wettability of the adhesive surface changes with time, causing misalignment or dropping when transporting electronic components.
  • the pressure-sensitive adhesive layer of the present invention has a displacement R of water contact angles ⁇ 1 and ⁇ 2 with respect to the pressure-sensitive adhesive surface under the following conditions T 1 and T 2 of 5 ° or less.
  • T 1 and T 2 Immediately after peeling off the peeling liner in a T 1 : 23 ° C environment
  • T 2 After peeling off the peeling liner in a 23 ° C environment and exposing the adhesive surface to an atmospheric environment for 2 hours
  • ⁇ 1 The above in T 1 Water contact angle of adhesive surface (°) ⁇ 2 : Water contact angle (°) of the adhesive surface at T 2 .
  • Displacement R (°) ⁇ 2 - ⁇ 1
  • the configuration in which the displacement R is 5 ° or less makes it difficult for the wettability of the pressure-sensitive adhesive surface to change over time even when the peeling liner is exposed to the atmospheric environment after peeling, and the electrons It is preferable in that it can prevent misalignment and dropout when transporting parts.
  • the ratio of the sinking depth of the pressure-sensitive adhesive layer to the thickness of the pressure-sensitive adhesive layer (subduction depth / thickness ⁇ 100) by the iron ball drop test under the following conditions with respect to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the present invention is determined. It is preferably 15% or more.
  • Iron ball drop test 1 g of iron ball is freely dropped from a height of 1 m onto the adhesive surface.
  • the pressure-sensitive adhesive layer of the present invention exhibits excellent shock absorption, and when receiving an electronic component, it may be damaged, bounced, misaligned, or turned inside out. It is preferable in that it can prevent problems from occurring.
  • the displacement R is adjusted to 5 ° or less, and the wettability of the adhesive surface is obtained even when the peeling liner is peeled off and then exposed to the air environment. Is preferable in that it does not easily change over time and can prevent misalignment and dropout when transporting electronic components.
  • the thickness of the pressure-sensitive adhesive layer of the present invention is preferably 1 ⁇ m or more and 500 ⁇ m or less.
  • the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 1 ⁇ m or more is preferable in that it is excellent in shock absorption due to collision of electronic components. Further, the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 500 ⁇ m or less is preferable from the viewpoint of transferability when the received electronic component is transferred to another carrier substrate or mounting substrate.
  • the resin composition of the present invention is preferably an acrylic pressure-sensitive adhesive composition.
  • the configuration in which the resin composition of the present invention is an acrylic pressure-sensitive adhesive composition is in terms of ease of designing a pressure-sensitive adhesive that adjusts the displacement R to 5 ° or less, transparency, adhesiveness, cost, and the like. ,preferable.
  • the pressure-sensitive adhesive layer of the present invention may have another pressure-sensitive adhesive layer laminated on the surface opposite to the pressure-sensitive adhesive surface.
  • the displacement R of the adhesive surface is adjusted to 5 ° or less, and the wettability of the adhesive surface does not easily change over time even when exposed to an atmospheric environment, and the position when transporting electronic components is achieved. It is preferable in that it can prevent displacement and falling off, and further, it is possible to adjust the shock absorption when receiving the electronic component by another pressure-sensitive adhesive layer laminated on the surface opposite to the pressure-sensitive adhesive surface.
  • another pressure-sensitive adhesive layer can be attached to a substrate constituting a transfer substrate, a carrier substrate, or the like.
  • the base material layer may be laminated on the surface opposite to the pressure-sensitive adhesive surface. It is preferable that the pressure-sensitive adhesive layer of the present invention has a base material layer on a surface opposite to the pressure-sensitive adhesive surface in that stability and handleability when receiving electronic components are improved.
  • another pressure-sensitive adhesive layer may be laminated on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated.
  • another pressure-sensitive adhesive layer By laminating another pressure-sensitive adhesive layer on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated, for example, another pressure-sensitive adhesive layer can be fixed to the carrier substrate, and from the viewpoint of workability. Is preferable.
  • the base material layer is preferably formed of a polyester film from the viewpoint of stability and handleability when receiving electronic components.
  • the second aspect of the present invention provides a pressure-sensitive adhesive layer formed by the resin composition of the present invention.
  • the third aspect of the present invention provides a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the second aspect of the present invention. Since the pressure-sensitive adhesive layer on the second side surface of the present invention and the pressure-sensitive adhesive sheet on the third side surface of the present invention have the pressure-sensitive adhesive layer of the present invention, they are suitable for receiving electronic components arranged on the temporary fixing material. More specifically, the electronic component is arranged on the temporary fixing material with a gap facing the surface on which the electronic component is arranged, and can be suitably used for receiving the electronic component.
  • the pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer of the present invention) formed from the resin composition of the present invention does not easily change the wettability of the pressure-sensitive adhesive surface over time even when exposed to the air environment after the peeling liner is peeled off. , It is possible to prevent misalignment and dropout when transporting electronic parts. Therefore, the resin composition of the present invention can be suitably used for forming a pressure-sensitive adhesive layer having both shock absorption and adhesiveness used for laser transfer.
  • FIG. 3 is a schematic cross-sectional view showing a first step in an embodiment of a method for processing an electronic component using the adhesive sheet shown in FIG.
  • FIG. 3 is a schematic cross-sectional view showing a second step and a third step in an embodiment of a method for processing an electronic component using the adhesive sheet shown in FIG.
  • the resin composition of the present invention is used to form a pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer of the present invention) whose adhesive surface is protected by a peeling liner.
  • the pressure-sensitive adhesive layer of the present invention is used in a processing technique for transferring a small electronic component such as a semiconductor chip or an LED chip to a mounting substrate such as a circuit board, and specifically, on a temporary fixing material.
  • the pressure-sensitive adhesive layer of the present invention By using the pressure-sensitive adhesive layer of the present invention for transferring electronic parts, it is possible to arrange a plurality of electronic parts on the pressure-sensitive adhesive layer of the present invention on an optical time scale, and it is not necessary to pick them up individually. ..
  • the electronic components arranged on the pressure-sensitive adhesive layer of the present invention can be transferred to another carrier substrate and mounted on the mounting substrate, or can be directly transferred from the pressure-sensitive adhesive layer of the present invention to the mounting substrate. Therefore, the manufacturing efficiency can be significantly improved.
  • the pressure-sensitive adhesive layer of the present invention has both shock absorption for alleviating the impact when receiving the electronic component and adhesiveness so as not to be displaced or fall off when the received electronic component is transported. ..
  • the form of the pressure-sensitive adhesive layer of the present invention is not particularly limited as long as it has the pressure-sensitive adhesive surface (the surface of the pressure-sensitive adhesive layer).
  • a single-sided adhesive sheet having only one side as an adhesive surface may be formed, or a double-sided adhesive sheet having both sides having an adhesive surface may be formed.
  • the double-sided pressure-sensitive adhesive sheet may have a form in which both pressure-sensitive adhesive surfaces are provided by the pressure-sensitive adhesive layer of the present invention, or one of them.
  • the adhesive surface is provided by the pressure-sensitive adhesive layer of the present invention, and the other pressure-sensitive adhesive surface is provided by a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention (sometimes referred to as "another pressure-sensitive adhesive layer" in the present specification). It may have a form to be used.
  • the pressure-sensitive adhesive layer of the present invention may form a so-called “base material-less type” pressure-sensitive adhesive sheet having no base material (base material layer), or may form a type of pressure-sensitive adhesive sheet having a base material. good.
  • the "base material-less type” adhesive sheet may be referred to as “base material-less adhesive sheet”
  • the type of adhesive sheet having a base material may be referred to as “base material-based adhesive sheet”.
  • Examples of the base material-less pressure-sensitive adhesive sheet include a double-sided pressure-sensitive adhesive sheet composed of only the pressure-sensitive adhesive layer of the present invention, and a pressure-sensitive adhesive layer different from the pressure-sensitive adhesive layer of the present invention (a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention).
  • Examples thereof include a double-sided adhesive sheet made of.
  • Examples of the pressure-sensitive adhesive sheet with a base material include a single-sided pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on one side of the base material, and a double-sided pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on both sides of the base material.
  • Examples thereof include a double-sided pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on one surface side of the base material and another pressure-sensitive adhesive layer on the other side surface.
  • base material (base material layer) is a support, and when the pressure-sensitive adhesive layer of the present invention is used, it is a portion that receives electronic components together with the pressure-sensitive adhesive layer.
  • the peeling liner that is peeled off when the pressure-sensitive adhesive layer is used is not included in the above-mentioned substrate.
  • the "adhesive sheet” shall include the meaning of "adhesive tape”. That is, the adhesive sheet may be an adhesive tape having a tape-like form.
  • the adhesive surface (adhesive surface for receiving electronic components) of the adhesive layer of the present invention is protected by a peeling liner.
  • the peeling liner is laminated on at least one adhesive surface in order to protect the impact absorption and adhesiveness of the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive layer of the present invention receives the electronic component. It is peeled off just before it is used for.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention, in which 1 is a pressure-sensitive adhesive sheet, 10 is a pressure-sensitive adhesive layer, and R1 and R2 are peeling liners.
  • the pressure-sensitive adhesive sheet 1 has a laminated structure in which a peeling liner R1, a pressure-sensitive adhesive layer 10, and a peeling liner R2 are laminated in this order.
  • the adhesive sheet 1 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board.
  • the pressure-sensitive adhesive layer 10 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done.
  • the peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 10 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 10a.
  • the adhesive surface 10b exposed by peeling off the peeling liner R2 is bonded to a substrate constituting a transfer substrate, a carrier substrate, or the like.
  • FIG. 2 is a schematic cross-sectional view showing another embodiment of the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention, where 2 is a pressure-sensitive adhesive sheet, 20 and 21 are pressure-sensitive adhesive layers, and R1 and R2 are peeling liners.
  • the pressure-sensitive adhesive sheet 2 has a laminated structure in which a peeling liner R1, a pressure-sensitive adhesive layer 20, a pressure-sensitive adhesive layer 21, and a peeling liner R2 are laminated in this order.
  • the adhesive sheet 2 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board.
  • the pressure-sensitive adhesive layer 20 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done.
  • the pressure-sensitive adhesive layer 21 can adjust the shock absorption when receiving electronic components together with the pressure-sensitive adhesive layer 20.
  • the pressure-sensitive adhesive layer 21 may be composed of the pressure-sensitive adhesive layer of the present invention, or may be composed of a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention.
  • the peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 20 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 20a.
  • the adhesive surface 21b exposed by peeling off the peeling liner R2 is bonded to a substrate constituting a transfer substrate, a carrier substrate, or the like.
  • FIG. 3 is a schematic cross-sectional view showing another embodiment of the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention, in which 3 is a pressure-sensitive adhesive sheet, 30 is a pressure-sensitive adhesive layer, S1 is a base material, and R1 is a peeling liner. ..
  • the pressure-sensitive adhesive sheet 3 has a laminated structure in which the peeling liner R1, the pressure-sensitive adhesive layer 30, and the base material S1 are laminated in this order.
  • the adhesive sheet 3 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board.
  • the pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done.
  • the base material S1 improves stability and handleability when receiving electronic components.
  • the peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 30 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 30a.
  • FIG. 4 is a schematic cross-sectional view showing another embodiment of the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention. Indicates a peeling liner.
  • the pressure-sensitive adhesive sheet 4 has a laminated structure in which a peeling liner R1, a pressure-sensitive adhesive layer 40, a base material S1, a pressure-sensitive adhesive layer 41, and a peeling liner R2 are laminated in this order.
  • the adhesive sheet 4 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board.
  • the pressure-sensitive adhesive layer 40 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done.
  • the base material S1 improves stability and handleability when receiving electronic components.
  • the pressure-sensitive adhesive layer 41 in the pressure-sensitive adhesive sheet 4, the pressure-sensitive adhesive layer 41, together with the pressure-sensitive adhesive layer 40, can adjust the impact absorption when receiving electronic components.
  • the pressure-sensitive adhesive layer 41 may be composed of the pressure-sensitive adhesive layer of the present invention, or may be composed of a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention.
  • the peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 40 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 40a.
  • the adhesive surface 41b exposed by peeling off the peeling liner R2 is attached to a substrate constituting a transfer substrate, a carrier substrate, or the like.
  • the pressure-sensitive adhesive layer of the present invention has a displacement R of water contact angles ⁇ 1 and ⁇ 2 with respect to the pressure-sensitive adhesive surface under the following conditions T 1 and T 2 of 5 ° or less.
  • T 1 and T 2 Immediately after peeling off the peeling liner in a T 1 : 23 ° C environment
  • T 2 After peeling off the peeling liner in a 23 ° C environment and exposing the adhesive surface to an atmospheric environment for 2 hours
  • ⁇ 1 The above in T 1 Water contact angle of adhesive surface (°) ⁇ 2 : Water contact angle (°) of the adhesive surface at T 2 .
  • Displacement R (°) ⁇ 2 - ⁇ 1
  • the configuration in which the displacement R is 5 ° or less makes it difficult for the wettability of the pressure-sensitive adhesive surface to change over time even when the peeling liner is exposed to the atmospheric environment after peeling, and the electrons It is preferable in that it can prevent misalignment and dropout when transporting parts.
  • the displacement R is preferably 4.5 ° or less, more preferably 4 ° or less, still more preferably 3.5 ° or less, and 3 ° in terms of preventing misalignment and falling off when transporting electronic components. Below, it may be 2.5 ° or less, 2 ° or less, or 1.5 ° or less.
  • the lower limit of the displacement R is not particularly limited, but when the wettability of the adhesive surface increases when the adhesive surface is exposed to the atmospheric environment, the transferability of the electronic component to another carrier substrate or mounting substrate becomes high. May decrease. From the viewpoint of transferability of electronic components, the displacement R is preferably ⁇ 5 ° or higher, more preferably -4 ° or higher, and even more preferably -3 ° or higher.
  • the water contact angle ⁇ 1 is preferably 120 ° or less, more preferably 118 ° or less, in that it can prevent misalignment and falling off when transporting electronic components. Further, the water contact angle ⁇ 1 is preferably 110 ° or more, more preferably 111 ° or more, from the viewpoint of transferability of electronic components.
  • the water contact angle and its displacement R are specifically measured by the method described in the examples below.
  • the water contact angle and the displacement R are the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer of the present invention, the type and amount of the cross-linking agent, and the pressure-sensitive adhesive layer. It can be adjusted according to the thickness and the like.
  • the ratio of the sinking depth of the pressure-sensitive adhesive layer to the thickness of the pressure-sensitive adhesive layer (subduction depth / thickness ⁇ 100) by the iron ball drop test under the following conditions with respect to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the present invention is determined. It is preferably 15% or more.
  • Iron ball drop test 1 g of iron ball is freely dropped from a height of 1 m onto the adhesive surface.
  • the configuration in which the ratio (sinking depth / thickness ⁇ 100) is 15% or more shows that the pressure-sensitive adhesive layer of the present invention exhibits excellent shock absorption, and is damaged or damaged when receiving an electronic component. It is preferable in that it can prevent problems such as bouncing and misalignment or turning over.
  • the ratio is more preferably 17% or more, further preferably 20% or more, and particularly preferably 30% or more.
  • the ratio (sinking depth / thickness ⁇ 100) is preferably 95% or less, more preferably 90% or less.
  • the ratio (sinking depth / thickness ⁇ 100) in the iron ball drop test is the type and composition (monomer composition) and crosslinking of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer of the present invention. It can be adjusted according to the type and amount of the agent, the thickness of the adhesive layer, and the like.
  • the displacement R is adjusted to 5 ° or less, and the wettability of the adhesive surface is obtained even when the peeling liner is peeled off and then exposed to the air environment. Is preferable in that it does not easily change over time and can prevent misalignment and dropout when transporting electronic components.
  • the rate of change in the adhesive force during irradiation is more preferably 94% or less, further preferably 93% or less, and may be 90% or less.
  • the rate of change in the adhesive force during irradiation is preferably 1% or more, more preferably 5% or more.
  • the initial adhesive force F 0 of the adhesive layer of the present invention with respect to stainless steel on the adhesive surface is preferably 0.1 N / 20 mm or more at room temperature.
  • the configuration in which the initial adhesive force F 0 is 0.1 N / 20 mm or more is preferable in that it is possible to suppress misalignment and flipping due to bouncing of electronic components at the time of collision.
  • the initial adhesive force F 0 is more preferably 0.2 N / 20 mm or more, and may be 0.3 N / 20 mm or more in terms of suppressing misalignment and turning over of the electronic component.
  • the upper limit of the initial adhesive force F 0 is not particularly limited, but is preferably 7.5 N / 20 mm or less, more preferably 7 N / 20 mm, from the viewpoint of transferability of the received electronic component to another carrier substrate or mounting substrate. Below, it is more preferably 6.5 N / 20 mm or less.
  • the initial adhesive strength is the adhesive strength before irradiation.
  • the adhesive force F 1 of the pressure-sensitive adhesive layer of the present invention to stainless steel after irradiation of the pressure-sensitive adhesive layer is preferably 0.01 N / 20 mm or more at room temperature.
  • the configuration in which the adhesive force F 1 after irradiation is 0.01 N / 20 mm or more is preferable in that it suppresses and retains the misalignment of the received electronic component when it is transported to the next step or the like, and after the irradiation.
  • the adhesive strength F 1 is more preferably 0.03 N / 20 mm or more, and further preferably 0.05 N / 20 mm or more.
  • the adhesive force F 1 after irradiation is preferably 2N / 20 mm or less, more preferably 1.5N / 20 mm or less, from the viewpoint of transferability of the received electronic component to another carrier substrate or mounting substrate.
  • the radiation irradiation means irradiation of ultraviolet rays (specific wavelength: 365 nm, integrated light amount: 460 mJ / cm 2 ) of a high-pressure mercury lamp.
  • the initial adhesive force F 0 , the adhesive force F 1 after irradiation, and the rate of change thereof can be measured by, for example, the adhesive force measurement described in Examples described later, and the adhesive layer of the present invention can be measured. It can be adjusted according to the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the above, the type and amount of the cross-linking agent, the thickness of the pressure-sensitive adhesive layer, the type and amount of the photopolymerization initiator, and the like. can.
  • the thickness of the pressure-sensitive adhesive layer of the present invention is preferably 1 ⁇ m or more and 500 ⁇ m or less.
  • the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 1 ⁇ m or more is preferable from the viewpoint of preventing the pressure-sensitive adhesive layer from being lost.
  • the thickness of the pressure-sensitive adhesive layer of the present invention is preferably 5 ⁇ m or more, and may be 10 ⁇ m or more, 20 ⁇ m or more, or 30 ⁇ m or more.
  • the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 500 ⁇ m or less is preferable from the viewpoint of transferability when transferring to another carrier substrate or mounting substrate of an electronic component, and may be 400 ⁇ m or less or 300 ⁇ m or less. ..
  • the thickness of the pressure-sensitive adhesive layer is the thickness of the entire laminated structure.
  • the thickness of the pressure-sensitive adhesive layer of the present invention that does not include another pressure-sensitive adhesive layer is preferably 1 ⁇ m or more and 50 ⁇ m or less.
  • the structure in which the thickness of the pressure-sensitive adhesive layer of the present invention is 1 ⁇ m or more is preferable from the viewpoint of suppressing changes in the wettability of the pressure-sensitive adhesive surface, preferably 2 ⁇ m or more, and more preferably 5 ⁇ m or more.
  • the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 50 ⁇ m or less is preferable from the viewpoint of transferability when transferring to another carrier substrate or mounting substrate of an electronic component, and even if it is 40 ⁇ m or less or 30 ⁇ m or less. good.
  • the initial probe tack value of the pressure-sensitive adhesive layer of the present invention at room temperature is preferably 5 N / cm 2 or more and 42 N / cm 2 or less.
  • the configuration in which the initial probe tack value is 5 N / cm 2 or more can sufficiently absorb the impact caused by the collision with the adhesive layer of the electronic component, and can suppress the displacement and inside out due to the bouncing of the electronic component at the time of collision. Is preferable.
  • the initial probe tack value is preferably 8 N / cm 2 or more, and may be 10 N / cm 2 or more, or 12 N / cm 2 or more, from the viewpoint of suppressing misalignment and turning over of electronic components.
  • the configuration in which the probe tack value is 42 N / cm 2 or less is preferable from the viewpoint of preventing the adhesive from sticking to the received electronic component and the adhesive residue, and is 40 N / cm 2 or less or 35 N / cm 2 or less. There may be.
  • the initial probe tack value is the probe tack value of the adhesive surface immediately after the peeling liner is peeled off.
  • the rate of change of the probe tack value after exposing the adhesive surface of the pressure-sensitive adhesive layer of the present invention to the initial probe tack value for 2 hours in an air environment is preferably more than -14%.
  • the configuration in which the rate of change of the probe tack value exceeds -14% is preferable in that it is possible to suppress the dropping and misalignment of electronic components during transportation.
  • the rate of change of the probe tack value is preferably ⁇ 10% or more, more preferably ⁇ 8% or more, in that the dropping or misalignment of the electronic component can be suppressed.
  • the upper limit of the rate of change of the probe tack value is not particularly limited, but is preferably 10% or less, preferably 5%, from the viewpoint of transferability when transferring the received electronic component to another carrier substrate or mounting substrate.
  • the probe tack value after exposure to 2 hours in an air environment is the probe tack value of the adhesive surface after peeling off the peeling liner and then exposing to 2 hours in an air environment.
  • the rate of change of the probe tack value is obtained by the following formula.
  • P 0 Initial probe tack value
  • P 1 Probe tack value after exposure for 2 hours in the atmospheric environment
  • Change rate of probe tack value (P 1 -P 0 ) / P 0 ⁇ 100
  • the initial probe tack value, the probe tack value after exposure to the air environment for 2 hours, and the rate of change thereof can be specifically measured by the method described in Examples described later, and the present invention can be used. It can be adjusted by the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer, the type and amount of the cross-linking agent, the thickness of the pressure-sensitive adhesive layer, and the like.
  • thermomechanical analysis TMA
  • Probe diameter 1.0 mm
  • Mode Needle insertion mode
  • Pushing load 0.05N
  • Pushing load time 20 minutes
  • the optical time scale correlates with the frequency at which the laser beam is swept, and is, for example, 100 kHz.
  • the physical properties of the pressure-sensitive adhesive in the frequency range of 100 kHz correspond to the physical characteristics of the pressure-sensitive adhesive in the low temperature region of -40 ° C according to the temperature-time conversion rule. It means that the relaxation characteristics are excellent.
  • TMA thermomechanical analysis
  • the above ratio (sinking depth / thickness ⁇ 100) when a load is applied to the pressure-sensitive adhesive layer at ⁇ 40 ° C. can be used as an index of impact mitigation characteristics.
  • thermomechanical analysis (TMA) at -40 ° C is 10% or more is due to collision of electronic parts even if the adhesive layer is thinned. It is preferable in that it can sufficiently absorb impact and can receive electronic components without damage or misalignment. From the viewpoint of sufficiently absorbing the impact caused by the collision of electronic parts, the ratio is preferably 15% or more, 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, or. It may be 80% or more. From the viewpoint of transferability of the received electronic component to another carrier substrate or mounting substrate, the above ratio is preferably 95% or less, and may be 90% or less.
  • the above ratio (sinking depth / thickness ⁇ 100) is the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer of the present invention and the type and amount of the cross-linking agent. , It can be adjusted by the thickness of the adhesive layer and the like.
  • the transfer of electronic components is completed on an optical time scale, so the impact mitigation characteristics of the pressure-sensitive adhesive on this time scale are important.
  • the optical time scale correlates with the frequency at which the laser beam is swept, and is, for example, 100 kHz. When converted to a time scale, it is about 10 microseconds, and the adhesive needs to be deformed in response to an impact on this time scale.
  • the common logarithm (Log 10 G') of the storage elastic modulus (Pa) at a frequency of 100 kHz and 25 ° C. of the pressure-sensitive adhesive layer of the present invention is preferably 7.5 or less.
  • the configuration in which the common logarithm of the storage elastic modulus is 7.5 or less can sufficiently absorb the impact caused by the collision with the pressure-sensitive adhesive layer of the electronic component, and causes the electronic component to be displaced or turned inside out due to the bounce at the time of collision. It is preferable in that it can be suppressed.
  • the common logarithm of the storage elastic modulus is preferably 7.4 or less, even if it is 7.3 or less, 7.2 or less, 7.1 or less, or 7 or less. good.
  • the common logarithm of the storage elastic modulus is preferably 4 or more, and may be 5 or more.
  • the loss coefficient (tan ⁇ ) of the pressure-sensitive adhesive layer of the present invention at a frequency of 100 kHz and 25 ° C. is preferably 0.8 or more.
  • the pressure-sensitive adhesive layer exhibits excellent damping property on an optical time scale, and can sufficiently absorb the impact due to collision with the pressure-sensitive adhesive layer such as an electronic component. It is preferable in that it can suppress misalignment and flipping due to bouncing of electronic parts at the time of collision.
  • the loss coefficient is preferably 0.95 or more, and may be 1.2 or more.
  • the loss coefficient is preferably 2.8 or less, and may be 2.3 or less.
  • the common logarithm (Log 10 G') of the storage elastic modulus (Pa) at a frequency of 1 Hz and ⁇ 40 ° C. of the pressure-sensitive adhesive layer of the present invention is preferably 8.5 or less.
  • the configuration in which the common logarithm of the storage elastic modulus is 8.5 or less can sufficiently absorb the impact caused by the collision with the adhesive layer of the electronic component, and causes the electronic component to be displaced or turned inside out due to the bounce at the time of collision.
  • the common logarithm of the storage elastic modulus is preferably 8.4 or less, even if it is 8.3 or less, 8.2 or less, 8.1 or less, or 8 or less. good.
  • the common logarithm of the storage elastic modulus is preferably 4 or more, and may be 5 or more.
  • the loss coefficient (tan ⁇ ) of the pressure-sensitive adhesive layer of the present invention at a frequency of 1 Hz and ⁇ 40 ° C. is preferably 0.1 or more.
  • the configuration in which the loss coefficient is 0.1 or more shows that the pressure-sensitive adhesive layer exhibits excellent damping properties at low temperatures, can sufficiently absorb the impact due to collision with the pressure-sensitive adhesive layer such as electronic components, and can sufficiently absorb electrons at the time of collision. It is preferable in that it can suppress misalignment and turning over due to the bouncing of parts.
  • the loss coefficient is preferably 0.2 or more, and may be 0.3 or more, 0.4 or more, or 0.5 or more.
  • the loss coefficient is preferably 2.2 or less, and may be 1.7 or less.
  • the common logarithm and loss coefficient of the storage elastic modulus can be measured by, for example, dynamic viscoelasticity measurement, and the resin composition constituting the pressure-sensitive adhesive layer of the present invention (the resin composition of the present invention). It can be adjusted according to the type and composition (monomer composition) and the type and amount of the cross-linking agent.
  • the resin composition (adhesive composition) constituting the pressure-sensitive adhesive layer of the present invention is not particularly limited, and for example, an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and the like. Examples thereof include polyester-based adhesives, polyamide-based adhesives, urethane-based adhesives, fluorine-based adhesives, and epoxy-based adhesives.
  • an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive are preferable, and among them, the desired various physical properties of the pressure-sensitive adhesive layer of the present invention, particularly the displacement R is adjusted to 5 ° or less.
  • Acrylic adhesives are preferable from the viewpoints of ease of design, transparency, adhesiveness, cost, and the like. That is, the pressure-sensitive adhesive layer of the present invention is preferably an acrylic pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive composition.
  • the above-mentioned pressure-sensitive adhesive can be used alone or in combination of two or more.
  • the acrylic pressure-sensitive adhesive composition contains an acrylic polymer as a base polymer.
  • the acrylic polymer is a polymer containing an acrylic monomer (a monomer having a (meth) acryloyl group in the molecule) as a monomer component constituting the polymer.
  • the acrylic polymer is preferably a polymer containing a (meth) acrylic acid alkyl ester as a monomer component constituting the polymer.
  • the acrylic polymer can be used alone or in combination of two or more.
  • the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer of the present invention may be in any form.
  • the pressure-sensitive adhesive composition may be an emulsion type, a solvent type (solution type), an active energy ray curing type, a heat melting type (hot melt type), or the like.
  • a solvent-type or active energy ray-curable pressure-sensitive adhesive composition is preferable because it is easy to obtain a pressure-sensitive adhesive layer having excellent productivity, optical properties and appearance.
  • a solvent-type pressure-sensitive adhesive composition is preferable from the viewpoint of absorbing the impact caused by the collision of the electronic components and suppressing the displacement and turning over of the electronic components.
  • the pressure-sensitive adhesive layer of the present invention is an acrylic-based pressure-sensitive adhesive layer containing an acrylic-based polymer as a base polymer, and is preferably formed by a solvent-type acrylic pressure-sensitive adhesive composition.
  • the active energy rays include ionizing radiation such as ⁇ rays, ⁇ rays, ⁇ rays, neutron rays, and electron beams, ultraviolet rays, and the like, and ultraviolet rays are particularly preferable. That is, the active energy ray-curable pressure-sensitive adhesive composition is preferably an ultraviolet-curable pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive composition (acrylic pressure-sensitive adhesive composition) for forming the acrylic pressure-sensitive adhesive layer is, for example, an acrylic pressure-sensitive adhesive composition containing an acrylic-based polymer as an essential component, or a simple material constituting the acrylic-based polymer.
  • examples thereof include a mixture of weights (monomers) (sometimes referred to as a "monomer mixture") or an acrylic pressure-sensitive adhesive composition containing a partial polymer thereof as an essential component.
  • the former include so-called solvent-type acrylic pressure-sensitive adhesive compositions.
  • Examples of the latter include so-called active energy ray-curable acrylic pressure-sensitive adhesive compositions.
  • the above-mentioned "monomer mixture” means a mixture containing a monomer component constituting a polymer.
  • the above-mentioned "partial polymer” may also be referred to as a "prepolymer", and means a composition in which one or more of the monomer components in the monomer mixture are partially polymerized. do.
  • the acrylic polymer is a polymer composed (formed) of an acrylic monomer as an essential monomer component (monomer component).
  • the acrylic polymer is preferably a polymer composed (formed) of a (meth) acrylic acid alkyl ester as an essential monomer component. That is, the acrylic polymer preferably contains (meth) acrylic acid alkyl ester as a constituent unit.
  • (meth) acrylic refers to "acrylic” and / or "methacrylic” (either or both of "acrylic” and “methacrylic"), and so on.
  • the acrylic polymer is composed of one kind or two or more kinds of monomer components.
  • (meth) acrylic acid alkyl ester as an essential monomer component, a (meth) acrylic acid alkyl ester having a linear or branched-chain alkyl group is preferably mentioned.
  • the (meth) acrylic acid alkyl ester can be used alone or in combination of two or more.
  • the (meth) acrylic acid alkyl ester having a linear or branched alkyl group is not particularly limited, and for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, (.
  • the (meth) acrylic acid alkyl ester having a linear or branched alkyl group is preferably a (meth) acrylic acid alkyl ester having a linear or branched alkyl group having 4 to 18 carbon atoms. , More preferably 2-ethylhexyl acrylate (2EHA), n-butyl acrylate (BA), lauryl acrylate (LA), lauryl methacrylate (LMA). Further, the (meth) acrylic acid alkyl ester having a linear or branched alkyl group can be used alone or in combination of two or more.
  • EHA 2-ethylhexyl acrylate
  • BA n-butyl acrylate
  • LA lauryl acrylate
  • LMA lauryl methacrylate
  • the (meth) acrylic acid alkyl ester having a linear or branched alkyl group can be used alone or in combination of two or more.
  • the ratio of the (meth) acrylic acid alkyl ester in all the monomer components (100% by weight) constituting the acrylic polymer is not particularly limited, but it absorbs the impact caused by the collision of the electronic component and the position of the electronic component shifts. It is preferably 80% by weight or more from the viewpoint of controlling the above-mentioned characteristics (particularly, impact collection property) from the viewpoint of suppressing the flipping and turning over, and the viewpoint of suppressing the dropping and misalignment of electronic components during transportation. It may be 85% by weight or more, or 90% by weight or more.
  • the upper limit of the ratio of the (meth) acrylic acid alkyl ester is also not particularly limited, but may be 99% by weight or less, or 98% by weight or less.
  • the acrylic polymer may contain a copolymerizable monomer together with the (meth) acrylic acid alkyl ester as a monomer component constituting the polymer. That is, the acrylic polymer may contain a copolymerizable monomer as a constituent unit.
  • the copolymerizable monomer may be used alone or in combination of two or more.
  • the copolymerizable monomer is not particularly limited, but is a reaction point with a cross-linking agent described later, an isocyanate compound having an ultraviolet polymerizable carbon-carbon double bond and an isocyanate group as a second functional group, and the like.
  • a monomer having a hydroxyl group in the molecule and a monomer having a carboxyl group in the molecule are preferably mentioned. That is, the acrylic polymer preferably contains a monomer having a hydroxyl group in the molecule as a constituent unit. Further, the acrylic polymer preferably contains a monomer having a carboxyl group in the molecule as a constituent unit.
  • the monomer having a hydroxyl group in the molecule is a monomer having at least one hydroxyl group (hydroxyl group) in the molecule (inside one molecule), and is a polymerization having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group. Those having a sex functional group and having a hydroxyl group are preferably mentioned.
  • the above-mentioned "monomer having a hydroxyl group in the molecule” may be referred to as "hydroxyl group-containing monomer".
  • the hydroxyl group-containing monomer can be used alone or in combination of two or more.
  • hydroxyl group-containing monomer examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and (. Contains hydroxyl groups such as 6-hydroxyhexyl acrylate, (meth) hydroxyoctyl acrylate, (meth) hydroxydecyl acrylate, (meth) hydroxylauryl acrylate, (meth) acrylate (4-hydroxymethylcyclohexyl). Meta) Acrylic acid ester; Vinyl alcohol; Allyl alcohol and the like can be mentioned.
  • hydroxyl group-containing monomer a hydroxyl group-containing (meth) acrylic acid ester is preferable, and 2-hydroxyethyl acrylate (HEA) and 4-hydroxybutyl acrylate (4HBA) are more preferable.
  • the proportion of the hydroxyl group-containing monomer in all the monomer components (100% by weight) constituting the acrylic polymer is particularly limited. Although it is not, it becomes a reaction point with a cross-linking agent described later or an isocyanate compound having both an ultraviolet polymerizable carbon-carbon double bond and an isocyanate group as a second functional group, and controls the degree of cross-linking and radiation curability. From the viewpoint of transparency, control of adhesive strength, etc., it is preferably 0.5% by weight or more, more preferably 0.8% by weight or more, and further preferably 1% by weight or more.
  • the upper limit of the proportion of the hydroxyl group-containing monomer is preferably 20% by weight or less, more preferably 18% by weight or less, and further preferably 15% by weight or less.
  • the monomer having a carboxyl group in the molecule is a monomer having at least one carboxyl group in the molecule (inside one molecule), and is polymerizable with an unsaturated double bond such as a (meth) acryloyl group or a vinyl group. Those having a functional group and a carboxyl group are preferably mentioned.
  • the above-mentioned "monomer having a carboxyl group in the molecule” may be referred to as "monomer containing a carboxyl group”.
  • the carboxyl group-containing monomer may be used alone or in combination of two or more.
  • carboxyl group-containing monomer examples include (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid. Further, the carboxyl group-containing monomer shall also include, for example, an acid anhydride group-containing monomer such as maleic anhydride and itaconic anhydride.
  • (meth) acrylic acid is preferable, and acrylic acid (AA) is more preferable.
  • the acrylic polymer contains the carboxyl group-containing monomer as a monomer component constituting the polymer
  • the ratio of the carboxyl group-containing monomer to all the monomer components (100% by weight) constituting the acrylic polymer is determined.
  • it serves as a reaction point with a cross-linking agent described later or an isocyanate compound having both an ultraviolet polymerizable carbon-carbon double bond and an isocyanate group as a second functional group, and controls the degree of cross-linking and radiation curability. It is preferably 0.5% by weight or more, more preferably 0.8% by weight or more, still more preferably 1% by weight or more, from the viewpoints of squeezing, transparency, control of adhesive force and the like.
  • the upper limit of the proportion of the carboxyl group-containing monomer is preferably 20% by weight or less, more preferably 18% by weight or less, and further preferably 15% by weight or less.
  • the total ratio of the hydroxyl group-containing monomer and the carboxyl group-containing monomer to the total monomer components (100% by weight) constituting the acrylic polymer is not particularly limited, but is not particularly limited, but the cross-linking agent and ultraviolet-polymerizable carbon-carbon described later are not particularly limited. It is preferably 1% by weight or more from the viewpoint of a reaction point with an isocyanate compound having both a double bond and an isocyanate group as a second functional group, transparency, control of adhesive strength, and the like. It is preferably 3% by weight or more.
  • the upper limit of the total of the above ratios is preferably 20% by weight or less, more preferably 15% by weight, from the viewpoint of obtaining a pressure-sensitive adhesive layer having appropriate flexibility and obtaining a pressure-sensitive adhesive layer having excellent transparency. % Or less.
  • examples of the copolymerizable monomer include a polyfunctional monomer.
  • examples of the polyfunctional monomer include hexanediol di (meth) acrylate, butanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl.
  • Glycoldi (meth) acrylate pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropanetri (meth) acrylate, tetramethylol methanetri (meth) acrylate, Examples thereof include allyl (meth) acrylate, vinyl (meth) acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, and urethane acrylate.
  • the polyfunctional monomer may be used alone or in combination of two or more.
  • the ratio of the polyfunctional monomer to the total monomer component (100% by weight) constituting the acrylic polymer is determined.
  • 0.5% by weight or less for example, more than 0% by weight and 0.5% by weight or less
  • more preferably 0.2% by weight or less for example, more than 0% by weight and 0% by weight. 2% by weight or less).
  • the above acrylic polymer is a monomer unit derived from one or more other monomers copolymerizable with (meth) acrylic acid ester, for example, from the viewpoint of modifying its cohesive force and heat resistance. It may be included.
  • Other copolymerizable monomers for forming the monomer unit of the acrylic polymer include, for example, a nitrogen-containing monomer, an alicyclic structure-containing monomer, an epoxy group-containing monomer, a sulfonic acid group-containing monomer, and a phosphoric acid group-containing monomer.
  • Examples of the nitrogen-containing monomer include acryloylmorpholine, acrylamide, N-vinylpyrrolidone, and acrylonitrile.
  • Examples of the alicyclic structure-containing monomer include cyclopropyl (meth) acrylate, cyclobutyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cycloheptyl (meth) acrylate, cyclooctyl (meth) acrylate, and isobornyl. Examples thereof include (meth) acrylate and dicyclopentanyl (meth) acrylate.
  • Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate.
  • sulfonic acid group-containing monomer examples include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, and (meth) acryloyloxynaphthalene sulfonic acid.
  • phosphoric acid group-containing monomer examples include 2-hydroxyethylacryloyl phosphate.
  • the acrylic polymer may contain, as a monomer component constituting the polymer, a monomer having a low glass transition temperature (Tg) when a homopolymer is formed (hereinafter, may be referred to as “low Tg monomer”). It is preferably contained.
  • Tg monomer a monomer having a low glass transition temperature (Tg) when a homopolymer is formed
  • the pressure-sensitive adhesive containing the acrylic polymer becomes soft, and the above-mentioned properties (particularly, shock absorption) of the pressure-sensitive adhesive layer of the present invention are controlled, due to collision of electronic components. It is preferable from the viewpoint of absorbing an impact and suppressing the misalignment and turning over of the electronic component, and from the viewpoint of suppressing the dropping and misalignment of the electronic component during transportation.
  • the glass transition temperature when the homopolymer of the low Tg monomer is formed is not particularly limited, but is, for example, 0 ° C. or lower, preferably ⁇ 10 ° C. or lower, and more preferably ⁇ 25 ° C. or lower.
  • the Tg of the low Tg monomer is in the above range, the impact absorption of the pressure-sensitive adhesive layer is improved.
  • the low Tg monomer may be the above-mentioned monomer exemplified as the monomer contained in the monomer component constituting the acrylic polymer, or may be another monomer.
  • the monomer component constituting the acrylic polymer is preferably the monomer exemplified as the monomer component constituting the acrylic polymer described above, and preferably contains a monomer component which is a low Tg monomer.
  • the low Tg monomer may be only one kind or two or more kinds.
  • the low Tg monomer is not particularly limited, and is, for example, 2-ethylhexyl acrylate (EHA, homopolymer Tg: -70 ° C), butyl acrylate (BA, homopolymer Tg: -55 ° C), and methacrylic acid.
  • EHA 2-ethylhexyl acrylate
  • BA butyl acrylate
  • methacrylic acid Lauryl (LMA, homopolymer Tg: -65 ° C), lauryl acrylate (LA, homopolymer Tg: -23 ° C), isononyl acrylate (iNAA, homopolymer Tg: -58 ° C) and the like can be mentioned.
  • 2-Ethylhexyl acrylate, butyl acrylate, and lauryl methacrylate are preferred.
  • the proportion of the low Tg monomer in the total monomer component (100% by weight) constituting the acrylic polymer is particularly limited. However, it is preferably 80% by weight or more, and may be 85% by weight or more, or 90% by weight or more.
  • the upper limit of the proportion of the low Tg monomer is also not particularly limited, but may be 99% by weight or less, or 98% by weight or less.
  • the above-mentioned "ratio of low Tg monomers" is the total of the proportions of the above two or more kinds of low Tg monomers.
  • the content of the base polymer (particularly acrylic polymer) in the pressure-sensitive adhesive layer of the present invention is not particularly limited, but is 50% by weight or more (for example, 50) with respect to 100% by weight of the total weight of the pressure-sensitive adhesive layer of the present invention. ⁇ 100% by weight), more preferably 80% by weight or more (for example, 80 to 100% by weight), still more preferably 90% by weight or more (for example, 90 to 100% by weight).
  • the base polymer such as the acrylic polymer contained in the pressure-sensitive adhesive composition of the present invention can be obtained by polymerizing a monomer component.
  • the polymerization method is not particularly limited, and examples thereof include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, and a polymerization method by irradiation with active energy rays (active energy ray polymerization method).
  • active energy ray polymerization method active energy ray polymerization method
  • the solution polymerization method and the active energy ray polymerization method are preferable, and the solution polymerization method is more preferable, from the viewpoints of transparency and cost of the pressure-sensitive adhesive layer.
  • various general solvents may be used for the polymerization of the above-mentioned monomer components.
  • the solvent include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane, methylcyclohexane and the like. Hydrocarbons of the above; organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone can be mentioned.
  • the solvent can be used alone or in combination of two or more.
  • a polymerization initiator such as a thermal polymerization initiator or a photopolymerization initiator (photoinitiator) may be used depending on the type of the polymerization reaction.
  • the polymerization initiator may be used alone or in combination of two or more.
  • the thermal polymerization initiator is not particularly limited, but is, for example, an azo-based polymerization initiator, a peroxide-based polymerization initiator (for example, dibenzoyl peroxide, tert-butyl permalate, etc.), a redox-based polymerization initiator, and the like. Can be mentioned. Of these, peroxide-based polymerization initiators are preferable.
  • azo-based polymerization initiator examples include 2,2'-azobisisobutyronitrile (hereinafter, may be referred to as "AIBN”) and 2,2'-azobis-2-methylbutyronitrile (hereinafter, “" AMBN "), 2,2'-azobis (2-methylpropionic acid) dimethyl, 4,4'-azobis-4-cyanovalerian acid and the like.
  • AIBN 2,2'-azobisisobutyronitrile
  • AMBN 2,2'-azobis-2-methylbutyronitrile
  • 2,2'-azobis (2-methylpropionic acid) dimethyl 2,4'-azobis-4-cyanovalerian acid and the like.
  • the thermal polymerization initiator may be used alone or in combination of two or more.
  • the amount of the thermal polymerization initiator used is not particularly limited, but is preferably 0.05 parts by weight or more, more preferably 0, with respect to 100 parts by weight of all the monomer components constituting the acrylic polymer. It is preferably 1 part by weight or more, preferably 0.5 part by weight or less, and more preferably 0.3 part by weight or less.
  • the photopolymerization initiator is not particularly limited, and is, for example, a benzoin ether-based photopolymerization initiator, an acetophenone-based photopolymerization initiator, an ⁇ -ketol-based photopolymerization initiator, an aromatic sulfonyl chloride-based photopolymerization initiator, and light.
  • Examples thereof include an active oxime-based photopolymerization initiator, a benzoin-based photopolymerization initiator, a benzyl-based photopolymerization initiator, a benzophenone-based photopolymerization initiator, a ketal-based photopolymerization initiator, and a thioxanthone-based photopolymerization initiator.
  • an acylphosphine oxide-based photopolymerization initiator and a titanocene-based photopolymerization initiator can be mentioned.
  • benzoin ether-based photopolymerization initiator examples include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and the like. Anisole methyl ether and the like can be mentioned.
  • acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 4-phenoxydichloroacetophenone, and 4- (t-butyl).
  • Dichloroacetophenone and the like can be mentioned.
  • Examples of the ⁇ -ketol-based photopolymerization initiator include 2-methyl-2-hydroxypropiophenone, 1- [4- (2-hydroxyethyl) phenyl] -2-methylpropan-1-one, and the like. Be done.
  • Examples of the aromatic sulfonyl chloride-based photopolymerization initiator include 2-naphthalene sulfonyl chloride and the like.
  • Examples of the photoactive oxime-based photopolymerization initiator include 1-phenyl-1,1-propanedione-2- (O-ethoxycarbonyl) -oxime.
  • Examples of the benzoin-based photopolymerization initiator include benzoin and the like.
  • Examples of the benzyl-based photopolymerization initiator include benzyl and the like.
  • Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, ⁇ -hydroxycyclohexylphenylketone and the like.
  • Examples of the ketal-based photopolymerization initiator include benzyldimethyl ketal and the like.
  • Examples of the thioxanthone-based photopolymerization initiator include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, dodecylthioxanthone and the like.
  • Examples of the acylphosphine oxide-based photopolymerization initiator include 2,4,6-trimethylbenzoyl-diphenyl-phosphinoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphinoxide and the like. ..
  • titanium-based photopolymerization initiator examples include bis ( ⁇ 5-2,4 -cyclopentadiene-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole-1-yl) -phenyl. ) Titanium and the like can be mentioned.
  • the photopolymerization initiator may be used alone or in combination of two or more.
  • the amount of the photopolymerization initiator used is not particularly limited, but for example, with respect to 100 parts by weight of all the monomer components constituting the acrylic polymer.
  • the amount is preferably 0.01 parts by weight or more, more preferably 0.1 parts by weight or more, and more preferably 3 parts by weight or less, still more preferably 1.5 parts by weight or less.
  • the acrylic pressure-sensitive adhesive composition of the present invention preferably contains a cross-linking agent.
  • the reason why the wettability of the adhesive surface changes with time when the peeling liner is exposed to the air environment after peeling is that the peeling agent contained in the peeling layer formed on the surface of the peeling liner moves to the adhesive layer. It is considered that the release agent transferred to the pressure-sensitive adhesive layer bleeds out to the surface of the pressure-sensitive adhesive surface. Therefore, the acrylic polymer in the acrylic pressure-sensitive adhesive layer is crosslinked, the movement of the release agent transferred to the pressure-sensitive adhesive layer in the pressure-sensitive adhesive layer is suppressed, and the bleed-out of the release agent to the surface of the pressure-sensitive adhesive surface is suppressed.
  • the cross-linking agent can be used alone or in combination of two or more.
  • the cross-linking agent is not particularly limited, and is, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, a melamine-based cross-linking agent, a peroxide-based cross-linking agent, a urea-based cross-linking agent, a metal alkoxide-based cross-linking agent, and a metal chelate-based cross-linking agent.
  • examples thereof include agents, metal salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, and amine-based cross-linking agents.
  • isocyanate-based cross-linking agents and epoxy-based cross-linking agents are preferable, and isocyanate-based cross-linking agents are more preferable.
  • isocyanate-based cross-linking agent examples include lower aliphatic polyisocyanates such as 1,2-ethylenediisocyanate, 1,4-butylenediocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate.
  • Examples of the isocyanate-based cross-linking agent include a trimethylolpropane / tolylene diisocyanate adduct (trade name "Coronate L", manufactured by Nippon Polyurethane Industry Co., Ltd.) and a trimethylolpropane / hexamethylene diisocyanate adduct (trade name "”.
  • Commercial products such as "Coronate HL” (manufactured by Nippon Polyurethane Industry Co., Ltd.) and trimethylolpropane / xylylene diisocyanate adduct (trade name "Takenate D-110N", manufactured by Mitsui Chemicals Co., Ltd.) can also be mentioned.
  • epoxy-based cross-linking agent examples include N, N, N', N'-tetraglycidyl-m-xylene diamine, diglycidyl aniline, and 1,3-bis (N, N-diglycidyl).
  • the amount of the cross-linking agent used is not particularly limited, but from the viewpoint that the displacement R can be controlled to prevent the electronic parts from falling off or being displaced during transportation. It is preferably 1 part by weight or more, more preferably 1.5 parts by weight or more, and further preferably 2 parts by weight or more with respect to 100 parts by weight of the base polymer. Further, the upper limit of the amount used is preferably 10 parts by weight or less with respect to 100 parts by weight of the base polymer, more preferably, from the viewpoint of obtaining appropriate flexibility in the pressure-sensitive adhesive layer and improving the adhesive strength. Is 5 parts by weight or less.
  • the acrylic pressure-sensitive adhesive composition of the present invention is not particularly limited, but may contain a cross-linking accelerator.
  • the type of the cross-linking accelerator can be appropriately selected depending on the type of the cross-linking agent used.
  • the cross-linking accelerator refers to a catalyst that increases the rate of the cross-linking reaction by the cross-linking agent.
  • Examples of such a cross-linking accelerator include tin (Sn) -containing compounds such as dioctyl tin dilaurate, dibutyl tin dilaurate, dibutyl tin diacetate, dibutyl tin diacetylacetonate, tetra-n-butyl tin, and trimethyl tin hydroxide; Examples thereof include amines such as N', N'-tetramethylhexanediamine and triethylamine, and N-containing compounds such as imidazoles. Of these, Sn-containing compounds are preferable.
  • cross-linking accelerators are particularly effective when a hydroxyl group-containing monomer is used as the sub-monomer and an isocyanate-based cross-linking agent is used as the cross-linking agent.
  • the amount of the cross-linking accelerator contained in the pressure-sensitive adhesive composition is, for example, about 0.001 to 0.5 parts by mass (preferably about 0.001 to 0.1 parts by mass) with respect to 100 parts by mass of the acrylic polymer. ).
  • the pressure-sensitive adhesive layer of the present invention may be a pressure-sensitive adhesive layer (adhesive force-reducable type pressure-sensitive adhesive layer) capable of intentionally reducing the adhesive force by an action from the outside, or may be a pressure-sensitive adhesive layer by an action from the outside. May be a pressure-sensitive adhesive layer (adhesive strength non-reducing type pressure-sensitive adhesive layer) in which the adhesive strength is hardly reduced or not reduced at all, and can be appropriately selected depending on a method and conditions for mounting an electronic component.
  • the pressure-sensitive adhesive layer of the present invention is a pressure-reducable type pressure-sensitive adhesive layer
  • the state in which the pressure-sensitive adhesive layer of the present invention exhibits a relatively high adhesive force is utilized to apply the pressure-sensitive adhesive layer to the electronic component or the like. The impact caused by the collision can be sufficiently absorbed, and the position shift and turning over due to the bouncing of electronic components at the time of the collision can be suppressed.
  • the adhesive force of the adhesive layer of the present invention is reduced to improve the transferability (delivery property) and to the electronic component. It is possible to suppress the adhesive residue of.
  • the pressure-sensitive adhesive forming such a pressure-reducing type pressure-sensitive adhesive layer examples include a radiation-curable pressure-sensitive adhesive and a heat-foaming type pressure-sensitive adhesive, and the radiation-curable pressure-sensitive adhesive is preferable in terms of operability. That is, the pressure-sensitive adhesive layer of the present invention is preferably formed from a radiation-curable pressure-sensitive adhesive.
  • the pressure-sensitive adhesive forming the pressure-reducing adhesive layer one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesive may be used.
  • the radiation-curable pressure-sensitive adhesive for example, a type of pressure-sensitive adhesive that cures by irradiation with an electron beam, ultraviolet rays, ⁇ -rays, ⁇ -rays, ⁇ -rays, or X-rays can be used, and a type that cures by irradiation with ultraviolet rays can be used.
  • a pressure-sensitive adhesive (ultraviolet curable pressure-sensitive adhesive) can be particularly preferably used.
  • the radiation-curable pressure-sensitive adhesive includes, for example, a base polymer such as an acrylic polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond.
  • a base polymer such as an acrylic polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond.
  • examples include mold radiation curable adhesives.
  • the base polymer an acrylic polymer similar to the above can be used.
  • Examples of the radiation-polymerizable monomer component include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol monohydroxypenta ( Examples thereof include meta) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate.
  • the radiation-polymerizable oligomer component examples include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and those having a molecular weight of about 100 to 30,000 are preferable.
  • the content of the radiation-curable monomer component and the oligomer component in the radiation-curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer of the present invention is, for example, 5 to 500 parts by mass, preferably 5 to 500 parts by mass, based on 100 parts by mass of the base polymer. It is about 40 to 150 parts by mass.
  • the additive-type radiation-curable pressure-sensitive adhesive for example, those disclosed in Japanese Patent Application Laid-Open No. 60-196956 may be used.
  • the radiation-curable pressure-sensitive adhesive is an intrinsic radiation-curing agent containing a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer backbone or at the end of the polymer backbone in the polymer backbone.
  • a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer backbone or at the end of the polymer backbone in the polymer backbone.
  • Sexual pressure-sensitive adhesives can also be mentioned.
  • an intrinsically curable pressure-sensitive adhesive it tends to be possible to suppress an unintended change in adhesive properties over time due to the movement of low molecular weight components in the formed pressure-sensitive adhesive layer.
  • Acrylic polymer is preferable as the base polymer contained in the internal radiation curable pressure-sensitive adhesive.
  • a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer for example, a raw material monomer containing a monomer component having a first functional group is polymerized (copolymerized) to obtain an acrylic polymer. Later, a compound having a second functional group capable of reacting with the first functional group and a radiopolymerizable carbon-carbon double bond is added to an acrylic polymer while maintaining the radiopolymerizability of the carbon-carbon double bond. Examples thereof include a method of subjecting to a condensation reaction or an addition reaction.
  • Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, and a hydroxy group and an isocyanate group.
  • Examples thereof include an isocyanate group and a hydroxy group.
  • a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of easiness of reaction tracking.
  • the above-mentioned first functional group is used.
  • a combination in which the hydroxy group is used and the second functional group is an isocyanate group is preferable.
  • Compounds having an isocyanate group and a radiopolymerizable carbon-carbon double bond, that is, a radiopolymerizable unsaturated functional group-containing isocyanate compound include, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-.
  • Examples thereof include ⁇ and ⁇ -dimethylbenzyl isocyanate.
  • Examples of the acrylic polymer having a hydroxy group include those containing the above-mentioned hydroxy group-containing monomer and structural units derived from ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. Be done.
  • the content of the above-mentioned radiopolymerizable unsaturated functional group-containing isocyanate compound in the radiation-curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer of the present invention is The amount is, for example, about 5 to 100 parts by mass, preferably about 7 to 50 parts by mass with respect to 100 parts by mass of the base polymer.
  • the radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator.
  • the photopolymerization initiator include ⁇ -ketor compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, and thioxanthone compounds. Examples thereof include camphorquinone, halogenated ketone, acylphosphinoxide, acylphosphonate and the like.
  • the ⁇ -ketol compound include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, and 2-methyl-2-hydroxy.
  • Examples thereof include propiophenone, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-1- (4- (4- (2-hydroxy-2-methylpropionyl) benzyl) phenyl) -2-methylpropan-1-one and the like.
  • Examples of the acetophenone compound include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholino.
  • Propane-1 and the like can be mentioned.
  • Examples of the benzoin ether-based compound include benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether and the like.
  • Examples of the ketal-based compound include benzyldimethyl ketal and the like.
  • Examples of the aromatic sulfonyl chloride compound include 2-naphthalene sulfonyl chloride and the like.
  • Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime.
  • Examples of the benzophenone compound include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone and the like.
  • thioxanthone-based compound examples include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl.
  • examples thereof include thioxanthone.
  • the content of the photopolymerization initiator in the radiation-curable pressure-sensitive adhesive is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer.
  • the heat-foaming pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams or expands when heated.
  • foaming agent include various inorganic foaming agents and organic foaming agents.
  • the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, azides and the like.
  • organic foaming agent examples include salt fluoride alkanes such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarboxylicamide and barium azodicarboxylate; paratoluene.
  • Hydrazide compounds such as sulfonyl hydrazide, diphenylsulfone-3,3'-disulfonyl hydrazide, 4,4'-oxybis (benzenesulfonyl hydrazide), allylbis (sulfonyl hydrazide); p-toluylene sulfonyl semicarbazide, 4,4'- Semi-carbazide compounds such as oxybis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morphory-1,2,3,4-thiatriazole; N, N'-dinitrosopentamethylenetetramine, N, N'-dimethyl- Examples thereof include N-nitroso compounds such as N, N'-dinitrosoterephthalamide.
  • heat-expandable microspheres examples include microspheres having a structure in which a substance that easily gasifies and expands by heating is enclosed in a shell.
  • the substance that easily gasifies and expands by the above heating examples include isobutane, propane, and pentane.
  • a heat-expandable microsphere can be produced by encapsulating a substance that easily gasifies and expands by heating in a shell-forming substance by a core selvation method, an interfacial polymerization method, or the like.
  • the shell-forming substance a substance exhibiting thermal meltability or a substance that can explode due to the action of thermal expansion of the encapsulating substance can be used.
  • Examples of such substances include vinylidene chloride / acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethylmethacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.
  • Examples of the pressure-sensitive pressure-sensitive adhesive layer include a pressure-sensitive pressure-sensitive adhesive layer.
  • the pressure-sensitive pressure-sensitive adhesive layer has a form in which the pressure-sensitive adhesive layer formed from the above-mentioned radiation-curable pressure-sensitive adhesive is cured in advance by irradiation with respect to the pressure-reducing type pressure-sensitive adhesive layer and has a certain adhesive strength. Contains an adhesive layer.
  • the pressure-sensitive adhesive forming the non-reducing adhesive strength type pressure-sensitive adhesive layer one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesive may be used.
  • the entire pressure-sensitive adhesive layer of the present invention may be a non-reduced pressure-sensitive adhesive layer, or a part of the pressure-sensitive adhesive layer may be a non-reduced pressure-sensitive adhesive layer.
  • the entire pressure-sensitive adhesive layer of the present invention may be a non-reduced pressure-sensitive adhesive layer, or a specific site in the pressure-sensitive adhesive layer of the present invention. Is a non-reducing adhesive force type pressure-sensitive adhesive layer, and other portions may be a pressure-reducing type pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer of the present invention has a laminated structure
  • all the pressure-sensitive adhesive layers in the laminated structure may be non-reduced adhesive strength type pressure-sensitive adhesive layers, or some of the pressure-sensitive adhesive layers in the laminated structure may be. It may be a non-reducing adhesive strength type pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer (irradiated radiation-curable pressure-sensitive adhesive layer) in which the pressure-sensitive adhesive layer (non-irradiated radiation-curable pressure-sensitive adhesive layer) formed from the radiation-curable pressure-sensitive adhesive is previously cured by irradiation is radiation. Even if the adhesive strength is reduced by irradiation, the adhesive strength due to the contained polymer component is exhibited, and the adhesive strength required for the adhesive layer of the present invention can be exhibited at the minimum.
  • the entire pressure-sensitive adhesive layer of the present invention may be the radiation-irradiated radiation-curable pressure-sensitive adhesive layer in the surface spreading direction of the pressure-sensitive adhesive layer of the present invention.
  • a part of the pressure-sensitive adhesive layer of the present invention may be a radiation-irradiated radiation-curable pressure-sensitive adhesive layer, and the other part may be a radiation-curable pressure-sensitive adhesive layer that has not been irradiated.
  • the "radiation-curable pressure-sensitive adhesive layer” means a pressure-sensitive adhesive layer formed of a radiation-curable pressure-sensitive adhesive, and is a radiation-non-irradiation radiation-curable pressure-sensitive adhesive layer having radiation curability and the pressure-sensitive adhesive. Includes both a radiation-cured radiation-curable pressure-sensitive adhesive layer after the agent layer has been cured by radiation irradiation.
  • the pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer a known or conventional pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive using an acrylic polymer as a base polymer can be preferably used.
  • the pressure-sensitive adhesive layer of the present invention contains an acrylic polymer as a pressure-sensitive pressure-sensitive adhesive
  • the acrylic polymer is a polymer containing a structural unit derived from a (meth) acrylic acid ester as the structural unit having the largest mass ratio. It is preferable to have.
  • the acrylic polymer for example, the acrylic polymer described as the acrylic polymer that can be contained in the above-mentioned additive-type radiation-curable pressure-sensitive adhesive can be adopted.
  • the silicone-based pressure-sensitive adhesive is not particularly limited, and known or commonly used silicone-based pressure-sensitive adhesives can be used. Adhesives and the like can be used.
  • the silicone-based adhesive may be either a one-component type or a two-component type.
  • the silicone-based adhesive may be used alone or in combination of two or more.
  • the addition type silicone-based pressure-sensitive adhesive is an addition reaction of an organopolysiloxane having an alkenyl group such as a vinyl group on a silicon atom and an organopolysiloxane having a hydrosilyl group using a platinum compound catalyst such as platinum chloride acid. It is a pressure-sensitive adhesive that produces a silicone-based polymer by subjecting it to a hydrosilylation reaction.
  • the peroxide-curable silicone-based pressure-sensitive adhesive is generally a pressure-sensitive adhesive that cures (crosslinks) an organopolysiloxane with a peroxide to produce a silicone-based polymer.
  • the condensed silicone-based pressure-sensitive adhesive is generally a pressure-sensitive adhesive that produces a silicone-based polymer by dehydration or dealcoholization reaction between polyorganosiloxanes having a hydrolyzable silyl group such as a silanol group or an alkoxysilyl group at the terminal. ..
  • silicone-based adhesive it is easy to control low adhesiveness and low tackiness, and it is possible to suppress changes in the wettability of the adhesive surface over time and prevent the electronic parts from falling off or misaligning during transportation.
  • a silicone-based pressure-sensitive adhesive composition containing a silicone rubber and a silicone resin can be mentioned.
  • the silicone rubber is not particularly limited as long as it is a silicone-based rubber component, but for example, organopolysiloxane having dimethylsiloxane, methylphenylsiloxane, or the like as a main constituent unit can be used. Further, depending on the type of reaction, a silicone-based rubber having an alkenyl group bonded to a silicon atom (alkenyl group-containing organopolysiloxane; in the case of an addition reaction type) and a silicone-based rubber having at least a methyl group (peroxide curable type).
  • a silicone-based rubber having a silanol group or a hydrolyzable alkoxysilyl group at the terminal in the case of a condensation type or the like can be used.
  • the weight average molecular weight of the organopolysiloxane in the silicone rubber is usually 150,000 or more, preferably 280,000 to 1,000,000, and particularly preferably 500,000 to 900,000.
  • the silicone resin is not particularly limited as long as it is a silicone-based resin used for a silicone-based pressure-sensitive adhesive, and for example, an M unit composed of the constituent unit "R 3 Si 1/2 " and the constituent unit "SiO". It consists of a (co) polymer having at least one unit selected from the Q unit consisting of " 2 ", the T unit consisting of the constituent unit "RSiO 3/2 ", and the D unit consisting of the constituent unit "R 2 SiO". Examples thereof include silicone resins made of organopolysiloxane.
  • R in the said structural unit represents a hydrocarbon group or a hydroxyl group.
  • hydrocarbon group examples include an aliphatic hydrocarbon group (an alkyl group such as a methyl group and an ethyl group), an alicyclic hydrocarbon group (a cycloalkyl group such as a cyclohexyl group), and an aromatic hydrocarbon group (such as a cycloalkyl group such as a cyclohexyl group).
  • Eryl groups such as phenyl group and naphthyl group
  • Various functional groups such as a vinyl group may be introduced into the organopolysiloxane in such a silicone resin, if necessary.
  • the functional group to be introduced may be a functional group capable of causing a crosslinking reaction.
  • the silicone resin an MQ resin composed of M units and Q units is preferable.
  • the weight average molecular weight of the organopolysiloxane in the silicone resin is usually 1000 or more, preferably 1000 to 20000, and particularly preferably 1500 to 10000.
  • the blending ratio of the silicone rubber and the silicone resin is not particularly limited, but from the viewpoint of easy control of low adhesiveness and low tackiness, for example, 100 to 220 parts by weight of the silicone resin is 100 parts by weight of the silicone rubber. (In particular, it is preferably 120 to 180 parts by weight).
  • the silicone rubber and the silicone resin may be in a mixed state in which they are simply mixed, and react with each other to form a condensate (particularly a portion). It may be a condensate), a cross-linking reaction product, an addition reaction product, or the like.
  • peroxide-curable silicone-based adhesive for example, the product name "KR-100", the product name “KR-101-10”, and the product name “KR-130” (all manufactured by Shin-Etsu Chemical Co., Ltd.). Etc. are commercially available.
  • the silicone-based adhesive composition containing silicone rubber and silicone resin is easy to control with low adhesiveness and low tackiness, and suppresses changes in the wettability of the adhesive surface over time, so that the electronic parts being transported It is preferable to contain a cross-linking agent from the viewpoint of suppressing dropping and misalignment.
  • the reason why the wettability of the adhesive surface changes with time when the peeling liner is exposed to the air environment after peeling is that the peeling agent contained in the peeling layer formed on the surface of the peeling liner moves to the adhesive layer. It is considered that the release agent transferred to the pressure-sensitive adhesive layer bleeds out to the surface of the pressure-sensitive adhesive surface.
  • the silicone rubber and the silicone resin in the silicone-based pressure-sensitive adhesive layer are crosslinked to suppress the movement of the release agent transferred to the pressure-sensitive adhesive layer in the pressure-sensitive adhesive layer, and the release agent bleeds out to the surface of the pressure-sensitive adhesive surface. By suppressing it, it is considered that the change over time in the wettability of the adhesive surface can be suppressed. It should be noted that this is a guess and should not be construed as limiting the present invention.
  • the cross-linking agent is not particularly limited, but a siloxane-based cross-linking agent (silicone-based cross-linking agent) and a peroxide-based cross-linking agent can be preferably used. Of these, a siloxane-based cross-linking agent is preferable.
  • the cross-linking agent can be used alone or in combination of two or more.
  • polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms in the molecule can be preferably used.
  • various organic groups may be bonded to the silicon atom to which the hydrogen atom is bonded in addition to the hydrogen atom.
  • the organic group include an alkyl group such as a methyl group and an ethyl group; an aryl group such as a phenyl group, and an alkyl halide group, but a methyl group is preferable from the viewpoint of synthesis and handling.
  • the skeleton structure of the polyorganohydrogensiloxane may have any of linear, branched, and cyclic skeleton structures, but linear skeletons are preferable.
  • peroxide-based cross-linking agent for example, diacyl peroxide, alkyl peroxy ester, peroxy dicarbonate, monoperoxy carbonate, peroxyketal, dialkyl peroxide, hydroperoxide, ketone peroxide and the like can be used. .. More specifically, for example, benzoyl peroxide, t-butylperoxybenzoate, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5-di.
  • siloxane-based cross-linking agent for example, the product name "BY24-741", the product name “SE1700Catalyst” (above, manufactured by Dow Toray Co., Ltd.); the product name "X-92-122” (above, manufactured by Shin-Etsu Chemical Co., Ltd.). ) Is commercially available.
  • the amount of the cross-linking agent used is not particularly limited, but low adhesiveness and low tackiness are controlled to suppress dropping and misalignment of electronic parts during transportation. From the viewpoint of being able to do so, it is preferably 0.5 parts by weight or more, more preferably 0.7 parts by weight or more, and further preferably 1 part by weight or more with respect to 100 parts by weight of the base polymer. Further, the upper limit of the amount used is preferably 10 parts by weight or less with respect to 100 parts by weight of the base polymer, more preferably, from the viewpoint of obtaining appropriate flexibility in the pressure-sensitive adhesive layer and improving the adhesive strength. Is 5 parts by weight or less.
  • the additive silicone-based pressure-sensitive adhesive composition preferably contains a curing catalyst such as a platinum catalyst.
  • a curing catalyst such as a platinum catalyst.
  • platinum catalysts for example, trade names "CAT-PL-50T” (manufactured by Shin-Etsu Chemical Co., Ltd.), "DOWNSIL NC-25 Catalyst” or “DOWNSIL SRX212 Catalyst” (manufactured by Dow Toray Co., Ltd.) are commercially available. Has been done. From the viewpoint of the balance between the receivability of electronic parts of the adhesive layer, position accuracy, transferability to the mounting substrate, tack force, etc., the content of the curing catalyst is determined by the silicone polymer (silicone rubber, silicone resin, etc.) as the base polymer. (Including) 100 parts by weight, preferably about 0.1 to 10 parts by weight.
  • the resin composition of the present invention further comprises a tackifier resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an antiaging agent, a filler, a colorant (pigment, dye, etc.), if necessary.
  • a tackifier resin Rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.
  • an antiaging agent e.g., an antiaging agent
  • a filler e.g., a filler, a colorant (pigment, dye, etc.)
  • a colorant pigment, dye, etc.
  • Additives such as an ultraviolet absorber, an antioxidant, a chain transfer agent, a plasticizer, a softener, a surfactant, and an antioxidant may be contained within a range that does not impair the effects of the present invention. Such additives can be used alone or in combination of two or more.
  • the method for producing the pressure-sensitive adhesive layer (particularly, the acrylic pressure-sensitive adhesive layer) of the present invention is not particularly limited, but for example, the above-mentioned resin composition is applied (coated) on a base material or a peeling liner to obtain a pressure-sensitive adhesive.
  • the agent composition layer can be dried and cured, or the above resin composition can be applied (coated) on a base material or a peeling liner, and the obtained pressure-sensitive adhesive composition layer can be irradiated with active energy rays to be cured. Can be mentioned. Further, if necessary, it may be further heated and dried.
  • the active energy rays include ionizing radiation such as ⁇ rays, ⁇ rays, ⁇ rays, neutron rays, and electron beams, ultraviolet rays, and the like, and ultraviolet rays are particularly preferable. Further, the irradiation energy of the active energy ray, the irradiation time, the irradiation method, and the like are not particularly limited.
  • the above resin composition can be produced by a known or conventional method.
  • a solvent-type acrylic pressure-sensitive adhesive composition can be prepared by mixing an additive (for example, an ultraviolet absorber, etc.) with a solution containing the acrylic polymer, if necessary.
  • the active energy ray-curable acrylic pressure-sensitive adhesive composition is prepared by mixing an additive (for example, an ultraviolet absorber) with the mixture of the acrylic monomers or a partial polymer thereof, if necessary. Can be made.
  • a known coating method may be used for applying (coating) the above resin composition.
  • a coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, or a direct coater may be used.
  • the active energy ray-curable pressure-sensitive adhesive composition contains a photopolymerization initiator.
  • the active energy ray-curable pressure-sensitive adhesive composition contains an ultraviolet absorber
  • the photopolymerization initiator contains at least a photopolymerization initiator having absorption characteristics in a wide wavelength range.
  • the photopolymerization initiator having absorption characteristics even in visible light. This is because there is a concern that the action of the ultraviolet absorber may inhibit the curing by the active energy rays.
  • the pressure-sensitive adhesive composition has high photocurability. This is because it is easy to obtain.
  • the adhesive surface of the pressure-sensitive adhesive layer and / or another pressure-sensitive adhesive layer of the present invention is protected by a peeling liner until use.
  • each pressure-sensitive adhesive surface may be protected by two peeling liners, or a roll may be provided by one peeling liner having both sides as peeling surfaces. It may be protected in a form of being wound in a shape (winding body).
  • the peeling liner is used as a shock-absorbing and adhesive protective material for the adhesive layer, and is peeled off during use. Further, when the pressure-sensitive adhesive layer of the present invention constitutes a base material-less pressure-sensitive adhesive sheet, the peeling liner also serves as a support for the pressure-sensitive adhesive layer.
  • a conventional release paper or the like can be used, and the present invention is not particularly limited, and examples thereof include a base material having a release layer.
  • the base material having the release layer include plastic films and paper surface-treated with a release agent such as silicone-based, long-chain alkyl-based, and fluorine-based.
  • silicone-based release agent examples include known silicone-based release agents such as addition reaction type, condensation reaction type, cationic polymerization type, and radical polymerization type.
  • Products commercially available as addition reaction type silicone release agents include, for example, KS-776A, KS-847T, KS-779H, KS-837, KS-778, KS-830 (manufactured by Shin-Etsu Chemical Co., Ltd.).
  • Examples thereof include SRX-211, SRX-345, SRX-357, SD7333, SD7220, SD7223, LTC-300B, LTC-350G, and LTC-310 (manufactured by Dow Toray Co., Ltd.).
  • Examples of products commercially available as a condensation reaction type include SRX-290 and SYLOFF-23 (manufactured by Dow Toray Co., Ltd.).
  • Products commercially available as cationically polymerized products include, for example, TPR-6501, TPR-6500, UV9300, VU9315, UV9430 (manufactured by Momentive Performance Materials), X62-7622 (manufactured by Shin-Etsu Chemical Co., Ltd.). And so on.
  • Examples of products commercially available as a radical polymerization type include X62-7205 (manufactured by Shin-Etsu Chemical Co., Ltd.).
  • silicone resin silicone resin composed of R 3 SiO 1/2 unit and SiO 4/2 unit
  • silica silica
  • ethyl cellulose and the like may be added to these release agents.
  • Long-chain alkyl group diameter strippers include long-chain alkyl group-containing aminoalkyd resins, long-chain alkyl group-containing acrylic resins, long-chain aliphatic pendant resins (polyvinyl alcohol, ethylene / vinyl alcohol copolymers, polyethyleneimine, and Examples thereof include known long-chain alkyl-based release agents (reaction products of at least one active hydrogen-containing polymer selected from the compound group consisting of hydroxyl group-containing cellulose derivatives) and long-chain alkyl group-containing isocyanates. It may be a release agent that carries out a curing reaction by adding a curing agent or an ultraviolet initiator, or it may be a release agent that volatilizes and solidifies a solvent.
  • an alkyl group having 8 to 30 carbon atoms is preferable, and an alkyl group having 10 or more carbon atoms, 12 or more, 18 or less, 24 or less, etc. may be used, and a linear alkyl group is particularly preferable.
  • a decyl group an undecyl group, a lauryl group, a dodecyl group, a tridecylic group, a myristyl group, a tetradecyl group, a pentadecyl group, a cetyl group, a palmitic acid group, a hexadecyl group, a heptadecyl group, a stearyl group, an octadecyl group, and a nonadecylic group.
  • Examples thereof include one or more alkyl groups selected from an icosyl group, a docosyl group and the like.
  • Products commercially available as long-chain alkyl release agents include, for example, Asioresin (registered trademark) RA-30 manufactured by Asio Sangyo Co., Ltd., Pyroyl (registered trademark) 1010, Pyroyl 1010S, and Pyroyl 1050 manufactured by Yushi Kogyo Co., Ltd. , Piroyl HT, Resem N-137 manufactured by Chukyo Yushi Co., Ltd., Exepearl (registered trademark) PS-MA manufactured by Kao Co., Ltd., Tessfine (registered trademark) 303 manufactured by Hitachi Kasei Co., Ltd., and the like.
  • Asioresin registered trademark
  • RA-30 manufactured by Asio Sangyo Co., Ltd.
  • Piroyl HT Resem N-137 manufactured by Chukyo Yushi Co., Ltd
  • fluorine-based release agent examples include a vinyl ether polymer containing a perfluoroalkyl group and a coating agent in which a fluororesin such as tetrafluoroethylene or trifluoroethylene is dispersed in a binder resin.
  • the release agent may contain an antistatic agent, a silane coupling agent, a lubricant and the like, if necessary.
  • the release agent layer may be formed on the surface of the plastic film or paper by a known method. Specifically, known coating methods such as gravure coating, Mayer bar coating, and air knife coating can be used.
  • the thickness of the peeling liner is not particularly limited and may be appropriately selected from the range of 5 to 100 ⁇ m.
  • the pressure-sensitive adhesive layer of the present invention may form a pressure-sensitive adhesive sheet in which another pressure-sensitive adhesive layer is laminated on a surface opposite to the pressure-sensitive adhesive surface. That is, the pressure-sensitive adhesive layer of the present invention may constitute a base-less double-sided pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer having a two-layer structure.
  • the pressure-sensitive adhesive layer of the present invention comprises a base material-less double-sided pressure-sensitive adhesive sheet having a two-layer structure pressure-sensitive adhesive layer, whereby, for example, the pressure-sensitive adhesive layer of the present invention is combined with another pressure-sensitive adhesive layer. , Shock absorption can be controlled. Further, another pressure-sensitive adhesive layer can be fixed to another substrate (carrier substrate), which is preferable from the viewpoint of workability.
  • the other pressure-sensitive adhesive layer may be composed of the same pressure-sensitive adhesive as the pressure-sensitive adhesive layer of the present invention, or may be composed of a pressure-sensitive adhesive different from the pressure-sensitive adhesive layer of the present invention.
  • a layer of a pressure-sensitive adhesive that can reduce the adhesive strength such as a radiation-curable pressure-sensitive adhesive or a heat-foaming type pressure-sensitive adhesive, is preferable.
  • Electronic components can be transferred with high adhesion between another adhesive layer and the carrier substrate, and then the adhesive strength of the other adhesive layer is reduced by irradiation or heating to easily peel off from the carrier substrate. Therefore, the carrier substrate can be easily reused, which is preferable from the viewpoint of excellent reworkability.
  • the thickness of the separate pressure-sensitive adhesive layer is not particularly limited, but is preferably 1 ⁇ m or more, and more preferably 3 ⁇ m or more. When the thickness is a certain value or more, it becomes easy to control the shock absorption and it becomes easy to stably fix it to the carrier substrate, which is preferable.
  • the upper limit of the thickness of another pressure-sensitive adhesive layer is not particularly limited, but is preferably 450 ⁇ m or less, and more preferably 300 ⁇ m or less. When the thickness is not more than a certain level, it is easy to peel off from the carrier substrate, and reworkability is improved, which is preferable.
  • the pressure-sensitive adhesive layer of the present invention may form a pressure-sensitive adhesive sheet in which a base material layer is laminated on a surface opposite to the pressure-sensitive adhesive surface. That is, the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) may constitute a pressure-sensitive adhesive sheet with a base material.
  • the base material functions as a support, which is preferable in that stability and handleability when receiving electronic components are improved.
  • the base material is not particularly limited, but for example, a plastic film can be preferably used.
  • a thermoplastic resin is preferable from the viewpoint of stability and handleability when receiving electronic parts.
  • the thermoplastic resin include polyolefins, polyesters, polyurethanes, polycarbonates, polyether ether ketones, polyimides, polyetherimides, polyamides, all aromatic polyamides, polyvinyl chlorides, polyvinylidene chlorides, polyphenylsulfides, aramids, and fluororesins.
  • Cellulosic resin, and silicone resin, and polyester film is preferable.
  • polystyrene resin examples include ethylene-vinyl acetate copolymers, ionomer resins, ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid ester copolymers, ethylene-butene copolymers, and ethylene-hexene copolymers. Be done.
  • the polyester examples include polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate.
  • the base material is preferably formed of a polyester film from the viewpoint of stability and handleability when receiving electronic components.
  • the base material may be made of one kind of material or may be made of two or more kinds of materials.
  • the base material may have a single-layer structure or a multi-layer structure.
  • the base material is made of a plastic film, it may be a non-stretched film, a uniaxially stretched film, or a biaxially stretched film. The peeling liner that is peeled off during use is not included in the "base material".
  • the thickness of the base material is not particularly limited, but is preferably 10 ⁇ m or more, more preferably 30 ⁇ m or more, for example, from the viewpoint of ensuring the strength for functioning as a support. Further, from the viewpoint of achieving appropriate flexibility, the thickness of the base material is preferably 200 ⁇ m or less, more preferably 180 ⁇ m or less.
  • the base material may have either a single layer or a plurality of layers. Further, in order to improve the adhesion to the pressure-sensitive adhesive layer of the present invention, the surface of the base material is known and commonly used, for example, physical treatment such as corona discharge treatment and plasma treatment, and chemical treatment such as undercoat treatment. Surface treatment may be appropriately applied.
  • the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) constitutes a pressure-sensitive adhesive sheet with a base material
  • another pressure-sensitive adhesive layer is formed on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated.
  • the agent layer may be laminated. That is, the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) may form a double-sided pressure-sensitive adhesive sheet with a base material.
  • the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) constitutes a double-sided pressure-sensitive adhesive sheet with a base material, so that the base material functions as a support and stability when receiving electronic components. It is preferable from the viewpoint of workability because it is possible to fix another pressure-sensitive adhesive layer to another substrate (carrier substrate) while improving the handleability.
  • the method for producing a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention includes the composition of the resin composition (pressure-sensitive adhesive composition) of the present invention. It depends on the above, and the known forming method can be used without particular limitation, and examples thereof include the following methods (1) to (4).
  • (1) The above resin composition is applied (coated) on a substrate to form a composition layer, and the composition layer is cured (for example, heat curing or curing by irradiation with an active energy ray such as ultraviolet rays).
  • Adhesive Layer to Produce Adhesive Sheet (2) The above resin composition is applied (coated) on a peeling liner to form a composition layer, and the composition layer is cured (for example, heat).
  • the above resin composition is applied (coated) on a peeling liner, dried and adhered.
  • a method for producing an adhesive sheet by transferring the adhesive layer onto a substrate after forming the agent layer.
  • a method of forming a pressure-sensitive adhesive layer by drying is preferable in terms of excellent productivity.
  • a known coating method can be adopted, and is not particularly limited, but for example, a roll coat, a kiss roll coat, a gravure coat, a reverse coat, etc. Examples thereof include a roll brush, a spray coat, a dip roll coat, a bar coat, a knife coat, an air knife coat, a curtain coat, a lip coat, and an extrusion coat method using a die coater.
  • the thickness (total thickness) of the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, still more preferably 3 ⁇ m or more. When the thickness is at least a certain level, it is preferable that the electronic component is easily transferred to the pressure-sensitive adhesive layer of the present invention with high accuracy.
  • the upper limit of the thickness (total thickness) of the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 500 ⁇ m or less, and more preferably 300 ⁇ m or less. When the thickness is not more than a certain level, it becomes easy to transfer the electronic component to another carrier board or mounting board with high accuracy, which is preferable.
  • the thickness of the pressure-sensitive adhesive sheet of the present invention does not include the thickness of the peeling liner.
  • the pressure-sensitive adhesive sheet of the present invention has the pressure-sensitive adhesive layer of the present invention, it exhibits excellent shock absorption.
  • the impact absorption rate (%) in the above iron ball drop test is 10% or more, preferably 15% or more, 20% or more, 25% or more, 30% or more, 35% or more, or 40% or more. May be.
  • the impact absorption rate (%) is obtained by measuring the impact load F when an impact is applied under the above conditions with the above iron ball drop tester and using the following formula.
  • Impact absorption rate (%) ⁇ (S 0 -S 1 ) / S 0 ⁇ x 100 (In the above formula, S 0 is the impact load when the iron ball is made to collide only with the SUS plate without attaching the adhesive sheet, and S 1 is the adhesive sheet of the structure composed of the SUS plate and the adhesive sheet. It is the impact load when an iron ball collides with the top.)
  • the adhesive sheet of the present invention is used as a method for processing electronic components (used for processing electronic components). More specifically, the pressure-sensitive adhesive sheet of the present invention is preferably used for receiving electronic components arranged on a temporary fixing material (board or pressure-sensitive adhesive sheet) in the pressure-sensitive adhesive layer of the present invention. Since the pressure-sensitive adhesive sheet of the present invention has the pressure-sensitive adhesive layer of the present invention, it can sufficiently absorb the impact caused by the collision with the pressure-sensitive adhesive layer such as electronic parts, and suppresses the displacement and turning over due to the bounce of the electronic parts at the time of collision. can. Further, since the pressure-sensitive adhesive sheet of the present invention has the pressure-sensitive adhesive layer of the present invention, it is possible to prevent the electronic parts from falling off or being displaced during transportation of the received electronic parts.
  • the method for processing an electronic component of the present invention includes a step (first step) of receiving the electronic component arranged on the temporary fixing material on the adhesive surface of the adhesive layer of the adhesive sheet of the present invention.
  • the pressure-sensitive adhesive sheet of the present invention can sufficiently absorb the impact caused by a collision with an adhesive layer such as an electronic component, and suppresses misalignment and turning over due to bouncing of the electronic component at the time of collision. can.
  • the surface on which the electronic component is arranged on the temporary fixing material and the adhesive surface of the adhesive layer of the adhesive sheet of the present invention face each other and are arranged with a gap.
  • This configuration is preferable in that the positional relationship between the temporary fixing material and the pressure-sensitive adhesive sheet of the present invention can be controlled, and electronic components can be arranged at a desired position on the pressure-sensitive adhesive sheet.
  • the method for processing an electronic component of the present invention further includes a step of arranging the electronic component on the pressure-sensitive adhesive sheet on another pressure-sensitive adhesive sheet or another substrate (second step), and a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. It is preferable to include a step (third step) of peeling the electronic component from the adhesive surface of the above.
  • the method for processing an electronic component of the present invention can efficiently transfer the electronic component by including the second step and the third step.
  • FIG. 5 is a schematic cross-sectional view showing a first step in an embodiment of the method for processing an electronic component of the present invention using the adhesive sheet 3 shown in FIG.
  • the peeling liner R1 of the adhesive sheet 3 is peeled off to expose the adhesive surface 30a (see FIG. 5A), and the temporary fixing material 50 is used.
  • This is a step of separating the electronic component 51 (see FIG. 5 (b)) arranged in the above and receiving it on the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 (see FIGS. 5 (c) and 5 (d)).
  • the peeling liner R1 of the adhesive sheet 3 is peeled off to expose the adhesive surface 30a of the adhesive layer 30.
  • a release layer made of a silicone-based, long-chain alkyl-based, fluorine-based or other release agent is formed (not shown). A part of the release agent contained in the release layer has been transferred to the pressure-sensitive adhesive layer 30.
  • a plurality of electronic components 51 are arranged on one side of the temporary fixing material 50.
  • the material constituting the temporary fixing material 50 is not particularly limited, and examples thereof include the above-mentioned plastic film and glass substrate.
  • the temporary fixing material 50 may be an adhesive sheet, and in that case, the electronic component 51 may be arranged on the adhesive surface of the adhesive sheet.
  • the temporary fixing material 50 is preferably made of a radiation-permeable material.
  • the method of arranging the electronic component 51 on one side of the temporary fixing material 50 is not particularly limited, and examples thereof include arranging the electronic component 51 via the adhesive force-reducable adhesive layer described above. In that case, the temporary fixing state can be released by irradiating or heating the pressure-sensitive adhesive layer with reduced adhesive strength.
  • the electronic component 51 is arranged on the temporary fixing material 50 via the radiation-curable pressure-sensitive adhesive layer (not shown).
  • a plurality of electronic components 51 are arranged on one side of the temporary fixing material 50.
  • the size of the electronic component 51 is, for example, 1 ⁇ m 2 to 250,000 ⁇ m 2 . According to the method for processing an electronic component of the present invention, such a small electronic component can be efficiently transferred.
  • the surface on which the electronic component 51 of the temporary fixing material 50 is arranged is arranged downward, the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 is arranged upward, and the temporary fixing material 50 is arranged.
  • the surface on which the electronic component 51 is temporarily fixed and the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 face each other, and a gap d is provided.
  • the gap d By providing the gap d, the positional relationship between the temporary fixing material 50 and the adhesive sheet 3 can be controlled, and the electronic component 51 can be arranged at a desired position of the adhesive sheet 3.
  • the interval of the gap d is not particularly limited, but is, for example, about 1 to 1000 ⁇ m.
  • the pressure-sensitive adhesive layer 30 is formed from the pressure-sensitive adhesive layer of the present invention and has impact absorption. Further, the surface of the pressure-sensitive adhesive sheet 3 on which the pressure-sensitive adhesive layer 30 is not formed may be laminated with another pressure-sensitive adhesive layer, and in that case, it is fixed to another substrate via another pressure-sensitive adhesive layer. It may be (not shown).
  • the electronic component 51 is irradiated with laser light L from the side of the temporary fixing material 50 to release the temporary fixing state of the electronic component 51, and the electronic component 51 is separated from the temporary fixing material 50. More specifically, when the temporary fixing material 50 in the portion where the electronic component 51 is in contact is irradiated with the laser beam L, the adhesive force is reduced, and the electronic component 51 is separated from the temporary fixing material 50. Will be done.
  • the laser beam L may irradiate a plurality of electronic components 51 individually, irradiate a part thereof, irradiate all the electronic components 51 at once, or irradiate the electronic components 51 by sweeping. good. In this embodiment, a part of a plurality of electronic components 51 is irradiated.
  • the electronic component 51 separated from the temporary fixing material 50 falls toward the adhesive sheet 3 and is received by the adhesive surface 30a of the adhesive layer 30.
  • the pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention and exhibits excellent shock absorption. Therefore, the pressure-sensitive adhesive layer 30 absorbs the shock caused by the collision of electronic parts to prevent damage, and suppresses misalignment and turning over of electronic parts. can.
  • FIGS. 5D and 5E another electronic component 51 arranged on the temporary fixing material 50 is irradiated with laser light L to be separated and dropped, and is received by the adhesive surface 30a of the adhesive layer 30 (transfer). do).
  • the laser beam L is irradiated to the electronic component 51 adjacent to the electronic component 51 irradiated with the laser beam L in FIG. 5 (b).
  • the positional relationship between the temporary fixing material 50 and the adhesive sheet 3 may be the same as that in FIG. 5 (b), or the positional relationship may be shifted.
  • the temporary fixing material 50 is shifted to the right of FIG. 5 by a predetermined interval with respect to the pressure-sensitive adhesive sheet 3, and then the laser beam L is irradiated.
  • the electronic component 51 can be arranged on the pressure-sensitive adhesive layer 30 of the pressure-sensitive adhesive sheet 3 by controlling the pitch to a desired level.
  • FIG. 5 (f) shows a form in which all the electronic components 51 are received by the pressure-sensitive adhesive layer 30 by repeating the steps shown in FIGS. 5 (d) and 5 (e).
  • the electronic components 51 are arranged with a desired pitch.
  • the adhesive surface 30a of the adhesive layer 30 is exposed to the atmospheric environment.
  • the release agent transferred from the release layer formed on the surface of the peeling liner R1 in contact with the adhesive surface 30a to the adhesive layer 30 bleeds out to the adhesive surface 30a. It is conceivable that.
  • the release agent bleeds out to the adhesive surface 30a, the wettability and adhesiveness of the adhesive surface 30a decrease with time, the ability to hold the electronic component 51 decreases, and the adhesive surface 30a retains the adhesive layer 30.
  • problems such as dropping or misalignment of the electronic component 51 may occur.
  • the pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention, and the release agent transferred to the pressure-sensitive adhesive layer 30 is suppressed from moving in the pressure-sensitive adhesive layer 30, and bleed-out to the pressure-sensitive adhesive surface 30a occurs. It is suppressed. Therefore, the wettability and the adhesiveness of the adhesive surface 30a in the atmospheric environment are suppressed from being lowered with time, and when the electronic component 51 held in the adhesive layer 30 is transported or used in the next step, it is used. It is possible to suppress problems such as dropping and misalignment of the electronic component 51.
  • FIG. 6 is a schematic cross-sectional view showing the second step and the third step in one embodiment of the method for processing an electronic component of the present invention using the adhesive sheet 3 shown in FIG.
  • the electronic components 51 arranged on the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 are arranged so as to face or separate from the other adhesive sheet or the substrate 60.
  • the surface 61 of the substrate 60 facing the adhesive sheet 3 is an adhesive surface
  • the surface 61 is a circuit surface.
  • the electronic component 51 in the state of FIG. 5F is inverted and arranged downward facing the surface 61 of the substrate 60.
  • the pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention, the wettability of the pressure-sensitive adhesive surface 30a and the deterioration of the adhesiveness with time in an air environment are suppressed. Therefore, in FIG. 6A. Even if the electronic component 51 is conveyed to the form and arranged downward, the electronic component 51 on the adhesive surface 30a of the adhesive layer 30 is maintained without falling off or being displaced.
  • the surface 61 of another adhesive sheet or substrate 60 and the electronic component 51 arranged on the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 are brought close to each other to obtain electrons.
  • the electronic component 51 can be placed on the surface 61 of another adhesive sheet or substrate 60.
  • the electronic component 51 is irradiated with ultraviolet rays U from the base material S1 side of the pressure-sensitive adhesive sheet 3 as shown in FIG. 6 (c).
  • the ultraviolet U U cures the pressure-sensitive adhesive layer 30 formed from the radiation-curable pressure-sensitive adhesive, reduces the adhesive strength, and makes the electronic component 51 peelable.
  • the ultraviolet rays U may irradiate all the electronic components 51, or may irradiate some of the electronic components 51 with a mask or the like, if necessary. In this embodiment, all the electronic components 51 are irradiated with ultraviolet rays U.
  • the electronic component 51 is peeled off from the pressure-sensitive adhesive surface 30a of the pressure-sensitive adhesive layer 30 of the pressure-sensitive adhesive sheet 3. At the same time, it can be transferred to the surface 61 of another adhesive sheet or substrate 60. Since the radiation-curable pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 30 is cured by ultraviolet rays U and its adhesive strength is reduced, the electronic component 51 can be easily peeled off to the surface 61 of another pressure-sensitive adhesive sheet or substrate 60. It can be transferred and placed. The electronic component 51 arrangement pattern on the pressure-sensitive adhesive layer 30 of the pressure-sensitive adhesive sheet 3 is maintained, and the electronic component 51 is transferred and arranged on the surface 61.
  • the method of processing electronic components can be similarly carried out by using the adhesive sheets 1, 2 and 4 shown in FIGS. 1, 2 and 4 instead of the adhesive sheet 3. In that case, it is preferable to peel off the peeling liner R2 of the adhesive sheets 1, 2 and 4 and fix it to a carrier substrate formed of a glass plate or the like for use.
  • the electronic components to be mounted on the mounting board are not particularly limited, but can be suitably used for fine and thin semiconductor chips and LED chips.
  • Example 1 (Preparation of adhesive) Acrylic polymer solution A containing 100 parts by weight of acrylic polymer A, 3 parts by weight of a cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name “Coronate L”), ⁇ -hydroxyketone-based photopolymerization initiator (manufactured by BASF Japan, A pressure-sensitive adhesive was obtained by adding 3 parts by weight (trade name "Irgacure 127", molecular weight: 340.4, absorption coefficient at wavelength 365 nm: 1.07 ⁇ 10 2 ml / g ⁇ cm).
  • a cross-linking agent manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L
  • ⁇ -hydroxyketone-based photopolymerization initiator manufactured by BASF Japan
  • a pressure-sensitive adhesive was obtained by adding 3 parts by weight (trade name "Irgacure 127", molecular weight: 340.4, absorption coefficient at wavelength 365
  • Adhesive sheet The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 ⁇ m) so that the thickness after solvent volatilization (drying) is 50 ⁇ m. Formed a pressure-sensitive adhesive layer. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 2 (manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 ⁇ m) from (peeling liner 1 / adhesive layer / peeling liner 2). I got an adhesive sheet.
  • Example 2 A pressure-sensitive adhesive sheet composed of (peeling liner 1 / pressure-sensitive adhesive layer / peeling liner 2) was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer after solvent volatilization (drying) was 100 ⁇ m.
  • Example 3 A pressure-sensitive adhesive sheet composed of (peeling liner 1 / pressure-sensitive adhesive layer / peeling liner 2) was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer after solvent volatilization (drying) was 150 ⁇ m.
  • Example 4 (Preparation of adhesive) An adhesive was obtained by adding 2 parts by weight of a cross-linking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "Tetrad C”) to an acrylic polymer solution B containing 100 parts by weight of acrylic polymer B. (Adhesive sheet) The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 ⁇ m) so that the thickness after solvent volatilization (drying) is 50 ⁇ m. Formed a pressure-sensitive adhesive layer.
  • a cross-linking agent manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "Tetrad C
  • acrylic polymer solution B containing 100 parts by weight of acrylic polymer B.
  • Adhesive sheet The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-
  • peeling liner 2 manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 ⁇ m
  • Acrylic polymer solution A containing 100 parts by weight of acrylic polymer A, 0.2 parts by weight of a cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L”), ⁇ -hydroxyketone-based photopolymerization initiator (BASF Japan)
  • Acrylic 2 was obtained by adding 3 parts by weight of the product, trade name "Irgacure 127", molecular weight: 340.4, absorption coefficient at wavelength 365 nm: 1.07 ⁇ 10 2 ml / g ⁇ cm).
  • the above adhesive 1 is applied to the release-treated surface of the release liner 2 (manufactured by Toray Industries, Inc., trade name “Therapeutic MDA”, thickness: 38 ⁇ m) so that the thickness after solvent volatilization (drying) is 10 ⁇ m.
  • the pressure-sensitive adhesive layer 1 was formed.
  • the above pressure-sensitive adhesive 2 is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 ⁇ m) so that the thickness after solvent volatilization (drying) is 50 ⁇ m.
  • the pressure-sensitive adhesive layer 2 was formed.
  • a pressure-sensitive adhesive sheet composed of (peeling liner 2 / pressure-sensitive adhesive layer 1 / pressure-sensitive adhesive layer 2 / peeling liner 1) is bonded so that the pressure-sensitive adhesive surfaces of the pressure-sensitive adhesive layer 1 and the pressure-sensitive adhesive layer 2 obtained above are in contact with each other. Obtained.
  • Example 6 It is composed of (peeling liner 2 / pressure-sensitive adhesive layer 1 / pressure-sensitive adhesive layer 2 / peeling liner 1) in the same manner as in Example 5 except that the thickness of the pressure-sensitive adhesive layer 1 after solvent volatilization (drying) is 20 ⁇ m. Obtained an adhesive sheet.
  • Example 7 (Preparation of adhesive) Silicone polymer C (manufactured by Dow Toray Co., Ltd., trade name "SD4600FC”) containing 100 parts by weight of a cross-linking agent (manufactured by Dow Toray Co., Ltd., trade name "BY 24-741”) 1.0 A pressure-sensitive adhesive was obtained by adding 0.9 parts by weight and 0.9 parts by weight of a platinum catalyst (manufactured by Dow Toray Co., Ltd., trade name "SRX212 Catalyst").
  • Adhesive sheet The above adhesive is applied to the release-treated surface of the release liner 3 (manufactured by Mitsubishi Chemical Corporation, trade name "MRS # 50", thickness: 50 ⁇ m) so that the thickness after solvent volatilization (drying) is 50 ⁇ m. A pressure-sensitive adhesive layer was formed. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 4 (manufactured by Fujiko Co., Ltd., trade name "SK1U”, thickness: 38 ⁇ m), and is composed of (peeling liner 3 / adhesive layer / peeling liner 4). I got an adhesive sheet.
  • Example 8 (Preparation of adhesive) Crosslinked to a silicone polymer solution D containing 100 parts by weight of silicone polymer C (manufactured by Dow Toray Co., Ltd., trade name "SD4600FC”) and 30 parts by weight of silicone polymer D (manufactured by Dow Toray Co., Ltd., trade name "SE1700").
  • a pressure-sensitive adhesive layer was formed.
  • the adhesive surface of the obtained adhesive layer is protected by a peeling liner 4 (manufactured by Fujiko Co., Ltd., trade name "SK1U", thickness: 38 ⁇ m), and is composed of (peeling liner 3 / adhesive layer / peeling liner 4). I got an adhesive sheet.
  • Adhesive sheet The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 ⁇ m) so that the thickness after solvent volatilization (drying) is 30 ⁇ m. Formed a pressure-sensitive adhesive layer. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 2 (manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 ⁇ m) from (peeling liner 1 / adhesive layer / peeling liner 2). I got an adhesive sheet.
  • Example 1 to 4 are peeling liners 2, Examples 5 and 6 are peeling liners 1, and Examples 7 and 8 are peeling lines.
  • the peeling liner 2 was peeled off, and the exposed adhesive layer surface was attached to a slide glass (manufactured by Matsunami Glass Industry Co., Ltd., 26 mm ⁇ 76 mm) using a 2 kg hand roller. did.
  • the peeling liner on the evaluation surface of the evaluation sample obtained as described above (Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, and Examples 7 and 8 are peeling liners 3).
  • Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, and Examples 7 and 8 are peeling liners 3).
  • the peeling liner 1) was peeled off, and a 1 g iron ball was freely dropped from a height of 1 m onto the exposed pressure-sensitive adhesive layer surface using a ball drop tester. The amount of the iron ball subducting into the pressure-sensitive adhesive layer surface was measured with a confocal laser scanning microscope.
  • the subduction amount ( ⁇ m) is divided by the thickness ( ⁇ m) of the pressure-sensitive adhesive layer (in Examples 5 and 6, the total of the pressure-sensitive adhesive layer 1 and the pressure-sensitive adhesive layer 2), and the value per unit thickness ( The amount of subduction / thickness ⁇ 100) (%) was determined.
  • Examples 1 to 4 are peeling liners 1
  • Examples 5 and 6 are peeling liners 2
  • Examples 7 and 8 are peeling liners 3
  • Comparative Examples 1 and 2 are peeling liners.
  • the initial adhesive force F 0 of the adhesive sheet was set according to the method according to JIS Z 0237: 2000 (bonding condition: 2 kg roller 1 reciprocation, tension). The measurement was carried out at a speed of 300 mm / min, a peeling angle of 180 °, and a measurement temperature of 23 ° C.).
  • Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, and Examples 7 and 8 are peeling liners 3).
  • the probe tack value of the exposed pressure-sensitive adhesive layer surface was measured by a probe tack measuring machine (manufactured by RHESCA, trade name "TACKINESS Model TAC-II").
  • the initial adhesive force F 0 of the adhesive layer to the stainless steel on the adhesive surface and the adhesive force F 1 of the adhesive layer to the stainless steel on the adhesive surface after irradiation are as follows.
  • Rate of change in adhesive strength during irradiation (%) (F 0 -F 1 ) / F 0 x 100
  • the resin composition according to any one of Supplementary note 1 to 5 wherein the thickness of the pressure-sensitive adhesive layer is 1 ⁇ m or more and 500 ⁇ m or less.
  • Adhesive sheet 10 Adhesive layers R1, R2 Peeling liner 2 Adhesive sheets 20, 21 Adhesive layer 3 Adhesive sheet 30 Adhesive layer S1 Base material 4 Adhesive sheets 40, 41 Adhesive layer 50 Temporary fixing material (board or adhesive sheet) 51 Electronic components 60 Adhesive sheet or substrate

Abstract

The purpose of the present invention is to provide a resin composition for forming a pressure-sensitive adhesive layer in which an adhesive surface, even in the state of being exposed to the air environment, is less apt to change in wettability and which, when used for conveying electronic components, is less apt to cause a position shift or falling. This resin composition is for use in forming a pressure-sensitive adhesive layer 10 which includes an adhesive surface 10a protected by a release liner R1.　The pressure-sensitive adhesive layer 10 has a difference R between contact angles θ1 and θ2 of the adhesive surface 10a with water of 5° or less, the contact angles being measured under the following conditions T1 and T2, respectively.　Conditions T1: Immediately after removing release liner R1 in a 23°C environment Conditions T2: After removing release liner R1 in a 23°C environment and exposing adhesive surface 10a to the air environment for 2 hours Contact angle θ1: Contact angle (°) of adhesive surface 10a with water under T1 Contact angle θ2: Contact angle (°) of adhesive surface 10a with water under T2 Difference R (°) = θ2-θ1

Description

樹脂組成物Resin composition
　本発明は、樹脂組成物に関する。より詳細には、本発明は、半導体チップやＬＥＤチップなどの小型の電子部品の転写に使用される粘着剤層の形成に好適に使用できる樹脂組成物に関する。 The present invention relates to a resin composition. More specifically, the present invention relates to a resin composition that can be suitably used for forming an adhesive layer used for transfer of small electronic components such as semiconductor chips and LED chips.
　半導体装置の製造過程においては、一般に、ダイシングテープ上に仮固定した状態で半導体ウェハをダイシングにより個片化し、個片化された半導体チップはウェハ裏面のダイシングテープ側からピン部材により突き押して、コレットと呼ばれる吸着治具によりピックアップし、回路基板などの実装基板に実装されている（例えば、特許文献１）。 In the manufacturing process of a semiconductor device, generally, a semiconductor wafer is individually prepared by dicing while temporarily fixed on a dicing tape, and the individualized semiconductor chip is pushed by a pin member from the dicing tape side on the back surface of the wafer to collet. It is picked up by a suction jig called, and mounted on a mounting board such as a circuit board (for example, Patent Document 1).
　しかしながら、微細加工技術の進歩により半導体チップの小型化、薄型化が進んでおり、コレットで個別にピックアップすることが困難になってきている。また、半導体装置の小型化も進んでおり、多数の微細な半導体チップを実装基板上に密に実装することが要求されてきており、コレットにより個別に実装するのは効率が悪いという問題もあった。 However, with the progress of microfabrication technology, semiconductor chips are becoming smaller and thinner, and it is becoming difficult to pick them up individually with collets. In addition, the miniaturization of semiconductor devices is progressing, and it is required to densely mount a large number of fine semiconductor chips on a mounting substrate, and there is also a problem that it is inefficient to mount them individually by collets. rice field.
　上記の問題を解決する手段として、レーザートランスファーと呼ばれる技術が検討されている（例えば、特許文献２参照）。レーザートランスファーでは、まず、仮固定材上に半導体チップなどの小型（例えば、一辺１００μｍ以下サイズの方形）の電子部品を格子状に配置し、電子部品が配置された面を下方に向けて配置する。次に、該仮固定材の電子部品が配置された面に対向して、電子部品を転写する（受け取る）ための転写用基板を隙間を設けて配置する。次に、仮固定材側から電子部品にレーザー光を照射することにより、仮固定を解除して剥離させ、転写用基板上に落下させることにより転写する。転写用基板に転写された電子部品は、別のキャリア基板に転写して実装基板に実装することができ、或いは、転写用基板から直接実装基板に転写することにより実装することができる。 As a means for solving the above problems, a technique called laser transfer is being studied (see, for example, Patent Document 2). In laser transfer, first, small electronic components such as semiconductor chips (for example, squares with a side of 100 μm or less) are arranged in a grid pattern on a temporary fixing material, and the surface on which the electronic components are arranged is arranged downward. .. Next, a transfer substrate for transferring (receiving) the electronic component is arranged with a gap facing the surface on which the electronic component of the temporary fixing material is arranged. Next, by irradiating the electronic component with a laser beam from the temporary fixing material side, the temporary fixing is released, the electronic component is peeled off, and the electronic component is dropped onto the transfer substrate to transfer the component. The electronic components transferred to the transfer board can be transferred to another carrier board and mounted on the mounting board, or can be mounted by transferring directly from the transfer board to the mounting board.
　レーザートランスファーでは、小型の電子部品をコレットなどを用いて機械的にピックアップする必要がなく、複数の電子部品にレーザー光を照射し、掃引することにより光学的な時間スケールで転写することができるため効率が飛躍的に向上する。また、仮固定材と転写用基板を隙間（クリアランス）を設けて配置することにより、電子部品を所望の間隔に調整して電子部品を配列することができるという利点も有する。 In laser transfer, it is not necessary to mechanically pick up small electronic components using a collet or the like, and multiple electronic components can be transferred on an optical time scale by irradiating them with laser light and sweeping them. Efficiency is dramatically improved. Further, by arranging the temporary fixing material and the transfer substrate with a gap (clearance), there is an advantage that the electronic components can be adjusted to a desired interval and the electronic components can be arranged.
　レーザートランスファーでは、仮固定材と転写用基板が隙間（クリアランス）を設けて配置されるため、剥離された電子部品が転写用基板に衝突した際に衝撃を受けて破損したり、跳ねて位置ずれが生じたり、裏返るなどの不具合が生じる問題があり、転写用基板の表面には、電子部品が転写用基板に衝突した際の衝撃を緩和するための衝撃吸収性が要求される。一方、受け取った電子部品を搬送する際に、位置ずれや脱落しないような粘着性も要求される。このため、前記転写用基板の表面には、衝撃吸収性と粘着性を兼ね備える粘着剤層が設けられている（例えば、特許文献２）。 In laser transfer, the temporary fixing material and the transfer board are arranged with a gap (clearance), so when the peeled electronic component collides with the transfer board, it is damaged by impact or bounces off the position. However, the surface of the transfer substrate is required to have shock absorption for alleviating the impact when an electronic component collides with the transfer substrate. On the other hand, when transporting the received electronic component, adhesiveness is also required so as not to be misaligned or fall off. Therefore, a pressure-sensitive adhesive layer having both shock absorption and adhesiveness is provided on the surface of the transfer substrate (for example, Patent Document 2).
特開２０１９－９２０３号公報Japanese Unexamined Patent Publication No. 2019-9203 特開２０１９－０６７８９２公報JP-A-2019-067892
　上記粘着剤層の表面（粘着面）は、通常は、はく離ライナーで保護され、使用直前にはく離ライナーを剥離して、装置に組み付けられて使用されている。しかしながら、はく離ライナーを剥離して大気環境下に曝露された状態では、粘着面の濡れ性が経時的に変化して、電子部品を搬送する際に位置ずれや脱落が生じるという問題があった。 The surface (adhesive surface) of the adhesive layer is usually protected by a peeling liner, and the peeling liner is peeled off immediately before use and assembled to the device for use. However, when the peeling liner is peeled off and exposed to the atmospheric environment, there is a problem that the wettability of the adhesive surface changes with time, causing misalignment or dropping when transporting electronic components.
　本発明は上記の問題に鑑みてなされたものであり、その目的は、大気環境下に曝露された状態でも粘着面の濡れ性が変化しにくく、電子部品を搬送する際に位置ずれや脱落が生じにくい粘着剤層を形成するための樹脂組成物を提供することである。 The present invention has been made in view of the above problems, and an object of the present invention is that the wettability of the adhesive surface does not easily change even when exposed to an air environment, and misalignment or dropout occurs when transporting electronic components. It is an object of the present invention to provide a resin composition for forming a pressure-sensitive adhesive layer that is unlikely to occur.
　本発明の第１の側面は、樹脂組成物を提供する。本発明の第１の側面の樹脂組成物は、粘着剤層を形成するために使用されるものである。
　本明細書において、本発明の第１の側面の樹脂組成物を「本発明の樹脂組成物」、本発明の第１の側面の樹脂組成物により形成される粘着剤層を「本発明の粘着剤層」を称する場合がある。 The first aspect of the present invention provides a resin composition. The resin composition of the first aspect of the present invention is used to form a pressure-sensitive adhesive layer.
In the present specification, the resin composition of the first aspect of the present invention is referred to as "the resin composition of the present invention", and the pressure-sensitive adhesive layer formed by the resin composition of the first aspect of the present invention is referred to as "adhesive of the present invention". It may be referred to as "agent layer".
　本発明の粘着剤層は、仮固定材上に配置された電子部品を受け取るために好適に使用できるものであり、より詳細には、仮固定材上に電子部品が配置された面と対向して隙間を設けて配置され、電子部品を受け取るために好適に使用できるものである。従って、本発明の粘着剤層は、前記電子部品を受け取る際の衝撃を緩和するための衝撃吸収性と、受け取った電子部品を搬送する際に位置ずれや脱落しないような粘着性とを兼ね備えるものである。そして、本発明の樹脂組成物は、そのような衝撃吸収性と、粘着性とを兼ね備える本発明の粘着剤層を形成するために好適に使用できるものである。 The pressure-sensitive adhesive layer of the present invention can be suitably used for receiving the electronic component arranged on the temporary fixing material, and more specifically, the pressure-sensitive adhesive layer faces the surface on which the electronic component is arranged on the temporary fixing material. It is arranged with a gap and can be suitably used for receiving electronic components. Therefore, the pressure-sensitive adhesive layer of the present invention has both shock absorption for alleviating the impact when receiving the electronic component and adhesiveness so as not to be displaced or fall off when transporting the received electronic component. Is. The resin composition of the present invention can be suitably used for forming the pressure-sensitive adhesive layer of the present invention having such shock absorption and adhesiveness.
　本発明の粘着剤層は、その粘着面がはく離ライナーで保護されている。前記はく離ライナーは、本発明の粘着剤層の衝撃吸収性と粘着性を保護するために少なくとも一方の粘着面上に積層されるものであり、本発明の粘着剤層を前記電子部品を受け取るために使用する直前に剥離される。しかし、はく離ライナーを剥離後に大気環境下に曝露された状態では、粘着面の濡れ性が経時的に変化して、電子部品を搬送する際に位置ずれや脱落が生じるという問題があった。 The adhesive layer of the present invention has its adhesive surface protected by a peeling liner. The peeling liner is laminated on at least one adhesive surface in order to protect the impact absorption and adhesiveness of the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive layer of the present invention receives the electronic component. It is peeled off just before it is used for. However, when the peeling liner is exposed to the atmospheric environment after peeling, there is a problem that the wettability of the adhesive surface changes with time, causing misalignment or dropping when transporting electronic components.
　本発明の粘着剤層は、下記条件Ｔ1、Ｔ2における前記粘着面に対する水の接触角θ1、θ2の変位Ｒが５°以下である。
　Ｔ1：２３℃環境下で前記はく離ライナーを剥離した直後
　Ｔ2：２３℃環境下で前記はく離ライナーを剥離し、前記粘着面を大気環境下で２時間曝露後
　θ1：Ｔ1での前記粘着面の水接触角（°）
　θ2：Ｔ2での前記粘着面の水接触角（°）
　変位Ｒ（°）＝θ2－θ1 The pressure-sensitive adhesive layer of the present invention has a displacement R of water contact angles θ 1 and θ 2 with respect to the pressure-sensitive adhesive surface under the following conditions T 1 and T 2 of 5 ° or less.
Immediately after peeling off the peeling liner in a T 1 : 23 ° C environment T 2 : After peeling off the peeling liner in a 23 ° C environment and exposing the adhesive surface to an atmospheric environment for 2 hours θ 1 : The above in T 1 Water contact angle of adhesive surface (°)
θ 2 : Water contact angle (°) of the adhesive surface at T 2 .
Displacement R (°) = θ 2 -θ 1
　本発明の粘着剤層において、前記変位Ｒが５°以下であるという構成は、はく離ライナーを剥離後に大気環境下に曝露された状態でも、粘着面の濡れ性が経時的に変化しにくく、電子部品を搬送する際の位置ずれや脱落を防止できるという点で、好適である。 In the pressure-sensitive adhesive layer of the present invention, the configuration in which the displacement R is 5 ° or less makes it difficult for the wettability of the pressure-sensitive adhesive surface to change over time even when the peeling liner is exposed to the atmospheric environment after peeling, and the electrons It is preferable in that it can prevent misalignment and dropout when transporting parts.
　本発明の粘着剤層の前記粘着面に対する下記条件の鉄球落下試験による粘着剤層の沈み込み深さの前記粘着剤層の厚さに対する割合（沈み込み深さ／厚さ×１００）は、１５％以上であることが好ましい。
　鉄球落下試験：１ｇの鉄球を高さ１ｍから粘着面に自由落下させる。 The ratio of the sinking depth of the pressure-sensitive adhesive layer to the thickness of the pressure-sensitive adhesive layer (subduction depth / thickness × 100) by the iron ball drop test under the following conditions with respect to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the present invention is determined. It is preferably 15% or more.
Iron ball drop test: 1 g of iron ball is freely dropped from a height of 1 m onto the adhesive surface.
　前記割合が、１５％以上であるという構成は、本発明の粘着剤層が優れた衝撃吸収性を示し、電子部品を受け取る際に、破損したり、跳ねて位置ずれが生じたり、裏返るなどの不具合が生じることを防止できる点で、好ましい。 When the ratio is 15% or more, the pressure-sensitive adhesive layer of the present invention exhibits excellent shock absorption, and when receiving an electronic component, it may be damaged, bounced, misaligned, or turned inside out. It is preferable in that it can prevent problems from occurring.
　本発明の粘着剤層の前記粘着面のステンレスに対する常温での初期粘着力Ｆ0と、放射線照射後の前記粘着剤層の前記粘着面のステンレスに対する常温での粘着力Ｆ1において、下記式で示される放射線照射時粘着力の変化率が９５％以下であることが好ましい。

　放射線照射時粘着力の変化率（％）＝（Ｆ0－Ｆ1）／Ｆ0×１００ The initial adhesive force F 0 of the pressure-sensitive adhesive layer of the present invention to the stainless steel on the adhesive surface and the adhesive force F 1 of the pressure-sensitive adhesive layer to the stainless steel of the adhesive surface after irradiation are as follows. It is preferable that the rate of change in the adhesive strength at the time of irradiation shown is 95% or less.

Rate of change in adhesive strength during irradiation (%) = (F 0 -F 1 ) / F 0 x 100
　前記放射線照射時粘着力の変化率が９５％以下であるという構成は、前記変位Ｒを５°以下に調整し、はく離ライナーを剥離後に大気環境下に曝露された状態でも、粘着面の濡れ性が経時的に変化しにくく、電子部品を搬送する際の位置ずれや脱落を防止できるという点で、好適である。 In the configuration in which the rate of change of the adhesive force during irradiation is 95% or less, the displacement R is adjusted to 5 ° or less, and the wettability of the adhesive surface is obtained even when the peeling liner is peeled off and then exposed to the air environment. Is preferable in that it does not easily change over time and can prevent misalignment and dropout when transporting electronic components.
　本発明の粘着剤層の厚みは、１μｍ以上５００μｍ以下であることが好ましい。本発明の粘着剤層の厚みが１μｍ以上であるという構成は、電子部品の衝突による衝撃吸収性に優れるという点で、好ましい。また、本発明の粘着剤層の厚みが５００μｍ以下であるという構成は、受け取った電子部品を別のキャリア基板や実装基板へ転写する際の転写性の観点から好ましい。 The thickness of the pressure-sensitive adhesive layer of the present invention is preferably 1 μm or more and 500 μm or less. The configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 1 μm or more is preferable in that it is excellent in shock absorption due to collision of electronic components. Further, the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 500 μm or less is preferable from the viewpoint of transferability when the received electronic component is transferred to another carrier substrate or mounting substrate.
　本発明の樹脂組成物は、アクリル系粘着剤組成物であることが好ましい。本発明の樹脂組成物が、アクリル系粘着剤組成物であるという構成は、前記変位Ｒを５°以下に調整する粘着剤の設計のしやすさ、透明性、粘着性、コスト等の点で、好ましい。 The resin composition of the present invention is preferably an acrylic pressure-sensitive adhesive composition. The configuration in which the resin composition of the present invention is an acrylic pressure-sensitive adhesive composition is in terms of ease of designing a pressure-sensitive adhesive that adjusts the displacement R to 5 ° or less, transparency, adhesiveness, cost, and the like. ,preferable.
　本発明の粘着剤層は、前記粘着面とは反対側の面に別の粘着剤層が積層されていてもよい。この構成は、前記粘着面において前記変位Ｒを５°以下に調整し、大気環境下に曝露された状態でも、粘着面の濡れ性が経時的に変化しにくく、電子部品を搬送する際の位置ずれや脱落を防止でき、さらに、前記粘着面とは反対側の面に積層される別の粘着剤層により、電子部品を受け取る際の衝撃吸収性を調整できる点で、好ましい。また、別の粘着剤層を、転写用基板を構成する基材、又はキャリア基板などに貼り合わせることができる。 The pressure-sensitive adhesive layer of the present invention may have another pressure-sensitive adhesive layer laminated on the surface opposite to the pressure-sensitive adhesive surface. In this configuration, the displacement R of the adhesive surface is adjusted to 5 ° or less, and the wettability of the adhesive surface does not easily change over time even when exposed to an atmospheric environment, and the position when transporting electronic components is achieved. It is preferable in that it can prevent displacement and falling off, and further, it is possible to adjust the shock absorption when receiving the electronic component by another pressure-sensitive adhesive layer laminated on the surface opposite to the pressure-sensitive adhesive surface. Further, another pressure-sensitive adhesive layer can be attached to a substrate constituting a transfer substrate, a carrier substrate, or the like.
　本発明の粘着剤層（前記別の粘着剤層が積層される場合を含む）は、前記粘着面とは反対側の面に基材層が積層されていてもよい。本発明の粘着剤層が、前記粘着面とは反対側の面に基材層を有することにより、電子部品を受け取る際の安定性や取り扱い性が向上する点で好ましい。 In the pressure-sensitive adhesive layer of the present invention (including the case where the other pressure-sensitive adhesive layer is laminated), the base material layer may be laminated on the surface opposite to the pressure-sensitive adhesive surface. It is preferable that the pressure-sensitive adhesive layer of the present invention has a base material layer on a surface opposite to the pressure-sensitive adhesive surface in that stability and handleability when receiving electronic components are improved.
　本発明の粘着剤層において、前記基材層の前記粘着剤層が積層されていない面に、別の粘着剤層が積層されていてもよい。前記基材層の前記粘着剤層が積層されていない面に別の粘着剤層が積層されていることにより、例えば、別の粘着剤層をキャリア基板に固定することができ、作業性の観点から好ましい。
　前記基材層は、電子部品を受け取る際の安定性や取り扱い性の観点から、ポリエステルフィルムから形成されることが好ましい。 In the pressure-sensitive adhesive layer of the present invention, another pressure-sensitive adhesive layer may be laminated on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated. By laminating another pressure-sensitive adhesive layer on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated, for example, another pressure-sensitive adhesive layer can be fixed to the carrier substrate, and from the viewpoint of workability. Is preferable.
The base material layer is preferably formed of a polyester film from the viewpoint of stability and handleability when receiving electronic components.
　本発明の第２の側面は、本発明の樹脂組成物により形成される粘着剤層を提供する。また、本発明の第３の側面は、本発明の第２の側面の粘着剤層を有する粘着シートを提供する。本発明の第２の側面の粘着剤層、及び本発明の第３の側面の粘着シートは、本発明の粘着剤層を有するため、仮固定材上に配置された電子部品を受け取るために好適に使用できるものであり、より詳細には、仮固定材上に電子部品が配置された面と対向して隙間を設けて配置され、電子部品を受け取るために好適に使用できるものである。 The second aspect of the present invention provides a pressure-sensitive adhesive layer formed by the resin composition of the present invention. Further, the third aspect of the present invention provides a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the second aspect of the present invention. Since the pressure-sensitive adhesive layer on the second side surface of the present invention and the pressure-sensitive adhesive sheet on the third side surface of the present invention have the pressure-sensitive adhesive layer of the present invention, they are suitable for receiving electronic components arranged on the temporary fixing material. More specifically, the electronic component is arranged on the temporary fixing material with a gap facing the surface on which the electronic component is arranged, and can be suitably used for receiving the electronic component.
　本発明の樹脂組成物から形成される粘着剤層（本発明の粘着剤層）は、はく離ライナーを剥離後に大気環境下に曝露された状態でも、粘着面の濡れ性が経時的に変化しにくく、電子部品を搬送する際の位置ずれや脱落を防止できる。従って、本発明の樹脂組成物は、レーザートランスファーに使用される衝撃吸収性と粘着性を兼ね備える粘着剤層を形成するために好適に使用できる。 The pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer of the present invention) formed from the resin composition of the present invention does not easily change the wettability of the pressure-sensitive adhesive surface over time even when exposed to the air environment after the peeling liner is peeled off. , It is possible to prevent misalignment and dropout when transporting electronic parts. Therefore, the resin composition of the present invention can be suitably used for forming a pressure-sensitive adhesive layer having both shock absorption and adhesiveness used for laser transfer.
本発明の粘着剤層を有する粘着シートの一実施形態を示す断面模式図である。It is sectional drawing which shows one Embodiment of the pressure-sensitive adhesive sheet which has the pressure-sensitive adhesive layer of this invention. 本発明の粘着剤層を有する粘着シートの他の一実施形態を示す断面模式図である。It is sectional drawing which shows the other embodiment of the pressure-sensitive adhesive sheet which has the pressure-sensitive adhesive layer of this invention. 本発明の粘着剤層を有する粘着シートの他の一実施形態を示す断面模式図である。It is sectional drawing which shows the other embodiment of the pressure-sensitive adhesive sheet which has the pressure-sensitive adhesive layer of this invention. 本発明の粘着剤層を有する粘着シートの他の一実施形態を示す断面模式図である。It is sectional drawing which shows the other embodiment of the pressure-sensitive adhesive sheet which has the pressure-sensitive adhesive layer of this invention. 図３に示す粘着シートを用いた電子部品の加工方法の一実施形態における第１工程を表す断面模式図である。FIG. 3 is a schematic cross-sectional view showing a first step in an embodiment of a method for processing an electronic component using the adhesive sheet shown in FIG. 図３に示す粘着シートを用いた電子部品の加工方法の一実施形態における第２工程及び第３工程を表す断面模式図である。FIG. 3 is a schematic cross-sectional view showing a second step and a third step in an embodiment of a method for processing an electronic component using the adhesive sheet shown in FIG.
　本発明の樹脂組成物は、はく離ライナーで粘着面が保護された粘着剤層（本発明の粘着剤層）を形成するために使用されるものである。
　本発明の粘着剤層は、半導体チップやＬＥＤチップなどの小型の電子部品を回路基板などの実装基板に移載する加工技術に使用されるものであり、具体的には、仮固定材上に配置された電子部品を受け取るために使用される粘着剤層、より詳細には、仮固定材上に電子部品が配置された面と対向して隙間を設けて配置され、電子部品を受け取るために使用される粘着剤層として好適に使用されるものである。本発明の粘着剤層を電子部品の移載に使用することにより、複数の電子部品を光学的な時間スケールで本発明の粘着剤層に配置することが可能となり、個別にピックアップする必要がない。本発明の粘着剤層に配置された電子部品は、別のキャリア基板に転写して実装基板に実装することができ、或いは、本発明の粘着剤層から実装基板に直接移載することができるため、製造効率を格段に向上させることができる。本発明の粘着剤層は、前記電子部品を受け取る際の衝撃を緩和するための衝撃吸収性と、受け取った電子部品を搬送する際に位置ずれや脱落しないような粘着性とを兼ね備えるものである。 The resin composition of the present invention is used to form a pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer of the present invention) whose adhesive surface is protected by a peeling liner.
The pressure-sensitive adhesive layer of the present invention is used in a processing technique for transferring a small electronic component such as a semiconductor chip or an LED chip to a mounting substrate such as a circuit board, and specifically, on a temporary fixing material. An adhesive layer used to receive the placed electronic components, more specifically to be placed on the temporary fixing material with a gap facing the surface on which the electronic components are placed to receive the placed electronic components. It is preferably used as a pressure-sensitive adhesive layer to be used. By using the pressure-sensitive adhesive layer of the present invention for transferring electronic parts, it is possible to arrange a plurality of electronic parts on the pressure-sensitive adhesive layer of the present invention on an optical time scale, and it is not necessary to pick them up individually. .. The electronic components arranged on the pressure-sensitive adhesive layer of the present invention can be transferred to another carrier substrate and mounted on the mounting substrate, or can be directly transferred from the pressure-sensitive adhesive layer of the present invention to the mounting substrate. Therefore, the manufacturing efficiency can be significantly improved. The pressure-sensitive adhesive layer of the present invention has both shock absorption for alleviating the impact when receiving the electronic component and adhesiveness so as not to be displaced or fall off when the received electronic component is transported. ..
　本発明の粘着剤層は、前記粘着面（粘着剤層表面）を有する限り、その形態は特に限定されない。例えば、片面のみが粘着面である片面粘着シートを構成してもよいし、両面が粘着面である両面粘着シートを構成してもよい。また、本発明の粘着剤層が両面粘着シートを構成する場合、前記両面粘着シートは、両方の粘着面が本発明の粘着剤層により提供される形態を有していてもよいし、一方の粘着面が本発明の粘着剤層により提供され、他方の粘着面が本発明の粘着剤層以外の粘着剤層（本明細書において、「別の粘着剤層」と称する場合がある）により提供される形態を有していてもよい。 The form of the pressure-sensitive adhesive layer of the present invention is not particularly limited as long as it has the pressure-sensitive adhesive surface (the surface of the pressure-sensitive adhesive layer). For example, a single-sided adhesive sheet having only one side as an adhesive surface may be formed, or a double-sided adhesive sheet having both sides having an adhesive surface may be formed. Further, when the pressure-sensitive adhesive layer of the present invention constitutes a double-sided pressure-sensitive adhesive sheet, the double-sided pressure-sensitive adhesive sheet may have a form in which both pressure-sensitive adhesive surfaces are provided by the pressure-sensitive adhesive layer of the present invention, or one of them. The adhesive surface is provided by the pressure-sensitive adhesive layer of the present invention, and the other pressure-sensitive adhesive surface is provided by a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention (sometimes referred to as "another pressure-sensitive adhesive layer" in the present specification). It may have a form to be used.
　本発明の粘着剤層は、基材（基材層）を有しない、いわゆる「基材レスタイプ」の粘着シートを構成してもよいし、基材を有するタイプの粘着シートを構成してもよい。なお、本明細書において、「基材レスタイプ」の粘着シートを「基材レス粘着シート」と称する場合があり、基材を有するタイプの粘着シートを「基材付き粘着シート」と称する場合がある。上記基材レス粘着シートとしては、例えば、本発明の粘着剤層のみからなる両面粘着シートや、本発明の粘着剤層と別の粘着剤層（本発明の粘着剤層以外の粘着剤層）からなる両面粘着シート等が挙げられる。また、上記基材付き粘着シートとしては、例えば、基材の片面側に本発明の粘着剤層を有する片面粘着シートや、基材の両面側に本発明の粘着剤層を有する両面粘着シートや、基材の一方の面側に本発明の粘着剤層を有し、他方の面側に別の粘着剤層を有する両面粘着シートなどが挙げられる。なお、上記の「基材（基材層）」とは、支持体のことであり、本発明の粘着剤層を使用する際には、粘着剤層とともに電子部品を受け取る部分である。粘着剤層の使用時に剥離されるはく離ライナーは、上記基材に含まれない。なお、「粘着シート」には、「粘着テープ」の意味を含むものとする。すなわち、前記粘着シートは、テープ状の形態を有する粘着テープであってもよい。 The pressure-sensitive adhesive layer of the present invention may form a so-called "base material-less type" pressure-sensitive adhesive sheet having no base material (base material layer), or may form a type of pressure-sensitive adhesive sheet having a base material. good. In the present specification, the "base material-less type" adhesive sheet may be referred to as "base material-less adhesive sheet", and the type of adhesive sheet having a base material may be referred to as "base material-based adhesive sheet". be. Examples of the base material-less pressure-sensitive adhesive sheet include a double-sided pressure-sensitive adhesive sheet composed of only the pressure-sensitive adhesive layer of the present invention, and a pressure-sensitive adhesive layer different from the pressure-sensitive adhesive layer of the present invention (a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention). Examples thereof include a double-sided adhesive sheet made of. Examples of the pressure-sensitive adhesive sheet with a base material include a single-sided pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on one side of the base material, and a double-sided pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on both sides of the base material. Examples thereof include a double-sided pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on one surface side of the base material and another pressure-sensitive adhesive layer on the other side surface. The above-mentioned "base material (base material layer)" is a support, and when the pressure-sensitive adhesive layer of the present invention is used, it is a portion that receives electronic components together with the pressure-sensitive adhesive layer. The peeling liner that is peeled off when the pressure-sensitive adhesive layer is used is not included in the above-mentioned substrate. The "adhesive sheet" shall include the meaning of "adhesive tape". That is, the adhesive sheet may be an adhesive tape having a tape-like form.
　本発明の粘着剤層の前記粘着面（電子部品を受け取るための粘着面）は、はく離ライナーにより保護されている。前記はく離ライナーは、本発明の粘着剤層の衝撃吸収性と粘着性を保護するために少なくとも一方の粘着面上に積層されるものであり、本発明の粘着剤層を前記電子部品を受け取るために使用される直前に剥離される。 The adhesive surface (adhesive surface for receiving electronic components) of the adhesive layer of the present invention is protected by a peeling liner. The peeling liner is laminated on at least one adhesive surface in order to protect the impact absorption and adhesiveness of the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive layer of the present invention receives the electronic component. It is peeled off just before it is used for.
　本発明の粘着剤層の実施形態について、図面を参照して、以下に説明するが、本発明の粘着剤層は当該実施形態に限定されるものではない。
　図１は、本発明の粘着剤層を有する粘着シートの一実施形態を示す断面模式図であり、１は粘着シート、１０は粘着剤層、Ｒ１、Ｒ２ははく離ライナーを示す。 An embodiment of the pressure-sensitive adhesive layer of the present invention will be described below with reference to the drawings, but the pressure-sensitive adhesive layer of the present invention is not limited to the embodiment.
FIG. 1 is a schematic cross-sectional view showing an embodiment of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention, in which 1 is a pressure-sensitive adhesive sheet, 10 is a pressure-sensitive adhesive layer, and R1 and R2 are peeling liners.
　図１に示すように、粘着シート１は、はく離ライナーＲ１と、粘着剤層１０と、はく離ライナーＲ２が、この順に積層された積層構造を有する。粘着シート１は、半導体チップやＬＥＤチップなどの小型の電子部品を回路基板などの実装基板に実装する加工技術に使用されるものである。粘着シート１において、粘着剤層１０は本発明の粘着剤層で構成されるものであり、仮固定材に配置された電子部品を分離し、分離された前記電子部品を受け取るために好適に使用されるものである。はく離ライナーＲ１は、使用前に粘着剤層１０から剥離され、露出した粘着面１０ａで電子部品を受け取るものである。はく離ライナーＲ２を剥離することにより露出する粘着面１０ｂは、転写用基板を構成する基材、又はキャリア基板などに貼り合わされる。 As shown in FIG. 1, the pressure-sensitive adhesive sheet 1 has a laminated structure in which a peeling liner R1, a pressure-sensitive adhesive layer 10, and a peeling liner R2 are laminated in this order. The adhesive sheet 1 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board. In the pressure-sensitive adhesive sheet 1, the pressure-sensitive adhesive layer 10 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done. The peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 10 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 10a. The adhesive surface 10b exposed by peeling off the peeling liner R2 is bonded to a substrate constituting a transfer substrate, a carrier substrate, or the like.
　図２は、本発明の粘着剤層を有する粘着シートの他の一実施形態を示す断面模式図であり、２は粘着シート、２０、２１は粘着剤層、Ｒ１、Ｒ２ははく離ライナーを示す。 FIG. 2 is a schematic cross-sectional view showing another embodiment of the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention, where 2 is a pressure-sensitive adhesive sheet, 20 and 21 are pressure-sensitive adhesive layers, and R1 and R2 are peeling liners.
　図２に示すように、粘着シート２は、はく離ライナーＲ１と、粘着剤層２０と、粘着剤層２１と、はく離ライナーＲ２とが、この順で積層された積層構造を有する。粘着シート２は、半導体チップやＬＥＤチップなどの小型の電子部品を回路基板などの実装基板に実装する加工技術に使用されるものである。粘着シート２において、粘着剤層２０は本発明の粘着剤層で構成されるものであり、仮固定材に配置された電子部品を分離し、分離された前記電子部品を受け取るために好適に使用されるものである。粘着シート２において、粘着剤層２１は、粘着剤層２０と共に、電子部品を受け取る際の衝撃吸収性を調整しうるものである。粘着剤層２１は、本発明の粘着剤層で構成されるものであってもよく、本発明の粘着剤層以外の粘着剤層で構成されるものであってもよい。はく離ライナーＲ１は、使用前に粘着剤層２０から剥離され、露出した粘着面２０ａで電子部品を受け取るものである。はく離ライナーＲ２を剥離することにより露出する粘着面２１ｂは、転写用基板を構成する基材、又はキャリア基板などに貼り合わされる。 As shown in FIG. 2, the pressure-sensitive adhesive sheet 2 has a laminated structure in which a peeling liner R1, a pressure-sensitive adhesive layer 20, a pressure-sensitive adhesive layer 21, and a peeling liner R2 are laminated in this order. The adhesive sheet 2 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board. In the pressure-sensitive adhesive sheet 2, the pressure-sensitive adhesive layer 20 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done. In the pressure-sensitive adhesive sheet 2, the pressure-sensitive adhesive layer 21 can adjust the shock absorption when receiving electronic components together with the pressure-sensitive adhesive layer 20. The pressure-sensitive adhesive layer 21 may be composed of the pressure-sensitive adhesive layer of the present invention, or may be composed of a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention. The peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 20 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 20a. The adhesive surface 21b exposed by peeling off the peeling liner R2 is bonded to a substrate constituting a transfer substrate, a carrier substrate, or the like.
　図３は、本発明の粘着剤層を有する粘着シートの他の一実施形態を示す断面模式図であり、３は粘着シート、３０は粘着剤層、Ｓ１は基材、Ｒ１ははく離ライナーを示す。 FIG. 3 is a schematic cross-sectional view showing another embodiment of the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention, in which 3 is a pressure-sensitive adhesive sheet, 30 is a pressure-sensitive adhesive layer, S1 is a base material, and R1 is a peeling liner. ..
　図３に示すように、粘着シート３は、はく離ライナーＲ１と、粘着剤層３０と、基材Ｓ１とが、この順に積層された積層構造を有する。粘着シート３は、半導体チップやＬＥＤチップなどの小型の電子部品を回路基板などの実装基板に実装する加工技術に使用されるものである。粘着シート３において、粘着剤層３０は本発明の粘着剤層で構成されるものであり、仮固定材に配置された電子部品を分離し、分離された前記電子部品を受け取るために好適に使用されるものである。粘着シート３において、基材Ｓ１は、電子部品を受け取る際の安定性や取り扱い性を向上させるものである。はく離ライナーＲ１は、使用前に粘着剤層３０から剥離され、露出した粘着面３０ａで電子部品を受け取るものである。 As shown in FIG. 3, the pressure-sensitive adhesive sheet 3 has a laminated structure in which the peeling liner R1, the pressure-sensitive adhesive layer 30, and the base material S1 are laminated in this order. The adhesive sheet 3 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board. In the pressure-sensitive adhesive sheet 3, the pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done. In the pressure-sensitive adhesive sheet 3, the base material S1 improves stability and handleability when receiving electronic components. The peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 30 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 30a.
　図４は、本発明の粘着剤層を有する粘着シートの他の一実施形態を示す断面模式図であり、４は粘着シート、４０、４１は粘着剤層、Ｓ１は基材、Ｒ１，Ｒ２ははく離ライナーを示す。 FIG. 4 is a schematic cross-sectional view showing another embodiment of the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention. Indicates a peeling liner.
　図４に示すように、粘着シート４は、はく離ライナーＲ１と、粘着剤層４０と、基材Ｓ１と、粘着剤層４１と、はく離ライナーＲ２が、この順で積層された積層構造を有する。粘着シート４は、半導体チップやＬＥＤチップなどの小型の電子部品を回路基板などの実装基板に実装する加工技術に使用されるものである。粘着シート４において、粘着剤層４０は本発明の粘着剤層で構成されるものであり、仮固定材に配置された電子部品を分離し、分離された前記電子部品を受け取るために好適に使用されるものである。粘着シート４において、基材Ｓ１は、電子部品を受け取る際の安定性や取り扱い性を向上させるものである。粘着シート４において、粘着剤層４１は、粘着剤層４０と共に、電子部品を受け取る際の衝撃吸収性を調整しうるものである。粘着剤層４１は、本発明の粘着剤層で構成されるものであってもよく、本発明の粘着剤層以外の粘着剤層で構成されるものであってもよい。はく離ライナーＲ１は、使用前に粘着剤層４０から剥離され、露出した粘着面４０ａで電子部品を受け取るものである。はく離ライナーＲ２を剥離することにより露出する粘着面４１ｂは、転写用基板を構成する基材、又はキャリア基板などに貼り合わされる。
　以下、各構成について、説明する。 As shown in FIG. 4, the pressure-sensitive adhesive sheet 4 has a laminated structure in which a peeling liner R1, a pressure-sensitive adhesive layer 40, a base material S1, a pressure-sensitive adhesive layer 41, and a peeling liner R2 are laminated in this order. The adhesive sheet 4 is used in a processing technique for mounting a small electronic component such as a semiconductor chip or an LED chip on a mounting substrate such as a circuit board. In the pressure-sensitive adhesive sheet 4, the pressure-sensitive adhesive layer 40 is composed of the pressure-sensitive adhesive layer of the present invention, and is suitably used for separating electronic parts arranged on the temporary fixing material and receiving the separated electronic parts. Is to be done. In the pressure-sensitive adhesive sheet 4, the base material S1 improves stability and handleability when receiving electronic components. In the pressure-sensitive adhesive sheet 4, the pressure-sensitive adhesive layer 41, together with the pressure-sensitive adhesive layer 40, can adjust the impact absorption when receiving electronic components. The pressure-sensitive adhesive layer 41 may be composed of the pressure-sensitive adhesive layer of the present invention, or may be composed of a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention. The peeling liner R1 is peeled off from the pressure-sensitive adhesive layer 40 before use, and receives electronic components on the exposed pressure-sensitive adhesive surface 40a. The adhesive surface 41b exposed by peeling off the peeling liner R2 is attached to a substrate constituting a transfer substrate, a carrier substrate, or the like.
Hereinafter, each configuration will be described.
（本発明の粘着剤層）
　本発明の粘着剤層は、下記条件Ｔ1、Ｔ2における前記粘着面に対する水の接触角θ1、θ2の変位Ｒが５°以下である。
　Ｔ1：２３℃環境下で前記はく離ライナーを剥離した直後
　Ｔ2：２３℃環境下で前記はく離ライナーを剥離し、前記粘着面を大気環境下で２時間曝露後
　θ1：Ｔ1での前記粘着面の水接触角（°）
　θ2：Ｔ2での前記粘着面の水接触角（°）
　変位Ｒ（°）＝θ2－θ1 (Adhesive layer of the present invention)
The pressure-sensitive adhesive layer of the present invention has a displacement R of water contact angles θ 1 and θ 2 with respect to the pressure-sensitive adhesive surface under the following conditions T 1 and T 2 of 5 ° or less.
Immediately after peeling off the peeling liner in a T 1 : 23 ° C environment T 2 : After peeling off the peeling liner in a 23 ° C environment and exposing the adhesive surface to an atmospheric environment for 2 hours θ 1 : The above in T 1 Water contact angle of adhesive surface (°)
θ 2 : Water contact angle (°) of the adhesive surface at T 2 .
Displacement R (°) = θ 2 -θ 1
　本発明の粘着剤層において、前記変位Ｒが５°以下であるという構成は、はく離ライナーを剥離後に大気環境下に曝露された状態でも、粘着面の濡れ性が経時的に変化しにくく、電子部品を搬送する際の位置ずれや脱落を防止できるという点で、好適である。電子部品を搬送する際の位置ずれや脱落を防止できるという点で、前記変位Ｒは、４．５°以下が好ましく、より好ましく４°以下、さらに好ましくは３．５°以下であり、３°以下、２．５°以下、２°以下、又は１．５°以下であってもよい。 In the pressure-sensitive adhesive layer of the present invention, the configuration in which the displacement R is 5 ° or less makes it difficult for the wettability of the pressure-sensitive adhesive surface to change over time even when the peeling liner is exposed to the atmospheric environment after peeling, and the electrons It is preferable in that it can prevent misalignment and dropout when transporting parts. The displacement R is preferably 4.5 ° or less, more preferably 4 ° or less, still more preferably 3.5 ° or less, and 3 ° in terms of preventing misalignment and falling off when transporting electronic components. Below, it may be 2.5 ° or less, 2 ° or less, or 1.5 ° or less.
　前記変位Ｒの下限値は、特に限定されないが、前記粘着面を大気環境下で曝露後した場合に粘着面の濡れ性が上昇すると、電子部品を他のキャリア基板や実装基板への転写性が低下する場合がある。電子部品の転写性の観点から、変位Ｒは、－５°以上が好ましく、より好ましくは－４°以上、さらに好ましくは、－３°以上である。 The lower limit of the displacement R is not particularly limited, but when the wettability of the adhesive surface increases when the adhesive surface is exposed to the atmospheric environment, the transferability of the electronic component to another carrier substrate or mounting substrate becomes high. May decrease. From the viewpoint of transferability of electronic components, the displacement R is preferably −5 ° or higher, more preferably -4 ° or higher, and even more preferably -3 ° or higher.
　本発明の粘着剤層において、前記水接触角θ1は、電子部品を搬送する際の位置ずれや脱落を防止できるという点で、１２０°以下が好ましく、１１８°以下がより好ましい。また、前記水接触角θ1は、電子部品の転写性の観点から、１１０°以上が好ましく、１１１°以上がより好ましい。 In the pressure-sensitive adhesive layer of the present invention, the water contact angle θ 1 is preferably 120 ° or less, more preferably 118 ° or less, in that it can prevent misalignment and falling off when transporting electronic components. Further, the water contact angle θ 1 is preferably 110 ° or more, more preferably 111 ° or more, from the viewpoint of transferability of electronic components.
　前記水接触角、及びその変位Ｒは、具体的には、後掲の実施例に記載の方法により測定されるものである。前記水接触角、及び変位Ｒは、本発明の粘着剤層を構成する樹脂組成物（本発明の樹脂組成物）の種類や組成（モノマー組成）や架橋剤の種類や量、粘着剤層の厚みなどにより調整することができる。 The water contact angle and its displacement R are specifically measured by the method described in the examples below. The water contact angle and the displacement R are the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer of the present invention, the type and amount of the cross-linking agent, and the pressure-sensitive adhesive layer. It can be adjusted according to the thickness and the like.
　本発明の粘着剤層の前記粘着面に対する下記条件の鉄球落下試験による粘着剤層の沈み込み深さの前記粘着剤層の厚さに対する割合（沈み込み深さ／厚さ×１００）は、１５％以上であることが好ましい。
　鉄球落下試験：１ｇの鉄球を高さ１ｍから粘着面に自由落下させる。 The ratio of the sinking depth of the pressure-sensitive adhesive layer to the thickness of the pressure-sensitive adhesive layer (subduction depth / thickness × 100) by the iron ball drop test under the following conditions with respect to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer of the present invention is determined. It is preferably 15% or more.
Iron ball drop test: 1 g of iron ball is freely dropped from a height of 1 m onto the adhesive surface.
　前記割合（沈み込み深さ／厚さ×１００）が、１５％以上であるという構成は、本発明の粘着剤層が優れた衝撃吸収性を示し、電子部品を受け取る際に、破損したり、跳ねて位置ずれが生じたり、裏返るなどの不具合が生じることを防止できる点で、好ましい。本発明の粘着剤層が優れた衝撃吸収性の観点から、前記割合は、より好ましくは１７％以上であり、さらに好ましくは２０％以上であり、特に好ましくは３０％以上である。また、他のキャリア基板や実装基板への電子部品の転写性の観点から、前記割合（沈み込み深さ／厚さ×１００）は、好ましくは９５％以下、より好ましくは９０％以下である。 The configuration in which the ratio (sinking depth / thickness × 100) is 15% or more shows that the pressure-sensitive adhesive layer of the present invention exhibits excellent shock absorption, and is damaged or damaged when receiving an electronic component. It is preferable in that it can prevent problems such as bouncing and misalignment or turning over. From the viewpoint of excellent shock absorption of the pressure-sensitive adhesive layer of the present invention, the ratio is more preferably 17% or more, further preferably 20% or more, and particularly preferably 30% or more. Further, from the viewpoint of transferability of the electronic component to another carrier substrate or mounting substrate, the ratio (sinking depth / thickness × 100) is preferably 95% or less, more preferably 90% or less.
　鉄球落下試験は、具体的には、後掲の実施例に記載の方法により測定されるものである。鉄球落下試験における前記割合（沈み込み深さ／厚さ×１００）は、本発明の粘着剤層を構成する樹脂組成物（本発明の樹脂組成物）の種類や組成（モノマー組成）や架橋剤の種類や量、粘着剤層の厚みなどにより調整することができる。 Specifically, the iron ball drop test is measured by the method described in the examples below. The ratio (sinking depth / thickness × 100) in the iron ball drop test is the type and composition (monomer composition) and crosslinking of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer of the present invention. It can be adjusted according to the type and amount of the agent, the thickness of the adhesive layer, and the like.
　前記粘着剤層の前記粘着面のステンレスに対する常温での初期粘着力Ｆ0と、放射線照射後の前記粘着剤層の前記粘着面のステンレスに対する常温での粘着力Ｆ1において、下記式で示される放射線照射時粘着力の変化率が９５％以下であることが好ましい。

　放射線照射時粘着力の変化率（％）＝（Ｆ0－Ｆ1）／Ｆ0×１００ The initial adhesive force F 0 of the adhesive layer to the stainless steel on the adhesive surface and the adhesive force F 1 of the adhesive layer to the stainless steel on the adhesive surface after irradiation are represented by the following formulas. It is preferable that the rate of change in the adhesive force during irradiation is 95% or less.

Rate of change in adhesive strength during irradiation (%) = (F 0 -F 1 ) / F 0 x 100
　前記放射線照射時粘着力の変化率が９５％以下であるという構成は、前記変位Ｒを５°以下に調整し、はく離ライナーを剥離後に大気環境下に曝露された状態でも、粘着面の濡れ性が経時的に変化しにくく、電子部品を搬送する際の位置ずれや脱落を防止できるという点で、好適である。前記変位Ｒを５°以下に調整するという観点から、前記放射線照射時粘着力の変化率は、より好ましくは９４％以下、さらに好ましくは９３％以下であり、９０％以下であってもよい。また、他のキャリア基板や実装基板への電子部品の転写性の観点から、前記放射線照射時粘着力の変化率は、好ましくは１％以上、より好ましくは５％以上である。 In the configuration in which the rate of change of the adhesive force during irradiation is 95% or less, the displacement R is adjusted to 5 ° or less, and the wettability of the adhesive surface is obtained even when the peeling liner is peeled off and then exposed to the air environment. Is preferable in that it does not easily change over time and can prevent misalignment and dropout when transporting electronic components. From the viewpoint of adjusting the displacement R to 5 ° or less, the rate of change in the adhesive force during irradiation is more preferably 94% or less, further preferably 93% or less, and may be 90% or less. Further, from the viewpoint of transferability of electronic components to other carrier substrates and mounting substrates, the rate of change in the adhesive force during irradiation is preferably 1% or more, more preferably 5% or more.
　本発明の粘着剤層の前記粘着面のステンレスに対する常温での初期粘着力Ｆ0は、０．１Ｎ／２０ｍｍ以上であることが好ましい。前記初期粘着力Ｆ0が０．１Ｎ／２０ｍｍ以上であるという構成は、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる点で好ましい。電子部品の位置ずれや裏返りを抑制できる点で、前記初期粘着力Ｆ0が０．２Ｎ／２０ｍｍ以上がより好ましく、０．３Ｎ／２０ｍｍ以上であってもよい。前記初期粘着力Ｆ0の上限は、特に限定されないが、受け取った電子部品の別のキャリア基板や実装基板への転写性の観点から、好ましくは７．５Ｎ／２０ｍｍ以下、より好ましくは７Ｎ／２０ｍｍ以下、さらに好ましくは６．５Ｎ／２０ｍｍ以下である。なお、初期粘着力は、放射線照射前の粘着力である。 The initial adhesive force F 0 of the adhesive layer of the present invention with respect to stainless steel on the adhesive surface is preferably 0.1 N / 20 mm or more at room temperature. The configuration in which the initial adhesive force F 0 is 0.1 N / 20 mm or more is preferable in that it is possible to suppress misalignment and flipping due to bouncing of electronic components at the time of collision. The initial adhesive force F 0 is more preferably 0.2 N / 20 mm or more, and may be 0.3 N / 20 mm or more in terms of suppressing misalignment and turning over of the electronic component. The upper limit of the initial adhesive force F 0 is not particularly limited, but is preferably 7.5 N / 20 mm or less, more preferably 7 N / 20 mm, from the viewpoint of transferability of the received electronic component to another carrier substrate or mounting substrate. Below, it is more preferably 6.5 N / 20 mm or less. The initial adhesive strength is the adhesive strength before irradiation.
　本発明の粘着剤層の前記粘着面の放射線照射後のステンレスに対する常温での粘着力Ｆ1は、０．０１Ｎ／２０ｍｍ以上であることが好ましい。前記放射線照射後粘着力Ｆ1が０．０１Ｎ／２０ｍｍ以上であるという構成は、次の工程などへ搬送する際に受け取った電子部品の位置ずれを抑制し保持する点で好ましく、前記放射線照射後粘着力Ｆ1は、０．０３Ｎ／２０ｍｍ以上がより好ましく、０．０５Ｎ／２０ｍｍ以上がさらに好ましい。また、前記放射線照射後粘着力Ｆ1は、受け取った電子部品の別のキャリア基板や実装基板への転写性の観点から、好ましくは２Ｎ／２０ｍｍ以下、より好ましくは１．５Ｎ／２０ｍｍ以下である。なお、放射線照射とは、高圧水銀灯の紫外線（特定波長：３６５ｎｍ、積算光量：４６０ｍＪ／ｃｍ2）の照射を意味する。 The adhesive force F 1 of the pressure-sensitive adhesive layer of the present invention to stainless steel after irradiation of the pressure-sensitive adhesive layer is preferably 0.01 N / 20 mm or more at room temperature. The configuration in which the adhesive force F 1 after irradiation is 0.01 N / 20 mm or more is preferable in that it suppresses and retains the misalignment of the received electronic component when it is transported to the next step or the like, and after the irradiation. The adhesive strength F 1 is more preferably 0.03 N / 20 mm or more, and further preferably 0.05 N / 20 mm or more. Further, the adhesive force F 1 after irradiation is preferably 2N / 20 mm or less, more preferably 1.5N / 20 mm or less, from the viewpoint of transferability of the received electronic component to another carrier substrate or mounting substrate. .. The radiation irradiation means irradiation of ultraviolet rays (specific wavelength: 365 nm, integrated light amount: 460 mJ / cm 2 ) of a high-pressure mercury lamp.
　上記初期粘着力Ｆ0、放射線照射後粘着力Ｆ1、及びその変化率は、例えば、後掲の実施例に記載の粘着力測定により測定することができるものであり、本発明の粘着剤層を構成する樹脂組成物（本発明の樹脂組成物）の種類や組成（モノマー組成）や架橋剤の種類や量、粘着剤層の厚み、光重合開始剤の種類や量などにより調整することができる。 The initial adhesive force F 0 , the adhesive force F 1 after irradiation, and the rate of change thereof can be measured by, for example, the adhesive force measurement described in Examples described later, and the adhesive layer of the present invention can be measured. It can be adjusted according to the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the above, the type and amount of the cross-linking agent, the thickness of the pressure-sensitive adhesive layer, the type and amount of the photopolymerization initiator, and the like. can.
　本発明の粘着剤層の厚みは１μｍ以上５００μｍ以下であることが好ましい。本発明の粘着剤層の厚みが１μｍ以上であるという構成は、粘着剤層の粘着剤ヌケ等を防ぐという点で好ましい。電子部品の衝突による衝撃吸収性の観点から、本発明の粘着剤層の厚みは５μｍ以上が好ましく、１０μｍ以上、２０μｍ以上、又は３０μｍ以上であってもよい。本発明の粘着剤層の厚みが５００μｍ以下であるという構成は、電子部品の別のキャリア基板や実装基板へ転写する際の転写性の観点から好ましく、４００μｍ以下、又は３００μｍ以下であってもよい。なお、本発明の粘着剤層が、別の粘着剤層との積層構造である場合、前記粘着剤層の厚みは、積層構造全体の厚みである。 The thickness of the pressure-sensitive adhesive layer of the present invention is preferably 1 μm or more and 500 μm or less. The configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 1 μm or more is preferable from the viewpoint of preventing the pressure-sensitive adhesive layer from being lost. From the viewpoint of shock absorption due to collision of electronic components, the thickness of the pressure-sensitive adhesive layer of the present invention is preferably 5 μm or more, and may be 10 μm or more, 20 μm or more, or 30 μm or more. The configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 500 μm or less is preferable from the viewpoint of transferability when transferring to another carrier substrate or mounting substrate of an electronic component, and may be 400 μm or less or 300 μm or less. .. When the pressure-sensitive adhesive layer of the present invention has a laminated structure with another pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer is the thickness of the entire laminated structure.
　本発明の粘着剤層が、別の粘着剤層との積層構造である場合、別の粘着剤層を含まない本発明の粘着剤層の厚みは、１μｍ以上５０μｍ以下であることが好ましい。本発明の粘着剤層の厚みが１μｍ以上であるという構成は、粘着面の濡れ性の変化を抑制する観点で好ましく、２μｍ以上が好ましく、５μｍ以上がより好ましい。また、本発明の粘着剤層の厚みが５０μｍ以下であるという構成は、電子部品の別のキャリア基板や実装基板へ転写する際の転写性の観点から好ましく、４０μｍ以下、３０μｍ以下であってもよい。 When the pressure-sensitive adhesive layer of the present invention has a laminated structure with another pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer of the present invention that does not include another pressure-sensitive adhesive layer is preferably 1 μm or more and 50 μm or less. The structure in which the thickness of the pressure-sensitive adhesive layer of the present invention is 1 μm or more is preferable from the viewpoint of suppressing changes in the wettability of the pressure-sensitive adhesive surface, preferably 2 μm or more, and more preferably 5 μm or more. Further, the configuration in which the thickness of the pressure-sensitive adhesive layer of the present invention is 50 μm or less is preferable from the viewpoint of transferability when transferring to another carrier substrate or mounting substrate of an electronic component, and even if it is 40 μm or less or 30 μm or less. good.
　本発明の粘着剤層の常温における初期プローブタック値は、５Ｎ／ｃｍ2以上４２Ｎ／ｃｍ2以下であることが好ましい。前記初期プローブタック値が５Ｎ／ｃｍ2以上という構成は、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる点で好ましい。電子部品の位置ずれや裏返りを抑制できる点で、上記初期プローブタック値は、８Ｎ／ｃｍ2以上が好ましく、１０Ｎ／ｃｍ2以上、又は１２Ｎ／ｃｍ2以上であってもよい。また、前記プローブタック値が４２Ｎ／ｃｍ2以下であるという構成は、受け取った電子部品への粘着剤の固着、糊残りを防ぐ観点から好ましく、４０Ｎ／ｃｍ2以下、又は３５Ｎ／ｃｍ2以下であってもよい。なお、初期プローブタック値とは、はく離ライナーを剥離した直後の粘着面のプローブタック値である。 The initial probe tack value of the pressure-sensitive adhesive layer of the present invention at room temperature is preferably 5 N / cm 2 or more and 42 N / cm 2 or less. The configuration in which the initial probe tack value is 5 N / cm 2 or more can sufficiently absorb the impact caused by the collision with the adhesive layer of the electronic component, and can suppress the displacement and inside out due to the bouncing of the electronic component at the time of collision. Is preferable. The initial probe tack value is preferably 8 N / cm 2 or more, and may be 10 N / cm 2 or more, or 12 N / cm 2 or more, from the viewpoint of suppressing misalignment and turning over of electronic components. Further, the configuration in which the probe tack value is 42 N / cm 2 or less is preferable from the viewpoint of preventing the adhesive from sticking to the received electronic component and the adhesive residue, and is 40 N / cm 2 or less or 35 N / cm 2 or less. There may be. The initial probe tack value is the probe tack value of the adhesive surface immediately after the peeling liner is peeled off.
　本発明の粘着剤層の前記初期プローブタック値に対する粘着面を大気環境下で２時間曝露後のプローブタック値の変化率は、－１４％を超えることが好ましい。前記プローブタック値の変化率が－１４％を超えるという構成は、搬送時の電子部品の脱落や位置ずれを抑制できる点で好ましい。電子部品の脱落や位置ずれを抑制できる点で、上記プローブタック値の変化率は、－１０％以上が好ましく、－８％以上がより好ましい。また、前記プローブタック値の変化率の上限値は、特に限定されないが、受け取った電子部品を別のキャリア基板や実装基板へ転写する際の転写性の観点から、１０％以下が好ましく、５％以下が好ましい。なお、大気環境下で２時間曝露後のプローブタック値は、はく離ライナーを剥離した後に、大気環境下で２時間曝露した後の粘着面のプローブタック値である。また、前記プローブタック値の変化率は、以下の式で求められるものである。

　Ｐ0：初期プローブタック値
　Ｐ1：大気環境下で２時間曝露後のプローブタック値
　プローブタック値の変化率＝（Ｐ1－Ｐ0）／Ｐ0×１００ The rate of change of the probe tack value after exposing the adhesive surface of the pressure-sensitive adhesive layer of the present invention to the initial probe tack value for 2 hours in an air environment is preferably more than -14%. The configuration in which the rate of change of the probe tack value exceeds -14% is preferable in that it is possible to suppress the dropping and misalignment of electronic components during transportation. The rate of change of the probe tack value is preferably −10% or more, more preferably −8% or more, in that the dropping or misalignment of the electronic component can be suppressed. The upper limit of the rate of change of the probe tack value is not particularly limited, but is preferably 10% or less, preferably 5%, from the viewpoint of transferability when transferring the received electronic component to another carrier substrate or mounting substrate. The following is preferable. The probe tack value after exposure to 2 hours in an air environment is the probe tack value of the adhesive surface after peeling off the peeling liner and then exposing to 2 hours in an air environment. Further, the rate of change of the probe tack value is obtained by the following formula.

P 0 : Initial probe tack value P 1 : Probe tack value after exposure for 2 hours in the atmospheric environment Change rate of probe tack value = (P 1 -P 0 ) / P 0 × 100
　上記初期プローブタック値、大気環境下で２時間曝露後のプローブタック値、その変化率は、具体的には、後掲の実施例に記載の方法により測定することができるものであり、本発明の粘着剤層を構成する樹脂組成物（本発明の樹脂組成物）の種類や組成（モノマー組成）や架橋剤の種類や量、粘着剤層の厚みなどにより調整することができる。 The initial probe tack value, the probe tack value after exposure to the air environment for 2 hours, and the rate of change thereof can be specifically measured by the method described in Examples described later, and the present invention can be used. It can be adjusted by the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer, the type and amount of the cross-linking agent, the thickness of the pressure-sensitive adhesive layer, and the like.
　本発明の粘着剤層に対する下記条件の熱機械分析（ＴＭＡ）による沈み込み深さの前記粘着剤層の厚さに対する割合（沈み込み深さ／厚さ×１００）は１０％以上であることが好ましい。
・熱機械分析（ＴＭＡ）
　プローブ直径：１．０ｍｍ
　モード：針入モード
　押し込み荷重：０．０５Ｎ
　測定雰囲気温度：－４０℃
　押し込み負荷時間：２０分 The ratio of the sinking depth to the thickness of the pressure-sensitive adhesive layer (subduction depth / thickness × 100) by thermomechanical analysis (TMA) under the following conditions for the pressure-sensitive adhesive layer of the present invention is 10% or more. preferable.
・ Thermomechanical analysis (TMA)
Probe diameter: 1.0 mm
Mode: Needle insertion mode Pushing load: 0.05N
Measurement atmosphere temperature: -40 ° C
Pushing load time: 20 minutes
　レーザートランスファー工程においては、光学的な時間スケールで電子部品の転写が完了するため、この時間スケールでの粘着剤の衝撃緩和特性が重要となる。具体的には、光学的な時間スケールとは、レーザー光を掃引する周波数と相関があり、例えば、１００ｋＨｚなどである。１００ｋＨｚの周波数領域の粘着剤物性は、温度時間換算則より－４０℃の低温領域での粘着剤物性に相当するため、この温度域で粘着剤に荷重を掛けたときの変形量が大きいほど衝撃緩和特性が優れていることを意味する。例えば、熱機械分析（ＴＭＡ）で－４０℃において粘着剤層に荷重を掛けた際の上記割合（沈み込み深さ／厚さ×１００）を衝撃緩和特性の指標として用いることが出来る。 In the laser transfer process, the transfer of electronic components is completed on an optical time scale, so the impact mitigation characteristics of the adhesive on this time scale are important. Specifically, the optical time scale correlates with the frequency at which the laser beam is swept, and is, for example, 100 kHz. The physical properties of the pressure-sensitive adhesive in the frequency range of 100 kHz correspond to the physical characteristics of the pressure-sensitive adhesive in the low temperature region of -40 ° C according to the temperature-time conversion rule. It means that the relaxation characteristics are excellent. For example, in thermomechanical analysis (TMA), the above ratio (sinking depth / thickness × 100) when a load is applied to the pressure-sensitive adhesive layer at −40 ° C. can be used as an index of impact mitigation characteristics.
　－４０℃での熱機械分析（ＴＭＡ）における上記割合（沈み込み深さ／厚さ×１００）が１０％以上であるという構成は、粘着剤層を薄くしても、電子部品などの衝突による衝撃を十分に吸収でき、電子部品を損傷や位置ずれなく受け取ることができる点で好ましい。電子部品などの衝突による衝撃を十分に吸収できる点から、当該割合は、１５％以上が好ましく、２０％以上、３０％以上、４０％以上、５０％以上、６０％以上、７０％以上、又は８０％以上であってもよい。受け取った電子部品の別のキャリア基板や実装基板への転写性の観点から、上記割合は、９５％以下が好ましく、９０％以下であってもよい。 The configuration that the above ratio (sinking depth / thickness × 100) in the thermomechanical analysis (TMA) at -40 ° C is 10% or more is due to collision of electronic parts even if the adhesive layer is thinned. It is preferable in that it can sufficiently absorb impact and can receive electronic components without damage or misalignment. From the viewpoint of sufficiently absorbing the impact caused by the collision of electronic parts, the ratio is preferably 15% or more, 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, or. It may be 80% or more. From the viewpoint of transferability of the received electronic component to another carrier substrate or mounting substrate, the above ratio is preferably 95% or less, and may be 90% or less.
　上記割合（沈み込み深さ／厚さ×１００）は、本発明の粘着剤層を構成する樹脂組成物（本発明の樹脂組成物）の種類や組成（モノマー組成）や架橋剤の種類や量、粘着剤層の厚みなどにより調整することができる。 The above ratio (sinking depth / thickness × 100) is the type and composition (monomer composition) of the resin composition (resin composition of the present invention) constituting the pressure-sensitive adhesive layer of the present invention and the type and amount of the cross-linking agent. , It can be adjusted by the thickness of the adhesive layer and the like.
　レーザートランスファー工程においては、光学的な時間スケールで電子部品の転写が完了するため、この時間スケールでの粘着剤の衝撃緩和特性が重要となる。具体的には、光学的な時間スケールとは、レーザー光を掃引する周波数と相関があり、例えば、１００ｋＨｚなどである。時間スケールに換算するとおよそ１０マイクロ秒であり、この時間スケールでの衝撃に対して粘着剤が応答して変形する必要がある。
　本発明の粘着剤層の周波数１００ｋＨｚ、２５℃での貯蔵弾性率（Ｐａ）の常用対数（Ｌｏｇ10Ｇ'）は７．５以下であることが好ましい。前記貯蔵弾性率の常用対数が７．５以下であるという構成は、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる点で好ましい。電子部品の衝突による衝撃吸収性の観点から、前記貯蔵弾性率の常用対数は、７．４以下が好ましく、７．３以下、７．２以下、７．１以下、又は７以下であってもよい。本発明の粘着剤層上に受け取った電子部品を搬送する際に位置がずれるのを防ぐ観点から、上記貯蔵弾性率の常用対数は、４以上が好ましく、５以上であってもよい。 In the laser transfer process, the transfer of electronic components is completed on an optical time scale, so the impact mitigation characteristics of the pressure-sensitive adhesive on this time scale are important. Specifically, the optical time scale correlates with the frequency at which the laser beam is swept, and is, for example, 100 kHz. When converted to a time scale, it is about 10 microseconds, and the adhesive needs to be deformed in response to an impact on this time scale.
The common logarithm (Log 10 G') of the storage elastic modulus (Pa) at a frequency of 100 kHz and 25 ° C. of the pressure-sensitive adhesive layer of the present invention is preferably 7.5 or less. The configuration in which the common logarithm of the storage elastic modulus is 7.5 or less can sufficiently absorb the impact caused by the collision with the pressure-sensitive adhesive layer of the electronic component, and causes the electronic component to be displaced or turned inside out due to the bounce at the time of collision. It is preferable in that it can be suppressed. From the viewpoint of shock absorption due to collision of electronic components, the common logarithm of the storage elastic modulus is preferably 7.4 or less, even if it is 7.3 or less, 7.2 or less, 7.1 or less, or 7 or less. good. From the viewpoint of preventing the position of the received electronic component from shifting on the pressure-sensitive adhesive layer of the present invention, the common logarithm of the storage elastic modulus is preferably 4 or more, and may be 5 or more.
　本発明の粘着剤層の周波数１００ｋＨｚ、２５℃での損失係数（ｔａｎδ）は０．８以上であることが好ましい。前記損失係数が０．８以上であるという構成は、前記粘着剤層が光学的な時間スケールにおいて優れた減衰性を示し、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる点で好ましい。電子部品の衝突による衝撃吸収性の観点から、前記損失係数は、０．９５以上が好ましく、１．２以上であってもよい。本発明の粘着剤層上に受け取った電子部品を搬送する際に位置がずれるのを防ぐ観点から、前記損失係数は、２．８以下が好ましく、２．３以下であってもよい。 The loss coefficient (tan δ) of the pressure-sensitive adhesive layer of the present invention at a frequency of 100 kHz and 25 ° C. is preferably 0.8 or more. In the configuration where the loss coefficient is 0.8 or more, the pressure-sensitive adhesive layer exhibits excellent damping property on an optical time scale, and can sufficiently absorb the impact due to collision with the pressure-sensitive adhesive layer such as an electronic component. It is preferable in that it can suppress misalignment and flipping due to bouncing of electronic parts at the time of collision. From the viewpoint of shock absorption due to collision of electronic components, the loss coefficient is preferably 0.95 or more, and may be 1.2 or more. From the viewpoint of preventing the position of the received electronic component from shifting on the pressure-sensitive adhesive layer of the present invention, the loss coefficient is preferably 2.8 or less, and may be 2.3 or less.
　１００ｋＨｚの周波数領域の粘着剤物性は、温度時間換算則より－４０℃の低温領域での粘着剤物性に相当するため、この温度域での粘着剤の衝撃緩和特性も同様に重要である。
　本発明の粘着剤層の周波数１Ｈｚ、－４０℃での貯蔵弾性率（Ｐａ）の常用対数（Ｌｏｇ10Ｇ'）は８．５以下であることが好ましい。前記貯蔵弾性率の常用対数が８．５以下であるという構成は、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる点で好ましい。電子部品の衝突による衝撃吸収性の観点から、前記貯蔵弾性率の常用対数は、８．４以下が好ましく、８．３以下、８．２以下、８．１以下、又は８以下であってもよい。本発明の粘着剤層上に受け取った電子部品を搬送する際に位置がずれるのを防ぐ観点から、上記貯蔵弾性率の常用対数は、４以上が好ましく、５以上であってもよい。 Since the physical properties of the pressure-sensitive adhesive in the frequency region of 100 kHz correspond to the physical characteristics of the pressure-sensitive adhesive in the low temperature region of −40 ° C. according to the temperature-time conversion rule, the impact mitigation characteristics of the pressure-sensitive adhesive in this temperature range are also important.
The common logarithm (Log 10 G') of the storage elastic modulus (Pa) at a frequency of 1 Hz and −40 ° C. of the pressure-sensitive adhesive layer of the present invention is preferably 8.5 or less. The configuration in which the common logarithm of the storage elastic modulus is 8.5 or less can sufficiently absorb the impact caused by the collision with the adhesive layer of the electronic component, and causes the electronic component to be displaced or turned inside out due to the bounce at the time of collision. It is preferable in that it can be suppressed. From the viewpoint of shock absorption due to collision of electronic components, the common logarithm of the storage elastic modulus is preferably 8.4 or less, even if it is 8.3 or less, 8.2 or less, 8.1 or less, or 8 or less. good. From the viewpoint of preventing the position of the received electronic component from shifting on the pressure-sensitive adhesive layer of the present invention, the common logarithm of the storage elastic modulus is preferably 4 or more, and may be 5 or more.
　本発明の粘着剤層の周波数１Ｈｚ、－４０℃での損失係数（ｔａｎδ）は０．１以上であることが好ましい。前記損失係数が０．１以上であるという構成は、前記粘着剤層が低温において優れた減衰性を示し、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる点で好ましい。電子部品の衝突による衝撃吸収性の観点から、前記損失係数は、０．２以上が好ましく、０．３以上、０．４以上、又は０．５以上であってもよい。粘着シート上に受け取った電子部品を搬送する際に位置がずれるのを防ぐ観点から、前記損失係数は、２．２以下が好ましく、１．７以下であってもよい。 The loss coefficient (tan δ) of the pressure-sensitive adhesive layer of the present invention at a frequency of 1 Hz and −40 ° C. is preferably 0.1 or more. The configuration in which the loss coefficient is 0.1 or more shows that the pressure-sensitive adhesive layer exhibits excellent damping properties at low temperatures, can sufficiently absorb the impact due to collision with the pressure-sensitive adhesive layer such as electronic components, and can sufficiently absorb electrons at the time of collision. It is preferable in that it can suppress misalignment and turning over due to the bouncing of parts. From the viewpoint of shock absorption due to collision of electronic components, the loss coefficient is preferably 0.2 or more, and may be 0.3 or more, 0.4 or more, or 0.5 or more. From the viewpoint of preventing the position of the received electronic component from shifting on the pressure-sensitive adhesive sheet, the loss coefficient is preferably 2.2 or less, and may be 1.7 or less.
　上記貯蔵弾性率の常用対数、損失係数は、例えば、動的粘弾性測定により測定することができるものであり、本発明の粘着剤層を構成する樹脂組成物（本発明の樹脂組成物）の種類や組成（モノマー組成）や架橋剤の種類や量などにより調整することができる。 The common logarithm and loss coefficient of the storage elastic modulus can be measured by, for example, dynamic viscoelasticity measurement, and the resin composition constituting the pressure-sensitive adhesive layer of the present invention (the resin composition of the present invention). It can be adjusted according to the type and composition (monomer composition) and the type and amount of the cross-linking agent.
（本発明の樹脂組成物）
　本発明の粘着剤層を構成する樹脂組成物（粘着剤組成物）としては、特に限定されないが、例えば、アクリル系粘着剤、ゴム系粘着剤、ビニルアルキルエーテル系粘着剤、シリコーン系粘着剤、ポリエステル系粘着剤、ポリアミド系粘着剤、ウレタン系粘着剤、フッ素系粘着剤、エポキシ系粘着剤などが挙げられる。粘着剤層を構成する樹脂組成物としては、アクリル系粘着剤、シリコーン系粘着剤が好ましく、中でも、本発明の粘着剤層の上記所望の各種物性、特に、前記変位Ｒを５°以下に調整する粘着剤の設計のしやすさ、透明性、粘着性、コスト等の点より、アクリル系粘着剤が好ましい。つまり、本発明の粘着剤層は、アクリル系粘着剤組成物から構成されたアクリル系粘着剤層であることが好ましい。上記粘着剤は、単独で又は２種以上組み合わせて用いることができる。 (Resin composition of the present invention)
The resin composition (adhesive composition) constituting the pressure-sensitive adhesive layer of the present invention is not particularly limited, and for example, an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and the like. Examples thereof include polyester-based adhesives, polyamide-based adhesives, urethane-based adhesives, fluorine-based adhesives, and epoxy-based adhesives. As the resin composition constituting the pressure-sensitive adhesive layer, an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive are preferable, and among them, the desired various physical properties of the pressure-sensitive adhesive layer of the present invention, particularly the displacement R is adjusted to 5 ° or less. Acrylic adhesives are preferable from the viewpoints of ease of design, transparency, adhesiveness, cost, and the like. That is, the pressure-sensitive adhesive layer of the present invention is preferably an acrylic pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive composition. The above-mentioned pressure-sensitive adhesive can be used alone or in combination of two or more.
　上記アクリル系粘着剤組成物は、ベースポリマーとしてアクリル系ポリマーを含有する。上記アクリル系ポリマーは、ポリマーを構成するモノマー成分として、アクリル系モノマー（分子中に（メタ）アクリロイル基を有するモノマー）を含むポリマーである。上記アクリル系ポリマーは、ポリマーを構成するモノマー成分として（メタ）アクリル酸アルキルエステルを含むポリマーであることが好ましい。なお、アクリル系ポリマーは、単独で又は２種以上組み合わせて用いることができる。 The acrylic pressure-sensitive adhesive composition contains an acrylic polymer as a base polymer. The acrylic polymer is a polymer containing an acrylic monomer (a monomer having a (meth) acryloyl group in the molecule) as a monomer component constituting the polymer. The acrylic polymer is preferably a polymer containing a (meth) acrylic acid alkyl ester as a monomer component constituting the polymer. The acrylic polymer can be used alone or in combination of two or more.
　本発明の粘着剤層を形成する粘着剤組成物は、いずれの形態であってもよい。例えば、粘着剤組成物は、エマルジョン型、溶剤型（溶液型）、活性エネルギー線硬化型、熱溶融型（ホットメルト型）などであってもよい。中でも、生産性の点、光学特性や外観性に優れる粘着剤層が得やすい点より、溶剤型、活性エネルギー線硬化型の粘着剤組成物が好ましい。特に、電子部品の衝突による衝撃を吸収し、電子部品の位置ずれや裏返りを抑制できる観点から、溶剤型の粘着剤組成物が好ましい。 The pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer of the present invention may be in any form. For example, the pressure-sensitive adhesive composition may be an emulsion type, a solvent type (solution type), an active energy ray curing type, a heat melting type (hot melt type), or the like. Above all, a solvent-type or active energy ray-curable pressure-sensitive adhesive composition is preferable because it is easy to obtain a pressure-sensitive adhesive layer having excellent productivity, optical properties and appearance. In particular, a solvent-type pressure-sensitive adhesive composition is preferable from the viewpoint of absorbing the impact caused by the collision of the electronic components and suppressing the displacement and turning over of the electronic components.
　つまり、本発明の粘着剤層は、アクリル系ポリマーをベースポリマーとして含有するアクリル系粘着剤層であり、溶剤型のアクリル系粘着剤組成物により形成されることが好ましい。 That is, the pressure-sensitive adhesive layer of the present invention is an acrylic-based pressure-sensitive adhesive layer containing an acrylic-based polymer as a base polymer, and is preferably formed by a solvent-type acrylic pressure-sensitive adhesive composition.
　上記活性エネルギー線としては、例えば、α線、β線、γ線、中性子線、電子線などの電離性放射線や、紫外線などが挙げられ、特に、紫外線が好ましい。即ち、上記活性エネルギー線硬化型の粘着剤組成物は、紫外線硬化型の粘着剤組成物が好ましい。 Examples of the active energy rays include ionizing radiation such as α rays, β rays, γ rays, neutron rays, and electron beams, ultraviolet rays, and the like, and ultraviolet rays are particularly preferable. That is, the active energy ray-curable pressure-sensitive adhesive composition is preferably an ultraviolet-curable pressure-sensitive adhesive composition.
　上記アクリル系粘着剤層を形成する粘着剤組成物（アクリル系粘着剤組成物）としては、例えば、アクリル系ポリマーを必須成分とするアクリル系粘着剤組成物、又は、アクリル系ポリマーを構成する単量体（モノマー）の混合物（「モノマー混合物」と称する場合がある）若しくはその部分重合物を必須成分とするアクリル系粘着剤組成物などが挙げられる。前者としては、例えば、いわゆる溶剤型のアクリル系粘着剤組成物などが挙げられる。また。後者としては、例えば、いわゆる活性エネルギー線硬化型のアクリル系粘着剤組成物などが挙げられる。上記「モノマー混合物」とは、ポリマーを構成するモノマー成分を含む混合物を意味する。また、上記「部分重合物」とは、「プレポリマー」と称する場合もあり、上記モノマー混合物中のモノマー成分のうちの１又は２以上のモノマー成分が部分的に重合している組成物を意味する。 The pressure-sensitive adhesive composition (acrylic pressure-sensitive adhesive composition) for forming the acrylic pressure-sensitive adhesive layer is, for example, an acrylic pressure-sensitive adhesive composition containing an acrylic-based polymer as an essential component, or a simple material constituting the acrylic-based polymer. Examples thereof include a mixture of weights (monomers) (sometimes referred to as a "monomer mixture") or an acrylic pressure-sensitive adhesive composition containing a partial polymer thereof as an essential component. Examples of the former include so-called solvent-type acrylic pressure-sensitive adhesive compositions. Also. Examples of the latter include so-called active energy ray-curable acrylic pressure-sensitive adhesive compositions. The above-mentioned "monomer mixture" means a mixture containing a monomer component constituting a polymer. Further, the above-mentioned "partial polymer" may also be referred to as a "prepolymer", and means a composition in which one or more of the monomer components in the monomer mixture are partially polymerized. do.
　上記アクリル系ポリマーは、アクリル系モノマーを必須のモノマー成分（単量体成分）として構成（形成）された重合体である。上記アクリル系ポリマーは、（メタ）アクリル酸アルキルエステルを必須のモノマー成分として構成（形成）された重合体であることが好ましい。すなわち、上記アクリル系ポリマーは、構成単位として、（メタ）アクリル酸アルキルエステルを含むことが好ましい。本明細書において、「（メタ）アクリル」とは、「アクリル」及び／又は「メタクリル」（「アクリル」及び「メタクリル」のうち、いずれか一方又は両方）を表し、他も同様である。なお、上記アクリル系ポリマーは、１種又は２種以上のモノマー成分により構成される。 The acrylic polymer is a polymer composed (formed) of an acrylic monomer as an essential monomer component (monomer component). The acrylic polymer is preferably a polymer composed (formed) of a (meth) acrylic acid alkyl ester as an essential monomer component. That is, the acrylic polymer preferably contains (meth) acrylic acid alkyl ester as a constituent unit. As used herein, "(meth) acrylic" refers to "acrylic" and / or "methacrylic" (either or both of "acrylic" and "methacrylic"), and so on. The acrylic polymer is composed of one kind or two or more kinds of monomer components.
　必須のモノマー成分としての上記（メタ）アクリル酸アルキルエステルとしては、直鎖又は分岐鎖状のアルキル基を有する（メタ）アクリル酸アルキルエステルが好ましく挙げられる。なお、（メタ）アクリル酸アルキルエステルは、単独で又は２種以上組み合わせて用いることができる。 As the above-mentioned (meth) acrylic acid alkyl ester as an essential monomer component, a (meth) acrylic acid alkyl ester having a linear or branched-chain alkyl group is preferably mentioned. The (meth) acrylic acid alkyl ester can be used alone or in combination of two or more.
　直鎖又は分岐鎖状のアルキル基を有する（メタ）アクリル酸アルキルエステルとしては、特に限定されないが、例えば、（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸プロピル、（メタ）アクリル酸イソプロピル、（メタ）アクリル酸ｎ－ブチル、（メタ）アクリル酸イソブチル、（メタ）アクリル酸ｓ－ブチル、（メタ）アクリル酸ｔ－ブチル、（メタ）アクリル酸ペンチル、（メタ）アクリル酸イソペンチル、（メタ）アクリル酸ヘキシル、（メタ）アクリル酸ヘプチル、（メタ）アクリル酸オクチル、（メタ）アクリル酸２－エチルヘキシル、（メタ）アクリル酸イソオクチル、（メタ）アクリル酸ノニル、（メタ）アクリル酸イソノニル、（メタ）アクリル酸デシル、（メタ）アクリル酸イソデシル、（メタ）アクリル酸ウンデシル、（メタ）アクリル酸ドデシル（（メタ）アクリル酸ラウリル）、（メタ）アクリル酸トリデシル、（メタ）アクリル酸テトラデシル、（メタ）アクリル酸ペンタデシル、（メタ）アクリル酸ヘキサデシル、（メタ）アクリル酸ヘプタデシル、（メタ）アクリル酸オクタデシル（ステアリル（メタ）アクリレート）、イソステアリル（メタ）アクリレート、（メタ）アクリル酸ノナデシル、（メタ）アクリル酸エイコシルなどの炭素数が１～２０の直鎖又は分岐鎖状のアルキル基を有する（メタ）アクリル酸アルキルエステルが挙げられる。中でも、上記直鎖又は分岐鎖状のアルキル基を有する（メタ）アクリル酸アルキルエステルは、炭素数が４～１８の直鎖又は分岐鎖状のアルキル基を有する（メタ）アクリル酸アルキルエステルが好ましく、より好ましくはアクリル酸２－エチルヘキシル（２ＥＨＡ）、ｎ－ブチルアクリレート（ＢＡ）、ラウリルアクリレート（ＬＡ）、ラウリルメタクリレート（ＬＭＡ）である。また、上記直鎖又は分岐鎖状のアルキル基を有する（メタ）アクリル酸アルキルエステルは、単独で又は２種以上を組み合わせて用いることができる。 The (meth) acrylic acid alkyl ester having a linear or branched alkyl group is not particularly limited, and for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, (. Isopropyl acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, (meth) Isopentyl acrylate, (meth) hexyl acrylate, (meth) heptyl acrylate, (meth) octyl acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, (meth) ) Isononyl acrylate, (meth) decyl acrylate, (meth) isodecyl acrylate, (meth) undecyl acrylate, (meth) dodecyl acrylate ((meth) lauryl acrylate), (meth) tridecyl acrylate, (meth) ) Tetradecyl acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate (stearyl (meth) acrylate), isostearyl (meth) acrylate, (meth) Examples thereof include (meth) acrylic acid alkyl esters having a linear or branched alkyl group having 1 to 20 carbon atoms, such as nonadesyl acrylate and eicosyl (meth) acrylate. Among them, the (meth) acrylic acid alkyl ester having a linear or branched alkyl group is preferably a (meth) acrylic acid alkyl ester having a linear or branched alkyl group having 4 to 18 carbon atoms. , More preferably 2-ethylhexyl acrylate (2EHA), n-butyl acrylate (BA), lauryl acrylate (LA), lauryl methacrylate (LMA). Further, the (meth) acrylic acid alkyl ester having a linear or branched alkyl group can be used alone or in combination of two or more.
　上記アクリル系ポリマーを構成する全モノマー成分（１００重量％）中の、上記（メタ）アクリル酸アルキルエステルの割合は、特に限定されないが、電子部品の衝突による衝撃を吸収し、電子部品の位置ずれや裏返りを抑制できる観点、搬送中の電子部品の脱落や位置ずれを抑制できる観点から、上記諸特性（特に、衝撃収取性）に制御する観点から、８０重量％以上であることが好ましく、８５重量％以上、又は９０重量％以上であってもよい。（メタ）アクリル酸アルキルエステルの割合の上限も、特に限定されないが、９９重量％以下、又は９８重量％以下であってもよい。 The ratio of the (meth) acrylic acid alkyl ester in all the monomer components (100% by weight) constituting the acrylic polymer is not particularly limited, but it absorbs the impact caused by the collision of the electronic component and the position of the electronic component shifts. It is preferably 80% by weight or more from the viewpoint of controlling the above-mentioned characteristics (particularly, impact collection property) from the viewpoint of suppressing the flipping and turning over, and the viewpoint of suppressing the dropping and misalignment of electronic components during transportation. It may be 85% by weight or more, or 90% by weight or more. The upper limit of the ratio of the (meth) acrylic acid alkyl ester is also not particularly limited, but may be 99% by weight or less, or 98% by weight or less.
　上記アクリル系ポリマーは、ポリマーを構成するモノマー成分として、上記（メタ）アクリル酸アルキルエステルとともに、共重合性モノマーを含んでいてもよい。すなわち、上記アクリル系ポリマーは、構成単位として、共重合性モノマーを含んでいてもよい。なお、共重合性モノマーは、単独で又は２種以上を組み合わせて用いることができる。 The acrylic polymer may contain a copolymerizable monomer together with the (meth) acrylic acid alkyl ester as a monomer component constituting the polymer. That is, the acrylic polymer may contain a copolymerizable monomer as a constituent unit. The copolymerizable monomer may be used alone or in combination of two or more.
　上記共重合性モノマーとしては、特に限定されないが、後述の架橋剤や紫外線重合性炭素－炭素二重結合と第２の官能基たるイソシアネート基とを併有するイソシアネート化合物等との反応点になる点、透明性、粘着力の制御等の点より、分子内に水酸基を有するモノマー、分子内にカルボキシル基を有するモノマーが好ましく挙げられる。すなわち、上記アクリル系ポリマーは、構成単位として、分子内に水酸基を有するモノマーを含むことが好ましい。また、上記アクリル系ポリマーは、構成単位として、分子内にカルボキシル基を有するモノマーを含むことが好ましい。 The copolymerizable monomer is not particularly limited, but is a reaction point with a cross-linking agent described later, an isocyanate compound having an ultraviolet polymerizable carbon-carbon double bond and an isocyanate group as a second functional group, and the like. From the viewpoint of transparency, control of adhesive strength and the like, a monomer having a hydroxyl group in the molecule and a monomer having a carboxyl group in the molecule are preferably mentioned. That is, the acrylic polymer preferably contains a monomer having a hydroxyl group in the molecule as a constituent unit. Further, the acrylic polymer preferably contains a monomer having a carboxyl group in the molecule as a constituent unit.
　上記分子内に水酸基を有するモノマーは、分子内（１分子内）に水酸基（ヒドロキシル基）を少なくとも１つ有するモノマーであり、（メタ）アクリロイル基又はビニル基等の不飽和二重結合を有する重合性の官能基を有し、かつヒドロキシル基を有するものが好ましく挙げられる。本明細書においては、上記「分子内に水酸基を有するモノマー」を「水酸基含有モノマー」と称する場合がある。なお、水酸基含有モノマーは、単独で又は２種以上を組み合わせて用いることができる。 The monomer having a hydroxyl group in the molecule is a monomer having at least one hydroxyl group (hydroxyl group) in the molecule (inside one molecule), and is a polymerization having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group. Those having a sex functional group and having a hydroxyl group are preferably mentioned. In the present specification, the above-mentioned "monomer having a hydroxyl group in the molecule" may be referred to as "hydroxyl group-containing monomer". The hydroxyl group-containing monomer can be used alone or in combination of two or more.
　上記水酸基含有モノマーとしては、例えば、（メタ）アクリル酸２－ヒドロキシエチル、（メタ）アクリル酸２－ヒドロキシプロピル、（メタ）アクリル酸３－ヒドロキシプロピル、（メタ）アクリル酸４－ヒドロキシブチル、（メタ）アクリル酸６－ヒドロキシヘキシル、（メタ）アクリル酸ヒドロキシオクチル、（メタ）アクリル酸ヒドロキシデシル、（メタ）アクリル酸ヒドロキシラウリル、（メタ）アクリル酸（４－ヒドロキシメチルシクロヘキシル）などの水酸基含有（メタ）アクリル酸エステル；ビニルアルコール；アリルアルコールなどが挙げられる。 Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and (. Contains hydroxyl groups such as 6-hydroxyhexyl acrylate, (meth) hydroxyoctyl acrylate, (meth) hydroxydecyl acrylate, (meth) hydroxylauryl acrylate, (meth) acrylate (4-hydroxymethylcyclohexyl). Meta) Acrylic acid ester; Vinyl alcohol; Allyl alcohol and the like can be mentioned.
　中でも、上記水酸基含有モノマーとしては、水酸基含有（メタ）アクリル酸エステルが好ましく、より好ましくはアクリル酸２－ヒドロキシエチル（ＨＥＡ）、アクリル酸４－ヒドロキシブチル（４ＨＢＡ）である。 Among them, as the hydroxyl group-containing monomer, a hydroxyl group-containing (meth) acrylic acid ester is preferable, and 2-hydroxyethyl acrylate (HEA) and 4-hydroxybutyl acrylate (4HBA) are more preferable.
　上記アクリル系ポリマーが、ポリマーを構成するモノマー成分として上記水酸基含有モノマーを含有する場合、上記アクリル系ポリマーを構成する全モノマー成分（１００重量％）中の、上記水酸基含有モノマーの割合は、特に限定されないが、後述の架橋剤や紫外線重合性炭素－炭素二重結合と第２の官能基たるイソシアネート基とを併有するイソシアネート化合物等との反応点になり、架橋度や放射線硬化性を制御する点、透明性、粘着力の制御等の点より、０．５重量％以上であることが好ましく、より好ましくは０．８重量％以上であり、さらに好ましくは１重量％以上である。また、上記水酸基含有モノマーの割合の上限は、２０重量％以下であることが好ましく、より好ましくは１８重量％以下であり、さらに好ましくは１５重量％以下である。 When the acrylic polymer contains the hydroxyl group-containing monomer as a monomer component constituting the polymer, the proportion of the hydroxyl group-containing monomer in all the monomer components (100% by weight) constituting the acrylic polymer is particularly limited. Although it is not, it becomes a reaction point with a cross-linking agent described later or an isocyanate compound having both an ultraviolet polymerizable carbon-carbon double bond and an isocyanate group as a second functional group, and controls the degree of cross-linking and radiation curability. From the viewpoint of transparency, control of adhesive strength, etc., it is preferably 0.5% by weight or more, more preferably 0.8% by weight or more, and further preferably 1% by weight or more. The upper limit of the proportion of the hydroxyl group-containing monomer is preferably 20% by weight or less, more preferably 18% by weight or less, and further preferably 15% by weight or less.
　上記分子内にカルボキシル基を有するモノマーは、分子内（１分子内）にカルボキシル基を少なくとも１つ有するモノマーであり、（メタ）アクリロイル基又はビニル基等の不飽和二重結合を有する重合性の官能基を有し、かつカルボキシル基を有するものが好ましく挙げられる。本明細書においては、上記「分子内にカルボキシル基を有するモノマー」を「カルボキシル基含有モノマー」と称する場合がある。なお、カルボキシル基含有モノマーは、単独で又は２種以上を組み合わせて用いることができる。 The monomer having a carboxyl group in the molecule is a monomer having at least one carboxyl group in the molecule (inside one molecule), and is polymerizable with an unsaturated double bond such as a (meth) acryloyl group or a vinyl group. Those having a functional group and a carboxyl group are preferably mentioned. In the present specification, the above-mentioned "monomer having a carboxyl group in the molecule" may be referred to as "monomer containing a carboxyl group". The carboxyl group-containing monomer may be used alone or in combination of two or more.
　上記カルボキシル基含有モノマーとしては、例えば、（メタ）アクリル酸、イタコン酸、マレイン酸、フマル酸、クロトン酸、イソクロトン酸などが挙げられる。また、上記カルボキシル基含有モノマーには、例えば、無水マレイン酸、無水イタコン酸等の酸無水物基含有モノマーも含まれるものとする。 Examples of the carboxyl group-containing monomer include (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid. Further, the carboxyl group-containing monomer shall also include, for example, an acid anhydride group-containing monomer such as maleic anhydride and itaconic anhydride.
　中でも、上記カルボキシル基含有モノマーとしては、（メタ）アクリル酸が好ましく、より好ましくはアクリル酸（ＡＡ）である。 Among them, as the carboxyl group-containing monomer, (meth) acrylic acid is preferable, and acrylic acid (AA) is more preferable.
　上記アクリル系ポリマーが、ポリマーを構成するモノマー成分として上記カルボキシル基含有モノマーを含有する場合、上記アクリル系ポリマーを構成する全モノマー成分（１００重量％）中の、上記カルボキシル基含有モノマーの割合は、特に限定されないが、後述の架橋剤や紫外線重合性炭素－炭素二重結合と第２の官能基たるイソシアネート基とを併有するイソシアネート化合物等との反応点になり、架橋度や放射線硬化性を制御する点、透明性、粘着力の制御等の点より、０．５重量％以上であることが好ましく、より好ましくは０．８重量％以上であり、さらに好ましくは１重量％以上である。また、上記カルボキシル基含有モノマーの割合の上限は、２０重量％以下であることが好ましく、より好ましくは１８重量％以下であり、さらに好ましくは１５重量％以下である。 When the acrylic polymer contains the carboxyl group-containing monomer as a monomer component constituting the polymer, the ratio of the carboxyl group-containing monomer to all the monomer components (100% by weight) constituting the acrylic polymer is determined. Although not particularly limited, it serves as a reaction point with a cross-linking agent described later or an isocyanate compound having both an ultraviolet polymerizable carbon-carbon double bond and an isocyanate group as a second functional group, and controls the degree of cross-linking and radiation curability. It is preferably 0.5% by weight or more, more preferably 0.8% by weight or more, still more preferably 1% by weight or more, from the viewpoints of squeezing, transparency, control of adhesive force and the like. The upper limit of the proportion of the carboxyl group-containing monomer is preferably 20% by weight or less, more preferably 18% by weight or less, and further preferably 15% by weight or less.
　上記アクリル系ポリマーを構成する全モノマー成分（１００重量％）中の、上記水酸基含有モノマー及び上記カルボキシル基含有モノマーの割合の合計は、特に限定されないが、後述の架橋剤や紫外線重合性炭素－炭素二重結合と第２の官能基たるイソシアネート基とを併有するイソシアネート化合物等との反応点になる点、透明性、粘着力の制御等の点より、１重量％以上であることが好ましく、より好ましくは３重量％以上である。また、上記割合の合計の上限は、適度な柔軟性を有する粘着剤層を得る点、透明性に優れる粘着剤層を得る点より、２０重量％以下であることが好ましく、より好ましくは１５重量％以下である。 The total ratio of the hydroxyl group-containing monomer and the carboxyl group-containing monomer to the total monomer components (100% by weight) constituting the acrylic polymer is not particularly limited, but is not particularly limited, but the cross-linking agent and ultraviolet-polymerizable carbon-carbon described later are not particularly limited. It is preferably 1% by weight or more from the viewpoint of a reaction point with an isocyanate compound having both a double bond and an isocyanate group as a second functional group, transparency, control of adhesive strength, and the like. It is preferably 3% by weight or more. Further, the upper limit of the total of the above ratios is preferably 20% by weight or less, more preferably 15% by weight, from the viewpoint of obtaining a pressure-sensitive adhesive layer having appropriate flexibility and obtaining a pressure-sensitive adhesive layer having excellent transparency. % Or less.
　さらに、共重合性モノマーとしては、例えば、多官能性モノマーが挙げられる。上記多官能性モノマーとしては、例えば、ヘキサンジオールジ（メタ）アクリレート、ブタンジオールジ（メタ）アクリレート、（ポリ）エチレングリコールジ（メタ）アクリレート、（ポリ）プロピレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、ペンタエリスリトールジ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、テトラメチロールメタントリ（メタ）アクリレート、アリル（メタ）アクリレート、ビニル（メタ）アクリレート、ジビニルベンゼン、エポキシアクリレート、ポリエステルアクリレート、ウレタンアクリレートなどが挙げられる。なお、多官能性モノマーは、単独で又は２種以上を組み合わせて用いることができる。 Further, examples of the copolymerizable monomer include a polyfunctional monomer. Examples of the polyfunctional monomer include hexanediol di (meth) acrylate, butanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl. Glycoldi (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropanetri (meth) acrylate, tetramethylol methanetri (meth) acrylate, Examples thereof include allyl (meth) acrylate, vinyl (meth) acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, and urethane acrylate. The polyfunctional monomer may be used alone or in combination of two or more.
　上記アクリル系ポリマーが、ポリマーを構成するモノマー成分として上記多官能性モノマーを含有する場合、上記アクリル系ポリマーを構成する全モノマー成分（１００重量％）中の、上記多官能性モノマーの割合は、特に限定されないが、０．５重量％以下（例えば、０重量％を超えて０．５重量％以下）が好ましく、より好ましくは０．２重量％以下（例えば、０重量％を超えて０．２重量％以下）である。 When the acrylic polymer contains the polyfunctional monomer as a monomer component constituting the polymer, the ratio of the polyfunctional monomer to the total monomer component (100% by weight) constituting the acrylic polymer is determined. Although not particularly limited, 0.5% by weight or less (for example, more than 0% by weight and 0.5% by weight or less) is preferable, and more preferably 0.2% by weight or less (for example, more than 0% by weight and 0% by weight). 2% by weight or less).
　上記のアクリル系ポリマーは、例えばその凝集力や耐熱性等の改質の観点から、(メタ)アクリル酸エステルと共重合可能な一種類の又は二種類以上の他のモノマーに由来するモノマーユニットを含んでいてもよい。アクリル系ポリマーのモノマーユニットをなすための他の共重合性モノマーとしては、例えば、窒素含有モノマー、脂環構造含有モノマー、エポキシ基含有モノマー、スルホン酸基含有モノマー、および、リン酸基含有モノマーが挙げられる。窒素含有モノマーとしては、例えば、アクリロイルモルフォリン、アクリルアミド、Ｎ－ビニルピロリドン、およびアクリロニトリルが挙げられる。脂環構造含有モノマーとしては、例えば、シクロプロピル（メタ）アクリレート、シクロブチル（メタ）アクリレート、シクロペンチル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、シクロヘプチル（メタ）アクリレート、シクロオクチル（メタ）アクリレート、イソボルニル（メタ）アクリレート、ジシクロペンタニル（メタ）アクリレートが挙げられる。エポキシ基含有モノマーとしては、例えば、(メタ)アクリル酸グリシジルおよび(メタ)アクリル酸メチルグリシジルが挙げられる。スルホン酸基含有モノマーとしては、例えば、スチレンスルホン酸、アリルスルホン酸、２-(メタ)アクリルアミド-２-メチルプロパンスルホン酸、(メタ)アクリルアミドプロパンスルホン酸、および(メタ)アクリロイルオキシナフタレンスルホン酸が挙げられる。リン酸基含有モノマーとしては、例えば２-ヒドロキシエチルアクリロイルホスフェートが挙げられる。 The above acrylic polymer is a monomer unit derived from one or more other monomers copolymerizable with (meth) acrylic acid ester, for example, from the viewpoint of modifying its cohesive force and heat resistance. It may be included. Other copolymerizable monomers for forming the monomer unit of the acrylic polymer include, for example, a nitrogen-containing monomer, an alicyclic structure-containing monomer, an epoxy group-containing monomer, a sulfonic acid group-containing monomer, and a phosphoric acid group-containing monomer. Can be mentioned. Examples of the nitrogen-containing monomer include acryloylmorpholine, acrylamide, N-vinylpyrrolidone, and acrylonitrile. Examples of the alicyclic structure-containing monomer include cyclopropyl (meth) acrylate, cyclobutyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cycloheptyl (meth) acrylate, cyclooctyl (meth) acrylate, and isobornyl. Examples thereof include (meth) acrylate and dicyclopentanyl (meth) acrylate. Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate. Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, and (meth) acryloyloxynaphthalene sulfonic acid. Can be mentioned. Examples of the phosphoric acid group-containing monomer include 2-hydroxyethylacryloyl phosphate.
　特に限定されないが、上記アクリル系ポリマーは、ポリマーを構成するモノマー成分として、ホモポリマーを形成した際のガラス転移温度（Ｔｇ）が低いモノマー（以下、「低Ｔｇモノマー」と称する場合がある）が含まれることが好ましい。上記モノマー成分として低Ｔｇモノマーを用いると、当該アクリル系ポリマーを含有する粘着剤が柔らかくなり、本発明の粘着剤層の上記諸特性（特に、衝撃吸収性）を制御し、電子部品の衝突による衝撃を吸収し、電子部品の位置ずれや裏返りを抑制できる観点、搬送中の電子部品の脱落や位置ずれを抑制できる観点から、好ましい。 Although not particularly limited, the acrylic polymer may contain, as a monomer component constituting the polymer, a monomer having a low glass transition temperature (Tg) when a homopolymer is formed (hereinafter, may be referred to as “low Tg monomer”). It is preferably contained. When a low Tg monomer is used as the monomer component, the pressure-sensitive adhesive containing the acrylic polymer becomes soft, and the above-mentioned properties (particularly, shock absorption) of the pressure-sensitive adhesive layer of the present invention are controlled, due to collision of electronic components. It is preferable from the viewpoint of absorbing an impact and suppressing the misalignment and turning over of the electronic component, and from the viewpoint of suppressing the dropping and misalignment of the electronic component during transportation.
　上記低Ｔｇモノマーのホモポリマーを形成した際のガラス転移温度は、特に限定されないが、例えば、０℃以下であり、好ましくは－１０℃以下、より好ましくは－２５℃以下である。上記低ＴｇモノマーのＴｇが上記範囲であることにより、粘着剤層の衝撃吸収性が上がる。 The glass transition temperature when the homopolymer of the low Tg monomer is formed is not particularly limited, but is, for example, 0 ° C. or lower, preferably −10 ° C. or lower, and more preferably −25 ° C. or lower. When the Tg of the low Tg monomer is in the above range, the impact absorption of the pressure-sensitive adhesive layer is improved.
　上記低Ｔｇモノマーは、アクリル系ポリマーを構成するモノマー成分に含まれるモノマーとして例示した上述のモノマーであってもよいし、それ以外のモノマーであってもよい。特に、アクリル系ポリマーを構成するモノマー成分は、上述のアクリル系ポリマーを構成するモノマー成分として例示したモノマーであって、且つ、低Ｔｇモノマーであるモノマー成分を含むことが好ましい。上記低Ｔｇモノマーは、１種のみであってもよいし、２種以上であってもよい。 The low Tg monomer may be the above-mentioned monomer exemplified as the monomer contained in the monomer component constituting the acrylic polymer, or may be another monomer. In particular, the monomer component constituting the acrylic polymer is preferably the monomer exemplified as the monomer component constituting the acrylic polymer described above, and preferably contains a monomer component which is a low Tg monomer. The low Tg monomer may be only one kind or two or more kinds.
　上記低Ｔｇモノマーとしては、特に限定されないが、例えば、アクリル酸２－エチルヘキシル（ＥＨＡ、ホモポリマーのＴｇ：－７０℃）、アクリル酸ブチル（ＢＡ、ホモポリマーのＴｇ：－５５℃）、メタクリル酸ラウリル（ＬＭＡ、ホモポリマーのＴｇ：－６５℃）、アクリル酸ラウリル（ＬＡ、ホモポリマーのＴｇ：－２３℃）、アクリル酸イソノニル（ｉＮＡＡ、ホモポリマーのＴｇ：－５８℃）等が挙げられ、アクリル酸２－エチルヘキシル、アクリル酸ブチル、メタクリル酸ラウリルが好ましい。 The low Tg monomer is not particularly limited, and is, for example, 2-ethylhexyl acrylate (EHA, homopolymer Tg: -70 ° C), butyl acrylate (BA, homopolymer Tg: -55 ° C), and methacrylic acid. Lauryl (LMA, homopolymer Tg: -65 ° C), lauryl acrylate (LA, homopolymer Tg: -23 ° C), isononyl acrylate (iNAA, homopolymer Tg: -58 ° C) and the like can be mentioned. 2-Ethylhexyl acrylate, butyl acrylate, and lauryl methacrylate are preferred.
　上記アクリル系ポリマーが、ポリマーを構成するモノマー成分として上記低Ｔｇモノマーを含有する場合、上記アクリル系ポリマーを構成する全モノマー成分（１００重量％）中の、上記低Ｔｇモノマーの割合は、特に限定されないが、８０重量％以上であることが好ましく、８５重量％以上、又は９０重量％以上であってもよい。低Ｔｇモノマーの割合の上限も、特に限定されないが、９９重量％以下、又は９８重量％以下であってもよい。低Ｔｇモノマーの割合が上記範囲内であると、上記諸特性（特に、衝撃吸収性）を制御し、電子部品の衝突による衝撃を吸収し、電子部品の位置ずれや裏返りを抑制できる観点、搬送中の電子部品の脱落や位置ずれを抑制できる観点から、好ましい。なお、ポリマーを構成するモノマー成分中に２種以上の低Ｔｇモノマーが含まれる場合は、上記「低Ｔｇモノマーの割合」は、上記２種以上の低Ｔｇモノマーの割合の合計である。 When the acrylic polymer contains the low Tg monomer as a monomer component constituting the polymer, the proportion of the low Tg monomer in the total monomer component (100% by weight) constituting the acrylic polymer is particularly limited. However, it is preferably 80% by weight or more, and may be 85% by weight or more, or 90% by weight or more. The upper limit of the proportion of the low Tg monomer is also not particularly limited, but may be 99% by weight or less, or 98% by weight or less. When the ratio of the low Tg monomer is within the above range, the above-mentioned characteristics (particularly, impact absorption) can be controlled, the impact due to the collision of the electronic component can be absorbed, and the displacement and turning over of the electronic component can be suppressed. It is preferable from the viewpoint of suppressing the dropping and misalignment of the electronic parts inside. When two or more kinds of low Tg monomers are contained in the monomer components constituting the polymer, the above-mentioned "ratio of low Tg monomers" is the total of the proportions of the above two or more kinds of low Tg monomers.
　本発明の粘着剤層中のベースポリマー（特にアクリル系ポリマー）の含有量は、特に限定されないが、本発明の粘着剤層の総重量１００重量％に対して、５０重量％以上（例えば、５０～１００重量％）が好ましく、より好ましくは８０重量％以上（例えば、８０～１００重量％）、さらに好ましくは９０重量％以上（例えば、９０～１００重量％）である。 The content of the base polymer (particularly acrylic polymer) in the pressure-sensitive adhesive layer of the present invention is not particularly limited, but is 50% by weight or more (for example, 50) with respect to 100% by weight of the total weight of the pressure-sensitive adhesive layer of the present invention. ~ 100% by weight), more preferably 80% by weight or more (for example, 80 to 100% by weight), still more preferably 90% by weight or more (for example, 90 to 100% by weight).
　本発明の粘着剤組成物が含有する、上記アクリル系ポリマーなどのベースポリマーは、モノマー成分を重合することにより得られる。この重合方法としては、特に限定されないが、例えば、溶液重合方法、乳化重合方法、塊状重合方法、活性エネルギー線照射による重合方法（活性エネルギー線重合方法）などが挙げられる。中でも、粘着剤層の透明性、コストなどの点より、溶液重合方法、活性エネルギー線重合方法が好ましく、溶液重合方法がより好ましい。 The base polymer such as the acrylic polymer contained in the pressure-sensitive adhesive composition of the present invention can be obtained by polymerizing a monomer component. The polymerization method is not particularly limited, and examples thereof include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, and a polymerization method by irradiation with active energy rays (active energy ray polymerization method). Among them, the solution polymerization method and the active energy ray polymerization method are preferable, and the solution polymerization method is more preferable, from the viewpoints of transparency and cost of the pressure-sensitive adhesive layer.
　また、上記のモノマー成分の重合に際しては、各種の一般的な溶剤が用いられてもよい。上記溶剤としては、例えば、酢酸エチル、酢酸ｎ－ブチル等のエステル類；トルエン、ベンゼン等の芳香族炭化水素類；ｎ－ヘキサン、ｎ－ヘプタン等の脂肪族炭化水素類；シクロヘキサン、メチルシクロヘキサン等の脂環式炭化水素類；メチルエチルケトン、メチルイソブチルケトン等のケトン類などの有機溶剤が挙げられる。なお、溶剤は、単独で又は２種以上組み合わせて用いることができる。 Further, various general solvents may be used for the polymerization of the above-mentioned monomer components. Examples of the solvent include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane, methylcyclohexane and the like. Hydrocarbons of the above; organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone can be mentioned. The solvent can be used alone or in combination of two or more.
　上記のモノマー成分の重合に際しては、重合反応の種類に応じて、熱重合開始剤や光重合開始剤（光開始剤）などの重合開始剤が用いられてもよい。なお、重合開始剤は、単独で又は２種以上を組み合わせて用いることができる。 In the polymerization of the above-mentioned monomer components, a polymerization initiator such as a thermal polymerization initiator or a photopolymerization initiator (photoinitiator) may be used depending on the type of the polymerization reaction. The polymerization initiator may be used alone or in combination of two or more.
　上記熱重合開始剤としては、特に限定されないが、例えば、アゾ系重合開始剤、過酸化物系重合開始剤（例えば、ジベンゾイルペルオキシド、ｔｅｒｔ－ブチルペルマレエート等）、レドックス系重合開始剤等が挙げられる。中でも、過酸化物系重合開始剤が好ましい。上記アゾ系重合開始剤としては、２，２'－アゾビスイソブチロニトリル（以下、「ＡＩＢＮ」と称する場合がある）、２，２'－アゾビス－２－メチルブチロニトリル（以下、「ＡＭＢＮ」と称する場合がある）、２，２'－アゾビス（２－メチルプロピオン酸）ジメチル、４，４'－アゾビス－４－シアノバレリアン酸などが挙げられる。なお、熱重合開始剤は、単独で又は２種以上を組み合わせて用いることができる。 The thermal polymerization initiator is not particularly limited, but is, for example, an azo-based polymerization initiator, a peroxide-based polymerization initiator (for example, dibenzoyl peroxide, tert-butyl permalate, etc.), a redox-based polymerization initiator, and the like. Can be mentioned. Of these, peroxide-based polymerization initiators are preferable. Examples of the azo-based polymerization initiator include 2,2'-azobisisobutyronitrile (hereinafter, may be referred to as "AIBN") and 2,2'-azobis-2-methylbutyronitrile (hereinafter, "" AMBN "), 2,2'-azobis (2-methylpropionic acid) dimethyl, 4,4'-azobis-4-cyanovalerian acid and the like. The thermal polymerization initiator may be used alone or in combination of two or more.
　上記熱重合開始剤の使用量は、特に限定されないが、例えば、上記アクリル系ポリマーを構成する全モノマー成分１００重量部に対して、０．０５重量部以上であることが好ましく、より好ましくは０．１重量部以上であり、また、０．５重量部以下であることが好ましく、より好ましくは０．３重量部以下である。 The amount of the thermal polymerization initiator used is not particularly limited, but is preferably 0.05 parts by weight or more, more preferably 0, with respect to 100 parts by weight of all the monomer components constituting the acrylic polymer. It is preferably 1 part by weight or more, preferably 0.5 part by weight or less, and more preferably 0.3 part by weight or less.
　上記光重合開始剤としては、特に限定されないが、例えば、ベンゾインエーテル系光重合開始剤、アセトフェノン系光重合開始剤、α－ケトール系光重合開始剤、芳香族スルホニルクロリド系光重合開始剤、光活性オキシム系光重合開始剤、ベンゾイン系光重合開始剤、ベンジル系光重合開始剤、ベンゾフェノン系光重合開始剤、ケタール系光重合開始剤、チオキサントン系光重合開始剤等が挙げられる。他にも、アシルフォスフィンオキサイド系光重合開始剤、チタノセン系光重合開始剤が挙げられる。上記ベンゾインエーテル系光重合開始剤としては、例えば、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインプロピルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル、２，２－ジメトキシ－１，２－ジフェニルエタン－１－オン、アニソールメチルエーテル等が挙げられる。上記アセトフェノン系光重合開始剤としては、例えば、２，２－ジエトキシアセトフェノン、２，２－ジメトキシ－２－フェニルアセトフェノン、１－ヒドロキシシクロヘキシルフェニルケトン、４－フェノキシジクロロアセトフェノン、４－（ｔ－ブチル）ジクロロアセトフェノン等が挙げられる。上記α－ケトール系光重合開始剤としては、例えば、２－メチル－２－ヒドロキシプロピオフェノン、１－［４－（２－ヒドロキシエチル）フェニル］－２－メチルプロパン－１－オン等が挙げられる。上記芳香族スルホニルクロリド系光重合開始剤としては、例えば、２－ナフタレンスルホニルクロライド等が挙げられる。上記光活性オキシム系光重合開始剤としては、例えば、１－フェニル－１，１－プロパンジオン－２－（Ｏ－エトキシカルボニル）－オキシム等が挙げられる。上記ベンゾイン系光重合開始剤としては、例えば、ベンゾイン等が挙げられる。上記ベンジル系光重合開始剤としては、例えば、ベンジル等が挙げられる。上記ベンゾフェノン系光重合開始剤としては、例えば、ベンゾフェノン、ベンゾイル安息香酸、３，３'－ジメチル－４－メトキシベンゾフェノン、ポリビニルベンゾフェノン、α－ヒドロキシシクロヘキシルフェニルケトン等が挙げられる。上記ケタール系光重合開始剤としては、例えば、ベンジルジメチルケタール等が挙げられる。上記チオキサントン系光重合開始剤としては、例えば、チオキサントン、２－クロロチオキサントン、２－メチルチオキサントン、２，４－ジメチルチオキサントン、イソプロピルチオキサントン、２，４－ジイソプロピルチオキサントン、ドデシルチオキサントン等が挙げられる。上記アシルフォスフィンオキサイド系光重合開始剤としては、例えば、２，４，６－トリメチルベンゾイル－ジフェニル－フォスフィンオキサイド、ビス（２，４，６－トリメチルベンゾイル）－フェニルフォスフィンオキサイド等が挙げられる。上記チタノセン系光重合開始剤としては、例えば、ビス（η5－２，４－シクロペンタジエン－１－イル）－ビス（２，６－ジフルオロ－３－（１Ｈ－ピロール－１－イル）－フェニル）チタニウム等が挙げられる。なお、光重合開始剤は、単独で又は２種以上を組み合わせて用いることができる。 The photopolymerization initiator is not particularly limited, and is, for example, a benzoin ether-based photopolymerization initiator, an acetophenone-based photopolymerization initiator, an α-ketol-based photopolymerization initiator, an aromatic sulfonyl chloride-based photopolymerization initiator, and light. Examples thereof include an active oxime-based photopolymerization initiator, a benzoin-based photopolymerization initiator, a benzyl-based photopolymerization initiator, a benzophenone-based photopolymerization initiator, a ketal-based photopolymerization initiator, and a thioxanthone-based photopolymerization initiator. In addition, an acylphosphine oxide-based photopolymerization initiator and a titanocene-based photopolymerization initiator can be mentioned. Examples of the benzoin ether-based photopolymerization initiator include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and the like. Anisole methyl ether and the like can be mentioned. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 4-phenoxydichloroacetophenone, and 4- (t-butyl). ) Dichloroacetophenone and the like can be mentioned. Examples of the α-ketol-based photopolymerization initiator include 2-methyl-2-hydroxypropiophenone, 1- [4- (2-hydroxyethyl) phenyl] -2-methylpropan-1-one, and the like. Be done. Examples of the aromatic sulfonyl chloride-based photopolymerization initiator include 2-naphthalene sulfonyl chloride and the like. Examples of the photoactive oxime-based photopolymerization initiator include 1-phenyl-1,1-propanedione-2- (O-ethoxycarbonyl) -oxime. Examples of the benzoin-based photopolymerization initiator include benzoin and the like. Examples of the benzyl-based photopolymerization initiator include benzyl and the like. Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α-hydroxycyclohexylphenylketone and the like. Examples of the ketal-based photopolymerization initiator include benzyldimethyl ketal and the like. Examples of the thioxanthone-based photopolymerization initiator include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, dodecylthioxanthone and the like. Examples of the acylphosphine oxide-based photopolymerization initiator include 2,4,6-trimethylbenzoyl-diphenyl-phosphinoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphinoxide and the like. .. Examples of the titanium-based photopolymerization initiator include bis (η 5-2,4 -cyclopentadiene-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole-1-yl) -phenyl. ) Titanium and the like can be mentioned. The photopolymerization initiator may be used alone or in combination of two or more.
　上記アクリル系ポリマーの重合の際に上記光重合開始剤を用いる場合、上記光重合開始剤の使用量は、特に限定されないが、例えば、上記アクリル系ポリマーを構成する全モノマー成分１００重量部に対して、０．０１重量部以上であることが好ましく、より好ましくは０．１重量部以上であり、また、３重量部以下であることが好ましく、より好ましくは１．５重量部以下である。 When the photopolymerization initiator is used in the polymerization of the acrylic polymer, the amount of the photopolymerization initiator used is not particularly limited, but for example, with respect to 100 parts by weight of all the monomer components constituting the acrylic polymer. The amount is preferably 0.01 parts by weight or more, more preferably 0.1 parts by weight or more, and more preferably 3 parts by weight or less, still more preferably 1.5 parts by weight or less.
　本発明のアクリル系粘着剤組成物は、架橋剤を含むことが好ましい。はく離ライナーを剥離後に大気環境下に曝露された状態で粘着面の濡れ性が経時的に変化する原因は、はく離ライナーの表面に形成された剥離層に含まれる剥離剤が粘着剤層に移行し、粘着剤層に移行した剥離剤が、粘着面の表面にブリードアウトするためと考えられる。従って、アクリル系粘着剤層におけるアクリル系ポリマーを架橋し、粘着剤層に移行した剥離剤の粘着剤層内での移動を抑制して、粘着面の表面への剥離剤のブリードアウトを抑制することにより、粘着面の濡れ性の経時的変化を抑制することができると考えられる。なお、これは推測であり、本発明を限定するものとして解釈すべきではない。架橋剤は、単独で又は２種以上組み合わせて用いることができる。 The acrylic pressure-sensitive adhesive composition of the present invention preferably contains a cross-linking agent. The reason why the wettability of the adhesive surface changes with time when the peeling liner is exposed to the air environment after peeling is that the peeling agent contained in the peeling layer formed on the surface of the peeling liner moves to the adhesive layer. It is considered that the release agent transferred to the pressure-sensitive adhesive layer bleeds out to the surface of the pressure-sensitive adhesive surface. Therefore, the acrylic polymer in the acrylic pressure-sensitive adhesive layer is crosslinked, the movement of the release agent transferred to the pressure-sensitive adhesive layer in the pressure-sensitive adhesive layer is suppressed, and the bleed-out of the release agent to the surface of the pressure-sensitive adhesive surface is suppressed. Therefore, it is considered that the change in the wettability of the adhesive surface with time can be suppressed. It should be noted that this is a guess and should not be construed as limiting the present invention. The cross-linking agent can be used alone or in combination of two or more.
　上記架橋剤としては、特に限定されないが、例えば、イソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤、過酸化物系架橋剤、尿素系架橋剤、金属アルコキシド系架橋剤、金属キレート系架橋剤、金属塩系架橋剤、カルボジイミド系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、アミン系架橋剤などが挙げられる。中でも、イソシアネート系架橋剤、エポキシ系架橋剤が好ましく、より好ましくはイソシアネート系架橋剤である。 The cross-linking agent is not particularly limited, and is, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, a melamine-based cross-linking agent, a peroxide-based cross-linking agent, a urea-based cross-linking agent, a metal alkoxide-based cross-linking agent, and a metal chelate-based cross-linking agent. Examples thereof include agents, metal salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, and amine-based cross-linking agents. Of these, isocyanate-based cross-linking agents and epoxy-based cross-linking agents are preferable, and isocyanate-based cross-linking agents are more preferable.
　上記イソシアネート系架橋剤（多官能イソシアネート化合物）としては、例えば、１，２－エチレンジイソシアネート、１，４－ブチレンジイソシアネート、１，６－ヘキサメチレンジイソシアネートなどの低級脂肪族ポリイソシアネート類；シクロペンチレンジイソシアネート、シクロヘキシレンジイソシアネート、イソホロンジイソシアネート、水素添加トリレンジイソシアネート、水素添加キシレンジイソシアネートなどの脂環族ポリイソシアネート類；２，４－トリレンジイソシアネート、２，６－トリレンジイソシアネート、４，４'－ジフェニルメタンジイソシアネート、キシリレンジイソシアネートなどの芳香族ポリイソシアネート類などが挙げられる。また、上記イソシアネート系架橋剤としては、例えば、トリメチロールプロパン／トリレンジイソシアネート付加物（商品名「コロネートＬ」、日本ポリウレタン工業株式会社製）、トリメチロールプロパン／ヘキサメチレンジイソシアネート付加物（商品名「コロネートＨＬ」、日本ポリウレタン工業株式会社製）、トリメチロールプロパン／キシリレンジイソシアネート付加物（商品名「タケネートＤ－１１０Ｎ」、三井化学株式会社製）などの市販品も挙げられる。 Examples of the isocyanate-based cross-linking agent (polyfunctional isocyanate compound) include lower aliphatic polyisocyanates such as 1,2-ethylenediisocyanate, 1,4-butylenediocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate. , Cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate and other alicyclic polyisocyanates; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate , Aromatic polyisocyanates such as xylylene diisocyanate and the like. Examples of the isocyanate-based cross-linking agent include a trimethylolpropane / tolylene diisocyanate adduct (trade name "Coronate L", manufactured by Nippon Polyurethane Industry Co., Ltd.) and a trimethylolpropane / hexamethylene diisocyanate adduct (trade name "". Commercial products such as "Coronate HL" (manufactured by Nippon Polyurethane Industry Co., Ltd.) and trimethylolpropane / xylylene diisocyanate adduct (trade name "Takenate D-110N", manufactured by Mitsui Chemicals Co., Ltd.) can also be mentioned.
　上記エポキシ系架橋剤（多官能エポキシ化合物）としては、例えば、Ｎ，Ｎ，Ｎ'，Ｎ'－テトラグリシジル－ｍ－キシレンジアミン、ジグリシジルアニリン、１，３－ビス（Ｎ，Ｎ－ジグリシジルアミノメチル）シクロヘキサン、１，６－ヘキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、ソルビトールポリグリシジルエーテル、グリセロールポリグリシジルエーテル、ペンタエリスリトールポリグリシジルエーテル、ポリグリセロールポリグリシジルエーテル、ソルビタンポリグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、アジピン酸ジグリシジルエステル、ｏ－フタル酸ジグリシジルエステル、トリグリシジル－トリス（２－ヒドロキシエチル）イソシアヌレート、レゾルシンジグリシジルエーテル、ビスフェノール－Ｓ－ジグリシジルエーテルの他、分子内にエポキシ基を２つ以上有するエポキシ系樹脂などが挙げられる。また、上記エポキシ系架橋剤としては、例えば、商品名「テトラッドＣ」（三菱ガス化学株式会社製）などの市販品も挙げられる。 Examples of the epoxy-based cross-linking agent (polyfunctional epoxy compound) include N, N, N', N'-tetraglycidyl-m-xylene diamine, diglycidyl aniline, and 1,3-bis (N, N-diglycidyl). Aminomethyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether , Gglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2) -Hydroxyethyl) isocyanurate, resorcin diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy-based resins having two or more epoxy groups in the molecule can be mentioned. Further, examples of the epoxy-based cross-linking agent include commercially available products such as the trade name "Tetrad C" (manufactured by Mitsubishi Gas Chemical Company, Inc.).
　アクリル系粘着剤組成物が架橋剤を含む場合、上記架橋剤の使用量は、特に限定されないが、前記変位Ｒを制御して、搬送中の電子部品の脱落や位置ずれを抑制できる観点から、ベースポリマー１００重量部に対して、１重量部以上であることが好ましく、より好ましくは１．５重量部以上、さらに好ましくは２重量部以上である。また、上記使用量の上限は、粘着剤層において適度な柔軟性を得て、粘着力を向上させる点より、ベースポリマー１００重量部に対して、１０重量部以下であることが好ましく、より好ましくは５重量部以下である。 When the acrylic pressure-sensitive adhesive composition contains a cross-linking agent, the amount of the cross-linking agent used is not particularly limited, but from the viewpoint that the displacement R can be controlled to prevent the electronic parts from falling off or being displaced during transportation. It is preferably 1 part by weight or more, more preferably 1.5 parts by weight or more, and further preferably 2 parts by weight or more with respect to 100 parts by weight of the base polymer. Further, the upper limit of the amount used is preferably 10 parts by weight or less with respect to 100 parts by weight of the base polymer, more preferably, from the viewpoint of obtaining appropriate flexibility in the pressure-sensitive adhesive layer and improving the adhesive strength. Is 5 parts by weight or less.
　本発明のアクリル系粘着剤組成物は、特に限定されないが、架橋促進剤を含んでいてもよい。架橋促進剤の種類は、使用する架橋剤の種類に応じて適宜選択することができる。なお、本明細書において、架橋促進剤とは、架橋剤による架橋反応の速度を高める触媒を指す。かかる架橋促進剤としては、ジオクチル錫ジラウレート、ジブチル錫ジラウレート、ジブチル錫ジアセテート、ジブチル錫ジアセチルアセトナート、テトラ－ｎ－ブチル錫、トリメチル錫ヒドロキシド等の錫（Ｓｎ）含有化合物；Ｎ，Ｎ，Ｎ'，Ｎ'－テトラメチルヘキサンジアミンやトリエチルアミン等のアミン類、イミダゾール類等のＮ含有化合物；等が例示される。なかでも、Ｓｎ含有化合物が好ましい。これら架橋促進剤の使用は、上記副モノマーとしてヒドロキシル基含有モノマーを用い、かつ架橋剤としてイソシアネート系架橋剤を用いた場合に特に効果的である。上記粘着剤組成物に含まれる架橋促進剤の量は、上記アクリル系ポリマー１００質量部に対し、例えば、０．００１～０．５質量部程度（好ましくは０．００１～０．１質量部程度）とすることができる。 The acrylic pressure-sensitive adhesive composition of the present invention is not particularly limited, but may contain a cross-linking accelerator. The type of the cross-linking accelerator can be appropriately selected depending on the type of the cross-linking agent used. In the present specification, the cross-linking accelerator refers to a catalyst that increases the rate of the cross-linking reaction by the cross-linking agent. Examples of such a cross-linking accelerator include tin (Sn) -containing compounds such as dioctyl tin dilaurate, dibutyl tin dilaurate, dibutyl tin diacetate, dibutyl tin diacetylacetonate, tetra-n-butyl tin, and trimethyl tin hydroxide; Examples thereof include amines such as N', N'-tetramethylhexanediamine and triethylamine, and N-containing compounds such as imidazoles. Of these, Sn-containing compounds are preferable. The use of these cross-linking accelerators is particularly effective when a hydroxyl group-containing monomer is used as the sub-monomer and an isocyanate-based cross-linking agent is used as the cross-linking agent. The amount of the cross-linking accelerator contained in the pressure-sensitive adhesive composition is, for example, about 0.001 to 0.5 parts by mass (preferably about 0.001 to 0.1 parts by mass) with respect to 100 parts by mass of the acrylic polymer. ).
　本発明の粘着剤層は、外部からの作用によって意図的に粘着力を低減させることが可能な粘着剤層（粘着力低減可能型粘着剤層）であってもよいし、外部からの作用によっては粘着力がほとんど又は全く低減しない粘着剤層（粘着力非低減型粘着剤層）であってもよく、電子部品を実装する手法や条件等に応じて適宜に選択することができる。 The pressure-sensitive adhesive layer of the present invention may be a pressure-sensitive adhesive layer (adhesive force-reducable type pressure-sensitive adhesive layer) capable of intentionally reducing the adhesive force by an action from the outside, or may be a pressure-sensitive adhesive layer by an action from the outside. May be a pressure-sensitive adhesive layer (adhesive strength non-reducing type pressure-sensitive adhesive layer) in which the adhesive strength is hardly reduced or not reduced at all, and can be appropriately selected depending on a method and conditions for mounting an electronic component.
　本発明の粘着剤層が粘着力低減可能型粘着剤層である場合、本発明の粘着剤層が相対的に高い粘着力を示す状態と相対的に低い粘着力を示す状態とを使い分けることが可能となる。例えば、本発明の粘着剤層が電子部品を受け取る（転写する）工程では、本発明の粘着剤層が相対的に高い粘着力を示す状態を利用して、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる。一方で、その後、受け取った電子部品を別のキャリア基板や実装基板へ転写する過程では、本発明の粘着剤層の粘着力を低減させることで、転写性（受け渡し性）の向上や電子部品への糊残りを抑制することができる。 When the pressure-sensitive adhesive layer of the present invention is a pressure-reducable type pressure-sensitive adhesive layer, it is possible to properly use a state in which the pressure-sensitive adhesive layer of the present invention exhibits a relatively high adhesive strength and a state in which the pressure-sensitive adhesive layer exhibits a relatively low adhesive strength. It will be possible. For example, in the step of receiving (transferring) an electronic component by the pressure-sensitive adhesive layer of the present invention, the state in which the pressure-sensitive adhesive layer of the present invention exhibits a relatively high adhesive force is utilized to apply the pressure-sensitive adhesive layer to the electronic component or the like. The impact caused by the collision can be sufficiently absorbed, and the position shift and turning over due to the bouncing of electronic components at the time of the collision can be suppressed. On the other hand, after that, in the process of transferring the received electronic component to another carrier substrate or mounting substrate, the adhesive force of the adhesive layer of the present invention is reduced to improve the transferability (delivery property) and to the electronic component. It is possible to suppress the adhesive residue of.
　このような粘着力低減可能型粘着剤層を形成する粘着剤としては、例えば、放射線硬化性粘着剤、加熱発泡型粘着剤等が挙げられ、放射線硬化性粘着剤が操作性の点で好ましい。すなわち、本発明の粘着剤層は放射線硬化性粘着剤から形成されることが好ましい。粘着力低減可能型粘着剤層を形成する粘着剤としては、一種の粘着剤を使用してもよいし、二種以上の粘着剤を使用してもよい。 Examples of the pressure-sensitive adhesive forming such a pressure-reducing type pressure-sensitive adhesive layer include a radiation-curable pressure-sensitive adhesive and a heat-foaming type pressure-sensitive adhesive, and the radiation-curable pressure-sensitive adhesive is preferable in terms of operability. That is, the pressure-sensitive adhesive layer of the present invention is preferably formed from a radiation-curable pressure-sensitive adhesive. As the pressure-sensitive adhesive forming the pressure-reducing adhesive layer, one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesive may be used.
　上記放射線硬化性粘着剤としては、例えば、電子線、紫外線、α線、β線、γ線、又はＸ線の照射により硬化するタイプの粘着剤を用いることができ、紫外線照射によって硬化するタイプの粘着剤（紫外線硬化性粘着剤）を特に好ましく用いることができる。 As the radiation-curable pressure-sensitive adhesive, for example, a type of pressure-sensitive adhesive that cures by irradiation with an electron beam, ultraviolet rays, α-rays, β-rays, γ-rays, or X-rays can be used, and a type that cures by irradiation with ultraviolet rays can be used. A pressure-sensitive adhesive (ultraviolet curable pressure-sensitive adhesive) can be particularly preferably used.
　上記放射線硬化性粘着剤としては、例えば、アクリル系ポリマー等のベースポリマーと、放射線重合性の炭素－炭素二重結合等の官能基を有する放射線重合性のモノマー成分やオリゴマー成分とを含有する添加型の放射線硬化性粘着剤が挙げられる。ベースポリマーとしては、上記と同様のアクリル系ポリマーを使用することができる。 The radiation-curable pressure-sensitive adhesive includes, for example, a base polymer such as an acrylic polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond. Examples include mold radiation curable adhesives. As the base polymer, an acrylic polymer similar to the above can be used.
　上記放射線重合性のモノマー成分としては、例えば、ウレタン（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールモノヒドロキシペンタ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、１，４－ブタンジオールジ（メタ）アクリレート等挙げられる。上記放射線重合性のオリゴマー成分としては、例えば、ウレタン系、ポリエーテル系、ポリエステル系、ポリカーボネート系、ポリブタジエン系等の種々のオリゴマーが挙げられ、分子量が１００～３００００程度のものが好ましい。本発明の粘着剤層を形成する放射線硬化性粘着剤中の上記放射線硬化性のモノマー成分及びオリゴマー成分の含有量は、上記ベースポリマー１００質量部に対して、例えば５～５００質量部、好ましくは４０～１５０質量部程度である。また、添加型の放射線硬化性粘着剤としては、例えば特開昭６０－１９６９５６号公報に開示のものを用いてもよい。 Examples of the radiation-polymerizable monomer component include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol monohydroxypenta ( Examples thereof include meta) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate. Examples of the radiation-polymerizable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and those having a molecular weight of about 100 to 30,000 are preferable. The content of the radiation-curable monomer component and the oligomer component in the radiation-curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer of the present invention is, for example, 5 to 500 parts by mass, preferably 5 to 500 parts by mass, based on 100 parts by mass of the base polymer. It is about 40 to 150 parts by mass. Further, as the additive-type radiation-curable pressure-sensitive adhesive, for example, those disclosed in Japanese Patent Application Laid-Open No. 60-196956 may be used.
　上記放射線硬化性粘着剤としては、放射線重合性の炭素－炭素二重結合等の官能基をポリマー側鎖や、ポリマー主鎖中、ポリマー主鎖末端に有するベースポリマーを含有する内在型の放射線硬化性粘着剤も挙げられる。このような内在型の放射線硬化性粘着剤を用いると、形成された粘着剤層内での低分子量成分の移動に起因する粘着特性の意図しない経時的変化を抑制することができる傾向がある。 The radiation-curable pressure-sensitive adhesive is an intrinsic radiation-curing agent containing a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer backbone or at the end of the polymer backbone in the polymer backbone. Sexual pressure-sensitive adhesives can also be mentioned. When such an intrinsically curable pressure-sensitive adhesive is used, it tends to be possible to suppress an unintended change in adhesive properties over time due to the movement of low molecular weight components in the formed pressure-sensitive adhesive layer.
　上記内在型の放射線硬化性粘着剤に含有されるベースポリマーとしては、アクリル系ポリマーが好ましい。アクリル系ポリマーへの放射線重合性の炭素－炭素二重結合の導入方法としては、例えば、第１の官能基を有するモノマー成分を含む原料モノマーを重合（共重合）させてアクリル系ポリマーを得た後、上記第１の官能基と反応し得る第２の官能基及び放射線重合性の炭素－炭素二重結合を有する化合物を、炭素－炭素二重結合の放射線重合性を維持したままアクリル系ポリマーに対して縮合反応又は付加反応させる方法が挙げられる。 Acrylic polymer is preferable as the base polymer contained in the internal radiation curable pressure-sensitive adhesive. As a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer, for example, a raw material monomer containing a monomer component having a first functional group is polymerized (copolymerized) to obtain an acrylic polymer. Later, a compound having a second functional group capable of reacting with the first functional group and a radiopolymerizable carbon-carbon double bond is added to an acrylic polymer while maintaining the radiopolymerizability of the carbon-carbon double bond. Examples thereof include a method of subjecting to a condensation reaction or an addition reaction.
　上記第１の官能基と上記第２の官能基の組み合わせとしては、例えば、カルボキシ基とエポキシ基、エポキシ基とカルボキシ基、カルボキシ基とアジリジル基、アジリジル基とカルボキシ基、ヒドロキシ基とイソシアネート基、イソシアネート基とヒドロキシ基等が挙げられる。これらの中でも、反応追跡の容易さの観点から、ヒドロキシ基とイソシアネート基の組み合わせ、イソシアネート基とヒドロキシ基の組み合わせが好ましい。中でも、反応性の高いイソシアネート基を有するポリマーを作製することは技術的難易度が高く、一方でヒドロキシ基を有するアクリル系ポリマーの作製及び入手の容易性の観点から、上記第１の官能基がヒドロキシ基であり、上記第２の官能基がイソシアネート基である組み合わせが好ましい。イソシアネート基及び放射性重合性の炭素－炭素二重結合を有する化合物、すなわち、放射線重合性の不飽和官能基含有イソシアネート化合物としては、例えば、メタクリロイルイソシアネート、２－メタクリロイルオキシエチルイソシアネート、ｍ－イソプロペニル－α，α－ジメチルベンジルイソシアネート等が挙げられる。また、ヒドロキシ基を有するアクリル系ポリマーとしては、上述のヒドロキシ基含有モノマーや、２－ヒドロキシエチルビニルエーテル、４－ヒドロキシブチルビニルエーテル、ジエチレングリコールモノビニルエーテル等のエーテル系化合物に由来する構成単位を含むものが挙げられる。 Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, and a hydroxy group and an isocyanate group. Examples thereof include an isocyanate group and a hydroxy group. Among these, a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of easiness of reaction tracking. Above all, it is technically difficult to prepare a polymer having a highly reactive isocyanate group, and on the other hand, from the viewpoint of easy preparation and availability of an acrylic polymer having a hydroxy group, the above-mentioned first functional group is used. A combination in which the hydroxy group is used and the second functional group is an isocyanate group is preferable. Compounds having an isocyanate group and a radiopolymerizable carbon-carbon double bond, that is, a radiopolymerizable unsaturated functional group-containing isocyanate compound include, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-. Examples thereof include α and α-dimethylbenzyl isocyanate. Examples of the acrylic polymer having a hydroxy group include those containing the above-mentioned hydroxy group-containing monomer and structural units derived from ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. Be done.
　上記の放射線重合性の不飽和官能基含有イソシアネート化合物を使用する場合、本発明の粘着剤層を形成する放射線硬化性粘着剤中の上記放射線重合性の不飽和官能基含有イソシアネート化合物の含有量は、上記ベースポリマー１００質量部に対して、例えば５～１００質量部、好ましくは７～５０質量部程度である。 When the above-mentioned radiopolymerizable unsaturated functional group-containing isocyanate compound is used, the content of the above-mentioned radiopolymerizable unsaturated functional group-containing isocyanate compound in the radiation-curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer of the present invention is The amount is, for example, about 5 to 100 parts by mass, preferably about 7 to 50 parts by mass with respect to 100 parts by mass of the base polymer.
　上記放射線硬化性粘着剤は、光重合開始剤を含有することが好ましい。上記光重合開始剤としては、例えば、α－ケトール系化合物、アセトフェノン系化合物、ベンゾインエーテル系化合物、ケタール系化合物、芳香族スルホニルクロリド系化合物、光活性オキシム系化合物、ベンゾフェノン系化合物、チオキサントン系化合物、カンファーキノン、ハロゲン化ケトン、アシルホスフィノキシド、アシルホスフォナート等が挙げられる。上記α－ケトール系化合物としては、例えば、４－（２－ヒドロキシエトキシ）フェニル（２－ヒドロキシ－２－プロピル）ケトン、α－ヒドロキシ－α，α’－ジメチルアセトフェノン、２－メチル－２－ヒドロキシプロピオフェノン、１－ヒドロキシシクロヘキシルフェニルケトン、２－ヒドロキシ－１－（４－（４－（２－ヒドロキシ－２－メチルプロピオニル）ベンジル）フェニル）－２－メチルプロパン－１－オン等が挙げられる。上記アセトフェノン系化合物としては、例えば、メトキシアセトフェノン、２，２－ジメトキシ－２－フェニルアセトフェノン、２，２－ジエトキシアセトフェノン、２－メチル－１－［４－（メチルチオ）－フェニル］－２－モルホリノプロパン－１等が挙げられる。上記ベンゾインエーテル系化合物としては、例えば、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、アニソインメチルエーテル等が挙げられる。上記ケタール系化合物としては、例えば、ベンジルジメチルケタール等が挙げられる。上記芳香族スルホニルクロリド系化合物としては、例えば、２－ナフタレンスルホニルクロリド等が挙げられる。上記光活性オキシム系化合物としては、例えば、１－フェニル－１，２－プロパンジオン－２－（Ｏ－エトキシカルボニル）オキシム等が挙げられる。上記ベンゾフェノン系化合物としては、例えば、ベンゾフェノン、ベンゾイル安息香酸、３，３'－ジメチル－４－メトキシベンゾフェノン等が挙げられる。上記チオキサントン系化合物としては、例えば、チオキサントン、２－クロロチオキサントン、２－メチルチオキサントン、２，４－ジメチルチオキサントン、イソプロピルチオキサントン、２，４－ジクロロチオキサントン、２，４－ジエチルチオキサントン、２，４－ジイソプロピルチオキサントン等が挙げられる。放射線硬化性粘着剤中の光重合開始剤の含有量は、ベースポリマー１００質量部に対して、例えば０．０５～２０質量部である。 The radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include α-ketor compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, and thioxanthone compounds. Examples thereof include camphorquinone, halogenated ketone, acylphosphinoxide, acylphosphonate and the like. Examples of the α-ketol compound include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, and 2-methyl-2-hydroxy. Examples thereof include propiophenone, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-1- (4- (4- (2-hydroxy-2-methylpropionyl) benzyl) phenyl) -2-methylpropan-1-one and the like. .. Examples of the acetophenone compound include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholino. Propane-1 and the like can be mentioned. Examples of the benzoin ether-based compound include benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether and the like. Examples of the ketal-based compound include benzyldimethyl ketal and the like. Examples of the aromatic sulfonyl chloride compound include 2-naphthalene sulfonyl chloride and the like. Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime. Examples of the benzophenone compound include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone and the like. Examples of the thioxanthone-based compound include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl. Examples thereof include thioxanthone. The content of the photopolymerization initiator in the radiation-curable pressure-sensitive adhesive is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer.
　上記加熱発泡型粘着剤は、加熱によって発泡や膨張をする成分（発泡剤、熱膨張性微小球等）を含有する粘着剤である。上記発泡剤としては、種々の無機系発泡剤や有機系発泡剤が挙げられる。上記無機系発泡剤としては、例えば、炭酸アンモニウム、炭酸水素アンモニウム、炭酸水素ナトリウム、亜硝酸アンモニウム、水素化ホウ素ナトリウム、アジド類等が挙げられる。上記有機系発泡剤としては、例えば、トリクロロモノフルオロメタン、ジクロロモノフルオロメタン等の塩フッ化アルカン；アゾビスイソブチロニトリル、アゾジカルボンアミド、バリウムアゾジカルボキシレート等のアゾ系化合物；パラトルエンスルホニルヒドラジド、ジフェニルスルホン－３，３'－ジスルホニルヒドラジド、４，４'－オキシビス（ベンゼンスルホニルヒドラジド）、アリルビス（スルホニルヒドラジド）等のヒドラジン系化合物；ｐ－トルイレンスルホニルセミカルバジド、４，４'－オキシビス（ベンゼンスルホニルセミカルバジド）等のセミカルバジド系化合物；５－モルホリル－１，２，３，４－チアトリアゾール等のトリアゾール系化合物；Ｎ，Ｎ'－ジニトロソペンタメチレンテトラミン、Ｎ，Ｎ'－ジメチル－Ｎ，Ｎ'－ジニトロソテレフタルアミド等のＮ－ニトロソ系化合物等が挙げられる。上記熱膨張性微小球としては、例えば、加熱によって容易にガス化して膨張する物質が殻内に封入された構成の微小球が挙げられる。上記加熱によって容易にガス化して膨張する物質としては、例えば、イソブタン、プロパン、ペンタン等が挙げられる。加熱によって容易にガス化して膨張する物質をコアセルベーション法や界面重合法等によって殻形成物質内に封入することによって、熱膨張性微小球を作製することができる。上記殻形成物質としては、熱溶融性を示す物質や、封入物質の熱膨張の作用によって破裂し得る物質を用いることができる。そのような物質としては、例えば、塩化ビニリデン・アクリロニトリル共重合体、ポリビニルアルコール、ポリビニルブチラール、ポリメチルメタクリレート、ポリアクリロニトリル、ポリ塩化ビニリデン、ポリスルホン等が挙げられる。 The heat-foaming pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams or expands when heated. Examples of the foaming agent include various inorganic foaming agents and organic foaming agents. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, azides and the like. Examples of the organic foaming agent include salt fluoride alkanes such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarboxylicamide and barium azodicarboxylate; paratoluene. Hydrazide compounds such as sulfonyl hydrazide, diphenylsulfone-3,3'-disulfonyl hydrazide, 4,4'-oxybis (benzenesulfonyl hydrazide), allylbis (sulfonyl hydrazide); p-toluylene sulfonyl semicarbazide, 4,4'- Semi-carbazide compounds such as oxybis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morphory-1,2,3,4-thiatriazole; N, N'-dinitrosopentamethylenetetramine, N, N'-dimethyl- Examples thereof include N-nitroso compounds such as N, N'-dinitrosoterephthalamide. Examples of the heat-expandable microspheres include microspheres having a structure in which a substance that easily gasifies and expands by heating is enclosed in a shell. Examples of the substance that easily gasifies and expands by the above heating include isobutane, propane, and pentane. A heat-expandable microsphere can be produced by encapsulating a substance that easily gasifies and expands by heating in a shell-forming substance by a core selvation method, an interfacial polymerization method, or the like. As the shell-forming substance, a substance exhibiting thermal meltability or a substance that can explode due to the action of thermal expansion of the encapsulating substance can be used. Examples of such substances include vinylidene chloride / acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethylmethacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.
　上記粘着力非低減型粘着剤層としては、例えば、感圧型粘着剤層が挙げられる。なお、感圧型粘着剤層には、粘着力低減可能型粘着剤層に関して上述した放射線硬化性粘着剤から形成された粘着剤層を予め放射線照射によって硬化させつつも一定の粘着力を有する形態の粘着剤層が含まれる。粘着力非低減型粘着剤層を形成する粘着剤としては、一種の粘着剤を使用してもよいし、二種以上の粘着剤を使用してもよい。また、本発明の粘着剤層の全体が粘着力非低減型粘着剤層であってもよいし、一部が粘着力非低減型粘着剤層であってもよい。例えば、本発明の粘着剤層が単層構造を有する場合、本発明の粘着剤層の全体が粘着力非低減型粘着剤層であってもよいし、本発明の粘着剤層における特定の部位が粘着力非低減型粘着剤層であり、他の部位が粘着力低減可能型粘着剤層であってもよい。また、本発明の粘着剤層が積層構造を有する場合、積層構造における全ての粘着剤層が粘着力非低減型粘着剤層であってもよいし、積層構造中の一部の粘着剤層が粘着力非低減型粘着剤層であってもよい。 Examples of the pressure-sensitive pressure-sensitive adhesive layer include a pressure-sensitive pressure-sensitive adhesive layer. The pressure-sensitive pressure-sensitive adhesive layer has a form in which the pressure-sensitive adhesive layer formed from the above-mentioned radiation-curable pressure-sensitive adhesive is cured in advance by irradiation with respect to the pressure-reducing type pressure-sensitive adhesive layer and has a certain adhesive strength. Contains an adhesive layer. As the pressure-sensitive adhesive forming the non-reducing adhesive strength type pressure-sensitive adhesive layer, one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesive may be used. Further, the entire pressure-sensitive adhesive layer of the present invention may be a non-reduced pressure-sensitive adhesive layer, or a part of the pressure-sensitive adhesive layer may be a non-reduced pressure-sensitive adhesive layer. For example, when the pressure-sensitive adhesive layer of the present invention has a single-layer structure, the entire pressure-sensitive adhesive layer of the present invention may be a non-reduced pressure-sensitive adhesive layer, or a specific site in the pressure-sensitive adhesive layer of the present invention. Is a non-reducing adhesive force type pressure-sensitive adhesive layer, and other portions may be a pressure-reducing type pressure-sensitive adhesive layer. Further, when the pressure-sensitive adhesive layer of the present invention has a laminated structure, all the pressure-sensitive adhesive layers in the laminated structure may be non-reduced adhesive strength type pressure-sensitive adhesive layers, or some of the pressure-sensitive adhesive layers in the laminated structure may be. It may be a non-reducing adhesive strength type pressure-sensitive adhesive layer.
　放射線硬化性粘着剤から形成された粘着剤層（放射線未照射放射線硬化型粘着剤層）を予め放射線照射によって硬化させた形態の粘着剤層（放射線照射済放射線硬化型粘着剤層）は、放射線照射によって粘着力が低減されているとしても、含有するポリマー成分に起因する粘着性を示し、本発明の粘着剤層に最低限必要な粘着力を発揮することが可能である。放射線照射済放射線硬化型粘着剤層を用いる場合、本発明の粘着剤層の面広がり方向において、本発明の粘着剤層の全体が放射線照射済放射線硬化型粘着剤層であってもよく、本発明の粘着剤層の一部が放射線照射済放射線硬化型粘着剤層であり且つ他の部分が放射線未照射の放射線硬化型粘着剤層であってもよい。なお、本明細書において、「放射線硬化型粘着剤層」とは、放射線硬化性粘着剤から形成された粘着剤層をいい、放射線硬化性を有する放射線未照射放射線硬化型粘着剤層及び当該粘着剤層が放射線照射により硬化した後の放射線硬化済放射線硬化型粘着剤層の両方を含む。 The pressure-sensitive adhesive layer (irradiated radiation-curable pressure-sensitive adhesive layer) in which the pressure-sensitive adhesive layer (non-irradiated radiation-curable pressure-sensitive adhesive layer) formed from the radiation-curable pressure-sensitive adhesive is previously cured by irradiation is radiation. Even if the adhesive strength is reduced by irradiation, the adhesive strength due to the contained polymer component is exhibited, and the adhesive strength required for the adhesive layer of the present invention can be exhibited at the minimum. When the irradiated radiation-curable pressure-sensitive adhesive layer is used, the entire pressure-sensitive adhesive layer of the present invention may be the radiation-irradiated radiation-curable pressure-sensitive adhesive layer in the surface spreading direction of the pressure-sensitive adhesive layer of the present invention. A part of the pressure-sensitive adhesive layer of the present invention may be a radiation-irradiated radiation-curable pressure-sensitive adhesive layer, and the other part may be a radiation-curable pressure-sensitive adhesive layer that has not been irradiated. In the present specification, the "radiation-curable pressure-sensitive adhesive layer" means a pressure-sensitive adhesive layer formed of a radiation-curable pressure-sensitive adhesive, and is a radiation-non-irradiation radiation-curable pressure-sensitive adhesive layer having radiation curability and the pressure-sensitive adhesive. Includes both a radiation-cured radiation-curable pressure-sensitive adhesive layer after the agent layer has been cured by radiation irradiation.
　上記感圧型粘着剤層を形成する粘着剤としては、公知乃至慣用の感圧型の粘着剤を用いることができ、アクリル系ポリマーをベースポリマーとするアクリル系粘着剤を好ましく用いることができる。本発明の粘着剤層が感圧型の粘着剤としてアクリル系ポリマーを含有する場合、当該アクリル系ポリマーは、（メタ）アクリル酸エステルに由来する構成単位を質量割合で最も多い構成単位として含むポリマーであることが好ましい。上記アクリル系ポリマーとしては、例えば、上述の添加型の放射線硬化性粘着剤に含まれ得るアクリル系ポリマーとして説明されたアクリル系ポリマーを採用することができる。 As the pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer, a known or conventional pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive using an acrylic polymer as a base polymer can be preferably used. When the pressure-sensitive adhesive layer of the present invention contains an acrylic polymer as a pressure-sensitive pressure-sensitive adhesive, the acrylic polymer is a polymer containing a structural unit derived from a (meth) acrylic acid ester as the structural unit having the largest mass ratio. It is preferable to have. As the acrylic polymer, for example, the acrylic polymer described as the acrylic polymer that can be contained in the above-mentioned additive-type radiation-curable pressure-sensitive adhesive can be adopted.
　上記シリコーン系粘着剤としては、特に制限されず、公知乃至慣用のシリコーン系粘着剤を用いることができ、例えば、付加型シリコーン系粘着剤、過酸化物硬化型シリコーン系粘着剤、縮合型シリコーン系粘着剤などを用いることができる。シリコーン系粘着剤は１液型、２液型のいずれであってもよい。シリコーン系粘着剤は１種単独で又は２種以上を組み合わせて使用することができる。 The silicone-based pressure-sensitive adhesive is not particularly limited, and known or commonly used silicone-based pressure-sensitive adhesives can be used. Adhesives and the like can be used. The silicone-based adhesive may be either a one-component type or a two-component type. The silicone-based adhesive may be used alone or in combination of two or more.
　前記付加型シリコーン系粘着剤は、一般に、ケイ素原子にビニル基等のアルケニル基を有するオルガノポリシロキサンとヒドロシリル基を有するオルガノポリシロキサンとを、塩化白金酸等の白金化合物触媒を用いて付加反応（ヒドロシリル化反応）させることによりシリコーン系ポリマーを生成させる粘着剤である。過酸化物硬化型シリコーン系粘着剤は、一般に、オルガノポリシロキサンを過酸化物により硬化（架橋）させてシリコーン系ポリマーを生成させる粘着剤である。また、縮合型シリコーン系粘着剤は、一般に、末端にシラノール基又はアルコキシシリル基等の加水分解性シリル基を有するポリオルガノシロキサン間の脱水又は脱アルコール反応によりシリコーン系ポリマーを生成させる粘着剤である。 Generally, the addition type silicone-based pressure-sensitive adhesive is an addition reaction of an organopolysiloxane having an alkenyl group such as a vinyl group on a silicon atom and an organopolysiloxane having a hydrosilyl group using a platinum compound catalyst such as platinum chloride acid. It is a pressure-sensitive adhesive that produces a silicone-based polymer by subjecting it to a hydrosilylation reaction. The peroxide-curable silicone-based pressure-sensitive adhesive is generally a pressure-sensitive adhesive that cures (crosslinks) an organopolysiloxane with a peroxide to produce a silicone-based polymer. Further, the condensed silicone-based pressure-sensitive adhesive is generally a pressure-sensitive adhesive that produces a silicone-based polymer by dehydration or dealcoholization reaction between polyorganosiloxanes having a hydrolyzable silyl group such as a silanol group or an alkoxysilyl group at the terminal. ..
　シリコーン系粘着剤としては、低粘着性、低タック性にコントロールしやすい点、粘着面の濡れ性の経時的変化を抑制して、搬送中の電子部品の脱落や位置ずれを抑制できる観点より、例えば、シリコーンゴムとシリコーンレジンとを含有するシリコーン系粘着剤組成物が挙げられる。 As a silicone-based adhesive, it is easy to control low adhesiveness and low tackiness, and it is possible to suppress changes in the wettability of the adhesive surface over time and prevent the electronic parts from falling off or misaligning during transportation. For example, a silicone-based pressure-sensitive adhesive composition containing a silicone rubber and a silicone resin can be mentioned.
　前記シリコーンゴムとしては、シリコーン系のゴム成分であれば特に制限されないが、例えば、ジメチルシロキサン、メチルフェニルシロキサンなどを主な構成単位とするオルガノポリシロキサンを使用できる。また、反応の型に応じて、ケイ素原子に結合したアルケニル基を有するシリコーン系ゴム（アルケニル基含有オルガノポリシロキサン；付加反応型の場合）、メチル基を少なくとも有するシリコーン系ゴム（過酸化物硬化型の場合）、末端にシラノール基又は加水分解性のアルコキシシリル基を有するシリコーン系ゴム（縮合型の場合）などを用いることができる。なお、シリコーンゴムにおけるオルガノポリシロキサンの重量平均分子量は、通常、１５万以上であるが、好ましくは２８万～１００万であり、特に５０万～９０万が好適である。 The silicone rubber is not particularly limited as long as it is a silicone-based rubber component, but for example, organopolysiloxane having dimethylsiloxane, methylphenylsiloxane, or the like as a main constituent unit can be used. Further, depending on the type of reaction, a silicone-based rubber having an alkenyl group bonded to a silicon atom (alkenyl group-containing organopolysiloxane; in the case of an addition reaction type) and a silicone-based rubber having at least a methyl group (peroxide curable type). In the case of), a silicone-based rubber having a silanol group or a hydrolyzable alkoxysilyl group at the terminal (in the case of a condensation type) or the like can be used. The weight average molecular weight of the organopolysiloxane in the silicone rubber is usually 150,000 or more, preferably 280,000 to 1,000,000, and particularly preferably 500,000 to 900,000.
　また、前記シリコーンレジンとしては、シリコーン系粘着剤に使用されているシリコーン系のレジンであれば特に制限されないが、例えば、構成単位「Ｒ3Ｓｉ1/2」からなるＭ単位、構成単位「ＳｉＯ2」からなるＱ単位、構成単位「ＲＳｉＯ3/2」からなるＴ単位、および構成単位「Ｒ2ＳｉＯ」からなるＤ単位から選択される少なくとも１種の単位を有する（共）重合体からなるオルガノポリシロキサンからなるシリコーンレジンなどが挙げられる。なお、前記構成単位におけるＲは炭化水素基又はヒドロキシル基を示す。前記炭化水素基としては、例えば、脂肪族炭化水素基（メチル基、エチル基等のアルキル基など）、脂環式炭化水素基（シクロヘキシル基等のシクロアルキル基など）、芳香族炭化水素基（フェニル基、ナフチル基等のアリール基など）などが挙げられる。前記Ｍ単位と、Ｑ単位、Ｔ単位およびＤ単位から選択された少なくとも１種の単位との割合（比）としては、例えば、前者／後者（モル比）＝０．３／１～１．５／１（好ましくは０．５／１～１．３／１）程度であることが望ましい。このようなシリコーンレジンにおけるオルガノポリシロキサンには、必要に応じて、ビニル基等の各種官能基が導入されていてもよい。なお、導入される官能基は、架橋反応を生じることが可能な官能基であってもよい。シリコーンレジンとしては、Ｍ単位とＱ単位からなるＭＱレジンが好ましい。シリコーンレジンにおけるオルガノポリシロキサンの重量平均分子量は、通常、１０００以上であるが、好ましくは１０００～２００００であり、特に１５００～１００００が好適である。 The silicone resin is not particularly limited as long as it is a silicone-based resin used for a silicone-based pressure-sensitive adhesive, and for example, an M unit composed of the constituent unit "R 3 Si 1/2 " and the constituent unit "SiO". It consists of a (co) polymer having at least one unit selected from the Q unit consisting of " 2 ", the T unit consisting of the constituent unit "RSiO 3/2 ", and the D unit consisting of the constituent unit "R 2 SiO". Examples thereof include silicone resins made of organopolysiloxane. In addition, R in the said structural unit represents a hydrocarbon group or a hydroxyl group. Examples of the hydrocarbon group include an aliphatic hydrocarbon group (an alkyl group such as a methyl group and an ethyl group), an alicyclic hydrocarbon group (a cycloalkyl group such as a cyclohexyl group), and an aromatic hydrocarbon group (such as a cycloalkyl group such as a cyclohexyl group). (Eryl groups such as phenyl group and naphthyl group) and the like can be mentioned. The ratio (ratio) between the M unit and at least one unit selected from the Q unit, the T unit, and the D unit is, for example, the former / the latter (molar ratio) = 0.3 / 1 to 1.5. It is preferably about 1/1 (preferably 0.5 / 1 to 1.3 / 1). Various functional groups such as a vinyl group may be introduced into the organopolysiloxane in such a silicone resin, if necessary. The functional group to be introduced may be a functional group capable of causing a crosslinking reaction. As the silicone resin, an MQ resin composed of M units and Q units is preferable. The weight average molecular weight of the organopolysiloxane in the silicone resin is usually 1000 or more, preferably 1000 to 20000, and particularly preferably 1500 to 10000.
　シリコーンゴムとシリコーンレジンとの配合割合としては、特に制限されないが、低粘着性、低タック性にコントロールしやすい点より、例えば、シリコーンゴム１００重量部に対して、シリコーンレジンが１００～２２０重量部（特に、１２０～１８０重量部）であることが好ましい。 The blending ratio of the silicone rubber and the silicone resin is not particularly limited, but from the viewpoint of easy control of low adhesiveness and low tackiness, for example, 100 to 220 parts by weight of the silicone resin is 100 parts by weight of the silicone rubber. (In particular, it is preferably 120 to 180 parts by weight).
　なお、シリコーンゴムとシリコーンレジンとを含有するシリコーン系粘着剤組成物において、シリコーンゴムとシリコーンレジンとは、単に混合されている混合状態であってもよく、互いに反応して、縮合物（特に部分縮合物）、架橋反応物、付加反応生成物等となっていてもよい。 In the silicone-based pressure-sensitive adhesive composition containing the silicone rubber and the silicone resin, the silicone rubber and the silicone resin may be in a mixed state in which they are simply mixed, and react with each other to form a condensate (particularly a portion). It may be a condensate), a cross-linking reaction product, an addition reaction product, or the like.
　付加型シリコーン系粘着剤として、例えば、商品名「ＳＤ４５８０」、商品名「ＳＤ４５８４」、商品名「ＳＤ４５８５」、商品名「ＳＤ４５８７Ｌ」、商品名「ＳＤ４５６０」、商品名「ＳＤ４５７０」、商品名「ＳＤ４６００ＦＣ」、商品名「ＳＤ４５９３」、商品名「ＳＥ１７００」（以上、ダウ・東レ株式会社製）；商品名「ＫＲ－３７００」、商品名「ＫＲ－３７０１」、商品名「Ｘ－４０－３２３７－１」、商品名「Ｘ－４０－３２４０」、商品名「Ｘ－４０－３２９１－１」、商品名「Ｘ－４０－３３０６」（以上、信越化学工業株式会社製）が市販されている。また、過酸化物硬化型シリコーン系粘着剤として、例えば、商品名「ＫＲ－１００」、商品名「ＫＲ－１０１－１０」、商品名「ＫＲ－１３０」（以上、信越化学工業株式会社製）などが市販されている。 As the add-on silicone adhesive, for example, product name "SD4580", product name "SD4584", product name "SD4585", product name "SD4587L", product name "SD4560", product name "SD4570", product name "SD4600FC". , Product name "SD4593", Product name "SE1700" (all manufactured by Dow Toray Co., Ltd.); Product name "KR-3700", Product name "KR-3701", Product name "X-40-3237-1" , The product name "X-40-3240", the product name "X-40-3291-1", and the product name "X-40-3306" (all manufactured by Shin-Etsu Chemical Industry Co., Ltd.) are commercially available. Further, as a peroxide-curable silicone-based adhesive, for example, the product name "KR-100", the product name "KR-101-10", and the product name "KR-130" (all manufactured by Shin-Etsu Chemical Co., Ltd.). Etc. are commercially available.
　シリコーンゴムとシリコーンレジンとを含有するシリコーン系粘着剤組成物は、低粘着性、低タック性にコントロールしやすい点、粘着面の濡れ性の経時的変化を抑制して、搬送中の電子部品の脱落や位置ずれを抑制できる観点より、架橋剤を含んでいることが好ましい。はく離ライナーを剥離後に大気環境下に曝露された状態で粘着面の濡れ性が経時的に変化する原因は、はく離ライナーの表面に形成された剥離層に含まれる剥離剤が粘着剤層に移行し、粘着剤層に移行した剥離剤が、粘着面の表面にブリードアウトするためと考えられる。従って、シリコーン系粘着剤層におけるシリコーンゴムとシリコーンレジンを架橋し、粘着剤層に移行した剥離剤の粘着剤層内での移動を抑制して、粘着面の表面への剥離剤のブリードアウトを抑制することにより、粘着面の濡れ性の経時的変化を抑制することができると考えられる。なお、これは推測であり、本発明を限定するものとして解釈すべきではない。このような架橋剤としては、特に制限されないが、シロキサン系架橋剤（シリコーン系架橋剤）、過酸化物系架橋剤を好適に用いることができる。中でも、シロキサン系架橋剤が好ましい。架橋剤は１種単独で又は２種以上組み合わせて使用することができる。 The silicone-based adhesive composition containing silicone rubber and silicone resin is easy to control with low adhesiveness and low tackiness, and suppresses changes in the wettability of the adhesive surface over time, so that the electronic parts being transported It is preferable to contain a cross-linking agent from the viewpoint of suppressing dropping and misalignment. The reason why the wettability of the adhesive surface changes with time when the peeling liner is exposed to the air environment after peeling is that the peeling agent contained in the peeling layer formed on the surface of the peeling liner moves to the adhesive layer. It is considered that the release agent transferred to the pressure-sensitive adhesive layer bleeds out to the surface of the pressure-sensitive adhesive surface. Therefore, the silicone rubber and the silicone resin in the silicone-based pressure-sensitive adhesive layer are crosslinked to suppress the movement of the release agent transferred to the pressure-sensitive adhesive layer in the pressure-sensitive adhesive layer, and the release agent bleeds out to the surface of the pressure-sensitive adhesive surface. By suppressing it, it is considered that the change over time in the wettability of the adhesive surface can be suppressed. It should be noted that this is a guess and should not be construed as limiting the present invention. The cross-linking agent is not particularly limited, but a siloxane-based cross-linking agent (silicone-based cross-linking agent) and a peroxide-based cross-linking agent can be preferably used. Of these, a siloxane-based cross-linking agent is preferable. The cross-linking agent can be used alone or in combination of two or more.
　前記シロキサン系架橋剤としては、例えば、分子中にケイ素原子に結合している水素原子を２個以上有するポリオルガノハイドロジェンシロキサンを好適に用いることができる。このようなポリオルガノハイドロジェンシロキサンにおいて、水素原子が結合しているケイ素原子には、水素原子以外に各種有機基が結合していてもよい。該有機基としては、メチル基、エチル基等のアルキル基；フェニル基等のアリール基の他、ハロゲン化アルキル基などが挙げられるが、合成や取り扱いの観点から、メチル基が好ましい。また、ポリオルガノハイドロジェンシロキサンの骨格構造は、直鎖状、分岐状、環状のいずれの骨格構造を有していてもよいが、直鎖状が好適である。 As the siloxane-based cross-linking agent, for example, polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms in the molecule can be preferably used. In such a polyorganohydrogensiloxane, various organic groups may be bonded to the silicon atom to which the hydrogen atom is bonded in addition to the hydrogen atom. Examples of the organic group include an alkyl group such as a methyl group and an ethyl group; an aryl group such as a phenyl group, and an alkyl halide group, but a methyl group is preferable from the viewpoint of synthesis and handling. The skeleton structure of the polyorganohydrogensiloxane may have any of linear, branched, and cyclic skeleton structures, but linear skeletons are preferable.
　前記過酸化物系架橋剤としては、例えば、ジアシルパーオキサイド、アルキルパーオキシエステル、パーオキシジカーボネート、モノパーオキシカーボネート、パーオキシケタール、ジアルキルパーオキサイド、ハイドロパーオキサイド、ケトンパーオキサイドなどを使用できる。より具体的には、例えば、過酸化ベンゾイル、ｔ－ブチルパーオキシベンゾエート、ジクミルパーオキサイド、ｔ－ブチルクミルパーオキサイド、ジ－ｔ－ブチルパーオキサイド、２，５－ジメチル－２，５－ジ－ｔ－ブチルパーオキシヘキサン、２，４－ジクロロ－ベンゾイルパーオキサイド、ジ－ｔ－ブチルパーオキシ－ジイソプロピルベンゼン、１，１－ビス（ｔ－ブチルパーオキシ）－３，３，５－トリメチルシクロヘキサン、２，５－ジメチル－２，５－ジ－ｔ－ブチルパーオキシヘキシン－３などが挙げられる。 As the peroxide-based cross-linking agent, for example, diacyl peroxide, alkyl peroxy ester, peroxy dicarbonate, monoperoxy carbonate, peroxyketal, dialkyl peroxide, hydroperoxide, ketone peroxide and the like can be used. .. More specifically, for example, benzoyl peroxide, t-butylperoxybenzoate, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5-di. -T-Butylperoxyhexane, 2,4-dichloro-benzoyl peroxide, di-t-butylperoxy-diisopropylbenzene, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane , 2,5-Dimethyl-2,5-di-t-butylperoxyhexin-3 and the like.
　シロキサン系架橋剤として、例えば、商品名「ＢＹ２４－７４１」、商品名「ＳＥ１７００Ｃａｔａｌｙｓｔ」（以上、ダウ・東レ株式会社製）；商品名「Ｘ－９２－１２２」（以上、信越化学工業株式会社製）が市販されている。 As the siloxane-based cross-linking agent, for example, the product name "BY24-741", the product name "SE1700Catalyst" (above, manufactured by Dow Toray Co., Ltd.); the product name "X-92-122" (above, manufactured by Shin-Etsu Chemical Co., Ltd.). ) Is commercially available.
　シリコーン系粘着剤組成物が架橋剤を含む場合、上記架橋剤の使用量は、特に限定されないが、低粘着性、低タック性を制御して、搬送中の電子部品の脱落や位置ずれを抑制できる観点から、ベースポリマー１００重量部に対して、０．５重量部以上であることが好ましく、より好ましくは０．７重量部以上、さらに好ましくは１重量部以上である。また、上記使用量の上限は、粘着剤層において適度な柔軟性を得て、粘着力を向上させる点より、ベースポリマー１００重量部に対して、１０重量部以下であることが好ましく、より好ましくは５重量部以下である。 When the silicone-based pressure-sensitive adhesive composition contains a cross-linking agent, the amount of the cross-linking agent used is not particularly limited, but low adhesiveness and low tackiness are controlled to suppress dropping and misalignment of electronic parts during transportation. From the viewpoint of being able to do so, it is preferably 0.5 parts by weight or more, more preferably 0.7 parts by weight or more, and further preferably 1 part by weight or more with respect to 100 parts by weight of the base polymer. Further, the upper limit of the amount used is preferably 10 parts by weight or less with respect to 100 parts by weight of the base polymer, more preferably, from the viewpoint of obtaining appropriate flexibility in the pressure-sensitive adhesive layer and improving the adhesive strength. Is 5 parts by weight or less.
　前記付加型シリコーン系粘着剤組成物には、白金触媒などの硬化触媒を含むことが好ましい。白金触媒として、例えば、商品名「ＣＡＴ－ＰＬ－５０Ｔ」（信越化学工業株式会社製）、「ＤＯＷＳＩＬ　ＮＣ－２５　Ｃａｔａｌｙｓｔ」または「ＤＯＷＳＩＬ　ＳＲＸ２１２ Ｃａｔａｌｙｓｔ」（以上、ダウ・東レ株式会社製）などが市販されている。粘着剤層の電子部品の受け取り性、位置精度、実装基板への転写性やタック力等のバランスの観点から、硬化触媒の含有量は、ベースポリマーとしてのシリコーン系ポリマー（シリコーンゴム、シリコーンレジン等を含む）１００重量部に対して、０．１～１０重量部程度が好ましい。 The additive silicone-based pressure-sensitive adhesive composition preferably contains a curing catalyst such as a platinum catalyst. As platinum catalysts, for example, trade names "CAT-PL-50T" (manufactured by Shin-Etsu Chemical Co., Ltd.), "DOWNSIL NC-25 Catalyst" or "DOWNSIL SRX212 Catalyst" (manufactured by Dow Toray Co., Ltd.) are commercially available. Has been done. From the viewpoint of the balance between the receivability of electronic parts of the adhesive layer, position accuracy, transferability to the mounting substrate, tack force, etc., the content of the curing catalyst is determined by the silicone polymer (silicone rubber, silicone resin, etc.) as the base polymer. (Including) 100 parts by weight, preferably about 0.1 to 10 parts by weight.
　本発明の樹脂組成物は、必要に応じて、さらに、粘着付与樹脂（ロジン誘導体、ポリテルペン樹脂、石油樹脂、油溶性フェノールなど）、老化防止剤、充填剤、着色剤（顔料や染料など）、紫外線吸収剤、酸化防止剤、連鎖移動剤、可塑剤、軟化剤、界面活性剤、帯電防止剤などの添加剤を、本発明の効果を損なわない範囲で含有していてもよい。なお、このような添加剤は、単独で又は２種以上組み合わせて用いることができる。 The resin composition of the present invention further comprises a tackifier resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an antiaging agent, a filler, a colorant (pigment, dye, etc.), if necessary. Additives such as an ultraviolet absorber, an antioxidant, a chain transfer agent, a plasticizer, a softener, a surfactant, and an antioxidant may be contained within a range that does not impair the effects of the present invention. Such additives can be used alone or in combination of two or more.
　本発明の粘着剤層（特に、アクリル系粘着剤層）の作製方法は、特に限定されないが、例えば、上記樹脂組成物を基材又ははく離ライナー上に塗布（塗工）し、得られた粘着剤組成物層を乾燥硬化させることや、上記樹脂組成物を基材又ははく離ライナー上に塗布（塗工）し、得られた粘着剤組成物層に活性エネルギー線を照射して硬化させることが挙げられる。また、必要に応じて、さらに、加熱乾燥してもよい。 The method for producing the pressure-sensitive adhesive layer (particularly, the acrylic pressure-sensitive adhesive layer) of the present invention is not particularly limited, but for example, the above-mentioned resin composition is applied (coated) on a base material or a peeling liner to obtain a pressure-sensitive adhesive. The agent composition layer can be dried and cured, or the above resin composition can be applied (coated) on a base material or a peeling liner, and the obtained pressure-sensitive adhesive composition layer can be irradiated with active energy rays to be cured. Can be mentioned. Further, if necessary, it may be further heated and dried.
　上記活性エネルギー線としては、例えば、α線、β線、γ線、中性子線、電子線などの電離性放射線や、紫外線などが挙げられ、特に、紫外線が好ましい。また、活性エネルギー線の照射エネルギー、照射時間、照射方法などは特に制限されない。 Examples of the active energy rays include ionizing radiation such as α rays, β rays, γ rays, neutron rays, and electron beams, ultraviolet rays, and the like, and ultraviolet rays are particularly preferable. Further, the irradiation energy of the active energy ray, the irradiation time, the irradiation method, and the like are not particularly limited.
　上記樹脂組成物は、公知乃至慣用の方法で作製することができる。例えば、溶剤型のアクリル系粘着剤組成物は、上記アクリル系ポリマーを含有する溶液に、必要に応じて、添加剤（例えば、紫外線吸収剤など）を混合することにより、作製することができる。例えば、活性エネルギー線硬化型のアクリル系粘着剤組成物は、上記アクリル系モノマーの混合物又はその部分重合物に、必要に応じて、添加剤（例えば、紫外線吸収剤など）を混合することにより、作製することができる。 The above resin composition can be produced by a known or conventional method. For example, a solvent-type acrylic pressure-sensitive adhesive composition can be prepared by mixing an additive (for example, an ultraviolet absorber, etc.) with a solution containing the acrylic polymer, if necessary. For example, the active energy ray-curable acrylic pressure-sensitive adhesive composition is prepared by mixing an additive (for example, an ultraviolet absorber) with the mixture of the acrylic monomers or a partial polymer thereof, if necessary. Can be made.
　なお、上記樹脂組成物の塗布（塗工）には、公知のコーティング法を利用してもよい。例えば、グラビヤロールコーター、リバースロールコーター、キスロールコーター、ディップロールコーター、バーコーター、ナイフコーター、スプレーコーター、コンマコーター、ダイレクトコーターなどのコーターが用いられてもよい。 A known coating method may be used for applying (coating) the above resin composition. For example, a coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, or a direct coater may be used.
　特に、活性エネルギー線硬化型の粘着剤組成物により粘着剤層を形成する場合、活性エネルギー線硬化型の粘着剤組成物は光重合開始剤を含むことが好ましい。なお、活性エネルギー線硬化型の粘着剤組成物が紫外線吸収剤を含有する場合には、光重合開始剤として、広い波長範囲で吸光特性を有する光重合開始剤を少なくとも含むことが好ましい。例えば、紫外光に加え、可視光でも吸光特性を有する光重合開始剤を少なくとも含むことが好ましい。これは、紫外線吸収剤の作用により活性エネルギー線による硬化の阻害が懸念されるところ、広い波長範囲で吸光特性を有する光重合開始剤を含んでいると、粘着剤組成物において高い光硬化性が得やすくなるからである。 In particular, when the pressure-sensitive adhesive layer is formed by the active energy ray-curable pressure-sensitive adhesive composition, it is preferable that the active energy ray-curable pressure-sensitive adhesive composition contains a photopolymerization initiator. When the active energy ray-curable pressure-sensitive adhesive composition contains an ultraviolet absorber, it is preferable that the photopolymerization initiator contains at least a photopolymerization initiator having absorption characteristics in a wide wavelength range. For example, in addition to ultraviolet light, it is preferable to contain at least a photopolymerization initiator having absorption characteristics even in visible light. This is because there is a concern that the action of the ultraviolet absorber may inhibit the curing by the active energy rays. However, if a photopolymerization initiator having absorption characteristics in a wide wavelength range is contained, the pressure-sensitive adhesive composition has high photocurability. This is because it is easy to obtain.
（はく離ライナー）
　本発明の粘着剤層及び／又は別の粘着剤層の粘着面は、使用時までははく離ライナーにより保護されている。本発明の粘着剤層が両面粘着シートを構成する場合の各粘着面は、２枚のはく離ライナーによりそれぞれ保護されていてもよいし、両面が剥離面となっているはく離ライナー１枚により、ロール状に巻回される形態（巻回体）で保護されていてもよい。はく離ライナーは粘着剤層の衝撃吸収性、粘着性の保護材として用いられ、使用する際に剥がされる。また、本発明の粘着剤層が基材レス粘着シートを構成する場合、はく離ライナーは粘着剤層の支持体としての役割も担う。 (Release liner)
The adhesive surface of the pressure-sensitive adhesive layer and / or another pressure-sensitive adhesive layer of the present invention is protected by a peeling liner until use. When the pressure-sensitive adhesive layer of the present invention constitutes a double-sided pressure-sensitive adhesive sheet, each pressure-sensitive adhesive surface may be protected by two peeling liners, or a roll may be provided by one peeling liner having both sides as peeling surfaces. It may be protected in a form of being wound in a shape (winding body). The peeling liner is used as a shock-absorbing and adhesive protective material for the adhesive layer, and is peeled off during use. Further, when the pressure-sensitive adhesive layer of the present invention constitutes a base material-less pressure-sensitive adhesive sheet, the peeling liner also serves as a support for the pressure-sensitive adhesive layer.
　上記はく離ライナーとしては、慣用の剥離紙などを使用でき、特に限定されないが、例えば、剥離層を有する基材などが挙げられる。上記剥離層を有する基材としては、例えば、シリコーン系、長鎖アルキル系、フッ素系等の剥離剤により表面処理されたプラスチックフィルムや紙などが挙げられる。 As the peeling liner, a conventional release paper or the like can be used, and the present invention is not particularly limited, and examples thereof include a base material having a release layer. Examples of the base material having the release layer include plastic films and paper surface-treated with a release agent such as silicone-based, long-chain alkyl-based, and fluorine-based.
　シリコーン系剥離剤は、付加反応型、縮合反応型、カチオン重合型、ラジカル重合型などの、公知のシリコーン系剥離剤が挙げられる。付加反応型シリコーン系剥離剤として市販されている製品には、例えば、ＫＳ－７７６Ａ、ＫＳ－８４７Ｔ、ＫＳ－７７９Ｈ、ＫＳ－８３７、ＫＳ－７７８、ＫＳ－８３０（信越化学工業株式会社製）、ＳＲＸ－２１１、ＳＲＸ－３４５、ＳＲＸ－３５７、ＳＤ７３３３、ＳＤ７２２０、ＳＤ７２２３、ＬＴＣ－３００Ｂ、ＬＴＣ－３５０Ｇ、ＬＴＣ－３１０（ダウ・東レ株式会社製）などが挙げられる。縮合反応型として市販されている製品には、例えば、ＳＲＸ－２９０、ＳＹＬＯＦＦ－２３（ダウ・東レ株式会社製）などが挙げられる。カチオン重合型として市販されている製品には、例えば、ＴＰＲ－６５０１、ＴＰＲ－６５００、ＵＶ９３００、ＶＵ９３１５、ＵＶ９４３０（モメンティブ・パーフォーマンス・マテリアルズ社製）、Ｘ６２－７６２２（信越化学工業株式会社製）などが挙げられる。ラジカル重合型として市販されている製品には、例えば、Ｘ６２－７２０５（信越化学工業株式会社製）などが挙げられる。また、これらの剥離剤に剥離性能の調整のために、シリコーンレジン（Ｒ3ＳｉＯ1/2単位とＳｉＯ4/2単位からなるケイ素樹脂）やシリカ、エチルセルロースなどを添加しても良い。 Examples of the silicone-based release agent include known silicone-based release agents such as addition reaction type, condensation reaction type, cationic polymerization type, and radical polymerization type. Products commercially available as addition reaction type silicone release agents include, for example, KS-776A, KS-847T, KS-779H, KS-837, KS-778, KS-830 (manufactured by Shin-Etsu Chemical Co., Ltd.). Examples thereof include SRX-211, SRX-345, SRX-357, SD7333, SD7220, SD7223, LTC-300B, LTC-350G, and LTC-310 (manufactured by Dow Toray Co., Ltd.). Examples of products commercially available as a condensation reaction type include SRX-290 and SYLOFF-23 (manufactured by Dow Toray Co., Ltd.). Products commercially available as cationically polymerized products include, for example, TPR-6501, TPR-6500, UV9300, VU9315, UV9430 (manufactured by Momentive Performance Materials), X62-7622 (manufactured by Shin-Etsu Chemical Co., Ltd.). And so on. Examples of products commercially available as a radical polymerization type include X62-7205 (manufactured by Shin-Etsu Chemical Co., Ltd.). Further, in order to adjust the peeling performance, silicone resin (silicon resin composed of R 3 SiO 1/2 unit and SiO 4/2 unit), silica, ethyl cellulose and the like may be added to these release agents.
　長鎖アルキル基径剥離剤には、長鎖アルキル基含有アミノアルキッド樹脂、長鎖アルキル基含有アクリル樹脂、長鎖脂肪族ペンダント型樹脂（ポリビニルアルコール、エチレン／ビニルアルコール共重合物、ポリエチレンイミン、および水酸基含有セルロース誘導体からなる化合物群の中から選ばれる少なくとも１種の活性水素含有ポリマーと、長鎖アルキル基含有イソシアネートとの反応生成物）などの、公知の長鎖アルキル系剥離剤が挙げられる。硬化剤、紫外線開始剤を添加して硬化反応を行う剥離剤でもよいし、溶剤を揮発させて固化する剥離剤でもよい。 Long-chain alkyl group diameter strippers include long-chain alkyl group-containing aminoalkyd resins, long-chain alkyl group-containing acrylic resins, long-chain aliphatic pendant resins (polyvinyl alcohol, ethylene / vinyl alcohol copolymers, polyethyleneimine, and Examples thereof include known long-chain alkyl-based release agents (reaction products of at least one active hydrogen-containing polymer selected from the compound group consisting of hydroxyl group-containing cellulose derivatives) and long-chain alkyl group-containing isocyanates. It may be a release agent that carries out a curing reaction by adding a curing agent or an ultraviolet initiator, or it may be a release agent that volatilizes and solidifies a solvent.
　「長鎖アルキル基」としては、炭素数が８～３０のアルキル基が好ましく、炭素数が１０以上、１２以上、１８以下、２４以下等でもよく、中でも直鎖状のアルキル基が好ましい。具体例としては、デシル基、ウンデシル基、ラウリル基、ドデシル基、トリデシル基、ミリスチル基、テトラデシル基、ペンタデシル基、セチル基、パルミチル基、ヘキサデシル基、ヘプタデシル基、ステアリル基、オクタデシル基、ノナデシル基、イコシル基、ドコシル基等から選択される、１種又は２種以上のアルキル基が挙げられる。 As the "long-chain alkyl group", an alkyl group having 8 to 30 carbon atoms is preferable, and an alkyl group having 10 or more carbon atoms, 12 or more, 18 or less, 24 or less, etc. may be used, and a linear alkyl group is particularly preferable. Specific examples include a decyl group, an undecyl group, a lauryl group, a dodecyl group, a tridecylic group, a myristyl group, a tetradecyl group, a pentadecyl group, a cetyl group, a palmitic acid group, a hexadecyl group, a heptadecyl group, a stearyl group, an octadecyl group, and a nonadecylic group. Examples thereof include one or more alkyl groups selected from an icosyl group, a docosyl group and the like.
　長鎖アルキル系剥離剤として市販されている製品には、例えば、アシオ産業株式会社製アシオレジン（登録商標）ＲＡ－３０、一方社油脂工業株式会社製ピーロイル（登録商標）１０１０、ピーロイル１０１０Ｓ、ピーロイル１０５０、ピーロイルＨＴ、中京油脂株式会社製レゼムＮ－１３７、花王株式会社製エキセパール（登録商標）ＰＳ－ＭＡ、日立化成株式会社製テスファイン（登録商標）３０３等が挙げられる。 Products commercially available as long-chain alkyl release agents include, for example, Asioresin (registered trademark) RA-30 manufactured by Asio Sangyo Co., Ltd., Pyroyl (registered trademark) 1010, Pyroyl 1010S, and Pyroyl 1050 manufactured by Yushi Kogyo Co., Ltd. , Piroyl HT, Resem N-137 manufactured by Chukyo Yushi Co., Ltd., Exepearl (registered trademark) PS-MA manufactured by Kao Co., Ltd., Tessfine (registered trademark) 303 manufactured by Hitachi Kasei Co., Ltd., and the like.
　フッ素系剥離剤としては、パーフルオロアルキル基含有ビニルエーテルポリマーや、テトラフルオロエチレン、トリフルオロエチレンなどのフッ素樹脂をバインダー樹脂中に分散させたコーティング剤などが挙げられる。 Examples of the fluorine-based release agent include a vinyl ether polymer containing a perfluoroalkyl group and a coating agent in which a fluororesin such as tetrafluoroethylene or trifluoroethylene is dispersed in a binder resin.
　剥離剤は、必要に応じて、帯電防止剤、シランカップリング剤、滑剤などを含有しても良い。
　プラスチックフィルムや紙の表面に、剥離剤層を形成するのは、公知の方法で行えばよい。具体的には、グラビアコーティング、メイヤーバーコーティング、エアーナイフコーティングなどの、公知の塗工方法を使用することができる。
　はく離ライナーの厚さは、特に限定されず、５～１００μｍの範囲から適宜選択すればよい。 The release agent may contain an antistatic agent, a silane coupling agent, a lubricant and the like, if necessary.
The release agent layer may be formed on the surface of the plastic film or paper by a known method. Specifically, known coating methods such as gravure coating, Mayer bar coating, and air knife coating can be used.
The thickness of the peeling liner is not particularly limited and may be appropriately selected from the range of 5 to 100 μm.
（別の粘着剤層）
　本発明の粘着剤層は、前記粘着面とは反対側の面に別の粘着剤層が積層した粘着シートを構成してもよい。すなわち、本発明の粘着剤層は、２層構造の粘着剤層を有する基材レス両面粘着シートを構成してもよい。本発明の粘着剤層が、２層構造の粘着剤層を有する基材レス両面粘着シート基材レス両面粘着シートを構成することにより、例えば、本発明の粘着剤層が別の粘着剤層と共に、衝撃吸収性を制御することができる。また、別の粘着剤層を他の基板（キャリア基板）に固定することができ、作業性の観点から好ましい。 (Another adhesive layer)
The pressure-sensitive adhesive layer of the present invention may form a pressure-sensitive adhesive sheet in which another pressure-sensitive adhesive layer is laminated on a surface opposite to the pressure-sensitive adhesive surface. That is, the pressure-sensitive adhesive layer of the present invention may constitute a base-less double-sided pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer having a two-layer structure. The pressure-sensitive adhesive layer of the present invention comprises a base material-less double-sided pressure-sensitive adhesive sheet having a two-layer structure pressure-sensitive adhesive layer, whereby, for example, the pressure-sensitive adhesive layer of the present invention is combined with another pressure-sensitive adhesive layer. , Shock absorption can be controlled. Further, another pressure-sensitive adhesive layer can be fixed to another substrate (carrier substrate), which is preferable from the viewpoint of workability.
　前記別の粘着剤層は、本発明の粘着剤層と同一の粘着剤で構成されていてもよく、本発明の粘着剤層と異なる粘着剤で構成されていてもよい。例えば、放射線硬化性粘着剤や加熱発泡型粘着剤などの粘着力低減可能型粘着剤層であることが好ましい。別の粘着剤層とキャリア基板との密着性が高い状態で電子部品を転写でき、また、その後に放射線照射や加熱により他の粘着剤層の粘着力を低下させてキャリア基板から容易に剥離することができるため、キャリア基板を容易に再利用でき、リワーク性に優れる観点から好ましい。 The other pressure-sensitive adhesive layer may be composed of the same pressure-sensitive adhesive as the pressure-sensitive adhesive layer of the present invention, or may be composed of a pressure-sensitive adhesive different from the pressure-sensitive adhesive layer of the present invention. For example, a layer of a pressure-sensitive adhesive that can reduce the adhesive strength, such as a radiation-curable pressure-sensitive adhesive or a heat-foaming type pressure-sensitive adhesive, is preferable. Electronic components can be transferred with high adhesion between another adhesive layer and the carrier substrate, and then the adhesive strength of the other adhesive layer is reduced by irradiation or heating to easily peel off from the carrier substrate. Therefore, the carrier substrate can be easily reused, which is preferable from the viewpoint of excellent reworkability.
　別の粘着剤層の厚みは、特に限定されないが、１μｍ以上が好ましく、より好ましくは３μｍ以上である。厚みが一定以上であると、衝撃吸収性を制御しやくなり、また、キャリア基板に安定して固定しやすくなり、好ましい。また、別の粘着剤層の厚みの上限値は、特に限定されないが、４５０μｍ以下が好ましく、より好ましくは３００μｍ以下である。厚みが一定以下であると、キャリア基板から剥離しやすくなり、リワーク性が向上し、好ましい。 The thickness of the separate pressure-sensitive adhesive layer is not particularly limited, but is preferably 1 μm or more, and more preferably 3 μm or more. When the thickness is a certain value or more, it becomes easy to control the shock absorption and it becomes easy to stably fix it to the carrier substrate, which is preferable. The upper limit of the thickness of another pressure-sensitive adhesive layer is not particularly limited, but is preferably 450 μm or less, and more preferably 300 μm or less. When the thickness is not more than a certain level, it is easy to peel off from the carrier substrate, and reworkability is improved, which is preferable.
（基材）
　本発明の粘着剤層（別の粘着剤層との２層構造を含む）は、前記粘着面とは反対側の面に基材層が積層されている粘着シートを構成してもよい。すなわち、本発明の粘着剤層（別の粘着剤層との２層構造を含む）は基材付き粘着シートを構成していてもよい。本発明の粘着剤層が基材付き粘着シートを構成することにより、基材が支持体として機能し、電子部品を受け取る際の安定性や取り扱い性が向上する点で好ましい。 (Base material)
The pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) may form a pressure-sensitive adhesive sheet in which a base material layer is laminated on a surface opposite to the pressure-sensitive adhesive surface. That is, the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) may constitute a pressure-sensitive adhesive sheet with a base material. When the pressure-sensitive adhesive layer of the present invention constitutes a pressure-sensitive adhesive sheet with a base material, the base material functions as a support, which is preferable in that stability and handleability when receiving electronic components are improved.
　上記基材としては、特に限定されないが、例えば、プラスチックフィルムを好適に用いることができる。プラスチック基材の構成材料としては、電子部品を受け取る際の安定性や取り扱い性の観点から、熱可塑性樹脂が好ましい。熱可塑性樹脂としては、例えば、ポリオレフィン、ポリエステル、ポリウレタン、ポリカーボネート、ポリエーテルエーテルケトン、ポリイミド、ポリエーテルイミド、ポリアミド、全芳香族ポリアミド、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリフェニルスルフィド、アラミド、フッ素樹脂、セルロース系樹脂、およびシリコーン樹脂が挙げられ、ポリエステルフィルムが好ましい。ポリオレフィンとしては、例えば、低密度ポリエチレン、直鎖状低密度ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、超低密度ポリエチレン、ランダム共重合ポリプロピレン、ブロック共重合ポリプロピレン、ホモポリプロレン、ポリブテン、ポリメチルペンテン、エチレン－酢酸ビニル共重合体、アイオノマー樹脂、エチレン－(メタ)アクリル酸共重合体、エチレン－(メタ)アクリル酸エステル共重合体、エチレン－ブテン共重合体、およびエチレン－ヘキセン共重合体が挙げられる。ポリエステルとしては、例えば、ポリエチレンテレフタレート、ポリエチレンナフタレート、およびポリブチレンテレフタレートが挙げられる。基材は、電子部品を受け取る際の安定性や取り扱い性の観点から、ポリエステルフィルムから形成されることが好ましい。基材は、一種類の材料からなってもよし、二種類以上の材料からなってもよい。基材は、単層構造を有してもよいし、多層構造を有してもよい。また、基材は、プラスチックフィルムよりなる場合、無延伸フィルムであってもよいし、一軸延伸フィルムであってもよいし、二軸延伸フィルムであってもよい。使用時に剥離されるはく離ライナーは「基材」には含まない。 The base material is not particularly limited, but for example, a plastic film can be preferably used. As the constituent material of the plastic base material, a thermoplastic resin is preferable from the viewpoint of stability and handleability when receiving electronic parts. Examples of the thermoplastic resin include polyolefins, polyesters, polyurethanes, polycarbonates, polyether ether ketones, polyimides, polyetherimides, polyamides, all aromatic polyamides, polyvinyl chlorides, polyvinylidene chlorides, polyphenylsulfides, aramids, and fluororesins. , Cellulosic resin, and silicone resin, and polyester film is preferable. Examples of the polyolefin include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolyprolene, polybutene, and polymethylpentene. Examples include ethylene-vinyl acetate copolymers, ionomer resins, ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid ester copolymers, ethylene-butene copolymers, and ethylene-hexene copolymers. Be done. Examples of the polyester include polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate. The base material is preferably formed of a polyester film from the viewpoint of stability and handleability when receiving electronic components. The base material may be made of one kind of material or may be made of two or more kinds of materials. The base material may have a single-layer structure or a multi-layer structure. When the base material is made of a plastic film, it may be a non-stretched film, a uniaxially stretched film, or a biaxially stretched film. The peeling liner that is peeled off during use is not included in the "base material".
　上記基材の厚みは、特に限定されないが、例えば、支持体として機能するための強度を確保するという観点からは、好ましくは１０μｍ以上、より好ましくは３０μｍ以上である。また、適度な可撓性を実現するという観点からは、基材の厚さは、好ましくは２００μｍ以下、より好ましくは１８０μｍ以下である。なお、上記基材は単層および複層のいずれの形態を有していてもよい。また、上記基材の表面には、本発明の粘着剤層との密着性を高めるため、例えば、コロナ放電処理、プラズマ処理等の物理的処理、下塗り処理等の化学的処理などの公知慣用の表面処理が適宜施されていてもよい。 The thickness of the base material is not particularly limited, but is preferably 10 μm or more, more preferably 30 μm or more, for example, from the viewpoint of ensuring the strength for functioning as a support. Further, from the viewpoint of achieving appropriate flexibility, the thickness of the base material is preferably 200 μm or less, more preferably 180 μm or less. The base material may have either a single layer or a plurality of layers. Further, in order to improve the adhesion to the pressure-sensitive adhesive layer of the present invention, the surface of the base material is known and commonly used, for example, physical treatment such as corona discharge treatment and plasma treatment, and chemical treatment such as undercoat treatment. Surface treatment may be appropriately applied.
　本発明の粘着剤層（別の粘着剤層との２層構造を含む）が基材付き粘着シートを構成する場合、前記基材層の粘着剤層が積層されていない面に、別の粘着剤層が積層されていてもよい。すなわち、本発明の粘着剤層（別の粘着剤層との２層構造を含む）は、基材付き両面粘着シートを構成してもよい。本発明の粘着剤層（別の粘着剤層との２層構造を含む）が基材付き両面粘着シートを構成することにより、基材が支持体として機能し、電子部品を受け取る際の安定性や取り扱い性が向上すると共に、別の粘着剤層を他の基板（キャリア基板）に固定することができ、作業性の観点から好ましい。 When the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) constitutes a pressure-sensitive adhesive sheet with a base material, another pressure-sensitive adhesive layer is formed on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated. The agent layer may be laminated. That is, the pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) may form a double-sided pressure-sensitive adhesive sheet with a base material. The pressure-sensitive adhesive layer of the present invention (including a two-layer structure with another pressure-sensitive adhesive layer) constitutes a double-sided pressure-sensitive adhesive sheet with a base material, so that the base material functions as a support and stability when receiving electronic components. It is preferable from the viewpoint of workability because it is possible to fix another pressure-sensitive adhesive layer to another substrate (carrier substrate) while improving the handleability.
（粘着シートの製造方法）
　本発明の粘着剤層を有する粘着シート（本明細書において、「本発明の粘着シート」と称する場合がある。）の製造方法は、本発明の樹脂組成物（粘着剤組成物）の組成などによって異なり、特に限定されず、公知の形成方法を利用することができるが、例えば、以下の（１）～（４）などの方法が挙げられる。
（１）上記樹脂組成物を基材上に塗布（塗工）して組成物層を形成し、該組成物層を硬化（例えば、熱硬化や紫外線などの活性エネルギー線照射による硬化）させて粘着剤層を形成して粘着シートを製造する方法
（２）上記樹脂組成物を、はく離ライナー上に塗布（塗工）して組成物層を形成し、該組成物層を硬化（例えば、熱硬化や紫外線などの活性エネルギー線照射による硬化）させて粘着剤層を形成した後、該粘着剤層を基材上に転写して粘着シートを製造する方法
（３）上記樹脂組成物を、基材上に塗布（塗工）し、乾燥させて粘着剤層を形成して粘着シートを製造する方法
（４）上記樹脂組成物を、はく離ライナー上に塗布（塗工）し、乾燥させて粘着剤層を形成した後、該粘着剤層を基材上に転写して粘着シートを製造する方法 (Manufacturing method of adhesive sheet)
The method for producing a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention (sometimes referred to as “the pressure-sensitive adhesive sheet of the present invention” in the present specification) includes the composition of the resin composition (pressure-sensitive adhesive composition) of the present invention. It depends on the above, and the known forming method can be used without particular limitation, and examples thereof include the following methods (1) to (4).
(1) The above resin composition is applied (coated) on a substrate to form a composition layer, and the composition layer is cured (for example, heat curing or curing by irradiation with an active energy ray such as ultraviolet rays). Method of Forming Adhesive Layer to Produce Adhesive Sheet (2) The above resin composition is applied (coated) on a peeling liner to form a composition layer, and the composition layer is cured (for example, heat). A method of forming an adhesive layer by curing or irradiating with an active energy ray such as ultraviolet rays) and then transferring the adhesive layer onto a substrate to produce an adhesive sheet (3) Based on the above resin composition. A method of applying (coating) on a material and drying to form an adhesive layer to produce an adhesive sheet (4) The above resin composition is applied (coated) on a peeling liner, dried and adhered. A method for producing an adhesive sheet by transferring the adhesive layer onto a substrate after forming the agent layer.
　上記（１）～（４）における製膜方法としては、生産性に優れるという点で、乾燥させて粘着剤層を形成させる方法が好ましい。 As the film forming method in the above (1) to (4), a method of forming a pressure-sensitive adhesive layer by drying is preferable in terms of excellent productivity.
　上記樹脂組成物を所定の面上に塗布（塗工）する方法としては、公知のコーティング方法を採用することがき、特に限定されないが、例えば、ロールコート、キスロールコート、グラビアコート、リバースコート、ロールブラッシュ、スプレーコート、ディップロールコート、バーコート、ナイフコート、エアーナイフコート、カーテンコート、リップコート、ダイコーターなどによる押出しコート法などが挙げられる。 As a method of applying (coating) the resin composition on a predetermined surface, a known coating method can be adopted, and is not particularly limited, but for example, a roll coat, a kiss roll coat, a gravure coat, a reverse coat, etc. Examples thereof include a roll brush, a spray coat, a dip roll coat, a bar coat, a knife coat, an air knife coat, a curtain coat, a lip coat, and an extrusion coat method using a die coater.
　本発明の粘着シートの厚み（総厚み）は、特に限定されないが、１μｍ以上が好ましく、より好ましくは２μｍ以上、さらに好ましくは３μｍ以上である。厚みが一定以上であると、本発明の粘着剤層に電子部品が精度よく転写しやすくなり、好ましい。また、本発明の粘着シートの厚み（総厚み）の上限値は、特に限定されないが、５００μｍ以下が好ましく、より好ましくは３００μｍ以下である。厚みが一定以下であると、電子部品を精度よく他のキャリア基板や実装基板に転写しやすくなり、好ましい。なお、本発明の粘着シートの厚みには、はく離ライナーの厚みは含めないものとする。 The thickness (total thickness) of the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, still more preferably 3 μm or more. When the thickness is at least a certain level, it is preferable that the electronic component is easily transferred to the pressure-sensitive adhesive layer of the present invention with high accuracy. The upper limit of the thickness (total thickness) of the pressure-sensitive adhesive sheet of the present invention is not particularly limited, but is preferably 500 μm or less, and more preferably 300 μm or less. When the thickness is not more than a certain level, it becomes easy to transfer the electronic component to another carrier board or mounting board with high accuracy, which is preferable. The thickness of the pressure-sensitive adhesive sheet of the present invention does not include the thickness of the peeling liner.
　本発明の粘着シートは、本発明の粘着剤層を有するため、優れた衝撃吸収性を示す。例えば、上記の鉄球落下試験における衝撃吸収率（％）は１０％以上であり、好ましくは１５％以上であり、２０％以上、２５％以上、３０％以上、３５％以上、又は４０％以上であってもよい。
　衝撃吸収率（％）は、上記の鉄球落下試験機にて、上記条件で衝撃を加えた際の衝撃荷重Ｆを計測し、以下の式より求める。
　衝撃吸収率（％）＝｛（Ｓ0－Ｓ1）／Ｓ0｝×１００ 
（上記式において、Ｓ0は粘着シートを貼着せず、ＳＵＳ板のみに鉄球を衝突させた時の衝撃荷重のことであり、Ｓ1はＳＵＳ板と粘着シートとからなる構造体の粘着シート上に鉄球を衝突させた時の衝撃荷重のことである） Since the pressure-sensitive adhesive sheet of the present invention has the pressure-sensitive adhesive layer of the present invention, it exhibits excellent shock absorption. For example, the impact absorption rate (%) in the above iron ball drop test is 10% or more, preferably 15% or more, 20% or more, 25% or more, 30% or more, 35% or more, or 40% or more. May be.
The impact absorption rate (%) is obtained by measuring the impact load F when an impact is applied under the above conditions with the above iron ball drop tester and using the following formula.
Impact absorption rate (%) = {(S 0 -S 1 ) / S 0 } x 100
(In the above formula, S 0 is the impact load when the iron ball is made to collide only with the SUS plate without attaching the adhesive sheet, and S 1 is the adhesive sheet of the structure composed of the SUS plate and the adhesive sheet. It is the impact load when an iron ball collides with the top.)
（電子部品の加工方法）
　本発明の粘着シートは、電子部品の加工方法（電子部品の加工用途）に用いられる。より具体的には、本発明の粘着シートは、仮固定材（基板、もしくは粘着シート）上に配置された電子部品を本発明の粘着剤層で受け取るために好ましく使用される。本発明の粘着シートは、本発明の粘着剤層を有するため、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる。また、本発明の粘着シートは、本発明の粘着剤層を有するため、受け取った電子部品の搬送時に、電子部品の脱落や位置ずれを抑制することができる。 (Processing method for electronic components)
The adhesive sheet of the present invention is used as a method for processing electronic components (used for processing electronic components). More specifically, the pressure-sensitive adhesive sheet of the present invention is preferably used for receiving electronic components arranged on a temporary fixing material (board or pressure-sensitive adhesive sheet) in the pressure-sensitive adhesive layer of the present invention. Since the pressure-sensitive adhesive sheet of the present invention has the pressure-sensitive adhesive layer of the present invention, it can sufficiently absorb the impact caused by the collision with the pressure-sensitive adhesive layer such as electronic parts, and suppresses the displacement and turning over due to the bounce of the electronic parts at the time of collision. can. Further, since the pressure-sensitive adhesive sheet of the present invention has the pressure-sensitive adhesive layer of the present invention, it is possible to prevent the electronic parts from falling off or being displaced during transportation of the received electronic parts.
　本発明の粘着シートを上記電子部品の加工用途に使用する場合、前記仮固定材の電子部品が配置された面と、本発明の粘着シートの粘着剤層の粘着面とが対向して、隙間を設けて配置されることが好ましい。当該構成は、前記仮固定材と本発明の粘着シートとの位置関係を制御することができ、電子部品を粘着シートの所望の位置に配置できる点で好ましい。 When the adhesive sheet of the present invention is used for processing the electronic components, the surface on which the electronic components of the temporary fixing material are arranged and the adhesive surface of the adhesive layer of the adhesive sheet of the present invention face each other and have a gap. It is preferable to provide and arrange. This configuration is preferable in that the positional relationship between the temporary fixing material and the pressure-sensitive adhesive sheet of the present invention can be controlled, and electronic components can be arranged at a desired position on the pressure-sensitive adhesive sheet.
　本発明の電子部品の加工方法は、仮固定材上に配置された電子部品を本発明の粘着シートの粘着剤層の粘着面で受け取る工程（第１工程）を含む。本発明の電子部品の加工方法において、本発明の粘着シートは、電子部品などの粘着剤層への衝突による衝撃を十分に吸収でき、衝突時の電子部品の跳ねによる位置ずれや裏返りなどを抑制できる。 The method for processing an electronic component of the present invention includes a step (first step) of receiving the electronic component arranged on the temporary fixing material on the adhesive surface of the adhesive layer of the adhesive sheet of the present invention. In the method for processing an electronic component of the present invention, the pressure-sensitive adhesive sheet of the present invention can sufficiently absorb the impact caused by a collision with an adhesive layer such as an electronic component, and suppresses misalignment and turning over due to bouncing of the electronic component at the time of collision. can.
　本発明の電子部品の加工方法において、前記仮固定材上に電子部品が配置された面と、本発明の粘着シートの粘着剤層の粘着面とが対向して、隙間を設けて配置されることが好ましい。当該構成は、前記仮固定材と本発明の粘着シートとの位置関係を制御することができ、電子部品を粘着シートの所望の位置に配置できる点で好ましい。 In the method for processing an electronic component of the present invention, the surface on which the electronic component is arranged on the temporary fixing material and the adhesive surface of the adhesive layer of the adhesive sheet of the present invention face each other and are arranged with a gap. Is preferable. This configuration is preferable in that the positional relationship between the temporary fixing material and the pressure-sensitive adhesive sheet of the present invention can be controlled, and electronic components can be arranged at a desired position on the pressure-sensitive adhesive sheet.
　本発明の電子部品の加工方法は、さらに、前記粘着シート上の電子部品を、他の粘着シート又は他の基板上に配置する工程（第２工程）と、及び、前記粘着シートの粘着剤層の粘着面上から、電子部品を剥離する工程（第３工程）とを含むことが好ましい。本発明の電子部品の加工方法は、第２工程及び第３工程を含むことにより、効率的に電子部品を移載することができる。 The method for processing an electronic component of the present invention further includes a step of arranging the electronic component on the pressure-sensitive adhesive sheet on another pressure-sensitive adhesive sheet or another substrate (second step), and a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. It is preferable to include a step (third step) of peeling the electronic component from the adhesive surface of the above. The method for processing an electronic component of the present invention can efficiently transfer the electronic component by including the second step and the third step.
　本発明の電子部品の加工方法の実施形態について、図面を参照して以下に説明するが、本発明の電子部品の加工方法は当該実施形態に限定されるものではない。図５は、図３に示す粘着シート３を用いた本発明の電子部品の加工方法の一実施形態における第１工程を表す断面模式図である。 An embodiment of the method for processing an electronic component of the present invention will be described below with reference to the drawings, but the method for processing an electronic component of the present invention is not limited to the embodiment. FIG. 5 is a schematic cross-sectional view showing a first step in an embodiment of the method for processing an electronic component of the present invention using the adhesive sheet 3 shown in FIG.
　本実施形態において、本発明の電子部品の加工方法の第１工程は、粘着シート３のはく離ライナーＲ１を剥離して、粘着面３０ａを露出させ（図５（ａ）参照）、仮固定材５０に配置された電子部品５１（図５（ｂ）参照）を分離して、粘着シート３の粘着剤層３０の粘着面３０ａで受け取る工程である（図５（ｃ）、（ｄ）参照）。 In the present embodiment, in the first step of the method for processing an electronic component of the present invention, the peeling liner R1 of the adhesive sheet 3 is peeled off to expose the adhesive surface 30a (see FIG. 5A), and the temporary fixing material 50 is used. This is a step of separating the electronic component 51 (see FIG. 5 (b)) arranged in the above and receiving it on the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 (see FIGS. 5 (c) and 5 (d)).
　図５（ａ）において、粘着シート３のはく離ライナーＲ１を剥離して、粘着剤層３０の粘着面３０ａを露出させる。はく離ライナーＲ１の粘着面３０ａと接する面には、シリコーン系、長鎖アルキル系、フッ素系等の剥離剤による剥離層が形成されている（図示略）。剥離層に含まれる剥離剤の一部は、粘着剤層３０に移行している。 In FIG. 5A, the peeling liner R1 of the adhesive sheet 3 is peeled off to expose the adhesive surface 30a of the adhesive layer 30. On the surface of the peeling liner R1 in contact with the adhesive surface 30a, a release layer made of a silicone-based, long-chain alkyl-based, fluorine-based or other release agent is formed (not shown). A part of the release agent contained in the release layer has been transferred to the pressure-sensitive adhesive layer 30.
　図５（ｂ）において、仮固定材５０の片面に複数の電子部品５１が配置されている。仮固定材５０を構成する材料は特に限定されず、上記のプラスチックフィルムやガラス基板が挙げられる。また、仮固定材５０は粘着シートであってもよく、その場合、電子部品５１は粘着シートの粘着面上に配置されていてもよい。仮固定材５０は放射線透過性の材料で構成されることが好ましい。 In FIG. 5B, a plurality of electronic components 51 are arranged on one side of the temporary fixing material 50. The material constituting the temporary fixing material 50 is not particularly limited, and examples thereof include the above-mentioned plastic film and glass substrate. Further, the temporary fixing material 50 may be an adhesive sheet, and in that case, the electronic component 51 may be arranged on the adhesive surface of the adhesive sheet. The temporary fixing material 50 is preferably made of a radiation-permeable material.
　仮固定材５０の片面に電子部品５１を配置する方法は、特に限定されず、例えば、上記の粘着力低減可能型粘着剤層を介して電子部品５１を配置することが挙げられる。その場合、粘着力低減可能型粘着剤層に放射線を照射するか、加熱することにより、仮固定状態を解除することができる。本実施形態では、電子部品５１は、上記の放射線硬化性粘着剤層（図示略）を介して仮固定材５０に配置されている。 The method of arranging the electronic component 51 on one side of the temporary fixing material 50 is not particularly limited, and examples thereof include arranging the electronic component 51 via the adhesive force-reducable adhesive layer described above. In that case, the temporary fixing state can be released by irradiating or heating the pressure-sensitive adhesive layer with reduced adhesive strength. In the present embodiment, the electronic component 51 is arranged on the temporary fixing material 50 via the radiation-curable pressure-sensitive adhesive layer (not shown).
　本実施形態では、仮固定材５０の片面に複数の電子部品５１が配置されている。本実施形態では、上記電子部品５１のサイズは、例えば、１μｍ2～２５００００μｍ2である。本発明の電子部品の加工方法によれば、このような小型の電子部品を効率的に移載することができる。 In this embodiment, a plurality of electronic components 51 are arranged on one side of the temporary fixing material 50. In the present embodiment, the size of the electronic component 51 is, for example, 1 μm 2 to 250,000 μm 2 . According to the method for processing an electronic component of the present invention, such a small electronic component can be efficiently transferred.
　本実施形態では、仮固定材５０の電子部品５１が配置された面を下方に向けて配置し、粘着シート３の粘着剤層３０の粘着面３０ａを上方に向けて配置し、仮固定材５０の電子部品５１が仮固定された面と、粘着シート３の粘着剤層３０の粘着面３０ａとが対向して、隙間ｄを設けて配置される。隙間ｄを設けることにより、仮固定材５０と粘着シート３との位置関係を制御することができ、電子部品５１を粘着シート３の所望の位置に配置できる。隙間ｄの間隔は、特に限定されないが、例えば、１～１０００μｍ程度である。 In the present embodiment, the surface on which the electronic component 51 of the temporary fixing material 50 is arranged is arranged downward, the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 is arranged upward, and the temporary fixing material 50 is arranged. The surface on which the electronic component 51 is temporarily fixed and the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 face each other, and a gap d is provided. By providing the gap d, the positional relationship between the temporary fixing material 50 and the adhesive sheet 3 can be controlled, and the electronic component 51 can be arranged at a desired position of the adhesive sheet 3. The interval of the gap d is not particularly limited, but is, for example, about 1 to 1000 μm.
　本実施形態では、粘着剤層３０は、本発明の粘着剤層から形成されるものであり、衝撃吸収性を有する。また、粘着シート３の粘着剤層３０が形成されていない面は、別の粘着剤層が積層されていてもよく、その場合、別の粘着剤層を介してその他の基板に固定されていてもよい（図示略）。 In the present embodiment, the pressure-sensitive adhesive layer 30 is formed from the pressure-sensitive adhesive layer of the present invention and has impact absorption. Further, the surface of the pressure-sensitive adhesive sheet 3 on which the pressure-sensitive adhesive layer 30 is not formed may be laminated with another pressure-sensitive adhesive layer, and in that case, it is fixed to another substrate via another pressure-sensitive adhesive layer. It may be (not shown).
　本実施形態では、仮固定材５０の側から電子部品５１にレーザー光Ｌを照射して電子部品５１の仮固定状態を解除して、電子部品５１を仮固定材５０から分離する。より詳細には、電子部品５１が接触している部分の仮固定材５０にレーザー光Ｌが照射されると粘着力が低下して、電子部品５１を仮固定材５０から剥離することにより、分離される。レーザー光Ｌは複数の電子部品５１に個別に照射してもよく、一部に照射してもよく、全ての電子部品５１に一括して照射してもよく、掃引することにより照射してもよい。本実施形態では、複数の電子部品５１の一部に照射するものである。 In the present embodiment, the electronic component 51 is irradiated with laser light L from the side of the temporary fixing material 50 to release the temporary fixing state of the electronic component 51, and the electronic component 51 is separated from the temporary fixing material 50. More specifically, when the temporary fixing material 50 in the portion where the electronic component 51 is in contact is irradiated with the laser beam L, the adhesive force is reduced, and the electronic component 51 is separated from the temporary fixing material 50. Will be done. The laser beam L may irradiate a plurality of electronic components 51 individually, irradiate a part thereof, irradiate all the electronic components 51 at once, or irradiate the electronic components 51 by sweeping. good. In this embodiment, a part of a plurality of electronic components 51 is irradiated.
　図５（ｃ）において、仮固定材５０から分離された電子部品５１は、粘着シート３に向かって落下し、粘着剤層３０の粘着面３０ａで受け取られる。粘着剤層３０は、本発明の粘着剤層で構成されており、優れた衝撃吸収性を示すため、電子部品の衝突による衝撃を吸収して破損を防ぎ、電子部品の位置ずれや裏返りを抑制できる。 In FIG. 5C, the electronic component 51 separated from the temporary fixing material 50 falls toward the adhesive sheet 3 and is received by the adhesive surface 30a of the adhesive layer 30. The pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention and exhibits excellent shock absorption. Therefore, the pressure-sensitive adhesive layer 30 absorbs the shock caused by the collision of electronic parts to prevent damage, and suppresses misalignment and turning over of electronic parts. can.
　図５（ｄ）、（ｅ）において、仮固定材５０に配置された別の電子部品５１にレーザー光Ｌを照射して分離、落下させ、粘着剤層３０の粘着面３０ａに受け取らせる（転写する）。本実施形態では、図５（ｂ）においてレーザー光Ｌを照射した電子部品５１の隣の電子部品５１にレーザー光Ｌを照射する。 In FIGS. 5D and 5E, another electronic component 51 arranged on the temporary fixing material 50 is irradiated with laser light L to be separated and dropped, and is received by the adhesive surface 30a of the adhesive layer 30 (transfer). do). In the present embodiment, the laser beam L is irradiated to the electronic component 51 adjacent to the electronic component 51 irradiated with the laser beam L in FIG. 5 (b).
　図５（ｄ）、（ｅ）において、仮固定材５０と粘着シート３の位置関係は、図５（ｂ）と同じであってもよく、位置関係をずらしたものであってもよい。本実施形態では、粘着シート３に対して仮固定材５０を図５の右方向に所定間隔ずらしてから、レーザー光Ｌを照射する。これにより、所望のピッチに制御して電子部品５１を粘着シート３の粘着剤層３０に配置することができる。 In FIGS. 5 (d) and 5 (e), the positional relationship between the temporary fixing material 50 and the adhesive sheet 3 may be the same as that in FIG. 5 (b), or the positional relationship may be shifted. In the present embodiment, the temporary fixing material 50 is shifted to the right of FIG. 5 by a predetermined interval with respect to the pressure-sensitive adhesive sheet 3, and then the laser beam L is irradiated. Thereby, the electronic component 51 can be arranged on the pressure-sensitive adhesive layer 30 of the pressure-sensitive adhesive sheet 3 by controlling the pitch to a desired level.
　図５（ｆ）において、図５（ｄ）、（ｅ）に示す工程を繰り返すことにより、全ての電子部品５１が粘着剤層３０に受け取られた形態を示す。本実施形態において、電子部品５１は所望のピッチを設けて配列されている。 FIG. 5 (f) shows a form in which all the electronic components 51 are received by the pressure-sensitive adhesive layer 30 by repeating the steps shown in FIGS. 5 (d) and 5 (e). In this embodiment, the electronic components 51 are arranged with a desired pitch.
　図５（ｂ）～（ｅ）の工程中、及び図５（ｆ）の状態の保管中、粘着剤層３０の粘着面３０ａは、大気環境下に曝露される。粘着面３０ａが大気環境下に曝露されると、はく離ライナーＲ１の粘着面３０ａと接する面に形成された剥離層から粘着剤層３０に移行した剥離剤が、粘着面３０ａにブリードアウトしてくると考えられる。粘着面３０ａに剥離剤がブリードアウトしてくると、粘着面３０ａの濡れ性、粘着性が経時的に低下して、電子部品５１を保持する能力が低下し、粘着剤層３０に保持された状態の電子部品５１を搬送したり、次工程に供する際に、電子部品５１の脱落や位置ずれ等の不具合が生じ得る。 During the steps of FIGS. 5 (b) to 5 (e) and during the storage of the state of FIG. 5 (f), the adhesive surface 30a of the adhesive layer 30 is exposed to the atmospheric environment. When the adhesive surface 30a is exposed to the atmospheric environment, the release agent transferred from the release layer formed on the surface of the peeling liner R1 in contact with the adhesive surface 30a to the adhesive layer 30 bleeds out to the adhesive surface 30a. it is conceivable that. When the release agent bleeds out to the adhesive surface 30a, the wettability and adhesiveness of the adhesive surface 30a decrease with time, the ability to hold the electronic component 51 decreases, and the adhesive surface 30a retains the adhesive layer 30. When the electronic component 51 in the state is transported or used in the next process, problems such as dropping or misalignment of the electronic component 51 may occur.
　粘着剤層３０は、本発明の粘着剤層で構成されており、粘着剤層３０に移行した剥離剤は、粘着剤層３０内で移動が抑制されており、粘着面３０ａへのブリードアウトが抑制されている。従って、大気環境下での粘着面３０ａの濡れ性、粘着性の経時的低下が抑制されて、粘着剤層３０に保持された状態の電子部品５１を搬送したり、次工程に供する際に、電子部品５１の脱落や位置ずれ等の不具合を抑制することができる。 The pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention, and the release agent transferred to the pressure-sensitive adhesive layer 30 is suppressed from moving in the pressure-sensitive adhesive layer 30, and bleed-out to the pressure-sensitive adhesive surface 30a occurs. It is suppressed. Therefore, the wettability and the adhesiveness of the adhesive surface 30a in the atmospheric environment are suppressed from being lowered with time, and when the electronic component 51 held in the adhesive layer 30 is transported or used in the next step, it is used. It is possible to suppress problems such as dropping and misalignment of the electronic component 51.
　図６は、図３に示す粘着シート３を用いた本発明の電子部品の加工方法の一実施形態における第２工程及び第３工程を表す断面模式図である。 FIG. 6 is a schematic cross-sectional view showing the second step and the third step in one embodiment of the method for processing an electronic component of the present invention using the adhesive sheet 3 shown in FIG.
　図６（ａ）に示すように、他の粘着シート又は基板６０に対向、離間して、粘着シート３の粘着剤層３０の粘着面３０ａ上に配列された電子部品５１を配置する。６０が粘着シートの場合、基板６０の粘着シート３に対向する面６１は粘着面であり、６０が実装基板の場合、面６１は回路面である。 As shown in FIG. 6A, the electronic components 51 arranged on the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 are arranged so as to face or separate from the other adhesive sheet or the substrate 60. When 60 is an adhesive sheet, the surface 61 of the substrate 60 facing the adhesive sheet 3 is an adhesive surface, and when 60 is a mounting substrate, the surface 61 is a circuit surface.
　図６（ａ）において、図５（ｆ）の状態の電子部品５１は、反転して、基板６０の面６１に対向して下向きに配置される。粘着剤層３０は本発明の粘着剤層で構成されているため、大気環境下での粘着面３０ａの濡れ性、粘着性の経時的低下が抑制されている、従って、図６（ａ）の形態に電子部品５１が搬送されて、下向きに配置されたとしても、粘着剤層３０の粘着面３０ａの電子部品５１は、脱落や位置ずれすることなく、保持は維持されている。 In FIG. 6A, the electronic component 51 in the state of FIG. 5F is inverted and arranged downward facing the surface 61 of the substrate 60. Since the pressure-sensitive adhesive layer 30 is composed of the pressure-sensitive adhesive layer of the present invention, the wettability of the pressure-sensitive adhesive surface 30a and the deterioration of the adhesiveness with time in an air environment are suppressed. Therefore, in FIG. 6A. Even if the electronic component 51 is conveyed to the form and arranged downward, the electronic component 51 on the adhesive surface 30a of the adhesive layer 30 is maintained without falling off or being displaced.
　次に、図６（ｂ）に示すように、他の粘着シート又は基板６０の面６１と粘着シート３の粘着剤層３０の粘着面３０ａ上に配列された電子部品５１を近接させて、電子部品５１と面６１を接触させることにより、電子部品５１を他の粘着シート又は基板６０の面６１に配置することができる。 Next, as shown in FIG. 6 (b), the surface 61 of another adhesive sheet or substrate 60 and the electronic component 51 arranged on the adhesive surface 30a of the adhesive layer 30 of the adhesive sheet 3 are brought close to each other to obtain electrons. By bringing the component 51 into contact with the surface 61, the electronic component 51 can be placed on the surface 61 of another adhesive sheet or substrate 60.
　次に、粘着剤層３０が放射線硬化性粘着剤から形成される場合は、図６（ｃ）に示すように、粘着シート３の基材Ｓ１側から電子部品５１に紫外線Ｕを照射する。紫外線Ｕにより、放射線硬化性粘着剤から形成される粘着剤層３０は硬化して粘着力が低下して、電子部品５１は剥離可能になる。紫外線Ｕは全ての電子部品５１に照射してもよく、必要に応じてマスク等をして一部の電子部品５１に照射してもよい。本実施形態は、全ての電子部品５１に紫外線Ｕを照射する。 Next, when the pressure-sensitive adhesive layer 30 is formed of a radiation-curable pressure-sensitive adhesive, the electronic component 51 is irradiated with ultraviolet rays U from the base material S1 side of the pressure-sensitive adhesive sheet 3 as shown in FIG. 6 (c). The ultraviolet U U cures the pressure-sensitive adhesive layer 30 formed from the radiation-curable pressure-sensitive adhesive, reduces the adhesive strength, and makes the electronic component 51 peelable. The ultraviolet rays U may irradiate all the electronic components 51, or may irradiate some of the electronic components 51 with a mask or the like, if necessary. In this embodiment, all the electronic components 51 are irradiated with ultraviolet rays U.
　次に、図６（ｄ）に示すように、粘着シート３と他の粘着シート又は基板６０を離間させることにより、粘着シート３の粘着剤層３０の粘着面３０ａ上から電子部品５１が剥離することができ、それと同時に、他の粘着シート又は基板６０の面６１へ転写される。粘着剤層３０を構成する放射線硬化性粘着剤は、紫外線Ｕにより硬化して粘着力が低下しているため、電子部品５１を容易に剥離して、他の粘着シート又は基板６０の面６１へ転写して、配置することができる。粘着シート３の粘着剤層３０上の電子部品５１配置パターンが維持された状態で、面６１へ転写、配置される。 Next, as shown in FIG. 6D, by separating the pressure-sensitive adhesive sheet 3 from another pressure-sensitive adhesive sheet or substrate 60, the electronic component 51 is peeled off from the pressure-sensitive adhesive surface 30a of the pressure-sensitive adhesive layer 30 of the pressure-sensitive adhesive sheet 3. At the same time, it can be transferred to the surface 61 of another adhesive sheet or substrate 60. Since the radiation-curable pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 30 is cured by ultraviolet rays U and its adhesive strength is reduced, the electronic component 51 can be easily peeled off to the surface 61 of another pressure-sensitive adhesive sheet or substrate 60. It can be transferred and placed. The electronic component 51 arrangement pattern on the pressure-sensitive adhesive layer 30 of the pressure-sensitive adhesive sheet 3 is maintained, and the electronic component 51 is transferred and arranged on the surface 61.
　図５、６において、粘着シート３に替えて、図１、２、４に示される粘着シート１、２、４を用いて、同様に電子部品の加工方法を実施することができる。その場合、粘着シート１、２、４のはく離ライナーＲ２を剥離して、ガラス板などで形成されたキャリア基板に固定して使用することが好ましい。 In FIGS. 5 and 6, the method of processing electronic components can be similarly carried out by using the adhesive sheets 1, 2 and 4 shown in FIGS. 1, 2 and 4 instead of the adhesive sheet 3. In that case, it is preferable to peel off the peeling liner R2 of the adhesive sheets 1, 2 and 4 and fix it to a carrier substrate formed of a glass plate or the like for use.
　実装基板上への実装する電子部品としては、特に限定されないが、微細で薄型の半導体チップやＬＥＤチップに好適に使用することができる。 The electronic components to be mounted on the mounting board are not particularly limited, but can be suitably used for fine and thin semiconductor chips and LED chips.
　以下に実施例を挙げて本発明をより詳細に説明するが、本発明はこれらの実施例により何ら限定されるものではない。 The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples.
［製造例１］アクリルポリマーＡの製造
　トルエン中に、２－エチルヘキシルアクリレート１００重量部と、２－ヒドロキシエチルアクリレート１２．６重量部と、重合開始剤として過酸化ベンゾイル０．２５重量部とを加えた後、窒素ガス気流下６０℃で重合反応を行い、これにメタクリロイルオキシエチルイソシアネート１３．５重量部を加えて付加反応させることで、炭素－炭素二重結合を有するアクリル系共重合体（アクリルポリマーＡ）のトルエン溶液を得た。 [Production Example 1] Production of Acrylic Polymer A 100 parts by weight of 2-ethylhexyl acrylate, 12.6 parts by weight of 2-hydroxyethyl acrylate, and 0.25 parts by weight of benzoyl peroxide as a polymerization initiator are added to toluene. After that, a polymerization reaction is carried out at 60 ° C. under a nitrogen gas stream, and 13.5 parts by weight of methacryloyloxyethyl isocyanate is added thereto to carry out an addition reaction, whereby an acrylic copolymer having a carbon-carbon double bond (acrylic). A toluene solution of polymer A) was obtained.
［製造例２］アクリルポリマーＢの製造
　トルエン中に、２－エチルヘキシルアクリレート１００重量部と、アクリル酸２重量部と、トリメチロールプロパントリアクリレート０．０１重量部と、重合開始剤として過酸化ベンゾイル０．２重量部とを加えた後、７０℃に加熱してアクリル系共重合体（アクリルポリマーＢ）のトルエン溶液を得た。 [Production Example 2] Production of Acrylic Polymer B In toluene, 100 parts by weight of 2-ethylhexyl acrylate, 2 parts by weight of acrylic acid, 0.01 part by weight of trimethylolpropane triacrylate, and 0 benzoyl peroxide as a polymerization initiator. After adding 2 parts by weight, the mixture was heated to 70 ° C. to obtain a toluene solution of the acrylic copolymer (acrylic polymer B).
［実施例１］
（粘着剤の調製）
　アクリルポリマーＡを１００重量部含むアクリル系ポリマー溶液Ａに、架橋剤（日本ポリウレタン工業株式会社製、商品名「コロネートＬ」）３重量部、α－ヒドロキシケトン系光重合開始剤（ＢＡＳＦジャパン製、商品名「イルガキュア１２７」、分子量：３４０．４、波長３６５ｎｍの吸光係数：１．０７×１０2ｍｌ／ｇ・ｃｍ）３重量部を加え粘着剤を得た。
（粘着シート）
　はく離ライナー１（株式会社フジコー製、商品名「ＰＥＴ－７５－ＳＣＡ１」、厚み：７５μｍ）の離型処理面に上記の粘着剤を溶剤揮発（乾燥）後の厚みが５０μｍとなるように塗布して粘着剤層を形成した。得られた粘着剤層の粘着面をはく離ライナー２（東レ株式会社製、商品名「セラピールＭＤＡ」、厚さ：３８μｍ）で保護して、（はく離ライナー１／粘着剤層／はく離ライナー２）からなる粘着シートを得た。 [Example 1]
(Preparation of adhesive)
Acrylic polymer solution A containing 100 parts by weight of acrylic polymer A, 3 parts by weight of a cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), α-hydroxyketone-based photopolymerization initiator (manufactured by BASF Japan, A pressure-sensitive adhesive was obtained by adding 3 parts by weight (trade name "Irgacure 127", molecular weight: 340.4, absorption coefficient at wavelength 365 nm: 1.07 × 10 2 ml / g · cm).
(Adhesive sheet)
The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 μm) so that the thickness after solvent volatilization (drying) is 50 μm. Formed a pressure-sensitive adhesive layer. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 2 (manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 μm) from (peeling liner 1 / adhesive layer / peeling liner 2). I got an adhesive sheet.
［実施例２］
　溶剤揮発（乾燥）後の粘着剤層の厚みを１００μｍとしたこと以外は、実施例１と同様にして、（はく離ライナー１／粘着剤層／はく離ライナー２）からなる粘着シートを得た。 [Example 2]
A pressure-sensitive adhesive sheet composed of (peeling liner 1 / pressure-sensitive adhesive layer / peeling liner 2) was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer after solvent volatilization (drying) was 100 μm.
［実施例３］
　溶剤揮発（乾燥）後の粘着剤層の厚みを１５０μｍとしたこと以外は、実施例１と同様にして、（はく離ライナー１／粘着剤層／はく離ライナー２）からなる粘着シートを得た。 [Example 3]
A pressure-sensitive adhesive sheet composed of (peeling liner 1 / pressure-sensitive adhesive layer / peeling liner 2) was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer after solvent volatilization (drying) was 150 μm.
［実施例４］
（粘着剤の調製）
　アクリルポリマーＢを１００重量部含むアクリル系ポリマー溶液Ｂに、架橋剤（三菱ガス化学株式会社製、商品名「テトラッドＣ」）２重量部を加え粘着剤を得た。
（粘着シート）
　はく離ライナー１（株式会社フジコー製、商品名「ＰＥＴ－７５－ＳＣＡ１」、厚み：７５μｍ）の離型処理面に上記の粘着剤を溶剤揮発（乾燥）後の厚みが５０μｍとなるように塗布して粘着剤層を形成した。得られた粘着剤層の粘着面をはく離ライナー２（東レ株式会社製、商品名「セラピールＭＤＡ」、厚さ：３８μｍ）で保護して、（はく離ライナー１／粘着剤層／はく離ライナー２）からなる粘着シートを得た。 [Example 4]
(Preparation of adhesive)
An adhesive was obtained by adding 2 parts by weight of a cross-linking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "Tetrad C") to an acrylic polymer solution B containing 100 parts by weight of acrylic polymer B.
(Adhesive sheet)
The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 μm) so that the thickness after solvent volatilization (drying) is 50 μm. Formed a pressure-sensitive adhesive layer. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 2 (manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 μm) from (peeling liner 1 / adhesive layer / peeling liner 2). I got an adhesive sheet.
［実施例５］
（粘着剤１の調製）
　アクリルポリマーＢを１００重量部含むアクリル系ポリマー溶液Ｂに、架橋剤（三菱ガス化学（株）製、商品名「テトラッドＣ」）２重量部を加え粘着剤１を得た。
（粘着剤２の調製）
　アクリルポリマーＡを１００重量部含むアクリル系ポリマー溶液Ａに、架橋剤（日本ポリウレタン工業株式会社製、商品名「コロネートＬ」）０．２重量部、α－ヒドロキシケトン系光重合開始剤（ＢＡＳＦジャパン製、商品名「イルガキュア１２７」、分子量：３４０．４、波長３６５ｎｍの吸光係数：１．０７×１０2ｍｌ／ｇ・ｃｍ）３重量部を加え粘着剤２を得た。
（粘着シート）
　はく離ライナー２（東レ株式会社製、商品名「セラピールＭＤＡ」、厚さ：３８μｍ）の離型処理面に上記の粘着剤１を溶剤揮発（乾燥）後の厚みが１０μｍとなるように塗布して粘着剤層１を形成した。
　次いで、はく離ライナー１（株式会社フジコー製、商品名「ＰＥＴ－７５－ＳＣＡ１」、厚み：７５μｍ）の離型処理面に上記の粘着剤２を溶剤揮発（乾燥）後の厚みが５０μｍとなるように塗布して粘着剤層２を形成した。
　上記で得られた粘着剤層１と粘着剤層２の粘着面同士が接触するように貼り合わせ、（はく離ライナー２／粘着剤層１／粘着剤層２／はく離ライナー１）からなる粘着シートを得た。 [Example 5]
(Preparation of adhesive 1)
To the acrylic polymer solution B containing 100 parts by weight of the acrylic polymer B, 2 parts by weight of a cross-linking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "Tetrad C") was added to obtain an adhesive 1.
(Preparation of adhesive 2)
Acrylic polymer solution A containing 100 parts by weight of acrylic polymer A, 0.2 parts by weight of a cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), α-hydroxyketone-based photopolymerization initiator (BASF Japan) Acrylic 2 was obtained by adding 3 parts by weight of the product, trade name "Irgacure 127", molecular weight: 340.4, absorption coefficient at wavelength 365 nm: 1.07 × 10 2 ml / g · cm).
(Adhesive sheet)
The above adhesive 1 is applied to the release-treated surface of the release liner 2 (manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 μm) so that the thickness after solvent volatilization (drying) is 10 μm. The pressure-sensitive adhesive layer 1 was formed.
Next, the above pressure-sensitive adhesive 2 is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 μm) so that the thickness after solvent volatilization (drying) is 50 μm. The pressure-sensitive adhesive layer 2 was formed.
A pressure-sensitive adhesive sheet composed of (peeling liner 2 / pressure-sensitive adhesive layer 1 / pressure-sensitive adhesive layer 2 / peeling liner 1) is bonded so that the pressure-sensitive adhesive surfaces of the pressure-sensitive adhesive layer 1 and the pressure-sensitive adhesive layer 2 obtained above are in contact with each other. Obtained.
［実施例６］
　溶剤揮発（乾燥）後の粘着剤層１の厚みを２０μｍとしたこと以外は、実施例５と同様にして、（はく離ライナー２／粘着剤層１／粘着剤層２／はく離ライナー１）からなる粘着シートを得た。 [Example 6]
It is composed of (peeling liner 2 / pressure-sensitive adhesive layer 1 / pressure-sensitive adhesive layer 2 / peeling liner 1) in the same manner as in Example 5 except that the thickness of the pressure-sensitive adhesive layer 1 after solvent volatilization (drying) is 20 μm. Obtained an adhesive sheet.
［実施例７］
（粘着剤の調製）
　シリコーンポリマーＣ（ダウ・東レ株式会社製、商品名「ＳＤ４６００ＦＣ」）１００重量部含むシリコーン系ポリマー溶液Ｃに、架橋剤（ダウ・東レ株式会社製、商品名「ＢＹ　２４－７４１」）１．０重量部、白金触媒（ダウ・東レ株式会社製、商品名「ＳＲＸ２１２Ｃａｔａｌｙｓｔ」）０．９重量部を加え粘着剤を得た。
（粘着シート）
　はく離ライナー３（三菱ケミカル株式会社製、商品名「ＭＲＳ＃５０」、厚み：５０μｍ）の離型処理面に上記の粘着剤を溶剤揮発（乾燥）後の厚みが５０μｍとなるように塗布して粘着剤層を形成した。得られた粘着剤層の粘着面をはく離ライナー４（株式会社フジコー製、商品名「ＳＫ１Ｕ」、厚さ：３８μｍ）で保護して、（はく離ライナー３／粘着剤層／はく離ライナー４）からなる粘着シートを得た。 [Example 7]
(Preparation of adhesive)
Silicone polymer C (manufactured by Dow Toray Co., Ltd., trade name "SD4600FC") containing 100 parts by weight of a cross-linking agent (manufactured by Dow Toray Co., Ltd., trade name "BY 24-741") 1.0 A pressure-sensitive adhesive was obtained by adding 0.9 parts by weight and 0.9 parts by weight of a platinum catalyst (manufactured by Dow Toray Co., Ltd., trade name "SRX212 Catalyst").
(Adhesive sheet)
The above adhesive is applied to the release-treated surface of the release liner 3 (manufactured by Mitsubishi Chemical Corporation, trade name "MRS # 50", thickness: 50 μm) so that the thickness after solvent volatilization (drying) is 50 μm. A pressure-sensitive adhesive layer was formed. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 4 (manufactured by Fujiko Co., Ltd., trade name "SK1U", thickness: 38 μm), and is composed of (peeling liner 3 / adhesive layer / peeling liner 4). I got an adhesive sheet.
［実施例８］
（粘着剤の調製）
　シリコーンポリマーＣ（ダウ・東レ株式会社製、商品名「ＳＤ４６００ＦＣ」）１００重量部、シリコーンポリマーＤ（ダウ・東レ株式会社製、商品名「ＳＥ１７００」）３０重量部含むシリコーン系ポリマー溶液Ｄに、架橋剤（ダウ・東レ株式会社製、商品名「ＢＹ　２４－７４１」）１．０重量部、架橋剤（ダウ・東レ株式会社製、商品名「ＳＥ１７００Ｃａｔａｌｙｓｔ」）３重量部、白金触媒（ダウ・東レ株式会社製、商品名「ＳＲＸ２１２Ｃａｔａｌｙｓｔ」）０．９重量部を加え粘着剤を得た。
（粘着シート）
　はく離ライナー３（三菱ケミカル株式会社製、商品名「ＭＲＳ＃５０」、厚み：５０μｍ）の離型処理面に上記の粘着剤を溶剤揮発（乾燥）後の厚みが５０μｍとなるように塗布して粘着剤層を形成した。得られた粘着剤層の粘着面をはく離ライナー４（株式会社フジコー製、商品名「ＳＫ１Ｕ」、厚さ：３８μｍ）で保護して、（はく離ライナー３／粘着剤層／はく離ライナー４）からなる粘着シートを得た。 [Example 8]
(Preparation of adhesive)
Crosslinked to a silicone polymer solution D containing 100 parts by weight of silicone polymer C (manufactured by Dow Toray Co., Ltd., trade name "SD4600FC") and 30 parts by weight of silicone polymer D (manufactured by Dow Toray Co., Ltd., trade name "SE1700"). Agent (manufactured by Dow Toray Co., Ltd., trade name "BY 24-741") 1.0 part by weight, cross-linking agent (manufactured by Dow Toray Co., Ltd., trade name "SE1700 Polymerist") 3 parts by weight, platinum catalyst (Dow Toray Co., Ltd.) A pressure-sensitive adhesive was obtained by adding 0.9 parts by weight (manufactured by Co., Ltd., trade name "SRX212 Catalyst").
(Adhesive sheet)
The above adhesive is applied to the release-treated surface of the release liner 3 (manufactured by Mitsubishi Chemical Corporation, trade name "MRS # 50", thickness: 50 μm) so that the thickness after solvent volatilization (drying) is 50 μm. A pressure-sensitive adhesive layer was formed. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 4 (manufactured by Fujiko Co., Ltd., trade name "SK1U", thickness: 38 μm), and is composed of (peeling liner 3 / adhesive layer / peeling liner 4). I got an adhesive sheet.
［比較例１］
（粘着剤の調製）
　アクリルポリマーＡを１００重量部含むアクリル系ポリマー溶液Ａに、架橋剤（日本ポリウレタン工業株式会社製、商品名「コロネートＬ」）０．２重量部、α－ヒドロキシケトン系光重合開始剤（ＢＡＳＦジャパン製、商品名「イルガキュア１２７」、分子量：３４０．４、波長３６５ｎｍの吸光係数：１．０７×１０2ｍｌ／ｇ・ｃｍ）３重量部を加え粘着剤を得た。
（粘着シート）
　はく離ライナー１（株式会社フジコー製、商品名「ＰＥＴ－７５－ＳＣＡ１」、厚み：７５μｍ）の離型処理面に上記の粘着剤を溶剤揮発（乾燥）後の厚みが３０μｍとなるように塗布して粘着剤層を形成した。得られた粘着剤層の粘着面をはく離ライナー２（東レ株式会社製、商品名「セラピールＭＤＡ」、厚さ：３８μｍ）で保護して、（はく離ライナー１／粘着剤層／はく離ライナー２）からなる粘着シートを得た。 [Comparative Example 1]
(Preparation of adhesive)
Acrylic polymer solution A containing 100 parts by weight of acrylic polymer A, 0.2 parts by weight of a cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), α-hydroxyketone-based photopolymerization initiator (BASF Japan) Acrylic was obtained by adding 3 parts by weight of the product, trade name "Irgacure 127", molecular weight: 340.4, absorption coefficient at wavelength 365 nm: 1.07 × 10 2 ml / g · cm).
(Adhesive sheet)
The above adhesive is applied to the release-treated surface of the release liner 1 (manufactured by Fujiko Co., Ltd., trade name "PET-75-SCA1", thickness: 75 μm) so that the thickness after solvent volatilization (drying) is 30 μm. Formed a pressure-sensitive adhesive layer. The adhesive surface of the obtained adhesive layer is protected by a peeling liner 2 (manufactured by Toray Industries, Inc., trade name "Therapeutic MDA", thickness: 38 μm) from (peeling liner 1 / adhesive layer / peeling liner 2). I got an adhesive sheet.
［比較例２］
　溶剤揮発（乾燥）後の粘着剤層の厚みを５０μｍとしたこと以外は、比較例１と同様にして、（はく離ライナー１／粘着剤層／はく離ライナー２）からなる粘着シートを得た。 [Comparative Example 2]
A pressure-sensitive adhesive sheet composed of (peeling liner 1 / pressure-sensitive adhesive layer / peeling liner 2) was obtained in the same manner as in Comparative Example 1 except that the thickness of the pressure-sensitive adhesive layer after solvent volatilization (drying) was 50 μm.
　＜評価＞
　実施例及び比較例で得られた粘着シートについて、以下の評価を行った。結果を表１に示す。 <Evaluation>
The adhesive sheets obtained in Examples and Comparative Examples were evaluated as follows. The results are shown in Table 1.
（１）接触角
　実施例及び比較例で得られた粘着シートのはく離ライナー（実施例１～４は、はく離ライナー２、実施例５、６は、はく離ライナー１、実施例７、８は、はく離ライナー４、比較例１、２は、はく離ライナー２）を剥離し、曝露された粘着剤層面を、スライドガラス（松波ガラス工業株式会社製、２６ｍｍ×７６ｍｍ）に、２ｋｇハンドローラーを用いて貼着した。
　上記のようにして得られた評価用試料の評価面のはく離ライナー（実施例１～４は、はく離ライナー１、実施例５、６は、はく離ライナー２、実施例７、８は、はく離ライナー３、比較例１、２は、はく離ライナー１）を剥離した直後に、曝露された該粘着剤層面の接触角を、接触角計（協和界面科学株式会社製、商品名「ＣＸ－Ａ型」）を用いて、該粘着剤層表面に水を２μＬ滴下して５秒後の値を計測した。測定は、Ｎ＝５で実施し、これら測定値の平均値を初期接触角θ1とした。
　また、曝露２時間後の接触角は、上記のようにして得られた評価用試料の評価面のはく離ライナー（実施例１～４は、はく離ライナー１、実施例５、６は、はく離ライナー２、実施例７、８は、はく離ライナー３、比較例１、２は、はく離ライナー１）を剥離し、曝露された該粘着剤層表面を大気環境下で２時間曝露した後に、上記同様の条件により曝露２時間後の接触角θ2を測定した。
　接触角の変位Ｒ（°）を次式により求めた。

　変位Ｒ（°）＝θ2－θ1 (1) Contact angle The peeling liner of the adhesive sheet obtained in Examples and Comparative Examples (Examples 1 to 4 are peeling liners 2, Examples 5 and 6 are peeling liners 1, and Examples 7 and 8 are peeling lines. In the liner 4, Comparative Examples 1 and 2, the peeling liner 2) was peeled off, and the exposed adhesive layer surface was attached to a slide glass (manufactured by Matsunami Glass Industry Co., Ltd., 26 mm × 76 mm) using a 2 kg hand roller. did.
The peeling liner on the evaluation surface of the evaluation sample obtained as described above (Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, and Examples 7 and 8 are peeling liners 3). In Comparative Examples 1 and 2, immediately after the peeling liner 1) was peeled off, the contact angle of the exposed adhesive layer surface was measured by a contact angle meter (manufactured by Kyowa Interface Science Co., Ltd., trade name "CX-A type"). 2 μL of water was dropped on the surface of the pressure-sensitive adhesive layer, and the value after 5 seconds was measured. The measurement was carried out at N = 5, and the average value of these measured values was taken as the initial contact angle θ 1 .
Further, the contact angle after 2 hours of exposure is the peeling liner on the evaluation surface of the evaluation sample obtained as described above (Examples 1 to 4 are peeling liners 1, and Examples 5 and 6 are peeling liners 2). In Examples 7 and 8, the peeling liner 3 was peeled off, and in Comparative Examples 1 and 2, the peeling liner 1) was peeled off, and the exposed surface of the pressure-sensitive adhesive layer was exposed to the exposed adhesive layer surface for 2 hours under the same conditions as described above. The contact angle θ 2 was measured 2 hours after exposure.
The displacement R (°) of the contact angle was calculated by the following equation.

Displacement R (°) = θ 2 -θ 1
（２）鉄球落下試験（沈み込み量／厚さ）
　実施例及び比較例で得られた粘着シート（幅３０ｍｍ×長さ３０ｍｍ）のはく離ライナー（実施例１～４は、はく離ライナー２、実施例５、６は、はく離ライナー１、実施例７、８は、はく離ライナー４、比較例１、２は、はく離ライナー２）を剥離し、曝露された粘着剤層面の全面を、両面接着テープ（日東電工株式会社性、商品名「Ｎｏ．５６００」）を介して、ＳＵＳ板（厚さ５ｍｍ）に、２ｋｇハンドローラーを用いて貼着した。
　上記のようにして得られた評価用試料の評価面のはく離ライナー（実施例１～４は、はく離ライナー１、実施例５、６は、はく離ライナー２、実施例７、８は、はく離ライナー３、比較例１、２は、はく離ライナー１）を剥離し、曝露された該粘着剤層面に、落球試験機を用いて、１ｇの鉄球を高さ１ｍから自由落下させた。該鉄球による粘着剤層面への沈み込み量を、共焦点レーザー顕微鏡により計測した。次に、該沈み込み量（μｍ）を粘着剤層（実施例５、６では、粘着剤層１、粘着剤層２の合計）の厚さ（μｍ）で割り、単位厚さ当たりの値（沈み込み量／厚さ×１００）（％）を求めた。 (2) Iron ball drop test (subduction amount / thickness)
The peeling liner of the adhesive sheet (width 30 mm × length 30 mm) obtained in Examples and Comparative Examples (Examples 1 to 4 are peeling liners 2, Examples 5 and 6 are peeling liners 1, Examples 7 and 8 The peeling liner 4, Comparative Examples 1 and 2) were peeled off, and the entire surface of the exposed adhesive layer surface was covered with a double-sided adhesive tape (Nitto Denko Corporation, trade name "No. 5600"). It was attached to a SUS plate (thickness 5 mm) using a 2 kg hand roller.
The peeling liner on the evaluation surface of the evaluation sample obtained as described above (Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, and Examples 7 and 8 are peeling liners 3). In Comparative Examples 1 and 2, the peeling liner 1) was peeled off, and a 1 g iron ball was freely dropped from a height of 1 m onto the exposed pressure-sensitive adhesive layer surface using a ball drop tester. The amount of the iron ball subducting into the pressure-sensitive adhesive layer surface was measured with a confocal laser scanning microscope. Next, the subduction amount (μm) is divided by the thickness (μm) of the pressure-sensitive adhesive layer (in Examples 5 and 6, the total of the pressure-sensitive adhesive layer 1 and the pressure-sensitive adhesive layer 2), and the value per unit thickness ( The amount of subduction / thickness × 100) (%) was determined.
（３）粘着力（対ＳＵＳ３０４）
　実施例及び比較例で得られた粘着シート（幅３０ｍｍ×長さ３０ｍｍ）のはく離ライナー（実施例１～４は、はく離ライナー２、実施例５、６は、はく離ライナー１、実施例７、８は、はく離ライナー４、比較例１、２は、はく離ライナー２）を剥離し、曝露された粘着剤層面の全面に、ポリエチレンテレフタレートフィルム（東レ株式会社製、商品名「ルミラーＳ１０」、厚み：５０μｍ）を貼着した。次いで、評価面のはく離ライナー（実施例１～４は、はく離ライナー１、実施例５、６は、はく離ライナー２、実施例７、８は、はく離ライナー３、比較例１、２は、はく離ライナー１）を剥離し、曝露された粘着剤層面をＳＵＳ３０４に貼着した直後の粘着シートの初期粘着力Ｆ0を、ＪＩＳ　Ｚ　０２３７：２０００に準じた方法（貼り合わせ条件：２ｋｇローラー１往復、引張速度：３００ｍｍ／ｍｉｎ、剥離角度：１８０°、測定温度：２３℃）により、測定した。
　また、評価面の粘着剤層面をＳＵＳ３０４に貼着した粘着シートの粘着剤層全面に紫外線照射装置（日東精機株式会社製、商品名「ＵＭ－８１０」）を用いて、高圧水銀灯の紫外線（特定波長：３６５ｎｍ、積算光量：４６０ｍＪ／ｃｍ2）を照射し、上記と同様にして、放射線照射後粘着力Ｆ1を測定した。
　放射線照射時粘着力の変化率（％）を次式により求めた。

　放射線照射時粘着力の変化率（％）＝（Ｆ0－Ｆ1）／Ｆ0×１００ (3) Adhesive strength (against SUS304)
The peeling liner of the adhesive sheet (width 30 mm × length 30 mm) obtained in Examples and Comparative Examples (Examples 1 to 4 are peeling liners 2, Examples 5 and 6 are peeling liners 1, Examples 7 and 8 The peeling liner 4, Comparative Examples 1 and 2) were peeled off, and a polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name "Lumirror S10", thickness: 50 μm) was applied to the entire surface of the exposed adhesive layer surface. ) Was pasted. Next, the peeling liner on the evaluation surface (Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, Examples 7 and 8 are peeling liners 3, and Comparative Examples 1 and 2 are peeling liners. Immediately after 1) was peeled off and the exposed adhesive layer surface was attached to SUS304, the initial adhesive force F 0 of the adhesive sheet was set according to the method according to JIS Z 0237: 2000 (bonding condition: 2 kg roller 1 reciprocation, tension). The measurement was carried out at a speed of 300 mm / min, a peeling angle of 180 °, and a measurement temperature of 23 ° C.).
In addition, using an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name "UM-810") on the entire surface of the adhesive layer of the adhesive sheet on which the adhesive layer surface of the evaluation surface is attached to SUS304, ultraviolet rays of a high-pressure mercury lamp (specified). The wavelength: 365 nm, the integrated light amount: 460 mJ / cm 2 ) was irradiated, and the adhesive force F 1 after irradiation was measured in the same manner as above.
The rate of change (%) of the adhesive strength during irradiation was calculated by the following formula.

Rate of change in adhesive strength during irradiation (%) = (F 0 -F 1 ) / F 0 x 100
（４）プローブタック値
　実施例及び比較例で得られた粘着シート（幅２０ｍｍ×長さ５０ｍｍ）の剥離ライナー（実施例１～４は、はく離ライナー２、実施例５、６は、はく離ライナー１、実施例７、８は、はく離ライナー４、比較例１、２は、はく離ライナー２）を剥離し、曝露された粘着剤層面の全面を、両面接着テープ（日東電工株式会社、商品名「Ｎｏ．５６００」）を介して、スライドガラス（松浪ガラス工業株式会社製、２６ｍｍ×７６ｍｍ）に、２ｋｇハンドローラーを用いて貼着した。
　上記のようにして得られた評価用試料の評価面のはく離ライナー（実施例１～４は、はく離ライナー１、実施例５、６は、はく離ライナー２、実施例７、８は、はく離ライナー３、比較例１、２は、はく離ライナー１）を剥離した直後に、曝露された該粘着剤層面のプローブタック値を、プローブタック測定機（ＲＨＥＳＣＡ社製、商品名「ＴＡＣＫＩＮＥＳＳ　Ｍｏｄｅｌ　ＴＡＣ－ＩＩ」）を用いて、５ｍｍΦのＳＵＳ製のプローブ端子にて、プローブ下降速度（Ｉｍｍｅｒｓｉｏｎ　ｓｐｅｅｄ）：１２０ｍｍ／ｍｉｎ、テスト速度（ｔｅｓｔ　ｓｐｅｅｄ）：６００ｍｍ／ｍｉｎ、密着荷重（Ｐｒｅｌｏｄ）：２０ｇｆ、密着保持時間（ｐｒｅｓｓ　ｔｉｍｅ）：１秒の条件で計測した。測定はＮ＝５で実施し、これら測定値の平均値を初期プローブタック値Ｐ0（Ｎ／ｃｍ2）とした。
　また、曝露２時間後のプローブタック値は、上記のようにして得られた評価用試料の評価面のはく離ライナー（実施例１～４は、はく離ライナー１、実施例５、６は、はく離ライナー２、実施例７、８は、はく離ライナー３、比較例１、２は、はく離ライナー１）を剥離し、曝露された該粘着剤層表面を大気環境下で２時間曝露した後に、上記同様の条件にて、曝露２時間後プローブタック値Ｐ1（Ｎ／ｃｍ2）を計測した。
　プローブタック値の変化率（％）を次式により求めた。

　プローブタック値の変化率（％）＝（Ｐ1－Ｐ0）／Ｐ0×１００

　また、以下の評価基準で電子部品の搬送性を評価した。

　〇（搬送性良好）：プローブタック値の変化率が－１４％超
　×（搬送性良好）：プローブタック値の変化率が－１４％以下 (4) Probe tack value The peeling liner of the adhesive sheet (width 20 mm × length 50 mm) obtained in Examples and Comparative Examples (Peeling liner 2 in Examples 1 to 4, and peeling liner 1 in Examples 5 and 6). In Examples 7 and 8, the peeling liner 4 was peeled off, and in Comparative Examples 1 and 2, the peeling liner 2) was peeled off, and the entire surface of the exposed adhesive layer surface was covered with a double-sided adhesive tape (Nitto Denko Co., Ltd., trade name "No." .5600 ”) was attached to a slide glass (manufactured by Matsunami Glass Industry Co., Ltd., 26 mm × 76 mm) using a 2 kg hand roller.
The peeling liner on the evaluation surface of the evaluation sample obtained as described above (Examples 1 to 4 are peeling liners 1, Examples 5 and 6 are peeling liners 2, and Examples 7 and 8 are peeling liners 3). In Comparative Examples 1 and 2, immediately after the peeling liner 1) was peeled off, the probe tack value of the exposed pressure-sensitive adhesive layer surface was measured by a probe tack measuring machine (manufactured by RHESCA, trade name "TACKINESS Model TAC-II"). With a 5 mmΦ SUS probe terminal, probe descent speed (Immersion speed): 120 mm / min, test speed (test speed): 600 mm / min, adhesion load (Preld): 20 gf, adhesion retention time (press). time): Measured under the condition of 1 second. The measurement was carried out at N = 5, and the average value of these measured values was taken as the initial probe tack value P 0 (N / cm 2 ).
Further, the probe tack value after 2 hours of exposure is the peeling liner on the evaluation surface of the evaluation sample obtained as described above (Examples 1 to 4 are peeling liners 1, and Examples 5 and 6 are peeling liners. 2. In Examples 7 and 8, the peeling liner 3 was peeled off, and in Comparative Examples 1 and 2, the peeling liner 1) was peeled off, and the exposed surface of the pressure-sensitive adhesive layer was exposed for 2 hours in an air environment, and then the same as above was applied. Under the conditions, the probe tack value P 1 (N / cm 2 ) was measured 2 hours after the exposure.
The rate of change (%) of the probe tack value was calculated by the following equation.

Rate of change of probe tack value (%) = (P 1 -P 0 ) / P 0 × 100

In addition, the transportability of electronic components was evaluated according to the following evaluation criteria.

〇 (Good transportability): Change rate of probe tack value exceeds -14% × (Good transportability): Change rate of probe tack value is -14% or less
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　上記で説明した発明のバリエーションを以下に付記する。
〔付記１〕はく離ライナーで粘着面が保護された粘着剤層を形成するための樹脂組成物であって、
　下記条件Ｔ1、Ｔ2における前記粘着面に対する水の接触角θ1、θ2の変位Ｒが５°以下である、樹脂組成物。
　Ｔ1：２３℃環境下で前記はく離ライナーを剥離した直後
　Ｔ2：２３℃環境下で前記はく離ライナーを剥離し、前記粘着面を大気環境下で２時間曝露後
　θ1：Ｔ1での前記粘着面の水接触角（°）
　θ2：Ｔ2での前記粘着面の水接触角（°）
　変位Ｒ（°）＝θ2－θ1
〔付記２〕前記粘着剤層が、仮固定材上に配置された電子部品を受け取るために使用される、付記１に記載の樹脂組成物。
〔付記３〕前記粘着剤層が、仮固定材上に電子部品が配置された面と対向して隙間を設けて配置され、電子部品を受け取るために使用される、付記１又は２に記載の樹脂組成物。
〔付記４〕前記粘着剤層の前記粘着面に対する下記条件の鉄球落下試験による粘着剤層の沈み込み深さの前記粘着剤層の厚さに対する割合（沈み込み深さ／厚さ×１００）が、１５％以上である、付記１～３のいずれか１つに記載の樹脂組成物。
　鉄球落下試験：１ｇの鉄球を高さ１ｍから粘着面に自由落下させる。
〔付記５〕前記粘着剤層の前記粘着面のステンレスに対する常温での初期粘着力Ｆ0と、放射線照射後の前記粘着剤層の前記粘着面のステンレスに対する常温での粘着力Ｆ1において、下記式で示される放射線照射時粘着力の変化率が９５％以下である、付記１～４のいずれか１つに記載の樹脂組成物。

　放射線照射時粘着力の変化率（％）＝（Ｆ0－Ｆ1）／Ｆ0×１００
〔付記６〕前記粘着剤層の厚みが、１μｍ以上５００μｍ以下である、付記１～５のいずれか１つに記載の樹脂組成物。
〔付記７〕アクリル系粘着剤組成物である、付記１～６のいずれか１つに記載の樹脂組成物。
〔付記８〕前記粘着剤層が、前記粘着面とは反対側の面に別の粘着剤層が積層されている、付記１～７のいずれか１つに記載の樹脂組成物。
〔付記９〕前記粘着剤層が、前記粘着面とは反対側の面に基材層が積層されている、付記１～８のいずれか１つに記載の樹脂組成物。
〔付記１０〕前記基材層の前記粘着剤層が積層されていない面に、別の粘着剤層が積層されている、付記９に記載の樹脂組成物。
〔付記１１〕前記基材層が、ポリエステルフィルムから形成される、付記９又は１０に記載の樹脂組成物。
〔付記１２〕付記１～１１のいずれか１つに記載の樹脂組成物により形成される粘着剤層。
〔付記１３〕付記１２に記載の粘着剤層を有する粘着シート。 Variations of the invention described above are added below.
[Appendix 1] A resin composition for forming an adhesive layer whose adhesive surface is protected by a peeling liner.
A resin composition in which the displacement R of the contact angles θ 1 and θ 2 of water with respect to the adhesive surface under the following conditions T 1 and T 2 is 5 ° or less.
Immediately after peeling off the peeling liner in a T 1 : 23 ° C environment T 2 : After peeling off the peeling liner in a 23 ° C environment and exposing the adhesive surface to an atmospheric environment for 2 hours θ 1 : The above in T 1 Water contact angle of adhesive surface (°)
θ 2 : Water contact angle (°) of the adhesive surface at T 2 .
Displacement R (°) = θ 2 -θ 1
[Appendix 2] The resin composition according to Annex 1, wherein the pressure-sensitive adhesive layer is used to receive an electronic component arranged on a temporary fixing material.
[Supplementary Note 3] The description according to Supplementary Note 1 or 2, wherein the adhesive layer is arranged on the temporary fixing material with a gap facing the surface on which the electronic component is arranged, and is used for receiving the electronic component. Resin composition.
[Appendix 4] Ratio of the sinking depth of the pressure-sensitive adhesive layer to the thickness of the pressure-sensitive adhesive layer by the iron ball drop test under the following conditions with respect to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer (subduction depth / thickness × 100). The resin composition according to any one of Supplementary note 1 to 3, wherein the resin composition is 15% or more.
Iron ball drop test: 1 g of iron ball is freely dropped from a height of 1 m onto the adhesive surface.
[Appendix 5] The initial adhesive force F 0 of the adhesive layer to the stainless steel on the adhesive surface and the adhesive force F 1 of the adhesive layer to the stainless steel on the adhesive surface after irradiation are as follows. The resin composition according to any one of Supplementary note 1 to 4, wherein the rate of change in the adhesive strength at the time of irradiation represented by the formula is 95% or less.

Rate of change in adhesive strength during irradiation (%) = (F 0 -F 1 ) / F 0 x 100
[Supplementary Note 6] The resin composition according to any one of Supplementary note 1 to 5, wherein the thickness of the pressure-sensitive adhesive layer is 1 μm or more and 500 μm or less.
[Appendix 7] The resin composition according to any one of the appendices 1 to 6, which is an acrylic pressure-sensitive adhesive composition.
[Appendix 8] The resin composition according to any one of Supplementary note 1 to 7, wherein another pressure-sensitive adhesive layer is laminated on the surface of the pressure-sensitive adhesive layer opposite to the pressure-sensitive adhesive surface.
[Supplementary Note 9] The resin composition according to any one of Supplementary note 1 to 8, wherein the pressure-sensitive adhesive layer has a base material layer laminated on a surface opposite to the pressure-sensitive adhesive surface.
[Appendix 10] The resin composition according to Annex 9, wherein another pressure-sensitive adhesive layer is laminated on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated.
[Appendix 11] The resin composition according to Annex 9 or 10, wherein the base material layer is formed of a polyester film.
[Appendix 12] The pressure-sensitive adhesive layer formed by the resin composition according to any one of the appendices 1 to 11.
[Appendix 13] The pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer according to Appendix 12.
１　　　　　　　　　粘着シート
１０　　　　　　　　粘着剤層
Ｒ１、Ｒ２　　　　　はく離ライナー
２　　　　　　　　　粘着シート
２０、２１　　　　　粘着剤層
３　　　　　　　　　粘着シート
３０　　　　　　　　粘着剤層
Ｓ１　　　　　　　　基材
４　　　　　　　　　粘着シート
４０、４１　　　　　粘着剤層
５０　　　　　　　　仮固定材（基板もしくは粘着シート）
５１　　　　　　　　電子部品
６０　　　　　　　　粘着シート又は基板 1 Adhesive sheet 10 Adhesive layers R1, R2 Peeling liner 2 Adhesive sheets 20, 21 Adhesive layer 3 Adhesive sheet 30 Adhesive layer S1 Base material 4 Adhesive sheets 40, 41 Adhesive layer 50 Temporary fixing material (board or adhesive sheet)
51 Electronic components 60 Adhesive sheet or substrate

Claims (13)

  1. 　はく離ライナーで粘着面が保護された粘着剤層を形成するための樹脂組成物であって、
    　下記条件Ｔ1、Ｔ2における前記粘着面に対する水の接触角θ1、θ2の変位Ｒが５°以下である、樹脂組成物。
    　Ｔ1：２３℃環境下で前記はく離ライナーを剥離した直後
    　Ｔ2：２３℃環境下で前記はく離ライナーを剥離し、前記粘着面を大気環境下で２時間曝露後
    　θ1：Ｔ1での前記粘着面の水接触角（°）
    　θ2：Ｔ2での前記粘着面の水接触角（°）
    　変位Ｒ（°）＝θ2－θ1     A resin composition for forming an adhesive layer whose adhesive surface is protected by a peeling liner.
    A resin composition in which the displacement R of the contact angles θ 1 and θ 2 of water with respect to the adhesive surface under the following conditions T 1 and T 2 is 5 ° or less.
    Immediately after peeling off the peeling liner in a T 1 : 23 ° C environment T 2 : After peeling off the peeling liner in a 23 ° C environment and exposing the adhesive surface to an atmospheric environment for 2 hours θ 1 : The above in T 1 Water contact angle of adhesive surface (°)
    θ 2 : Water contact angle (°) of the adhesive surface at T 2 .
    Displacement R (°) = θ 2 -θ 1
  2. 　前記粘着剤層が、仮固定材上に配置された電子部品を受け取るために使用される、請求項１に記載の樹脂組成物。 The resin composition according to claim 1, wherein the pressure-sensitive adhesive layer is used to receive an electronic component arranged on a temporary fixing material.
  3. 　前記粘着剤層が、仮固定材上に電子部品が配置された面と対向して隙間を設けて配置され、電子部品を受け取るために使用される、請求項１又は２に記載の樹脂組成物。 The resin composition according to claim 1 or 2, wherein the pressure-sensitive adhesive layer is arranged on the temporary fixing material with a gap facing the surface on which the electronic component is arranged, and is used for receiving the electronic component. ..
  4. 　前記粘着剤層の前記粘着面に対する下記条件の鉄球落下試験による粘着剤層の沈み込み深さの前記粘着剤層の厚さに対する割合（沈み込み深さ／厚さ×１００）が、１５％以上である、請求項１～３のいずれか１項に記載の樹脂組成物。
    　鉄球落下試験：１ｇの鉄球を高さ１ｍから粘着面に自由落下させる。     The ratio of the sinking depth of the pressure-sensitive adhesive layer to the thickness of the pressure-sensitive adhesive layer (subduction depth / thickness × 100) by the iron ball drop test under the following conditions with respect to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer is 15%. The resin composition according to any one of claims 1 to 3, which is the above.
    Iron ball drop test: 1 g of iron ball is freely dropped from a height of 1 m onto the adhesive surface.
  5. 　前記粘着剤層の前記粘着面のステンレスに対する常温での初期粘着力Ｆ0と、放射線照射後の前記粘着剤層の前記粘着面のステンレスに対する常温での粘着力Ｆ1において、下記式で示される放射線照射時粘着力の変化率が９５％以下である、請求項１～４のいずれか１項に記載の樹脂組成物。

    　放射線照射時粘着力の変化率（％）＝（Ｆ0－Ｆ1）／Ｆ0×１００     The initial adhesive force F 0 of the adhesive layer to the stainless steel on the adhesive surface and the adhesive force F 1 of the adhesive layer to the stainless steel on the adhesive surface after irradiation are represented by the following formulas. The resin composition according to any one of claims 1 to 4, wherein the rate of change in the adhesive strength at the time of irradiation is 95% or less.

    Rate of change in adhesive strength during irradiation (%) = (F 0 -F 1 ) / F 0 x 100
  6. 　前記粘着剤層の厚みが、１μｍ以上５００μｍ以下である、請求項１～５のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 5, wherein the thickness of the pressure-sensitive adhesive layer is 1 μm or more and 500 μm or less.
  7. 　アクリル系粘着剤組成物である、請求項１～６のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 6, which is an acrylic pressure-sensitive adhesive composition.
  8. 　前記粘着剤層が、前記粘着面とは反対側の面に別の粘着剤層が積層されている、請求項１～７のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 7, wherein the pressure-sensitive adhesive layer is laminated with another pressure-sensitive adhesive layer on a surface opposite to the pressure-sensitive adhesive surface.
  9. 　前記粘着剤層が、前記粘着面とは反対側の面に基材層が積層されている、請求項１～８のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 8, wherein the pressure-sensitive adhesive layer has a base material layer laminated on a surface opposite to the pressure-sensitive adhesive surface.
  10. 　前記基材層の前記粘着剤層が積層されていない面に、別の粘着剤層が積層されている、請求項９に記載の樹脂組成物。 The resin composition according to claim 9, wherein another pressure-sensitive adhesive layer is laminated on the surface of the base material layer on which the pressure-sensitive adhesive layer is not laminated.
  11. 　前記基材層が、ポリエステルフィルムから形成される、請求項９又は１０に記載の樹脂組成物。 The resin composition according to claim 9 or 10, wherein the base material layer is formed of a polyester film.
  12. 　請求項１～１１のいずれか１項に記載の樹脂組成物により形成される粘着剤層。 A pressure-sensitive adhesive layer formed by the resin composition according to any one of claims 1 to 11.
  13. 　請求項１２に記載の粘着剤層を有する粘着シート。 An adhesive sheet having the adhesive layer according to claim 12.
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