WO2022131306A1 - 転写用両面粘着シート - Google Patents

転写用両面粘着シート Download PDF

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Publication number
WO2022131306A1
WO2022131306A1 PCT/JP2021/046350 JP2021046350W WO2022131306A1 WO 2022131306 A1 WO2022131306 A1 WO 2022131306A1 JP 2021046350 W JP2021046350 W JP 2021046350W WO 2022131306 A1 WO2022131306 A1 WO 2022131306A1
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Prior art keywords
pressure
sensitive adhesive
adhesive layer
double
transfer
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PCT/JP2021/046350
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English (en)
French (fr)
Japanese (ja)
Inventor
元気 越智
奈津子 沖田
弘司 野呂
Original Assignee
日東電工株式会社
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Priority claimed from JP2021091449A external-priority patent/JP2022097357A/ja
Priority claimed from JP2021091122A external-priority patent/JP2022183681A/ja
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN202180084632.9A priority Critical patent/CN116615510A/zh
Priority to KR1020237023879A priority patent/KR20230123491A/ko
Publication of WO2022131306A1 publication Critical patent/WO2022131306A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Definitions

  • the present invention relates to a double-sided adhesive sheet for transfer.
  • Patent Document 1 a semiconductor chip obtained by fragmenting a semiconductor wafer is received by a double-sided adhesive sheet for transfer on a carrier substrate and then transferred onto a mounting substrate (for example,).
  • marking may be performed on the double-sided adhesive sheet for transfer in order to impart distinctiveness when transporting the double-sided adhesive sheet for transfer that has received the semiconductor chip.
  • an ultraviolet laser is used for such marking, as shown in FIG. 5, the first pressure-sensitive adhesive layer 12 is peeled off from the base material 10 and floats up, so that the flatness of the double-sided pressure-sensitive adhesive sheet for transfer is impaired.
  • the position of the electronic component 21 is misaligned and transfer defects are likely to occur.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a double-sided adhesive sheet for transfer, which is less likely to cause misalignment of electronic components even when irradiated with ultraviolet rays and can maintain transfer accuracy.
  • the present inventors have made a first adhesive layer for receiving fine electronic components such as a semiconductor chip, a base material, and a second for temporarily fixing to a carrier substrate.
  • a double-sided adhesive sheet for transfer which has an adhesive layer and the ratio of the floating height before irradiation to the floating height after irradiation with a specific ultraviolet laser is within a specific range, marking by ultraviolet laser irradiation is performed.
  • marking by ultraviolet laser irradiation is performed.
  • the present invention has been completed based on these findings.
  • the present invention is a double-sided pressure-sensitive adhesive sheet for transfer in which a first pressure-sensitive adhesive layer, a base material, and a second pressure-sensitive adhesive layer are laminated in this order.
  • the first pressure-sensitive adhesive layer is composed of a low-stickiness pressure-sensitive adhesive layer.
  • the second pressure-sensitive adhesive layer is composed of a peelable pressure-sensitive adhesive layer.
  • a double-sided pressure-sensitive adhesive sheet for transfer which has a ratio of R z1 (R z1 / R z2 ) of 0.2 to 1600.
  • the area ratio of the floating area to the irradiation area is 20.0. % Or less is preferable.
  • the present invention is also a double-sided pressure-sensitive adhesive sheet for transfer in which a first pressure-sensitive adhesive layer, a base material, and a second pressure-sensitive adhesive layer are laminated in this order.
  • the first pressure-sensitive adhesive layer is composed of a low-stickiness pressure-sensitive adhesive layer.
  • the second pressure-sensitive adhesive layer is composed of a peelable pressure-sensitive adhesive layer.
  • the ratio (R z2 / t 1 ) of the floating height R z2 ( ⁇ m) to the thickness t 1 ( ⁇ m) of the first pressure-sensitive adhesive layer is preferably 1.0 or less.
  • the double-sided adhesive sheet for transfer of the present invention is less likely to lose its flatness even when irradiated with an ultraviolet laser, it is possible to suppress misalignment of electronic components and transfer defects and maintain transfer accuracy.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of the first step in a method of mounting an electronic component on a mounting substrate using the double-sided adhesive sheet for transfer shown in FIG. 1.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a second step in a method of mounting an electronic component on a mounting substrate using the double-sided adhesive sheet for transfer shown in FIG. 1.
  • the double-sided pressure-sensitive adhesive sheet for transfer has a laminated structure in which a first pressure-sensitive adhesive layer, a base material, and a second pressure-sensitive adhesive layer are laminated in this order, and the first pressure-sensitive adhesive layer is described above.
  • the ratio of the floating height R z1 before irradiation to the floating height R z2 after irradiating an ultraviolet laser with a wavelength of 248 nm with a beam size of 130 ⁇ 105 ⁇ m, an output of 100 mJ / cm 2 , a frequency of 100 Hz, and a pulse width of 10 ns (R). z1 / R z2 ) is 0.2 to 1600.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of the double-sided adhesive sheet for transfer of the present invention, in which 1 is a double-sided adhesive sheet for transfer, 10 is a base material, 11 is a first adhesive layer, and 12 is a second adhesive. Shows the agent layer.
  • the configuration in which the ratio (R z1 / R z2 ) is 0.2 to 1600 is preferable from the viewpoint of the position accuracy of the electronic component received in the first pressure-sensitive adhesive layer, more preferably 0.4 to 1500, and 0. .5-1400 is more preferable.
  • the floating heights R z1 and R z2 are the maximum heights of the amount of swelling in the vertical direction (Z-axis direction) of the irradiated portion after laser irradiation, and are, for example, a laser microscope (product name "VK-X100"). It can be obtained by analyzing the surface observation image obtained by using (manufactured by KEYENCE CORPORATION).
  • the first pressure-sensitive adhesive layer is irradiated with an ultraviolet laser having a wavelength of 248 nm with a beam size of 130 ⁇ 105 ⁇ m, an output of 100 mJ / cm 2 , a frequency of 100 Hz, and a pulse width of 10 ns.
  • the area ratio of the floating area is preferably 20.0% or less.
  • the configuration in which the area ratio is 20.0% or less is preferable from the viewpoint of the position accuracy of the electronic component received in the first pressure-sensitive adhesive layer, more preferably 15.0% or less, and further preferably 10.0% or less. preferable.
  • the lower limit of the area ratio is usually 0%.
  • the floating area is the area of the portion where the low-adhesive pressure-sensitive adhesive layer is peeled off from the base material and lifted up, and can be obtained by analyzing, for example, a surface observation image taken with a microscope.
  • the ratio (R z2 / t 1 ) of the floating height R z2 ( ⁇ m) to the thickness t 1 ( ⁇ m) of the first pressure-sensitive adhesive layer is 1.0 or less. Is preferable.
  • the configuration in which the ratio (R z2 / t 1 ) is 1.0 or less is preferable from the viewpoint of the position accuracy of the electronic component received in the first pressure-sensitive adhesive layer, 0.5 or less is more preferable, and 0.4 or less. The following is more preferable.
  • the above-mentioned floating height R z2 after irradiation with an ultraviolet laser and the area ratio of the floating area are the adhesive strength by adjusting the type and composition of the adhesive constituting the first adhesive layer, the degree of cross-linking, and the like, and It can be adjusted by suppressing the reaction of the base material by adjusting the type and the amount of the ultraviolet absorber added, and by adjusting the adhesion between the pressure-sensitive adhesive and the base material.
  • the double-sided pressure-sensitive adhesive sheet for transfer has a laminated structure in which a first pressure-sensitive adhesive layer, a base material, and a second pressure-sensitive adhesive layer are laminated in this order, and the first pressure-sensitive adhesive is described above.
  • the layer is irradiated with an ultraviolet laser having a wavelength of 248 nm with a beam size of 130 ⁇ 105 ⁇ m, an output of 100 mJ / cm 2 , a frequency of 100 Hz, and a pulse width of 10 ns
  • the area ratio of the floating area to the irradiated area is 20.0% or less.
  • the position accuracy of the electronic component can be maintained by the configuration that the area ratio is 20.0% or less.
  • the area ratio is preferably 15.0% or less, more preferably 10.0% or less.
  • the first pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer for receiving and holding electronic components, and is composed of a low-stickiness pressure-sensitive adhesive layer.
  • the configuration in which the first pressure-sensitive adhesive layer is composed of a low-stickiness pressure-sensitive adhesive layer is preferable in that the force applied to the electronic component when it is received can be reduced and damage to the electronic component can be suppressed.
  • the electronic component is peeled off from the dicing tape by pushing it with a pin member and dropped onto the first pressure-sensitive adhesive layer.
  • the configuration in which the first pressure-sensitive adhesive layer is composed of a low-stickiness pressure-sensitive adhesive layer is such that when the first pressure-sensitive adhesive layer receives an electronic component in a non-contact manner, the electronic component does not bounce and is easily caught by the first pressure-sensitive adhesive layer. It is also preferable in that it can be received with high positional accuracy. Further, it is also preferable that the electronic component received by the double-sided adhesive sheet for transfer can be easily peeled off from the first pressure-sensitive adhesive layer when the electronic component is mounted on the mounting substrate.
  • the first pressure-sensitive adhesive layer has low adhesive pressure by adjusting the type and composition of the constituent pressure-sensitive adhesive, the degree of cross-linking, etc., and by forming WBL (Week Boundary Layer) by blending a light peeling agent and a plasticizer. It can be an agent layer.
  • WBL Wide Boundary Layer
  • the 180 ° peeling adhesive force of the first pressure-sensitive adhesive layer on the PET film at 25 ° C. is not particularly limited, but it can be received with high positional accuracy without damaging the electronic components, and further good transfer to the mounting substrate. From the viewpoint of properties, it is preferably 100 mN / 25 mm or less, more preferably 50 mN / 25 mm or less, and further preferably 10 mN / 25 mm. Further, from the viewpoint of the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer, the 180 ° peeling adhesive force of the first pressure-sensitive adhesive layer to the glass plate at 25 ° C. is preferably 0.1 mN / 25 mm or more. More preferably, it is 1 mN / 25 mm or more.
  • the double-sided adhesive sheet for transfer is held at 160 ° C. for 5 minutes against the 180 ° peeling adhesive force (hereinafter, may be referred to as “P1a” in the present specification) of the first pressure-sensitive adhesive layer against the PET film at 25 ° C.
  • P1a 180 ° peeling adhesive force
  • P1b the 180 ° peeling adhesive force
  • the ratio (P1b / P1a) of the 180 ° peeling adhesive force (hereinafter, may be referred to as “P1b” in the present specification) to the PET film of the first pressure-sensitive adhesive layer at 25 ° C. is particularly limited. However, 3.0 or less is preferable, and 2.5 or less is more preferable.
  • P1b / P1a is 3.0 or less is the first adhesion to the electronic component when the electronic component received by the double-sided adhesive sheet for transfer of the present invention is transferred onto the mounting substrate by thermocompression bonding and mounted. It is preferable in that the adhesive strength of the agent layer does not increase and it can be satisfactorily peeled off and transferred to the mounting substrate.
  • the second adhesive layer of the double-sided adhesive sheet for transfer is attached to a glass plate, and the PET film is attached to the adhesive surface of the first adhesive layer, 2 kg roller, 1 It is crimped under reciprocating crimping conditions and aged for 30 minutes in an atmosphere of 23 ° C. and 50% RH. After aging, in accordance with JIS Z0237, the transfer double-sided adhesive sheet is peeled off from the adherend under the conditions of 25 ° C, 50% RH, tensile speed of 300 mm / min, and peeling angle of 180 °, and then pulled by 180 °. The peeling adhesive strength (mN / 25 mm) is measured.
  • the PET film is not particularly limited as long as it is untreated PET, and examples thereof include the trade name "Lumirror # 25-S10, thickness 23 ⁇ m" (manufactured by Toray Industries, Inc.).
  • the surface force of the first pressure-sensitive adhesive layer can be adjusted by the type and composition of the constituent pressure-sensitive adhesive, the degree of cross-linking, additives such as fatty acid ester and fluorine-based surfactant, and the like.
  • the storage elastic modulus (E'1a) of the first pressure-sensitive adhesive layer at a frequency of 1 Hz and 25 ° C. by AFM-DMA is preferably 50 MPa or less. This configuration is preferable in order to reliably bond the electronic components received by the first pressure-sensitive adhesive layer. If the E'1a is too high, the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer is lowered, and problems such as misalignment or dropping of the electronic component may occur. From the viewpoint of the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer, E'1a is preferably 40 MPa or less, more preferably 30 MPa or less.
  • E'1a is preferably 0.1 MPa or more. If the E'1a is too low, the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer becomes too high, and the transferability at the time of mounting on the mounting substrate may be impaired. From the viewpoint of transferability of electronic components to a mounting substrate, E'1a is preferably 0.2 MPa or more, more preferably 0.5 MPa or more.
  • the storage elastic modulus (E'1b) of the first pressure-sensitive adhesive layer at a frequency of 1 kHz and 25 ° C. by AFM-DMA is preferably 100 MPa or less.
  • This configuration is preferable in that when the first pressure-sensitive adhesive layer receives the electronic component in a non-contact manner, the electronic component is not repelled on the surface of the first pressure-sensitive adhesive layer and can be received with high positional accuracy. If the E'1b is too high, when the electronic component is dropped and received without contacting the surface of the first pressure-sensitive adhesive layer, the electronic component is flipped and deviates from a predetermined position or is turned over, resulting in position accuracy. Is likely to decrease.
  • E'1b is preferably 90 MPa or less, more preferably 80 MPa or less. Further, it may be 70 MPa or less, 60 MPa or less, 50 MPa or less, 40 MPa or less, 30 MPa or less, and particularly 20 MPa or less.
  • E'1b is preferably 0.5 MPa or more. If the E'1b is too low, the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer becomes high, and when the electronic component falls, it is buried in the first pressure-sensitive adhesive layer and mounted on a mounting substrate. The transferability may be impaired. From the viewpoint of transferability of electronic components to the mounting substrate, E'1b is preferably 0.7 MPa or more, more preferably 1.0 MPa or more.
  • the frequency of the first pressure-sensitive adhesive layer by AFM-DMA is 1 Hz
  • the frequency of the first pressure-sensitive adhesive layer by AFM-DMA is 1 kHz with respect to the storage elastic modulus (E'1a) at 25 ° C.
  • the ratio (E'1b / E'1a) of the storage elastic modulus (E'1b) at 25 ° C. is preferably larger than 1.00.
  • This configuration is preferable in that the balance between the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer, the position accuracy, the transferability to the mounting substrate, and the like is improved.
  • E'1b / E'1a is preferably 1.05 or more, and more preferably 1.10 or more, from the viewpoint of the balance between the adhesiveness of electronic components, the position accuracy, and the transferability to the mounting substrate.
  • the upper limit of E'1b / E'1a is not particularly limited, but is preferably 3.00 or less from the viewpoint of the above balance.
  • the loss elastic modulus (E "1a) of the first pressure-sensitive adhesive layer at a frequency of 1 Hz and 25 ° C. by AFM-DMA is preferably 7 MPa or less. It is preferable from the viewpoint of excellent transferability of the component to the mounting substrate. If E “1a is too high, the adhesiveness of the electronic component to the first pressure-sensitive adhesive layer becomes too high, and transfer when mounting the component on the mounting substrate. Sex may be impaired. From the viewpoint of transferability of the electronic component to the mounting substrate, E "1a is preferably 5 MPa or less, more preferably 3 MPa or less.
  • E "1a is preferably 0.01 MPa or more, more preferably 0.03 MPa or more.
  • the loss elastic modulus (E "1a) at a frequency of 1 Hz and 25 ° C. are the types and compositions of the pressure-sensitive adhesives, the degree of cross-linking and the like. Can be adjusted by.
  • the tack force of the first pressure-sensitive adhesive layer on the stainless steel plate is 10 to 250 gf / ⁇ 5 mm SUS.
  • the tack force of the first pressure-sensitive adhesive layer on a stainless steel plate can be adjusted by the type and composition of the constituent pressure-sensitive adhesive, the degree of cross-linking, additives such as fatty acid ester and fluorine-based surfactant, and the like.
  • the surface force of the first pressure-sensitive adhesive layer is preferably ⁇ 500 to ⁇ 100 ⁇ N.
  • the surface force of the first pressure-sensitive adhesive layer can be adjusted by the type and composition of the constituent pressure-sensitive adhesive, the degree of cross-linking, additives such as fatty acid ester and fluorine-based surfactant, and the like.
  • the thickness t 1 of the first pressure-sensitive adhesive layer is not particularly limited, but is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more. When the thickness is at least a certain level, it is preferable that the first pressure-sensitive adhesive layer makes it easier for electronic components to receive the electronic components with high accuracy.
  • the upper limit of the thickness t 1 of the first pressure-sensitive adhesive layer is not particularly limited, but is preferably 100 ⁇ m, more preferably 90 ⁇ m, and further preferably 80 ⁇ m, 70 ⁇ m, 60 ⁇ m, or 50 ⁇ m.
  • 45 ⁇ m, 40 ⁇ m, 35 ⁇ m, ⁇ m, 30 ⁇ m, 25 ⁇ m, 20 ⁇ m, 15 ⁇ m or 0 ⁇ m are more preferable.
  • the thickness is not more than a certain level, it becomes easy to transfer the electronic component to the mounting substrate with high accuracy, which is preferable.
  • the haze of the first pressure-sensitive adhesive layer is not particularly limited, but is preferably 10% or less, more preferably 5.0% or less. When the haze is 10% or less, excellent transparency can be obtained.
  • the pattern attached on the carrier substrate for example, the transfer position of the electronic component
  • the indicator can be visually recognized, which is preferable.
  • a first pressure-sensitive adhesive layer is formed on a separator and allowed to stand in a normal state (23 ° C., 50% RH) for at least 24 hours, then the separator is peeled off and a slide glass (for example, total light beam) is used.
  • a sample bonded to a transmittance of 91.8% and a haze of 0.4% is used as a sample, and measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.). be able to.
  • the total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the first pressure-sensitive adhesive layer is not particularly limited, but is preferably 85% or more, more preferably 88. % Or more.
  • the total light transmittance is 85% or more, excellent transparency is obtained.
  • a pattern for example, of an electronic component
  • a marker indicating the transfer position can be visually recognized, which is preferable.
  • a first pressure-sensitive adhesive layer is formed on a separator and allowed to stand in a normal state (23 ° C., 50% RH) for at least 24 hours, then the separator is peeled off and a slide glass (for example,) is obtained.
  • Total light transmittance 91.8%, haze 0.4%) as a sample, using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Laboratory Co., Ltd.) Can be measured.
  • the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer is not particularly limited, and is, for example, a silicone-based pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, an acrylic-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, and a polyamide-based pressure-sensitive adhesive.
  • a pressure-sensitive adhesive, an epoxy-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a fluorine-based pressure-sensitive adhesive, and the like can be included.
  • silicone-based adhesives and urethanes which can be received with high position accuracy without damaging electronic parts and are easy to control with low adhesiveness and low tackiness from the viewpoint of good transferability to the mounting substrate.
  • Based adhesives and acrylic adhesives are preferable, silicone adhesives and urethane adhesives are more preferable, and silicone adhesives are even more preferable.
  • the silicone-based pressure-sensitive adhesive is not particularly limited, and known or commonly used silicone-based pressure-sensitive adhesives can be used. Agents and the like can be used.
  • the silicone-based adhesive may be either a one-component type or a two-component type.
  • the silicone-based pressure-sensitive adhesive can be used alone or in combination of two or more.
  • the above-mentioned addition-type silicone-based pressure-sensitive adhesive generally comprises an addition reaction of an organopolysiloxane having an alkenyl group such as a vinyl group on a silicon atom and an organopolysiloxane having a hydrosilyl group using a platinum compound catalyst such as platinum chloride acid. It is a pressure-sensitive adhesive that produces a silicone-based polymer by subjecting it to a hydrosilylation reaction.
  • the peroxide-curable silicone-based pressure-sensitive adhesive is generally a pressure-sensitive adhesive that cures (crosslinks) an organopolysiloxane with a peroxide to produce a silicone-based polymer.
  • the condensed silicone-based pressure-sensitive adhesive is generally a pressure-sensitive adhesive that produces a silicone-based polymer by dehydration or dealcoholization reaction between polyorganosiloxanes having a hydrolyzable silyl group such as a silanol group or an alkoxysilyl group at the terminal. ..
  • silicone-based adhesive examples include silicone-based adhesives containing silicone rubber and silicone resin because they are easy to control with low adhesiveness and low tackiness.
  • the silicone rubber is not particularly limited as long as it is a silicone-based rubber component, but for example, organopolysiloxane having dimethylsiloxane, methylphenylsiloxane, or the like as a main constituent unit can be used. Further, depending on the type of reaction, a silicone-based rubber having an alkenyl group bonded to a silicon atom (alkenyl group-containing organopolysiloxane; in the case of an addition reaction type) and a silicone-based rubber having at least a methyl group (peroxide curable type).
  • a silicone-based rubber having a silanol group or a hydrolyzable alkoxysilyl group at the terminal in the case of a condensation type or the like can be used.
  • the weight average molecular weight of the organopolysiloxane in the silicone rubber is usually 150,000 or more, preferably 280,000 to 1,000,000, and particularly preferably 500,000 to 900,000.
  • the silicone resin is not particularly limited as long as it is a silicone-based resin used for a silicone-based pressure-sensitive adhesive, and for example, an M unit composed of the constituent unit "R 3 Si 1/2 " and the constituent unit "SiO". It consists of a (co) polymer having at least one unit selected from the Q unit consisting of " 2 ", the T unit consisting of the constituent unit "RSiO 3/2 ", and the D unit consisting of the constituent unit "R 2 SiO". Examples thereof include silicone resins made of organopolysiloxane.
  • R in the said structural unit represents a hydrocarbon group or a hydroxyl group.
  • hydrocarbon group examples include an aliphatic hydrocarbon group (alkyl group such as methyl group and ethyl group), an alicyclic hydrocarbon group (cycloalkyl group such as cyclohexyl group), and an aromatic hydrocarbon group (aroma group).
  • Aryl groups such as phenyl group and naphthyl group) and the like can be mentioned.
  • Various functional groups such as a vinyl group may be introduced into the organopolysiloxane in such a silicone resin, if necessary.
  • the functional group to be introduced may be a functional group capable of causing a crosslinking reaction.
  • As the silicone resin an MQ resin composed of M units and Q units is preferable.
  • the weight average molecular weight of the organopolysiloxane in the silicone resin is usually 1000 or more, preferably 1000 to 20000, and particularly preferably 1500 to 10000.
  • the blending ratio of the silicone rubber and the silicone resin is not particularly limited, but from the viewpoint of easy control of low adhesiveness and low tackiness, for example, 100 to 220 parts by weight of the silicone resin is 100 parts by weight of the silicone rubber. (In particular, it is preferably 120 to 180 parts by weight).
  • the silicone rubber and the silicone resin may be in a mixed state in which they are simply mixed, and react with each other to form a condensate (particularly a partial condensate). ), Cross-linking reaction product, addition reaction product, or the like.
  • silicone-based adhesives containing silicone rubber and silicone resin usually contain a cross-linking agent in order to form a cross-linked structure because it is easy to control low adhesiveness and low tackiness.
  • the cross-linking agent is not particularly limited, but a siloxane-based cross-linking agent (silicone-based cross-linking agent) and a peroxide-based cross-linking agent can be preferably used.
  • the cross-linking agent can be used alone or in combination of two or more.
  • polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms in the molecule can be preferably used.
  • various organic groups may be bonded to the silicon atom to which the hydrogen atom is bonded in addition to the hydrogen atom.
  • the organic group include an alkyl group such as a methyl group and an ethyl group; an aryl group such as a phenyl group and an alkyl halide group, but a methyl group is preferable from the viewpoint of synthesis and handling.
  • the skeleton structure of the polyorganohydrogensiloxane may have any of linear, branched, and cyclic skeleton structures, but linear skeletons are preferable.
  • peroxide-based cross-linking agent for example, diacyl peroxide, alkyl peroxy ester, peroxy dicarbonate, monoperoxy carbonate, peroxyketal, dialkyl peroxide, hydroperoxide, ketone peroxide and the like can be used. .. More specifically, for example, benzoyl peroxide, t-butylperoxybenzoate, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5-di.
  • Examples of the additive silicone adhesive have trade names "KR-3700”, “KR-3701”, “X-40-3237-1”, “X-40-3240”, and “X-40-3291-1”. , “X-40-3306” (all manufactured by Shin-Etsu Chemical Co., Ltd.) are commercially available. Further, as a peroxide-curable silicone-based adhesive, for example, trade names "KR-100”, “KR-101-10", “KR-130” (all manufactured by Shin-Etsu Chemical Co., Ltd.) and the like are commercially available. Has been done.
  • the additive silicone-based pressure-sensitive adhesive preferably contains a curing catalyst such as a platinum catalyst.
  • a curing catalyst such as a platinum catalyst.
  • platinum catalysts for example, the product name "CAT-PL-50T” (manufactured by Shin-Etsu Chemical Co., Ltd.), the product name “DOWNSIL NC-25 Catalyst”, “DOWNSIL SRX212 Catalyst” (all manufactured by Dow Toray Co., Ltd.) ) Etc. are commercially available.
  • the content of the curing catalyst is determined by the silicone-based polymer (silicone rubber, silicone) as the base polymer. About 0.1 to 10 parts by weight is preferable with respect to 100 parts by weight (including resin and the like).
  • the urethane-based pressure-sensitive adhesive is not particularly limited, and a known or commonly used urethane-based pressure-sensitive adhesive can be used. A urethane-based adhesive containing the above is preferable.
  • any suitable polyol can be adopted as long as it is a polyol having two or more hydroxyl groups.
  • a polyol having two hydroxyl groups include a polyol having two hydroxyl groups (diol), a polyol having three hydroxyl groups (triol), a polyol having four hydroxyl groups (tetraol), and a polyol having five hydroxyl groups.
  • penaol polyol having 6 hydroxyl groups (hexaol) and the like can be mentioned.
  • Polyols can be used alone or in combination of two or more.
  • the polyol preferably contains a polyol having a number average molecular weight (Mn) of 400 to 20000.
  • the content of the polyol having a number average molecular weight (Mn) of 400 to 20000 in the total amount of the polyol is preferably 50 to 100% by weight, more preferably 70 to 100% by weight, and further preferably 90 to 90 to 100% by weight. It is 100% by weight, particularly preferably 95 to 100% by weight, and most preferably substantially 100% by weight.
  • a urethane-based pressure-sensitive adhesive controlled to have low adhesiveness and low tackiness can be provided. be able to.
  • polyols examples include polyester polyols, polyether polyols, polycaprolactone polyols, polycarbonate polyols, castor oil-based polyols, and the like.
  • the polyester polyol can be obtained, for example, by an esterification reaction between a polyol component and an acid component.
  • polyol component examples include ethylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, and 2-butyl-2-ethyl-.
  • Examples of the acid component include succinic acid, methylsuccinic acid, adipic acid, piceric acid, azelaic acid, sebacic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, dimer acid, and 2-methyl-1. , 4-Cyclohexanedicarboxylic acid, 2-ethyl-1,4-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, phthalic acid, isophthalic acid, terephthalic acid, 1,4-naphthalenedicarboxylic acid, 4,4'-biphereldicarboxylic acid Examples thereof include acids and their acid anhydrides.
  • polyether polyol examples include water, low molecular weight polyols (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), dihydroxybenzene (catechol, resorcin, hydroquinone, etc.).
  • polyether polyols obtained by addition polymerization of alkylene oxides such as ethylene oxide, propylene oxide and butylene oxide using the above as an initiator.
  • alkylene oxides such as ethylene oxide, propylene oxide and butylene oxide using the above as an initiator.
  • Specific examples thereof include polyethylene glycol, polypropylene glycol, polytetramethylene glycol and the like.
  • polycaprolactone polyol examples include caprolactone-based polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as ⁇ -caprolactone and ⁇ -valerolactone.
  • polycarbonate polyol examples include a polycarbonate polyol obtained by subjecting the polyol component to a polycondensation reaction with phosgen; the polyol component and the polyol component, dimethyl carbonate, diethyl carbonate, diprovyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethylbutyl carbonate, ethylene carbonate.
  • Polycarbonate polyol obtained by esterifying the contained compound Polycarbonate polyol obtained by etherifying the various polycarbonate polyols and the hydroxyl group-containing compound; Obtained by performing an ester exchange reaction between the various polycarbonate polyols and the ester compound.
  • Polycarbonate polyol Polycarbonate polyol; Polycarbonate polyol obtained by ester exchange reaction between the various polycarbonate polyols and a hydroxyl group-containing compound; Polycarbonate-based polycarbonate polyol obtained by a polycondensation reaction between the various polycarbonate polyols and a dicarboxylic acid compound; Examples thereof include a copolymerized polyether polycarbonate polyol obtained by copolymerizing a polyol and an alkylene oxide.
  • castor oil-based polyol examples include castor oil-based polyol obtained by reacting a castor oil fatty acid with the above-mentioned polyol component. Specific examples thereof include castor oil-based polyols obtained by reacting castor oil fatty acid with polypropylene glycol.
  • polyol it is preferable to use a polyol (triol) having three hydroxyl groups as an essential component from the viewpoint of low adhesiveness, low tackiness, wettability and the like to the electronic parts of the first pressure-sensitive adhesive layer.
  • the polyol (triol) having three hydroxyl groups is preferably contained in an amount of 50 to 100% by weight, more preferably 70 to 100% by weight, based on the total amount of the components constituting the polyol.
  • polyfunctional isocyanate-based compound examples include aliphatic polyisocyanate, alicyclic polyisocyanate, and aromatic polyisocyanate compound.
  • aliphatic polyisocyanate examples include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylenediocyanate, dodecamethylene diisocyanate, 2,4,4-. Examples thereof include trimethylhexamethylene diisocyanate.
  • Examples of the alicyclic polyisocyanate include 1,3-cyclopentenediisocyanate, 1,3-cyclohexanediisocyanate, 1,4-cyclohexanediisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, and hydrogenated tolylene diisocyanate.
  • Examples thereof include isocyanate hydrogenated tetramethylxylylene diisocyanate.
  • aromatic polyisocyanate examples include phenylenediocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, and 4,4'-diphenylmethane diisocyanate, 4 , 4'-toluene diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalenediocyanate, xylylene diisocyanate and the like.
  • aliphatic polyisocyanates and modified products thereof are preferable.
  • the cross-linked structure of the aliphatic polyisocyanate and its modified product is richer in flexibility than other isocyanate-based cross-linking agents, and it is easy to control low adhesiveness and low tackiness.
  • hexamethylene diisocyanate and its modified product are particularly preferable.
  • the above-mentioned polyfunctional isocyanate-based compound and the above-mentioned polyol are the isocyanate group of the above-mentioned polyfunctional isocyanate-based compound and the above-mentioned polyol from the viewpoint of low adhesiveness, low tackiness, and wettability to electronic parts of the first pressure-sensitive adhesive layer.
  • the equivalent ratio (NCO / OH) of the hydroxyl groups is preferably 1 to 5, more preferably 1.1 to 3, and even more preferably 1.2 to 2.
  • the urethane-based pressure-sensitive adhesive preferably contains a catalyst such as an iron-based compound and / or a tin-based compound.
  • a catalyst such as an iron-based compound and / or a tin-based compound.
  • tin-based catalysts such as dibutyltin dilaurate and dioctyltin dilaurate, tris (acetylacetonate) iron, tris (hexane-2,4-dionat) iron, and tris (heptane-2,4-dionat) iron.
  • the content (usage amount) of the catalyst contained in the urethane-based pressure-sensitive adhesive is preferably 0.002 to 0.5 parts by weight, more preferably 0.005 to 0.3 parts by weight, based on 100 parts by weight of the polyol. , 0.01-0.1 parts by weight is more preferable. Within this range, the rate of the crosslinking reaction is high when the pressure-sensitive adhesive layer is formed, and the pot life of the pressure-sensitive adhesive composition is long, which is a preferable embodiment.
  • a urethane-based adhesive containing a urethane prepolymer is also preferable because it is easy to control low adhesiveness and low tackiness.
  • Examples of the urethane-based pressure-sensitive adhesive containing a urethane prepolymer include a pressure-sensitive adhesive containing a polyurethane polyol as a urethane prepolymer and a polyfunctional isocyanate-based compound.
  • Urethane prepolymers can be used alone or in combination of two or more.
  • the polyfunctional isocyanate compound can be used alone or in combination of two or more.
  • the polyurethane polyol as a urethane prepolymer is preferably formed by reacting a polyester polyol and a polyether polyol with an organic polyisosianate compound in the presence of a catalyst or in the absence of a catalyst.
  • any suitable polyester polyol can be used.
  • a polyester polyol include a polyester polyol obtained by reacting an acid component with a glycol component.
  • the acid component include terephthalic acid, adipic acid, azelaic acid, sebatic acid, phthalic anhydride, isophthalic acid, trimellitic acid and the like.
  • the glycol component include ethylene glycol, propylene glycol, diethylene glycol, butylene glycol, 1,6-hexane glycol, 3-methyl-1,5-pentanediol, 3,3'-dimethylol heptane, and polyoxyethylene glycol.
  • polyester polyol examples include polyester polyols obtained by ring-opening polymerization of lactones such as polycaprolactone, poly ( ⁇ -methyl- ⁇ -valerolactone) and polyvalerolactone.
  • the molecular weight of the polyester polyol can be from low molecular weight to high molecular weight.
  • the number average molecular weight is preferably 500 to 5000. If the number average molecular weight is less than 500, the reactivity becomes high and gelation may easily occur. If the number average molecular weight exceeds 5000, the reactivity may be low, and the cohesive force of the polyurethane polyol itself may be low.
  • the amount of the polyester polyol used is preferably 10 to 90 mol% in the polyol constituting the polyurethane polyol.
  • any suitable polyether polyol can be used.
  • a polyether polyol for example, a low molecular weight polyol such as water, propylene glycol, ethylene glycol, glycerin, or trimethylolpropane is used as an initiator, and an oxylan compound such as ethylene oxide, propylene oxide, butylene oxide, or tetrahydrofuran is used.
  • an oxylan compound such as ethylene oxide, propylene oxide, butylene oxide, or tetrahydrofuran is used.
  • examples thereof include polyether polyols obtained by polymerization.
  • Specific examples of such a polyether polyol include a polyether polyol having two or more functional groups, such as polypropylene glycol, polyethylene glycol, and polytetramethylene glycol.
  • the molecular weight of the polyether polyol can be from low molecular weight to high molecular weight.
  • the number average molecular weight is preferably 1000 to 5000. If the number average molecular weight is less than 1000, the reactivity becomes high and gelation may occur easily. If the number average molecular weight exceeds 5000, the reactivity may be low, and the cohesive force of the polyurethane polyol itself may be low.
  • the amount of the polyether polyol used is preferably 20 to 80 mol% in the polyol constituting the polyurethane polyol.
  • polyether polyols are, if necessary, glycols such as ethylene glycol, 1,4-butanediol, neopentyl glycol, butylethylpentanediol, glycerin, trimethylolpropane, pentaerythritol, ethylenediamine, and N.
  • glycols such as ethylene glycol, 1,4-butanediol, neopentyl glycol, butylethylpentanediol, glycerin, trimethylolpropane, pentaerythritol, ethylenediamine, and N.
  • polyvalent amines such as aminoethylethanolamine, isophoronediamine, and xylylenediamine.
  • the polyether polyol only a bifunctional polyether polyol may be used, or a polyether polyol having a number average molecular weight of 1000 to 5000 and having at least 3 or more hydroxyl groups in one molecule is used. Part or all may be used.
  • a part or all of the polyether polyol having an average molecular weight of 1000 to 5000 and having at least 3 or more hydroxyl groups in one molecule is used as the polyether polyol, the balance between the adhesive strength and the removability becomes good. obtain.
  • the number average molecular weight is less than 1000, the reactivity becomes high and gelation may easily occur.
  • the number average molecular weight of such a polyether polyol is more preferably 2500 to 3500.
  • organic polyisocyanate compound any suitable organic polyisocyanate compound can be used.
  • organic polyisocyanate compound include aromatic polyisocyanates, aliphatic polyisocyanates, aromatic aliphatic polyisocyanates, and alicyclic polyisocyanates.
  • aromatic polyisocyanate examples include 1,3-phenylenediocyanate, 4,4'-diphenyldiisocyanate, 1,4-phenylenediocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, and 2,6.
  • aliphatic polyisocyanate examples include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylenediocyanate, 1,3-butylenediocyanate, and dodecamethylene diisocyanate. Examples thereof include 2,4,4-trimethylhexamethylene diisocyanate.
  • aromatic aliphatic polyisocyanate examples include ⁇ , ⁇ '-diisocyanate-1,3-dimethylbenzene, ⁇ , ⁇ '-diisocyanate-1,4-dimethylbenzene, ⁇ , ⁇ '-diisocyanate-1,4-diethylbenzene. , 1,4-Tetramethylxylylene diisocyanate, 1,3-tetramethylxylylene diisocyanate and the like.
  • Examples of the alicyclic polyisocyanate include 3-isocyanate methyl-3,5,5-trimethylcyclohexylisocyanate, 1,3-cyclopentanediisocyanate, 1,3-cyclohexanediisocyanate, 1,4-cyclohexanediisocyanate, and methyl-2. , 4-Cyclohexanediisocyanate, methyl-2,6-cyclohexanediisocyanate, 4,4'-methylenebis (cyclohexylisocyanate), 1,4-bis (isocyanatemethyl) cyclohexane, 1,4-bis (isocyanatemethyl) cyclohexane and the like. Be done.
  • organic polyisocyanate compound a trimethylolpropane adduct body, a biuret body reacted with water, a trimer having an isocyanurate ring, or the like can also be used in combination.
  • Any suitable catalyst can be used as the catalyst that can be used to obtain the polyurethane polyol.
  • a catalyst include tertiary amine compounds and organometallic compounds.
  • tertiary amine compound examples include triethylamine, triethylenediamine, 1,8-diazabicyclo (5,4,0) -undecene-7 (DBU) and the like.
  • organometallic compound examples include tin-based compounds and non-tin-based compounds.
  • tin-based compound examples include dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin dimalate, dibutyltin dilaurate (DBTDL), dibutyltin diacetate, dibutyltin sulfide, tributyltin sulfide, tributyltin oxide, and tributyl.
  • Examples thereof include tin acetate, triethyl tin ethoxide, tributyl tin ethoxide, dioctyl tin oxide, tributyl tin chloride, tributyl tin trichloroacetate, tin 2-ethylhexanoate and the like.
  • non-tin compound examples include titanium compounds such as dibutyl titanium dichloride, tetrabutyl titanate, and butoxytitanium trichloride; lead compounds such as lead oleate, lead 2-ethylhexanoate, lead benzoate, and lead naphthenate.
  • titanium compounds such as dibutyl titanium dichloride, tetrabutyl titanate, and butoxytitanium trichloride
  • lead compounds such as lead oleate, lead 2-ethylhexanoate, lead benzoate, and lead naphthenate.
  • Iron-based compounds such as iron 2-ethylhexanoate and iron acetylacetonate
  • Cobalt-based compounds such as cobalt benzoate and cobalt 2-ethylhexanoate
  • Zinc-based compounds such as zinc naphthenate and zinc 2-ethylhexanoate
  • Titanium-based compounds such as zirconium naphth
  • Examples of the combination of such two types of catalysts include tertiary amine / organometallic, tin-based / non-tin-based, and tin-based / tin-based, preferably tin-based / tin-based, and more preferably.
  • the tin 2-ethylhexanoate / dibutyltin dilaurate is preferably less than 1 and more preferably 0.2 to 0.6 by weight. When the compounding ratio is 1 or more, gelation may easily occur due to the balance of catalytic activity.
  • the amount of the catalyst used is preferably 0.01 to 1.0% by weight with respect to the total amount of the polyester polyol, the polyether polyol, and the organic polyisosianate compound.
  • the reaction temperature is preferably less than 100 ° C, more preferably 85 ° C to 95 ° C. If the temperature is 100 ° C. or higher, it may be difficult to control the reaction rate and the crosslinked structure, and it may be difficult to obtain a polyurethane polyol having a predetermined molecular weight.
  • the reaction temperature is preferably 100 ° C. or higher, more preferably 110 ° C. or higher. Further, when the polyurethane polyol is obtained without a catalyst, it is preferable to react for 3 hours or more.
  • a method for obtaining a polyurethane polyol for example, 1) a method of charging a polyester polyol, a polyether polyol, a catalyst, and an organic polyisocyanate into a flask in full quantity, and 2) a method of charging a polyester polyol, a polyether polyol, and a catalyst into a flask and organically polyisocianate. There is a method of adding the polyol by dropping it. As a method for obtaining a polyurethane polyol, the method 2) is preferable in controlling the reaction.
  • Any suitable solvent can be used to obtain the polyurethane polyol.
  • a solvent include methyl ethyl ketone, ethyl acetate, toluene, xylene, acetone and the like.
  • toluene is preferable.
  • the above-mentioned compound can be used.
  • any method for producing a polyurethane-based composition obtained from a composition containing a urethane prepolymer any method is suitable as long as it is a method for producing a polyurethane-based resin composition using a so-called "urethane prepolymer" as a raw material.
  • a manufacturing method can be adopted.
  • the acrylic pressure-sensitive adhesive is not particularly limited, and a known or commonly used acrylic pressure-sensitive adhesive can be used.
  • an acrylic polymer is contained as a base polymer because it is easy to control low adhesiveness and low tackiness. Acrylic adhesives that can be used.
  • the acrylic polymer is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acryloyl group in the molecule) as a structural unit of the polymer.
  • the acrylic polymer is preferably a polymer containing the largest amount of structural units derived from (meth) acrylic acid ester by weight.
  • the acrylic polymer can be used alone or in combination of two or more. Further, in the present specification, "(meth) acrylic” means "acrylic” and / or "methacrylic” (either one or both of "acrylic” and “methacrylic”), and the same applies to the others.
  • Examples of the (meth) acrylic acid ester include hydrocarbon group-containing (meth) acrylic acid esters.
  • Examples of the hydrocarbon group-containing (meth) acrylic acid ester include (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, and (meth) acrylic acid aryl ester.
  • Examples of the (meth) acrylic acid alkyl ester include methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, and pentyl ester of (meth) acrylic acid.
  • Examples of the (meth) acrylic acid cycloalkyl ester include cyclopentyl ester and cyclohexyl ester of (meth) acrylic acid.
  • Examples of the (meth) acrylic acid aryl ester include phenyl ester and benzyl ester of (meth) acrylic acid.
  • the above hydrocarbon group-containing (meth) acrylic acid ester can be used alone or in combination of two or more.
  • the proportion of the hydrocarbon group-containing (meth) acrylic acid ester in all the monomer components of the above is preferably 40% by weight or more, more preferably 60% by weight or more.
  • the acrylic polymer is a structural unit derived from other monomer components copolymerizable with the hydrocarbon group-containing (meth) acrylic acid ester for the purpose of modifying cohesive force, heat resistance, adhesiveness, tackiness and the like. May include.
  • the other monomer components include functional groups such as a carboxy group-containing monomer, an acid anhydride monomer, a hydroxy group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, and acrylonitrile. Examples thereof include monomers and vinyl ester-based monomers.
  • Examples of the carboxy group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
  • Examples of the acid anhydride monomer include maleic anhydride, itaconic anhydride and the like.
  • Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 6-hydroxyhexyl (meth) acrylate.
  • Examples thereof include 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate.
  • Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate.
  • sulfonic acid group-containing monomer examples include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methyl propane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth). ) Acryloyloxynaphthalene sulfonic acid and the like can be mentioned.
  • phosphoric acid group-containing monomer examples include 2-hydroxyethylacryloyl phosphate and the like.
  • Examples of the vinyl ester-based monomer include vinyl acetate, vinyl propionate, vinyl butyrate, vinyl pivalate, vinyl cyclohexanecarboxylic acid, and vinyl benzoate.
  • the other monomer components may be used alone or in combination of two or more.
  • the total ratio of the other monomer components to all the monomer components is preferably 60% by weight or less, more preferably 40% by weight or less.
  • the acrylic polymer may contain a structural unit derived from a polyfunctional monomer copolymerizable with the monomer component forming the acrylic polymer in order to form a crosslinked structure in the polymer skeleton.
  • the polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and penta.
  • the polyfunctional monomer can be used alone or in combination of two or more.
  • the proportion of the polyfunctional monomer in all the monomer components of the above is preferably 40% by weight or less, more preferably 30% by weight or less.
  • the acrylic polymer is obtained by subjecting one or more kinds of monomer components including an acrylic monomer to polymerization.
  • monomer components including an acrylic monomer examples include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.
  • the weight average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3 million.
  • the weight average molecular weight is 100,000 or more, the amount of low molecular weight substances in the pressure-sensitive adhesive layer tends to be small, and contamination of electronic parts and the like can be further suppressed.
  • the acrylic pressure-sensitive adhesive composition forming the first pressure-sensitive adhesive layer may contain a cross-linking agent.
  • the acrylic polymer can be crosslinked to further reduce the low molecular weight substances in the first pressure-sensitive adhesive layer.
  • the weight average molecular weight of the acrylic polymer can be increased to control low adhesiveness and low tackiness.
  • the cross-linking agent include polyisocyanate compounds, epoxy compounds, polyol compounds (polyphenol-based compounds and the like), aziridine compounds, melamine compounds and the like, and isocyanate-based cross-linking agents and / or epoxy-based cross-linking agents are preferable.
  • the amount used is preferably about 10 parts by weight or less, more preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the acrylic polymer.
  • Examples of the isocyanate-based cross-linking agent include aliphatic isocyanates, alicyclic isocyanates, and aromatic isocyanates.
  • Examples of the aliphatic isocyanates include trimethylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate, and dimerate diisocyanate.
  • Examples of the alicyclic isocyanates include cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, and 1,3-bis (isocyanatomethyl) cyclohexane.
  • aromatic isocyanates examples include 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate.
  • isocyanate-based cross-linking agents include trimethylolpropane adduct of tolylene diisocyanate (trade name "Coronate L", manufactured by Tosoh Corporation) and isocyanulate of hexamethylene diisocyanate (trade name "Coronate HX", Tosoh Corporation). ) Made) is also mentioned.
  • epoxy-based cross-linking agent examples include N, N, N', N'-tetraglycidyl-m-xylene diamine, diglycidyl aniline, and 1,3-bis (N, N-diglycidylamino).
  • the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer preferably contains a light peeling agent.
  • WBL Strong Boundary Layer; weak boundary layer
  • the light peeling agent is not particularly limited, and known light peeling agents can be used without limitation, and examples thereof include silicone-based peeling agents, fluorine-based surfactants, aliphatic esters, and the like. , Can be used alone or in combination of two or more.
  • the silicone-based release agent is not particularly limited, and examples thereof include a thermosetting silicone-based release agent and an ionizing radiation-curable silicone-based release agent. Further, the silicone-based release agent may be either a solvent-free type that does not contain a solvent or a solvent type that is dissolved or dispersed in an organic solvent. The silicone-based release agent can be used alone or in combination of two or more.
  • thermosetting silicone-based release agent is not particularly limited, but preferably contains organohydrogenpolysiloxane and organopolysiloxane having an aliphatic unsaturated group. Further, the silicone-based release agent is preferably a heat-addition reaction curable silicone-based release agent that is cured by cross-linking due to a heat addition reaction.
  • the heat-added reaction-curable silicone-based stripping agent is not particularly limited, but is a polysiloxane (Si—H group-containing polysiloxane) having a hydrogen atom (H) bonded to a silicon atom (Si) in the molecule, and a molecule.
  • a polysiloxane (Si—H group reactive polysiloxane) containing a functional group (Si—H group reactive functional group) reactive with a Si—H bond (covalent bond between Si and H) is contained therein.
  • the containing release agent is preferably mentioned.
  • this release agent is cured by addition reaction of Si—H group and Si—H group reactive functional group and cross-linking.
  • the Si to which H is bonded may be either Si in the main chain or Si in the side chain.
  • the Si—H group-containing polysiloxane is preferably a polysiloxane containing two or more Si—H groups in the molecule.
  • a dimethylhydrogensiloxane-based polymer such as poly (dimethylsiloxane-methylsiloxane) is preferably mentioned.
  • the Si—H group-reactive polysiloxane the Si—H group-reactive functional group or the side chain containing such a functional group forms the main chain (skeleton) of the siloxane-based polymer (for example, the main chain).
  • Preferred examples thereof include polysiloxane in an embodiment bonded to Si at the end and Si) inside the main chain.
  • a polysiloxane in which a Si—H group-reactive functional group is directly bonded to Si in the main chain is preferable.
  • a polysiloxane containing two or more Si—H group-reactive functional groups in the molecule is also preferable.
  • Si—H group-reactive functional group in the Si—H group-reactive polysiloxane examples include alkenyl groups such as vinyl group and hexenyl group.
  • siloxane-based polymer forming the main chain portion of the Si—H group-reactive polysiloxane examples include polydialkylsiloxanes such as polydimethylsiloxane, polydiethylsiloxane, and polymethylethylsiloxane (the two alkyl groups are the same). However, they may be different.); Polyalkylarylsiloxane; Poly (dimethylsiloxanemethylsiloxane), polymers obtained by polymerizing a plurality of Si-containing monomers, and the like. Among them, polydimethylsiloxane is preferable as the siloxane-based polymer forming the main chain portion.
  • the heat-added reaction-curable silicone-based release agent contains a polysiloxane having two or more Si—H groups in the molecule and a polysiloxane containing two or more Si—H group-reactive functional groups in the molecule. It is preferably a heat-added reaction-curable silicone-based release agent contained therein.
  • the ionizing radiation-curable silicone-based release agent is not particularly limited, but a UV-curable silicone-based release agent that cures by causing a cross-linking reaction by irradiation with ultraviolet rays (UV) is preferable.
  • UV ultraviolet rays
  • the UV curable silicone-based stripping agent is a stripping agent that cures by undergoing a chemical reaction such as cationic polymerization, radical polymerization, radical addition polymerization, or hydrosilylation reaction by UV irradiation.
  • a UV-curable silicone-based release agent that is cured by cationic polymerization is particularly preferable.
  • the cationically polymerized UV-curable silicone-based release agent is not particularly limited, but at least two epoxy groups form the main chain (skeleton) of the siloxane-based polymer (for example, Si at the end of the main chain, the main chain). Si) inside the chain and / or Si contained in the side chain, respectively, directly or via a divalent group (alkylene group such as methylene group or ethylene group; alkyleneoxy group such as ethyleneoxy group or propyleneoxy group).
  • a release agent containing an epoxy group-containing polysiloxane bonded to the backbone is preferably used. The mode of bonding these at least two epoxy groups to Si may be the same or different.
  • a release agent containing a polysiloxane containing two or more side chains containing one or more epoxy groups is preferable.
  • the epoxy group-containing side chain include a glycidyl group, a glycidyloxy group (glycidyloxy group), a 3,4-epoxycyclohexyl group, a 2,3-epoxycyclopentyl group and the like.
  • the epoxy group-containing polysiloxane may be linear, branched, or a mixture thereof.
  • thermosetting silicone-based release agent in the silicone-based pressure-sensitive adhesive from the viewpoint that the first pressure-sensitive adhesive layer can be easily controlled to have low adhesiveness and low tackiness.
  • the content of the silicone-based release agent is not particularly limited, but is 100 parts by weight of the silicone-based polymer as the base polymer. On the other hand, it is preferably 0.5 parts by weight or more and 100 parts by weight or less. When the content is 0.5 parts by weight or more, it becomes easy to obtain the effect that the first pressure-sensitive adhesive layer can be easily controlled to have low adhesiveness and low tackiness, more preferably 1 part by weight or more, and further more. It is preferably 3 parts by weight or more. Further, when the content is 100 parts by weight or less, sufficient adhesiveness cannot be obtained, and it becomes easy to suppress a problem that it becomes difficult to receive electronic parts, more preferably 30 parts by weight or less, and even more. It is preferably 25 parts by weight or less.
  • the fluorine-based surfactant is not particularly limited, and is, for example, a fluorine-based oligomer, a perfluorobutane sulfonate, a perfluoroalkyl group-containing carboxylate, a hexafluoropentane trimmer derivative-containing sulfonate, and a hexafluoropentane trimmer.
  • Examples thereof include a derivative-containing carboxylate, a hexafluoropentane trimmer derivative-containing quaternary ammonium salt, a hexafluoropentane trimmer derivative-containing betaine, and a hexafluoropentane trimmer derivative-containing polyoxyethylene ether, and among them, a fluorine-based oligomer is preferable.
  • the fluorine-based surfactant can be used alone or in combination of two or more.
  • fluorine-based surfactant examples include, for example, commercially available products having trade names "Megafuck F-114" and “Megafuck F-410" (all manufactured by DIC Co., Ltd.) and trade names "Surflon S”.
  • the weight average molecular weight (Mw) of the fluorine-based oligomer is preferably 3500 or more, more preferably 5000 or more, still more preferably 10,000 or more, and particularly preferably 20000 or more.
  • the weight average molecular weight of the fluorine-based oligomer is 3500 or more, it becomes easy to control the low adhesiveness and low tackiness. Further, when the weight average molecular weight is 20000 or more, foaming at the time of blending the pressure-sensitive adhesive (composition) can be suppressed, and the appearance after the pressure-sensitive adhesive coating is excellent, which is preferable.
  • the upper limit of the weight average molecular weight (Mw) of the fluorine-based oligomer is preferably 200,000, more preferably 100,000 or less. By setting the upper limit to 200,000, the fluorine-based oligomer is likely to be unevenly distributed on the surface, and the light peeling effect is more likely to be exhibited, which is preferable.
  • fluorine-based oligomer for example, as commercial products, trade names "Megafuck F-251", “Megafuck F-253", “Megafuck F-281”, “Megafuck F-410", “Megafuck F-410", “ “Mega Fuck F-430”, “Mega Fuck F-444", “Mega Fuck F-477”, “Mega Fuck F-510”, “Mega Fuck F-511”, “Mega Fuck F-551”, “Mega Fuck” "F-552”, “Mega Fuck F-553”, “Mega Fuck F-554”, “Mega Fuck F-555”, “Mega Fuck F-556", “Mega Fuck F-557”, “Mega Fuck F-” 558 ”,“ Mega Fuck F-559 ”,“ Mega Fuck F-560 ”,“ Mega Fuck F-561 ”,“ Mega Fuck F-562 ”,“ Mega Fuck F-563 ”,“ Mega Fuck F-565 ” , “Mega Fuck F-568
  • the content of the fluorine-based surfactant is not particularly limited, but the weight of the silicone-based polymer as the base polymer is 100. It is preferably 0.01 parts by weight or more and 5 parts by weight or less with respect to the portion. When the content is 0.01 parts by weight or more, it becomes easy to obtain the effect that the first pressure-sensitive adhesive layer can be easily controlled to have low adhesiveness and low tackiness, and more preferably 0.05 parts by weight or more. Even more preferably, it is 0.1 part by weight or more.
  • the content is 5 parts by weight or less, sufficient adhesiveness cannot be obtained, it becomes easy to suppress a problem that it becomes difficult to receive electronic parts, and from the viewpoint of suppressing deterioration of transparency, from the viewpoint of suppressing deterioration of transparency. It is more preferably 3 parts by weight or less, and even more preferably 2 parts by weight or less.
  • the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer contains a fatty acid ester, low adhesiveness, low tackiness, and wettability to electronic parts of the first pressure-sensitive adhesive layer can be expected.
  • fatty acid ester examples include polyoxyethylene bisphenol A lauric acid ester, butyl stearate, 2-ethylhexyl palmitate, 2-ethylhexyl stearate, monoglyceride behenate, cetyl 2-ethylhexanoate, and isopropyl myristate.
  • Fatty acid esters can be used alone or in combination of two or more.
  • the content of the fatty acid ester contained in the urethane-based pressure-sensitive adhesive composition is from the viewpoint of low adhesiveness to electronic parts, low tackiness, wettability and stainability to adherends of the first pressure-sensitive adhesive layer.
  • 1 to 50 parts by weight is preferable, 2 to 40 parts by weight is more preferable, and 3 to 30 parts by weight is further preferable with respect to 100 parts by weight of the polyol.
  • the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer contains a light peeling agent
  • the content (total amount) thereof is low adhesiveness, low tackiness, and wettability to electronic parts of the first pressure-sensitive adhesive layer.
  • stainability to electronic parts and electronic parts for example, 0.1 part by weight or more is preferable, 1 part by weight or more is more preferable, and 3 parts by weight or more is further preferable with respect to 100 parts by weight of the base polymer.
  • 50 parts by weight or less is preferable, 30 parts by weight or less is more preferable, and 10 parts by weight or less is further preferable.
  • the ultraviolet absorber is not particularly limited, and is, for example, a triazine-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, an oxybenzophenone-based ultraviolet absorber, a salicylate ester-based ultraviolet absorber, and a cyanoacrylate-based agent.
  • examples thereof include ultraviolet absorbers, which can be used alone or in combination of two or more.
  • benzotriazole-based ultraviolet absorbers and triazine-based ultraviolet absorbers are preferable from the viewpoint of high ultraviolet absorbing ability at a wavelength of around 250 nm.
  • triazine-based ultraviolet absorber having two or less hydroxyl groups in one molecule examples include 2,4-bis- [ ⁇ 4- (4-ethylhexyloxy) -4-hydroxy ⁇ -phenyl] -6. -(4-Methenylphenyl) -1,3,5-triazine (trade name "Tinosorb S", manufactured by BASF), 2,4-bis [2-hydroxy-4-butoxyphenyl] -6- (2,4) -Dibutoxyphenyl) -1,3,5-triazine (trade name "TINUVIN 460", manufactured by BASF), 2- (4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine) -Reaction product of (2-yl) -5-hydroxyphenyl and [(C 10 -C 16 (mainly C 12 -C 13 ) alkyloxy) methyl] oxylan (trade name "TINUVIN400", manufactured by BASF), 2 -[4,6-bis (2,
  • benzophenone-based ultraviolet absorber (benzophenone-based compound) and oxybenzophenone-based ultraviolet absorber (oxybenzophenone-based compound)
  • examples of the benzophenone-based ultraviolet absorber (benzophenone-based compound) and oxybenzophenone-based ultraviolet absorber (oxybenzophenone-based compound) include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, and 2-hydroxy.
  • -4-methoxybenzophenone-5-sulfonic acid anhydrous and trihydrate
  • 2-hydroxy-4-octyloxybenzophenone 4-dodecyloxy-2-hydroxybenzophenone
  • 4-benzyloxy-2-hydroxybenzophenone 2, Examples thereof include 2', 4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4,4-dimethoxybenzophenone and the like.
  • salicylate ester-based ultraviolet absorber examples include phenyl-2-acryloyloxybenzoate, phenyl-2-acrylyloxy-3-methylbenzoate, and phenyl-2-acryloyloxy.
  • cyanoacrylate-based ultraviolet absorber examples include alkyl-2-cyanoacrylate, cycloalkyl-2-cyanoacrylate, alkoxyalkyl-2-cyanoacrylate, alkenyl-2-cyanoacrylate, and alkynyl-.
  • 2-Cyanoacrylate and the like can be mentioned.
  • the above-mentioned ultraviolet absorber may be used alone or in combination of two or more.
  • the maximum absorption wavelength of the absorption spectrum of the ultraviolet absorber is preferably in the wavelength region of 200 to 400 nm, and more preferably in the wavelength region of 240 to 380 nm.
  • Examples of such an ultraviolet absorber include the trade name "Tinuvin 384-2" (maximum absorption wavelength 345 nm, manufactured by BASF) and the like.
  • the ultraviolet transmittance TUV 1 of the ultraviolet rays having a wavelength of 248 nm of the first pressure-sensitive adhesive layer is 75% or less (more preferably 70% or less, still more preferably 50% or less, although it depends on the thickness of the first pressure-sensitive adhesive layer. The lower limit is usually 5%).
  • the ultraviolet transmittance is, for example, the transmittance in which ultraviolet rays having a wavelength of 248 nm are vertically incident on the first pressure-sensitive adhesive layer, a spectrophotometer (product name “U-4100”), Hitachi High-Tech Science Co., Ltd. Can be measured using (manufactured by).
  • the value (TUV 1 / t 1 ) obtained by dividing the ultraviolet transmittance TUV 1 of the ultraviolet rays having a wavelength of 248 nm of the first adhesive layer by the thickness t 1 of the first adhesive layer is 5.00 or less. It is preferable, more preferably 4.90 or less, further preferably 4.80 or less, and the lower limit is preferably 0.50, more preferably 0.70, still more preferably 1.00.
  • the content of the ultraviolet absorber in the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer varies depending on the thickness of the first pressure-sensitive adhesive layer.
  • the weight of the pressure-sensitive adhesive is 100.
  • the amount is preferably 0.05 to 1.5 parts by weight, more preferably 0.07 to 1.2 parts by weight, still more preferably 1.0 to 1.0 parts by weight.
  • the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer may contain an antioxidant.
  • an antioxidant By containing an antioxidant, deterioration such as discoloration during storage of the double-sided adhesive sheet for transfer of the present invention can be suppressed, and the double-sided adhesive sheet for transfer can be easily cut to improve workability. be able to.
  • antioxidants examples include phenol-based, phosphorus-based, sulfur-based and amine-based antioxidants, and at least one of these is used.
  • phenolic antioxidants are preferable, and hindered phenolic antioxidants are particularly preferable.
  • phenolic antioxidant examples include 2,6-di-t-butyl-p-cresol, 2,6-di-t-butyl-4-ethylphenol, and 2,6-, as monocyclic phenol compounds.
  • the above-mentioned antioxidant may be used alone or in combination of two or more.
  • the content of the deterioration inhibitor contained in the pressure-sensitive adhesive composition is, for example, relative to 100 parts by weight of the first pressure-sensitive adhesive composition from the viewpoint of suppressing deterioration such as discoloration during storage and processability of the double-sided pressure-sensitive adhesive sheet for transfer. Therefore, 0.01 to 10 parts by weight is preferable, 0.03 to 5 parts by weight is more preferable, and 0.1 to 3 parts by weight is further preferable.
  • the pressure-sensitive adhesive composition constituting the first pressure-sensitive adhesive layer may contain any suitable other components as long as the effects of the present invention are not impaired.
  • suitable other components include tackifiers, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, plasticizers, conductive agents, surface lubricants, leveling agents, and heat-resistant stables.
  • agents, polymerization inhibitors, lubricants, solvents and the like include agents, polymerization inhibitors, lubricants, solvents and the like.
  • the second pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer for temporarily fixing to a carrier substrate, and is composed of a peelable pressure-sensitive adhesive layer.
  • the configuration in which the second pressure-sensitive adhesive layer is composed of a peelable pressure-sensitive adhesive layer is preferable in that the second pressure-sensitive adhesive layer can be peeled off from the carrier substrate without contamination such as adhesive residue, and reworkability can be improved.
  • the second pressure-sensitive adhesive layer is a peelable pressure-sensitive adhesive layer by adjusting the adhesiveness according to the type and composition of the pressure-sensitive adhesive, the degree of cross-linking, etc., and by reducing the adhesive strength by physical stimuli such as heat and electromagnetic waves such as ultraviolet rays. Can be.
  • the 180 ° peeling adhesive force of the second pressure-sensitive adhesive layer on the glass plate at 25 ° C. is not particularly limited, but it can be peeled off from the carrier substrate without contamination such as adhesive residue, and is 5000 mN from the viewpoint of improving reworkability. It is preferably / 25 mm or less, more preferably 3000 mN / 25 mm or less, and further preferably 1000 mN / 25 mm or less. Further, from the viewpoint of the adhesiveness of the carrier substrate to the second pressure-sensitive adhesive layer, the 180 ° peeling adhesive force of the second pressure-sensitive adhesive layer to the glass plate at 25 ° C. is preferably 1 mN / 25 mm or more, more preferably. Is 5 mN / 25 mm or more.
  • the double-sided adhesive sheet for transfer is held at 160 ° C. for 5 minutes against the 180 ° peeling adhesive force (hereinafter, may be referred to as “P2a” in the present specification) of the second pressure-sensitive adhesive layer against the glass plate at 25 ° C.
  • P2a 180 ° peeling adhesive force
  • P2b the 180 ° peeling adhesive force
  • the ratio (P2b / P2a) of the 180 ° peeling adhesive force (hereinafter, may be referred to as “P2b” in the present specification) to the glass plate of the second pressure-sensitive adhesive layer at 25 ° C. is particularly limited. However, 3 or less is preferable, and 2.5 or less is more preferable.
  • the configuration in which P2b / P2a is 3 or less means that the electronic component received by the double-sided adhesive sheet for transfer of the present invention is transferred onto the mounting substrate by thermocompression bonding and mounted, and the second adhesive layer with respect to the carrier substrate is mounted. It is preferable in that the adhesive strength does not increase, the peeling is good, and the reworkability is excellent.
  • the 180 ° peeling adhesive strength of the second pressure-sensitive adhesive layer at 25 ° C. can be measured in the same manner as in the first pressure-sensitive adhesive layer.
  • the adhesive strength of the second adhesive layer is determined by adjusting the type and composition of the constituent adhesive, the degree of cross-linking, etc., and by forming WBL (Week Boundary Layer) by blending a light peeling agent and a plasticizer. Can be adjusted.
  • WBL Wide Boundary Layer
  • the thickness of the second pressure-sensitive adhesive layer is not particularly limited, but is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more. When the thickness is not more than a certain level, the second pressure-sensitive adhesive layer tends to be stably fixed to the carrier substrate, which is preferable.
  • the upper limit of the thickness of the second pressure-sensitive adhesive layer is not particularly limited, but is preferably 30 ⁇ m, more preferably 20 ⁇ m. When the thickness is not more than a certain level, the second pressure-sensitive adhesive layer is easily peeled off from the carrier substrate, and the reworkability is improved, which is preferable.
  • the haze of the second pressure-sensitive adhesive layer is not particularly limited, but is preferably 10% or less, more preferably 5% or less. When the haze is 10% or less, excellent transparency is obtained.
  • the pattern for example, the receiving position of the electronic component
  • the indicator can be visually recognized, which is preferable.
  • a second pressure-sensitive adhesive layer is formed on a separator and allowed to stand in a normal state (23 ° C., 50% RH) for at least 24 hours, then the separator is peeled off and a slide glass (for example, total light beam) is used.
  • a sample bonded to a transmittance of 91.8% and a haze of 0.4% is used as a sample, and measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.). be able to.
  • the total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the second pressure-sensitive adhesive layer is not particularly limited, but is preferably 85% or more, more preferably 88. % Or more.
  • the total light transmittance is 85% or more, excellent transparency is obtained.
  • a pattern for example, of an electronic component
  • a marker indicating the receiving position can be visually recognized, which is preferable.
  • a second pressure-sensitive adhesive layer is formed on the separator and allowed to stand in a normal state (23 ° C., 50% RH) for at least 24 hours, and then the separator is peeled off to obtain a slide glass (for example,).
  • Total light transmittance 91.8%, haze 0.4%) as a sample, using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Laboratory Co., Ltd.) Can be measured.
  • the pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer is not particularly limited, but for example, the silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, acrylic-based pressure-sensitive adhesive, and rubber-based pressure-sensitive adhesive used in the first pressure-sensitive adhesive layer described above are not particularly limited. Examples thereof include agents, polyester adhesives, polyamide adhesives, epoxy adhesives, vinyl alkyl ether adhesives, fluorine adhesives and the like. Among these, silicone-based adhesives, urethane-based adhesives, and acrylic-based adhesives are preferable, and urethane-based adhesives and acrylics are preferable because they can be peeled off from the carrier substrate without contamination such as adhesive residue, and from the viewpoint of improving reworkability. Based adhesives are more preferable, and acrylic adhesives are even more preferable.
  • the second pressure-sensitive adhesive layer in the double-sided adhesive sheet for transfer of the present invention is a pressure-sensitive adhesive layer (adhesive strength can be reduced) capable of intentionally reducing the adhesive force by an external action in the process of using the double-sided adhesive sheet for transfer. It may be a type adhesive layer), or it is an adhesive layer (adhesive strength non-reduced adhesive layer) in which the adhesive strength is hardly or not reduced by an external action in the process of using the double-sided adhesive sheet for transfer. However, it can be appropriately selected depending on the method and conditions for transferring the electronic component using the double-sided adhesive sheet for transfer of the present invention.
  • the second pressure-sensitive adhesive layer When the second pressure-sensitive adhesive layer is a pressure-reducing type pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer exhibits a relatively high adhesive strength in the process of manufacturing and using the double-sided pressure-sensitive adhesive sheet for transfer of the present invention. It is possible to use the state showing relatively low adhesive strength properly.
  • the state in which the second pressure-sensitive adhesive layer exhibits relatively high adhesive strength is utilized from the carrier substrate. It is possible to suppress / prevent the floating of the double-sided adhesive sheet for transfer.
  • the reworkability can be improved by reducing the adhesive force of the second pressure-sensitive adhesive layer.
  • Examples of the pressure-sensitive adhesive forming such a pressure-reducing type pressure-sensitive adhesive layer include a radiation-curable pressure-sensitive adhesive and a heat-foaming type pressure-sensitive adhesive.
  • the pressure-sensitive adhesive forming the pressure-reducing type pressure-sensitive adhesive layer can be used alone or in combination of two or more.
  • the radiation-curable pressure-sensitive adhesive for example, a type of pressure-sensitive adhesive that cures by irradiation with an electron beam, ultraviolet rays, ⁇ -rays, ⁇ -rays, ⁇ -rays, or X-rays can be used, and a type that cures by irradiation with ultraviolet rays can be used.
  • a pressure-sensitive adhesive (ultraviolet curable pressure-sensitive adhesive) can be particularly preferably used.
  • the radiation-curable pressure-sensitive adhesive includes, for example, a base polymer such as an acrylic polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond.
  • a base polymer such as an acrylic polymer
  • a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond.
  • Examples include mold radiocurable adhesives.
  • the same acrylic polymer as the first pressure-sensitive adhesive layer can be used. All for forming an acrylic polymer from the viewpoint that basic properties such as tackiness due to a hydrocarbon group-containing (meth) acrylic acid ester are appropriately expressed in the second pressure-sensitive adhesive layer, and stickiness and peelability can be easily controlled.
  • the ratio of the hydrocarbon group-containing (meth) acrylic acid ester in the monomer component is preferably 40% by weight or more, more preferably 60% by weight or more.
  • the acrylic polymer may contain a hydroxy group-containing monomer.
  • the acrylic polymer in the second pressure-sensitive adhesive layer contains a hydroxy group-containing monomer, an appropriate cohesive force can be easily obtained in the second pressure-sensitive adhesive layer.
  • the proportion of the hydroxy group-containing monomer in the acrylic polymer is, for example, 0.1 to 30% by weight, preferably 0. It is 5 to 20% by weight.
  • the acrylic polymer may contain a carboxy group-containing monomer.
  • the acrylic polymer in the second pressure-sensitive adhesive layer contains a carboxy group-containing monomer, it is easy to obtain appropriate adhesive reliability in the second pressure-sensitive adhesive layer.
  • the ratio of the carboxy group-containing monomer in the acrylic polymer is, for example, 0.1 to 30% by weight, preferably 0.5 to 0.5% by weight. 20% by weight.
  • the acrylic polymer may contain a vinyl ester monomer.
  • the acrylic polymer in the second pressure-sensitive adhesive layer contains a vinyl ester-based monomer, an appropriate cohesive force can be easily obtained in the second pressure-sensitive adhesive layer.
  • the proportion of the vinyl ester-based monomer in the acrylic polymer is, for example, 0.1 to 60% by weight, preferably 0.5 to 50% by weight. % By weight.
  • the acrylic pressure-sensitive adhesive composition forming the second pressure-sensitive adhesive layer may contain a cross-linking agent.
  • the acrylic polymer can be crosslinked to further reduce the low molecular weight substances in the second pressure-sensitive adhesive layer.
  • the weight average molecular weight of the acrylic polymer can be increased to control low adhesiveness and peelability.
  • the cross-linking agent include polyisocyanate compounds, epoxy compounds, polyol compounds (polyphenol-based compounds and the like), aziridine compounds, melamine compounds and the like, and isocyanate-based cross-linking agents and / or epoxy-based cross-linking agents are preferable cross-linking agents.
  • the amount used is preferably about 10 parts by weight or less, more preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the acrylic polymer.
  • a cross-linking accelerator may be used in the acrylic pressure-sensitive adhesive composition forming the second pressure-sensitive adhesive layer.
  • the type of the cross-linking accelerator can be appropriately selected depending on the type of the cross-linking agent used.
  • the cross-linking accelerator refers to a catalyst that increases the rate of the cross-linking reaction by the cross-linking agent.
  • Examples of such a cross-linking accelerator include tin (Sn) -containing compounds such as dioctyl tin dilaurate, dibutyl tin dilaurate, dibutyl tin diacetate, dibutyl tin diacetylacetonate, tetra-n-butyl tin, and trimethyl tin hydroxide; Examples thereof include amines such as N', N'-tetramethylhexanediamine and triethylamine, and N-containing compounds such as imidazoles. Of these, Sn-containing compounds are preferable.
  • cross-linking accelerators are particularly effective when a hydroxyl group-containing monomer is used as the sub-monomer and an isocyanate-based cross-linking agent is used as the cross-linking agent.
  • the amount of the cross-linking accelerator contained in the pressure-sensitive adhesive composition is, for example, about 0.001 to 0.5 parts by weight (preferably about 0.001 to 0.1 parts by weight) with respect to 100 parts by weight of the acrylic polymer. ).
  • Examples of the radiation-polymerizable monomer component include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol monohydroxypenta ( Examples thereof include meta) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate.
  • the radiation-polymerizable oligomer component examples include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and those having a molecular weight of about 100 to 30,000 are preferable.
  • the content of the radiation-curable monomer component and the oligomer component in the radiation-curable pressure-sensitive adhesive forming the second pressure-sensitive adhesive layer is, for example, 5 to 500 parts by weight, preferably 40 parts by weight, based on 100 parts by weight of the base polymer. It is about 150 parts by weight.
  • the additive-type radiation-curable pressure-sensitive adhesive for example, those disclosed in Japanese Patent Application Laid-Open No. 60-196956 may be used.
  • the radiation-curable pressure-sensitive adhesive is an intrinsic radiation-curing agent containing a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer backbone or at the end of the polymer backbone in the polymer backbone.
  • a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer backbone or at the end of the polymer backbone in the polymer backbone.
  • sexual pressure-sensitive adhesives can also be mentioned.
  • an intrinsically curable pressure-sensitive adhesive there is a tendency to suppress unintended changes in adhesive properties over time due to the movement of low molecular weight components in the formed second pressure-sensitive adhesive layer. be.
  • Acrylic polymer is preferable as the base polymer contained in the internal radiation curable pressure-sensitive adhesive.
  • a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer for example, a raw material monomer containing a monomer component having a first functional group is polymerized (copolymerized) to obtain an acrylic polymer. Later, a compound having a second functional group capable of reacting with the first functional group and a radiopolymerizable carbon-carbon double bond is added to an acrylic polymer while maintaining the radiopolymerizability of the carbon-carbon double bond. Examples thereof include a method of subjecting to a condensation reaction or an addition reaction.
  • Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, and a hydroxy group and an isocyanate group.
  • Examples thereof include an isocyanate group and a hydroxy group.
  • a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of easiness of reaction tracking.
  • the above-mentioned first functional group is used.
  • a combination in which the hydroxy group is used and the second functional group is an isocyanate group is preferable.
  • Compounds having an isocyanate group and a radiopolymerizable carbon-carbon double bond, that is, a radiopolymerizable unsaturated functional group-containing isocyanate compound include, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-.
  • the acrylic polymer having a hydroxy group contains the above-mentioned hydroxy group-containing monomer and structural units derived from ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glucol monovinyl ether. Can be mentioned.
  • the radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator.
  • the photopolymerization initiator include ⁇ -ketor compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, and thioxanthone compounds. Examples thereof include camphorquinone, halogenated ketone, acylphosphinoxide, acylphosphonate and the like.
  • the ⁇ -ketol compound include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, and 2-methyl-2-hydroxy.
  • Examples thereof include propiophenone and 1-hydroxycyclohexylphenyl ketone.
  • Examples of the acetophenone compound include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2-methyl-1- [4- (methylthio) -phenyl] -2. -Molholinopropane-1 and the like can be mentioned.
  • Examples of the benzoin ether-based compound include benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether and the like.
  • Examples of the ketal-based compound include benzyldimethyl ketal and the like.
  • Examples of the aromatic sulfonyl chloride compound include 2-naphthalene sulfonyl chloride and the like.
  • Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime.
  • Examples of the benzophenone compound include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone and the like.
  • thioxanthone-based compound examples include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl.
  • examples thereof include thioxanthone.
  • the content of the photopolymerization initiator in the radiation curable pressure-sensitive adhesive is, for example, 0.05 to 20 parts by weight with respect to 100 parts by weight of the base polymer.
  • the heat-foaming pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams or expands when heated.
  • foaming agent include various inorganic foaming agents and organic foaming agents.
  • the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium boron hydride, azides and the like.
  • organic foaming agent examples include salt fluoride alkanes such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarboxylicamide and barium azodicarboxylate; paratoluene.
  • Hydrazide compounds such as sulfonyl hydrazide, diphenylsulfone-3,3'-disulfonyl hydrazide, 4,4'-oxybis (benzenesulfonyl hydrazide), allylbis (sulfonyl hydrazide); p-toluylene sulfonyl semicarbazide, 4,4'- Semi-carbazide compounds such as oxybis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morphory-1,2,3,4-thiatriazole; N, N'-dinitrosopentamethylenetetramine, N, N'-dimethyl- Examples thereof include N-nitroso compounds such as N, N'-dinitrosoterephthalamide.
  • heat-expandable microspheres examples include microspheres having a structure in which a substance that easily gasifies and expands by heating is enclosed in a shell.
  • the substance that easily gasifies and expands by the above heating examples include isobutane, propane, and pentane.
  • a heat-expandable microsphere can be produced by encapsulating a substance that easily gasifies and expands by heating in a shell-forming substance by a core selvation method, an interfacial polymerization method, or the like.
  • the shell-forming substance a substance exhibiting thermal meltability or a substance that can explode due to the action of thermal expansion of the encapsulating substance can be used.
  • Examples of such substances include vinylidene chloride / acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethylmethacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.
  • Examples of the pressure-sensitive pressure-sensitive adhesive layer include a pressure-sensitive pressure-sensitive adhesive layer.
  • the pressure-sensitive pressure-sensitive adhesive layer has a form in which the pressure-sensitive adhesive layer formed from the above-mentioned radiation-curable pressure-sensitive adhesive is cured in advance by irradiation with respect to the pressure-reducing type pressure-sensitive adhesive layer and has a certain adhesive strength. Contains an adhesive layer.
  • the pressure-sensitive adhesive forming the non-reducing pressure-sensitive pressure-sensitive adhesive layer can be used alone or in combination of two or more. Further, the entire second pressure-sensitive adhesive layer may be a non-reduced adhesive force type pressure-sensitive adhesive layer, or a part of the second pressure-sensitive adhesive layer may be a non-reduced adhesive force type pressure-sensitive adhesive layer.
  • the entire second pressure-sensitive adhesive layer may be a non-reduced pressure-sensitive adhesive layer, or a specific portion of the second pressure-sensitive adhesive layer may have adhesive strength. It is a non-reducing type pressure-sensitive adhesive layer, and other parts may be a type pressure-sensitive pressure-sensitive adhesive layer that can reduce the adhesive strength.
  • the second pressure-sensitive adhesive layer has a laminated structure, all the pressure-sensitive adhesive layers in the laminated structure may be non-reduced adhesive strength type pressure-sensitive adhesive layers, and some of the pressure-sensitive adhesive layers in the laminated structure adhere to each other. It may be a force-reduced pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer (irradiated radiation-curable pressure-sensitive adhesive layer) in which the pressure-sensitive adhesive layer (non-irradiated radiation-curable pressure-sensitive adhesive layer) formed from the radiation-curable pressure-sensitive adhesive is previously cured by irradiation is radiation. Even if the adhesive strength is reduced by irradiation, it exhibits adhesiveness due to the polymer component contained therein, and can exhibit the minimum adhesive strength required for the double-sided adhesive sheet for transfer of the present invention.
  • the entire second pressure-sensitive adhesive layer may be the radiation-irradiated radiation-curable pressure-sensitive adhesive layer in the surface spreading direction of the second pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer may be used.
  • a part of the agent layer may be a radiation-irradiated radiation-curable pressure-sensitive adhesive layer, and the other part may be a radiation-unirradiated radiation-curable pressure-sensitive adhesive layer.
  • the “radiocurable pressure-sensitive adhesive layer” refers to a pressure-sensitive adhesive layer formed of a radiation-curable pressure-sensitive adhesive, which is a radiation-curable non-irradiated radiation-curable pressure-sensitive adhesive layer and the pressure-sensitive adhesive. Includes both a radiation-cured, radiation-curable pressure-sensitive adhesive layer after the agent layer has been cured by irradiation.
  • the pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer a known or conventional pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive using an acrylic polymer as a base polymer can be preferably used.
  • the acrylic polymer is a polymer containing a structural unit derived from a (meth) acrylic acid ester as the structural unit having the largest weight ratio. Is preferable.
  • the acrylic polymer for example, the acrylic polymer described as the acrylic polymer that can be contained in the above-mentioned additive-type radiation-curable pressure-sensitive adhesive can be adopted.
  • the base material in the double-sided pressure-sensitive adhesive sheet for transfer of the present invention is an element that functions as a support in the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.
  • Examples of the base material include a plastic base material (particularly a plastic film).
  • the base material may be a single layer or a laminated body of the same type or different types of base materials.
  • Examples of the resin constituting the plastic base material include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homopolyprolene.
  • Ethylene-vinyl acetate copolymer Ethylene-vinyl acetate copolymer (EVA), Ionomer, Ethylene- (meth) acrylic acid copolymer, Ethylene- (meth) acrylic acid ester (random, alternating) copolymer, Ethylene- Polyolefin resins such as butene copolymers and ethylene-hexene copolymers; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate and polybutylene terephthalate (PBT); polycarbonates; polyimides; polyether ether ketones; polyetherimides Examples thereof include polyamides such as aramid and total aromatic polyamides; polyphenyl sulfides; fluororesins; polyvinyl chlorides; polyvinylidene chlorides; cellulose resins; silicone resins and the like.
  • EVA Ethylene-vinyl acetate copoly
  • the base material is mainly a heat-resistant resin such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), and polyetheretherketone (PEEK). It is preferable to include it as a component, and it is more preferable to contain polyimide as a main component.
  • the main component of the base material is a component that occupies the largest weight ratio among the constituent components.
  • the above resins can be used alone or in combination of two or more.
  • the second pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer as described above, it is preferable that the base material has radiation permeability.
  • the plastic film may be non-oriented or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.), but the non-oriented property is heat-shrinkable. It is preferable because it is difficult to show.
  • the surface of the base material on the side of the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer is, for example, corona discharge treatment, plasma treatment, sand mat processing, etc., for the purpose of improving adhesion, retention, etc. with the pressure-sensitive adhesive layer.
  • Physical treatment such as ozone exposure treatment, flame exposure treatment, high piezoelectric shock exposure treatment, ionized radiation treatment; chemical treatment such as chromium acid treatment; coating agent (undercoating agent); surface treatment such as easy adhesion treatment by silicone primer treatment It may be given.
  • a conductive vapor-filmed layer containing a metal, an alloy, an oxide thereof or the like may be provided on the surface of the substrate, or a conductive polymer such as PEDOT-PSS may be coated. It is preferable that the surface treatment for enhancing the adhesion is applied to the entire surface of the base material on the pressure-sensitive adhesive layer side.
  • the thickness of the base material is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, still more preferably 15 ⁇ m, from the viewpoint of ensuring the strength for the base material to function as a support in the double-sided pressure-sensitive adhesive sheet for transfer of the present invention. As mentioned above, it is particularly preferably 20 ⁇ m or more. Further, from the viewpoint of realizing appropriate flexibility in the double-sided pressure-sensitive adhesive sheet for transfer of the present invention, the thickness of the base material is preferably 200 ⁇ m or less, more preferably 180 ⁇ m or less, still more preferably 150 ⁇ m or less.
  • the haze of the base material is not particularly limited, but is preferably 10% or less, more preferably 5.0% or less. When the haze is 10% or less, excellent transparency is obtained.
  • the pattern for example, the receiving position of the electronic component
  • the indicator can be visually recognized, which is preferable.
  • the haze can be measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.).
  • the total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the substrate is not particularly limited, but is preferably 85% or more, more preferably 88% or more. be.
  • the total light transmittance is 85% or more, excellent transparency is obtained.
  • a pattern for example, of an electronic component
  • a marker indicating the receiving position can be visually recognized, which is preferable.
  • the total light transmittance can be measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.).
  • the surface of the pressure-sensitive adhesive layer (the pressure-sensitive surface of the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer) of the double-sided pressure-sensitive adhesive sheet for transfer of the present invention may be protected by a release liner (separator) until use.
  • the separator is used as a protective material for the pressure-sensitive adhesive layer and is peeled off when the pressure-sensitive adhesive sheet is attached to the adherend.
  • 2A and 2B are schematic cross-sectional views showing an embodiment of the double-sided adhesive sheet for transfer of the present invention, in which 1 is a double-sided adhesive sheet for transfer, 10 is a base material, 11 is a first adhesive layer, and 12 is a second adhesive.
  • the agent layers 110 and 120 indicate separators. The separator may not always be provided.
  • a conventional release paper or the like can be used.
  • a fluorine-based polymer for example, polytetrafluoroethylene
  • a fluorine-based polymer for example, polytetrafluoroethylene
  • a low-adhesion substrate made of (for example, an olefin resin such as polyethylene or polypropylene) or the like can be used.
  • a separator having a peeling treatment layer formed on at least one surface of the separator base material can be preferably used.
  • the base material for such a separator include polyester film (polyethylene terephthalate film, etc.), olefin resin film (polyethylene film, polypropylene film, etc.), polyvinyl chloride film, polyimide film, polyamide film (nylon film), rayon film, etc.
  • plastic-based base film synthetic resin film
  • papers high-quality paper, Japanese paper, kraft paper, glassin paper, synthetic paper, top-coated paper, etc.
  • the peeling treatment agent constituting the peeling treatment layer is not particularly limited, and for example, a silicone-based peeling treatment agent, a fluorine-based peeling treatment agent, a long-chain alkyl-based peeling treatment agent, or the like can be used.
  • the stripping agent can be used alone or in combination of two or more. Since the first pressure-sensitive adhesive layer is composed of a low-stickiness pressure-sensitive adhesive layer, it is possible to use a base material that has not been treated with the release treatment agent as a separator.
  • the separator may have an antistatic layer formed on at least one surface of the separator base material in order to prevent adverse effects on electronic components.
  • the antistatic layer may be formed on one surface (peeling-treated surface or untreated surface) of the separator, or may be formed on both surfaces (peeling-treated surface and untreated surface) of the separator.
  • antistatic agent contained in the antistatic resin examples include a quaternary ammonium salt, a pyridinium salt, a cationic antistatic agent having a cationic functional group such as a first, second and third amino groups, and a sulfonate.
  • anionic antistatic agents having anionic functional groups such as sulfate ester salts, phosphonates and phosphate ester salts, alkylbetaines and derivatives thereof, imidazoline and its derivatives, and amphoteric antistatic agents such as alanine and its derivatives.
  • Amino alcohol and its derivatives, glycerin and its derivatives, polyethylene glycol and its derivatives and other nonionic antistatic agents, and the above-mentioned cationic, anionic and amphoteric ion-type monomers having ionic conductive groups are polymerized or polymerized. Examples thereof include an ion conductive polymer obtained by copolymerization. These compounds may be used alone or in combination of two or more.
  • the thickness of the separator is not particularly limited and may be appropriately selected from the range of 5 to 100 ⁇ m.
  • the method for producing the double-sided pressure-sensitive adhesive sheet for transfer of the present invention varies depending on the composition of the pressure-sensitive adhesive composition and the like, and is not particularly limited, and known forming methods can be used. 4) and the like can be mentioned.
  • the pressure-sensitive adhesive composition is applied (coated) on a substrate to form a composition layer, and the composition layer is cured (for example, heat curing or curing by irradiation with active energy rays such as ultraviolet rays).
  • a method for producing an adhesive sheet by forming an adhesive layer (2) The above-mentioned adhesive composition is applied (coated) on a separator to form a composition layer, and the composition layer is cured (for example,).
  • thermosetting As the curing method in the above (1) to (4), a method of thermosetting is preferable in that a homogeneous and surface-smooth adhesive layer can be formed in terms of excellent productivity.
  • a known coating method can be adopted, and is not particularly limited, but for example, a roll coat, a kiss roll coat, a gravure coat, and a reverse coat.
  • the thickness (total thickness) of the double-sided pressure-sensitive adhesive sheet for transfer of the present invention is not particularly limited, but is preferably 10 ⁇ m or more, and more preferably 15 ⁇ m or more. When the thickness is a certain value or more, the first pressure-sensitive adhesive layer can easily receive the electronic component with high accuracy, which is preferable.
  • the upper limit of the thickness (total thickness) of the double-sided adhesive sheet for transfer of the present invention is not particularly limited, but is preferably 500 ⁇ m, more preferably 300 ⁇ m. When the thickness is not more than a certain level, it becomes easy to transfer the electronic component to the mounting substrate with high accuracy, which is preferable.
  • the thickness of the double-sided adhesive sheet for transfer of the present invention does not include the thickness of the separator.
  • the haze of the double-sided pressure-sensitive adhesive sheet for transfer (according to JIS K7136) of the present invention is not particularly limited, but is preferably 10% or less, more preferably 5.0% or less. When the haze is 10% or less, excellent transparency is obtained.
  • the pattern for example, the receiving position of the electronic component
  • the indicator can be visually recognized, which is preferable.
  • the double-sided pressure-sensitive adhesive sheet for transfer is allowed to stand in a normal state (23 ° C., 50% RH) for at least 24 hours, and then the separator, if any, is peeled off and the slide glass (for example, total light beam) is removed.
  • a sample bonded to a transmittance of 91.8% and a haze of 0.4% is used as a sample, and measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.). be able to.
  • the total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the double-sided adhesive sheet for transfer of the present invention is not particularly limited, but is preferably 85% or more, more preferably 88% or more. When the total light transmittance is 85% or more, excellent transparency is obtained.
  • a pattern for example, of an electronic component
  • a marker indicating the receiving position can be visually recognized, which is preferable.
  • the double-sided adhesive sheet for transfer is allowed to stand in a normal state (23 ° C., 50% RH) for at least 24 hours, and then the separator, if any, is peeled off to obtain a slide glass (for example,).
  • the double-sided adhesive sheet for transfer of the present invention is suitably used for a method of mounting an electronic component on a mounting substrate.
  • the method for mounting an electronic component on a mounting substrate using the double-sided adhesive sheet for transfer of the present invention preferably includes the following steps. Step of receiving the diced electronic component by the first pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet for transfer (first step) Step of transferring the electronic component received by the first pressure-sensitive adhesive layer to the mounting substrate (second step)
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of the first step in a method of mounting an electronic component on a mounting substrate using the double-sided adhesive sheet for transfer of the present invention.
  • the double-sided adhesive sheet 1 for transfer is attached to the carrier substrate 22 on the adhesive surface of the second adhesive layer 12.
  • a marking pattern for arranging electronic components may be attached to the surface of the carrier substrate 22 that is attached to the second adhesive layer 12. Since the double-sided adhesive sheet 1 for transfer has high transparency, the marking pattern attached to the carrier substrate 22 can be visually recognized.
  • a plurality of electronic components 21 individualized by dicing are attached to the dicing tape 20 and the first adhesive layer is attached. It is arranged so as to face the adhesive surface of 11 and to be separated from each other.
  • the electronic component 21 is pushed by the pin member 23 from the surface on which the electronic component 21 of the dicing tape 20 is not attached so that the electronic component 21 is brought close to the adhesive surface of the first adhesive layer 11. ,
  • the adhesive surface of the first adhesive layer 11 receives.
  • the electronic component 21 may be received in contact with the first pressure-sensitive adhesive layer 11 or may be received in a non-contact manner.
  • the electronic component 21 is pushed until the electronic component 21 is peeled off from the dicing tape 20 and dropped onto the adhesive surface of the electronic component 21.
  • the adhesive surface of the first pressure-sensitive adhesive layer 11 When the first pressure-sensitive adhesive layer 11 is received in contact with each other, the adhesive surface of the first pressure-sensitive adhesive layer 11 has low adhesiveness, and therefore the stress when the electronic component 21 is received is weak, so that damage to the electronic component 21 can be suppressed. When received in a non-contact manner, the adhesive surface of the first adhesive layer 11 has low adhesiveness, so that the dropped electronic component 21 can be caught with high positional accuracy.
  • the electronic component 21 may be peeled from the dicing tape 20 by irradiating the pin member 23 with radiation such as ultraviolet rays or a laser beam.
  • the electronic component 21 may be received by the first pressure-sensitive adhesive layer 11 individually, or a plurality of electronic components 21 may be received at once.
  • FIG. 3C is a schematic cross-sectional view showing a form in which all the electronic components 21 of the dicing tape 20 are received on the adhesive surface of the first adhesive layer 11 of the double-sided adhesive sheet 1 for transfer.
  • FIG. 4 is a schematic cross-sectional view showing a second step in a method of mounting an electronic component on a mounting substrate using the double-sided adhesive sheet for transfer of the present invention.
  • the mounting substrate 30 is arranged on the adhesive surface of the first adhesive layer 11 of the double-sided adhesive sheet 1 for transfer, facing and separated from the circuit surface 31 (circuit pattern is not shown).
  • the electronic component 21 is arranged.
  • FIG. 4B the circuit surface 31 of the mounting substrate 30 and the electronic components 21 arranged on the adhesive surface of the first adhesive layer 11 of the double-sided adhesive sheet 1 for transfer are brought close to each other.
  • the electronic component 21 and the circuit surface 31 of the mounting board 30 are brought into contact with each other.
  • the transfer of the electronic component 21 to the circuit surface 31 of the mounting substrate 30 may be performed by thermocompression bonding (for example, 150 ° C. for 1 minute). Since the base material 10, the first pressure-sensitive adhesive layer 11, and / or the second pressure-sensitive adhesive layer 12 constituting the double-sided pressure-sensitive adhesive sheet 1 for transfer have excellent heat resistance, they can be expanded or contracted by thermocompression bonding, and have adhesive strength. Is hard to change, so that the electronic component 21 can be transferred to the circuit surface 31 of the mounting board 30 with high accuracy.
  • the electronic component 21 is peeled off from the first adhesive layer 11 and the circuit surface 31 of the mounting substrate 30 is separated. Is transferred to. Since the first pressure-sensitive adhesive layer 11 is composed of a low-stickiness pressure-sensitive adhesive layer, the electronic component 21 can be easily peeled off, and the electronic component 21 can be efficiently mounted on the mounting substrate 30 without being damaged. ..
  • the transfer double-sided adhesive sheet 1 of FIG. 4C after the electronic component 21 is mounted on the mounting substrate 30 may be peeled off from the carrier substrate 22 (not shown). Since the second pressure-sensitive adhesive layer 12 is composed of a peelable pressure-sensitive adhesive layer, it can be peeled off without adhesive residue and has excellent reworkability, so that the carrier substrate 22 can be easily reused.
  • the electronic components to be mounted on the mounting board are not particularly limited, but can be suitably used for fine and thin semiconductor chips and LED chips.
  • Silicone-based adhesive (additional reaction type silicone-based adhesive, trade name "X-40-3306", manufactured by Shin-Etsu Chemical Co., Ltd.) 100 parts by weight, platinum-based catalyst 1 (trade name "CAT-PL-50T", Shin-Etsu Chemical Co., Ltd. 1.4 parts by weight, Silicone-based release agent 1 (additional reaction type silicone-based release agent containing dimethylpolysiloxane as the main component, trade name "KS-776A", Shin-Etsu Chemical Co., Ltd.
  • Silicone-based adhesive composition on the silicone primer-treated surface of the base film (polyester film with one side treated with silicone primer, thickness 75 ⁇ m, trade name "Diafoil MRF # 75", manufactured by Mitsubishi Resin Co., Ltd.)
  • the product (1) was applied so that the glue thickness after drying was 15 ⁇ m, cured under the conditions of a drying temperature of 120 ° C. and a drying time of 5 minutes, and dried. In this way, a film having a silicone-based pressure-sensitive adhesive layer on the silicone primer-treated layer of the base film was obtained.
  • a separator (1) (a polyethylene terephthalate film that has not been peeled off, a thickness of 25 ⁇ m, a trade name of “Lumilar S10 # 25”, manufactured by Toyo Spinning Co., Ltd.) is bonded onto the adhesive surface of the silicone-based adhesive film, and silicone is attached.
  • a laminated body (1) having a laminated structure of [separator (1) layer] / [silicone-based adhesive (1) layer] / [base film layer]] was obtained by protecting the system-based pressure-sensitive adhesive layer.
  • Separator (2) peeled polyethylene terephthalate film, thickness 38 ⁇ m, trade name “MRF # 38”, manufactured by Mitsubishi Chemical Co., Ltd.
  • MRF # 38 trade name “MRF # 38”, manufactured by Mitsubishi Chemical Co., Ltd.
  • a fountain roll so that the thickness after drying is 20 ⁇ m.
  • Example 2 to 6 Comparative Examples 1 and 2>
  • a silicone-based pressure-sensitive adhesive composition containing an ultraviolet absorber (trade name "Tinuvin 384-2, maximum absorption wavelength 345 nm, manufactured by BASF") so as to have the blending amount shown in Table 1 was used.
  • the first pressure-sensitive adhesive layer was formed so as to have the thickness shown in Table 1, and a double-sided pressure-sensitive adhesive sheet for transfer was obtained.
  • a thin piece is cut out from the first pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet for transfer using a microtome, and 200 to 800 nm using a micro-ultraviolet visible-near-infrared spectrophotometer (product name "MSV-5200 DGK", manufactured by Nippon Spectroscopy).
  • the transmittance was measured in the wavelength range of 248 nm, and the value at the wavelength of 248 nm was defined as the ultraviolet transmittance TUV 1 .
  • the surface observation image obtained by using a laser microscope (product name "VK-X100", manufactured by KEYENCE CORPORATION) was analyzed, and the floating height R z2 after irradiation was calculated for each dot. Obtained as the average value of the maximum height. Further, with respect to the double-sided adhesive sheet for transfer before irradiation with the ultraviolet laser, the floating height R z1 before irradiation was obtained in the same manner from the surface observation image of the portion corresponding to 9 dots.
  • an ultraviolet laser (wavelength 248 nm, laser beam size 130 ⁇ 105 ⁇ m (laser light spot cross-sectional area 13650 ⁇ m 2 , output 100 mJ / cm) from the silicone-based adhesive layer side. 2 ) was irradiated with a pulse time of 10 nsec and a frequency of 100 Hz so as to have 9 dots (average irradiation area 15300 ⁇ m 2 ) in 1 mm 2. For each dot of these 9 dots, a digital microscope (product name “VHX-700F”) was applied.
  • a surface observation image was taken at an observation magnification of 200 times using (manufactured by Keyence Co., Ltd.), analyzed by the image processing software ImageJ, and the area where the floating occurred (floating area) was taken as the average value of 9 dots.
  • the area ratio (%) of the floating area was determined as the area ratio of the floating area to the laser irradiation area of 15300 ⁇ m 2 .
  • a double-sided adhesive sheet for transfer from which the separator (1) has been peeled off is attached to a dicing ring so that the first adhesive layer is on the surface, and dicing to a depth of 10 ⁇ m on the surface of the double-sided adhesive sheet allows a plurality of 1 mm square sides. Marked.
  • a semiconductor wafer pretreated with laser light so that it is cut into a size of 1 mm ⁇ 1 mm at the time of expansion is polished to a thickness of 30 ⁇ m, and then bonded to a dicing die bond film to form a dicing die bond with a semiconductor wafer.
  • the dicing die bond film with the semiconductor wafer is held in the dicing ring of the dicing separator (product name "DDS2300", manufactured by DISCO), and the cool expander unit has an expand temperature of -15 ° C, an expand speed of 200 mm / sec, and an expand amount of 11 mm.
  • the semiconductor wafer and the dicing layer are cut, and then at room temperature, the room temperature is expanded under the conditions of an expanding speed of 1 mm / sec and an expanding amount of 7 mm, and further, heat is performed while maintaining the expanded state.
  • the room temperature is expanded under the conditions of an expanding speed of 1 mm / sec and an expanding amount of 7 mm, and further, heat is performed while maintaining the expanded state.
  • the dicing tape on the outer peripheral portion of the semiconductor chip was thermally shrunk to maintain the state in which the semiconductor wafer and the dicing layer were broken. , A dicing die bond film having a semiconductor chip with a die bond layer was obtained.
  • the dicing diebond film having the semiconductor chip with the diebond layer facing down and the double-sided adhesive sheet for transfer with the marked first adhesive layer facing up were placed on the semiconductor chip with the diebond layer and the markings while aligning the markings. Arrange them so as to face each other with a clearance of 1 mm, push them with a needle from the upper side (back side) of the dicing die bond film, and drop exactly 10 semiconductor chips with a die bond layer on the adhesive surface of the first adhesive layer at the marking position. Then, a double-sided adhesive sheet for transfer was obtained by receiving the semiconductor chip.
  • the part other than the part that received the semiconductor chip with the die bond layer was an ultraviolet laser (wavelength 248 nm, laser light spot cross-sectional area 15300 ⁇ m 2 , output 100 mJ / cm 2 , frequency 100 Hz, (Pulse width 10 ns) is irradiated so as to be an alignment mark, a mounting board with the corresponding marking is installed and aligned with the alignment mark as a reference, and a semiconductor chip with a die bond layer is placed on the aligned mounting board.
  • the semiconductor chip with a die bond layer was confirmed using a microscope, and the position accuracy was evaluated according to the following criteria.
  • ⁇ A semiconductor chip with a die bond layer that is misaligned with respect to the marking position of the mounting board was not confirmed.
  • ⁇ A semiconductor chip with a die bond layer that is misaligned with respect to the marking position of the mounting board. confirmed
  • Double-sided adhesive sheet for transfer 10 Base material 11 First adhesive layer 12 Second adhesive layer 110, 120 Separator 20 Dicing tape 21 Electronic components 22 Carrier substrate 23 Pin member 30 Mounting substrate 31 Circuit surface

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2021/046350 2020-12-18 2021-12-15 転写用両面粘着シート WO2022131306A1 (ja)

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CN202180084632.9A CN116615510A (zh) 2020-12-18 2021-12-15 转印用双面粘合片
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JP2020-210489 2020-12-18
JP2020210489 2020-12-18
JP2021-091449 2021-05-31
JP2021091449A JP2022097357A (ja) 2020-12-18 2021-05-31 転写用両面粘着シート
JP2021091122A JP2022183681A (ja) 2021-05-31 2021-05-31 転写用両面粘着シート
JP2021-091122 2021-05-31

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7254394B1 (ja) * 2022-12-02 2023-04-10 株式会社写真化学 電子部品移載ロール及び電子部品移載方法

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JP2001085360A (ja) * 1999-09-09 2001-03-30 Lintec Corp 電子部品の貼着方法およびそのための粘着テープの切り込み形成方法
JP2003324142A (ja) * 2002-04-30 2003-11-14 Lintec Corp 半導体ウエハの処理方法およびそのための半導体ウエハの転写装置
JP2004186279A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 電子部品の３次元実装方法
JP2005263876A (ja) * 2004-03-16 2005-09-29 Lintec Corp 両面粘着シートおよび脆質部材の転写方法
JP2013075978A (ja) * 2011-09-30 2013-04-25 Nitto Denko Corp 粘着シート
JP2017031331A (ja) * 2015-08-03 2017-02-09 ニッタ株式会社 タッチセンサ転写用感温性粘着テープ
WO2018096858A1 (ja) * 2016-11-24 2018-05-31 リンテック株式会社 両面シリコーン粘着シート及び両面シリコーン粘着シートの製造方法
WO2021131517A1 (ja) * 2019-12-27 2021-07-01 日東電工株式会社 粘着シート

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Publication number Priority date Publication date Assignee Title
JP2001085360A (ja) * 1999-09-09 2001-03-30 Lintec Corp 電子部品の貼着方法およびそのための粘着テープの切り込み形成方法
JP2003324142A (ja) * 2002-04-30 2003-11-14 Lintec Corp 半導体ウエハの処理方法およびそのための半導体ウエハの転写装置
JP2004186279A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 電子部品の３次元実装方法
JP2005263876A (ja) * 2004-03-16 2005-09-29 Lintec Corp 両面粘着シートおよび脆質部材の転写方法
JP2013075978A (ja) * 2011-09-30 2013-04-25 Nitto Denko Corp 粘着シート
JP2017031331A (ja) * 2015-08-03 2017-02-09 ニッタ株式会社 タッチセンサ転写用感温性粘着テープ
WO2018096858A1 (ja) * 2016-11-24 2018-05-31 リンテック株式会社 両面シリコーン粘着シート及び両面シリコーン粘着シートの製造方法
WO2021131517A1 (ja) * 2019-12-27 2021-07-01 日東電工株式会社 粘着シート

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7254394B1 (ja) * 2022-12-02 2023-04-10 株式会社写真化学 電子部品移載ロール及び電子部品移載方法

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